Electronic paper assembly and laser cutting method and laser cutting drawing thereof

Abstract

The application discloses an electronic paper assembly and a laser cutting method and laser cutting drawing thereof, and belongs to the technical field of electronic paper processing. The electronic paper assembly is provided with a non-closed half-ear-shaped silver adhesive hole formed by cutting off an outer edge, and the silver adhesive hole penetrates through an electronic ink capsule layer and does not penetrate through an ITO transparent conductive layer, so that the FPL raw material utilization rate is improved and the production cost is reduced. The laser cutting process is optimized, the hole is first processed by half cutting, then a split line is cut to form a half-hole structure, then film prying and ITO layer cleaning are completed, finally, the product shape is cut, and a special cutting drawing is matched to guide the processing. The scheme effectively avoids laser smoke and dust pollution of the exposed ITO layer generated in the shape cutting, solves the problems of poor contact between the silver adhesive and the ITO, circuit breakage, display abnormality and the like, the process does not need to reform the existing equipment, has strong adaptability, takes into account the production efficiency and the product yield, and is suitable for large-scale mass production.

Description

Technical Field

[0001] This invention relates to the field of electrophoretic display film processing technology, specifically to an electronic paper assembly with a half-ear-shaped silver paste hole, a laser cutting method for the assembly, and matching laser cutting drawings. Background Technology

[0002] Electronic paper (ePaper): A reflective display technology that simulates the visual characteristics of real paper. It relies on ambient light rather than backlight to display content, and features ultra-low power consumption and high readability in sunlight. It consumes no power when maintaining a static image, making it suitable for devices that require long-term display (such as e-books and electronic tags).

[0003] Electronic paper components generally consist of three layers: a TFT glass substrate, an FPL film, and a PS protective layer. The TFT glass substrate is the driving substrate, containing circuit components; the FPL film is the middle display layer, encapsulating electronic ink; and the PS protective layer is a sealing and protective layer covering the edges of the FPL.

[0004] Electrophoretic display film (EPD film, commonly known in the industry as electronic ink film, ink film, or FPL film) is a reflective electrophoretic display technology that relies on ambient light for imaging, eliminating the need for a backlight source. It features ultra-low power consumption, excellent visibility under strong light, and zero power consumption for static images, making it widely used in e-books, electronic price tags, and industrial display terminals. Mainstream products employ microencapsulated electrophoretic display technology, with the core component being the electrophoretic display film (EPD film, also known as FPL film or electronic ink film). Common series include Carta, Pearl, and Spectra three-color microencapsulated films.

[0005] The EPD electronic paper display module mainly consists of a TFT glass substrate, an FPL front planar layer, a PS protective layer, an IC driver chip, and an FPC cable. Among them, the TFT substrate is the bottom driving structure, which relies on the thin-film transistor array to control the pixel state; the FPL front planar layer is the core display medium and also the component with the highest cost in the module; the PS protective layer plays a role in protection, sealing, anti-glare, and anti-ultraviolet protection.

[0006] FPL is a multi-layered composite structure, consisting of a PS protective layer, an ITO transparent conductive layer, an adhesive layer, and a microcapsule electronic ink layer from top to bottom. The main substrate for the ITO transparent conductive layer is a 25μm~75μm optical-grade PET film, which is formed by magnetron sputtering to serve as the top common electrode. The electronic ink layer contains 30~100μm microcapsules filled with electrophoretic solution and charged pigment particles. The display is achieved by the displacement of the particles driven by an electric field.

[0007] Silver paste holes are set at the edge of the FPL to fill the conductive silver paste, enabling conductivity between the TFT substrate and the FPL circuit. The common aperture of the silver paste holes is 0.60mm~1.0mm. The traditional structure is a fully circular closed silver paste hole, and the corresponding process flow is: laser cutting of the ear hole → skidding and cleaning of the ear hole → secondary cleaning of the ear hole → cutting of the product shape. This process can avoid the ITO layer being contaminated by laser fume and has stable conductivity.

[0008] To improve the utilization rate of FPL raw materials and reduce production costs, the industry has modified the full-circular ear hole to a semi-circular, semi-ear-shaped, non-closed structure. However, when using traditional processes, the exposed ITO layer after cleaning is contaminated by smoke and dust generated during subsequent cutting, causing poor contact between the silver paste and ITO, circuit breaks, and leading to problems such as driver failure, screen flickering, and black screens, resulting in a significant drop in product yield. Currently, there is no dedicated processing technology suitable for the semi-ear structure, and this technical challenge urgently needs to be solved. Summary of the Invention

[0009] This invention aims to solve the problem that in existing half-ear structure electronic paper components, laser fumes and dust contaminate the exposed ITO layer inside the silver paste holes during laser cutting, leading to poor circuit contact, open circuits, and abnormal display; while retaining the advantages of the half-ear structure, such as high raw material utilization and low production cost.

[0010] The applicant proposes an electronic paper assembly comprising an electronic ink capsule layer and an ITO transparent conductive layer. The electronic ink capsule layer includes an electronic ink capsule film, and the ITO transparent conductive layer includes a transparent substrate with an ITO transparent common electrode coating on the transparent substrate. The electronic paper assembly is cut to form an outer edge according to an applicable product. It includes at least one unclosed silver paste hole for filling with conductive silver paste, the unclosed silver paste hole being formed by the outer edge breaking through a closed silver paste hole. The silver paste hole penetrates the electronic ink layer and does not penetrate the ITO transparent conductive layer.

[0011] FPL components in electronic paper products are generally formed by cutting FPL, but FPL cutting requires advanced technology and is difficult for ordinary manufacturers to process. After years of observation and experimentation, the applicant has verified that using specialized cutting manufacturers to produce FPL components into market-standard parts can significantly improve industry efficiency. Centralizing the master die cutting process to a single manufacturer can drastically reduce overall industry costs and improve efficiency. By making the silver paste holes into semi-perforations, the area of ​​the FPL component can be reduced, increasing the utilization rate of the master die.

[0012] The applicant proposed that the silver paste hole be semi-circular, semi-rectangular, or semi-elliptical.

[0013] Making the silver paste holes semi-circular makes them easier to process; making them half-rectangular or half-elliptical can reduce the height of the silver paste holes and improve the utilization rate of the mother film.

[0014] The applicant stated that the electronic paper component includes two silver paste holes, which are symmetrically distributed on the left and right sides.

[0015] Making two silver-plated holes provides redundant connections and improves product performance.

[0016] The applicant proposes a laser cutting method for electronic paper components, used to produce the aforementioned electronic paper components, comprising the following steps: S10. Place the electronic paper motherboard onto the laser cutting equipment; the electronic paper motherboard includes an electronic ink capsule layer and an ITO transparent conductive layer; S20. On the electronic paper motherboard, at least two A-processing holes are partially cut out using a laser. The A-processing holes penetrate the electronic ink layer but do not penetrate the ITO transparent conductive layer. S30. On the electronic paper motherboard, a laser is used to partially cut out the A-processing hole dividing line, which divides the A-processing hole into two half-holes. The two ends of the A-processing hole dividing line extend beyond the boundary of the A-processing hole. The A-processing hole dividing line penetrates the electronic ink capsule layer and the ITO transparent conductive layer. S50. Perform secondary cutting on the overall product shape of the FPL motherboard to divide the FPL motherboard into two or more electronic paper components, without performing secondary cutting on the A processing hole dividing line.

[0017] Through a secondary cutting process, the debris generated by the second cutting will not enter the ITO transparent conductive layer exposed by the first cutting. The two ends of the dividing line of machining hole A extend beyond the boundary of machining hole A, making the distance of the second cutting far away from machining hole A, so that debris is less likely to jump into the interior of machining hole A.

[0018] The applicant proposes that a protective film be covered on the electronic paper motherboard; step S20 is followed by step S21, where the protective film on the electronic paper motherboard is removed.

[0019] The debris generated during the first cut can be removed by removing the protective film.

[0020] The applicant proposes that a protective film is covered on the electronic paper motherboard; step S30 is followed by step S22, S22: cleaning the exposed ITO layer corresponding to the A machining hole; the cleaning uses a special cleaning solvent to remove cutting dust, smoke residue and impurities.

[0021] By cleaning, the debris generated during the first cut is removed, improving product performance. During the second cut, the cutting line is kept away from the A machining hole, preventing contamination of the exposed ITO layer.

[0022] The applicant proposed that step S50 be followed by step S60, whereby a PS protective layer is applied to the segmented electronic paper assembly.

[0023] The applicant proposes that step S50 is followed by step S52, whereby a temporary protective film is applied to the segmented electronic paper assembly.

[0024] By covering the electronic paper components with a temporary protective film, they can be sold as standalone products directly to downstream manufacturers, protecting them from contamination during handling and storage.

[0025] The applicant proposed that step S50 is followed by step S51, where S51 is the process of cleaning the cutting dust generated during the cutting process using the negative pressure of the laser cutting platform after the secondary cutting.

[0026] By using the negative pressure of the laser cutting platform to clean the cutting dust generated during the cutting process, subsequent cleaning procedures are reduced. During secondary cutting, the cutting will not expose a new ITO layer, and most of the residue can be eliminated through negative pressure.

[0027] The applicant proposes a laser cutting drawing for use with the above-mentioned cutting method, wherein the laser cutting drawing includes the position and cutting depth of the A-processing hole; the laser cutting drawing includes the position and shape of the dividing line of the A-processing hole; and the laser cutting drawing includes the position and shape of the secondary cutting.

[0028] Beneficial effects, eliminating ITO layer contamination: Optimizing process layout and placing the outer shape cutting afterward completely avoids laser smoke and dust contamination of the ITO layer at the silver paste holes, solving defects such as poor contact, open circuit, and abnormal display, and improving product yield.

[0029] Cost reduction and efficiency improvement: The half-ear silver paste hole structure improves the utilization rate of FPL raw materials, reduces waste of scrap materials, and effectively reduces the production cost of modules.

[0030] Good process compatibility: No need to replace existing laser cutting equipment, only adjust the cutting program, process sequence and drawings, the transformation cost is low and it can be directly adapted to existing production lines.

[0031] The product has stable performance: the conductivity of the half-ear structure is consistent with that of the traditional full-ear structure, and the electronic paper driving and display performance are not affected, resulting in high reliability.

[0032] Wide range of applications: The silver paste holes can be made into various shapes such as semi-circle, semi-rectangular, and semi-ellipse, which can be adapted to electronic paper products of different specifications.

[0033] High production efficiency: The new auxiliary processes are simple and the overall production cycle is basically the same as that of traditional processes, without affecting the production line capacity. Attached Figure Description

[0034] Figure 1 This is a schematic diagram of embodiment 1 of the electronic paper component; Figure 2 This is a partial cross-sectional view of the electronic paper assembly; Figure 3 This is a schematic diagram of embodiment 2 of the electronic paper component; Figure 4 This is a schematic diagram of embodiment 3 of the electronic paper component; Figure 5 This is a schematic diagram of the electronic paper assembly in each step of the laser cutting method for electronic paper assemblies in the prior art; Figure 6 This is a schematic diagram of the electronic paper assembly in each step of the laser cutting method for electronic paper assemblies in this application. Detailed Implementation

[0035] The embodiments of this application will be further described in detail below with reference to the accompanying drawings.

[0036] It should be noted that the following description of preferred embodiments of this application does not constitute any limitation on this application. The description of preferred embodiments is merely an illustration of the general principles of this application. The embodiments described in this application are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0037] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the equipment or component referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first," "second," and technical features numbered with Arabic numerals 1, 2, 3, etc., and designations such as "A" and "B," are used for descriptive purposes only, for ease of explanation, and do not represent a temporal or spatial order; they should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first," "second," and numbered with Arabic numerals 1, 2, 3, etc., may explicitly or implicitly include one or more of that feature. In the description of this application, "several" means two or more, unless otherwise expressly and specifically defined.

[0038] like Figure 1 Example 1 of an electronic paper component.

[0039] like Figure 1 As shown, in this embodiment of the electronic paper assembly, it includes an electronic ink capsule layer 1010 and an ITO transparent conductive layer 1020. The electronic ink capsule layer includes an electronic ink capsule film, and the ITO transparent conductive layer includes a transparent substrate. An ITO transparent common electrode film is deposited on the transparent substrate. The electronic paper assembly is cut to form an outer edge according to the applicable product. It includes at least one unclosed silver paste hole 1021, which is used to fill conductive silver paste. The unclosed silver paste hole is formed by the outer edge breaking through a closed silver paste hole. The silver paste hole penetrates the electronic ink layer. The silver paste hole does not penetrate the ITO transparent conductive layer.

[0040] Figure 2 A cross-sectional schematic diagram of Example 1. Figure 2 The electronic ink capsule layer 1010 and the ITO transparent conductive layer 1020 are processed into a whole by the upstream manufacturer. In electronic paper products, when viewed from below the screen, the electronic ink capsule layer 1010 is below the ITO transparent conductive layer.

[0041] FPL (Film-Plastic Composite) components in electronic paper products are generally formed by cutting large FPL sheets. However, FPL cutting requires advanced technology, making it difficult for ordinary manufacturers to process. After years of observation and experimentation, the applicant has verified that having specialized cutting manufacturers produce FPL components into market-standard parts can significantly improve industry efficiency. Centralizing the master film cutting process to a single manufacturer can drastically reduce overall industry costs and increase efficiency. By making the silver paste holes into semi-perforated holes, the area of ​​the FPL component can be reduced, increasing the utilization rate of the master film.

[0042] Figure 3 , Schematic diagram of Example 2. Figure 4 , Schematic diagram of Example 3. Figure 1 In the middle, the silver paste hole is semi-circular. Figure 3 In the middle, the silver paste hole is semi-elliptical. Figure 4 In the middle, the silver paste hole is a semi-rectangular shape.

[0043] Making the silver paste holes semi-circular makes them easier to process; making them half-rectangular or half-elliptical can reduce the height of the silver paste holes and improve the utilization rate of the mother film.

[0044] The electronic paper component may include two silver-painted vias, symmetrically distributed on the left and right sides. Adding two silver-painted vias provides redundant connections and improves product performance.

[0045] like Figure 5 A schematic diagram of the cutting steps for an electronic paper assembly with two silver paste holes in the prior art.

[0046] In step A10, the via is cut using a laser. The via only cuts the electronic ink capsule layer, not the ITO transparent conductive layer. In step A20, the broken debris and cut via waste are removed through cleaning. In step A30, the edge lines are cut according to product design requirements after cleaning. In the complete product process, the product edge lines do not cut the vias. For example, with via 5010, the edge cutting lines do not cut the exposed ITO layer and do not contaminate it.

[0047] Figure 6 The diagram illustrates the cutting steps of an electronic paper assembly with two silver-painted semi-holes. It includes the following steps: Step S10: Placing the electronic paper motherboard onto a laser cutting device; the electronic paper motherboard comprises an electronic ink encapsulation layer and an ITO transparent conductive layer; Step S20: On the electronic paper motherboard, at least two A-processing holes 6010 are partially cut out using a laser. The A-processing holes penetrate the electronic ink layer but do not penetrate the ITO transparent conductive layer. Step S30: On the electronic paper motherboard, a laser is used to partially cut out the A-processing hole dividing line 6020, which divides the A-processing hole into two half-holes. The two ends of the A-processing hole dividing line extend beyond the boundary of the A-processing hole. The A-processing hole dividing line penetrates the electronic ink capsule layer and the ITO transparent conductive layer. Step S50: Perform a secondary cut on the FPL motherboard to form the overall product shape. The cut line 6030 formed by the cut is shown in the figure. Two or more electronic paper components are divided on the FPL motherboard. The A processing hole dividing line is not cut a second time.

[0048] Through secondary cutting, the debris generated by the second cutting will not enter the ITO transparent conductive layer 6031 exposed by the first cutting. The two ends of the dividing line of the A-processing hole extend beyond the boundary of the A-processing hole, making the distance of the second cutting far away from the A-processing hole, so that debris is less likely to jump into the interior of the A-processing hole.

[0049] In some embodiments, a protective film is covered on the electronic paper motherboard; step S20 is followed by step S21, where the protective film on the electronic paper motherboard is removed. By removing the protective film, the debris generated during the first cutting can be removed.

[0050] In some embodiments, a protective film is covered on the electronic paper motherboard; step S30 is followed by step S22, S22: cleaning the exposed ITO layer corresponding to the A machining hole; the cleaning uses a special cleaning solvent to remove cutting dust, smoke residue and impurities.

[0051] By cleaning, the debris generated during the first cut is removed, improving product performance. During the second cut, the cutting line is kept away from the A machining hole, preventing contamination of the exposed ITO layer.

[0052] In some embodiments, step S50 is followed by step S60, whereby a PS protective layer is applied to the segmented electronic paper assembly.

[0053] In some embodiments, step S50 is followed by step S52, where a temporary protective film is applied to the segmented electronic paper assembly.

[0054] By covering the electronic paper components with a temporary protective film, they can be sold as standalone products directly to downstream manufacturers, protecting them from contamination during handling and storage.

[0055] In some embodiments, step S50 is followed by step S51, where S51: after the secondary cutting, the cutting dust generated during the cutting process is cleaned by the negative pressure of the laser cutting platform.

[0056] By using the negative pressure of the laser cutting platform to clean the cutting dust generated during the cutting process, subsequent cleaning procedures are reduced. During secondary cutting, the cutting will not expose a new ITO layer, and most of the residue can be eliminated through negative pressure.

[0057] A laser cutting drawing for use in the above-mentioned cutting method, the laser cutting drawing includes the position or cutting depth of the A-processing hole; the laser cutting drawing includes the position and shape of the dividing line of the A-processing hole; the laser cutting drawing includes the position and shape of the secondary cutting.

[0058] As shown in the accompanying drawings, these are merely embodiments of this application and do not limit the scope of this patent application. Any equivalent structural or procedural transformations made using the content of the application specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of this application.

Claims

1. An electronic paper component, characterized in that, It includes an electronic ink capsule layer and an ITO transparent conductive layer. The electronic ink capsule layer includes an electronic ink capsule film, and the ITO transparent conductive layer includes a transparent substrate. An ITO transparent common electrode film is included on the transparent substrate. The electronic paper component is cut to form its outer edge according to the applicable product; It includes at least one unclosed silver paste hole for filling with conductive silver paste, the unclosed silver paste hole being formed by the outer edge breaking through a closed silver paste hole; The silver paste holes penetrate the electronic ink layer; The silver paste holes do not penetrate the ITO transparent conductive layer.

2. The electronic paper assembly as claimed in claim 1, characterized in that, The silver paste holes are semi-circular, semi-rectangular, or semi-elliptical.

3. The electronic paper assembly as described in claim 1, characterized in that, The electronic paper component includes two silver paste holes, which are symmetrically distributed on the left and right sides.

4. A laser cutting method for an electronic paper assembly, used to generate the electronic paper assembly according to any one of claims 1 to 3, characterized in that, Includes the following steps: S10: Place the electronic paper master board onto the laser cutting equipment; the electronic paper master board includes an electronic ink capsule layer and an ITO transparent conductive layer; S20: On the electronic paper motherboard, at least two A-processing holes are partially cut out using a laser. The A-processing holes penetrate the electronic ink layer but do not penetrate the ITO transparent conductive layer. S30: On the electronic paper motherboard, a laser is used to partially cut out the A-processing hole dividing line, which divides the A-processing hole into two half-holes. The two ends of the A-processing hole dividing line extend beyond the boundary of the A-processing hole. The A-processing hole dividing line penetrates the electronic ink capsule layer and the ITO transparent conductive layer. S50: Perform secondary cutting on the FPL motherboard to cut the overall product shape, and divide the FPL motherboard into two or more electronic paper components, without performing secondary cutting on the A processing hole dividing line.

5. The laser cutting method for electronic paper components according to claim 4, characterized in that, A protective film is applied to the electronic paper motherboard; step S20 is followed by step S21. S21: Remove the protective film from the electronic paper motherboard.

6. The laser cutting method for electronic paper components according to claim 4, characterized in that, A protective film is applied to the electronic paper motherboard; step S30 is followed by step S22. S22: Clean the exposed ITO layer corresponding to the A machining hole; the cleaning uses a special cleaning solvent to remove cutting dust, smoke residue and impurities.

7. The laser cutting method for electronic paper components according to claim 4, characterized in that, Step S50 is followed by step S60. S60: Cover the segmented electronic paper assembly with a PS protective layer.

8. The laser cutting method for electronic paper components according to claim 4, characterized in that, Step S50 is followed by step S52. S52: Cover the segmented electronic paper assembly with a temporary protective film.

9. The laser cutting method for electronic paper components according to claim 4, characterized in that, Step S50 is followed by step S51. S51: After the second cut, the cutting dust generated during the cutting process is cleaned by the negative pressure of the laser cutting platform.

10. A laser-cut drawing applied to the cutting method according to any one of claims 4-9, characterized in that, The laser cutting drawing includes the location or cutting depth of the machining hole A; The laser cutting drawing includes the position and shape of the dividing line of the A machining hole; The laser cutting drawing includes the location and shape of the secondary cut.

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