A flange polishing apparatus with a swarf adsorption structure and a method of using the same

Abstract

The present application relates to the technical field of flange polishing, in particular to a flange polishing device with waste chip adsorption structure, comprising a polishing mechanism, which comprises a polishing table, the top of the polishing table is fixedly connected with an electric cylinder, the output end of the electric cylinder is fixedly connected with a transmission plate penetrating into the inside of the polishing table, the bottom of the transmission plate is fixedly connected with a motor, the output end of the motor is fixedly connected with a grinding disc, and the bottom of the inner wall of the polishing table is fixedly connected with a positioning seat; an air extraction mechanism, which comprises an air extraction pump, the top of the air extraction pump is fixedly connected with the front side of the bottom of the transmission plate, the flange is fixed on the polishing mechanism, and then the polishing mechanism is started to polish the flange; after polishing is completed, the air extraction mechanism is started to extract and clean the chips generated during polishing; and the gas discharged in the process of starting the air extraction mechanism enters the air injection mechanism to blow the chips on the surface of the flange.

Description

Technical Field

[0001] This invention relates to the technical field of flange polishing, and more particularly to a flange polishing device with a waste chip adsorption structure and its usage method. Background Technology

[0002] As a core component in pipeline connections and mechanical equipment, the surface polishing precision of flanges directly affects sealing performance and assembly reliability. The polishing process is a crucial step in flange production. During flange polishing, a large amount of fine metal shavings, oxide scale, and abrasive particles are generated. Effective cleaning of these debris is essential for ensuring polishing quality, production safety, and equipment lifespan.

[0003] The existing debris removal structure of flange polishing equipment has obvious defects. Most of them adopt a single negative pressure adsorption method. Due to the limitations of the flange's annular irregular structure, blind adsorption zones are easily formed in areas such as end faces, holes, and dead corners of steps. Debris is easy to hide and remain, making it difficult to remove completely. At the same time, the fine debris generated by high-speed polishing is easily dispersed and adhered by centrifugal force and static electricity. Not only is it not easy to be sucked up and cleaned by negative pressure, but it will also cause scratches on the polished surface and affect the processing accuracy. Summary of the Invention

[0004] The purpose of this section is to outline some aspects of embodiments of the present invention and to briefly describe some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be construed as limiting the scope of the invention.

[0005] In view of the problems existing in the flange polishing equipment with waste adsorption structure, the present invention is proposed.

[0006] Therefore, the purpose of this invention is to provide a flange polishing device with a waste adsorption structure, which aims to clean polishing debris and improve the cleaning effect.

[0007] To solve the above-mentioned technical problems, the present invention provides the following technical solution: including, A polishing mechanism includes a polishing table, an electric cylinder fixedly connected to the top of the polishing table, a transmission plate fixedly connected to the output end of the electric cylinder through the inner side of the polishing table, a motor fixedly connected to the bottom of the transmission plate, a grinding disc fixedly connected to the output end of the motor, and a positioning seat fixedly connected to the bottom of the inner wall of the polishing table. An air extraction mechanism includes an air pump, the top of which is fixedly connected to the front side of the bottom of a transmission plate; a mounting plate is movably fitted onto the surface of the motor output end; a rubber baffle is fixedly connected to the bottom of the mounting plate; a dust extraction ring is fixedly connected to the bottom of the mounting plate; a filter box is connected to the input end of the air pump; and a filter cover is fixedly connected inside the filter box. The jet mechanism includes a jet ring fitted on the surface of the suction ring. An air inlet pipe is connected to the top of the jet ring, extending from the top of the air inlet pipe to the top of the mounting plate. A plurality of air-gathering holes are formed at the bottom of the inner wall of the jet ring and are distributed in a ring at equal intervals. An extended air guide pipe is connected to the bottom of the air-gathering holes. A jet hole is formed on the surface of the extended air guide pipe and is also distributed in a ring at equal intervals. The suction pump has two output ends located at the top of both sides of the pump. A limiting block is fixedly connected to the top of the output ends of the suction pump, located at the top of the end of the air inlet pipe furthest from the mounting plate.

[0008] As a preferred embodiment of the flange polishing device with waste adsorption structure described in this invention, the bottom of the filter cover is threadedly connected to a sealing cover, and the bottom of the sealing cover is connected to a one-way air inlet valve.

[0009] In a preferred embodiment of the flange polishing equipment with a waste adsorption structure described in this invention, the one-way air inlet valve is connected to the dust extraction ring via a hose, and a limit rod is fixedly connected to the top of the mounting plate.

[0010] As a preferred embodiment of the flange polishing equipment with waste adsorption structure described in this invention, the limiting rods are provided in three and are distributed in a ring at equal intervals, and the bottom of the mounting plate is provided with a limiting groove.

[0011] As a preferred embodiment of the flange polishing equipment with waste adsorption structure described in this invention, the limiting grooves are provided in three equidistant rings, and the inner wall of the limiting grooves is slidably connected to the surface of the limiting rod.

[0012] In a preferred embodiment of the flange polishing device with a waste adsorption structure described in this invention, a limiting plate is fixedly connected to the top of the limiting rod, and the diameter of the limiting plate is larger than the diameter of the inner wall of the limiting groove.

[0013] In a preferred embodiment of the flange polishing device with waste adsorption structure described in this invention, a tension spring is fixedly connected to the bottom of the limiting plate, and the other end of the tension spring is fixedly connected to the top of the mounting plate.

[0014] In a preferred embodiment of the flange polishing equipment with a waste adsorption structure described in this invention, a bearing sleeve is fixedly connected inside the mounting plate, and the mounting plate is movably sleeved on the surface of the motor drive end through the bearing sleeve.

[0015] The beneficial effects of the present invention are as follows: the flange is fixed on the polishing mechanism, and then the polishing mechanism is started to polish the flange. After polishing is completed, the debris generated during polishing is extracted and cleaned by starting the air extraction mechanism. During the process of starting the air extraction mechanism, the gas discharged enters the air jet mechanism to blow air onto the debris on the flange surface.

[0016] In view of the problems existing in the flange polishing equipment with waste adsorption structure, the present invention is proposed.

[0017] Therefore, the purpose of this invention is to provide a method for using a flange polishing device with a waste adsorption structure, the purpose of which is to blow air to remove the debris generated during polishing from the flange, and to extract the debris in conjunction with an air extraction method.

[0018] To solve the above-mentioned technical problems, the present invention provides the following technical solution: including, The flange is polished using a polishing machine; Use an air extraction mechanism to remove and clean up the debris generated during polishing; Use an air jet mechanism to blow air onto the flange surface to remove debris.

[0019] As a preferred embodiment of the method of using the flange polishing equipment with waste adsorption structure described in this invention, it further includes: Fix the flange onto the polishing mechanism, and then start the polishing mechanism to polish the flange; After polishing is completed, the air extraction mechanism is activated to remove and clean the debris generated during polishing. During the activation of the suction mechanism, the exhaust gas enters the jetting mechanism to blow air onto the flange surface to remove debris.

[0020] The beneficial effects of the present invention are as follows: the flange is fixed on the polishing mechanism, and then the polishing mechanism is started to polish the flange. After polishing is completed, the debris generated during polishing is extracted and cleaned by starting the air extraction mechanism. During the process of starting the air extraction mechanism, the gas discharged enters the air jet mechanism to blow air onto the debris on the flange surface. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein: Figure 1 This is a schematic diagram of the overall structure of the present invention.

[0022] Figure 2 A three-dimensional structural diagram of the transmission plate provided by the present invention.

[0023] Figure 3 A three-dimensional structural diagram of the mounting plate provided by the present invention.

[0024] Figure 4 This is a cross-sectional structural diagram of the dust extraction ring provided by the present invention.

[0025] Figure 5 This is an exploded view of the filter box provided by the present invention. Detailed Implementation

[0026] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0027] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.

[0028] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that is mutually exclusive with other embodiments.

[0029] Secondly, the present invention is described in detail with reference to the schematic diagrams. When detailing the embodiments of the present invention, for ease of explanation, the cross-sectional views illustrating the device structure may be partially enlarged, not according to the usual scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of the present invention. In addition, actual fabrication should include three-dimensional spatial dimensions of length, width, and depth.

[0030] Example 1

[0031] Reference Figures 1-5 The first embodiment of the present invention provides a method for using a flange polishing device with a waste adsorption structure, which realizes the blowing of the debris generated during polishing to remove it from the flange, and the extraction of the debris in conjunction with the air extraction method.

[0032] Fix the flange onto the polishing mechanism 100, and then start the polishing mechanism 100 to descend to the bottom to polish the flange.

[0033] When the polishing mechanism 100 descends to its lowest point, it will drive the air extraction mechanism 200 to cover the flange, preventing polishing debris from flying outwards. After polishing is completed, the air extraction mechanism 200 will be activated to extract and clean the debris generated during polishing.

[0034] When the polishing mechanism 100 descends to its lowest point, the jetting mechanism 300 connects with the suction mechanism 200, allowing the gas discharged during the activation of the suction mechanism 200 to enter the jetting mechanism 300 and loosen the debris adhering to the flange surface, thus facilitating its removal and cleaning. Then, the polishing mechanism 100 is slightly raised, disconnecting the jetting mechanism 300 from the suction mechanism 200. At this point, the suction mechanism 200 fully exhausts the loosened debris for cleaning.

[0035] Example 2

[0036] Reference Figures 1-5 In the second embodiment of the present invention, a polishing mechanism 100 is provided to polish the flange.

[0037] The polishing mechanism 100 includes a polishing table 101. An electric cylinder 102 is fixedly connected to the top of the polishing table 101. The output end of the electric cylinder 102 extends through to the inner side of the polishing table 101 and is fixedly connected to a transmission plate 103. A motor 104 is fixedly connected to the bottom of the transmission plate 103. A grinding disc 105 is fixedly connected to the output end of the motor 104. A positioning seat 106 is fixedly connected to the bottom of the inner wall of the polishing table 101.

[0038] The operator places the flange to be polished stably on the positioning seat 106 at the bottom of the inner wall of the polishing table 101. The limiting structure of the positioning seat 106 enables the flange to be quickly centered and fixed, ensuring that the flange will not shift or shake during the polishing process and guaranteeing polishing accuracy. Then, the electric cylinder 102 fixed at the top of the polishing table 101 is activated. The output end of the electric cylinder 102 extends downward, driving the transmission plate 103 fixed to it to move down synchronously. The motor 104 fixed at the bottom of the transmission plate 103 and the grinding disc 105 at the output end of the motor 104 move down accordingly until the grinding disc 105 adheres to the surface of the flange to be polished. At this time, the electric cylinder 102 stops moving down and maintains its current position. Next, the motor 104 is started, and the output end of the motor 104 drives the polishing disc 105 to rotate at high speed to polish the flange surface. During the polishing process, the electric cylinder 102 can slowly adjust the height of the transmission plate 103 according to the preset polishing parameters to ensure that the polishing disc 105 maintains a stable contact pressure with the flange surface, adapting to the processing needs of flanges with different thicknesses and polishing precision requirements. After polishing is completed, the motor 104 stops running, the output end of the electric cylinder 102 retracts upward, driving the transmission plate 103, the motor 104 and the polishing disc 105 to move upward synchronously and detach from the flange surface. The operator can then remove the polished flange, completing a single polishing operation.

[0039] Example 3

[0040] Reference Figures 1-5 In the third embodiment of the present invention, an air extraction mechanism 200 and an air jet mechanism 300 are provided to loosen and extract the polished debris.

[0041] The air extraction mechanism 200 includes an air pump 201. The top of the air pump 201 is fixedly connected to the front side of the bottom of the transmission plate 103. A mounting plate 202 is movably sleeved on the surface of the output end of the motor 104. A rubber baffle 203 is fixedly connected to the bottom of the mounting plate 202. A dust extraction ring 204 is fixedly connected to the bottom of the mounting plate 202. A filter box 205 is connected to the input end of the air pump 201. A filter cover 206 is fixedly connected inside the filter box 205. A sealing cover 207 is threadedly connected to the bottom of the filter cover 206. The bottom of the sealing cover 207 is connected to... A one-way air intake valve 208 is connected to a dust extraction ring 204 via a hose. Three limit rods 209 are fixedly connected to the top of the mounting plate 202, arranged in a ring at equal intervals. Three limit grooves 210 are also provided at the bottom of the mounting plate 202, arranged in a ring at equal intervals. The inner wall of the limit groove 210 slides against the surface of the limit rod 209. A limit disc 211 is fixedly connected to the top of the limit rod 209. The diameter of the limit disc 211 is larger than the diameter of the inner wall of the limit groove 210. A tension spring 212 is fixedly connected to the bottom of the disc 211, and the other end of the tension spring 212 is fixedly connected to the top of the mounting plate 202. A bearing sleeve 213 is fixedly connected inside the mounting plate 202, and the mounting plate 202 is movably sleeved on the surface of the transmission end of the motor 104 through the bearing sleeve 213. The jet mechanism 300 includes a jet ring 301, which is sleeved on the surface of the suction ring. An air inlet pipe 302 is connected to the top of the jet ring 301, and the top of the air inlet pipe 302 extends to the top of the mounting plate 202. A converging point is opened at the bottom of the inner wall of the jet ring 301. The air vent 303 has several air-gathering vents that are evenly distributed in a ring. The bottom of the air-gathering vent 303 is connected to an extended air guide pipe 304. The surface of the extended air guide pipe 304 has several air-jet vents 305 that are evenly distributed in a ring. The air pump 201 has two output ends. The two output ends of the air pump 201 are located at the top of both sides of the air pump 201. A limit block 306 is fixedly connected to the top of the output end of the air pump 201. The limit block 306 is located at the top of the end of the air inlet pipe 302 away from the mounting plate 202.

[0042] During the downward movement of the transmission plate 103 of the polishing mechanism 100, the mounting plate 202, which is movably sleeved at the output end of the motor 104, moves downward synchronously. The rubber baffle 203 fixed at the bottom of the mounting plate 202 first adheres to the bottom of the inner wall of the polishing table 101, completely enclosing the flange and grinding disc 105 in the enclosed space to prevent polishing debris from scattering outward. At the same time, the air jet ring 301 sleeved on the surface of the dust extraction ring 204 moves downward synchronously with the mounting plate 202. The top of the air intake pipe 302 connected to the top of the air jet ring 301 aligns with the output ends on both sides of the top of the air pump 201. The limiting block 306 at the top of the output end of the air pump 201 limits the air intake pipe 302. To ensure precise connection between the air inlet pipe 302 and the output end of the vacuum pump 201 and prevent gas leakage, after the polishing operation starts, the motor 104 drives the polishing disc 105 to rotate at high speed for polishing. At this time, the vacuum pump 201 is not started temporarily to avoid airflow interfering with the polishing accuracy. After the polishing operation is completed and the motor 104 stops running, the vacuum pump 201 is started. The vacuum pump 201 starts working and generates negative pressure, which sucks in the debris in the enclosed space through the filter box 205 connected to its input end. The debris first enters the filter box 205 through the one-way air inlet valve 208 (connected to the bottom of the sealing cover 207). The filter cover 206 inside the filter box 205 intercepts and filters the debris, preventing it from leaking out. Debris entering the vacuum pump 201 can damage the equipment. Filtered clean gas is discharged through the two output ends of the vacuum pump 201, enters the inlet pipe 302, and is delivered to the inside of the jet ring 301. Several annularly spaced, equidistant air-gathering holes 303 on the bottom of the inner wall of the jet ring 301 converge the gas and deliver it to the extended air guide pipe 304. The extended air guide pipe 304 extends to the vicinity of the flange surface, where several annularly spaced, equidistant jet holes 305 evenly spray the gas, forming an annular airflow that blows away the fine debris adhering to the flange surface, causing the debris to detach and be efficiently extracted by the dust-collecting ring 204 of the vacuum mechanism 200. During the purging process, the annular distribution design of the jet holes 305 can cover the entire surface of the flange, including dead areas such as end faces and hole positions, avoiding purging blind spots. Among them, the three annularly distributed limit rods 209 fixed on the top of the mounting plate 202 slide in cooperation with the limit groove 210 at the bottom of the mounting plate 202, playing a guiding role during the downward movement of the mounting plate 202. The limit plate 211 can prevent the limit rods 209 from falling out of the limit groove 210, and the tension spring 212 provides elastic buffer for the mounting plate 202, ensuring that the rubber blocking cover 203 fits tightly with the polishing table 101, while avoiding rigid collisions between the mounting plate 202 and the transmission plate 103.The bearing sleeve 213 inside the mounting plate 202 ensures that the mounting plate 202 remains stationary and does not rotate synchronously with the motor 104 when the output end of the motor 104 rotates at high speed. This ensures the stability of the dust extraction ring 204, the rubber baffle 203, and the air jet ring 301, guaranteeing the effective cleaning of debris. After the air pump 201 starts, it continues to work, and the air jet mechanism 300 continuously sprays air synchronously to thoroughly blow away and extract the fine debris remaining on the flange surface. After a period of time, the electric cylinder 102... The drive plate 103 moves slightly upward, disengaging the air inlet pipe 302 from the output end of the vacuum pump 201. The jet mechanism 300 stops jetting, while the vacuum pump 201 continues to operate, performing final extraction of any remaining loose debris in the enclosed space. Once the debris is completely removed, the vacuum pump 201 stops operating, and the electric cylinder 102 drives the drive plate 103 upward. The mounting plate 202 moves upward synchronously under the tension of the tension spring 212, and the rubber stop cover 203 detaches from the polishing table 101, completing the debris removal operation.

[0043] The remaining structure is the same as that in Example 2.

[0044] Example 4

[0045] Reference Figures 1-5 This is the fourth embodiment of the present invention, which differs from the third embodiment in that: this embodiment provides a flange polishing device with a waste chip adsorption structure and its usage method.

[0046] Place the flange to be polished on the positioning seat 106, adjust the limiting structure of the positioning seat 106 to ensure that the flange is centered and fixed without any offset or loosening. After the preparation is completed, start the electric cylinder 102. The output end of the electric cylinder 102 extends downward, driving the transmission plate 103, motor 104, polishing disc 105, air pump 201, mounting plate 202 and air jet ring 301 to move down synchronously. During the downward movement, the mounting plate 202 moves smoothly under the guidance of the limiting rod 209. The tension spring 212 is in a stretched state and provides a buffer force. When the rubber blocking cover 203 is in contact with the bottom of the inner wall of the polishing table 101, the flange and polishing disc 105 are completely enclosed in the closed space formed by the rubber blocking cover 203 and the polishing table 101. At this time, the air inlet pipe 302 and the output end of the air pump 201 are precisely connected under the limiting action of the limiting block 306. The electric cylinder 102 stops moving down and maintains its current position. Then, start the motor 104. The output end of the motor 104 drives the transmission plate 103, motor 104 205, and air jet ring 301 to move down synchronously. The grinding disc 105 rotates at high speed to polish the flange surface. During the polishing process, the electric cylinder 102 slowly adjusts the height of the transmission plate 103 according to preset parameters to ensure stable contact pressure between the grinding disc 105 and the flange surface to guarantee polishing accuracy. During this stage, the vacuum pump 201 is not started to avoid airflow interference with polishing accuracy and affecting the smoothness of the flange surface. After the polishing reaches the preset requirements, the motor 104 is turned off, the grinding disc 105 stops rotating, and the polishing operation officially stops. After the polishing operation stops, the vacuum pump 201 is started. The vacuum pump 201 generates negative pressure and begins to extract polishing debris in the enclosed space. The clean gas discharged from the output end of the vacuum pump 201 enters the jet ring 301 through the air inlet pipe 302, and after being gathered by the air gathering hole 303, it is evenly sprayed out through the jet hole 305 of the extended air guide pipe 304 to blow away the fine debris adhering to the flange surface, so that the debris can be removed from the flange surface for efficient extraction by the dust extraction ring 204.The filter box 205 of the extraction mechanism 200 intercepts and filters the extracted debris to prevent it from damaging the extraction pump 201. The sealing cover 207 prevents debris from leaking from the bottom of the filter box 205, and the one-way inlet valve 208 prevents backflow of gas, ensuring dust extraction efficiency. The extraction pump 201 operates continuously, and the jetting mechanism 300 simultaneously and continuously jets air to thoroughly blow away and extract the fine debris remaining on the flange surface. After a period of time, the electric cylinder 102 is activated, causing the transmission plate 103 to move slightly upward, disengaging the inlet pipe 302 from the output end of the extraction pump 201. The jetting mechanism 300 stops jetting air, while the extraction pump 201 continues to operate to perform the final extraction of the remaining loose debris in the enclosed space. After thorough cleaning, the vacuum pump 201 is turned off, and the electric cylinder 102 continues to retract upwards, driving the transmission plate 103, motor 104, polishing disc 105, vacuum pump 201, mounting plate 202, and air jet ring 301 to move synchronously to their initial positions. The mounting plate 202 resets under the tension of the tension spring 212, and the rubber baffle 203 detaches from the polishing table 101. After debris removal and equipment reset, the equipment maintenance and workpiece removal process begins. The operator opens the sealing cover 207 and cleans the debris trapped by the filter cover 206 inside the filter box 205. After cleaning, the sealing cover 207 is securely threaded to ensure a tight seal. Then, the polished flange is removed from the positioning seat 106.

[0047] In summary, the flange is fixed on the polishing mechanism 100, and then the polishing mechanism 100 is started to polish the flange. After polishing is completed, the air extraction mechanism 200 is started to extract and clean the debris generated during polishing. The gas discharged during the start of the air extraction mechanism 200 enters the air jet mechanism 300 to blow air onto the debris on the flange surface.

[0048] It is important to note that the constructions and arrangements of this application shown in several different exemplary embodiments are merely illustrative. Although only a few embodiments are described in detail in this disclosure, those who consult this disclosure will readily understand that many modifications are possible without substantially departing from the novelty and advantages of the subject matter described in this application. For example, variations in the size, dimensions, structure, shape, and proportions of various elements, as well as parameter values ​​such as temperature, pressure, etc., installation arrangements, use of materials, color, orientation, etc. For instance, an element shown as integrally formed may be composed of multiple parts or elements, the position of elements may be inverted or otherwise changed, and the nature or number or position of discrete elements may be altered or changed. Therefore, all such modifications are intended to be included within the scope of the invention. The order or sequence of any process or method steps may be changed or rearranged according to alternative embodiments. In the claims, any "device plus function" clause is intended to cover the structure performing the function described herein, and not only structurally equivalent but also equivalent in structure. Other substitutions, modifications, alterations, and omissions may be made in the design, operation, and arrangement of the exemplary embodiments without departing from the scope of the invention. Therefore, the present invention is not limited to the specific embodiments, but extends to various modifications that still fall within the scope of the appended claims. Furthermore, for the purpose of providing a concise description of exemplary embodiments, not all features of the actual embodiments may be omitted, i.e., those features not relevant to the currently considered best mode for carrying out the invention, or those features not relevant to implementing the invention.

[0049] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A flange polishing device with a waste chip adsorption structure, characterized in that: include, A polishing mechanism (100) includes a polishing table (101), an electric cylinder (102) is fixedly connected to the top of the polishing table (101), a transmission plate (103) is fixedly connected to the output end of the electric cylinder (102) through the inner side of the polishing table (101), a motor (104) is fixedly connected to the bottom of the transmission plate (103), a grinding disc (105) is fixedly connected to the output end of the motor (104), and a positioning seat (106) is fixedly connected to the bottom of the inner wall of the polishing table (101). An air extraction mechanism (200) includes an air pump (201), the top of which is fixedly connected to the front side of the bottom of the transmission plate (103). A mounting plate (202) is movably fitted onto the surface of the output end of the motor (104). A rubber baffle (203) is fixedly connected to the bottom of the mounting plate (202), and a dust extraction ring (204) is fixedly connected to the bottom of the mounting plate (202). A filter box (205) is connected to the input end of the air pump (201), and a filter cover (206) is fixedly connected inside the filter box (205). A jet mechanism (300) includes a jet ring (301) fitted onto the surface of the suction ring. An air inlet pipe (302) is connected to the top of the jet ring (301), extending from the top of the air inlet pipe (302) to the top of the mounting plate (202). A collection hole (303) is provided at the bottom of the inner wall of the jet ring (301). Several collection holes (303) are provided and are evenly distributed in a ring. An extension air guide pipe (304) is connected to the bottom of each collection hole (303). The extended air duct (304) has air jet holes (305) on its surface. The air jet holes (305) are a plurality of holes and are distributed in a ring at equal intervals. The air pump (201) has two output ends. The two output ends of the air pump (201) are located at the top of both sides of the air pump (201). A limiting block (306) is fixedly connected to the top of the output end of the air pump (201). The limiting block (306) is located at the top of the end of the air inlet pipe (302) away from the mounting plate (202).

2. The flange polishing equipment with a waste chip adsorption structure according to claim 1, characterized in that: The bottom of the filter cover (206) is threadedly connected to a sealing cap (207), and the bottom of the sealing cap (207) is connected to a one-way air intake valve (208).

3. The flange polishing equipment with a waste chip adsorption structure according to claim 2, characterized in that: The one-way air intake valve (208) is connected to the dust extraction ring (204) via a hose, and a limit rod (209) is fixedly connected to the top of the mounting plate (202).

4. The flange polishing equipment with a waste chip adsorption structure according to claim 3, characterized in that: The limiting rods (209) are provided in three and are distributed in a ring at equal intervals, and the bottom of the mounting plate (202) is provided with a limiting groove (210).

5. The flange polishing equipment with a waste chip adsorption structure according to claim 4, characterized in that: The limiting groove (210) has three openings and is distributed in a ring at equal distances. The inner wall of the limiting groove (210) is slidably connected to the surface of the limiting rod (209).

6. The flange polishing equipment with a waste chip adsorption structure according to claim 5, characterized in that: The top of the limiting rod (209) is fixedly connected to a limiting disk (211), and the diameter of the limiting disk (211) is larger than the diameter of the inner wall of the limiting groove (210).

7. The flange polishing equipment with a waste chip adsorption structure according to claim 6, characterized in that: A tension spring (212) is fixedly connected to the bottom of the limiting plate (211), and the other end of the tension spring (212) is fixedly connected to the top of the mounting plate (202).

8. The flange polishing equipment with a waste chip adsorption structure according to claim 7, characterized in that: The mounting plate (202) is internally fixedly connected to a bearing sleeve (213), and the mounting plate (202) is movably sleeved on the surface of the transmission end of the motor (104) through the bearing sleeve (213).

9. A method of using a flange polishing device with a waste chip adsorption structure, characterized in that: The flange polishing equipment with a waste adsorption structure as described in any one of claims 1 to 8 further includes, The flange is polished using a polishing machine (100); Use an air extraction device (200) to remove and clean the debris generated during polishing; Use the jetting mechanism (300) to blow air onto the flange surface to remove debris.

10. The method of using the flange polishing equipment with a waste chip adsorption structure according to claim 9, characterized in that: include, Fix the flange onto the polishing mechanism (100), and then start the polishing mechanism (100) to polish the flange; After polishing is completed, the debris generated during polishing is removed and cleaned by activating the air extraction mechanism (200). During the process of starting the suction mechanism (200), the gas discharged enters the jet mechanism (300) to blow air onto the debris on the flange surface.

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