A die cutting process for pi die cut parts

Abstract

The present application relates to a kind of die-cutting processes of PI die-cutting piece, PI die-cutting piece includes release film area, PI film product area, handle film area in turn from bottom to top, the thickness of PI film product area ≥0.05mm, die-cutting process is: from bottom to top in turn adhering release film layer, PI film layer, form first material belt;To PI film layer is die-cut once, die-cut PI film product area PI film product edge line not coinciding with handle film area, carry out first waste;On the first material belt after once die-cutting upper layer adhering handle film layer, form second material belt;To handle film layer is die-cut twice, die-cut the interval between adjacent PI die-cutting piece, carry out second waste;To PI film layer is die-cut three times, die-cut handle film area handle film area edge line of handle film area, carry out third waste, and PI die-cutting piece is obtained by winding, complete.Compared with prior art, the present application can effectively avoid thick PI die-cutting piece product flanging and surface indentation phenomenon, avoid causing thickness NG, and then improve the quality of thick PI die-cutting piece, improve product yield.

Description

Technical Field

[0001] This invention relates to the field of die-cutting technology, and in particular to a die-cutting process for PI die-cut parts. Background Technology

[0002] Polyimide (PI) die-cut parts are widely used in structural and functional components of electronic devices due to their excellent temperature resistance and mechanical support properties. In recent years, with the increasing demand for high-performance electronic products, the industry's requirements for the thickness specifications of PI die-cut parts have been increasing (generally requiring ≥0.5mm), leading to significant challenges to traditional die-cutting processes.

[0003] Currently, the main processing method for thick PI die-cut parts in the industry adopts the process route of "pre-cutting the handle + die-cutting the outline". That is, a portion of the material is first removed to form the handle, and then the final shape of the product is processed using die-cutting tools (e.g., ...). Figures 1-3 (As shown). However, this process has the following inherent defects: (1) When pre-cutting the handle, the thick PI material is prone to edge folding (flanging) and surface indentation due to local stress concentration, resulting in out-of-tolerance (NG) thickness uniformity of the product; (2) Multiple cuts lead to the accumulation of interlayer deformation, and the product thickness tolerance rises sharply to 0.05-0.15mm, exceeding the industry standard of ±0.03mm, which in turn affects the assembly accuracy and reliability of downstream customers. The above problems seriously restrict the mass production yield and application range of thick PI die-cut parts, and process innovation is urgently needed.

[0004] Patent publication number CN118205945A discloses a processing technology for small PI double-sided adhesive die-cut parts with handles. The process includes the following steps: primary strip lamination to form a primary strip; first-punch die-cutting and waste removal; secondary strip lamination: sequentially laminating a handle release film and a protective film onto the second double-sided adhesive, removing the release film, and laminating a second auxiliary material cover film under the first double-sided adhesive to form a secondary strip; second-punch die-cutting and waste removal: performing second-punch die-cutting on a two-punch die-cutting machine, and removing the waste material containing the second auxiliary material cover film and the protective film, obtaining the small PI double-sided adhesive die-cut part with handles; product winding. However, when the PI film reaches a certain thickness, this processing technology results in edge flanging and surface indentation, leading to substandard product thickness. Summary of the Invention

[0005] The purpose of this invention is to overcome the defects of the prior art by providing a die-cutting process for PI die-cut parts, effectively avoiding edge turning and surface indentation in thick PI die-cut parts, preventing thickness defects, thereby improving the quality of thick PI die-cut parts and increasing product yield.

[0006] The objective of this invention can be achieved through the following technical solutions:

[0007] A die-cutting process for a PI die-cutting part, wherein the PI die-cutting part includes, from bottom to top, a release film area, a PI film product area, and a handle film area, wherein the thickness of the PI film product area is ≥0.05mm, and the die-cutting process includes the following steps:

[0008] S1. From bottom to top, the release film layer and the PI film layer are sequentially bonded to form the first material strip;

[0009] S2. Perform a die-cut on the PI film layer of the material strip, and perform a waste removal process on the edge line of the PI film product area that does not coincide with the handle film area.

[0010] S3. The handle film layer is laminated onto the first strip after one die-cutting to form the second strip;

[0011] S4. Perform secondary die-cutting on the handle film layer of the second strip, and die-cut the interval area between adjacent PI die-cut parts to perform secondary waste removal;

[0012] S5. Perform three die-cuts on the PI film layer of the second strip, die-cut the edge line of the handle film area, perform three waste removals, and rewind to obtain the PI die-cut part, thus completing the process.

[0013] Furthermore, the PI film product area is located within the handle film area, and the edge line of the PI film product partially overlaps with the edge line of the handle film area.

[0014] Furthermore, the edge line of the PI film product includes an outer edge line of the PI film product that coincides with the edge line of the handle film area, and an inner edge line of the PI film product located within the handle film area and not coinciding with the edge line of the handle film area.

[0015] Furthermore, in step S2, the first die-cutting line of a single die-cut is a continuous curve covering the inner edge line of the PI film product of several PI die-cut parts.

[0016] Furthermore, in step S1, the first material strip also includes a first protective film layer adhered to the surface of the PI film layer and a bottom protective film layer adhered to the bottom of the release film layer.

[0017] Furthermore, in step S3, the specific bonding process of the second material strip is as follows: peel off the first protective film layer of the top layer of the first material strip, and sequentially bond the handle film layer and the second protective film layer to the surface of the PI film layer to obtain the second material strip.

[0018] Furthermore, in step S5, the second protective film layer and the bottom protective film layer are peeled off during winding to obtain the PI die-cut part.

[0019] Furthermore, in step S2, positioning holes located at both ends of the first strip are also cut during the die-cutting process;

[0020] In steps S3 to S5, the handle film layer is positioned according to the positioning holes cut during the first die-cutting, and then the second and third die-cutting are performed.

[0021] Furthermore, in step S4, the secondary die-cutting line of the secondary die-cutting is a closed shape of two adjacent PI die-cutting parts.

[0022] Furthermore, in step S4, the secondary die-cutting line is located at one end of the PI die-cutting piece having the PI film product area, and its length is greater than or equal to the length of the PI film product area.

[0023] Furthermore, the minimum distance between the secondary die-cutting line and the PI film product area is 0-1mm, and can be 0.

[0024] Compared with the prior art, the present invention has the following advantages:

[0025] (1) Through the die-cutting process of the present invention, the extrusion of PI die-cut products can be avoided during the processing, and the phenomenon of edge turning and surface indentation of thick PI die-cut products can be effectively avoided, resulting in thickness NG, thereby ensuring the quality of PI die-cut products and improving product yield.

[0026] (2) The present invention performs die-cutting on the handle film layer in the interval area between adjacent PI die-cut parts, cutting only the handle film layer to form the interval groove, while preserving the integrity of the PI film layer. Through the pre-cutting of the handle film layer, the PI film layer still maintains continuous support when punching the shape of the PI die-cut parts in the future, avoiding the composite stress caused by the synchronous cutting of the handle film and the PI layer.

[0027] (3) The present invention performs die-cutting on the handle film layer in the interval area between adjacent PI die-cut parts to form an interval groove. The formed interval groove provides a stress release channel for subsequent punching and reduces the risk of edge tearing. Moreover, when punching the main product shape, since the handle film layer has been pre-cut with an interval groove, the cutting depth of the PI film layer is only its own thickness, and there is no need to penetrate the handle film layer, which significantly reduces the cutting pressure. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the PI die-cut part of the present invention;

[0029] Figure 2 This is a schematic diagram of a single die-cutting process using a traditional method.

[0030] Figure 3 This is a schematic diagram of secondary die-cutting in a traditional process.

[0031] Figure 4 This is a schematic diagram of a single die-cutting operation according to the process route shown in Example 1;

[0032] Figure 5 This is a schematic diagram of the secondary die-cutting process shown in Example 1;

[0033] Figure 6 This is a schematic diagram showing the location of the secondary die-cutting line in the process route shown in Example 1;

[0034] Figure 7 This is a schematic diagram of the three-stage die-cutting process shown in Example 1;

[0035] Figure 8 This is a schematic diagram of the layers of the first strip shown in Example 1;

[0036] Figure 9 This is a schematic diagram of the layers of the second strip shown in Example 1;

[0037] Figure 10 This is a layered schematic diagram of the PI die-cut part shown in Example 1.

[0038] Explanation of markings in the diagram:

[0039] 1-PI die-cut part, 11-release film area, 12-PI film product area, 121-PI film product edge line, 1211-PI film product outer edge line, 1212-PI film product inner edge line, 13-handle film area, 131-handle film area edge line;

[0040] 2-First material strip, 21-Release film layer, 22-PI film layer, 23-First protective film layer, 24-Underlying protective film layer;

[0041] 3-Second material strip, 31-Handle film layer, 32-Second protective film layer;

[0042] 41 - First die-cutting line, 42 - Second die-cutting line, 43 - Positioning hole. Detailed Implementation

[0043] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments. The embodiments are implemented based on the technical solution of the present invention, providing detailed implementation methods and specific operating procedures. However, the scope of protection of the present invention is not limited to the following embodiments. In the following embodiments or examples, unless otherwise specified, the functional components or structures are conventional components or structures used in the art to achieve the corresponding functions.

[0044] It should be noted that in the description of this invention, the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," and "the other end," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0045] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0046] Example 1

[0047] A die-cutting process for a PI die-cutting part, wherein the PI die-cutting part 1 includes, from bottom to top, a release film area 11, a PI film product area 12, and a handle film area 13, wherein the thickness of the PI film product area 12 is 0.05 mm. The PI film product area 12 is located within the handle film area 13, and the edge line 121 of the PI film product partially overlaps with the edge line 131 of the handle film area. The edge line 121 of the PI film product includes an outer edge line 1211 that overlaps with the edge line 131 of the handle film area, and an inner edge line 1212 that is located within the handle film area 13 and does not overlap with the edge line 131 of the handle film area.

[0048] In this embodiment, as Figure 1 , 4 As shown in Figure 10, the die-cutting process includes the following steps:

[0049] S1. The bottom protective film layer 24, release film layer 21, PI film layer 22, and first protective film layer 23 are sequentially bonded from bottom to top to form the first material strip 2.

[0050] S2. Perform a die-cut on the PI film layer 22 of the material strip 2, cut the positioning holes 43 located at both ends of the first material strip 2, and die-cut the edge line 121 of the PI film product area 12 that does not coincide with the handle film area 13, and perform a waste removal. The first die-cutting line 41 of the first die-cut is a continuous curve covering the inner edge line 1212 of the PI film product of several PI die-cut parts 1.

[0051] S3. Peel off the first protective film layer 23 from the top layer of the first strip 2, position it according to the positioning hole 43 cut during the first die cutting, and sequentially attach the handle film layer 31 and the second protective film layer 32 to the surface of the PI film layer 22 to obtain the second strip 3.

[0052] S4. Positioning is performed based on the positioning holes 43 cut during the first die-cutting. A second die-cutting is then performed on the handle film layer 31 of the second strip 3, cutting the space between adjacent PI die-cut parts 1, and performing secondary waste removal. The secondary die-cutting line 42 is a closed shape adjacent to two adjacent PI die-cut parts 1. The secondary die-cutting line 42 is located at the end of the PI die-cut part 1 with the PI film product area 12, and its length is greater than or equal to the length of the PI film product area 12. The minimum distance between the secondary die-cutting line 42 and the PI film product area 12 is 0, or any value between 0 and 1 mm.

[0053] S5. Position the PI film layer 22 of the second strip 3 according to the positioning hole 43 cut during the first die cutting, perform three die cuttings on the PI film layer 22 of the second strip 3, die cut the edge line 131 of the handle film area 13, peel off the second protective film layer 32 and the bottom protective film layer 24, perform three waste removals, and rewind to obtain the PI die-cut part 1, thus completing the process.

[0054] Although the present invention has been described in detail above with general descriptions, specific embodiments, and experiments, modifications or improvements can be made to it, which will be obvious to those skilled in the art. Therefore, all such modifications or improvements made without departing from the spirit of the present invention fall within the scope of protection claimed by the present invention.

Claims

1. A die-cutting process for PI die-cut parts, characterized in that, The PI die-cut part (1) includes, from bottom to top, a release film area (11), a PI film product area (12), and a handle film area (13), wherein the thickness of the PI film product area (12) is ≥ 0.05mm, the die-cutting process includes the following steps: S1. From bottom to top, release film layer (21) and PI film layer (22) are sequentially bonded to form the first material strip (2); S2. Die-cut the PI film layer (22) of the strip (2) once, and die-cut the edge line (121) of the PI film product area (12) that does not coincide with the handle film area (13) once, and remove waste once. S3. A handle film layer (31) is bonded to the first strip (2) after one die-cutting to form a second strip (3); S4. Perform secondary die-cutting on the handle film layer (31) of the second strip (3), and die-cut the interval area between adjacent PI die-cut parts (1) to perform secondary waste removal; S5. Perform three die-cuts on the PI film layer (22) of the second strip (3), and die-cut the edge line (131) of the handle film area (13) of the handle film area (13). Perform three waste removals and rewind to obtain the PI die-cut part (1). Complete.

2. The die-cutting process for a PI die-cut part according to claim 1, characterized in that, The PI film product area (12) is located within the handle film area (13), and the edge line (121) of the PI film product partially overlaps with the edge line (131) of the handle film area.

3. The die-cutting process for a PI die-cutting part according to claim 2, characterized in that, The edge line (121) of the PI film product includes an outer edge line (1211) of the PI film product that coincides with the edge line (131) of the handle film area, and an inner edge line (1212) of the PI film product that is located within the handle film area (13) and does not coincide with the edge line (131) of the handle film area.

4. The die-cutting process for a PI die-cutting part according to claim 3, characterized in that, In step S2, the first die-cutting line (41) of a single die-cut is a continuous curve of the inner edge line (1212) of the PI film product covering a number of PI die-cut parts (1).

5. The die-cutting process for a PI die-cutting part according to claim 1, characterized in that, In step S1, the first material strip (2) further includes a first protective film layer (23) adhered to the surface of the PI film layer (22) and a bottom protective film layer (24) adhered to the bottom of the release film layer (21).

6. The die-cutting process for a PI die-cut part according to claim 5, characterized in that, In step S3, the specific bonding process of the second material strip (3) is as follows: peel off the first protective film layer (23) on the top layer of the first material strip (2), and bond the handle film layer (31) and the second protective film layer (32) to the surface of the PI film layer (22) in sequence to obtain the second material strip (3).

7. The die-cutting process for a PI die-cut part according to claim 6, characterized in that, In step S5, the second protective film layer (32) and the bottom protective film layer (24) are peeled off during winding to obtain the PI die-cut part (1).

8. The die-cutting process for a PI die-cut part according to claim 1, characterized in that, In step S2, during the die-cutting process, positioning holes (43) located at both ends of the first strip (2) are also cut; In steps S3 to S5, positioning is performed according to the positioning hole (43) cut during the first die-cutting, the handle film layer (31) is attached, and a second die-cutting and a third die-cutting are performed.

9. The die-cutting process for a PI die-cut part according to claim 1, characterized in that, In step S4, the secondary die-cutting line (42) of the secondary die-cutting is a closed shape that is adjacent to two PI die-cutting parts (1).

10. The die-cutting process for a PI die-cut part according to claim 9, characterized in that, In step S4, the secondary die-cutting line (42) is located at one end of the PI die-cutting piece (1) having the PI film product area (12), and its length is greater than or equal to the length of the PI film product area (12).

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