Evaporation crucible and evaporation method

Abstract

The present application relates to the technical field of evaporation technology, and discloses an evaporation crucible and an evaporation method. The crucible body of the evaporation crucible comprises a bottom wall and a side wall, the bottom wall and the side wall are arranged to form a containing cavity, the containing cavity is used for containing to-be-evaporated materials, and an opening is formed at an end of the side wall away from the bottom wall; a nozzle is arranged at the opening, a spraying cavity is formed in the nozzle, the spraying cavity is communicated with the containing cavity, and the nozzle is further provided with an evaporation opening communicated with the spraying cavity; a first evaporation sub-space and a second evaporation sub-space form an evaporation space; a functional plate module comprises at least one functional single plate, the functional single plate is arranged in the evaporation space to inhibit oxidation and adsorb oxide particles, a plurality of functional holes are arranged on the functional single plate, and the to-be-evaporated materials after being heated and evaporated can pass through the functional holes in the evaporation space, leave the evaporation crucible through the evaporation opening, and enter a vacuum coating cavity. The present application can effectively reduce the oxidation of the to-be-evaporated materials, and effectively prevent the oxidized particles from overflowing into the vacuum coating cavity.

Description

Technical Field

[0001] This invention relates to the field of vapor deposition technology, and more particularly to a vapor deposition crucible and a vapor deposition method. Background Technology

[0002] Vacuum deposition is a method in which the material to be deposited is heated and vaporized or sublimated in a deposition crucible under vacuum, thereby condensing and depositing onto the surface of a substrate material to form a thin film. Currently, vacuum deposition is widely used in the manufacture of various thin-film devices, especially organic thin-film devices. For example, in the manufacturing process of organic small-molecule devices such as OLEDs (Organic Light-Emitting Diodes), vacuum deposition is often used to prepare the various organic functional layers of the device. The preparation process is generally carried out under high vacuum (10⁻⁶ ℃). -3 Pa~10 -7 In a vapor deposition environment, organic materials placed in a crucible are heated until they melt and evaporate, thus depositing onto a substrate above the crucible. During the vapor deposition process, the material to be evaporated needs to be placed inside the crucible, which provides a stable storage space, keeping the material in a specific position during heating and evaporation, preventing it from scattering or splashing. Therefore, the vapor deposition crucible is one of the most important pieces of equipment in the vapor deposition process.

[0003] In the existing technology, during the point source metal chamber evaporation process, some magnesium metal is oxidized and converted into ash, leading to the following problems: 1. Film defects: Ash particles are deposited on the substrate surface to form micro-pits / pinholes, affecting the optical performance of the substrate (resistance / transmittance, etc.); 2. Material waste: The oxidation loss of high-purity magnesium metal directly increases production costs; 3. Equipment contamination: Some mineral components are deposited on the inner wall of the vacuum chamber, shortening the equipment maintenance cycle.

[0004] Therefore, there is an urgent need for a vapor deposition crucible and vapor deposition method to solve the above problems. Summary of the Invention

[0005] Based on the above, the purpose of this invention is to provide a vapor deposition crucible and vapor deposition method that can effectively reduce the oxidation of the material to be vapor deposited, while effectively preventing oxidized oxide particles from overflowing into the vacuum deposition chamber.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] Evaporation crucible, including:

[0008] The crucible body includes a bottom wall and a side wall surrounding the bottom wall in the circumferential direction. The bottom wall and the side wall form a receiving cavity for holding the material to be vaporized. An opening is formed at the end of the side wall away from the bottom wall.

[0009] A nozzle is disposed at the opening, and a spray chamber is formed inside the nozzle. The spray chamber is connected to the receiving cavity. The nozzle is also provided with a vapor deposition port connected to the spray chamber. The receiving cavity, except for the part containing the material to be vaporized, is a first evaporation subspace, and the spray chamber is a second evaporation subspace. The first evaporation subspace and the second evaporation subspace together form an evaporation space.

[0010] The functional board module includes at least one functional board disposed within the evaporation space. The functional board is configured to adsorb oxide particles and has a reaction barrier layer that inhibits oxidation. The functional board has multiple functional holes, through which the material to be deposited after heating and evaporation can exit the evaporation crucible through the evaporation port after being discharged from the evaporation space and enter the vacuum coating chamber.

[0011] As a preferred embodiment of the vapor deposition crucible, the functional panel is made of silicon carbide ceramic, the color of the reaction barrier layer is only on the outside of the silicon carbide ceramic, the reaction barrier layer is set as a zirconium boride coating, and the zirconium boride coating also includes yttrium aluminum garnet.

[0012] As a preferred embodiment of the vapor deposition crucible, the porosity of the functional plate of the silicon carbide ceramic is set to 55%-65%; the thickness of the reaction barrier layer is set to 50 micrometers-100 micrometers.

[0013] As a preferred embodiment of the vapor deposition crucible, the ratio of the total area of ​​the plurality of functional holes to the surface area of ​​the functional plate is set to 0.4-0.5; and / or, the functional holes are set to be circular, and the diameter of the circular functional holes is set to 2 mm-3 mm; and / or, the plurality of functional holes are uniformly arranged in a preset shape on the functional plate.

[0014] As a preferred embodiment of the vapor deposition crucible, the functional board module is detachably connected to the nozzle.

[0015] As a preferred embodiment of the vapor deposition crucible, the functional plate is arranged parallel to the bottom wall; the functional plate module is detachably connected to the side wall of the crucible body, or the functional plate module is detachably connected to the bottom wall of the crucible body, and the ratio of the distance between the functional plate and the opening to the distance between the functional plate and the bottom wall is set to 1 / 4-1 / 3.

[0016] As a preferred embodiment of the vapor deposition crucible, the functional plate module is provided with two or more functional plates arranged in parallel and spaced apart from each other, and the functional holes on adjacent functional plates at least partially overlap.

[0017] As a preferred embodiment of the vapor deposition crucible, the functional plate is rotatably disposed in the evaporation space to adjust the overlap area of ​​the functional holes of adjacent functional plates.

[0018] Evaporation deposition method, the evaporation deposition method comprising:

[0019] Place the material to be vaporized into the crucible body of any of the above-described vapor deposition crucibles;

[0020] A cover layer is laid on the surface of the vapor-deposited material, the cover layer being used to seal the material to be vapor-deposited;

[0021] Assemble the functional board module and the nozzle;

[0022] Evaporation begins.

[0023] As a preferred embodiment of the vapor deposition method, the coating layer is set as tungsten carbide powder, and the thickness of the coating layer is set to 5 mm-10 mm.

[0024] The beneficial effects of this invention are as follows:

[0025] The crucible body of this invention has a bottom wall surrounding it to form a accommodating cavity, which holds the material to be vaporized. An opening is provided at the end of the accommodating cavity away from the bottom wall to facilitate the placement of the material into the cavity. The vaporization crucible also has a nozzle located at the opening, with a spray chamber forming within it. The spray chamber communicates with the accommodating cavity, and the nozzle also has a vaporization port communicating with the spray chamber. The material to be vaporized, placed in the accommodating cavity, evaporates or sublimates upon heating and overflows through the vaporization port into the vacuum coating chamber for coating. It is worth noting that the material to be vaporized is placed on the bottom wall of the accommodating cavity; therefore, the portion of the accommodating cavity above the material is a first evaporation subspace, while the spray chamber is a second evaporation subspace. The first and second evaporation subspaces together form an evaporation space. The vapor deposition crucible is also equipped with a functional board module, which has multiple functional holes. These holes allow the material to be vaporized or sublimated after heating to pass through the vapor deposition port before overflowing. Because the functional board inhibits oxidation and adsorbs oxide particles, the vapor deposition crucible with this module effectively reduces the oxidation of the material to be vaporized and effectively prevents oxidized oxide particles from overflowing into the vacuum deposition chamber. This reduces the formation of micropits / pinholes on the substrate surface due to oxide shells, ensuring good optical performance (resistance / transmittance, etc.) of the substrate. It also reduces waste of materials such as magnesium, thus lowering production costs. Furthermore, it effectively reduces oxide particle deposition on the inner wall of the vacuum deposition chamber, reducing equipment contamination and shortening equipment maintenance cycles. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of the present invention and these drawings without creative effort.

[0027] Figure 1 This is a cross-sectional view of the vapor deposition crucible provided in a specific embodiment of the present invention;

[0028] Figure 2 This is a top view of the functional panel of the vapor deposition crucible provided in a specific embodiment of the present invention;

[0029] Figure 3 This is a cross-sectional view of a nozzle of a vapor deposition crucible provided in a specific embodiment of the present invention;

[0030] Figure 4 This is a cross-sectional view of another nozzle of the vapor deposition crucible provided in a specific embodiment of the present invention;

[0031] Figure 5 This is a cross-sectional view of the two functional plates and the spacer ring of the vapor deposition crucible provided in a specific embodiment of the present invention;

[0032] Figure 6 This is a cross-sectional view of two functional single plates equipped with support columns of the vapor deposition crucible provided in a specific embodiment of the present invention.

[0033] Figure 7 This is a cross-sectional view of the crucible body of the vapor deposition crucible provided in a specific embodiment of the present invention, with the mounting platform provided in the cross-section.

[0034] Figure 8 This is a cross-sectional view of a vapor deposition crucible provided in a specific embodiment of the present invention, which is provided with supporting legs 330 disposed on a functional single board.

[0035] Figure 9 This is a cross-sectional view of the nozzle and functional board of the vapor deposition crucible provided in a specific embodiment of the present invention.

[0036] Figure 10 This is a top view of a functional board of a vapor deposition crucible that can be used with a nozzle, provided in a specific embodiment of the present invention.

[0037] Figure 11 This is a cross-sectional view of the vapor deposition method provided in a specific embodiment of the present invention after the material to be vapor deposited and the covering layer are laid on the crucible body;

[0038] Figure 12 This is a cross-sectional view of the assembled functional board in the vapor deposition method provided in a specific embodiment of the present invention;

[0039] Figure 13 This is a cross-sectional view of the assembled nozzle in the vapor deposition method provided in a specific embodiment of the present invention.

[0040] In the picture:

[0041] 1. Material to be vapor-deposited;

[0042] 100. Crucible body; 101. Receiving cavity; 102. First evaporation subspace; 110. Bottom wall; 120. Side wall; 121. Mounting platform; 130. Opening;

[0043] 200. Nozzle; 201. Spray chamber; 202. Second evaporation subspace; 210. Evaporation port; 220. Diffusion section; 230. Assembly protrusion;

[0044] 300. Functional board module; 310. Functional board; 311. Functional hole; 312. Spacer post; 313. Clearance groove; 320. Spacer ring; 330. Support leg;

[0045] 400. Overlay. Detailed Implementation

[0046] Embodiments of the present invention are described in detail below. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0047] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The terms "first position" and "second position" refer to two different positions.

[0048] Unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing" should be interpreted broadly. For example, they can refer to fixed connections or detachable connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and connections within two components or interactions between two components. Those skilled in the art can understand the specific meaning of these terms in this invention based on the specific circumstances.

[0049] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0050] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0051] like Figures 1-10 As shown, this embodiment provides a vapor deposition crucible, which includes a crucible body 100, a nozzle 200, and a functional board module 300. The crucible body 100 includes a bottom wall 110 and a side wall 120 surrounding the bottom wall 110. The bottom wall 110 and the side wall 120 form a receiving cavity 101 for holding the material to be vapor-deposited 1. An opening 130 is formed at the end of the side wall 120 away from the bottom wall 110. The nozzle 200 is disposed in the opening 130, and a spraying cavity 201 is formed inside the nozzle 200. The spraying cavity 201 communicates with the receiving cavity 101. The nozzle 200 is also provided with a vapor deposition port 210 communicating with the spraying cavity 201. In addition to holding the material to be vapor-deposited 1, the receiving cavity 101 also provides a vapor deposition port 210 communicating with the spraying cavity 201. The portion of the material to be vaporized 1 is the first evaporation subspace 102, and the spray chamber 201 is the second evaporation subspace 202. The first evaporation subspace 102 and the second evaporation subspace 202 together form an evaporation space. The functional board module 300 includes at least one functional board 310, which is disposed in the evaporation space. The functional board 310 is configured to adsorb oxide particles and is provided with a reaction barrier layer that can inhibit oxidation. The functional board 310 is provided with multiple functional holes 311. The material to be vaporized 1 after being heated and evaporated can pass through the functional holes 311 in the evaporation space and leave the vaporization crucible through the vaporization port 210 to enter the vacuum coating chamber.

[0052] The bottom wall 110 of the crucible body 100 surrounds the circumference of the bottom wall 110 to form a receiving cavity 101, which is used to hold the material to be vaporized 1. At the same time, an opening 130 is provided at the end of the receiving cavity 101 away from the bottom wall 110 to facilitate the placement of the material to be vaporized 1 into the receiving cavity 101. The vaporization crucible is also provided with a nozzle 200 located at the opening 130. A spraying cavity 201 is formed in the nozzle 200, which is connected to the receiving cavity 101. The nozzle 200 is also provided with a vaporization port 210 connected to the spraying cavity 201. After the material to be vaporized 1 placed in the receiving cavity 101 is heated, evaporated, vaporized, or sublimated, it overflows through the vaporization port 210 into the vacuum coating chamber for coating. It is worth noting that the material to be vaporized 1 is placed on the bottom wall 110 of the accommodating cavity 101. Therefore, the upper part of the accommodating cavity 101 containing the material to be vaporized 1 is the first evaporation subspace 102, while the spray cavity 201 is the second evaporation subspace 202. The first evaporation subspace 102 and the second evaporation subspace 202 together form an evaporation space. The vaporization crucible is also provided with a functional board module 300 including a functional board 310. By providing multiple functional holes 311 on the functional board 310, the material to be vaporized 1 after being heated, vaporized, or sublimated can still pass through the functional holes 311 before overflowing from the vaporization port 210. Since the functional board 310 has the function of inhibiting oxidation and adsorbing oxide particles, the evaporation crucible equipped with the functional board module 300 can effectively reduce the oxidation of the material to be evaporated 1, and effectively prevent the oxidized oxide particles from overflowing into the vacuum coating chamber, thereby reducing the formation of micropits / pinholes on the substrate surface by the oxide shell, ensuring good optical performance (resistance / transmittance, etc.) of the substrate; at the same time, it reduces the waste of the material to be evaporated 1, such as magnesium, to reduce production costs; in addition, it effectively reduces the deposition of oxide particles on the inner wall of the vacuum coating chamber, reduces equipment contamination, and shortens the equipment maintenance cycle.

[0053] Understandably, vapor deposition typically requires heating the material to be deposited (1) to its evaporation temperature. Therefore, the vapor deposition crucible must be able to withstand high temperatures without deformation, melting, or cracking to ensure the smooth progress of the vapor deposition process. Simultaneously, the vapor deposition crucible must avoid chemical reactions with the material to be deposited (1), preventing components of the crucible material from contaminating the material and thus ensuring the purity of the deposited film. For example, the crucible body 100 and the nozzle can be made of boron nitride, quartz, or platinum. Boron nitride possesses advantages such as high melting point, good thermal conductivity, good insulation, high bending strength, good thermal shock resistance, and chemical corrosion resistance. It also maintains stable high-frequency dielectric properties at high temperatures and has excellent machinability. Furthermore, the sidewalls 120 and bottom wall 110 of the crucible body 100 are made of the same material and integrally molded, resulting in higher strength for the vapor deposition crucible.

[0054] Specifically, the nozzle 200 includes at least a structure with one end larger than the other. The end with the larger cross-sectional area is detachably connected to both the nozzle 200 and the crucible body 100, while the end with the smaller cross-sectional area serves as a vapor deposition port 210 to control the overflow direction and flow rate of the vapor from the material to be vaporized 1. The detachable connection also facilitates the placement of the material to be vaporized 1 into the receiving cavity 101 and the arrangement of the functional board module 300 within the evaporation space. In other embodiments, such as... Figure 3 As shown, a diffusion section 220 is provided at the end of the vapor deposition port 210 of the nozzle 200 away from the crucible body 100. The cross-section of the diffusion section 220 gradually increases along the end away from the vapor deposition port 210, which is used to guide the vapor of the material to be vaporized 1 overflowing from the vapor deposition port 210 and increase the diffusion range of the vapor of the material to be vaporized 1.

[0055] Furthermore, in a shape structure where one end is larger than the other, the inclination of the inner wall of the nozzle 200 can remain constant or can be configured to vary in segments. For example, as shown... Figure 4 As shown, the inner wall is divided into two sections according to the degree of inclination, with a greater degree of inclination at the end near the vapor deposition port 210. This arrangement allows the inner wall of the nozzle 200 at the end near the crucible body 100 to better concentrate the vapor of the material to be vaporized 1, facilitating the smoother entry of the vapor of the material to be vaporized 1 placed in the first evaporation sub-space 102 into the second evaporation sub-space 202; the inner wall of the nozzle 200 at the end near the vapor deposition port 210 also has a better guiding effect on the vapor of the material to be vaporized 1, facilitating the smoother flow of the vapor of the material to be vaporized 1 placed in the second evaporation sub-space 202 towards the vapor deposition port 210.

[0056] To achieve the connection between the nozzle 200 and the crucible body 100, the end of the nozzle 200 away from the vapor deposition port 210 extends into the crucible body 100 and is sealed to the inner side wall 120 of the crucible body 100. In this case, the vapor of the material to be vaporized 1 needs to pass through the connection between the nozzle and the crucible body 100 before entering the nozzle, which can easily lead to the accumulation or overflow of the material to be vaporized 1 at the connection between the nozzle and the crucible body 100. Therefore, in this embodiment, as... Figure 1As shown, the end of the nozzle 200 furthest from the vapor deposition port 210 can be positioned to cover the outside of the opening 130 of the crucible body 100. This ensures that the vapor of the material to be vaporized 1 completely detaches from the side wall 120 of the crucible body 100 before entering the nozzle 200, and is directly guided by the inner wall of the nozzle 200 to the vapor deposition port 210. This results in smoother vapor flow of the material to be vaporized 1. Simultaneously, the connection point between the nozzle and the crucible body 100 avoids contact with a large amount of vapor from the material to be vaporized 1, effectively reducing the overflow of vapor from the connection point and preventing material waste. Furthermore, it effectively reduces the accumulation and deposition of vapor at the connection point. Optionally, the nozzle 200 and the crucible body 100 can be detachably connected by a threaded connection, making the connection more reliable and disassembly more convenient.

[0057] In this embodiment, the functional plate 310 is made of silicon carbide ceramic. Silicon carbide ceramic, as the base layer of the functional plate 310, has advantages such as high temperature resistance (melting point up to 2700℃), good thermal stability, corrosion resistance, high thermal conductivity, and low coefficient of expansion. This allows the functional plate 310 to be stably placed in the evaporation space without reacting with the material to be deposited 1. Simultaneously, the functional plate 310 made of silicon carbide ceramic has a honeycomb porous structure, which can be used to adsorb the magnesium oxide nanoparticles generated in the early stages, effectively preventing the spillage of magnesium oxide particles. Preferably, the silicon carbide ceramic is arranged in a gradient, that is, the porosity is higher on the outer periphery of the functional plate 310 to adsorb magnesium oxide nanoparticles, while the porosity is lower on the inner side to ensure the structural strength of the functional plate 310.

[0058] Optionally, the porosity of the silicon carbide ceramic functional plate 310 is set to 55%-65%. Too low a porosity results in fewer pores and smaller pore volume, leading to a correspondingly smaller specific surface area, which significantly reduces the adsorption capacity of the functional plate 310. Furthermore, too low a porosity also causes slow adsorption rates, low efficiency, and easy clogging. Too high a porosity affects the strength of the functional plate 310, reduces adsorption selectivity, and affects the overflow of the material to be vaporized 1. Additionally, excessive porosity reduces adsorption reliability. For example, the porosity of the silicon carbide ceramic functional plate 310 is set to 60%. In other embodiments, it can also be set to 56%, 57%, 58%, 59%, 61%, 62%, 63%, 64%, or other values ​​that meet the requirements; no specific limitation is made here.

[0059] Specifically, a reaction barrier layer is provided on the outer surface of the functional unit to suppress the oxidation of the material 1 to be vapor-deposited. In this embodiment, the reaction barrier layer is a zirconium boride coating, which also includes yttrium aluminum garnet. Oxygen vacancies in the yttrium aluminum garnet lattice preferentially combine with oxygen atoms in magnesium oxide, thereby enabling further growth of magnesium oxide. The zirconium boride reacts with magnesium vapor to form a passivation layer, preventing further oxidation diffusion. In other words, the reaction barrier layer as a whole can form an "oxygen trap" in the high-temperature environment of vacuum deposition, thereby suppressing oxidation. Furthermore, the zirconium boride coating and yttrium aluminum garnet also possess advantages such as high melting point, high thermal conductivity, and high chemical stability, making them suitable for vacuum and high-temperature deposition environments.

[0060] For example, the thickness of the reaction barrier layer is set to 50-100 micrometers. An excessively thick reaction barrier layer will increase or decrease heat transfer resistance, affecting heat transfer and evaporation efficiency. Furthermore, an excessively thick reaction barrier layer also presents challenges in processing, high complexity, and susceptibility to cracking or peeling. An excessively thin reaction barrier layer will result in poor inhibition of oxidation and adsorption of oxide particles. For example, the thickness of the reaction barrier layer is set to 60, 70, 80, or 90 micrometers, or other values ​​that meet the requirements; no specific limitation is made here.

[0061] As an alternative solution for vapor deposition crucibles, such as Figure 2 As shown, the ratio of the total area of ​​the multiple functional holes 311 to the surface area of ​​the functional board 310 is set to 0.4-0.5. It is understood that the functional holes 311 are designed so that the heated material to be deposited 1 passes through and overflows from the nozzle 200 to deposit the substrate. Therefore, if the ratio of the total area of ​​the multiple functional holes 311 to the surface area of ​​the functional board 310 is too small, it will reduce the overflow of steam affecting the material to be deposited 1, thereby reducing the evaporation rate, prolonging the evaporation time, and increasing the equipment load. If the ratio is too large, it will not reduce the steam area, reduce steam fluctuations, or stabilize the evaporation rate. For example, the ratio of the total area of ​​the multiple functional holes 311 to the surface area of ​​the functional board 310 can also be set to 0.41, 0.42, 0.43, 0.44, 0.45, 0.46, 0.47, 0.48, 0.49, or other values ​​that meet the requirements; no specific limitation is made here.

[0062] Optionally, the functional hole 311 can be circular. A circular functional hole 311 is easier to manufacture, and it has fewer dead angles on its inner wall, effectively reducing the risk of clogging and minimizing downtime for cleaning. For example, the diameter of the circular functional hole 311 can be set to 2-3 mm, which allows for the passage of vapor from the material to be deposited while minimizing the risk of clogging. The diameter of the circular functional hole 311 can also be set to 2.1 mm, 2.2 mm, 2.3 mm, 2.4 mm, 2.5 mm, 2.6 mm, 2.7 mm, 2.8 mm, 2.9 mm, or other suitable values; no specific limitation is made here.

[0063] It is worth noting that the shape and size of the multiple functional holes 311 on the functional board 310 can be set to be different, and the density of functional holes 311 at different positions can also be set to be different. Those skilled in the art can set it according to actual needs. Furthermore, the multiple functional holes 311 are evenly arranged in a preset shape on the functional board. The preset shape can be an axisymmetric shape, a centrally symmetric shape, a matrix shape, etc. The axisymmetric shape can be an isosceles triangle, a rectangle, etc., and the centrally symmetric shape can be a parallelogram, a square, etc. In this embodiment, the multiple functional holes 311 are circular, and an appropriate number of functional holes 311 are also arranged along a square matrix inside the circle.

[0064] As an alternative solution for vapor deposition crucibles, such as Figure 1 As shown, the functional plate 310 is arranged parallel to the bottom wall 110. This arrangement ensures consistency in the distance between the functional plate 310 and the material 1 to be vapor-deposited, guaranteeing a more consistent effect in inhibiting oxidation and adsorbing oxide particles, while also ensuring more uniform deposition of the material 1 through the functional holes 311. For example, the bottom wall 110 is circular, and the side wall 120 is arranged circumferentially along the circular bottom wall 110, meaning the accommodating cavity 101 is a cylindrical orifice space. Correspondingly, the opening 130, nozzle 200, and functional plate 310 are also circular with a matching diameter, wherein the vapor deposition port 210 of the nozzle 200 is coaxially arranged with the opening 130. The circular vapor deposition crucible structure has higher stability, more uniform heat distribution, and facilitates processing, manufacturing, clamping, and transport.

[0065] In this embodiment, the functional board module 300 may also be provided with two or more functional boards 310 arranged in parallel and spaced apart. By increasing the number of functional boards 310, the area used to suppress oxidation and adsorb oxide particles can be increased, thereby improving the effect of suppressing oxidation and adsorbing oxide particles. It is worth noting that the functional holes 311 on adjacent functional boards 310 overlap at least partially to ensure the steam pass-through rate of the material 1 to be vaporized.

[0066] For example, to achieve mutual positioning of two or more functional boards 310, such as Figure 5 As shown, the functional board module 300 also includes a spacer ring 320. The shape and size of the spacer ring 320 are adapted to the functional board 310, so that it can both support adjacent functional boards 310 and affect the function of the functional board 310. In the spacer ring 320 scheme, a spacer ring 320 needs to be set between every two adjacent functional boards 310, which requires a large number of components.

[0067] In other embodiments, such as Figure 6 As shown, the functional board module 300 includes three or more spacer posts 312. These spacer posts 312 are of equal length and are integrally formed with the functional board 310, meaning adjacent functional boards 310 are supported and positioned by the spacer posts 312. It is worth noting that this solution is achieved by changing the shape of the functional board 310 itself, eliminating the need for additional components and reducing the number of parts. Furthermore, since the spacer posts 312 are integrally formed with the functional board 310, they also have the function of inhibiting oxidation and adsorbing oxide particles, thus further enhancing the function of the vapor deposition crucible in inhibiting oxidation and adsorbing oxide particles. Specifically, in the solution where the functional board 310 is mounted via a mounting platform 121 on the side wall 120, the spacer post 312 of the lowest functional board 310 with the spacer posts 312 can directly abut against the mounting platform 121. Optionally, the thickness of the spacer ring 320 and the length of the spacer posts 312 can be selected by those skilled in the art according to actual needs, and are not specifically limited here.

[0068] Preferably, to change the throughput of the vapor of the material to be deposited 1 in the multiple functional plates 310, at least one functional plate 310 is rotatably disposed in the evaporation space to adjust the overlap area of ​​the functional holes 311 of adjacent functional plates 310. It is understood that, to enable the functional plate 310 to rotate and adjust the overlap area of ​​the functional holes 311 of adjacent functional plates 310, the functional plate 310 is preferably circular, and the multiple functional holes 311 on the functional plate 310 are distributed in a centrally symmetrical shape.

[0069] As an optional solution for the vapor deposition crucible, to enable the functional board 310 to be installed in the evaporation space, the functional board module 300 is detachably mounted on the crucible body 100. This detachability facilitates the disassembly and cleaning of the functional board 310, and also facilitates the placement of the material to be vapor-deposited 1 into the receiving cavity 101. Optionally, the functional board can be detachably connected to the side wall 120 of the crucible body 100, or the functional board can also be detachably connected to the bottom wall 110 of the crucible body 100.

[0070] It is worth noting that the functional board 310 is configured to be adapted to the cross-section of the board installed in the evaporation space. The adaptation includes shape adaptation and size adaptation. The purpose is to ensure that the material to be vaporized 1 must pass through the functional hole 311 of the functional board 310 before overflowing from the vaporization port 210, so as to prevent the material to be vaporized 1 from overflowing from the circumferential outer side of the functional board 310.

[0071] To enable the functional board to be detached from the side wall 120 of the crucible body 100, in one embodiment, such as Figure 1 As shown, a mounting platform 121 extending towards the receiving cavity 101 is provided on the inner side of the side wall 120 connecting the crucible body 100. The functional board 310 is placed on the surface of the mounting platform 121 away from the bottom wall 110. This connection method has a simple structure and is easy to install. The mounting platform 121 can circumferentially surround the side wall 120, making the support more reliable; as shown... Figure 7 As shown, the mounting platform 121 can also be segmented, with at least three segments evenly spaced along the circumference of the side wall 120. This allows for the installation of the functional panel 310 while minimizing obstruction of its surface, ensuring sufficient area for the functional panel 310 to inhibit oxidation and adsorb oxide particles. The mounting platform 121 is perpendicular to the side wall 120, improving the reliability of its support for the functional panel 310. The mounting platform 121 is integrally formed with the side wall 120.

[0072] To enable the functional board to be detached from the bottom wall 110 of the crucible body 100, such as Figure 8As shown, the functional board module 300 also includes support legs 330, which are disposed on the functional board 310. When the functional board 310 is placed inside the crucible body 100, the support legs 330 can abut against the bottom wall 110 of the crucible body 100, thereby supporting the functional board 310. It is understood that at least three support legs 330 are provided. This arrangement can be adapted to the crucible body 100 without the need to manufacture a crucible body 100 with a special structure separately, resulting in lower replacement costs. However, in the above arrangement, the support legs 330 extend at least partially into the material to be evaporated, which may damage the integrity of the material to be evaporated 1 already laid in the accommodating cavity 101. To avoid this problem, the support legs 330 can also be integrally formed with the bottom wall 110. In this case, when the material to be evaporated 1 is laid, the material to be evaporated 1 will automatically be located around the support legs 330, so the assembly of the functional board 310 will not affect the material to be evaporated that has already been laid. When the support leg 330 is disposed on the bottom wall 110, the height of the support leg 330 should be higher than the upper limit of the accommodating cavity 101 that needs to hold the material 1 to be vaporized, that is, the support leg 330 extends at least to the first evaporation subspace 102. When the support leg 330 is disposed on either the bottom wall 110 or the functional board 310, a positioning groove is correspondingly provided on the other side for cooperating with the support leg 330 to achieve positioning.

[0073] In other embodiments, the functional board module 300 can also be configured to be detachably connected to the nozzle 200. For example, the functional board module 300 is further provided with a hook, which is disposed on the inner wall of either the functional board 310 or the nozzle 200, while the other is provided with a hook ring that can cooperate with the hook. The detachable connection between the functional board 310 and the nozzle 200 is achieved through the cooperation of the hook and the hook ring. It is understood that if the functional board 310 is placed in the first evaporation subspace 102, the length of the hook or hook ring can be adjusted appropriately.

[0074] In this embodiment, as Figure 9 As shown, at least two mounting protrusions 230 are circumferentially spaced on the inner wall of the nozzle 200, correspondingly, as Figure 10As shown, the functional board 310 has a circumferentially provided clearance groove 313 corresponding to the mounting protrusion 230. During assembly, the clearance groove 313 can be aligned with the mounting protrusion 230 and pass through the mounting protrusion 230. Then, by rotating the functional board 310 and the nozzle 200 relative to each other, the clearance groove 313 and the mounting protrusion 230 are offset from each other circumferentially. At this time, the mounting protrusion 230 can be used to support the functional board 310, and the functional board 310 is fixed in the second evaporation subspace 202 inside the suction nozzle. This connection method is more reliable than the connection method of hook and hook ring. In addition, due to the complex structure of hook and hook ring, there is a distance between the vapor of the material to be vaporized 1 at the connection position, which leads to deposition, material waste, and in severe cases, affects the vaporization effect.

[0075] It is worth noting that the functional board 310 can be located in either the first evaporation subspace 102 or the second evaporation subspace 202. Those skilled in the art can configure it according to actual needs, and no specific limitations are made here. Specifically, for example... Figure 1 As shown, the functional board 310 is preferably set inside the first evaporation subspace 102. On the one hand, the inner diameter of the second evaporation subspace 202 is smaller than that of the second evaporation subspace 202, and the diameter of the functional board 310 is also smaller, resulting in a smaller area for inhibiting oxidation and adsorbing oxide particles. On the other hand, the area of ​​the first evaporation subspace 102 is larger, making it easier to set the functional board 310.

[0076] Furthermore, when the functional plate 310 is disposed within the first evaporation subspace 102, the ratio of the distance between the functional plate 310 and the opening 130 to the distance between the functional plate 310 and the bottom wall 110 is set to 1 / 4-1 / 3. This setting provides sufficient space for the installation of the functional plate 310 and the heating vaporization or sublimation of the material to be vaporized 1, preventing the material to be vaporized 1 from contacting the functional plate 310 before it is fully vaporized or sublimated; at the same time, it prevents the functional plate 310 from being placed too close to the opening 130, which would affect the installation of the nozzle 200.

[0077] This embodiment also discloses a vapor deposition method, the vapor deposition method comprising: depositing vapor onto any of the above schemes and as shown in the example... Figures 1-10 The material to be vaporized 1 is placed inside the crucible body 100 of the vapor deposition crucible shown; a covering layer 400 is laid on the surface of the vapor deposition material, and the covering layer 400 is used to seal the material to be vapor deposition 1; the functional board module 300 and the nozzle 200 are assembled; vapor deposition begins.

[0078] The vapor deposition crucible used in the above-described vapor deposition method has the function of inhibiting oxidation and adsorbing oxide particles. Simultaneously, a covering layer 400 is laid on the surface of the vapor deposition material. The covering layer 400 is used to seal the material to be vapor deposited 1, reducing the contact between the material to be vapor deposited 1 and oxygen before vacuuming. In other words, the above vapor deposition scheme can reduce the oxidation and overflow of the material to be vapor deposited 1 through both chemical bonding and physical isolation, effectively reducing the impact of oxide particles on the vapor deposition effect and ensuring the quality of the coating.

[0079] Specifically, the covering layer 400 is set as tungsten carbide powder, which can be tungsten carbide (WC) powder. It has the characteristics of high melting point, good chemical stability and good thermal conductivity. It can act as a physical sealing layer to prevent the material to be vaporized 1 from contacting oxygen and being oxidized, and it will not affect the normal vaporization of the material to be vaporized 1.

[0080] Furthermore, the thickness of the cover layer 400 is set to 5 mm-10 mm. This thickness must be designed to provide a certain degree of sealing for the material to be deposited 1, while also ensuring that the material to be deposited 1 can penetrate the cover layer 400 and smoothly enter the first evaporation subspace 102 after being heated. It must also consider the amount of material to be deposited 1, cost, and the ease of application. For example, the cover layer 400 can be laid to a thickness of 6 mm, 7 mm, 8 mm, 9 mm, or other thicknesses that meet the specified requirements. Additionally, the particle size selection of the tungsten carbide powder also needs to consider the overall sealing effect under the preset thickness, as well as cost. Those skilled in the art can set the above parameters according to actual conditions, and no specific limitations are made here. It is worth noting that the application of the cover layer 400 needs to be as uniform as possible to ensure consistent sealing of the material to be deposited 1 at various points on the bottom wall 110.

[0081] Optionally, the cover layer 400 can be laid manually or mechanically. When laid manually, the required weight of tungsten carbide powder can be calculated based on the desired thickness, and then the weighed tungsten carbide powder is laid, which helps ensure the correct thickness. Mechanical laying increases automation and is more accurate and efficient than manual laying.

[0082] It is understandable that vapor deposition requires vapor deposition equipment, which has a vacuum deposition chamber. A heating device is installed inside the vacuum deposition chamber, and the vapor deposition crucible can be placed inside the chamber. The heating device heats the vapor deposition crucible, and the substrate to be deposited is also placed above the vapor deposition crucible within the vacuum deposition chamber. The specific operating steps using the above-mentioned vapor deposition crucible and vapor deposition method are as follows: First, the material to be vapor-deposited 1 is placed inside the crucible body 100 of the vapor deposition crucible; then, a covering layer 400 is laid on top of the material to be vapor-deposited 1. After laying, as shown... Figure 11As shown; then place the functional board 310 on the mounting platform 121 of the crucible body 100, as follows. Figure 12 As shown; then the nozzle 200 is assembled with the crucible body 100, as follows. Figure 13 As shown; finally, a vacuum will be drawn and heated to perform the coating.

[0083] The above description is only a preferred embodiment of the present invention. For those skilled in the art, there will be changes in the specific implementation and application scope based on the ideas of the present invention. The content of this specification should not be construed as a limitation of the present invention.

Claims

1. A vapor deposition crucible, characterized in that, include: The crucible body (100) includes a bottom wall (110) and a side wall (120) surrounding the bottom wall (110) in the circumference. The bottom wall (110) and the side wall (120) form a receiving cavity (101) for holding the material (1) to be vaporized. An opening (130) is formed at the end of the side wall (120) away from the bottom wall (110). A nozzle (200) is disposed in the opening (130), and a spray chamber (201) is formed inside the nozzle (200). The spray chamber (201) is connected to the accommodating cavity (101). The nozzle (200) is also provided with a vapor deposition port (210) connected to the spray chamber (201). The accommodating cavity (101) is a first evaporation subspace (102) except for the part containing the material to be vaporized (1). The spray chamber (201) is a second evaporation subspace (202). The first evaporation subspace (102) and the second evaporation subspace (202) together form an evaporation space. The functional board module (300) includes at least one functional board (310), which is disposed in the evaporation space. The functional board (310) is configured to adsorb oxide particles and is provided with a reaction barrier layer that can inhibit oxidation. The functional board (310) is provided with a plurality of functional holes (311). The material to be deposited (1) after being heated and evaporated can pass through the functional holes (311) in the evaporation space and leave the evaporation crucible through the evaporation port (210) to enter the vacuum coating chamber.

2. The vapor deposition crucible according to claim 1, characterized in that, The functional board (310) is made of silicon carbide ceramic, and the reaction barrier layer is disposed on the outside of the silicon carbide ceramic. The reaction barrier layer is a zirconium boride coating, and the zirconium boride coating also includes yttrium aluminum garnet.

3. The vapor deposition crucible according to claim 2, characterized in that, The porosity of the functional single plate (310) of silicon carbide ceramic is set to 55%-65%; the thickness of the reaction barrier layer is set to 50 micrometers-100 micrometers.

4. The vapor deposition crucible according to claim 1, characterized in that, The ratio of the total area of ​​the plurality of functional holes (311) to the surface area of ​​the functional board (310) is set to 0.4-0.5; and / or, the functional holes (311) are set to be circular, and the diameter of the circular functional holes (311) is set to 2 mm-3 mm; and / or, the plurality of functional holes (311) are evenly arranged in a preset shape on the functional board.

5. The vapor deposition crucible according to claim 1, characterized in that, The functional board module (300) is detachably connected to the nozzle (200).

6. The vapor deposition crucible according to claim 1, characterized in that, The functional board (310) is arranged parallel to the bottom wall (110); the functional board module (300) is detachably connected to the side wall (120) of the crucible body (100), or the functional board module (300) is detachably connected to the bottom wall (110) of the crucible body (100); the ratio of the distance between the functional board (310) and the opening (130) to the distance between the functional board (310) and the bottom wall (110) is set to 1 / 4-1 / 3.

7. The vapor deposition crucible according to claim 1, characterized in that, The functional board module (300) is provided with two or more functional boards (310) arranged in parallel and spaced apart from each other, and the functional holes (311) on adjacent functional boards (310) overlap at least partially.

8. The vapor deposition crucible according to claim 7, characterized in that, The functional board (310) is rotatably disposed in the evaporation space to adjust the overlap area of ​​the functional holes (311) of adjacent functional boards (310).

9. A vapor deposition method, characterized in that, The vapor deposition method includes: Place the material to be vaporized (1) into the crucible body (100) of the vapor deposition crucible as described in any one of claims 1-8; A cover layer (400) is laid on the surface of the vapor deposition material, the cover layer (400) being used to seal the material to be vapor deposited (1); Assemble the functional board module (300) and the nozzle (200); Evaporation begins.

10. The vapor deposition method according to claim 9, characterized in that, The cover layer (400) is made of tungsten carbide powder, and the thickness of the cover layer (400) is set to 5 mm-10 mm.

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