A soft insulation black PI adhesive tape

Abstract

The application provides a soft insulating black PI adhesive tape, which comprises, from bottom to top, a heat-conducting layer, a bearing layer, an insulating layer, a flexible layer, a heat-resistant layer, a reinforcing layer and a pressure-sensitive adhesive layer. In the working process, the heat-conducting layer can improve the heat dissipation performance of the soft insulating black PI adhesive tape. The bearing layer can improve the insulating performance and high-temperature resistance of the soft insulating black PI adhesive tape. The insulating layer can improve the insulating performance of the soft insulating black PI adhesive tape. The flexible layer can improve the flexibility of the soft insulating black PI adhesive tape. The heat-resistant layer can improve the high-temperature resistance of the soft insulating black PI adhesive tape, and the reinforcing layer can improve the structural strength and stability of the soft insulating black PI adhesive tape. The soft insulating black PI adhesive tape has small thickness, good flexibility and excellent insulating performance of each film layer, and can ensure sufficient insulating performance while ensuring flexibility.

Description

Technical Field

[0001] This invention relates to the field of PI tape, and in particular to flexible insulating black PI tape. Background Technology

[0002] PI tape, also known as polyimide tape or gold finger tape, uses polyimide film as the base material and imported silicone pressure-sensitive adhesive. PI tape boasts excellent adhesion, good conformability, acid and alkali resistance, radiation resistance, high temperature resistance, solvent resistance, no solder seepage, no residue, self-adhesive sealing, electrical insulation, and radiation resistance. Polyimide tape can be used for PCB gold finger protection, printed circuit board gold fingers, solder pots, motors, transformers, heating elements, electrical insulation, lithium batteries, hot air soldering, shielding protection at various stages of solder potting, motor insulation, coil winding, electromagnetic wave shielding, anti-static properties, and insulation of wires, cables, and magnets.

[0003] However, traditional PI tapes, such as the patent application number CN202122285103.5 entitled "PI Tape for Flexible and Rigid Bonded Boards," protect a technology with low flexibility and poor insulation performance. Summary of the Invention

[0004] Therefore, it is necessary to provide a soft and insulating black PI tape to address the technical problems of low flexibility and poor insulation performance of traditional PI tapes.

[0005] A soft insulating black PI tape comprises, from bottom to top: a thermally conductive layer, a bonding layer, an insulating layer, a flexible layer, a heat-resistant layer, a reinforcing layer, and a pressure-sensitive adhesive layer; One side of the thermally conductive layer is connected to the receiving layer, and a release agent layer is provided on the side of the thermally conductive layer facing away from the receiving layer; the side of the receiving layer facing away from the thermally conductive layer is connected to the insulating layer; the side of the insulating layer facing away from the receiving layer is connected to the flexible layer; the flexible layer facing away from the insulating layer is connected to the heat-resistant layer; the side of the heat-resistant layer facing away from the flexible layer is connected to the reinforcing layer; and the side of the reinforcing layer facing away from the heat-resistant layer is connected to the pressure-sensitive adhesive layer.

[0006] In one embodiment, the thermally conductive layer is a silicone rubber coating.

[0007] In one embodiment, the receiving layer is a polyimide film layer.

[0008] In one embodiment, the insulating layer is an epoxy resin film.

[0009] In one embodiment, the flexible layer is a silicone film layer.

[0010] In one embodiment, the heat-resistant layer is a polyamide-imide film layer.

[0011] In one embodiment, the reinforcing layer is a polyphenylene ether film layer.

[0012] In one embodiment, the thickness of the thermally conductive layer is from 0.001 mm to 0.003 mm.

[0013] In one embodiment, the thickness of the support layer is from 0.004 mm to 0.008 mm.

[0014] In one embodiment, the thickness of the insulating layer is 0.005 mm to 0.008 mm.

[0015] During operation, the aforementioned flexible insulating black PI tape exhibits the following characteristics: The thermally conductive layer enhances heat dissipation; the bonding layer improves insulation and high-temperature resistance; the insulating layer enhances insulation performance; the flexible layer improves flexibility; the heat-resistant layer enhances high-temperature resistance; and the reinforcing layer improves structural strength and stability. This flexible insulating black PI tape is characterized by its thinness, good flexibility, and excellent insulation properties across all layers, ensuring sufficient insulation while maintaining flexibility. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of a flexible insulating black PI tape in one embodiment; Figure 2 This is a partially enlarged structural diagram of a flexible insulating black PI tape in one embodiment. Detailed Implementation

[0017] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below. In the description of the present invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0018] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0019] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0020] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0021] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0022] Please refer to the following: Figures 1 to 2 The present invention provides a soft insulating black PI tape 10, which includes, from bottom to top: a thermally conductive layer 100, a receiving layer 200, an insulating layer 300, a flexible layer 400, a heat-resistant layer 500, a reinforcing layer 600, and a pressure-sensitive adhesive layer 700.

[0023] One side of the thermally conductive layer 100 is connected to the receiving layer 200, and a release agent layer 110 is provided on the side of the thermally conductive layer 100 facing away from the receiving layer 200. In this embodiment, the thickness of the thermally conductive layer 100 is 0.001 mm to 0.003 mm. Further, the thickness of the thermally conductive layer 100 is 0.002 mm. In one embodiment, the thermally conductive layer 100 is a silicone rubber coating. Silicone rubber coating has excellent insulation properties, flexibility, high temperature resistance, and weather resistance. It can improve the insulation properties, flexibility, high temperature resistance, and weather resistance of the flexible insulating black PI tape 10.

[0024] The side of the receiving layer 200 facing away from the thermally conductive layer 100 is connected to the insulating layer 300. In this embodiment, the thickness of the receiving layer 200 is 0.004 mm to 0.008 mm. More specifically, the thickness of the receiving layer 200 is 0.005 mm. In this embodiment, the receiving layer 200 is a polyimide film layer. The polyimide film layer has good high-temperature resistance and insulation properties, which can improve the insulation and high-temperature resistance of the flexible insulating black PI tape 10.

[0025] In this embodiment, the thickness of the insulating layer 300 is 0.005 mm to 0.008 mm. Further, the thickness of the insulating layer 300 is 0.006 mm. In one embodiment, the insulating layer 300 is an epoxy resin film. Epoxy resin has good weather resistance and excellent electrical insulation properties, which can improve the weather resistance and electrical insulation properties of the flexible insulating black PI tape 10.

[0026] The insulating layer 300, facing away from the receiving layer 200, is connected to the flexible layer 400. In this embodiment, the thickness of the flexible layer 400 is 0.002 mm to 0.005 mm. Further, the thickness of the flexible layer 400 is 0.003 mm. In one embodiment, the flexible layer 400 is a silicone film layer. The silicone film layer has excellent high-temperature resistance and corrosion resistance, which can improve the high-temperature resistance and corrosion resistance of the flexible insulating black PI tape 10.

[0027] The flexible layer 400 is connected to the heat-resistant layer 500, facing away from the insulating layer 300. In this embodiment, the thickness of the heat-resistant layer 500 is 0.003 mm to 0.006 mm. More specifically, the thickness of the heat-resistant layer 500 is 0.004 mm. In this embodiment, the heat-resistant layer 500 is a polyamide-imide film. Polyamide-imide films have good corrosion resistance, excellent high-temperature resistance, and high tensile strength.

[0028] The side of the heat-resistant layer 500 facing away from the flexible layer 400 is connected to the reinforcing layer 600. In this embodiment, the thickness of the reinforcing layer 600 is 0.002 mm to 0.006 mm. More specifically, the thickness of the reinforcing layer 600 is 0.004 mm. In this embodiment, the reinforcing layer 600 is a polyphenylene ether film. Polyphenylene ether film is a high-strength film layer with excellent high-temperature resistance, impact resistance, and structural strength. The side of the reinforcing layer 600 facing away from the heat-resistant layer 500 is connected to the pressure-sensitive adhesive layer 700.

[0029] During operation, the aforementioned flexible insulating black PI tape 10 exhibits the following characteristics: The heat-conducting layer 100 enhances the heat dissipation performance of the tape. The bonding layer 200 improves the insulation and high-temperature resistance of the tape. The insulating layer 300 enhances the insulation performance of the tape. The flexible layer 400 improves the flexibility of the tape. The heat-resistant layer 500 enhances the high-temperature resistance of the tape, and the reinforcing layer 600 improves the structural strength and stability of the tape. The aforementioned flexible insulating black PI tape 10 features a thin thickness, good flexibility, and excellent insulation properties in each layer, ensuring sufficient insulation while maintaining flexibility.

[0030] To enhance the high-temperature resistance of the pressure-sensitive adhesive layer 700, in one embodiment, the pressure-sensitive adhesive layer 700 comprises the following components in parts by weight: 6 to 15 parts methyl methacrylate, 7 to 15 parts butyl acrylate, 6 to 14 parts bisphenol A epoxy resin, 6 to 12 parts terpene resin, 2 to 5 parts vinyltriethoxysilane, 5 to 10 parts acrylic acid, 2 to 4 parts natural rubber latex, 2 to 4 parts dodecyl mercaptan, 1 to 2 parts zinc oxide, 1 to 2 parts silica micropowder, 1 to 2 parts kaolin, and 10 to 20 parts ethyl acetate. The pressure-sensitive adhesive composed of the above components can improve the high-temperature resistance of the pressure-sensitive adhesive layer.

[0031] To improve the high-temperature resistance of the release agent layer 110, the release agent layer 110 is made of a release agent comprising the following components in parts by weight: 25 to 55 parts tripropylene glycol diacrylate, 5 to 15 parts vinyl polydimethylsiloxane, 4 to 8 parts polytetrafluoroethylene micro powder, 15 to 25 parts vinyl silicone oil, 1 to 2 parts kaolin, and 0.5 to 1 part silicone defoamer. The release agent composed of the above components exhibits excellent high-temperature resistance and strong thermal stability. The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0032] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A soft, insulating black PI tape, characterized in that, From bottom to top, it includes: a thermally conductive layer, a bonding layer, an insulating layer, a flexible layer, a heat-resistant layer, a reinforcing layer, and a pressure-sensitive adhesive layer; One side of the thermally conductive layer is connected to the receiving layer, and a release agent layer is provided on the side of the thermally conductive layer facing away from the receiving layer; the side of the receiving layer facing away from the thermally conductive layer is connected to the insulating layer; the side of the insulating layer facing away from the receiving layer is connected to the flexible layer; the flexible layer facing away from the insulating layer is connected to the heat-resistant layer; the side of the heat-resistant layer facing away from the flexible layer is connected to the reinforcing layer; and the side of the reinforcing layer facing away from the heat-resistant layer is connected to the pressure-sensitive adhesive layer.

2. The flexible insulating black PI tape according to claim 1, characterized in that, The thermally conductive layer is a silicone rubber coating.

3. The flexible insulating black PI tape according to claim 1, characterized in that, The receiving layer is a polyimide film layer.

4. The flexible insulating black PI tape according to claim 1, characterized in that, The insulating layer is an epoxy resin film.

5. The flexible insulating black PI tape according to claim 1, characterized in that, The flexible layer is a silicone film layer.

6. The flexible insulating black PI tape according to claim 1, characterized in that, The heat-resistant layer is a polyamide-imide film layer.

7. The flexible insulating black PI tape according to claim 1, characterized in that, The reinforcing layer is a polyphenylene ether film layer.

8. The flexible insulating black PI tape according to claim 1, characterized in that, The thickness of the thermally conductive layer is from 0.001 mm to 0.003 mm.

9. The flexible insulating black PI tape according to claim 1, characterized in that, The thickness of the supporting layer is from 0.004 mm to 0.008 mm.

10. The flexible insulating black PI tape according to claim 1, characterized in that, The thickness of the insulating layer is from 0.005 mm to 0.008 mm.

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