A temperature control system and a temperature control method

Abstract

The application provides a temperature control system and a temperature control method. The system comprises a refrigeration device and a circulating device. The refrigeration device comprises a compressor, a condenser, an evaporator, a gas-liquid separator, a heat exchanger and a supercooling liquid accumulator. The supercooling liquid accumulator is used for supercooling treatment and storage of refrigerant. The heat exchanger is connected with an external heat source and used for heating the refrigerant output by the gas-liquid separator to control the suction superheat degree of the compressor. The application replaces the traditional hot gas bypass valve with the heat exchanger, so that all the refrigerant discharged by the compressor participates in refrigeration, the energy waste of the hot gas is avoided, and the refrigeration efficiency is improved. Meanwhile, the supercooling liquid accumulator improves the low-temperature load capacity, so that the equipment is miniaturized, and the investment cost and operation cost are reduced.

Description

Technical Field

[0001] This application relates to the field of temperature control technology, and more specifically, to a temperature control system and a temperature control method. Background Technology

[0002] Semiconductor temperature control devices are crucial equipment in the semiconductor integrated circuit manufacturing process. They provide circulating fluid at the required temperature to maintain the temperature of the process chambers. In practical applications, semiconductor temperature control devices precisely control temperature through cooling and heating processes. The process chambers require varying temperatures throughout the manufacturing process, with some chambers needing to periodically switch between -80°C and 20°C, resulting in significant load variations and high control precision requirements. This necessitates the design of cryogenic semiconductor temperature control devices. Traditional designs for cryogenic semiconductor temperature control devices incorporate hot gas bypass valves. Controlling the opening of these valves regulates the intake superheat balance system, preventing liquid refrigerant from being drawn into the compressor and causing liquid slugging damage.

[0003] However, in existing technologies, the use of hot gas to maintain system stability increases compressor energy consumption, reduces system refrigeration efficiency, requires a large amount of refrigerant, results in low refrigerant utilization, and necessitates larger compressors to increase load capacity at low temperatures, leading to increased equipment size and hindering miniaturization. This results in both high production costs and high energy consumption. Summary of the Invention

[0004] In view of this, the purpose of this application is to provide a temperature control system and a temperature control method to overcome the problems in the prior art.

[0005] In a first aspect, embodiments of this application provide a temperature control system, the system including a refrigeration device and a circulation device; the refrigeration device includes a compressor, a condenser, an evaporator, a gas-liquid separator, a heat exchanger, and a subcooled liquid receiver; The compressor outlet is connected to the inlet of the first heat exchange channel in the condenser, the outlet of the first heat exchange channel in the condenser is connected to the inlet of the subcooled liquid receiver, the outlet of the subcooled liquid receiver is connected to the inlet of the first heat exchange channel in the evaporator, the outlet of the first heat exchange channel in the evaporator is connected to the inlet of the gas-liquid separator, and the outlet of the gas-liquid separator is connected to the inlet of the compressor via the heat exchanger. The subcooled liquid receiver is also provided with an external cooling pipeline. The inlet end of the external cooling pipeline is connected to the outlet end of the first heat exchange channel in the condenser, and the outlet end of the external cooling pipeline is connected to the inlet end of the gas-liquid separator. The external cooling pipeline is located outside the liquid storage space in the subcooled liquid receiver and is used to cool the refrigerant stored in the liquid storage space. The first heat exchange channel in the heat exchanger is connected between the outlet end of the gas-liquid separator and the inlet end of the compressor, and the second heat exchange channel in the heat exchanger is connected to an external heat source. The inlet end of the second heat exchange channel in the evaporator is connected to the outlet end of the circulation device, and the inlet end of the circulation device is connected to the outlet end of the second heat exchange channel in the evaporator, so that the circulating liquid in the circulation device exchanges heat with the refrigerant in the first heat exchange channel in the evaporator. The subcooled liquid receiver subcools and stores the refrigerant, and the heat exchanger uses an external heat source to heat the refrigerant output from the gas-liquid separator in order to control the suction superheat of the compressor and maintain stable system operation.

[0006] In some technical solutions of this application, the external heat source is plant circulating water, the inlet end of the second heat exchange channel in the heat exchanger is connected to the plant circulating water supply pipeline, and the outlet end of the second heat exchange channel in the heat exchanger is connected to the plant circulating water return pipeline; a heat exchange valve is also provided at the inlet end of the second heat exchange channel in the heat exchanger to regulate the flow rate of the plant circulating water flowing into the second heat exchange channel.

[0007] In some technical solutions of this application, the external heat source is the high-temperature and high-pressure gaseous refrigerant discharged from the outlet end of the compressor; the inlet end of the second heat exchange channel in the heat exchanger is connected to the outlet end of the compressor, and the outlet end of the second heat exchange channel in the heat exchanger is connected to the inlet end of the condenser. The inlet end of the second heat exchange channel is also provided with a heat exchange three-way valve. The first port of the heat exchange three-way valve is connected to the outlet end of the compressor, the second port is connected to the inlet end of the second heat exchange channel in the heat exchanger, and the third port is connected to the inlet end of the first heat exchange channel in the condenser. The heat exchange three-way valve is used to regulate the flow rate of high-pressure hot gas diverted to the second heat exchange channel in the heat exchanger, so as to control the suction superheat of the compressor.

[0008] In some technical solutions of this application, the above-mentioned refrigeration device also includes an expansion valve, a subcooling valve, and a bypass valve; The expansion valve is located between the outlet end of the subcooled liquid receiver and the inlet end of the first heat exchange channel in the evaporator; The subcooling valve is located between the outlet end of the first heat exchange channel in the condenser and the inlet end of the external cooling pipe. The bypass valve is located between the outlet end of the compressor and the inlet end of the first heat exchange channel in the evaporator.

[0009] In some technical solutions of this application, the above system also includes a controller; The controller is used for: The opening degree of the expansion valve is calculated using a PID control algorithm based on the difference between the target temperature setpoint and the actual temperature of the circulating fluid. The opening degree of the subcooling valve is calculated using a PID control algorithm based on the difference between the target value of the intake pressure and the actual value of the intake pressure. The opening degree of the heat exchange valve is calculated using a PID control algorithm based on the difference between the target value of the intake temperature and the actual value of the intake temperature.

[0010] Secondly, embodiments of this application provide a temperature control method applied to the aforementioned temperature control system; the method includes: Based on the received temperature adjustment command from the load device, the valves in the temperature control system are controlled to allow the refrigerant in the refrigeration unit to circulate in the compressor, condenser, subcooled liquid receiver, evaporator, gas-liquid separator, and heat exchanger. The refrigerant exchanges heat with the circulating liquid in the circulation device through the evaporator to regulate the temperature of the circulating liquid, thereby controlling the temperature of the load device. During the refrigerant circulation process, the subcooled liquid receiver subcools and stores the refrigerant, and an external heat source in the heat exchanger heats the refrigerant output from the gas-liquid separator to control the suction superheat of the compressor and maintain stable system operation.

[0011] In some technical solutions of this application, the external heat source is plant circulating water, the inlet end of the second heat exchange channel in the heat exchanger is connected to the plant circulating water supply pipeline, and the outlet end of the second heat exchange channel in the heat exchanger is connected to the plant circulating water return pipeline; a heat exchange valve is also provided at the inlet end of the second heat exchange channel in the heat exchanger to regulate the flow rate of the plant circulating water flowing into the second heat exchange channel; The method further includes: calculating the opening degree of the heat exchange valve based on the difference between the target value of the intake temperature and the actual value of the collected intake temperature using a PID control algorithm, so as to adjust the flow rate of the plant circulating water flowing into the second heat exchange channel.

[0012] In some technical solutions of this application, the aforementioned external heat source is the high-temperature, high-pressure gaseous refrigerant discharged from the outlet end of the compressor; the inlet end of the second heat exchange channel in the heat exchanger is connected to the outlet end of the compressor, and the outlet end of the second heat exchange channel in the heat exchanger is connected to the inlet end of the condenser; a heat exchange three-way valve is also provided at the inlet end of the second heat exchange channel, the first port of the heat exchange three-way valve is connected to the outlet end of the compressor, the second port is connected to the inlet end of the second heat exchange channel in the heat exchanger, and the third port is connected to the inlet end of the first heat exchange channel in the condenser; The method further includes: calculating the opening degree of the heat exchange three-way valve based on the difference between the target value of the intake temperature and the actual value of the collected intake temperature using a PID control algorithm, so as to adjust the flow rate of the high-pressure hot gas diverted to the second heat exchange channel in the heat exchanger.

[0013] In some technical solutions of this application, the above-mentioned refrigeration device further includes an expansion valve, a subcooling valve, and a bypass valve; the expansion valve is disposed between the outlet end of the subcooled liquid receiver and the inlet end of the first heat exchange channel in the evaporator; the subcooling valve is disposed between the outlet end of the first heat exchange channel in the condenser and the inlet end of the external cooling pipe; the bypass valve is disposed between the outlet end of the compressor and the inlet end of the first heat exchange channel in the evaporator. The method further includes: when the system is under low load or no load, controlling the bypass valve to open, and bypassing part of the refrigerant to the inlet end of the first heat exchange channel in the evaporator, so as to maintain the system's suction pressure stable.

[0014] In some technical solutions of this application, the above system further includes a controller; the controller is used to perform the following steps: The opening degree of the expansion valve is calculated using a PID control algorithm based on the difference between the target temperature setpoint and the actual temperature of the circulating fluid. The opening degree of the subcooling valve is calculated using a PID control algorithm based on the difference between the target value of the intake pressure and the actual value of the intake pressure. The opening degree of the heat exchange valve is calculated using a PID control algorithm based on the difference between the target value of the intake temperature and the actual value of the intake temperature.

[0015] The technical solutions provided by the embodiments of this application may include the following beneficial effects: This application provides a temperature control system, which includes a refrigeration device and a circulation device. The refrigeration device includes a compressor, a condenser, an evaporator, a gas-liquid separator, a heat exchanger, and a subcooled liquid receiver. The compressor outlet is connected to the inlet of a first heat exchange channel in the condenser, the outlet of the first heat exchange channel in the condenser is connected to the inlet of the subcooled liquid receiver, the outlet of the subcooled liquid receiver is connected to the inlet of the first heat exchange channel in the evaporator, the outlet of the first heat exchange channel in the evaporator is connected to the inlet of the gas-liquid separator, and the outlet of the gas-liquid separator is connected to the inlet of the compressor via the heat exchanger. The subcooled liquid receiver is also provided with an external cooling pipe, the inlet of which is connected to the outlet of the first heat exchange channel in the condenser, and the outlet of which is connected to the gas-liquid separator. The external cooling pipe is located outside the liquid storage space in the subcooled liquid receiver and is used to cool the refrigerant stored in the liquid storage space. The first heat exchange channel in the heat exchanger is connected between the outlet end of the gas-liquid separator and the inlet end of the compressor, and the second heat exchange channel in the heat exchanger is connected to an external heat source. The inlet end of the second heat exchange channel in the evaporator is connected to the outlet end of the circulation device, and the inlet end of the circulation device is connected to the outlet end of the second heat exchange channel in the evaporator, so that the circulating liquid in the circulation device exchanges heat with the refrigerant in the first heat exchange channel in the evaporator. The subcooled liquid receiver subcools and stores the refrigerant, and the heat exchanger uses the external heat source to heat the refrigerant output from the gas-liquid separator to control the suction superheat of the compressor and maintain stable system operation.

[0016] This application controls the compressor's suction superheat by installing a heat exchanger in the refrigeration unit and using an external heat source to heat the refrigerant output from the gas-liquid separator. This replaces the traditional method of using a hot gas bypass valve to maintain stable system operation, allowing full utilization of the energy of the refrigerant discharged from the compressor, avoiding energy waste of hot gas, effectively improving the system's refrigeration efficiency and reducing operating energy consumption. At the same time, this application uses a subcooled liquid receiver to subcool and store the refrigerant, effectively improving the load-bearing capacity at low temperatures. This allows refrigeration requirements to be met without increasing the power of the compressor, condenser, and evaporator, and also reduces the amount of refrigerant charged, which is conducive to equipment miniaturization, thereby reducing investment and operating costs.

[0017] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 A schematic diagram of a temperature control system provided in an embodiment of this application is shown; Figure 2 A schematic diagram of another temperature control system provided in an embodiment of this application is shown; Figure 3 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. It should be understood that the accompanying drawings in this application are for illustrative and descriptive purposes only and are not intended to limit the scope of protection of this application. Furthermore, it should be understood that the schematic drawings are not drawn to scale. The flowcharts used in this application illustrate operations implemented according to some embodiments of this application. It should be understood that the operations in the flowcharts may not be implemented in sequence, and steps without logical contextual relationships may be reversed or implemented simultaneously. In addition, those skilled in the art, guided by the content of this application, may add one or more other operations to the flowcharts, or remove one or more operations from the flowcharts.

[0021] Furthermore, the described embodiments are merely some, not all, of the embodiments of this application. The components of the embodiments of this application described and illustrated herein can typically be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0022] It should be noted that the term "comprising" will be used in the embodiments of this application to indicate the presence of the features declared thereafter, but does not exclude the addition of other features.

[0023] Semiconductor temperature control devices are crucial equipment in the semiconductor integrated circuit manufacturing process. They provide circulating fluid at the required temperature to maintain the temperature of the process chambers. In practical applications, semiconductor temperature control devices precisely control temperature through cooling and heating processes. The process chambers require varying temperatures throughout the manufacturing process, with some chambers needing to periodically switch between -80°C and 20°C, resulting in significant load variations and high control precision requirements. This necessitates the design of cryogenic semiconductor temperature control devices. Traditional designs for cryogenic semiconductor temperature control devices incorporate hot gas bypass valves. Controlling the opening of these valves regulates the intake superheat balance system, preventing liquid refrigerant from being drawn into the compressor and causing liquid slugging damage.

[0024] However, in existing technologies, the use of hot gas to maintain system stability increases compressor energy consumption, reduces system refrigeration efficiency, requires a large amount of refrigerant, results in low refrigerant utilization, and necessitates larger compressors to increase load capacity at low temperatures, leading to increased equipment size and hindering miniaturization. This results in both high production costs and high energy consumption.

[0025] Based on this, this application provides a temperature control system and a temperature control method, which are described below through embodiments. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0026] Please see Figure 1 , Figure 1 This is a schematic diagram of a temperature control system provided in an embodiment of this application. Figure 1 As shown in the illustration, the temperature control system provided in this application embodiment includes a refrigeration device 100 and a circulation device 200. The refrigeration device 100 includes a compressor 112, a condenser 111, an evaporator 116, a gas-liquid separator 113, a heat exchanger 115, a subcooled liquid receiver 114, and control valves. The circulation device 200 is used to store, transport, and circulate circulating liquid, so that the circulating liquid exchanges heat with the refrigerant in the refrigeration device 100 when flowing through the evaporator 116, thereby regulating the temperature of the circulating liquid and thus controlling the temperature of the load equipment. The circulation device 200 may include, for example, a water tank and a water pump, wherein the inlet end of the water tank serves as the inlet end of the circulation device 200, the outlet end of the water tank is connected to the inlet end of the water pump, the outlet end of the water pump is connected to the liquid inlet corresponding to the load equipment, and the liquid outlet corresponding to the load equipment serves as the outlet end of the circulation device 200. Under the power of the water pump, the circulating liquid is drawn from the water tank and sucked into the water pump. After being pressurized by the water pump, it is transported to the load equipment. After exchanging heat with the load equipment, it returns to the water tank or returns to the water tank through the evaporator 116, forming a circulation loop.

[0027] The outlet end of the compressor 112 is connected to the inlet end of the first heat exchange channel in the condenser 111. The outlet end of the first heat exchange channel in the condenser 111 is connected to the inlet end of the subcooled liquid receiver 114. The outlet end of the subcooled liquid receiver 114 is connected to the inlet end of the first heat exchange channel in the evaporator 116 via the expansion valve 106. The outlet end of the first heat exchange channel in the evaporator 116 is connected to the inlet end of the gas-liquid separator 113. The outlet end of the gas-liquid separator 113 is connected to the inlet end of the compressor 112 via the heat exchanger 115.

[0028] In this process, compressor 112 draws in low-temperature, low-pressure gaseous refrigerant from evaporator 116 using mechanical energy, and then compresses it into high-temperature, high-pressure gaseous refrigerant. The high-temperature gaseous refrigerant is cooled and condensed into liquid by condenser 111, and then subcooled by subcooled liquid receiver 114. The subcooled liquid refrigerant is then throttled and depressurized by expansion valve 106 before entering evaporator 116, where it exchanges heat with circulating liquid in circulation device 200, absorbing heat from the circulating liquid and evaporating into low-temperature, low-pressure gas. The low-temperature, low-pressure gas enters gas-liquid separator 113, where any entrained liquid refrigerant is separated out. The pure gaseous refrigerant then enters heat exchanger 115, where it exchanges heat with an external heat source, absorbing heat to further ensure complete vaporization, and is finally drawn in by compressor 112.

[0029] The heat exchanger 115 uses an external heat source to heat the refrigerant, controlling the suction superheat of the compressor 112 and preventing liquid refrigerant from entering the compressor and causing liquid slugging. In this way, the refrigerant discharged from the compressor 112 is all cooled by the condenser 111 before participating in refrigeration, without the need to deduct a portion of the hot gas for bypass, avoiding energy waste of hot gas and improving refrigeration efficiency.

[0030] In one possible implementation, the external heat source is plant circulating water (water temperature ≥18℃). The inlet end of the second heat exchange channel in the heat exchanger 115 is connected to the plant circulating water supply pipeline, and the outlet end of the second heat exchange channel in the heat exchanger 115 is connected to the plant circulating water return pipeline. A heat exchange valve 103 is also provided at the inlet end of the second heat exchange channel in the heat exchanger 115 to regulate the flow rate of the plant circulating water flowing into the second heat exchange channel. Thus, when the system is operating at a low temperature of -80℃, the plant circulating water serves as a stable and reliable external heat source. By adjusting the opening of the heat exchange valve 103 using PID control, the water flow rate entering the heat exchanger 115 is precisely controlled, thereby maintaining the intake superheat within the set range and ensuring stable system operation.

[0031] However, the application of the above-described implementation method is limited when the factory site lacks the necessary circulating water system. Therefore, in another possible implementation method, such as... Figure 2As shown, the external heat source is the high-temperature, high-pressure gaseous refrigerant discharged from the outlet of the compressor 112. It should be noted that the hot gas is not directly bypassed back to the compressor's suction end, but rather diverted through the heat exchange three-way valve 103 into the heat exchanger 115 to release heat, and then flows into the inlet of the condenser 111 to continue participating in the refrigeration cycle. Therefore, this hot gas is also fully utilized. The inlet end of the second heat exchange channel in the heat exchanger 115 is connected to the outlet end of the compressor 112, and the outlet end of the second heat exchange channel in the heat exchanger 115 is connected to the inlet end of the first heat exchange channel in the condenser 111. The inlet end of the second heat exchange channel is also equipped with a heat exchange three-way valve 103. The first port of the heat exchange three-way valve 103 is connected to the outlet end of the compressor 112, the second port is connected to the inlet end of the second heat exchange channel in the heat exchanger 115, and the third port is connected to the inlet end of the first heat exchange channel in the condenser 111. The heat exchange three-way valve 103 is used to regulate the flow rate of high-pressure hot gas diverted to the second heat exchange channel in the heat exchanger 115, thereby controlling the suction superheat of the compressor 112. In this way, the high-temperature, high-pressure hot gas discharged from the system's own compressor 112 is used to heat the refrigerant, eliminating the need for an external water source. This ensures stable system operation while achieving self-circulation of internal energy, further improving the system's compactness and energy-saving effect.

[0032] The refrigeration device 100 also includes an expansion valve 106, a subcooling valve 105, and a bypass valve 107. The expansion valve 106 is located between the outlet end of the subcooled liquid receiver 114 and the inlet end of the first heat exchange channel in the evaporator 116, and is used to throttle and reduce the pressure of the refrigerant entering the evaporator 116 and control the refrigerant flow rate into the evaporator 116. The subcooling valve 105 is located between the outlet end of the first heat exchange channel in the condenser 111 and the inlet end of the external cooling pipe, and is used to adjust the refrigerant flow rate into the external cooling pipe of the subcooled liquid receiver 114, thereby controlling the subcooling degree of the refrigerant in the subcooled liquid receiver 114. The bypass valve 107 is located between the outlet end of the compressor 112 and the inlet end of the first heat exchange channel in the evaporator 116, and is used to bypass part of the refrigerant to the inlet end of the first heat exchange channel in the evaporator 116 when the system is under low load or no load, so as to maintain the stability of the suction pressure of the system and prevent the compressor 112 from stopping due to excessively low suction pressure.

[0033] During system operation, the system can be regulated by the controller using a triple PID control algorithm: based on the difference between the target temperature setpoint and the actual temperature of the circulating liquid, the PID control algorithm calculates the opening of the expansion valve 106 to provide sufficient cooling capacity to the circulating system; based on the difference between the target suction pressure and the actual suction pressure, the PID control algorithm calculates the opening of the subcooling valve 105 to ensure the suction pressure required at different temperature points, while simultaneously subcooling the refrigerant in the subcooling receiver 114 to increase its cooling capacity; based on the difference between the target suction superheat and the actual suction temperature, the PID control algorithm calculates the opening of the heat exchange valve or heat exchange three-way valve 103 to maintain the suction superheat within the required range, ensuring that the system operates in the most economical and stable state.

[0034] For example, in the control of expansion valve 106, the target temperature at the plate outlet (i.e., the target temperature of the circulating liquid) is set as TSV, the real-time temperature at the plate outlet TPV is collected, and the PID calculates the required cooling capacity output value MV1 (0≤MV1≤100). Then, the actual opening degree of expansion valve 106 EXP1=MV1×k1, where k1=f(TSV1, TSV2...TSVn) is the opening degree coefficient at the corresponding temperature point (0≤k1≤1), which is calibrated according to the system operating temperature range.

[0035] For example, in the control of the subcooling valve 105, based on the target suction pressure value PSV and the collected real-time suction pressure value PPV, the PID calculates the output value MV2 (0≤MV2≤100). Then, the actual opening degree of the subcooling valve 105 EXP2=MV2×k2 (0≤k2≤1) to ensure the suction pressure required at different temperature points. The target suction pressure value PSV can be set by the required evaporation temperature, T1=TSV-Ta (Ta≥5℃, the specific value is set according to the system conditions), and the target suction pressure value PSV=f(T1). The relationship between PSV and T1 can be obtained by looking up the relationship between the saturated vapor pressure and temperature of the corresponding refrigerant.

[0036] For example, in the control of the heat exchange valve or heat exchange three-way valve 103, based on the target suction temperature TSV2 and the collected real-time suction temperature TPV2, the PID calculates the output value MV3 (0≤MV3≤100). Then, the actual opening degree EXP3 of the heat exchange valve or heat exchange three-way valve 103 is EXP3 = MV3 × k3 (0≤k3≤1). According to the superheat formula: suction superheat = suction temperature - evaporation temperature, the target suction temperature TSV2 = T2 + T1, where T2 is the set suction superheat (T2≥3℃, the specific value is set according to the system conditions), thereby accurately controlling the suction superheat within a safe and efficient range.

[0037] Through the optimization of the above system and the corresponding control algorithm, this application avoids the waste of system energy caused by using hot gas to control the suction superheat while ensuring stable system operation. It ensures that all the refrigerant discharged from the compressor participates in refrigeration, effectively improving the system's refrigeration efficiency. This allows for the selection of smaller compressors in future system designs, reducing the refrigerant charge and enabling miniaturization of the equipment. This reduces both investment and operating costs while simultaneously improving the system's refrigeration efficiency.

[0038] This application also provides a temperature control method, which can be applied to the temperature control system described in any of the above embodiments, specifically as a controller in the temperature control system. The refrigeration device 100 includes a compressor 112, a condenser 111, an evaporator 116, a gas-liquid separator 113, a heat exchanger 115, a subcooled liquid receiver 114, and multiple valves; the circulation device 200 includes a water tank and a water pump. The controller, through communicative connection with each component in the temperature control system, can obtain the current operating parameters of each component and send control commands to each component to adjust its operating parameters.

[0039] Specifically, the temperature control method includes: According to the received temperature adjustment command from the load device, the valves in the temperature control system are controlled to allow the refrigerant in the refrigeration device 100 to circulate in the compressor 112, condenser 111, subcooled liquid receiver 114, evaporator 116, gas-liquid separator 113, and heat exchanger 115. The refrigerant exchanges heat with the circulating liquid in the circulation device 200 through the evaporator 116 to regulate the temperature of the circulating liquid, thereby controlling the temperature of the load device 300. During the refrigerant circulation process, the subcooled liquid receiver 114 is used to subcool and store the refrigerant, and the external heat source in the heat exchanger 115 is used to heat the refrigerant output from the gas-liquid separator 113 to control the suction superheat of the compressor 112 and maintain stable system operation.

[0040] In one possible implementation, the external heat source is plant circulating water. The inlet end of the second heat exchange channel in the heat exchanger 115 is connected to the plant circulating water supply pipeline, and the outlet end of the second heat exchange channel in the heat exchanger 115 is connected to the plant circulating water return pipeline. A heat exchange valve 103 is also provided at the inlet end of the second heat exchange channel in the heat exchanger 115 to regulate the flow rate of the plant circulating water flowing into the second heat exchange channel. The method further includes: calculating the opening degree of the heat exchange valve 103 based on the difference between the target value of the suction temperature and the actual value of the collected suction temperature using a PID control algorithm, so as to regulate the flow rate of the plant circulating water flowing into the second heat exchange channel.

[0041] In another possible implementation, the external heat source is the high-temperature, high-pressure gaseous refrigerant discharged from the outlet of the compressor 112; the inlet end of the second heat exchange channel in the heat exchanger 115 is connected to the outlet end of the compressor 112, and the outlet end of the second heat exchange channel in the heat exchanger 115 is connected to the inlet end of the first heat exchange channel in the condenser 111; a heat exchange three-way valve 103 is also provided at the inlet end of the second heat exchange channel, the first port of the heat exchange three-way valve 103 is connected to the outlet end of the compressor 112, the second port is connected to the inlet end of the second heat exchange channel in the heat exchanger 115, and the third port is connected to the inlet end of the first heat exchange channel in the condenser 111. The method further includes: calculating the opening degree of the heat exchange three-way valve 103 using a PID control algorithm based on the difference between the target suction temperature value and the actual suction temperature value, so as to adjust the flow rate of the high-pressure hot gas diverted to the second heat exchange channel in the heat exchanger 115.

[0042] Furthermore, the refrigeration device 100 also includes an expansion valve 106, a subcooling valve 105, and a bypass valve 107; the expansion valve 106 is disposed between the outlet end of the subcooled liquid receiver 114 and the inlet end of the first heat exchange channel in the evaporator 116; the subcooling valve 105 is disposed between the outlet end of the first heat exchange channel in the condenser 111 and the inlet end of the external cooling pipe; the bypass valve 107 is disposed between the outlet end of the compressor 112 and the inlet end of the first heat exchange channel in the evaporator 116. The method further includes: when the system is under low load or no load, controlling the bypass valve 107 to open, bypassing a portion of the refrigerant to the inlet end of the first heat exchange channel in the evaporator 116, so as to maintain a stable suction pressure of the system.

[0043] It should be noted that during system operation, the controller can use a triple PID control algorithm to regulate the system: based on the difference between the target temperature setpoint and the actual temperature of the circulating liquid, the PID control algorithm calculates the opening of the expansion valve 106 to provide sufficient cooling capacity to the circulating system; based on the difference between the target suction pressure and the actual suction pressure, the PID control algorithm calculates the opening of the subcooling valve 105 to ensure the suction pressure required at different temperature points, while simultaneously subcooling the refrigerant in the subcooling receiver 114 to increase its cooling capacity; based on the difference between the target suction superheat and the actual suction temperature, the PID control algorithm calculates the opening of the heat exchange valve or heat exchange three-way valve 103 to maintain the suction superheat within the required range, ensuring that the system operates in the most economical and stable state.

[0044] like Figure 3As shown, this application provides an electronic device for executing the temperature control method of this application. The device includes a memory, a processor, a bus, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, it implements the steps of the temperature control method described above.

[0045] Specifically, the aforementioned memory and processor can be general-purpose memory and processor, without any specific limitations. When the processor runs the computer program stored in the memory, it can execute the aforementioned temperature control method.

[0046] Corresponding to the temperature control method in this application, this application embodiment also provides a computer storage medium storing a computer program, which is executed by a processor to perform the steps of the above-described temperature control method.

[0047] Specifically, the storage medium can be a general-purpose storage medium, such as a removable disk or hard disk. When the computer program on the storage medium is run, it can execute the temperature control method described above.

[0048] In the embodiments provided in this application, it should be understood that the disclosed systems and methods can be implemented in other ways. The system embodiments described above are merely illustrative. For example, the division of units is only a logical functional division, and there may be other division methods in actual implementation. Furthermore, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Additionally, the coupling or direct coupling or communication connection shown or discussed may be through some communication interface; the indirect coupling or communication connection between systems or units may be electrical, mechanical, or other forms.

[0049] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment, depending on actual needs.

[0050] In addition, the functional units in the embodiments provided in this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.

[0051] If the aforementioned functions are implemented as software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or a portion of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0052] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. In addition, the terms "first", "second", "third", etc. are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0053] Finally, it should be noted that the above-described embodiments are merely specific implementations of this application, used to illustrate the technical solutions of this application, and not to limit them. The protection scope of this application is not limited thereto. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that any person skilled in the art can still modify or easily conceive of changes to the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some of the technical features, within the scope of the technology disclosed in this application; and these modifications, changes, or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application. All should be covered within the protection scope of this application. Therefore, the protection scope of this application should be determined by the protection scope of the claims.

Claims

1. A temperature control system, characterized in that, The system includes a refrigeration unit and a circulation unit; the refrigeration unit includes a compressor, a condenser, an evaporator, a gas-liquid separator, a heat exchanger, and a subcooled liquid receiver; The compressor outlet is connected to the inlet of the first heat exchange channel in the condenser, the outlet of the first heat exchange channel in the condenser is connected to the inlet of the subcooled liquid receiver, the outlet of the subcooled liquid receiver is connected to the inlet of the first heat exchange channel in the evaporator, the outlet of the first heat exchange channel in the evaporator is connected to the inlet of the gas-liquid separator, and the outlet of the gas-liquid separator is connected to the inlet of the compressor via the heat exchanger. The subcooled liquid receiver is also provided with an external cooling pipeline. The inlet end of the external cooling pipeline is connected to the outlet end of the first heat exchange channel in the condenser, and the outlet end of the external cooling pipeline is connected to the inlet end of the gas-liquid separator. The external cooling pipeline is located outside the liquid storage space in the subcooled liquid receiver and is used to cool the refrigerant stored in the liquid storage space. The first heat exchange channel in the heat exchanger is connected between the outlet end of the gas-liquid separator and the inlet end of the compressor, and the second heat exchange channel in the heat exchanger is connected to an external heat source. The inlet end of the second heat exchange channel in the evaporator is connected to the outlet end of the circulation device, and the inlet end of the circulation device is connected to the outlet end of the second heat exchange channel in the evaporator, so that the circulating liquid in the circulation device exchanges heat with the refrigerant in the first heat exchange channel in the evaporator. The subcooled liquid receiver subcools and stores the refrigerant, and the heat exchanger uses an external heat source to heat the refrigerant output from the gas-liquid separator in order to control the suction superheat of the compressor and maintain stable system operation.

2. The system according to claim 1, characterized in that, The external heat source is the plant circulating water. The inlet end of the second heat exchange channel in the heat exchanger is connected to the plant circulating water supply pipeline, and the outlet end of the second heat exchange channel in the heat exchanger is connected to the plant circulating water return pipeline. A heat exchange valve is also provided at the inlet end of the second heat exchange channel in the heat exchanger to regulate the flow rate of the plant circulating water flowing into the second heat exchange channel.

3. The system according to claim 1, characterized in that, The external heat source is the high-temperature, high-pressure gaseous refrigerant discharged from the outlet of the compressor; the inlet end of the second heat exchange channel in the heat exchanger is connected to the outlet end of the compressor, and the outlet end of the second heat exchange channel in the heat exchanger is connected to the inlet end of the condenser. The inlet end of the second heat exchange channel is also provided with a heat exchange three-way valve. The first port of the heat exchange three-way valve is connected to the outlet end of the compressor, the second port is connected to the inlet end of the second heat exchange channel in the heat exchanger, and the third port is connected to the inlet end of the first heat exchange channel in the condenser. The heat exchange three-way valve is used to regulate the flow rate of high-pressure hot gas diverted to the second heat exchange channel in the heat exchanger, so as to control the suction superheat of the compressor.

4. The system according to claim 1, characterized in that, The refrigeration device also includes an expansion valve, a subcooling valve, and a bypass valve; The expansion valve is located between the outlet end of the subcooled liquid receiver and the inlet end of the first heat exchange channel in the evaporator; The subcooling valve is located between the outlet end of the first heat exchange channel in the condenser and the inlet end of the external cooling pipe. The bypass valve is located between the outlet end of the compressor and the inlet end of the first heat exchange channel in the evaporator.

5. The system according to claim 4, characterized in that, The system also includes a controller; The controller is used for: The opening degree of the expansion valve is calculated using a PID control algorithm based on the difference between the target temperature setpoint and the actual temperature of the circulating fluid. The opening degree of the subcooling valve is calculated using a PID control algorithm based on the difference between the target value of the intake pressure and the actual value of the intake pressure. The opening degree of the heat exchange valve is calculated using a PID control algorithm based on the difference between the target value of the intake temperature and the actual value of the intake temperature.

6. A temperature control method, characterized in that, Applied to the temperature control system according to any one of claims 1 to 5; the method includes: Based on the received temperature adjustment command from the load device, the valves in the temperature control system are controlled to allow the refrigerant in the refrigeration unit to circulate in the compressor, condenser, subcooled liquid receiver, evaporator, gas-liquid separator, and heat exchanger. The refrigerant exchanges heat with the circulating liquid in the circulation device through the evaporator to regulate the temperature of the circulating liquid, thereby controlling the temperature of the load device. During the refrigerant circulation process, the subcooled liquid receiver subcools and stores the refrigerant, and an external heat source in the heat exchanger heats the refrigerant output from the gas-liquid separator to control the suction superheat of the compressor and maintain stable system operation.

7. The method according to claim 6, characterized in that, The external heat source is the plant circulating water. The inlet end of the second heat exchange channel in the heat exchanger is connected to the plant circulating water supply pipeline, and the outlet end of the second heat exchange channel in the heat exchanger is connected to the plant circulating water return pipeline. A heat exchange valve is also provided at the inlet end of the second heat exchange channel in the heat exchanger to regulate the flow rate of the plant circulating water flowing into the second heat exchange channel. The method further includes: calculating the opening degree of the heat exchange valve based on the difference between the target value of the intake temperature and the actual value of the collected intake temperature using a PID control algorithm, so as to adjust the flow rate of the plant circulating water flowing into the second heat exchange channel.

8. The method according to claim 6, characterized in that, The external heat source is the high-temperature, high-pressure gaseous refrigerant discharged from the compressor outlet; the inlet end of the second heat exchange channel in the heat exchanger is connected to the outlet end of the compressor, and the outlet end of the second heat exchange channel in the heat exchanger is connected to the inlet end of the condenser; a heat exchange three-way valve is also provided at the inlet end of the second heat exchange channel, the first port of the heat exchange three-way valve is connected to the outlet end of the compressor, the second port is connected to the inlet end of the second heat exchange channel in the heat exchanger, and the third port is connected to the inlet end of the first heat exchange channel in the condenser; The method further includes: calculating the opening degree of the heat exchange three-way valve based on the difference between the target value of the intake temperature and the actual value of the collected intake temperature using a PID control algorithm, so as to adjust the flow rate of the high-pressure hot gas diverted to the second heat exchange channel in the heat exchanger.

9. The method according to claim 6, characterized in that, The refrigeration device further includes an expansion valve, a subcooling valve, and a bypass valve; the expansion valve is located between the outlet end of the subcooled liquid receiver and the inlet end of the first heat exchange channel in the evaporator; the subcooling valve is located between the outlet end of the first heat exchange channel in the condenser and the inlet end of the external cooling pipe; the bypass valve is located between the outlet end of the compressor and the inlet end of the first heat exchange channel in the evaporator. The method further includes: when the system is under low load or no load, controlling the bypass valve to open, and bypassing part of the refrigerant to the inlet end of the first heat exchange channel in the evaporator, so as to maintain the system's suction pressure stable.

10. The method according to claim 9, characterized in that, The system also includes a controller; the controller is used to perform the following steps: The opening degree of the expansion valve is calculated using a PID control algorithm based on the difference between the target temperature setpoint and the actual temperature of the circulating fluid. The opening degree of the subcooling valve is calculated using a PID control algorithm based on the difference between the target value of the intake pressure and the actual value of the intake pressure. The opening degree of the heat exchange valve is calculated using a PID control algorithm based on the difference between the target value of the intake temperature and the actual value of the intake temperature.

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