A ceramic automatic chip mounter and a method for using the same

Abstract

The present application belongs to the technical field of automatic processing equipment for ceramic piezoelectric components, and particularly relates to a ceramic automatic chip mounter and a use method thereof, comprising a machine base, a feeding tray arranged on the machine base, a first three-axis driving module, a dispensing and chip mounting mechanism, a second three-axis driving module, a adhesive tape mounting mechanism and a sectional transportation guide rail; the transportation guide rail is divided into a jig feeding section, a jig overturning section and a jig discharging section, and cooperates with a jacking mechanism, a jig overturning clamping assembly, a material wiping visual assembly and a multifunctional dispensing and chip mounting mechanism to realize automatic cleaning, picking and precise mounting of strain gauges and terminal sheets, as well as full-automatic processing of piezoelectric stack double-sided dispensing, chip mounting and adhesive tape mounting. The present application realizes work division by double three-axis modules and assembly line type jig transportation, integrates full-process processing functions, solves the problems of existing equipment process dispersion, low processing precision and insufficient automation, has good processing consistency and high production efficiency, and is suitable for piezoelectric stack large-scale precision production.

Description

Technical Field

[0001] This invention belongs to the technical field of automated processing equipment for ceramic piezoelectric components, and particularly relates to an automatic ceramic chip attaching machine and its usage method. Background Technology

[0002] A fast-reflecting mirror (FRMirror) is a precision servo system capable of high-frequency, small-angle beam deflection. The piezoelectric ceramic FRMirror represents a significant advancement in FRMirror technology. By utilizing the inverse piezoelectric effect of piezoelectric ceramics, combined with a precise flexible hinge mechanism, high-resolution displacement sensing, and advanced control algorithms, it perfectly addresses the demands of modern high-performance optical systems for high-speed, high-precision, and high-bandwidth beam control, becoming a core component in high-end precision optical equipment. Its technological development exemplifies the collaborative progress of multiple disciplines, including materials science, mechanics, electronics, and control. The high performance of piezoelectric ceramic fast reflectors makes them an indispensable core component in the following fields: 1. Free-space optical communication: compensating for platform vibration and aiming errors in inter-satellite and ground-to-satellite laser communication; 2. Adaptive optics: correcting wavefront distortion caused by atmospheric turbulence in astronomical telescopes (used as tilting mirrors); 3. Precision laser processing and engraving: controlling laser beams for high-speed, high-precision scanning and positioning; 4. Biomedical imaging: such as confocal microscopy and optical coherence tomography, used for beam scanning and aberration correction; 5. Inertial confinement fusion: used to guide and stabilize multiple high-energy laser beams for precise target hitting.

[0003] Existing processing methods mostly rely on manual assistance and semi-automatic equipment operation, which has the following drawbacks: 1. The processes are fragmented and have low integration: dispensing, patching, tape application, and fixture flipping are all completed by independent equipment, resulting in cumbersome material handling and long production cycles; 2. Poor alignment accuracy: Manual material handling and manual positioning fixtures result in large deviations between the strain gauge and the terminal piece, affecting the sensing and driving accuracy of the piezoelectric stack. Therefore, there is an urgent need for an integrated, high-precision, and fully automated ceramic chip mounter to solve the technical problems of scattered processes, low precision, and insufficient automation in existing technologies. Summary of the Invention

[0004] The purpose of this invention is to provide an automatic ceramic chip mounter and its usage method, aiming to solve the technical problems of dispersed processes, low precision, and insufficient automation in the prior art.

[0005] To achieve the above objectives, an embodiment of the present invention provides an automatic ceramic chip mounter, comprising: a base and a component disposed on the base: The loading tray is used to hold strain gauges and terminal pieces. The first three-axis drive module, the drive end of the first three-axis linear drive module moves along the three axes. The dispensing and mounting mechanism is located at the drive end of the first three-axis drive module. This mechanism is used to dispense adhesive onto the piezoelectric stack in the flat fixture and to pick up strain gauges and terminal pieces from the loading tray and transport them to the piezoelectric stack for bonding and installation. The second three-axis drive module, a linear drive module, is located on one side of the first three-axis drive module. The drive end of the second three-axis drive module moves along the three axes. The tape-applying mechanism is located at the drive end of the second and third-axis drive module. This mechanism is used to apply tape to the upper surface of the piezoelectric stack. The transport guide rail, via a first three-axis drive module and a second three-axis drive module, is used to transport the flat fixture along its movement. The transport guide rail is provided with the following sequentially arranged along a straight direction: The jig loading section is used for loading and transporting the flat jig containing the piezoelectric stack. The jig flipping section is used to flip the flat-mounted jig. The jig cutting section is used to cut and apply adhesive tape to the flat jig.

[0006] Furthermore, it also includes: The lifting mechanism is mounted on the machine base and located below the fixture tilting section. The lifting mechanism is used to lift the flat fixture on the fixture tilting section for the dispensing and gluing mechanism to process.

[0007] Furthermore, the lifting mechanism includes: The lifting drive component is mounted on the machine base and located below the fixture tilting section. A lifting plate is located at the drive end of a lifting drive unit, which drives the lifting plate to rise or fall. The lifting plate is used to lift the flat fixture on the tilting section of the fixture. Positioning posts are set on the upper surface of the lifting plate and are used to position the flat fixture on the flipping section of the fixture.

[0008] Furthermore, the fixture flipping section includes: The tilting drive frame is slidably mounted on the machine base. The tilting driven frame is slidably mounted on the machine base and is positioned opposite to the tilting drive frame. The tilting drive frame and the tilting driven frame cooperate to clamp and transport the flat fixture. A double-ended lead screw has a tilting drive frame and a tilting driven frame screwed to its two ends respectively. The rotation of the double-ended lead screw drives the tilting drive frame and the tilting driven frame to move closer to or further apart from each other. The positioning motor is mounted on the machine base. The drive end of the positioning motor is connected to the bidirectional lead screw and is used to drive the bidirectional lead screw to rotate.

[0009] Furthermore, the fixture flipping section also includes: Two fixture clamping assemblies are respectively mounted opposite to the tilting drive frame and the tilting driven frame, and are rotatably connected to the tilting drive frame and the tilting driven frame via drive shafts. The fixture clamping assembly includes: Connecting plate, the connecting plate is connected to the drive shaft. A fixture drive conveyor belt is mounted on the connecting plate. This conveyor belt carries the flat fixture and drives it in linear motion. A cover plate is placed on top of a connecting plate, and a gap is provided between the cover plate and the fixture drive conveyor belt for placing a flat fixture. A tilting motor, mounted on a tilting drive frame, is connected to a drive shaft and drives the fixture clamping assembly on the tilting drive frame to rotate. Connecting column: The connecting column is used to connect the cover plate on the flip drive frame and the cover plate on the flip driven frame.

[0010] Furthermore, it also includes: The wiping assembly is mounted on the base and located on one side of the loading tray. The wiping assembly is used to wipe the strain gauges and terminal pieces picked up by the dispensing and mounting mechanism. The first camera is mounted on the base and located on one side of the loading tray. The first camera is used to photograph the position of the strain gauge and terminal piece after wiping.

[0011] Furthermore, the wiping component includes: Wiping plate, the wiping plate is set on the machine base. A placement disc is rotatably mounted on the wiping plate; the placement disc is used to hold rolls of wiping paper. A winding disc is rotatably mounted on the wiping plate and is used to wind up the wiping paper roll. The take-up motor drives the take-up disc to rotate. An alcohol container, located on the wiping board, is used to store alcohol. Several guide rollers are rotatably mounted on the wiping plate, and each guide roller is used to guide the wiping paper through the alcohol box.

[0012] Furthermore, the dispensing and bonding mechanism includes: The mounting plate is located at the drive end of the first three-axis drive module, which drives the mounting plate to move along three axes. A second camera, mounted on the mounting plate, is used to capture images of the position of the flat fixture on the fixture flipping section. Two suction nozzles, mounted on the mounting plate, are used to pick up strain gauges and terminal pieces. A glue dispensing gun, mounted on a mounting plate, is used to dispense glue onto piezoelectric stacks on a flat-mounted fixture. Several lifting cylinders are mounted on a mounting plate. The drive end of each lifting cylinder is connected to the nozzle and the glue gun, respectively. The lifting cylinders are used to drive the glue gun and the nozzle to move in the vertical direction.

[0013] Furthermore, the dispensing and bonding mechanism also includes: The pressing block, which is set on the mounting plate, is used to press the strain gauges and terminal pieces on the piezoelectric stack.

[0014] The present invention provides a method for using an automatic ceramic chip mounter, comprising: Step 1: Manually install the piezoelectric stack onto the flat mounting fixture, and then load it from the fixture's loading section. Step 2: Manually place the strain gauges and terminal pieces onto the loading tray. Step 3: The jig loading section transports the flat-packed jig to the jig turning section. Step 4: The first three-axis drive module drives the dispensing and bonding mechanism to move onto the loading tray. The dispensing and bonding mechanism picks up the strain gauges and terminal pieces from the loading tray. Step 5: The first three-axis drive module drives the dispensing and patching mechanism to move to the fixture flipping section. The dispensing and patching mechanism dispenses adhesive and installs strain gauges and terminal pieces onto the flat fixture on the fixture flipping section. Step Six: After installation, the flat fixture on the fixture flipping section is driven to the fixture unloading section. The second and third axis drive modules drive the tape application mechanism to move above the flat fixture. The tape application mechanism automatically applies tape and rolls and squeezes adhesive onto the piezoelectric stacks on the strain gauges and terminal pieces. Step 7: After applying adhesive tape to one side of the flat fixture, return the flat fixture to the fixture flipping section to flip it over. Then repeat steps 4 to 6 to apply adhesive and stickers to the other side of the flat fixture. Step 8: Material feeding section - flat mounting fixture.

[0015] The above-mentioned technical solutions of one or more of the ceramic automatic chip mounters provided in this invention have at least one of the following technical effects: Using a base as the supporting body and a segmented transport guide rail as the main material conveying line, the equipment processing area is divided into loading, processing, and unloading stations along the conveying direction; functional zoning operations are achieved through two independent three-axis drive modules, wherein the first three-axis drive module drives the dispensing and mounting mechanism to complete the piezoelectric stack dispensing, strain gauge and terminal piece picking and bonding processes in the area above the guide rail; the second three-axis drive module drives the tape-applying mechanism to independently complete the tape-applying and rolling processes on the piezoelectric stack surface; the transport guide rail forms a closed-loop transport link through a fixture loading section, a fixture flipping section, and a fixture unloading section; the fixture flipping section is used to achieve automatic flipping of the flat fixture and the internal piezoelectric stack, allowing the dispensing and mounting mechanism and the tape-applying mechanism to sequentially complete standardized processing of the two end faces of the piezoelectric stack; the entire process relies on the core logic of assembly line transport and parallel operation of dual modules to complete the automated double-sided assembly processing of the piezoelectric stack.

[0016] This invention integrates the entire process of material feeding, piezoelectric stack dispensing and applying, surface tape application, and fixture conveying and flipping into a single machine by integrating a base with a feeding tray, a first three-axis drive module, a second three-axis drive module, a dispensing and patching mechanism, a tape application mechanism, and segmented transport rails. This eliminates the traditional multi-device, dispersed operation mode, reduces material transfer time, and significantly shortens production cycle time. The first and second three-axis drive modules operate separately, allowing for parallel processing without interference: The first three-axis drive module carries the dispensing and patching mechanism, while the second three-axis drive module carries the tape application mechanism. The two three-axis modules move independently, and the processes are carried out in parallel. The dispensing and patching operations and the tape application operations do not interfere with each other, maximizing the use of equipment workstation space and increasing productivity per unit time. The transport guide rail is divided into a fixture loading section, a fixture flipping section, and a fixture unloading section, enabling automatic loading of pre-assembled piezoelectric stack fixtures, automatic flipping of fixtures during processing, and automatic unloading of finished fixtures, forming a closed-loop production line. No manual fixture transfer is required throughout the process, making it suitable for large-scale mass production. The transport guide rail integrates a flipping station, combined with a dual-function processing mechanism, naturally adapting to the processing requirements of double-sided piezoelectric stack patching and double-sided tape application. The equipment is highly versatile and can complete double-sided precision assembly without additional modifications. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of an automatic ceramic chip mounter provided in an embodiment of the present invention.

[0019] Figure 2 This is a schematic diagram of the fixture flipping section of an automatic ceramic bonding machine provided in an embodiment of the present invention.

[0020] Figure 3 This is a schematic diagram of the wiping assembly of an automatic ceramic patching machine provided in an embodiment of the present invention.

[0021] Figure 4 This is a schematic diagram of the dispensing and bonding mechanism of an automatic ceramic bonding machine provided in an embodiment of the present invention.

[0022] Figure 5 This is a schematic diagram of the lifting mechanism of an automatic ceramic tile attaching machine provided in an embodiment of the present invention.

[0023] Reference numerals: 100, base; 200, loading tray; 300, first three-axis drive module; 400, dispensing and patching mechanism; 410, mounting plate; 420, second camera; 430, nozzle; 440, dispensing gun; 450, lifting cylinder; 460, pressing block; 500, second three-axis drive module; 600, tape application mechanism; 700, transport guide rail; 710, fixture loading section; 720, fixture tilting section; 721, tilting drive frame; 722, tilting driven frame; 723, double-acting lead screw; 724, adjustment mechanism. 730. Motor; 740. Fixture feeding section; 741. Fixture clamping assembly; 742. Drive shaft; 743. Connecting plate; 744. Fixture drive conveyor belt; 745. Cover plate; 746. Tilting motor; 800. Connecting column; 810. Lifting mechanism; 820. Lifting drive component; 830. Positioning column; 900. Wiping assembly; 910. First shooting camera; 920. Wiping plate; 921. Placement disc; 922. Rewinding disc; 923. Rewinding motor; 924. Alcohol box; 925. Guide roller shaft. Detailed Implementation

[0024] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain embodiments of the present invention, and should not be construed as limiting the present invention.

[0025] In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0026] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of the present invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0027] In the embodiments of the present invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of the present invention according to the specific circumstances.

[0028] In one embodiment of the present invention, reference is made to... Figures 1-5 As shown, an automatic ceramic chip mounter is provided, including: a base 100 and components disposed on the base 100: Feeding tray 200 is used to place strain gauges and terminal pieces. The first three-axis drive module 300, the drive end of the first three-axis linear drive module moves along the three axes. The dispensing and mounting mechanism 400 is located at the drive end of the first three-axis drive module 300. The dispensing and mounting mechanism 400 is used to dispense adhesive to the piezoelectric stack in the flat fixture and to pick up strain gauges and terminal pieces from the loading tray 200 and transport them to the piezoelectric stack for bonding and installation. The second three-axis drive module 500 is located on one side of the first three-axis drive module 300, and the drive end of the second three-axis drive module 500 moves along the three axes. The tape-applying mechanism 600 is located at the drive end of the second three-axis drive module 500. The tape-applying mechanism 600 is used to apply tape to the upper surface of the piezoelectric stack. The transport guide rail 700, via the first three-axis drive module 300 and the second three-axis drive module 500, is used to transport flat fixtures that move along the transport guide rail 700. The transport guide rail 700 is provided with the following sequentially along a straight direction: The jig loading section 710 is used for loading and transporting the flat jig containing the piezoelectric stack. Fixture flipping section 720 is used to flip flat-mounted fixtures. The jig cutting section 730 is used for cutting and applying tape to the flat jig.

[0029] In this embodiment, the base 100 is integrally cast from cast iron, which has the characteristics of shock absorption and high rigidity, and avoids the impact of equipment vibration on the fitting accuracy during processing; the loading tray 200 is fixed to the front end area of ​​the base 100 by bolts, and the surface of the tray is provided with matrix positioning grooves for classifying and positioning strain gauges and terminal pieces to prevent material stacking from shifting.

[0030] The first three-axis drive module 300 is a linear three-axis drive module, which adopts a gantry-type linear motor drive structure. Its drive end can achieve precise displacement in the X (lateral), Y (longitudinal), and Z (vertical) three-axis directions, with a repeatability positioning accuracy of ±0.01mm. The dispensing and patching mechanism 400 is fixed to the drive end of the first three-axis drive module 300 through a flange. It is driven by the first three-axis drive module 300 to move across the entire range. This mechanism has both dispensing and patching functions. It can perform quantitative dispensing of adhesive to the piezoelectric stack inside the flat fixture and pick up strain gauges and terminal pieces in the loading tray 200 and transfer them to the surface of the piezoelectric stack to complete the bonding and assembly.

[0031] The second three-axis drive module 500 has the same structure as the first three-axis drive module 300 and is arranged side by side on the right side of the first three-axis drive module 300. The working areas of the two partially overlap but their motion trajectories do not interfere with each other. Its drive end can also achieve X / Y / Z three-axis displacement. The tape applicator 600 is bolted to the drive end of the second three-axis drive module 500 and moves with the three axes of the module. It is used to apply insulating protective tape to the upper surface of the processed piezoelectric stack and complete the rolling and tape removal operation.

[0032] The transport guide rail 700 adopts a linear guide rail structure, passing through the processing area below the first three-axis drive module 300 and the second three-axis drive module 500. The guide rail uses synchronous belt drive to carry and transport the flat fixture along the guide rail in a straight line. Along the material conveying direction, the transport guide rail 700 is divided into an integrally connected fixture loading section 710, a fixture flipping section 720, and a fixture unloading section 730.

[0033] The fixture loading section 710 is located at the front end of the guide rail and is used for manually or by connecting to the production line to feed the pre-installed piezoelectric stack flat fixture; the fixture flipping section 720 is located in the core processing area in the middle of the guide rail and is used to clamp and flip the flat fixture 180° to realize double-sided dispensing and patching processing of the workpiece; the fixture unloading section 730 is located at the end of the guide rail and is used for tape application processing and to output the finished flat fixture that has completed double-sided dispensing, patching, and tape application.

[0034] Specifically, refer to Figures 1-5 As shown, it also includes: The lifting mechanism 800 is mounted on the base 100 and located below the fixture flipping section 720. The lifting mechanism 800 is used to lift the flat fixture on the fixture flipping section 720 for the dispensing and gluing mechanism 400 to process.

[0035] In this embodiment, the lifting mechanism 800 is bolted to the base 100 and precisely positioned directly below the fixture flipping section 720. It serves as a supporting positioning component for the fixture processing station. In existing technologies, the flat fixture is directly placed on the transport guide rail 700 for processing. The guide rail transmission gap and the fixture being suspended can cause slight shaking during processing, affecting dispensing accuracy and patch alignment accuracy. This embodiment addresses this by providing the lifting mechanism 800 below the fixture flipping section 720. When the flat fixture is transported to the flipping section processing station, the lifting mechanism 800 lifts the flat fixture upwards, disengaging it from the transmission structure of the transport guide rail 700. This eliminates the shaking interference caused by the guide rail gap and locks the fixture at a preset processing height, specifically for the dispensing and patching mechanism 400 to perform precise dispensing and patching.

[0036] Specifically, refer to Figures 1-5 As shown, the lifting mechanism 800 includes: The lifting drive component 810 is mounted on the base 100 and located below the fixture tilting section 720. A lifting plate 820 is disposed at the drive end of a lifting drive component 810. The lifting drive component 810 is used to drive the lifting plate 820 to rise or fall. The lifting plate 820 is used to lift the flat fixture on the fixture tilting section 720. Positioning post 830 is set on the upper surface of lifting plate 820 and is used for the flat fixture on the positioning fixture flipping section 720.

[0037] In this embodiment, the lifting drive component 810 is a servo electric cylinder, fixedly installed in the internal cavity of the machine base 100 by a bracket, and vertically aligned with the center of the fixture tilting section 720. It has a closed-loop displacement control function, and the lifting stroke can be precisely adjusted. The lifting plate 820 is a rectangular aluminum alloy plate, rigidly connected to the power output end of the lifting drive component 810 through a flange. The lifting drive component 810 can drive the lifting plate 820 to rise or fall smoothly in the vertical direction. The surface area of ​​the lifting plate 820 matches the bottom area of ​​the flat fixture, and is used to fully lift and raise the flat fixture. This achieves precise limit positioning of the fixture in the XY direction, preventing fixture deviation during processing.

[0038] Specifically, refer to Figures 1-5 As shown, the fixture flip section 720 includes: A tilting drive frame 721 is slidably mounted on the base 100. The tilting driven frame 722 is slidably mounted on the machine base 100 and is positioned opposite to the tilting drive frame 721. The tilting drive frame 721 and the tilting driven frame 722 cooperate to clamp and transport the flat fixture. A bidirectional lead screw 723 is provided, with a tilting drive frame 721 and a tilting driven frame 722 screwed to its two ends respectively. The rotation of the bidirectional lead screw 723 drives the tilting drive frame 721 and the tilting driven frame 722 to move closer to or further away from each other. The positioning motor 724 is mounted on the machine base 100. The drive end of the positioning motor 724 is connected to the bidirectional lead screw 723 and is used to drive the bidirectional lead screw 723 to rotate.

[0039] In this embodiment, two parallel linear slide rails are provided on the base 100 corresponding to the jig flipping section 720 area. The bottom of the flipping drive frame 721 and the flipping driven frame 722 are both equipped with sliders. The two are slidably mounted on the slide rails of the base 100 through the sliders and are arranged facing each other from left to right. The two frames cooperate to form a clamping space for clamping flat jigs of different widths and assisting in the conveying.

[0040] A fixed support is provided in the middle of the bidirectional lead screw 723, which is fixed on the machine base 100. The left and right ends of the bidirectional lead screw 723 are provided with external threads with opposite directions of rotation, and the two ends are respectively threaded to the threaded seats at the bottom of the flip drive frame 721 and the flip driven frame 722. The adjustment motor 724 is a stepper motor, which is fixed on the side of the machine base 100, and its output shaft is connected to the end of the bidirectional lead screw 723 through a coupling.

[0041] During operation, the adjustment motor 724 drives the bidirectional lead screw 723 to rotate in the forward or reverse direction. Utilizing the reverse thread characteristics at both ends, it drives the flipping drive frame 721 and the flipping driven frame 722 to move closer to each other or separate, adjusting the distance between the two frames in real time. This is used to lift the flat fixture using the anti-air lifting mechanism 800, which is used for dispensing and attaching adhesive to the voltage stack in the flat fixture.

[0042] Specifically, refer to Figures 1-5 As shown, the jig flipping section 720 also includes: Two fixture clamping assemblies 740 are respectively mounted on the tilting drive frame 721 and the tilting driven frame 722, and are rotatably connected to the tilting drive frame 721 and the tilting driven frame 722 via a drive shaft 741. The jig clamping assembly 740 includes: Connecting plate 742, connecting plate 742 is connected to drive shaft 741. A fixture drive conveyor belt 743 is mounted on a connecting plate 742. The fixture drive conveyor belt 743 carries the flat fixture and drives the flat fixture to perform linear motion. A cover plate 744 presses down on a connecting plate 742. A gap is provided between the cover plate 744 and the fixture drive conveyor belt 743 for placing a flat fixture. A flip motor 745 is mounted on a flip drive frame 721 and connected to a drive shaft 741. The flip motor 745 drives the fixture clamping assembly 740 on the flip drive frame 721 to rotate. Connecting post 746 is used to connect cover plate 744 on flip drive frame 721 and cover plate 744 on flip driven frame 722.

[0043] In this embodiment, the single-set jig clamping assembly 740 includes a connecting plate 742, a jig drive conveyor belt 743, and a cover plate 744; the outer end of the connecting plate 742 is fixedly connected to the drive shaft 741 and can rotate synchronously with the drive shaft 741; the jig drive conveyor belt 743 is a silicone anti-slip synchronous belt, which is assembled on the inner side of the connecting plate 742 and driven by a built-in stepper motor to support the flat jig and drive the jig to be transported linearly along the guide rail direction.

[0044] The cover plate 744 is made of an insulating rigid plastic plate and is pressed and installed on top of the connecting plate 742. A 2-5mm limiting gap is reserved between the cover plate 744 and the fixture drive conveyor belt 743 below. This gap matches the thickness of the flat fixture, allowing the flat fixture to pass through and be placed, while limiting the vertical jump of the fixture.

[0045] The flip motor 745 is fixedly installed on the outer wall of the flip drive frame 721. The output end of the flip motor 745 is connected to the drive shaft 741 on the same side through a reducer, which is used to drive the fixture clamping assembly 740 on the side of the flip drive frame 721 to rotate around the drive shaft 741. Two parallel connecting columns 746 are provided. The two ends of the connecting columns 746 are respectively fixed to the cover plate 744 on the side of the flip drive frame 721 and the cover plate 744 on the side of the flip driven frame 722 by bolts, so that the two cover plates 744 are linked synchronously and maintain consistent gap during flipping to avoid fixture jamming.

[0046] During operation, the flipping motor 745 drives the transmission shaft 741 to rotate 180°, which drives the two sets of fixture clamping components 740 to flip synchronously, realizing the automatic flipping of the flat fixture in the clamping state without the need for manual disassembly of the fixture.

[0047] Specifically, refer to Figures 1-5 As shown, it also includes: The wiping assembly 900 is mounted on the base 100 and located on one side of the loading tray 200. The wiping assembly 900 is used to wipe the strain gauges and terminal pieces picked up by the dispensing and mounting mechanism 400. The first camera 910 is mounted on the base 100 and located on one side of the loading tray 200. The first camera 910 is used to photograph the position of the strain gauge and terminal piece after wiping.

[0048] In this embodiment, the wiping component 900 is fixed to the base 100 by a bracket and is located on the right side of the loading tray 200. It is a cleaning station before material picking and is used to wipe and clean the surface of the strain gauge and terminal piece that the dispensing and bonding mechanism 400 is about to pick up, so as to eliminate the influence of impurities on the bonding strength.

[0049] The first imaging camera 910 uses a high-definition industrial CCD camera, equipped with a ring light, and is fixed on the left side of the loading tray 200 of the base 100. The camera lens is vertically downward and aimed at the material picking area of ​​the loading tray 200. After the strain gauge and terminal piece are wiped and cleaned, the first imaging camera 910 collects the two-dimensional coordinate position of the material in real time and transmits the position data to the equipment control system, providing a visual reference for the subsequent mechanism to accurately pick up the material.

[0050] Specifically, refer to Figures 1-5 As shown, the wiping assembly 900 includes: Wiping plate 920 is mounted on base 100. A placement disc 921 is rotatably mounted on a wiping plate 920. The placement disc 921 is used to hold a roll of wiping paper. A winding disc 922 is rotatably mounted on the wiping plate 920 and is used to wind up the wiping paper roll. The winding motor 923 drives the winding disc 922 to rotate. Alcohol container 924 is mounted on the wiping plate 920 and is used to store alcohol. Several guide rollers 925 are rotatably mounted on the wiping plate 920, and each guide roller 925 is used to guide the wiping paper through the alcohol box 924.

[0051] In this embodiment, the wiping plate 920 is an L-shaped sheet metal bracket, which is bolted to the base 100; the placement disc 921 is rotatably mounted on the upper part of the wiping plate 920 via a damping shaft, and is used to roll up and place the original dust-free wiping paper roll, which can be passively rotated with the paper output; the winding disc 922 is rotatably mounted on the lower part of the wiping plate 920 via a bearing, and is used to wind up the used waste wiping paper.

[0052] The winding motor 923 is a speed-regulating DC motor, fixed on the back of the wiping plate 920. Its output shaft is connected to the center of the winding disc 922, continuously driving the winding disc 922 to rotate in a specific direction, thereby realizing automatic continuous feeding and taking back of the wiping paper.

[0053] An alcohol box 924 is embedded in the central cavity of the wiping plate 920. The box contains anhydrous ethanol, which is used to soak the wiping paper to improve the cleaning effect. The guide roller 925 is installed on the paper path channel of the wiping plate 920 and rotates evenly to guide and limit the travel path of the wiping paper, so that the wiping paper is forced to pass through the soaking area inside the alcohol box 924, ensuring that the wiping paper is fully soaked in the liquid before wiping the material.

[0054] Specifically, refer to Figures 1-5 As shown, the dispensing and bonding mechanism 400 includes: Mounting plate 410 is disposed at the drive end of the first three-axis drive module 300, which drives the mounting plate 410 to move along three axes. A second camera 420 is mounted on the mounting plate 410 and is used to capture images of the position of the flat fixture on the fixture flipping section 720. Two suction nozzles 430 are mounted on the mounting plate 410 and are used to pick up strain gauges and terminal pieces. A dispensing gun 440 is mounted on a mounting plate 410 and is used to dispense adhesive onto a piezoelectric stack on a flat mounting fixture. Several lifting cylinders 450 are mounted on the mounting plate 410. The drive end of each lifting cylinder 450 is connected to the nozzle 430 and the glue gun 440 respectively. The lifting cylinder 450 is used to drive the glue gun 440 and the nozzle 430 to move in the vertical direction.

[0055] In this embodiment, the mounting plate 410 is fixed to the drive end of the first three-axis drive module 300, and is driven by the first three-axis drive module 300 to achieve full-range three-axis movement; the lens of the second shooting camera 420 is vertically downward, used to capture the precise coordinate position of the flat fixture and piezoelectric stack on the fixture flipping section 720, so as to achieve visual alignment of the workpiece end.

[0056] The two sets of suction nozzles 430 are vacuum ceramic suction nozzles 430, which are respectively used to pick up strain gauges and terminal pieces. The material is picked up without damage through negative pressure adsorption. The glue gun 440 is a precision screw glue gun 440, which is used to quantitatively apply conductive glue or structural glue to the preset points of the piezoelectric stack.

[0057] All three sets of lifting cylinders 450 are vertically fixed to the mounting plate 410. The drive end of the lifting cylinder 450 is connected to two suction nozzles 430 and one glue gun 440 respectively, which can independently drive the corresponding parts to rise and fall in the vertical direction, realize independent control of picking, dispensing and avoidance actions, and avoid interference of parts movement.

[0058] Specifically, refer to Figures 1-5 As shown, the dispensing and bonding mechanism 400 also includes: Pressing block 460 is disposed on mounting plate 410 and is used to press the strain gauge and terminal piece on the piezoelectric stack.

[0059] In this embodiment, the pressing block 460 is made of anti-static silicone material and is fixed to the side of the mounting plate 410 by a small lifting cylinder 450, located in the working area of ​​the nozzle 430 and the glue gun 440. After the nozzle 430 attaches the strain gauge and terminal piece to the piezoelectric stack adhesive surface, the matching lifting cylinder 450 drives the pressing block 460 to move downward, applying constant pressure to the attached material for a preset time (more than 10 seconds) to expel air bubbles inside the glue, compact the bonding surface between the material and the piezoelectric stack, ensure the bonding firmness, and prevent delamination and edge lifting in the later stage.

[0060] In another embodiment of the invention, reference is made to... Figures 1-5 As shown, a method for using an automatic ceramic chip mounter includes: Step 1: Manually install the piezoelectric stack onto the flat mounting fixture, and then load it from the fixture's loading section 710. Step 2: Manually place the strain gauges and terminal pieces onto the loading tray 200. Step 3: The jig loading section 710 transports the flat jig to the jig turning section 720. Step 4: The first three-axis drive module 300 drives the dispensing and patching mechanism 400 to move onto the loading tray 200. The dispensing and patching mechanism 400 picks up the strain gauges and terminal pieces from the loading tray 200. Step 5: The first three-axis drive module 300 drives the dispensing and patching mechanism 400 to move to the fixture flipping section 720. The dispensing and patching mechanism 400 dispenses adhesive and installs strain gauges and terminal pieces on the flat fixture on the fixture flipping section 720. Step Six: After installation, the flat fixture on the fixture flipping section 720 is driven to the fixture unloading section 730. The second and third axis drive module 500 drives the tape application mechanism 600 to move above the flat fixture. The tape application mechanism 600 automatically applies tape and rolls and squeezes glue onto the piezoelectric stack on the strain gauge and terminal piece. Step 7: After applying adhesive tape to one side of the flat fixture, return the flat fixture to the fixture flipping section 720 for flipping. Then repeat steps 4 to 6 to apply adhesive and stickers to the other side of the flat fixture. Step 8: 730 blanking section for blanking flat fixture.

[0061] In this embodiment, step one, pre-installation and loading preparation: the piezoelectric stack is manually positioned and installed into the built-in slot of the flat fixture to complete the pre-installation of the workpiece; the flat fixture carrying the piezoelectric stack is placed at the starting position of the fixture loading section 710 of the transport guide rail 700 to start the equipment loading process.

[0062] Step 2, Material Placement: The operator neatly places the batch of strain gauges and terminal pieces in the loading tray 200 according to the direction of the positioning slot, thus completing the batch preparation of the surface mount materials.

[0063] Step 3, Fixture Conveying and Positioning: The synchronous belt of the fixture feeding section 710 drives the flat fixture with pre-installed piezoelectric stack to be conveyed along the guide rail and accurately enters the fixture flipping section 720; the adjustment motor 724 drives the bidirectional lead screw 723 to rotate, adjusts the distance between the flipping drive frame 721 and the flipping driven frame 722, so that the fixture clamping assembly 740 clamps the flat fixture and completes the initial positioning.

[0064] Step 4, Material Pickup and Cleaning Positioning: The first three-axis drive module 300 drives the dispensing and patching mechanism 400 to move above the loading tray 200, and the lifting cylinder 450 drives the suction nozzle 430 downward to pick up the strain gauge and terminal piece in the tray under negative pressure; the module drives the material through the wiping component 900, and the liquid-soaked wiping paper removes dust and oil from the surface of the material; after cleaning is completed, the first shooting camera 910 captures the position of the material and completes the coordinate correction.

[0065] Step 5, workpiece dispensing and patching: The first three-axis drive module 300, carrying the dispensing and patching mechanism 400, moves to the processing station of the fixture flipping section 720. The lifting mechanism 800's lifting drive component 810 pushes the lifting plate 820 upward, and the positioning column 830 locks the position of the flat fixture. After the second camera 420 identifies the piezoelectric stack position, the dispensing gun 440 descends to complete the quantitative dispensing. Subsequently, the nozzle 430 accurately attaches the calibrated strain gauge and terminal piece to the piezoelectric stack adhesive surface, and the pressing block 460 presses down to complete the initial compaction.

[0066] Step 6, Single-sided tape application: After the single-sided tape application process is completed, the fixture clamping assembly 740 is released, and the transport guide rail 700 transports the flat fixture to the fixture unloading section 730. The second and third axis drive module 500 drives the tape application mechanism 600 to move above the fixture, automatically extracts the tape, applies it to the upper surface of the piezoelectric stack, and squeezes out air bubbles inside the adhesive through the rolling structure, thus completing the single-sided tape application operation.

[0067] Step 7, workpiece flipping and double-sided processing: After single-sided processing is completed, the transport guide rail 700 drives the flat fixture back to the fixture flipping section 720; the fixture clamping assembly 740 re-clamps the fixture, and the flipping motor 745 drives the transmission shaft 741 to rotate 180°, causing the fixture to flip over as a whole; after flipping is completed, repeat steps 4 to 6 to perform the complete set of processes of material picking, dispensing, patching, and tape application on the other side of the piezoelectric stack.

[0068] Step 8, Finished Product Unloading: After all double-sided processing of the piezoelectric stack is completed, the fixture flipping section 720 releases the clamping structure, and the transport guide rail 700 drives the finished product flat fixture to the end of the fixture unloading section 730. The finished product is unloaded manually or by connecting to the production line, and the single processing flow is completed.

[0069] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An automatic ceramic chip mounter, characterized in that: include: The base (100) and the components disposed on the base (100): Loading tray (200); the loading tray (200) is used to place strain gauges and terminal pieces; First three-axis drive module (300); the drive end of the first three-axis drive linear module moves along the three axes; Dispensing and attaching mechanism (400); The dispensing and attaching mechanism (400) is located at the drive end of the first three-axis drive module (300). The dispensing and attaching mechanism (400) is used to dispense adhesive to the piezoelectric stack in the flat fixture and pick up the strain gauge and terminal piece on the loading tray (200) and transport them to the piezoelectric stack for bonding and installation. The second three-axis drive module (500) is disposed on one side of the first three-axis drive module (300), and the drive end of the second three-axis drive module (500) moves along the three axes. Tape application mechanism (600); The tape application mechanism (600) is disposed at the drive end of the second three-axis drive module (500), and the tape application mechanism (600) is used to apply tape to the upper surface of the piezoelectric stack; Transport guide rail (700); the transport guide rail (700) passes through the first three-axis drive module (300) and the second three-axis drive module (500), the transport guide rail (700) is used to transport flat fixtures to move along the transport guide rail (700), the transport guide rail (700) is provided with the following in a straight line: The jig loading section (710) is used for loading and transporting the flat jig with the piezoelectric stack installed. Fixture flipping section (720); the fixture flipping section (720) is used to flip the flat fixture; The fixture unloading section (730) is used to unload the flat fixture after the adhesive tape is applied.

2. The automatic ceramic chip mounter according to claim 1, characterized in that: Also includes: Lifting mechanism (800); The lifting mechanism (800) is disposed on the base (100) and located below the fixture flipping section (720). The lifting mechanism (800) is used to lift the flat fixture on the fixture flipping section (720) for the dispensing and gluing mechanism (400) to process.

3. The automatic ceramic chip mounter according to claim 2, characterized in that: The lifting mechanism (800) includes: Lifting drive (810); the lifting drive (810) is disposed on the base (100) and located below the fixture tilting section (720); Lifting plate (820); The lifting plate (820) is disposed at the driving end of the lifting drive member (810), the lifting drive member (810) is used to drive the lifting plate (820) to rise or fall, and the lifting plate (820) is used to lift the flat fixture on the fixture flipping section (720); Positioning post (830); The positioning post (830) is disposed on the upper surface of the lifting plate (820), and the positioning post (830) is used to position the flat fixture on the fixture flipping section (720).

4. The automatic ceramic chip mounter according to claim 3, characterized in that: The fixture flipping section (720) includes: A tilting drive frame (721); the tilting drive frame (721) is slidably mounted on the base (100); A flip driven frame (722) is slidably disposed on the base (100) and is disposed opposite to the flip drive frame (721). The flip drive frame (721) and the flip driven frame (722) cooperate to clamp the transport flat fixture. A bidirectional lead screw (723); the two ends of the bidirectional lead screw (723) are respectively screwed to the flipping drive frame (721) and the flipping driven frame (722), and the rotation of the bidirectional lead screw (723) is used to drive the flipping drive frame (721) and the flipping driven frame (722) to move closer to each other or further away from each other; Positioning motor (724); The positioning motor (724) is mounted on the base (100), and the driving end of the positioning motor (724) is connected to the bidirectional lead screw (723) for driving the bidirectional lead screw (723) to rotate.

5. The automatic ceramic chip mounter according to claim 4, characterized in that: The fixture flipping section (720) also includes: Two fixture clamping assemblies (740); the two fixture clamping assemblies (740) are respectively disposed opposite to the flip drive frame (721) and the flip driven frame (722), and are rotatably connected to the flip drive frame (721) and the flip driven frame (722) through a drive shaft (741); The fixture clamping assembly (740) includes: Connecting plate (742); the connecting plate (742) is connected to the drive shaft (741); Fixture drive conveyor belt (743); The fixture drive conveyor belt (743) is disposed on the connecting plate (742), and the fixture drive conveyor belt (743) is used to carry the flat fixture and drive the flat fixture to make linear motion; Cover plate (744); the cover plate (744) covers the connecting plate (742), and a gap is provided between the cover plate (744) and the fixture drive conveyor belt (743) for placing the flat fixture; A flip motor (745) is mounted on the flip drive frame (721) and connected to the transmission shaft (741) to drive the jig clamping assembly (740) on the flip drive frame (721) to rotate. Connecting column (746); the connecting column (746) is used to connect the cover plate (744) on the flip drive frame (721) and the cover plate (744) on the flip driven frame (722).

6. The automatic ceramic chip mounter according to claim 1, characterized in that: Also includes: Wiping assembly (900); The wiping assembly (900) is disposed on the base (100) and located on one side of the loading tray (200), and the wiping assembly (900) is used to wipe the strain gauges and terminal pieces picked up by the dispensing and patching mechanism (400); First camera (910); The first camera (910) is mounted on the base (100) and located on one side of the loading tray (200). The first camera (910) is used to photograph the position of the strain gauge and terminal piece after wiping.

7. The automatic ceramic chip mounter according to claim 6, characterized in that: The wiping assembly (900) includes: Wiping plate (920); the wiping plate (920) is disposed on the base (100); Placement disc (921); the placement disc (921) is rotatably disposed on the wiping plate (920), and the placement disc (921) is used to place the wiping paper roll; A winding disc (922); the winding disc (922) is rotatably disposed on the wiping plate (920), and the winding disc (922) is used to wind up the wiping paper roll; A winding motor (923); the winding motor (923) is used to drive the winding disc (922) to rotate; An alcohol container (924); the alcohol container (924) is disposed on the wiping plate (920), and the alcohol container (924) is used to store alcohol; A plurality of guide rollers (925); each of the guide rollers (925) is rotatably disposed on the wiping plate (920), and each of the guide rollers (925) is used to guide the wiping paper through the alcohol box (924).

8. The automatic ceramic chip mounter according to claim 1, characterized in that: The dispensing and patching mechanism (400) includes: Mounting plate (410); The mounting plate (410) is disposed at the driving end of the first three-axis drive module (300), and the first three-axis drive module (300) is used to drive the mounting plate (410) to move along the three axes; Second camera (420); The second camera (420) is mounted on the mounting plate (410) and is used to capture the position of the flat fixture on the fixture flipping section (720); Two suction nozzles (430); the suction nozzles (430) are disposed on the mounting plate (410), and the suction nozzles (430) are used to pick up strain gauges and terminal pieces; Dispensing gun (440); The dispensing gun (440) is disposed on the mounting plate (410), and the dispensing gun (440) is used to dispense piezoelectric stacks on a flat mounting fixture; A plurality of lifting cylinders (450); each of the lifting cylinders (450) is mounted on the mounting plate (410), and the driving end of each of the lifting cylinders (450) is connected to the nozzle (430) and the glue gun (440) respectively. The lifting cylinder (450) is used to drive the glue gun (440) and the nozzle (430) to move in the vertical direction.

9. The automatic ceramic chip mounter according to claim 8, characterized in that: The dispensing and patching mechanism (400) further includes: Pressing block (460); the pressing block (460) is disposed on the mounting plate (410) and is used to press the strain gauge and terminal piece on the piezoelectric stack.

10. A method of using an automatic ceramic chip mounter, for use with the automatic ceramic chip mounter as described in any one of claims 1 to 9, characterized in that: include: Step 1: Manually install the piezoelectric stack onto the flat fixture, and then feed it from the fixture loading section (710); Step 2: Manually place the strain gauges and terminal pieces onto the loading tray (200); Step 3: The jig loading section (710) transports the flat jig to the jig turning section (720); Step 4: The first three-axis drive module (300) drives the dispensing and patching mechanism (400) to move onto the loading tray (200), and the dispensing and patching mechanism (400) picks up the strain gauge and terminal piece on the loading tray (200); Step 5: The first three-axis drive module (300) drives the dispensing and patching mechanism (400) to move to the fixture flipping section (720). The dispensing and patching mechanism (400) dispenses glue and installs strain gauges and terminal pieces on the flat fixture on the fixture flipping section (720). Step 6: After installation, the flat fixture on the fixture flipping section (720) is driven to the fixture unloading section (730). The second three-axis drive module (500) drives the tape applicator (600) to move above the flat fixture. The tape applicator (600) automatically applies tape and rolls and squeezes glue onto the piezoelectric stack on the strain gauge and terminal piece after installation. Step 7: After applying adhesive tape to one side of the flat fixture, the flat fixture is returned to the fixture flipping section (720) for flipping. Then, steps 4 to 6 are repeated to apply adhesive and stickers to the other side of the flat fixture. Step 8, Fixture feeding section (730): Feed flat fixture.

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