Detachable laser transmission module and optical connector assembly for integrated circuit integration

Abstract

Disclosed is a detachable laser transmission module and an optical connector assembly for integrated circuit integration. The optical connector assembly for integrated circuit integration includes an integrated circuit module and a detachable laser transmission module. The integrated circuit module includes an integrated circuit. The detachable laser transmission module is configured to optically couple the integrated circuit module and includes a laser fixing member and a laser detachable connector. The laser fixing member is configured to be fixed to the integrated circuit module, and the laser detachable connector is detachably engaged with the laser fixing member and configured to hold a laser unit.

Description

Technical Field

[0001] This application relates to an optical connector, and more specifically, to a detachable laser transmission module and an optical connector assembly for integrated circuit integration. Background Technology

[0002] Photonic integrated circuits (PICs) are essential components in optical communication systems. They achieve high-density optical integration by integrating multiple optical functions into a single chip.

[0003] In existing technologies, the optical coupling process of aligning and optically coupling several fiber optic or laser light sources to a photonic integrated circuit typically relies on manual alignment techniques. Since each fiber optic or laser light source must be individually positioned and coupled to an optical port or interface on the photonic integrated circuit, this manual alignment technique is not only labor-intensive but also quite time-consuming.

[0004] Therefore, existing optocoupler processes are not only difficult to scale to high-volume processes, but also suffer from limited alignment accuracy and high assembly costs. Based on this, there is an urgent need in the related technical field for a solution to overcome the limitations of manual alignment and achieve a highly efficient and repeatable assembly process.

[0005] Furthermore, in existing photonic integrated circuit designs, to ensure good optical coupling between the laser element's light source and the optical ports or interfaces on the photonic integrated circuit, and to reduce alignment complexity and optical loss, the laser element is typically directly integrated into the photonic integrated circuit. However, this approach can easily lead to the following problems: for example, embedding laser elements in the manufacturing process often involves more stringent process conditions, resulting in poor process yield; in addition, the heat generated by such embedded laser elements during operation may affect adjacent electronic components, thereby reducing the overall performance and reliability of the photonic integrated circuit. Summary of the Invention

[0006] This application provides a detachable laser transmission module and an optical connector assembly for integrated circuit integration, which solves the problems of alignment complexity, thermal interference and integration yield in the prior art, and realizes array-level optical coupling between optical fiber and / or laser components and photonic integrated circuits (PIC) or optoelectronic integrated circuits (OEIC).

[0007] The optical connector assembly includes a detachable alignment element for providing high-precision positioning between the laser array of the laser element and the optical waveguide. The laser array in the laser element is a monolithic laser array fabricated using semiconductor processes such as epitaxial growth or lithography, ensuring compatibility with wafer-level processes and supporting mass production. Simultaneously, active alignment between the laser array and the optical waveguide achieves batch-level optical coupling and improves optical alignment accuracy. Therefore, it helps achieve sub-micron level coupling accuracy, improves optical performance, and reduces insertion loss caused by optical coupling.

[0008] Furthermore, in the configuration of this application, the laser array is disposed outside the photonic integrated circuit or the optoelectronic integrated circuit, and then optically coupled to the photonic integrated circuit or the optoelectronic integrated circuit via the optical connector assembly. Therefore, the heat source generated by the laser element can be separated from the photonic integrated circuit or the optoelectronic integrated circuit to avoid local heating. It also facilitates independent thermal management of the laser element. In addition, the configuration can also avoid the limitations caused by the co-packaging of the laser array and the photonic integrated circuit or the optoelectronic integrated circuit, thereby improving the system configuration flexibility and reducing the overall process complexity.

[0009] In a first aspect, embodiments of this application provide an optical connector assembly for integrated circuit integration, the optical connector assembly comprising an integrated circuit module and a detachable laser transmission module.

[0010] The integrated circuit module includes an integrated circuit. The detachable laser transmission module is configured to be optically coupled to the integrated circuit module.

[0011] Optionally, in some embodiments of this application, the detachable laser transmission module includes a laser fixing member and a detachable laser connector. The laser fixing member is configured to be fixed to the integrated circuit module. The detachable laser connector is detachably engaged with the laser fixing member and configured to hold the laser unit.

[0012] Optionally, in some embodiments of this application, the laser unit includes a substrate and a laser array, the laser array being formed along the edge of the substrate, the laser array being an integral laser array and having multiple laser emitters.

[0013] Optionally, in some embodiments of this application, the detachable laser transmission module further includes a guide. The guide is disposed on the laser fixing member, and the guide is configured to be fixed to the laser fixing member after being actively aligned with the laser unit.

[0014] Optionally, in some embodiments of this application, the laser fixing member is configured to be fixed to the integrated circuit module after the guide member, the laser unit and the integrated circuit are actively aligned with each other.

[0015] Optionally, in some embodiments of this application, the laser fixing member includes a fixing member housing, a mounting groove, and at least one engaging portion. The fixing member housing is disposed adjacent to the integrated circuit module, and the mounting groove is recessed in the fixing member housing and configured to accommodate the guide member.

[0016] Optionally, the laser detachable connector includes a body and at least one positioning part, the positioning part being detachably engaged with the engagement part.

[0017] Optionally, in some embodiments of this application, the integrated circuit module further includes a first optical interface disposed on one side of the integrated circuit. When the detachable laser transmission module is engaged with the integrated circuit module, at least one internal feedback loop is formed between the guide and the first optical interface, and the internal feedback loop is configured to receive optical signals from the laser unit.

[0018] Optionally, in some embodiments of this application, the detachable laser transmission module further includes two guide members configured to be aligned with each other, wherein one guide member is disposed on the laser fixing member, and the other guide member is disposed on the laser detachable connector, and optically aligned with the laser unit.

[0019] Optionally, in some embodiments of this application, the integrated circuit module further includes a first optical interface and a second optical interface, the second optical interface being disposed on one side of the integrated circuit, and the detachable laser transmission module being configured to be optically coupled to the first optical interface.

[0020] Optionally, in some embodiments of this application, the optical connector assembly further includes an optical fiber transmission module. The optical fiber transmission module is configured to be optically coupled to the integrated circuit module and includes an optical fiber component, an optical fiber fixing member, and a cover. The optical fiber fixing member is fixed to the integrated circuit module, and the cover is configured to hold the optical fiber component and fix the optical fiber component to the optical fiber fixing member.

[0021] The optical fiber component has a plurality of optical fibers, which are housed between the optical fiber fixing member and the cover member and are optically coupled to the second optical interface.

[0022] Optionally, in some embodiments of this application, the optical connector assembly further includes an optical fiber transmission module. The optical fiber transmission module is configured to be optically coupled to the integrated circuit module and includes an optical fiber component, an optical fiber fixing member, and a detachable optical fiber connector. The optical fiber fixing member is fixed to the integrated circuit module and includes at least one engagement portion. The detachable optical fiber connector is detachably engaged with the optical fiber fixing member and includes at least one positioning portion corresponding to the engagement portion and configured to engage with the engagement portion.

[0023] The optical fiber component includes a plurality of optical fibers, which are held in place by the detachable optical fiber connector and optically coupled to the second optical interface.

[0024] Secondly, embodiments of this application provide a detachable laser transmission module. The detachable laser transmission module includes a laser fixing component and a detachable laser connector.

[0025] The laser fixture is configured to be fixed to the integrated circuit module, and the laser detachable connector is detachably engaged with the laser fixture and configured to hold the laser unit.

[0026] Optionally, in some embodiments of this application, the laser unit includes a substrate and a laser array, the laser array being formed along the edge of the substrate, the laser array being an integral laser array and having multiple laser emitters.

[0027] Optionally, in some embodiments of this application, the detachable laser transmission module further includes a guide member disposed on the laser fixing member, and the guide member is configured to be fixed to the laser fixing member after being actively aligned with the laser unit.

[0028] Optionally, in some embodiments of this application, the laser fixing member is configured to be fixed to the integrated circuit module after the guide member, the laser unit and the integrated circuit of the integrated circuit module are actively aligned with each other.

[0029] Optionally, in some embodiments of this application, the laser fixing member includes a fixing member housing, a mounting groove, and at least one joint. The fixing member housing is disposed adjacent to the integrated circuit module, and the mounting groove is recessed in the fixing member housing and is used to accommodate the guide member.

[0030] The laser detachable connector includes a body and at least one positioning part, which is detachably engaged with the engagement part.

[0031] Optionally, in some embodiments of this application, the integrated circuit module includes an integrated circuit and a first optical interface, the first optical interface being disposed on one side of the integrated circuit. When the detachable laser transmission module is engaged with the integrated circuit module, at least one internal feedback loop is formed between the guide and the first optical interface, the internal feedback loop being configured to receive optical signals from the laser unit.

[0032] Optionally, in some embodiments of this application, the detachable laser transmission module further includes two guide members configured to be aligned with each other, wherein one guide member is disposed on the laser fixing member, and the other guide member is disposed on the laser detachable connector, and optically aligned with the laser unit.

[0033] This application offers at least the following advantages: Before the optical connector assembly is joined, an active alignment process is performed between the laser array and the integrated circuit module, thereby achieving array-level optical coupling and sub-micron-level optical alignment accuracy. This configuration reduces labor costs and insertion loss, and improves optical performance. Furthermore, by performing a corresponding active alignment process on a replacement detachable laser transmission module to align it with the first optical interface of the integrated circuit module, it achieves reusability. Moreover, since the laser array is an integrated laser array and is located externally to the integrated circuit module, thermal interference to the integrated circuit module during operation is reduced, contributing to improved process flexibility and yield. Additionally, the laser array is fabricated via an epitaxial growth process, which helps improve its compatibility with semiconductor manufacturing processes. Attached Figure Description

[0034] The above and other aspects, features, and advantages of certain embodiments of this application will become more apparent from the following description taken in conjunction with the accompanying drawings, wherein: Figure 1 This is a perspective view of an optical connector assembly for integrated circuit integration according to the first embodiment of this application, showing an implementation of the optical connector assembly in a non-connected state.

[0035] Figure 2 This is an exploded view of the optical connector assembly of the first embodiment of this application.

[0036] Figure 3 This is a perspective view of the optical connector assembly of the first embodiment of this application, showing an implementation state in which the optical connector assembly is in a mated state.

[0037] Figure 4 This is a schematic diagram of a detachable laser transmission module and an integrated circuit module according to an embodiment of this application, showing the connection relationship between the detachable laser transmission module and the integrated circuit module.

[0038] Figure 5 This is a partially enlarged perspective view of a detachable laser transmission module for an optical connector assembly for integrated circuit integration according to a second embodiment of this application, showing an implementation where the detachable laser transmission module is in a non-connected state.

[0039] Figure 6 This is a perspective view of an optical connector assembly for integrated circuit integration according to a third embodiment of this application, showing an implementation of the optical connector assembly in a non-connected state.

[0040] Figure 7 This is a perspective view of the optical connector assembly for integrated circuit integration according to the third embodiment of this application, showing an embodiment in which the optical connector assembly is in a mated state.

[0041] Figure 8 This is a perspective view of an optical connector assembly for integrated circuit integration according to the fourth embodiment of this application, showing an implementation of the optical connector assembly in a non-connected state.

[0042] The following are explanations of some of the reference numerals in the accompanying drawings: 100, 100a, 100b: Optical connector assembly; 10: Integrated circuit module; 101: Integrated Circuits; 11: Second optical interface; 12: First optical interface; 20, 20a: Fiber optic transmission module; 21: Fiber optic components; 211: Optical fiber; 22, 22a: Fiber optic fasteners; 221a, 221b: Joint; 23: Covering parts; 24: Detachable fiber optic connector; 241a, 241b: Positioning parts; 30, 30a, 30b: Detachable laser transmission modules; 31: Laser unit; 311: substrate; 312: Laser array; 313: Photodiode; 314: Electrode; 32, 32a: Laser fixing components; 321, 321a: Fixing component housing; 322: Mounting slot; 323, 323b: Joint; 33, 33a: Laser detachable connector; 331: Ontology; 332, 332a, 332b: Positioning parts; 34: Guiding components; 35: Internal feedback loop. Detailed Implementation

[0043] In the following sections, embodiments of this application will be described in detail with reference to the accompanying drawings.

[0044] It should be noted that the accompanying drawings in this application are only used to illustrate the relative positions of the components and are not related to the actual dimensions of each component. Those skilled in the art to which this application pertains should understand that, without conflict, the embodiments described in this application may have various variations and be implemented in different forms, and are not intended to limit this application; all variations or modifications made in accordance with the technical spirit of this application should be covered within the substantive protection scope of this application.

[0045] This application provides an optical connector assembly for integrated circuit integration. The optical connector assembly enables simultaneous alignment and coupling of multiple optical fibers and / or laser arrays with a photonic integrated circuit (PIC) or an optoelectronic integrated circuit (OEIC), and includes a reusable detachable structure. This design overcomes the process limitations of prior art where optical fibers and / or laser arrays are aligned one-to-one, thus facilitating increased production volume and improved assembly efficiency. Furthermore, the laser array is formed externally to the integrated circuit using semiconductor processes, allowing the optical connector assembly to maintain the optical coupling accuracy between the photonic integrated circuit (PIC) or the optoelectronic integrated circuit (OEIC) and the laser array, while also improving thermal management issues related to laser structure heat generation.

[0046] See Figure 1 and Figure 2 , Figure 1 A perspective view of an optical connector assembly 100 for integrated circuit integration according to a first embodiment of this application is shown. The optical connector assembly 100 includes an integrated circuit (IC) module 10 and a detachable laser transmission module 30.

[0047] The integrated circuit module 10 may be a photonic integrated circuit (PIC) or an optoelectronic integrated circuit (OEIC), and includes an integrated circuit 101 and a first optical interface 12 to form a co-packaged optics (CPO). The first optical interface 12 is disposed on one side of the integrated circuit 101 and is used for optical coupling to the detachable laser transmission module 30. The first optical interface 12 may include an edge coupler, a spot-size converter, a grating coupler, an adiabatic taper, or a combination thereof.

[0048] It should be noted that the internal operation of the integrated circuit module 10 is well known to those with common knowledge in the field of semiconductor-related technologies, and its details will not be elaborated here.

[0049] The detachable laser transmission module 30 is configured to be optically coupled to the first optical interface 12 and includes a laser fixing component 32, a laser detachable connector 33, and a guide component 34.

[0050] The laser fixing member 32 is used to fix the integrated circuit module 10 and includes a fixing member housing 321, a mounting groove 322, and at least one engaging portion 323. The fixing member housing 321 is disposed adjacent to the first optical interface 12. The mounting groove 322 is recessed in the fixing member housing 321 and is used to accommodate the guide member 34. The laser detachable connector 33 is detachably engaged with the laser fixing member 32 and is used to hold the laser unit 31. The laser detachable connector 33 includes a body 331 and at least one positioning portion 332. The positioning portion 332 is detachably engaged with the engaging portion 323. The guide member 34 is disposed in the mounting groove 322 of the laser fixing member 32 and may be an optical waveguide.

[0051] Specifically, the guide member 34 is configured to be fixed to the laser fixing member 32 after being actively aligned with the laser unit 31. The laser fixing member 32 is configured to be fixed to the integrated circuit module 10 after the guide member 34, the laser unit 31 and the integrated circuit 101 are actively aligned with each other.

[0052] It is important to note that the active alignment process can be implemented using different assembly methods. In some embodiments, the laser unit 31 and the guide 34 can be temporarily fixed in position using a fixture after active alignment. Furthermore, after the laser fixing member 32 is engaged with the laser detachable connector 33, the laser unit 31 and the guide 34 are respectively fixed to the laser detachable connector 33 and the laser fixing member 32 by adhesive bonding or welding. In other embodiments, the laser unit 31 is first fixed to the laser detachable connector 33 by adhesive bonding or welding, then the laser detachable connector 33 is engaged to the laser fixing member 32, followed by active alignment of the laser unit 31 and the guide 34. Afterwards, the guide 34 is fixed to the laser fixing member 32 by adhesive bonding or welding. In yet another embodiment, the guide 34 is first adhesively or welded to the laser fixing member 32. After the laser detachable connector 33 is engaged with the laser fixing member 32, the laser unit 31 is positioned on the laser detachable connector 33 and actively aligned with the guide member 34. Then, the laser unit 31 is glued or welded to the laser detachable connector 33.

[0053] In some embodiments, the guide 34 is formed via epitaxial growth and etching processes.

[0054] In some embodiments, the laser fixing member 32 includes a plurality of engagement portions 323 formed in the fixing member housing 321. The laser detachable connector 33 includes a plurality of positioning portions 332, each corresponding to one of the engagement portions 323 and configured to engage with the corresponding engagement portion 323.

[0055] In the first embodiment, such as Figure 1 and Figure 2 As shown, the laser fixing component includes two engaging portions 323, which are pins and extend from the fixing component housing 321. The laser detachable connector 33 includes two positioning portions 332, which are insertion holes corresponding to the two engaging portions 323.

[0056] The laser unit 31 includes a substrate 311 and a laser array 312. The laser array 312 is formed along the edge of the substrate 311. The laser array 312 is configured to be optically aligned with the first optical interface 12 and consists of multiple laser emitters to form an integrated laser array.

[0057] In the first embodiment, the laser emitter may be a laser diode made of semiconductor material, including but not limited to gallium arsenide (GaAs), gallium nitride (GaN), or indium gallium arsenide (InGaAsP), and the laser emitter includes an epitaxial light-emitting structure.

[0058] In some embodiments, the fabrication process of the laser array 312 includes the following steps: Prepare a growth substrate, such as a sapphire substrate, silicon substrate, gallium nitride substrate, gallium arsenide substrate, or other similar substrate; optionally, form an epitaxial layer on the growth substrate using a metal-organic chemical vapor deposition (MOCVD) process; form the epitaxial light-emitting structure on the epitaxial layer, the epitaxial light-emitting structure having an n-type epitaxial layer disposed on the epitaxial layer and a p-type epitaxial stack disposed on the n-type epitaxial layer; remove a portion of the structure of the p-type epitaxial stack by etching to expose the n-type epitaxial layer, thereby forming a plurality of laser emitters spaced apart from each other; and form a plurality of electrodes, the electrodes being respectively disposed on the p-type epitaxial stack and the exposed n-type epitaxial layer to achieve external electrical connection.

[0059] By precisely controlling the formation position and design of the laser unit 31 through epitaxial growth and etching processes, high-density integration and miniaturization are facilitated. Furthermore, in the field of fiber optic transmission, the output power of the laser is sufficient to suppress the effects of light divergence. Therefore, the integrated laser array 312 is suitable for coupling with optical fibers. Further, since both the guide 34 and the laser array 312 are fabricated based on epitaxial growth and etching processes, it helps improve the alignment between the guide 34 and the laser array 312, thereby reducing the alignment tolerance requirements during connector assembly and improving the overall optical coupling efficiency of the connector assembly. In addition, since the process of the laser array 312 can be performed externally to the integrated circuit module 10, it also reduces the thermal budget (also known as heat buildup) experienced by the integrated circuit module 10 during the process, helps maintain the performance of temperature-sensitive components inside the module, and simplifies the back-end integration process, thereby improving the process flexibility and yield of the integrated circuit module 10.

[0060] It should be noted that the manufacturing process of the laser array 312 described above is for illustrative purposes only and is not intended to limit the scope of protection of this application. The actual manufacturing process steps and their sequence may be adjusted according to actual needs, and will not be elaborated here.

[0061] See also Figure 1When the optical connector assembly 100 is in a non-engaged state, and before the integrated circuit module 10 is engaged with the detachable laser transmission module 30, the laser unit 31 is first fixed within the detachable laser connector 33. Next, the laser fixing member 32 is engaged with the detachable laser connector 33. Then, before fixing the guide member 34 into the mounting slot 322, the guide member 34 is positioned within the fixing member housing 321 through an active alignment process. After the guide member 34 and the laser unit 31 are actively aligned, the assembled laser fixing member 32 and the detachable laser connector 33 are positioned and aligned with the coupling port formed in the first optical interface 12. After the guide member 34, the laser unit 31, and the first optical interface 12 are actively aligned, the fixing member housing 321 is fixed to the integrated circuit module 10. Once the mounting housing 321 is fixed to the integrated circuit module 10, the laser mounting component 32 and the laser detachable connector 33 can be repeatedly disassembled and reassembled without needing to go through the alignment process again.

[0062] See Figure 4 In some embodiments, when the detachable laser transmission module 30 is coupled to the integrated circuit module 10, two internal feedback loops 35 are formed between the guide 34 and the first optical interface 12 to confirm the integrity of the optical signal from the laser array 312 of the laser unit 31, thereby ensuring the accuracy of optical alignment in the active alignment process. The optical signal emitted by the laser array 312 is guided into one of the internal feedback loops 35, and the feedback signal returning along the return path of the internal feedback loop 35 is monitored by a photodiode 313, which converts the optical signal into an electrical signal and outputs it to the electrode 314. The photodiode 313 may be disposed within the laser unit 31 or integrated with the laser array 312 for monitoring the feedback signal. The electrode 314 is electrically connected to the photodiode 313 to transmit the converted electrical signal for subsequent processing or alignment control.

[0063] Through the aforementioned feedback mechanism, power changes caused by alignment deviations can be detected, and the position of the laser unit 31 can be dynamically adjusted accordingly to facilitate real-time optical alignment optimization.

[0064] In other embodiments, one or more internal feedback loops 35 may be formed between the guide 34 and the first optical interface 12, depending on design requirements, system complexity, or alignment accuracy requirements, and are not limited to the foregoing examples.

[0065] See Figure 2 and Figure 3 . Figure 3 The illustration shows an embodiment of the optical connector assembly 100 in a engaged state. After the first optical interface 12, the guide 34, and the laser unit 31 are actively aligned with each other, the fixing housing 321 is fixed to the integrated circuit module 10. When the laser detachable connector 33 is disassembled and re-engaged to the laser fixing member 32, the two engagement portions 323 (i.e., two pins) extend into the corresponding two positioning portions 332 (i.e., two sockets), allowing the laser array 312 to be optically aligned with the first optical interface 12 without additional alignment procedures. This facilitates simultaneous multi-channel coupling and optical signal transmission between the laser emitter in the laser array 312 and the optical coupler in the first optical interface 12. The light emitted by the laser array 312 can be coupled into the first optical interface 12 via the guide 34, thereby facilitating effective optical coupling between the laser array 312 and the integrated circuit module 10.

[0066] After the optical connector assembly 100 becomes worn out, the detachable laser connector 33 can be removed from the laser fixing member 32. At this time, the first optical interface 12 of the integrated circuit module 10 can still be used for subsequent active alignment with another laser array. The aforementioned reuse is achieved by configuring a corresponding replacement laser element on the replacement detachable laser connector 33. Specifically, the replacement detachable laser connector 33 is first engaged with the laser fixing member 32, and an active alignment process is used to ensure that the replacement laser element is accurately aligned with the first optical interface 12. Then, the replacement laser element is fixed to form the replacement detachable laser connector 33. The detachable laser transmission module 30 provided in this application not only improves ease of use but also reduces the labor costs required for optical alignment of the laser array and / or optical fiber when replacing or reconfiguring components. Furthermore, since the laser unit 31 is located outside the integrated circuit module 10, the heat generated by the laser array 312 during operation can be directly dissipated to the outside, thereby helping to avoid thermal interference to other components within the integrated circuit module 10.

[0067] In some embodiments, the first optical interface 12 of the integrated circuit module 10 can still be used for subsequent bonding with another laser array. This reusability is achieved by providing a replacement, detachable laser transmission module 30 through the following steps.

[0068] First, the initial guide 34 is aligned with the initial laser array 312 via an active alignment process. When the initial detachable laser connector 33 engages with the initial laser fixing member 32, the initial guide 34 is fixed within the fixing member housing 321. Then, the initial detachable laser connector 33 is separated from the initial laser fixing member 32. Next, a replacement detachable laser connector 33 is engaged with the initial laser fixing member 32. After actively aligning the laser array of the replacement laser unit 31 with the initial guide 34, the replacement laser unit 31 is fixed to the replacement detachable laser connector 33. Subsequently, the initial laser fixing member 32 is separated from the replacement detachable laser connector 33, and a replacement laser fixing member 32 and a replacement guide 34 are provided to engage and align with the replacement detachable laser connector 33, thereby forming a set of replacement detachable laser transmission modules 30. Multiple replacement detachable laser transmission modules 30 can be provided in the aforementioned manner, and each replacement detachable laser transmission module 30 is equipped with a properly aligned laser fixing component 32 and a laser detachable connector 33.

[0069] It should be noted that the foregoing embodiments are used to illustrate different modular replacement methods, thereby providing greater optical design flexibility and applicability to various configuration requirements of different laser units. Furthermore, depending on the replacement method employed, the guide 34 can remain fixed to the laser fixing member 32, allowing for repeated replacement of different detachable laser connectors 33 without the need for realignment; alternatively, the guide 34 and the laser fixing member 32 can also be replaced along with the laser unit 31.

[0070] In some alternative embodiments, an active alignment process can be performed before the replacement laser fixture 32 is attached to the first optical interface 12. During the active alignment process, the guide 34 disposed on the replacement laser fixture 32 is actively aligned with the first optical interface 12, followed by subsequent assembly steps. This allows the use of multiple replacement detachable laser transmission modules 30, each equipped with a properly aligned combination of the laser array 312 and the guide 34, facilitating optical alignment with the first optical interface 12.

[0071] See Figure 1 and Figure 2In other embodiments, the optical connector assembly 100 further includes an optical fiber transmission module 20 configured to be optically coupled to the integrated circuit module 10. The integrated circuit module 10 includes a first optical interface 12 and a second optical interface 11. The first optical interface 12 and the second optical interface 11 are each disposed on one side of the integrated circuit 101 to form a common package optical element (CPO).

[0072] In this embodiment, the first optical interface 12 and the second optical interface 11 are respectively disposed on opposite sides of the integrated circuit 101.

[0073] It should be noted that the aforementioned configuration of the first optical interface 12 and the second optical interface 11 is not intended to limit this application. In other embodiments, the first optical interface 12 and the second optical interface 11 may also be disposed on the same side or adjacent two sides of the integrated circuit 101. The second optical interface 11 is used for optical coupling to the fiber optic transmission module 20 and may include an edge coupler, a spot converter, a grating coupler, or a combination thereof.

[0074] The fiber optic transmission module 20 may be, for example, a fiber array unit (FAU), configured to be optically coupled to the integrated circuit module 10, and includes a fiber optic component 21, a fiber optic fixing member 22, and a cover 23. The fiber optic component 21 includes a plurality of optical fibers 211. The fiber optic fixing member 22 is fixed to the integrated circuit module 10 and disposed adjacent to the second optical interface 11. The cover 23 is used to hold the fiber optic component 21 and fix the fiber optic component 21 to the fiber optic fixing member 22. The optical fibers 211 are housed between the fiber optic fixing member 22 and the cover 23, and are optically coupled to corresponding coupling ports formed within the second optical interface 11.

[0075] See Figure 5 , Figure 5 The illustration shows a detachable laser transmission module 30a of an optical connector assembly 100 for integrated circuit integration according to a second embodiment of this application.

[0076] In the second embodiment, the detachable laser transmission module 30a includes two guide members 34. The two guide members 34 may be optical waveguides and are configured to align with each other, allowing optical signals to be transmitted via a coupling interface between the two guide members 34 when they are engaged. One guide member 34 is disposed within the mounting slot 322 and optically aligned with the first optical interface 12, while the other guide member 34 is disposed within the body 331 of the detachable laser connector 33 and optically aligned with the laser array 312.

[0077] When the optical connection assembly 100 is in the engaged state, the detachable laser transmission module 30a is engaged with the integrated circuit module 10, and an optical alignment interface is formed between the two guide members 34, enabling the laser array 312 to be optically aligned and optically coupled with the optical coupler (i.e., coupling port) formed in the first optical interface 12. Furthermore, the arrangement of the two guide members 34 helps to improve the accuracy of optical coupling, thereby enhancing alignment accuracy, reducing optical loss, and improving the signal transmission efficiency through the optical alignment interface.

[0078] See Figure 6 and Figure 7 , Figure 6 and Figure 7 The illustrations depict the optical connector assembly 100a for integrated circuit integration in a non-connected state and a connected state, respectively, according to the third embodiment of this application.

[0079] In the third embodiment, the optical fiber transmission module 20a includes two splicing elements, namely an optical fiber fixing member 22a and an optical fiber detachable connector 24, which correspond to each other. The optical fiber fixing member 22a includes two splicing portions 221a and 221b. The splicing portion 221a forms a pair of insertion holes, and the splicing portion 221b is a plug-in with a protruding snap-fit ​​portion.

[0080] The detachable fiber optic connector 24 includes two positioning portions 241a and 241b, which correspond to the two connecting portions 221a and 221b, respectively, and are configured to engage with the corresponding connecting portions 221a and 221b. Specifically, the positioning portion 241a has two pins for engaging with the connecting portion 221a. The positioning portion 241b is a socket and has a snap-fit ​​opening. When the fiber optic fastener 22a engages with the detachable fiber optic connector 24, the protruding snap-fit ​​portion of the connecting portion 221b engages with the snap-fit ​​opening of the positioning portion 241b, thereby fixing the detachable fiber optic connector 24 onto the fiber optic fastener 22a.

[0081] It should be noted that the number and structural configuration of the joints of the fiber optic fastener 22a, and the number and structural configuration of the positioning portions of the detachable fiber optic connector 24, may vary depending on design requirements. For example, in some embodiments, the fiber optic fastener 22a may include only a single joint, and the detachable fiber optic connector 24 may also be equipped with a single corresponding positioning portion. In other embodiments, the fiber optic fastener 22a and the detachable fiber optic connector 24 may each be equipped with multiple joints and positioning portions to improve mechanical stability or alignment accuracy during connection. Furthermore, the joints and positioning portions may be selected from various other types of connection components such as pins, holes, snap-fit ​​structures, or magnetic elements, depending on structural or optical coupling requirements.

[0082] In the third embodiment, the combination of the junction 221b (i.e., plug-in) and the positioning part 241b (i.e., socket) of the optical fiber transmission module 20a can also be called a reflow connector. When the optical fiber fixing member 22a is joined to the integrated circuit module 10, and the detachable optical fiber connector 24 is detached from the optical fiber fixing member 22a, at least one packaging process or back-end process, such as a reflow process, can be performed to solder the integrated circuit module 10 to a substrate (e.g., a printed circuit board) or to another integrated circuit to form a three-dimensional integrated circuit (3DIC). Before performing the reflow process, the optical fiber component 21 is first fixed in the detachable optical fiber connector 24, and the optical fiber fixing member 22a is joined to the detachable optical fiber connector 24; at the same time, an optical waveguide (not shown) is placed on the optical fiber fixing member 22a through an active alignment process to align with the optical fiber component 21, and then the optical waveguide is fixed to the optical fiber fixing member 22a. Subsequently, through an active alignment process, the coupled fiber optic fastener 22a and the detachable fiber optic connector 24 are positioned and aligned with the second optical interface 11. Once the coupling port of the second optical interface 11, the optical waveguide, and the fiber optic component 21 are aligned, the fiber optic fastener 22a is fixed to the integrated circuit module 10. Then, before performing the reflow process, the detachable fiber optic connector 24 is removed from the fiber optic fastener 22a. This avoids thermal damage to the fiber optic component 21 due to exposure to high-temperature processes. Furthermore, performing the reflow process after alignment helps strengthen the mechanical connection between the fiber optic fastener 22a and the integrated circuit module 10.

[0083] See also Figure 1In some embodiments, the detachable laser transmission module 30 may also be a reflow connector and provide similar functions to the fiber optic transmission module 20a. For the sake of simplicity, the relevant details will not be repeated here.

[0084] See Figure 8 , Figure 8 The illustration shows an optical connector assembly 100b for integrated circuit integration according to a fourth embodiment of this application.

[0085] In the fourth embodiment, the structure of the optical fiber transmission module 20a is the same as that of the optical fiber transmission module 20a in the third embodiment, and will not be described in detail here.

[0086] The detachable laser transmission module 30b also includes two corresponding engaging elements: a laser fixing member 32a and a detachable laser connector 33a. The laser fixing member 32a includes two engaging portions, one of which forms a pair of insertion holes (not shown) on the fixing member housing 321a, and the other engaging portion 323b is a plug with a protruding snap-fit ​​portion. The detachable laser connector 33a includes two positioning portions 332a and 332b, corresponding to the two engaging portions of the laser fixing member 32a and configured to engage with them. Specifically, the positioning portion 332a forms a pair of pins for insertion into corresponding insertion holes. The positioning portion 332b is a socket with a snap-fit ​​opening. During the engagement of the laser fixing component 32a and the laser detachable connector 33a, the engagement portion 323b is inserted into the socket, so that the protruding snap-fit ​​portion of the engagement portion 323b is fixed in the snap-fit ​​opening, thereby providing a stable mechanical connection between the detachable laser transmission module 30b and the integrated circuit module 10 and maintaining optical alignment.

[0087] It should be noted that the number and structural configuration of the engagement portions of the laser fixing member 32a, and the number and structural configuration of the positioning portions of the laser detachable connector 33a, may vary depending on design requirements. In some embodiments, the laser fixing member 32a and the laser detachable connector 33a may each have only a single pair of corresponding engagement portions and positioning portions, allowing them to engage with each other. In other embodiments, the laser fixing member 32a and the laser detachable connector 33a may also be configured with several pairs of corresponding engagement portions and positioning portions to improve mechanical stability and alignment accuracy.

[0088] In some embodiments, the guide 34 is disposed within the fixing housing 321a of the laser fixing member 32a, and is optically aligned with the laser array 312 through an active alignment process.

[0089] In the fourth embodiment, the combination of the joint 323b (i.e., plug-in) and the positioning part 332b (i.e., socket) of the fiber optic transmission module 20a and the detachable laser transmission module 30b is a reflow connector. After the fiber optic fixing member 22a and the laser fixing member 32a are both fixed to the integrated circuit module 10, the detachable fiber optic connector 24 and the detachable laser connector 33a can be removed respectively. Then, at least one packaging process or back-end process, such as a reflow process, can be performed to solder the integrated circuit module 10 to a substrate or printed circuit board, or to solder another integrated circuit to the integrated circuit module 10.

[0090] In summary, the optical connector assembly 100 for integrated circuit integration in this application achieves active alignment between the laser array 312 and the integrated circuit module 10, and between the optical fiber component 21 and the integrated circuit module 10, prior to bonding. The alignment process achieves array-level optical coupling and sub-micron-level optical alignment accuracy, thereby reducing labor costs and connector insertion loss, and improving optical performance. Furthermore, by executing corresponding active alignment processes, subsequent replacement laser devices (such as the detachable laser transmission module 30) and fiber optic devices (such as the fiber optic transmission module 20) can be aligned with the first optical interface 12 and the second optical interface 11, respectively, making the optical connector assembly reusable. Moreover, since the laser array 312 is an integrated laser array fabricated via an epitaxial growth process and is located outside the integrated circuit module 10, thermal interference to the integrated circuit module 10 during operation is reduced, which helps improve process integration flexibility and yield, and also enhances its compatibility with semiconductor processes. Therefore, it effectively achieves the effects desired by this application.

Claims

1. An optical connector assembly for integrated circuit integration, characterized in that, Include: Integrated circuit modules, including integrated circuits; and A detachable laser transmission module is configured to be optically coupled to the integrated circuit module.

2. The optical connector assembly for integrated circuit integration as described in claim 1, characterized in that, The detachable laser transmission module includes: Laser-mounted fastener, configured to be fixed to the integrated circuit module; and A detachable laser connector is detachably engaged with the laser fixture and configured to hold the laser unit.

3. The optical connector assembly for integrated circuit integration as described in claim 2, characterized in that, The laser unit includes a substrate and a laser array. The laser array is formed along the edge of the substrate and is an integral laser array with multiple laser emitters.

4. The optical connector assembly for integrated circuit integration as described in claim 2, characterized in that, The detachable laser transmission module also includes a guide member disposed on the laser fixing member, and the guide member is configured to be fixed to the laser fixing member after being actively aligned with the laser unit.

5. The optical connector assembly for integrated circuit integration as described in claim 4, characterized in that, The laser fixing component is configured to be fixed to the integrated circuit module after the guide, the laser unit, and the integrated circuit are actively aligned with each other.

6. The optical connector assembly for integrated circuit integration as described in claim 4, characterized in that, The laser fixing component includes a fixing component housing, a mounting groove, and at least one joint. The fixing component housing is disposed adjacent to the integrated circuit module, and the mounting groove is recessed in the fixing component housing and configured to accommodate the guide component. The laser detachable connector includes a body and at least one positioning part, which is detachably engaged with the engagement part.

7. The optical connector assembly for integrated circuit integration as described in claim 4, characterized in that, The integrated circuit module further includes a first optical interface, which is disposed on one side of the integrated circuit; When the detachable laser transmission module is connected to the integrated circuit module, at least one internal feedback loop is formed between the guide and the first optical interface. The internal feedback loop is configured to receive optical signals from the laser unit.

8. The optical connector assembly for integrated circuit integration as described in claim 2, characterized in that, The detachable laser transmission module further includes two guide members configured to be aligned with each other, wherein one guide member is disposed on the laser fixing member, and the other guide member is disposed on the detachable laser connector, and the optical alignment is located on the laser unit.

9. The optical connector assembly for integrated circuit integration as claimed in claim 1, characterized in that, The integrated circuit module further includes a first optical interface and a second optical interface. The second optical interface is disposed on one side of the integrated circuit, and the detachable laser transmission module is configured to be optically coupled to the first optical interface.

10. The optical connector assembly for integrated circuit integration as described in claim 9, characterized in that, The optical connector assembly further includes an optical fiber transmission module, which is configured to be optically coupled to the integrated circuit module and includes: Fiber optic components; Fiber optic fastener, fixed to the integrated circuit module; and A cover is configured to hold the optical fiber component and fix the optical fiber component to the optical fiber fixing member; The optical fiber component has a plurality of optical fibers, which are housed between the optical fiber fixing member and the cover member and are optically coupled to the second optical interface.

11. The optical connector assembly for integrated circuit integration as claimed in claim 9, characterized in that, The optical connector assembly further includes an optical fiber transmission module, which is configured to be optically coupled to the integrated circuit module and includes: Fiber optic components; An optical fiber fastener, fixed to the integrated circuit module, and including at least one junction; and A detachable fiber optic connector is detachably coupled to the fiber optic fastener and includes at least one positioning portion corresponding to the coupling portion and configured to engage with the coupling portion. The optical fiber component includes several optical fibers, which are held in place by the detachable optical fiber connector and optically coupled to the second optical interface.

12. A detachable laser transmission module, characterized in that, Include: Laser-mounted fasteners, configured to be fixed to integrated circuit modules; and A detachable laser connector is detachably engaged with the laser fixture and configured to hold the laser unit.

13. The detachable laser transmission module as described in claim 12, characterized in that, The laser unit includes a substrate and a laser array. The laser array is formed along the edge of the substrate and is an integral laser array with multiple laser emitters.

14. The detachable laser transmission module as described in claim 12, characterized in that, The detachable laser transmission module also includes a guide member disposed on the laser fixing member, and the guide member is configured to be fixed to the laser fixing member after being actively aligned with the laser unit.

15. The detachable laser transmission module as described in claim 14, characterized in that, The laser fixing component is configured to be fixed to the integrated circuit module after the guide, the laser unit, and the integrated circuit of the integrated circuit module are actively aligned with each other.

16. The detachable laser transmission module as described in claim 14, characterized in that, The laser fixing component includes a fixing component housing, a mounting groove, and at least one joint. The fixing component housing is disposed adjacent to the integrated circuit module, and the mounting groove is recessed in the fixing component housing and is used to accommodate the guide component. The laser detachable connector includes a body and at least one positioning part, which is detachably engaged with the engagement part.

17. The detachable laser transmission module as described in claim 14, characterized in that, The integrated circuit module includes an integrated circuit and a first optical interface, wherein the first optical interface is disposed on one side of the integrated circuit; When the detachable laser transmission module is connected to the integrated circuit module, at least one internal feedback loop is formed between the guide and the first optical interface, and the internal feedback loop is configured to receive optical signals from the laser unit.

18. The detachable laser transmission module as described in claim 12, characterized in that, The detachable laser transmission module also includes two guide members configured to be aligned with each other, wherein one guide member is disposed on the laser fixing member, and the other guide member is disposed on the detachable laser connector and optically aligned with the laser unit.

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