Infrared microscope objective and imaging device
Patent Information
- Application Number
- CN202610747179.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-05-28
- Publication Date
- 2026-10-30
AI Technical Summary
然而,通用市售中继镜头通常放大倍率在1×或更高,用于1×以下的放大倍率时,往往存在像差校正困难、远心性不足、后工作距过短导致无法安装探测器窗口或制冷结构等问题
[0016]综上所述,本申请公开一种成像装置,包括红外显微镜头以及能够接收该红外显微镜头所成像的探测器。红外显微镜头的F数为1.0,工作波段为8~12μm,工作温度为-40℃~+80℃。该红外显微镜头的放大倍率β满足:0.11≤β≤0.15,物方线视场2y满足:75mm≤2y≤80mm,数值孔径NA满足:0.05≤NA≤0.08,物方工作距WD满足:199mm≤WD≤201mm,水平方向视场角HFOV满足:16°≤HFOV≤18°,垂直方向视场角满足:13°≤VFOV≤14°。探测器为非制冷型红外探测器,分辨率为640×512,像元大小为12μm。该红外显微镜头仅利用3片透镜,实现将前级光学系统形成的大尺寸一次实像高效地缩小成像至小靶面红外探测器上,结构简单紧凑,制作成本较低。同时,该红外显微镜头具有良好的像差校正,成像清晰度一致性较高,且在工作温度范围内,成像质量稳定,具有优异的消热差能力。
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Figure CN123010221A_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of optical lens technology, specifically relating to an infrared microscope lens and imaging device. Background Technology
[0002] In optical imaging systems, relay imaging lenses are often used to re-image the real image formed by the preceding optical module (such as a microscope objective, telescope objective, or pre-imaging group) to the subsequent detector or visual system at a certain magnification, thereby achieving image plane position conversion, size scaling, and pupil matching.
[0003] In applications such as infrared microscopy, semiconductor detection, and low-light signal acquisition, the following technical contradictions are often encountered: On the one hand, to obtain high resolution or large numerical aperture (NA), the imaging field of view of the pre-stage objective lens is usually designed to be large, with the size of the primary image plane reaching several millimeters or even tens of millimeters; on the other hand, the photosensitive target size of the post-stage infrared detector (such as cooled InSb or MCT focal plane array) is often very small, with a typical diagonal size of only 1 mm to 2 mm. If the large primary real image formed by the pre-stage is directly projected onto the small target detector, it will result in the loss of most light energy, a severe reduction in the effective field of view, and an inability to achieve synchronous imaging of the entire sample area.
[0004] To address this issue, the traditional approach is to replace the front-stage objective lens with one of different magnifications or sacrifice resolution to adjust the field of view. However, this increases system complexity and cost, and it's difficult to simultaneously meet the requirements of a large field of view, high resolution, and detector-target surface matching. Another method is to add a fixed-magnification imaging lens group between the primary image plane and the detector, i.e., a relay lens. However, commercially available relay lenses typically have a magnification of 1× or higher. When used for magnifications below 1×, they often suffer from problems such as difficulty in aberration correction, insufficient telecentricity, and a short back working distance that prevents the installation of detector windows or cooling structures.
[0005] Furthermore, the infrared band (especially the mid-wave infrared 3~5μm or long-wave infrared 8~12μm) has a high diffraction limit, which limits the choice of lens materials (such as silicon, germanium, chalcogenide glass, etc.) and the dispersion characteristics vary greatly, making it more difficult to achieve relay imaging in a wide range while simultaneously controlling spherical aberration, coma, field curvature and distortion.
[0006] Therefore, there is an urgent need for a specially designed relay lens with a magnification of less than 1×, which can efficiently reduce the large-size single real image formed by the front-end optical system and image it onto a small target infrared detector, while maintaining good aberration correction, so as to improve the system's light energy utilization and imaging consistency. Summary of the Invention
[0007] Therefore, it is necessary to provide an infrared microscope head and imaging device with a magnification of less than 1×, which can efficiently reduce the large-size single real image formed by the pre-stage optical system to a small target infrared detector, while maintaining good aberration correction.
[0008] The technical solution proposed in this application is as follows: An infrared microscope head has a magnification β satisfying: 0.11≤β≤0.15, an object-side field of view 2y satisfying: 75mm≤2y≤80mm, and a working wavelength range of 8~12μm. The infrared microscope head is composed of a first lens, a second lens, and a third lens arranged sequentially along the optical axis. The first lens is a meniscus positive lens with its convex surface facing the object side, the second lens is a meniscus negative lens with its convex surface facing the object side, and the third lens is a biconvex positive lens. The air gap between the first lens and the second lens is 4.54 mm, and the air gap between the second lens and the third lens is 7.81 mm.
[0009] Furthermore, the first lens has a center thickness of 6 mm, an object-side radius of curvature of 19.39 mm, and an image-side radius of curvature of 45.335 mm; the second lens has a center thickness of 2 mm, an object-side radius of curvature of 31.161 mm, and an image-side radius of curvature of 10.069 mm; and the third lens has a center thickness of 4.7 mm, an object-side radius of curvature of 37 mm, and an image-side radius of curvature of -79.565 mm.
[0010] Furthermore, the numerical aperture NA of the infrared microscope head satisfies: 0.05≤NA≤0.08, the object-side working distance WD satisfies: 199mm≤WD≤201mm, the horizontal field of view HFOV satisfies: 16°≤HFOV≤18°, and the vertical field of view satisfies: 13°≤VFOV≤14°.
[0011] Furthermore, all lenses are made of chalcogenide glass.
[0012] Furthermore, the image-side surface of the first lens, the object-side surface of the second lens, and the image-side surface of the third lens are all aspherical surfaces, and satisfy the aspherical surface formula: Where Z is the distance vector from the vertex of the aspherical surface at a height r along the optical axis; c = 1 / R; R is the paraxial curvature fitting radius of the mirror; k is the conic coefficient; A, B, C, D, and E are higher-order aspherical coefficients.
[0013] An imaging device includes the aforementioned infrared microscope head and a detector capable of receiving images from the infrared microscope head.
[0014] Furthermore, the detector has a resolution of 640×512 and a pixel size of 12μm.
[0015] Furthermore, the total optical length of the imaging device is 35.11 mm, and the back intercept is 10.06.
[0016] In summary, this application discloses an imaging device, including an infrared microscope head and a detector capable of receiving images from the infrared microscope head. The infrared microscope head has an F-number of 1.0, an operating wavelength of 8~12μm, and an operating temperature of -40℃~+80℃. The magnification β of the infrared microscope head satisfies: 0.11≤β≤0.15, the object-side field of view 2y satisfies: 75mm≤2y≤80mm, the numerical aperture NA satisfies: 0.05≤NA≤0.08, the object-side working distance WD satisfies: 199mm≤WD≤201mm, the horizontal field of view HFOV satisfies: 16°≤HFOV≤18°, and the vertical field of view satisfies: 13°≤VFOV≤14°. The detector is an uncooled infrared detector with a resolution of 640×512 and a pixel size of 12μm. This infrared microscope lens utilizes only three lenses to efficiently reduce the large-size real image formed by the pre-amplifier optical system and project it onto a small-target infrared detector. Its structure is simple and compact, resulting in low manufacturing costs. Furthermore, this infrared microscope lens exhibits excellent aberration correction, high consistency in image sharpness, and stable image quality within its operating temperature range, demonstrating superior thermal distortion mitigation capabilities. Attached Figure Description
[0017] The accompanying drawings are provided to further understand this application and form part of the specification. They are used together with the embodiments of this application to explain this application and do not constitute a limitation thereof.
[0018] Figure 1 This is a schematic diagram of the optical path structure of an infrared microscope head provided in one embodiment of this application; Figure 2 MTF image of an infrared microscope lens at 20°C provided in one embodiment of this application; Figure 3 MTF image of an infrared microscope lens at -40°C provided in one embodiment of this application; Figure 4 MTF image of an infrared microscope head at 80°C provided in one embodiment of this application; Figure 5 A dot plot of an infrared microscope head at 20°C provided in an embodiment of this application; Figure 6 A dot plot of an infrared microscope lens at -40°C provided in one embodiment of this application; Figure 7A dot plot of an infrared microscope head at 80°C provided in an embodiment of this application; Figure 8 A field distortion image of an infrared microscope head provided in one embodiment of this application; Figure 9 A diffraction-enclosed energy map of an infrared microscope head provided in an embodiment of this application; Figure 10 A relative illumination diagram of an infrared microscope lens provided in one embodiment of this application; Figure 11 A vignetting image of an infrared microscope lens provided in one embodiment of this application.
[0019] Label Explanation: 11. First lens; 12. Second lens; 13. Third lens; 14. Protective window; 15. Image plane. Detailed Implementation
[0020] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.
[0021] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0022] This application discloses an imaging device, including an infrared microscope head and a detector capable of receiving images from the infrared microscope head. The infrared microscope head has an F-number of 1.0, an operating wavelength of 8~12μm, and an operating temperature of -40℃~+80℃. The magnification β of the infrared microscope head satisfies: 0.11≤β≤0.15, the object-side field of view 2y satisfies: 75mm≤2y≤80mm, the numerical aperture NA satisfies: 0.05≤NA≤0.08, the object-side working distance WD satisfies: 199mm≤WD≤201mm, the horizontal field of view HFOV satisfies: 16°≤HFOV≤18°, and the vertical field of view VFOV satisfies: 13°≤VFOV≤14°. The detector is an uncooled infrared detector with a resolution of 640×512 and a pixel size of 12μm.
[0023] like Figure 1As shown, in one embodiment, the infrared microscope head comprises a first lens 11, a second lens 12, and a third lens 13 arranged sequentially along the optical axis. The first lens 11 is a meniscus positive lens with its convex surface facing the object side, the second lens 12 is a meniscus negative lens with its convex surface facing the object side, and the third lens 13 is a biconvex positive lens. Further, the detector includes a protective window 14 and an image plane 15 arranged sequentially along the optical axis.
[0024] In one specific embodiment, the magnification of the infrared microscope lens is β=0.129, the object-side field of view is 2y=77.6mm, the numerical aperture is NA=0.064, and the field of view is 16.9°×13.6°.
[0025] Furthermore, please also refer to Table 1. The air gap between the first lens 11 and the second lens 12 is 4.54 mm, the air gap between the second lens 12 and the third lens 13 is 7.81 mm, the air gap between the third lens 13 and the protective window 14 is 7.56 mm, and the air gap between the protective window 14 and the image plane 15 is 1.5 mm.
[0026] Furthermore, the first lens 11 has a center thickness of 6 mm, an object-side radius of curvature of 19.39 mm, and an image-side radius of curvature of 45.335 mm; the second lens 12 has a center thickness of 2 mm, an object-side radius of curvature of 31.161 mm, and an image-side radius of curvature of 10.069 mm; the third lens 13 has a center thickness of 4.7 mm, an object-side radius of curvature of 37 mm, and an image-side radius of curvature of -79.565 mm; and the protective window 14 has a thickness of 1 mm.
[0027] Based on the above embodiments, it can be determined that the total optical length of the imaging device is 35.11 mm and the back focal length is 10.06 mm.
[0028] In this embodiment, all lenses are made of chalcogenide glass to reduce manufacturing costs.
[0029] Table 1 Data for each component It needs to be explained that, in Figure 1 In the illustrated embodiment, from left to right along the optical axis, the left side is the object side and the right side is the image side. For example, the S1 surface of the first lens 11 is the object side surface and the S2 surface is the image side surface. Other lenses are similar and will not be described in detail here.
[0030] In this embodiment, the image-side surface of the first lens 11, the object-side surface of the second lens 12, and the image-side surface of the third lens 13 are all aspherical surfaces and satisfy the aspherical surface formula: Where Z is the distance vector from the vertex of the aspherical surface at a height r along the optical axis; c = 1 / R; R is the paraxial curvature fitting radius of the mirror; k is the conic coefficient; A, B, C, D, and E are higher-order aspherical coefficients. The aspherical data are shown in Table 2.
[0031] Table 2 Aspherical Data Please see Figures 2 to 8 , Figure 2 This is the MTF image of the infrared microscope lens at 20℃. Figure 3 This is the MTF image of the infrared microscope lens at -40℃. Figure 4 This is the MTF image of an infrared microscope lens at 80℃; Figure 5 This is a dot plot of an infrared microscope lens at 20°C. Figure 6 This is a dot plot of an infrared microscope lens at -40℃. Figure 7 This is a dot plot of an infrared microscope lens at 80°C. Figure 8 This is a field curvature distortion diagram of the infrared microscope lens. It can be seen that within the operating temperature range of -40℃ to 80℃, the MTF curve of this infrared microscope lens is close to the diffraction limit, and the RMS radius of the dot plot is less than or equal to the Airy disk radius, exhibiting excellent thermal distortion reduction performance. It is suitable for extreme temperature environments and also demonstrates good chromatic aberration correction capability across the entire field of view, resulting in high consistency in image clarity.
[0032] Please also refer to Figures 9 to 11 , Figure 9 This is a diffraction pattern surrounding the energy level of an infrared microscope lens. Figure 10 This is a relative illumination diagram of an infrared microscope lens. Figure 11 This is a vignetting pattern of the infrared microscope lens. It shows that this infrared microscope lens has high energy concentration and high illumination uniformity, making it suitable for detecting weak infrared signals. Furthermore, there is no mechanical obstruction within the lens's light-transmitting area, achieving 100% vignetting efficiency.
[0033] In summary, this application discloses an imaging device, including an infrared microscope head and a detector capable of receiving images from the infrared microscope head. The infrared microscope head has an F-number of 1.0, an operating wavelength of 8~12μm, and an operating temperature of -40℃~+80℃. The magnification β of the infrared microscope head satisfies: 0.11≤β≤0.15, the object-side field of view 2y satisfies: 75mm≤2y≤80mm, the numerical aperture NA satisfies: 0.05≤NA≤0.08, the object-side working distance WD satisfies: 199mm≤WD≤201mm, the horizontal field of view HFOV satisfies: 16°≤HFOV≤18°, and the vertical field of view satisfies: 13°≤VFOV≤14°. The detector is an uncooled infrared detector with a resolution of 640×512 and a pixel size of 12μm. This infrared microscope lens utilizes only three lenses to efficiently reduce the large-size real image formed by the pre-amplifier optical system and project it onto a small-target infrared detector. Its structure is simple and compact, resulting in low manufacturing costs. Furthermore, this infrared microscope lens exhibits excellent aberration correction, high consistency in image sharpness, and stable image quality within its operating temperature range, demonstrating superior thermal distortion mitigation capabilities.
[0034] Although embodiments of this application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the appended claims and their equivalents.
Claims
1. An infrared microscope objective, characterized by The magnification β satisfies: 0.11≤β≤0.15, the object-side field of view 2y satisfies: 75mm≤2y≤80mm, the working wavelength is 8~12μm, and the infrared microscope head is composed of a first lens, a second lens and a third lens arranged sequentially along the optical axis. The first lens is a meniscus positive lens with the convex surface facing the object side, the second lens is a meniscus negative lens with the convex surface facing the object side, and the third lens is a biconvex positive lens. The air gap between the first lens and the second lens is 4.54 mm, and the air gap between the second lens and the third lens is 7.81 mm.
2. The infrared microscope of claim 1, wherein, The first lens has a center thickness of 6 mm, an object-side radius of curvature of 19.39 mm, and an image-side radius of curvature of 45.335 mm; the second lens has a center thickness of 2 mm, an object-side radius of curvature of 31.161 mm, and an image-side radius of curvature of 10.069 mm; the third lens has a center thickness of 4.7 mm, an object-side radius of curvature of 37 mm, and an image-side radius of curvature of -79.565 mm.
3. The infrared microscope lens of claim 1, wherein, The numerical aperture NA of the infrared microscope head satisfies: 0.05≤NA≤0.08, the object working distance WD satisfies: 199mm≤WD≤201mm, the horizontal field of view HFOV satisfies: 16°≤HFOV≤18°, and the vertical field of view VFOV satisfies: 13°≤VFOV≤14°.
4. The infrared microscope head according to claim 1, characterized in that, All lenses are made of chalcogenide glass.
5. The infrared microscope head according to claim 1, characterized in that, The image-side surface of the first lens, the object-side surface of the second lens, and the image-side surface of the third lens are all aspherical surfaces and satisfy the aspherical surface formula: Where Z is the distance vector from the vertex of the aspherical surface at a height r along the optical axis; c = 1 / R; R is the paraxial curvature fitting radius of the mirror; k is the conic coefficient; A, B, C, D, and E are higher-order aspherical coefficients.
6. An imaging device, characterized in that, It includes the infrared microscope head as described in any one of claims 1-5 and a detector capable of receiving images from the infrared microscope head.
7. The imaging apparatus according to claim 6, characterized in that, The detector has a resolution of 640×512 and a pixel size of 12μm.
8. The imaging apparatus according to claim 6, characterized in that, The imaging device has an optical length of 35.11 mm and a back cutoff of 10.06.