An automatic enclosing water retaining device

Abstract

The application relates to the technical field of wafer processing, and discloses a surrounding type automatic water blocking device. Through the cooperation of a sealing water collecting mechanism and first and second water blocking mechanisms, a dynamic surrounding type shielding is formed around a grinding head module of a wafer edge grinding device, so that the debris and water mist generated during the grinding of the wafer are effectively constrained inside the sealing water collecting mechanism, thereby avoiding the problem of debris splashing; meanwhile, the outward diffusion of the water mist is significantly inhibited, and a series of problems caused by the diffusion of the water mist are avoided; in addition, the second water blocking mechanism can move synchronously with a Y-axis moving module of the wafer edge grinding device, cooperates with the first water blocking mechanism in an opposite direction, realizes self-adaptive opening and closing, eliminates the interference of a fixed closed cavity on the large-range movement of the grinding head, realizes the compatible processing of wafers of multiple specifications, greatly reduces the sealing gap through dynamic surrounding, effectively solves the problem of serious leakage of the split water blocking structure, and significantly improves the production line operation rate and reduces the maintenance cost.

Description

Technical Field

[0001] This invention relates to the field of wafer processing technology, and in particular to an enclosed automatic water-blocking device. Background Technology

[0002] After dicing, semiconductor wafers often have defects such as burrs, chipping, and out-of-roundness at their edges. These defects significantly reduce the mechanical strength of the wafer and cause yield losses in subsequent processes such as photolithography, coating, and etching. The wafer edge grinding station is the core process unit for achieving precise shaping of the wafer's outer periphery.

[0003] Currently, most existing wafer edge grinding equipment has an open structure for its edge grinding station, which has several technical drawbacks:

[0004] First, the high-speed cutting of silicon materials by the grinding head generates a large amount of silicon debris. The debris flies around unrestrainedly, contaminating precision components such as lead screws, sensors, and vision cameras inside the workstation. At the same time, there is a safety hazard of debris splashing and scratching operators.

[0005] Secondly, the grinding process requires continuous spraying of cooling pure water, and the high-speed friction generates high-pressure water mist. The open-structure workstations lack any isolation barriers, allowing the water mist to diffuse and spread. On one hand, the water mist corrodes metal moving parts such as guide rails, bearings, and lead screws, leading to rust and jamming, shortening the lifespan of components, and significantly increasing maintenance costs. On the other hand, water mist adheres to the lens and sensor surface, causing misjudgments in dimensional detection and wafer positioning failure, resulting in processing scrap. Furthermore, water mist seeps into the wiring terminals and servo motors, causing insulation degradation, short circuits, and shutdowns, reducing production line uptime.

[0006] Third, the existing edge grinding station is only equipped with a simple fixed water baffle, which cannot adaptively open and close with the XYZ three-axis stroke of the grinding head. If a fixed closed cavity is used, it will interfere with the large-scale movement of the grinding head and cannot be compatible with multi-specification wafer processing. The split water baffle structure lacks a synchronous linkage design, has a large sealing gap, and suffers from serious water mist leakage.

[0007] Therefore, improvements to existing technologies are necessary. Summary of the Invention

[0008] This invention provides an enclosed automatic water-blocking device to solve the problems existing in the prior art.

[0009] To achieve the above objectives, the present invention provides the following technical solution:

[0010] An enclosed automatic water-blocking device is applied to a wafer grinding equipment. The equipment includes a base, a three-axis grinding mechanism, and a wafer vacuum adsorption stage. The three-axis grinding mechanism and the wafer vacuum adsorption stage are respectively disposed on the base. The device includes:

[0011] A sealed water collection mechanism is provided on the base; the interior of the sealed water collection mechanism is hollow, with an opening at the top for the grinding head module of the three-axis grinding mechanism to enter the interior, and an avoidance opening at the bottom for the wafer vacuum adsorption stage to enter the interior, for collecting debris and water mist generated during wafer grinding;

[0012] The first water-blocking mechanism is disposed on the base and at the opening, and can move in the Y direction to form a dynamic local shielding at the opening during the wafer grinding process.

[0013] The second water-blocking mechanism is disposed on the Y-axis moving module of the three-axis grinding mechanism and at the opening. It can move synchronously with the Y-axis moving module in the Y direction. During the wafer grinding process, it cooperates with the first water-blocking mechanism to form a dynamic enclosed shield around the grinding head module at the opening.

[0014] Furthermore, in the enclosed automatic water-blocking device, the sealing water collection mechanism includes a front side plate, a rear side plate, a left side plate, a right side plate, and a bottom plate;

[0015] The front panel, left panel, rear panel and right panel are connected end to end in sequence to enclose and form the opening;

[0016] The base plate is connected to the bottom of the front side plate, rear side plate, left side plate and right side plate, and the clearance opening is opened on the base plate.

[0017] Furthermore, in the enclosed automatic water-blocking device, a drain outlet is also provided on the bottom plate;

[0018] The drain outlet is connected to the drain pipe via a quick-release drain connector, and is used to discharge the collected debris and water mist.

[0019] Furthermore, in the enclosed automatic water-blocking device, a guide groove is provided on the bottom surface of the base plate facing the interior of the sealing water collection mechanism, and the guide groove is arranged at an inclination towards the sewage outlet.

[0020] Furthermore, in the enclosed automatic water-blocking device, the first water-blocking mechanism includes a first water-blocking curtain and a moving drive module;

[0021] The first water curtain is disposed at the opening, with its front end connected to the front side panel and its rear end connected to the mobile drive module; the front end is the end close to the front side panel, and the rear end is the end away from the front side panel.

[0022] The mobile drive module is mounted on the base and can move in the Y direction. During the wafer grinding process, it drives the first water curtain to move in the Y direction to adjust the local blocking range of the opening by the first water curtain.

[0023] Furthermore, in the enclosed automatic water-blocking device, the mobile drive module includes a first fixed plate, a first sliding plate, a first slider, a slide rail, a connecting frame, and a mobile drive unit;

[0024] The two slide rails are respectively disposed on the outer surfaces of the left side plate and the right side plate, and extend along the Y direction;

[0025] The two first sliding plates are slidably mounted on the corresponding slide rails via a first slider;

[0026] The first fixing plate is located at the opening, and one end is connected to one of the first sliding plates, and the other end is connected to the other first sliding plate; the rear end of the first water curtain is connected to the side of the first fixing plate.

[0027] The mobile drive unit is disposed on the base and connected to the first fixed plate or one of the first sliding plates through the connecting frame. It can move in the Y direction and is used to drive the first water curtain, the first fixed plate, the first sliding plate and the first slider to move along the slide rail.

[0028] Furthermore, in the enclosed automatic water-blocking device, the mobile drive module also includes guide bars;

[0029] The two guide strips are respectively disposed on the inner surfaces of the left and right side plates, extending along the Y direction, and are provided with guide grooves;

[0030] The first water curtain is slidably installed in the corresponding guide groove on both sides;

[0031] Alternatively, guide grooves may be provided on the inner surfaces of the left side plate and the right side plate;

[0032] The first water curtain is slidably installed in the corresponding guide groove on both sides.

[0033] Furthermore, in the enclosed automatic water-blocking device, the second water-blocking mechanism includes a second water-blocking curtain, a third water-blocking curtain, a fourth water-blocking curtain, and an installation module;

[0034] The second water curtain is disposed at the opening, with its front end connected to the mounting module and its rear end connected to the rear side plate;

[0035] The third water curtain is located at the opening and is connected to the installation module;

[0036] The fourth water curtain is located at the opening and is connected to the installation module;

[0037] The mounting module is mounted on the Y-axis moving module and can move synchronously with the Y-axis moving module in the Y direction. During the wafer grinding process, it drives the second, third, and fourth water curtains to move in the Y direction to cooperate with the first water curtain. This allows the second, third, and fourth water curtains and the first water curtain to form a dynamic enclosed shield around the grinding head module at the opening.

[0038] Furthermore, in the enclosed automatic water-blocking device, the installation module includes a second fixed plate, a second sliding plate, a second slider, a third fixed plate, a fourth fixed plate, and a fifth fixed plate;

[0039] Two second sliding plates are respectively mounted on the corresponding slide rails via a second slider; at least one of the second sliding plates is connected to the Y-axis moving module.

[0040] The second fixing plate is located at the opening, and one end is connected to one of the second sliding plates, and the other end is connected to the other second sliding plate; the front end of the second water curtain is connected to the side of the second fixing plate;

[0041] The fifth fixing plate is located at the opening, with one end connected to one of the second sliding plates and the other end connected to the other second sliding plate;

[0042] The third fixing plate and the fourth fixing plate are respectively located at the opening, and one end is slidably installed on the fifth fixing plate along the X direction, and the other end is slidably installed on the second fixing plate along the X direction;

[0043] The left side of the third water curtain is connected to the second sliding plate near the left side plate, and the right side is connected to the side of the third fixed plate; the left side is the side close to the left side plate, and the right side is the side away from the left side plate.

[0044] The right side of the fourth water curtain is connected to the second sliding plate near the right side plate, and the left side is connected to the side of the fourth fixed plate.

[0045] Furthermore, in the enclosed automatic water-blocking device, the device also includes a stroke sensing closed-loop control component, which is electrically connected to the wafer grinding equipment, for sensing the relative position between the first sliding plate and the second sliding plate, and feeding it back to the wafer grinding equipment, so as to realize the safety interlock of the grinding action.

[0046] The stroke sensing closed-loop control component includes a sensor and a sensing element;

[0047] One of the sensor and the sensing element is disposed on the first sliding plate, and the other is disposed on the second sliding plate.

[0048] Compared with the prior art, the present invention has the following beneficial effects:

[0049] This invention provides an enclosed automatic water-blocking device. Through the coordinated operation of a sealed water-collecting mechanism and a first and second water-blocking mechanism, a dynamic enclosed shield is formed around the grinding head module of a wafer grinding equipment. This effectively confines the debris and water mist generated during wafer grinding within the sealed water-collecting mechanism, thereby preventing debris from splashing and contaminating precision components such as lead screws, sensors, and vision cameras, and eliminating the risk of personnel scratches. Simultaneously, it significantly inhibits the outward diffusion of water mist, preventing corrosion and jamming of metal parts such as guide rails and bearings, and avoiding dimensional errors caused by water mist adhering to the lens and sensing end face. It detects misjudgments and positioning failures, and prevents insulation degradation and short-circuit shutdowns caused by water mist seeping into the wiring terminals and servo motors. In addition, the second water-blocking mechanism can move synchronously with the Y-axis moving module of the wafer grinding equipment and cooperate with the first water-blocking mechanism to achieve adaptive opening and closing. This not only eliminates the interference of the fixed closed cavity on the large-range movement of the grinding head, realizing the compatible processing of wafers of various specifications, but also significantly reduces the sealing gap through dynamic enclosure, effectively solving the problem of serious leakage in the split water-blocking structure, significantly improving the production line uptime and reducing maintenance costs. Attached Figure Description

[0050] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0051] Figure 1 This is one of the structural schematic diagrams of an enclosed automatic water-blocking device provided in an embodiment of the present invention;

[0052] Figure 2 This is a second structural schematic diagram of an enclosed automatic water-blocking device provided in an embodiment of the present invention;

[0053] Figure 3 This is a schematic diagram of the structure of the sealing water collection mechanism, the second water blocking mechanism, and part of the first water blocking mechanism provided in the embodiments of the present invention;

[0054] Figure 4 This is the third structural schematic diagram of an enclosing automatic water-blocking device provided in an embodiment of the present invention;

[0055] Figure 5This is a schematic diagram of the connecting frame and the moving drive unit provided in an embodiment of the present invention.

[0056] Figure label:

[0057] 1. Sealed water collection mechanism, 2. First water blocking mechanism, 3. Second water blocking mechanism, 4. Opening, 5. Quick-release drain connector, 6. Stroke sensing closed-loop control component;

[0058] Front side panel 11, rear side panel 12, left side panel 13, right side panel 14, bottom panel 15;

[0059] First water curtain 21, mobile drive module 22;

[0060] First fixed plate 221, first sliding plate 222, first slider 223, slide rail 224, connecting frame 225, moving drive unit 226, guide bar 227;

[0061] Second water curtain 31, third water curtain 32, fourth water curtain 33, installation module 34;

[0062] Second fixed plate 341, second sliding plate 342, second slider 343, third fixed plate 344, fourth fixed plate 345, fifth fixed plate 346;

[0063] Sensor 61, sensing element 62;

[0064] Base 100, three-axis grinding mechanism 200, wafer vacuum adsorption stage 300;

[0065] Grinding head module 201, Y-axis moving module 202, X-axis moving module 203, Z-axis moving module 204. Detailed Implementation

[0066] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0067] Please refer to Figure 1-2This invention provides an enclosing automatic water-blocking device applied to a wafer edge grinding equipment. The wafer edge grinding equipment includes a base 100, a three-axis grinding mechanism 200, and a wafer vacuum adsorption stage 300. The three-axis grinding mechanism 200 and the wafer vacuum adsorption stage 300 are respectively fixedly mounted on the base 100. The three-axis grinding mechanism 200 further includes a grinding head module 201, a Y-axis moving module 202, an X-axis moving module 203, and a Z-axis moving module 204. The grinding head module 201 can achieve high-precision displacement in three-dimensional space under the coordinated drive of the X-axis moving module 203, the Y-axis moving module 202, and the Z-axis moving module 204 to complete the precision grinding of the wafer's outer periphery.

[0068] The enclosed automatic water-blocking device includes a sealing water collection mechanism 1, a first water-blocking mechanism 2, and a second water-blocking mechanism 3.

[0069] Specifically, the sealing water collection mechanism 1 is fixedly mounted on the base 100, located at the processing position of the grinding head module 201 and the wafer vacuum adsorption stage 300. The interior of the sealing water collection mechanism 1 forms a hollow cavity structure with an opening 4 at the top. The opening 4 allows the grinding head module 201 of the triaxial grinding mechanism 200 to extend into the internal cavity of the sealing water collection mechanism 1. The bottom of the sealing water collection mechanism 1 has a clearance opening, which allows the wafer vacuum adsorption stage 300, which carries the wafer to be processed, to extend into the internal cavity of the sealing water collection mechanism 1. This allows the grinding head module 201 and the wafer on the wafer vacuum adsorption stage 300 to form a relatively arranged grinding relationship within the internal cavity of the sealing water collection mechanism 1. The sealed water collection mechanism 1 is mainly used to collect the silicon debris generated by the high-speed cutting of silicon material by the grinding head and the mixture of wastewater and water mist formed by continuous spray cooling during the grinding process, so as to provide a relatively closed processing environment for the grinding process.

[0070] The first water-blocking mechanism 2 is disposed on the base 100 and located at the opening 4 at the top of the sealing water collection mechanism 1. The first water-blocking mechanism 2 is configured to reciprocate in the Y-axis direction to form a dynamic local shield at the opening 4 that varies with the processing conditions during wafer grinding, thereby reducing the open area at the opening 4.

[0071] The second water-blocking mechanism 3 is disposed on the Y-axis moving module 202 of the three-axis grinding mechanism 200, and is also located at the opening 4 at the top of the sealing water collection mechanism 1. The second water-blocking mechanism 3 can move synchronously with the Y-axis moving module 202 in the Y-axis direction, and is used to form a counter-cooperative relationship with the first water-blocking mechanism 2 during the wafer grinding process, thereby forming a dynamic enclosed shielding structure around the grinding head module 201 at the opening 4.

[0072] This invention, through the coordinated operation of the sealing water collection mechanism 1, the first water blocking mechanism 2, and the second water blocking mechanism 3, constructs a dynamic, enclosed shielding barrier around the grinding head module 201 of the wafer grinding equipment. During the grinding process, silicon chips generated by the high-speed cutting of the grinding head and the high-pressure water mist formed by the cooling water are effectively confined within the internal cavity of the sealing water collection mechanism 1, thereby preventing silicon chips from splashing freely and contaminating precision components such as lead screws, sensors, and vision cameras. Simultaneously, it completely eliminates the safety hazard of chip splashes injuring operators.

[0073] Meanwhile, the dynamic enclosed shielding barrier can significantly suppress the diffusion of high-pressure water mist into the external space of the sealed water collection mechanism 1. On the one hand, it effectively prevents water mist from spreading and adhering to the surfaces of metal moving parts such as guide rails, bearings, and lead screws, preventing rust and jamming caused by long-term water mist corrosion, greatly extending the service life of components and significantly reducing equipment maintenance costs. On the other hand, it effectively prevents water mist from adhering to the surfaces of the detection lens and sensing end face, fundamentally avoiding problems such as misjudgment of size detection and wafer positioning failure caused by water mist interference, significantly improving processing yield. Furthermore, it effectively prevents water mist from seeping into the wiring terminals and electrical components such as servo motors, preventing short-circuit shutdown accidents caused by decreased insulation performance, thereby significantly improving the uptime of the production line and the stability of equipment operation.

[0074] Furthermore, since the second water-blocking mechanism 3 is directly mounted on the Y-axis moving module 202, it can move synchronously with the Y-axis moving module 202 in the Y-axis direction in real time, and form a counter-adaptive opening and closing cooperation with the first water-blocking mechanism 2 fixed on the base 100. This design completely eliminates the structural interference problem caused by the traditional fixed closed cavity to the large-range movement of the grinding head, allowing the grinding head module 201 to move freely within the XYZ three-axis stroke range, effectively accommodating the processing needs of various wafers of different specifications. At the same time, through the dynamic counter-cooperation of the first water-blocking mechanism 2 and the second water-blocking mechanism 3, the shielding range can be automatically adjusted according to the real-time position of the grinding head, greatly reducing the sealing gap. This effectively solves the drawbacks of the existing split water-blocking structure, such as excessive sealing gap and serious water mist leakage caused by the lack of synchronous linkage design. While ensuring the freedom of movement of the grinding head, it achieves a high level of dynamic sealing of the grinding station.

[0075] Please refer to this again. Figure 2 In one embodiment of this invention, the sealing water collection mechanism 1 further includes a front side plate 11, a rear side plate 12, a left side plate 13, a right side plate 14, and a bottom plate 15.

[0076] Specifically, the front side plate 11, the left side plate 13, the rear side plate 12, and the right side plate 14 are connected end to end to form a rectangular frame structure with an internal hollow cavity. The top of the rectangular frame structure forms the opening 4, allowing the grinding head module 201 of the three-axis grinding mechanism 200 to extend into the internal cavity of the sealing water collection mechanism 1 through the opening 4, thereby forming a relatively closed grinding processing space inside the sealing water collection mechanism 1. The bottom plate 15 is fixedly connected to the bottom end face of the front side plate 11, the rear side plate 12, the left side plate 13, and the right side plate 14, thus forming a semi-closed water collection cavity structure with a relatively closed bottom and an open top together with the above four side plates. The base plate 15 has a clearance opening at a position corresponding to the wafer vacuum adsorption stage 300. The wafer vacuum adsorption stage 300 can extend into the internal cavity of the sealing water collection mechanism 1 through the clearance opening, so that the wafer to be processed carried on the wafer vacuum adsorption stage 300 and the grinding head module 201 form a grinding relationship with opposite arrangement inside the sealing water collection mechanism 1.

[0077] It should be further explained that, in this embodiment, the edges of the front side plate 11, the rear side plate 12, the left side plate 13, the right side plate 14, and the bottom plate 15 are all provided with connecting holes for assembly and connection. The plates are detachably spliced ​​together by fastening screws passing through the connecting holes, thereby facilitating the assembly, maintenance, and component replacement of the sealing water collection mechanism 1. To further improve the sealing performance of the sealing water collection mechanism 1 and prevent water mist and wastewater generated during grinding from leaking outwards from the splicing gaps between the plates, a full-coverage silicone sealing gasket is provided at each splicing joint. The silicone sealing gasket is clamped between the splicing end faces of two adjacent plates and undergoes elastic compression deformation under the locking action of the fastening screws, thereby forming a continuous, dense, and reliable elastic sealing barrier at each splicing joint, effectively blocking the leakage path of water mist and wastewater.

[0078] Furthermore, in this embodiment, the front side plate 11, the rear side plate 12, the left side plate 13, the right side plate 14, and the bottom plate 15 are all integrally formed from 6061 aluminum alloy material through precision milling. 6061 aluminum alloy possesses excellent machinability, high structural strength, and good corrosion resistance, meeting the structural stability requirements of the sealing water collection mechanism 1 under long-term exposure to cooling water and silica debris. To further enhance the corrosion resistance of each plate in humid environments and environments containing trace amounts of corrosive media, all plates undergo hard anodizing surface treatment after milling, forming a dense, hard, and chemically stable oxide film layer on the surface of each plate. This significantly enhances the overall corrosion resistance of the sealing water collection mechanism 1, effectively extending its service life and reducing long-term maintenance costs.

[0079] Please refer to this again. Figure 2 In one embodiment of this invention, a drain outlet is further provided on the base plate 15. The drain outlet penetrates the plate body of the base plate 15 and communicates with the internal cavity of the sealing water collection mechanism 1.

[0080] The drain outlet is sealed with a quick-release drain connector 5, the outlet end of which is connected to an external drain pipe. This connector is used to discharge the silicon debris and wastewater mixture collected inside the sealed water collection mechanism 1 during the grinding process to an external wastewater treatment system in a timely and efficient manner. This prevents the debris and wastewater from accumulating inside the sealed water collection mechanism 1 for a long time, thus avoiding secondary pollution or blockage and ensuring the continuous cleanliness and stable operation of the grinding station.

[0081] Preferably, to further improve the discharge efficiency of waste liquid inside the sealed water collection mechanism 1 and prevent waste liquid from accumulating on the upper surface of the base plate 15, a guide channel is also provided on the bottom surface of the base plate 15 facing the interior of the sealed water collection mechanism 1. The guide channel extends from each edge area and non-drainage area of ​​the bottom surface of the base plate 15 toward the drain outlet, and has an overall downward slope structure toward the drain outlet. Through this inclined guide channel, the debris and wastewater mixture collected on the bottom surface of the base plate 15 can be directed and converged to the drain outlet by gravity, thereby significantly improving the waste discharge efficiency, reducing the residual liquid on the surface of the base plate 15, and reducing the risk of secondary water mist emission due to liquid evaporation.

[0082] It should be further noted that in this embodiment, the quick-release drain connector 5 adopts a quick-release connection structure, which allows operators to quickly complete the disassembly and assembly without the aid of special tools, thereby significantly shortening the equipment maintenance and cleaning cycle. Simultaneously, the internal cavity of the quick-release drain connector 5 is lined with a polytetrafluoroethylene (PTFE) corrosion-resistant sealing liner. This PTFE corrosion-resistant sealing liner has excellent chemical corrosion resistance and self-lubricating properties, effectively resisting long-term erosion by silica-containing wastewater and preventing leakage or jamming due to corrosion inside the connector. The quick-release drain connector 5 and the base plate 15 are connected by a threaded seal, with a sealing element added at the threaded joint for sealing, thus forming a reliable double-sealing structure at the drain outlet. This ensures that the drain passage maintains excellent sealing and leak-proof performance while providing convenient quick disassembly and assembly.

[0083] Please refer to this again. Figure 2 In one embodiment of this invention, the first water-blocking mechanism 2 further includes a first water-blocking curtain 21 and a mobile drive module 22.

[0084] Specifically, the first water-blocking curtain 21 is horizontally arranged at the opening 4 at the top of the sealing water collection mechanism 1, forming a physical barrier for a local area of ​​the opening 4. The first water-blocking curtain 21 has a front end and a rear end arranged opposite to each other along the Y-axis direction, wherein the front end is the end of the first water-blocking curtain 21 closer to the front side plate 11, and the rear end is the end of the first water-blocking curtain 21 away from the front side plate 11. The front end of the first water-blocking curtain 21 is fixedly connected to the top of the front side plate 11, and its rear end is fixedly connected to the moving drive module 22.

[0085] The mobile drive module 22 is fixedly mounted on the base 100, located in the side area of ​​the sealing water collection mechanism 1. The mobile drive module 22 is configured to reciprocate linearly in the Y-axis direction. During wafer grinding, based on the real-time Y-axis position of the grinding head module 201, it drives the rear end of the first water curtain 21 to extend and retract in the Y-axis direction, thereby adjusting the effective coverage length and local blocking range of the first water curtain 21 at the opening 4. When the mobile drive module 22 drives the rear end of the first water curtain 21 to move towards the front side plate 11, the first water curtain 21 retracts as a whole, and its blocking range of the opening 4 decreases accordingly; conversely, when the rear end moves away from the front side plate 11, the first water curtain 21 extends as a whole, and its blocking range of the opening 4 increases accordingly. Through this telescopic dynamic adjustment mechanism, the first water-blocking mechanism 2 can flexibly adjust the size of the open area at the opening 4 according to the actual processing conditions. Under the premise of ensuring that the grinding head module 201 has sufficient movement space, it can effectively block the non-working area of ​​the opening 4, thereby significantly reducing the channel area for water mist and debris to escape upward from the top opening.

[0086] It should be further explained that, in this embodiment, the first water-blocking curtain 21 is made entirely of a flexible water-blocking material, and its curtain body is uniformly provided with an accordion pleat structure. The accordion pleats are continuously arranged along the Y-axis direction, giving the first water-blocking curtain 21 a foldable and telescopic characteristic along the Y-axis direction. Under the driving action of the moving drive module 22, the first water-blocking curtain 21 can achieve smooth telescopic deformation through the folding and unfolding of the accordion pleats, which not only ensures the flexibility and continuity of the blocking range adjustment, but also ensures that the first water-blocking curtain 21 always maintains a flat and taut state during the telescopic process, avoiding the formation of pleats and gaps due to the looseness of the curtain body, thereby ensuring the tightness of the blocking of the opening 4. At the same time, when the first water-blocking curtain 21 is in the extended state, the accordion pleat structure can form multiple folded sealing surfaces, effectively extending the leakage path of water mist and debris, and further improving the water-blocking and sealing effect.

[0087] Please refer to Figure 4 and Figure 5 In one embodiment of this example, the mobile drive module 22 further includes a first fixed plate 221, a first sliding plate 222, a first slider 223, a slide rail 224, a connecting frame 225, and a mobile drive unit 226.

[0088] Specifically, the two slide rails 224 are respectively fixedly installed on the outer surfaces of the left side plate 13 and the right side plate 14 of the sealing water collection mechanism 1, and both slide rails 224 extend parallel to each other along the Y-axis, thus forming a symmetrical double slide rail guide structure. The two first sliding plates 222 are slidably installed on their respective slide rails 224 via a first slider 223. A precision linear sliding pair is formed between the first slider 223 and the slide rail 224, allowing the first sliding plate 222 to perform smooth and precise linear reciprocating motion along the Y-axis under the guiding constraint of the slide rail 224.

[0089] The first fixing plate 221 is horizontally positioned above the opening 4, with one end fixedly connected to one of the first sliding plates 222 and the other end fixedly connected to the other first sliding plate 222, thus forming an integrated linkage frame structure with the two first sliding plates 222. The rear end of the first water curtain 21 is fixedly connected to the side of the first fixing plate 221. When the first fixing plate 221 moves along the Y-axis, it can simultaneously drive the rear end of the first water curtain 21 to perform telescopic displacement, thereby realizing dynamic adjustment of the blocking range of the opening 4.

[0090] The mobile drive unit 226 is fixedly mounted on the base 100, located in the side area of ​​the sealing water collection mechanism 1. The drive output end of the mobile drive unit 226 is fixedly connected to the first fixed plate 221 or one of the first sliding plates 222 via the connecting frame 225, and is used to output linear driving force along the Y-axis direction according to control commands during the grinding process. The mobile drive unit 226 drives the first fixed plate 221, the two first sliding plates 222, and the corresponding first slider 223 to move synchronously along the slide rail 224 via the connecting frame 225, and then the first fixed plate 221 pulls the rear end of the first water curtain 21 to complete the telescopic adjustment in the Y-axis direction. Through the above-mentioned design of the double slide rail symmetrical guide and integrated linkage frame structure, the first water curtain 21 can maintain balanced force at both ends and run smoothly during telescopic movement, effectively avoiding curtain tilting or jamming caused by unilateral force, and ensuring the reliability and repeatability of dynamic blocking.

[0091] It should be further explained that, in this embodiment, the top region of the first fixing plate 221 is also provided with a notch structure. This notch structure, on the one hand, reduces the overall weight by removing some redundant material from the top of the first fixing plate 221, thereby reducing the driving load on the moving drive unit 226, improving response speed, and reducing energy consumption; on the other hand, the notch structure provides necessary clearance for the wafer loading robot in the working area above the opening 4, effectively preventing structural interference between the first fixing plate 221 and the wafer loading robot during its movement, thus ensuring smooth connection between the loading / unloading process and the grinding process, and improving the overall automation efficiency and operational safety of the machine.

[0092] Please refer to this again. Figure 4 In one embodiment of this invention, the mobile drive module 22 further includes a guide bar 227.

[0093] Two guide strips 227 are respectively fixedly disposed on the inner surfaces of the left side plate 13 and the right side plate 14 facing the internal cavity of the sealing water collection mechanism 1, and both guide strips 227 extend parallel to each other along the Y-axis and are respectively arranged opposite to the corresponding slide rails 224 in the horizontal direction. Each guide strip 227 has a guide groove extending through along the Y-axis, and the two sides of the first water curtain 21 along the Y-axis are respectively slidably embedded in the corresponding guide groove, thereby forming an embedded sliding guide constraint on the two sides of the first water curtain 21. During the process of the mobile drive unit 226 driving the first water curtain 21 to extend and retract in the Y-axis direction, the two side walls of the guide groove can continuously limit the lateral movement and support the two side edges of the first water curtain 21, effectively preventing the first water curtain 21 from shifting laterally, lifting its edges, or wrinkling and deforming due to the flexible material properties during the extension and retraction process. This ensures that the first water curtain 21 always maintains a flat and taut state and stably covers the opening 4, thereby significantly improving the local sealing tightness of the opening 4 and further suppressing water mist and debris from escaping outward from the lateral gap between the first water curtain 21 and the left side plate 13 and the right side plate 14.

[0094] In another alternative embodiment, the guide strip 227 can be omitted, and the guide groove can be integrally formed on the inner surfaces of the left side plate 13 and the right side plate 14 by machining. The two side edges of the first water curtain 21 are also slidably installed within the guide grooves corresponding to the inner surfaces of the left side plate 13 and the right side plate 14. This alternative solution integrates the guiding function into the plate structure of the left side plate 13 and the right side plate 14, eliminating the need for additional guide strip parts and corresponding assembly and debugging processes. This effectively simplifies the overall structure, reduces the number of parts and cumulative assembly errors, lowers manufacturing costs and post-maintenance complexity, while maintaining the same guiding constraint and water-blocking sealing effect.

[0095] Please refer to this again. Figure 2 and in conjunction with references Figure 3 In one embodiment of this invention, the second water-blocking mechanism 3 further includes a second water-blocking curtain 31, a third water-blocking curtain 32, a fourth water-blocking curtain 33, and an installation module 34.

[0096] Specifically, the second water curtain 31 is horizontally arranged at the opening 4, having a front end and a rear end arranged opposite each other along the Y-axis. The front end of the second water curtain 31 is fixedly connected to the mounting module 34, and the rear end is fixedly connected to the top of the rear side plate 12. The second water curtain 31 is configured to telescopically move in the Y-axis direction. When the mounting module 34 moves in the Y-axis direction, the front end of the second water curtain 31 moves synchronously with the mounting module 34, while its rear end remains fixedly connected to the rear side plate 12. This allows the overall coverage length of the second water curtain 31 to change through stretching or compression in the Y-axis direction, dynamically adjusting its local occlusion range of the opening 4.

[0097] The third water curtain 32 and the fourth water curtain 33 are both disposed at the opening 4 and are fixedly connected to the mounting module 34. The third water curtain 32 and the fourth water curtain 33 are configured to move synchronously as a whole with the mounting module 34 in the Y-axis direction. Their effective coverage length in the Y-axis direction remains constant, and their shape does not undergo significant expansion or contraction during movement. They are used to cooperate with the second water curtain 31 and the first water curtain 21 to construct a circumferential enclosed barrier around the grinding head module 201 at the opening 4.

[0098] The mounting module 34 is fixedly mounted on the Y-axis moving module 202 of the three-axis grinding mechanism 200. The mounting module 34 is configured to move synchronously with the Y-axis moving module 202 in the Y-axis direction, thereby tracking the processing position of the grinding head module 201 in the Y-axis direction in real time. During the wafer grinding process, the mounting module 34 serves as a common support and driving base for the second water curtain 31, the third water curtain 32, and the fourth water curtain 33, synchronously driving the second water curtain 31, the third water curtain 32, and the fourth water curtain 33 to move in the Y-axis direction.

[0099] The second water-blocking curtain 31 extends and retracts under the drive of the mounting module 34, while the third water-blocking curtain 32 and the fourth water-blocking curtain 33 move as a whole under the drive of the mounting module 34. Through the coordinated operation of the above-mentioned differentiated movement modes, the second water-blocking curtain 31, the third water-blocking curtain 32, and the fourth water-blocking curtain 33 form a counter-cooperative relationship with the first water-blocking curtain 21 of the first water-blocking mechanism 2. Together, they form a dynamic enclosed shielding structure around the grinding head module 201 at the opening 4.

[0100] As the grinding head module 201 changes its processing position along the Y-axis, the mounting module 34 moves in real time following the Y-axis moving module 202, causing the second water curtain 31, the third water curtain 32, and the fourth water curtain 33 to adjust their spatial positions synchronously. This is in real-time adaptation to the telescopic adjustment of the first water curtain 21, ensuring that each water curtain always forms a continuous, closed, and dynamically enclosing barrier around the grinding head module 201. This dynamic enclosing barrier structure can adaptively adjust the blocking range on each side according to the real-time Y-axis coordinate of the grinding head module 201. While ensuring sufficient movement space for the grinding head module 201, it minimizes the opening gap at the opening 4, effectively confining grinding debris and water mist within the internal cavity of the sealing water collection mechanism 1, significantly improving the dynamic sealing performance of the grinding station.

[0101] Please refer to this again. Figure 3 and Figure 4 In one embodiment of this example, the mounting module 34 further includes a second fixing plate 341, a second sliding plate 342, a second slider 343, a third fixing plate 344, a fourth fixing plate 345, and a fifth fixing plate 346.

[0102] Specifically, the two second sliding plates 342 are slidably mounted on the corresponding slide rails 224 via a second slider 343, and at least one second sliding plate 342 is fixedly connected to the Y-axis moving module 202. Thus, the Y-axis moving module 202 directly provides the driving force in the Y-axis direction, enabling the second sliding plate 342 to perform precise and stable linear reciprocating motion along the Y-axis direction under the guiding constraint of the slide rail 224. By sharing the same set of slide rails 224 with the first water-blocking mechanism 2, the overall mechanical structure is effectively simplified, the number of parts and assembly processes are reduced, and manufacturing and maintenance costs are lowered. At the same time, it ensures that the first water-blocking mechanism 2 and the second water-blocking mechanism 3 have a unified reference guide in the Y-axis direction, improving the consistency of their motion trajectories and the accuracy of their opposing coordination.

[0103] The second fixing plate 341 is horizontally positioned above the opening 4, with one end fixedly connected to one of the second sliding plates 342 and the other end fixedly connected to the other second sliding plate 342, thus forming an integrated linkage frame between the second fixing plate 341 and the two second sliding plates 342. The front end of the second water curtain 31 is fixedly connected to the side of the second fixing plate 341 facing the center of the opening 4. When the second sliding plate 342 moves along the Y-axis direction under the drive of the Y-axis moving module 202, the second fixing plate 341 simultaneously pulls the front end of the second water curtain 31 to move, while the rear end of the second water curtain 31 remains fixedly connected to the rear side plate 12, thereby realizing the telescopic movement adjustment of the second water curtain 31 in the Y-axis direction.

[0104] The fifth fixing plate 346 is also horizontally positioned above the opening 4, with one end of the fifth fixing plate 346 fixedly connected to one of the second sliding plates 342 and the other end fixedly connected to the other second sliding plate 342, thereby forming another integrated linkage frame with the second sliding plates 342. The fifth fixing plate 346 and the second fixing plate 341 are arranged at intervals in the Y-axis direction, forming a lateral installation space between them for accommodating the third water curtain 32 and the fourth water curtain 33.

[0105] The third fixing plate 344 and the fourth fixing plate 345 are respectively located at the opening 4. One end of the third fixing plate 344 is slidably mounted on the fifth fixing plate 346 along the X-axis, and the other end is slidably mounted on the second fixing plate 341 along the X-axis. Similarly, one end of the fourth fixing plate 345 is slidably mounted on the fifth fixing plate 346 along the X-axis, and the other end is slidably mounted on the second fixing plate 341 along the X-axis. Through this sliding mounting structure along the X-axis, the third fixing plate 344 and the fourth fixing plate 345 can slide linearly relative to the second fixing plate 341 and the fifth fixing plate 346 along the X-axis, respectively, thereby providing guiding support for the telescopic movement of the third water curtain 32 and the fourth water curtain 33 along the X-axis.

[0106] The third water curtain 32 is disposed at the opening 4 and has a left side and a right side arranged opposite to each other along the X-axis. The left side is the side of the third water curtain 32 closer to the left side plate 13, and the right side is the side of the third water curtain 32 away from the left side plate 13. The left side of the third water curtain 32 is fixedly connected to the second sliding plate 342 near the left side plate 13, and the right side of the third water curtain 32 is fixedly connected to the side of the third fixed plate 344 facing the left side plate 13.

[0107] The fourth water curtain 33 is also located at the opening 4, and has a left side and a right side arranged opposite to each other along the X-axis. The right side of the fourth water curtain 33 is fixedly connected to the second sliding plate 342 near the right side plate 14, and the left side of the fourth water curtain 33 is fixedly connected to the side of the fourth fixed plate 345 facing the right side plate 14.

[0108] It should be further explained that, in this embodiment, the second water-blocking mechanism 3 and the first water-blocking mechanism 2 share the same set of slide rails 224 arranged along the Y-axis. This shared guide structure not only effectively reduces the space occupied by the equipment in the Y-axis direction and improves the structural compactness, but also ensures that the first water-blocking mechanism 2 and the second water-blocking mechanism 3 have completely parallel motion references in the Y-axis direction, which facilitates high-precision opposing dynamic coordination.

[0109] During movement along the Y-axis, the third and fourth water curtains 32 and 33, driven by the second sliding plate 342, move synchronously with the Y-axis moving module 202. Their positions along the Y-axis correspond in real time to the Y-axis coordinates of the grinding head module 201, ensuring continuous lateral shielding within the Y-axis travel range of the grinding head module 201. Simultaneously, the third and fourth water curtains 32 and 33 can also extend and retract along the X-axis. Specifically, when the third and fourth fixing plates 344 and 345 slide along the X-axis, they can respectively stretch or compress the third and fourth water curtains 32 and 33 in the X-axis direction. This dynamically adjusts the effective coverage width of the water curtains on both sides according to the real-time position of the grinding head module 201 in the X-axis direction or wafer size differences, achieving adaptive shielding in the X-axis direction. By combining overall servo movement in the Y-axis direction with independent telescopic adjustment in the X-axis direction, the third water curtain 32 and the fourth water curtain 33 can flexibly adjust the spatial coverage range in a two-dimensional plane. Together with the first water curtain 21 and the second water curtain 31, they construct a dynamic enclosed shielding barrier around the grinding head module 201 at the opening 4, which can adaptively adjust within the XYZ three-axis stroke range. This ensures the freedom of movement of the grinding head while maximizing the compression of the opening gap.

[0110] Please refer to this again. Figure 4 In one embodiment of this invention, the enclosed automatic water-blocking device further includes a stroke-sensing closed-loop control component 6.

[0111] The stroke-sensing closed-loop control component 6 is electrically connected to the control system of the wafer grinding equipment, forming a key detection link in the grinding process safety interlock circuit. The stroke-sensing closed-loop control component 6 is configured to sense the relative positional relationship between the first sliding plate 222 of the first water-blocking mechanism 2 and the second sliding plate 342 of the second water-blocking mechanism 3 in the Y-axis direction in real time, and feed back the detected position signal to the control system of the wafer grinding equipment in real time.

[0112] The control system of the wafer grinding equipment performs a logical judgment on the enclosed shielding state formed by the first water-blocking mechanism 2 and the second water-blocking mechanism 3 at the opening 4 based on the position signal fed back by the stroke sensing closed-loop control component 6, thereby realizing safe interlock control of the grinding action. Specifically, when the stroke sensing closed-loop control component 6 senses that the relative position between the first sliding plate 222 and the second sliding plate 342 reaches a preset close threshold, it indicates that the first water-blocking curtain 21, the second water-blocking curtain 31, the third water-blocking curtain 32, and the fourth water-blocking curtain 33 have formed a dynamic enclosed shielding sufficient to meet the sealing requirements around the grinding head module 201 at the opening 4. At this time, the control system of the wafer grinding equipment determines that the grinding station is in a safe closed state and allows the grinding action to be started or continued. Conversely, when the stroke sensing closed-loop control component 6 senses that the relative position between the first sliding plate 222 and the second sliding plate 342 reaches a preset relatively far threshold, it indicates that the distance between the first water-blocking mechanism 2 and the second water-blocking mechanism 3 is too large, and there is a significant open gap at the opening 4, failing to form a sufficiently sealed enclosed shield around the grinding head module 201. At this time, the control system of the wafer edge grinding equipment determines that the grinding station is not in a safe closed state, prohibits the start of the grinding action or immediately interrupts the ongoing grinding process, thereby effectively preventing the grinding process from being carried out under insufficient water-blocking seal, which would lead to debris splashing and water mist leakage, fundamentally avoiding equipment pollution, detection misjudgment and personnel safety hazards caused by seal failure.

[0113] In this embodiment, the travel sensing closed-loop control component 6 further includes a sensor 61 and a sensing element 62.

[0114] One of the sensor 61 and the sensing plate 62 is fixedly mounted on the first sliding plate 222, and the other is correspondingly fixedly mounted on the second sliding plate 342. They are arranged opposite each other in the Y-axis direction and maintain an appropriate sensing distance. When the first sliding plate 222 and the second sliding plate 342 undergo relative displacement in the Y-axis direction, the relative position between the sensor 61 and the sensing plate 62 changes accordingly. The sensor 61 detects the approach or departure of the sensing plate 62 and outputs an electrical signal characterizing their relative positional relationship in real time. The sensor 61 can be a position detection element known in the art, such as a proximity sensor, a photoelectric sensor, or a magnetic induction sensor. The sensing plate 62 is made of a sensing material that matches the sensor 61 to ensure the sensitivity and reliability of position detection. By directly arranging the sensor 61 and the sensing plate 62 on the first sliding plate 222 and the second sliding plate 342 that participate in forming the enclosing barrier, the stroke sensing closed-loop control component 6 can directly and accurately reflect the actual enclosing distance between the first water-blocking mechanism 2 and the second water-blocking mechanism 3, avoiding the cumulative error caused by indirect measurement, and significantly improving the accuracy and response speed of safety interlock determination.

[0115] Although this invention frequently uses terms such as sealing water collection mechanism and first water-blocking mechanism, the possibility of using other terms is not excluded. These terms are used merely for the convenience of describing and explaining the essence of this invention; interpreting them as any additional limitation would contradict the spirit of this invention.

[0116] Finally, it should be noted that although the above embodiments have been described in the description and drawings of this invention, this should not limit the scope of patent protection of this invention. Any technical solutions that are based on the essential concept of this invention, utilize the content described in the description and drawings of this invention to make equivalent structural or procedural substitutions or modifications, as well as the direct or indirect application of the technical solutions of the above embodiments to other related technical fields, are all included within the scope of patent protection of this invention.

Claims

1. A surround-type automatic water-blocking device, applied to a wafer grinding equipment, the equipment comprising a base (100), a three-axis grinding mechanism (200), and a wafer vacuum adsorption stage (300), wherein the three-axis grinding mechanism (200) and the wafer vacuum adsorption stage (300) are respectively disposed on the base (100), characterized in that, The device includes: A sealing water collection mechanism (1) is provided on the base (100); the sealing water collection mechanism (1) is hollow inside, with an opening (4) at the top for the grinding head module (201) of the three-axis grinding mechanism (200) to enter the interior, and an avoidance opening at the bottom for the wafer vacuum adsorption stage (300) to enter the interior, for collecting debris and water mist generated during wafer grinding; The first water-blocking mechanism (2) is disposed on the base (100) and at the opening (4), and can move in the Y direction to form a dynamic local shielding at the opening (4) during the wafer grinding process; The second water-blocking mechanism (3) is set on the Y-axis moving module (202) of the three-axis grinding mechanism (200) and at the opening (4). It can move synchronously with the Y-axis moving module (202) in the Y direction. It is used to cooperate with the first water-blocking mechanism (2) in the opposite direction during the wafer grinding process to form a dynamic enclosed shield around the grinding head module (201) at the opening (4).

2. The enclosed automatic water-blocking device according to claim 1, characterized in that, The sealing water collection mechanism (1) includes a front side plate (11), a rear side plate (12), a left side plate (13), a right side plate (14), and a bottom plate (15). The front side panel (11), left side panel (13), rear side panel (12) and right side panel (14) are connected end to end to enclose and form the opening (4). The base plate (15) is connected to the bottom of the front side plate (11), the rear side plate (12), the left side plate (13) and the right side plate (14), and the clearance opening is opened on the base plate (15).

3. The enclosed automatic water-blocking device according to claim 2, characterized in that, The base plate (15) is also provided with a drain outlet; The drain outlet is connected to the drain pipe via a quick-release drain connector (5) to discharge the collected debris and water mist.

4. The enclosed automatic water-blocking device according to claim 3, characterized in that, The bottom plate (15) has a guide groove on its bottom surface facing the inside of the sealing water collection mechanism (1), and the guide groove is arranged at an angle toward the sewage outlet.

5. The enclosed automatic water-blocking device according to claim 2, characterized in that, The first water-blocking mechanism (2) includes a first water-blocking curtain (21) and a moving drive module (22); The first water curtain (21) is located at the opening (4), and its front end is connected to the front side plate (11), and its rear end is connected to the mobile drive module (22); the front end is the end close to the front side plate (11), and the rear end is the end away from the front side plate (11); The mobile drive module (22) is disposed on the base (100) and can move in the Y direction. It is used to drive the first water curtain (21) to move in the Y direction during the wafer grinding process, so as to adjust the local blocking range of the first water curtain (21) on the opening (4).

6. The enclosed automatic water-blocking device according to claim 5, characterized in that, The mobile drive module (22) includes a first fixed plate (221), a first sliding plate (222), a first slider (223), a slide rail (224), a connecting frame (225), and a mobile drive unit (226). The two slide rails (224) are respectively disposed on the outer surfaces of the left side plate (13) and the right side plate (14), and extend along the Y direction; The two first sliding plates (222) are slidably mounted on the corresponding slide rails (224) via a first slider (223); The first fixing plate (221) is located at the opening (4), and one end is connected to one of the first sliding plates (222), and the other end is connected to the other first sliding plate (222); the rear end of the first water curtain (21) is connected to the side of the first fixing plate (221); The mobile drive unit (226) is disposed on the base (100) and connected to the first fixed plate (221) or one of the first sliding plates (222) through the connecting frame (225). It can move in the Y direction to drive the first water curtain (21), the first fixed plate (221), the first sliding plate (222) and the first slider (223) to move along the slide rail (224).

7. The enclosed automatic water-blocking device according to claim 6, characterized in that, The mobile drive module (22) also includes a guide bar (227); The two guide strips (227) are respectively disposed on the inner surfaces of the left side plate (13) and the right side plate (14), extending along the Y direction, and having guide grooves. The first water curtain (21) is slidably installed in the corresponding guide groove on both sides; Alternatively, guide grooves may be provided on the inner surfaces of the left side plate (13) and the right side plate (14); The first water curtain (21) is slidably installed in the corresponding guide groove on both sides.

8. The enclosed automatic water-blocking device according to claim 6, characterized in that, The second water-blocking mechanism (3) includes a second water-blocking curtain (31), a third water-blocking curtain (32), a fourth water-blocking curtain (33), and an installation module (34); The second water curtain (31) is located at the opening (4), and its front end is connected to the mounting module (34), and its rear end is connected to the rear side plate (12); The third water curtain (32) is located at the opening (4) and is connected to the installation module (34); The fourth water curtain (33) is located at the opening (4) and is connected to the installation module (34); The mounting module (34) is mounted on the Y-axis moving module (202) and can move synchronously with the Y-axis moving module (202) in the Y direction. During the wafer grinding process, it drives the second water curtain (31), the third water curtain (32) and the fourth water curtain (33) to move in the Y direction to cooperate with the first water curtain (21). This allows the second water curtain (31), the third water curtain (32) and the fourth water curtain (33) to work together with the first water curtain (21) at the opening (4) to form a dynamic enclosed shield around the grinding head module (201).

9. The enclosed automatic water-blocking device according to claim 8, characterized in that, The mounting module (34) includes a second fixing plate (341), a second sliding plate (342), a second slider (343), a third fixing plate (344), a fourth fixing plate (345), and a fifth fixing plate (346). Two second sliding plates (342) are respectively mounted on the corresponding slide rails (224) via a second slider (343); at least one second sliding plate (342) is connected to the Y-axis moving module (202); The second fixing plate (341) is located at the opening (4), and one end is connected to one of the second sliding plates (342), and the other end is connected to the other second sliding plate (342); the front end of the second water curtain (31) is connected to the side of the second fixing plate (341); The fifth fixing plate (346) is located at the opening (4), and one end is connected to one of the second sliding plates (342), and the other end is connected to the other second sliding plate (342); The third fixing plate (344) and the fourth fixing plate (345) are respectively located at the opening (4), and one end is slidably installed on the fifth fixing plate (346) along the X direction, and the other end is slidably installed on the second fixing plate (341) along the X direction. The left side of the third water curtain (32) is connected to the second sliding plate (342) near the left side plate (13), and the right side is connected to the side of the third fixed plate (344); the left side is the side near the left side plate (13), and the right side is the side away from the left side plate (13). The right side of the fourth water curtain (33) is connected to the second sliding plate (342) near the right side plate (14), and the left side is connected to the side of the fourth fixed plate (345).

10. The enclosed automatic water-blocking device according to claim 9, characterized in that, The device also includes a stroke sensing closed-loop control component (6), which is electrically connected to the wafer grinding equipment and is used to sense the relative position between the first sliding plate (222) and the second sliding plate (342) and feed it back to the wafer grinding equipment to achieve a safe interlock for the grinding action; The stroke sensing closed-loop control component (6) includes a sensor (61) and a sensing plate (62). One of the sensor (61) and the sensing sheet (62) is disposed on the first sliding plate (222), and the other is disposed on the second sliding plate (342).

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