Resin composition, adhesive member, and electronic device

Abstract

The present application relates to a resin composition, an adhesive member, and an electronic device. The resin composition can include a (meth)acrylate copolymer, a monofunctional (meth)acrylate monomer, a photoradical polymerization initiator, and a photocationic polymerization initiator. The (meth)acrylate copolymer included in the resin composition is a copolymer of a cationically reactive (meth)acrylate monomer containing an epoxy group or an oxetanyl group and a non-cationically reactive (meth)acrylate monomer, and can be polymerized by including the cationically reactive (meth)acrylate monomer containing an epoxy group or an oxetanyl group within a specific content (e.g., amount) range.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority and benefit to Japanese Patent Application No. 2025-074947, filed on April 28, 2025, with the Japan Patent Office, the entire contents of which are incorporated herein by reference. Technical Field

[0003] One or more embodiments of this disclosure relate to (i) resin compositions, (ii) adhesive members, and (iii) electronic devices. For example, one or more embodiments of this disclosure particularly relate to (i) resin compositions, (ii) adhesive members formed from resin compositions, and (iii) electronic devices including adhesive members. Background Technology

[0004] Various types of display devices have been developed for use in multimedia electronic devices such as televisions, mobile phones (or smartphones), tablets, computers, navigation systems, and / or game consoles. Recently, development has focused on display devices incorporating stepped sections due to the application of electronic modules with various functions and / or new designs integrated into printed layers. Additionally, display devices equipped with flexible display components that ensure folding, bending, and / or rolling are being developed to improve user convenience. Adhesive resins have been used to form adhesive layers (or adhesive components) applied to these display devices, and they are expected or required to provide strong and reliable adhesion to the various components / components included in the display device. Summary of the Invention

[0005] One or more aspects of embodiments of this disclosure relate to resin compositions that can exhibit excellent or suitable adhesive properties even during light curing in an air atmosphere.

[0006] One or more aspects of embodiments of this disclosure relate to electronic devices with improved reliability, which are implemented by bonding a substrate included in the electronic device with an adhesive member that exhibits excellent or suitable adhesion even at room temperature, high temperature, and high temperature and humidity environments.

[0007] Other aspects will be set forth in part in the description which follows and in part will be obvious from the description or may be learned by practice of the presented embodiments.

[0008] According to one or more embodiments of this disclosure, the resin composition comprises a (meth)acrylate copolymer as a first copolymer or a second copolymer, a monofunctional (meth)acrylate monomer, a photoradical polymerization initiator, and a photocatalytic polymerization initiator. The first copolymer is a copolymer of a first monomer and a third monomer (e.g., polymerized by including the first monomer and the third monomer), wherein the first monomer is a cationicly reactive (meth)acrylate monomer containing an epoxy group, and the third monomer is a non-cationicly reactive (meth)acrylate monomer. The second copolymer is a copolymer of a second monomer and a third monomer (e.g., polymerized by including the second monomer and the third monomer), wherein the second monomer is a cationicly reactive (meth)acrylate monomer containing an oxetyl group. The first copolymer is a copolymer of a first monomer in an amount of about 1 part by mass to about 30 parts by mass relative to the total amount of the first and third monomers (e.g., polymerized by including about 1 part by mass to about 30 parts by mass relative to the total amount of the first and third monomers), and the resin composition does not contain any other cationicly reactive compounds other than the first and second monomers included in the polymerization of the (meth)acrylate copolymer.

[0009] In one or more embodiments, the (meth)acrylate copolymer may have a weight-average molecular weight of about 3,000 to about 30,000.

[0010] In one or more embodiments, the first monomer may include at least one of glycidyl methacrylate, glycidyl acrylate, methyl (3,4-epoxycyclohexyl)acrylate and methyl (3,4-epoxycyclohexyl)methacrylate, and the second monomer may include at least one of methyl (3-ethyloxetane-3-yl)acrylate and methyl (3-ethyloxetane-3-yl)methacrylate.

[0011] In one or more embodiments, the third monomer may include at least one of methyl methacrylate and isoborneol methacrylate.

[0012] In one or more embodiments, the first copolymer may be a copolymer of a first monomer, methyl methacrylate, and isoborneol methacrylate (e.g., polymerized by comprising the first monomer, methyl methacrylate, and isoborneol methacrylate).

[0013] In one or more embodiments, the first monomer may be glycidyl methacrylate or (3,4-epoxycyclohexyl)methyl methacrylate.

[0014] In one or more embodiments, the second copolymer may be a copolymer of a second monomer, methyl methacrylate, and isoborneol methacrylate (e.g., polymerized by comprising a second monomer, methyl methacrylate, and isoborneol methacrylate).

[0015] In one or more embodiments, the second monomer may be (3-ethyloxetane-3-yl)methyl methacrylate.

[0016] In one or more embodiments, the monofunctional (meth)acrylate monomer may include at least one of 4-hydroxybutyl acrylate, 2-ethylhexyl acrylate, and tetrahydrofurfuryl acrylate.

[0017] In one or more embodiments, the photoinduced cationic polymerization initiator may include borate and / or sulfonate.

[0018] According to one or more embodiments of the present disclosure, an adhesive member derived from a resin composition cured by light exposure in an air atmosphere (e.g., formed from a resin composition cured by light exposure in an air atmosphere) is provided.

[0019] In one or more embodiments, at a temperature of about 25°C, the adhesive member may have a 180° peel strength of about 800 gf / 25 mm or greater for at least one of the glass substrate and the polymer substrate.

[0020] In one or more embodiments, at a temperature of about 60°C, the adhesive member may have a 180° peel strength of about 200 gf / 25 mm or greater for at least one of the glass substrate and the polymer substrate.

[0021] In one or more embodiments, at a temperature of about 85°C and a relative humidity of about 85%, the adhesive member may have a 180° peel strength of about 100 gf / 25 mm or greater for at least one of a glass substrate and a polymer substrate.

[0022] According to one or more embodiments of the present disclosure, an electronic device includes a display device comprising at least one adhesive member derived from a resin composition described herein (e.g., formed from a resin composition described herein).

[0023] In one or more embodiments, the display device may further include a display panel configured to display an image and a window on the display panel (e.g., arranged on the display panel), and an adhesive member may be (e.g., arranged between the display panel and the window).

[0024] In one or more embodiments, for example, the electronic device may be at least one of a television, desktop monitor, outdoor billboard, tablet PC, laptop computer, personal digital terminal, in-vehicle device, game console, smartphone, tablet computer, smartwatch, and camera.

[0025] In one or more embodiments, the resin composition comprises: (i) a copolymer of a first monomer and a third monomer or (ii) a copolymer of a second monomer and a third monomer, wherein the first monomer is a cationic reactive (meth)acrylate monomer containing an epoxy group, the third monomer is a non-cationic reactive (meth)acrylate monomer, and the second monomer is a cationic reactive (meth)acrylate monomer containing an oxetyl group; the (meth)acrylate copolymer may have a weight-average molecular weight of about 3,000 to about 30,000, and the content of the first monomer in the epoxy copolymer of the first monomer and the third monomer may be about 1 part by weight to about 30 parts by weight per 100 parts by weight of the total amount of the first monomer and the third monomer, and the resin composition further comprises a monofunctional (meth)acrylate monomer, a photopolymer, and a photopolymer. The resin composition comprises a basic polymerization initiator and a photo-induced cationic polymerization initiator (e.g., borates or sulfonates), excluding any other cationic reactive compounds other than the first and second monomers included in the polymerization of (meth)acrylate copolymers; when photocured in an air atmosphere, the resin composition produces an adhesive component derived therefrom, which exhibits a 180° peel strength of about 800 gf / 25 mm at about 25°C, a 180° peel strength of about 200 gf / 25 mm at about 60°C, and a 180° peel strength of about 100 gf / 25 mm at about 85°C and about 85% relative humidity, and at least one such adhesive component can be incorporated between the display panel and the window of the electronic device to provide improved reliability across room temperature, high temperature and high temperature and high humidity environments. Attached Figure Description

[0026] The accompanying drawings are included to provide a further understanding of this disclosure, and are incorporated in and constitute a part of this disclosure. The drawings illustrate embodiments of the disclosure and, together with the description, serve to explain the principles of the disclosure. The above and / or other aspects of this disclosure should become apparent and understandable from the following description of embodiments in conjunction with the accompanying drawings. In the drawings:

[0027] Figure 1 A block diagram of an electronic device according to one or more embodiments of the present disclosure;

[0028] Figure 2 A schematic diagram of an electronic device according to one or more embodiments of the present disclosure is shown;

[0029] Figure 3A A perspective view illustrating an electronic device according to one or more embodiments of the present disclosure;

[0030] Figure 3B A perspective view illustrating an electronic device according to one or more embodiments of the present disclosure;

[0031] Figure 4 An exploded perspective view of an electronic device according to one or more embodiments of the present disclosure;

[0032] Figure 5 A cross-sectional view showing a portion of a display device according to one or more embodiments of the present disclosure;

[0033] Figures 6A to 6C A view for describing the steps of forming an adhesive member included in an electronic device according to one or more embodiments of the present disclosure;

[0034] Figure 7 A cross-sectional view is shown for illustrating a display device according to one or more embodiments of the present disclosure; and

[0035] Figure 8 A cross-sectional view is shown for illustrating a display device according to one or more embodiments of the present disclosure. Detailed Implementation

[0036] The embodiments of this disclosure can be modified in many alternative forms, and therefore specific embodiments will be illustrated and described in more detail in the accompanying drawings. However, it should be understood that this disclosure is not intended to be limited to the specific forms disclosed, but rather to cover all modifications, equivalents, and alternatives that fall within the spirit and scope of this disclosure.

[0037] In this disclosure, it will be understood that if (for example, when) an element (or area, layer, and / or portion, etc.) is referred to as "on" another element, "connected to" or "attached to" another element (or area, layer, and / or portion, etc.), then it may be directly arranged on, directly connected to or directly attached to another element (or area, layer, and / or portion, etc.), or one or more other elements may be arranged therebetween. In contrast, "directly on" may mean that there is no additional intervening element or layer between the element or layer and another element or layer. Additionally, if (for example, when) a layer, film, area, and / or plate, etc., is referred to as "below" or "under" another portion, then it may be "directly" below the other portion, or one or more intervening layers may be present therebetween. Furthermore, if (for example, when) an element is referred to as being arranged "on" another element, then it may be arranged below the other element.

[0038] Throughout this disclosure, the same reference numerals or symbols refer to the same elements, and for the sake of brevity, their repeated descriptions are omitted. In the drawings, the scale and dimensions (e.g., thickness) of elements may be enlarged or reduced to effectively describe the technical content. As used herein, the terms "and / or," "or," or " / " include any and all combinations of one or more of the associated enumerated elements.

[0039] It will be understood that although the terms “first” and / or “second”, etc., may be used herein to describe one or more suitable elements, these elements are not limited by these terms. These terms are used only to distinguish one element from another. For example, without departing from the scope of this disclosure, a first element may be referred to as a second element. Similarly, a second element may be referred to as a first element. In this disclosure, unless the context clearly indicates otherwise, the singular expressions “a,” “an,” and “the” are intended to also include the plural forms. Furthermore, the use of “may” when describing embodiments of this disclosure refers to “one or more embodiments of this disclosure.”

[0040] Additionally, the terms "below," "under," "below," "above," "on top," and / or "above" are used to describe the relationships between the elements illustrated in the accompanying drawings. These terms are relative concepts and are described based on the directions indicated in the drawings.

[0041] It will be further understood that if (for example, when) the terms “comprise(s) / comprising,” “include(s) / including,” and / or “has(have) / having” are used in this disclosure, it indicates the presence of the described features, quantities, steps, operations, elements, components, or combinations thereof, but does not preclude the possibility of the presence or addition of one or more other features, quantities, steps, operations, elements, components, and / or combinations thereof. Additionally, the terms “comprise(s) / comprising,” “include(s) / including,” “has(have) / having,” or other similar terms include or support the terms “composed of” and “substantially composed of,” which indicate the presence of the described features, quantities, steps, operations, components, parts, or combinations thereof, and the absence or substantial absence of other features, quantities, steps, operations, components, parts, or combinations thereof.

[0042] As used herein, "directly disposed on" can indicate that there are no additional layers, films, zones, and / or plates between one component (such as a layer, membrane, zone, and / or plate) and another component (such as a layer, membrane, zone, and / or plate). For example, "directly disposed on" can indicate that there are no additional components (such as adhesive components) disposed between two layers or two components.

[0043] Unless otherwise specified, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will be further understood that terms, such as those defined in commonly used dictionaries, shall be interpreted as having a meaning consistent with their meaning in the context of the relevant field and shall not be interpreted in an ideal or overly formal sense unless expressly so defined herein.

[0044] Hereinafter, one or more embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0045] Figure 1 This is a block diagram of an electronic device EA according to one or more embodiments of the present disclosure. Reference Figure 1 An electronic device EA according to one or more embodiments may include a display module 11, a processor 12, a memory 13, and a power module 14.

[0046] The processor 12 may include at least one of a central processing unit (CPU), an application processor (AP), a graphics processing unit (GPU), a communication processor (CP), an image signal processor (ISP), and a controller.

[0047] The memory 13 may store data information expected or required for the operation of the processor 12 and / or the display module 11. When the processor 12 executes the application program stored in the memory 13, image data signals and / or input control signals are transmitted to the display module 11, and the display module 11 may process the received signals and output image information through the display screen. The display module 11 may include a display panel for displaying images.

[0048] The power module 14 may include a power supply module (such as a power adapter or battery device) and a power conversion module that converts the power supplied by the power supply module to generate the power desired or required for the operation of the electronic device EA.

[0049] At least one of the components of the aforementioned electronic device EA may be included in a display panel according to one or more embodiments, as described later, and in a display device according to one or more embodiments, including the display panel. In one or more embodiments, some of the individual modules that are functionally included in a single module may be included in the display device, and other modules may be provided separately from the display device. For example, the display device may include a display module 11, and the processor 12, memory 13, and power module 14 may be provided within the electronic device EA as other devices besides the display device.

[0050] Figure 2 A schematic diagram of an electronic device according to one or more embodiments of the present disclosure is shown.

[0051] refer to Figure 2 One or more suitable electronic devices, including display devices according to one or more embodiments, may include electronic devices for displaying images (such as smartphones EA_1a, tablet PCs EA_1b, laptops EA_1c, TVs EA_1d, and desktop monitors EA_1e), wearable electronic devices (such as smart glasses EA_2a, head-mounted displays EA_2b, and smartwatches EA_2c), and vehicle electronic devices EA_3 (such as a vehicle's instrument panel, center console, or central information display (CID) arranged on the instrument panel, and a vehicle's interior mirror display).

[0052] Figure 3A and Figure 3B Perspective views of electronic devices EA or EA-1 according to one or more embodiments of the present disclosure are shown respectively. Figure 3A A tablet terminal is shown as an example of an electronic device EA according to one or more embodiments. Figure 3B A smartphone is shown as an example of an electronic device EA-1 according to one or more embodiments.

[0053] refer to Figure 3A A tablet terminal can be formed by placing electronic modules, camera modules and / or power modules mounted on the motherboard together with the display device DD in a bracket / housing HAU.

[0054] exist Figure 3A In one or more embodiments, the electronic device EA including the display device DD can provide a flat display surface, but embodiments of the present invention are not limited thereto. Figure 3BAs shown, in one or more embodiments, the electronic device EA-1 may include a curved display surface or a three-dimensional display surface. For example, the three-dimensional display surface may include multiple display areas indicating different directions, and may also include a bent display surface. The electronic device EA-1 according to one or more embodiments may be a flexible electronic device. The flexible electronic device may be a foldable electronic device.

[0055] The display device DD may include a display surface EA-IS defined by a first directional axis DR1 and a second directional axis DR2 intersecting the first directional axis DR1. The display device DD may provide an image to a user through the display surface EA-IS. The display device DD may display an image on the display surface EA-IS, which is parallel to each of the first directional axis DR1 and the second directional axis DR2, and oriented towards a third directional axis DR3.

[0056] In this document, the first direction axis DR1 and the second direction axis DR2 may be perpendicular to each other, and the third direction axis DR3 may be the normal direction of the plane defined by the first direction axis DR1 and the second direction axis DR2. The thickness direction of the display device DD may be parallel to the third direction axis DR3. The front surface (or upper surface) and the rear surface (or lower surface) may be opposite each other, and the normal direction of each of the front surface (or upper surface) and the rear surface (or lower surface) may be parallel to the third direction axis DR3. The term "section" refers to a surface parallel to the third direction axis DR3, and the term "plane" refers to a surface perpendicular to the third direction axis DR3. A plane indicates the plane defined by the first direction axis DR1 and the second direction axis DR2. The directions indicated by the first to third direction axes DR1, DR2, and DR3 as described herein are relative concepts and may therefore be changed to other directions. In addition, the directions indicated by the first to third direction axes DR1, DR2, and DR3 may be described as first to third directions and may use the same reference numerals. The terms "in a plane" or "in a planar view" as used herein may be defined as a state if (e.g., when) viewed from a third directional axis DR3. For example, the term "in a plane" may be described based on a plane defined together by a first directional axis DR1 and a second directional axis DR2. The terms "in a section" or "in a section view" as used herein may be defined as a state if (e.g., when) viewed from a direction perpendicular to the third directional axis DR3 (e.g., from the first directional axis DR1 or the second directional axis DR2).

[0057] like Figure 3A As shown, the display surface EA-IS may include a display area AA in which an image is displayed and a non-display area NAA adjacent to the display area AA. The non-display area NAA is the area in which no image is displayed. Figure 3A In the image, the icon is shown as an example.

[0058] refer to Figure 3B The electronic device EA-1 according to one or more embodiments may include a plurality of display surfaces. The electronic device EA-1 according to one or more embodiments may include display surfaces IS-M, IS-S1, IS-S2, IS-S3 and IS-S4 with different main display orientations.

[0059] In one or more embodiments, the electronic device EA-1 may be a three-dimensional electronic device including an upper display surface IS-M and a plurality of side display surfaces IS-S1, IS-S2, IS-S3, and IS-S4. Each of the plurality of side display surfaces IS-S1, IS-S2, IS-S3, and IS-S4 may be a display surface extending from one side of the upper display surface IS-M. In one or more embodiments, the electronic device EA-1 may include a main display surface that displays images primarily in one direction and a plurality of sub-display surfaces that display images in directions different from the direction in which the main display surface displays images. Figure 3B In one or more embodiments of the electronic device EA-1 shown, the main display surface may be the upper display surface IS-M, and the sub-display surfaces may be a plurality of side display surfaces IS-S1, IS-S2, IS-S3 and IS-S4.

[0060] Multiple side display surfaces IS-S1, IS-S2, IS-S3, and IS-S4 may each have a display surface that is not parallel to the upper display surface IS-M. In one or more embodiments, the multiple side display surfaces IS-S1, IS-S2, IS-S3, and IS-S4 may be display areas that are each bent and extended from one side of the upper display surface IS-M. For example, the multiple side display surfaces IS-S1, IS-S2, IS-S3, and IS-S4 may be bent display areas. Figure 3B In this embodiment, the first to fourth display surfaces IS-S1, IS-S2, IS-S3 and IS-S4 are each bent from one of the four sides of the upper display surface IS-M. However, unlike the illustration, in one or more embodiments, some of the first to fourth display surfaces IS-S1, IS-S2, IS-S3 and IS-S4 may not be provided.

[0061] Figure 4 An exploded perspective view of an electronic device EA according to one or more embodiments of the present disclosure. Figure 4 Can be Figure 3A An exploded perspective view of the electronic device EA shown in the figure.

[0062] refer to Figure 3A and Figure 4The electronic device EA may include a display device DD and a housing HAU. According to one or more embodiments, the display device DD may include a display module DM, a window WP, and an adhesive member AP. The display device DD may be the portion of the electronic device EA that provides an image. Figure 4 The display device DD shown can be applied to Figure 3B The electronic device EA-1. The housing HAU can accommodate the display module DM.

[0063] exist Figure 4 In the electronic device EA shown, the window WP and the housing HAU can be combined to form the external portion of the electronic device EA. The housing HAU can be arranged below the display module DM. In one or more embodiments, the housing HAU may comprise a material with high rigidity. For example, the housing HAU may comprise multiple frames and / or plates formed of glass, plastic, or metal. The housing HAU provides a predetermined receiving space. The display module DM can be housed within the receiving space of the housing HAU and is therefore protected from external impacts.

[0064] The display module DM can be activated by an electrical signal. The display module DM can be the portion that substantially provides an image. The active area AA-DM can be the area activated by an electrical signal. The active area AA-DM can be the area corresponding to the display area AA of the electronic device EA, and can overlap with the display area AA when viewed in a plane (e.g., in a plan view). The peripheral area NAA-DM can be the area adjacent to at least one side of the active area AA-DM. Circuitry or wiring for driving the display module DM can be arranged in the peripheral area NAA-DM. The peripheral area NAA-DM can be the area corresponding to the non-display area NAA of the electronic device EA, and can not overlap with the display area AA when viewed in a plane.

[0065] The adhesive member AP may be formed from a resin composition according to one or more embodiments of the present disclosure. The adhesive member AP may be a cured product of a resin composition that is cured by light exposure. The adhesive member AP may include a polymer derived from the resin composition. Resin compositions according to one or more embodiments will be described later.

[0066] An adhesive member AP can be provided between adjacent components arranged in the display device DD to bond adjacent components to each other. For example, in one or more embodiments, the display module DM and the window WP can be bonded by the adhesive member AP. The adhesive member AP can contact the lower surface of the window WP and the upper surface of the display module DM. At least one adhesive member AP can be provided within the display device DD.

[0067] The adhesive component AP exhibits excellent or adequate adhesive properties at room temperature without deteriorating adhesion to adjacent components, and this is also true in high temperature and high humidity environments. For example, even at a room temperature of about 25°C, at a high temperature of about 60°C, and / or at a high temperature of about 85°C and a relative humidity (RH) of about 85%, the adhesive component AP exhibits excellent or adequate adhesive properties without deteriorating adhesion to the window WP and the display module DM.

[0068] The window WP may include a transmissive area TA and a border area BZA. The transmissive area TA may overlap with at least a portion of the effective area AA-DM of the display module DM. The transmissive area TA may be an optically transparent area. The transmissive area TA may be an area corresponding to the effective area AA-DM. The image generated from the display module DM can be provided to the user through the transmissive area TA.

[0069] The border region BZA may be a region with relatively lower light transmittance than the transmission region TA. The border region BZA may define the shape of the transmission region TA. In one or more embodiments, the border region BZA may be adjacent to the transmission region TA and may surround the transmission region TA.

[0070] The bezel area BZA may have a predetermined or set color. The bezel area BZA covers the peripheral area NAA-DM of the display module DM, and thus prevents or reduces the visibility of the peripheral area NAA-DM from the outside. However, embodiments of this disclosure are not limited thereto. For example, in one or more embodiments, the bezel area BZA may be arranged adjacent only to one side of the transmissive area TA, and at least a portion of the bezel area BZA may not be provided.

[0071] Figure 5 This is a cross-sectional view showing a portion of a display device DD according to one or more embodiments of the present disclosure. Figure 5 To illustrate the relationship according to one or more embodiments Figure 3A A cross-sectional view of the portion corresponding to line I-I'. A display device DD according to one or more embodiments may be included in the aforementioned electronic device EA. The display device DD may be the portion of the electronic device EA that provides an image. Figure 5 The display device DD shown can be applied to Figure 3B The electronic device EA-1.

[0072] refer to Figure 5 The display module DM may include a display panel DP and an input sensing portion TP disposed on the display panel DP. The display panel DP may include a substrate BS, a circuit layer DP-CL disposed on the substrate BS, a display element layer DP-EL disposed on the circuit layer DP-CL, and an encapsulation layer TFE covering the display element layer DP-EL. An adhesive member AP may be disposed between the display module DM and the window WP.

[0073] Figure 5 The components of the display panel DP shown are examples, and the components of the display panel DP are not limited thereto. For example, in one or more embodiments, the display panel DP may include liquid crystal display elements, and in these embodiments, the encapsulation layer TFE may not be provided.

[0074] The substrate BS provides a substrate surface on which the circuit layer DP-CL is disposed. In one or more embodiments, the substrate BS may be a flexible substrate that is bendable, foldable, and / or rollable. The substrate BS may be a glass substrate, a metal substrate, or a polymer substrate. However, embodiments of this disclosure are not limited thereto, and the substrate BS may be an inorganic layer, an organic layer, or a composite material layer.

[0075] The circuit layer DP-CL may include insulating layers, semiconductor patterns, conductive patterns, and / or signal lines. For example, the circuit layer DP-CL may include switching transistors and driving transistors for driving the light-emitting elements of the display element layer DP-EL.

[0076] The display element layer DP-EL may include light-emitting elements configured to emit light. For example, the light-emitting elements may include organic light-emitting materials, inorganic light-emitting materials, organic-inorganic light-emitting materials, quantum dots, quantum rods, micron LEDs, or nano LEDs.

[0077] The encapsulation layer TFE may be disposed on (e.g., on top of) the display element layer DP-EL. The encapsulation layer TFE serves to protect the display element layer DP-EL from moisture, oxygen, and / or foreign matter (such as dust particles). In one or more embodiments, the encapsulation layer TFE may include at least one inorganic layer. In one or more embodiments, the encapsulation layer TFE may include at least one organic layer and at least one inorganic layer. For example, in one or more embodiments, the encapsulation layer TFE may include an inorganic layer, an organic layer, and an inorganic layer stacked sequentially.

[0078] An input sensing portion TP may be disposed on a display panel DP. For example, in one or more embodiments, the input sensing portion TP may be disposed directly on the encapsulation layer TFE of the display panel DP. The input sensing portion TP can sense external input to convert the external input into a predetermined input signal and provide the input signal to the display panel DP. For example, in a display device DD according to one or more embodiments, the input sensing portion TP may be a touch sensing portion for sensing touch. The input sensing portion TP can recognize direct touch by a user, indirect touch by a user, direct touch by an object, or indirect touch by an object.

[0079] The input sensing portion TP can sense at least one of the location and intensity (pressure) of a touch applied from the outside. In one or more embodiments, the input sensing portion TP may have one or more suitable structures or be formed of one or more suitable materials, and the embodiments disclosed herein are not limited thereto. The input sensing portion TP may include a plurality of sensing electrodes for sensing external input. In one or more embodiments, the sensing electrodes may sense the external input capacitively. The display panel DP can receive the input signal from the input sensing portion TP and generate an image corresponding to the input signal.

[0080] The window WP may include a base layer BL and a printed layer BM. In one or more embodiments, the window WP may further include at least one functional layer provided on the base layer BL. For example, the functional layer may be a hard coating and / or an anti-fingerprint coating, etc., but embodiments of this disclosure are not limited thereto.

[0081] In one or more embodiments, the substrate BL may be a glass substrate or a polymer substrate. In one or more embodiments, the substrate BL may be a plastic substrate. For example, the substrate BL may be formed of polyimide, polyacrylate, polymethyl methacrylate, polycarbonate, polyethylene naphthalate, polyvinylidene chloride, polyvinylidene fluoride, polystyrene, ethylene vinyl alcohol copolymer, or combinations thereof.

[0082] A printed layer BM may be disposed on (e.g., one) surface of a substrate layer BL. The printed layer BM may be provided on the lower surface of the substrate layer BL adjacent to the display module DM. The printed layer BM may be disposed on an edge region of the substrate layer BL. In one or more embodiments, the printed layer BM may be an ink-printed layer. In one or more embodiments, the printed layer BM may be a layer formed by including pigments and / or dyes. In the window WP, the border area BZA ( Figure 4 It can provide a portion of which has a printed layer BM.

[0083] The adhesive component AP can be arranged below the window WP. Within the window WP, a stepped portion SP-a may exist between the base layer BL (on which no printed layer BM is provided) and the printed layer BM. The adhesive component AP has excellent or adequate adhesive strength (and peel adhesion), and therefore allows the display module DM and the window WP to be joined without lifting the stepped portion SP-a.

[0084] The adhesive component AP may have a thickness T0 of about 10 micrometers (μm) to about 500 μm, about 10 μm to about 300 μm, or about 10 μm to about 100 μm. However, this is only an example, and the thickness T0 of the adhesive component AP is not limited thereto.

[0085] At approximately 25°C, the adhesive member AP can exhibit a 180° peel strength of approximately 800 gf / 25 mm or greater for at least one of a glass substrate and a polymer substrate. The polymer substrate can be formed of polyethylene terephthalate (PET), but embodiments of this disclosure are not limited thereto. Additionally, at approximately 60°C, the adhesive member AP can exhibit a 180° peel strength of approximately 200 gf / 25 mm or greater for at least one of a glass substrate and a polymer substrate. At approximately 85°C and approximately 85% relative humidity, the adhesive member AP can exhibit a 180° peel strength of approximately 100 gf / 25 mm or greater for at least one of a glass substrate and a polymer substrate. Therefore, the adhesive member AP according to one or more embodiments can exhibit excellent or suitable adhesion at room temperature, and also in high temperature and high humidity environments.

[0086] The adhesive component AP may be formed from a resin composition according to one or more embodiments. The resin composition according to one or more embodiments may include (meth)acrylate copolymers, monofunctional (meth)acrylate monomers, photoradical polymerization initiators, and photocationic polymerization initiators. Herein, (meth)acrylate refers to both acrylates and methacrylates. For example, (meth)acrylate may include acrylates and / or methacrylates.

[0087] The resin composition according to one or more embodiments comprises a (meth)acrylate copolymer and thus prevents or reduces inhibition of surface curing of the resin composition exposed to air, thereby exhibiting excellent or adequate adhesion (and tack), unlike typical resin compositions that fail to cure due to oxygen during light curing in an air atmosphere.

[0088] The (meth)acrylate copolymers according to one or more embodiments may be copolymers of cationic reactive (meth)acrylate monomers and non-cationic reactive (meth)acrylate monomers (e.g., polymerized by comprising cationic reactive (meth)acrylate monomers and non-cationic reactive (meth)acrylate monomers). In other words, the (meth)acrylate copolymers according to one or more embodiments may be products of copolymerizing cationic reactive (meth)acrylate monomers and non-cationic reactive (meth)acrylate monomers. The cationic reactive (meth)acrylate monomers may include cationic polymerizable functional groups. For example, the cationic reactive (meth)acrylate monomers may include epoxy or oxetane groups, both of which exhibit excellent or suitable cationic polymerizability. (Meth)acrylate copolymers can be copolymers of cationic (meth)acrylate monomers containing epoxy groups and non-cationic (meth)acrylate monomers (e.g., polymerized by including both cationic (meth)acrylate monomers containing epoxy groups and non-cationic (meth)acrylate monomers), or copolymers of cationic (meth)acrylate monomers containing oxetyl groups and non-cationic (meth)acrylate monomers (e.g., polymerized by including both cationic (meth)acrylate monomers containing oxetyl groups and non-cationic (meth)acrylate monomers). In this document, the cationic (meth)acrylate monomer containing epoxy groups may be referred to as the "first monomer," and the cationic (meth)acrylate monomer containing oxetyl groups may be referred to as the "second monomer." Additionally, in this document, the non-cationic (meth)acrylate monomer may be referred to as the "third monomer."

[0089] In one or more embodiments, the (meth)acrylate copolymer may be a copolymer of a first monomer and a third monomer (e.g., polymerized by including the first monomer and the third monomer). In one or more embodiments, the (meth)acrylate copolymer may be a copolymer of a second monomer and a third monomer (e.g., polymerized by including the second monomer and the third monomer). Hereinafter, the (meth)acrylate copolymer obtained by copolymerizing the first monomer and the third monomer may be referred to as the "first copolymer". The (meth)acrylate copolymer obtained by copolymerizing the second monomer and the third monomer may be referred to as the "second copolymer". The (meth)acrylate copolymer may be either the first copolymer or the second copolymer.

[0090] In one or more embodiments, the resin composition includes a first copolymer or a second copolymer, and thus prevents or reduces inhibition of surface curing during photocuring in the presence of oxygen. For example, a resin composition including a first copolymer or a second copolymer can improve the cohesiveness at the interface between the (meth)acrylate copolymer (i.e., the first copolymer and / or the second copolymer) and the atmosphere by segregating at the outermost surface during photocuring. Additionally, the resin composition including a first copolymer or a second copolymer can therefore maintain excellent or adequate adhesion (and tack) at room temperature and in high-temperature and high-humidity environments by interacting with the resin matrix through photoionic reactions with respect to epoxy groups or oxetanediol groups.

[0091] The first copolymer may be a copolymer of a first monomer in an amount less than that of the third monomer (e.g., polymerized by including a first monomer in an amount less than that of the third monomer). In one or more embodiments, the first copolymer may be a copolymer of a first monomer in an amount of about 1 part by mass to about 30 parts by mass relative to the total amount of 100 parts by mass of the first monomer and the third monomer (e.g., polymerized by including a first monomer in an amount of about 1 part by mass to about 30 parts by mass relative to the total amount of 100 parts by mass of the first monomer and the third monomer). When the resin composition includes a first copolymer polymerized by including a first monomer in the above-mentioned content (e.g., amount) range, the adhesive member AP formed from such a resin composition may exhibit excellent or suitable adhesion at room temperature, high temperature, and high temperature and high humidity environments.

[0092] If, for example, the resin composition includes a first copolymer polymerized by including a first monomer in an amount of less than about 1 part by mass, the resin composition may have reduced internal cohesive strength, and therefore the adhesive member formed from the resin composition may have deteriorated adhesion in high temperature and high humidity environments. If, for example, the resin composition includes a first copolymer polymerized by including a first monomer in an amount of more than about 30 parts by mass, the resin composition may have increased internal cohesive strength, but the adhesion to the substrate (such as a glass substrate) may be reduced.

[0093] The content (e.g., amount) of the second and third monomers used in the polymerization of the second copolymer is not particularly limited. However, in one or more embodiments, the second copolymer may be polymerized by including the second monomer in an amount less than that of the third monomer. In one or more embodiments, the second copolymer may be polymerized by including a second monomer in an amount of about 1 to about 30 parts by mass relative to the total amount of the second and third monomers (100 parts by mass).

[0094] The first copolymer and the second copolymer may each have a weight-average molecular weight (Mw) of about 3,000 to about 30,000. Weight-average molecular weight may not be expressed in units, but may be expressed in g / mol based on molar mass. Resin compositions according to one or more embodiments include a first copolymer or a second copolymer each having a weight-average molecular weight of about 3,000 to about 30,000, and thus prevent or reduce inhibition of surface curing during photocuring, and exhibit excellent or suitable adhesive / tack properties at room temperature, and also in high temperature and high humidity environments. In this disclosure, unless otherwise stated, the weight-average molecular weight of the polymer (e.g., (meth)acrylate copolymer) is measured and characterized by gel permeation chromatography (GPC) of polystyrene standards.

[0095] Relative to 100 parts by weight of the monofunctional (meth)acrylate monomer in the resin composition, the first copolymer or the second copolymer may be included in an amount from about 5 parts by weight to about 50 parts by weight. If the first copolymer or the second copolymer is included in an amount less than about 5 parts by weight, the amount of copolymer segregating onto the surface of the resin composition after curing is small, resulting in insufficient adhesive / adhesive properties based on cohesive strength. If the amount of the first copolymer or the second copolymer exceeds about 50 parts by weight, the amount of copolymer segregating onto the surface of the resin composition after curing is large, resulting in insufficient adhesive / adhesive properties due to excessive cohesive strength. If the first copolymer or the second copolymer is included within the above content (e.g., amount) range, the resin composition according to one or more embodiments may exhibit excellent or suitable adhesion and tack during photocuring.

[0096] The cationic reactive (meth)acrylate monomer may include at least one of glycidyl acrylate, glycidyl methacrylate, methyl (3,4-epoxycyclohexyl)acrylate, methyl (3,4-epoxycyclohexyl)methacrylate, methyl (3-ethyloxetane-3-yl)acrylate, and methyl (3-ethyloxetane-3-yl)methacrylate. For example, in one or more embodiments, the first monomer may include at least one of glycidyl acrylate, glycidyl methacrylate, methyl (3,4-epoxycyclohexyl)acrylate, and methyl (3,4-epoxycyclohexyl)methacrylate. In one or more embodiments, the first monomer may be glycidyl methacrylate or methyl (3,4-epoxycyclohexyl)methacrylate. In one or more embodiments, the second monomer may include at least one of methyl (3-ethyloxetane-3-yl)acrylate and methyl (3-ethyloxetane-3-yl)methacrylate. However, embodiments of this disclosure are not limited thereto.

[0097] The third monomer may include at least one of methyl methacrylate and isoborneol methacrylate. In one or more embodiments, the third monomer may (e.g., simultaneously) include both methyl methacrylate and isoborneol methacrylate. However, embodiments of this disclosure are not limited thereto, and the third monomer may include methyl methacrylate and / or isoborneol methacrylate, or may include other non-cationically reactive (meth)acrylate monomers.

[0098] Monofunctional (meth)acrylate monomers may include at least one of hydroxyl-containing monofunctional (meth)acrylate monomers, alicyclic monofunctional (meth)acrylate monomers, and alkyl monofunctional (meth)acrylate monomers. In one or more embodiments, the monofunctional (meth)acrylate monomer may include at least one of 4-hydroxybutyl acrylate, 2-ethylhexyl acrylate, and tetrahydrofurfuryl acrylate. For example, in one or more embodiments, the monofunctional (meth)acrylate monomer may include 4-hydroxybutyl acrylate, 2-ethylhexyl acrylate, and tetrahydrofurfuryl acrylate, but the embodiments of this disclosure are not limited thereto.

[0099] The monofunctional (meth)acrylate monomer may have a weight-average molecular weight of about 500 or less, or a molecular weight of about 500 g / mol or less. For example, in one or more embodiments, the monofunctional (meth)acrylate monomer may have a weight-average molecular weight of about 100 to about 500, or a molecular weight of about 100 g / mol to about 500 g / mol. The weight-average molecular weight or molecular weight of the monofunctional (meth)acrylate monomer may not be limited to the above ranges.

[0100] The resin composition according to one or more embodiments may include a photopolymerization initiator. The resin composition may include two or more different types (categories) of photopolymerization initiators. For example, in one or more embodiments, the resin composition may include a photoradical polymerization initiator and a photocationic polymerization initiator. The amount of photopolymerization initiator may be from about 0.01% by mass to about 5% by mass relative to the total mass of the resin composition, but the content (e.g., amount) of photopolymerization initiator included in the resin composition is not limited thereto.

[0101] Photoradical polymerization initiators can be activated by ultraviolet light. For example, in one or more embodiments, the resin composition may include phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide as a photoradical polymerization initiator, but embodiments of this disclosure are not limited thereto.

[0102] Photo-cationic polymerization initiators can generate cationic or Lewis acids by ultraviolet light and initiate the polymerization of cationic curable components (such as cationic reactive (meth)acrylate monomers containing epoxy or oxetyl groups). In one or more embodiments, the photo-cationic polymerization initiator may include borates and / or sulfonates. For example, in one or more embodiments, the resin composition may include CPI-310B (manufactured by SAN-APRO) of [1,1'-biphenyl]-4-yl-[4-[[1,1'-biphenyl]-4-ylthio]phenyl](phenyl)sulfonium tetra(perfluorophenyl)borate (including mixtures of isomers) as a photo-cationic polymerization initiator, but embodiments of this disclosure are not limited thereto.

[0103] For example, in one or more embodiments, the photopolymerization initiator may be at least one of 2,2-dimethoxy-1,2-diphenylethyl-1-one, 1-hydroxycyclohexyl-phenyl one, 2-hydroxy-2-methyl-1-phenyl-1-propanone, 2-hydroxy-1-[4-(2-hydroxyethoxy)phenyl]-2-methyl-1-propanone, and 2-hydroxy-1-{4-[4-(2-hydroxy-2-methyl-propanoyl)-benzyl]-phenyl}-2-methylprop-1-one.

[0104] In one or more embodiments, the photopolymerization initiator may be at least one of 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinoprop-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-1-butanone, 2-dimethylamino-2-(4-methyl-benzyl)-1-(4-morphone-4-yl-phenyl)-but-1-one, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, [1-(4-phenylsulfonylbenzoyl)heptadeneamino]benzoate, [1-[9-ethyl-6-(2-methylbenzoyl)carbazole-3-yl]ethyleneamino]acetate, and bis(2,4-cyclopentadienyl)bis[2,6-difluoro-3-(1-pyrrole)phenyl]titanium (IV).

[0105] The resin composition according to one or more embodiments may not include (e.g., may exclude) any other cationic reactive compounds as its components. For example, the resin composition may not include (e.g., may exclude) any other cationic reactive compounds other than the cationic reactive (meth)acrylates of the first monomer included in the polymerization of the first copolymer and the second monomer included in the polymerization of the second copolymer.

[0106] Additionally, the resin composition according to one or more embodiments may not include (e.g., may exclude) solvents. The resin composition may not include (e.g., may exclude) volatile organic solvents. The resin composition according to one or more embodiments may be provided as a solvent-free resin composition. When provided via inkjet printing or dispensing, the solvent-free resin composition improves discharge facilitation. Furthermore, when a solvent-free resin composition is used in the process of preparing the adhesive component AP, unlike resin compositions containing volatile organic solvents, processes for drying volatile organic solvents (e.g., heating processes) can be omitted, thereby improving process efficiency.

[0107] In one or more embodiments, the resin composition may comprise only (e.g., of the following composition or substantially of the following composition) a (meth)acrylate copolymer as a first copolymer or a second copolymer, a monofunctional (meth)acrylate monomer, a photoradical polymerization initiator, and a photocationic polymerization initiator as components of the resin composition. For example, in one or more embodiments, the resin composition may be formed from a (meth)acrylate copolymer as a first copolymer or a second copolymer, a monofunctional (meth)acrylate monomer, a photoradical polymerization initiator, and a photocationic polymerization initiator.

[0108] Figures 6A to 6C The views illustrate, for illustrative purposes, some steps of a method for manufacturing an electronic device according to one or more embodiments of the present disclosure. Figures 6A to 6C This may be a view used to describe the steps of forming an adhesive member AP included in an electronic device according to one or more embodiments of the present disclosure. For reference Figures 6A to 6C A description will be provided, but references will no longer be provided. Figures 1 to 5 The provided descriptions are repetitive, and the main focus will be on the differences.

[0109] refer to Figures 6A to 6C A method of manufacturing an electronic device according to one or more embodiments may include providing a resin composition RC, forming an adhesive member AP, and bonding adjacent substrates BP1 and BP2 via the adhesive member AP. The adhesive member AP may be formed from the resin composition RC according to one or more embodiments of the present disclosure. The formation of the adhesive member AP may include a curing step of curing the resin composition RC.

[0110] refer to Figure 6A A resin composition RC according to one or more embodiments may be provided on a first substrate BP1. The first substrate BP1 may provide a reference surface thereon on which the resin composition RC is provided. For example, the first substrate BP1 may be... Figure 5 The display module DM or window WP described herein. The resin composition RC can be directly applied to one surface of the first substrate BP1.

[0111] In one or more embodiments, the first substrate BP1 may also be a temporary substrate for forming the adhesive member AP from the resin composition RC. If (for example, when) the first substrate BP1 is provided as a temporary substrate, any substrate that allows the resin composition RC provided on the first substrate BP1 to cure easily can be used without limitation.

[0112] The resin composition RC according to one or more embodiments may be provided on the first substrate BP1 by inkjet printing, dispensing, or bar coating. For example, in one or more embodiments, the resin composition RC may be provided on the first substrate BP1 by inkjet printing. The resin composition RC may be discharged from an inkjet head IHD and provided on the first substrate BP1. The inkjet head IHD may include a plurality of nozzles NZ that may be spaced apart and / or separated (e.g., spaced apart or separated) along a direction at a specified or set interval.

[0113] Each of the nozzles NZ can respectively discharge the resin composition RC toward the first substrate BP1. For example, the discharge direction of each of the nozzles NZ can be perpendicular to the first substrate BP1. In one or more embodiments, each of the nozzles NZ may include an outlet having a circular orifice shape. However, embodiments of the present disclosure are not limited thereto, and the shape of the outlet of each of the nozzles NZ may be varied or suitably modified. In addition, the number and size of the nozzles NZ included in the inkjet head IHD may be varied or suitably modified. Although Figure 6A The image shows a method of providing the resin composition RC by inkjet printing, but the method of providing the resin composition RC is not limited to this.

[0114] In one or more embodiments, the resin composition RC can be applied to a surface of a substrate in a flowable liquid state. For example, the resin composition RC is provided on a surface of a first substrate BP1, and the resin composition RC in a flowable liquid state can be provided up to the outer edge portion of the first substrate BP1. For example, the edges of the applied resin composition RC and the edges of the first substrate BP1 may be substantially aligned in cross-section. In this document, the term "substantially" includes embodiments in which the physical values / properties are the same and embodiments in which differences exist within the range of process tolerances.

[0115] refer to Figure 6B A resin composition RC can be applied to a first substrate BP1 at a constant thickness using UV light irradiation. The resin composition RC can be photocured. The UV light applied to the resin composition RC can be ultraviolet light. Adhesive component AP ( Figure 6C It can be formed from a cured resin composition RC.

[0116] The curing of the resin composition RC can be carried out in an air atmosphere. The resin composition RC according to one or more embodiments does not require additional equipment and / or additional processes to block oxygen during UV light irradiation, and exhibits excellent or adequate adhesion without deterioration of surface curing even when irradiated with UV light in an air atmosphere (e.g., when) in an air atmosphere.

[0117] In one or more embodiments, the resin composition RC can be cured by a single-step light curing process. For example, the adhesive member AP according to one or more embodiments can be formed by providing UV light to the resin composition RC in a single step. The resin composition RC according to one or more embodiments reduces the increase in the number of processes that require multiple UV light curing steps, thereby achieving the effect of shortening the process (e.g., cost reduction).

[0118] Although Figure 6B The illustration shows the direct irradiation of the resin composition RC with UV light, but embodiments of the present disclosure are not limited thereto. In one or more embodiments, a carrier film may be disposed on the applied resin composition RC with a substantially uniform thickness, and the carrier film may transmit ultraviolet light.

[0119] refer to Figure 6C The second substrate BP2 can be bonded to the first substrate BP1 via an adhesive member AP. For example, by using RC (as a resin composition) Figure 6B A second substrate BP2 is provided on the adhesive member AP of the cured product, and a specified or set pressure is applied, allowing the second substrate BP2 to be attached to the first substrate BP1 via the adhesive member AP. For example, the adhesive member AP can laminate the first substrate BP1 and the second substrate BP2. In this disclosure, the "cured" resin composition RC may be in a partially cured (pre-cured) state, wherein the adhesive member AP retains residual tack or can be further cured under heat and / or pressure, thereby ensuring adhesion between the first substrate BP1 and the second substrate BP2.

[0120] The second substrate BP2 can be Figure 5 The second substrate BP2 may be different from the first substrate BP1, as described in the diagram. For example, in one or more embodiments, if the first substrate BP1 is a display module DM, then the second substrate BP2 may be a window WP. In one or more embodiments, if the first substrate BP1 is a window WP, then the second substrate BP2 may be a display module DM.

[0121] As a cured product of the resin composition RC, the adhesive member AP exhibits excellent or adequate adhesion, with a 180° peel strength meeting the aforementioned range even under conditions of room temperature of approximately 25°C, high temperature of approximately 60°C, and / or high temperature of approximately 85°C and relative humidity of approximately 85%. Accordingly, a display device DD including the adhesive member AP according to one or more embodiments... Figure 5 It can demonstrate excellent or adequate durability.

[0122] Figure 7 A cross-sectional view of a display device DD-a according to one or more embodiments of the present disclosure is shown below. For reference to... Figure 7 The display device DD-a shown in the figure is provided in a description and will no longer be provided with reference to the reference. Figures 1 to 5 and Figures 6A to 6C The provided descriptions are repetitive, and the main focus will be on the differences.

[0123] Reference Figure 4 and Figure 5 Compared to the described display device DD, Figure 7 The display device DD-a shown may further include a light control layer PP and an optical adhesive layer AP-a. According to one or more embodiments, the display device DD-a may further include a light control layer PP disposed between the adhesive member AP and the window WP, and an optical adhesive layer AP-a disposed between the light control layer PP and the window WP. The light control layer PP may include a polarizer or a color filter layer.

[0124] The optical adhesive layer AP-a may include a resin composition RC derived from one or more embodiments. Figure 6A The optical adhesive layer AP-a may be formed from a resin composition RC according to one or more embodiments of the present disclosure. The optical adhesive layer AP-a formed from the resin composition RC according to one or more embodiments may have a 180° peel strength of about 800 gf / 25 mm or greater for at least one of a glass substrate and a polymer substrate at a temperature of about 25°C. The optical adhesive layer AP-a may have a 180° peel strength of about 200 gf / 25 mm or greater for at least one of a glass substrate and a polymer substrate at a temperature of about 60°C. The optical adhesive layer AP-a may have a 180° peel strength of about 100 gf / 25 mm or greater for at least one of a glass substrate and a polymer substrate at a temperature of about 85°C and a relative humidity of about 85%. Accordingly, the optical adhesive layer AP-a comprising a polymer derived from the resin composition RC according to one or more embodiments may exhibit excellent or suitable adhesion.

[0125] Figure 8A cross-sectional view of a display device DD-b according to one or more embodiments of the present disclosure is shown below. For reference... Figure 8 The display device DD-b shown in the figure, according to one or more embodiments, is provided in the description and will not be provided again with reference to the reference. Figures 1 to 7 The provided descriptions are repetitive, and the main focus will be on the differences.

[0126] Reference Figure 4 and Figure 5 Compared to the described display device DD, Figure 8 The display device DD-b shown in the figure, according to one or more embodiments, may further include a light control layer PP, an optical adhesive layer AP-a, and a sandwich adhesive layer PIB. Figure 7 The display device DD-a shown in the figure is the same as that according to one or more embodiments. Figure 8 The display device DD-b shown in the figure, according to one or more embodiments, may further include a light control layer PP disposed between an adhesive member AP and a window WP, and an optical adhesive layer AP-a disposed between the light control layer PP and the window WP.

[0127] In the display device DD-b according to one or more embodiments, an adhesive member AP may be provided between the display panel DP and the input sensing portion TP. For example, the input sensing portion TP may not be directly disposed on the display panel DP, and the display panel DP and the input sensing portion TP may be bonded together by the adhesive member AP. For example, the adhesive member AP may be disposed on the encapsulation layer TFE of the display panel DP. Figure 5 Between the input sensing part TP and the input sensing part TP.

[0128] A sandwich adhesive layer PIB can be provided below the light control layer PP. The sandwich adhesive layer PIB can be disposed between the input sensing portion TP and the light control layer PP, and can be formed of an adhesive material having excellent or suitable moisture-proof properties. For example, in one or more embodiments, the sandwich adhesive layer PIB can be formed by including polyisobutylene. The sandwich adhesive layer PIB can be disposed on the input sensing portion TP to prevent or reduce corrosion of the sensing electrodes of the input sensing portion TP. The display device DD-b according to one or more embodiments includes resin compositions RC according to one or more embodiments. Figure 6A The optical adhesive layer AP-a and adhesive component AP are formed, and the display device DD-b including the optical adhesive layer AP-a and adhesive component AP can exhibit excellent or appropriate reliability.

[0129] Hereinafter, with reference to embodiments and comparative examples, resin compositions and adhesive members formed from resin compositions according to one or more embodiments of the present disclosure will be specifically described. Furthermore, the embodiments provided herein are merely illustrative for understanding the present disclosure, and the scope of the disclosure is not limited thereto.

[0130] Example

[0131] 1. Preparation of (meth)acrylate copolymers

[0132] (1) Synthesis Example 1: Synthesis of MC-1

[0133] Add 40 mL of butyl acetate to a round-bottom flask equipped with a condenser, dropping funnel, nitrogen inlet tube, and magnetic stirrer, and stir the solution at room temperature for 30 minutes while purging nitrogen to deoxygenate the solvent. Heat the resulting solution in an oil bath to an internal temperature of approximately 90°C. Prepare a homogeneous mixture by adding 14.0 g of methyl methacrylate (MMA, Tokyo Chemical Industry Co., Ltd.), 11.0 g of isoborneol methacrylate (IBXMA, Tokyo Chemical Industry Co., Ltd.), 10.0 g of glycidyl methacrylate (GMA, manufactured by Tokyo Chemical Industry Co., Ltd.), 0.5 g of free radical initiator V-601 (dimethyl-2,2'-azobis(2-propionate) (Fujifilm and Koko Pure Chemicals Co., Ltd.)) as a thermal polymerization initiator, and 10 mL of butyl acetate to the dropping funnel. Open the stopcock of the dropping funnel to slowly add the mixture dropwise to the round-bottom flask over one hour. The resulting mixture was then stirred for 3 hours to allow for polymerization. After polymerization, the round-bottom flask was removed from the oil bath and allowed to cool completely. 800 mL of ethanol was then added to a 1,000 mL beaker and stirred with a magnetic stirrer. The solution from the round-bottom flask after polymerization was then gradually added dropwise to extract the precipitate. The precipitate was filtered using a vacuum filter and then washed and filtered again with ethanol to remove butyl acetate and unreacted monomers. The precipitate was dried under reduced pressure to obtain 32.0 g of a white powder, MC-1, which is a copolymer of MMA, IBXMA, and GMA. The obtained white powder MC-1 has a weight-average molecular weight of 25,000.

[0134] (2) Synthesis Example 2: Synthesis of MC-2

[0135] Except that 10.0 g of Cyclomer M100 (M100 from Daicel) was used instead of GMA, 32.6 g of a white powder MC-2, which is a copolymer of MMA, IBXMA and M100 ((3,4-epoxycyclohexyl)methyl methacrylate), was obtained by essentially the same synthetic method as in Synthesis Example 1. The obtained white powder MC-2 has a weight average molecular weight of 30,000.

[0136] (3) Synthesis Example 3: Synthesis of MC-3

[0137] Except that 10.0 g of OXE-30 (Osaka Organic Chemicals Co., Ltd.) was used instead of GMA, 24.8 g of white powder MC-3 was obtained by essentially the same synthetic method as in Synthesis Example 1. MC-3 is a copolymer of MMA, IBXMA, and OXE-30 ((3-ethyloxetane-3-yl)methyl methacrylate). The obtained white powder MC-3 has a weight-average molecular weight of 27,000.

[0138] (4) Synthesis Example 4: Synthesis of MC-4

[0139] Except that the amount of V-601 was changed to 4.0 g, 30.7 g of white powder MC-4, a copolymer of MMA, IBXMA and GMA, was obtained by essentially the same synthesis method as in Synthesis Example 1. The obtained white powder MC-4 had a weight-average molecular weight of 4,000.

[0140] (5) Synthesis Example 5: Synthesis of MC-5

[0141] Except that the amount of V-601 was changed to 4.0 g, 31.9 g of white powder MC-5, a copolymer of MMA, IBXMA and M100, was obtained by essentially the same synthesis method as in Synthesis Example 2. The obtained white powder MC-5 had a weight-average molecular weight of 5,500.

[0142] (6) Synthesis Example 6: Synthesis of MC-6

[0143] Except that the amount of V-601 was changed to 4.0 g, 29.9 g of white powder MC-6, a copolymer of MMA, IBXMA and OXE-30, was obtained by essentially the same synthesis method as in Synthesis Example 3. The obtained white powder MC-6 had a weight-average molecular weight of 4,800.

[0144] (7) Synthesis Example 7: Synthesis of MC-7

[0145] Except that the amount of GMA was changed to 0.3 g, 24.8 g of white powder MC-7, a copolymer of MMA, IBXMA and GMA, was obtained by essentially the same synthesis method as in Synthesis Example 1. The obtained white powder MC-7 had a weight-average molecular weight of 20,000.

[0146] (8) Synthesis Example 8: Synthesis of MC-8

[0147] Except that the amount of M100 was changed to 0.3 g, 25.0 g of white powder MC-8, a copolymer of MMA, IBXMA and M100, was obtained by essentially the same synthesis method as in Synthesis Example 2. The obtained white powder MC-8 had a weight-average molecular weight of 22,000.

[0148] (9) Synthesis Example 9: Synthesis of MC-9

[0149] Except that the amount of OXE-30 was changed to 0.3 g, 24.8 g of white powder MC-9, a copolymer of MMA, IBXMA and OXE-30, was obtained by essentially the same synthesis method as in Synthesis Example 3. The obtained white powder MC-9 had a weight average molecular weight of 19,000.

[0150] (10) Synthesis Example 10: Synthesis of MC-10

[0151] Except that the amount of V-601 was changed to 4.0 g, 23.3 g of white powder MC-10, a copolymer of MMA, IBXMA and GMA, was obtained by essentially the same synthesis method as in Synthesis Example 7. The obtained white powder MC-10 had a weight-average molecular weight of 3,200.

[0152] (11) Synthesis Example 11: Synthesis of MC-11

[0153] Except that the amount of V-601 was changed to 4.0 g, 24.1 g of white powder MC-11, a copolymer of MMA, IBXMA and M100, was obtained by essentially the same synthesis method as in Synthesis Example 8. The obtained white powder MC-11 had a weight-average molecular weight of 3,400.

[0154] (12) Synthesis Example 12: Synthesis of MC-12

[0155] Except that the amount of V-601 was changed to 4.0 g, 22.9 g of white powder MC-12, a copolymer of MMA, IBXMA and OXE-30, was obtained by essentially the same synthesis method as in Synthesis Example 9. The obtained white powder MC-12 had a weight-average molecular weight of 3,100.

[0156] (13) Synthesis Example 13: Synthesis of MC-13

[0157] Except for the absence of GMA, 23.3 g of a white powder MC-13, a copolymer of MMA and IBXMA, was obtained by essentially the same synthetic method as in Synthesis Example 1. The obtained white powder MC-13 had a weight-average molecular weight of 21,000.

[0158] (14) Synthesis Example 14: Synthesis of MC-14

[0159] Except for the absence of GMA, 22.3 g of a white powder MC-14, a copolymer of MMA and IBXMA, was obtained using essentially the same synthetic method as in Synthesis Example 4. The obtained white powder MC-14 had a weight-average molecular weight of 3,100.

[0160] (15) Synthesis Example 15: Synthesis of MC-15

[0161] Except that the amount of GMA was changed to 12.0 g and the amount of V-601 was changed to 0.6 g, 31.8 g of white powder MC-15, a copolymer of MMA, IBXMA and GMA, was obtained by essentially the same synthesis method as in Synthesis Example 1. The obtained white powder MC-15 had a weight-average molecular weight of 25,000.

[0162] (16) Synthesis Example 16: Synthesis of MC-16

[0163] Except that the amount of M100 was changed to 12.0 g and the amount of V-601 was changed to 0.6 g, 34.0 g of white powder MC-16, a copolymer of MMA, IBXMA and M100, was obtained by essentially the same synthesis method as in Synthesis Example 2. The obtained white powder MC-16 had a weight-average molecular weight of 29,000.

[0164] (17) Synthesis Example 17: Synthesis of MC-17

[0165] Except that the amount of V-601 was changed to 5.0 g, 31.3 g of white powder MC-17, a copolymer of MMA, IBXMA and GMA, was obtained by essentially the same synthesis method as in Synthesis Example 15. The obtained white powder MC-17 had a weight-average molecular weight of 3,800.

[0166] (18) Synthesis Example 18: Synthesis of MC-18

[0167] Except that the amount of V-601 was changed to 5.0 g, 32.6 g of white powder MC-18, a copolymer of MMA, IBXMA and M100, was obtained by essentially the same synthesis method as in Synthesis Example 16. The obtained white powder MC-18 had a weight-average molecular weight of 5,500.

[0168] (19) Synthesis Example 19: Synthesis of MC-19

[0169] Except that the amount of GMA was changed to 0.2 g, 24.1 g of white powder MC-19, a copolymer of MMA, IBXMA and GMA, was obtained by essentially the same synthesis method as in Synthesis Example 7. The obtained white powder MC-19 had a weight-average molecular weight of 19,000.

[0170] (20) Synthesis Example 20: Synthesis of MC-20

[0171] Except that the amount of M100 was changed to 0.2 g, 24.6 g of white powder MC-20, a copolymer of MMA, IBXMA and M100, was obtained by essentially the same synthesis method as in Synthesis Example 8. The obtained white powder MC-20 had a weight-average molecular weight of 21,000.

[0172] (21) Synthesis Example 21: Synthesis of MC-21

[0173] Except that the amount of V-601 was changed to 3.5 g, 22.9 g of white powder MC-21, a copolymer of MMA, IBXMA and GMA, was obtained by essentially the same synthesis method as in Synthesis Example 19. The obtained white powder MC-21 had a weight-average molecular weight of 3,100.

[0174] (22) Synthesis Example 22: Synthesis of MC-22

[0175] Except that the amount of V-601 was changed to 3.5 g, 23.8 g of white powder MC-22, a copolymer of MMA, IBXMA and M100, was obtained by essentially the same synthesis method as in Synthesis Example 20. The obtained white powder MC-22 had a weight-average molecular weight of 3,200.

[0176] The masses (m1) of the cationic reactive (meth)acrylate monomers, the masses (m2) of the non-cationic reactive (meth)acrylate monomers, and the masses (in g) of the free radical initiator used in Synthesis Examples 1 to 22 are shown in Tables 1 to 5. Additionally, the weight-average molecular weights of copolymers MC-1 to MC-22 synthesized from Synthesis Examples 1 to 22 are shown in Tables 1 to 5.

[0177] Table 1

[0178]

[0179] Table 2

[0180]

[0181] Table 3

[0182]

[0183] Table 4

[0184]

[0185] Table 5

[0186]

[0187] 2. Preparation of resin composition

[0188] Tables 6 to 11 show the composition and content (e.g., amount) of each of the resin compositions of the Examples and the resin compositions of the Comparative Examples. Each component was added to a light-proof sealed container according to the mixing ratios (e.g., parts by mass) listed in Tables 6 to 11, and the mixture was stirred at room temperature for 12 hours using a mixing roller to prepare each of the resin compositions of the Examples and each of the resin compositions of the Comparative Examples.

[0189] Table 6

[0190]

[0191] Table 7

[0192]

[0193] Table 8

[0194]

[0195] Table 9

[0196]

[0197] Table 10

[0198]

[0199] Table 11

[0200]

[0201] The components of the resin composition are as follows, as shown in Tables 6 to 11.

[0202] (meth)acrylate copolymer

[0203] MC-1: A copolymer of MMA, IBXMA, and GMA synthesized by Example 1

[0204] MC-2: A copolymer of MMA, IBXMA, and M100 synthesized by Synthesis Example 2

[0205] MC-3: A copolymer of MMA, IBXMA, and OXE-30 synthesized by Synthesis Example 3

[0206] MC-4: A copolymer of MMA, IBXMA, and GMA synthesized by Example 4.

[0207] MC-5: A copolymer of MMA, IBXMA, and M100 synthesized by Synthesis Example 5

[0208] MC-6: A copolymer of MMA, IBXMA, and OXE-30 synthesized by Example 6

[0209] MC-7: A copolymer of MMA, IBXMA, and GMA synthesized by Example 7.

[0210] MC-8: A copolymer of MMA, IBXMA, and M100 synthesized by Example 8.

[0211] MC-9: A copolymer of MMA, IBXMA, and OXE-30 synthesized by Example 9.

[0212] MC-10: A copolymer of MMA, IBXMA, and GMA synthesized by Synthesis Example 10

[0213] MC-11: A copolymer of MMA, IBXMA, and M100 synthesized by Synthesis Example 11

[0214] MC-12: A copolymer of MMA, IBXMA, and OXE-30 synthesized by Synthesis Example 12

[0215] MC-13: A copolymer of MMA and IBXMA synthesized by Synthesis Example 13

[0216] MC-14: A copolymer of MMA and IBXMA synthesized by Synthesis Example 14

[0217] MC-15: A copolymer of MMA, IBXMA, and GMA synthesized by Synthesis Example 15

[0218] MC-16: A copolymer of MMA, IBXMA, and M100 synthesized by Synthesis Example 16

[0219] MC-17: A copolymer of MMA, IBXMA, and GMA synthesized by Synthesis Example 17

[0220] MC-18: A copolymer of MMA, IBXMA, and M100 synthesized by Synthesis Example 18

[0221] MC-19: A copolymer of MMA, IBXMA, and GMA synthesized by Synthesis Example 19

[0222] MC-20: A copolymer of MMA, IBXMA, and M100 synthesized by Synthesis Example 20

[0223] MC-21: A copolymer of MMA, IBXMA, and GMA synthesized by Synthesis Example 21

[0224] MC-22: A copolymer of MMA, IBXMA and M100 synthesized by Synthesis Example 20

[0225] Monofunctional (meth)acrylate monomers

[0226] 4HBA: 4-Hydroxybutyl acrylate (manufactured by Osaka Organic Chemicals Co., Ltd.)

[0227] THFA: Tetrahydrofurfuryl acrylate

[0228] 2EHA: 2-Ethylhexyl acrylate (manufactured by Toa Synthetic Co., Ltd.)

[0229] Photoradical polymerization initiator

[0230] Omnirad 819: Phenylenol bis(2,4,6-trimethylbenzoyl)phosphine oxide (manufactured by IGM Resins)

[0231] Photo-induced cationic polymerization initiator

[0232] CPI-310B: [1,1'-Biphenyl]-4-yl-[4-[[1,1'-Biphenyl]-4-ylthio]phenyl](phenyl)sulfonyl tetra(perfluorophenyl)borate (including a mixture of isomers, manufactured by SAN-APRO)

[0233] 3. Performance evaluation of the resin composition

[0234] 1) Evaluation of adhesive properties

[0235] Each resin composition of the examples or comparative examples was applied to one surface of a 76×26mm glass slide substrate to a thickness of 100μm and cured by UV irradiation in air to prepare the corresponding adhesive component. Subsequently, a 150mm×20mm, 50μm thick PET film substrate was laminated using an atmospheric pressure laminator to form a laminate, and then the laminate was vacuum degassed for 5 minutes in an autoclave at 30°C / 0.5 MPa. The obtained laminate was used as a peel test sample.

[0236] According to JIS Z0237, 180° peel tests were conducted at 25°C, 60°C, and 85°C / 85%RH. The average peel strength over the range of 20 mm to 80 mm after peeling began was used as the evaluation value (180° peel strength), and the evaluation value at each temperature was evaluated according to the following three-level criteria. The results are listed in Tables 9 to 13. For 180° peel strength, ◎ and ○ were set as pass (◎ indicates exceptionally good results), and × was set as failure.

[0237] Evaluation criteria for 180° peel strength at 25°C

[0238] ◎: 1500gf / 25mm or greater 180° peel strength

[0239] ○: 180° peel strength of 800gf / 25mm or greater but less than 1500gf / 25mm.

[0240] ×: Peel strength at 180° less than 800gf / 25mm

[0241] Evaluation criteria for 180° peel strength at 60°C

[0242] ◎: 500gf / 25mm or greater 180° peel strength

[0243] ○: 180° peel strength of 200gf / 25mm or greater but less than 500gf / 25mm.

[0244] ×: Peel strength at 180° less than 200gf / 25mm

[0245] Evaluation criteria for 180° peel strength at 85℃ / 85%RH

[0246] ◎: 200gf / 25mm or greater 180° peel strength

[0247] ○: 100gf / 25mm or greater but less than 200gf / 25mm 180° peel strength

[0248] ×: Peel strength at 180° less than 100gf / 25mm

[0249] Table 12

[0250]

[0251] Table 13

[0252]

[0253] Table 14

[0254]

[0255] Table 15

[0256]

[0257] Table 16

[0258]

[0259] Table 17

[0260]

[0261] Referring to the evaluation results of the examples and comparative examples in Tables 12 to 17, it can be seen that, in the measurement results of the peel samples prepared by light irradiation in an air atmosphere, Examples 1 to 24, i.e., the resin compositions comprising the first copolymer or the second copolymer, all exhibited excellent or adequate adhesion under all conditions, including room temperature (25°C), high temperature (60°C), and high temperature and high humidity environment (85°C / 85%RH). This is considered to be a result of the copolymer segregating on the outermost surface during the photocuring of the resin composition, thereby maintaining adhesion (tackiness) through a certain cohesive force, and imparting interaction with the resin matrix through the photo-cationic reaction of the epoxy groups or oxetanediols in the copolymer.

[0262] In contrast, Comparative Example 1, a resin composition containing neither the first copolymer nor the second copolymer, failed to exhibit the desired adhesion at room temperature, high temperature, or high temperature and high humidity. This result in Comparative Example 1 is attributed to the insufficient adhesion caused by the inhibition of curing at the outermost surface due to the influence of oxygen in the air atmosphere during photocuring.

[0263] Furthermore, the resin compositions of Comparative Examples 2 to 5 each exhibited relatively satisfactory adhesion at room temperature, but showed significantly reduced adhesion at high temperatures (60 °C) and in high-temperature and high-humidity environments (85 °C / 85% RH). These results are because, although adhesion was maintained similarly to the examples at near room temperature, the copolymers lacked cationic reactive groups, leading to weak interactions with the resin matrix and a significant increase in fluidity at high temperatures, resulting in a loss of overall cohesion. Additionally, high humidity caused water penetration between the cured layer and the substrate, making peeling easier.

[0264] Furthermore, the resin compositions of Comparative Examples 6 to 9 each exhibited relatively satisfactory adhesion (tack) at high temperature (60°C) and high temperature and high humidity environments (85°C / 85% RH), but none exhibited adhesion at room temperature. These results are because the copolymers contain too many cationic reactive groups, and even the addition of a small amount (V-601) results in a very high crosslinking density in the resin matrix, thereby hardening the resin surface and preventing it from exhibiting adhesion.

[0265] Furthermore, the resin compositions of Comparative Examples 10 to 13 each exhibited relatively satisfactory adhesion at room temperature, but all showed significantly reduced adhesion, particularly under high temperature and high humidity conditions (85°C / 85% RH). These results are due to the following reasons: because the copolymers contain very few cationic reactive groups, even with a large addition (V-601), the interaction with the resin matrix is ​​insufficient, leading to reduced flowability at high temperatures and thus reduced overall cohesion; and because high humidity causes water penetration between the cured layer and the substrate, making peeling easier.

[0266] The resin composition according to one or more embodiments comprises a copolymer of (meth)acrylate monomers containing epoxy or oxetyl groups and (meth)acrylate monomers containing cationic reactive (meth)acrylate monomers and (meth)acrylate monomers containing non-cationic reactive (meth)acrylate monomers (e.g., polymerized by means of (meth)acrylate monomers containing epoxy or oxetyl groups and (meth)acrylate monomers containing non-cationic reactive (meth)acrylate monomers), and thus reduces the inhibition of curing by oxygen during photocuring in an air atmosphere, thereby providing the effect of preventing or reducing the reduction of adhesive strength. Furthermore, the resin composition according to one or more embodiments exhibits excellent or adequate adhesive strength during curing at room temperature, as well as during curing in high temperature and high humidity environments.

[0267] The adhesive component according to one or more embodiments is formed from the resin composition according to one or more embodiments, and thus exhibits excellent or suitable adhesive properties at room temperature, high temperature and high temperature and high humidity.

[0268] Electronic devices according to one or more embodiments include adhesive members according to one or more embodiments, and thus may exhibit excellent or appropriate reliability.

[0269] As used herein, the terms “substantially,” “about,” or similar terms are used as terms of approximation and not as terms of degree, and are intended to account for inherent deviations in measured or calculated values ​​that would be recognized by a person skilled in the art. “About,” as used herein, includes stated values ​​and means within an acceptable range of deviation for a particular value, determined by a person skilled in the art considering the measurement in question and the errors associated with the measurement of that particular quantity (i.e., limitations of the measurement system). For example, “about” may mean within one or more standard deviations, or within ±30%, ±20%, ±10%, or ±5% of the stated value. Furthermore, it should be understood that even if the terms “about,” “about,” or “substantially” are not explicitly stated in a given element (e.g., a claim element), the scope of that element is intended to include variations that are not substantial or within the understanding of a person skilled in the art. For example, the numerical values ​​and ranges provided herein are intended to include tolerances and measurement uncertainties that would be recognized by a person skilled in the art, and these elements (e.g., claim elements) should be interpreted accordingly to encompass these equivalents.

[0270] In the context of this application, and unless otherwise defined, the term “use, using, used” may be regarded as synonymous with the term “utilize, utilizing, utilized”, respectively.

[0271] Any numerical range set forth herein is intended to include all subranges of the same numerical precision falling within the set forth range. For example, the range “1.0 to 10.0” is intended to include (and inclusive) the stated minimum value of 1.0 and the stated maximum value of 10.0, i.e., all subranges having a minimum value equal to or greater than 1.0 and a maximum value equal to or less than 10.0 (e.g., 2.4 to 7.6). Any maximum numerical limit set forth herein is intended to include all lower numerical limits falling within it, and any minimum numerical limit set forth herein is intended to include all higher numerical limits falling within it. Accordingly, the applicant reserves the right to modify this disclosure (including the claims) to expressly set forth any subrange falling within the range expressly set forth herein.

[0272] The light-emitting elements, display devices, display modules, display panels, electronic devices / equipment, their manufacturing equipment, or any other related devices / equipment or components described herein according to embodiments of this disclosure can be implemented using any suitable hardware, firmware (e.g., application-specific integrated circuits), software, or a combination of software, firmware, and hardware. For example, various components of the device may be formed on an integrated circuit (IC) chip or on a separate IC chip. Furthermore, various components of the device may be implemented on a flexible printed circuit film, a tape-on-a-chip (TCP), or a printed circuit board (PCB), or formed on a substrate. Furthermore, various components of the device may be processes or threads running on one or more processors in one or more computing devices, executing computer program instructions and interacting with other system components to perform the various functions described herein. The computer program instructions are stored in memory, which may be implemented in a computing device using standard memory devices (e.g., random access memory (RAM)). The computer program instructions may also be stored in other non-transitory computer-readable media (e.g., CD-ROM (read-only optical disc storage) or flash memory drives). Furthermore, those skilled in the art will recognize that, without departing from the scope of the embodiments of this disclosure, the functions of various computing devices may be combined or integrated into a single computing device, or the functions of a dedicated computing device may be distributed across one or more other computing devices.

[0273] In this disclosure, each suitable feature of the various embodiments of this disclosure may be combined or integrated with each other in part or in whole, and may be technically interlocked and operated in various suitable ways. Unless otherwise stated or implied, each embodiment may be implemented independently of each other or in combination with each other in any suitable way.

[0274] In the foregoing description, reference has been made to one or more embodiments of the present disclosure. However, it will be understood by those skilled in the art or those of ordinary skill in the art that one or more appropriate modifications and changes may be made to the present disclosure, provided that such modifications and changes do not depart from the spirit and technical scope of the present disclosure as set forth in the claims.

[0275] Therefore, the technical scope of this disclosure is not limited to the content described in the detailed description of this disclosure, but should be determined by the claims and their equivalents.

Claims

1. A resin composition comprising: (meth)acrylate copolymer, wherein the (meth)acrylate copolymer is a first copolymer or a second copolymer; Monofunctional (meth)acrylate monomers; Photoradical polymerization initiators; and Photo-induced cationic polymerization initiator, The first copolymer is a copolymer of a first monomer and a third monomer, wherein the first monomer is a cationic reactive (meth)acrylate monomer containing an epoxy group, and the third monomer is a non-cationic reactive (meth)acrylate monomer. The second copolymer is a copolymer of the second monomer and the third monomer, wherein the second monomer is a cationic reactive (meth)acrylate monomer containing an oxetyl group. The first copolymer is a copolymer of the first monomer in an amount of 1 to 30 parts by mass relative to the total amount of 100 parts by mass of the first monomer and the third monomer, and The resin composition does not include any other cationic reactive compounds other than the first monomer and the second monomer included in the polymerization of the (meth)acrylate copolymer.

2. The resin composition according to claim 1, wherein the (meth)acrylate copolymer has a weight-average molecular weight of 3,000 to 30,000.

3. The resin composition according to claim 1, wherein the amount of the (meth)acrylate copolymer is from 5 parts by weight to 50 parts by weight relative to 100 parts by weight of the monofunctional (meth)acrylate monomer.

4. The resin composition according to claim 1, wherein the first monomer comprises at least one selected from glycidyl methacrylate, glycidyl acrylate, methyl (3,4-epoxycyclohexyl)acrylate, and methyl (3,4-epoxycyclohexyl)methacrylate. The second monomer includes at least one of (3-ethyloxetane-3-yl)methyl acrylate and (3-ethyloxetane-3-yl)methyl methacrylate.

5. The resin composition according to claim 1, wherein the third monomer comprises at least one of methyl methacrylate and isobornyl methacrylate.

6. The resin composition according to claim 1, wherein the first copolymer is a copolymer of the first monomer, methyl methacrylate and isobornyl methacrylate.

7. The resin composition according to claim 1, wherein the second copolymer is a copolymer of the second monomer, methyl methacrylate and isobornyl methacrylate.

8. The resin composition according to claim 1, wherein the monofunctional (meth)acrylate monomer comprises at least one selected from 4-hydroxybutyl acrylate, 2-ethylhexyl acrylate, and tetrahydrofurfuryl acrylate.

9. An adhesive component derived from a resin composition according to any one of claims 1 to 8, cured by light exposure in an air atmosphere.

10. The adhesive member according to claim 9, at a temperature of 25°C, has a 180° peel strength of 800 gf / 25 mm or greater for at least one of the glass substrate and the polymer substrate.

11. The adhesive member according to claim 9, at a temperature of 60°C, has a 180° peel strength of 200 gf / 25 mm or greater for at least one of the glass substrate and the polymer substrate.

12. The adhesive member according to claim 9, at a temperature of 85°C and a relative humidity of 85%, has a 180° peel strength of 100 gf / 25 mm or greater for at least one of a glass substrate and a polymer substrate.

13. An electronic device comprising a display device, the display device including at least one adhesive member according to any one of claims 9 to 12.

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