Mask plate surface shape adjusting apparatus and mask plate surface shape adjusting method

Abstract

The application provides a mask plate surface type adjusting device and a mask plate surface type adjusting method, and relates to the field of photoetching technology. The mask plate surface type adjusting device comprises a wafer fixing module, a suction cup, a detection module, a position adjusting module and a surface type adjusting module. The wafer fixing module is used for placing a wafer. The suction cup is arranged opposite to the wafer fixing module and is used for adsorbing a mask plate to be adjusted. The detection module is used for emitting a detection laser signal to the mask plate to be adjusted and receiving a target laser signal reflected by the mask plate to be adjusted, so as to obtain surface type data of the mask plate to be adjusted. The position adjusting module is connected with the detection module and is used for controlling the detection module to move according to a target emission position and a target scanning path. The surface type adjusting module is used for receiving the surface type data sent by the detection module and adjusting the surface type of the mask plate to be adjusted according to the surface type data, so as to realize high-precision surface type regulation and control and improve exposure precision.

Description

Technical Field

[0001] This application relates to the field of photolithography technology, and more specifically, to a photomask surface shape adjustment device and a photomask surface shape adjustment method. Background Technology

[0002] During the photolithography process, the distance between the wafer and the photomask (i.e., the depth of focus) will affect the exposure accuracy. If the flatness of the photomask surface is low, it is difficult to control the distance between the wafer and the photomask (i.e., the depth of focus), which will lead to a reduction in the linewidth accuracy and overlay accuracy of the exposure. Summary of the Invention

[0003] In order to at least overcome the above-mentioned deficiencies in the prior art, the purpose of this application is to provide a mask template surface adjustment device and a mask template surface adjustment method.

[0004] In a first aspect, embodiments of this application provide a mask template shape adjustment device, the mask template shape adjustment device comprising: A wafer fixing module, wherein the wafer fixing module is used to place a wafer; A suction cup is disposed opposite to the wafer fixing module. The suction cup is used to adsorb a mask template to be adjusted. The mask template to be adjusted is located on the side of the suction cup closer to the wafer. The mask template to be adjusted includes a mask pattern area. The detection module is located on the side of the wafer fixing module away from the chuck. The detection module is used to emit a detection laser signal to the mask to be adjusted and receive the target laser signal reflected by the mask to be adjusted in order to obtain the surface data of the mask to be adjusted. A position adjustment module is connected to the detection module, and the position adjustment module is used to control the movement of the detection module according to the target launch position and the target scanning path; A surface shape adjustment module is connected to the suction cup. The surface shape adjustment module is used to receive surface shape data sent by the detection module and adjust the surface shape of the mask to be adjusted according to the surface shape data to obtain the target mask.

[0005] In one possible implementation, the mask surface adjustment device further includes an angle adjustment module connected to the detection module, which is used to adjust the emission angle of the detection laser signal.

[0006] In one possible implementation, the detection module includes multiple micro-displacement sensors arranged in an array; each micro-displacement sensor includes a laser emitting unit and a signal receiving probe; the laser emitting unit is used to emit the detection laser signal to the mask to be adjusted, and the signal receiving probe is used to receive the target laser signal reflected by the mask to be adjusted, so as to obtain the surface data of the mask to be adjusted.

[0007] In one possible implementation, the wafer fixing module is provided with at least one transmission window; the detection module is used to emit the detection laser signal to the mask to be adjusted through the transmission window of the wafer fixing module.

[0008] In one possible implementation, the suction cup includes a vacuum suction cup, and the surface of the suction cup facing the wafer fixing module is provided with a plurality of adsorption holes, which are evenly distributed for fixing the mask to be adjusted by vacuum adsorption.

[0009] Secondly, embodiments of this application also provide a method for adjusting the surface shape of a photomask, wherein the method is applied to the photomask surface shape adjustment device described in any of the above aspects, and the method includes: A wafer is provided, and the wafer is placed on a wafer fixing module; A mask template to be adjusted is provided, the mask template to be adjusted includes a mask pattern area; the mask template to be adjusted is disposed on the side of the chuck close to the wafer, the chuck is disposed opposite to the wafer fixing module; The target emission position and target scanning path are obtained. Based on the target emission position and target scanning path, the detection module is controlled to move through the position adjustment module, so that the detection module emits a detection laser signal towards the mask to be adjusted. The detection module receives the target laser signal reflected by the mask to be adjusted to obtain the surface data of the mask to be adjusted. The surface shape of the mask to be adjusted is adjusted using the surface shape adjustment module based on the surface shape data to obtain the target mask.

[0010] In one possible implementation, the steps of obtaining the target launch position and the target scanning path include: The scanning direction is determined based on the shape of the mask pattern area, and the stepping direction and stepping distance of the position adjustment module are determined based on the preset data acquisition density. A target scanning path is generated based on the scanning direction, the stepping direction, and the stepping distance; The target emission position is determined based on the size of the mask pattern area, the position of the mask pattern area, and the scanning path.

[0011] In one possible implementation, the detection module includes a plurality of micro-displacement sensors arranged in an array; the micro-displacement sensors include a laser emitting unit and a signal receiving probe; The step of controlling the detection module to move according to the target emission position and the target scanning path via the position adjustment module, so that the detection module emits a detection laser signal toward the mask to be adjusted, includes: Based on the target emission position and the target scanning path, the position adjustment module controls the movement of multiple laser emission units, causing the multiple laser emission units to emit detection laser signals toward the mask to be adjusted; The step of receiving the target laser signal reflected by the mask to be adjusted through the detection module to obtain the surface data of the mask to be adjusted includes: Multiple signal receiving probes are used to receive multiple target laser signals reflected by the mask to be adjusted, so as to obtain the surface shape data of the mask to be adjusted.

[0012] In one possible implementation, the mask template shape adjustment device further includes an angle adjustment module, which is connected to the detection module; Before the step of controlling the detection module to move according to the target emission position and the target scanning path via the position adjustment module, so that the detection module emits a detection laser signal toward the mask to be adjusted, the method further includes: The position adjustment module and the surface adjustment module are calibrated for accuracy based on preset conditions. The emission angle of the detection module is adjusted by the angle adjustment module so that the emission direction of the detection laser signal is perpendicular to the plane of the mask to be adjusted. The wafer fixing module is controlled to remain stationary relative to the position adjustment module.

[0013] In one possible implementation, after adjusting the surface shape of the mask to be adjusted using a surface shape adjustment module based on the surface shape data to obtain the target mask, the method further includes: The spacing between the wafer and the target mask is adjusted, and the wafer is exposed to form a target graphic area on the wafer surface that corresponds to the mask pattern area.

[0014] Based on any of the above aspects, the mask surface shape adjustment device and mask surface shape adjustment method provided in this application embodiment can detect the surface shape information of the mask to be adjusted in real time through the coordinated cooperation of the detection module and the position adjustment module, and send the surface shape information to the surface shape adjustment module so that the surface shape adjustment module can adjust the surface shape of the mask to be adjusted, thereby achieving high-precision surface shape control, which is beneficial to improving the line width accuracy and overlay accuracy of exposure. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings required in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is one of the structural schematic diagrams of the mask template surface shape adjustment device provided in this embodiment; Figure 2 This is the second schematic diagram of the mask template surface shape adjustment device provided in this embodiment; Figure 3 This is the third schematic diagram of the mask template surface shape adjustment device provided in this embodiment; Figure 4 This is one of the flowcharts illustrating the mask template surface shape adjustment method provided in this embodiment; Figure 5 This is a schematic diagram of the sub-steps of step S130 provided in this embodiment; Figure 6 A schematic diagram of the target scanning path provided in this embodiment; Figure 7 This is the second flowchart illustrating the mask template surface shape adjustment method provided in this embodiment.

[0017] Icons: 100-Wafer fixing module; 110-Transmission window; 200-Suction cup; 300-Detection module; 400-Position adjustment module; 410-Macro stage; 420-Micro stage; 500-Surface shape adjustment module; 600-Measurement platform; 700-Angle adjustment module; 800-Mask to be adjusted; 810-Mask pattern area. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0019] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0020] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0021] In the description of this application, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In addition, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0022] Furthermore, terms such as "horizontal," "vertical," and "sag" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal relative to "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0023] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0024] It should be noted that, where there is no conflict, different features in the embodiments of this application can be combined with each other.

[0025] The inventors discovered that in nanoimprint lithography, contact lithography, or proximity lithography processes, the distance between the wafer and the photomask (i.e., the depth of focus) has a significant impact on exposure accuracy. The distance between the wafer and the photomask (i.e., the depth of focus) is typically only tens of nanometers. Due to deviations that can occur during the processing and installation of the photomask, the flatness of the photomask surface is reduced, which in turn affects the linewidth accuracy and overlay accuracy of the exposure.

[0026] Currently, to improve exposure accuracy, vertical or horizontal surface profile interferometers are typically used to measure the surface profile of the photomask in order to adjust the distance (depth of focus) between the wafer and the photomask in real time. However, these interferometers are bulky and difficult to install in existing lithography equipment. Furthermore, the photomask is usually oriented downwards, further increasing the measurement difficulty. As a result, it is impossible to accurately obtain the surface profile data of the photomask, which further increases the difficulty of control during the exposure process and directly affects the lithography accuracy.

[0027] In view of this, this embodiment provides a solution to the above problems, and the solution provided in this embodiment will be described in detail below.

[0028] Please refer to Figure 1 , Figure 1 Example: A schematic diagram of the structure of the mask surface adjustment device provided in this embodiment. The mask surface adjustment device may include a wafer fixing module 100, a suction cup 200, a detection module 300, a position adjustment module 400, and a surface adjustment module 500.

[0029] The suction cup 200 is positioned opposite the wafer fixing module 100. The wafer fixing module 100 is used to place the wafer, and the suction cup 200 is used to attach the mask 800 to be adjusted. The mask 800 to be adjusted can be located on the side of the suction cup 200 closer to the wafer, and the mask 800 to be adjusted can include a mask pattern area 810. The wafer can be positioned above the wafer fixing module 100, and the mask 800 to be adjusted can be positioned below the suction cup 200; their relative positioning allows for alignment and exposure.

[0030] In addition, the wafer fixing module 100 can also be used to adjust the position of the wafer so that the plane on which the wafer is located is parallel to the plane on which the mask 800 to be adjusted is located. Specifically, the wafer fixing module 100 can control the wafer to achieve six degrees of freedom of motion adjustment, including translation along the X, Y, and Z axes and rotation around the X, Y, and Z axes, thereby accurately compensating for the alignment error between the wafer and the mask 800 to be adjusted.

[0031] Please refer to Figure 2The detection module 300 can be located on the side of the wafer fixing module 100 away from the suction cup 200. The detection module 300 can be used to emit detection laser signals to the mask 800 to be adjusted and receive the target laser signals reflected by the mask 800 to obtain the surface data of the mask 800 to be adjusted.

[0032] In this embodiment, the detection module 300 can emit a detection laser signal to the surface of the mask 800 to be adjusted facing the wafer side, and receive the target laser signal reflected back from the surface. By analyzing the target laser signal, the surface profile data of the mask 800 to be adjusted can be obtained. After obtaining the surface profile data, the detection module 300 can transmit the surface profile data to the surface profile adjustment module 500.

[0033] Please refer to this again. Figure 1 The position adjustment module 400 can be connected to the detection module 300, and the position adjustment module 400 can be used to control the movement of the detection module 300 according to the target launch position and the target scanning path.

[0034] In this embodiment, the target emission position and target scanning path can be determined first according to the measurement requirements. Then, the position adjustment module 400 controls the detection module 300 to move to the target emission position and scans the mask 800 to be adjusted point by point along the target scanning path to obtain the surface data of the mask 800 to be adjusted. The position adjustment module 400 may include a macro stage 410 and a micro stage 420. The micro stage 420 is located on the side of the macro stage 410 close to the wafer fixing module 100, and the macro stage 410 and the micro stage 420 are fixedly connected to realize the movement of the detection module 300 in the X-axis and Y-axis directions.

[0035] In addition, the detection module 300 is rigidly connected to the position adjustment module 400 and does not contact the wafer fixing module 100. Therefore, the six-degree-of-freedom motion adjustment of the wafer fixing module 100 can be avoided from interfering with the detection module 300.

[0036] The surface shape adjustment module 500 is connected to the suction cup 200. The surface shape adjustment module 500 can be used to receive surface shape data sent by the detection module 300 and adjust the surface shape of the mask template 800 to be adjusted according to the surface shape data to obtain the target mask template.

[0037] In this embodiment, the surface shape adjustment module 500 can be located above the suction cup 200. The suction cup 200 and the surface shape adjustment module 500 can be rigidly connected through the first connector. After receiving the surface shape data sent by the detection module 300, the surface shape adjustment module 500 can adjust the surface shape of the mask 800 to be adjusted so that it meets the preset flatness requirements, thereby facilitating the adjustment of the spacing between the target mask and the wafer. It has the advantages of miniaturization, modularity, and real-time measurement.

[0038] Additionally, the mask profile adjustment device may also include a measurement platform 600, which may be located on the side of the chuck 200 away from the wafer fixing module 100, for mounting the profile adjustment module 500. The profile adjustment module 500 can be fixedly mounted on the surface of the measurement platform 600 away from the chuck 200 via a second connector.

[0039] Based on the above design, in the mask shape adjustment device provided in this embodiment, through the coordinated cooperation of the detection module 300 and the position adjustment module 400, the shape information of the mask 800 to be adjusted can be detected in real time, and the shape information is sent to the shape adjustment module 500, so that the shape adjustment module 500 adjusts the shape of the mask 800 to be adjusted, thereby achieving high-precision shape control, which is beneficial to improving the line width accuracy and overlay accuracy of exposure.

[0040] In one possible implementation, the mask surface adjustment device may further include an angle adjustment module 700, which is connected to the detection module 300 and can be used to adjust the emission angle of the detection laser signal.

[0041] In this embodiment, the detection module 300 can be fixedly installed with the angle adjustment module 700 through the third connector. The angle adjustment module 700 can be a two-degree-of-freedom adjustment mechanism, which is used to control the laser emission port of the detection module 300 to rotate along the X-axis and Y-axis directions, so that the emission direction of the detection laser signal emitted by the detection module 300 can be perpendicular to the plane where the mask to be detected is located.

[0042] In one possible implementation, the detection module 300 may include a plurality of micro-displacement sensors arranged in an array. The micro-displacement sensors may include a laser emitting unit and a signal receiving probe. The laser emitting unit may be used to emit a detection laser signal to the mask 800 to be adjusted, and the signal receiving probe may be used to receive the target laser signal reflected by the mask 800 to obtain the surface data of the mask 800 to be adjusted.

[0043] In this embodiment, to improve data acquisition efficiency, multiple micro-displacement sensors can be used to perform multi-point synchronous detection on the mask 800 to be adjusted, and these sensors can be fixed in an array to increase the scanning range. The micro-displacement sensors can be picometer sensors, or other high-precision laser-based displacement sensors, optical displacement sensors, etc.

[0044] In some examples, the detection module 300 may include three micro-displacement sensors arranged in a straight line. When performing surface shape detection on the mask 800 to be adjusted, the three micro-displacement sensors move synchronously to acquire surface shape data of the mask 800. The arrangement direction of the three micro-displacement sensors may be perpendicular to the scanning direction.

[0045] In other examples, the detection module 300 may include four micro-displacement sensors arranged in a rectangular array. When the surface of the mask 800 to be adjusted is detected, the four micro-displacement sensors move synchronously to collect surface data of the mask 800 to be adjusted.

[0046] It should be noted that the specific number and arrangement of the multiple micro-displacement sensors in the detection module 300 can be adapted to the actual detection accuracy requirements and the size of the mask, and no specific limitation is made here.

[0047] In one possible implementation, please refer to Figure 3 The wafer fixing module 100 is provided with at least one transmission window 110, and the detection module 300 can be used to emit a detection laser signal to the mask 800 to be adjusted through the transmission window 110 of the wafer fixing module 100.

[0048] In this embodiment, the wafer fixing module 100 may include one or more transmission windows 110. The wafer fixing module 100 may be rectangular in shape. When the wafer fixing module 100 includes one transmission window 110, the transmission window 110 may be located at any one of the four corner positions of the wafer fixing module 100. When the wafer fixing module 100 includes four transmission windows 110, the four transmission windows 110 may be located at the four corner positions of the wafer fixing module 100, respectively. The transmission window 110 has a through-hole structure, allowing the detection laser signal to pass through and illuminate the surface of the mask 800 to be adjusted.

[0049] When the detection module 300 includes multiple micro-displacement sensors, the multiple micro-displacement sensors can send detection laser signals through the same transmission window 110 on the wafer fixing module 100.

[0050] In one possible implementation, the suction cup 200 may include a vacuum suction cup 200. The surface of the suction cup 200 facing the wafer fixing module 100 is provided with a plurality of adsorption holes. The plurality of adsorption holes are evenly distributed and are used to fix the mask template 800 to be adjusted by vacuum adsorption.

[0051] In this embodiment, when the mask template 800 to be adjusted is installed on the mask template surface adjustment device, the suction cup 200 can adsorb and fix the mask template 800 through the adsorption holes, ensuring its stable position and no loosening. During the adsorption process, the vacuum system is activated, and air is drawn through the adsorption holes to form a negative pressure, thereby achieving a firm adsorption of the mask template 800 to be adjusted. To avoid deformation of the mask template 800 due to local stress concentration, the adsorption holes can be evenly distributed in an array to make the adsorption force distribution more balanced. At the same time, the adsorption force of the suction cup 200 can be adjusted according to the material and thickness of the mask template 800 to increase the reliability of the fixation of the mask template 800.

[0052] It should be noted that the number and shape of the adsorption pores can be adjusted according to actual needs, and no specific limitations are made here.

[0053] This application also provides a method for adjusting the surface shape of a mask template. This method can be applied to the mask template surface shape adjustment device provided in this embodiment. Please refer to... Figure 4 The mask template surface adjustment method may include the following steps.

[0054] Step S110: Provide a wafer and place the wafer on the wafer fixing module 100.

[0055] In this embodiment, the wafer can be fixed above the wafer fixing module 100, and the position of the wafer can be adjusted by the wafer fixing module 100.

[0056] Step S120: Provide a mask template 800 to be adjusted, the mask template 800 including a mask pattern area 810; place the mask template 800 to be adjusted on the side of the suction cup 200 close to the wafer, the suction cup 200 being disposed opposite to the wafer fixing module 100.

[0057] In this embodiment, the suction cup 200 is arranged opposite to the wafer fixing module 100. The suction cup 200 can be used to adsorb the mask 800 to be adjusted, so that the mask 800 to be adjusted is located above the wafer, ensuring that the mask 800 to be adjusted remains stable during the detection and adjustment process.

[0058] After the wafer and the mask 800 to be adjusted are installed sequentially, the position of the wafer can be adjusted by the wafer fixing module 100 so that the plane on which the wafer is located is parallel to the plane on which the mask 800 to be adjusted is located. Specifically, the wafer fixing module 100 can control the wafer to achieve six degrees of freedom of motion adjustment, including translation along the X, Y, and Z axes and rotation around the X, Y, and Z axes.

[0059] Step S130: Obtain the target emission position and target scanning path. Based on the target emission position and target scanning path, control the detection module 300 to move through the position adjustment module 400, so that the detection module 300 emits a detection laser signal toward the mask template 800 to be adjusted.

[0060] In this embodiment, the target emission position and target scanning path of the detection laser signal can be obtained first. Then, based on the target emission position and target scanning path, the position adjustment module 400 is controlled to move the detection module 300 to the target emission position, so that the detection module 300 starts to emit the detection laser signal to the mask 800 to be adjusted and scans along the target scanning path.

[0061] Step S140: The detection module 300 receives the target laser signal reflected by the mask 800 to be adjusted, so as to obtain the surface data of the mask 800 to be adjusted.

[0062] In this embodiment, during the process of the position adjustment module 400 controlling the detection module 300 to move along the target scanning path, the detection module 300 can receive the target laser signal reflected by the mask 800 to be adjusted, and calculate the height information of each point on the surface of the mask 800 to be adjusted based on the target laser signal to obtain the surface data of the mask 800 to be adjusted. Then, it draws a cloud map based on the surface data for visualization processing, and transmits the surface data to the surface adjustment module 500.

[0063] Step S150: Adjust the surface shape of the mask template 800 to be adjusted according to the surface shape data through the surface shape adjustment module 500 to obtain the target mask template.

[0064] In this embodiment, the surface shape adjustment module 500 can receive surface shape data sent by the detection module 300, and adjust the surface shape of the mask template 800 to be adjusted according to the surface shape data, thereby obtaining the target mask template.

[0065] In addition, the wafer fixing module 100 can also correct the position of the wafer based on the surface data detected by the detection module 300, so that the plane on which the wafer is located is parallel to the plane on which the target mask is located.

[0066] In the above design, by integrating the detection module 300 into the exposure equipment, the surface profile information of the mask 800 to be adjusted can be measured online in real time. It has the advantages of miniaturization, modularity, and real-time measurement. At the same time, the surface profile adjustment module 500 can be controlled to adjust the surface profile of the mask 800 to be adjusted according to the surface profile information of the mask 800, so as to improve the line width accuracy and overlay accuracy of the exposure.

[0067] In one possible implementation, please refer to Figure 5 When obtaining the target launch position and target scanning path, step S130 may include the following sub-steps.

[0068] Step S131: Determine the scanning direction based on the shape of the mask pattern area 810, and determine the stepping direction and stepping distance of the position adjustment module 400 based on the preset data acquisition density.

[0069] Step S132: Generate a target scanning path based on the scanning direction, the stepping direction, and the stepping distance.

[0070] Step S133: Determine the target emission position based on the size of the mask pattern area 810, the position of the mask pattern area 810, and the scanning path.

[0071] In this embodiment, the detection module 300 may include multiple micro-displacement sensors arranged in an array. First, the scanning direction of the detection module 300 is determined based on the shape of the mask pattern region 810 and the arrangement and orientation of the multiple micro-displacement sensors. Then, the stepping direction and stepping distance of the position adjustment module 400 are determined based on a preset data acquisition density. This generates a target scanning path using the scanning direction, stepping direction, and stepping distance, and the target scanning path is transmitted to the position adjustment module 400. Finally, the target exit position d0(x0, y0) can be determined based on the size of the mask pattern region 810, the position of the mask pattern region 810, and the scanning path. The target exit position is typically located at a corner of the mask pattern region 810.

[0072] During the data acquisition process via the detection module 300, the density and accuracy of the data acquisition will affect the surface shape adjustment accuracy and efficiency of the mask 800 to be adjusted. The density and accuracy of the data acquisition are usually determined by the stepping direction and stepping distance of the position adjustment module 400. If the data acquisition density is higher, the surface shape adjustment accuracy is higher, but the efficiency is lower. Therefore, the data acquisition density can be preset according to actual needs.

[0073] In one possible implementation, the detection module 300 may include a plurality of micro-displacement sensors arranged in an array, and the micro-displacement sensors may include a laser emitting unit and a signal receiving probe.

[0074] In step S130, when the detection module 300 is moved by the position adjustment module 400 according to the target emission position and the target scanning path, so that the detection module 300 emits a detection laser signal toward the mask 800 to be adjusted, multiple laser emitting units can be moved by the position adjustment module 400 according to the target emission position and the target scanning path, so that multiple laser emitting units emit detection laser signals toward the mask 800 to be adjusted.

[0075] In this embodiment, multiple laser emitting units can be controlled simultaneously to perform uniform scanning motion via the position adjustment module 400, based on the target emission position and target scanning path. Please refer to... Figure 6 In some examples, the position adjustment module 400 can first control multiple laser emitting units to move in the positive direction of the Y-axis according to the scanning distance. When they move to the edge of the mask pattern area 810, the position adjustment module 400 can control multiple laser emitting units to move in the negative direction of the X-axis according to the step distance, and then move in the negative direction of the Y-axis until the scanning is completed.

[0076] In other examples, the position adjustment module 400 can also control multiple laser emitting units to perform scanning motions in the X and Y directions along the centerline of the mask 800 to be adjusted and collect data.

[0077] In step S140, when the detection module 300 receives the target laser signal reflected by the mask 800 to be adjusted in order to obtain the surface data of the mask 800, multiple signal receiving probes can be used to receive multiple target laser signals reflected by the mask 800 to be adjusted in order to obtain the surface data of the mask 800.

[0078] Specifically, after the position adjustment module 400 controls the detection module 300 to move to the target emission position, causing the detection module 300 to begin emitting detection laser signals towards the mask template 800 to be adjusted, multiple signal receiving probes can begin taking readings, and record the readings (x0, y0, z0) obtained at the target emission position, (x... 0+u y0, z 0+u ), (x 0-u y0, z 0-u Set the value to zero, and then collect data (x) during the scanning motion. i y i , z i ), (x i+u y0, z i+u ), (x i-u y i , z i-uThe collected data is processed to obtain the surface profile data of the mask 800 to be adjusted. Here, u can represent the spacing between adjacent signal receiving probes.

[0079] In one possible implementation, the mask surface adjustment device may further include an angle adjustment module 700, which is connected to the detection module 300.

[0080] Please refer to Figure 7 Before step S130, test preparation work is required. The mask surface adjustment method may also include the following steps.

[0081] Step S210: Accuracy calibration of the position adjustment module 400 and the surface adjustment module 500 based on preset conditions.

[0082] In step S220, the emission angle of the detection module 300 is adjusted by the angle adjustment module 700 so that the emission direction of the detection laser signal is perpendicular to the plane of the mask 800 to be adjusted.

[0083] Step S230: Control the wafer fixing module 100 to remain stationary relative to the position adjustment module 400.

[0084] In this embodiment, the position adjustment module 400 can be leveled and calibrated in the X and Y directions, and the straightness and Z-direction axial movement values ​​can be adjusted to the required accuracy according to engineering requirements; and the flatness of the surface adjustment module 500 can be adjusted to the required accuracy according to engineering requirements; then, the laser emission ports of multiple micro-displacement sensors can be adjusted to be parallel through the angle adjustment module, and the extension direction of multiple laser emission ports can be parallel to the plane where the mask 800 to be adjusted is located; finally, the micro-motion stage 420 in the position adjustment module 400 and the wafer fixing module 100 are controlled in a closed-loop control state, so that the wafer fixing module 100 remains stationary relative to the micro-motion stage 420.

[0085] In one possible implementation, after the surface shape of the mask to be adjusted 800 is adjusted by the surface shape adjustment module 500 according to the surface shape data to obtain the target mask, the spacing between the wafer and the target mask can also be adjusted, and the wafer can be exposed to form a target graphic area corresponding to the mask pattern area 810 on the wafer surface.

[0086] In this embodiment, after the surface shape of the mask 800 to be adjusted is adjusted, the spacing between the wafer and the target mask can be adjusted to achieve wafer exposure.

[0087] In summary, this embodiment provides a mask surface shape adjustment device and a mask surface shape adjustment method. Through the coordinated cooperation of the detection module and the position adjustment module, the surface shape information of the mask to be adjusted can be detected in real time, and the surface shape information can be sent to the surface shape adjustment module, so that the surface shape adjustment module can adjust the surface shape of the mask to be adjusted, thereby achieving high-precision surface shape control, which is beneficial to improving the line width accuracy and overlay accuracy of exposure.

[0088] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0089] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A mask template surface shape adjustment device, characterized in that, The mask template shape adjustment device includes: A wafer fixing module, wherein the wafer fixing module is used to place a wafer; A suction cup is disposed opposite to the wafer fixing module. The suction cup is used to adsorb a mask template to be adjusted. The mask template to be adjusted is located on the side of the suction cup closer to the wafer. The mask template to be adjusted includes a mask pattern area. The detection module is located on the side of the wafer fixing module away from the chuck. The detection module is used to emit a detection laser signal to the mask to be adjusted and receive the target laser signal reflected by the mask to be adjusted in order to obtain the surface data of the mask to be adjusted. A position adjustment module is connected to the detection module, and the position adjustment module is used to control the movement of the detection module according to the target launch position and the target scanning path; A surface shape adjustment module is connected to the suction cup. The surface shape adjustment module is used to receive surface shape data sent by the detection module and adjust the surface shape of the mask to be adjusted according to the surface shape data to obtain the target mask.

2. The mask template surface adjustment device according to claim 1, characterized in that, The mask surface adjustment device further includes an angle adjustment module, which is connected to the detection module and is used to adjust the emission angle of the detection laser signal.

3. The mask template surface adjustment device according to claim 1, characterized in that, The detection module includes multiple micro-displacement sensors arranged in an array; each micro-displacement sensor includes a laser emitting unit and a signal receiving probe; the laser emitting unit is used to emit the detection laser signal to the mask to be adjusted, and the signal receiving probe is used to receive the target laser signal reflected by the mask to be adjusted, so as to obtain the surface data of the mask to be adjusted.

4. The mask template surface adjustment device according to claim 1, characterized in that, The wafer fixing module is provided with at least one transmission window; the detection module is used to emit the detection laser signal to the mask to be adjusted through the transmission window of the wafer fixing module.

5. The mask template surface adjustment device according to claim 1, characterized in that, The suction cup includes a vacuum suction cup, and the surface of the suction cup facing the wafer fixing module is provided with multiple adsorption holes. The multiple adsorption holes are evenly distributed and are used to fix the mask to be adjusted by vacuum adsorption.

6. A method for adjusting the surface shape of a mask template, characterized in that, The method, applied to the mask template surface adjustment device according to any one of claims 1-5, comprises: A wafer is provided, and the wafer is placed on a wafer fixing module; A mask template to be adjusted is provided, the mask template to be adjusted includes a mask pattern area; the mask template to be adjusted is disposed on the side of the chuck close to the wafer, the chuck is disposed opposite to the wafer fixing module; The target emission position and target scanning path are obtained. Based on the target emission position and target scanning path, the detection module is controlled to move through the position adjustment module, so that the detection module emits a detection laser signal towards the mask to be adjusted. The detection module receives the target laser signal reflected by the mask to be adjusted to obtain the surface data of the mask to be adjusted. The surface shape of the mask to be adjusted is adjusted using the surface shape adjustment module based on the surface shape data to obtain the target mask.

7. The mask template surface shape adjustment method according to claim 6, characterized in that, The steps to obtain the target launch position and target scanning path include: The scanning direction is determined based on the shape of the mask pattern area, and the stepping direction and stepping distance of the position adjustment module are determined based on the preset data acquisition density. A target scanning path is generated based on the scanning direction, the stepping direction, and the stepping distance; The target emission position is determined based on the size of the mask pattern area, the position of the mask pattern area, and the scanning path.

8. The mask template surface shape adjustment method according to claim 6, characterized in that, The detection module includes multiple micro-displacement sensors arranged in an array; each micro-displacement sensor includes a laser emitting unit and a signal receiving probe. The step of controlling the detection module to move according to the target emission position and the target scanning path via the position adjustment module, so that the detection module emits a detection laser signal toward the mask to be adjusted, includes: Based on the target emission position and the target scanning path, the position adjustment module controls multiple laser emitting units to move, so that the multiple laser emitting units emit detection laser signals toward the mask to be adjusted; The step of receiving the target laser signal reflected by the mask to be adjusted through the detection module to obtain the surface data of the mask to be adjusted includes: Multiple signal receiving probes are used to receive multiple target laser signals reflected by the mask to be adjusted, so as to obtain the surface shape data of the mask to be adjusted.

9. The mask template surface shape adjustment method according to claim 6, characterized in that, The mask template shape adjustment device further includes an angle adjustment module, which is connected to the detection module; Before the step of controlling the detection module to move according to the target emission position and the target scanning path via the position adjustment module, so that the detection module emits a detection laser signal toward the mask to be adjusted, the method further includes: The position adjustment module and the surface adjustment module are calibrated for accuracy based on preset conditions. The emission angle of the detection module is adjusted by the angle adjustment module so that the emission direction of the detection laser signal is perpendicular to the plane of the mask to be adjusted. The wafer fixing module is controlled to remain stationary relative to the position adjustment module.

10. The mask template surface shape adjustment method according to claim 6, characterized in that, After adjusting the surface shape of the mask to be adjusted using the surface shape adjustment module based on the surface shape data to obtain the target mask, the method further includes: The spacing between the wafer and the target mask is adjusted, and the wafer is exposed to form a target graphic area on the wafer surface that corresponds to the mask pattern area.

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