A hot trap device and thin film deposition apparatus

Abstract

The application provides a heat trap device and a thin film deposition equipment, the heat trap device comprises a rack and a heat trap, the rack is located outside a vacuum pump, and a mounting surface of the rack is located above the vacuum pump; the heat trap is detachably mounted on the mounting surface, one end of the heat trap is connected with a process cavity through a first pipeline, the other end of the heat trap is connected with the vacuum pump through a second pipeline, a first valve is arranged on the first pipeline, and a second valve is arranged on the second pipeline. The heat trap is transferred from the narrow space of the machine end to the Sub-Fab layer, and the vertical space reuse layout mode of the rack is used to cross above the vacuum pump for overhead installation, so that the heat trap does not need to occupy the plane arrangement space alone, the equipment arrangement density of the factory area is optimized, and the site construction cost is saved; meanwhile, after the heat trap is separated from the narrow space of the machine end, the disassembly, transportation and cleaning and maintenance can be carried out in the open space, the operation difficulty is greatly reduced, the shutdown time of single maintenance can be significantly shortened, the maintenance efficiency is improved, and the machine operation rate is improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and more particularly to a heat trap device and a thin film deposition apparatus. Background Technology

[0002] In the field of semiconductor thin film deposition manufacturing, atomic layer deposition (ALD) technology, with its excellent step coverage capability and sub-nanometer film thickness control precision, has become a key process for fabricating high-dielectric-constant dielectric layers and metal electrodes in advanced dynamic random access memory (DRAM) manufacturing processes. As DRAM memory cells continue to shrink, the process requirements for controlling film uniformity, density, and particulate contamination are becoming increasingly stringent. This directly prompts semiconductor manufacturers to place higher demands on the uptime of process equipment.

[0003] In the exhaust gas treatment system of ALD equipment, in order to capture unreacted precursors and reaction byproducts and prevent them from entering and damaging the vacuum pump unit, a hot trap device is usually installed on the exhaust line between the process chamber and the vacuum pump.

[0004] Currently, due to limitations in integrated design and the principle of minimizing the gas extraction path, most heat traps in existing ALD (Alternating Current Discharge) equipment are directly located at the machine end. However, with the increasing number of peripheral supporting equipment (such as multi-channel gas pipelines, RF matching units, temperature control and cooling units, etc.), the available operating space at the machine end has become extremely narrow. Furthermore, to meet high-temperature resistance and sufficient collection efficiency, the heat trap is often designed as a bulky and heavy structure. These shortcomings make it extremely difficult for maintenance personnel to disassemble, move, and reinstall the heat trap in a space-constrained environment during subsequent maintenance. This not only consumes a significant amount of manpower and time but also significantly prolongs the non-productive downtime of the equipment, severely restricting further improvements in machine uptime. Summary of the Invention

[0005] This invention provides a heat trap device and a thin film deposition equipment, which solves the problems of difficult maintenance and low machine uptime of existing heat trap devices.

[0006] This invention provides a heat trap device, comprising: The frame is located outside the vacuum pump, and its mounting surface is located above the vacuum pump; A heat trap is detachably mounted on the mounting surface. One end of the heat trap is connected to the process chamber through a first pipe, and the other end is connected to the vacuum pump through a second pipe. A first valve is provided on the first pipe, and a second valve is provided on the second pipe.

[0007] In the heat trap device provided by the present invention, the heat trap device further includes a bypass pipe, one end of which is connected to the first pipe and the other end of which is connected to the second pipe, and a bypass valve is provided on the bypass pipe.

[0008] In the heat trap device provided by the present invention, the heat trap device further includes a water cooling component, which is installed on the outside of the heat trap to dissipate heat from the heat trap.

[0009] In the heat trap device provided by the present invention, the water cooling component includes a water outlet pipe, which is connected to the water outlet of the heat trap. The water outlet pipe is equipped with a flow meter, which is signal-connected to the machine controller.

[0010] In the heat trap device provided by the present invention, the water cooling component further includes a water inlet pipe, which is connected to the water inlet of the heat trap. The water inlet pipe is equipped with a control valve, which is used to automatically control the opening and closing of the water inlet pipe according to the detection result of the flow meter.

[0011] In the heat trap device provided by the present invention, the water inlet pipe is also provided with a manual valve for manually controlling the opening and closing of the water inlet pipe.

[0012] In the heat trap device provided by the present invention, an installation space is provided between the mounting surface and the top of the vacuum pump, and a liquid receiving tray is installed in the installation space, the liquid receiving tray being located below the water cooling assembly.

[0013] In the heat trap device provided by the present invention, a leakage detection sensor is fixedly installed in the liquid receiving tray, and the leakage detection sensor is electrically connected to the machine controller.

[0014] In the heat trap device provided by the present invention, the heat trap device further includes a heat trap controller, which is mounted on the mounting surface.

[0015] The present invention also provides a thin film deposition apparatus, comprising: Process chamber and vacuum pump; A heat trap device, wherein one end of the heat trap is connected to the process chamber through the first pipe, and the other end is connected to the vacuum pump through the second pipe.

[0016] This application utilizes a vertical space reuse layout by transferring the heat trap from the confined space of the machine end to the Sub-Fab layer and using the rack to span above the vacuum pump for overhead installation. This eliminates the need for the heat trap to occupy separate floor space, optimizes the equipment layout density in the plant area, and saves on site construction costs. At the same time, after the heat trap is removed from the confined space of the machine end, disassembly, transportation, and cleaning maintenance can all be carried out in an open space, greatly reducing the difficulty of operation, significantly shortening the downtime for each maintenance, improving maintenance efficiency, and thus increasing machine uptime. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the following description of the embodiments will be briefly introduced. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 A diagram of the existing heat trap installation structure; Figure 2 This is a structural diagram of the heat trap device, vacuum pump, and process chamber in an embodiment of the present invention; Figure 3 This is a diagram showing the installation structure of the heat trap and vacuum pump in an embodiment of the present invention; Figure 4 This is a structural diagram of the heat trap device during normal operation in an embodiment of the present invention; Figure 5 This is a structural diagram of the heat trap during maintenance in an embodiment of the present invention.

[0019] The labels for the attached figures are as follows: 1. Heat trap device; 11. Frame; 111. Reinforcing rib; 12. Heat trap; 121. Heat trap controller; 13. First pipe; 14. Second pipe; 15. First valve; 16. Second valve; 17. Bypass pipe; 18. Bypass valve; 191. Water outlet pipe; 192. Water inlet pipe; 193. Flow meter; 194. Control valve; 195. Manual valve; 196. Liquid receiving tray; 197. Leakage detection sensor; 2. Vacuum pump; 3. Process chamber; 4. Exhaust gas treatment system. Detailed Implementation

[0020] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0021] Reference Figures 2 to 5The diagram illustrates an embodiment of the heat trap device 1 and thin film deposition equipment of the present invention. The heat trap device 1 is disposed between the process chamber 3 and the vacuum pump 2 of the semiconductor thin film deposition equipment, and is used to capture and decompose the exhaust gas generated within the process chamber 3 to protect the vacuum pump 2 and ensure the process stability of the equipment. Currently, the heat trap 12 is installed at the end of the machine (see reference). Figure 1 As shown in the figure, it is extremely difficult to disassemble, transport and reinstall the heat trap 12 in a space-constrained environment. This not only consumes a lot of manpower and time costs, but also significantly prolongs the non-productive downtime of the equipment, which seriously restricts the further improvement of the machine's utilization rate.

[0022] To address the problems of difficult maintenance and low machine uptime of existing heat trap devices 1, this embodiment installs the heat trap device 1 above the vacuum pump 2. The heat trap device 1 includes a frame 11 and a heat trap 12. The frame 11 is located outside the vacuum pump 2, and the mounting surface of the frame 11 is located directly above the vacuum pump 2. The heat trap 12 is detachably mounted on the mounting surface. One end of the heat trap 12 is connected to the process chamber 3 through a first pipe 13, and the other end is connected to the vacuum pump 2 through a second pipe 14. A first valve 15 is provided on the first pipe 13, and a second valve 16 is provided on the second pipe 14.

[0023] Specifically, refer to Figure 2 As shown, the frame 11 is the core supporting structure of the heat trap device 1, and is generally made of high-strength metal profiles welded or assembled to support the heat trap 12 and its supporting components. The frame 11 is located outside the vacuum pump 2, that is, it does not interfere with the installation and maintenance space of the vacuum pump 2. The support structure of the frame 11 is distributed on both sides of the vacuum pump 2, so that the main body of the frame 11 spans the upper area of ​​the vacuum pump 2. The vacuum pump 2 refers to a dry multistage vacuum pump 2 used to provide continuous and stable negative pressure suction for the process chamber 3, and it is fixedly installed on the ground of the Sub-Fab (i.e., the lower interlayer / technology interlayer).

[0024] More specifically, the rack 11 is fixedly installed on the floor of the Sub-Fab, wherein the Sub-Fab refers to the technical mezzanine directly below the cleanroom (Fab), which is used to house bulky auxiliary facilities such as the vacuum pump 2, exhaust gas treatment equipment, and chemical cabinets, and the cleanroom refers to the high-cleanliness area used to house the process chamber 3 (machine).

[0025] Furthermore, the frame 11 has a horizontal mounting surface that is higher than the top of the vacuum pump 2. The mounting surface is the bearing plane on the top of the frame 11 used to fix the heat trap 12. The vertical projection of this plane falls within the horizontal projection range of the vacuum pump 2. That is, the mounting surface faces the space above the vacuum pump 2. The frame 11 and the top of the vacuum pump 2 are vertically spaced, making full use of the originally unused three-dimensional space on the top of the vacuum pump 2 without occupying additional floor space.

[0026] More specifically, within the gap between the mounting surface and the vacuum pump 2, the frame 11 is provided with reinforcing ribs 111, the two ends of which are respectively connected to the two sides of the frame 11, thereby improving the structural strength and load-bearing stability of the frame 11.

[0027] Reference Figures 2 to 5 As shown, the heat trap 12 refers to a container device located between the exhaust end of the process chamber 3 and the intake end of the vacuum pump 2, used to capture unreacted precursors and reaction byproducts by heating or physical interception. It contains heating elements and a trapping structure, capable of decomposing the precursors at high temperatures and adhering them to the trap wall or trapping element. The heat trap 12 prevents particulate matter from entering the vacuum pump 2 and causing pump wear or damage. This embodiment employs a large-volume 160-liter structure, providing a larger byproduct capture capacity.

[0028] The heat sink 12 is detachably fixed to the mounting surface by means of bolt connection or quick-release buckle connection, so that the heat sink 12 is stably supported and also facilitates subsequent disassembly and maintenance operations.

[0029] Furthermore, the heat sink 12 has an inlet end and an outlet end, wherein, in this embodiment, the inlet end is located above the heat sink 12, and the outlet end is located below the heat sink 12. The inlet end of the heat sink 12 is connected to the exhaust port of the process chamber 3 through the first pipe 13. The first pipe 13 refers to the exhaust pipe connecting the inlet end of the heat sink 12 and the exhaust port of the process chamber 3 (i.e., the machine foreline, referring to the main exhaust pipe from the process chamber to the vacuum pump 2), and is usually a round pipe made of metal. The first valve 15 is installed on the first pipe 13. The first valve 15 refers to the on / off control component installed on the first pipe 13, used to control the on / off of the air passage between the exhaust port of the process chamber 3 and the heat sink 12. Its specific form can be a pneumatic gate valve.

[0030] More specifically, the air inlet of the heat sink 12 is connected upwards to the first pipe 13, which extends upwards and connects to the pre-pipeline of the process chamber 3, ultimately connecting to the process chamber 3 of the Fab layer; the first valve 15 is installed in series on the first pipe 13 near the heat sink 12. The first valve 15 remains open during normal operation and closes when maintenance of the heat sink 12 is required, thereby cutting off the air path between the process chamber 3 and the heat sink 12.

[0031] The outlet of the heat trap 12 is connected to the suction port of the vacuum pump 2 through the second pipe 14. The second pipe 14 is a suction pipe that connects the outlet of the heat trap 12 and the suction port of the vacuum pump 2, and is also a round pipe made of metal. The second valve 16 is installed on the second pipe 14. The second valve 16 is an on / off control device installed on the second pipe 14, which is used to control the on / off of the air passage between the outlet of the heat trap 12 and the suction port of the vacuum pump 2. Its specific form can be a manual valve.

[0032] More specifically, the outlet end of the heat trap 12 is connected downward to the second pipe 14, and the second pipe 14 extends downward to connect to the inlet of the vacuum pump 2; the second valve 16 is installed in series on the second pipe 14 near the heat trap 12. The second valve 16 is also kept open during normal operation. When it is necessary to disassemble the heat trap 12, the second valve 16 is closed, and the second valve 16 can be removed together with the heat trap 12. Since closing the second valve 16 can block the outlet port of the heat trap 12, it prevents the by-product particles accumulated inside the heat trap 12 from falling into the vacuum pump 2, thus protecting the vacuum pump 2.

[0033] This embodiment utilizes a vertical space reuse layout by transferring the heat sink 12 from the confined space of the machine end to the Sub-Fab layer and using the rack 11 to span above the vacuum pump 2 for overhead installation. This eliminates the need for the heat sink 12 to occupy separate planar space, optimizing the plant's equipment layout density and saving on site construction costs. Simultaneously, with the heat sink 12 removed from the confined space of the machine end, disassembly, transportation, and cleaning maintenance can all be carried out in an open space, significantly reducing operational difficulty, shortening downtime for single maintenance, improving maintenance efficiency, and thus increasing machine uptime. Furthermore, the increased installation space allows for the installation of large-capacity heat sinks 12, such as 160-liter ones, above the rack 11, thereby increasing byproduct capacity, effectively extending the continuous operating time of the heat sink 12, reducing cleaning and maintenance frequency, and further lowering operation and maintenance costs.

[0034] In one embodiment, reference is made to Figure 2 , Figure 4 , Figure 5 As shown, the heat trap device 1 also includes a bypass pipe 17. One end of the bypass pipe 17 is connected to the first pipe 13, and the other end is connected to the second pipe 14. A bypass valve 18 is provided on the bypass pipe 17. Specifically, the bypass pipe 17 refers to a spare evacuation passage connected in parallel to both ends of the heat trap 12 body. One end of this passage is connected to the first pipe 13, and the other end is connected to the second pipe 14, forming a spare passage that spans the heat trap 12 body. Its function is to serve as a temporary evacuation passage when the heat trap 12 is disassembled for maintenance.

[0035] More specifically, one end of the bypass pipe 17 is connected to the first pipe 13 and is located between the first valve 15 and the process chamber 3, specifically at the front end of the first valve 15. This position is located on the side of the first valve 15 closest to the process chamber 3, so that when the first valve 15 is closed, the bypass pipe 17 remains in communication with the process chamber 3. The other end of the bypass pipe 17 is connected to the second pipe 14 and is located between the second valve 16 and the vacuum pump 2, specifically at the rear end of the second valve 16. This position is located on the side of the second valve 16 closest to the vacuum pump 2, so that when the second valve 16 is closed, the bypass pipe 17 remains in communication with the vacuum pump 2.

[0036] A bypass valve 18 is connected in series on the bypass pipe 17. The bypass valve 18 is a valve installed on the bypass pipe 17 for controlling the opening and closing of the backup passage. It can be a manual valve or a pneumatic valve.

[0037] When the heat trap 12 is operating normally, the bypass valve 18 remains closed. Process byproducts flow from the process chamber 3 sequentially through the first pipe 13, the first valve 15, the heat trap 12, the second valve 16, and the second pipe 14 to the vacuum pump 2 (i.e., the main extraction passage, see reference). Figure 4 (The arrow direction). When the heat trap 12 needs to be disassembled for maintenance, first close the first valve 15 and the second valve 16 to completely isolate the heat trap 12 from the main evacuation passage. Then open the bypass valve 18. At this time, the by-products discharged from the process chamber 3 bypass the heat trap 12 through the bypass pipe 17 and directly enter the vacuum pump 2 (refer to...). Figure 5 (The arrow direction) is used to maintain the continuous flow of the air extraction passage and ensure that processes such as machine purging can be carried out normally.

[0038] Furthermore, two bypass valves 18 are provided. One bypass valve 18 is fixed to the side of the bypass pipe 17 near the first pipe 13, and the other bypass valve 18 is fixed to the side of the bypass pipe 17 near the second pipe 14. When the heat trap 12 is working normally, both bypass valves 18 remain closed, and the first valve 15 and the second valve 16 are both open, so that process by-products flow from the main evacuation passage to the vacuum pump 2, preventing by-products from the process chamber 3 from flowing from the first pipe 13 into the bypass pipe 17, and also preventing by-products from the second pipe 14 from flowing into the bypass pipe 17, thereby ensuring that by-products only flow in the main evacuation passage and improving flow efficiency. When the heat trap 12 is disassembled for maintenance, both bypass valves 18 are opened, and the first valve 15 and the second valve 16 are closed, so that by-products from the process chamber 3 flow from the bypass pipe 17 to the vacuum pump 2.

[0039] In this embodiment, by setting up the bypass pipe 17 and its bypass valve 18, when the heat trap 12 needs to be disassembled for maintenance, the byproducts discharged from the process chamber 3 can bypass the heat trap 12 and directly enter the vacuum pump 2 through the bypass pipe 17. During the entire disassembly and maintenance process of the heat trap 12, the purging (i.e., the process step of replacing residual gas in the chamber with inert gas) and process pressure inside the process chamber 3 remain unaffected. The machine can complete the replacement or cleaning of the heat trap 12 without stopping, effectively avoiding long-term non-productive downtime caused by the maintenance of the heat trap 12, and significantly improving the effective production time and uptime of the machine. At the same time, the structure of this backup passage is simple and reliable, requiring no modification to the original main pipeline layout, and has strong adaptability. It can achieve the maintenance bypass function without affecting the main pipeline gas resistance and pumping efficiency; furthermore, the isolation design of the bypass valve 18 ensures no gas bypass leakage during normal production, ensuring the collection efficiency and process stability of the heat trap 12.

[0040] In a specific embodiment, the heat sink device 1 further includes a water-cooling component (not shown in the figure), which is installed on the outside of the heat sink 12 to dissipate heat from the heat sink 12. Specifically, the water-cooling component refers to a device installed on the outside of the main body of the heat sink 12, used to remove the high-temperature heat of the heat sink 12 through circulating cooling water to reduce the outer shell temperature of the heat sink 12 and the ambient temperature. The water-cooling component may include cooling water channels or cooling jacket structures and corresponding inlet and outlet water pipes 191, etc. The medium introduced into the water-cooling component is process cooling water, i.e., PCW, which is centrally prepared by the plant management system and circulated through the pipeline network to remove the heat generated by the operation of the heat sink 12 and ensure the stability of the operating temperature of the heat sink 12.

[0041] In this embodiment, the water-cooling assembly is installed on the outer side of the heat sink 12 and fixedly arranged using the frame 11. It is not attached to the heat sink 12 body, allowing the water-cooling assembly to remain stationary during heat sink 12 assembly and disassembly. The inlet of the water-cooling assembly connects to the plant's process cooling water supply network, and the outlet connects to the plant's process cooling water return network. Cooling water enters the cooling channels inside the heat sink 12 through the water-cooling assembly for heat exchange, and then flows back to the plant's pipeline network, achieving circulating heat dissipation. The entire water system's piping support, fixation, and arrangement are all completed using the frame 11, eliminating the need for additional independent support structures and avoiding additional floor space occupation in the Sub-Fab.

[0042] Because the heat sink 12 operates at extremely high internal temperatures, reaching hundreds of degrees Celsius, this embodiment effectively isolates the heat from radiation to the Sub-Fab environment and the rack 11 by incorporating the water-cooling component. This prevents the rack 11 from undergoing thermal deformation due to prolonged heating, which could affect installation accuracy and service life. Simultaneously, the water-cooling component effectively reduces the outer casing temperature of the heat sink 12, preventing burns to maintenance personnel during operation and improving equipment safety and maintenance convenience.

[0043] Furthermore, the inlet and outlet water pipes 191 and control components of the water-cooling assembly are all integrated on the frame 11, further optimizing space utilization. When disassembling the heat sink 12, it is not necessary to disassemble the entire water pipeline; disassembly can be completed simply by disconnecting the connection between the heat sink 12 and the water pipeline, significantly simplifying maintenance procedures and shortening operation time. Moreover, the fixed arrangement of the water-cooling assembly's pipes reduces pipe deformation and joint wear caused by frequent disassembly and assembly, lowering the risk of leakage and improving the long-term reliability of the equipment. Finally, the cooling water source is uniformly supplied and circulated by the plant system, eliminating the need for process equipment to provide cooling water resources and supporting pipelines, effectively simplifying the water system design on the process equipment side and reducing equipment interfaces.

[0044] In one embodiment, reference is made to Figures 2 to 5 As shown, the water-cooling assembly includes a water outlet pipe 191, which is connected to the outlet of the heat sink 12. The water outlet pipe 191 is equipped with a flow meter 193, which is signal-connected to the machine controller. Specifically, the water outlet pipe 191 connects to the cooling water outlet of the heat sink 12, directs the heated cooling water to the plant's cooling water return system, and serves as a return water branch for the water-cooling assembly. The heat sink 12 has a cooling water outlet; one end of the water outlet pipe 191 is connected to the outlet, and the other end is connected to the plant's cooling water return system.

[0045] The flow meter 193 refers to a sensing component installed on the outlet pipe 191 for real-time detection of cooling water flow parameters. It can convert the flow signal into an electrical signal output to detect the operating status of the water-cooling components in real time. The flow meter 193 is connected in series in the outlet pipe 191, that is, after the cooling water flows out of the heat sink 12, it first passes through the flow meter 193 and then flows to the plant return water system.

[0046] The flow meter 193 is signal-connected to the machine controller, transmitting the detected real-time flow data to the machine controller. The signal connection refers to the transmission of electrical signals or data information via a signal cable. In this embodiment, it specifically refers to the flow meter 193 transmitting the flow detection signal to the machine controller in the form of an analog quantity (such as a 4-20mA current signal). The machine controller is the main control unit of the process machine, responsible for the overall process logic control and status monitoring. It can receive sensor signals and display alarm information on the graphical user interface (GUI).

[0047] When the detected traffic data is below the set threshold or abnormal fluctuations occur, the machine controller generates corresponding alarm information and displays a prompt on the machine's graphical user interface to notify maintenance personnel to handle the situation promptly.

[0048] In this embodiment, by installing the flow meter 193 on the outlet pipe 191, the cooling water circulation status of the heat sink 12 can be monitored in real time, and faults such as water blockage, flow interruption, and leakage can be detected in a timely manner. This prevents the heat sink 12 from overheating and failing due to insufficient cooling, ensuring stable exhaust gas capture performance. Furthermore, placing the flow meter 193 on the outlet pipe 191 rather than the inlet pipe 192 can more accurately reflect the actual cooling water flow through the heat sink 12, avoiding misjudgments caused by pressure fluctuations in the inlet pipe 192. Moreover, the flow signal is directly connected to the machine controller, and abnormal alarms can be displayed intuitively on the machine operation interface, facilitating rapid response and handling by maintenance personnel and shortening fault diagnosis time. At the same time, continuous flow monitoring can accumulate water circuit operation data, providing data support for preventive maintenance and improving the precision of equipment operation and maintenance.

[0049] In a specific embodiment, refer to Figures 2 to 5As shown, the water-cooling assembly also includes a water inlet pipe 192, which is connected to the water inlet of the heat sink 12. The water inlet pipe 192 is equipped with a control valve 194, which automatically controls the opening and closing of the water inlet pipe 192 based on the detection result of the flow meter 193. Specifically, the water inlet pipe 192 refers to the pipeline connecting to the water inlet of the heat sink 12 and introducing low-temperature cooling water supplied by the plant into the heat sink 12. The heat sink 12 has a cooling water inlet, one end of the water inlet pipe 192 is connected to the water inlet of the heat sink 12, and the other end of the water inlet pipe 192 is connected to the plant's cooling water supply system, serving as a water supply branch for the water-cooling assembly.

[0050] A control valve 194 is connected in series on the inlet pipe 192, and the control valve 194 forms a linkage control logic with the flow meter 193 on the outlet pipe 191. The control valve 194 is an automatically actuated on / off valve installed on the inlet pipe 192, specifically a pneumatic valve, driven by an actuator to open or close the valve, offering fast response and high reliability. The control valve 194 is used to automatically control the on / off state of the inlet pipe 192 based on the detection results of the flow meter 193. Further, the actuator of the control valve 194 (such as an electromagnetic pilot valve) is electrically connected to the machine controller. The machine controller sends control commands to the control valve 194 based on the real-time flow data fed back by the flow meter 193. The control valve 194 receives the control commands from the machine controller and automatically adjusts its opening degree or on / off state to control the on / off state of the inlet pipe 192.

[0051] Specifically, when the flow meter 193 detects that the cooling water flow rate in the outlet pipe 191 is lower than a preset threshold or there is an abnormal fluctuation, the machine controller sends a closing command to the control valve 194, and the control valve 194 automatically closes, cutting off the cooling water from entering the heat sink 12, thereby preventing continuous leakage of cooling water.

[0052] Furthermore, when the machine controller detects that the return water flow is lower than a preset threshold, it controls the control valve 194 to automatically open to increase the water supply flow; when the machine controller detects that the flow is abnormally interrupted or malfunctions, it controls the control valve 194 to automatically trigger protection and cut off, thereby realizing closed-loop control of cooling water flow.

[0053] This embodiment achieves automatic interlock control by setting the control valve 194 and using the flow signal fed back from the flow meter 193. When the water cooling system (i.e., the water cooling components and the internal water circuit of the heat sink 12) experiences leakage or flow interruption, it can automatically and quickly shut off the water supply or adjust the flow rate. This prevents continuous cooling water leakage from damaging the Sub-Fab environment, the vacuum pump 2, and electrical equipment, thus realizing the automatic safety protection function of the water cooling system, improving the safety of equipment operation, and ensuring the stable and controllable cooling effect of the heat sink 12. It also prevents flow fluctuations from affecting the exhaust gas capture efficiency and process consistency. This automatic control method requires no manual intervention, has a fast response speed, and can effectively prevent the escalation of faults and reduce failure losses.

[0054] In one embodiment, reference is made to Figures 2 to 5 As shown, the water inlet pipe 192 is also equipped with a manual valve 195 for manually controlling the opening and closing of the water inlet pipe 192. Specifically, the manual valve 195 refers to a valve installed on the water inlet pipe 192 that requires manual operation to control the opening and closing of the water inlet pipe 192. It is usually a ball valve or a gate valve, operated by rotating a handwheel or handle. The manual valve 195 serves as a physical redundancy guarantee for the automatic control loop, used for physical isolation of the water circuit in inspection and maintenance scenarios.

[0055] In this embodiment, the manual valve 195 is installed in series on the water inlet pipe 192, located upstream of the control valve 194 (i.e., near the plant's water supply end). During normal equipment operation, the manual valve 195 remains fully open, and the downstream control valve 194 automatically regulates the cooling water flow. When the equipment is under maintenance, the heat sink 12 is disassembled or reassembled, or the control valve 194 malfunctions, maintenance personnel can manually close the manual valve 195 to physically cut off the water supply to the water inlet pipe 192, completely isolating the water pressure and ensuring on-site operational safety.

[0056] This embodiment provides dual control protection for the cooling water system by adding the manual valve 195. When the control valve 194 is operating normally, the manual valve 195 remains open, not affecting the normal operation of the automatic control. When the control valve 194 malfunctions (e.g., jammed or unable to close) and requires repair or replacement, or when the equipment is being repaired or the heat sink 12 is being disassembled, maintenance personnel can manually close the manual valve 195, isolating the control valve 194 from the plant water supply. This facilitates online repair or replacement of the control valve 194 and cuts off the water supply to the inlet pipe 192 without stopping the entire plant water supply system, improving the maintainability and operational flexibility of the equipment.

[0057] In a specific embodiment, refer to Figures 2 to 5As shown, an installation space is provided between the mounting surface and the top of the vacuum pump 2. A liquid receiving tray 196 is installed in the installation space, and the liquid receiving tray 196 is located below the water-cooling assembly. Specifically, the installation space is a reserved vertical space between the mounting surface of the frame 11 and the top of the vacuum pump 2. It is an unused three-dimensional space above the vacuum pump 2. The installation space can be used to install components such as the liquid receiving tray 196, the second pipe 14, the second valve 16, the water inlet pipe 192, the water outlet pipe 191, the flow meter 193, and the control valve 194, so as to avoid installing most components on the mounting surface, which would affect the installation space of the heat trap 12, and to avoid making the mounting surface cluttered. The liquid receiving tray 196 is installed in the installation space. The liquid receiving tray 196 is located below the water cooling assembly. The liquid receiving tray 196 is a disc-shaped container used to collect possible leaked cooling water to prevent the cooling water from flowing freely to the Sub-Fab floor or into the interior of equipment such as the vacuum pump 2. It is usually made of corrosion-resistant metal material.

[0058] Furthermore, the drip tray 196 can be fixed to the frame 11 or the housing of the vacuum pump 2 by welding, bolting, or bracket support. The projection of the drip tray 196 on the horizontal plane covers the area directly below the water-cooling assembly, meaning the coverage area of ​​the drip tray 196 is greater than or equal to the projection area of ​​the water-cooling assembly on the horizontal plane. This ensures that any leakage, whether at pipe joints, valves, or the cooling water sealing structure of the heat sink 12 itself, can be completely collected by the drip tray 196, preventing liquid from dripping directly onto the vacuum pump 2 body and surrounding electrical components, thus preventing equipment damage and electrical safety hazards.

[0059] More specifically, the liquid receiving tray 196 can be placed on the reinforcing rib 111 and connected to the reinforcing member in a detachable manner, thereby eliminating the need to design other structures to support the liquid receiving tray 196 and reducing production costs.

[0060] This embodiment makes full use of the unused vertical space above the vacuum pump 2 to arrange the liquid receiving tray 196, without occupying additional planar space, thus achieving efficient reuse of space; and the liquid receiving tray 196 can effectively collect leaked liquid, preventing liquid from seeping into the vacuum pump 2 and causing equipment damage, and also preventing electrical safety hazards caused by water leakage, thereby improving the safety of equipment operation; at the same time, it can centrally collect accumulated liquid, making it easier for maintenance personnel to detect potential leaks in a timely manner and reducing the risk of escalation of faults.

[0061] In one embodiment, reference is made to Figure 3As shown, a leak detection sensor 197 is fixedly installed inside the liquid receiving tray 196, and the leak detection sensor 197 is electrically connected to the machine controller. Specifically, the leak detection sensor 197 (also known as a liquid level sensor or liquid contact sensor) is a sensing element fixedly installed inside the liquid receiving tray 196 for detecting whether there is leaking liquid inside the liquid receiving tray 196. When the liquid reaches a certain height, the sensor outputs a signal to monitor for leakage faults in the water circuit (i.e., the water circuit of the water cooling component and the cooling water of the heat sink 12) in real time.

[0062] The leakage detection sensor 197 is fixedly installed at the bottom of the liquid receiving tray 196, and can accurately detect the water accumulation and amount in the liquid receiving tray 196. The leakage detection sensor 197 is electrically connected to the machine controller. The electrical connection refers to the electrical conduction achieved through wires. In this embodiment, it specifically refers to the leakage detection sensor 197 transmitting its on / off signal or voltage signal to the machine controller through wires. The machine controller is the main control unit of the process machine and can receive the leakage signal from the sensor and trigger an alarm.

[0063] When the water accumulation in the drip tray 196 reaches a set threshold or the accumulated leaked liquid in the drip tray 196 reaches the trigger level of the leak detection sensor 197, the leak detection sensor 197 sends a leak detection signal to the machine controller. The machine controller then triggers a leak alarm and displays the alarm information on the machine's graphical user interface. Furthermore, the control valve 194 on the water inlet pipe 192 can be closed in conjunction with the leak detection sensor to automatically cut off the water supply and prevent further damage.

[0064] This embodiment, by setting up the leakage detection sensor 197 and electrically connecting it to the machine controller, allows the machine controller to receive the detection signal and issue an alarm message in real time when there is leaking liquid in the drip tray 196 (e.g., displaying a cooling water leakage alarm through the machine's GUI interface). This achieves automatic monitoring and alarming of water circuit leaks, enabling maintenance personnel to detect and handle leaks promptly, preventing excessive leakage from causing more serious equipment damage, and improving the monitoring intelligence and operational safety of the water cooling system. The leakage detection sensor 197 enables early detection and warning of leaks, avoiding equipment damage caused by undetected leaks, significantly reducing failure losses, and improving the equipment's safety protection level.

[0065] In one embodiment, reference is made to Figures 2 to 5As shown, the heat sink device 1 also includes a heat sink controller 121, which is mounted on the mounting surface. Specifically, the heat sink controller 121 is a control unit specifically used to control the working state of the heat sink 12, integrating functions such as heating control, water cooling regulation, and status acquisition. It can be a programmable logic controller (PLC) or a dedicated controller.

[0066] The heat sink controller 121 is fixedly installed on the mounting surface of the rack 11 and arranged on the same side as the heat sink 12, that is, arranged side by side with the heat sink 12 on the mounting surface of the rack 11, without occupying the floor space of the Sub-Fab separately, thus further optimizing space utilization.

[0067] The heat sink controller 121 is electrically connected to the heating module of the heat sink 12 and related components of the water cooling assembly, and independently performs functions such as temperature control of the heat sink 12 and local regulation of the water cooling system. This allows the heat sink controller 121 to independently perform the basic control functions of the heat sink 12, reducing the occupation of the machine tool controller resources and simplifying the control system design of the process machine tool.

[0068] Furthermore, the heat sink controller 121 is also communicatively connected to the machine controller, enabling the heat sink controller 121 to upload operating status, fault alarms, and other information to the machine controller, which is then displayed on the machine's graphical user interface. When any signal from the heating system, flow meter 193, or leakage detection sensor 197 malfunctions, relevant alarm information can be simultaneously uploaded to the machine interface. By uploading alarm information to the machine interface, centralized monitoring at the operator's end is ensured, and the functions of heat sink control and machine main control are decoupled. When the machine performs preventative maintenance, there is no need to simultaneously verify the control components of the heat sink 12, thus shortening the machine maintenance time.

[0069] Reference Figures 2 to 5 As shown, this application also provides a thin film deposition apparatus, which includes a process chamber 3, a vacuum pump 2, and a heat trap device 1. The heat trap device 1 is any of the heat trap devices described above. Since the heat trap device 1 has been described in detail in the above embodiments, it will not be described again here. One end of the heat trap 12 is connected to the process chamber 3 through the first pipe 13, and the other end is connected to the vacuum pump 2 through the second pipe 14.

[0070] Specifically, the thin film deposition equipment is a mass production process equipment for performing semiconductor thin film deposition processes. In this embodiment, it is specifically an atomic layer deposition (ALD) equipment, especially a core process equipment for manufacturing dynamic random access memory (DRAM) memory chips, used to deposit high-precision, high-uniformity functional thin films on the wafer surface.

[0071] The thin film deposition equipment includes a process chamber 3, a vacuum pump 2, and the aforementioned heat trap device 1. The process chamber 3 is the core reaction unit of the thin film deposition equipment, located in the upper clean production area (i.e., the Fab layer), providing a sealed vacuum process environment for wafer thin film growth. The vacuum pump 2 is a dry vacuum pumping device located in the lower Sub-Fab area (i.e., the lower interlayer / technology interlayer), used to continuously extract vacuum from the process chamber 3 and transport process exhaust gases to maintain the vacuum environment required for the chamber process. The heat trap device 1 is an exhaust gas treatment unit used to capture precursor byproducts and particulate matter in the process exhaust gases, preventing impurities from entering the vacuum pump 2 and causing pump damage.

[0072] The heat trap device 1 is installed in the Sub-Fab area, spanning horizontally above the vacuum pump 2 via the rack 11. It utilizes the unused vertical space at the top of the vacuum pump 2, requiring no additional floor space. The inlet of the heat trap 12 of the heat trap device 1 is sealed to the exhaust end of the process chamber 3 via the first pipe 13, which runs vertically through the floor, transporting the process exhaust gas discharged from the process chamber 3 to the heat trap 12 for byproduct collection. The outlet of the heat trap 12 is sealed to the inlet of the vacuum pump 2 via the second pipe 14. The exhaust gas filtered by the heat trap 12 enters the vacuum pump 2 through the second pipe 14 and is finally discharged by the vacuum pump 2 to the plant exhaust gas treatment system 4.

[0073] The thin film deposition equipment described in this embodiment, by employing the aforementioned heat trap device 1, achieves zero additional occupation of ground space for the heat trap 12 by transferring the heat trap 12 from the space-constrained end of the machine (i.e., the Fab layer) to the Sub-Fab layer and installing it across the vacuum pump 2 using the frame 11. This frees up space at the end of the machine, making maintenance operations no longer restricted, thereby improving equipment maintenance efficiency and increasing equipment uptime.

[0074] Meanwhile, the bypass pipe 17 allows the machine to be replaced without stopping during the maintenance of the heat sink 12. The second valve 16 is disassembled along with the heat sink 12 to prevent byproduct particles from falling into the vacuum pump 2, significantly reducing non-productive downtime and protecting the vacuum pump 2, thus greatly improving machine uptime. Furthermore, the automatic monitoring and protection system, consisting of the water-cooling assembly, the flow meter 193, the control valve 194, and the leakage detection sensor 197, combined with alarm feedback from the heat sink controller 121 and the machine's GUI interface, comprehensively ensures the safety and reliability of the equipment operation.

[0075] Finally, in this embodiment, the power supply and cooling water source of the heat sink 12 are both independently taken from the plant's public utility system. The complete separation of the two from the machine simplifies the equipment complexity. Furthermore, the 160L large-capacity heat sink 12 can be set up to enhance the by-product collection capability and extend the maintenance cycle, thereby significantly improving the machine uptime of the thin film deposition equipment, reducing operating costs, and increasing production line capacity.

[0076] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in the present invention, and these modifications or substitutions should all be covered within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A heat trap device, characterized in that, include: The frame is located outside the vacuum pump, and its mounting surface is located above the vacuum pump; A heat trap is detachably mounted on the mounting surface. One end of the heat trap is connected to the process chamber through a first pipe, and the other end is connected to the vacuum pump through a second pipe. A first valve is provided on the first pipe, and a second valve is provided on the second pipe.

2. The heat trap device according to claim 1, characterized in that, The heat trap device further includes a bypass pipe, one end of which is connected to the first pipe and the other end of which is connected to the second pipe, and a bypass valve is provided on the bypass pipe.

3. The heat trap device according to claim 1, characterized in that, The heat trap device also includes a water-cooling component, which is installed on the outside of the heat trap to dissipate heat from the heat trap.

4. The heat trap device according to claim 3, characterized in that, The water cooling assembly includes a water outlet pipe connected to the outlet of the heat sink. The water outlet pipe is equipped with a flow meter, which is signal-connected to the machine controller.

5. The heat trap device according to claim 4, characterized in that, The water-cooling assembly also includes a water inlet pipe connected to the water inlet of the heat sink. The water inlet pipe is equipped with a control valve, which is used to automatically control the opening and closing of the water inlet pipe based on the detection result of the flow meter.

6. The heat trap device according to claim 5, characterized in that, The water inlet pipe is also equipped with a manual valve for manually controlling the opening and closing of the water inlet pipe.

7. The heat trap device according to claim 3, characterized in that, An installation space is provided between the mounting surface and the top of the vacuum pump, and a liquid receiving tray is installed in the installation space. The liquid receiving tray is located below the water cooling assembly.

8. The heat trap device according to claim 7, characterized in that, A leakage detection sensor is fixedly installed inside the liquid receiving tray, and the leakage detection sensor is electrically connected to the machine controller.

9. The heat trap device according to claim 1, characterized in that, The heat sink device also includes a heat sink controller, which is mounted on the mounting surface.

10. A thin film deposition apparatus, characterized in that, include: Process chamber and vacuum pump; A heat trap device, wherein the heat trap device is the heat trap device according to any one of claims 1-9, one end of the heat trap is connected to the process chamber through the first pipe, and the other end is connected to the vacuum pump through the second pipe.

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