Chip low-temperature test method and device, electronic equipment and storage medium

Abstract

The application relates to the technical field of chip testing, and discloses a chip low-temperature testing method and device, electronic equipment and a storage medium.The chip low-temperature testing method comprises the following steps: opening a temperature control device, and adjusting the temperature control device based on a preset test temperature of a chip sample; detecting the environmental temperature of the chip sample; determining that a blowing device is opened; removing water vapor on the surface of the chip sample through dry gas, so that the chip sample is free of frost or water mist; entering a chip sample imaging mode; the chip sample imaging mode comprises that the chip sample is free of frost or water mist at the preset test temperature, and a failure point of the chip sample is positioned based on hot spot imaging; the imaging is clear, the failure point is accurately positioned, and the success rate of chip low-temperature testing and the accuracy of data are improved.

Description

Technical Field

[0001] This invention relates to the field of chip testing technology, and in particular to a chip low-temperature testing method, apparatus, electronic device, and storage medium. Background Technology

[0002] In the field of semiconductor chip failure analysis, for chip samples that only show failure phenomena at low temperatures, it is necessary to cool them to the target temperature using a controllable cooling device, and then combine it with an optical or electron beam microscopy imaging system to accurately locate the failure point.

[0003] However, in the existing low-temperature testing process, in order to ensure the stable reproduction of failure phenomena, chip samples need to be kept at low temperature for a long time. When the low-temperature surface comes into contact with the surrounding humid and hot air, water vapor condenses easily, which directly causes the microscopic image to become blurred and the contrast to decrease, resulting in unclear imaging and thus affecting the test results and accuracy of the chip sample. Summary of the Invention

[0004] The purpose of this invention is to provide a chip low-temperature testing method, apparatus, electronic device, and storage medium to solve the aforementioned problems in chip low-temperature testing in related technologies.

[0005] To address the aforementioned problems in the existing technology, the present invention adopts the following technical solution:

[0006] According to one aspect of the present invention, a method for low-temperature testing of a chip is provided, comprising:

[0007] Turn on the temperature control device;

[0008] The temperature control device adjusts the preset test temperature based on the chip sample.

[0009] Detect the ambient temperature of the chip sample to determine if the air blowing device is turned on;

[0010] The moisture on the surface of the chip sample is removed by drying gas, so that the chip sample is free of frost or water mist;

[0011] Entering chip sample imaging mode: The chip sample imaging mode includes chip samples without frost or water mist at a preset test temperature, and locating the failure points of the chip sample based on hotspot imaging.

[0012] As an optional technical solution, it also includes the following: (The sentence is incomplete and requires more context to be translated accurately.)

[0013] The chip sample is fixed on the worktable;

[0014] The detection end of the temperature detection device is attached to the chip sample;

[0015] The test cover of the temperature control device is located above the workbench and is enclosed over the chip sample.

[0016] As an optional technical solution, it also includes a device located after the temperature control device that adjusts the preset test temperature based on the chip sample:

[0017] The test cover of the temperature control device is covered with a light-shielding cloth.

[0018] As an optional technical solution, the determination of the air blowing device to open by detecting the ambient temperature of the chip sample includes:

[0019] When the temperature detection device detects that the ambient temperature of the chip sample has not reached the preset test temperature, the temperature control device continues to adjust the ambient temperature of the chip sample; when the temperature detection device detects that the ambient temperature of the chip sample has reached the preset test temperature, the temperature control device maintains the ambient temperature of the chip sample.

[0020] The air blowing device is always in the open state.

[0021] As an optional technical solution, the opening of the air blowing device specifically includes:

[0022] The gas blown out by the air blowing device is dried after multi-stage dehydration, oil removal and micro-particle filtration.

[0023] The air blowing device blows air onto the surface of the chip sample.

[0024] According to another aspect of the present invention, a chip low-temperature testing apparatus is provided, comprising:

[0025] Temperature control module, used to turn on the temperature control device;

[0026] A temperature setting module is used to set the preset test temperature of the chip sample by the temperature control device;

[0027] The temperature detection module is used to detect the ambient temperature of the chip sample and determine when the air blowing device is turned on.

[0028] The gas control module is used to control the air blowing device to remove moisture from the surface of the chip sample;

[0029] The sample imaging module is used for hotspot imaging of chip samples.

[0030] As an optional technical solution, the temperature detection module is specifically used to send the ambient temperature detection signal of the chip sample to the air blowing device.

[0031] As an optional technical solution, the sample imaging module is specifically used to identify the hot spots of the chip sample when there is no frost or water mist at a preset test temperature as failure points.

[0032] According to another aspect of the present invention, an electronic device is provided, comprising:

[0033] At least one processor; and

[0034] A memory communicatively connected to at least one of the processors; wherein

[0035] The memory stores a computer program that can be executed by at least one of the processors, such that at least one of the processors can perform the chip low-temperature testing method of the present invention.

[0036] According to another aspect of the present invention, a computer-readable storage medium is provided, the computer-readable storage medium storing computer instructions for causing a processor to execute and implement the chip low-temperature testing method of the present invention.

[0037] The chip low-temperature testing method, apparatus, electronic device, and storage medium provided by this invention have at least the following beneficial effects:

[0038] This low-temperature chip testing method involves activating the temperature control device and adjusting it based on a preset test temperature for the chip sample. The ambient temperature of the chip sample is monitored to ensure the air blowing device is activated. Dry gas is used to remove moisture from the chip sample surface, ensuring no frost or water vapor forms. The chip sample then enters imaging mode: this mode ensures the chip sample is free of frost or water vapor at the preset test temperature, and uses hotspot imaging to locate failure points on the chip sample. The imaging is clear, and the failure points are accurately located, improving the success rate and accuracy of low-temperature chip testing. Attached Figure Description

[0039] Figure 1 This is a flowchart of the chip low-temperature testing method in Embodiment 1 of the present invention;

[0040] Figure 2 This is a schematic diagram of the chip low-temperature testing device in Embodiment 2 of the present invention;

[0041] Figure 3 This is a schematic diagram of the electronic device that implements the low-temperature chip testing method in Embodiment 3 of the present invention.

[0042] In the picture:

[0043] 100. Temperature control module; 200. Temperature setting module; 300. Temperature detection module; 400. Gas control module; 500. Sample imaging module. Detailed Implementation

[0044] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0045] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The terms "first position" and "second position" refer to two different positions. Furthermore, "above," "on top of," and "over" the first feature in relation to the second feature includes the first feature directly above and diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "under," and "below" the first feature in relation to the second feature includes the first feature directly below and diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0046] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0047] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0048] Example 1

[0049] In existing low-temperature testing procedures, to ensure the stable reproduction of failure phenomena, chip samples need to be maintained at low temperatures for extended periods. However, when the low-temperature surface comes into contact with the surrounding warm and humid air, water vapor condensation easily occurs, directly causing blurring of the microscopic image, decreased contrast, and unclear imaging, thus affecting the test results and accuracy of the chip sample. To address this, this embodiment provides a low-temperature chip testing method, applicable to the field of chip testing technology. This method is executed using a low-temperature chip testing device, specifically, as follows... Figure 1 As shown, the low-temperature testing method for this chip includes the following steps.

[0050] S10: The chip sample is fixed on the worktable.

[0051] If the chip sample is a bare chip, it needs to be fixed on a carrier board, and the test pins of the bare chip are brought out by wire bonding, followed by encapsulation. If the chip sample is a packaged chip, the packaged sample needs wire bonding to bring out the test pins. It should be noted that the encapsulation and wire bonding processes are to avoid unstable pin bonding caused by direct exposure to cold air, resulting in poor contact or scratches.

[0052] S20: The detection end of the temperature detection device is attached to the chip sample.

[0053] The temperature detection device is set as a temperature measuring instrument. The thermocouple at the detection end of the temperature detection device is attached to the chip sample to detect the surface temperature of the chip sample in real time.

[0054] S30: The test cover of the temperature control device is located above the workbench and is enclosed on the chip sample.

[0055] The temperature control device is set as a heat flow meter. The test cover of the temperature control device is placed directly above the chip sample, and the temperature of the chip sample inside the test cover is controlled by the temperature control device.

[0056] S100: Turn on the temperature control device.

[0057] S200: Temperature control device for preset test temperature adjustment based on chip sample.

[0058] Based on the preset test temperature of the chip sample and the extreme temperature range of the temperature control device, the test temperatures of the chip sample are set to -20℃, -30℃, -40℃, -50℃, -60℃, and -70℃. Taking a test temperature of -30℃ as an example, a light-shielding cloth is used to cover the test cover of the temperature control device.

[0059] S300: Detects the ambient temperature of the chip sample to determine if the air blowing device is turned on.

[0060] Specifically, S300 includes S301-S302.

[0061] S301: When the temperature detection device detects that the ambient temperature of the chip sample has not reached the preset test temperature, the temperature control device continues to adjust the ambient temperature of the chip sample. When the temperature detection device detects that the ambient temperature of the chip sample has reached the preset test temperature, the temperature control device maintains the ambient temperature of the chip sample.

[0062] If the temperature displayed by the temperature detection device has not reached -30℃, it means that the temperature control device has not yet lowered the temperature of the chip sample to -30℃. At this time, the temperature control device continues to adjust the ambient temperature of the chip sample. Once the temperature displayed by the temperature detection device reaches -30℃, the ambient temperature of the chip sample reaches the preset test temperature. Under the action of the temperature control device, the ambient temperature of the chip sample remains constant, with an error of ±0.1℃.

[0063] S302: The air blowing device is always in the open position.

[0064] When the temperature control device starts working, the blowing device is always on, regardless of whether the ambient temperature of the chip sample reaches the preset test temperature. The gas blown out by the blowing device is dried after passing through multiple stages of water and oil removal and micro-particle filtration. The blowing device continuously blows gas onto the surface of the chip sample.

[0065] S400: Removes moisture from the surface of the chip sample by using dry gas, so that the chip sample is free of frost or water mist.

[0066] The air blowing device includes an external air source and an airflow valve. The external air source supplies air, and the airflow volume is controlled by the adjustable airflow valve. The air blowing nozzle is kept at a certain working distance from the camera lens, and the air blowing nozzle is aimed at the chip sample to blow air. The surface of the chip sample is completely covered by the pre-treated dry gas, preventing the chip sample from condensing into frost or water vapor.

[0067] S500: Enter chip sample imaging mode: The chip sample imaging mode includes chip samples without frost or water mist at a preset test temperature, and locates the failure points of the chip sample based on hotspot imaging.

[0068] When the chip sample reaches the preset test temperature and there is no frost or water vapor, the chip sample meets the requirements of the low-temperature environment. The chip sample is then imaged by the imaging device. The image is clear, and there are no obvious fluctuations in the image and signal. The electrical properties of the sample are not significantly changed, the hot spot position is not significantly deviated, and the failure point is accurately located, thereby improving the success rate and accuracy of the chip low-temperature test.

[0069] The chip low-temperature testing method provided in this embodiment involves activating the temperature control device and adjusting it based on a preset test temperature for the chip sample. The ambient temperature of the chip sample is detected to ensure the air blowing device is activated. Dry gas is used to remove moisture from the surface of the chip sample, preventing frost or water mist. The chip sample imaging mode is then activated: this mode ensures the chip sample is free of frost or water mist at the preset test temperature. Failure points on the chip sample are located based on hotspot imaging. The imaging is clear, with no significant fluctuations in image and signal, no significant changes in sample electrical properties, no significant deviation in hotspot positions, and precise location of failure points, thus improving the success rate and accuracy of low-temperature chip testing.

[0070] Example 2

[0071] This embodiment provides a chip low-temperature testing device, which can perform the chip low-temperature testing method described in the above embodiment.

[0072] Specifically, such as Figure 2 As shown, the chip low-temperature testing device includes a temperature control module 100, a temperature setting module 200, a temperature detection module 300, a gas control module 400, and a sample imaging module 500.

[0073] The temperature control module 100 is used to turn on the temperature control device; the temperature setting module 200 is used to set the preset test temperature of the chip sample by the temperature control device; the temperature detection module 300 is used to detect the ambient temperature of the chip sample and determine that the blowing device is turned on; the gas control module 400 is used to control the blowing device to remove water vapor from the surface of the chip sample; and the sample imaging module 500 is used for hot spot imaging of the chip sample.

[0074] The chip low-temperature testing apparatus provided in this embodiment includes a temperature control module 100 for activating the temperature control device; a temperature setting module 200 for setting the preset test temperature of the chip sample; a temperature detection module 300 for detecting the ambient temperature of the chip sample to determine when the air blowing device is activated; a gas control module 400 for controlling the air blowing device to remove moisture from the surface of the chip sample; and a sample imaging module 500 for hotspot imaging of the chip sample. The imaging is clear, with no significant fluctuations in image and signal, no significant changes in sample electrical properties, no significant deviation in hotspot positions, and precise location of failure points, thus improving the success rate and accuracy of chip low-temperature testing.

[0075] Based on the above embodiments, the temperature detection module 300 is specifically used to send the ambient temperature detection signal of the chip sample to the air blowing device.

[0076] Based on the above embodiments, the sample imaging module 500 is specifically used to determine the failure point by imaging the hot spots of the chip sample when there is no frost or water mist at a preset test temperature.

[0077] The chip low-temperature testing device provided in Embodiment 2 of the present invention can be used to execute the chip low-temperature testing method provided in the above embodiments, and has corresponding functions and beneficial effects.

[0078] Example 3

[0079] Figure 3 A schematic diagram of the structure of an electronic device 10 according to an embodiment of the present invention is shown. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device may also represent various forms of mobile devices, such as personal digital processors, cellular phones, smartphones, wearable devices (e.g., helmets, glasses, watches, etc.), and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely illustrative and are not intended to limit the implementation of the invention described and / or claimed herein.

[0080] like Figure 3 As shown, the electronic device 10 includes at least one processor 11 and a memory, such as a read-only memory (ROM) 12 or a random access memory (RAM) 13, communicatively connected to the at least one processor 11. The memory stores computer programs executable by the at least one processor. The processor 11 can perform various appropriate actions and processes based on the computer program stored in the ROM 12 or loaded into the RAM 13 from storage unit 18. The RAM 13 can also store various programs and data required for the operation of the electronic device 10. The processor 11, ROM 12, and RAM 13 are interconnected via a bus 14. An input / output (I / O) interface 15 is also connected to the bus 14.

[0081] Multiple components in electronic device 10 are connected to I / O interface 15, including: input unit 16, such as keyboard, mouse, etc.; output unit 17, such as various types of displays, speakers, etc.; storage unit 18, such as disk, optical disk, etc.; and communication unit 19, such as network card, modem, wireless transceiver, etc. Communication unit 19 allows electronic device 10 to exchange information / data with other devices through computer networks such as the Internet and / or various telecommunications networks.

[0082] Processor 11 can be a variety of general-purpose and / or special-purpose processing components with processing and computing capabilities. Some examples of processor 11 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various special-purpose artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any suitable processor, controller, microcontroller, etc. Processor 11 performs the various methods and processes described above, such as chip cryogenic testing methods.

[0083] In some embodiments, the chip cryogenic testing method may be implemented as a computer program tangibly contained in a computer-readable storage medium, such as storage unit 18. In some embodiments, part or all of the computer program may be loaded and / or installed on electronic device 10 via ROM 12 and / or communication unit 19. When the computer program is loaded into RAM 13 and executed by processor 11, one or more steps of the chip cryogenic testing method described above may be performed. Alternatively, in other embodiments, processor 11 may be configured to perform the chip cryogenic testing method by any other suitable means (e.g., by means of firmware).

[0084] Various embodiments of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field-programmable gate arrays (FPGAs), application-specific integrated circuits (ASICs), application-specific standard products (ASSPs), systems-on-a-chip (SoCs), programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various embodiments may include implementations in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which may be a dedicated or general-purpose programmable processor, capable of receiving data and instructions from a storage system, at least one input device, and at least one output device, and transmitting data and instructions to the storage system, the at least one input device, and the at least one output device.

[0085] Computer programs used to implement the chip low-temperature testing method of the present invention can be written in any combination of one or more programming languages. These computer programs can be provided to the processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, such that when executed by the processor, the functions / operations specified in the flowcharts and / or block diagrams are implemented. The computer programs can be executed entirely on the machine, partially on the machine, as a standalone software package partially on the machine and partially on a remote machine, or entirely on a remote machine or server.

[0086] In the context of this invention, a computer-readable storage medium can be a tangible medium that may contain or store a computer program for use by or in conjunction with an instruction execution system, apparatus, or device. A computer-readable storage medium may include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatus, or devices, or any suitable combination of the foregoing. Alternatively, a computer-readable storage medium may be a machine-readable signal medium. More specific examples of machine-readable storage media include electrical connections based on one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fibers, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination of the foregoing.

[0087] To provide interaction with a user, the systems and techniques described herein can be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and pointing device (e.g., a mouse or trackball) through which the user provides input to the electronic device. Other types of devices can also be used to provide interaction with the user; for example, feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including sound input, voice input, or tactile input).

[0088] The systems and technologies described herein can be implemented in computing systems that include backend components (e.g., as data servers), or middleware components (e.g., application servers), or frontend components (e.g., user computers with graphical user interfaces or web browsers through which users can interact with implementations of the systems and technologies described herein), or any combination of such backend, middleware, or frontend components. The components of the system can be interconnected via digital data communication of any form or medium (e.g., communication networks). Examples of communication networks include local area networks (LANs), wide area networks (WANs), blockchain networks, and the Internet.

[0089] A computing system can include clients and servers. Clients and servers are generally located far apart and typically interact through communication networks. The client-server relationship is created by computer programs running on the respective computers and having a client-server relationship with each other. The server can be a cloud server, also known as a cloud computing server or cloud host, which is a hosting product within the cloud computing service system to address the shortcomings of traditional physical hosts and VPS services, such as high management difficulty and weak business scalability.

[0090] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this invention can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this invention can be achieved, and this is not limited herein.

[0091] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A method for low-temperature testing of chips, characterized in that, include: Turn on the temperature control device; The temperature control device adjusts the preset test temperature based on the chip sample. Detect the ambient temperature of the chip sample to determine if the air blowing device is turned on; The moisture on the surface of the chip sample is removed by drying gas, so that the chip sample is free of frost or water mist; Entering chip sample imaging mode: The chip sample imaging mode includes chip samples without frost or water mist at a preset test temperature, and locating the failure points of the chip sample based on hotspot imaging.

2. The chip low-temperature testing method according to claim 1, characterized in that, Also includes the area located before the temperature control device is turned on: The chip sample is fixed on the worktable; The detection end of the temperature detection device is attached to the chip sample; The test cover of the temperature control device is located above the workbench and is enclosed over the chip sample.

3. The chip low-temperature testing method according to claim 2, characterized in that, It also includes the temperature control device located after the preset test temperature adjustment based on the chip sample: The test cover of the temperature control device is covered with a light-shielding cloth.

4. The chip low-temperature testing method according to claim 2, characterized in that, The detection chip sample's ambient temperature determines whether the air blowing device is activated, including: When the temperature detection device detects that the ambient temperature of the chip sample has not reached the preset test temperature, the temperature control device continues to adjust the ambient temperature of the chip sample. When the temperature detection device detects that the ambient temperature of the chip sample has reached the preset test temperature, the temperature control device maintains the ambient temperature of the chip sample. The air blowing device is always in the open state.

5. The chip low-temperature testing method according to claim 1, characterized in that, The opening of the air blowing device specifically includes: The gas blown out by the air blowing device is dried after multi-stage dehydration, oil removal and micro-particle filtration. The air blowing device blows air onto the surface of the chip sample.

6. A chip low-temperature testing device, characterized in that, include: Temperature control module, used to turn on the temperature control device; A temperature setting module is used to set the preset test temperature of the chip sample by the temperature control device; The temperature detection module is used to detect the ambient temperature of the chip sample and determine when the air blowing device is turned on. The gas control module is used to control the air blowing device to remove moisture from the surface of the chip sample; The sample imaging module is used for hotspot imaging of chip samples.

7. The chip low-temperature testing apparatus according to claim 6, characterized in that, The temperature detection module is specifically used to send the ambient temperature detection signal of the chip sample to the air blowing device.

8. The chip low-temperature testing apparatus according to claim 6, characterized in that, The sample imaging module is specifically used to identify the hot spots of the chip sample when there is no frost or water mist at a preset test temperature as failure points.

9. An electronic device, characterized in that, include: At least one processor; as well as A memory that is communicatively connected to at least one of the processors; in The memory stores a computer program that can be executed by at least one of the processors, the computer program being executed by at least one of the processors to enable at least one of the processors to perform the chip low-temperature testing method according to any one of claims 1-5.

10. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer instructions that are used to cause a processor to execute the chip low-temperature testing method according to any one of claims 1-5.

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