A process, structure and material for coupling and packaging a fiber array module

Abstract

A kind of FA fiber array module coupling packaging process, structure and material, including S1, form multiple (n≥2) V-shaped groove on large size quartz substrate;S2, sequentially to the optical fiber in the quartz V-shaped groove that is adjusted position enters and exits preliminary fixation;S3, through vacuum film (or plastic package, Modeling) technology is covered to large size quartz substrate comprehensively and is baked;Dry film can directly act as FA optical module insulating protective layer after solidification, for physical protection, chemical protection, water and oxygen isolation, need not to increase glass cover protection additionally;S4, large size quartz substrate is sequentially cut, and the FA fiber array module device that independently completes whole process packaging is obtained.The application effectively improves FA optical module packaging efficiency, replaces UV curing process with vacuum film (or plastic package) technology, replaces UV ultraviolet curing glue with dry film (or plastic package material), simplifies FA optical module packaging process flow and reduces production cost.

Description

Technical Field

[0001] This invention relates to the field of FA (fiber optic array) optical module packaging technology, and in particular to a packaging process, structure and material that can effectively improve the packaging efficiency of FA fiber optic array modules. Background Technology

[0002] The core of FA fiber array module packaging is to achieve micron-level optical path coupling, structural reinforcement, and overall protection between optical chips and multi-channel fiber arrays. The entire process is divided into three major stages: pre-processing, core optical coupling, and final packaging. The entire process involves eight standardized procedures and is suitable for mass production lines of 400G / 800G / 1.6T silicon photonics and EML high-speed optical modules. The FA optical module packaging process mainly includes substrate and device pre-processing, precision micro-dispensing, visually guided passive / active coupling alignment, UV pre-curing locking, secondary thermal curing to strengthen adhesion, comprehensive coupling performance testing, shell assembly and sealing, final testing, and aging screening.

[0003] The current mass production line's basic operation unit is single-module serial processing. There is no batch parallel mode for multiple synchronous coupling. Only the process can be optimized in parallel within a single module. There are two generations of process equipment: (1) Traditional single FA serial equipment. The TX and RX fiber arrays of a single module complete alignment, dispensing, and curing in sequence. The whole process is step-by-step and serial. Each tooling can only carry one optical module. The complete coupling process of a single module takes 6-8 minutes. Loading and unloading, leveling, and optimization are all performed step by step. The effective utilization rate of the equipment is less than 60%. (2) New generation dual FA parallel automated equipment. The tooling still holds one module at a time. Only the TX and RX ends are synchronously coupled and synchronously dispensing and pre-curing are achieved within a single module. There is no need for secondary shape change and repeated positioning. The single coupling process is compressed to 2.5-3 minutes. However, it is still essentially one-to-one processing and cannot load two or more modules for synchronous packaging at the same time. The back-end thermosetting oven can bake multiple trays in batches, but it is an offline process and does not improve the output of the core coupling station. The core coupling station processes individual particles sequentially, with only offline curing and testing steps allowing for batch processing. The coupling process is the bottleneck for the entire production line's capacity.

[0004] FA coupling is an active optical path closed-loop optimization process. Each module chip has individual differences in its mode field and FA end-face loss. Each fiber channel requires independent real-time optical power scanning optimization. Simultaneous coupling of multiple chips can lead to mutual interference of optical path signals and visual positioning crosstalk, making it impossible to build a multi-station parallel coupling platform. Only one chip can be processed sequentially, limiting production capacity. Traditional equipment operates TX and RX serially. After coupling one end, the fixture needs to be disassembled and repositioned before processing the other end. Repeated leveling and visual calibration consume significant time. Adhesive pre-curing and offline thermal curing involve waiting processes. After coupling, semi-finished products need to be batch-piled for baking, and intermediate buffer turnover lengthens the overall production cycle, resulting in a low percentage of effective equipment processing time. Fluctuations in FA end-face angle, fiber spacing, and adhesive shrinkage rate between batches can easily lead to excessive coupling loss and optical path drift after curing, resulting in a 5%–10% rework rate per batch. Rework requires removing the original adhesive layer and re-cleaning the coupling, with each reworked chip taking twice the time of a normal product, crowding out main line capacity and reducing the overall line's average efficiency.

[0005] The entire process of FA fiber array module packaging consists of device preprocessing, active precision coupling, curing and strengthening, and assembly and aging of the whole machine. The coupling process directly determines the optical performance and is also the core bottleneck of production capacity. Currently, all mass production equipment in the industry adopts the single-chip sequential packaging mode. Only the new generation of models can realize TX / RX dual FA synchronous parallel processing in a single module. Offline baking and testing can be batch processed, but it cannot break through the underlying limitation of single-chip serial coupling. The efficiency pain points are concentrated in four points: (1) Active optical path coupling process does not support multi-chip synchronous processing, and there is a natural production capacity limit; (2) The traditional serial coupling process repeatedly positions and levels, resulting in a lot of wasted time; (3) Silicon photonics and other high-bandwidth modules have narrow coupling tolerance and long six-dimensional power optimization cycle time; (4) Material consistency defects bring high frequency of rework and frequent manual replacement, which reduces equipment utilization rate. With the increasing demand for 1.6T and 3.2T optical modules, the industry is optimizing efficiency through FA-Lens integrated prefabricated components, multi-channel parallel optimization algorithms, and continuous online curing equipment, but it cannot change the basic operation mode of single-chip packaging in the short term.

[0006] Therefore, how to effectively improve the packaging efficiency of FA optical modules throughout the entire FA packaging process has always been a hot research topic in FA optical module packaging technology. Summary of the Invention

[0007] To address the aforementioned technical problems, the present invention aims to provide a packaging process, structure, and materials that can effectively improve the packaging efficiency of FA fiber array modules. This packaging structure and method can effectively improve the packaging efficiency of FA optical modules by replacing the UV curing process with vacuum lamination (or molding) technology and replacing UV curing adhesive with dry film (or molding compound), simplifying the FA optical module packaging process and reducing production costs.

[0008] To achieve the above technical objectives and effects, this invention provides a FA fiber array module coupling and packaging process, which mainly includes the following steps:

[0009] S1, Multiple (n≥2) V-grooves are formed on a large-size quartz substrate;

[0010] S2, sequentially and preliminarily fix the optical fibers that have been positioned in the quartz V-groove;

[0011] S3 uses vacuum lamination (or molding) technology to fully cover and bake large-size quartz substrates; after the dry film is cured, it can directly serve as the insulating protective layer of FA optical modules for physical protection, chemical protection, and water and oxygen isolation, without the need for additional glass cover protection.

[0012] S4 involves sequentially cutting a large-size quartz substrate to obtain an independent FA fiber array module device that has completed the entire process of packaging.

[0013] In step S3, the organic dry film layer is a type of dry film material such as epoxy resin or polyimide; in this embodiment, the organic dry film is Ajinomoto ABF dry film.

[0014] In step S2, the optimal position of the optical fiber in the V-groove of the quartz substrate is determined by adjusting the position of the optical fiber, and the optical fiber in the adjusted position is initially fixed by a small amount of UV curing adhesive through a "dispensing + UV curing" process.

[0015] According to another aspect of the present invention, an FA fiber array module coupling packaging structure is obtained by the above process, comprising: a large-size quartz substrate, a dry film layer, and a plurality of V-grooves are provided on the surface of the large-size quartz substrate, and the optical fiber is placed in the V-grooves of the quartz substrate.

[0016] By adjusting the position of the optical fiber, the optimal position for the optical fiber to be placed in the V-groove of the quartz substrate is determined, and the optical fiber with the adjusted position is initially fixed by a small amount of UV curing adhesive through a "dispensing + UV curing" process.

[0017] The V-groove of the quartz substrate is further filled by vacuum lamination technology, and a dry film layer is covered on the surface of the large-size quartz substrate. After high-temperature baking and curing, the dry film layer can directly serve as the insulating protective layer of the FA fiber array module, without the need for additional glass cover plate protection.

[0018] According to another aspect of the present invention, a packaging material for an FA optical fiber array module is provided, comprising a dry film layer, wherein optical fibers are placed in a V-groove of a quartz substrate, a small amount of UV-curable adhesive is filled by vacuum lamination technology, and the entire dry film layer is covered on the upper surface of a large-size quartz substrate and baked at high temperature; after curing, the dry film layer can directly serve as an insulating protective layer for the FA optical module, for physical protection, chemical protection, and water and oxygen isolation, without the need for additional glass cover protection.

[0019] The beneficial effects of the present invention are mainly as follows: (1) By simultaneously encapsulating multiple (≥2) FA optical modules on a large-size quartz substrate, the encapsulation efficiency of FA optical modules can be significantly improved; (2) During the encapsulation process, only a small amount of UV curing adhesive is used, which can greatly reduce the UV curing time, shorten the encapsulation time of a single FA, and reduce the production cost (the amount of UV curing adhesive used is greatly reduced); (3) After curing, the Ajinomoto ABF dry film can directly serve as the insulating protective layer (physical protection, chemical protection, water and oxygen isolation, etc.) of the FA optical module, without the need for additional glass cover protection, simplifying the FA optical module encapsulation process and reducing the production cost. Attached Figure Description

[0020] Figure 1 A top view showing the formation of multiple V-grooves on a large-size quartz substrate.

[0021] Figure 2 for Figure 1 A side view structural diagram obtained by magnifying the V-groove.

[0022] Figure 3 This is a schematic diagram of the structure for the initial fixation of the optical fiber after adjustment in the "dispensing + UV curing" process.

[0023] Figure 4 This is a schematic diagram showing the result of baking a dry film layer covering the entire surface of a quartz substrate at high temperature.

[0024] Figure 5 A top view of a dry film layer covering the entire surface of a large-size quartz substrate.

[0025] Figure 6 This is a schematic diagram of an FA optical module device obtained by sequentially cutting a quartz substrate. Detailed Implementation

[0026] The invention will be further described below with reference to the accompanying drawings and embodiments.

[0027] (1) Multiple (n≥2) V-grooves are formed on a large-size quartz substrate to obtain the following: Figure 1The structure shown is a top view. 10 is a large-size quartz substrate, and 101 is a V-groove. It is known that during the FA optical module packaging process, the quartz V-groove used to place the optical fiber is mostly arc-shaped. Figure 1 Eight V-grooves are fabricated on the large-size quartz substrate shown to accommodate optical fibers.

[0028] (2) Put Figure 1 The enlarged side view of a V-groove on a large quartz substrate is shown below. Figure 2 As shown, the optical fiber is placed within the V-groove. 10 represents the quartz substrate, and 11 represents the optical fiber. In this embodiment, the FA (Automatic Facial Assembly) full-process packaging is based on a schematic diagram of an FA optical module packaged within a V-groove.

[0029] (3) By adjusting the position of the optical fiber, the optimal position of the optical fiber in the V-groove of the quartz substrate is determined, and the optical fiber with the adjusted position is initially fixed by a small amount of UV-curable adhesive through a "dispensing + UV curing" process, as shown below. Figure 3 The structure shown is shown. 12 represents the cured UV adhesive. The same operating process is then applied sequentially to... Figure 1 The optical fibers placed in all the V-grooves of the large-size quartz substrate shown are initially fixed.

[0030] (4) The V-groove of the quartz substrate is further filled by vacuum lamination (or molding) technology, and a dry film layer (or molding layer) is covered on the upper surface of the large-size quartz substrate. After high-temperature baking, the result is as follows: Figure 4 The structure shown is shown. 13 is the baked dry film layer (or molding layer). Covering the entire surface of a large-size quartz substrate with a dry film layer (or molding layer) yields the structure shown. Figure 5 The structure shown is a top view. In this embodiment, the dry film used is Ajinomoto ABF dry film. After curing, the ABF dry film can directly serve as the insulating protective layer (physical protection, chemical protection, water and oxygen isolation, etc.) for the FA optical module, without the need for an additional glass cover plate.

[0031] (5) The large-size quartz substrate is cut sequentially using a cutting process to obtain independent FA optical module devices that have completed the entire packaging process, such as Figure 6 The structure shown.

[0032] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A coupling and packaging process for a fiber optic array module, characterized in that, Includes the following steps: S1, multiple V-grooves are formed on a large-size quartz substrate; S2, sequentially and preliminarily fix the optical fibers that have been positioned in the quartz V-groove; S3 uses vacuum lamination technology to fully cover a large-size quartz substrate to form a dry film layer, which is then baked. After curing, the dry film can directly serve as the insulating protective layer of the FA optical module for physical protection, chemical protection, and water and oxygen isolation, without the need for an additional glass cover plate. S4 involves sequentially cutting a large-size quartz substrate to obtain an independent FA fiber array module device that has completed the entire process of packaging.

2. The process according to claim 1, characterized in that, In step S2, the optimal position of the optical fiber in the V-groove of the quartz substrate is determined by adjusting the position of the optical fiber, and the optical fiber in the adjusted position is initially fixed by a small amount of UV curing adhesive through a "dispensing + UV curing" process.

3. The process according to claim 1, characterized in that, In step S3, the V-groove of the quartz substrate is further filled by vacuum film bonding technology, and a dry film layer is covered on the upper surface of the large-size quartz substrate and baked at high temperature.

4. The process according to claim 1, characterized in that, In step S3, the dry film layer is Ajinomoto ABF dry film.

5. A FA fiber array module coupling packaging structure obtained by the packaging process according to any one of claims 1 to 4, characterized in that: include: Large-size quartz substrate and dry film layer: Multiple V-grooves are set on the surface of the large-size quartz substrate, and optical fibers are placed in the V-grooves of the quartz substrate. By adjusting the position of the optical fiber, the optimal position for the optical fiber to be placed in the V-groove of the quartz substrate is determined, and the optical fiber with the adjusted position is initially fixed by a small amount of UV curing adhesive through a "dispensing + UV curing" process. The V-groove of the quartz substrate is further filled by vacuum lamination technology, and a dry film layer is covered on the surface of the large-size quartz substrate. After high-temperature baking and curing, the dry film layer can directly serve as the insulating protective layer of the FA fiber array module, without the need for additional glass cover plate protection.

6. The packaging structure according to claim 5, characterized in that: The V-groove is in the shape of an arc.

7. A packaging material for a fiber optic array module, characterized in that, Applied to claim 1 or 5, it includes a dry film layer, in which an optical fiber is placed in a V-groove of a quartz substrate, a small amount of UV-curable adhesive is filled by vacuum lamination technology, and the entire dry film layer is covered on the upper surface of a large-size quartz substrate and baked at high temperature; after curing, the dry film layer can directly serve as an insulating protective layer for FA optical modules, for physical protection, chemical protection, and water and oxygen isolation, without the need for additional glass cover protection.

8. The material according to claim 7, characterized in that, The dry film layer is selected from Ajinomoto ABF dry film.

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