Automated measurement method for optical microscopic measurement, and device and computer program product thereof

Abstract

The application relates to an automatic measurement method for optical microscopic measurement, a device and a computer program product thereof. The method comprises the following steps: in response to a measurement parameter configuration request for a target workpiece, acquiring and displaying a standard workpiece image corresponding to the target workpiece; in response to image positioning feature selection information, extracting an image positioning feature from the standard workpiece image, constructing and displaying a standard image coordinate system corresponding to the standard workpiece image; in response to measurement point configuration information for the standard workpiece image, determining at least one standard measurement point included in the standard workpiece image and a target measurement mode corresponding to the standard measurement point; performing feature matching on the target workpiece image according to the image positioning feature, and constructing a target image coordinate system corresponding to the target workpiece image; and performing measurement on the target measurement point according to the target measurement mode, to obtain a measurement result corresponding to the target workpiece. The method can improve the efficiency of workpiece measurement.

Description

[0001] This application is a divisional application of the invention patent with application number 2026100088833, application date of 2026.1.6, and invention title "Automated Measurement Method, Device, Computer Equipment, Medium and Program Product". Technical Field

[0002] This application relates to the field of optical inspection technology, and in particular to an automated measurement method, apparatus, computer equipment, computer-readable storage medium, and computer program product for optical microscopy. Background Technology

[0003] Currently, optical microscopy technology is widely used in various fields such as scientific and technological research and industrial measurement. White light interferometers and confocal microscopes can be used as inspection instruments for sub-nanometer level measurement of various precision devices and material surfaces. They have the characteristics of high precision, high resolution, and non-contact scanning imaging, and can realize the three-dimensional morphology reconstruction of the workpiece under test. They can be widely used in semiconductor manufacturing and packaging process inspection, micro-nano inspection, precision measurement and aerospace fields.

[0004] In some application scenarios, the workpieces to be tested are often in batches or the same workpiece contains a large number of units to be tested, such as wafers. This often requires repeatable measurements on a large number of workpieces with the same testing requirements. For testing equipment, efficiency and accuracy are often contradictory metrics. Therefore, how to rapidly improve testing efficiency while meeting the requirements for testing accuracy is a pressing issue that needs to be addressed. Summary of the Invention

[0005] Therefore, it is necessary to provide an automated measurement method, apparatus, computer equipment, computer-readable storage medium, and computer program product for optical microscopy that can improve detection efficiency in response to the above-mentioned technical problems.

[0006] In a first aspect, this application provides an automated measurement method, the method comprising:

[0007] In response to a request to configure measurement parameters for a target workpiece, the system acquires and displays a standard workpiece image corresponding to the target workpiece.

[0008] In response to image positioning feature selection information for the standard workpiece image, image positioning features are extracted from the standard workpiece image;

[0009] Based on the image positioning features, a standard image coordinate system corresponding to the standard workpiece image is constructed and displayed;

[0010] In response to the measurement point configuration information for the standard workpiece image, at least one standard measurement point included in the standard workpiece image and the target measurement method corresponding to the standard measurement point are determined;

[0011] In response to a measurement request for the target workpiece, a target workpiece image is acquired.

[0012] Based on the image positioning features, feature matching is performed on the target workpiece image, and a target image coordinate system corresponding to the target workpiece image is constructed based on the matched image features.

[0013] Based on the standard coordinates of the at least one standard measurement point in the standard image coordinate system, locate the target measurement point corresponding to the target workpiece image in the target image coordinate system;

[0014] The target measurement point is measured according to the target measurement method to obtain the measurement result corresponding to the target workpiece.

[0015] In some embodiments, the step of acquiring and displaying a standard workpiece image corresponding to the target workpiece in response to a measurement parameter configuration request for the target workpiece includes:

[0016] In response to the measurement parameter configuration request, a preset graphical configuration interface is displayed. The graphical configuration interface includes a first image display area, a second image display area, a configuration information display area, and an operation toolbox area. The first image display area is used to display the regional image of the worktable acquired by the preset camera. The second image display area is used to display the current position information of the preset camera relative to the worktable. The configuration information display area is used to record and display the configured standard measurement points and the target measurement method in the configuration order. The operation toolbox area is used to provide graphical operation tools, including drawing tools for defining geometric objects in the first image display area and / or the second image display area, and configuration triggering tools for starting the preset measurement process.

[0017] In some embodiments, extracting image positioning features from the standard workpiece image in response to image positioning feature selection information for the standard workpiece image includes:

[0018] In response to the selection information of the first drawing tool in the operation toolbox area, a first geometric region defined by the first drawing tool is determined in the first image display area;

[0019] The image within the first geometric region is analyzed, and at least one geometric feature of a preset geometric type is extracted as the image localization feature;

[0020] The step of constructing and displaying the standard image coordinate system corresponding to the standard workpiece image based on the image positioning features includes:

[0021] In response to the selection of a coordinate system construction tool in the operation toolbox area, the standard image coordinate system is generated and displayed in the first image display area based on at least two features specified by the user from the image positioning features; wherein the at least two features are used to determine the origin of the coordinate system and the direction of at least one coordinate axis.

[0022] In some embodiments, determining at least one standard measurement point included in the standard workpiece image and the target measurement method corresponding to the standard measurement point in response to measurement point configuration information for the standard workpiece image includes:

[0023] In response to the selection information of the second drawing tool in the operation toolbox area, the at least one standard measurement point is determined according to the position of the selection information, and the standard coordinates and configuration timing information of the at least one standard measurement point are displayed in the configuration information display area;

[0024] And / or, in response to the selection information of the array generation tool in the operation toolbox area, a preset array parameter input interface is displayed;

[0025] In response to the setting information of measurement range, distribution quantity and order in the array parameter input interface, at least one standard measurement point is generated in the first image display area according to the setting parameters indicated by the setting information, and the standard coordinates and configuration timing information of the at least one standard measurement point are displayed in the configuration information display area.

[0026] In some embodiments, determining at least one standard measurement point included in the standard workpiece image and the target measurement method corresponding to the standard measurement point in response to measurement point configuration information for the standard workpiece image includes:

[0027] In response to configuration trigger information for any standard measurement point displayed in the configuration information display area, a preset measurement parameter configuration panel is displayed;

[0028] In response to the acquisition mode selection information in the measurement parameter configuration panel, configurable measurement parameter items included in the selected target image acquisition mode are configured for any standard measurement point; the image acquisition mode includes a first imaging mode for acquiring two-dimensional contour information and / or a second imaging mode for acquiring three-dimensional topographic information; wherein, the configurable measurement parameter items corresponding to the second imaging mode include the magnification of the objective lens used for scanning and the coverage mode of the scanning field of view; the coverage mode includes single-field scanning and multi-field stitching scanning;

[0029] The target measurement method is obtained in response to the configuration information for the configurable measurement parameter item.

[0030] In some embodiments, determining at least one standard measurement point included in the standard workpiece image and the target measurement method corresponding to the standard measurement point in response to measurement point configuration information for the standard workpiece image includes:

[0031] In response to selecting the second imaging mode for the standard measurement point, preset data analysis chain configuration options are displayed in the measurement parameter configuration panel;

[0032] In response to the triggering information of the data analysis chain configuration options, the chain processing module configuration interface is displayed;

[0033] In response to the configuration information in the chain processing module configuration interface, a data analysis chain is configured for the standard measurement point configured with the second imaging mode, and the data analysis chain is recorded as the target measurement method; wherein, the data analysis chain includes at least one data preprocessing module and / or at least one parameter analysis module configured in sequence, the data preprocessing module is used to perform noise filtering or error correction on the raw three-dimensional data obtained by scanning, and the parameter analysis module is used to calculate preset surface morphology parameters based on the preprocessed data.

[0034] In some embodiments, if the number of standard measurement points is multiple, the method further includes:

[0035] In response to the selection information of multiple standard measurement points in the configuration information display area, group operation options corresponding to the multiple standard measurement points are displayed; the group operation options include the option to create a point group.

[0036] In response to the selection information of the create point group option, the multiple standard measurement points selected by the selection information are created as a measurement point group and identified as a group in the configuration information display area;

[0037] In response to the configuration trigger information for the measurement point group, a target measurement method is uniformly configured for the measurement point group.

[0038] In some embodiments, the method further includes:

[0039] In response to editing information for the configuration information display area, the editing information includes at least one of the following: adjusting the measurement timing of measurement points, adding or deleting the standard measurement points, modifying the position of the standard measurement points, or enabling / disabling the measurement timing.

[0040] The standard measurement points and the target measurement method are adjusted according to the editing information.

[0041] In some embodiments, the step of measuring the target measurement point according to the target measurement method to obtain the measurement result corresponding to the target workpiece includes:

[0042] The actual measurement data of each target measurement point included in the measurement results are compared with the preset design threshold to obtain the deviation value and the pass / fail judgment result of each target measurement point.

[0043] In the second image display area, the corresponding pass / fail judgment result is superimposed and displayed at the actual position of each target measurement point in the target image coordinate system.

[0044] Secondly, this application also provides an automated measuring device, the device comprising:

[0045] The display module is used to obtain and display the standard workpiece image corresponding to the target workpiece in response to a request for configuring measurement parameters for the target workpiece.

[0046] The extraction module is configured to extract image positioning features from the standard workpiece image in response to image positioning feature selection information for the standard workpiece image;

[0047] The construction module is used to construct and display the standard image coordinate system corresponding to the standard workpiece image based on the image positioning features;

[0048] The determination module is configured to determine, in response to the measurement point configuration information for the standard workpiece image, at least one standard measurement point included in the standard workpiece image and the target measurement method corresponding to the standard measurement point;

[0049] The acquisition module is used to acquire a target workpiece image in response to a measurement request for the target workpiece;

[0050] The matching module is used to perform feature matching in the target workpiece image based on the image positioning features, and to construct a target image coordinate system corresponding to the target workpiece image based on the matched image features;

[0051] The positioning module is used to locate the target measurement point corresponding to the target workpiece image in the target image coordinate system according to the standard coordinates of the at least one standard measurement point in the standard image coordinate system;

[0052] The measurement module is used to measure the target measurement point according to the target measurement method to obtain the measurement result corresponding to the target workpiece.

[0053] Thirdly, this application also provides a computer device, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the steps included in any of the aforementioned automated measurement method embodiments.

[0054] Fourthly, this application also provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the steps included in any of the aforementioned automated measurement method embodiments.

[0055] Fifthly, this application also provides a computer program product, including a computer program that, when executed by a processor, implements the steps included in any of the aforementioned automated measurement method embodiments.

[0056] The aforementioned automated measurement methods, devices, computer equipment, computer-readable storage media, and computer program products, by pre-setting measurement programs based on standard workpiece images and achieving accurate reproduction of measurement tasks through automatic feature matching and coordinate mapping in actual measurements, can effectively avoid the repetitive manual configuration of each workpiece in related technologies, significantly improving measurement efficiency. They are particularly suitable for workpiece inspection with a large number of repetitive units. The embodiments of the present invention can automatically complete measurement, data comparison, and result visualization, transforming raw data into intuitive quality decision information and improving the automation and intelligence level of quality control. Attached Figure Description

[0057] To more clearly illustrate the technical solutions in the embodiments of this application or related technologies, the drawings used in the description of the embodiments of this application or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0058] Figure 1 This is a diagram illustrating the application environment of a workpiece measurement method in one embodiment;

[0059] Figure 2 This is a flowchart illustrating a workpiece measurement method in one embodiment;

[0060] Figure 3 This is a schematic diagram of a graphical configuration interface in a workpiece measurement method according to another embodiment;

[0061] Figure 4 This is a schematic diagram of the image coordinate system in a workpiece measurement method according to another embodiment;

[0062] Figure 5 This is a schematic diagram of the array parameter input interface and the program bar displaying measurement point information in another embodiment of the workpiece measurement method;

[0063] Figure 6 A schematic diagram of a measurement parameter configuration panel in a workpiece measurement method according to another embodiment;

[0064] Figure 7 This is a schematic diagram of the measurement parameters of the measurement point group in the workpiece measurement method of another embodiment;

[0065] Figure 8 This is a structural block diagram of an automated measurement device in one embodiment;

[0066] Figure 9 This is an internal structural diagram of a computer device in one embodiment. Detailed Implementation

[0067] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0068] It should be noted that the terms "first," "second," etc., used in this application can be used to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish the first element from the second element. The terms "comprising" and "having," and any variations thereof, used in this application, are intended to cover non-exclusive inclusion. The term "multiple" used in this application refers to two or more. The term "and / or" used in this application refers to one of the embodiments, or any combination of multiple embodiments.

[0069] The workpiece measurement method (or automated measurement method) provided in this application embodiment can be applied to, for example... Figure 1The optical microscopic measuring instrument shown can be a white light interferometer, confocal microscope, or white light interferometric confocal profilometer, etc., which are devices that use optical microscopy to measure targets. For clarity, the embodiments described below use a white light interferometric confocal profilometer as an example of an optical microscopic measuring instrument. This white light interferometric confocal profilometer may include: an optical imaging module for non-contact image acquisition of the workpiece, including a white light interferometer objective, a confocal objective, and a high-resolution camera, supporting two-dimensional imaging and three-dimensional topographic scanning; a precision motion control module for a worktable supporting the workpiece and / or driving the optical imaging module to perform high-precision, multi-axis linkage, achieving positioning and scanning of the measurement field of view; a control and processing system, including a processor, memory, and communication interface, for executing measurement control logic, image processing, and data analysis algorithms, and supporting data interaction with external devices or a host computer; a human-machine interface providing a graphical operating environment for receiving user commands, displaying measurement images, configuring parameters, and presenting measurement results; and a data storage unit for storing preset measurement programs, workpiece design data, acquired images, and analysis results.

[0070] In one exemplary embodiment, such as Figure 2 As shown, a workpiece measurement method is provided, which can be applied to... Figure 1 The optical microscopic measuring instrument used in this example is a white light interferometric confocal profilometer, and the process includes the following steps:

[0071] Step 202: In response to the measurement parameter configuration request for the target workpiece, obtain and display the standard workpiece image corresponding to the target workpiece.

[0072] The target workpiece can refer to a batch-produced workpiece in the semiconductor manufacturing, microelectromechanical systems (MEMS), precision optical components, and aerospace parts manufacturing fields, containing a large number of identical or periodically arranged units to be measured. Examples include wafers, chips, optical lens arrays, microfluidic chips, and precision stamped parts. The target workpiece may exhibit the following characteristics: a single workpiece has multiple features that need to be measured (such as solder joint height, linewidth, and roughness); different workpieces within the same batch have the same measurement requirements, such as these workpieces being manufactured based on the same design drawings.

[0073] In this embodiment of the invention, when an automated measurement process needs to be established for a certain type of workpiece (i.e., the target workpiece), the user (e.g., the user) starts the optical micrometer and triggers the measurement parameter configuration function. In response to the request, the camera on the optical micrometer is controlled to take a picture of the standard workpiece placed on the worktable (e.g., a reference workpiece processed from the same template as the target workpiece or a standard sample corresponding to the calibrated target workpiece). The standard workpiece image is then obtained and displayed through the preset interactive interface on the optical micrometer, thereby providing a visual basis for the user to configure the parameters required for automated measurement.

[0074] Step 204: In response to the image positioning feature selection information for the standard workpiece image, extract image positioning features from the standard workpiece image.

[0075] Among them, based on the displayed standard workpiece image, the user can select image positioning feature information. The image positioning feature selection information is used to specify one or more positioning areas with stable, unique geometric shapes and easy recognition on the image. Based on the selected positioning area, an image coordinate system corresponding to the standard workpiece image can be constructed, thereby providing a measurement standard for the parameters required for automated measurement.

[0076] Specifically, the aforementioned interactive interface may also display an operation toolbar, where the image positioning feature selection information can be entered by the user through tool selection operations in the operation toolbar. Image positioning feature selection operations may include at least one of: point / box selection, drawing, and region specification. Point / box selection can involve directly clicking or selecting the center of a preset positioning mark in the image, such as a crosshair, L-shape, or circle. Drawing involves tracing along clear structural edges on the workpiece (such as straight boundaries or prominent steps). Region specification refers to defining an area containing a specific shape (such as a circular hole or rectangular boss).

[0077] After receiving the interactive command to select image localization features, the system extracts features from the region specified by the command based on a preset image processing algorithm (such as edge detection, template matching, Hough transform, etc.), extracting precise and quantifiable geometric elements as image localization features. For example, it extracts the center point coordinates from the selected crosshair region; extracts the equation of a straight line from the drawn edge; and extracts the center coordinates and radius from the enclosed circular hole region.

[0078] In this embodiment, the image positioning features can possess characteristics such as high contrast, high repeatability, and low deformation, as they are typically intentionally manufactured or inevitably formed during the design drawings and production process of a workpiece. For example, the scribe line or specially etched alignment mark on a wafer exhibits highly consistent relative position and geometric shape across all workpieces in the same batch. Therefore, establishing a coordinate system based on the image positioning features allows for a stable and accurate association between the design drawings, standard workpiece images, and the image of any subsequent target workpiece to be measured.

[0079] Step 206: Based on the image positioning features, construct and display the standard image coordinate system corresponding to the standard workpiece image.

[0080] Specifically, by utilizing the extracted image positioning features, a standard image coordinate system (or positioning coordinate system) is defined as a unique two-dimensional or three-dimensional spatial reference system fixed to the standard workpiece image. The construction process of the standard image coordinate system can be as follows:

[0081] Determine the origin, for example, you can specify a point feature (such as the center of a Mark point) as the origin of the coordinate system.

[0082] Determine the axis of rotation by using another point feature or a line feature to determine the direction of the coordinate axis. For example, specify another Mark point, and the direction of the line connecting the origin and that point can be defined as the X-axis; or specify an extracted straight line and define its direction as the X-axis or Y-axis.

[0083] Determining the plane and orientation: For three-dimensional measurement, three non-collinear point features may be needed to determine the measurement plane.

[0084] For example: If two point features are extracted (such as the centers A and B of two circular marks), then point A can be defined as the origin, the direction of vector AB as the positive X-axis, and the Y-axis can be determined according to the right-hand rule (or by specifying the direction perpendicular to AB). If one point feature (center O) and one line feature (line L) are extracted, then point O can be defined as the origin, and the normal or tangent direction of line L as the X-axis. If three point features are extracted (such as the three vertices of a triangle), the centroid can be used as the origin, and an axis can be determined by connecting two of the points.

[0085] Based on the above principles, a standard image coordinate system is automatically calculated and generated, and then visualized and overlaid on a standard workpiece image. All subsequent measurement points and measurement paths will be defined and recorded based on this coordinate system, thus ensuring the spatial consistency of the measurement program.

[0086] Step 208: In response to the measurement point configuration information for the standard workpiece image, determine at least one standard measurement point included in the standard workpiece image and the target measurement method corresponding to the standard measurement point.

[0087] In this context, a standard measurement point refers to a pre-defined spatial coordinate on a standard workpiece image, representing the microscopic or functional area to be inspected. For example, on a chip, it might be the center of a pad used to measure its height (coplanarity); on an optical component, it might be the center of a specific area used to measure the surface error or roughness of that area. Specifically, standard measurement points can be generated by clicking on the desired measurement location one by one on the image using the "Arbitrary Point" tool, or by using the "Array" tool to batch generate multiple measurement points in a matrix distribution by setting the measurement range, number of rows, number of columns, and order.

[0088] By acquiring standard measurement points set by users on standard workpiece images using interactive tools, expert knowledge about which specific locations need to be measured for specific types of workpieces is solidified. This allows for automatic and rapid measurement of workpieces with a large number of identical repeating units (such as chips on a wafer) or multiple workpieces with the same measurement requirements, based on the pre-solidified expert knowledge. This improves workpiece measurement efficiency while ensuring measurement accuracy.

[0089] Optionally, users can also set the execution order of standard measurement points (e.g., scan by row, scan by column, or a custom path), and / or group a series of measurement points with the same measurement requirements (create a point group). This sequence and grouping information, together with the discrete measurement point coordinates and measurement methods, constitutes a structured, sequentially executable dynamic program flow, rather than just a static list of points.

[0090] The target measurement method characterizes the complete set of technical solutions and parameters for data acquisition and processing of a specific measurement point (or group of points). This may include: image acquisition parameters, which determine how to acquire raw image data. The core is selecting the imaging mode, such as a two-dimensional (2D) imaging mode (for size and angle measurements) or a three-dimensional (3D) scanning mode (for topography, height, and roughness measurements). For 3D mode, key parameters include one or more of the following: objective lens magnification (determining field of view size and lateral resolution), scanning method (single-point scanning, line scanning, area scanning), scanning range / depth, and whether field stitching is required.

[0091] Data processing and analysis parameters determine how to obtain the desired measurement results from the raw data. This includes a series of preprocessing algorithms (such as leveling, denoising, and filtering to correct systematic errors and random noise) and final analysis algorithms (such as calculating characteristic values ​​such as roughness, step height, volume, and curvature within a specified area). The measurement configuration information input by the user through the interactive interface, including the positioning coordinate system, the set of measurement points (which may include the location of each measurement point, measurement order, and grouping), and the detailed measurement and analysis parameters associated with each point (or group of points), is integrated, serialized, and stored into a complete, independently runnable automated program.

[0092] Optionally, the optical micrometer is equipped with measurement software to implement the workpiece measurement method provided in the embodiments of this application.

[0093] After steps 202-208, which complete the determination of the standard image coordinate system and the configuration of measurement points, all the setting steps in steps 202-208 can be saved, that is, the edited measurement program can be saved to obtain the measurement template program for the target workpiece. The measurement template program at least saves the setting of the standard image coordinate system and the configuration of measurement points. Therefore, when the user needs to measure another batch of new workpieces, they can directly retrieve the measurement template program with the same measurement requirements from the measurement software, so that the optical micrometer can automatically run the measurement template program to automatically measure the other batch of new workpieces and automatically obtain new measurement results.

[0094] In a straightforward manner, the measurement software can store measurement template programs for different types of target workpieces, enabling the optical micrometer to automatically run the corresponding measurement template program for different types of workpieces to be measured. It is only necessary to ensure that the measurement software stores the corresponding measurement template program that has the same measurement requirements as the workpiece to be measured.

[0095] At this point, after completing step 208, the measurement program (or automation program) creation process in this embodiment is complete. The corresponding execution content in subsequent steps 210 to 216 can be implemented by calling the measurement program of the target workpiece; that is, the measurement result of the target workpiece can be obtained by the measurement software of the optical micrometer executing the measurement program.

[0096] Step 210: In response to a measurement request for the target workpiece, acquire a target workpiece image.

[0097] Optionally, the measurement request can be for a single workpiece or receive a list containing multiple workpiece identifiers, thus enabling automatic and continuous execution. When it is necessary to inspect a batch of identical workpieces, or when it is necessary to perform batch measurements on a new, similar target workpiece, the user or a pre-set robotic arm places the target workpiece on the stage of the optical micrometer and triggers the execution of the pre-built automated program to control the camera to photograph the target workpiece on the current stage, obtaining an image of the target workpiece. Alternatively, the user can manually control the camera to move to the appropriate position to photograph the target workpiece on the current stage, obtaining an image of the target workpiece. Optionally, to improve the interactivity and intuitiveness of the workpiece measurement process, the target workpiece image can be displayed in the aforementioned interactive interface.

[0098] Step 212: Perform feature matching in the target workpiece image based on the image positioning features, and construct the target image coordinate system corresponding to the target workpiece image based on the matched image features.

[0099] Optionally, a feature matching algorithm (such as feature-based template matching) is performed on the target workpiece image to find corresponding features with the same geometric type and descriptor as the image positioning features. For example, finding a cross-shaped Mark point or an edge segment with the same orientation angle and length. After obtaining the matched features and their parameters in the target image (such as new center coordinates, new line equations), the user can be further guided to quickly visually confirm or fine-tune the automatic matching results (UI highlight prompts, one-click confirmation or drag-and-drop adjustment). Alternatively, the user can input image positioning feature selection information on the target workpiece image, and the positioning area selected in the current step needs to correspond to the positioning area selected in the creation step above. This yields matching features found on the target image using the exact same geometric principles that can be used for positioning, thereby constructing a target image coordinate system for measuring and positioning the target image.

[0100] Step 214: Based on the standard coordinates of at least one standard measurement point in the standard image coordinate system, locate the target measurement point corresponding to the target workpiece image in the target image coordinate system.

[0101] This process involves calculating the spatial transformation relationship between the standard image coordinate system and the target image coordinate system (which could be an affine transformation matrix including translation, rotation, and possibly scaling). Using this spatial transformation relationship, the standard coordinates of each standard measurement point recorded in the automated program are automatically and accurately mapped to the actual physical position on the current target workpiece image. These mapped positions are the target measurement points that the equipment needs to actually travel to and perform the measurement in this process, thereby eliminating positional and angular deviations caused by workpiece placement and clamping.

[0102] Step 216: Measure the target measurement point according to the target measurement method to obtain the measurement result corresponding to the target workpiece.

[0103] The control optical micrometer executes the target measurement according to the preset target measurement method for each target measurement point (or its group of points) in the automated program. For example, the specific execution process may include: driving the motion mechanism to move the measuring lens (objective) relative to the stage to the target measurement point; switching to the specified objective magnification according to the configuration; executing the configured scanning process (such as vertical scanning of white light interferometry); after acquiring the raw data, automatically calling the configured preprocessing and analysis algorithm chain for processing; and outputting the final measurement value of the point (such as height value, roughness value).

[0104] The system iterates through all target measurement points in the order set in the automated program, completing the measurement of the entire workpiece and summarizing all data to generate a comprehensive measurement result report. The report may include the measured values ​​of each point, statistical information, comparison with design thresholds, and pass / fail judgments. Optionally, for batch requests, after completing one workpiece, the system can automatically move to the next workpiece position (if it is a multi-workpiece stage) or prompt for workpiece replacement, achieving fully automated and high-precision workpiece inspection for the entire batch.

[0105] In the construction phase, this invention utilizes a graphical interface and feature extraction technology to transform complex measurement process knowledge into a structured, reusable digital program. During the execution phase, robust feature matching and coordinate mapping techniques ensure accurate reproduction of the measurement task across different individual workpieces. This enables one-click, fully automated, and rapid inspection of large batches of identical workpieces while maintaining measurement accuracy, significantly reducing labor costs and improving production efficiency and workpiece quality.

[0106] In some embodiments, in response to a measurement parameter configuration request for a target workpiece, acquiring and displaying a standard workpiece image corresponding to the target workpiece includes:

[0107] In response to a measurement parameter configuration request, a preset graphical configuration interface is displayed. This interface includes a first image display area, a second image display area, a configuration information display area, and an operation toolbox area. The first image display area shows the regional image of the worktable acquired by the preset camera. The second image display area displays the position information of the current preset camera relative to the worktable. The configuration information display area records and displays the configured standard measurement points and target measurement methods in the configuration order. The operation toolbox area provides graphical operation tools, including drawing tools for defining geometric objects in the first and / or second image display areas, and configuration trigger tools for initiating preset measurement processes.

[0108] When a user triggers a request to configure measurement parameters for a target workpiece, a pre-defined graphical configuration interface is displayed in response. This graphical configuration interface is the core workspace for users to interact with the automated measurement system and complete the measurement program construction. This graphical configuration interface can be referenced... Figure 3 ,like Figure 3 As shown, the graphical configuration interface can include the following four functional areas:

[0109] The first image display area displays workpiece images captured in real-time by a preset camera or pre-loaded images. During the program construction phase, after a standard workpiece is placed on the worktable, this area displays the field-of-view image captured by the camera in real-time or loads previously captured and recorded images, i.e., standard workpiece images. Users can directly observe workpiece details in this area and perform subsequent feature extraction, measurement point setting, and all other visualization tasks based on this image. This area is the main visual information area for the entire configuration process.

[0110] The second image display area can be displayed as a navigation map or an overview. It dynamically displays the macroscopic position of the current camera's field of view relative to the entire worktable or workpiece. The navigation map presents the entire worktable in thumbnail form, and uses a highlighted box or indicator icon to indicate the specific location and extent of the field of view displayed in the first image display area within the current work area. This helps users grasp the layout of measurement points macroscopically, especially when configuring a large array of measurement points spanning multiple fields of view, avoiding omissions or duplications, and supporting quick field-of-view positioning by clicking directly on the navigation map.

[0111] Configuration Information Display Area: This area records and displays all configured measurement steps and parameters in real time, in structured text or icon format, according to the order in which the configuration information was entered. It can be represented as a program bar or a list of steps. For example, after the user completes the coordinate system establishment, this area will generate a "Coordinate System Established" record; after the user adds a measurement point, it will sequentially display information such as "Measurement Point 1: [Coordinates]"; after the user configures the measurement method for a measurement point, it will display a summary of the measurement parameters for that point. This area provides the user with a clear view of the program logic, representing the textual representation of the automation program. It also allows users to select, edit, rearrange, or delete configured steps within this area.

[0112] The Toolset area centrally provides various graphical tools needed to build automation programs, presented as icon buttons or menus. These tools can be categorized into two main types:

[0113] Drawing tools: used to define geometric objects in the first image display area and / or the second image display area. For example, these include a "feature extraction tool" for drawing or selecting to extract features such as points, lines, and circles; a "point tool" for clicking and placing measurement points on the image; and a "range drawing tool" for drawing the measurement range, etc.

[0114] Configuration trigger tools: These are used to launch preset measurement process configuration dialog boxes or function panels. For example, clicking the "Measurement Settings" button that appears after a measurement point is recorded, or directly calling the trigger buttons for functions such as "Array Generation" and "Create Point Group".

[0115] In this embodiment of the invention, by providing a clearly defined and functionally specialized graphical configuration interface, the complex task of constructing measurement programs is decomposed into different interactive modules: the first image display area is responsible for high-precision, detailed operation and observation; the second image display area provides macroscopic position reference and quick navigation; the configuration information display area ensures the transparency and traceability of the program logic; and the operation toolbox area centralizes all operation entry points, reducing the learning cost. This optimizes the user's measurement template program configuration experience, making the process of transforming professional measurement knowledge into automated programs more intuitive, efficient, and less prone to errors, laying a solid foundation for efficient and accurate automated measurement from a human-computer interaction perspective.

[0116] In some embodiments, in response to image positioning feature selection information for a standard workpiece image, image positioning features are extracted from the standard workpiece image, including:

[0117] In response to the selection information of the first drawing tool in the operation toolbox area, a first geometric region defined by the first drawing tool is received in the first image display area;

[0118] Analyze the image within the first geometric region and extract at least one geometric feature of a preset geometric type as the image localization feature;

[0119] Based on image positioning features, a standard image coordinate system corresponding to a standard workpiece image is constructed and displayed, including:

[0120] In response to the selection of a coordinate system construction tool in the operation toolbox area, a standard image coordinate system is generated and displayed in the first image display area based on at least two features specified from image positioning features; wherein the at least two features are used to determine the origin of the coordinate system and the orientation of at least one coordinate axis.

[0121] Among them, such as Figure 4As shown, the operation toolbox area in the graphical configuration interface provides users with a first drawing tool specifically for extracting localization features. The first drawing tool can be a set of feature extraction tools, such as a "point tool", "line tool", "circle tool" or a dedicated "mark point selection tool".

[0122] When a user needs to select positioning features on a standard workpiece image, the interaction flow can be as follows: 1. Tool Selection: The user first selects the desired first drawing tool in the toolbox area (e.g., selecting the "Line Tool" to extract a straight edge as a feature). 2. Region Definition: The user inputs definition information using the selected tool on the standard workpiece image displayed in the first image display area. For example: If the "Point Tool" or "Mark Point Selection Tool" is selected, the user can click or drag to select an area containing Mark points (such as a cross shape) as the first geometric region. If the "Line Tool" is selected, the user can draw a line segment along the edge of the workpiece; the area covered by this line segment is considered the first geometric region for extracting line features. If the "Circle Tool" is selected, the user can click the center of the circle and drag to define the radius or draw along the edge of a circular hole to form a first geometric region for extracting circular features. 3. Feature Extraction: After receiving the above interaction information from the user, the image pixels within the first geometric region are automatically analyzed. The system invokes a pre-defined feature extraction algorithm (such as grayscale centroid extraction for point centers, Hough transform for line extraction, or least squares method for circle fitting) to extract at least one precise geometric feature of a pre-defined geometric type from the region. For example, it extracts the center point coordinates from the selected crosshair region; extracts the start and end coordinates and direction vectors of lines from the drawn line segment region; and extracts the center coordinates and radius from the defined circular region. These extracted geometric elements are then recorded as image localization features for subsequent coordinate system construction.

[0123] Furthermore, after successfully extracting one or more image localization features, the coordinate system construction operation is performed within the same graphical interface. Specifically, the user selects a coordinate system construction tool (e.g., a button or menu item named "Create Coordinate System") in the toolbox area. In response to this operation, the user is prompted to specify at least two features from the extracted image localization features as the construction reference. The user can complete this specification by clicking the highlighted feature identifier in the first image display area. For example, the user specifies an extracted point feature (such as the center of Mark point A) as the origin of the coordinate system. Subsequently, the user specifies another point feature (the center of Mark point B) or a line feature (such as the extracted straight edge L). In this embodiment of the invention, the coordinate axis direction is automatically calculated and determined according to the user's specification: if a second point is specified, the direction from the origin to that point is the positive X-axis; if a line is specified, the direction of the normal or tangent of that line is the positive X-axis (or Y-axis).

[0124] Optionally, based on user-specified features, coordinate transformation calculations are automatically performed to generate and overlay a visual standard image coordinate system onto the standard workpiece image in the first image display area. This coordinate system can be presented in the form of crosshairs, coordinate axis arrows, and an origin marker. The selection of at least two features fundamentally determines the position of the origin and the direction of at least one coordinate axis of the coordinate system, thereby establishing a repeatable absolute spatial reference system that is strictly bound to the standard workpiece image.

[0125] In this embodiment of the invention, users do not need to manually input coordinates or complex parameters. They can complete high-precision feature extraction and coordinate system definition simply by clicking, drawing, and selecting in a graphical way.

[0126] In some embodiments, in response to measurement point configuration information for a standard workpiece image, determining at least one standard measurement point included in the standard workpiece image and the target measurement method corresponding to the standard measurement point includes:

[0127] In response to the selection information of the second drawing tool in the operation toolbox area, the at least one standard measurement point is determined according to the position of the selection information, and the standard coordinates and configuration timing information of the at least one standard measurement point are displayed in the configuration information display area;

[0128] And / or, in response to the selection of the array generation tool in the operation toolbox area, display the preset array parameter input interface;

[0129] In response to the setting information of measurement range, distribution quantity and order in the array parameter input interface, at least one standard measurement point is generated in the first image display area according to the setting parameters indicated by the setting information, and the standard coordinates and configuration timing information of at least one standard measurement point are displayed in the configuration information display area.

[0130] For scenarios with a small number of measurement points or where their locations are not strictly distributed, a discrete point selection mode can be implemented using a second drawing tool. Specifically, the user selects the second drawing tool in the toolbox area. This tool can be an icon for either the "Any Point Tool" or the "Measurement Point Tool." The user sets a measurement point on the standard workpiece image displayed in the first image display area by performing at least one click. Each click location is considered a standard measurement point to be measured. The system responds in real-time to each user click. On one hand, it calculates the standard coordinates corresponding to the click location based on the standard image coordinate system. On the other hand, in the configuration information display area, a new measurement point record is added according to the order of the clicks (configuration sequence). This record can include the measurement point number (e.g., "Measurement Point 1"), its standard coordinate values, and can visually display its configuration sequence information (e.g., through list numbers or visual flowchart nodes). Simultaneously, a visual identifier (e.g., a numbered cross or dot) can be generated on the image in the first image display area at the click location, thus synchronously completing the setting of the measurement point both spatially and logically.

[0131] Correspondingly, for batch measurements of large quantities of periodically arranged units under test (such as chips or lens arrays on a wafer), a batch mode based on an array generation tool can be adopted to improve the configuration efficiency of the automation program. Specifically, this involves the user selecting an array generation tool (or "array measurement point tool") in the toolbox area. In response to this selection, such as... Figure 5 As shown, a preset array parameter input interface (which can be a pop-up dialog box or a sidebar panel) is displayed, allowing users to interactively set a series of parameters, including: measurement range, used to define the boundary of the area where measurement points are generated. This can be achieved by directly drawing a rectangle or polygon in the first or second image display area (navigation map), or by directly entering coordinate values ​​in the parameter input box; distribution quantity, used to define the number of rows and columns of measurement points in the X and Y directions, thus determining an M×N measurement point matrix; and measurement order, used to define the measurement execution order of these measurement points, such as "from left to right, from top to bottom" (Z-shaped), "serpentine," or "priority column," etc. This determines the camera movement path during the automation program's execution.

[0132] In this embodiment of the invention, after detecting that the user has completed and confirmed the parameter settings, at least one standard measurement point (which can be dozens to hundreds) is automatically generated in a regular array within the measurement range specified in the first image display area, according to all the setting parameters indicated by the setting information. The standard coordinates of these points are automatically calculated based on the array parameters. At the same time, all the generated measurement points (which can be presented in a dot matrix format) are visualized on the image in the first image display area. In the configuration information display area, records of all these standard measurement points are generated and displayed in batches according to a preset measurement order (configuration sequence), and each record contains its sequence number, standard coordinates, and position index in the array.

[0133] This invention, through graphical interaction, tightly integrates spatial location information (coordinates) with program logic information (timing) and provides real-time feedback on the configuration interface. This makes the constructed set of measurement points not only a collection of coordinates, but also a structured task sequence with explicit execution instructions.

[0134] In some embodiments, in response to measurement point configuration information for a standard workpiece image, determining at least one standard measurement point included in the standard workpiece image and the target measurement method corresponding to the standard measurement point includes:

[0135] In response to configuration trigger information for any standard measurement point displayed in the configuration information display area, a preset measurement parameter configuration panel is displayed;

[0136] In response to the acquisition mode selection information in the measurement parameter configuration panel, configure the configurable measurement parameter items included in the selected target image acquisition mode for any standard measurement point; the image acquisition mode includes a first imaging mode for acquiring two-dimensional contour information and / or a second imaging mode for acquiring three-dimensional topography information; wherein, the configurable measurement parameter items corresponding to the second imaging mode include the magnification of the objective lens used for scanning and the coverage mode of the scanning field of view; the coverage mode includes single field of view scanning and multi-field of view stitching scanning;

[0137] The target measurement method is obtained in response to the configuration information for the configurable measurement parameter items.

[0138] After a user completes the configuration of one or more standard measurement points (these points and their information can be displayed in the configuration information display area), the interactive flow for configuring the target measurement method corresponding to these one or more standard measurement points can be as follows: The user executes configuration trigger information for any record item of a standard measurement point displayed in the configuration information display area. This information is usually obtained by clicking the "Settings" or "Edit" button next to the measurement point record or by double-clicking the record directly. This information indicates that the user intends to configure a detailed measurement method for this specific measurement point. In response to the above configuration trigger information, such as... Figure 6As shown, a preset measurement parameter configuration panel (usually a pop-up window or expanded sidebar) is displayed. This panel can be considered the core interface for the user to "program" the measurement point. In the measurement parameter configuration panel, the user can first select the acquisition mode. Based on common scenarios and needs of workpiece measurement, at least two image acquisition modes can be provided for the user to choose from: First imaging mode (which can be prompted as "2D measurement" or "dimensional measurement"): Using ordinary lighting and a lens, the two-dimensional contour information of the workpiece is acquired. It is mainly used to measure the geometric dimensions such as length, width, diameter, angle, and position of planar features. Second imaging mode (which can be prompted as "3D scanning" or "topography measurement"): This mode uses an objective lens based on the principle of white light interference or confocal principle to scan and acquire the three-dimensional topography information (i.e., height data) of the workpiece surface. This is the basis for achieving sub-nanometer precision measurements of surface roughness, step height, flatness, etc. Further, after detecting that the user has completed the selection of the measurement mode, the configurable measurement parameter items under this mode are dynamically displayed. The user needs to configure the specific information for these parameter items. If the user selects the second imaging mode (3D scanning), the configurable measurement parameters for this mode will include at least the following: Magnification of the scanning objective: The user must select an interference lens or confocal lens from the list (e.g., 10X, 20X, 50X). The choice of magnification directly determines the field of view and lateral resolution of a single scan, and is a crucial parameter for balancing measurement range and accuracy. Scanning field of view coverage mode: The user can choose one of the following two scanning modes: Single field of view scan: A single scan is performed within the field of view of a single lens centered on the measurement point. Suitable for situations where the feature size is smaller than the field of view. Multi-field stitching scan: Starting from the measurement point, the lens moves multiple times according to a preset stitching strategy (e.g., 2×2, 3×3), and the results are automatically stitched into a large-area topographic map. Suitable for scenarios where the measured features span a large area or require large field-of-view, high-resolution measurements.

[0139] After detecting that the user has completed the configuration of all configurable measurement parameters, the image acquisition mode selected by the user and all the specific parameter values ​​set in that mode are integrated and recorded as the target measurement method corresponding to that specific standard measurement point.

[0140] This invention decomposes the abstract workpiece measurement process into clearly defined and interactively configurable parameters. The mode selection (2D / 3D) fundamentally distinguishes the measurement principle from the application purpose. The depth parameter configuration (objective magnification, stitching mode) for 3D mode ensures that the measurement process can be precisely adapted to specific inspection requirements (such as accuracy requirements and feature size).

[0141] In some embodiments, in response to measurement point configuration information for a standard workpiece image, determining at least one standard measurement point included in the standard workpiece image and the target measurement method corresponding to the standard measurement point includes:

[0142] In response to selecting the second imaging mode for the standard measurement point, preset data analysis chain configuration options are displayed in the measurement parameter configuration panel;

[0143] In response to the trigger information for the data analysis chain configuration options, the chain processing module configuration interface is displayed;

[0144] In response to the configuration information in the chain processing module configuration interface, a data analysis chain is configured for any standard measurement point, and the data analysis chain is recorded as the target measurement method. The data analysis chain includes at least one data preprocessing module and / or at least one parameter analysis module configured in sequence. The data preprocessing module is used to filter out noise or correct errors in the raw three-dimensional data obtained by scanning, and the parameter analysis module is used to calculate preset surface morphology parameters based on the preprocessed data.

[0145] Once the user selects the second imaging mode (i.e., 3D scanning mode) for the standard measurement point and completes the configuration of the second imaging mode and basic scanning parameters such as objective magnification and coverage mode, this embodiment of the invention can further provide advanced data analysis configuration functions, including the following:

[0146] The measurement parameter configuration panel displays preset data analysis chain configuration options. This option is typically presented as a separate tab (such as "Analysis Settings"), an expand button, or a checkbox (such as "Enable Advanced Analysis"), clearly prompting the user to configure subsequent data processing workflows for this 3D scan.

[0147] In response to user triggers for configuring the data analysis chain (such as clicking the tab or button), the corresponding chain processing module configuration interface is displayed. The chain processing module configuration interface defines the sequentially executed data processing steps, allowing users to build specific analysis chains through configuration information. A data analysis chain is a sequentially executed modular process that can include two types of modules for user configuration, or they can be integrated into a single module. One is a data preprocessing module: this module performs initial processing and error correction on the raw 3D topographic data (i.e., the height data matrix) obtained from scanning to improve data quality. Typical preprocessing modules include: a leveling / de-tilting module: eliminating systematic height gradients introduced by workpiece or stage tilt; a spike / outlier removal module: filtering out isolated extremely high or low noise points caused by dust or bad pixels; and a standard filtering module (such as Gaussian filtering, median filtering): smoothing random high-frequency noise and preserving true surface topographic features. The other is a parameter analysis module: this module performs specific feature calculations based on the preprocessed, relatively "clean" 3D data. Typical analysis modules include: a roughness calculation module, which calculates surface roughness parameters such as the arithmetic mean height Sa and the root mean square height Sq; a step height / depth measurement module, which measures the height difference between two selected areas; and a volume / area calculation module, which calculates the volume and projected area of ​​pits or protrusions.

[0148] Users can add the required preprocessing and analysis modules to the analysis chain in a logical order (e.g., leveling first, then denoising, and finally roughness calculation) by dragging, checking, or adding from a list, and set the internal parameters (e.g., the window size of the filter) for each module.

[0149] After detecting that the user has completed the configuration of the chained processing module, this data analysis chain (i.e., the module type, execution order, and parameters) is recorded and stored as an important component of the target measurement method. Thus, when the automated program executes to the measurement point, it will not only collect data according to the set scanning parameters, but also automatically and without human intervention execute this preset data analysis chain, and directly output the final feature value result (such as "roughness Sa=0.8nm").

[0150] This embodiment moves the complex data analysis work that relies on manual post-processing in traditional measurements to the program construction stage and solidifies it into a reusable automated program. This avoids the repetitive, tedious, and potentially inconsistent manual data processing information after each measurement. Furthermore, through standardized preprocessing steps (leveling and noise reduction), various errors are systematically eliminated, ensuring the accuracy and repeatability of the analysis results.

[0151] In some embodiments, if the number of standard measurement points is multiple, the method further includes:

[0152] In response to the selection of multiple standard measurement points in the configuration information display area, group operation options corresponding to the multiple standard measurement points are displayed; the group operation options include the option to create a point group.

[0153] In response to the selection of the option to create a point group, the multiple standard measurement points selected in the selection information are created as a measurement point group and identified as a group in the configuration information display area;

[0154] In response to configuration trigger information for a group of measurement points, the target measurement method is uniformly configured for the group of measurement points.

[0155] When multiple standard measurement points with the same detection requirements exist, how to perform batch and unified configuration management is a key method to further improve program construction efficiency and simplify the configuration of complex measurement tasks. Therefore, in this embodiment of the invention, if the number of standard measurement points is multiple, the method further includes the following batch configuration steps:

[0156] Optionally, in response to a user selecting records of multiple standard measurement points in the configuration information display area by clicking in conjunction with the keyboard (e.g., Ctrl+click) or dragging a selection box. It is understood that the selected measurement points may typically be spatially dispersed, but they share the same measurement requirements (e.g., measuring the height of the same type of pads, or measuring the roughness of a series of microstructures).

[0157] In response to the selection of multiple measurement points, a set of group operation options corresponding to this scenario is displayed. These options can appear as drop-down menus, right-click context menus, or floating toolbars. Among them, a core and essential option is the "Create Point Group" option (for example, labeled "Create Group" or "Group").

[0158] In response to the selection of the "Create Point Group" option (e.g., clicking the option), the multiple independent standard measurement points selected in the selection information will be created into a measurement point group (e.g., named "Point Group 1"). This will be displayed in the configuration information display area. Figure 7 As shown, this group of measurement points can be identified as a group. For example, this group of points may be collapsed under an expandable parent node, or highlighted with the same color and icon, thus clearly defining their hierarchical relationship visually and in terms of data structure.

[0159] After creating a point group, users no longer need to configure the measurement method individually for each measurement point within the group. Instead, users can perform a configuration trigger operation for the measurement point group (e.g., right-click the point group name and select "Set Measurement Parameters"). Responding to this operation will initiate a measurement parameter configuration process similar to that described in the previous example. Any configuration operations performed by the user in this process (such as image acquisition mode selection, scan parameter settings, and data analysis chain definition) will be recognized as a unified configuration for the measurement point group. Subsequently, this unified target measurement method will be automatically associated with and applied to all standard measurement points within the measurement point group.

[0160] This invention provides a measurement point group configuration function. For a large number of measurement points with the same measurement method, the user only needs to configure once to complete the measurement method settings for all points, avoiding massive repetitive operations. It also ensures that all measurement points in the group use the exact same measurement and analysis parameters, eliminating the risk of human error or parameter inconsistency that may be caused by configuring each point individually. Furthermore, if it is necessary to modify the parameters of a certain type of measurement point (for example, changing the filtering algorithm for roughness analysis from Gaussian filtering to median filtering), the user only needs to modify the configuration of its point group, and all associated measurement points will be automatically updated, greatly facilitating program debugging and optimization.

[0161] In some embodiments, feature matching is performed in the target workpiece image based on image positioning features, and a target image coordinate system corresponding to the target workpiece image is constructed based on the matched image features, including:

[0162] Load the target workpiece image in the first image display area;

[0163] In the target workpiece image, search for regions with the same geometric type as the image positioning features used when constructing the standard image coordinate system;

[0164] The searched areas are highlighted as candidate features in the first image display area;

[0165] In response to user confirmation or position correction information for candidate features, a target image coordinate system is constructed in the target workpiece image based on the features confirmed or corrected according to the confirmation or position correction information.

[0166] When the automated program begins measuring a new target workpiece, it needs to reconstruct a coordinate system on that workpiece that corresponds perfectly to the construction phase. Specifically, this involves loading and displaying an image of the target workpiece, captured in real-time by a camera, in the first image display area. At this point, the user has typically placed the target workpiece on the worktable, but its position and orientation may have undergone arbitrary translation and rotation compared to the standard workpiece during the construction process.

[0167] Within the loaded target workpiece image, a feature matching algorithm is automatically executed to search for regions with the same geometric type as the image positioning features used when constructing the standard image coordinate system. Specifically, stored geometric descriptions of positioning features (such as a template of a cross-shaped mark point, a line parameter in a specific direction, or a circle with a specific radius) are invoked and searched within the current field of view. For example, all possible cross-shaped regions in the target image are searched, and their similarity to the standard template is calculated.

[0168] After the feature matching algorithm completes, the region with the highest similarity is selected as a candidate feature and highlighted on the target workpiece image in the first image display area (e.g., outlined with a flashing box or a different colored outline). The system waits for and receives confirmation or position correction information from the user regarding the candidate features. If the user determines that the automatically matched feature is correct (e.g., the selected crosshair is indeed the correct one), they can confirm by clicking the "Confirm" button or directly clicking the highlighted area.

[0169] If the automatic matching has a slight deviation (e.g., the center of the selected area is slightly offset from the center of the actual Mark), the user can manually fine-tune it by dragging the corners or center point of the highlighted tooltip with the mouse to ensure precise alignment with the actual feature. Finally, based on the features that have been confirmed or corrected according to the confirmation information or position correction information, a target image coordinate system is constructed in the target workpiece image. The geometric principles used to construct this coordinate system (e.g., which feature point is the origin and which feature direction is the X-axis) are exactly the same as those used to construct the standard image coordinate system in Example 3. Thus, the target image coordinate system established on the target workpiece is precisely aligned geometrically with the standard image coordinate system on the standard workpiece.

[0170] Even if there are placement errors in the workpiece, the measurement task can be accurately mapped to the correct physical position of the new workpiece through feature matching and coordinate system reconstruction. The fine-tuning function eliminates the pixel-level error inherent in image matching algorithms, ensuring sub-pixel-level positioning accuracy. Automatic matching completes most of the work, and manual verification is only required, which takes very little time. At the same time, the manual verification step also serves as a check, preventing matching errors caused by changes in lighting, stains, etc., and improving the robustness of the entire system.

[0171] In some embodiments, the method further includes:

[0172] In response to editing information in the configuration information display area, the editing information includes at least one of the following: adjusting the measurement timing of measurement points, adding or deleting standard measurement points, modifying the location of standard measurement points, or enabling / disabling the measurement timing.

[0173] Adjust the standard measurement points and target measurement methods according to the editing information.

[0174] To improve the practicality and adaptability of workpiece measurement and enable it to cope with complex process changes or measurement strategy optimization needs, this embodiment of the invention allows users to dynamically adjust and optimize the configured measurement process at any stage of program construction or when reviewing a saved program, without having to rebuild it from scratch. Specifically, in the configuration information display area, users can execute specific editing information for recorded and displayed measurement point information or measurement steps (such as "Measurement Point 1", "Point Group 1", "Establish Coordinate System", etc.). The editing information aims to adjust the configured measurement process logic and may include at least one of the following:

[0175] Adjust the execution order of measurement points: For example, by dragging the record item of "Measurement Point 3" before "Measurement Point 2", you can change the order in which the camera visits these two points when the automation program runs.

[0176] Add a new standard measurement point: Insert a new measurement point at any position in the existing point list using a tool (such as in Example 4).

[0177] Delete existing standard measurement points: Select one or more measurement point records, execute the deletion information, and remove them from the measurement task sequence.

[0178] To modify the coordinates of an existing standard measurement point: Select a measurement point and drag its visual identifier directly to the new location in the first image display area. Its standard coordinates will then be automatically updated.

[0179] Enable / disable specific measurement steps or measurement points: Temporarily enable or skip a measurement point or analysis step without deleting it by checking a box or using a switch. This is very useful when debugging programs or targeting specific areas.

[0180] Dynamic configuration updates: The system responds to edited information and immediately adjusts the standard measurement points and target measurement methods accordingly. Specifically, this manifests as follows:

[0181] Update the displayed content: In the configuration information display area, refresh and reflect the results of the edits in real time, such as updating the list order, removing entries, or marking disabled steps.

[0182] Update the corresponding measurement process configuration data: In the system background, all configuration data associated with the object being edited (such as coordinate data, execution order index, and parameter relationships) will be updated synchronously. For example, after adjusting the order, the program execution engine will read the new order list; after modifying the coordinates of a point, its stored standard coordinate values ​​will be updated; after reconfiguring the measurement method for that point, its associated target measurement method parameters will be replaced.

[0183] Therefore, when the workpiece design is fine-tuned or the inspection process is updated, users can directly modify the existing program (such as adding new measurement points or updating analysis parameters) to quickly generate a new version of the program, protecting the previous configuration results. Furthermore, embodiments of this invention allow for the creation of complex measurement strategies that include conditional branches (by enabling / disabling simulation of specific steps) or variable paths, enabling the program to adapt to a wider range of inspection scenarios.

[0184] In some embodiments, measurements are performed on target measurement points according to the target measurement method to obtain measurement results corresponding to the target workpiece, including:

[0185] The actual measurement data of each target measurement point included in the measurement results are compared with the preset design threshold to obtain the deviation value and the pass / fail judgment result of each target measurement point.

[0186] In the second image display area, the corresponding pass / fail judgment result is superimposed and displayed at the actual position of each target measurement point in the target image coordinate system.

[0187] In this invention, to combine the judgment of measurement results with spatial visualization after the automated measurement is completed, and to achieve rapid and intuitive interpretation of the detection results, the original measurement data is transformed into intuitive and decision-making quality information, which is then displayed in association with spatial location in the second image display area of ​​the graphical interface. Specifically, this includes:

[0188] After scanning, collecting, and analyzing the target measurement points according to a predetermined procedure, the system obtains the specific actual measurement data (such as roughness values, step height values, distance values, etc.) for each target measurement point. The actual measurement data for each target measurement point in the measurement results are then compared one by one with the design thresholds (i.e., the upper and / or lower limits of the acceptance criteria) pre-set for this type of workpiece. Through comparison, the system calculates the deviation between the actual measurement data and the design threshold for each measurement point, and automatically generates a pass / fail judgment result for that point based on whether the deviation exceeds the allowable range. The judgment result is usually a binary state, such as "OK" (acceptable) or "NG" (unacceptable), but may also include more levels such as "warning".

[0189] Visual overlay is performed in the second image display area: The system then initiates the visualization process. In the second image display area (i.e., the navigation map or panoramic view window), based on the actual position of each target measurement point mapped in the target image coordinate system, the system overlays and displays the corresponding qualification judgment result at the corresponding coordinates of that position.

[0190] Each judgment result (such as an "OK" label or a red / green dot) is plotted above the actual physical location of the measurement point in the panoramic view, achieving precise binding between measurement data and workpiece spatial location. Since the second image display area shows the macroscopic layout of the workpiece (such as the entire wafer, the outline of the entire workpiece), the pass / fail status of all measurement points is displayed simultaneously and globally, allowing users to quickly see: which areas have all measurement points that are pass (possibly displayed as a green area), and which locations have non-passing points (displayed as prominent red marks), thus immediately grasping the overall quality distribution of the workpiece.

[0191] This invention transforms complex numerical reports into easily identifiable "OK / NG" maps through automated result interpretation and spatial visualization, greatly accelerating the quality judgment process and supporting rapid sorting and decision-making on the production line. The generated inspection report not only includes data tables but also a panoramic view of the workpiece with interpretation result markers, making the report easier to understand and facilitating subsequent problem tracing and analysis.

[0192] It should be understood that although the steps in the flowcharts of the above embodiments are shown sequentially according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the above embodiments may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the steps or stages in other steps. It is understood that the steps in different embodiments can be freely combined as needed, and all non-contradictory solutions formed by such combinations are within the scope of protection of this application.

[0193] Based on the same inventive concept, this application also provides an automated measuring device for implementing the workpiece measurement method described above. The solution provided by this device is similar to the solution described in the above method; therefore, the specific limitations in one or more embodiments of the automated measuring device provided below can be found in the limitations of the workpiece measurement method described above, and will not be repeated here.

[0194] In one exemplary embodiment, such as Figure 8 As shown, an automated measuring device 300 is provided, the device comprising:

[0195] The display module 302 is used to obtain and display the standard workpiece image corresponding to the target workpiece in response to the measurement parameter configuration request for the target workpiece.

[0196] Extraction module 304 is used to extract image positioning features from standard workpiece image in response to image positioning feature selection information for standard workpiece image;

[0197] Module 306 is used to construct and display the standard image coordinate system corresponding to the standard workpiece image based on the image positioning features;

[0198] The determination module 308 is used to determine, in response to the measurement point configuration information for the standard workpiece image, at least one standard measurement point included in the standard workpiece image and the target measurement method corresponding to the standard measurement point.

[0199] The acquisition module 310 is used to acquire a target workpiece image in response to a measurement request for the target workpiece.

[0200] Matching module 312 is used to perform feature matching in the target workpiece image based on image positioning features, and to construct the target image coordinate system corresponding to the target workpiece image based on the matched image features;

[0201] The positioning module 314 is used to locate the target measurement point corresponding to the target workpiece image in the target image coordinate system according to the standard coordinates of at least one standard measurement point in the standard image coordinate system.

[0202] The measurement module 316 is used to measure the target measurement point according to the target measurement method and obtain the measurement result corresponding to the target workpiece.

[0203] Each module in the aforementioned automated measuring device can be implemented entirely or partially through software, hardware, or a combination thereof. These modules can be embedded in or independent of the processor in a computer device, or stored in the memory of a computer device as software, so that the processor can access and execute the information corresponding to each module.

[0204] In one exemplary embodiment, a computer device is provided, which may be a terminal, and its internal structure diagram may be as follows: Figure 9As shown, the computer device includes a processor, memory, input / output interface, communication interface, display unit, and input device. The processor, memory, and input / output interface are connected via a system bus, and the communication interface, display unit, and input device are also connected to the system bus via the input / output interface. The processor provides computational and control capabilities. The memory includes non-volatile storage media and internal memory. The non-volatile storage media stores information systems and computer programs. The internal memory provides an environment for the operation of the information systems and computer programs stored in the non-volatile storage media. The input / output interface is used for exchanging information between the processor and external devices. The communication interface is used for wired or wireless communication with external terminals; wireless communication can be achieved through Wi-Fi, mobile cellular networks, Near Field Communication (NFC), or other technologies. When the computer program is executed by the processor, it implements a workpiece measurement method. The display unit is used to form a visually visible image and can be a display screen, projection device, or virtual reality imaging device. The display screen can be an LCD screen or an e-ink screen. The input device of the computer device can be a touch layer covering the display screen, or buttons, trackballs, or touchpads set on the casing of the computer device, or external keyboards, touchpads, or mice, etc.

[0205] Those skilled in the art will understand that Figure 9 The structure shown is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the computer device to which the present application is applied. Specific computer devices may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.

[0206] In one exemplary embodiment, a computer device is provided, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the steps included in any of the foregoing workpiece measurement method embodiments.

[0207] In one embodiment, a computer-readable storage medium is provided having a computer program stored thereon, which, when executed by a processor, implements the steps included in any of the foregoing workpiece measurement method embodiments.

[0208] In one embodiment, a computer program product is provided, including a computer program that, when executed by a processor, implements the steps included in any of the foregoing workpiece measurement method embodiments.

[0209] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, data stored, data displayed, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties, and the collection, use and processing of the relevant data must comply with relevant regulations.

[0210] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium, and when executed, it can include the processes of the embodiments of the above methods. Any references to memory, databases, or other media used in the embodiments provided in this application can include at least one of non-volatile memory and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can take many forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM). The databases involved in the embodiments provided in this application may include at least one type of relational database and non-relational database. Non-relational databases may include, but are not limited to, blockchain-based distributed databases. The processors involved in the embodiments provided in this application may be general-purpose processors, central processing units, graphics processing units, digital signal processors, programmable logic devices, quantum computing-based data processing logic devices, artificial intelligence (AI) processors, etc., and are not limited to these.

[0211] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this application.

[0212] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. An automated measurement method for optical microscopy, characterized in that, The method includes: Acquire and display the standard workpiece image corresponding to the target workpiece; Extract image positioning features from the standard workpiece image to construct the image coordinate system corresponding to the standard workpiece image; Using the image coordinate system as a reference, at least one standard measurement point included in the standard workpiece image and the target measurement method corresponding to the standard measurement point are determined; According to the target measurement method and the image coordinate system, the standard measurement points in the standard workpiece image are measured sequentially to obtain the measurement results corresponding to the target workpiece.

2. The method according to claim 1, characterized in that, The method is applied to an optical microscopic measuring instrument; the optical microscopic measuring instrument includes at least one of a white light interferometer, a confocal microscope, and a white light interferometric confocal profilometer; the target workpiece is a lens array, and the measurement result includes the roughness or curvature of the lens units on the lens array.

3. The method according to claim 1, characterized in that, The step of extracting image positioning features from the standard workpiece image to construct the image coordinate system corresponding to the standard workpiece image includes: Load the standard workpiece image into the first image display area; In the standard workpiece image, a first geometric region defined by the first drawing tool is determined; the image within the first geometric region is analyzed, and at least two geometric features of preset geometric types are extracted as the image positioning features; Based on the image positioning features, the image coordinate system is constructed in the standard workpiece image.

4. The method according to claim 2, characterized in that, The target measurement method includes image acquisition parameters and imaging mode for determining the image data to be acquired; the imaging mode adopts a three-dimensional scanning mode; the image acquisition parameters of the three-dimensional scanning mode include at least one of the magnification of the objective lens and whether field stitching is required.

5. The method according to claim 1, characterized in that, The step of acquiring and displaying the standard workpiece image corresponding to the target workpiece includes: In response to the measurement parameter configuration request, a preset graphical configuration interface is displayed. The graphical configuration interface includes a first image display area, a second image display area, a configuration information display area, and an operation toolbox area. The first image display area displays an image of the worktable area captured by a preset camera. The second image display area displays the current position information of the preset camera relative to the worktable. The configuration information display area records and displays the configured standard measurement points and the target measurement method in the configuration order. The operation toolbox area provides graphical operation tools, including drawing tools for defining geometric objects in the first and / or second image display areas, and configuration triggering tools for initiating a preset measurement process.

6. The method according to claim 5, characterized in that, The process of determining the target measurement method includes: In response to configuration trigger information for any standard measurement point displayed in the configuration information display area, a preset measurement parameter configuration panel is displayed; In response to the acquisition mode selection information in the measurement parameter configuration panel, configurable measurement parameter items included in the selected target image acquisition mode are configured for any standard measurement point; the image acquisition mode includes a first imaging mode for acquiring two-dimensional contour information and / or a second imaging mode for acquiring three-dimensional topographic information; wherein, the configurable measurement parameter items corresponding to the second imaging mode include the magnification of the objective lens used for scanning and the coverage mode of the scanning field of view; the coverage mode includes single-field scanning and multi-field stitching scanning; The target measurement method is obtained in response to the configuration information for the configurable measurement parameter item.

7. The method according to claim 6, characterized in that, The step of obtaining the target measurement method in response to configuration information for the configurable measurement parameter item includes: In response to selecting the second imaging mode for the standard measurement point, preset data analysis chain configuration options are displayed in the measurement parameter configuration panel; In response to the triggering information of the data analysis chain configuration options, the chain processing module configuration interface is displayed; In response to the configuration information in the chain processing module configuration interface, a data analysis chain is configured for the standard measurement point configured with the second imaging mode, and the data analysis chain is recorded as the target measurement method; wherein, the data analysis chain includes at least one data preprocessing module and / or at least one parameter analysis module configured in sequence, the data preprocessing module is used to perform noise filtering or error correction on the raw three-dimensional data obtained by scanning, and the parameter analysis module is used to calculate preset surface morphology parameters based on the preprocessed data.

8. The method according to claim 7, characterized in that, The preprocessing module includes at least one of a leveling module, an outlier removal module, and a standard filtering module; the leveling module is used to eliminate systematic height gradients introduced by the tilt of the workpiece or stage; the outlier removal module is used to filter out isolated extremely high or low noise points caused by dust or bad pixels; the standard filtering module is used to smooth random high-frequency noise and retain the true surface morphology features.

9. An automated measuring device for optical microscopy, characterized in that, The device includes: The display module is used to obtain and display the standard workpiece image corresponding to the target workpiece in response to a request for configuring measurement parameters for the target workpiece. The extraction module is configured to extract image positioning features from the standard workpiece image in response to image positioning feature selection information for the standard workpiece image, so as to construct an image coordinate system corresponding to the standard workpiece image; The determination module is configured to determine, in response to the measurement point configuration information for the standard workpiece image, at least one standard measurement point included in the standard workpiece image and the target measurement method corresponding to the standard measurement point; The measurement module is used to sequentially measure the standard measurement points in the standard workpiece image according to the target measurement method and the image coordinate system, and obtain the measurement results corresponding to the target workpiece.

10. A computer program product, comprising a computer program, characterized in that, When the computer program is executed by a processor, it implements the steps of the method according to any one of claims 1 to 8.

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