A mask

Abstract

The application discloses a mask. The mask comprises a plate body, the plate body comprises a mask pattern area and an edge area, the edge area is arranged around the mask pattern area, the mask pattern area comprises a plurality of array-arranged pattern openings, the plate body comprises a first surface and a second surface arranged oppositely, the pattern openings are arranged through the first surface and the second surface, the first surface of the plate body is provided with a convex structure, the convex structure is used for contacting the surface of an array substrate to be evaporated, the convex structure comprises a first convex part, the first convex part is located in the edge area, at least part of the first convex part is arranged around the pattern opening, the first convex part comprises a top surface and a side surface connected with the top surface, the top surface is used for contacting the surface of the array substrate to be evaporated, at least part of the top surface is provided with an anti-static layer, and the anti-static layer is exposed to the top surface. The embodiment of the application can improve the situation that the wirings of the array substrate are damaged due to static electricity generated between the CMM and the array substrate.

Description

Technical Field

[0001] This invention relates to the field of display technology, and more particularly to a photomask. Background Technology

[0002] With the development of display technology, organic light-emitting diode (OLED) displays are considered to be the next generation of emerging application technologies for flat panel displays due to their many advantages such as self-illumination, high resolution, and high brightness.

[0003] Common metal masks (CMMs) are used when fabricating films with universal patterns for OLED displays. During the film fabrication process, static electricity can easily be generated between the CMM and the array substrate, causing damage to the traces on the array substrate and resulting in bright lines on the screen. Summary of the Invention

[0004] This invention provides a photomask to solve the problem of static electricity easily generated between the CMM and the array substrate, which can damage the traces on the array substrate.

[0005] According to one aspect of the present invention, a photomask is provided, the photomask covering a plate body; the plate body includes a photomask pattern area and an edge area; wherein the edge area is disposed around the photomask pattern area;

[0006] The mask pattern area includes a plurality of pattern openings arranged in an array; the plate body includes a first surface and a second surface disposed opposite to each other; the pattern openings are disposed through the first surface and the second surface; the first surface of the plate body is provided with a protruding structure, the protruding structure being used to contact the surface of the array substrate to be vapor-deposited;

[0007] The protruding structure includes a plurality of first protrusions, the first protrusions being located in the edge region, and at least a portion of the first protrusions being disposed around the pattern opening;

[0008] The first protrusion includes a top surface and a side surface connected to the top surface, wherein the top surface is used to contact the surface of the array substrate to be vapor-deposited; at least a portion of the top surface is provided with an antistatic layer, the antistatic layer being exposed on the top surface.

[0009] Optionally, the first protrusions in the edge region are arranged symmetrically;

[0010] Preferably, there is a preset interval between two adjacent pattern openings;

[0011] The protruding structure includes a second protrusion, which is disposed within at least two of the preset intervals in the mask pattern area; wherein the at least two preset intervals are arranged in a centrally symmetrical manner.

[0012] Optionally, the number of the second protrusions located within each of the preset intervals includes at least one.

[0013] Optionally, the preset interval includes a first preset interval, a second preset interval, or a third preset interval; wherein each of the first preset intervals is arranged along a first direction, each of the second preset intervals is arranged along a second direction, and each of the third preset intervals is arranged along a third direction; the second direction and the third direction intersect the first direction respectively;

[0014] The number of the second protrusions located within each of the first preset intervals is the same;

[0015] And / or, the number of the second protrusions located within each of the second preset intervals is the same;

[0016] And / or, the number of the second protrusions located within each of the third preset intervals is the same.

[0017] Optionally, each of the second protrusions located within two adjacent first preset intervals is provided in a one-to-one correspondence in the first direction;

[0018] And / or, each of the second protrusions located within two adjacent second preset intervals is provided in a one-to-one correspondence in the second direction;

[0019] And / or, each of the second protrusions located within two adjacent third preset intervals is provided in a corresponding manner in the third direction.

[0020] Optionally, the antistatic layer is provided on the side of the first protrusion; the side of the first protrusion is perpendicular to the top surface;

[0021] And / or, the antistatic layer is provided on the top surface and side surface of the second protrusion; wherein, the second protrusion is used to contact the array substrate through the antistatic layer from the top surface; the side surface of the second protrusion is perpendicular to the top surface.

[0022] Optionally, the antistatic layer is disposed on the entire surface of the plate on the first surface where the protrusion structure is provided.

[0023] Optionally, the antistatic layer comprises polythiophene.

[0024] Optionally, the shape of the protrusion structure includes a column or a hemisphere, and the cross-sectional shape of the protrusion structure parallel to the surface of the plate includes a circle.

[0025] Optionally, the height of the protrusion structure along the thickness direction of the plate body ranges from 45 to 55 μm, and the diameter of the contact surface between the protrusion structure and the array substrate ranges from 45 to 55 μm.

[0026] The photomask provided in this embodiment of the invention includes a plate body with a first surface and a second surface disposed opposite to each other. A raised structure is provided on the first surface of the plate body to support the photomask on the surface of an array substrate. The raised structure includes a first protrusion disposed in the edge region of the plate body, at least a portion of which surrounds a pattern opening, providing stable support for the photomask and ensuring that the distance between all positions of the photomask and the array substrate is equal, thus significantly reducing the contact area between the plate body and the array substrate. An antistatic layer is also provided on the top surface of the first protrusion, allowing the photomask to contact the array substrate through the antistatic layer covering at least a portion of the top surface of the first protrusion, further reducing the surface resistance of the materials of the photomask and the array substrate. By providing the first protrusion on the first surface of the plate body, friction between the photomask and the array substrate during the vapor deposition process can be reduced, effectively reducing charge accumulation and preventing static electricity generation. This effectively prevents electrostatic damage to the metal traces of the array substrate, improves the bright line phenomenon on the display panel, and enhances the display effect.

[0027] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 This is a front view schematic diagram of a mask and an array substrate cooperating according to an embodiment of the present invention;

[0030] Figure 2 This is a top view of a mask facing away from the array substrate, according to an embodiment of the present invention.

[0031] Figure 3 This is a top view of the first surface of a photomask according to an embodiment of the present invention;

[0032] Figure 4 yes Figure 3 A schematic diagram of the cross-sectional structure along the A-A' direction;

[0033] Figure 5 yes Figure 4 A magnified schematic diagram of the structure of the area within the dashed circle.

[0034] Figure 6 This is a front view schematic diagram of a mask and an array substrate in conjunction, provided by relevant technology;

[0035] Figure 7 This is a top view of the first surface of another photomask provided according to an embodiment of the present invention;

[0036] Figure 8 yes Figure 7 A schematic diagram of a cross-sectional structure along the B-B' direction;

[0037] Figure 9 yes Figure 7 A schematic diagram of another cross-sectional structure along the B-B' direction. Detailed Implementation

[0038] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0039] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0040] As described in the background section, in the fabrication process of OLED displays, when preparing films such as the cathode layer, cathode capping layer (CPL), and anode modification layer (LiF), a vapor deposition method is used. A cathode molded surface (CMM) is used to deposit the vapor deposition material within specific patterned areas of the CMM, thereby forming a film layer with a specific pattern on the array substrate. However, during the vapor deposition process, friction inevitably occurs between the CMM and the array substrate, generating static electricity. This static electricity may damage the array substrate, causing damage to the metal traces on the substrate and resulting in defects such as bright lines on the display.

[0041] Based on the above-mentioned technical problems, the embodiments of the present invention provide the following technical solutions:

[0042] This invention provides a photomask. When fabricating corresponding film layers in an OLED display panel using a vapor deposition method, the photomask is used in conjunction with an array substrate. Specifically, one surface of the photomask contacts the array substrate to position a specific pattern on the photomask at a corresponding location on the array substrate; while the other surface of the photomask is used to hold the vapor deposition material. Figure 1 This is a front view schematic diagram of a mask and an array substrate in cooperation according to an embodiment of the present invention. Figure 2 This is a top view schematic diagram of a mask facing away from the array substrate, provided in an embodiment of the present invention. Figure 3 This is a top view of the first surface of a photomask provided in an embodiment of the present invention. Figure 4 yes Figure 3 A schematic diagram of the cross-sectional structure along the A-A' direction. Figure 5 yes Figure 4 A magnified structural diagram of the area within the dashed circle. (Combined with...) Figures 1 to 5 The mask includes: a plate body 00; the plate body 00 includes a mask pattern area 01 and an edge area 02; wherein the edge area 02 is disposed around the mask pattern area 01.

[0043] The mask pattern area 01 includes a plurality of pattern openings 200 arranged in an array; the plate body 00 includes a first surface 001 and a second surface 002 disposed opposite to each other; the pattern openings 200 are disposed through the first surface 001 and the second surface 002; the first surface 001 of the plate body 00 is provided with a protrusion structure 100, the protrusion structure 100 is used to contact the surface of the array substrate 000 to be vapor-deposited; the protrusion structure 100 includes a plurality of first protrusions 110, the first protrusions 110 are located in the edge area 02, and at least a portion of the first protrusions 110 are disposed around the pattern openings 200.

[0044] The first protrusion 110 includes a top surface 111 and a side surface 112 connected to the top surface 111, wherein the top surface 111 is used to contact the surface of the array substrate 000 to be vapor-deposited; at least a portion of the top surface 111 is provided with an antistatic layer 300, the antistatic layer being exposed on the top surface 300.

[0045] Specifically, the mask includes a plate body 00 and a border 03 surrounding the plate body 00. During use with the array substrate 000, the first surface 001 of the plate body 00 is the side facing the array substrate 000, used to contact the surface to be vapor-deposited in the array substrate 000; the second surface 002 of the plate body 00 is the side facing away from the array substrate 000, used to support the vapor-deposited material; the first surface 001 and the second surface 002 are two large-area surfaces arranged opposite each other. The plate body 00 can be divided into an edge region 02 and a mask pattern region 01 located inside the edge region 02. The mask pattern in the mask pattern region 01 can be set by the user according to actual application needs, and is not limited here. For example, in this embodiment of the invention, the mask pattern in the mask pattern region 01 can be a rectangular pattern opening 200 arranged in an array, see [reference]. Figures 2 to 4 The pattern opening 200 is a through opening that penetrates the first surface 001 and the second surface 002, so that during the vapor deposition process, the vapor deposition material is deposited on the corresponding position of the surface to be vapor deposited on the array substrate 000 through the pattern opening 200, thereby completing the preparation of the corresponding film layer.

[0046] For example, Figure 6 A front view schematic diagram of a mask and array substrate mating, provided for related technologies. (See also...) Figure 6 In related technologies, the mask plate 10 is in full contact with the array substrate 11, and friction inevitably occurs between the mask plate 10 and the array substrate 11 during the vapor deposition process. Due to the large contact area between the mask plate 10 and the array substrate 11, a significant amount of static electricity is generated during this friction. Furthermore, the CMM is made of metal, and the surface of the array substrate 11 has numerous array metal traces, all of which have a certain conductivity for static electricity. Therefore, the large amount of static electricity generated by friction may damage the array substrate 11, causing damage to the metal traces and resulting in bright lines on the display panel, thus affecting the display effect.

[0047] Based on this, see Figures 1 to 3The photomask provided in this embodiment of the invention has a raised structure 100 on its first surface 001 facing the array substrate 000, while the second surface 002 of the plate body 00 facing away from the array substrate 000 is a flat surface, i.e., without the raised structure 100. The raised structure 100 has a certain height, which can separate the plate body 00 of the photomask from the array substrate 000. That is, the photomask contacts the surface of the array substrate 000 to be vapor-deposited through the raised structure 100, and the raised structure 100 can support the photomask on the surface of the array substrate 000 to be vapor-deposited, so that the specific pattern in the mask pattern area 01 of the plate body 00 corresponds to the corresponding position on the surface of the array substrate 000 to be vapor-deposited, thereby forming a film layer with a specific pattern on the surface of the array substrate 000 by vapor deposition. Compared to related technologies where the mask and array substrate are in full-surface contact, the mask provided in this embodiment of the invention only contacts the surface of the array substrate 000 to be vapor-deposited through a raised structure 100. This significantly reduces the contact area between the mask and the array substrate 000, effectively reducing friction and charge accumulation, thus preventing static electricity. This effectively protects the metal traces of the array substrate 000 from electrostatic discharge, preventing defects such as bright lines on the display panel and improving display performance.

[0048] For example, the raised structure 100 includes a first raised portion 110 disposed in the edge region 02 of the plate body 00, that is, the first raised portion 110 is disposed around the mask pattern region 01, and at least a portion of the first raised portion 110 is disposed around the pattern opening 200. In other words, the first raised portion 110 disposed in the edge region 02 may be disposed around each pattern opening 200 near the edge of the mask pattern region 01. For example, see [link to example]. Figure 3 This illustrates the case where two first protrusions 110 are respectively provided at corresponding positions on two sides of the edge region 02. This ensures that the distance between each position of the entire mask and the array substrate 000 is equal, and the distance between the position around the pattern opening 200 and the array substrate 000 will not change due to the opening of the pattern opening 200, thereby ensuring that the film layer prepared by vapor deposition has good preparation accuracy.

[0049] See Figure 5 An antistatic material is coated on at least a portion of the top surface 111 of the first protrusion 110 to form an antistatic layer 300. This antistatic layer 300 covers at least a portion of the top surface 111 of the first protrusion 110, allowing the photomask to contact the surface of the array substrate 000 to be vapor-deposited through the antistatic layer 300 covering the top surface 111 of the first protrusion 110. By providing the antistatic layer 300, the surface resistance of the materials of the photomask and the array substrate can be further reduced, effectively preventing static electricity accumulation and preventing electrostatic damage to the metal traces of the array substrate.

[0050] The photomask provided in this embodiment of the invention includes a plate body with a first surface and a second surface disposed opposite to each other. A raised structure is provided on the first surface of the plate body to support the photomask on the surface of an array substrate. The raised structure includes a first protrusion disposed in the edge region of the plate body, at least a portion of which surrounds a pattern opening, providing stable support for the photomask and ensuring that the distance between all positions of the photomask and the array substrate is equal, thus significantly reducing the contact area between the plate body and the array substrate. An antistatic layer is also provided on the top surface of the first protrusion, allowing the photomask to contact the array substrate through the antistatic layer covering at least a portion of the top surface of the first protrusion, further reducing the surface resistance of the materials of the photomask and the array substrate. By providing the first protrusion on the first surface of the plate body, friction between the photomask and the array substrate during the vapor deposition process can be reduced, effectively reducing charge accumulation and preventing static electricity generation. This effectively prevents electrostatic damage to the metal traces of the array substrate, improves the bright line phenomenon on the display panel, and enhances the display effect.

[0051] Based on the above embodiments, Figure 7 This is a top view schematic diagram of the first surface of another type of photomask provided in an embodiment of the present invention. See also Figure 3 and Figure 7 Optionally, the first protrusions 110 provided in the edge area 02 are arranged symmetrically.

[0052] Specifically, to ensure uniform support force of the first protrusion 110 on the plate 00, multiple first protrusions 110 can be provided in the edge region 02, and the multiple first protrusions 110 are symmetrically arranged to maintain the stability of the plate 00. The symmetrical arrangement of the multiple first protrusions 110 in the edge region 02 can be either axially symmetrical or centrally symmetrical, without limitation. For example, see [link to example]. Figure 3 and Figure 7 All of them show that the first protrusions 110 provided in the edge region 02 are arranged in both axisymmetric and centrosymmetric configurations. This allows the mask to be stably supported on the surface of the array substrate 000, and significantly reduces the contact area between the plate 00 and the array substrate 000, reducing charge accumulation and preventing electrostatic discharge from damaging the metal traces of the array substrate 000.

[0053] Based on the above embodiments, see below. Figure 7 There is a preset interval 210 between two adjacent pattern openings 200.

[0054] The protrusion structure 100 includes a second protrusion 120, which is disposed within at least two preset intervals 210 in the mask pattern area 01; wherein the at least two preset intervals 210 are arranged in a centrally symmetrical manner.

[0055] For example, for film layers such as the cathode layer, CPL layer, and LiF layer in an OLED display panel that do not require specific patterns, a CMM (Chemical Model Array) is often used to mask the substrate, and the corresponding materials are deposited to form the aforementioned film layers. Therefore, the mask pattern area 01 of the mask plate 00 is provided with a general mask pattern, that is, multiple pattern openings 200 arranged in an array, with each pattern opening 200 spaced apart. In addition, a semi-etched area is usually provided around the edge of each pattern opening 200. The semi-etched area is set around the edge of the pattern opening 200, that is, the corresponding part of the material of the plate 00 is etched away by the etching process, forming an area with a certain etching depth but not completely etched through. In the actual vapor deposition process, the thickness of the substrate 00 causes shadows to appear at the edges of the pattern opening 200, resulting in a thinner vapor-deposited material layer at these edges. Therefore, by setting a semi-etched area around the edges of the pattern opening 200, the thickness of the substrate 00 at these edges can be reduced, thereby improving the uniformity of the deposited vapor-deposited material layer. Furthermore, the semi-etched area guides the vapor-deposited material through the pattern opening 200 more smoothly, reducing accumulation or gaps at the edges. This improves the quality of the vapor-deposited material layer, reducing defects and inhomogeneities, and ultimately increasing the yield of the display panel. In addition, the semi-etched area can also serve as an alignment mark, helping to improve the alignment accuracy between the mask and the array substrate during vapor deposition, thus ensuring the precision of the vapor-deposited film layer. It should be noted that the semi-etched area at the edge of the pattern opening 200 on the substrate 00 is not... Figure 2 , Figure 3 as well as Figure 7 As shown in the image.

[0056] A predetermined interval 210 is provided between two adjacent pattern openings 200 arranged in a certain direction. Multiple second protrusions 120 are provided in the mask pattern area 01 surrounded by the edge region 02 of the plate body 00, and each second protrusion 120 is located within at least two predetermined intervals 210 between the pattern openings 200. To ensure uniform support force of the protrusion structure 100 on the plate body 00, second protrusions 120 can be provided in at least two predetermined intervals 210 arranged centrally symmetrically in the mask pattern area 01 on the entire plate body 00. Thus, in addition to the first protrusion 110 in the edge region 02, second protrusions 120 arranged centrally symmetrically are also provided in the mask pattern area 01, which can evenly distribute the support force of the protrusion structure 100 on the plate body 00, making the distance between each position of the large-area plate body 00 and the array substrate the same, avoiding the influence of small distance differences on the vapor deposition film layer, and ensuring the manufacturing quality of the display panel.

[0057] Based on the above embodiments, optionally, see below. Figure 7 The number of second protrusions 120 located within each preset interval 210 includes at least one.

[0058] Specifically, a second protrusion 120 may or may not be provided in any of the preset intervals 210 between any two adjacent pattern openings 200, and can be set by the user according to actual needs, without limitation. Furthermore, the number of second protrusions 120 provided in each preset interval 210 can also be set by the user according to actual needs, without limitation. For example, at least one second protrusion 120 can be arranged according to the corresponding size of the preset intervals 210.

[0059] Based on the above embodiments, see below. Figure 3 and Figure 7 Optionally, the preset interval 210 includes a first preset interval 211, a second preset interval 212, or a third preset interval 213; wherein each first preset interval 211 is arranged along a first direction, each second preset interval 212 is arranged along a second direction, and each third preset interval 213 is arranged along a third direction; the second direction and the third direction intersect with the first direction respectively.

[0060] The number of second protrusions 120 located in each of the first preset intervals 211 is the same; and / or the number of second protrusions 120 located in each of the second preset intervals 212 is the same; and / or the number of second protrusions 120 located in each of the third preset intervals 213 is the same.

[0061] Specifically, among the multiple pattern openings 200 arranged in an array in the mask pattern area 01, there are preset intervals 210 arranged in different directions. These include a first preset interval 211 arranged along a first direction, a second preset interval 212 arranged along a second direction, and a third preset interval 213 arranged along a third direction, and the first direction, second direction, and third direction intersect each other. The first direction and the second direction can be mutually perpendicular; for example, the first direction can be the X direction, the second direction can be the Y direction, and the third direction can be any direction between the first and second directions; or, the first direction can also be the Y direction, the second direction can be the X direction, and the third direction can be any direction between the first and second directions, without limitation. For example, as... Figure 7 As shown, in this embodiment of the invention, the arrangement of the second protrusion 120 is described using the first direction as X, the second direction as Y, and the third direction as the direction represented by the straight line where the pattern opening 200 is arranged diagonally as an example. In the following embodiments, X represents the first direction, Y represents the second direction, and Y1 represents the third direction.

[0062] To further ensure the uniform distribution of the supporting force of the protruding structure 100 on the plate 00, a certain number of second protrusions 120 can be provided in each preset interval 210 to improve the preparation accuracy of the film layer. Preferably, the number of second protrusions 120 provided in each preset interval 210 is the same in each first preset interval 211 arranged along the first direction X, the same in each second preset interval 212 arranged along the second direction Y, and the same in each third preset interval 213 arranged along the third direction Y1. The number of second protrusions 120 in the first preset interval 211 arranged along the first direction X, the second preset interval 212 arranged along the second direction Y, and the third preset interval 213 arranged along the third direction Y1 can be the same, or they can be not completely the same or different; no limitation is imposed here.

[0063] Based on the above embodiments, see below. Figure 3 and Figure 7 Optionally, each of the second protrusions 120 located within two adjacent first preset intervals 211 is provided in a corresponding manner in the first direction X; and / or, each of the second protrusions 120 located within two adjacent second preset intervals 212 is provided in a corresponding manner in the second direction Y; and / or, each of the second protrusions 120 located within two adjacent third preset intervals 213 is provided in a corresponding manner in the third direction Y1.

[0064] Specifically, the second protrusions 120 located in the preset intervals 210 corresponding to the two opposite sides of each pattern opening 200 can be of the same number, and the same number of second protrusions 120 can be arranged one-to-one in the corresponding directions. For example, see Figure 7Each of the first preset intervals 211 located on both sides of a pattern opening 200 has three second protrusions 120. The three second protrusions 120 in adjacent first preset intervals 211 are correspondingly arranged in the first direction X, thereby applying a uniformly distributed supporting force to the plate 00, ensuring that the distance between the plate 00 and the array substrate is the same at all points, which is beneficial for improving the fabrication accuracy of the film layer. Similarly, for a mask pattern area 01 including a mask with multiple rows of pattern openings 200, each of the second preset intervals 212 between adjacent rows of pattern openings 200 has a second protrusion 120. The number of second protrusions 120 in each second preset interval 212 can be the same, and they correspond one-to-one in the second direction Y, thereby providing a uniformly distributed supporting force to the plate 00. Similarly, in the third direction Y1, each of the third preset intervals 213 can have a second protrusion 120, and the number of second protrusions 120 in each third preset interval 213 can be the same, and they correspond in the third direction Y1. This ensures that the supporting force on all positions of the entire photomask plate 00 is uniform, making the distance between the plate 00 and the array substrate the same at all points, which is beneficial to improving the fabrication accuracy of the film layer.

[0065] Based on the above embodiments, Figure 8 yes Figure 7 A schematic diagram of a cross-sectional structure along the B-B' direction. See also... Figure 7 and Figure 8 Optionally, the shape of the protrusion structure 100 includes a column or a hemisphere, and the cross-sectional shape of the protrusion structure 100 parallel to the surface of the plate 00 includes a circle.

[0066] Specifically, the protruding structure 100 can be configured as a cylinder or a hemisphere; preferably, the protruding structure 100 is configured as a cylinder, see [reference]. Figure 8 The cross-sectional shape of the protrusion structure 100 along the thickness direction of the plate 00 is rectangular, which makes the protrusion structure 100 and the array substrate have a flat contact surface. Compared with setting it as a hemisphere, it can effectively prevent the mask from being relatively displaced on the surface of the array substrate during the evaporation process, which is beneficial to improving the preparation accuracy of the film layer.

[0067] Based on the above embodiments, see Figure 1 and Figure 7 Optionally, the height of the protrusion structure 100 along the thickness direction of the plate 00 ranges from 45 to 55 μm, and the diameter of the contact surface between the protrusion structure 100 and the array substrate 000 ranges from 45 to 55 μm.

[0068] Specifically, if the height of the protrusion 100 is too small, the distance between the plate 00 and the array substrate 000 will be too small. Although they may not be in complete contact, charge accumulation may still occur, leading to electrostatic discharge and damage to the metal traces. If the height of the protrusion 100 is too large, it may cause unnecessary material loss, increasing the cost of mask fabrication. If the diameter of the contact surface between the protrusion 100 and the array substrate 000 is too small, relative displacement may occur between them during the vapor deposition process, affecting the film fabrication accuracy. If the diameter of the contact surface between the protrusion 100 and the array substrate 000 is too large, the contact area between them will be too large, making it easier for electrostatic discharge to damage the metal traces.

[0069] It should be noted that the photomask also includes a frame, which surrounds the plate 00. The frame is generally made of metal to support the plate 00 and ensure its stability during the vapor deposition process. For example, the plate 00 is often made of a material with high strength and a low coefficient of thermal expansion to maintain stability during vapor deposition; for example, the material of the plate 00 may include Invar alloy, 304 stainless steel, and 301 stainless steel. The first protrusion 110 and the second protrusion 120 can also be made of Invar alloy. Invar alloy is a magnetic metal alloy composed of iron and nickel, possessing the outstanding advantage of an extremely low coefficient of thermal expansion. It also features low thermal conductivity, high toughness, high reduction of area, good ductility, low strength and hardness, and good plasticity, making it an important structural material. By using the same material as the plate 00 for the first protrusion 110 and the second protrusion 120, they can be firmly bonded to the plate 00. Preferably, the first protrusion 110, the second protrusion 120 and the plate 00 can be made into an integral structure to ensure the stability of the mask with the protrusion structure 100 during the vapor deposition process, thereby improving the preparation accuracy of the film layer.

[0070] Based on the above embodiments, see below. Figure 5 , Figure 7 and Figure 8 Optionally, an antistatic layer 300 is provided on the side 112 of the first protrusion 110; the side 112 of the first protrusion 110 is perpendicular to the top surface 111.

[0071] Specifically, in addition to coating the top surface 111 of the first protrusion 110 with an antistatic layer 300, an antistatic material can also be coated on the side surface 112 of the first protrusion 110 to form an antistatic layer 300. That is, an antistatic layer 300 is formed on the exposed surface of the first protrusion 110 to wrap the first protrusion 110, so that the photomask can contact the surface of the array substrate 000 to be vapor-deposited through the antistatic layer 300 covering the surface of the first protrusion 110. By setting the antistatic layer 300, the surface resistance of the materials of the photomask and the array substrate can be further reduced, effectively preventing the accumulation of static electricity and preventing electrostatic damage to the metal traces of the array substrate.

[0072] Based on the above embodiments, optionally, see below. Figure 7 and Figure 8 An antistatic layer 300 is provided on the top surface 101 and the side surface 102 of the second protrusion 120; wherein, the second protrusion 120 is used to contact the array substrate 000 through the antistatic layer 300 from the top surface 101; the side surface 102 of the second protrusion 120 is perpendicular to the top surface 101.

[0073] Specifically, in addition to coating the top and side surfaces of the first protrusion 110 with an antistatic layer 300, in this embodiment, an antistatic layer 300 can also be coated on the surface of the second protrusion 120. That is, the exposed surfaces of the second protrusion 120, including the top surface 101 and the surrounding side surfaces 102, are coated with an antistatic material, thereby forming an antistatic layer 300 that wraps around the second protrusion 120. By providing the antistatic layer 300, the surface resistance of the mask and the array substrate can be further reduced, effectively preventing static electricity accumulation and preventing electrostatic damage to the metal traces of the array substrate.

[0074] Based on the above embodiments, Figure 9 yes Figure 7 A schematic diagram of another cross-sectional structure along the B-B' direction. See also... Figure 7 and Figure 9 Optionally, the antistatic layer 300 is disposed on the entire surface of the plate 00 on the first surface where the raised structure 100 is provided.

[0075] Specifically, in addition to being disposed on the surface of the raised structure 100, the antistatic layer 300 in this embodiment can also be coated with an antistatic material on the entire first surface of the plate 00 where the raised structure 100 is disposed, forming an antistatic layer 300 covering the exposed surface of the raised structure 100 and the entire first surface of the plate 00 facing the array substrate. This entire surface of the antistatic layer 300 further reduces charge accumulation, effectively preventing electrostatic discharge from damaging the metal traces of the array substrate and improving the appearance of bright lines on the display panel.

[0076] The antistatic layer 300 needs to possess certain resistivity, transparency, abrasion resistance, chemical resistance, and stability. The materials used to prepare the antistatic layer 300 can include a variety of materials, such as conductive polymer materials, carbon-based materials, metals and their alloys, metal oxide materials, composite materials, antistatic additive materials, natural materials, and certain special materials. Among these, conductive polymer materials can include polyaniline (PANI), polypyrrole (PPy), and polythiophene (PTh). Polyaniline has good conductivity and chemical stability, and its conductivity can be adjusted through doping and dedoping processes; polypyrrole has high conductivity and good environmental stability, and can be synthesized through chemical or electrochemical methods; polythiophene has excellent conductivity and transparency. Exemplarily, in this embodiment of the invention, the antistatic layer 300 includes polythiophene. Polythiophene is a common conductive polymer with good solubility, easily prepared into solutions or dispersions, and conveniently coated onto the surface of the corresponding substrate to prepare an antistatic coating. Polythiophene has permanent antistatic properties, does not migrate, and can maintain stable antistatic performance during long-term use. Furthermore, the polythiophene coating has good adhesion and is not easily peeled off.

[0077] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A photomask, characterized in that, The photomask includes a plate body, which includes a photomask pattern area and an edge area; wherein the edge area is disposed around the photomask pattern area. The mask pattern area includes a plurality of pattern openings arranged in an array; the plate body includes a first surface and a second surface disposed opposite to each other; the pattern openings are disposed through the first surface and the second surface; the first surface of the plate body is provided with a protruding structure, the protruding structure being used to contact the surface of the array substrate to be vapor-deposited; The protruding structure includes a plurality of first protrusions, the first protrusions being located in the edge region, and at least a portion of the first protrusions being disposed around the pattern opening; The first protrusion includes a top surface and a side surface connected to the top surface, wherein the top surface is used to contact the surface of the array substrate to be vapor-deposited; at least a portion of the top surface is provided with an antistatic layer, the antistatic layer being exposed on the top surface.

2. The photomask according to claim 1, characterized in that, The first protrusions in the edge area are arranged symmetrically. Preferably, there is a preset interval between two adjacent pattern openings; The protruding structure includes a second protrusion, which is disposed within at least two of the preset intervals in the mask pattern area; wherein the at least two preset intervals are arranged in a centrally symmetrical manner.

3. The photomask according to claim 2, characterized in that, The number of the second protrusions located within each of the preset intervals includes at least one.

4. The photomask according to claim 3, characterized in that, The preset interval includes a first preset interval, a second preset interval, or a third preset interval; wherein each of the first preset intervals is arranged along a first direction, each of the second preset intervals is arranged along a second direction, and each of the third preset intervals is arranged along a third direction; the second direction and the third direction intersect the first direction respectively; The number of the second protrusions located within each of the first preset intervals is the same; And / or, the number of the second protrusions located within each of the second preset intervals is the same; And / or, the number of the second protrusions located within each of the third preset intervals is the same.

5. The photomask according to claim 4, characterized in that, Each of the second protrusions located within two adjacent first preset intervals is provided in a one-to-one correspondence in the first direction; And / or, each of the second protrusions located within two adjacent second preset intervals is provided in a one-to-one correspondence in the second direction; And / or, each of the second protrusions located within two adjacent third preset intervals is provided in a corresponding manner in the third direction.

6. The photomask according to claim 2, characterized in that, The antistatic layer is provided on the side of the first protrusion; the side of the first protrusion is perpendicular to the top surface; And / or, the antistatic layer is provided on the top surface and side surface of the second protrusion; wherein, the second protrusion is used to contact the array substrate through the antistatic layer from the top surface; the side surface of the second protrusion is perpendicular to the top surface.

7. The photomask according to claim 1, characterized in that, The antistatic layer is disposed on the entire surface of the plate body on the first surface where the protruding structure is provided.

8. The photomask according to claim 6 or 7, characterized in that, The antistatic layer comprises polythiophene.

9. The photomask according to claim 1, characterized in that, The shape of the protruding structure includes a column or a hemisphere, and the cross-sectional shape of the protruding structure parallel to the surface of the plate includes a circle.

10. The photomask according to claim 9, characterized in that, The height of the protrusion structure along the thickness direction of the plate ranges from 45 to 55 μm, and the diameter of the contact surface between the protrusion structure and the array substrate ranges from 45 to 55 μm.

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