A process and system for die cutting and waste removal of a narrow double-sided adhesive product

Abstract

The present application relates to a kind of narrow double-sided tape product die cutting waste process and system, narrow double-sided tape product includes release film product area and the double-sided tape product area pasted on its surface side end, the width of double-sided tape product area is 1 ~ 3mm, die cutting waste process includes the following steps: the double-sided tape layer and release film layer are obtained by lamination;Double-sided tape layer is carried out once die cutting along first die cutting line, first die cutting line includes sequentially connected first outer tangent, inner tangent and second outer tangent, first outer tangent and second outer tangent are located outside narrow double-sided tape product, the part of inner tangent located in narrow double-sided tape product and the inner edge line of double-sided tape product area coincide;Release film layer is carried out twice die cutting along second die cutting line, second die cutting line and the edge line of release film product area coincide;Along first die cutting line and second die cutting line, waste is carried out, and narrow double-sided tape product is obtained by winding, complete.Compared with prior art, the present application effectively improves narrow double-sided tape waste efficiency and product yield.

Description

Technical Field

[0001] This invention relates to the field of die-cutting technology, and in particular to a waste removal process and system for die-cutting narrow double-sided adhesive products. Background Technology

[0002] Narrow double-sided adhesive tape products (1-3mm width) have been widely used in the following fields due to their precise positioning, high material utilization and convenient operation: (1) Consumer electronics: used for fixing and sealing micro-components such as screen modules, camera components, battery modules and audio interfaces in smartphones and tablets, such as achieving traceless bonding between the screen frame and the body, with both structural stability and dust and water resistance; (2) Computer equipment: used in the manufacture of laptops to achieve reliable fixing of keyboard membranes, touchpad components and heat dissipation modules, effectively preventing component displacement caused by long-term mechanical vibration; (3) Home appliances: used for fixing control panels, display modules and internal cables in refrigerators, air conditioners and other equipment, ensuring stable electrical contact between membrane switches and circuit boards.

[0003] like Figures 1-4 As shown, the traditional die-cutting and waste removal process for narrow double-sided adhesive tape products typically involves two steps: the first step involves cutting the double-sided adhesive layer with a die and removing waste; the second step involves simultaneously cutting the double-sided adhesive layer and the underlying release film with a die and removing waste. However, material displacement and abnormal waste removal occur when processing 1-3mm narrow double-sided adhesive tape. This is because the effective width of the narrow double-sided adhesive product is too narrow, lacking sufficient support area on the carrier film, making it prone to positional displacement under the stress of the cutting tool during die-cutting; furthermore, when the waste removal pull exceeds the adhesion and holding force of the narrow double-sided adhesive tape on the carrier film, the effective product is abnormally peeled off along with the waste. These technical defects severely restrict the processing accuracy and yield of narrow double-sided adhesive tape, necessitating technological breakthroughs through process innovation.

[0004] Patent publication number CN113580262A discloses a die-cutting method and system for double-sided adhesive products containing multiple double-sided adhesive elements. During the single-pass die-cutting of the double-sided adhesive element pattern, the individual double-sided adhesive elements are connected into a single unit via a designed adhesive-covered connecting piece. When double-sided adhesive waste needs to be removed, smaller double-sided adhesive elements remain connected to larger ones, ensuring stable adhesion of the smaller elements to the product tape instead of being removed with the waste. This significantly reduces the defect rate of small double-sided adhesive elements and improves product yield. However, this die-cutting method is suitable for double-sided adhesive products containing multiple double-sided adhesive elements, but not for narrow double-sided adhesive tapes. Summary of the Invention

[0005] The purpose of this invention is to overcome the problems of material displacement and abnormal waste removal in the existing technology of narrow double-sided tape by providing a waste removal process and system for die-cutting narrow double-sided tape products, which can effectively improve the waste removal efficiency and product yield of narrow double-sided tape.

[0006] The objective of this invention can be achieved through the following technical solutions:

[0007] In one aspect, the present invention provides a die-cutting waste removal process for narrow double-sided adhesive products. The narrow double-sided adhesive product includes a release film product area and a double-sided adhesive product area adhered to its surface side. The width of the double-sided adhesive product area is 1-3 mm. The die-cutting waste removal process includes the following steps:

[0008] S1. Lay the double-sided adhesive layer and release film layer from top to bottom to obtain the material tape;

[0009] S2. The double-sided adhesive layer of the material strip is die-cut once along the first die-cutting line. The first die-cutting line includes a first outer tangent line, an inner tangent line, and a second outer tangent line connected in sequence. The first outer tangent line and the second outer tangent line are located outside the narrow double-sided adhesive product. The portion of the inner tangent line located inside the narrow double-sided adhesive product coincides with the inner edge line of the double-sided adhesive product area.

[0010] S3. The release film layer of the material strip is die-cut a second time along the second die-cutting line, and the second die-cutting line coincides with the edge line of the release film product area;

[0011] S4. Waste is removed along the first and second die-cutting lines, and the product is wound up to obtain a narrow double-sided adhesive product, thus completing the process.

[0012] Furthermore, in step S1, the material strip also includes a protective film layer located at the bottom of the release film layer.

[0013] Further, in step S2, the connection point between the first external tangent and the internal tangent is the first endpoint, the connection point between the internal tangent and the second external tangent is the second endpoint, and the straight line connecting the first endpoint and the second endpoint is a dummy line, which is located outside the release film product area.

[0014] Furthermore, in steps S2 and S3, the portion of the edge line of the release film product area located between the dummy line and the inner edge line of the double-sided adhesive product area is the middle line, and the distance between the dummy line and the middle line is 1 to 3 mm.

[0015] Furthermore, in step S2, the first external tangent and the second external tangent are straight lines, and they are located on the same straight line.

[0016] Further, in step S2, the internal tangent line includes:

[0017] An inner segment located within the narrow double-sided adhesive product and coinciding with the inner edge line of the double-sided adhesive product area;

[0018] The outer section is located on the narrow double-sided adhesive product and is connected to both ends of the inner section.

[0019] Furthermore, the outer tangent segment is a circular arc.

[0020] Furthermore, the release film product area includes a release film product body and a release film product protrusion protruding from the release film product body;

[0021] The double-sided adhesive product area is located on one side of the protruding part of the release film product.

[0022] Furthermore, the outer edge line of the double-sided adhesive product area coincides with the outer edge line of the release film product protrusion.

[0023] On the other hand, the present invention also provides a narrow double-sided adhesive product die-cutting waste removal system for performing the aforementioned die-cutting waste removal process, wherein the die-cutting waste removal system comprises, in sequence along the conveying direction of the material belt:

[0024] A bonding mechanism for bonding the double-sided adhesive layer and the release film layer;

[0025] A first die-cutting machine for die-cutting the double-sided adhesive layer of the strip along the first die-cutting line in one pass;

[0026] A second die-cutting machine for performing secondary die-cutting of the release film layer of the material strip along the second die-cutting line;

[0027] A waste removal mechanism for removing waste along the first and second die-cutting lines;

[0028] And a winding mechanism for winding narrow double-sided adhesive products.

[0029] Compared with the prior art, the present invention has the following advantages:

[0030] (1) The die-cutting waste removal process of the present invention changes the traditional die-cutting waste removal method. By setting the first die-cutting line, the phenomenon of narrow double-sided tape material displacement and waste removal abnormality are avoided.

[0031] (2) The first die-cutting line of the present invention is changed from the traditional one that coincides with the edge line of the double-sided adhesive product area to the inner tangent segment of the inner tangent line that coincides with the inner edge line of the double-sided adhesive product area. The first outer tangent line and the second outer tangent line are located outside the narrow double-sided adhesive product, so that during one die-cutting, the double-sided adhesive product area is connected with the double-sided adhesive waste outside it to form a mechanical anchor point, thereby providing sufficient tensile strength to prevent the double-sided adhesive product area from being pulled and displaced during waste discharge.

[0032] (3) During the first die-cutting, part of the double-sided adhesive layer is left as waste material on the outside of the double-sided adhesive layer, while the inner cutting line precisely cuts the inner edge line of the double-sided adhesive product area; during the second die-cutting of the release film layer, the second die-cutting line coincides with the edge line of the release film product area, so that all waste material can be removed at once during waste removal, reducing the number of times the material is pulled and avoiding material displacement caused by two waste removals.

[0033] (4) When the double-sided adhesive layer is die-cut once in this invention, the first outer tangent line and the second outer tangent line are located outside the narrow double-sided adhesive product to form an external waste area, while the inner tangent line precisely cuts the inner edge line of the double-sided adhesive product area. In this way, when the release film layer is die-cut twice, the waste has been partially separated, making it easier to peel off when discharging waste and reducing the pulling force on the double-sided adhesive product.

[0034] (5) After the release film layer is die-cut twice, the boundary of the release film waste is aligned with the boundary of the double-sided adhesive layer waste. When the waste is discharged, the adhesive layer and the release film waste form an integral waste unit through the anchoring area to avoid misalignment caused by layer peeling. Attached Figure Description

[0035] Figure 1 This is a schematic diagram of the narrow double-sided adhesive product of the present invention;

[0036] Figure 2 This is a schematic diagram of the first die-cutting line in a traditional die-cutting waste removal process;

[0037] Figure 3 This is a schematic diagram of the second die-cutting line in a traditional die-cutting waste removal process;

[0038] Figure 4 A schematic diagram of the combination of the first and second die-cutting lines in a traditional die-cutting waste removal process;

[0039] Figure 5 This is a schematic diagram of the first die-cutting line in the die-cutting waste removal process shown in Example 1;

[0040] Figure 6 This is a schematic diagram of a die-cut strip as shown in Example 1;

[0041] Figure 7 This is a schematic diagram of the combination of the first and second die-cutting lines in the die-cutting waste removal process shown in Example 1;

[0042] Figure 8 This is a schematic diagram of the material strip for secondary die-cutting as shown in Example 1;

[0043] Figure 9 This is a schematic diagram of multiple narrow double-sided adhesive products on the material strip in the die-cutting waste removal process shown in Example 1;

[0044] Figure 10 This is a photograph of the narrow double-sided adhesive product shown in Example 1;

[0045] Figure 11 This is a schematic diagram of the die-cutting waste removal system shown in Example 2.

[0046] Explanation of markings in the diagram:

[0047] 1-Material tape, 11-Double-sided adhesive layer, 12-Release film layer, 13-Protective film layer;

[0048] 21-First die-cutting line, 211-First external tangent line, 212-Internal tangent line, 2121-Internal segment, 2122-External segment, 213-Second external tangent line, 214-First endpoint, 215-Second endpoint, 216-Dummy line, 22-Second die-cutting line;

[0049] 3- Narrow double-sided adhesive product, 31- Double-sided adhesive product area, 32- Release film product area, 321- Release film product body, 322- Release film product protrusion, 321- Center line;

[0050] 41-Lamination mechanism, 42-First die-cutting machine, 43-Second die-cutting machine, 44-Waste removal mechanism, 45-Rewinding mechanism. Detailed Implementation

[0051] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments. The embodiments are implemented based on the technical solution of the present invention, providing detailed implementation methods and specific operating procedures. However, the scope of protection of the present invention is not limited to the following embodiments. In the following embodiments or examples, unless otherwise specified, the functional components or structures are conventional components or structures used in the art to achieve the corresponding functions.

[0052] It should be noted that in the description of this invention, the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," and "the other end," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0053] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0054] Example 1

[0055] like Figure 1 , 5 As shown in Figure 10, a die-cutting and waste removal process for narrow double-sided adhesive products is described. The narrow double-sided adhesive product 3 includes a release film product area 32 and a double-sided adhesive product area 31 pasted on its surface side. The width of the double-sided adhesive product area 31 is 2 mm.

[0056] In this embodiment, the release film product area 32 includes a release film product body 321 and a release film product protrusion 322 protruding from the release film product body 321;

[0057] The double-sided adhesive product area 31 is located on one side of the release film product protrusion 322.

[0058] In this embodiment, the release film product body 321 is a rounded rectangle; the release film product protrusion 322 is an arc strip disposed on one side of the rectangle. The double-sided adhesive product area 31 is an arc strip shape, and the outer edge line of the double-sided adhesive product area 31 coincides with the outer edge line of the release film product protrusion 322.

[0059] The die-cutting waste removal process includes the following steps:

[0060] S1. Double-sided adhesive layer 11 and release film layer 12 are bonded from top to bottom to obtain material tape 1;

[0061] S2. The double-sided adhesive layer 11 of the material strip 1 is die-cut once along the first die-cutting line 21. The first die-cutting line includes a first outer tangent line 211, an inner tangent line 212 and a second outer tangent line 213 connected in sequence. The first outer tangent line 211 and the second outer tangent line 213 are located outside the narrow double-sided adhesive product 3. The portion of the inner tangent line 212 located inside the narrow double-sided adhesive product 3 coincides with the inner edge line of the double-sided adhesive product area 31.

[0062] S3. The release film layer 12 of the material strip 1 is die-cut a second time along the second die-cutting line 22, and the second die-cutting line 22 coincides with the edge line of the release film product area 32.

[0063] S4. Waste is removed along the first die-cutting line 21 and the second die-cutting line 22, and the product is wound up to obtain narrow double-sided adhesive product 3, thus completing the process.

[0064] In this embodiment, in step S1, the material strip 1 further includes a protective film layer 13 located at the bottom of the release film layer 12.

[0065] In this embodiment, in step S2, the connection point of the first external tangent line 211 and the internal tangent line 212 is the first endpoint 214, the connection point of the internal tangent line 212 and the second external tangent line 213 is the second endpoint 215, and the straight line connecting the first endpoint 214 and the second endpoint 215 is the dummy line 216, which is located outside the release film product area 32.

[0066] In this embodiment, in steps S2 and S3, the portion of the edge line of the release film product area 32 located between the dummy line 216 and the inner edge line of the double-sided adhesive product area 31 is the middle line 321. The distance between the dummy line 216 and the middle line 321 is 1 to 3 mm, with the maximum distance being 3 mm.

[0067] In this embodiment, in step S2, the first external tangent line 211 and the second external tangent line 213 are straight lines, and they are located on the same straight line.

[0068] In this embodiment, in step S2, the inner tangent 212 includes:

[0069] An inner segment 2121 located within the narrow double-sided adhesive product 3 and coinciding with the inner edge line of the double-sided adhesive product area 31;

[0070] The outer section 2122 is located on the narrow double-sided adhesive product 3 and is connected to both ends of the inner section 2121.

[0071] In this embodiment, the outer tangent segment 2122 is an arc.

[0072] Example 2

[0073] A waste removal system for die-cutting narrow double-sided adhesive products, such as Figure 11 As shown, the die-cutting waste removal system, used to perform the die-cutting waste removal process described in Example 1, comprises the following components sequentially along the conveying direction of the material belt 1:

[0074] A bonding mechanism 41 for bonding the double-sided adhesive layer 11 and the release film layer 12;

[0075] A first die-cutting machine 42 is used to perform a single die-cutting of the double-sided adhesive layer 11 of the strip 1 along the first die-cutting line 21;

[0076] A second die-cutting machine 43 is used to perform secondary die-cutting of the release film layer 12 of the material strip 1 along the second die-cutting line 22;

[0077] Waste removal mechanism 44 for removing waste along the first die-cutting line 21 and the second die-cutting line 22;

[0078] And a winding mechanism 45 for winding narrow double-sided adhesive product 3.

[0079] Although the present invention has been described in detail above with general descriptions, specific embodiments, and experiments, modifications or improvements can be made to it, which will be obvious to those skilled in the art. Therefore, all such modifications or improvements made without departing from the spirit of the present invention fall within the scope of protection claimed by the present invention.

Claims

1. A waste removal process for die-cutting narrow double-sided adhesive products, characterized in that, The narrow double-sided adhesive product (3) includes a release film product area (32) and a double-sided adhesive product area (31) pasted on its surface side. The width of the double-sided adhesive product area (31) is 1-3 mm. The die-cutting waste removal process includes the following steps: S1. The double-sided adhesive layer (11) and the release film layer (12) are bonded together from top to bottom to obtain the material tape (1); S2. The double-sided adhesive layer (11) of the strip (1) is die-cut once along the first die-cutting line (21). The first die-cutting line includes a first outer tangent line (211), an inner tangent line (212), and a second outer tangent line (213) connected in sequence. The first outer tangent line (211) and the second outer tangent line (213) are located outside the narrow double-sided adhesive product (3). The portion of the inner tangent line (212) located inside the narrow double-sided adhesive product (3) coincides with the inner edge line of the double-sided adhesive product area (31). S3. The release film layer (12) of the strip (1) is die-cut a second time along the second die-cutting line (22), and the second die-cutting line (22) coincides with the edge line of the release film product area (32); S4. Waste is removed along the first die-cutting line (21) and the second die-cutting line (22), and the narrow double-sided adhesive product (3) is obtained by winding.

2. The die-cutting and waste removal process for narrow double-sided adhesive products according to claim 1, characterized in that, In step S1, the material strip (1) also includes a protective film layer (13) located at the bottom of the release film layer (12).

3. The die-cutting and waste removal process for narrow double-sided adhesive products according to claim 1, characterized in that, In step S2, the connection point between the first external tangent (211) and the internal tangent (212) is the first endpoint (214), the connection point between the internal tangent (212) and the second external tangent (213) is the second endpoint (215), and the straight line connecting the first endpoint (214) and the second endpoint (215) is a dummy line (216), which is located outside the release film product area (32).

4. The die-cutting and waste removal process for narrow double-sided adhesive products according to claim 3, characterized in that, In steps S2 and S3, the portion of the edge line of the release film product area (32) located between the dummy line (216) and the inner edge line of the double-sided adhesive product area (31) is the middle line (321), and the distance between the dummy line (216) and the middle line (321) is 1 to 3 mm.

5. The die-cutting and waste removal process for narrow double-sided adhesive products according to claim 1, characterized in that, In step S2, the first external tangent (211) and the second external tangent (213) are straight lines, and they are located on the same straight line.

6. The die-cutting waste removal process for narrow double-sided adhesive products according to claim 1, characterized in that, In step S2, the internal tangent (212) includes: An inner segment (2121) located within the narrow double-sided adhesive product (3) and coinciding with the inner edge line of the double-sided adhesive product area (31); The outer section (2122) is located on the narrow double-sided adhesive product (3) and is connected to both ends of the inner section (2121).

7. The die-cutting and waste removal process for narrow double-sided adhesive products according to claim 6, characterized in that, The external tangent segment (2122) is an arc.

8. The die-cutting and waste removal process for narrow double-sided adhesive products according to claim 1, characterized in that, The release film product area (32) includes a release film product body (321) and a release film product protrusion (322) protruding from the release film product body (321); The double-sided adhesive product area (31) is located on one side of the release film product protrusion (322).

9. The die-cutting and waste removal process for narrow double-sided adhesive products according to claim 8, characterized in that, The outer edge of the double-sided adhesive product area (31) coincides with the outer edge of the release film product protrusion (322).

10. A waste removal system for die-cutting narrow double-sided adhesive products, characterized in that, For performing the die-cutting waste removal process as described in any one of claims 1 to 9, the die-cutting waste removal system comprises, in sequence along the conveying direction of the material strip (1): A bonding mechanism (41) for bonding the double-sided adhesive layer (11) and the release film layer (12); A first die-cutting machine (42) for die-cutting the double-sided adhesive layer (11) of the strip (1) along the first die-cutting line (21) once; A second die-cutting machine (43) is used to perform secondary die-cutting of the release film layer (12) of the strip (1) along the second die-cutting line (22); Waste discharge mechanism (44) for discharging waste along the first die-cutting line (21) and the second die-cutting line (22); And a winding mechanism (45) for winding narrow double-sided adhesive products (3).

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