A slit valve with driver cooling and temperature regulation method

Abstract

The application discloses a kind of slit valve and temperature regulating method with driver cooling, slit valve includes valve seat, driver, valve box, valve plate and cooling unit;Driver is connected to valve seat;Valve box is connected to driver;Valve plate is connected to driver, when driver drives valve plate and inserts to valve box, valve plate closes valve box, when driver drives valve plate and moves away from valve box, valve plate moves to storage cavity, and synchronously opens valve box;Wherein, the cooling unit is used to start the cooling treatment of driver when driver exceeds preset working temperature range.It uses temperature sensor to obtain the temperature of driver, and the working mode of cooling unit is controlled by controller according to real-time temperature, so that the driver is dynamically cooled, the influence of high-temperature heat transfer of valve plate and the like on the lubricating grease in the driver is reduced, rapid deterioration of the lubricating grease is avoided, the service life of the driver is improved, the wafer manufacturing process is stably and reliably operated, and the production efficiency is improved.

Description

Technical Field

[0001] This invention relates to the field of slit valve temperature control, and more particularly to a slit valve with actuator cooling and a temperature regulation method. Background Technology

[0002] In semiconductor wafer manufacturing, critical processes such as wafer deposition, etching, and ion implantation must be completed within a specific reaction chamber (also known as a process chamber). These reaction chambers typically require high operating temperatures to ensure process stability and wafer fabrication accuracy. As a crucial sealing component between the reaction chamber and the wafer transport channel, the temperature performance of the slit valve directly impacts the chamber's sealing effect, wafer transport stability, and process yield. With the rapid development of microelectronics technology and continuous upgrades in wafer fabrication processes, the temperature requirements for slit valves have significantly increased. The slit valve temperature must be compatible with the high-temperature environment of the reaction chamber to prevent condensation of gas within the chamber and contamination of the wafer surface due to temperature differences, or to avoid insufficient temperature affecting sealing performance and ultimately impacting wafer fabrication quality. To increase the temperature of slit valves, current technologies often involve adding simple heating elements such as heating bands to the outside of the valve body. This external heating method has significant drawbacks: if the valve plate and valve box become too hot due to process requirements or external heating, the heat will be directly conducted to the actuator through the valve's structural components. The actuator, as the core moving part that enables the slit valve plate to open and close, is internally equipped with lubricating grease to reduce friction between moving parts and ensure smooth and reliable valve plate operation. However, the lubricating grease inside the actuator is highly sensitive to temperature. Under continuous high temperatures, the lubricating grease will accelerate evaporation, aging, and even carbonization. This not only significantly reduces the lubricating performance and service life of the grease but also increases friction between the moving parts inside the actuator, increasing operating resistance. This can lead to actuator jamming, failure, and other malfunctions, shortening the overall lifespan of the actuator, affecting the normal operation of the slit valve and even the entire wafer manufacturing equipment, increasing equipment maintenance costs, and reducing production efficiency. Summary of the Invention

[0003] The purpose of this invention is to overcome the shortcomings of the prior art and provide a slit valve with actuator cooling to solve the technical problem of existing high-temperature slit valves affecting the actuator.

[0004] To achieve the above objectives, the present invention adopts the following technical solution: In a first aspect, embodiments of the present invention provide a slit valve with actuator cooling, comprising: Valve seat, wherein the valve seat has a receiving cavity; A driver, which is connected to the valve seat; A valve housing, which is connected to the actuator; A valve plate is connected to the driver. When the driver drives the valve plate to be inserted into the valve box, the valve plate closes the valve box. When the driver drives the valve plate away from the valve box, the valve plate moves to the receiving cavity and simultaneously opens the valve box. The slit valve with actuator cooling further includes a cooling unit, which is used to initiate a cooling process for the actuator when the actuator exceeds a preset operating temperature range.

[0005] The cooling unit includes an air-cooled module.

[0006] The cooling unit includes a liquid cooling module.

[0007] The cooling unit further includes a controller and a first temperature sensor. The first temperature sensor is used to detect the operating temperature of the driver in real time, and the controller is used to obtain the detected temperature value of the first temperature sensor and control the operating mode of the air-cooled module or the liquid-cooled module.

[0008] The valve box is embedded with a first heating and temperature measuring component, which is electrically connected to the controller. The first heating and temperature measuring component is used to heat the valve box and simultaneously acquire the current temperature value.

[0009] The first heating and temperature measurement component includes a first heating rod and a second temperature sensor. The first heating rod is inserted into the valve box and controlled by the controller, and the second temperature sensor is electrically connected to the controller.

[0010] The valve seat is also embedded with a second heating and temperature measuring component, which is electrically connected to the controller. The second heating and temperature measuring component is used to preheat the valve plate and simultaneously acquire the current temperature value.

[0011] The second heating and temperature measuring component includes a second heating rod and a third temperature sensor. The second heating rod is inserted into the valve seat and controlled by the controller, and the third temperature sensor is electrically connected to the controller.

[0012] Secondly, embodiments of the present invention provide a temperature regulation method performed by a slit valve equipped with a driver cooling, the method comprising the following steps: The current operating temperature of the driver is acquired in real time and the temperature value is transmitted to the controller. The controller controls the operating mode of the cooling unit based on the acquired temperature value and preset control logic to regulate the temperature of the driver.

[0013] The temperature regulation method also includes the following steps: The second heating and temperature measurement component is activated to preheat the valve plate, and the current second temperature value of the valve plate is obtained in real time and transmitted to the controller. The first heating and temperature measurement component is activated to heat the valve box, and the current first temperature value of the valve box is obtained in real time and transmitted to the controller. The controller receives a first temperature value and a second temperature value, and controls the working power of the first heating rod and the second heating rod according to a preset control logic.

[0014] The present invention provides a slit valve with driver cooling and a temperature regulation method. It uses a temperature sensor to obtain the temperature of the driver and a controller to control the working mode of the cooling unit according to the real-time temperature. The controller dynamically and intelligently controls the driver cooling to keep the driver within the set working temperature range. This reduces the impact of high-temperature heat transfer from the valve plate and other components on the lubricating grease inside the driver, prevents the lubricating grease from deteriorating rapidly, improves the service life of the driver, ensures the stable and reliable operation of the wafer manufacturing process, and improves production efficiency.

[0015] The above description is merely an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention, it can be implemented according to the contents of the specification. In order to make the above and other objects, features and advantages of the present invention more obvious and understandable, preferred embodiments are described in detail below. Attached Figure Description

[0016] Figure 1 and Figure 2 This is a schematic diagram of the overall structure of the slit valve with driver cooling according to the first embodiment of the present invention at different angles.

[0017] Figure 3 This is a front view of the slit valve with actuator cooling according to the first embodiment of the present invention.

[0018] Figure 4 This is a schematic diagram of the back structure of a slit valve with actuator cooling according to the first embodiment of the present invention.

[0019] Figure 5 This is an exploded view of a slit valve with actuator cooling according to the first embodiment of the present invention.

[0020] Figure 6 and Figure 7 This is a schematic diagram of the overall structure of a slit valve with actuator cooling according to a second embodiment of the present invention from different perspectives.

[0021] Figure 8 This is an exploded view of a slit valve with actuator cooling according to a second embodiment of the present invention.

[0022] Explanation of reference numerals in the attached figures: The first slit valve 100 with actuator cooling includes a valve seat 11, an actuator 14, a valve box 12, a valve plate 13, a transfer port 121, a first cooling unit 101, an air-cooled module 19, a controller 18, a first temperature sensor 17, a first heating and temperature measuring component 15, a second heating and temperature measuring component 16, a first protective cover 191, and an air inlet 1911. The second slit valve 200 with actuator cooling includes a second cooling unit 201, a liquid-cooled module 29, a second protective cover 291, and a heat dissipation hole 2911. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0024] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0025] In the description of this invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0026] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. In this invention, terms such as "installed," "connected," "joined," and "fixed" should be interpreted broadly. For example, they can refer to a connection, a detachable connection, or an integral part; they can refer to a connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0027] In the description of this specification, references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. The illustrative expressions of the above terms in this specification should not be construed as necessarily referring to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0028] As a critical sealing component between the reaction chamber and the wafer transport channel, the slit valve's temperature performance directly affects the chamber's sealing effect, wafer transport stability, and process yield. With the rapid development of microelectronics technology and continuous upgrades in wafer fabrication processes, the temperature requirements for slit valves have also increased significantly. The slit valve temperature must be compatible with the high-temperature environment of the reaction chamber to avoid condensation of gas within the chamber and contamination of the wafer surface due to temperature differences between the slit valve and the chamber, or to prevent insufficient temperature from affecting sealing performance and ultimately impacting wafer processing quality. To improve the slit valve temperature, existing technologies often involve adding simple heating components such as heating bands to the outside of the valve body. However, this heating method has significant drawbacks: if the valve plate and valve box become too hot due to process requirements or external heating, heat will be directly conducted to the actuator through the slit valve's structural components. The actuator, as the core moving component that realizes the opening and closing action of the slit valve plate, is internally equipped with lubricating grease to reduce friction between moving parts and ensure the smoothness and reliability of the valve plate's opening and closing action. The lubricating grease inside the actuator is highly sensitive to temperature. Under sustained high temperatures, the grease will evaporate, age, and even carbonize more rapidly. This not only significantly reduces the lubricating performance and lifespan of the grease but also increases friction between moving parts inside the actuator, leading to increased operating resistance. This can cause actuator malfunctions such as jamming or failure, shortening the overall lifespan of the actuator, affecting the normal operation of the slit valve and even the entire wafer manufacturing equipment, increasing equipment maintenance costs, and reducing production efficiency. Based on these needs, this invention provides a slit valve with actuator cooling.

[0029] Please see Figures 1 to 5 In this first embodiment, the first slit valve 100 with driver cooling is used for semiconductor thin film deposition, etching and ion implantation processes, specifically for controlling the opening and closing of the wafer transfer port of the process chamber. When open, the wafer can enter and exit the process chamber, and when closed, a high-temperature, sealed, vacuum process environment is formed in the process chamber.

[0030] The first slit valve 100 with actuator cooling includes a slit valve (also called a slide gate valve) and a first cooling unit 101. The slit valve includes an actuator 14, and the first cooling unit 101 is used to activate a cooling process for the actuator 14 when its temperature exceeds a set range. The slit valve is mounted at the wafer transfer port of the process chamber; therefore, the high-temperature heat energy of the process chamber is conducted to the slit valve, thereby increasing the actuator temperature. In this embodiment, by providing the first cooling unit 101, the actuator temperature is activated to cool it when it exceeds a preset range, avoiding the adverse effects of excessively high actuator temperature.

[0031] Specifically, the slit valve further includes: Valve seat 11, wherein the valve seat 11 has a receiving cavity, such as Figure 1 From the view shown, the receiving cavity is vertically opened inside the valve seat 11; A driver 14 is connected to the valve seat 11; Valve housing 12, which is connected to the actuator 14; A valve plate 13 is connected to the drive end of the driver 14. When the driver 14 drives the valve plate 13 to insert into the valve box 12, the valve plate 13 closes the valve box 12. When the driver 14 drives the valve plate 13 away from the valve box 12, the valve plate 13 moves to the receiving cavity and simultaneously opens the valve box 12. That is, the driver 14 is used to drive the valve plate 13 to move relative to the valve box 12, thereby opening and closing the transfer port 121 of the valve box 12.

[0032] In this embodiment, as Figure 1 From the shown perspective, the valve seat 11 is positioned below the actuator 14, the valve box 12 is positioned above the actuator 14, and the valve plate 13 is connected to the drive end of the actuator 14. The actuator 14 drives the valve plate 13 to move vertically up and down. When the valve plate 13 moves to the wafer transfer port 121 of the valve box 12, the valve plate 13 and the valve box 12 are plugged in to close and seal the wafer transfer port 121. At this time, the process chamber assembled with it can enter a sealed state, allowing the process chamber to enter the processing preparation state. When the wafer processing is completed and it is necessary to remove the wafer from the process chamber, the actuator 14 drives the valve plate 13 to descend until the wafer transfer port 121 of the valve box 12 is fully opened. At the same time, the valve plate 13 descends into the receiving cavity inside the valve seat 11, and the wafer transfer robot extends into the process chamber from the open wafer transfer port 121 to remove the wafer.

[0033] The aforementioned driver 14 includes a gear and rack transmission mechanism driven by a cylinder or a gear and rack transmission mechanism driven by a motor, etc. Lubricating grease is provided between the meshing parts of the gear and rack transmission mechanism to improve the smoothness of the driver 14 and reduce friction and wear.

[0034] During semiconductor processing in the process chamber, valve plate 13 and valve box 12 are in a closed state. During this process, the process chamber, valve box 12, and valve plate 13 are all at high temperatures. Since the actuator 14 is connected to the valve plate 13 and in contact with the valve box 12, the high-temperature heat energy of the valve plate 13 and valve box 12 is transferred to the actuator 14. The actuator 14 contains lubricating grease, which is used to reduce friction between moving parts and ensure the smoothness and reliability of the valve plate opening and closing action. However, the lubricating grease inside the actuator is quite sensitive to temperature. Under continuous high temperature environment, the lubricating grease will accelerate volatilization, aging, and even carbonization. This will not only significantly reduce the lubricating performance and service life of the lubricating grease, but also lead to increased friction between moving parts inside the actuator and increased running resistance, which in turn will cause actuator jamming, failure, and other malfunctions, shortening the overall service life of the actuator, affecting the normal operation of the slit valve and even the entire wafer manufacturing equipment, increasing equipment maintenance costs, and reducing production efficiency. In order to reduce the impact of high temperature on the actuator 14 by the valve box 12 and valve plate 13, the first slit valve 100 with actuator cooling is provided with an independent first cooling unit 101. The first cooling unit 101 is used to start the cooling process of the actuator 14 when the actuator 14 exceeds the preset operating temperature range, so as to avoid the lubricating grease inside the actuator 14 being affected by high temperature.

[0035] In this first embodiment, the first cooling unit 101 includes an air-cooled module 19, which may be an air-supplying module such as a fan.

[0036] Furthermore, the first cooling unit 101 also includes a controller 18 and a first temperature sensor 17. The first temperature sensor 17 is used to detect the operating temperature of the driver 14 in real time, and the controller 18 is used to obtain the detected temperature value of the first temperature sensor 17 and control the operating mode of the air-cooled module 19.

[0037] For example, when the first temperature sensor 17 detects that the current temperature of the driver 14 exceeds 50 degrees Celsius, the controller 18 controls the airflow speed of the air-cooling module 19, that is, increases the fan speed and increases the airflow to quickly remove the heat from the driver 14 and cool it down rapidly. If the first temperature sensor 17 detects that the current temperature of the driver 14 exceeds 90 degrees Celsius, the airflow speed of the air-cooling module 19 is further increased to further improve the cooling efficiency. Of course, in other embodiments, when the controller 18 obtains the real-time temperature value of the driver 14, it can determine the output power of the air-cooling module 19 according to the temperature range of the driver 14. In this embodiment, the air-cooling module 19 has two fans, which are positioned at the same height below the driver 14 to deliver air to the location of the driver 14 and remove the heat transferred by the valve box 12 in the form of airflow. In other embodiments, the number of fans is adjusted according to the heat dissipation requirements.

[0038] Please refer to it again. Figures 1 to 5 The valve box 12 is embedded with a first heating and temperature measuring component 15, which is electrically connected to the controller 18. The first heating and temperature measuring component 15 is used to heat the valve box 12 and simultaneously acquire its current temperature value. The valve box 12 is connected to the process chamber; therefore, before wafer processing, the valve box 12 needs to be heated to the same temperature as the process chamber to avoid temperature fluctuations in the process chamber caused by the temperature difference between the valve box 12 and the process chamber, which would affect the wafer processing quality. In this embodiment, the first heating and temperature measuring component 15 is also controlled by the controller 18 to achieve centralized control.

[0039] Specifically, the first heating and temperature measurement component 15 includes a first heating rod and a second temperature sensor. The first heating rod is inserted into the valve box 12 and controlled by the controller 18, and the second temperature sensor is electrically connected to the controller 18. The controller 18 acquires the detected temperature value of the second temperature sensor in real time and controls the working power of the first heating rod according to the acquired temperature value, so that the valve box 12 and the valve plate 13 are kept at the same temperature as the process chamber.

[0040] The valve seat 11 is further embedded with a second heating and temperature measuring component 16, which is electrically connected to the controller 18. The second heating and temperature measuring component 16 is used to preheat the valve plate 13 and simultaneously acquire the current temperature value. The valve plate 13 is located in the storage cavity of the valve seat 11 (the valve seat 11 is always in a low-temperature working space). Before starting the wafer processing, the valve plate 13 needs to be preheated. When the valve plate 13 is inserted into the valve box 12, the first heating and temperature measuring component 14 is mainly used to heat the valve box 12 and maintain the temperature of the valve plate 13 and the valve box 12, while the second heating and temperature measuring component 16 is used to preheat or keep the valve plate 13 warm, so that the valve plate 13 is always maintained within the set temperature range during the opening or closing of the valve box 12, thereby improving work efficiency and reducing waiting time.

[0041] Similarly, the second heating and temperature measuring component 16 includes a second heating rod and a third temperature sensor. The second heating rod is inserted into the valve seat 11 and controlled by the controller 18, and the third temperature sensor is electrically connected to the controller 18. The controller 18 acquires the preheating temperature value of the valve plate 13 obtained by the third temperature sensor in real time and controls the heating power of the second heating rod according to the current temperature. The second heating and temperature measuring component 16 is controlled by the controller 18, also for the purpose of unified and centralized control.

[0042] Please refer to it again. Figure 5In this first embodiment, the air-cooled module 19 and the controller 18 are both located on the same side of the valve seat 11. The air-cooled module 19 and the controller 18 are also provided with a first protective cover 191. The first protective cover 191 is connected to the valve seat 11 and has a plurality of air inlets 1911.

[0043] Please see Figures 6 to 8 This is a schematic diagram of the structure of Embodiment 2. In the second embodiment, the second slit valve 200 with actuator cooling includes: Valve seat 11, wherein the valve seat 11 has a receiving cavity, such as Figure 6 From the view shown, the receiving cavity is vertically opened inside the valve seat 11; A driver 14 is connected to the valve seat 11; Valve housing 12, which is connected to the actuator 14; Valve plate 13 is connected to driver 14. When driver 14 drives valve plate 13 to be inserted into valve box 12, valve plate 13 closes valve box 12. When driver 14 drives valve plate 13 away from valve box 12, valve plate 13 moves to storage cavity and opens valve box 12 simultaneously.

[0044] When the valve plate 13 moves to the wafer transfer port 121 of the valve box 12, the valve plate 13 and the valve box 12 are plugged together to close and seal the wafer transfer port 121. At this time, the process chamber can enter a sealed state and enter the processing preparation state. When the wafer processing is completed and it is necessary to remove the wafer from the process chamber, the driver 14 drives the valve plate 13 to descend until the wafer transfer port 121 of the valve box 12 is fully opened. At the same time, the valve plate 13 descends into the receiving cavity in the valve seat 11.

[0045] In order to reduce the impact of high temperature on the actuator 14 by the valve box 12 and valve plate 13, the second slit valve 200 with actuator cooling also includes a second cooling unit 201. The second cooling unit 201 is used to start the cooling process of the actuator 14 when the actuator 14 exceeds the preset operating temperature range, so as to prevent the lubricating grease inside the actuator 14 from being affected by high temperature.

[0046] In this second embodiment, the second cooling unit 201 includes a liquid cooling module 29, which may be a module such as a heat exchanger that exchanges heat energy through liquid flow.

[0047] Furthermore, the second cooling unit 201 also includes a controller 18 and a first temperature sensor 17. The first temperature sensor 17 is used to detect the operating temperature of the driver 14 in real time, and the controller 18 is used to obtain the detected temperature value of the first temperature sensor 17 and control the operating mode of the liquid cooling module 29.

[0048] When the first temperature sensor 17 detects that the current temperature of the driver 14 exceeds 50 degrees Celsius, the controller 18 controls the delivery flow rate of the liquid cooling module 29, that is, increases the speed of the liquid delivery pump and increases the delivery liquid flow rate, so as to quickly remove the heat from the driver 14 and cool it down rapidly. If the current temperature of the driver 14 is even higher, the controller 18 controls the liquid cooling module 29 to operate at a higher cooling power to improve cooling efficiency.

[0049] Please refer to it again. Figures 6 to 8 The valve box 12 is embedded with a first heating and temperature measuring component 15, which is electrically connected to the controller 18. The first heating and temperature measuring component 15 is used to heat the valve box 12 and simultaneously acquire the current temperature value of the valve box 12.

[0050] Specifically, the first heating and temperature measuring component 15 includes: a first heating rod and a second temperature sensor. The first heating rod is inserted into the valve box 12 and controlled by the controller 18, and the second temperature sensor is electrically connected to the controller 18.

[0051] The valve seat 11 is also embedded with a second heating and temperature measuring component 16, which is electrically connected to the controller 18. The second heating and temperature measuring component 16 is used to preheat the valve plate 13 and simultaneously acquire the current temperature value.

[0052] Similarly, the second heating and temperature measuring component 16 includes a second heating rod and a third temperature sensor. The second heating rod is inserted into the valve seat 11 and controlled by the controller 18, and the third temperature sensor is electrically connected to the controller 18.

[0053] Please refer to it again. Figure 8 In this second embodiment, the liquid cooling module 29 and the controller 18 are both located on the same side of the valve seat 11. A second protective cover 291 is also provided outside the liquid cooling module 29 and the controller 18. The second protective cover 291 is connected to the valve seat 11 and has several heat dissipation holes 2911. Specifically, the liquid cooling module 29 is a reciprocating bent heat exchange tube with flowing coolant inside. The length of the heat exchange tube can be adjusted according to the heat dissipation efficiency requirements of the driver 14.

[0054] Please refer again to Embodiment 1 and Embodiment 2. In another embodiment, the air-cooled module 19 of Embodiment 1 and the liquid-cooled module 29 of Embodiment 2 can be used in combination. That is, the liquid-cooled module 19 and the liquid-cooled module 29 are set below the driver 14 at the same time. The driver 14 is cooled by both liquid cooling and air cooling. The liquid-cooled module 29 and the air-cooled module 19 can be started at the same time or at different times.

[0055] An embodiment of the present invention provides a temperature regulation method performed by either the first slit valve 1000 with actuator cooling or the second slit valve 200 with actuator cooling, the method comprising the following steps: The current operating temperature of the driver 14 is acquired in real time and the temperature value is transmitted to the controller 18. The real-time temperature of the driver 14 is detected by the first sensor 17 and the temperature value is transmitted to the controller 18 synchronously. The controller 18 controls the operating mode of the air-cooled module 19 and / or the liquid-cooled module 29 based on the acquired temperature value and preset control logic to regulate the temperature of the driver 14. The operating mode here mainly involves changing the fan speed to increase the airflow, or changing the refrigerant flow rate to increase the liquid delivery volume.

[0056] Furthermore, the temperature regulation method also includes the following steps: The second heating and temperature measuring component 16 is activated to preheat the valve plate 13, and the current second temperature value of the valve plate 13 is obtained in real time and transmitted to the controller 18. The first heating and temperature measuring component 15 is activated to heat the valve box 12, and the current first temperature value of the valve box 12 is obtained in real time and transmitted to the controller 18. The controller 18 receives the first temperature value and the second temperature value, and controls the working power of the first heating rod and the second heating rod according to the preset control logic.

[0057] This temperature regulation method uses a controller 18 to acquire the temperatures of the actuator 14, valve box 12, and valve plate 13 detected in real time by the first temperature sensor 17, the second temperature sensor, and the third temperature sensor, respectively. Combined with the working temperature of the process chamber, it performs comprehensive control to achieve intelligent dynamic temperature regulation of the slit valve, ensuring that the valve plate 13 and valve box 12 maintain a high degree of consistency with the temperature of the process chamber, ultimately improving wafer processing efficiency and quality.

[0058] The slit valve and temperature regulation method with driver cooling in this embodiment use a temperature sensor to obtain the driver temperature, and the controller controls the working mode of the cooling unit according to the real-time temperature to cool the driver and keep the driver within the set working temperature range. This reduces the impact of high-temperature heat transfer from the valve plate and other components on the lubricating grease inside the driver, prevents the lubricating grease from deteriorating rapidly, improves the service life of the driver, ensures the stable and reliable operation of the wafer manufacturing process, and improves production efficiency.

[0059] The above examples are merely illustrative of the technical content of the present invention to facilitate easier understanding by the reader, but do not imply that the implementation of the present invention is limited to these examples. Any technical extensions or re-creations made based on the present invention are protected by the present invention. The scope of protection of the present invention is defined by the claims.

Claims

1. A slit valve with actuator cooling, characterized in that, It includes a slit valve and a cooling unit. The slit valve includes an actuator, and the cooling unit is used to initiate a cooling process for the actuator when the actuator exceeds a preset operating temperature range.

2. The slit valve with actuator cooling according to claim 1, characterized in that, The cooling unit includes an air-cooled module and / or a liquid-cooled module.

3. The slit valve with actuator cooling according to claim 2, characterized in that, The cooling unit also includes a controller and a first temperature sensor. The first temperature sensor is used to detect the operating temperature of the driver in real time. The controller is used to obtain the detected temperature value of the first temperature sensor and control the operating mode of the air-cooled module or the liquid-cooled module.

4. The slit valve with actuator cooling according to claim 3, characterized in that, The slit valve includes: Valve seat, wherein the valve seat has a receiving cavity; A valve housing, which is connected to the actuator; A valve plate is connected to the driver. When the driver drives the valve plate to insert into the valve box, the valve plate closes the valve box. When the driver drives the valve plate away from the valve box, the valve plate moves to the receiving cavity and simultaneously opens the valve box.

5. The slit valve with actuator cooling according to claim 4, characterized in that, The valve box is embedded with a first heating and temperature measuring component, which is electrically connected to the controller. The first heating and temperature measuring component is used to heat the valve box and simultaneously acquire the current temperature value.

6. The slit valve with actuator cooling according to claim 5, characterized in that, The first heating and temperature measurement component includes: a first heating rod and a second temperature sensor. The first heating rod is inserted into the valve box and controlled by the controller, and the second temperature sensor is electrically connected to the controller.

7. The slit valve with actuator cooling according to claim 4, characterized in that, The valve seat is also embedded with a second heating and temperature measuring component, which is electrically connected to the controller. The second heating and temperature measuring component is used to preheat the valve plate and simultaneously acquire the current temperature value of the valve plate.

8. A method for temperature regulation of a slit valve, wherein the temperature regulation method is performed by a slit valve having actuator cooling as described in any one of claims 1 to 7, characterized in that, Includes the following steps: The current operating temperature of the driver is acquired in real time and the temperature value is transmitted to the controller. The controller controls the operating mode of the cooling unit based on the acquired temperature value and preset control logic to regulate the temperature of the driver.

9. The temperature regulation method for the slit valve according to claim 8, characterized in that, It also includes the following steps: The second heating and temperature measurement component is activated to preheat the valve plate, and the current second temperature value of the valve plate is obtained in real time and transmitted to the controller. The first heating and temperature measurement component is activated to heat the valve box, and the current first temperature value of the valve box is obtained in real time and transmitted to the controller. The controller receives a first temperature value and a second temperature value, and controls the working power of the first heating rod and the second heating rod according to a preset control logic.

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