Electro-optical modulation chip, electro-optical modulation assembly and optical module
Patent Information
- Application Number
- CN202510562378.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-30
- Publication Date
- 2026-10-30
AI Technical Summary
[0014]由于参考的仍然是地信号，图2所示的电光调制组件600的抗干扰能力及调制效率仍然较差，其本质仍然是单端推挽形式的电光调制组件
[0034]与常用技术相比，本申请的第一行波电极与第二行波电极位于第一波导臂的两侧。第三行波电极与第二行波电极位于第二波导臂的两侧。第一电场与第二电场的极化方向相反。第一波导臂及第二波导臂在极化方向相反的电场中实现差分推挽。差分推挽可实现电光调制芯片的调制效率翻倍的效果。另外，正负电极相互参考，可提高抗干扰能力。第二端子位于第一端子及调制区之间，可有效避免信号串扰。
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Figure CN123010273A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of optical communication component manufacturing technology, and in particular to an electro-optic modulation chip, an electro-optic modulation component, and an optical module. Background Technology
[0002] Currently, electro-optic modulation components are key optoelectronic devices, primarily used to convert electrical signals into optical signals, playing a crucial role in optical communication and optical applications. Their basic principle is to modulate the optical properties of materials by applying an external electric field, thereby achieving the modulation of optical signals.
[0003] For example, existing thin-film lithium niobate electro-optic modulation components play an important role in optical modules. These components utilize the electro-optic effect of lithium niobate crystals, that is, changing the refractive index of the crystal under the influence of an electric field to achieve efficient control of optical signals.
[0004] like Figure 1 As shown, the commonly used electro-optic modulation component 500 generally adopts a single-end push-pull working mode.
[0005] The electro-optic modulation assembly 500 includes an electro-optic modulation chip 50 and a driver 51.
[0006] The electro-optic modulation chip 50 includes a first ground electrode 501, a first waveguide arm 502, a first traveling wave electrode 503, a second waveguide arm 505, and a second ground electrode 505 arranged side by side in sequence. The multiple electrodes form a G, S, G arrangement.
[0007] A first electric field is generated between the first traveling wave electrode 503 and the first ground electrode 501 to modulate the optical signal in the first waveguide arm 502. A second electric field is generated between the first traveling wave electrode 503 and the second ground electrode 505 to modulate the optical signal in the second waveguide arm 505. The polarization directions of the first and second electric fields are opposite.
[0008] Since the reference is the ground signal Figure 1 The electro-optic modulation component 500 shown has poor anti-interference capability and modulation efficiency.
[0009] In addition, to accommodate the single-ended push-pull electro-optic modulation chip 50, the driver 51 also uses a single-ended driver. Currently, most mainstream drivers are differential drivers, and changing a differential driver to a single-ended driver would waste one output channel.
[0010] like Figure 2 As shown, a common technique also proposes an electro-optic modulation component 600 using a differential driver.
[0011] The electro-optic modulation component 600 includes an electro-optic modulation chip 60 and a driver 61, wherein the driver 61 is a differential driver.
[0012] The electro-optic modulation chip 60 includes a first ground electrode 601, a first traveling wave electrode 602, a first waveguide arm 603, a second ground electrode 604, a second traveling wave electrode 606, a second waveguide arm 606, and a third ground electrode 607 arranged side by side in sequence. The multiple electrodes form an arrangement of G, S+, G, S-, G.
[0013] A first electric field is generated between the first traveling wave electrode 602 and the first ground electrode 604 to modulate the optical signal in the first waveguide arm 603. A second electric field is generated between the second traveling wave electrode 606 and the third ground electrode 607 to modulate the optical signal in the second waveguide arm 606. The polarization directions of the first and second electric fields are opposite.
[0014] Since the reference is still the ground signal, Figure 2 The anti-interference capability and modulation efficiency of the electro-optic modulation component 600 shown are still relatively poor, and its essence is still a single-end push-pull type electro-optic modulation component. Summary of the Invention
[0015] This application discloses an electro-optic modulation chip, including a modulation region and a non-modulation region. The modulation region includes a first traveling-wave electrode, a first waveguide arm, a second traveling-wave electrode, a second waveguide arm, and a third traveling-wave electrode arranged sequentially. A first electric field is generated between the first traveling-wave electrode and the second traveling-wave electrode to modulate the optical signal in the first waveguide arm, and a second electric field is generated between the third traveling-wave electrode and the second traveling-wave electrode to modulate the optical signal in the second waveguide arm. The non-modulation region includes a first terminal electrically connected to the first traveling-wave electrode and the third traveling-wave electrode, and a second terminal electrically connected to the second traveling-wave electrode. The second terminal is located between the first terminal and the modulation region.
[0016] In one embodiment, the phase difference between the electrical signal loaded on the first traveling wave electrode and the second traveling wave electrode is 180°, and the phase difference between the electrical signal loaded on the first traveling wave electrode and the third traveling wave electrode is 0°.
[0017] In one embodiment, the first terminal is connected to the first traveling wave electrode via a first wire, the second terminal is connected to the second traveling wave electrode via a second wire, and the first terminal is connected to the third traveling wave electrode via a third wire, wherein the first wire and the third wire are of equal length.
[0018] In one embodiment, the first terminal is located on the extension line of the second traveling wave electrode.
[0019] In one embodiment, the second terminal is located between the first terminal and the second traveling wave electrode.
[0020] In one embodiment, the first conductor and the third conductor are arranged symmetrically about the straight line where the second traveling wave electrode is located.
[0021] In one embodiment, the second traveling wave electrode, the second terminal, and the first terminal are located on a straight line.
[0022] In one embodiment, the first waveguide arm and the second waveguide arm are made of lithium niobate.
[0023] In one embodiment, the modulation region further includes a first ground electrode located on the side of the first traveling wave electrode away from the second traveling wave electrode and a second ground electrode located on the side of the third traveling wave electrode away from the second traveling wave electrode, and the non-modulation region further includes a third terminal electrically connected to the first ground electrode and a fourth terminal electrically connected to the second ground electrode.
[0024] In one embodiment, the modulation region further includes a connecting segment connecting the first ground electrode and the second ground electrode, wherein the first ground electrode, the connecting segment, and the second ground electrode are connected to form a U-shaped structure.
[0025] In one embodiment, the first terminal and the second terminal form a terminal group, and the third terminal, the terminal group and the fourth terminal are arranged along a second direction, which is perpendicular to the length direction of the first waveguide arm. A first reference line and a second reference line extending along the second direction are defined. The first reference line and the second reference line are both straight lines. The first reference line passes through the third terminal, the first terminal and the fourth terminal at the same time, and the second reference line passes through the third terminal, the second terminal and the fourth terminal at the same time.
[0026] This application discloses an electro-optic modulation component, including a driver and an electro-optic modulation chip as described in any of the above technical solutions. The driver includes a first signal terminal and a second signal terminal. The driver outputs a differential drive signal through the first signal terminal and the second signal terminal. The first signal terminal is electrically connected to the first terminal, and the second signal terminal is electrically connected to the second terminal.
[0027] In one embodiment, the electro-optic modulation component further includes a circuit board having a first pad, a second pad, a third pad, and a fourth pad. The first pad and the third pad are connected by a sixth wire, and the second pad and the fourth pad are connected by a seventh wire. The first pad is connected to the first terminal, the second pad is connected to the second terminal, the third pad is connected to the first signal terminal, and the fourth pad is connected to the second signal terminal.
[0028] In one embodiment, the circuit board includes a mounting surface that carries the electro-optic modulation chip and the driver, wherein the first pad, the second pad, the third pad, and the fourth pad are located on the mounting surface.
[0029] In one embodiment, the first terminal is connected to the first traveling wave electrode via a first wire, the second terminal is connected to the second traveling wave electrode via a second wire, and the first terminal is connected to the third traveling wave electrode via a third wire. The first wire and the second wire have a first length difference, the third wire and the second wire have a second length difference, and the seventh wire and the sixth wire have a third length difference. The third length difference compensates for at least a portion of the first length difference and at least a portion of the second length difference.
[0030] In one embodiment, the first wire and the third wire are of the same length, the length of the first wire is greater than the length of the second wire, and the length of the seventh wire is greater than the length of the sixth wire.
[0031] In one embodiment, the electro-optic modulation component further includes a digital signal processor, which includes the driver.
[0032] In one embodiment, the driver and the electro-optic modulation chip are stacked vertically, with the first signal terminal directly connected to the first terminal and the second signal terminal directly connected to the second terminal.
[0033] This application discloses an optical module, including an optical connector and an electro-optic modulation component as described in any of the above technical solutions, wherein the first waveguide arm and the second waveguide arm are connected to the optical connector.
[0034] Compared to commonly used technologies, in this application, the first and second traveling-wave electrodes are located on opposite sides of the first waveguide arm. The third and second traveling-wave electrodes are located on opposite sides of the second waveguide arm. The polarization directions of the first and second electric fields are opposite. The first and second waveguide arms achieve differential push-pull in electric fields with opposite polarization directions. Differential push-pull can double the modulation efficiency of the electro-optic modulation chip. In addition, the positive and negative electrodes reference each other, which can improve the anti-interference capability. The second terminal is located between the first terminal and the modulation area, which can effectively avoid signal crosstalk. Attached Figure Description
[0035] Figure 1 and Figure 2 This is a schematic diagram of an electro-optic modulation component using common technologies;
[0036] Figure 3 This is a schematic diagram of an electro-optic modulation chip according to an embodiment of this application;
[0037] Figure 4 and Figure 5 They are respectively through Figure 1 A cross-sectional view of an example of the second terminal and the first terminal;
[0038] Figure 6 This is a schematic diagram illustrating the performance testing of the first and third traveling wave electrodes using a standard GSG probe module according to an embodiment of this application.
[0039] Figure 7 This is a schematic diagram illustrating the testing of the performance of the second traveling wave electrode using a standard GSG probe module according to an embodiment of this application;
[0040] Figure 8 This is a schematic diagram showing the separation of multiple components of the electro-optic modulation assembly according to the first embodiment of this application;
[0041] Figure 9 yes Figure 8 A schematic diagram of the electro-optic modulation components after assembly;
[0042] Figure 10 It was through Figure 9 A cross-sectional view of the first signal terminal, the first terminal, and the waveguide arm;
[0043] Figure 11 It was through Figure 9 Cross-sectional view of the second signal terminal, the second terminal, and the waveguide arm;
[0044] Figure 12 This is a schematic diagram showing the separation of multiple components of the electro-optic modulation assembly according to the second embodiment of this application;
[0045] Figure 13 yes Figure 12 A schematic diagram of the electro-optic modulation components after assembly;
[0046] Figure 14 This is a schematic diagram of the electro-optic modulation component after assembly according to the third embodiment of this application;
[0047] Figure 15 This is a schematic diagram of the driver according to the fourth embodiment of this application;
[0048] Figure 16 This is a schematic diagram of the electro-optic modulation component after assembly according to the fourth embodiment of this application;
[0049] Figure 17 It was through Figure 16 A cross-sectional view of the first signal terminal, the second signal terminal, the first terminal, the second terminal, and the waveguide arm;
[0050] Figure 18 It was through Figure 16 A cross-sectional view of the third (or fourth) terminal and the waveguide arm;
[0051] Figure 19 This is a cross-sectional view of an optical module according to an embodiment of this application. The optical module includes... Figure 10 The electro-optic modulation assembly and optical connector shown are shown.
[0052] Figure 20 This is a cross-sectional view of an optical module according to an embodiment of this application. The optical module includes... Figure 17 The electro-optic modulation component and optical connector shown are shown. Specific Implementation
[0053] The present application will now be described in detail with reference to the specific embodiments shown in the accompanying drawings. However, these embodiments do not limit the present application, and any structural, methodological, or functional modifications made by those skilled in the art based on these embodiments are included within the scope of protection of this application.
[0054] In the various figures of this application, for ease of illustration, certain dimensions of structures or parts may be exaggerated relative to other structures or parts; therefore, they are only used to illustrate the basic structure of the subject matter of this application.
[0055] Furthermore, terms such as “above,” “over,” “below,” and “under,” used herein to indicate spatial relative position, are for illustrative purposes to describe the relationship of one unit or feature relative to another unit or feature as shown in the accompanying drawings. The terms of spatial relative position may be intended to include different orientations of the device in use or operation other than those shown in the figures. For example, if the device in the figures is flipped, a unit described as being “below” other units or features would be “above” other units or features. Therefore, the exemplary term “below” can encompass both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or otherwise), and the spatially related descriptive terms used herein will be interpreted accordingly.
[0056] Figure 3 This is a schematic diagram of the electro-optic modulation chip 100 according to an embodiment of this application.
[0057] The electro-optic modulation chip 100 includes a modulation region C1 and a non-modulation region C2.
[0058] The modulation region C1 is defined as the area where the optical signal is modulated. The modulation region C1 is... Figure 1 The area above the dashed line L.
[0059] The unmodulated region C2 is defined as the area where no optical signal modulation occurs. For example, the unmodulated region C2 might be the area connected to the driver. The unmodulated region C2 is... Figure 1 The area below the dashed line L.
[0060] The modulation region C1 includes a first traveling wave electrode 11, a first waveguide arm 21, a second traveling wave electrode 12, a second waveguide arm 22, and a third traveling wave electrode 13 arranged in sequence.
[0061] The first traveling wave electrode 11, the first waveguide arm 21, the second traveling wave electrode 12, the second waveguide arm 22, and the third traveling wave electrode 13 all extend along the first direction Y. The first direction Y is... Figure 1 The vertical direction in the middle.
[0062] A first electric field is generated between the first traveling wave electrode 11 and the second traveling wave electrode 12 to modulate the optical signal in the first waveguide arm 21. The polarization direction of the first waveguide arm 21 is from left to right.
[0063] A second electric field is generated between the third traveling wave electrode 13 and the second traveling wave electrode 12, thereby modulating the optical signal in the second waveguide arm 22. The polarization direction of the second waveguide arm 22 is from right to left.
[0064] In this embodiment, the first traveling-wave electrode 11 and the second traveling-wave electrode 12 are located on both sides of the first waveguide arm 21. The third traveling-wave electrode 13 and the second traveling-wave electrode 12 are located on both sides of the second waveguide arm 22. The polarization directions of the first electric field and the second electric field are opposite. The first waveguide arm 21 and the second waveguide arm 22 implement differential push-pull in electric fields with opposite polarization directions. Differential push-pull can double the modulation efficiency of the electro-optic modulation chip. In addition, the positive and negative electrodes reference each other, which can improve the anti-interference capability.
[0065] The unmodulated region C2 includes a first terminal 31 electrically connected to the first traveling wave electrode 11 and the third traveling wave electrode 13, and a second terminal 32 electrically connected to the second traveling wave electrode 12. The second terminal 32 is located between the first terminal 31 and the modulation region C1.
[0066] "The second terminal 32 is located between the first terminal 31 and the modulation area C1" means that the second terminal 32 is closer to the modulation area C1 than the first terminal 31. The second terminal 32 and the first terminal 31 can be regarded as being arranged along the first direction Y.
[0067] The electrical signal generated by the driver is transmitted to the first traveling wave electrode 11, the second traveling wave electrode 12 and the third traveling wave electrode 13 through the first terminal 31 and the second terminal 32.
[0068] Specifically, the first terminal 31 is connected to the first traveling wave electrode 11 via a first wire 41. The second terminal 32 is connected to the second traveling wave electrode 12 via a second wire 42. The first terminal 31 is connected to the third traveling wave electrode 13 via a third wire 43.
[0069] The first wire 41, the second wire 42, and the third wire 43 are all signal transmission lines. The electrical signal is transmitted to the first traveling wave electrode 11 via the first terminal 31 and the first wire 41. The electrical signal is transmitted to the second traveling wave electrode 12 via the second terminal 32 and the second wire 42. The electrical signal is transmitted to the third traveling wave electrode 13 via the first terminal 31 and the third wire 43.
[0070] In this embodiment, the first terminal 31 is connected to both the first traveling wave electrode 11 and the third traveling wave electrode 13. The second terminal 32 is connected to the second traveling wave electrode 12. The configuration of one first terminal 31 and one second terminal 32 can be adapted to a standard driver.
[0071] The second terminal 32 is closer to the modulation area C1 than the first terminal 31. The second wire 42 can be connected to the second terminal 32 without extending through the first wire 41 and the third wire 43. This effectively avoids signal crosstalk between the first wire 41, the second wire 42, and the third wire 43.
[0072] Optionally, the phase difference between the electrical signal applied to the first traveling wave electrode 11 and the second traveling wave electrode 12 is 180°.
[0073] The phase difference between the electrical signal applied to the first traveling wave electrode 11 and the third traveling wave electrode 13 is 0°.
[0074] Optionally, the first traveling wave electrode 11 and the third traveling wave electrode 13 are positive electrodes, and the second traveling wave electrode 12 is a negative electrode. Alternatively, the first traveling wave electrode 11 and the third traveling wave electrode 13 are negative electrodes, and the second traveling wave electrode 12 is a positive electrode. This embodiment takes the first traveling wave electrode 11 and the third traveling wave electrode 13 as positive electrodes and the second traveling wave electrode 12 as a negative electrode as an example.
[0075] Optional, continue to combine Figure 3 The modulation region C1 also includes a first microelectrode 111 connected to the first traveling wave electrode 11, a second microelectrode 121 connected to the second traveling wave electrode 12, a third microelectrode 122 connected to the second traveling wave electrode 12, and a fourth microelectrode 131 connected to the third traveling wave electrode 13.
[0076] The first microelectrode 111 and the second microelectrode 121 are arranged side by side and located between the first traveling wave electrode 11 and the second traveling wave electrode 12.
[0077] The third microelectrode 122 and the fourth microelectrode 131 are arranged side by side and located between the first traveling wave electrode 11 and the second traveling wave electrode 12.
[0078] The first microelectrode 111 and the second microelectrode 121 form a microelectrode pair to enhance the electric field strength of the first electric field, thereby enhancing the photoelectric effect and improving the modulation efficiency.
[0079] The third microelectrode 122 and the fourth microelectrode 131 form a microelectrode pair to enhance the electric field strength of the second electric field, thereby enhancing the photoelectric effect and improving the modulation efficiency.
[0080] The structures of the first microelectrode 111, the second microelectrode 121, the third microelectrode 122, and the fourth microelectrode 131 can be T-shaped, L-shaped, or groove-shaped, etc.
[0081] Combination Figures 4 to 5 The electro-optic modulation chip 100 has a stacked structure.
[0082] The electro-optic modulation chip 100 includes, from bottom to top, a substrate layer 54, a buried layer 55, and a modulation crystal 50.
[0083] The substrate 54 may be a silicon substrate, and the buried layer 55 may be made of silicon dioxide, but is not limited thereto.
[0084] The first traveling wave electrode 11, the first waveguide arm 21, the second traveling wave electrode 12, the second waveguide arm 22, the third traveling wave electrode 13, the first terminal 31, the second terminal 32, the first wire 41, the second wire 42, and the third wire 43 are all located on the side of the modulation crystal 50 away from the buried layer 55.
[0085] The materials for the first waveguide arm 21 and the second waveguide arm 22 can be lithium niobate.
[0086] Optionally, the first conductor 41 and the third conductor 43 are of equal length and are symmetrically arranged about the second conductor 42 as an axis of symmetry. This arrangement ensures that the transmission time of the signal from the first terminal 31 to the first traveling wave electrode 11 and the third traveling wave electrode 13 is equal.
[0087] Optionally, the second traveling wave electrode 12, the second terminal 32, and the first terminal 31 are located on a straight line. The second terminal 32 is located on the extension line of the second traveling wave electrode 12. The first terminal 31 is also located on the extension line of the second traveling wave electrode 12.
[0088] In other embodiments, the second traveling wave electrode 12, the second terminal 32, and the first terminal 31 may not be located on a straight line. For example, Figure 3 The second terminal 32 in the middle is offset to the left or right.
[0089] Taking the second traveling wave electrode 12, the second terminal 32, and the first terminal 31 as an example where they are arranged in a straight line, the first conductor 41 and the third conductor 43 are both L-shaped. The first conductor 41, the first terminal 31, and the third conductor 43 form a U-shaped structure that connects the first traveling wave electrode 11 and the third traveling wave electrode 13. The second conductor 42 is in the shape of an "I". The second conductor 42 and the second terminal 32 are located within the area enclosed by the U-shaped structure. The second conductor 42 is disconnected from the U-shaped structure. The second conductor 42 does not cross with the first conductor 41 or the third conductor 43. By rationally arranging the first conductor 41, the second conductor 42, the third conductor 43, the first terminal 31, and the second terminal 32, signal crosstalk caused by the crossing of the first conductor 41, the second conductor 42, and the third conductor 43 can be effectively avoided.
[0090] Optional, combined Figures 3 to 5 The modulation region C1 also includes a first ground electrode 14 located on the side of the first traveling wave electrode 11 away from the second traveling wave electrode 12 and a second ground electrode 15 located on the side of the third traveling wave electrode 13 away from the second traveling wave electrode 12. The electrodes of the modulation region C1 are arranged in the pattern of G, S+, S-, S+, G.
[0091] Both the first ground electrode 14 and the second ground electrode 15 extend along the first direction Y. The modulation region C1 may also include a connecting segment 16 connecting the first ground electrode 14 and the second ground electrode 15. The first ground electrode 14, the connecting segment 16, and the second ground electrode 15 are connected to form a U-shaped structure. The U-shaped structure surrounds the first traveling wave electrode 11, the first waveguide arm 21, the second traveling wave electrode 12, the second waveguide arm 22, and the third traveling wave electrode 13.
[0092] Optionally, in order to reduce common-mode interference, the modulation region C1 also includes a first differential-mode resistor R1, a second differential-mode resistor R2, and a third differential-mode resistor R3.
[0093] The two ends of the first differential mode resistor R1 are connected to the first traveling wave electrode 11 and the voltage source Vmod, respectively. The two ends of the second differential mode resistor R2 are connected to the second traveling wave electrode 12 and the voltage source Vmod, respectively. The two ends of the third differential mode resistor R3 are connected to the third traveling wave electrode 13 and the voltage source Vmod, respectively.
[0094] The unmodulated region C2 also includes a third terminal 33 electrically connected to the first ground electrode 14 and a fourth terminal 34 electrically connected to the second ground electrode 15. The third terminal 33 is connected to the first ground electrode 14 via a fourth wire 44. The fourth terminal 34 is connected to the second ground electrode 15 via a fifth wire 45. Both the fourth wire 44 and the fifth wire 45 are signal transmission lines.
[0095] When the electro-optic modulation chip 100 is connected to the driver, the electrical signal generated by the driver is transmitted to the first ground electrode 14 through the third terminal 33. The electrical signal is transmitted to the second ground electrode 15 through the fourth terminal 34. The first ground electrode 14 and the second ground electrode 15 transmit ground signals.
[0096] Optionally, the first terminal 31 and the second terminal 32 form a terminal group 35. The third terminal 33, the terminal group 35, and the fourth terminal 34 are arranged along a second direction X. The second direction X is perpendicular to the length direction of the first waveguide arm 21, that is, the second direction X is perpendicular to the first direction Y.
[0097] The third terminal 33, terminal group 35 and the fourth terminal 34 are arranged side by side, which facilitates subsequent electrical testing, packaging and other processes.
[0098] Define two lines extending along the second direction X as the first reference line L1 and the second reference line L2. Both the first reference line L1 and the second reference line L2 are straight lines.
[0099] The first reference line L1 passes through the third terminal 33, the first terminal 31, and the fourth terminal 34 simultaneously. In the second direction X, at least a portion of the third terminal 33, the first terminal 31, and the fourth terminal 34 are located on the same straight line, which facilitates simultaneous electrical testing of the third terminal 33, the first terminal 31, and the fourth terminal 34.
[0100] The second reference line L2 passes through the third terminal 33, the second terminal 32, and the fourth terminal 34 simultaneously. In the second direction X, at least a portion of the third terminal 33, the second terminal 32, and the fourth terminal 34 are located on the same straight line, which facilitates simultaneous electrical testing of the third terminal 33, the second terminal 32, and the fourth terminal 34.
[0101] In the first direction Y, the widths of the third terminal 33 and the fourth terminal 34 are approximately equal, and the width of the third terminal 33 is approximately equal to the total width of the terminal group 35.
[0102] The width of the third terminal 33 is approximately the sum of the width of the first terminal 31, the width of the second terminal 32, and the distance between the first terminal 31 and the second terminal 32.
[0103] Combination Figure 6 and Figure 7 The electro-optic modulation chip 100 of this application embodiment can be applied to a conventional probe module 200.
[0104] The traditional probe module 200 is a standard GSG probe module. The probe module 200 includes three probes 61, 62, and 63 arranged in sequence.
[0105] When the probe module 200 contacts the electro-optic modulation chip 100, the line L4 connecting the three contact ends 611, 621, and 631 of the three probes 61, 62, and 63 is parallel to the second direction X. The three contact ends 611, 621, and 631 respectively contact the third terminal 33, the first terminal 31, and the fourth terminal 34. Alternatively, the three contact ends 611, 621, and 631 respectively contact the third terminal 33, the second terminal 32, and the fourth terminal 34. In this way, by moving the probe module 200 along the first direction Y, electrical testing of the first terminal 31, the second terminal 32, the third terminal 33, and the fourth terminal 34 can be achieved.
[0106] Combination Figure 6 When the three contact terminals 611, 621, and 631 of the probe module 200 contact the third terminal 33, the first terminal 31, and the fourth terminal 34 respectively, the GS+G channel test can be performed. That is, the performance test of the first traveling wave electrode 11 and the third traveling wave electrode 13 can be performed.
[0107] Combination Figure 7 When the probe module 200 is moved upward so that the three contact terminals 611, 621, and 631 contact the third terminal 33, the second terminal 32, and the fourth terminal 34 respectively, the GS-G channel can be tested, that is, the performance of the second traveling wave electrode 12 can be tested.
[0108] This embodiment can perform performance testing of the first traveling wave electrode 11, the second traveling wave electrode 12, and the third traveling wave electrode 13 using a standard GSG probe module, without the need to modify the probe module.
[0109] Combination Figures 8 to 18 This application also provides an electro-optic modulation component 300, which includes a driver 70 and an electro-optic modulation chip 100.
[0110] The driver 70 includes an amplifier 75, a first signal terminal 71, and a second signal terminal 72 that are electrically connected together.
[0111] The first signal terminal 71 is electrically connected directly or indirectly to the first terminal 31. The input signal transmitted to the driver 70 is amplified by the amplifier 75 to form a positive differential signal. The positive differential signal is transmitted to the first traveling wave electrode 11 and the third traveling wave electrode 13 through the first signal terminal 71 and the first terminal 31.
[0112] The second signal terminal 72 is electrically connected directly or indirectly to the second terminal 32. The input signal transmitted to the driver 70 is amplified by the amplifier 75 to form a negative polarity differential signal. The negative polarity differential signal is transmitted to the second traveling wave electrode 12 through the second signal terminal 72 and the second terminal 32.
[0113] The driver 70 also includes a third signal terminal 73 and a fourth signal terminal 74.
[0114] The third signal terminal 73 is electrically connected directly or indirectly to the third terminal 33. The ground signal generated by the driver 70 is transmitted to the first ground electrode 14 through the third signal terminal 73 and the third terminal 33.
[0115] The fourth signal terminal 74 is electrically connected directly or indirectly to the fourth terminal 34. The ground signal generated by the driver 70 is transmitted to the second ground electrode 15 through the fourth signal terminal 74 and the fourth terminal 34.
[0116] The following describes various embodiments of the electro-optic modulation component 300.
[0117] First Embodiment
[0118] In the first embodiment, combined with Figures 8 to 11 The electro-optic modulation assembly 300 includes an electro-optic modulation chip 100, a driver 70, and a circuit board 80. In this embodiment, the driver 70 is a drive circuit DRV (Driver).
[0119] The circuit board 80 can be a traditional printed circuit board or other substrate capable of transmitting electrical signals. For example, the circuit board 80 can be a ceramic substrate or a silicon substrate with circuitry.
[0120] The circuit board 80 includes a mounting surface 81 that supports the electro-optic modulation chip 100 and the driver 70. For example, the electro-optic modulation chip 100 and the driver 70 are mounted to the mounting surface 81 of the circuit board 80 in a flip-chip manner. The circuit board 80 is used to realize signal transmission between the electro-optic modulation chip 100 and the driver 70.
[0121] The mounting surface 81 of the circuit board 80 is provided with a first pad 811, a second pad 821, a third pad 812 and a fourth pad 822.
[0122] The first pad 811 and the third pad 812 are connected by the sixth wire 91. The second pad 821 and the fourth pad 822 are connected by the seventh wire 92.
[0123] The first pad 811 is connected to the first terminal 31. The second pad 821 is connected to the second terminal 32. The third pad 812 is connected to the first signal terminal 71. The fourth pad 822 is connected to the second signal terminal 72.
[0124] Both the sixth conductor 91 and the seventh conductor 92 are L-shaped. The length of the sixth conductor 91 is approximately equal to the length of the seventh conductor 92.
[0125] The mounting surface 81 is also provided with a fifth pad 831 for connecting the third terminal 33, a sixth pad 841 for connecting the fourth terminal 34, a seventh pad 832 for connecting the third signal terminal 73, and an eighth pad 842 for connecting the fourth signal terminal 74.
[0126] The fifth pad 831 and the seventh pad 832 are connected by the eighth conductor 94. The sixth pad 841 and the eighth pad 842 are connected by the ninth conductor 95.
[0127] The seventh pad 832 and the fifth pad 831 are roughly aligned vertically. The eighth pad 842 and the sixth pad 841 are roughly aligned vertically. The length of the eighth conductor 94 is approximately equal to the length of the ninth conductor 95.
[0128] When the electro-optic modulation chip 100 and the driver 70 are mounted on the circuit board 80, the first signal terminal 71 is electrically connected to the first terminal 31 through the third pad 812, the sixth wire 91, and the first pad 811. The positive differential signal generated by the driver 70 is transmitted to the first traveling wave electrode 11 and the third traveling wave electrode 13 through the first signal terminal 71 and the first terminal 31.
[0129] The second signal terminal 72 is electrically connected to the second terminal 32 via the fourth pad 822, the seventh wire 92, and the second pad 821. The negative polarity differential signal generated by the driver 70 is transmitted to the second traveling wave electrode 12 through the second signal terminal 72 and the second terminal 32.
[0130] The third signal terminal 73 is electrically connected to the third terminal 33 via the seventh pad 832, the eighth wire 94, and the fifth pad 831. The ground signal generated by the driver 70 is transmitted to the first ground electrode 14 through the third signal terminal 73 and the third terminal 33.
[0131] The fourth signal terminal 74 is electrically connected to the fourth terminal 34 via the eighth pad 842, the ninth wire 95, and the sixth pad 841. The ground signal generated by the driver 70 is transmitted to the second ground electrode 15 through the fourth signal terminal 74 and the fourth terminal 34.
[0132] Second Embodiment
[0133] In the second embodiment, combined with Figure 12 and Figure 13 The electro-optic modulation assembly 300 includes an electro-optic modulation chip 100, a driver 70, and a circuit board 80. The driver 70 and the circuit board 80 are mounted to the mounting surface 81 of the circuit board 80 via a flip-chip configuration. For ease of explanation, identical or similar components in different embodiments are referred to by the same or similar designations, which will be the same below.
[0134] The main difference between the second embodiment and the first embodiment is that the seventh pad 832, the fourth pad 822, the third pad 812, and the eighth pad 842 in the second embodiment are shifted to the left relative to the seventh pad 832, the fourth pad 822, the third pad 812, and the eighth pad 842 in the first embodiment. The lengths of the corresponding eighth conductor 94, the seventh conductor 92, the sixth conductor 91, and the ninth conductor 95 also change. Specifically, the lengths of the eighth conductor 94, the seventh conductor 92, and the ninth conductor 95 become longer, while the length of the sixth conductor 91 becomes shorter.
[0135] Taking the second traveling wave electrode 12, the second terminal 32, and the first terminal 31 as an example where they are located in a straight line. The first wire 41 and the third wire 43 are of equal length. The explanation will focus on the first wire 41.
[0136] The length of the first conductor 41 is greater than the length of the second conductor 42. Therefore, the delay generated by the second conductor 42 is less than the delay generated by the first conductor 41. A delay difference will occur between the second conductor 42 and the first conductor 41.
[0137] When the electro-optic modulation chip 100 and driver 70 are mounted on the circuit board 80, the positive differential signal needs to pass through the sixth wire 91 and the first wire 41 to be transmitted to the first traveling wave electrode 11. Therefore, the total length of the sixth wire 91 and the first wire 41 will determine the delay on the positive differential signal transmission path.
[0138] The negative polarity differential signal needs to pass through the seventh wire 92 and the second wire 42 to be transmitted to the second traveling wave electrode 12. Therefore, the total length of the seventh wire 92 and the second wire 42 will determine the delay on the transmission path of the negative polarity differential signal.
[0139] In the second embodiment, the length of the seventh conductor 92 is greater than the length of the sixth conductor 91.
[0140] There is a first length difference between the first conductor 41 and the second conductor 42. There is a third length difference between the seventh conductor 92 and the sixth conductor 91. The third length difference compensates for at least part of the first length difference. That is, the delay difference generated between the seventh conductor 92 and the sixth conductor 91 can be used to compensate for the delay difference generated between the second conductor 42 and the first conductor 41. This reduces the delay difference on both the positive and negative differential signal transmission paths.
[0141] When the third length difference can compensate for all the first length differences, the delay difference on the positive polarity differential signal transmission path and the negative polarity differential signal transmission path is zero.
[0142] Similarly, there is a second length difference between the third conductor 43 and the second conductor 42, and the third length difference compensates for at least part of the second length difference. That is, the delay difference generated between the seventh conductor 92 and the sixth conductor 91 can be used to compensate for the delay difference generated between the third conductor 43 and the second conductor 42. This reduces the delay difference on both the positive and negative polarity differential signal transmission paths.
[0143] When the third length difference can compensate for all the second length differences, the delay difference on the positive polarity differential signal transmission path and the negative polarity differential signal transmission path is zero.
[0144] The second embodiment compensates for the delay difference on the electro-optic modulation chip 100 by using the delay difference on the circuit board 80, which can reduce the delay difference on the positive polarity differential signal transmission path and the negative polarity differential signal transmission path, thereby improving signal transmission performance.
[0145] The specific lengths of the first wire 41, the second wire 42, the third wire 43, the sixth wire 91, and the seventh wire 92 can be adjusted according to actual needs. For example, the length of the second wire 42 can be adjusted by setting the first terminal 31 and the second terminal 32 to be staggered in the first direction Y. Alternatively, the length can be adjusted by adding more bends to the first wire 41, the second wire 42, the third wire 43, the sixth wire 91, or the seventh wire 92.
[0146] Third Embodiment
[0147] In the third embodiment, combined with Figure 14 The electro-optic modulation assembly 300 includes an electro-optic modulation chip 100, a driver 70, and a circuit board 80. The driver 70 and the circuit board 80 are mounted to the mounting surface 81 of the circuit board 80 in a flip-chip manner.
[0148] The main difference between the third embodiment and the first embodiment is that the electro-optic modulation component 300 in the third embodiment includes a digital signal processor (DSP) 301, and the digital signal processor 301 includes a driver 70.
[0149] The digital signal processor 301 uses a direct-drive architecture. Direct-drive circuitry results in shorter circuitry and better signal quality.
[0150] Fourth embodiment
[0151] In the fourth embodiment, combined with Figures 15 to 18 The electro-optic modulation component 300 includes an electro-optic modulation chip 100 and a driver 70.
[0152] The main difference between the fourth embodiment and the first embodiment is that the fourth embodiment eliminates the circuit board 80 in the first embodiment, and the fourth embodiment directly assembles the electro-optic modulation chip 100 and the driver 70 by 3D stacking.
[0153] In the fourth embodiment, the driver 70 and the electro-optic modulation chip 100 are stacked vertically, the first signal terminal 71 is directly connected to the first terminal 31, the second signal terminal 72 is directly connected to the second terminal 32, the third signal terminal 73 is directly connected to the third terminal 33, and the fourth signal terminal 74 is directly connected to the fourth terminal 34.
[0154] Combination Figure 19 and Figure 20 This application also provides an optical module 400. The optical module 400 includes an optical connector 40 and an electro-optic modulation assembly 300.
[0155] Figure 19 The electro-optic modulation assembly 300 shown includes a circuit board 80 and an optoelectronic modulation chip 100 and a driver 70 flip-chip mounted on the circuit board 80. The first waveguide arm 21 and the second waveguide arm 22 are connected to the optical connector 40.
[0156] Figure 20 The electro-optic modulation assembly 300 shown includes a modulation chip 100 and a driver 70 stacked together. The first waveguide arm 21 and the second waveguide arm 22 are connected to the optical connector 40.
[0157] The optical connector 40 is located at the optical signal output end of the electro-optic modulation assembly 300. The optical connector 40 may include, for example, an optical fiber array 401. The modulated optical signals in the first waveguide arm 21 and the second waveguide arm 22 are output through the optical fiber array 401.
[0158] In summary, the first traveling-wave electrode 11 and the second traveling-wave electrode 12 of this application are located on both sides of the first waveguide arm 21. The third traveling-wave electrode 13 and the second traveling-wave electrode 12 are located on both sides of the second waveguide arm 22. The polarization directions of the first electric field and the second electric field are opposite. The first waveguide arm 21 and the second waveguide arm 22 achieve differential push-pull in electric fields with opposite polarization directions. Differential push-pull can double the modulation efficiency of the electro-optic modulation chip. In addition, the positive and negative electrodes reference each other, which can improve the anti-interference capability.
[0159] The second terminal 32 is located between the first terminal 31 and the modulation area C1, which can effectively avoid signal crosstalk.
[0160] It should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This way of describing the specification is only for clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.
[0161] The detailed descriptions listed above are merely specific illustrations of feasible embodiments of this application and are not intended to limit the scope of protection of this application. All equivalent embodiments or modifications made without departing from the spirit of the art of this application should be included within the scope of protection of this application.
Claims
1. An electro-optic modulation chip, characterized in that, The system includes a modulation region and a non-modulation region. The modulation region includes a first traveling-wave electrode, a first waveguide arm, a second traveling-wave electrode, a second waveguide arm, and a third traveling-wave electrode arranged sequentially. A first electric field is generated between the first traveling-wave electrode and the second traveling-wave electrode to modulate the optical signal in the first waveguide arm. A second electric field is generated between the third traveling-wave electrode and the second traveling-wave electrode to modulate the optical signal in the second waveguide arm. The non-modulation region includes a first terminal electrically connected to the first traveling-wave electrode and the third traveling-wave electrode, and a second terminal electrically connected to the second traveling-wave electrode. The second terminal is located between the first terminal and the modulation region.
2. The electro-optic modulation chip according to claim 1, characterized in that, The phase difference between the electrical signal applied to the first traveling wave electrode and the second traveling wave electrode is 180°, and the phase difference between the electrical signal applied to the first traveling wave electrode and the third traveling wave electrode is 0°.
3. The electro-optic modulation chip according to claim 1, characterized in that, The first terminal is connected to the first traveling wave electrode via a first wire, the second terminal is connected to the second traveling wave electrode via a second wire, and the first terminal is connected to the third traveling wave electrode via a third wire. The first wire and the third wire are of equal length.
4. The electro-optic modulation chip according to claim 3, characterized in that, The first terminal is located on the extension line of the second traveling wave electrode.
5. The electro-optic modulation chip according to claim 4, characterized in that, The second terminal is located between the first terminal and the second traveling wave electrode.
6. The electro-optic modulation chip according to claim 3, characterized in that, The first conductor and the third conductor are arranged symmetrically about the straight line where the second traveling wave electrode is located.
7. The electro-optic modulation chip according to claim 1, characterized in that, The second traveling wave electrode, the second terminal, and the first terminal are located on a straight line.
8. The electro-optic modulation chip according to claim 1, characterized in that, The first waveguide arm and the second waveguide arm are made of lithium niobate.
9. The electro-optic modulation chip according to claim 1, characterized in that, The modulation region further includes a first ground electrode located on the side of the first traveling wave electrode away from the second traveling wave electrode and a second ground electrode located on the side of the third traveling wave electrode away from the second traveling wave electrode. The non-modulation region further includes a third terminal electrically connected to the first ground electrode and a fourth terminal electrically connected to the second ground electrode.
10. The electro-optic modulation chip according to claim 9, characterized in that, The modulation region further includes a connecting segment that connects the first ground electrode and the second ground electrode, and the first ground electrode, the connecting segment, and the second ground electrode are connected to form a U-shaped structure.
11. The electro-optic modulation chip according to claim 9, characterized in that, The first terminal and the second terminal form a terminal group. The third terminal, the terminal group and the fourth terminal are arranged along a second direction, which is perpendicular to the length direction of the first waveguide arm. A first reference line and a second reference line extending along the second direction are defined. The first reference line and the second reference line are both straight lines. The first reference line passes through the third terminal, the first terminal and the fourth terminal at the same time. The second reference line passes through the third terminal, the second terminal and the fourth terminal at the same time.
12. An electro-optic modulation component, characterized in that, The device includes a driver and an electro-optic modulation chip as described in any one of claims 1-11. The driver includes a first signal terminal and a second signal terminal. The driver outputs a differential drive signal through the first signal terminal and the second signal terminal. The first signal terminal is electrically connected to the first terminal, and the second signal terminal is electrically connected to the second terminal.
13. The electro-optic modulation component according to claim 12, characterized in that, The electro-optic modulation assembly further includes a circuit board on which a first pad, a second pad, a third pad, and a fourth pad are provided. The first pad and the third pad are connected by a sixth wire, and the second pad and the fourth pad are connected by a seventh wire. The first pad is connected to the first terminal, the second pad is connected to the second terminal, the third pad is connected to the first signal terminal, and the fourth pad is connected to the second signal terminal.
14. The electro-optic modulation component according to claim 13, characterized in that, The circuit board includes a mounting surface that supports the electro-optic modulation chip and the driver, and the first pad, the second pad, the third pad and the fourth pad are located on the mounting surface.
15. The electro-optic modulation component according to claim 13, characterized in that, The first terminal is connected to the first traveling wave electrode via a first wire, the second terminal is connected to the second traveling wave electrode via a second wire, the first terminal is connected to the third traveling wave electrode via a third wire, the first wire and the second wire have a first length difference, the third wire and the second wire have a second length difference, and the seventh wire and the sixth wire have a third length difference. The third length difference compensates for at least part of the first length difference and at least part of the second length difference.
16. The electro-optic modulation component according to claim 15, characterized in that, The first conductor is the same length as the third conductor, the length of the first conductor is greater than the length of the second conductor, and the length of the seventh conductor is greater than the length of the sixth conductor.
17. The electro-optic modulation component according to claim 12, characterized in that, The electro-optic modulation assembly further includes a digital signal processor, which includes the driver.
18. The electro-optic modulation component according to claim 12, characterized in that, The driver and the electro-optic modulation chip are stacked one on top of the other, with the first signal terminal directly connected to the first terminal and the second signal terminal directly connected to the second terminal.
19. An optical module, characterized in that, Includes an optical connector and an electro-optic modulation assembly as described in any one of claims 12-18, wherein the first waveguide arm and the second waveguide arm are connected to the optical connector.