High-purity copper cathode plate cleaning vacuum adsorption grabbing and transferring device
Patent Information
- Application Number
- CN202611502885.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-09-24
- Publication Date
- 2026-10-30
AI Technical Summary
[0003]但铜阴极板真空吸附转运装置在对不同尺寸的铜阴极板进行吸附转运时,难以根据铜阴极板的尺寸调整吸附支撑范围,导致板体中部容易发生弯曲变形,且吸附完成后不易实现平稳脱附,因此,本申请提供了一种高纯铜阴极板洁净真空吸附抓取转运装置来满足需求
本发明通过在吸附缓放机构中设置气囊,使气囊在铜阴极板吸附过程中受到板面的挤压而发生形变,从而对铜阴极板中部形成辅助支撑,能够降低铜阴极板在提起和转运过程中因自重产生的中部弯曲变形,提高铜阴极板转运过程中的稳定性。
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Figure CN123000738A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of vacuum adsorption and gripping technology, and in particular to a clean vacuum adsorption, gripping, and transfer device for a high-purity copper cathode plate. Background Technology
[0002] For example, patent CN215287039U, entitled "A High-Safety Vacuum Handling Machine," addresses the issue of poor safety performance and the susceptibility to accidents during power outages in existing vacuum handling machines. The proposed solution includes a mounting frame with a mounting plate fixedly mounted on its rear side. A handle and a vacuum pump are fixedly mounted on the front and rear sides of the mounting plate, respectively. Four horizontal plates are fixedly mounted at the bottom of the mounting frame, each with a detachable locking mechanism. Two locking mechanisms are mounted on each horizontal plate, and eight vacuum suction cups are mounted on each of these mechanisms, each holding the same material. A protective block is fixedly mounted at the bottom of the mounting frame. This application improves the safety of the vacuum handling machine during operation, protects workers, and provides an alarm signal, resulting in excellent performance.
[0003] However, when using a vacuum adsorption and transfer device for copper cathode plates of different sizes, it is difficult to adjust the adsorption support range according to the size of the copper cathode plate, which makes it easy for the middle of the plate to bend and deform. Furthermore, it is not easy to achieve stable desorption after adsorption. Therefore, this application provides a clean vacuum adsorption gripping and transfer device for high-purity copper cathode plates to meet the requirements. Summary of the Invention
[0004] The purpose of this application is to provide a clean vacuum adsorption gripping and transfer device for high-purity copper cathode plates, which can effectively solve the problems mentioned in the background art.
[0005] To achieve the above objectives, this application provides the following technical solution: a clean vacuum adsorption gripping and transfer device for high-purity copper cathode plates, comprising a robotic arm, one end of which is provided with an adsorption adjustment mechanism for controlling the vacuum adsorption area of the copper cathode plate, the lower end of which is provided with an adsorption release mechanism, and both sides of the adsorption release mechanism are rotatably mounted with lateral support mechanisms for increasing the adsorption support points of the copper cathode plate in conjunction with the adsorption adjustment mechanism, and two adsorption components are symmetrically mounted at the lower end of the adsorption adjustment mechanism; The adsorption and release mechanism includes a suction cup assembly and a housing assembly. The housing assembly is fixedly installed at the lower end of the adsorption adjustment mechanism. Several suction cup assemblies are provided, and the several suction cup assemblies are distributed in a ring array at the lower end of the housing assembly.
[0006] The adsorption adjustment mechanism includes a structural frame fixedly installed at one end of the robotic arm. Support shafts are symmetrically arranged on both sides of the structural frame. An outer diameter support frame and an adjustment support frame are rotatably installed on the outer surface of each of the two support shafts. The rotation radius of the outer diameter support frame is greater than that of the adjustment support frame.
[0007] Among them, one end of each of the two outer diameter support frames and the adjusting support frame is provided with an electric telescopic rod, and one end of the electric telescopic rod is fixedly installed inside the structural frame. A main control air pipe is provided in the middle of the structural frame, and electric sliding rods are provided at the lower end of the structural frame and on both sides of the main control air pipe.
[0008] The outer shell assembly includes a mounting plate and an air extraction ring. The lower end of the mounting plate is symmetrically provided with mounting grooves, and an airbag is provided in the middle of the lower end of the mounting plate. The outer surface of the suction ring is provided with a plurality of suction nozzles, and the outer surface of the suction ring is connected to a first suction pipe. The suction ring passes through a rubber sleeve, and the suction nozzles are located inside the rubber sleeve. One end of the first suction pipe extends into the interior of the main air control pipe.
[0009] The suction cup assembly includes a supporting base shell, which is fixedly installed at the lower end of the mounting plate. A rubber sleeve is connected to the lower end of the supporting base shell. The rubber sleeve is made of rubber and has a sealing lip at its lower end.
[0010] The suction cup assembly further includes an adsorption plate, a support ring is provided on the outer surface of the adsorption plate, an inner cover is provided on the inner wall of the rubber sleeve and the inner cover is fitted on the outer surface of the support ring, a sealing ring is provided at the lower end of the adsorption plate, the adsorption plate is located inside the rubber sleeve, and one end of the adsorption plate is connected to a flexible tube that communicates with the inside of the main control air pipe.
[0011] The sealing ring has several through holes arranged in a ring array inside, and the through holes connect the adsorption plate and the internal space of the rubber sleeve.
[0012] The side support mechanism includes a mounting frame, which is rotatably mounted inside the mounting groove. A retaining shell is provided inside the mounting frame, and a limit frame is provided at the upper end of the retaining shell. One end of the adjusting support frame is slidably mounted inside the limit frame. A rubber cover is provided at the lower end of the retaining shell, and a stop plate is provided at the lower part of the inner wall of the rubber cover. Several springs are provided at the upper end of the stop plate.
[0013] The upper end of the support plate is provided with an air inlet pipe that communicates with the inside of the main control air pipe. The lower end of the rubber cover is connected to a sealing soft ring. The lower end of the sealing soft ring is connected to a metal soft sheet. The metal soft sheet is made of elastic metal sheet. The bottom wall of the metal soft sheet is provided with a rubber sealing sheet. An airbag ring is provided between the rubber sealing sheet and the metal soft sheet. The bottom wall of the rubber sealing sheet is provided with a thin rubber sheet.
[0014] The adsorption assembly includes a swing frame, which is rotatably mounted on one end of an outer diameter support frame. A counterweight is provided at the lower end of the swing frame. Several suction cups are provided inside the swing frame, and the upper end of each suction cup is connected to a second suction pipe. One end of the second suction pipe is connected to the interior of the main air control pipe.
[0015] In summary, the technical effects and advantages of this invention are as follows: This invention incorporates an airbag in the adsorption and release mechanism. The airbag deforms under the pressure of the copper cathode plate during adsorption, thus providing auxiliary support to the center of the copper cathode plate. This reduces the bending deformation of the copper cathode plate due to its own weight during lifting and transport, thereby improving the stability of the copper cathode plate during transport.
[0016] This invention utilizes the electric telescopic rod, outer diameter support frame, and adjustment support frame in the adsorption adjustment mechanism, in conjunction with the side support mechanism and adsorption components, to allow the adsorption support position to be adjusted according to the size of the copper cathode plate. Furthermore, the larger rotation radius of the outer diameter support frame further expands the adsorption support range, thereby increasing the adsorption support points of the copper cathode plate, improving the device's adaptability to copper cathode plates of different sizes, and enhancing the stability of large-size copper cathode plates during transport.
[0017] This invention utilizes the cooperation between the adsorption plate, rubber sleeve, through hole, vacuum ring, first vacuum pipe, and hose to maintain vacuum adsorption of the copper cathode plate during transportation. When the copper cathode plate needs to be placed, gas is filled into the adsorption plate and enters the rubber sleeve through the through hole, thereby releasing the vacuum state of the adsorption plate and rubber sleeve, realizing the release of adsorption, and facilitating the smooth detachment and placement of the copper cathode plate. Attached Figure Description
[0018] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0019] Figure 1 A three-dimensional structural diagram of a clean vacuum adsorption gripping and transfer device for high-purity copper cathode plates; Figure 2 A partial first-view three-dimensional structural diagram of a high-purity copper cathode plate clean vacuum adsorption gripping and transfer device. Figure 3 A partial second-view three-dimensional structural diagram of a high-purity copper cathode plate clean vacuum adsorption gripping and transfer device. Figure 4 A first-person perspective three-dimensional connection structure diagram of the adsorption adjustment mechanism; Figure 5 A second-view three-dimensional connection structure diagram of the adsorption adjustment mechanism; Figure 6 This is a schematic diagram of the three-dimensional connection structure of the adsorption adjustment mechanism from a third-person perspective. Figure 7 This is a schematic diagram of the fourth-view three-dimensional connection structure of the adsorption adjustment mechanism; Figure 8 This is a schematic diagram of the three-dimensional connection structure of the adsorption and release mechanism; Figure 9 This is a schematic diagram of the three-dimensional connection structure of the outer shell assembly; Figure 10 This is a schematic diagram of the three-dimensional connection structure of the suction cup assembly; Figure 11 This is a schematic diagram of the three-dimensional connection structure between the rubber sleeve and the inner cover; Figure 12 This is a schematic diagram of the three-dimensional connection structure of the adsorption plate and the sealing ring; Figure 13 This is a schematic diagram of the three-dimensional connection structure of the sealing ring; Figure 14 A three-dimensional cross-sectional view of the connection structure between the sealing ring and the through hole; Figure 15 This is a schematic diagram of the three-dimensional connection structure of the adsorption and release mechanism, the lateral support mechanism, and the adsorption components. Figure 16 This is a schematic diagram of the three-dimensional connection structure of the lateral support mechanism; Figure 17 This is a three-dimensional sectional view of the connection structure of the lateral support mechanism; Figure 18 This is a schematic diagram of a partial three-dimensional connection structure of the lateral support mechanism; Figure 19 A schematic diagram of the three-dimensional connection structure between the rubber cover and the airbag ring; Figure 20 A three-dimensional cross-sectional view of the connection structure of the sealing soft ring, metal soft sheet and rubber sealing sheet; Figure 21 This is a schematic diagram of the three-dimensional connection structure of the adsorption component.
[0020] In the diagram: 1. Robotic arm; 2. Adsorption adjustment mechanism; 21. Structural frame; 22. Electric telescopic rod; 23. Outer diameter support frame; 24. Adjustment support frame; 25. Electric slide rod; 26. Main control air pipe; 27. Support shaft; 3. Adsorption and release mechanism; 31. Suction cup assembly; 311. Sealing lip; 312. Rubber sleeve; 313. Inner cover; 314. Adsorption plate; 315. Sealing ring; 316. Supporting bottom shell; 317. Supporting ring; 318. Penetration hole; 32. Outer shell assembly; 21. Mounting plate; 322. Mounting slot; 323. Suction ring; 324. Airbag; 325. First suction pipe; 326. Suction nozzle; 4. Side support mechanism; 41. Suction pipe; 42. Limiting frame; 43. Mounting frame; 44. Locking case; 45. Rubber cover; 46. Metal sheet; 47. Spring; 48. Support plate; 49. Airbag ring; 412. Sealing soft ring; 413. Rubber sealing sheet; 5. Adsorption assembly; 51. Swing frame; 52. Second suction pipe; 53. Suction cup. Detailed Implementation
[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0022] Example 1, Reference Figures 1 to 21 The high-purity copper cathode plate clean vacuum adsorption gripping and transfer device shown includes a robotic arm 1. One end of the robotic arm 1 is provided with an adsorption adjustment mechanism 2 for controlling the vacuum adsorption area of the copper cathode plate. The lower end of the adsorption adjustment mechanism 2 is provided with an adsorption release mechanism 3. Both sides of the adsorption release mechanism 3 are rotatably mounted with side support mechanisms 4 for increasing the adsorption support points of the copper cathode plate in conjunction with the adsorption adjustment mechanism 2. Two adsorption components 5 are symmetrically installed at the lower end of the adsorption adjustment mechanism 2.
[0023] The adsorption and release mechanism 3 includes a suction cup assembly 31 and a housing assembly 32. The housing assembly 32 is fixedly installed at the lower end of the adsorption adjustment mechanism 2. Several suction cup assemblies 31 are provided, and the several suction cup assemblies 31 are arranged in a ring array at the lower end of the housing assembly 32.
[0024] It is worth noting that by adjusting the position of the structural frame 21 through the robotic arm 1, the mounting plate 321 is driven to move downward through the electric slide bar 25, so that the mounting plate 321 drives the airbag 324 to abut against the surface of the copper cathode plate. At the same time, the rubber sleeve 312 and the adsorption plate 314 move downward synchronously, so that the sealing ring 315 and the sealing lip 311 abut against the surface of the copper cathode plate. Gas is extracted from inside the adsorption plate 314 through a flexible tube connected to the adsorption plate 314, and gas is extracted from inside the rubber sleeve 312 through the suction ring 323, suction nozzle 326 and first suction pipe 325, so that the sealing ring 315 and sealing lip 311 are attached to the surface of the copper cathode plate to perform vacuum adsorption on the copper cathode plate. When it is necessary to lower the copper cathode plate, stop evacuating the adsorption plate 314 through the hose and fill the adsorption plate 314 with gas so that the adsorption plate 314 is no longer in a vacuum state. Then, allow the gas inside the adsorption plate 314 to diffuse into the rubber sleeve 312 through the penetration hole 318 so that the rubber sleeve 312 is no longer in a vacuum state, thereby releasing the adsorption of the copper cathode plate. When the copper cathode plate is large, the electric telescopic rod 22 pushes the adjusting support frame 24 to rotate around the support shaft 27, and one end of the adjusting support frame 24 slides inside the limiting frame 42, driving the mounting frame 43 to rotate inside the mounting groove 322, so that the rubber sealing sheet 413 is on the same plane as the sealing lip 311 and the sealing ring 315, and the gas under the rubber cover 45 is extracted through the suction pipe 41, so that the rubber sealing sheet 413 is attached to the surface of the copper cathode plate; When it is necessary to move a larger copper cathode plate, the outer diameter support frame 23 is rotated by the electric telescopic rod 22, so that the outer diameter support frame 23 drives the adsorption assembly 5 to rotate and abut against the surface of the copper cathode plate. The gas inside the suction cup 53 is extracted through the second air extraction pipe 52 to adsorb the copper cathode plate for transport.
[0025] In Example 2, the adsorption adjustment mechanism 2 includes a structural frame 21 fixedly installed at one end of the robotic arm 1. Support shafts 27 are symmetrically arranged on both sides of the structural frame 21. Outer diameter support frames 23 and adjustment support frames 24 are rotatably mounted on the outer surfaces of both support shafts 27. The rotation radius of the outer diameter support frame 23 is greater than that of the adjustment support frame 24. An electric telescopic rod 22 is provided at one end of each of the two outer diameter support frames 23 and the adjustment support frame 24. One end of the electric telescopic rod 22 is fixedly installed inside the structural frame 21. A main control air pipe 26 is provided in the middle of the structural frame 21. Electric sliding rods 25 are provided at the lower end of the structural frame 21 on both sides of the main control air pipe 26. The electric telescopic rods 22 are configured to drive the adjustment support frame 24 and the outer diameter support frame 23 to rotate around the support shafts 27 to different unfolded positions. The electric sliding rods 25 are configured to drive the adsorption release mechanism 3 to move in the direction close to the copper cathode plate.
[0026] The housing assembly 32 includes a mounting plate 321, with mounting grooves 322 symmetrically provided at the lower end of the mounting plate 321. An airbag 324 is provided in the middle of the lower end of the mounting plate 321. The airbag 324 is configured to be squeezed and deformed when the mounting plate 321 pushes against the copper cathode plate, and to support the middle of the copper cathode plate. The housing assembly 32 also includes a suction ring 323. A plurality of suction nozzles 326 are provided on the outer surface of the suction ring 323. A first suction pipe 325 is connected to the outer surface of the suction ring 323. The suction ring 323 passes through the rubber sleeve 312. The suction nozzles 326 are located inside the rubber sleeve 312 and are configured to extract the gas inside the rubber sleeve 312. One end of the first suction pipe 325 extends into the interior of the main control pipe 26.
[0027] The suction cup assembly 31 includes a support base 316, which is fixedly installed at the lower end of the mounting plate 321 and configured to move synchronously with the mounting plate 321. A rubber sleeve 312 is connected to the lower end of the support base 316. The rubber sleeve 312 is made of rubber and a sealing lip 311 is provided at the lower end of the rubber sleeve 312. The sealing lip 311 is configured to press against the surface of the copper cathode plate as the support base 316 moves downward.
[0028] The suction cup assembly 31 also includes an adsorption plate 314. A support ring 317 is provided on the outer surface of the adsorption plate 314. An inner cover 313 is provided on the inner wall of the rubber sleeve 312. The inner cover 313 is fitted on the outer surface of the support ring 317 and is configured to isolate the interior of the rubber sleeve 312 into a separate sealed space. A sealing ring 315 is provided at the lower end of the adsorption plate 314. The adsorption plate 314 is located inside the rubber sleeve 312. One end of the adsorption plate 314 is connected to a flexible tube that communicates with the interior of the main control air pipe 26. Several through holes 318 are provided inside the sealing ring 315 in a ring array. The through holes 318 connect the internal space of the adsorption plate 314 and the rubber sleeve 312 and are configured to diffuse the gas in the adsorption plate 314 into the interior of the rubber sleeve 312 when the flexible tube fills the adsorption plate 314 with gas, so that the rubber sleeve 312 lags behind the adsorption plate 314 to release the vacuum state.
[0029] The side support mechanism 4 includes a mounting frame 43, which is rotatably mounted inside the mounting groove 322. A retaining shell 44 is provided inside the mounting frame 43. A limiting frame 42 is provided at the upper end of the retaining shell 44. One end of the adjusting support frame 24 is slidably mounted inside the limiting frame 42. A rubber cover 45 is provided at the lower end of the retaining shell 44. The limiting frame 42 is configured such that when the adjusting support frame 24 rotates and one end of it slides inside the limiting frame 42, the retaining shell 44 drives the mounting frame 43 to rotate and unfold within the mounting groove 322.
[0030] A stop plate 48 is provided on the lower part of the inner wall of the rubber cover 45. Several springs 47 are provided on the upper end of the stop plate 48. An air suction pipe 41 communicating with the inside of the main control air pipe 26 is provided on the upper end of the stop plate 48. The stop plate 48 is configured to isolate a separate air extraction space inside the rubber cover 45. The air suction pipe 41 is configured to extract the gas below the rubber cover 45. A sealing soft ring 412 is connected to the lower end of the rubber cover 45. A metal soft sheet 46 is connected to the lower end of the sealing soft ring 412. The metal soft sheet 46 is made of elastic metal sheet. A rubber sealing sheet 413 is provided on the bottom wall of the metal soft sheet 46. An airbag ring 49 is provided between the rubber sealing sheet 413 and the metal soft sheet 46. A rubber sheet is provided on the bottom wall of the rubber sealing sheet 413. The springs 47 and the rubber cover 45 are configured to provide buffer support for the copper cathode plate by contraction or rebound when the copper cathode plate is lifted.
[0031] The adsorption assembly 5 includes a swing frame 51, which is rotatably mounted on one end of the outer diameter support frame 23. Several suction cups 53 are arranged inside the swing frame 51. A counterweight is arranged at the lower end of the swing frame 51. The counterweight is configured so that the suction cups 53 remain perpendicular to the copper cathode plate after the swing frame 51 rotates around the outer diameter support frame 23. The upper end of the suction cups 53 is connected to a second suction pipe 52. One end of the second suction pipe 52 is connected to the interior of the main control pipe 26. The second suction pipe 52 is configured to extract the gas inside the suction cups 53.
[0032] The working principle is as follows: This device uses the main control air pipe 26 as the unified air circuit hub for all vacuuming and charging / discharging processes. The connecting hose of the adsorption plate 314, the first suction pipe 325, the suction pipe 41, and the second suction pipe 52 are all connected to the inside of the main control air pipe 26. The adsorption adjustment mechanism 2 drives the side support mechanism 4 and the adsorption assembly 5 to unfold through the two-stage rotating brackets of the adjusting support frame 24 and the outer diameter support frame 23, so as to change the vacuum adsorption area and increase the adsorption support points according to the size of the copper cathode plate. The specific working process is as follows: 1. Alignment and downward pressure.
[0033] When adsorbing and transporting the copper cathode plate, the robotic arm 1 first adjusts the spatial position of the structural frame 21, so that the adsorption and release mechanism 3 moves to the position to be grasped above the copper cathode plate. Then, the electric slide bar 25 at the lower end of the structural frame 21 drives the mounting plate 321 to move downward as a whole. When the mounting plate 321 moves downward, the airbag 324 in the middle of its lower end first touches the surface of the copper cathode plate; At the same time, the support base 316 fixedly installed at the lower end of the mounting plate 321 drives the rubber sleeve 312 and the adsorption plate 314 located inside the rubber sleeve 312 to move down synchronously, so that the sealing ring 315 at the lower end of the adsorption plate 314 and the sealing lip 311 at the lower end of the rubber sleeve 312 press against the surface of the copper cathode plate at the same time, establishing a sealed contact before adsorption.
[0034] 2. Dual-chamber independent vacuum adsorption.
[0035] After the pressure is applied, a vacuum is established simultaneously in both gas paths. One path draws gas from inside the adsorption plate 314 through a flexible tube connected to the adsorption plate 314; the other path draws gas from inside the suction ring 323 through the first suction pipe 325. The suction ring 323 then draws gas from inside the rubber sleeve 312 through each suction nozzle 326 that penetrates the rubber sleeve 312.
[0036] Because the inner cover 313 of the rubber sleeve 312 is fitted outside the support ring 317 of the adsorption disk 314, the interior of the rubber sleeve 312 is isolated into a separate sealed space independent of the inner cavity of the adsorption disk 314, and the two cavities are evacuated independently. During the evacuation process, the sealing ring 315 and the sealing lip 311 adhere to the surface of the copper cathode plate under the action of pressure difference, forming two layers of sealing contact, and the robotic arm 1 can then lift the copper cathode plate for transfer.
[0037] 3. Central support to prevent bending during transport.
[0038] The copper cathode plate has a large area and tends to bend in the middle after being adsorbed and lifted. When the rubber sleeve 312 and the adsorption plate 314 deform due to the vacuum being drawn, the air bladder 324 on the plate surface is simultaneously deformed by the reverse pressure of the copper cathode plate, forming a flexible support in the middle of the plate surface. This is beneficial for supporting the middle of the copper cathode plate and inhibiting its bending in the middle during transportation.
[0039] 4. Release in stages and gradually, and release the vacuum in an orderly manner.
[0040] Upon reaching the placement position, the vacuum in the two chambers is not released simultaneously. During the transport of the copper cathode plate, the first evacuation pipe 325 stops evacuating first, while the adsorption plate 314 continues to be evacuated through the hose, relying on the inner chamber to maintain adsorption. At the start of placement, the hose stops pumping air and begins filling the adsorption plate 314 with gas. The inner cavity of the adsorption plate 314 is the first to be released from vacuum and lose its adsorption capacity. Subsequently, the filling gas in the adsorption plate 314 diffuses into the rubber sleeve 312 through the ring-shaped array of perforations 318 on the sealing ring 315, thus releasing the vacuum from the inner cavity of the rubber sleeve 312. Once the rubber sleeve 312 and adsorption plate 314 are no longer subjected to vacuum extraction and compression, they gradually recover their deformation and push aside the copper cathode plate. The copper cathode plate is then released in an orderly and gradual manner, following the order of release from the inner cavity of the adsorption plate 314 first, followed by the release from the outer cavity of the rubber sleeve 312, completing one gripping and transfer cycle.
[0041] 5. Medium-sized copper cathode plate, with lateral support mechanism 4 unfolded.
[0042] When the size of the copper cathode plate increases, the electric telescopic rod 22 connected to the adjusting support frame 24 pushes the adjusting support frame 24 to rotate around the support shaft 27. One end of the adjusting support frame 24 slides inside the limiting frame 42 and drives the mounting frame 43 to rotate and unfold inside the mounting groove 322 of the mounting plate 321 via the retaining housing 44 until the rubber sealing piece 413 at the bottom of the rubber cover 45 at the lower end of the retaining housing 44 rotates to be on the same plane as the sealing lip 311 and the sealing ring 315 and then stops.
[0043] During adsorption, the robotic arm 1 drives the adsorption release mechanism 3 and the side support mechanism 4 to simultaneously press against the surface of the copper cathode plate. The rubber sealing sheet 413 presses against the plate surface, and several springs 47 inside the rubber cover 45 are compressed and accumulate deformation allowance. The suction pipe 41 draws gas from below the rubber cover 45 in the independent space isolated by the back plate 48, so that the rubber sealing sheet 413 on the bottom wall of the metal sheet 46 is tightly attached to the plate surface. The air bladder ring 49 between the metal sheet 46 and the rubber sealing sheet 413 is simultaneously compressed and deformed. After the copper cathode plate is lifted, the spring 47 and the rubber cover 45 are adaptively adjusted by contraction or rebound, so that the copper cathode plate maintains a suitable deformation state during transportation. The side support point and the central adsorption point jointly bear the weight of the plate.
[0044] 6. Large-size copper cathode plate, with adsorption component 5 extending outwards for adsorption.
[0045] For larger copper cathode plates, another set of electric telescopic rods 22 drives the outer diameter support frame 23 to rotate around the support shaft 27. Since the rotation radius of the outer diameter support frame 23 is greater than that of the adjustment support frame 24, its unfolding span is larger, which can drive the adsorption component 5 at the end to rotate and abut against the plate surface outside the coverage of the side support mechanism 4. Furthermore, the outer diameter support frame 23 and the adjustment support frame 24 can be unfolded synchronously and used together.
[0046] The swing frame 51 of the adsorption component 5 is rotatably mounted at one end of the outer diameter support frame 23. The counterweight at the lower end of the swing frame 51 enables it to swing adaptively after rotating with the outer diameter support frame 23, so that the suction cup 53 is always perpendicular to the surface of the copper cathode plate. As the adsorption adjustment mechanism 2 continues to press down, the suction cup 53 moves down and abuts against the plate surface. The second suction pipe 52 draws the gas inside the suction cup 53 to form adsorption, thereby increasing the adsorption support point on the outer edge of the plate surface. Together with the adsorption release mechanism 3 and the side support mechanism 4, it completes the multi-point adsorption and transfer of the large-size copper cathode plate.
[0047] Through the above process, this device achieves graded adjustment of the adsorption area and the number of support points by means of the two-stage rotating bracket of the adsorption adjustment mechanism 2, and achieves graded slow release by means of the independent air extraction of the inner cavity of the adsorption plate 314 and the outer cavity of the rubber sleeve 312, and the connection of the two cavities of the through hole 318 during the air filling stage. All air paths are uniformly gathered to the main control air pipe 26 for controlled opening and closing, which can adapt to the vacuum adsorption gripping and stable transfer of high-purity copper cathode plates of different sizes.
[0048] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.
Claims
1. A clean vacuum adsorption gripping and transfer device for high-purity copper cathode plates, characterized in that: The system includes a robotic arm (1), one end of which is provided with an adsorption adjustment mechanism (2) for controlling the vacuum adsorption area of the copper cathode plate. The lower end of the adsorption adjustment mechanism (2) is provided with an adsorption release mechanism (3). Both sides of the adsorption release mechanism (3) are rotatably equipped with side support mechanisms (4) for cooperating with the adsorption adjustment mechanism (2) to increase the adsorption support points of the copper cathode plate. Two adsorption components (5) are symmetrically installed at the lower end of the adsorption adjustment mechanism (2). The adsorption and release mechanism (3) includes a suction cup assembly (31) and a shell assembly (32). The shell assembly (32) is fixedly installed at the lower end of the adsorption adjustment mechanism (2). There are several suction cup assemblies (31), and the several suction cup assemblies (31) are arranged in a ring array at the lower end of the shell assembly (32).
2. The high-purity copper cathode plate clean vacuum adsorption gripping and transfer device according to claim 1, characterized in that: The adsorption adjustment mechanism (2) includes a structural frame (21) fixedly installed at one end of the robotic arm (1). Support shafts (27) are symmetrically arranged on both sides of the structural frame (21). An outer diameter support frame (23) and an adjustment support frame (24) are rotatably installed on the outer surface of the two support shafts (27). The rotation radius of the outer diameter support frame (23) is greater than the rotation radius of the adjustment support frame (24).
3. The high-purity copper cathode plate clean vacuum adsorption gripping and transfer device according to claim 2, characterized in that: One end of each of the two outer diameter support frames (23) and the adjusting support frame (24) is provided with an electric telescopic rod (22), and one end of the electric telescopic rod (22) is fixedly installed inside the structural frame (21). A main control air pipe (26) is provided in the middle of the structural frame (21), and electric sliding rods (25) are provided at the lower end of the structural frame (21) and on both sides of the main control air pipe (26).
4. The high-purity copper cathode plate clean vacuum adsorption gripping and transfer device according to claim 1, characterized in that: The outer shell assembly (32) includes a mounting plate (321) and an air extraction ring (323). The lower end of the mounting plate (321) is symmetrically provided with mounting grooves (322), and an airbag (324) is provided in the middle of the lower end of the mounting plate (321). The outer surface of the suction ring (323) is provided with a plurality of suction nozzles (326), the outer surface of the suction ring (323) is connected to a first suction pipe (325), the suction ring (323) passes through the rubber sleeve (312), and the suction nozzles (326) are located inside the rubber sleeve (312), and one end of the first suction pipe (325) extends into the interior of the main air control pipe (26).
5. The high-purity copper cathode plate clean vacuum adsorption gripping and transfer device according to claim 1, characterized in that: The suction cup assembly (31) includes a support base shell (316), which is fixedly installed at the lower end of the mounting plate (321). A rubber sleeve (312) is connected to the lower end of the support base shell (316). The rubber sleeve (312) is made of rubber material, and a sealing lip (311) is provided at the lower end of the rubber sleeve (312).
6. The high-purity copper cathode plate clean vacuum adsorption gripping and transfer device according to claim 5, characterized in that: The suction cup assembly (31) also includes an adsorption plate (314), the outer surface of which is provided with a support ring (317), the inner wall of which is provided with an inner cover (313), and the inner cover (313) is fitted on the outer surface of the support ring (317), the lower end of which is provided with a sealing ring (315), the adsorption plate (314) is located inside the rubber sleeve (312), and one end of the adsorption plate (314) is connected to a flexible tube that communicates with the inside of the main control air pipe (26).
7. The high-purity copper cathode plate clean vacuum adsorption gripping and transfer device according to claim 6, characterized in that: The sealing ring (315) has several through holes (318) arranged in a ring array inside, and the through holes (318) connect the adsorption plate (314) and the internal space of the rubber sleeve (312).
8. The high-purity copper cathode plate clean vacuum adsorption gripping and transfer device according to claim 2, characterized in that: The side support mechanism (4) includes a mounting frame (43), which is rotatably mounted inside the mounting groove (322). A retaining shell (44) is provided inside the mounting frame (43). A limiting frame (42) is provided at the upper end of the retaining shell (44). One end of the adjusting support frame (24) is slidably mounted inside the limiting frame (42). A rubber cover (45) is provided at the lower end of the retaining shell (44). A stop plate (48) is provided at the lower part of the inner wall of the rubber cover (45). Several springs (47) are provided at the upper end of the stop plate (48).
9. The high-purity copper cathode plate clean vacuum adsorption gripping and transfer device according to claim 8, characterized in that: The upper end of the support plate (48) is provided with an air inlet pipe (41) that communicates with the inside of the main control air pipe (26). The lower end of the rubber cover (45) is connected to a sealing soft ring (412). The lower end of the sealing soft ring (412) is connected to a metal soft sheet (46). The metal soft sheet (46) is made of elastic metal sheet material. The bottom wall of the metal soft sheet (46) is provided with a rubber sealing sheet (413). An airbag ring (49) is provided between the rubber sealing sheet (413) and the metal soft sheet (46). The bottom wall of the rubber sealing sheet (413) is provided with a rubber sheet.
10. A clean vacuum adsorption gripping and transfer device for a high-purity copper cathode plate according to claim 2, characterized in that: The adsorption assembly (5) includes a swing frame (51), which is rotatably mounted on one end of the outer diameter support frame (23). The lower end of the swing frame (51) is provided with a counterweight. The interior of the swing frame (51) is provided with a plurality of suction cups (53), and the upper end of the suction cups (53) is connected to a second suction pipe (52). One end of the second suction pipe (52) is connected to the interior of the main control pipe (26).
Citation Information
Patent Citations
High-safety vacuum transporter
CN215287039U
