Wafer double-side polishing device

Abstract

The application discloses a wafer double-side grinding and polishing device and belongs to the technical field of wafer processing equipment. The device comprises a base, a lower grinding disc, an upper grinding disc, a bearing assembly, a distribution assembly, a triggering assembly and a conducting assembly. The bearing assembly comprises a disc body arranged on the lower grinding disc and used for bearing a wafer. During the wafer double-side grinding and polishing process, the upper grinding disc can be used to generate a pressing action when the upper grinding disc is close to the lower grinding disc, drive the liquid supply distribution part to be synchronously adjusted, increase the grinding liquid entering the top surface of the wafer, reduce the grinding liquid entering the bottom surface of the wafer, and keep the bottom surface of the wafer to have basic liquid supply, thereby reducing the difference between the grinding liquid supply states of the two surfaces of the wafer, reducing the inconsistent removal amount of the two surfaces of the wafer, and reducing the influence of local uneven grinding on the wafer surface quality.

Description

Technical Field

[0001] This invention belongs to the technical field of wafer processing equipment, specifically a wafer double-sided grinding and polishing device. Background Technology

[0002] In semiconductor wafer fabrication, a 12-inch wafer typically refers to a wafer with a diameter of 300mm. It requires grinding and polishing to reduce wafer thickness error and improve wafer surface quality. During processing, the 12-inch wafer is usually placed in a wafer carrier structure located between an upper and lower grinding disk. The upper and lower grinding disks rotate relative to each other and simultaneously grind both sides of the 12-inch wafer. During the grinding process, polishing fluid needs to be continuously supplied to both sides of the 12-inch wafer so that it enters between the wafer surface and the polishing pad. Material removal is completed by the contact action between the abrasive in the polishing fluid and the polishing pad.

[0003] During double-sided grinding and polishing, the upper grinding disc presses down against the 12-inch wafer. The upper grinding fluid is squeezed and discharged towards the wafer edge. The lower grinding fluid, influenced by the carrier structure and the support of the lower grinding disc, experiences different flow resistance compared to the upper side. Due to the larger diameter of the 12-inch wafer, the distance the grinding fluid travels from the supply point to various parts of the wafer is longer. As the grinding pad wears, the wafer thickness decreases, and the downward pressure of the upper grinding disc changes, the gap between the upper and lower grinding surfaces also changes. This results in differences in the amount of grinding fluid entering and the residence time on both sides of the 12-inch wafer. This difference leads to inconsistent material removal on both sides of the wafer, and the wafer edge may also experience grinding defects due to excessively rapid discharge or localized accumulation of the grinding fluid. Uneven grinding affects the thickness consistency and surface quality of 12-inch wafers. In existing technologies, to solve the above problems, the common methods are to increase the number of polishing slurry nozzles, increase the polishing slurry supply, and adjust the slurry supply after detecting the pressure with sensors. Increasing the number of nozzles and increasing the slurry supply will increase the consumption of polishing slurry, and it is difficult to synchronously distribute the upper and lower slurry supply according to the actual distance changes between the upper and lower polishing pads. When using sensors and control valves for adjustment, the structural cost is high. Polishing slurry and polishing debris will affect the long-term stable operation of the detection components, and it is difficult to maintain the same slurry supply status on the upper and lower polishing surfaces of the 12-inch wafer during polishing pressure changes and polishing pad wear. Summary of the Invention

[0004] To address the problems existing in the prior art, the present invention aims to provide a wafer double-sided grinding and polishing apparatus.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: A wafer double-sided grinding and polishing apparatus includes a base, a lower grinding disc, an upper grinding disc, a support component, a distribution component, a triggering component, and a conduction component. The support component includes a disk body disposed on the lower grinding disc, and the disk body is used to support the wafer. The dispensing component includes a first block disposed on the base, and a second block is disposed within the first block; The triggering component includes a second ring body disposed on the outer side of the lower grinding disc; When the second ring moves toward the base, the second block moves, and at this time, the amount of polishing fluid entering between the wafer and the upper polishing disk increases, while the amount of polishing fluid entering between the wafer and the lower polishing disk decreases.

[0006] Preferably, the disk body has a first groove that penetrates the disk body and is used to accommodate the wafer. The base has a first ring that surrounds the lower grinding disk. The base has a second groove that is located on the side of the first ring away from the lower grinding disk. The second groove has a first hole.

[0007] Preferably, the first block has a first cavity, the second block is slidably disposed in the first cavity, the first block has a second hole that communicates with the first cavity, and the first block has a third hole that communicates with the first cavity.

[0008] Preferably, the second block has a fourth hole for adjusting the amount of polishing slurry entering the upper part of the wafer, the second block has a fifth hole for adjusting the amount of polishing slurry entering the lower part of the wafer, and the second block also has a sixth hole for maintaining the basic amount of polishing slurry entering the lower part of the wafer.

[0009] Preferably, the first block has a second hole and a third hole, and the second block has a fourth hole and a fifth hole. When the second block moves toward the lower grinding disc, the overlapping area of ​​the fourth hole and the second hole increases, and the overlapping area of ​​the fifth hole and the third hole decreases.

[0010] Preferably, the first block body is provided with a first cavity, and the first cavity body is provided with a first elastic member. One end of the first elastic member abuts against the first block body, and the other end of the first elastic member abuts against the second block body. The first elastic member is used to push the second block body to reset in a direction away from the lower grinding disc.

[0011] Preferably, the second ring body is provided with a rolling element for contacting the upper grinding disc, the base is provided with a column, the column passes through the second ring body, the column is used to limit the radial displacement of the second ring body, and a second elastic element is sleeved on the column, one end of the second elastic element abuts against the base, and the other end of the second elastic element abuts against the second ring body.

[0012] Preferably, the second ring body is connected to the first rod body, the first block body has a second cavity, the conductive component includes a second rod body rotatably disposed on the first block body, at least a portion of the second rod body is located in the second cavity, the first rod body cooperates with the second rod body so that the movement of the second ring body can drive the second rod body to rotate.

[0013] Preferably, the conductive component includes a second rod with a fifth groove, and a third rod on the first rod. The third rod is inserted into the fifth groove and can slide within the fifth groove. After the third rod abuts against the groove wall of the fifth groove, it drives the second rod to rotate.

[0014] Preferably, the second block has a third groove, the transmission component includes a second rod and a toggle member disposed on the second rod, the toggle member extends into the third groove, when the second rod rotates, the toggle member pushes against the groove wall of the third groove, causing the second block to move, the second rod has a fourth groove, and a third elastic member is disposed on one side of the first block, the third elastic member cooperating with the fourth groove.

[0015] The beneficial effects of this invention are as follows: I. In this invention, during the double-sided grinding and polishing process of a wafer, the pressing action generated when the upper grinding wheel approaches the lower grinding wheel can be used to synchronously adjust the liquid supply distribution part, thereby increasing the amount of polishing liquid entering the top surface of the wafer and decreasing the amount of polishing liquid entering the bottom surface of the wafer, while maintaining the basic liquid supply to the bottom surface of the wafer. When the upper grinding wheel presses against the wafer, the top surface of the wafer can receive a compensated liquid supply due to the pressure and faster liquid drainage. The stagnation of polishing liquid on the bottom surface of the wafer due to the support of the lower grinding wheel can be suppressed, thereby reducing the difference in the supply state of polishing liquid on the two sides of the wafer, reducing the inconsistency in the amount of removal on the two sides of the wafer, and reducing the impact of uneven local grinding on the surface quality of the wafer. II. In this invention, the triggering action is generated by the approach process before the upper grinding disc contacts the wafer. The upper grinding disc first contacts the rolling element, and uses the pre-pressure stroke between contacting the rolling element and contacting the wafer to drive the distribution component to switch from the initial liquid supply state to the grinding liquid supply state through mechanical transmission. After the upper grinding disc contacts the wafer, the positioning fit keeps the distribution component in the grinding liquid supply state. This liquid supply state does not depend on the slight movement of the upper grinding disc during the grinding process, and does not require additional sensors and electronic control valves. The rolling contact can reduce the frictional traction of the triggering part caused by the rotation of the upper grinding disc. The idle stroke fit can absorb the small displacement and assembly deviation generated when the upper grinding disc first contacts the rolling element. The positioning fit can reduce the repeated fluctuation of the liquid supply during the grinding process and improve the operational stability of the device during continuous grinding. Attached Figure Description

[0016] Figure 1 This is a three-dimensional schematic diagram of the overall structure of the present invention; Figure 2 This is a three-dimensional schematic diagram of the second tank structure of the present invention; Figure 3 This is a three-dimensional schematic diagram of the disk structure of the present invention; Figure 4 This is a three-dimensional schematic diagram of the second ring structure of the present invention; Figure 5 This is the present invention. Figure 4 Enlarged view of point A in the middle; Figure 6 This is a three-dimensional schematic diagram of the second ring body and its surface structure of the present invention; Figure 7 This is a three-dimensional schematic diagram of the first block and its surface structure of the present invention; Figure 8 This is a three-dimensional schematic diagram of the internal structure of the first block of the present invention; Figure 9 This is a three-dimensional schematic diagram of the internal structure of the first block of the present invention from another perspective; Figure 10 This is a three-dimensional schematic diagram of the second block of the present invention and its surface structure; Figure 11 This is a three-dimensional schematic diagram of the mating structure of the first block and the second block of the present invention.

[0017] In the diagram: 1. Base; 2. Lower grinding disc; 3. Upper grinding disc; 4. Bearing assembly; 41. Disc body; 411. First groove; 42. First ring; 43. Second groove; 431. First hole; 5. Distribution assembly; 51. First block; 511. First cavity; 512. Second hole; 513. Third hole; 514. Second cavity; 52. Second block; 521. Fourth hole; 522. Fifth hole; 523. Sixth hole; 524. Third groove; 53. First elastic element; 6. Trigger assembly; 61. Second ring; 62. Rolling element; 63. Column; 64. Second elastic element; 65. First rod; 7. Conducting assembly; 71. Second rod; 711. Fourth groove; 72. Fifth groove; 73. Third rod; 74. Actuating element; 75. Third elastic element. Detailed Implementation

[0018] The present invention will now be further described in conjunction with the accompanying drawings and specific embodiments.

[0019] Please see Figure 1A wafer double-sided grinding and polishing apparatus includes a base 1, a lower grinding disc 2, an upper grinding disc 3, a support component 4, a distribution component 5, a trigger component 6, and a conduction component 7. The lower grinding disc 2 is disposed on the top of the base 1, the upper grinding disc 3 is disposed directly above the lower grinding disc 2, the support component 4 is disposed on the top of the lower grinding disc 2 and the top of the base 1, the distribution component 5 is fixedly disposed on the base 1, the trigger component 6 is disposed between the lower grinding disc 2 and the support component 4, and the conduction component 7 is disposed between the distribution component 5 and the trigger component 6.

[0020] It should be noted that, in combination Figure 1 In this embodiment, the wafer is a 12-inch wafer with a diameter of 300mm. The term "wafer" as used below refers to this 12-inch wafer. The lower grinding disc 2 is driven by the output end of the external rotary drive mechanism. The external rotary drive mechanism can drive the lower grinding disc 2 to rotate. The upper grinding disc 3 is driven by the external rotary drive mechanism on the equipment frame. This external rotary drive mechanism can drive the upper grinding disc 3 to rotate. The upper grinding disc 3 is also connected to a lifting mechanism on the equipment frame. The lifting mechanism can move the upper grinding disc 3 closer to the lower grinding disc 2, and can also move the upper grinding disc 3 away from the lower grinding disc 2. The external rotary drive mechanism and the lifting mechanism... These are all common mechanisms in wafer double-sided polishing equipment, and will not be described in detail here. When the lower polishing disk 2 and the upper polishing disk 3 rotate relative to each other, the bottom and top surfaces of the wafer can be polished respectively. The lower polishing disk 2 and the upper polishing disk 3 are used to polish both sides of the wafer. The bearing component 4 is used to place the wafer and collect the polishing slurry flowing out of the wafer edge. The triggering component 6 is used to receive the pressing action generated when the upper polishing disk 3 approaches the lower polishing disk 2. The transmission component 7 is used to transmit the movement of the triggering component 6 to the distribution component 5. The distribution component 5 is used to change the supply amount of polishing slurry to both sides of the wafer, so that the distribution component 5 switches from the initial liquid supply state to the polishing liquid supply state before the upper polishing disk 3 contacts the wafer.

[0021] like Figure 1 and Figure 2 As shown, the base 1 is preferably made of stainless steel and is a horizontally arranged thick plate structure. The lower grinding disc 2 is preferably made of cast iron and is a disc-shaped structure. The lower grinding disc 2 is rotatably set in the middle of the base 1 and is used to contact the bottom surface of the wafer. The upper grinding disc 3 is preferably made of cast iron and is a disc-shaped structure. The upper grinding disc 3 is set on top of the lower grinding disc 2 and is used to contact the top surface of the wafer. The diameter of the grinding area of ​​both the lower grinding disc 2 and the upper grinding disc 3 that contacts the wafer is greater than 300 mm. The upper grinding disc 3 is used to contact the top surface of the wafer.

[0022] like Figure 2 and Figure 3As shown, the support component 4 includes a disk body 41, which is preferably made of engineering plastic. The disk body 41 has a thin, circular structure and is positioned on top of the lower grinding disk 2. The thickness of the disk body 41 is less than the thickness of the wafer. A first groove 411 is formed on the disk body 41. The first groove 411 is a circular through groove with a diameter larger than the outer diameter of the wafer. The first groove 411 is used to accommodate the wafer. After the wafer is placed in the first groove 411, the side of the wafer facing the lower grinding disk 2 can contact the wafer. The lower grinding disk 2 has a side of the wafer facing the upper grinding disk 3 that can contact the upper grinding disk 3. The disk body 41 is used to limit the wafer's radial displacement along the disk body 41. The first ring body 42 is preferably made of stainless steel and has a circular structure. The first ring body 42 is fixedly set on the base 1 and surrounds the lower grinding disk 2. There is an annular gap between the first ring body 42 and the lower grinding disk 2. This annular gap is used to avoid the rotation of the lower grinding disk 2. The top surface of the first ring body 42 is lower than the top surface of the lower grinding disk 2.

[0023] like Figure 2 and Figure 3 As shown, the second groove 43 is formed on the base 1. The second groove 43 is an annular groove and surrounds the first ring 42. The second groove 43 is used to receive the polishing fluid and grinding debris flowing out from the edge of the wafer. The second groove 43 has a first hole 431, which is a drain hole. The first hole 431 is connected to the drain channel in the base 1. The polishing fluid entering the second groove 43 can be discharged through the first hole 431. The first ring 42 is located between the second groove 43 and the lower grinding disc 2, which can reduce the rotation gap of the grinding debris in the second groove 43 entering the lower grinding disc 2.

[0024] When using, combine Figures 1 to 3 The disk body 41 holds the wafer through the first groove 411. The wafer is located between the lower grinding disk 2 and the upper grinding disk 3 along with the disk body 41. The polishing fluid flows out from the edge of the wafer and enters the second groove 43. The first hole 431 discharges the polishing fluid in the second groove 43. The first ring body 42 is placed between the lower grinding disk 2 and the second groove 43 to prevent the grinding debris in the second groove 43 from directly entering the rotation gap of the lower grinding disk 2.

[0025] like Figures 4 to 7As shown, the dispensing component 5 includes a first block 51, which is preferably made of stainless steel. The first block 51 is a block structure and is fixedly mounted on the top of the base 1. The first block 51 is close to the second groove 43 and located on the side of the second groove 43 away from the lower grinding disc 2. A first cavity 511 is formed inside the first block 51. The first cavity 511 is an elongated cavity. A liquid inlet hole is also formed on the first block 51, which communicates with the first cavity 511 and is used to connect with an external liquid supply structure. The first cavity 511 is also used to accommodate a second block 52, which can be placed in the first cavity 511. The first block 51 has a second hole 512 that is connected to the first cavity 511. The outlet end of the second hole 512 is connected to a pipe that is connected to the outer edge gap between the wafer and the upper grinding disk 3. The first block 51 has a third hole 513 that is connected to the first cavity 511. The outlet end of the third hole 513 is also connected to a pipe that is connected to the outer edge gap between the wafer and the lower grinding disk 2. This allows the polishing fluid to enter the space between the wafer and the upper grinding disk 3 after being sprayed out from the second hole 512, and to enter the space between the wafer and the lower grinding disk 2 after being sprayed out from the third hole 513.

[0026] like Figure 4 and Figure 5 As shown, a second cavity 514 is also provided inside the first block 51. The second cavity 514 is located below the first cavity 511 and is partially connected to the first cavity 511. The second cavity 514 is used to accommodate the second rod 71 in the conductive assembly 7. There is a movable gap between the cavity wall of the second cavity 514 and the second rod 71. This movable gap is used to provide space for the rotation of the second rod 71. The second cavity 514 and the first cavity 511 are connected at the position corresponding to the third groove 524. This connected position is used for the actuating member 74 to extend into the third groove 524. The second cavity 514 separates the rotation area of ​​the second rod 71 from the grinding area of ​​the wafer.

[0027] like Figures 8 to 11As shown, the second block 52 is preferably made of polyetheretherketone (PEEK) material. The second block 52 is a long strip-shaped block and is slidably disposed within the first cavity 511. The second block 52 can move closer to and further away from the lower grinding disc 2. The outer wall of the second block 52 slides in conjunction with the inner wall of the first cavity 511. The inner wall of the first cavity 511 restricts the displacement of the second block 52. When the second block 52 moves, it can change the opening area of ​​the grinding fluid entering the second hole 512 and the third hole 513. A fourth hole is formed on the second block 52. The fourth hole 521 is used to adjust the communication area between the first cavity 511 and the second hole 512. The fifth hole 522 is used to adjust the communication area between the first cavity 511 and the third hole 513. The sixth hole 523 is used to maintain basic communication between the first cavity 511 and the third hole 513. The sixth hole 523 can still supply a small amount of polishing fluid to the third hole 513 when the overlapping area between the fifth hole 522 and the third hole 513 decreases.

[0028] like Figures 8 to 11 As shown, when the second block 52 is in its initial position, the fourth hole 521 partially overlaps with the second hole 512. When the second block 52 is in its initial position, the fifth hole 522 partially overlaps with the third hole 513. The overlapping area of ​​the fifth hole 522 and the third hole 513 is greater than the overlapping area of ​​the fourth hole 521 and the second hole 512. When the second block 52 approaches the lower grinding disc 2, the fourth hole 521 gradually approaches the center position of the second hole 512. The fourth hole 521 and the second hole 512... As the overlapping area of ​​the second hole 512 increases, the amount of grinding fluid entering the second hole 512 also increases. When the second block 52 approaches the lower grinding disc 2, the fifth hole 522 gradually deviates from the center position of the third hole 513, and the overlapping area of ​​the fifth hole 522 and the third hole 513 decreases. As a result, the amount of grinding fluid entering the third hole 513 decreases. The sixth hole 523 remains connected to the third hole 513 during the movement of the second block 52, and the third hole 513 will not completely stop discharging liquid.

[0029] like Figure 9 As shown, a third groove 524 is provided on the second block 52. The third groove 524 is located on the side of the second block 52 near the second cavity 514. The third groove 524 has a groove structure, and the groove opening of the third groove 524 faces the second cavity 514. The third groove 524 is used to receive the actuating member 74. When the actuating member 74 swings in the third groove 524, the actuating member 74 can push against the groove wall of the third groove 524. After the second block 52 is pushed by the groove wall of the third groove 524, it slides along the first cavity 511.

[0030] like Figure 8 and Figure 9As shown, the first elastic element 53 is preferably a stainless steel compression spring. The first elastic element 53 is disposed in the first cavity 511. One end of the first elastic element 53 abuts against the inner wall of the first block 51, and the other end of the first elastic element 53 abuts against the second block 52. The first elastic element 53 is used to push the second block 52 to reset in a direction away from the lower grinding disc 2. When the second block 52 resets, the overlapping area of ​​the fourth hole 521 and the second hole 512 decreases. When the second block 52 resets, the overlapping area of ​​the fifth hole 522 and the third hole 513 increases.

[0031] When using, combine Figures 7 to 11 The polishing slurry first enters the first cavity 511. The position of the second block 52 in the first cavity 511 determines the amount of slurry discharged from the second hole 512 and the third hole 513. When the second block 52 is close to the lower grinding disk 2, the amount of slurry discharged from the second hole 512 increases and the amount of slurry discharged from the third hole 513 decreases. When the second block 52 is far away from the lower grinding disk 2, the amount of slurry discharged from the second hole 512 decreases and the amount of slurry discharged from the third hole 513 increases. The sixth hole 523 always ensures that the third hole 513 maintains a basic amount of slurry discharged, thus avoiding a lack of polishing slurry between the wafer and the lower grinding disk 2.

[0032] like Figures 3 to 5 As shown, the trigger assembly 6 includes a second ring 61, which is preferably made of stainless steel and has a circular structure. The second ring 61 is disposed between the first ring 42 and the second groove 43, with a movable gap between the second ring 61 and the first ring 42, and a movable gap between the second ring 61 and the second groove 43. The second ring 61 does not contact the lower grinding disc 2, the first ring 42, or the second groove 43. The rolling element 62 is preferably a ceramic roller and is a cylindrical roller. The rolling element 62 is rotatably disposed on the second ring 61 away from the base 1. On one side, the rolling elements 62 are equidistantly arranged on the second ring body 61. The outer peripheral surface of the rolling elements 62 is used to contact the upper grinding disk 3. The top of the rolling elements 62 is higher than the top surface of the second ring body 61. When the second elastic element 64 is in an uncompressed state, the outer edge of the top of the rolling elements 62 is higher than the top surface of the wafer placed in the first groove 411, so that when the upper grinding disk 3 approaches the lower grinding disk 2, it first contacts the rolling elements 62 and then contacts the top surface of the wafer. When the upper grinding disk 3 rotates, the rolling elements 62 can rotate relative to the second ring body 61. The rolling elements 62 are used to reduce the frictional traction of the upper grinding disk 3 on the second ring body 61.

[0033] like Figure 4 and Figure 6As shown, the column 63 is preferably made of stainless steel and is fixedly mounted on the base 1. The column 63 passes through the second ring 61, which has a guide hole for the column 63 to pass through. There are four columns 63, which are spaced apart along the second ring 61. The columns 63 are used to limit the radial displacement of the second ring 61, forcing the second ring 61 to slide only along the column 63. The second elastic element 64 is preferably made of stainless steel compression spring and is sleeved on the outside of the column 63. One end of the second elastic element 64 abuts against the base 1, and the other end abuts against the second ring 61. The second elastic element 64 is used to support the second ring 61. When the upper grinding disc 3 moves away from the lower grinding disc 2, the second elastic element 64 pushes the second ring 61 away from the base 1.

[0034] like Figure 4 and Figure 5 As shown, the first rod 65 is preferably made of stainless steel. The first rod 65 has a rod-shaped structure and is located on the side of the second ring 61 near the first block 51. One end of the first rod 65 is fixedly connected to the second ring 61. There is a movable gap between the first rod 65 and the first block 51. When the second ring 61 approaches the base 1, the first rod 65 simultaneously approaches the base 1. When the second ring 61 moves away from the base 1, the first rod 65 simultaneously moves away from the base 1.

[0035] When using, combine Figure 4 and Figure 5 During the process of the upper grinding disc 3 approaching the lower grinding disc 2, before the upper grinding disc 3 contacts the top surface of the wafer, the upper grinding disc 3 first presses against the rolling element 62. The rolling element 62 transmits the pressing force to the second ring body 61. The second ring body 61 slides along the column 63 and approaches the base 1, while compressing the second elastic element 64. When the second ring body 61 moves, the first rod body 65 moves synchronously with the second ring body 61. The first rod body 65 continues to transmit the movement of the second ring body 61 to the transmission component 7. The movement process of the upper grinding disc 3 from contacting the rolling element 62 to contacting the top surface of the wafer forms a pre-pressure stroke. The transmission component 7 can use this pre-pressure stroke to drive the distribution component 5 to complete the liquid supply state switching.

[0036] like Figure 4 , Figure 5 , Figure 8 and Figure 9As shown, the conductive assembly 7 includes a second rod 71, which is preferably made of stainless steel. The middle part of the second rod 71 is rotatably disposed on one side of the first block 51. One end of the second rod 71 is inserted into the second cavity 514, and the other end of the second rod 71 extends to the bottom of the first rod 65. The second rod 71 can swing within the second cavity 514. The space of the second cavity 514 is larger than the swing range of the second rod 71 to avoid collision with the first block 51 when the second rod 71 swings. Two fourth grooves 711 are formed on the second rod 71. The fourth grooves 711 are shallow grooves. The two fourth grooves 711 are spaced apart along the swing path of the second rod 71. The fourth grooves 711 are used to cooperate with the third elastic member 75. One fourth groove 711 corresponds to the undriven position of the second rod 71, and the other fourth groove 711 corresponds to the driven position of the second rod 71. When the third elastic member 75 is engaged with different fourth grooves 711, the second rod 71 can be held in the corresponding position.

[0037] like Figure 4 , Figure 5 , Figure 8 and Figure 9 As shown, the fifth groove 72 is located at the end of the second rod 71 near the first rod 65. The fifth groove 72 is an elongated oval groove that extends along the length of the second rod 71. The third rod 73 is preferably a short round stainless steel rod. The third rod 73 is fixedly located at the bottom end of the first rod 65 and can be inserted into the fifth groove 72. The third rod 73 can slide within the fifth groove 72. When the first rod 65 moves slightly, the third rod 73 first slides within the fifth groove 72. When the third rod 73 does not abut against the drive end groove wall of the fifth groove 72, the third rod 73 does not push the second rod 71 to rotate. This engagement forms a free stroke, which is used to absorb the assembly deviation and slight vibration when the upper grinding disc 3 first contacts the rolling element 62, and to prevent the second block 52 from shifting prematurely when the upper grinding disc 3 briefly contacts the rolling element 62.

[0038] like Figure 8 and Figure 9 As shown, the actuating element 74 is preferably a stainless steel fork-shaped element. The actuating element 74 is located at one end of the second rod 71 near the second block 52. The fork-shaped structure of the actuating element 74 extends into the third groove 524. When the second rod 71 rotates, the actuating element 74 swings with the second rod 71. The actuating element 74 pushes against the groove wall of the third groove 524. The third groove 524 transmits the thrust to the second block 52. After receiving the thrust, the second block 52 moves along the first cavity 511.

[0039] like Figure 4 and Figure 5As shown, the third elastic element 75 is preferably made of spring steel sheet. The third elastic element 75 is fixedly installed on the side wall of the first block 51. The free end of the third elastic element 75 extends toward the second rod 71 and presses against the second rod 71. When the second rod 71 is in the undriven position, the free end of the third elastic element 75 is inserted into a fourth groove 711. When the second rod 71 is in the driven position, the free end of the third elastic element 75 is inserted into another fourth groove 711. When the second rod 71 swings from one position to another, the third elastic element 75 bends first. After the second rod 71 reaches the corresponding position, the free end of the third elastic element 75 enters the corresponding fourth groove 711. The third elastic element 75 is used to increase the displacement resistance of the second rod 71. The third elastic element 75 does not prevent the second rod 71 from rotating after being subjected to force.

[0040] When using, combine Figure 4 , Figure 5 , Figure 8 and Figure 9 When the first rod 65 moves, it drives the third rod 73 to move synchronously. The third rod 73 first slides in the fifth groove 72. This sliding does not push the second rod 71 to rotate. When the upper grinding disk 3 has not yet contacted the top surface of the wafer and continues to approach the lower grinding disk 2, the second ring 61 and the first rod 65 continue to approach the base 1. The third rod 73 crosses the empty stroke formed by the fifth groove 72 and abuts against the drive end groove wall of the fifth groove 72. At this time, the third rod 73 can apply a pushing force to the fifth groove 72. After receiving this pushing force, the second rod 71 rotates in the second cavity 514. The second rod 71 drives the actuating member 74 to swing. The actuating member 74 pushes against the groove wall of the third groove 524, so that the second block 52 moves in the first cavity 511 after receiving the pushing force.

[0041] The following is the working principle of this embodiment: When preparing to use, combine Figures 1 to 3A 12-inch wafer with a diameter of 300mm is placed into the first groove 411 of the disk body 41. The first groove 411 restricts the wafer, preventing it from detaching from the disk body 41 during the grinding process. After the wafer is placed in the first groove 411, the bottom surface of the wafer faces the lower grinding disk 2, and the top surface faces the upper grinding disk 3. The lifting mechanism moves the upper grinding disk 3 closer to the lower grinding disk 2. Since the rolling element 62 is higher than the top surface of the wafer when the second elastic element 64 is not compressed, the upper grinding disk 3 contacts the rolling element 62 first, and through the rolling element 62, it moves the second ring 61 closer to the base 1. The grinding disc 3 continues to approach the lower grinding disc 2. The transmission component 7 and the distribution component 5 complete the repositioning before the upper grinding disc 3 contacts the top surface of the wafer. After the repositioning is completed, the upper grinding disc 3 continues to move and press against the top surface of the wafer. The lifting mechanism stops driving the upper grinding disc 3 to continue moving. The grinding pressure on the wafer is continuously provided by the lifting mechanism. The rotary drive mechanism drives the lower grinding disc 2 to rotate around its own axis. The rotary drive mechanism on the equipment frame drives the upper grinding disc 3 to rotate around its own axis. The lower grinding disc 2 and the upper grinding disc 3 act on the bottom and top surfaces of the wafer respectively, so that both sides of the wafer are ground. When supplying the grinding fluid, combine Figures 7 to 11 The external liquid supply structure delivers polishing slurry into the first cavity 511 of the first block 51. The polishing slurry in the first cavity 511 can enter the outer edge gap between the wafer and the upper grinding disk 3 through the second hole 512. The polishing slurry in the first cavity 511 can also enter the outer edge gap between the wafer and the lower grinding disk 2 through the third hole 513. The actual liquid output of the second hole 512 and the third hole 513 is determined by the position of the second block 52. When the second block 52 is in the initial position, the fourth hole 521 partially overlaps with the second hole 512, the fifth hole 522 partially overlaps with the third hole 513, and the sixth hole 523 remains connected to the third hole 513, so that polishing slurry can be obtained on both the top and bottom surfaces of the wafer. When the trigger action occurs, combined with Figures 3 to 6 As the upper grinding disc 3 approaches the lower grinding disc 2, the upper grinding disc 3 first presses against the rolling element 62 before contacting the top surface of the wafer. When the upper grinding disc 3 rotates, the rolling element 62 can rotate relative to the second ring 61, reducing the frictional pull of the upper grinding disc 3 on the second ring 61. As the upper grinding disc 3 continues to approach the lower grinding disc 2, the rolling element 62 transmits the pressing force to the second ring 61. The second ring 61 slides along the column 63 and approaches the base 1. The column 63 restricts the second ring 61 from radially shifting, so that the second ring 61 does not contact the lower grinding disc 2, the first ring 42, and the second groove 43. When the second ring 61 approaches the base 1, it compresses the second elastic element 64. The second elastic element 64 stores the elastic force that resets the second ring 61. This triggering action is generated by the pre-pressing stroke between the upper grinding disc 3 contacting the rolling element 62 and contacting the top surface of the wafer. When the second ring body 61 moves, it combines Figure 4 and Figure 5The first rod 65 moves synchronously with the second ring 61. The bottom end of the first rod 65 drives the third rod 73 to move. The third rod 73 is inserted into the fifth groove 72 of the second rod 71. When the first rod 65 moves slightly, the third rod 73 slides in the fifth groove 72 first. At this time, the third rod 73 does not abut against the inner wall and bottom wall of the fifth groove 72. Therefore, the second rod 71 does not rotate. This sliding segment forms a free stroke. This free stroke is used to absorb the small displacement and assembly deviation generated when the upper grinding disk 3 first contacts the rolling element 62. The moving distance required for the third rod 73 to cross this free stroke is less than the pre-pressure stroke of the upper grinding disk 3 mentioned above. This ensures that before the upper grinding disk 3 contacts the top of the wafer, the third rod 73 can abut against the drive end groove wall of the fifth groove 72. When the upper grinding disk 3 has not yet contacted the top surface of the wafer and continues to move towards the lower grinding disk 2, the combination Figure 4 , Figure 5 , Figure 8 and Figure 9 The third rod 73 abuts against the inner wall of the fifth groove 72. When the third rod 73 continues to move, it applies a pushing force to the fifth groove 72. After the second rod 71 is pushed by the third rod 73, it swings around the fulcrum of the rotational connection between the second rod 71 and the first block 51. The second cavity 514 provides space for the swing of the second rod 71, so that the second rod 71 does not get stuck with the first block 51 during the swing. After the second rod 71 swings from the undriven position to the driven position, the upper grinding disk 3 continues to approach the lower grinding disk 2 until the upper grinding disk 3 contacts the top surface of the wafer. When the second rod 71 swings, combined with Figure 8 and Figure 9 The actuating element 74 swings together with the second rod 71. The fork-shaped structure of the actuating element 74 moves within the third groove 524. After swinging, the actuating element 74 pushes against the groove wall of the third groove 524. The third groove 524 transmits the thrust applied by the actuating element 74 to the second block 52. After receiving the thrust, the second block 52 slides along the first cavity 511 and approaches the lower grinding disc 2. When the second block 52 moves, it compresses the first elastic element 53, so that the first elastic element 53 stores the elastic force that allows the second block 52 to reset. After the second block 52 moves to the grinding position, the dispensing component 5 completes the switch from the initial liquid supply state to the grinding liquid supply state. When the second block 52 approaches the lower grinding disc 2, it combines Figures 7 to 11As the fourth hole 521 gradually approaches the center of the second hole 512, the overlapping area between the fourth hole 521 and the second hole 512 increases, resulting in more polishing slurry entering the second hole 512 within the first cavity 511. Consequently, the amount of polishing slurry supplied between the wafer and the upper grinding disk 3 increases. When the second block 52 approaches the lower grinding disk 2, the fifth hole 522 gradually deviates from the center of the third hole 513, reducing the overlapping area between the fifth hole 522 and the third hole 513. This reduces the amount of polishing slurry entering the third hole 513 within the first cavity 511, thus decreasing the amount of polishing slurry supplied between the wafer and the lower grinding disk 2. The sixth hole 523 remains connected to the third hole 513 during the movement of the second block 52, allowing the third hole 513 to still supply a small amount of polishing slurry between the wafer and the lower grinding disk 2. This change in slurry supply occurs before the upper grinding disk 3 contacts the top of the wafer. After the upper grinding disk 3 contacts the wafer and enters the polishing state... The distribution component 5 maintains the grinding fluid supply state. As the upper grinding disk 3 approaches the lower grinding disk 2, the grinding fluid on the top surface of the wafer is squeezed and discharged towards the edge of the wafer. Therefore, the increased fluid supply of the second hole 512 can compensate for the grinding fluid on the top surface of the wafer. The bottom surface of the wafer is supported by the lower grinding disk 2, and the discharge state of the grinding fluid is different from that on the top surface of the wafer. Therefore, the reduced fluid supply of the third hole 513 can reduce the excessive retention of grinding fluid on the bottom surface of the wafer. The sixth hole 523 maintains the basic fluid output of the third hole 513, so that the bottom surface of the wafer will not lack grinding fluid. Through the above cooperation, the distribution component 5 can switch positions when the upper grinding disk 3 changes from the separation state to the grinding state, so that the top and bottom surfaces of the wafer obtain different predetermined fluid supply amounts before the grinding begins. This switching is a switch between the initial fluid supply state and the grinding fluid supply state, reducing the fluid supply difference caused by the different flow and discharge states of the grinding fluid on the upper and lower grinding surfaces of the 12-inch wafer. After the second rod 71 swings to the drive position, combined with Figure 4 and Figure 5 The free end of the third elastic element 75 disengages from one fourth groove 711 and, after bending, is inserted into another fourth groove 711. After the third elastic element 75 is inserted into the corresponding fourth groove 711, the second rod 71 is held in the driving position. After the position of the second rod 71 is stable, the pushing state of the actuating element 74 against the third groove 524 remains stable, and the position of the second block 52 in the first cavity 511 also remains stable. After the upper grinding disc 3 contacts the top surface of the wafer and stops moving, the second rod 71 can still be held in the driving position, so that the second block 52 continues to be in the grinding position. This cooperation can reduce the repeated sliding of the second block 52 caused by the slight jumping of the upper grinding disc 3, thereby reducing the fluctuation of the liquid output of the second hole 512 and the third hole 513. When the grinding fluid is discharged, it combines Figure 2 and Figure 3The polishing slurry and grinding debris flowing out from the edge of the wafer enter the second tank 43, where the polishing slurry is collected. The first hole 431 is connected to the drainage channel in the base 1, allowing the polishing slurry and grinding debris to be discharged through the first hole 431. The first ring 42 is located between the lower grinding disc 2 and the second tank 43, preventing grinding debris in the second tank 43 from entering the rotation gap of the lower grinding disc 2, thus reducing the impact of grinding debris on the rotation of the lower grinding disc 2. During reset, combined Figures 4 to 11 The lifting mechanism moves the upper grinding disc 3 away from the lower grinding disc 2, reducing the pressure of the upper grinding disc 3 on the rolling element 62. The second elastic element 64 releases its elastic force and pushes the second ring 61 away from the base 1. The second ring 61 drives the first rod 65 to reset. The first rod 65 drives the third rod 73 to move in the opposite direction within the fifth groove 72. The third rod 73 releases its resistance to the inner wall of the fifth groove 72. The first elastic element 53 releases its elastic force and pushes the second block 52 away from the lower grinding disc 2. The second block 52 drives the actuating element 74 to swing in the opposite direction through the third groove 524. The actuating element 74 drives the second rod 62 to swing in the opposite direction. When body 71 swings in the opposite direction, after the second rod body 71 returns to the undriven position, the free end of the third elastic element 75 is engaged in the corresponding fourth groove body 711, keeping the second rod body 71 in the undriven position. After the second block body 52 is reset, the overlapping area of ​​the fourth hole body 521 and the second hole body 512 decreases, and the amount of grinding fluid entering the second hole body 512 decreases. The overlapping area of ​​the fifth hole body 522 and the third hole body 513 increases, and the amount of grinding fluid entering the third hole body 513 increases. At this time, the distribution component 5 returns to the initial liquid supply state, which facilitates the readjustment of liquid supply when the upper grinding disc 3 approaches the lower grinding disc 2 next time.

[0042] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural or procedural transformations made based on the content of the present invention's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. A wafer double-sided grinding and polishing apparatus, comprising a base (1), a lower grinding disc (2), an upper grinding disc (3), a support component (4), a distribution component (5), a triggering component (6), and a conduction component (7), characterized in that: The carrier component (4) includes a disk body (41) disposed on the lower grinding disk (2), the disk body (41) being used to carry the wafer; The distribution component (5) includes a first block (51) disposed on the base (1), and a second block (52) is disposed inside the first block (51). The triggering component (6) includes a second ring (61) located on the outside of the lower grinding disc (2). When the second ring (61) moves toward the base (1), the second block (52) moves. At this time, the amount of polishing fluid entering between the wafer and the upper grinding wheel (3) increases, and the amount of polishing fluid entering between the wafer and the lower grinding wheel (2) decreases.

2. The wafer double-sided grinding and polishing apparatus according to claim 1, characterized in that: The disk body (41) is provided with a first groove (411) that penetrates the disk body (41) and is used to accommodate the wafer. The base (1) is provided with a first ring (42) that surrounds the lower grinding disk (2). The base (1) is provided with a second groove (43) that is located on the side of the first ring (42) away from the lower grinding disk (2). The second groove (43) is provided with a first hole (431) inside the second groove (43).

3. The wafer double-sided grinding and polishing apparatus according to claim 1, characterized in that: The first block (51) has a first cavity (511) inside, the second block (52) is slidably disposed in the first cavity (511), the first block (51) has a second hole (512) open on it, the second hole (512) communicates with the first cavity (511), and the first block (51) has a third hole (513) open on it, the third hole (513) communicates with the first cavity (511).

4. The wafer double-sided grinding and polishing apparatus according to claim 1, characterized in that: The second block (52) has a fourth hole (521) for adjusting the amount of polishing slurry entering the upper part of the wafer. The second block (52) has a fifth hole (522) for adjusting the amount of polishing slurry entering the lower part of the wafer. The second block (52) also has a sixth hole (523) for maintaining the basic amount of polishing slurry entering the lower part of the wafer.

5. The wafer double-sided grinding and polishing apparatus according to claim 1, characterized in that: The first block (51) has a second hole (512) and a third hole (513), and the second block (52) has a fourth hole (521) and a fifth hole (522). When the second block (52) moves toward the lower grinding disc (2), the overlapping area of ​​the fourth hole (521) and the second hole (512) increases, and the overlapping area of ​​the fifth hole (522) and the third hole (513) decreases.

6. The wafer double-sided grinding and polishing apparatus according to claim 1, characterized in that: The first block (51) is provided with a first cavity (511), and the first cavity (511) is provided with a first elastic element (53). One end of the first elastic element (53) abuts against the first block (51), and the other end of the first elastic element (53) abuts against the second block (52). The first elastic element (53) is used to push the second block (52) to reset in a direction away from the lower grinding disc (2).

7. The wafer double-sided grinding and polishing apparatus according to claim 1, characterized in that: The second ring (61) is provided with a rolling element (62) for contacting the upper grinding disc (3). The base (1) is provided with a column (63) for passing through the second ring (61) and for limiting the radial displacement of the second ring (61). A second elastic element (64) is sleeved on the column (63), one end of the second elastic element (64) abuts against the base (1), and the other end of the second elastic element (64) abuts against the second ring (61).

8. The wafer double-sided grinding and polishing apparatus according to claim 1, characterized in that: The second ring (61) is connected to the first rod (65), and the first block (51) has a second cavity (514) inside. The conductive assembly (7) includes a second rod (71) rotatably disposed on the first block (51). At least part of the second rod (71) is located inside the second cavity (514). The first rod (65) cooperates with the second rod (71) so that the movement of the second ring (61) can drive the second rod (71) to rotate.

9. A wafer double-sided grinding and polishing apparatus according to claim 8, characterized in that: The conductive component (7) includes a second rod (71), a fifth groove (72) is provided on the second rod (71), and a third rod (73) is provided on the first rod (65). The third rod (73) is inserted into the fifth groove (72) and can slide in the fifth groove (72). After the third rod (73) abuts against the groove wall of the fifth groove (72), it drives the second rod (71) to rotate.

10. A wafer double-sided grinding and polishing apparatus according to claim 9, characterized in that: The second block (52) has a third groove (524). The transmission component (7) includes a second rod (71) and a toggle member (74) disposed on the second rod (71). The toggle member (74) extends into the third groove (524). When the second rod (71) rotates, the toggle member (74) pushes against the groove wall of the third groove (524), causing the second block (52) to move. The second rod (71) has a fourth groove (711). The first block (51) has a third elastic member (75) on one side. The third elastic member (75) cooperates with the fourth groove (711).

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