A method and system for determining a heat inertia parameter of a pot

Abstract

The present application relates to the technical field of intelligent kitchen electrical appliances, in particular to a method and system for determining the thermal inertia parameter of a pot, the pot being applied to a stove, the stove having a controller and a heating device connected to each other, the method comprising: in response to a user cooking start instruction, controlling the heating device to heat the pot at a first preset power for a first preset time length; controlling the heating device to decrease from the first preset power to a second preset power; monitoring the bottom temperature information of the pot bottom and the corresponding time information; taking the bottom temperature information and the time information as the input of a thermal inertia prediction model to determine the thermal inertia parameter of the pot, and obtaining a target thermal inertia parameter; the present application can accurately determine the corresponding thermal inertia parameter of the pot according to the thermal inertia prediction model, the temperature information and the time information, the thermal inertia parameter directly reflecting the comprehensive effect of the pot bottom thickness, the material thermal conductivity coefficient and the heat capacity, providing accurate input basis for subsequent temperature control, and significantly improving the temperature control precision.

Description

Technical Field

[0001] This invention relates to the field of intelligent kitchen appliance technology, and in particular to a method and system for determining the thermal inertia parameters of cookware. Background Technology

[0002] Existing cooktop technologies typically employ a passive detection method based on temperature response during the heating process to identify cookware type. Specifically, during the initial heating period, a temperature acquisition unit captures temperature change data at the bottom of the cookware and calculates the temperature change over N sampling periods. This temperature fluctuation is then combined with the cooktop's current operating power and input into a pre-defined classification model or lookup table to determine the cookware type, which may include stainless steel, cast iron, earthenware, or induction cookware, among others.

[0003] However, the aforementioned existing technical solutions have significant shortcomings. First, existing technologies can only output a rough category label, such as classifying a cookware as a "stainless steel pot." However, even among stainless steel cookware, different pots exhibit orders of magnitude differences in heat capacity, thermal resistance, and heat storage capacity due to variations in bottom thickness. This difference directly determines the rate of temperature rise, temperature overshoot, and temperature control response characteristics during the heating process. Existing technologies cannot quantitatively distinguish these differences, making precise temperature control difficult. Second, existing technologies rely on the accumulation of temperature data over a long period during continuous heating, typically requiring several seconds or even tens of seconds of heating time to extract identifiable temperature fluctuation characteristics. During this process, if ingredients are added to the pot or the state of the ingredients changes, such as a decrease in water or stirring of the ingredients, the temperature fluctuation characteristics will change drastically, leading to distorted or unidentifiable cookware identification results and poor anti-interference capabilities. Summary of the Invention

[0004] To address the aforementioned technical issues, this invention utilizes a thermal inertia prediction model and the obtained temperature and time information to accurately determine the corresponding thermal inertia parameters of the cookware. These parameters directly reflect the combined effects of the cookware's bottom thickness, material thermal conductivity, and heat capacity, providing precise input for subsequent temperature control. This significantly improves temperature control accuracy, ensuring consistency in finished products for temperature-sensitive cooking methods and enhancing the user experience.

[0005] This invention provides a method for determining the thermal inertia parameters of a cookware used on a stove, the stove having a controller and a heating device interconnected. The method includes: In response to a user's cooking start command, the heating device is controlled to heat the cookware at a first preset power for a first preset duration; The power of the heating device is controlled to decrease from a first preset power to a second preset power; Monitor the temperature information at the bottom of the cookware and the corresponding time information; The bottom temperature information and the time information are used as inputs to the thermal inertia prediction model to determine the thermal inertia parameters of the cookware, thereby obtaining the target thermal inertia parameters.

[0006] Further, the step of using the bottom temperature information and the time information as inputs to the thermal inertia prediction model to determine the thermal inertia parameters of the cookware and obtain the target thermal inertia parameters includes: Based on the bottom temperature information and the corresponding time information, determine the delay time corresponding to the temperature peak of the pot bottom and the temperature decay rate after the temperature peak. The delay duration and the temperature decay rate are used as inputs to the thermal inertia prediction model to calculate the thermal inertia parameters corresponding to the cookware, thereby obtaining the target thermal inertia parameters; wherein, the thermal inertia prediction model is a thermal inertia formula.

[0007] Further, the step of determining the delay time corresponding to the temperature peak of the pot bottom and the temperature decay rate after the temperature peak based on the bottom temperature information and the corresponding time information includes: Obtain the heating time corresponding to the reduction of the heating device from the first preset power to the second preset power; Based on the bottom temperature information and the corresponding time information, determine the peak temperature of the pot bottom and the corresponding peak time; The delay duration is determined based on the difference between the peak time and the heating time; Obtain the first temperature value of the cookware corresponding to a preset time; wherein, the preset time is the time after the peak time; The temperature decay rate after the temperature peak is calculated based on the first temperature value, the temperature peak value, the peak value time, and the preset time.

[0008] Furthermore, the model parameters of the thermal inertia prediction model also include a delay time weighting coefficient, a temperature decay rate delay coefficient, and a system reference constant; The delay time weighting coefficient, the temperature decay rate delay coefficient, and the system reference constant are all positive adjustment parameters of the thermal inertia prediction model; The target thermal inertia parameter increases with the increase of the delay time weighting coefficient, the temperature decay rate delay coefficient, and the system reference constant, and decreases with the decrease of the delay time weighting coefficient, the temperature decay rate delay coefficient, and the system reference constant.

[0009] Further, the step of using the bottom temperature information and the time information as inputs to the thermal inertia prediction model to determine the thermal inertia parameters of the cookware and obtain the target thermal inertia parameters includes: Based on the bottom temperature information and the corresponding time information, determine the initial temperature of the pot bottom, the peak temperature of the pot bottom, and the delay time corresponding to the peak temperature of the pot bottom; The initial temperature, the delay duration, the peak temperature, and the preset temperature are used as inputs to the thermal inertia prediction model to calculate the thermal inertia parameters corresponding to the cookware, thereby obtaining the target thermal inertia parameters; wherein, the thermal inertia prediction model is a thermal inertia formula.

[0010] Further, the step of determining the initial temperature of the pot bottom, the peak temperature of the pot bottom, and the delay time corresponding to the peak temperature of the pot bottom based on the bottom temperature information and the corresponding time information includes: Based on the bottom temperature information and the corresponding time information, determine the initial temperature of the pot bottom, the peak temperature of the pot bottom, and the corresponding peak time; Obtain the heating time corresponding to the reduction of the heating device from the first preset power to the second preset power; The delay duration is determined based on the difference between the peak time and the heating time.

[0011] Furthermore, the method for determining the preset temperature includes: The third preset power of the heating device, the initial temperature of the pot, the mass of the pot, and the specific heat capacity of the pot are obtained. The preset temperature is calculated based on the third preset power, the initial temperature, the mass, the specific heat capacity, and the first preset duration.

[0012] Further, the step of using the bottom temperature information and the time information as inputs to the thermal inertia prediction model to determine the thermal inertia parameters of the cookware and obtain the target thermal inertia parameters includes: Based on the bottom temperature information and the corresponding time information, determine the delay time corresponding to the temperature peak of the pot bottom and the temperature drop within a second preset time after the temperature peak. The delay duration and the temperature drop are used as inputs to the thermal inertia prediction model to determine the target thermal inertia parameters; wherein, the thermal inertia prediction model is used to indicate the correspondence between multiple delay durations, multiple temperature drops, and multiple thermal inertia parameters.

[0013] Further, after the step of using the bottom temperature information and the time information as inputs to the thermal inertia prediction model to determine the thermal inertia parameters of the cookware and obtain the target thermal inertia parameters, the method further includes: Obtain the maximum and minimum thermal inertia coefficients of the cookware; The target thermal inertia parameter, the maximum cookware thermal inertia coefficient, and the minimum cookware thermal inertia coefficient are used as inputs to the normalization model. The target thermal inertia parameter is then normalized to obtain the target thermal inertia coefficient.

[0014] Furthermore, after the step of obtaining the target thermal inertia coefficient, the method further includes: If the target thermal inertia coefficient is less than the minimum cookware thermal inertia coefficient, the target thermal inertia coefficient is updated to 0; If the target thermal inertia coefficient is greater than the maximum cookware thermal inertia coefficient, the target thermal inertia coefficient is updated to 1.

[0015] This invention also protects a system for determining the thermal inertia parameters of a cookware, the system being used to implement the method for determining the thermal inertia parameters of a cookware as described above, the apparatus comprising: The first execution unit is configured to respond to a user's cooking start command by controlling the heating device to heat the cookware at a first preset power for a first preset duration. The second execution unit is used to control the power of the heating device to be reduced from a first preset power to a second preset power; The third execution unit is used to monitor the bottom temperature information and corresponding time information of the pot bottom; The fourth execution unit is used to take the bottom temperature information and the time information as inputs to the thermal inertia prediction model, determine the thermal inertia parameters of the cookware, and obtain the target thermal inertia parameters.

[0016] Implementing the embodiments of the present invention has the following beneficial effects: This invention controls the heating device to heat the cookware at a first preset power for a first preset time, and then controls the power of the heating device to decrease from the first preset power to a second preset power. This achieves a short-duration heat pulse at the bottom of the cookware when the heating device is switched off or its power is significantly reduced. After the heating device reduces its power to the second preset power, the temperature and time information at the bottom of the cookware are monitored. Based on the thermal inertia prediction model and the obtained temperature and time information, the corresponding thermal inertia parameters of the cookware can be accurately determined. These thermal inertia parameters directly reflect the combined effect of the cookware's bottom thickness, material thermal conductivity, and heat capacity, providing precise input for subsequent temperature control. This significantly improves temperature control accuracy, ensuring the consistency of finished products in temperature-sensitive cooking methods and enhancing the user experience. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the present invention, the accompanying drawings used in the description of the embodiments or prior art will be briefly introduced below. Obviously, the drawings described below are merely some embodiments of the present invention, and those skilled in the art can obtain other drawings based on these drawings without any creative effort.

[0018] Figure 1 This is a flowchart illustrating the method for determining the thermal inertia parameters of the cookware in this embodiment; Figure 2 This is a structural diagram of the system for determining the thermal inertia parameters of the cookware in this embodiment; Figure 3 This is the residual heat response curve of the cookware in this embodiment; Figure 4 This is a block diagram of the electronic device in this embodiment.

[0019] The corresponding reference numerals in the figure are as follows: 1-First execution unit; 2-Second execution unit; 3-Third execution unit; 4-Fourth execution unit; 5-WiFi module; 6-Processor; 7-Power supply; 8-RF circuit; 9-Memory; 10-Input unit; 11-Display unit; 12-Sensor; 13-Audio circuit; 101-Touch-sensitive surface; 102-Other input devices; 111-Display panel; 131-Speaker; 132-Microphone. Detailed Implementation

[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0021] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion.

[0022] Figure 1 This is a flowchart illustrating a method for determining the thermal inertia parameters of a cookware according to an embodiment of this application. This specification provides the method operation steps as shown in the embodiments or flowcharts, but based on conventional or non-inventive labor, more or fewer operation steps may be included. The order of steps listed in the embodiments is merely one possible execution order among many and does not represent the only possible execution order. In actual system or server product execution, the method can be executed sequentially according to the embodiments or drawings, or in parallel, for example, in an environment with parallel processors or multi-threaded processing.

[0023] See appendix Figures 1-4 This embodiment provides a method for determining the thermal inertia parameters of a cookware. The cookware is used on a stove, which has a controller and a heating device that are interconnected. The method includes: S101: In response to the user's cooking start command, control the heating device to heat the cookware with a first preset power for a first preset time; In this embodiment, the first preset power is much greater than the second preset power. The specific value of the first preset power is not limited. Preferably, the first preset power is the full power of the heating device. The specific value of the first preset duration is not limited, as long as it can generate a short heat pulse. Preferably, the first preset duration is 3 to 5 seconds.

[0024] S102: Control the power of the heating device to be reduced from the first preset power to the second preset power; In this embodiment, the specific value of the second preset power is not limited, as long as the second preset power is much smaller than the first preset power. Preferably, the second preset power is 0; that is, the controller controls the power of the heating device to be reduced from the first preset power to 0, so that a short pulse can be obtained. By monitoring the bottom temperature information of the pot bottom and the corresponding time information under the short pulse, the residual heat response curve after the power is reduced to 0 is obtained. The temperature of the residual heat response curve first rises to the temperature peak and then decreases from the temperature peak. By inputting the bottom temperature information and the corresponding time information obtained from the residual heat response curve into the thermal inertia prediction model, the thermal inertia parameters of the pot are determined.

[0025] S103: Monitor the bottom temperature information and corresponding time information of the pot; In this embodiment, the controller monitors the bottom temperature value of the pot and the time corresponding to the bottom temperature value in real time, generates corresponding bottom temperature information from multiple bottom temperature values, and generates time information from the corresponding time.

[0026] S104: Using the bottom temperature information and time information as input to the thermal inertia prediction model, the thermal inertia parameters of the cookware are determined to obtain the target thermal inertia parameters. This invention controls the heating device to heat the cookware at a first preset power for a first preset duration, and then controls the power of the heating device to decrease from the first preset power to a second preset power. This achieves a short-term heat pulse at the bottom of the cookware when the heating device is cut off or its heating power is significantly reduced. After the heating device reduces its power to the second preset power, the temperature information and corresponding time information at the bottom of the cookware are monitored. Based on the thermal inertia prediction model and the obtained temperature and time information, the corresponding thermal inertia parameters of the cookware can be accurately determined. These thermal inertia parameters directly reflect the combined effect of the cookware's bottom thickness, material thermal conductivity, and heat capacity, providing accurate input for subsequent temperature control, significantly improving temperature control accuracy, and thus ensuring the consistency of finished products in temperature-sensitive cooking methods, thereby improving the user experience.

[0027] It is understandable that the bottom of a cookware pot is its base. Cookware made of the same material can have vastly different heat capacity, thermal resistance, and heat storage capacity due to variations in the thickness of the bottom. These differences result in variations in the heating rate, temperature overshoot, and temperature control response speed of the cooker during the heating process. To accurately distinguish between cookware made of the same material but with different thicknesses, a short-time pulse is generated by reducing the power of the cooker's heating device to a second preset power. The bottom temperature and time information in the residual heat response curve corresponding to the short-time pulse are then obtained. This bottom temperature and time information are input into a thermal inertia prediction model to determine the thermal inertia parameters corresponding to cookware of different thicknesses.

[0028] Specifically, the bottom of the cookware has an inner surface and an outer surface. The inner surface forms the bottom boundary of the cooking cavity, and the outer surface is away from the cooking cavity. The outer surface is configured to receive thermal pulse excitation and generate a temperature response signal characterizing the thermal inertia parameters of the cookware in response to the thermal pulse excitation.

[0029] It should be noted that: the controller obtains the bottom temperature information and corresponding time information of the pot bottom after the power of the heating device is reduced from the first preset power to the second preset power, and plots the waste heat response curve based on the bottom temperature information and the corresponding time information. At the same time, it determines the delay time from the time the power is reduced from the first preset power to the second preset power until the temperature measured by the temperature sensor reaches the peak value, the temperature decay rate after the temperature exceeds the peak value, the temperature peak value and the peak value time through the waste heat response curve, and inputs at least one of the above information obtained from the waste heat response curve into the thermal inertia prediction model to predict the thermal inertia parameters.

[0030] It should also be noted that the thermal inertia prediction model is not limited, as long as it can accurately predict thermal inertia parameters; preferably, the thermal inertia prediction model is a thermal inertia formula or a thermal inertia prediction model used to indicate the correspondence between multiple delay durations, multiple temperature drop amounts and multiple thermal inertia parameters.

[0031] In this embodiment, the cooktop also includes a temperature sensor for acquiring the temperature of the bottom of the cookware. The temperature sensor is configured to acquire the temperature response signal of the outer surface of the bottom of the cookware at a high-frequency sampling rate, wherein the temperature response signal is the temperature of the bottom of the cookware.

[0032] See appendix Figure 3 The horizontal axis t represents time, the vertical axis T represents the temperature value at the bottom of the pot, a represents the pulse heating period, and b represents the arrival delay time corresponding to the temperature at the bottom of the pot reaching the peak temperature.

[0033] In some possible embodiments, the steps of using bottom temperature information and time information as inputs to the thermal inertia prediction model to determine the thermal inertia parameters of the cookware and obtain the target thermal inertia parameters include: S1041: Based on the bottom temperature information and the corresponding time information, determine the delay time corresponding to the temperature peak of the pot bottom and the temperature decay rate after the temperature peak; S1042: The delay time and temperature decay rate are used as inputs to the thermal inertia prediction model to calculate the thermal inertia parameters corresponding to the cookware, thereby obtaining the target thermal inertia parameters. The thermal inertia prediction model is a thermal inertia formula. By inputting the delay time and temperature decay rate into the thermal inertia prediction model for calculation, the accuracy of the obtained target thermal inertia parameters can be guaranteed, thereby ensuring that a precise input basis is provided for subsequent temperature control.

[0034] Specifically, target thermal inertia parameters Where H is the target thermal inertia parameter, This is the system reference constant used to compensate for the inherent thermal resistance of the glass panel of the stove. The time delay between the reduction of the first preset power to the second preset power and the time when the temperature sensor detects that the temperature has reached its peak value. This is the temperature decay rate after the temperature exceeds the peak value, such as the average temperature drop slope within 5 seconds after the peak value; and The pre-calibrated weighting coefficients are obtained from the stove's thermal calibration test with standard cookware before it leaves the factory. For example... It can take the value 0.5. Possible values ​​are 1.2.

[0035] In this embodiment, The delay time weighting coefficient corresponds to "thermal resistance" in physics, and it determines the proportion of "delay time" in the overall evaluation of cookware thickness. The value is mainly used to reduce the "longitudinal transmission sensitivity" of the stove control system to prevent the system's own delay from being misjudged as the thickness of the cookware. In this embodiment, This is the weighting coefficient for the temperature decay rate, which corresponds to the "heat capacity" in physics. This represents the slowness of temperature drop, i.e., the heat retention capacity of the pot bottom. This determines the weight of "heat storage capacity" in the overall evaluation; The value is mainly affected by the cooktop's "lateral and ambient heat dissipation characteristics." Specifically, this includes: the speed of the cooling fan on the cooktop chassis (stronger air cooling results in faster cooling), the area of ​​the microcrystalline panel, and the ambient temperature. If the cooktop has extremely strong internal heat dissipation capabilities... It will be too large, at which point it needs to be adjusted. The adjustment is made to compensate.

[0036] Specifically, and The value range of H is actually related to the range of H: if the target output value of H is between 0 and 10: Optimal range: Assuming the delay time of a thick-bottomed pan is likely between 2-15 seconds, to ensure the results fall within a reasonable range, The preferred value range is [0.1, 2.0]; The preferred range is as follows: assuming the absolute value of the cooling slope |α| after shutdown is between 0.2 and 0.5℃ / s, and its reciprocal is between 0.2 and 5. The preferred value range is [0.5, 5.0].

[0037] Specifically, the system's inherent compensation items This represents "the inherent thermal inertia of the stove's hardware system, excluding the cookware itself"; and the inherent compensation term. This can be determined through calibration methods, such as the baseline zeroing method: During the laboratory calibration stage before the stove leaves the factory, a single-layer pure aluminum foil or wrought iron sheet, with a thermal resistance close to zero, is placed tightly against the stove, and a very small amount of water is injected. Then, the stove is controlled to perform a "ignition-short heating-turn-off" pulse action, and the temperature at this time is recorded. And α; let H=0 in this case, and substituting it into the formula, we can deduce the reverse. : It is typically set as a "negative constant," the absolute value of which is exactly equal to the calculated thermal resistance-capacitance of the cooktop hardware system under no-load or extremely thin-pot conditions. Its range is generally [-5.0, -0.5]; where, .

[0038] In this embodiment, the controller determines the waste heat response curve based on the bottom temperature information and the corresponding time information, and determines the delay duration and temperature decay rate based on the waste heat response curve, and assigns a delay time weighting coefficient. Temperature decay rate weighting coefficient System reference constants Delay duration Using the temperature decay rate α as input to the thermal inertia prediction model, the thermal inertia parameters corresponding to the cookware are calculated to obtain the target thermal inertia parameters.

[0039] In some possible embodiments, the steps of determining the delay duration corresponding to the temperature peak of the pot bottom and the temperature decay rate after the temperature peak, based on the bottom temperature information and the corresponding time information, include: S10411: Obtain the heating moment when the heating device reduces from the first preset power to the second preset power; S10412: Determine the peak temperature of the pot bottom and the corresponding peak time based on the bottom temperature information and the corresponding time information; S10413: Determine the delay duration based on the difference between the peak time and the heating time; S10414: Obtain the first temperature value of the cookware corresponding to the preset time; wherein, the preset time is the time after the peak time; S10415: Calculate the temperature decay rate after the temperature peak based on the first temperature value, the temperature peak, the peak time, and the preset time. The above settings can simplify the calculation of the delay time and the temperature decay rate, thereby improving the system response speed.

[0040] In this embodiment, the model parameters of the thermal inertia prediction model also include a delay time weighting coefficient, a temperature decay rate delay coefficient, and a system reference constant; the delay time weighting coefficient, the temperature decay rate delay coefficient, and the system reference constant are all positive adjustment parameters of the thermal inertia prediction model; the target thermal inertia parameter increases with the increase of the delay time weighting coefficient, the temperature decay rate delay coefficient, and the system reference constant, and decreases with the decrease of the delay time weighting coefficient, the temperature decay rate delay coefficient, and the system reference constant.

[0041] In this embodiment, the controller obtains the peak time and heating time in the waste heat response curve, and the difference between the peak time and the heating time is the delay time; the preset time is any time after the peak time, and the specific value of the preset time is not limited, as long as the temperature decay rate can be accurately calculated. The selectable preset time is 5 seconds; (first temperature value minus temperature peak) / (preset time minus peak time) is the temperature decay rate after the temperature peak.

[0042] In some possible embodiments, the steps of using bottom temperature information and time information as inputs to the thermal inertia prediction model to determine the thermal inertia parameters of the cookware and obtain the target thermal inertia parameters include: S1043: Based on the bottom temperature information and the corresponding time information, determine the initial temperature of the pot bottom, the peak temperature of the pot bottom, and the delay time corresponding to the peak temperature of the pot bottom; S1044: The initial temperature, delay duration, peak temperature, and preset temperature are used as inputs to the thermal inertia prediction model to calculate the corresponding thermal inertia parameters of the cookware, thereby obtaining the target thermal inertia parameters. The thermal inertia prediction model is a thermal inertia formula. By inputting the initial temperature, delay duration, peak temperature, and preset temperature into the thermal inertia prediction model for calculation, the accuracy of the obtained target thermal inertia parameters can be guaranteed, thus ensuring a precise input basis for subsequent temperature control.

[0043] In this embodiment, the target thermal inertia parameter ;in, The time delay from when the power is reduced from the first preset power to the second preset power until the temperature reaches its peak value as measured by the temperature sensor. For the appendix Figure 3 The highest temperature peak measured by the temperature sensor in the waste heat response curve; This refers to the initial ambient temperature or the initial temperature of the pot bottom before ignition. This is the preset temperature during the short-time pulse thermal excitation. The preset temperature is the total theoretical energy initially applied by the heat source. It can be determined at the factory based on the preset power and preset duration. For example, the preset power is full power and the preset duration is 3 to 5 seconds.

[0044] Specifically, the formula for calculating the target thermal inertia parameter utilizes the natural logarithmic decay law of the first-order thermal response to forcibly decouple the interference of the initial temperature, directly calculating the time constant H representing the physical thickness characteristics of the cookware. If the user is using a thin iron pot, the heat transfer is extremely fast, and the probe measures... It will be closer If the user uses an extremely thick earthenware pot, the heat transfer resistance is extremely high. It will be more than Much lower. By comparing this fixed input value ( ) and the actual measured output value ( By doing so, the thermal inertia parameters of the cookware can be calculated.

[0045] In this embodiment, the controller determines the residual heat response curve based on the bottom temperature information and the corresponding time information, and determines the delay time and the highest temperature peak based on the residual heat response curve. It then obtains the initial temperature and preset temperature of the pot bottom, and uses the delay time, the highest temperature peak, the initial temperature of the pot bottom, and the preset temperature as inputs to the thermal inertia prediction model to calculate the thermal inertia parameters corresponding to the cookware, thereby obtaining the target thermal inertia parameters.

[0046] In some possible embodiments, the steps of determining the initial temperature of the pot bottom, the peak temperature of the pot bottom, and the delay time corresponding to the peak temperature of the pot bottom, based on the bottom temperature information and the corresponding time information, include: S10431: Based on the bottom temperature information and the corresponding time information, determine the initial temperature of the pot bottom, the peak temperature of the pot bottom, and the corresponding peak time; S10432: Obtain the heating time when the heating device reduces from the first preset power to the second preset power; S10433: Determine the delay duration based on the difference between the peak time and the heating time. The above setting can simplify the calculation of the delay duration and improve the system response speed.

[0047] In this embodiment, the controller obtains the peak time and heating time in the waste heat response curve, and the difference between the peak time and the heating time is the delay time.

[0048] In some possible embodiments, the method for determining the preset temperature includes: S1045: Obtain the third preset power of the heating device, the initial temperature of the pot, the mass of the pot, and the specific heat capacity of the pot; S1046: Calculate the preset temperature based on the third preset power, initial temperature, mass, specific heat capacity and the first preset duration. The above settings can ensure the accuracy of the determined preset temperature, thereby ensuring the accuracy of the target thermal inertia parameters.

[0049] In this embodiment, the specific range of the third preset power is not limited, as long as the preset temperature can be accurately determined. Preferably, the range of the third preset power is 80%-100% of the full power of the heating device. Optionally, the third preset power is the full power of the heating device.

[0050] In this embodiment, the preset temperature P is the full power of the stove's heating device; t is the heating time; m is the mass of the cookware; c is the specific heat capacity of the cookware material (J / (kg·℃)). This refers to the initial temperature of the cookware. The theoretically preset temperature.

[0051] In this embodiment, the method for determining the preset temperature is tested before leaving the factory and the relevant fixed value of the preset temperature is stored in the controller.

[0052] In some possible embodiments, the steps of using bottom temperature information and time information as inputs to the thermal inertia prediction model to determine the thermal inertia parameters of the cookware and obtain the target thermal inertia parameters include: S1047: Based on the bottom temperature information and the corresponding time information, determine the delay time corresponding to the temperature peak of the pot bottom and the temperature drop within the second preset time after the temperature peak. S1048: The delay duration and temperature drop are used as inputs to the thermal inertia prediction model to determine the target thermal inertia parameters. The thermal inertia prediction model is used to indicate the correspondence between multiple delay durations, multiple temperature drops, and multiple thermal inertia parameters. By matching the delay duration and temperature drop with multiple delay durations and multiple temperature drops in the thermal inertia prediction model, the target thermal inertia parameters corresponding to the delay duration and temperature drop can be quickly determined, improving the response speed and thus improving the user experience.

[0053] In this embodiment, the target thermal inertia parameters are determined by a lookup table / mapping matrix method based on the above correspondence. The above thermal inertia formula can be explicitly expressed as a discrete mapping matrix function built into the controller. Specifically, the controller has a pre-stored two-dimensional data table, with the X-axis representing the delay time. Multiple segmented intervals, with the Y-axis representing the temperature drop over a specified time period. The table contains multiple segmented intervals, and the cross values ​​within the table represent the corresponding thermal inertia parameters or thermal inertia coefficients. The controller uses a bilinear interpolation algorithm to search for and calculate the continuous numerical thermal inertia parameters or thermal inertia coefficients corresponding to the current input feature in the table.

[0054] In this embodiment, the thermal inertia prediction model is a mapping table, which includes multiple record entries. Each record entry contains the delay duration, the temperature drop amount, and the corresponding target thermal inertia parameters. Methods for determining the target thermal inertia parameters include: The target thermal inertia parameters are determined by matching the delay duration and temperature drop with the records in the mapping table.

[0055] In some possible embodiments, after using bottom temperature information and time information as inputs to the thermal inertia prediction model to determine the thermal inertia parameters of the cookware and obtain the target thermal inertia parameters, the method further includes: S105: Obtain the maximum and minimum thermal inertia coefficients of the cookware; S106: The target thermal inertia parameter, the maximum cookware thermal inertia coefficient, and the minimum cookware thermal inertia coefficient are used as inputs to the normalization model. The target thermal inertia parameter is normalized to obtain the target thermal inertia coefficient. By normalizing the target thermal inertia parameter, it is uniformly mapped to a preset dimensionless interval. This allows multiple feature parameters that could not directly participate in the same mathematical operation due to differences in dimensions to be weighted, summed, or logically judged on the same scale, thus providing a prerequisite for subsequent temperature control.

[0056] Specifically, the maximum and minimum thermal inertia coefficients of the cookware are two pre-calibrated physical limit characteristic benchmark values ​​built into the system. The maximum thermal inertia coefficient characterizes the absolute thermal inertia coefficient value of the physically limit-thick cookware that the system can identify as having the "slowest heat conduction and the largest heat storage." For example, the physically limit-thick cookware can be an extremely thick multi-layer composite bottom or a thick earthenware pot. The value is determined based on the range of the target output value of H. If the target range of H is between 0 and 10, then... The range is [9-10]; the absolute thermal inertia coefficient value of the physical limit thin pot that the minimum cookware thermal inertia coefficient characterization system can identify is "the fastest heat conduction and almost no heat storage", and its value ranges [0.1-0.5]. For example, the physical limit thin pot can be a 0.1mm single layer of wrought iron foil.

[0057] In this embodiment, for ease of processing, the thermal inertia parameter can be converted into a dimensionless parameter, i.e., it can be normalized. The normalization formula is as follows: ;in, The normalized thermal inertia coefficient typically falls within the 0-1 range. The maximum thermal inertia coefficient of the cookware, It is the minimum thermal inertia coefficient of the cookware.

[0058] In some possible embodiments, after obtaining the target thermal inertia coefficient, the method further includes: S107: If the target thermal inertia coefficient is less than the minimum cookware thermal inertia coefficient, update the target thermal inertia coefficient to 0; S108: If the target thermal inertia coefficient is greater than the maximum cookware thermal inertia coefficient, update the target thermal inertia coefficient to 1. This can achieve boundary limiting protection of the thermal inertia coefficient. Specifically, under abnormal conditions such as sudden interference or drastic changes in operating conditions, the thermal inertia coefficient is limited to a preset reasonable range to avoid controller malfunctions caused by abnormal inputs and improve the adaptability to different operating conditions.

[0059] In this embodiment, in actual kitchen scenarios, due to the extreme complexity of users' cookware, the calculated target thermal inertia coefficient may occasionally exceed the factory-set limit range. Therefore, it is necessary to add engineering limiting logic: that is, when the calculated target thermal inertia coefficient is less than the minimum cookware thermal inertia coefficient, the target thermal inertia coefficient is forced to be equal to zero, i.e., it is treated as the thinnest cookware; that is, when the calculated target thermal inertia coefficient is greater than the maximum cookware thermal inertia coefficient, the target thermal inertia coefficient is forced to be equal to 1, i.e., it is treated as the thickest cookware. The final output target thermal inertia coefficient is a continuous floating-point number or fixed-point decimal number that is strictly limited to the range of 0-1.

[0060] In this embodiment, if the thermal inertia coefficient obtained by normalization based on the target thermal inertia parameter is greater than the minimum thermal inertia coefficient of the cookware, and the target thermal inertia coefficient is less than the maximum thermal inertia coefficient of the cookware, the thermal inertia coefficient is determined as the target thermal inertia coefficient.

[0061] In this embodiment, the method for determining the thermal inertia parameters of the cookware includes: S101: In response to the user's cooking start command, control the heating device to heat the cookware with a first preset power for a first preset time; S102: Control the power of the heating device to be reduced from the first preset power to the second preset power; S103: Monitor the bottom temperature information and corresponding time information of the pot; S10411: Obtain the heating moment when the heating device reduces from the first preset power to the second preset power; S10412: Determine the peak temperature of the pot bottom and the corresponding peak time based on the bottom temperature information and the corresponding time information; S10413: Determine the delay duration based on the difference between the peak time and the heating time; S10414: Obtain the first temperature value of the cookware corresponding to the preset time; wherein, the preset time is the time after the peak time; S10415: Calculate the temperature decay rate after the temperature peak based on the first temperature value, the temperature peak value, the peak value time, and the preset time; S1042: Using the delay duration and temperature decay rate as inputs to the thermal inertia prediction model, calculate the thermal inertia parameters corresponding to the cookware to obtain the target thermal inertia parameters; wherein, the thermal inertia prediction model is a thermal inertia formula; Alternatively, S10431: Based on the bottom temperature information and the corresponding time information, determine the initial temperature of the pot bottom, the peak temperature of the pot bottom, and the corresponding peak time; S10432: Obtain the heating time when the heating device reduces from the first preset power to the second preset power; S10433: Determine the delay duration based on the difference between the peak time and the heating time; S1044: The initial temperature, delay time, peak temperature, and preset temperature are used as inputs to the thermal inertia prediction model to calculate the thermal inertia parameters corresponding to the cookware and obtain the target thermal inertia parameters; wherein, the thermal inertia prediction model is a thermal inertia formula; S1045: Obtain the third preset power of the heating device, the initial temperature of the pot, the mass of the pot, and the specific heat capacity of the pot; S1046: Calculate the preset temperature based on the third preset power, initial temperature, mass, specific heat capacity, and first preset duration; Alternatively, S1047: Based on the bottom temperature information and the corresponding time information, determine the delay time corresponding to the temperature peak of the pot bottom and the temperature drop within the second preset time after the temperature peak. S1048: Use the delay duration and temperature drop as inputs to the thermal inertia prediction model to determine the target thermal inertia parameters; wherein, the thermal inertia prediction model is used to indicate the correspondence between multiple delay durations, multiple temperature drops, and multiple thermal inertia parameters; S105: Obtain the maximum and minimum thermal inertia coefficients of the cookware; S106: Using the target thermal inertia parameter, the maximum cookware thermal inertia coefficient, and the minimum cookware thermal inertia coefficient as inputs to the normalization model, the target thermal inertia parameter is normalized to obtain the target thermal inertia coefficient. S107: If the target thermal inertia coefficient is less than the minimum cookware thermal inertia coefficient, update the target thermal inertia coefficient to 0; S108: If the target thermal inertia coefficient is greater than the maximum cookware thermal inertia coefficient, update the target thermal inertia coefficient to 1.

[0062] This invention also protects a system for determining the thermal inertia parameters of cookware. This system is used to implement the above-mentioned method for determining the thermal inertia parameters of cookware, and the apparatus includes: The first execution unit 1 is used to respond to the user's cooking start command and control the heating device to heat the pot with a first preset power for a first preset time. The second execution unit 2 is used to control the power of the heating device to be reduced from the first preset power to the second preset power; The third execution unit 3 is used to monitor the bottom temperature information and corresponding time information of the pot bottom; The fourth execution unit 4 is used to take the bottom temperature information and time information as input to the thermal inertia prediction model to determine the thermal inertia parameters of the cookware and obtain the target thermal inertia parameters. This invention controls the heating device to heat the cookware at a first preset power for a first preset time, and then controls the power of the heating device to decrease from the first preset power to a second preset power. This achieves a short-term heat pulse at the bottom of the cookware when the heating device is cut off or its heating power is significantly reduced. After the heating device reduces its power to the second preset power, the temperature information and corresponding time information at the bottom of the cookware are monitored. Based on the thermal inertia prediction model and the obtained temperature and time information, the corresponding thermal inertia parameters of the cookware can be accurately determined. These thermal inertia parameters directly reflect the combined effect of the cookware's bottom thickness, material thermal conductivity, and heat capacity, providing accurate input for subsequent temperature control, significantly improving temperature control accuracy, ensuring the consistency of finished products in temperature-sensitive cooking methods, and improving the user experience.

[0063] The first acquisition unit is used to acquire the heating time when the heating device reduces from a first preset power to a second preset power; The fifth execution unit is used to determine the peak temperature of the pot bottom and the corresponding peak time based on the bottom temperature information and the corresponding time information. The sixth execution unit is used to determine the delay duration based on the difference between the peak time and the heating time; The second acquisition unit is used to acquire the first temperature value of the cookware corresponding to a preset time; wherein, the preset time is the time after the peak time; The seventh execution unit is used to calculate the temperature decay rate after the temperature peak based on the first temperature value, the temperature peak value, the peak time, and the preset time. The eighth execution unit is used to take the delay time and temperature decay rate as inputs to the thermal inertia prediction model, calculate the thermal inertia parameters corresponding to the cookware, and obtain the target thermal inertia parameters; wherein, the thermal inertia prediction model is a thermal inertia formula; The ninth execution unit is used to determine the initial temperature of the pot bottom, the peak temperature of the pot bottom, and the corresponding peak time based on the bottom temperature information and the corresponding time information. The third acquisition unit is used to acquire the heating time when the heating device reduces from the first preset power to the second preset power; The tenth execution unit is used to determine the delay duration based on the difference between the peak time and the heating time; The eleventh execution unit is used to take the initial temperature, delay time, peak temperature and preset temperature as input to the thermal inertia prediction model, calculate the thermal inertia parameters corresponding to the cookware, and obtain the target thermal inertia parameters; wherein, the thermal inertia prediction model is a thermal inertia formula; The fourth acquisition unit is used to acquire the third preset power of the heating device, the initial temperature of the pot, the mass of the pot, and the specific heat capacity of the pot; The twelfth execution unit is used to calculate the preset temperature based on the third preset power, initial temperature, mass, specific heat capacity and the first preset duration; The thirteenth execution unit is used to determine the delay time corresponding to the temperature peak of the pot bottom and the temperature drop within the second preset time after the temperature peak, based on the bottom temperature information and the corresponding time information. The fourteenth execution unit is used to take the delay duration and temperature drop as inputs to the thermal inertia prediction model to determine the target thermal inertia parameters; wherein, the thermal inertia prediction model is used to indicate the correspondence between multiple delay durations, multiple temperature drops and multiple thermal inertia parameters; The fifth acquisition unit is used to acquire the maximum and minimum thermal inertia coefficients of the cookware. The fifteenth execution unit is used to take the target thermal inertia parameter, the maximum cookware thermal inertia coefficient, and the minimum cookware thermal inertia coefficient as inputs to the normalization model, and to normalize the target thermal inertia parameter to obtain the target thermal inertia coefficient. The sixteenth execution unit is used to update the target thermal inertia coefficient to 0 if the target thermal inertia coefficient is less than the minimum cookware thermal inertia coefficient. The seventeenth execution unit is used to update the target thermal inertia coefficient to 1 if the target thermal inertia coefficient is greater than the maximum cookware thermal inertia coefficient.

[0064] The present invention also protects a computer-readable storage medium storing at least one instruction or at least one program, wherein the at least one instruction or at least one program is loaded by a processor and executed as described above regarding the method for determining the thermal inertia parameters of a cookware.

[0065] The computer program product may include a storage medium having computer-readable program instructions loaded thereon for causing a processor to implement various aspects of the present application.

[0066] Storage media can be tangible devices capable of holding and storing instructions for use by an instruction execution device. Storage media are not limited to electrical storage devices, magnetic storage devices, optical storage devices, electromagnetic storage devices, semiconductor storage devices, or any suitable combination thereof. More specific examples of storage media (a non-exhaustive list) include: portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), static random access memory (SRAM), portable compact disc read-only memory (CD-ROM), digital multifunction disc (DVD), memory sticks, floppy disks, mechanical encoding devices, such as punch cards or recessed protrusions storing instructions thereon, and any suitable combination thereof. Storage media as used herein is not to be construed as transient signals themselves, such as radio waves or other freely propagating electromagnetic waves, electromagnetic waves propagating through waveguides or other transmission media, such as light pulses through fiber optic cables, or electrical signals transmitted through wires.

[0067] The computer-readable program instructions described herein can be downloaded from storage media to various computing / processing devices, or downloaded via a network, such as the Internet, local area network, wide area network, and / or wireless network, to an external computer or external storage device. The network may include copper cables, fiber optic cables, wireless transmission, routers, firewalls, switches, gateway computers, and / or edge servers. A network adapter card or network interface in each computing / processing device receives the computer-readable program instructions from the network and forwards them to storage media within the respective computing / processing device.

[0068] The computer program instructions used to perform the operations of this application may be assembly instructions, instruction set architecture (ISA) instructions, machine instructions, machine-dependent instructions, microcode, firmware instructions, status setting data, or source code or object code written in any combination of one or more programming languages, including object-oriented programming languages ​​such as Smalltalk, C++, etc., and conventional procedural programming languages ​​such as the "C" language or similar programming languages. The computer-readable program instructions may be executed entirely on the user's computer, partially on the user's computer, as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving remote computers, the remote computer may be connected to the user's computer via any type of network—including a local area network (LAN) or a wide area network (WAN)—or may be connected to an external computer, for example, via the Internet using an Internet service provider. In some embodiments, electronic circuits, such as programmable logic circuits or field-programmable gate arrays (or programmable logic arrays (PLAs), are personalized by utilizing the status information of the computer-readable program instructions. These electronic circuits can execute the computer-readable program instructions to implement various aspects of this application.

[0069] These computer-readable program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing apparatus to produce a machine such that, when executed by the processor of the computer or other programmable data processing apparatus, they create means for implementing the functions / actions specified in one or more blocks of a flowchart and / or block diagram. These computer-readable program instructions can also be stored in a storage medium that causes a computer, programmable data processing apparatus, and / or other device to operate in a particular manner; thus, the computer-readable medium storing the instructions constitutes an article of manufacture.

[0070] These computer-readable program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing apparatus to produce a machine such that, when executed by the processor of the computer or other programmable data processing apparatus, they create means for implementing the functions / actions specified in one or more blocks of the flowchart and / or block diagram. These computer-readable program instructions can also be stored in a computer-readable storage medium that causes a computer, programmable data processing apparatus, and / or other device to operate in a particular manner; thus, the computer-readable medium storing the instructions comprises an article of manufacture that includes instructions for implementing aspects of the functions / actions specified in one or more blocks of the flowchart and / or block diagram.

[0071] Computer-readable program instructions can also be loaded onto a computer, other programmable data processing apparatus, or other device to cause a series of operational steps to be executed on the computer, other programmable data processing apparatus, or other device to produce a computer-implemented process, thereby causing the instructions executed on the computer, other programmable data processing apparatus, or other device to perform the specified function / action.

[0072] The present invention also protects an electronic device, including at least one processor and a memory communicatively connected to the at least one processor; wherein the memory stores instructions executable by the at least one processor, and the at least one processor implements the above method for determining the thermal inertia parameters of a cookware by executing the instructions stored in the memory.

[0073] Figure 4 This is a block diagram illustrating an electronic device according to an exemplary embodiment. The electronic device may be a terminal, and its internal structure diagram may be as follows: Figure 4 As shown. The terminal may include an RF circuit 8, where RF is an abbreviation for Radio Frequency, a memory 9 including one or more computer-readable storage media, an input unit 10, a display unit 11, a sensor 12, an audio circuit 13, a WiFi module 5, where Wi-Fi is an abbreviation for Wireless Fidelity, a processor 6 including one or more processing cores, and a power supply 7, etc. Those skilled in the art will understand that... Figure 4 The terminal structure shown does not constitute a limitation on the terminal and may include more or fewer components than shown, or combine certain components, or have different component arrangements. Wherein: The RF circuit 8 can be used for receiving and transmitting signals during information transmission or calls. Specifically, it receives downlink information from the base station and hands it over to one or more processors 6 for processing; additionally, it transmits uplink data to the base station. Typically, the RF circuit 8 includes, but is not limited to, an antenna, at least one amplifier, a tuner, one or more oscillators, a Subscriber Identity Module (SIM) card, a transceiver, a coupler, an LNA (Low Noise Amplifier), a duplexer, etc. Furthermore, the RF circuit 8 can also communicate wirelessly with networks and other terminals. Wireless communication can use any communication standard or protocol, including but not limited to GSM (Global System for Mobile communication), GPRS (General Packet Radio Service), CDMA (Code Division Multiple Access), WCDMA (Wideband Code Division Multiple Access), LTE (Long Term Evolution), email, SMS (Short Messaging Service), etc.

[0074] The memory 9 can be used to store software programs and modules. The processor 6 executes various functional applications and data processing by running the software programs and modules stored in the memory 9. The memory 9 may mainly include a program storage area and a data storage area. The program storage area may store the operating system, application programs required for the functions, etc.; the data storage area may store data created according to the use of the terminal, etc. In addition, the memory 9 may include high-speed random access memory, and may also include non-volatile memory, such as at least one disk storage device, flash memory device, or other volatile solid-state storage device. Accordingly, the memory 9 may also include a memory controller to provide access to the memory 9 for the processor 6 and the input unit 10.

[0075] The input unit 10 can be used to receive input digital or character information, and to generate keyboard, mouse, joystick, optical, or trackball signal inputs related to user settings and function control. Specifically, the input unit 10 may include a touch-sensitive surface 101 and other input devices 102. The touch-sensitive surface 101, also known as a touch display screen or touchpad, can collect touch operations performed by the user on or near it, such as operations performed by the user using a finger, stylus, or any suitable object or accessory on or near the touch-sensitive surface 101, and drive the corresponding connection device according to a pre-set program. Optionally, the touch-sensitive surface 101 may include two parts: a touch detection device and a touch controller. The touch detection device detects the user's touch position and the signal generated by the touch operation, and transmits the signal to the touch controller; the touch controller receives touch information from the touch detection device, converts it into touch point coordinates, sends it to the processor 6, and can receive and execute commands sent by the processor 6. In addition, the touch-sensitive surface 101 can be implemented using various types such as resistive, capacitive, infrared, and surface acoustic wave. In addition to the touch-sensitive surface 101, the input unit 10 may also include other input devices 102. Specifically, other input devices 102 may include, but are not limited to, one or more of the following: physical keyboard, function keys such as volume control buttons, power buttons, trackball, mouse, joystick, etc.

[0076] The display unit 11 can be used to display information input by the user or information provided to the user, as well as various graphical user interfaces of the terminal. These graphical user interfaces can be composed of graphics, text, icons, videos, and any combination thereof. The display unit 11 may include a display panel 111, which can optionally be configured as an LCD (Liquid Crystal Display), OLED (Organic Light-Emitting Diode), or similar display panel 111. Furthermore, a touch-sensitive surface 101 can cover the display panel 111. When the touch-sensitive surface 101 detects a touch operation on or near it, it transmits the information to the processor 6 to determine the type of touch event. Subsequently, the processor 6 provides corresponding visual output on the display panel 111 according to the type of touch event. The touch-sensitive surface 101 and the display panel 111 can be implemented as two independent components to achieve input and output functions respectively. However, in some embodiments, the touch-sensitive surface 101 and the display panel 111 can be integrated to achieve input and output functions.

[0077] The terminal may also include at least one sensor 12, such as a light sensor, a motion sensor, and other sensors. Specifically, the light sensor may include an ambient light sensor and a proximity sensor. The ambient light sensor can adjust the brightness of the display panel 111 according to the ambient light level, and the proximity sensor can turn off the display panel 111 and / or backlight when the terminal is moved to the ear. As a type of motion sensor, a gravity acceleration sensor can detect the magnitude of acceleration in various directions, generally in three axes. When stationary, it can detect the magnitude and direction of gravity and can be used for applications that identify the terminal's posture, such as landscape / portrait switching, related games, magnetometer posture calibration, and vibration recognition functions, such as pedometers and taps. Other sensors that may be configured on the terminal, such as gyroscopes, barometers, hygrometers, thermometers, and infrared sensors, will not be described in detail here.

[0078] Audio circuitry 13, speaker 131, and microphone 132 provide an audio interface between the user and the terminal. Audio circuitry 13 converts received audio data into electrical signals, which are then transmitted to speaker 131, where they are converted into sound signals for output. Conversely, microphone 132 converts collected sound signals into electrical signals, which are received by audio circuitry 13, converted back into audio data, and then processed by processor 6 before being transmitted via RF circuitry 8 to, for example, another terminal, or output to memory 9 for further processing. Audio circuitry 13 may also include an earphone jack to facilitate communication between a peripheral headset and the terminal.

[0079] WiFi is a short-range wireless transmission technology. This terminal, through its WiFi module 5, can help users send and receive emails, browse web pages, and access streaming media, providing users with wireless broadband internet access. Although Figure 4 WiFi module 5 is shown, but it is understood that it is not a necessary component of the terminal and can be omitted as needed without changing the nature of the invention.

[0080] Processor 6 is the control center of the terminal, connecting various parts of the terminal through various interfaces and lines. It executes software programs and / or modules stored in memory 9, and calls data stored in memory 9 to perform various functions and process data, thereby providing overall monitoring of the terminal. Optionally, processor 6 may include one or more processing cores; preferably, processor 6 may integrate an application processor and a modem processor, wherein the application processor mainly handles the operating system, user interface, and applications, while the modem processor mainly handles wireless communication. It is understood that the modem processor may not be integrated into processor 6.

[0081] The terminal also includes a power supply 7, such as a battery, to power various components. Preferably, the power supply can be logically connected to the processor 6 through a power management system, thereby enabling functions such as charging, discharging, and power consumption management through the power management system. The power supply 7 may also include one or more DC or AC power supplies, recharging systems, power fault detection circuits, power converters or inverters, power status indicators, and other arbitrary components.

[0082] Although not shown, the terminal may also include a camera, Bluetooth module, etc., which will not be described in detail here. Specifically, in this embodiment, the terminal's display unit is a touch screen display, and the terminal also includes a memory and one or more programs, wherein one or more programs are stored in the memory and configured to be executed by one or more processors of the instructions in the method embodiment of the present invention.

[0083] The various embodiments of this application have been described above. These descriptions are exemplary and not exhaustive, nor are they limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen to best explain the principles, practical applications, or technological improvements to the embodiments in the market, or to enable others skilled in the art to understand the embodiments disclosed herein.

[0084] Where there is no conflict, the above embodiments and features described herein can be combined with each other.

[0085] The above description is merely a preferred embodiment of the present invention and should not be construed as limiting the scope of the invention. Therefore, any equivalent variations made in accordance with the claims of the present invention are still within the scope of the present invention.

Claims

1. A method for determining the thermal inertia parameters of a cookware, characterized in that, The cookware is used on a stove, the stove having a controller and a heating device that are interconnected, the method comprising: In response to a user's cooking start command, the heating device is controlled to heat the cookware at a first preset power for a first preset duration; The power of the heating device is controlled to decrease from a first preset power to a second preset power; Monitor the temperature information at the bottom of the cookware and the corresponding time information; The bottom temperature information and the time information are used as inputs to the thermal inertia prediction model to determine the thermal inertia parameters of the cookware, thereby obtaining the target thermal inertia parameters.

2. The method for determining the thermal inertia parameters of a cookware according to claim 1, characterized in that, The step of using the bottom temperature information and the time information as inputs to the thermal inertia prediction model to determine the thermal inertia parameters of the cookware and obtain the target thermal inertia parameters includes: Based on the bottom temperature information and the corresponding time information, determine the delay time corresponding to the temperature peak of the pot bottom and the temperature decay rate after the temperature peak. The delay duration and the temperature decay rate are used as inputs to the thermal inertia prediction model to calculate the thermal inertia parameters corresponding to the cookware, thereby obtaining the target thermal inertia parameters; wherein, the thermal inertia prediction model is a thermal inertia formula.

3. The method for determining the thermal inertia parameters of a cookware according to claim 2, characterized in that, The step of determining the delay time corresponding to the temperature peak of the pot bottom and the temperature decay rate after the temperature peak based on the bottom temperature information and the corresponding time information includes: Obtain the heating time corresponding to the reduction of the heating device from the first preset power to the second preset power; Based on the bottom temperature information and the corresponding time information, determine the peak temperature of the pot bottom and the corresponding peak time; The delay duration is determined based on the difference between the peak time and the heating time; Obtain the first temperature value of the cookware corresponding to a preset time; wherein, the preset time is the time after the peak time; The temperature decay rate after the temperature peak is calculated based on the first temperature value, the temperature peak value, the peak value time, and the preset time.

4. The method for determining the thermal inertia parameters of a cookware according to claim 1, characterized in that, The model parameters of the thermal inertia prediction model also include the delay time weighting coefficient, the temperature decay rate delay coefficient, and the system reference constant; The delay time weighting coefficient, the temperature decay rate delay coefficient, and the system reference constant are all positive adjustment parameters of the thermal inertia prediction model; The target thermal inertia parameter increases with the increase of the delay time weighting coefficient, the temperature decay rate delay coefficient, and the system reference constant, and decreases with the decrease of the delay time weighting coefficient, the temperature decay rate delay coefficient, and the system reference constant.

5. The method for determining the thermal inertia parameters of a cookware according to claim 1, characterized in that, The step of using the bottom temperature information and the time information as inputs to the thermal inertia prediction model to determine the thermal inertia parameters of the cookware and obtain the target thermal inertia parameters includes: Based on the bottom temperature information and the corresponding time information, determine the initial temperature of the pot bottom, the peak temperature of the pot bottom, and the delay time corresponding to the peak temperature of the pot bottom; The initial temperature, the delay duration, the peak temperature, and the preset temperature are used as inputs to the thermal inertia prediction model to calculate the thermal inertia parameters corresponding to the cookware, thereby obtaining the target thermal inertia parameters; wherein, the thermal inertia prediction model is a thermal inertia formula.

6. The method for determining the thermal inertia parameters of a cookware according to claim 5, characterized in that, The step of determining the initial temperature of the pot bottom, the peak temperature of the pot bottom, and the delay time corresponding to the peak temperature of the pot bottom based on the bottom temperature information and the corresponding time information includes: Based on the bottom temperature information and the corresponding time information, the initial temperature of the pot bottom, the peak temperature of the pot bottom, and the corresponding peak time are determined. Obtain the heating time corresponding to the reduction of the heating device from the first preset power to the second preset power; The delay duration is determined based on the difference between the peak time and the heating time.

7. The method for determining the thermal inertia parameters of a cookware according to claim 5, characterized in that, The method for determining the preset temperature includes: The third preset power of the heating device, the initial temperature of the pot, the mass of the pot, and the specific heat capacity of the pot are obtained. The preset temperature is calculated based on the third preset power, the initial temperature, the mass, the specific heat capacity, and the first preset duration.

8. The method for determining the thermal inertia parameters of a cookware according to claim 1, characterized in that, The step of using the bottom temperature information and the time information as inputs to the thermal inertia prediction model to determine the thermal inertia parameters of the cookware and obtain the target thermal inertia parameters includes: Based on the bottom temperature information and the corresponding time information, determine the delay time corresponding to the temperature peak of the pot bottom and the temperature drop within a second preset time after the temperature peak. The delay duration and the temperature drop are used as inputs to the thermal inertia prediction model to determine the target thermal inertia parameters; wherein, the thermal inertia prediction model is used to indicate the correspondence between multiple delay durations, multiple temperature drops, and multiple thermal inertia parameters.

9. The method for determining the thermal inertia parameters of a cookware according to any one of claims 1-8, characterized in that, After the step of using the bottom temperature information and the time information as inputs to the thermal inertia prediction model to determine the thermal inertia parameters of the cookware and obtain the target thermal inertia parameters, the method further includes: Obtain the maximum and minimum thermal inertia coefficients of the cookware; The target thermal inertia parameter, the maximum cookware thermal inertia coefficient, and the minimum cookware thermal inertia coefficient are used as inputs to the normalization model. The target thermal inertia parameter is then normalized to obtain the target thermal inertia coefficient.

10. The method for determining the thermal inertia parameters of a cookware according to claim 9, characterized in that, After the step of obtaining the target thermal inertia coefficient, the method further includes: If the target thermal inertia coefficient is less than the minimum cookware thermal inertia coefficient, the target thermal inertia coefficient is updated to 0; If the target thermal inertia coefficient is greater than the maximum cookware thermal inertia coefficient, the target thermal inertia coefficient is updated to 1.

11. A system for determining the thermal inertia parameters of a cookware, characterized in that, The cookware thermal inertia parameter determination system is used to implement the cookware thermal inertia parameter determination method as described in any one of claims 1-10, and the device includes: The first execution unit is configured to respond to a user's cooking start command by controlling the heating device to heat the cookware at a first preset power for a first preset duration. The second execution unit is used to control the power of the heating device to be reduced from a first preset power to a second preset power; The third execution unit is used to monitor the bottom temperature information and corresponding time information of the pot bottom; The fourth execution unit is used to take the bottom temperature information and the time information as inputs to the thermal inertia prediction model, determine the thermal inertia parameters of the cookware, and obtain the target thermal inertia parameters.

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