Display device

Abstract

Disclosed is a display device including: a display panel; and a back plate layer disposed at a lower surface of the display panel, the back plate layer can include an air gap formed therein, the air gap being completely surrounded by the back plate layer.

Description

[0001] This application claims priority and benefit to Korean Patent Application No. 10-2025-0055115, filed on April 28, 2025, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] Embodiments of this disclosure relate to display devices. Background Technology

[0003] With the development of the information society, the demand for display devices that display images is increasing, and various types of display devices, such as liquid crystal displays (LCDs) and organic light-emitting diode displays (OLEDs), are being utilized.

[0004] The display device includes multiple pixels and provides multiple switching elements to drive and control the pixels. Summary of the Invention

[0005] Therefore, one object of the embodiments of this disclosure is to overcome the above-mentioned disadvantages of the prior art and to provide a display device that can prevent damage to the display panel.

[0006] The purpose of this application is not limited to the above-described purpose, and other technical purposes can be inferred from the embodiments described below.

[0007] In order to achieve the purpose of this disclosure, according to an embodiment of this disclosure, a display device may include: a display panel; and a back plate layer disposed on the lower surface of the display panel, the back plate layer may include an air gap formed therein, the air gap being completely surrounded by the back plate layer.

[0008] To achieve the objectives of this disclosure, a display device according to another embodiment may include: a display panel including a main region, a sub-region, and a curved region; a first backplate layer disposed on the lower surface of the main region of the display panel; a second backplate layer disposed on the lower surface of the sub-region of the display panel; and a molded portion disposed on the lower surface of the curved region of the display panel, wherein the first backplate layer or the second backplate layer may include an air gap therein, and the molded portion may contact the first backplate layer.

[0009] Specific details of other implementation methods are included in the detailed embodiments and accompanying drawings.

[0010] According to embodiments of this disclosure, since the back panel layer has an air gap, during the process of attaching the back panel layer to the display panel, the back panel layer absorbs the impact caused by foreign objects remaining on the surface of the display panel, thereby preventing damage to the display panel.

[0011] In embodiments of this disclosure, the back panel layer absorbs external forces due to the air gaps within it, thereby preventing damage to the display panel.

[0012] The embodiments of this disclosure can provide a low-power display device that can improve lifespan.

[0013] However, the effects that can be obtained from this disclosure are not limited to those described above, and other unmentioned effects will be clearly understood by those skilled in the art from the following description. Attached Figure Description

[0014] Figure 1 This is a plan view of the display device according to the embodiment;

[0015] Figure 2 This is the basis for showing a bent state. Figure 1 A cross-sectional view of the display panel;

[0016] Figure 3 This is the basis for showing a bent state. Figure 1 A plan view of the display device;

[0017] Figure 4 It is along Figure 3 A cross-sectional view taken from line B-B';

[0018] Figure 5 It is along Figure 3 A cross-sectional view taken from line C-C';

[0019] Figure 6 It is along Figure 1 A cross-sectional view taken by line A-A';

[0020] Figure 7 This is a schematic plan view of the display device according to the embodiment;

[0021] Figure 8 It is along Figure 7 A cross-sectional view taken from line D-D';

[0022] Figure 9 and Figure 10 This is a cross-sectional view showing a display device for absorbing impacts from foreign objects according to an embodiment;

[0023] Figure 11 This is a cross-sectional view showing a display device absorbing external force according to one embodiment;

[0024] Figure 12 and Figure 13 This is a cross-sectional view showing a display device according to one embodiment absorbing external forces generated during the attachment of a printed circuit board. Detailed Implementation

[0025] In the following description, exemplary embodiments will be described with reference to the accompanying drawings.

[0026] The same reference numerals always refer to the same elements. In the drawings, the thickness, proportions, and dimensions of elements may be exaggerated for effective description. The scale of elements shown in the drawings is not limited to the scale shown in the drawings, as different scales may be used for ease of description.

[0027] In this disclosure, when an element (or region, layer, section, etc.) is referred to as being “on”, “connected”, or “coupled” to another element, it means that it can be directly connected / coupled to the other element, or that a third intermediate element can be disposed between them.

[0028] The term "and / or" includes any and all combinations of one or more associated configurations that can be defined.

[0029] Terms such as “first” and “second” may be used to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish one element from another. For example, without departing from the scope of this exemplary embodiment, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element. Unless the context clearly indicates otherwise, the singular form is intended to include the plural form as well.

[0030] Terms such as “below,” “lower,” “above,” and “upper” are used to describe the relationship between the components shown in the accompanying drawings. These terms are relative concepts and are described based on the orientation shown in the drawings. For example, one or more other parts may be located between two parts unless “directly” or “immediately” is used. Spatial relative terms such as “below,” “below,” “lower,” “above,” and “upper” can be used to readily describe the relationship between one element or component and another element or component as shown in the accompanying drawings. It should be understood that, in addition to the orientation shown in the accompanying drawings, spatial relative terms also cover different orientations of the device in use or operation. For example, if the device shown in the accompanying drawings is flipped, an element described as “below” or “below” another element may be placed above another element. Thus, the exemplary term “below” can include both downward and upward directions.

[0031] The terms “comprising,” “including,” “containing,” “having,” “having,” or “having” are intended to specify the presence of the features, quantities, steps, operations, elements, components, or combinations thereof described in this disclosure, and should be understood to not exclude the presence or addition of one or more other features, quantities, steps, operations, elements, components, or combinations thereof.

[0032] The various features of the various embodiments of this application can be combined or integrated with each other in part or in whole, and various technologies can be interconnected and driven. Each embodiment can be implemented independently of each other, or can be implemented together in an associated relationship.

[0033] The display device of this application will be described below with reference to the accompanying drawings and embodiments.

[0034] Figure 1 This is a plan view of a display device according to an embodiment.

[0035] Reference Figure 1 The display device 1 according to the embodiment may include a display panel 100. The display panel 100 may include a display area DA having a plurality of pixels PX and a non-display area NDA surrounding the display area DA. The planar shape of the display area DA may be rectangular. However, this disclosure is not limited thereto, and the planar shape of the display area DA may be square, circular, elliptical, or other polygonal. For example, the display area DA may have a rectangular shape with rounded corners, but is not limited thereto, and may also have a rectangular shape with sharp corners.

[0036] In the implementation, the first direction DR1 and the second direction DR2 are different directions that intersect each other, and represent, for example, directions that intersect perpendicularly in a plan view. Figure 1 In this embodiment, the first direction DR1 may generally coincide with the extension direction of the short side of the display panel 100, and the second direction DR2 may coincide with the extension direction of the long side of the display panel 100. However, the directions mentioned in the embodiment should be understood as relative directions, and the embodiment is not limited to the mentioned directions.

[0037] The display area DA may include a short side extending along a first direction DR1 and a long side extending along a second direction DR2. The non-display area NDA may surround the display area DA. The non-display area NDA may be located on one side and the other side of the display area DA along the first direction DR1, and on one side and the other side of the display area DA along the second direction DR2.

[0038] The display panel 100 may further include a sensor non-display area NDA_S and sensor holes SH1 and SH2 surrounded by the sensor non-display area NDA_S. Sensor holes SH1 and SH2 may be surrounded by the display area DA in a plan view. For example, there may be... Figure 1The two sensor holes SH1 and SH2 are shown, but the embodiments of this application are not limited to this. For example, a single sensor hole can be provided. The two sensor holes SH1 and SH2 may include a sensor hole for an infrared sensor and a sensor hole for a camera sensor, but the embodiments of this application are not limited to this. The sensor non-display area NDA_S can be disposed between the sensor holes SH1 and SH2 and the display area DA. The sensor non-display area NDA_S can completely surround the sensor holes SH1 and SH2. Pixels PX may not be disposed in the sensor non-display area NDA_S. In some embodiments, sensor holes SH1 and SH2 can be omitted, and the infrared sensor or camera sensor can be disposed in the display area DA. In this case, the number of pixels PX per unit area of ​​the display area DA with the infrared sensor or camera sensor can be less than the number of pixels PX per unit area of ​​the display area DA without the infrared sensor or camera sensor. That is, the display area DA with the infrared sensor or camera sensor can also include a transmission area.

[0039] The gate driver GIP can be located in a non-display area NDA on one side of the first direction DR1 of the display area DA, and in another non-display area NDA on the other side of the first direction DR1 of the display area DA. A low-potential voltage line VSSL can be located on the non-display area NDA outside the gate driver GIP. For example, as... Figure 1 As shown, the low-voltage line VSSL can extend from the printed circuit board FPCB, pass through the sub-region SR and the curved region BR, and is positioned outside the gate driver GIP on the non-display region NDA, surrounding the display region DA. The high-voltage line VDDL can be positioned outside the gate driver GIP on the non-display region NDA. The high-voltage line VDDL can also be positioned between the low-voltage line VSSL and the gate driver GIP.

[0040] The non-display area NDA located on the other side of the second direction DR2 of the display area DA can extend further along the second direction DR2 from the center portion of the other side of the second direction DR2 of the display area DA. The width of the non-display area NDA extending further along the second direction DR2 from the center portion of the other side of the second direction DR2 of the display area DA in the first direction DR1 can be smaller than the width of the non-display area NDA in the first direction DR1 adjacent to the other side of the second direction DR2 of the display area DA.

[0041] Display device 1 may include a main region MR, a sub-region SR, and a curved region BR located between the main region MR and the sub-region SR. The main region MR is formed by the display region DA and the non-display region NDA surrounding the display region DA on all four sides. The curved region BR and the sub-region SR are formed by the portion extending further along the second direction DR2 from the center portion on the other side of the display region DA. The curved region BR may be arranged between the sub-region SR and the main region MR. The sub-region SR may include a pad area PA. In some embodiments, the sub-region SR may include a first pad area and a second pad area located at the other end of the second direction DR2 of the sub-region SR. A data driver may be attached to the first pad area, and a printed circuit board (FPCB), described later, may be attached to the second pad area. The description below will focus on the case where only the pad area PA is arranged. Display device 1 may also include a printed circuit board (FPCB). The printed circuit board (FPCB) may be attached to the pad area PA. Multiple pads, each connected to the printed circuit board (FPCB), may be arranged on the pad area PA. Although not shown, a data driver may be arranged on the printed circuit board (FPCB), and the data driver may be provided in the form of a driver chip (IC).

[0042] Multiple pads can be arranged on the pad area PA. These pads can include power pads (low-potential voltage pad VSSP, high-potential voltage pad VDDP) and data voltage pads DP. The data voltage pad DP can be arranged at the center of the pad area PA, while the low-potential voltage pad VSSP and the high-potential voltage pad VDDP can be arranged around the periphery of the pad area PA. The high-potential voltage pad VDDP can be arranged between the low-potential voltage pad VSSP and the data voltage pad DP. Each power pad (VDDP, VSSP) can be located on the left and right sides of the pad area PA. The data voltage pad DP can be connected to the data line DL. The data line DL can be connected to each pixel PX in the display area DA.

[0043] Figure 2 It is shown Figure 1 The diagram shows a cross-sectional view of the display panel in a bent state.

[0044] Reference Figure 2 According to one embodiment, the curved region BR of the display panel 100 of the display device 1 can be curved in the thickness direction (or the third direction DR3). Therefore, the main region MR and the sub-region SR can overlap in the thickness direction. The display panel 100 can be curved such that the lower surface of the main region MR and the upper surface of the sub-region SR face each other. A printed circuit board FPCB can be attached to the end of the sub-region SR.

[0045] Figure 3 It shows the basis Figure 1A plan view of the curved state of the display device.

[0046] refer to Figure 3 The display device 1 may further include a molded portion MDP. The molded portion MDP may be located on the upper short side of the display panel 100 in the second direction DR2, the left and right long sides of the display panel 100, the corner side of the display panel 100, and the lower short side of the display panel 100 in the second direction DR2.

[0047] Figure 4 It is along Figure 3 The cross-sectional view taken by line B-B'.

[0048] refer to Figure 3 and Figure 4 The display device 1 may include a display panel 100, a polarizing layer 200, a cover window 300, a back panel layer 600, bonding layers 710, 720, 730, 740, 750, 760, 770, a cover layer MCL, a molded part MDP, and a housing HSP.

[0049] The curved region BR of the display panel 100 can have a curved shape and can be curved in the thickness direction. The main region MR and the sub-region SR of the display panel 100 can overlap each other.

[0050] A polarizing layer 200 can be disposed on the main region MR of the display panel 100. The polarizing layer 200 can polarize light emitted from the display panel 100 by a polarization angle. The polarizing layer 200 can emit light polarized by a polarization angle to the outside. The polarizing layer 200 can block the reflection of external light other than light polarized by a polarization angle. The polarizing layer 200 may include a first phase retardation layer, a second phase retardation layer located on the first phase retardation layer, and a polarizing layer located on the second phase retardation layer. Figure 5 and Figure 6 In the diagram, the polarizing layer 200 and the display panel 100 are shown as separate from each other; however, this disclosure is not limited thereto, and the polarizing layer 200 may also be included in the display panel 100. In some embodiments, the polarizing layer 200 may be omitted, and a color filter may be provided.

[0051] A cover window 300 may be disposed on the polarizing layer 200. The cover window 300 may be formed of a glass material such as glass or quartz, but embodiments of this disclosure are not limited thereto; the cover window 300 may also be formed of a plastic material. The cover window 300 may be disposed on the display panel 100, thereby protecting components disposed below the cover window 300 from external influences. The cover window 300 may be a cover layer formed by chemical strengthening, but embodiments of this disclosure are not limited thereto. The cover window 300 may be a cover layer, a window cover, or a cover member. Embodiments of this application are not limited thereto.

[0052] The cover window 300 can protect components disposed below the cover window 300 from external influences. However, as mentioned above, since the cover window 300 is made of glass, it may be damaged by external forces, resulting in glass fragments. These glass fragments can fly to the outside of the display device 1. According to embodiments of this application, in order to prevent glass fragments from flying due to damage to the cover window 300 or to improve the durability of the cover window 300, the display device 1 may further include at least one other layer located on the cover window 300. For example, the display device 1 may also include a film layer or coating layer located on the cover window 300, but embodiments of this application are not limited thereto.

[0053] The side surface of the cover window 300 may protrude further outward than the side surface of the display panel 100. For example, the side surface of the cover window 300 may protrude further outward than the end of the curved region BR of the display panel 100, but the embodiments of this application are not limited thereto.

[0054] A backplate layer 600 may be disposed below the display panel 100. The backplate layer 600 may be disposed below the display panel 100 to support the display panel 100. The backplate layer 600 may include a material capable of supporting the display panel 100. For example, the backplate layer 600 may include polyethylene terephthalate (PET), polyimide (PI), or polycarbonate (PC), but embodiments of this application are not limited thereto. The backplate layer 600 may maintain a constant curvature of the bending region BR when the display device 1 is bent, and may suppress wrinkles appearing on the upper surface of the display panel 100. As described below, the backplate layer 600 may include an air gap therein.

[0055] The back panel layer 600 may include a first back panel layer 610 located on the main region MR and a second back panel layer 620 located on the sub-region SR. The first back panel layer 610 may be disposed between the main region MR of the display panel 100 and a substrate layer (not shown), and the second back panel layer 620 may be disposed between the sub-region SR of the display panel 100 and a substrate layer (not shown). The back panel layer 600 may not be disposed on the curved region BR.

[0056] The fourth bonding layer 740 may be disposed between the first backsheet layer 610 and the second backsheet layer 620.

[0057] In some embodiments, a plate (not shown) may be further disposed between the first backplate layer 610 and the second backplate layer 620. The plate may include metal. For example, the plate may include stainless steel, but embodiments of this disclosure are not limited thereto.

[0058] The bonding layer may be disposed between the aforementioned components 100, 200, 300, 610, and 620. The bonding layer may include a first bonding layer 710, a second bonding layer 720, a third bonding layer 730, a fourth bonding layer 740, a fifth bonding layer 750, a sixth bonding layer 760, and a seventh bonding layer 770.

[0059] The first bonding layer 710 can connect or bond the display panel 100 and the polarizing layer 200.

[0060] The second bonding layer 720 can be disposed between the polarizing layer 200 and the cover window 300. The second bonding layer 720 can connect or bond the polarizing layer 200 and the cover window 300.

[0061] The third bonding layer 730 can be disposed between the first back panel layer 610 and the display panel 100. The third bonding layer 730 can connect or bond the first back panel layer 610 and the display panel 100.

[0062] The fourth bonding layer 740 may be disposed between the first backsheet layer 610 and the second backsheet layer 620. The fourth bonding layer 740 may connect or bond the first backsheet layer 610 and the second backsheet layer 620.

[0063] The fifth bonding layer 750 may be located between the second backplane layer 620 and the display panel 100 of the sub-region SR. The fifth bonding layer 750 may connect or bond the second backplane layer 620 and the display panel 100.

[0064] The first bonding layer 710 and the second bonding layer 720 may each include a transparent adhesive, but the embodiments of this disclosure are not limited thereto. For example, the transparent adhesive may be a transparent resin (OCR) or a transparent adhesive (OCA), but the embodiments of this disclosure are not limited thereto. The third bonding layer 730, the fourth bonding layer 740, the fifth bonding layer 750, the sixth bonding layer 760 and the seventh bonding layer 770 may each include a pressure-sensitive adhesive (PSA), but the embodiments of this application are not limited thereto.

[0065] A cover layer MCL can be disposed on one surface of the curved region BR of the display panel 100. The cover layer MCL may include a plastic material and can be coated on one surface of the curved region BR of the display panel 100 to cover the curved region BR of the display panel 100. Connecting wires can be disposed on the curved region BR. The cover layer MCL can protect the connecting wires from external impacts and prevent moisture from penetrating into the connecting wires. Furthermore, when the curved region BR of the display panel 100 is bent into a curved shape with a constant radius of curvature, the cover layer MCL can be used to position the connecting wires on a neutral surface. A neutral surface is formed within the curved region BR, where tensile and compressive forces are zero, and the connecting wires are located on the neutral surface, such that when the display panel 100 is bent, the connecting wires receive zero bending stress, thus the display panel 100 can be bent without being damaged by bending stress.

[0066] The cover layer MCL can contact the side surfaces of the polarizing layer 200 and the first bonding layer 710. The cover layer MCL can partially extend into the sub-region SR. The cover layer MCL can expose the printed circuit board FPCB.

[0067] The printed circuit board (FPCB) can be disposed in the pad area (PA) of the sub-region SR. The FPCB can be electrically connected to the pads on the display panel 100 via the anisotropic conductive film (ACF). The FPCB can be bonded to the lower surface of the first backplane layer 610 via the seventh bonding layer 770.

[0068] The molded portion MDP can be disposed on the cover layer MCL. The molded portion MDP may include organic materials (e.g., resin), but embodiments of this application are not limited thereto. The molded portion MDP may cover the outer surface of the curved region BR of the display panel 100, and may, for example, be in direct contact with the lower surface of the cover window 300. The molded portion MDP may also contact the inner surface of the housing HSP. The molded portion MDP may also be disposed on the inner side of the curved region BR. The molded portion MDP may contact the inner surface of the curved region BR and the side surfaces of the first backplate layer 610 and the second backplate layer 620.

[0069] The housing HSP can be disposed on the outermost side of the display device 1. The portion of the housing HSP extending in the thickness direction (or the third direction DR3) can directly contact the cover window 300 and the molded portion MDP. The portion of the housing HSP extending in the second direction DR2 can be bonded to the molded portion MDP via the sixth bonding layer 760.

[0070] Figure 5 It is along Figure 3 The cross-sectional view taken from line C-C'.

[0071] Figure 5The main region MR is shown, which includes the display area DA and the non-display area NDA. Figure 5 A cross-sectional view of the right side region (or the short side on one side in the first direction DR1) of the display device 1 is shown. The cross-sectional view of the right side region of the display device 1 may be substantially the same as the cross-sectional views of the left side region and the upper side region of the display device 1.

[0072] refer to Figure 3 and Figure 5 The molded portion MDP can directly contact the side surface of the display panel 100 and the side surface of the first back panel layer 610. The molded portion MDP can be bonded to the housing HSP via the sixth bonding layer 760. The molded portion MDP can contact the lower surface of the cover window 300 and the inner surface of the housing HSP.

[0073] In a display device 1 according to one embodiment, the molded portion MDP may include an organic material. The molded portion MDP may include an organic material that repeatedly contracts and expands according to heat.

[0074] Figure 6 It is along Figure 1 A cross-sectional view taken from line A-A'.

[0075] Reference Figure 6 The display panel 100 may include a substrate 101, a buffer layer 102, a first thin film transistor 120, a second thin film transistor 130, a storage electrode 140, a light-emitting unit 150, an encapsulation unit 170, a touch unit 180, and an upper organic layer 190.

[0076] The substrate 101 may include one or more plastic materials. For example, the substrate 101 may be a multi-substrate 101a, 101b, 101c comprising a variety of plastic materials (e.g., polyimide), but is not limited thereto.

[0077] A buffer layer 102 may be disposed on the substrate 101. The buffer layer 102 may minimize or delay the diffusion of moisture or oxygen through the substrate 101. The buffer layer 102 may be formed by stacking silicon nitride (SiNx) and silicon oxide (SiOx) at least once alternately, but embodiments of the present disclosure are not limited thereto.

[0078] The first light-shielding layer 126 may be disposed between the substrate 101 and the buffer layer 102. The first light-shielding layer 126 can prevent light from passing through the first semiconductor layer 123 of the first thin-film transistor 120. For example, the first semiconductor layer 123 may be disposed overlapping the first light-shielding layer 126. The first light-shielding layer 126 may be a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), nickel (Ni), neodymium (Nd) and copper (Cu) or their alloys, but the embodiments of this disclosure are not limited thereto.

[0079] A first insulating layer 103 may be disposed on the first light-shielding layer 126. The first insulating layer 103 can prevent short circuits between the structure of the first thin-film transistor 120 and the first light-shielding layer 126. The first insulating layer 103 may be made of the same material as the buffer layer 102, but embodiments of the present disclosure are not limited thereto. For example, the first insulating layer 103 may be made of inorganic materials such as silicon nitride (SiNx) or silicon oxide (SiOx), but embodiments of the present disclosure are not limited thereto.

[0080] The first thin-film transistor 120 may be disposed on the first insulating layer 103. The first thin-film transistor 120 may include a first source electrode 121, a first gate electrode 122, a first semiconductor layer 123, and a first drain electrode 124.

[0081] The first semiconductor layer 123 may be disposed on the first insulating layer 103. The first semiconductor layer 123 may be, but is not limited to, a metal oxide semiconductor such as IGZO (indium gallium zinc oxide), or a silicon-based semiconductor material such as amorphous silicon or polycrystalline silicon. The first semiconductor layer 123 may include a channel region, a source region, and a drain region.

[0082] Polycrystalline semiconductor layers have higher mobility than amorphous semiconductor layers and oxide semiconductor layers, thus enabling lower power consumption and superior reliability. Therefore, driving transistors can be formed from polycrystalline semiconductor layers.

[0083] The second insulating layer 104 may be disposed on the first semiconductor layer 123. The second insulating layer 104 may be made of the same material as the first insulating layer 103 and may prevent short circuits between the first semiconductor layer 123 and other components of the first thin-film transistor 120.

[0084] The first gate electrode 122 may be disposed on the second insulating layer 104. The first gate electrode 122 may be disposed on the second insulating layer 104 to overlap with the channel region of the first semiconductor layer 123. The first gate electrode 122 may be a single layer or multiple layers comprising molybdenum (Mo), copper (Cu), titanium (Ti), aluminum (Al), chromium (Cr), gold (Au), nickel (Ni), neodymium (Nd), or compounds thereof. The first gate electrode 122 may be disposed together with the gate line.

[0085] The third insulating layers 105_1 and 105_2 may be disposed on the first gate electrode 122. The third insulating layers 105_1 and 105_2 may be formed of the same material as the first insulating layer 103 or the second insulating layer 104.

[0086] The first source electrode 121 and the first drain electrode 124 can be disposed on the third insulating layers 105_1 and 105_2.

[0087] The first source electrode 121 and the first drain electrode 124 can be electrically connected to the first semiconductor layer 123 through contact holes. The first source electrode 121 and the first drain electrode 124 can be formed of a metallic material. For example, the first source electrode 121 and the first drain electrode 124 can be a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu) or their alloys, but the embodiments of this disclosure are not limited thereto.

[0088] The first source electrode 121 and the first drain electrode 124 can be arranged together with the data line. For example, the data line can be made of the same material as the first source electrode 121 and the first drain electrode 124, and can be formed on the same layer, but the embodiments of this disclosure are not limited thereto.

[0089] The storage electrode 140 may be arranged spaced apart from the first thin-film transistor 120. The storage electrode 140 may include a first storage electrode 141, a second storage electrode 142, and a third storage electrode 143.

[0090] The first storage electrode 141 may be placed on the same layer as the first gate electrode 122 and may be made of the same material, but the embodiments disclosed herein are not limited thereto.

[0091] The second storage electrode 142 may be disposed on the first storage electrode 141. The second storage electrode 142 may be disposed on the third insulating layers 105_1 and 105_2, and the third insulating layers 105_1 and 105_2 between the first storage electrode 141 and the second storage electrode 142 may be used as a dielectric to form a capacitor. The second storage electrode 142 may be made of the same material as the first storage electrode 141, but the embodiments of this disclosure are not limited thereto.

[0092] The second thin-film transistor 130 may be spaced apart from the first thin-film transistor 120 and the storage electrode 140. The second thin-film transistor 130 may include a second source electrode 131, a second gate electrode 132, a second semiconductor layer 133, and a second drain electrode 134.

[0093] The second light-shielding layer 136 can be disposed on the same layer as the second storage electrode 142.

[0094] Similar to the first light-shielding layer 126, the second light-shielding layer 136 can block light from reaching the second semiconductor layer 133, thereby extending the lifetime of the second thin-film transistor 130. For example, the second semiconductor layer 133 can be configured to overlap with the second light-shielding layer 136.

[0095] The fourth insulating layer 106 may be disposed on the second light-shielding layer 136. The fourth insulating layer 106 may be made of the same material as the first insulating layer 103, the second insulating layer 104, or the third insulating layers 105_1, 105_2, but is not limited thereto.

[0096] The second semiconductor layer 133 may be disposed on the fourth insulating layer 106. The second semiconductor layer 133 may include a source region, a drain region, and a channel region between the source region and the drain region.

[0097] The second semiconductor layer 133 may include, but is not limited to, metal oxide semiconductors such as IGZO (indium gallium zinc oxide), silicon-based semiconductor materials such as amorphous silicon or polycrystalline silicon.

[0098] The fifth insulating layer 108 may be disposed on the second semiconductor layer 133. The fifth insulating layer 108 may be made of the same material as the first insulating layer 103, the second insulating layer 104, the third insulating layer 105_1, 105_2 or the fourth insulating layer 106, but is not limited thereto.

[0099] The second gate electrode 132 can be disposed on the fifth insulating layer 108.

[0100] The second gate electrode 132 may be made of the same material as the first gate electrode 122. For example, the second gate electrode 132 may be formed as a single layer or multiple layers of molybdenum (Mo), copper (Cu), titanium (Ti), aluminum (Al), chromium (Cr), gold (Au), nickel (Ni), neodymium (Nd) or compounds thereof, but the embodiments of this disclosure are not limited thereto.

[0101] The sixth insulating layer 109 may be disposed on the second gate electrode 132. The sixth insulating layer 109 may be made of the same material as the first insulating layer 103, the second insulating layer 104, the third insulating layers 105_1, 105_2, the fourth insulating layer 106 or the fifth insulating layer 108, but the embodiments of this disclosure are not limited thereto.

[0102] The first source electrode 121, the first drain electrode 124, the third storage electrode 143, the second source electrode 131, and the second drain electrode 134 can be disposed on the sixth insulating layer 109.

[0103] The third storage electrode 143, the second source electrode 131, and the second drain electrode 134 can be made of the same material as the first source electrode 121 and the first drain electrode 124, and can be disposed on the same layer. For example, the third storage electrode 143, the second source electrode 131, and the second drain electrode 134 can be a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or their alloys, but the embodiments of this disclosure are not limited thereto.

[0104] The first thin-film transistor 120 can be a switching transistor, and the second thin-film transistor 130 can be a driving transistor, but the embodiments of this disclosure are not limited thereto.

[0105] The first protective layer 111 can be disposed on the first source electrode 121 and the first drain electrode 124.

[0106] The first protective layer 111 can planarize the upper part of the first thin-film transistor 120 and protect the first thin-film transistor 120. The first protective layer 111 can be formed of an organic material. For example, the first protective layer 111 can be formed of an organic material including but not limited to acrylic resin, epoxy resin, phenolic resin, polyamide resin or polyimide resin.

[0107] The second protective layer 112 may be disposed on the first protective layer 111. The second protective layer 112 may be formed of the same material as the first protective layer 111, but the embodiments of this disclosure are not limited thereto.

[0108] The connecting electrode 145 can be disposed between the first protective layer 111 and the second protective layer 112.

[0109] The connection electrode 145 can electrically connect the second thin-film transistor 130 to the light-emitting unit 150. The connection electrode 145 can be formed of the same material as the first source electrode 121 and the first drain electrode 124, but the embodiments of this disclosure are not limited thereto.

[0110] The connecting electrode 145 may be a single layer or multiple layers made of one or an alloy of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu), but the embodiments disclosed herein are not limited thereto.

[0111] The light-emitting unit 150 may be disposed on the second protective layer 112. The light-emitting unit 150 may include a first electrode 151, an organic layer 152, and a second electrode 153. The first electrode 151 may be used as an anode, and the second electrode 153 may be used as a cathode, but the embodiments disclosed herein are not limited thereto.

[0112] The first electrode 151 may be disposed on the second protective layer 112. The first electrode 151 may be electrically connected to the second thin-film transistor 130 through a contact hole formed in the second protective layer 112. The first electrode 151 may be a reflective electrode that reflects light, but the embodiments of this disclosure are not limited thereto. The first electrode 151 may comprise a highly reflective metallic material, such as a stacked structure of aluminum (Al) and titanium (Ti) (Ti / Al / Ti), a stacked structure of aluminum (Al) and indium tin oxide (ITO) (ITO / Al / ITO), or an APC alloy, and may be formed as a single layer or multiple layers, but the embodiments of this disclosure are not limited thereto.

[0113] An organic layer 152 may be disposed on the first electrode 151. The organic layer 152 may include one or more light-emitting structures (or light-emitting elements or components) stacked on the first electrode 151 in a sequence or reverse order of hole transport layer and electron transport layer. The organic layer 152 may be an organic light-emitting layer, an inorganic light-emitting layer, a quantum dot light-emitting layer, a micro light-emitting diode, or a micro-mini light-emitting diode, but is not limited thereto. For example, the organic layer 152 of a display panel 100 according to one embodiment of this disclosure may include an organic light-emitting layer. The organic layer 152 may include a red light-emitting layer, a green light-emitting layer, and a blue light-emitting layer.

[0114] The second electrode 153 may be disposed on the organic layer 152. The second electrode 153 may be a transparent electrode that transmits light, but is not limited thereto. For example, the second electrode 153 may include a transparent conductive material such as ITO (indium tin oxide) or IZO (indium zinc oxide), or a metal that transmits visible light.

[0115] The partition 154 can be configured to expose the first electrode 151. The partition 154 can define an opening (or light-emitting area) of a sub-pixel and can be configured to cover the edge portion of the first electrode 151. Each of the plurality of sub-pixels can include a red light-emitting area, a green light-emitting area, and a blue light-emitting area.

[0116] Spacer 155 can be further provided on dike 154.

[0117] The encapsulation unit 170 may be disposed on the spacer 154 or the light-emitting unit 150. The encapsulation unit 170 may include one or more insulating layers. For example, the encapsulation unit 170 may include a first encapsulation layer 171, a second encapsulation layer 172 disposed on the first encapsulation layer 171, and a third encapsulation layer 173 disposed on the second encapsulation layer 172. The encapsulation unit 170 may include one or more inorganic material layers and one or more organic material layers. For example, the first encapsulation layer 171 and the third encapsulation layer 173 may include inorganic materials, and the second encapsulation layer 172 may include organic materials.

[0118] A touch buffer layer 181 may be disposed on the encapsulation unit 170. For example, the touch buffer layer 181 may be disposed on the third encapsulation layer 173. The touch buffer layer 181 may be made of the same material as the buffer layer 102. A first touch conductive layer may be disposed on the touch buffer layer 181. A first touch insulating layer 183 may be disposed on the first touch conductive layer. The first touch insulating layer 183 can prevent short circuits between touch electrodes. The first touch insulating layer 183 may include organic or inorganic materials. A second touch conductive layer may be disposed on the first touch insulating layer 183.

[0119] The first touch conductive layer may include a second touch electrode 182, and the second touch conductive layer may include a first touch electrode 185. The first touch electrode 185 may include a 1a touch electrode 185a extending in a first direction and a 1b touch electrode 185b extending in a second direction different from the first direction. Figure 6 In the diagram, the first touch electrode 185 and the second touch electrode 182 are shown overlapping the light-emitting area, but the first touch electrode 185 and the second touch electrode 182 can each be arranged to overlap with the partition 154.

[0120] The second touch electrode 182 can be electrically connected to the 1a touch electrode 185a through a contact hole formed in the first touch insulating layer 183. For example, the 1a touch electrode 185a and the second touch electrode 182 can extend in a first direction.

[0121] The first touch electrode 185 and the second touch electrode 182 may comprise metallic materials. For example, the first touch electrode 185 and the second touch electrode 182 may be made of titanium (Ti), nickel (Ni), aluminum (Al), or alloys thereof, and may be made of a three-layer structure such as titanium (Ti) / aluminum (Al) / titanium (Ti), but embodiments of this disclosure are not limited thereto.

[0122] The second touch insulating layer 184 may be disposed on the second touch conductive layer. The second touch insulating layer 184 may include an organic material.

[0123] The upper organic layer 190 may be disposed on the touch unit 180, but the embodiments disclosed herein are not limited thereto. The upper organic layer 190 may include organic materials.

[0124] Figure 7 This is a schematic plan view of a display device according to one embodiment.

[0125] Reference Figure 7According to one embodiment, the display device 1 may include a first backplate layer 610 disposed in a main region MR and a second backplate layer 620 disposed in a sub-region SR. The first backplate layer 610 may include a first pattern CSP1 extending along a first direction DR1, and the second backplate layer 620 may include a second pattern CSP2 extending along the first direction DR1. The extension directions of the first pattern CSP1 and the second pattern CSP2 may be the same as the extension direction of the curved region BR. Multiple first patterns CSP1 may be provided and spaced apart from each other along the second direction DR2, and multiple second patterns CSP2 may be provided and spaced apart from each other along the second direction DR2. The first pattern CSP1 and the second pattern CSP2 may each correspond to... Figure 8 The first air gap AG1 is described in the text.

[0126] In some embodiments, the extension direction of the first pattern CSP1 and the second pattern CSP2 can be the second direction DR2, the first pattern CSP1 can be spaced apart in the first direction DR1, and the second pattern CSP2 can be spaced apart in the first direction DR1.

[0127] The first pattern CSP1 may have a first width W1, and the second pattern CSP2 may have a second width W2. The first width W1 and the second width W2 may be the same.

[0128] In some embodiments, the first width W1 may be greater than the second width W2. As described below, the first backplate layer 610 and the second backplate layer 620 can each absorb impacts or external forces applied to the display panel 100, thereby preventing damage to the display panel 100. Furthermore, in the case of a bent display device 1, the first backplate layer 610 may be positioned closer to the display panel 100 than the second backplate layer 620. The first pattern CSP1 and the second pattern CSP2 can absorb impacts or external forces applied to the first backplate layer 610 and the second backplate layer 620, and as described above, since the first backplate layer 610 is positioned closer to the display panel 100 than the second backplate layer 620, the first width W1 of the first pattern CSP1 may be greater than the second width W2 of the second pattern CSP2.

[0129] Figure 8 It is along Figure 7 The cross-sectional view taken by line D-D'. Figure 8 It shows Figure 7 The cross-sectional structure of the display panel 100, the first back panel layer 610, and the third bonding layer 730. Although in Figure 8 Only the cross-sectional structure of the first backsheet layer 610 is shown, but the cross-sectional structure of the second backsheet layer 620 may be the same as that of the first backsheet layer 610.

[0130] refer to Figure 7 and Figure 8 The first backing layer 610 may include a first base layer 611, a second base layer 612, and an elastic layer 613. The first base layer 611 may be disposed between the third bonding layer 730 and the second base layer 612, and may be directly connected to the third bonding layer 730. The second base layer 612 may face the first base layer 611. The elastic layer 613 is disposed between the first base layer 611 and the second base layer 612, and may be in direct contact with adjacent first base layers 611 and second base layers 612. The cross-sectional shape of the elastic layer 613 may be circular or elliptical, but the embodiments of this disclosure are not limited thereto.

[0131] The first air gap AG1 can be disposed within the elastic layer 613. The first air gap AG1 can have the same characteristics as the above. Figure 7 The first pattern CSP1 and the second pattern CSP2 described herein have the same structure. The first air gap AG1 can be completely surrounded by the elastic layer 613. Multiple elastic layers 613 can be provided and can be spaced apart from each other along the second direction DR2. The second air gap AG2 can be provided between adjacent elastic layers 613. The second air gap AG2 can be completely surrounded by adjacent elastic layers 613, the first base layer 611, and the second base layer 612.

[0132] According to one embodiment, the first base layer 611, the second base layer 612, and the elastic layer 613 may be integrally formed and may comprise the same material. For example, the first base layer 611, the second base layer 612, and the elastic layer 613 may comprise polyethylene terephthalate (PET), polyimide (PI), or polycarbonate (PC), but embodiments of this disclosure are not limited thereto.

[0133] The function of the first backplate layer 610 according to one embodiment in absorbing impacts or external forces applied to the display panel 100 will be described below.

[0134] Figure 9 and Figure 10 This is a cross-sectional view showing the absorption of impacts caused by foreign objects in a display device according to one embodiment. Figure 9 and Figure 10 The process of attaching the first back panel layer 610 to the display panel 100 is shown.

[0135] Reference Figure 9 Foreign object P can be placed on the surface of display panel 100 (based on...) Figure 4 On the lower surface of the display panel 100.

[0136] refer to Figure 10When the first backplate layer 610 is attached to the display panel 100 via the third bonding layer 730, if the first backplate layer 610 has low elasticity, an impact may be transmitted to the display panel 100 through the foreign object P, thereby damaging the display panel 100. However, in one embodiment, the first backplate layer 610 can be elastic due to the first air gap AG1 and the second air gap AG2. Therefore, as... Figure 10 As shown, the first base layer 611 rises along the steps of the foreign object P, and the first air gap AG1 and / or the second air gap AG2 are reduced due to the space created by the rising first base layer 611, thereby absorbing the impact caused by the foreign object P.

[0137] Figure 11 This is a cross-sectional view showing a display device absorbing external force according to one embodiment.

[0138] refer to Figure 11 External forces may be applied from above the first back panel layer 610. If the first back panel layer 610 has low elasticity, external forces may be applied to the display panel 100, thereby damaging the display panel 100.

[0139] However, according to one embodiment, when an external force is applied, the second base layer 612 can fill the second air gap AG2 located at the point where the external force is applied, thereby contacting the side surface of the adjacent elastic layer 613. That is, since the first backplate layer 610 absorbs the external force while deforming, the external force is not applied to the display panel 100, thereby preventing damage to the display panel 100.

[0140] Figure 12 and Figure 13 This is a cross-sectional view showing a display device according to one embodiment absorbing external forces generated during the attachment of a printed circuit board.

[0141] refer to Figure 12 As mentioned above (refer to the reference) Figure 4 The printed circuit board (FPCB) can be attached to the first backplane layer (610) via the seventh bonding layer (770). Before the FPCB contacts the seventh bonding layer (770), the elastic layer (613) of the first backplane layer (610) can have a first thickness T1 and can remain undeformed.

[0142] refer to Figure 13 When the printed circuit board (FPCB) is attached to the seventh bonding layer 770, the elastic layer 613' of the first backplane layer 610' can deform to have a second thickness T2 that is less than the first thickness T1. Furthermore, the cross-sectional structure of the elastic layer 613' can be widened according to the second thickness T2. Therefore, the cross-sectional structure of the first air gap AG1 can have a rectangular shape. Figure 13 As shown, because the first backing layer 610' absorbs external forces, adjacent elastic layers 613' can be in direct contact with each other. That is to say, Figure 12 The second air gap AG2 can be filled by the elastic layer 613'.

[0143] In other words, even during the process of attaching the printed circuit board FPCB, the structure of the first backplane layer 610 can withstand the external force used to attach the printed circuit board FPCB, thereby preventing the external force from being transmitted to the display panel 100 and preventing damage to the display panel 100.

[0144] According to an embodiment of the present disclosure, the display device includes a display panel and a back plate layer disposed on the lower surface of the display panel, the back plate layer including an air gap surrounded by the back plate layer.

[0145] In a display device according to an embodiment of the present disclosure, the backsheet layer may include a first base layer, a second base layer facing the first base layer, and an elastic layer located between the first base layer and the second base layer.

[0146] In a display device according to an embodiment of the present disclosure, an air gap may be provided between adjacent elastic layers and within the elastic layers.

[0147] In a display device according to an embodiment of the present disclosure, the air gap may include: a first air gap completely surrounded by an elastic layer; and a second air gap completely surrounded by a first base layer, a second base layer and an adjacent elastic layer.

[0148] In a display device according to an embodiment of the present disclosure, the first base layer, the second base layer, and the elastic layer may be integrally formed.

[0149] In a display device according to an embodiment of the present disclosure, the first base layer, the second base layer, and the elastic layer may comprise the same material.

[0150] According to embodiments of this disclosure, the air gap can be completely surrounded by the backing layer.

[0151] In a display device according to an embodiment of the present disclosure, the display panel may include a main region, a sub-region, and a curved region, and the back panel layer includes a first back panel layer located on the lower surface of the main region and a second back panel layer located on the lower surface of the sub-region.

[0152] In a display device according to an embodiment of the present disclosure, the first backplate layer and the second backplate layer may each include an air gap therein.

[0153] In a display device according to an embodiment of the present disclosure, the back panel layer may include a first base layer, a second base layer facing the first base layer, and an elastic layer located between the first base layer and the second base layer, wherein the extension direction of the elastic layer may be the same as the extension direction of the bending region.

[0154] In another aspect, a display device according to an embodiment of the present disclosure may include: a display panel including a main region, a sub-region and a curved region; a first backplate layer disposed on the lower surface of the main region of the display panel; a second backplate layer disposed on the lower surface of the sub-region of the display panel; and a molded portion disposed on the lower surface of the curved region of the display panel, wherein the first backplate layer or the second backplate layer may include an air gap therein, and the molded portion may contact the first backplate layer.

[0155] In a display device according to an embodiment of the present disclosure, each of the first backplate layer and the second backplate layer may include a first base layer, a second base layer facing the first base layer, and an elastic layer located between the first base layer and the second base layer.

[0156] In a display device according to an embodiment of the present disclosure, an air gap may be provided between adjacent elastic layers and within the elastic layers.

[0157] In a display device according to an embodiment of the present disclosure, the air gap may include: a first air gap completely surrounded by an elastic layer; and a second air gap completely surrounded by a first base layer, a second base layer and an adjacent elastic layer.

[0158] In a display device according to an embodiment of the present disclosure, the first base layer, the second base layer, and the elastic layer may be integrally formed.

[0159] In a display device according to an embodiment of the present disclosure, the first base layer, the second base layer, and the elastic layer may comprise the same material.

[0160] In a display device according to an embodiment of the present disclosure, the molded portion may contact at least one of a first base layer, a second base layer, and an elastic layer.

[0161] The display device according to the embodiments of the present disclosure may further include a cover layer disposed on the upper surface of the curved area of ​​the display panel, and the molded portion may be further disposed on the upper surface of the cover layer.

[0162] The display device according to the embodiments of the present disclosure may further include a polarizing layer disposed on the upper surface of the main area of ​​the display panel, the polarizing layer being in contact with the cover layer.

[0163] A display device according to an embodiment of the present disclosure may include a printed circuit board attached to the upper surface of a sub-region of a display panel, the printed circuit board being attached to the lower surface of a first backplane layer via an bonding layer.

[0164] Although embodiments of the invention have been described with reference to the accompanying drawings, those skilled in the art will understand that the technical configurations of the invention described above can be implemented in other specific forms without departing from the technical spirit or essential characteristics of the invention. Therefore, it should be understood that the above embodiments are illustrative in all respects and not restrictive. Furthermore, the scope of the invention is defined by the appended claims rather than the specific embodiments. Moreover, all changes or modifications derived from the meaning and scope of the claims and their equivalents should be interpreted as being included within the scope of the invention.

Claims

1. A display device, comprising: Display panel; and The back panel layer disposed on the lower surface of the display panel. The backsheet layer includes an air gap formed therein, which is completely surrounded by the backsheet layer.

2. The display device according to claim 1, wherein, The backsheet layer includes: First-level grassroots; The second grassroots level is oriented towards the first grassroots level; and An elastic layer located between the first base layer and the second base layer.

3. The display device according to claim 2, wherein, The air gap is disposed between adjacent elastic layers and within the elastic layers.

4. The display device according to claim 3, wherein, The air gap includes: The first air gap is completely surrounded by the elastic layer; and The second air gap is completely surrounded by the first base layer, the second base layer and the adjacent elastic layer.

5. The display device according to claim 2, wherein, The first base layer, the second base layer, and the elastic layer are integrally formed.

6. The display device according to claim 2, wherein, The first base layer, the second base layer, and the elastic layer all consist of the same material.

7. The display device according to claim 1, wherein, The display panel includes a main area, a sub-area, and a curved area. The backsheet layer includes a first backsheet layer located on the lower surface of the main region and a second backsheet layer located on the lower surface of the sub-region.

8. The display device according to claim 7, wherein, The first backsheet layer and the second backsheet layer each include the air gap located therein.

9. The display device according to claim 8, wherein, The backsheet layer includes a first base layer, a second base layer facing the first base layer, and an elastic layer located between the first base layer and the second base layer. The extension direction of the elastic layer is the same as the extension direction of the bending region.

10. A display device, comprising: The display panel includes a main area, a sub-area, and a curved area. A first backplate layer is disposed on the lower surface of the main area of ​​the display panel; A second backplate layer is disposed on the lower surface of the sub-region of the display panel; and A molded portion disposed on the lower surface of the curved area of ​​the display panel. The first backsheet layer or the second backsheet layer includes an air gap located therein. The molded portion contacts the first backplate layer.

11. The display device according to claim 10, wherein, Each of the first backsheet layer and the second backsheet layer includes: First-level grassroots; The second grassroots level is oriented towards the first grassroots level; and An elastic layer located between the first base layer and the second base layer.

12. The display device according to claim 11, wherein, The air gap is disposed between adjacent elastic layers and within the elastic layers.

13. The display device according to claim 12, wherein, The air gap includes: The first air gap is completely surrounded by the elastic layer; and The second air gap is completely surrounded by the first base layer, the second base layer and the adjacent elastic layer.

14. The display device according to claim 11, wherein, The first base layer, the second base layer, and the elastic layer are integrally formed.

15. The display device according to claim 11, wherein, The first base layer, the second base layer, and the elastic layer all consist of the same material.

16. The display device according to claim 11, wherein, The molded portion contacts at least one of the first base layer, the second base layer, and the elastic layer.

17. The display device according to claim 10, further comprising: A cover layer disposed on the upper surface of the curved area of ​​the display panel. The molded portion is further disposed on the upper surface of the cover layer.

18. The display device according to claim 17, further comprising: A polarizing layer disposed on the upper surface of the main area of ​​the display panel. The polarizing layer is in contact with the cover layer.

19. The display device according to claim 10, further comprising: A printed circuit board attached to the upper surface of the sub-region of the display panel. The printed circuit board is attached to the lower surface of the first backplane layer via a bonding layer.

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