Connector testing device

Abstract

The application discloses a connector testing device, and particularly relates to the technical field of testing, which comprises a testing adapter card and a testing device, wherein the testing device is arranged with a circuit board containing a connector to be tested; the testing adapter card is connected with the testing device and the connector to be tested respectively, and the testing adapter card and at least one pin pair in the testing device and the connector to be tested form at least one testing loop; the testing device sends a testing signal to each testing loop in the at least one testing loop; the testing adapter card in each testing loop acquires a response signal generated by the pin pair in each testing loop based on the testing signal, and sends the response signal to the testing device; and the testing device determines the welding state of the pin pair in each testing loop based on the response signal, so as to obtain the pin testing result of the connector to be tested according to the welding state. The application realizes rapid and accurate detection of the welding quality of the connector, effectively reduces the testing cost, avoids the loss of modules, and can accurately locate the pin with welding defects.

Description

Technical Field

[0001] This application relates to the field of testing technology, and in particular to a connector testing device. Background Technology

[0002] In related technologies, the soldering quality testing of connectors on circuit boards (such as computer boards and server motherboards) mainly adopts the method of actual module functional testing. This involves actually installing functional modules (such as CPUs (Central Processing Units), OAM (Open Accelerator Modules), etc.) onto the connectors on the circuit board, powering it on, and running a functional test program to verify whether the communication between the module and the circuit board is normal. However, this method has many drawbacks: on the one hand, functional modules are expensive, and frequent insertion and removal can cause irreversible wear on their gold fingers, resulting in extremely high testing costs; on the other hand, functional modules are large and require significant insertion and removal force, making them prone to structural interference with other electronic components on the circuit board during testing, leading to circuit board damage. Furthermore, the testing process is cumbersome and time-consuming, only determining whether the module is working properly, but not accurately locating the pins with soldering defects, greatly hindering rework. Summary of the Invention

[0003] This application provides a connector testing device to at least solve the problems of high testing cost, easy damage to modules, low testing efficiency, and inability to accurately locate soldering defect pins in related technologies.

[0004] This application provides a connector testing device, including: a test adapter card and a test device, wherein a circuit board containing the connector under test is placed in the test device; The test adapter card is connected to the test equipment and the connector under test respectively, and the test adapter card forms at least one test loop with at least one pin pair of the test equipment and the connector under test; The test equipment sends test signals to each test circuit in at least one test circuit; the test adapter card in each test circuit acquires the response signal generated by the pin pair in each test circuit based on the test signal, and sends the response signal to the test equipment; the test equipment determines the soldering status of the pin pair in each test circuit based on the response signal, so as to obtain the pin test result of the connector under test according to the soldering status.

[0005] The connector testing apparatus provided in this application connects a test adapter card to a test device and the connector under test (DUT). The test adapter card, the test device, and at least one pin pair in the DUT form at least one test loop. The test device sends test signals to each test loop within the at least one test loop. The test adapter card in each test loop acquires the response signals generated by the pin pairs in each test loop based on the test signals and sends the response signals to the test device. The test device determines the soldering state of the pin pairs in each test loop based on the response signals, thereby obtaining the pin test results of the DUT based on the soldering state. By using a test adapter card to replace expensive functional modules in constructing test loops, sending test signals to the loops, and acquiring response signals to determine the soldering state of the pin pairs, rapid and accurate detection of connector soldering quality can be achieved without installing actual functional modules. This effectively reduces testing costs, avoids module wear, and can accurately locate pins with soldering defects. Furthermore, the test adapter card is much smaller than functional modules, effectively avoiding interference with other electronic components on the circuit board. Attached Figure Description

[0006] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0007] Figure 1 A schematic diagram illustrating an OAM module interconnection communication provided in an embodiment of this application; Figure 2 This is a schematic diagram of a connector testing device provided in an embodiment of this application; Figure 3 This is a schematic diagram of another connector testing device provided in an embodiment of this application; Figure 4 A schematic diagram of an exemplary test circuit provided in an embodiment of this application; Figure 5 This is a schematic diagram of an exemplary connector testing process provided in an embodiment of this application. Detailed Implementation

[0008] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0009] It should be noted that, in the description of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. The terms "first," "second," etc., in this application are used to distinguish similar objects and are not used to describe a specific order or sequence.

[0010] Taking the OAM module connector for a server motherboard as an example, with the rapid development of artificial intelligence, deep learning, and high-performance computing technologies, the demand for AI (Artificial Intelligence) computing power is growing exponentially. The OAM hardware interface specification launched by the OCP (Open Compute Project) has become the mainstream solution for AI servers. Current mainstream OAM modules integrate core functions such as hardware monitoring, remote control, firmware upgrades, fault diagnosis, and asset management. They interconnect with the BMC (Baseboard Management Controller), fan board, power module, and various computing nodes through buses such as I2C / SMBus (System Management Bus) and PCIe (Peripheral Component Interconnect Express). Figure 1 The diagram illustrates an interconnection and communication process between OAM modules. Therefore, ensuring seamless communication between the OAM module and the motherboard is crucial, and the hardware foundation for this communication is the OAM module connector soldered onto the server motherboard. Failure to guarantee the soldering quality of the OAM module connectors on the server motherboard will make troubleshooting server malfunctions difficult, further exacerbating problems in large facilities such as data centers and computing centers.

[0011] Currently, the main technology for testing the soldering quality of OAM module connectors is the "actual OAM module functional test" method. This involves installing a complete OAM module on the motherboard under test, powering it on, and running a functional test program to verify whether the communication between the module and the motherboard is normal. However, this method has several drawbacks: Firstly, a single OAM module is worth tens of thousands of yuan. Frequent plugging and unplugging during mass production testing can cause irreversible damage to the module's gold fingers and internal circuitry, resulting in huge testing losses and costs.

[0012] Secondly, OAM modules are large and heavy, requiring a large insertion and extraction force (approximately 50-100N per board). Furthermore, the OAM connectors on the motherboard are usually surrounded by tall components such as high-power capacitors, inductors, and heat sinks, which can easily cause structural interference during testing, leading to damage to the motherboard.

[0013] Third, functional testing requires multiple steps such as module installation, power-on startup, and functional verification. Single-board testing can take several minutes, which cannot meet the cycle time requirements of mass production lines. Furthermore, functional testing can only determine whether the OAM module is working properly, but cannot accurately locate the pins with poor soldering, making rework difficult.

[0014] Fourth, the firmware and hardware interfaces of different OAM modules differ, requiring the development of separate test programs, which increases the maintenance cost and complexity of the test system.

[0015] To address the problems in related technologies, this application provides a connector testing device. This device replaces expensive OAM modules with a test adapter card to construct a test loop. Test signals are sent to the loop via testing equipment to obtain response signals, thereby determining the soldering status of connector pins. This eliminates the need for a physical OAM module, enabling rapid and accurate detection of connector soldering quality, effectively reducing testing costs, avoiding module wear, and precisely locating pins with soldering defects. Furthermore, the test adapter card is significantly smaller than the functional module, effectively avoiding interference with other electronic components on the circuit board.

[0016] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0017] Figure 2 This is a schematic diagram of a connector testing device provided in an embodiment of this application.

[0018] like Figure 2 As shown, the device includes: The test adapter card and test equipment are used. The test equipment contains a circuit board with a connector under test (DUT). The test adapter card is connected to both the test equipment and the DUT, forming at least one test loop with at least one pin pair in both the test equipment and the DUT. The test equipment sends test signals to each test loop in the at least one test loop. The test adapter card in each test loop acquires the response signals generated by the pin pairs in each test loop based on the test signals and sends the response signals to the test equipment. The test equipment determines the soldering status of the pin pairs in each test loop based on the response signals, so as to obtain the pin test results of the DUT based on the soldering status.

[0019] The testing equipment is the core device for performing electrical tests. It sends test signals to the test circuit, receives response signals, and determines the soldering status of each pin based on the response signals. This testing equipment can be a standardized ICT (In-Circuit Test) fixture in the electronics manufacturing industry. ICT is a standard testing method that detects manufacturing defects and component failures by testing the electrical performance and connections of components on a circuit board in-circuit. It mainly detects abnormal parameters of individual components and problems such as open circuits, short circuits, and poor soldering in circuit networks. It features simple operation, fast testing speed, and pin-level fault location, making it a core link in the mass production testing of circuit boards in the electronics manufacturing industry.

[0020] A circuit board containing a connector under test (DUT) refers to a circuit board such as an AI server motherboard or computer board that requires testing the soldering quality of its module connectors. This circuit board has one or more DUT connectors soldered on it (e.g., an OAM 688-pin high-density connector). The pins of the DUT connector are electrically connected to the circuit board via solder joints.

[0021] The test adapter card is the core component of this device. It is used to replace the expensive OAM module for soldering tests on connectors. One end of the adapter card is connected to the connector under test, and the other end is electrically connected to the test equipment.

[0022] The test adapter card and at least one pin pair in the connector under test form at least one test loop. Specifically, each signal pin pair on the test adapter card is electrically connected through the corresponding network on the circuit board (e.g., PCB (Printed Circuit Board) traces). The test adapter card then leads the pin signals back to the test equipment, thus forming a complete closed electrical path formed by the test equipment, the test adapter card, the pin pair of the connector under test, and the traces inside the circuit board.

[0023] Figure 3 This is a schematic diagram of another connector testing device provided in an embodiment of this application, as shown below. Figure 3 As shown, in some embodiments, the device further includes an adapter, through which the first connection end of the test adapter card is electrically connected to the test equipment.

[0024] The first connection end of the test adapter card is equipped with a flexible board connector (such as an FPC (Flexible Printed Circuit) connector), which has the advantages of small size, good flexibility and small space occupation. It can significantly reduce the size of the adapter card (only 1 / 3 of the standard OAM module) and effectively avoid structural interference with tall components around the circuit board (such as high-power capacitors, inductors, heat sinks, etc.).

[0025] The adapter is used to achieve interface matching and signal conversion between the test adapter card and the test equipment. Since the interface of standard ICT fixtures (test equipment) is typically a toggle connector (e.g., 2.54mm pitch), while the test adapter card, for miniaturization, uses a small FPC connector (e.g., 0.5mm pitch) at its first connection end, the two cannot be directly connected. Therefore, an adapter is needed for intermediate conversion. This adapter is a small PCB board. One end integrates an FPC female connector for connection to the FPC connector of the test adapter card via an FPC cable, and the other end integrates a standard toggle connector for connection to the ICT test equipment via a cable. Impedance matching wiring is used in the middle of the adapter to ensure that there is no significant signal attenuation or reflection during the conversion process.

[0026] The adapter features a modular design, allowing for the replacement of corresponding angled connectors to suit different test equipment interfaces, thus improving the versatility of the test system. The adapter cable uses shielded twisted-pair cable to reduce the impact of electromagnetic interference on test results.

[0027] In some embodiments, the device further includes a plugging / unplugging mechanism for driving the second connection end of the test adapter card to dock and disconnect from the connector under test in response to a test command for the connector under test.

[0028] The second connection end of the test adapter card is equipped with a male connector (such as the OAM688Pin male connector) that matches the connector under test. The pin definitions, dimensions and positioning methods of the male connector correspond one-to-one with the connector under test, ensuring that the two can be accurately mated.

[0029] The insertion / removal mechanism is the automated drive component of the entire device, used to automatically insert and remove the test adapter card from the connector under test. Because OAM high-density connectors require significant insertion and removal forces (approximately 50-100N per card), and a single motherboard typically carries more than 10 OAM connectors, manual insertion and removal is not only labor-intensive and inefficient, but also highly susceptible to damage due to improper operation. Therefore, automating insertion and removal through the insertion / removal mechanism (which provides an adjustable thrust of 0-500N) ensures both testing efficiency and reliability.

[0030] During testing, the insertion / removal mechanism responds to test commands issued by the control system, driving the second connection end of the test adapter card downwards to precisely align the male connector with the connector under test. After the test is completed, the insertion / removal mechanism again drives the second connection end upwards to separate the male connector from the connector under test.

[0031] By setting up a plug-in / plug-out mechanism, the docking and disconnection between the test adapter card and the connector under test is automated, eliminating the need for manual operation and effectively avoiding connector damage that may be caused by manual plugging and unplugging, while significantly improving testing efficiency.

[0032] In some embodiments, the insertion / removal mechanism includes a control system, a servo cylinder, and a spring separation assembly; wherein, the control system is used to control the extension or retraction of the servo cylinder in response to a test command of the connector under test, so that the servo cylinder drives the second connection end of the test adapter card to mate with the connector under test; the servo cylinder is provided with a buffer assembly, which is used to absorb impact force when the test adapter card mates with the connector under test; the spring separation assembly is used to assist the test adapter card in separating from the connector under test when the servo cylinder retracts.

[0033] The control system can use a PLC (Programmable Logic Controller) as the core control unit to receive test commands from the test equipment or user control panel and control the servo cylinders according to preset timing logic. The control system is also responsible for monitoring various status signals (such as position detection signals, pressure feedback signals, etc.) throughout the insertion and removal process, and issuing stop commands in a timely manner in case of abnormalities to protect the equipment and products.

[0034] The buffer assembly may include a pneumatic buffer at the end of the cylinder stroke or a separate hydraulic buffer. As the cylinder extends and moves the test adapter card downward, the buffer assembly begins to function when the adapter card is about to fully engage with the connector under test. It absorbs the kinetic energy of the moving parts, allowing the docking process to smoothly transition from rapid movement to a stop, thus preventing the connector pins from bending, breaking, or the circuit board from being damaged due to excessive impact.

[0035] The spring separation assembly is installed below the test adapter card (i.e., the first connection end) and includes multiple compression springs. When the servo cylinder extends to mate the test adapter card with the connector under test, the springs are compressed and store elastic potential energy. When the test is completed and the servo cylinder retracts, the compressed springs release the elastic potential energy, pushing the test adapter card upward to facilitate its smooth separation from the connector under test, effectively preventing separation difficulties caused by excessive insertion or extraction force or connector jamming.

[0036] Through the coordinated operation of the control system, servo cylinder, buffer assembly, and spring separation assembly, the docking and disconnection process between the test adapter card and the connector under test is automated, stable, and controllable, effectively protecting the connector and circuit board while improving testing efficiency and consistency.

[0037] In some embodiments, the device further includes: a mounting positioning component, which consists of a guide pin and a guide sleeve; the mounting positioning component is used to align and position the second connection end of the test adapter card with the connector under test when the insertion / removal mechanism drives the second connection end of the test adapter card to mate with the connector under test.

[0038] The guide pin, cylindrical in shape and with a tapered inlet section at its end, is mounted on the positioning base plate of the test adapter. The guide sleeve is positioned on the carrier plate of the test equipment or at the positioning hole location on the circuit board, with its inner diameter precisely matching the outer diameter of the guide pin (gap controlled at the micrometer level, positioning accuracy up to ±0.02mm). During the downward movement of the test adapter driven by the insertion / removal mechanism, the guide pin first enters the guide sleeve. Guided by the tapered inlet section, it automatically corrects the positional deviation between the test adapter and the connector under test, ensuring precise alignment of the pins and preventing damage to the connector during insertion / removal.

[0039] By using the guide pin and guide sleeve, high-precision automatic alignment is achieved during the docking process between the test adapter card and the connector under test, effectively eliminating the uncertainty of manual operation and ensuring the reliability and consistency of insertion and removal.

[0040] In some embodiments, the mounting positioning component further includes a positioning detection switch and a foolproof structure; the foolproof structure is used to prevent the second connection end of the test adapter card from misaligning with the connector under test; the positioning detection switch is used to send a trigger signal to the insertion / removal mechanism when the second connection end of the test adapter card is properly aligned with the connector under test, so that the insertion / removal mechanism stops the driving action of aligning the second connection end of the test adapter card with the connector under test according to the trigger signal.

[0041] The foolproof structure can employ a combination of foolproof pins and asymmetrical holes. For example, foolproof pins of different diameters or positions can be placed on the positioning base plate of the test adapter card, with matching foolproof holes at corresponding positions on the mainboard carrier. If the operator mistakenly installs the test adapter card in the wrong direction or position, the foolproof pins and holes will not align, thus physically preventing incorrect docking. Foolproof structures can also take the form of color markings or mechanical stops, the core purpose of which is to ensure that the test adapter card can only mate with the connector under test in the correct direction and position, avoiding equipment damage due to operational errors.

[0042] The positioning detection switch can be a contact microswitch or a non-contact proximity sensor. When the test adapter moves downward to the predetermined position where it is fully engaged with the connector under test, the positioning detection switch immediately sends a trigger signal to the control system. Upon receiving the trigger signal, the control system immediately issues a stop command to the servo cylinder, causing the cylinder to stop extending. At this point, the test adapter and the connector under test are fully engaged, effectively preventing over-insertion of the cylinder that could damage the connector.

[0043] By incorporating a foolproof structure and a positioning detection switch, the risk of damage such as incorrect or excessive connector insertion due to misoperation or control errors is effectively avoided, further enhancing the safety and reliability of the testing device.

[0044] In some embodiments, the test signal includes a test current, and the test device is configured to send a test current to a first test circuit, wherein the first test circuit is any one of at least one test circuit; if the test device does not receive a response signal generated by the test current based on the first pin pair of the first test circuit returned by the test adapter card, the soldering state of the first pin pair is determined to be abnormal; if the test device receives a response signal generated by the test current based on the test current based on the first pin pair of the first test circuit returned by the test adapter card, the voltage value of the first test circuit is determined, and the loop resistance value of the first test circuit is determined based on the voltage value and the current value corresponding to the test current; the soldering state of the first pin pair is determined based on the loop resistance value.

[0045] Specifically, after all components are connected to form a test circuit, the test equipment is powered on and a pre-written test program is run. The program outputs a constant DC test current (e.g., 1mA) to each test circuit. This current flows through each node in the test circuit, including the test equipment, test adapter card, input pins of the connector under test, PCB traces on the circuit board, output pins of the connector under test, test adapter card, and test equipment. During the flow of current through the circuit, a corresponding voltage drop is generated across the circuit's equivalent resistance.

[0046] This application judges the soldering quality of the pins of each test circuit based on the circuit's continuity and impedance value. If the test circuit is conductive and the impedance is within the normal range, it indicates that the pin soldering quality is good. If the test circuit is open or the impedance is abnormal, it indicates that there are defects such as poor soldering or open circuit.

[0047] Specifically, if a pin of the connector under test has an open-circuit soldering defect (i.e., there is no electrical connection between the pin and the circuit board pad), the test circuit is broken at that pin (the test circuit will not conduct), and the test current cannot form a complete loop. Therefore, the test equipment cannot collect any returned response signal. In this case, the pin is determined to have an abnormal soldering (open circuit). If the test circuit is conducting, the test equipment collects the voltage value across the test circuit and calculates the equivalent resistance value of the test circuit according to Ohm's law (resistance = voltage / current). The soldering status of the pin is further determined based on the resistance value.

[0048] In some embodiments, determining the soldering status of the first pin pair based on the loop resistance value includes: determining that the first pin pair is soldered normally when the loop resistance value is within the target resistance range; and determining that the first pin pair is soldered abnormally when the resistance value is not within the target resistance range.

[0049] The target resistance range is a reference interval derived from extensive testing of known well-soldered standard samples, taking into account factors such as the inherent conductor resistance of the test circuit, the normal fluctuation range of contact resistance, and measurement errors. For example, in practical applications, if the normal resistance of the circuit is within the range of 1Ω to 5Ω, the target resistance range is set to 1Ω-5Ω. When the measured circuit resistance falls within the 1Ω-5Ω range, it indicates that the electrical connection formed by the soldering of that pin is good, and the solder joint has normal conductivity, thus being judged as normal soldering. When the measured circuit resistance is below 1Ω, it may indicate an abnormal short circuit in the circuit, such as solder bridges between adjacent pins, thus being judged as abnormal soldering. When the measured circuit resistance is above 5Ω but below 100Ω, it may indicate partial poor soldering (cold solder, insufficient solder, etc.), leading to increased contact resistance, thus being judged as abnormal soldering (requiring rework). When the measured loop resistance value exceeds 100Ω or approaches infinity, it indicates that the loop is basically in an open circuit state, and there is almost no electrical connection between the pin and the pad, which is judged as an abnormal soldering (severe cold solder joint or open circuit).

[0050] It should be noted that the specific values ​​of the target resistance range (such as 1Ω-5Ω) are only illustrative examples. In actual applications, they can be adjusted and optimized according to factors such as the specific test circuit configuration, connector type, and PCB trace impedance.

[0051] By setting a clear target resistance range, the welding quality can be quantitatively judged, which can identify serious defects such as open circuit / short circuit, as well as potential reliability defects such as poor solder joints, thus eliminating the subjectivity of manual judgment.

[0052] In some embodiments, the test equipment is further configured to determine the soldering status of the pin pairs in each test circuit based on the response signal, and then generate a pin test report for the connector under test according to the pin number and the soldering status of the pins.

[0053] The pin number is a unique identifier for each connector pin. After completing the testing of all test circuits, the testing equipment associates the test result (normal soldering / abnormal soldering) of each pin with its pin number and stores it. The report may include the following information: the identification information of the motherboard under test (such as serial number), test time, the number and location of each connector, the number of each pin and its corresponding soldering status (abnormal items are marked with different colors), etc.

[0054] By generating detailed pin test reports, the traceability and visualization of test results are achieved. Maintenance personnel can quickly locate specific pins with soldering defects based on the reports, enabling targeted rework and significantly improving maintenance efficiency. Simultaneously, the test reports provide a data foundation for quality statistical analysis, helping to identify systemic soldering quality issues in the production process.

[0055] In some embodiments, after obtaining the pin test results of the connector under test based on the soldering status, the control system controls the servo cylinder to retract; the spring separation assembly pushes the second connection end of the test adapter card to separate from the connector under test when the servo cylinder retracts; and the circuit board containing the connector under test is removed from the test equipment.

[0056] Specifically, after the testing equipment completes all tests and generates a test report, it sends a test completion signal to the control system. Upon receiving this signal, the control system issues a retraction command to the servo cylinder according to a preset timing logic. The piston rod of the servo cylinder drives the test adapter card upward. During the cylinder retraction process, the spring separation assembly (compression spring) begins to release the elastic potential energy stored during compression, applying an upward thrust to the test adapter card to ensure smooth separation between the test adapter card and the connector under test, even under large insertion / extraction forces or slight jamming.

[0057] Once the test adapter card has completely detached from the connector under test and returned to its initial position, remove the tested circuit board from the carrier board of the test equipment. The testing process for this circuit board is now complete. Circuit boards that fail the test can be repaired and retested according to the test report.

[0058] With the automatic control of the control system and the assisted separation of the spring separation component, the circuit board is automatically released and smoothly unloaded after the test is completed. The entire testing process can be completed without manual intervention, from connection to testing to separation, ensuring the consistency and efficiency of the testing cycle.

[0059] In summary, the connector testing device provided in this application, through the coordinated operation of multiple functional modules such as test adapter cards, adapters, insertion / removal mechanisms, mounting and positioning components, position detection switches, and foolproof structures, combined with the current excitation and resistance detection of each test circuit by the testing equipment, achieves fully automated, high-precision, and high-efficiency testing of the soldering quality of various high-density connectors, including OAM module connectors. It can accurately locate each pin with soldering abnormalities and ensures traceability of results through test report output. This device effectively solves the technical problems of high cost, high loss, low efficiency, and inaccurate positioning caused by relying on expensive OAM modules for functional testing in related technologies.

[0060] This application also provides a connector testing method, applied to the aforementioned connector testing apparatus, comprising: The test adapter card is connected to the connector under test to construct at least one test loop, which is formed by the test adapter card and at least one pin pair of the test equipment and the connector under test.

[0061] Send test signals to each test loop in at least one test loop to obtain response signals generated by the pin pairs in each test loop based on the test signals; The soldering status of the pin pairs in each test circuit is determined based on the response signal, so as to obtain the pin test results of the connector under test according to the soldering status.

[0062] In embodiments of this application, a closed-loop test circuit is constructed by mating a test adapter card with the connector under test. For example, such as... Figure 4 As shown, Figure 4 This is a schematic diagram of an exemplary test circuit provided in an embodiment of this application. This application uses a server motherboard OAM module connector as an example. Figure 4 The OAM adapter card corresponds to the test connection card of this application, and the ICT device corresponds to the test device of this application. A test loop is formed between the OAM adapter card, the ICT device, and the motherboard OAM module connector. The ICT device sends test signals to each test loop according to a pre-written test program and collects response signals, realizing automated and parallel testing of the soldering quality of all connector pins.

[0063] For example, to aid understanding, this application uses a specific example to explain the connector testing method provided herein. This application takes an AI server motherboard equipped with eight OAM module connectors as an example to explain the testing process in detail, such as... Figure 5 As shown, Figure 5 This is a schematic diagram of an exemplary connector testing process provided in an embodiment of this application. Figure 5 In this application, OAM1~OAM8 correspond to the connector under test, the board under test corresponds to the circuit board, and the OAM adapter card corresponds to the test adapter card.

[0064] Reference Figure 5 This method is applied to the connector testing apparatus of the foregoing embodiments. The apparatus includes a test adapter card, a test device (ICT fixture), an adapter, a plug-in / plug-out mechanism, and mounting and positioning components. The test process can be initiated or test parameters input via an operating interface (such as a display panel or host computer) connected to the test device. The test device automatically executes the entire test process according to a pre-written test program, following the procedure below: Before officially starting the test, the operator needs to complete the following preparations: Place the circuit board containing the connector to be tested (…). Figure 5The board under test (BUT) is placed on the carrier plate of the test equipment (ICT fixture), the BUT is fixed by the positioning pins, and the clamping device of the fixture is activated to reliably fix the motherboard, ensuring that the BUT will not be displaced during subsequent docking and testing.

[0065] Multiple test adapter cards (the number matching the number of connectors under test on the motherboard; a motherboard with 8 OAM connectors requires 8 test adapter cards) are mounted on the mounting plate of the automated insertion and removal mechanism. The second connection end of each test adapter card (equipped with a male connector that matches the connector under test) faces the connector under test, and the first connection end (equipped with an FPC connector) is connected to the adapter via an FPC cable. Then, the adapter is connected to the ICT test equipment via a horn cable.

[0066] After all cable connections are completed, the test equipment enters the test-ready state. When the test equipment issues a test start command, the control system of the insertion / removal mechanism (e.g., a PLC controller) responds to the test command for the connector under test, controlling the servo cylinder to extend and move the second connection end of the test adapter card towards the connector under test. Guided by the guide pin, the adapter card precisely mates with the OAM connector on the motherboard. When the positioning detection switch is triggered, the control system immediately stops the extension action of the servo cylinder, at which point the adapter card and connector are fully engaged.

[0067] At this point, both the physical and electrical connections between the test adapter card and the connector under test (DUT) are established. Each pin of the second connector terminal (male connector) of the test adapter card forms a one-to-one electrical contact with the corresponding pin of the connector under test (female connector). The first connector terminal (FPC connector) of the test adapter card is connected to the test equipment via an adapter and cable. Thus, the test adapter card, the test equipment, and at least one pin pair of the connector under test form at least one test loop.

[0068] It should be noted that power and ground pins can be grouped and shorted on the test adapter card to facilitate power circuit testing by ICT. For each signal pin (with equal-length wiring on the adapter card to ensure consistent high-speed signal transmission), a corresponding independent test circuit can be constructed in the above manner, thereby enabling simultaneous testing of all connector pins.

[0069] Once all test adapters are properly connected and confirmed to be in place with the connector under test, the test equipment (ICT fixture) is powered on and runs the pre-written test program. The program sequentially sends a 1mA DC test current to each test loop. The test equipment can also select to send test signals of different amplitudes or frequencies (e.g., AC signals or pulse signals) according to actual test requirements, to adapt to different types of connectors and different test standards. The current flows along the test loop, passing through each electrical node in the path. During the flow of the test current through the loop, a corresponding voltage drop is generated across the equivalent resistance of the loop. If the loop is not conductive, the test equipment cannot obtain a response signal, indicating an abnormality in the pin soldering. If the loop is conductive, the test equipment collects the voltage value across the loop and calculates the loop resistance value of each test loop. If the resistance value is within the target resistance range (e.g., 1Ω-5Ω), the pin soldering is considered good; if the resistance value is greater than 100Ω, it is considered a cold solder joint or an open circuit.

[0070] After the testing equipment completes testing of all test circuits, the ICT automatically generates a test report, recording in detail the test results for each pin of each connector, and marking non-conforming items with different colors. Maintenance personnel can quickly locate the specific pin requiring repair based on this report and perform targeted resoldering or repair operations.

[0071] After the testing equipment completes the testing of all test circuits and generates a test report, the control system's servo cylinder retracts. During the cylinder retraction, the spring separation component releases the elastic potential energy stored during compression, applying an upward thrust to the test adapter card to facilitate its smooth separation from the connector under test. Once the test adapter card is completely detached from the connector under test, the ICT fixture clamping device is released, and the tested circuit board is removed from the ICT fixture's carrier plate.

[0072] Circuit boards whose test reports show all pins are qualified (PASS) can proceed to the next production process. For circuit boards whose test reports show pins with soldering abnormalities, maintenance personnel will repair the corresponding pins according to the abnormal pin numbers and abnormality types recorded in the test reports (such as resoldering, reballing, etc.). After the repair is completed, the circuit board will be put back into the testing equipment for retesting until all pins pass the test.

[0073] Understandably, the specific execution flow of this connector testing method can be found in the preceding text. Figures 2 to 3 The detailed descriptions of the corresponding embodiments will not be repeated here.

[0074] Embodiments of this application also provide an electronic device including the connector testing apparatus of any of the above embodiments.

[0075] Those skilled in the art will further recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of both. To clearly illustrate the interchangeability of hardware and software, the components and steps of the various examples have been generally described in terms of functionality in the foregoing description. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0076] The connector testing device provided in this application has been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make several improvements and modifications to this application without departing from the principles of this application, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A connector testing device, characterized in that, The device includes: Test adapter card and test equipment, wherein the test equipment contains a circuit board containing the connector under test; The test adapter card is connected to the test equipment and the connector under test respectively, and the test adapter card forms at least one test loop with at least one pin pair of the test equipment and the connector under test; The testing device sends test signals to each test circuit in the at least one test circuit; the test adapter card in each test circuit acquires the response signal generated by the pin pair in each test circuit based on the test signal, and sends the response signal to the testing device; the testing device determines the soldering state of the pin pair in each test circuit based on the response signal, so as to obtain the pin test result of the connector under test according to the soldering state.

2. The apparatus according to claim 1, characterized in that, The device further includes: Adapter; The first connection terminal of the test adapter card is electrically connected to the test equipment through the adapter; The first connection end is provided with a flexible plate connector.

3. The apparatus according to claim 1, characterized in that, The device further includes: Insertion and removal mechanism; The insertion and removal mechanism is used to respond to the test command on the connector under test, and drive the second connection end of the test adapter card to dock and disconnect from the connector under test; The second connection end is provided with a male connector that matches the connector under test.

4. The apparatus according to claim 3, characterized in that, The insertion / removal mechanism includes a control system, a servo cylinder, and a spring separation assembly. The control system is used to respond to a test command on the connector under test by controlling the extension or retraction of the servo cylinder, so that the servo cylinder drives the second connection end of the test adapter card to dock with the connector under test; the servo cylinder is provided with a buffer component, which is used to absorb impact force when the test adapter card docks with the connector under test. The spring separation assembly is used to assist in separating the test adapter card from the connector under test when the servo cylinder retracts.

5. The apparatus according to claim 3, characterized in that, The device further includes: The mounting and positioning assembly consists of a guide pin and a guide sleeve. The mounting and positioning component is used to align and position the second connection end of the test adapter card with the connector under test when the insertion and removal mechanism drives the second connection end of the test adapter card to mate with the connector under test.

6. The apparatus according to claim 5, characterized in that, The installation positioning component also includes a positioning detection switch and a foolproof structure; The foolproof structure is used to prevent the second connection end of the test adapter card from misaligning with the connector under test. The positioning detection switch is used to send a trigger signal to the insertion / removal mechanism when the second connection end of the test adapter card is properly mated with the connector under test, so that the insertion / removal mechanism stops the driving action of mating the second connection end of the test adapter card with the connector under test according to the trigger signal.

7. The apparatus according to claim 1, characterized in that, The test signal includes the test current. The test equipment is configured to send a test current to a first test circuit, wherein the first test circuit is any one of the at least one test circuit. If the test equipment does not receive a response signal generated by the test adapter card for the first pin pair of the first test circuit based on the test current, the soldering status of the first pin pair is determined to be abnormal. When the test equipment receives a response signal generated by the test adapter card for the first pin of the first test circuit based on the test current, the voltage value of the first test circuit is determined, and the circuit resistance value of the first test circuit is determined according to the voltage value and the current value corresponding to the test current. Based on the circuit resistance value, the soldering status of the first pin pair is determined.

8. The apparatus according to claim 7, characterized in that, Determining the soldering status of the first pin pair based on the loop resistance value includes: If the circuit resistance value is within the target resistance range, it is determined that the first pin is properly soldered. If the resistance value is not within the target resistance value range, it is determined that the soldering of the first pin pair is abnormal.

9. The apparatus according to claim 1, characterized in that, The testing equipment is also used to determine the soldering status of the pin pairs in each test circuit based on the response signal, and then generate a pin test report for the connector under test according to the pin number and the soldering status of the pins.

10. The apparatus according to claim 4, characterized in that, After obtaining the pin test results of the connector under test based on the welding status, the control system controls the servo cylinder to retract. The spring separation assembly pushes the second connection end of the test adapter card to separate from the connector under test when the servo cylinder retracts; Remove the circuit board containing the connector under test from the test equipment.

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