Electroplating anode and electroplating method using the same

Abstract

The embodiment of the present application provides an electroplating anode and an electroplating method using the electroplating anode, the electroplating anode forms an electric field with a cathode to be electroplated to form an electroplating layer on the surface of the cathode, the topography of the cathode is uneven, the electroplating anode is a conductive plate, the topography of the conductive plate is conformal to the topography of the cathode, the protruding part of the conductive plate corresponds to the recessed part of the cathode, and the recessed part of the conductive plate corresponds to the protruding part of the cathode. The embodiment of the present application provides an electroplating anode and an electroplating method using the electroplating anode, so that the surface electroplating of the cathode is uniform.

Description

[0001] This application is a divisional application of application number 201910935348.2, filed on September 29, 2019, entitled "An electroplating anode and an electroplating method using the electroplating anode". Technical Field

[0002] This invention relates to electroplating technology for printed circuit boards, and more particularly to an electroplating anode and an electroplating method using the electroplating anode. Background Technology

[0003] Currently, the most challenging characteristics for printed circuit boards (PCBs) in terms of manufacturing technology and processes are as follows: 1. Board thickness, reaching 10 cm or more. 2. Board size, reaching 120 cm × 120 cm or larger. 3. Hole aspect ratio, reaching 15:1, or even 20:1 or higher. 4. There are dense arrays of holes as well as scattered holes; the aspect ratio of the holes also varies. High-end PCB manufacturers and their customers have the following quality requirements or expectations for the above PCBs: 1. The copper deposition thickness inside the holes reaches the required thickness; at the same time, the copper deposition thickness on the surface is not excessive. 2. In through-holes, the copper deposition achieves an "X" shape, or even fills the entire hole. 3. On the surface, the copper deposition is evenly distributed.

[0004] Comparison of existing manufacturing technologies and processes: In summary, the challenge in fabricating such thick printed circuit boards lies in the fact that existing technologies cannot simultaneously achieve the following performance characteristics: 1. The copper deposition thickness inside the hole reaches the required thickness; 2. At the same time, the thickness of the copper deposition on the surface is not excessive; 3. Inside the via, copper deposition forms an "X" shape, or even fills the entire via; on the surface, copper deposition is evenly distributed. Summary of the Invention

[0005] This invention provides an electroplating anode and an electroplating method using the electroplating anode to achieve uniform electroplating on the cathode surface.

[0006] In a first aspect, embodiments of the present invention provide an electroplating anode, wherein the electroplating anode forms an electric field with a cathode to be electroplated to form an electroplating layer on the surface of the cathode, the cathode having an uneven morphology, the electroplating anode being a conductive plate, the morphology of the conductive plate being conformal or approximately conformal to the morphology of the cathode, the protruding portion in the conductive plate corresponding to the recessed portion in the cathode, and the recessed portion in the conductive plate corresponding to the protruding portion in the cathode.

[0007] Secondly, embodiments of the present invention provide an electroplating anode, wherein the electroplating anode forms an electric field with a cathode to be electroplated to form an electroplating layer on the surface of the cathode, the cathode having an uneven morphology, including: Insulating backing plate; Multiple conductive units are provided, each conductive unit including a needle rod and a needle tip disposed at one end of the needle rod. The end with the needle tip is the electroplated end of the conductive unit. The conductive unit is fixed to the insulating back plate by the needle rod. The multiple conductive units are arranged in an array, and any two conductive units are electrically insulated from each other.

[0008] Optionally, the surface of the needle tip facing away from the insulating backing plate is a convex curved surface, and the convex curved surface protrudes along the direction away from the insulating backing plate.

[0009] Optionally, the surface of the needle tip facing away from the insulating backplate is planar.

[0010] Optionally, the shape of the needle's vertical projection on the insulating backing plate is a regular hexagon.

[0011] Optionally, the device includes two insulating backplates, with the needle bar fixed to the two insulating backplates.

[0012] Optionally, it also includes an electroplating signal controller and multiple feed lines, wherein one of the conductive units is electrically connected to the electroplating signal controller via one of the feed lines, and the electroplating signal controller is used to apply an electroplating signal to the conductive unit.

[0013] Optionally, the device includes two insulating backplates, and the needle bar is fixed to the two insulating backplates; The portion of the feeder wire that is electrically connected to the conductive unit is located between the two insulating back plates.

[0014] Optionally, it further includes: a cathode surface morphology detector, an electric field distribution simulation optimizer, and an electric field distribution controller; the input terminal of the electric field distribution simulation optimizer is electrically connected to the cathode surface morphology detector, the output terminal of the electric field distribution simulation optimizer is electrically connected to the electric field distribution controller, and the electric field distribution controller is electrically connected to the electroplating signal controller; The electric field distribution simulation optimizer uses the cathode morphology information obtained from the cathode surface morphology detector, with the initial anode morphology or the current anode morphology and surface current distribution as models, to simulate and optimize the surface current distribution to obtain a more optimized surface current distribution. The optimized surface current distribution information is then transmitted to the electric field distribution controller, which controls the electroplating signal controller to output the electroplating signal to the conductive unit.

[0015] Optionally, it also includes: An electric field distribution simulation optimizer is used to establish an anode model based on the morphology of the cathode; An electric field distribution controller is electrically connected to the electroplating signal controller and the electric field distribution simulation optimizer. It is used to simulate and optimize the obtained cathode morphology information, using the initial anode morphology and surface current distribution as models, to obtain a more optimized surface current distribution. The optimized surface current distribution information is then transmitted to the electric field distribution controller, which controls the electroplating signal controller to output the electroplating signal to the conductive unit.

[0016] Optionally, the device may also include a plurality of drivers connected to the end of the needle bar away from the needle tip, for controlling the distance between the needle tip and the insulating backplate.

[0017] Optionally, it also includes an insulating thread and an insulating nut, the insulating nut being fixed to the insulating back plate, the insulating thread surrounding the needle bar, and the insulating thread threading into the insulating nut.

[0018] Optionally, the system further includes a mold substrate, an adhesive layer, and a power supply board. The adhesive layer is located between the mold substrate and the insulating back plate. The shape of the mold substrate facing the insulating back plate is conformal to the shape of the cathode. The protruding portion in the mold substrate corresponds to the recessed portion in the cathode, and the recessed portion in the mold substrate corresponds to the protruding portion in the cathode. The power supply board is electrically connected to the plurality of conductive units.

[0019] Optionally, the device includes two insulating backplates, and the needle bar is fixed to the two insulating backplates; The power supply board is located between the two insulating back plates.

[0020] Thirdly, embodiments of the present invention provide an electroplating method using the electroplating anode described in the first aspect, wherein the electroplating anode forms an electric field with the cathode to be electroplated to form an electroplating layer on the surface of the cathode, the cathode has an uneven morphology, the electroplating anode is a conductive plate, the morphology of the conductive plate is conformal to the morphology of the cathode, the protruding part in the conductive plate corresponds to the recessed part in the cathode, and the recessed part in the conductive plate corresponds to the protruding part in the cathode; The electroplating method includes: The anode geometry is obtained based on the cathode morphology; A mold substrate is prepared according to the anode geometry; the shape of one side of the mold substrate is conformally identical to the shape of the cathode, the protruding part in the mold substrate corresponds to the recessed part in the cathode, and the recessed part in the mold substrate corresponds to the protruding part in the cathode; The electroplating anode is prepared according to the mold substrate; An electroplating signal is applied to the electroplating anode.

[0021] Optionally, preparing the electroplating anode according to the mold substrate includes: A conductive layer is coated or deposited on the mold substrate to form the electroplating anode.

[0022] Optionally, preparing the electroplating anode according to the mold substrate includes: Provide a planar conductive plate; The mold substrate is used to press a planar conductive plate against one side of the cathode to deform it and conform it to the cathode. The mold substrate is then removed to form the electroplating anode.

[0023] Fourthly, embodiments of the present invention provide an electroplating method using the electroplating anode described in the second aspect, wherein the electroplating anode forms an electric field with the cathode to be electroplated to form an electroplating layer on the surface of the cathode, the cathode having an uneven morphology, the electroplating anode including an insulating back plate and a plurality of conductive units, each conductive unit including a needle rod and a needle tip disposed at one end of the needle rod, the end with the needle tip being the electroplating end of the conductive unit, the conductive unit being fixed to the insulating back plate by the needle rod; the plurality of conductive units are arranged in an array, and any two conductive units are electrically insulated; The electroplating method includes: The anode geometry and surface current distribution are obtained based on the cathode morphology; The distance between each needle and the insulating backing plate is controlled according to the anode geometry, and an individual electroplating signal is applied to each conductive unit according to the surface current distribution; or, all needles are controlled to have the same distance from the insulating backing plate, and an individual electroplating signal is applied to each conductive unit according to the surface current distribution; or, the distance between each needle and the insulating backing plate is controlled according to the anode geometry, and the same electroplating signal is applied to all conductive units.

[0024] Optionally, the electroplating anode includes a cathode surface morphology detector and an electric field distribution simulation optimizer; Obtaining the anode geometry and surface current distribution based on the cathode morphology includes: The cathode surface morphology detector detects the morphology information of the cathode in real time; The electric field distribution simulation optimizer acquires the anode geometry and surface current distribution in real time based on the cathode morphology information.

[0025] Optionally, the electroplating anode further includes an electric field distribution simulation optimizer; Obtaining the anode geometry and surface current distribution based on the cathode morphology includes: The electric field distribution simulation optimizer obtains the anode geometry and surface current distribution based on the cathode morphology and the anode model.

[0026] Optionally, the electroplating anode includes a plurality of drivers, the drivers being connected to the end of the needle bar away from the needle tip, for controlling the distance between the needle tip and the insulating backplate; Controlling the distance between each needle and the insulating backplate based on the anode geometry includes: Each of the drivers is driven to move the conductive unit connected to the driver according to the anode geometry, so as to control the distance between each needle and the insulating backplate.

[0027] Optionally, the electroplating anode further includes an insulating thread and an insulating nut, the insulating nut being fixed to the insulating back plate, the insulating thread surrounding the needle bar, and the insulating thread being threadedly connected to the insulating nut; Controlling the distance between each needle and the insulating backplate based on the anode geometry includes: Based on the anode geometry, the insulating thread is rotated in the insulating nut to control the distance between each needle and the insulating backing plate.

[0028] Optionally, controlling the distance between each needle and the insulating backplate according to the anode geometry includes: The mold substrate is prepared based on the anode geometry; The mold substrate is used to press one end of the plurality of needle bars opposite to the needle tip, so that the needle tips of the plurality of conductive units have an anode geometry; An adhesive or curing agent is filled between the mold substrate and the insulating back plate, and the adhesive or curing agent is cured to form an adhesive layer.

[0029] In this embodiment of the invention, the geometric morphology of the anode is modified according to the morphology of the cathode, so that the morphology of the electroplating anode and the cathode is preserved. That is, the protruding part of the electroplating anode corresponds to the concave part in the cathode, and the concave part in the electroplating anode corresponds to the protruding part in the cathode. This makes the electric field formed by each part of the cathode consistent with that formed by the electroplating anode, thereby making the electroplating on the cathode surface uniform. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the structure of an electroplating anode provided in an embodiment of the present invention; Figure 2 This is a schematic diagram of another electroplating anode provided in an embodiment of the present invention; Figure 3 for Figure 2 A top view of the electroplating anode shown in the diagram; Figure 4 This is a schematic diagram of another electroplating anode provided in an embodiment of the present invention; Figure 5 This is a schematic diagram of another electroplating anode provided in an embodiment of the present invention; Figure 6 for Figure 5 A top view of a portion of the structure of the electroplated anode shown in the image; Figure 7 This is a schematic diagram of another electroplating anode provided in an embodiment of the present invention; Figure 8 This is a schematic diagram of another electroplating anode provided in an embodiment of the present invention; Figure 9 This is a schematic diagram of another electroplating anode provided in an embodiment of the present invention; Figure 10 This is a schematic diagram of another electroplating anode provided in an embodiment of the present invention; Figure 11 This is a schematic diagram of another electroplating anode provided in an embodiment of the present invention; Figure 12 This is a schematic diagram of another electroplating anode provided in an embodiment of the present invention; Figure 13 This is a schematic diagram of another electroplating anode provided in an embodiment of the present invention; Figure 14 This is a schematic diagram of another electroplating anode provided in an embodiment of the present invention; Figure 15 This is a schematic diagram of another electroplating anode provided in an embodiment of the present invention; Figure 16 A flowchart of an electroplating method using an electroplating anode is provided as an embodiment of the present invention; Figure 17 A schematic diagram illustrating the fabrication of an electroplating anode provided in an embodiment of the present invention; Figure 18 for Figure 16 A detailed flowchart of the steps included in step S130; Figure 19 This is a schematic diagram illustrating the fabrication of another electroplating anode provided in an embodiment of the present invention; Figure 20 A flowchart of another electroplating method using an electroplating anode provided in an embodiment of the present invention; Figure 21 A flowchart of another electroplating method using an electroplating anode provided in an embodiment of the present invention; Figure 22A flowchart of another electroplating method using an electroplating anode provided in an embodiment of the present invention; Figure 23 A flowchart illustrating the fabrication process of an electroplating anode, provided as an embodiment of the present invention; Figure 24 This is a schematic diagram illustrating the fabrication of another electroplating anode provided in an embodiment of the present invention; Figure 25 This is a schematic diagram of another electroplating anode provided in an embodiment of the present invention. Detailed Implementation

[0031] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0032] Researchers have discovered that in existing technologies, a planar, plate-like or mesh-like electroplating anode is typically used to create an electric field with the cathode to be electroplated, thereby forming the metal to be plated on the cathode surface. Because the cathode has an uneven morphology, the electric field formed by the protruding parts of the cathode and the electroplating anode differs from that formed by the concave parts of the cathode and the electroplating anode, resulting in uneven electroplating on the cathode surface. The cathode to be electroplated can be, for example, a printed circuit board, and its morphology can be, for example, the morphology of one or both surfaces of the printed circuit board.

[0033] To address the aforementioned problems, this invention proposes various implementation methods under a general inventive concept. The general inventive concept is to modify the geometry of the anode or the electroplating signal of various parts of the electroplating anode based on the morphology of the cathode, thereby ensuring uniform electroplating on the cathode surface.

[0034] Figure 1 This is a schematic diagram of the structure of an electroplating anode provided in an embodiment of the present invention, with reference to... Figure 1 An electric field is formed between the electroplating anode 1 and the cathode 2 to be electroplated, so as to form an electroplating layer on the surface of the cathode 2. Figure 1 (Taking the uneven surface of one side of cathode 2 as an example for illustration), the shape of cathode 2 is uneven, and electroplating anode 1 is a conductive plate. The shape of the conductive plate is conformal or approximately conformal to the shape of cathode 2. The protruding part in the conductive plate corresponds to the concave part in cathode 2, and the concave part in the conductive plate corresponds to the protruding part in cathode 2.

[0035] In this embodiment of the invention, the geometric morphology of the anode is modified according to the morphology of the cathode, so that the morphology of the electroplating anode and the cathode is preserved or approximately preserved. That is, the protruding part of the electroplating anode corresponds to the concave part in the cathode, and the concave part in the electroplating anode corresponds to the protruding part in the cathode. This makes the electric field formed by each part of the cathode consistent with or tends to be consistent with that formed by the electroplating anode, thereby making the electroplating on the cathode surface uniform.

[0036] Figure 2 This is a schematic diagram of another electroplating anode provided in an embodiment of the present invention. Figure 3 for Figure 2 The top view of the electroplating anode shown is for reference. Figure 2 and Figure 3 An electroplating anode 1 forms an electric field with the cathode 2 to be electroplated, thereby forming an electroplating layer on the surface of the cathode 2, which has an uneven morphology. The electroplating anode 1 includes an insulating backplate 12 and multiple conductive units 11. Each conductive unit 11 includes a needle bar 111 and a needle tip 112 disposed at one end of the needle bar 111. The end with the needle tip 112 is the electroplating end of the conductive unit 11. An electric field is formed between the needle tip 112 of the conductive unit 11 and the cathode 2, so as to deposit metal ions in the electroplating solution onto the cathode surface to form electroplating on the cathode 2. For example, a copper layer can be formed by electroplating on a printed circuit board. The conductive units 11 are fixed to the insulating backplate 12 by the needle bar 111. Multiple conductive units 11 are arranged in an array, and any two conductive units 11 are electrically insulated from each other.

[0037] In this embodiment of the invention, the electroplating anode is discretized into multiple non-contacting conductive units; that is, a continuous large surface is discretized into small point surfaces. Therefore, by changing the distance from the needle tip of the conductive unit to the cathode, and / or changing the magnitude or pattern of the electroplating signal applied to the conductive unit, the geometry of the anode or the electroplating signal of each "small point surface" in the electroplating anode can be altered according to the morphology of the cathode, thereby ensuring uniform electroplating on the cathode surface. The electroplating signal can be, for example, current, voltage, or power, and can be direct current or pulsed current.

[0038] The embodiments of the present invention can at least achieve the following: 1. In holes with a depth-to-width ratio of 15:1 or even 20:1 or higher, effective material transport can be achieved; the holes can be filled with electroplated materials (such as copper).

[0039] 2. The plate size of the electroplating anode is up to 120 cm × 120 cm, and the surface electric field distribution or surface current distribution of the plate can be precisely controlled; so as to achieve uniform distribution of surface electroplating and controllable thickness of surface electroplating.

[0040] 3. Rapid electroplating.

[0041] Optionally, refer to Figure 3The shape of the needle 112's vertical projection onto the insulating backing plate 12 is a regular hexagon. Multiple needles 112 are arranged in an array. The multiple needles 112 are arranged sequentially in a row, with adjacent rows of needles 112 staggered. In other embodiments, the shape of the needle 112's vertical projection onto the insulating backing plate 12 can also be a square, rectangle, circle, or ellipse, etc., and this embodiment of the invention does not limit this.

[0042] Figure 4 This is a schematic diagram of another electroplating anode provided in an embodiment of the present invention, with reference to... Figure 4 The electroplating anode 1 includes two insulating back plates 12, and the needle rod 111 is fixed on the two insulating back plates 12. The two insulating back plates 12 increase the firmness between the insulating back plates 12 and the needle rod 111, making the needle rod 111 less prone to shaking, thereby more accurately controlling the position of the needle tip 112 and the electric field between the needle tip 112 and the cathode 2, so as to improve the electroplating effect of the cathode 2.

[0043] Figure 5 This is a schematic diagram of another electroplating anode provided in an embodiment of the present invention, with reference to... Figure 5 The surface of the needle tip 112 facing away from the insulating backplate 12 is a convex curved surface. The convex curved surface protrudes along the direction away from the insulating backplate 12. In this embodiment of the invention, the convex curved surface of the needle tip 112 has a larger surface area, thereby increasing the electric field strength formed between the needle tip 112 and the cathode 2. In other embodiments, the surface of the needle tip 112 facing away from the insulating backplate 12 may also have other shapes.

[0044] Figure 6 for Figure 5 A partial top view of the electroplated anode shown in the figure, for reference. Figure 5 and Figure 6 The electroplating anode 1 also includes an insulating thread 114 and an insulating nut 113. The insulating nut 113 is fixed to the insulating back plate 12, and the insulating thread 113 surrounds the needle bar 111. The insulating thread 114 and the insulating nut 113 are threadedly connected. In this embodiment of the invention, the distance between each needle 112 and the insulating back plate 12 can be controlled by rotating the insulating thread 114 in the insulating nut 113, thereby controlling the distance between each needle 112 and the cathode 2.

[0045] Optionally, refer to Figure 5 The electroplating anode 1 may also include a terminal 115, which is located at the end of the needle bar 111 away from the needle tip 112. The needle bar 111 and the needle tip 112 of the conductive unit 11 can be electrically connected to the feeder wire through the terminal 115 connected thereto.

[0046] Figure 7 This is a schematic diagram of another electroplating anode provided in an embodiment of the present invention, with reference to... Figure 7The surface of the needle 112 facing away from the insulating backplate 12 is flat. Because the needle 112 is flat, the needle 112 and the cathode 2 form a locally uniform electric field, thus reducing the difficulty of setting up the conductive unit 11 and reducing costs.

[0047] Figure 8 This is a schematic diagram of another electroplating anode provided in an embodiment of the present invention, with reference to... Figure 8 The electroplating anode 1 also includes an electroplating signal controller 13 and multiple feed lines 132. A conductive unit 11 is electrically connected to the electroplating signal controller 13 via a feed line 132. The electroplating signal controller 13 is used to apply an electroplating signal to the conductive unit 11.

[0048] Optionally, refer to Figure 8 The electroplating anode 1 includes two insulating back plates 12, and a needle rod 111 is fixed to the two insulating back plates 12. The portion of the feed wire 132 that is electrically connected to the conductive unit 11 is located between the two insulating back plates 12. In this embodiment of the invention, on the one hand, since the portion of the feed wire 132 that is electrically connected to the conductive unit 11 is located between the two insulating back plates 12, the two insulating back plates 12 can be used to protect the feed wire 132. On the other hand, since the portion of the feed wire 132 that is electrically connected to the conductive unit 11 is located between the two insulating back plates 12, it utilizes the space between the two insulating back plates 12 and does not occupy space outside the two insulating back plates 12, thereby increasing space utilization and improving the integration of components in the electroplating anode 1.

[0049] Optionally, refer to Figure 8 The electroplating anode 1 also includes a cathode surface morphology detector 17, an electric field distribution simulation optimizer 16, and an electric field distribution controller 15. The input of the electric field distribution simulation optimizer 16 is electrically connected to the cathode surface morphology detector 17, and the output of the electric field distribution simulation optimizer 16 is electrically connected to the electric field distribution controller 15. It is used to simulate and optimize the cathode morphology information obtained from the cathode surface morphology detector 17, using the initial or current anode morphology and surface current distribution as a model, to obtain a more optimized anode morphology and surface current distribution. The optimized anode morphology and surface current distribution information is then transmitted to the electric field distribution controller 15, which controls the electroplating signal controller 13 to output the electroplating signal to the conductive unit 11. In this embodiment of the invention, based on the real-time thickness and distribution of the electroplated material on the cathode surface, and based on the results of solving the set target using electroplating simulation software, the anode geometry and feed size, mode, and distribution are adjusted in real time. A system working in this manner is called an "intelligent adaptive adjustable anode."

[0050] Figure 9This is a schematic diagram of another electroplating anode provided in an embodiment of the present invention, with reference to... Figure 9 The electroplating anode 1 also includes an electric field distribution simulation optimizer 16 and an electric field distribution controller 15. The electric field distribution simulation optimizer 16 takes the morphology information of the cathode 2 and the initial anode morphology information as input, performs simulation and optimization to obtain an optimized anode morphology and surface current distribution. The electric field distribution controller 15 is electrically connected to the electroplating signal controller 13 and the electric field distribution simulation optimizer 16, and is used to control the electroplating signal controller 13 based on the optimized anode morphology and surface current distribution obtained from the electric field distribution simulation optimizer 16. In this embodiment of the invention, based on the initial cathode geometry and the results of solving the set target using electroplating simulation software to obtain a better anode geometry and the size, mode, and distribution of the current feed, the anode geometry and the size, mode, and distribution of the current feed are adjusted. A system that operates in this way is called an "intelligent adjustable anode".

[0051] Optionally, refer to Figure 8 and Figure 9 The electroplating anode 1 also includes a plurality of drivers 141, which are connected to the end of the needle bar 111 away from the needle tip 112 and are used to control the distance between the needle tip 112 and the insulating back plate 12, thereby controlling the distance between the needle tip 112 and the cathode 1.

[0052] For example, refer to Figure 8 and Figure 9 The needle bar 111 and needle tip 112 of the conductive unit 11 are made of titanium alloy or titanium alloy with a conductive layer coated on the surface. The needle bars 111 are vertically inserted into the holes of the insulating back plate 12, forming an array. All needle tips 112 are on the same side of the insulating back plate 12. On the other side of the insulating back plate 12, each needle bar 111 is connected to a driver 141, which drives the needle bar 111 to move linearly, thereby determining the relative distance between the needle tip 112 and the insulating back plate 12. All drivers 141 are controlled by a driver controller 14, which transmits different control signals to each driver 141, including different extension or retraction distances for each needle bar 111. Each needle tip 112 is fed an electroplating signal through the needle bar 111 and the feed wire 132. All feed wires 132 are connected to the electroplating signal controller 13, which determines the electroplating signal fed to each needle tip 112. The driver controller 14 and the electroplating signal controller 13 are controlled by an electric field distribution controller 15.

[0053] Figure 10 This is a schematic diagram of another electroplating anode provided in an embodiment of the present invention, with reference to... Figure 10All needles 112 are equidistant from the insulating backplate 12. The electroplating anode 1 also includes an electroplating signal controller 13 and multiple feed wires 132. A conductive unit 11 is electrically connected to the electroplating signal controller 13 via a feed wire 132. The electroplating signal controller 13 is used to apply an electroplating signal to the conductive unit 11. In this embodiment of the invention, the needles 112 are equidistant from the insulating backplate 12, meaning that the end faces of each needle 112 form a large plane, and the electroplating signals (e.g., surface current densities) on the end faces of the needles 112 are different.

[0054] For example, refer to Figure 10 The electroplating anode 1 also includes a cathode surface morphology detector 17, an electric field distribution simulation optimizer 16, and an electric field distribution controller 15. The input terminal of the electric field distribution simulation optimizer 16 is electrically connected to the cathode surface morphology detector 17, and the output terminal of the electric field distribution simulation optimizer 16 is electrically connected to the electric field distribution controller 15. It is used to simulate and optimize the cathode morphology information obtained from the cathode surface morphology detector 17, using the initial or current anode morphology and surface current distribution as models, to obtain a more optimized surface current distribution, and transmit the optimized surface current distribution information to the electric field distribution controller 15. The electric field distribution controller 15 controls the electroplating signal output by the electroplating signal controller 13 to the conductive unit 11.

[0055] Figure 11 This is a schematic diagram of another electroplating anode provided in an embodiment of the present invention, and... Figure 10 The similarities will not be repeated here; please refer to [reference]. Figure 11 The electroplating anode 1 also includes an electric field distribution simulation optimizer 16 and an electric field distribution controller 15. The input to the electric field distribution simulation optimizer 16 is the morphology information of the cathode 2 and the initial anode morphology information. It performs simulation and optimization to obtain an optimized surface current distribution. The electric field distribution controller 15 is electrically connected to the electroplating signal controller 13 and the electric field distribution simulation optimizer 16, and is used to control the electroplating signal controller 13 according to the optimized surface current distribution obtained from the electric field distribution simulation optimizer 16.

[0056] Figure 12 This is a schematic diagram of another electroplating anode provided in an embodiment of the present invention, with reference to... Figure 12 The conductive unit 11 is embedded and fixed in the insulating back plate 12.

[0057] For example, refer to Figure 12A groove is provided on one side surface of the insulating backplate 12, and the needles 12 of all conductive units 11 are fixed in the groove. The needles 12 of all conductive units 11 are at the same distance from the insulating backplate 12. One end of the needle rod 111 of the conductive unit 11 is electrically connected to the needle 112, and the other end of the needle rod 111 of the conductive unit 11 is exposed on the other side surface of the insulating backplate 12. It should be noted that the electroplating anode in the embodiment of the present invention may also include an electroplating signal controller 13, an electric field distribution controller 15, an electric field distribution simulation optimizer 16, or a cathode surface morphology detector 17. The embodiments of the present invention do not limit this.

[0058] Figure 13 This is a schematic diagram of another electroplating anode provided in an embodiment of the present invention, with reference to... Figure 13 The electroplating anode 1 also includes a plurality of drivers 141, which are connected to the end of the needle bar 111 away from the needle tip 112, and are used to control the distance between the needle tip 112 and the insulating back plate 12, thereby controlling the distance between the needle tip 112 and the cathode 1. In this embodiment of the invention, the distances of each needle tip 112 from the insulating back plate 12 are different, but the electroplating signal (e.g., surface current density) on the end face of the needle tip 112 is the same.

[0059] For example, refer to Figure 13 The electroplating anode 1 also includes a feed plate 191, to which all conductive units 11 are electrically connected. The feed plate 191 provides the same electroplating signal to all needles 112, making the electroplating signal (e.g., surface current density) on the end face of all needles 112 the same.

[0060] For example, refer to Figure 13 The electroplating anode 1 also includes a cathode surface morphology detector 17, an electric field distribution simulation optimizer 16, and an electric field distribution controller 15. The input of the electric field distribution simulation optimizer 16 is electrically connected to the cathode surface morphology detector 17, and the output of the electric field distribution simulation optimizer 16 is electrically connected to the electric field distribution controller 15. It is used to simulate and optimize the cathode morphology information obtained from the cathode surface morphology detector 17, using the initial anode morphology or the current anode morphology and surface current distribution as a model, to obtain a more optimized anode morphology. The optimized anode morphology information is then transmitted to the electric field distribution controller 15. The electric field distribution controller 15 controls the driver controller 14, which transmits different control signals to each driver 141, including different extension or retraction distances for each needle bar 111.

[0061] Figure 14 This is a schematic diagram of another electroplating anode provided in an embodiment of the present invention, and... Figure 13 The similarities will not be repeated here; please refer to [reference]. Figure 14The electroplating anode 1 also includes an electric field distribution simulation optimizer 16 and an electric field distribution controller 15. The electric field distribution simulation optimizer 16 takes the morphology information of the cathode 2 and the initial anode morphology information as input, performs simulation and optimization to obtain an optimized anode morphology. The electric field distribution controller 15 controls the driver controller 14, which transmits different control signals to each driver 141, including different extension or retraction distances for each needle bar 111.

[0062] Figure 15 This is a schematic diagram of another electroplating anode provided in an embodiment of the present invention, with reference to... Figure 15 The electroplating anode 1 further includes a mold substrate 192, an adhesive layer 193, and a feed plate 191. The adhesive layer 193 is located between the mold substrate 192 and the insulating back plate 12. The shape of the mold substrate 192 facing the insulating back plate 12 is conformally or approximately conformally conformal to the shape of the cathode 2. The protruding portions in the mold substrate 192 correspond to the recessed portions in the cathode 2, and vice versa. The mold substrate 192 can be, for example, a polymer mold. The feed plate 191 is electrically connected to a plurality of conductive units 11. In this embodiment of the invention, the distances of each needle 112 from the insulating back plate 12 are different, but the electroplating signal (e.g., surface current density) on the end face of the needle 112 is the same. The adhesive layer 193 is a polymer adhesive or curing agent to fix the pin. The polymer adhesive or curing agent is insoluble in the electrolyte but soluble in some solvents that are not electrolyte components. In these solvents, the mold substrate 192 and the back plate 12 are insoluble. This allows the mold substrate 192 to be detached from the back plate 12 and the conductive unit 11 if these solvents are used, so that the back plate 12 and the conductive unit 11 can be reused repeatedly.

[0063] Optionally, refer to Figure 15 The electroplating anode 1 includes two insulating back plates 12, and a needle rod 111 is fixed to the two insulating back plates 12. A feed plate 191 is located between the two insulating back plates 12. In this embodiment of the invention, on the one hand, the feed plate 191 is located between the two insulating back plates 12, and the two insulating back plates 12 can be used to protect the feed plate 191. On the other hand, the feed plate 191 is located between the two insulating back plates 12, utilizing the space between the two insulating back plates 12 without occupying space outside the two insulating back plates 12, thereby increasing space utilization and improving the integration of components in the electroplating anode 1.

[0064] Figure 16 This invention provides a flowchart of an electroplating method using an electroplating anode, based on an embodiment of the present invention. Figure 1 The electroplated anode shown is for reference. Figure 16 ,as well as Figure 1An electric field is formed between the electroplating anode 1 and the cathode 2 to be electroplated, thereby forming an electroplating layer on the surface of the cathode 2. The cathode 2 has an uneven morphology. The electroplating anode 1 is a conductive plate or conductive mesh, and the morphology of the conductive plate is conformal to that of the cathode 2. The protruding parts in the conductive plate correspond to the recessed parts in the cathode 2, and vice versa. The electroplating method includes the following steps: S110. Obtain the morphology of the electroplating anode 1 based on the morphology of the cathode 2.

[0065] For example, the input to the electric field distribution simulation optimizer is the cathode morphology information and the initial anode morphology information. The simulation is performed and optimized to obtain the optimized anode morphology.

[0066] S120. Prepare mold substrate 192 according to the morphology of electroplating anode 1.

[0067] The shape of one side of the mold substrate 192 is conformal to the shape of the cathode 2, the protruding part in the mold substrate 192 corresponds to the recessed part in the cathode 2, and the recessed part in the mold substrate 192 corresponds to the protruding part in the cathode 2.

[0068] S130. Prepare electroplating anode 1 according to mold substrate 192.

[0069] S140, Apply an electroplating signal to electroplating anode 1.

[0070] This invention provides an electroplating method using an electroplating anode for forming... Figure 1 The electroplating anode is shown, and the formed electroplating anode is used to electroplat the cathode.

[0071] Figure 17 This is a schematic diagram illustrating the fabrication of an electroplating anode provided by the present invention, with reference to... Figure 17 The preparation of electroplated anode 1 based on mold substrate 192 (i.e., step S130) includes: A conductive layer is coated or deposited on the mold substrate 192 to form an electroplating anode 1.

[0072] For example, an optimized anode geometry is obtained by the electric field distribution simulation optimizer 16; based on the optimized anode geometry, a mold substrate 192 is fabricated. The mold substrate 192 can be, for example, a polymer mold. An insoluble conductive layer or a soluble conductive layer is directly coated or deposited on the surface of the polymer mold to form the electroplated anode 1.

[0073] Figure 18 for Figure 16 A detailed flowchart of the steps included in step S130. Figure 19 This is a schematic diagram illustrating the fabrication of another electroplating anode provided in an embodiment of the present invention, with reference to... Figure 18 and Figure 19The preparation of electroplated anode 1 based on mold substrate 192 (i.e., step S130) includes: S1321. A planar conductive plate 102 is provided.

[0074] The planar conductive plate 102 can be plate-shaped or mesh-shaped.

[0075] S1322, Press the flat conductive plate 102 with the mold substrate 192 and the cathode 2 to deform it and keep it in shape with the cathode 2, and remove the mold substrate 192 to form the electroplating anode 1.

[0076] For example, the mold substrate 192 can be a rigid mold.

[0077] Figure 20 This is a flowchart of another electroplating method using an electroplating anode provided in an embodiment of the present invention, based on... Figures 2-15 The electroplated anode shown is for reference. Figure 20 ,as well as Figures 2-15 An electroplating anode 1 and a cathode 2 to be electroplated form an electric field to form an electroplating layer on the surface of the cathode 2. The cathode 2 has an uneven morphology. The electroplating anode 1 includes an insulating backplate 12 and multiple conductive units 11. Each conductive unit 11 includes a needle rod 111 and a needle tip 112 disposed at one end of the needle rod 111. The end with the needle tip 112 is the electroplating end of the conductive unit 11. The conductive unit 11 is fixed to the insulating backplate 12 by the needle rod 111. Multiple conductive units 11 are arranged in an array, and any two conductive units 11 are electrically insulated from each other. The electroplating method includes the following steps: S210. Obtain the anode geometry and surface current distribution based on the morphology of cathode 2.

[0078] Among them, surface current distribution refers to the surface current distribution of the anode.

[0079] S220: Control the distance between each needle 112 and the insulating backplate 12 according to the anode geometry, and control the individual electroplating signal applied to each conductive unit 11 according to the anode surface current distribution; or, control all needles 112 to have the same distance from the insulating backplate 12, and control the individual electroplating signal applied to each conductive unit 11 according to the anode surface current distribution; or, control the distance between each needle 112 and the insulating backplate 12 according to the anode geometry, and control the same electroplating signal to be applied to all conductive units 11.

[0080] The anode geometry and surface current distribution can be obtained by the electric field distribution simulation optimizer 16.

[0081] For example, in conjunction with the reference Figure 8 and Figure 9The distance between each needle 112 and the insulating backplate 12 can be controlled according to the anode geometry, and the individual electroplating signal applied to each conductive unit 11 can be controlled according to the current distribution on the anode surface.

[0082] For example, in conjunction with the reference Figure 10 and Figure 11 It can control all needles 112 to have the same distance from the insulating back plate 12, and control the application of a separate electroplating signal to each conductive unit 11 according to the current distribution on the anode surface.

[0083] For example, in conjunction with the reference Figure 13 , Figure 14 and Figure 15 The distance between each needle 112 and the insulating backplate 12 is controlled according to the anode geometry, thereby controlling the application of the same electroplating signal to all conductive units 11.

[0084] This invention provides an electroplating method using an electroplating anode for forming... Figures 2-15 The electroplating anode is shown, and the formed electroplating anode is used to electroplat the cathode.

[0085] Figure 21 A flowchart of another electroplating method using an electroplating anode provided in an embodiment of the present invention is shown below. Figure 8 , Figure 10 , Figure 13 , Figure 20 and Figure 21 The electroplating anode 1 includes a cathode surface morphology detector 17 and an electric field distribution simulation optimizer 16. Obtaining the anode geometry based on the cathode 2 morphology (i.e., step S210) includes: S2111, Cathode surface morphology detector 17 detects the morphology information of cathode 2 in real time.

[0086] S2112, the electric field distribution simulation optimizer 16 obtains the anode geometry and surface current distribution in real time based on the morphology information of the cathode 2.

[0087] Figure 22 A flowchart of another electroplating method using an electroplating anode provided in an embodiment of the present invention is shown below. Figure 9 , Figure 11 , Figure 14 , Figure 20 and Figure 22 The electroplating anode 1 also includes an electric field distribution simulation optimizer 16. Obtaining the anode geometry and surface current distribution based on the cathode 2 morphology (i.e., step S210) includes: S2121, Electric field distribution simulation optimizer 16 obtains the anode geometry and surface current distribution based on the morphology of cathode 2 and anode model.

[0088] Optionally, refer to Figure 8 , Figure 9 , Figure 13 , Figure 14 and Figure 20 The electroplating anode 1 includes a plurality of actuators 141, each actuator 141 being connected to the end of the needle bar 111 away from the needle tip 112, for controlling the distance between the needle tip 112 and the insulating backing plate 12. In step S220, controlling the distance between each needle tip 112 and the insulating backing plate 12 according to the anode geometry includes: Based on the anode geometry, each actuator 141 drives the conductive unit 11 connected to it to move, thereby controlling the distance between each needle 112 and the insulating backplate 12.

[0089] Optionally, refer to Figure 5 , Figure 7 and Figure 20 The electroplated anode 1 also includes an insulating thread 114 and an insulating nut 113. The insulating nut 113 is fixed to the insulating back plate 12, and the insulating thread 114 surrounds the needle bar 111, with the insulating thread 114 threadedly engaging with the insulating nut 113. In step S220, controlling the distance between each needle tip 112 and the insulating back plate 12 according to the anode geometry includes: Based on the anode geometry, the insulating thread 114 is rotated in the insulating nut 113 to control the distance between each needle 112 and the insulating backing plate 12.

[0090] Figure 23 This is a flowchart illustrating the fabrication process of an electroplating anode, as provided in an embodiment of the present invention. Figure 24 This is a schematic diagram illustrating the fabrication of another electroplating anode provided in an embodiment of the present invention, with reference to... Figure 21 In step S220, controlling the distance between each needle 112 and the insulating backplate 12 according to the anode geometry includes: S2261. Prepare mold substrate 192 according to anode geometry.

[0091] S2262, Using the mold substrate 192, press one end of the plurality of needle bars 111 opposite to the needle tip 112 so that the needle tip 112 of the plurality of conductive units 11 has an anode geometry.

[0092] S2263. An adhesive or curing agent is filled between the mold substrate 192 and the insulating back plate 12, and the adhesive or curing agent is cured to form an adhesive layer 193.

[0093] Figure 25 This is a schematic diagram of another electroplating anode provided in an embodiment of the present invention, with reference to... Figure 25The cathode 2 includes a first surface 21 and a second surface 22. Two electroplating anodes 1 are designated as first electroplating anodes D1 and D2. First electroplating anode D1 faces the first surface 21 of the cathode 2 and maintains its shape. Second electroplating anode D2 faces the second surface 22 of the cathode 2 and maintains its shape. First electroplating anode D1 and second electroplating anode D2 can be used simultaneously to electroplat the first surface 21 and the second surface 22 of the cathode 2. Alternatively, first electroplating anode D1 can be used to electroplat the first surface 21 of the cathode 2, and then second electroplating anode D2 can be used to electroplat the second surface 22 of the cathode 2. Alternatively, second electroplating anode D2 can be used to electroplat the second surface 22 of the cathode 2, and then first electroplating anode D1 can be used to electroplat the first surface 21 of the cathode 2. The electroplating anodes 1 (including first electroplating anode D1 and second electroplating anode D2) can be any of the electroplating anodes described in the above embodiments. The electroplating method for the electroplating anode 1 can be any of the electroplating methods described in the above embodiments.

[0094] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, combinations, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

Claims

1. An electroplating anode, wherein the electroplating anode forms an electric field with a cathode to be electroplated to form an electroplated layer on the surface of the cathode, the cathode having an uneven morphology, characterized in that, include: Insulating backing plate; Multiple conductive units, each conductive unit including a needle rod and a needle tip disposed at one end of the needle rod, the end with the needle tip being the electroplated end of the conductive unit, the conductive unit being fixed to the insulating back plate by the needle rod; the multiple conductive units are arranged in an array, and any two conductive units are electrically insulated; It also includes an electroplating signal controller and multiple feed lines. One of the conductive units is electrically connected to the electroplating signal controller via one of the feed lines. The electroplating signal controller is used to apply an electroplating signal to the conductive unit. It also includes a cathode surface morphology detector, an electric field distribution simulation optimizer, and an electric field distribution controller; the input terminal of the electric field distribution simulation optimizer is electrically connected to the cathode surface morphology detector, the output terminal of the electric field distribution simulation optimizer is electrically connected to the electric field distribution controller, and the electric field distribution controller is electrically connected to the electroplating signal controller; The electric field distribution simulation optimizer is used to simulate and optimize the cathode morphology information obtained from the cathode surface morphology detector, using the initial anode morphology or the current anode morphology and surface current distribution as a model, to obtain a more optimized surface current distribution. The optimized surface current distribution information is then transmitted to the electric field distribution controller, which controls the electroplating signal controller to output the electroplating signal to the conductive unit, thereby adjusting the anode geometry and / or the feed size, mode and distribution in real time. Or may also include: An electric field distribution simulation optimizer is used to establish an anode model based on the morphology of the cathode; An electric field distribution controller, electrically connected to the electroplating signal controller and the electric field distribution simulation optimizer, is used to simulate and optimize the acquired cathode morphology information, using the initial anode morphology and surface current distribution as models, to obtain a more optimized surface current distribution. The optimized surface current distribution information is then transmitted to the electric field distribution controller, which controls the electroplating signal output by the electroplating signal controller to the conductive unit, thereby adjusting the anode geometry and / or the feed size, mode, and distribution.

2. The electroplating anode according to claim 1, characterized in that, The surface of the needle tip facing away from the insulating backplate is a convex curved surface, which protrudes along the direction away from the insulating backplate.

3. The electroplating anode according to claim 1, characterized in that, The surface of the needle tip facing away from the insulating backplate is flat.

4. The electroplating anode according to claim 1, characterized in that, The distance between each needle and the insulating backplate is different, and the electroplating signal on the end face of each needle is the same.

5. The electroplating anode according to claim 1, characterized in that, The shape of the needle's vertical projection onto the insulating backplate is a regular hexagon, square, rectangle, circle, or ellipse.

6. The electroplating anode according to claim 1, characterized in that, Multiple needles are arranged in a row, with adjacent rows of needles staggered.

7. The electroplating anode according to claim 1, characterized in that, The needle bar and needle tip of the conductive unit are made of titanium alloy or are made of titanium alloy with a conductive layer coated on the surface.

8. The electroplating anode according to claim 1, characterized in that, It includes two insulating back plates, and the needle bar is fixed to the two insulating back plates.

9. The electroplating anode according to claim 1, characterized in that, Includes two insulating back plates, and the needle bar is fixed to the two insulating back plates; The portion of the feeder wire that is electrically connected to the conductive unit is located between the two insulating back plates.

10. The electroplating anode according to claim 1, characterized in that, It also includes multiple drivers connected to the end of the needle bar away from the needle tip, for controlling the distance between the needle tip and the insulating backplate.

11. The electroplating anode according to claim 10, characterized in that, All of the drivers are controlled by a driver controller that sends different control signals to each driver, including different extension or retraction distances for each needle bar.

12. The electroplating anode according to claim 1, characterized in that, It also includes an insulating thread and an insulating nut, the insulating nut being fixed to the insulating back plate, the insulating thread surrounding the needle bar, and the insulating thread threading into the insulating nut.

13. The electroplating anode according to claim 1, characterized in that, It also includes a mold substrate, an adhesive layer, and a power supply board. The adhesive layer is located between the mold substrate and the insulating back plate. The shape of the mold substrate facing the insulating back plate is conformal to the shape of the cathode. The protruding part in the mold substrate corresponds to the recessed part in the cathode, and the recessed part in the mold substrate corresponds to the protruding part in the cathode. The power supply board is electrically connected to the plurality of conductive units.

14. The electroplating anode according to claim 13, characterized in that, Includes two insulating back plates, and the needle bar is fixed to the two insulating back plates; The power supply board is located between the two insulating back plates.

15. An electroplating method using the electroplating anode of claim 1, wherein the electroplating anode forms an electric field with a cathode to be electroplated to form an electroplating layer on the surface of the cathode, the cathode having an uneven morphology, characterized in that, The electroplating anode includes an insulating back plate and multiple conductive units. Each conductive unit includes a needle rod and a needle tip disposed at one end of the needle rod. The end with the needle tip is the electroplating end of the conductive unit. The conductive unit is fixed to the insulating back plate by the needle rod. The multiple conductive units are arranged in an array, and any two conductive units are electrically insulated from each other; The electroplating method includes: The anode geometry and surface current distribution are obtained based on the cathode morphology; The distance between each needle and the insulating backing plate is controlled according to the anode geometry, and an individual electroplating signal is applied to each conductive unit according to the surface current distribution; or, all needles are controlled to have the same distance from the insulating backing plate, and an individual electroplating signal is applied to each conductive unit according to the surface current distribution; or, the distance between each needle and the insulating backing plate is controlled according to the anode geometry, and the same electroplating signal is applied to all conductive units. The electroplating anode includes a cathode surface morphology detector and an electric field distribution simulation optimizer; Obtaining the anode geometry and surface current distribution based on the cathode morphology includes: The cathode surface morphology detector detects the morphology information of the cathode in real time; The electric field distribution simulation optimizer obtains the anode geometry and surface current distribution in real time based on the cathode morphology information; Alternatively, the electroplating anode may also include an electric field distribution simulation optimizer; Obtaining the anode geometry and surface current distribution based on the cathode morphology includes: The electric field distribution simulation optimizer obtains the anode geometry and surface current distribution based on the cathode morphology and the anode model.

16. The electroplating method according to claim 15, characterized in that, The electroplating anode includes multiple drivers, which are connected to the end of the needle bar away from the needle tip, and are used to control the distance between the needle tip and the insulating backplate; Controlling the distance between each needle and the insulating backplate based on the anode geometry includes: Each of the drivers is driven to move the conductive unit connected to the driver according to the anode geometry, so as to control the distance between each needle and the insulating backplate.

17. The electroplating method according to claim 15, characterized in that, The electroplating anode also includes an insulating thread and an insulating nut, the insulating nut being fixed to the insulating back plate, the insulating thread surrounding the needle bar, and the insulating thread threading into the insulating nut. Controlling the distance between each needle and the insulating backplate based on the anode geometry includes: Based on the anode geometry, the insulating thread is rotated in the insulating nut to control the distance between each needle and the insulating backing plate.

18. The electroplating method according to claim 15, characterized in that, Controlling the distance between each needle and the insulating backplate based on the anode geometry includes: Mold substrates are prepared based on the anode geometry; The mold substrate is used to press one end of the plurality of needle bars opposite to the needle tip, so that the needle tips of the plurality of conductive units have an anode geometry; An adhesive or curing agent is filled between the mold substrate and the insulating back plate, and the adhesive or curing agent is cured to form an adhesive layer.

19. An electroplating anode, wherein the cathode comprises a first surface and a second surface, characterized in that, include: A first electroplating anode and a second electroplating anode, wherein the first electroplating anode is opposite to the first surface of the cathode and maintains the shape of the first surface of the cathode, and the second electroplating anode is opposite to the second surface of the cathode and maintains the shape of the second surface of the cathode; Wherein, the first electroplating anode and the second electroplating anode include the electroplating anode as described in any one of claims 1-14.

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