A dynamic distribution regulation device for current density of an electroplating tank

Abstract

The application relates to the technical field of electroplating tanks, and discloses a dynamic distribution regulation and control device for current density of an electroplating tank, which solves the problem that the current density of an existing electroplating tank is inconvenient to dynamically distribute and regulate, and comprises a cathode regulation and control mechanism and an electroplating tank body, the cathode regulation and control mechanism is located outside the electroplating tank body, a controller is fixedly arranged on the front face of the electroplating tank body, the cathode regulation and control mechanism is composed of a first supporting assembly, a second supporting assembly, a longitudinal moving assembly and a transverse moving assembly, the first supporting assembly and the second supporting assembly are respectively located at two ends of the electroplating tank body, the longitudinal moving assembly is installed at the top end of the first supporting assembly and the second supporting assembly, and the transverse moving assembly is installed at the top end of the longitudinal moving assembly; through the device, the current density can be dynamically regulated and controlled, and the electroplating efficiency and the uniformity of the plated layer are improved.

Description

Technical Field

[0001] This invention belongs to the field of electroplating tank technology, specifically a dynamic distribution control device for current density in electroplating tanks. Background Technology

[0002] In existing electroplating tanks, the workpiece is connected to the cathode during operation, and the anode rod is usually fixed inside the electroplating tank. The cathode and anode are in a relatively stable state, which can easily cause polarization of the concentration difference of the electroplating solution, affecting the uniformity of the coating and the electroplating efficiency. Therefore, this application proposes a dynamic distribution control device for the current density of the electroplating tank. Summary of the Invention

[0003] In order to overcome the shortcomings of the prior art, the present invention provides a dynamic distribution control device for the current density of an electroplating tank, which effectively solves the problem that the current density of the existing electroplating tank is not easy to dynamically distribute and control.

[0004] To achieve the above objectives, the present invention provides the following technical solution: a dynamic distribution control device for current density in an electroplating tank, comprising a cathode control mechanism and an electroplating tank body. The cathode control mechanism is located outside the electroplating tank body, and a controller is fixedly installed on the front side of the electroplating tank body. The cathode control mechanism is composed of a first support component, a second support component, a longitudinal movement component, and a transverse movement component. The first support component and the second support component are respectively located at both ends of the electroplating tank body. The longitudinal movement component is installed at the top of the first support component and the second support component, and the transverse movement component is installed at the top of the longitudinal movement component.

[0005] The first support assembly and the second support assembly both consist of two support legs, a support beam, a support vertical plate, and an electric telescopic rod. The two support legs are fixedly connected to the two ends of the bottom of the support beam, the support vertical plate is fixedly connected to one end of the support beam, and the electric telescopic rod is connected through the support vertical plate.

[0006] The longitudinal moving component consists of a rectangular frame, two supporting vertical plates, two electric telescopic rods, and four rollers. The two supporting vertical plates are fixedly connected to both sides of one end of the rectangular frame. The two electric telescopic rods are connected through the two supporting vertical plates. The four rollers are installed at the four corners of the bottom of the rectangular frame. The rectangular frame is connected to the electric telescopic rods.

[0007] The lateral movement assembly consists of two U-shaped support frames, two connecting beams, and four rollers. The two connecting beams are fixedly connected between the two U-shaped support frames, and the rollers are installed at both ends of the bottom of the two U-shaped support frames. The two U-shaped support frames are respectively connected to two electric telescopic rods.

[0008] Preferably, the top of the supporting beam is provided with a limiting groove that matches the roller.

[0009] Preferably, the top two sides of the rectangular frame are provided with limiting grooves that match the rollers.

[0010] Preferably, the top of the U-shaped support frame is provided with several placement slots.

[0011] Compared with the prior art, the beneficial effects of the present invention are:

[0012] (1) In operation, by setting up a cathode control mechanism consisting of a first support component, a second support component, a longitudinal moving component and a transverse moving component, the workpiece can be stably supported and the workpiece can be driven to move continuously and reciprocally inside the electroplating tank. On the one hand, the plating solution can be stirred, and on the other hand, the distance between the anode and the plating solution can be adjusted, thereby realizing the dynamic distribution adjustment of the current density and improving the electroplating efficiency and the uniformity of the plating layer.

[0013] (2) By setting the first limiting groove, the first roller can be limited; by setting the second limiting groove, the second roller can be limited; by setting the placement groove, the workpiece support frame can be limited and supported. Attached Figure Description

[0014] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used together with the embodiments of the invention to explain the invention and do not constitute a limitation thereof.

[0015] In the attached diagram:

[0016] Figure 1 This is one of the structural schematic diagrams of the dynamic distribution control device for current density in the electroplating tank according to the present invention;

[0017] Figure 2 This is the second schematic diagram of the dynamic distribution control device for current density in the electroplating tank according to the present invention.

[0018] Figure 3 This is a schematic diagram of the first support component structure of the present invention;

[0019] Figure 4 This is a schematic diagram of the longitudinal moving component structure of the present invention;

[0020] Figure 5 This is a schematic diagram of the lateral movement component structure of the present invention;

[0021] In the diagram: 1. Cathode control mechanism; 2. Electroplating tank body; 3. Controller; 4. First support assembly; 5. Second support assembly; 6. Longitudinal movement assembly; 7. Lateral movement assembly; 8. Support leg; 9. Support beam; 10. Support vertical plate one; 11. Electric telescopic rod one; 12. Rectangular frame; 13. Support vertical plate two; 14. Electric telescopic rod two; 15. Roller one; 16. U-shaped support frame; 17. Connecting beam; 18. Roller two; 19. Limiting groove one; 20. Limiting groove two; 21. Placement slot. Detailed Implementation

[0022] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0023] Depend on Figures 1 to 5 The present invention discloses a dynamic distribution control device for current density in an electroplating tank, comprising a cathode control mechanism 1 and an electroplating tank body 2. The cathode control mechanism 1 is located outside the electroplating tank body 2, and a controller 3 is fixedly mounted on the front side of the electroplating tank body 2. The cathode control mechanism 1 is composed of a first support component 4, a second support component 5, a longitudinal movement component 6, and a transverse movement component 7. The first support component 4 and the second support component 5 are respectively located at both ends of the electroplating tank body 2. The longitudinal movement component 6 is installed at the top of the first support component 4 and the second support component 5, and the transverse movement component 7 is installed at the top of the longitudinal movement component 6. The first support component 4 and the second support component 5 are each composed of two support legs 8, a support beam 9, a support vertical plate 10, and an electric telescopic rod 11. The two support legs 8 are respectively fixedly connected to the two ends of the bottom of the support beam 9, and the support vertical plate 10 is fixed. Connected to one end of the supporting beam 9, the electric telescopic rod 11 passes through and is connected to the supporting vertical plate 10. The longitudinal moving component 6 consists of a rectangular frame 12, two supporting vertical plates 13, two electric telescopic rods 14, and four rollers 15. The two supporting vertical plates 13 are fixedly connected to both sides of one end of the rectangular frame 12. The two electric telescopic rods 14 pass through and are connected to the two supporting vertical plates 13. The four rollers 15 are installed at the four corners of the bottom of the rectangular frame 12. The rectangular frame 12 is connected to the electric telescopic rod 11. The transverse moving component 7 consists of two U-shaped support frames 16, two connecting beams 17, and four rollers 18. The two connecting beams 17 are fixedly connected between the two U-shaped support frames 16. The rollers 18 are installed at both ends of the bottom of the two U-shaped support frames 16. The two U-shaped support frames 16 are connected to the two electric telescopic rods 14.

[0024] The workpiece support frame is placed at the top of the U-shaped support frame 16. The electric telescopic rod 11 drives the rectangular frame 12 to move, and the roller 15 rolls at the top of the support beam 9, thereby driving the entire longitudinal moving assembly 6 to move longitudinally. The electric telescopic rod 2 14 drives the U-shaped support frame 16 to move, and the roller 2 18 moves at the top of the rectangular frame 12, thereby enabling the workpiece to move continuously inside the electroplating tank body 2, and thus enabling dynamic control of the current density.

[0025] Depend on Figures 3 to 5 The top of the support beam 9 is provided with a limiting groove 19 that matches the roller 15, thereby limiting the roller 15. Both sides of the top of the rectangular frame 12 are provided with limiting grooves 20 that match the roller 18, thereby limiting the roller 18. The top of the U-shaped support frame 16 is provided with several placement slots 21, thereby limiting the workpiece support frame.

[0026] In operation, by setting up a cathode control mechanism consisting of a first support component, a second support component, a longitudinal moving component, and a transverse moving component, the workpiece can be stably supported and driven to move continuously and reciprocally inside the electroplating tank. On the one hand, it can agitate the plating solution, and on the other hand, it can adjust the distance between the workpiece and the anode, thereby achieving dynamic adjustment of the current density distribution and improving electroplating efficiency and coating uniformity. By setting a limiting groove one, the first roller can be limited; by setting a limiting groove two, the second roller can be limited; and by setting a placement groove, the workpiece support frame can be limited and supported.

Claims

1. A dynamic distribution control device for current density in an electroplating tank, comprising a cathode control mechanism (1) and an electroplating tank body (2), characterized in that: The cathode control mechanism (1) is located outside the electroplating tank body (2). A controller (3) is fixedly installed on the front of the electroplating tank body (2). The cathode control mechanism (1) is composed of a first support component (4), a second support component (5), a longitudinal movement component (6), and a transverse movement component (7). The first support component (4) and the second support component (5) are located at the two ends of the electroplating tank body (2), respectively. The longitudinal movement component (6) is installed at the top of the first support component (4) and the second support component (5), and the transverse movement component (7) is installed at the top of the longitudinal movement component (6). The first support assembly (4) and the second support assembly (5) are both composed of two support legs (8), a support beam (9), a support vertical plate (10) and an electric telescopic rod (11). The two support legs (8) are fixedly connected to the two ends of the bottom of the support beam (9), the support vertical plate (10) is fixedly connected to one end of the support beam (9), and the electric telescopic rod (11) is connected through the support vertical plate (10). The longitudinal moving component (6) consists of a rectangular frame (12), two supporting vertical plates (13), two electric telescopic rods (14), and four rollers (15). The two supporting vertical plates (13) are fixedly connected to both sides of one end of the rectangular frame (12). The two electric telescopic rods (14) are connected through the two supporting vertical plates (13). The four rollers (15) are installed at the four corners of the bottom of the rectangular frame (12). The rectangular frame (12) is connected to the electric telescopic rods (11). The lateral movement component (7) consists of two U-shaped support frames (16), two connecting beams (17), and four rollers (18). The two connecting beams (17) are fixedly connected between the two U-shaped support frames (16), and the rollers (18) are installed at both ends of the bottom of the two U-shaped support frames (16). The two U-shaped support frames (16) are respectively connected to two electric telescopic rods (14).

2. The dynamic distribution control device for current density in an electroplating tank according to claim 1, characterized in that: The top of the supporting beam (9) is provided with a limiting groove (19) that matches the roller (15).

3. The dynamic distribution control device for current density in an electroplating tank according to claim 1, characterized in that: The top two sides of the rectangular frame (12) are provided with limiting grooves (20) that match the rollers (18).

4. The dynamic distribution control device for current density in an electroplating tank according to claim 1, characterized in that: The top of the U-shaped support frame (16) is provided with several placement slots (21).

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