Laser processing corner thermal field regulation method and device and storage medium

Abstract

The application discloses a laser processing corner heat field regulation method and device and a storage medium, and belongs to the technical field of laser processing. The method comprises the following steps: determining an angle attenuation factor based on the corner angle of a corner section in a processing path; determining a speed attenuation factor based on the processing speed of the corner section; multiplying a basic closing delay value by the angle attenuation factor and / or the speed attenuation factor to obtain a laser closing delay value; and controlling laser power to decrease based on the laser closing delay value in the corner section. The application can inhibit the heat input concentration caused by the speed reduction of a processing head at the corner, avoid the distortion of a molten pool appearance, reduce a heat affected zone, and improve the processing precision at the corner.

Description

Technical Field

[0001] This application relates to the field of laser processing technology, and in particular to a method, device and storage medium for controlling the corner thermal field in laser processing. Background Technology

[0002] In laser processing processes such as laser cutting, laser welding, and laser additive manufacturing, the processing head moves along a pre-planned processing path, which is usually composed of alternating straight and corner segments.

[0003] To ensure stability during processing, laser processing systems typically employ a fixed laser on / off delay control strategy. Before processing begins, the laser's on and off delay parameters are pre-set and remain constant throughout the process. When the processing head reaches a corner, the motion control system reduces its speed to change direction. However, the laser's output power and off delay do not adjust with the reduced speed; the laser continues to output power at the same level as during the straight-line segment.

[0004] Because the laser's shutdown delay remains fixed, the machining head moves at a lower speed in the corner section than in the straight section. This results in a longer dwell time for the laser beam per unit length of path in the corner section, leading to a corresponding increase in accumulated laser energy per unit area. Consequently, the heat input in the corner section is significantly higher than in the straight section. This concentration of heat input in the corner section causes a rapid increase in the molten pool temperature within a short period, distorting the molten pool morphology and reducing machining accuracy at the corner.

[0005] The above content is only used to help understand the technical solution of this application and does not represent an admission that the above content is prior art. Summary of the Invention

[0006] The main objective of this application is to provide a method, device, and storage medium for controlling the corner thermal field in laser processing, aiming to solve the technical problem of low processing accuracy at corners.

[0007] To achieve the above objectives, this application provides a method for controlling the corner thermal field in laser processing, the method comprising the following steps: Determine the angle attenuation factor based on the corner angle of the corner segment in the processing path; Based on the processing speed of the corner segment, determine the speed attenuation factor; Multiply the base shutdown delay value by the angle attenuation factor and / or the velocity attenuation factor to obtain the laser shutdown delay value; Within the corner segment, the laser power is controlled to decrease based on the laser shutdown delay value.

[0008] In one embodiment, the step of determining the angle attenuation factor based on the corner angle of the corner segment in the processing path includes: The corner angle is compared with a preset angle threshold. When the corner angle is not greater than the preset angle threshold, the angle attenuation factor is determined to increase as the corner angle increases; When the corner angle is greater than the preset angle threshold, the angle attenuation factor is determined to decrease as the corner angle increases.

[0009] In one embodiment, the step of determining the speed attenuation factor based on the processing speed of the corner segment includes: Obtain the preset maximum processing speed; Calculate the ratio of the processing speed to the maximum processing speed; The velocity decay factor is determined to decrease as the ratio increases.

[0010] In one embodiment, before the step of determining the angle attenuation factor based on the corner angle of the corner segment in the processing path, the method further includes: Obtain the current position of the processing head on the processing path; Calculate the distance between the current position and the corner point of the corner segment; When the distance is less than a preset distance threshold, the angle attenuation factor and the velocity attenuation factor are determined.

[0011] In one embodiment, the step of controlling the laser power to decrease based on the laser shutdown delay value within the corner segment includes: The laser shutdown delay value is divided into multiple sub-time periods; Obtain the initial power value of the laser when it enters the corner segment; During the multiple sub-time periods, the laser power is gradually reduced from the initial power value until it is reduced to a preset lower power limit.

[0012] In one embodiment, before the step of determining the angle attenuation factor based on the corner angle of the corner segment in the processing path, the method further includes: Obtain the melting point, thermal diffusivity, current temperature of the preheating zone, and rate of temperature change of the material to be processed; Calculate the temperature difference between the melting point and the current temperature of the preheated region; Multiply the thermal diffusivity by the temperature difference and then divide by the temperature change rate to determine the laser activation delay value; Before the processing start point, the laser is turned on in advance for preheating based on the laser turn-on delay value.

[0013] In one embodiment, after the step of controlling the laser power to decrease based on the laser shutdown delay value within the corner segment, the method further includes: Obtain the machining head movement speed during the idle segment after the corner segment; The idle delay value is determined based on the basic idle delay value and the speed of the processing head. The idle delay value decreases as the speed of the processing head increases. The transition duration of the idle segment is controlled based on the idle delay value.

[0014] In one embodiment, after the step of controlling the laser power to decrease based on the laser shutdown delay value within the corner segment, the method further includes: The temperature of the molten pool in the corner section is collected in real time; Calculate the temperature deviation between the molten pool temperature and the target temperature; Based on the temperature deviation, the laser shutdown delay value is adjusted using proportional-integral-derivative control.

[0015] In addition, to achieve the above objectives, this application also provides a corner thermal field control device for laser processing, the device comprising: a memory, a processor, and a computer program stored in the memory and executable on the processor, the computer program being configured to implement the steps of the corner thermal field control method for laser processing as described above.

[0016] In addition, to achieve the above objectives, this application also provides a storage medium, which is a computer-readable storage medium, on which a computer program is stored, and when the computer program is executed by a processor, it implements the steps of the laser processing corner thermal field control method as described above.

[0017] One or more technical solutions proposed in this application have at least the following technical effects: This application determines the angle attenuation factor based on the corner angle of the corner segment in the machining path, and the speed attenuation factor based on the machining speed of the corner segment. The two main factors affecting the heat input of the corner segment—the geometry of the corner and the motion state of the machining head—are converted into attenuation coefficients used to correct the laser shut-off delay. The base shut-off delay value is then multiplied by the angle attenuation factor and the speed attenuation factor to obtain a laser shut-off delay value that dynamically changes with the corner angle and machining speed. This replaces the fixed shut-off delay parameter in the prior art with a laser shut-off delay value that changes in real time with the machining path. Within the corner segment, the laser power is controlled to decrease gradually based on this laser shut-off delay value, causing the laser power to decrease over time. In this case, the heat input of the corner segment decreases accordingly as the machining head decelerates, suppressing the heat input concentration caused by the deceleration at the corner, preventing a sharp rise in the molten pool temperature, thus avoiding molten pool morphology distortion, reducing the heat-affected zone, and improving the machining accuracy at the corner. Attached Figure Description

[0018] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0019] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a flowchart illustrating the first embodiment of the corner thermal field control method for laser processing according to this application. Figure 2 This is a flowchart illustrating the second embodiment of the corner thermal field control method for laser processing according to this application. Figure 3 This is a flowchart illustrating the third embodiment of the laser processing corner thermal field control method of this application; Figure 4 This is a flowchart illustrating the fourth embodiment of the corner thermal field control method for laser processing according to this application. Figure 5 This is a flowchart illustrating the fifth embodiment of the corner thermal field control method for laser processing according to this application. Figure 6 This is a schematic diagram of the corner thermal field control device for laser processing in the hardware operating environment involved in the embodiments of this application.

[0021] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0022] It should be understood that the specific embodiments described herein are merely illustrative of this application and are not intended to limit this application.

[0023] To better understand the above technical solutions, the following will provide a detailed explanation of the technical solutions in conjunction with the accompanying drawings and specific implementation methods.

[0024] The main solution of this application embodiment is: based on the corner angle of the corner segment in the processing path, determine the angle attenuation factor; based on the processing speed of the corner segment, determine the speed attenuation factor; multiply the basic shutdown delay value with the angle attenuation factor and / or the speed attenuation factor to obtain the laser shutdown delay value; and within the corner segment, control the laser power to decrease based on the laser shutdown delay value.

[0025] In related technologies, laser processing systems typically employ a fixed laser switching delay control strategy. Before processing begins, the laser's on-time and off-time parameters are pre-set and remain constant throughout the process. When the processing head reaches a corner, the motion control system reduces its speed to change direction. However, the laser's output power and off-time do not adjust with this speed reduction; the laser continues to output power at the same level as in the straight section. Because the off-time remains fixed, the processing head's speed at the corner is lower than in the straight section. This results in a longer dwell time for the laser beam per unit length of path at the corner, leading to a corresponding increase in accumulated laser energy per unit area. Consequently, the heat input at the corner is significantly higher than in the straight section. This concentrated heat input at the corner causes a rapid increase in the molten pool temperature within a short time, distorting the molten pool morphology and reducing processing accuracy at the corner.

[0026] This application determines the angle attenuation factor based on the corner angle of the corner segment in the processing path, and determines the speed attenuation factor based on the processing speed of the corner segment. The two main factors affecting the heat input of the corner segment, namely the geometry of the corner and the motion state of the processing head, are converted into attenuation coefficients for correcting the laser shutdown delay. Then, the basic shutdown delay value is multiplied by the angle attenuation factor and the speed attenuation factor to obtain the laser shutdown delay value that dynamically changes with the corner angle and processing speed. Thus, the laser shutdown delay value that changes in real time with the processing path replaces the fixed shutdown delay parameter in the prior art. The laser power is controlled to decrease gradually within the corner segment based on the laser shutdown delay value, so that the laser power gradually decreases over time within the corner segment.

[0027] To better understand the above technical solutions, exemplary embodiments of this application will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of this application are shown in the drawings, it should be understood that this application can be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided to enable a more thorough understanding of this application and to fully convey the scope of this application to those skilled in the art.

[0028] It should be noted that the executing entity in this embodiment can be a laser processing system, or a computing service device with data processing, network communication, and program execution functions, such as a tablet computer, personal computer, or mobile phone, or an electronic device capable of performing the above functions, a corner thermal field control device for laser processing, etc. This embodiment does not specifically limit it. The following uses a laser processing system as an example to describe this embodiment and the following embodiments.

[0029] Based on this, embodiments of this application provide a method for controlling the corner thermal field in laser processing, referring to... Figure 1 , Figure 1 This is a flowchart illustrating the first embodiment of the corner thermal field control method for laser processing according to this application.

[0030] In this embodiment, the corner thermal field control method for laser processing includes steps S10~S40: Step S10: Determine the angle attenuation factor based on the corner angle of the corner segment in the processing path; In this embodiment, the laser processing system determines the angle attenuation factor based on the corner angle of the corner segment in the processing path, thereby transforming the geometric features of the corner into a quantitative parameter for subsequent laser power control. It should be noted that the angle attenuation factor is a dimensionless coefficient used to quantify the influence of the corner angle on the laser power attenuation requirement; a smaller angle attenuation factor indicates a stronger attenuation of the laser power required. The system calculates the angle attenuation factor in real time based on the attenuation coefficient driven by the corner angle. The laser processing system reads the corner angle of the corner segment in the processing path and, according to the pre-established mapping relationship between the corner angle and the angle attenuation factor, calculates in real time the angle attenuation factor matching the current corner segment.

[0031] Specifically, the laser processing system acquires the geometric information of the processing path, identifies the current corner segment within the path, and reads the corresponding corner angle. Reading the corner angle provides a quantitative basis for the degree of heat accumulation at the current corner segment, as the magnitude of the corner angle determines the drastic change in the direction of motion, and consequently, the increase in energy input per unit area after the laser beam decelerates. The laser processing system compares the read corner angle with a preset angle threshold to determine the numerical range of the corner angle. This comparison distinguishes different corner shapes and matches them with different attenuation rules, as corners in different angle ranges have different heat accumulation characteristics, requiring different mapping relationships to calculate the attenuation factor. Based on the numerical range of the corner angle, the laser processing system uses the corresponding mapping relationship to calculate the angle attenuation factor, quantitatively converting the geometric characteristics of the corner angle into an attenuation factor. This ensures that the attenuation factor accurately reflects the laser power attenuation intensity required for the current corner segment.

[0032] As an optional implementation, the laser processing system employs a piecewise mapping relationship when determining the angle attenuation factor. The laser processing system compares the corner angle with a preset angle threshold. When the corner angle is not greater than the preset angle threshold, the laser processing system determines that the angle attenuation factor increases with the increase of the corner angle. The principle is that within the range where the corner angle is not greater than the preset angle threshold, the corner is an acute angle. The smaller the corner angle, the more drastic the change in motion direction, the more significant the laser beam deceleration, and the more severe the heat accumulation, requiring stronger power attenuation. Therefore, the angle attenuation factor is set to a smaller value. As the corner angle increases, the corner shape gradually becomes smoother, the degree of heat accumulation decreases, and the angle attenuation factor increases accordingly. When the corner angle is greater than the preset angle threshold, the laser processing system determines that the angle attenuation factor decreases with the increase of the corner angle.

[0033] It should be noted that when the corner angle exceeds the preset angle threshold, the corner enters an obtuse angle state. Although the drastic change in the direction of a single movement decreases, the obtuse corner corresponds to a longer transition path. The laser beam deceleration duration in the corner segment is longer, and the power attenuation needs to be maintained for a longer shutdown delay. Therefore, the laser processing system makes the angle attenuation factor decrease as the corner angle increases, thereby extending the laser shutdown delay to cover the longer corner transition path.

[0034] As an alternative implementation, the laser processing system first determines whether the triggering conditions are met before determining the angle attenuation factor. If the triggering conditions are met, preheating is performed in conjunction with a laser activation delay before determining the angle attenuation factor. The laser processing system obtains the current position of the processing head on the processing path and calculates the distance between the current position and the corner point of the corner segment. When this distance is less than a preset distance threshold, the determination of the angle attenuation factor is triggered. The principle is that when the laser beam is on the straight section before the corner segment, the laser processing system pre-detects the proximity of the processing head to the corner point. When the proximity reaches the preset distance threshold, the corner thermal field control process is initiated in a timely manner, thereby ensuring that the angle attenuation factor calculation is completed before the laser beam enters the corner segment, avoiding delays in corner thermal field control due to calculation lag. Before determining the angle attenuation factor, the laser processing system obtains the melting point, thermal diffusivity, current temperature and temperature change rate of the material to be processed, calculates the temperature difference between the melting point and the current temperature of the preheating area, determines the laser start-up delay value based on the quotient of the thermal diffusivity multiplied by the temperature difference and divided by the temperature change rate, and starts the laser in advance for preheating based on the laser start-up delay value before the processing start point.

[0035] Optionally, the laser processing system preheats the area to be processed by activating the laser in advance, bringing the area to a near-melting point before the laser beam arrives for actual processing. This reduces thermal shock during processing. Preheating, along with the angle attenuation factor, constitutes a preliminary step in corner thermal field control. By converting the corner angle into an angle attenuation factor, a quantitative correlation is established between corner geometry and laser power attenuation requirements, allowing the laser power attenuation intensity to adaptively adjust with changes in corner shape.

[0036] Step S20: Determine the speed attenuation factor based on the processing speed of the corner segment; In this embodiment, the laser processing system determines a velocity attenuation factor based on the processing speed of the corner segment, thereby transforming the motion characteristics of the corner segment into a quantitative parameter for subsequent laser power control. The velocity attenuation factor is a dimensionless coefficient used to quantify the influence of processing speed on the laser power attenuation requirement; a smaller velocity attenuation factor indicates a stronger laser power attenuation is required. The technique used to determine the velocity attenuation factor is a real-time calculation technique for the attenuation coefficient driven by the motion parameter of processing speed. The laser processing system reads the processing speed of the corner segment and, based on a pre-established mapping relationship between processing speed and the velocity attenuation factor, calculates in real-time a velocity attenuation factor that matches the current motion state of the corner segment. The velocity attenuation factor and the angle attenuation factor characterize the degree of heat accumulation in the corner segment from two dimensions: motion state and geometric shape, respectively.

[0037] Specifically, the laser processing system acquires the processing speed at corner segments. This speed acquisition provides a quantitative basis for understanding the degree of heat accumulation at the current corner segment's motion state. A decrease in processing speed leads to a longer residence time of the laser beam per unit length path, increasing the accumulated laser energy per unit area and exacerbating heat accumulation. The system also acquires a preset maximum processing speed and calculates the ratio of the current processing speed to the maximum. This ratio normalizes the processing speeds, converting speeds with different ranges into dimensionless relative quantities, thus providing a unified benchmark for subsequent attenuation factor calculations. The laser processing system determines that the speed attenuation factor decreases as this ratio increases. This attenuation factor quantitatively transforms the relative levels of processing speed into a speed attenuation factor, ensuring that the factor accurately reflects the laser power attenuation intensity required by changes in processing speed. The laser processing system also determines the speed attenuation factor based on the correspondence between processing speed and speed attenuation factor. Its function is to match the laser shut-off delay value with the processing speed. When the processing speed is high, the time required for the laser beam to pass through the corner section is short, so the speed attenuation factor takes a smaller value, thereby shortening the laser shut-off delay value, so that the laser power can be reduced in time within the limited time window of the corner section. When the processing speed is low, the time required for the laser beam to pass through the corner section is long, so the speed attenuation factor takes a larger value, thereby prolonging the laser shut-off delay value, so that the laser power reduction process is smoother.

[0038] As an optional implementation, the laser processing system determines the velocity attenuation factor to decrease linearly as the ratio of the processing speed to the maximum processing speed increases. The principle is that this linear decreasing relationship intuitively establishes a continuous correspondence between processing speed and attenuation intensity. When the processing speed is close to the maximum processing speed, the laser beam deceleration at corners is small, the velocity attenuation factor is close to its maximum value, and the additional attenuation to laser power is weak. When the processing speed is much lower than the maximum processing speed, the laser beam deceleration at corners is large, the velocity attenuation factor takes a smaller value, and a stronger attenuation is applied to the laser power.

[0039] As an alternative implementation, the laser processing system determines the velocity attenuation factor to decrease non-linearly as the ratio of the processing speed to the maximum processing speed increases, for example, by employing an exponential or stepwise decreasing relationship. The principle is that the degree of heat accumulation at corner sections increases sharply as the processing speed decreases. A non-linear decreasing relationship provides a more sensitive attenuation response in the lower processing speed range, causing the velocity attenuation factor to decrease faster in the low-speed range. This results in stronger power attenuation at low-speed corner sections where heat accumulation is more severe, while avoiding insufficient attenuation in the high-speed range due to an overly gradual change in the attenuation factor.

[0040] Step S30: Multiply the basic shutdown delay value by the angle attenuation factor and / or velocity attenuation factor to obtain the laser shutdown delay value; In this embodiment, the laser processing system multiplies the basic shutdown delay value by the angle attenuation factor and the velocity attenuation factor to obtain a laser shutdown delay value that comprehensively reflects the corner geometry and motion state. The basic shutdown delay value refers to a pre-set laser shutdown delay reference parameter for a specific processing technology, representing the reference duration of the laser power reduction process without considering differences in corner angle and processing speed. The actual laser shutdown delay value, on the other hand, refers to the actual laser shutdown delay duration obtained after comprehensively considering the influence of corner angle and processing speed, which determines the duration of the laser power reduction process within the corner segment. The technique used to obtain the laser shutdown delay value is a multi-attenuation factor product synthesis technique. The laser processing system multiplies the basic shutdown delay value by the angle attenuation factor and the velocity attenuation factor respectively, superimposing the geometric dimension correction and the motion dimension correction onto the reference delay.

[0041] Specifically, the laser processing system acquires a preset baseline shutdown delay value. This baseline shutdown delay value serves to determine the reference time scale for the laser power reduction process, providing a multiplicand for the weighted attenuation factor. The laser processing system multiplies the baseline shutdown delay value by an angle attenuation factor, geometrically correcting the baseline shutdown delay based on the angular characteristics of the corner segment. This ensures the shutdown delay reflects the impact of the corner angle on heat accumulation; a smaller angle attenuation factor results in a greater reduction in shutdown delay, corresponding to stronger and faster power attenuation. The laser processing system also multiplies the baseline shutdown delay value by a velocity attenuation factor. This multiplication corrects the baseline shutdown delay based on the motion characteristics of the corner segment, ensuring the shutdown delay reflects the impact of processing speed on heat accumulation. A smaller velocity attenuation factor results in a greater reduction in shutdown delay. The laser processing system then combines the results corrected by the angle attenuation factor and the velocity attenuation factor to obtain the final laser shutdown delay value.

[0042] As an optional implementation, the laser processing system multiplies the basic shutdown delay value simultaneously by both the angle attenuation factor and the velocity attenuation factor. That is, the basic shutdown delay value is first multiplied by the angle attenuation factor and then by the velocity attenuation factor to obtain the laser shutdown delay value. Heat accumulation at corners is affected by both the corner angle and the processing speed. By simultaneously adding these two attenuation factors to the basic shutdown delay value, the laser shutdown delay value can respond to changes in both geometry and motion, forming a complete joint correction for heat accumulation at corners.

[0043] As an alternative implementation, the laser processing system selectively multiplies the basic shutdown delay value by only the angle attenuation factor or only the velocity attenuation factor, based on the actual characteristics of the corner segment, to obtain the laser shutdown delay value. Specifically, for corner segments dominated by geometric changes, heat accumulation is mainly determined by the corner angle; in this case, only the angle attenuation factor is needed for correction. For corner segments dominated by changes in motion velocity, heat accumulation is mainly determined by the processing speed; in this case, only the velocity attenuation factor is needed for correction. Selectively using a single attenuation factor can reduce computational complexity while ensuring the correction effect and avoiding redundant corrections of irrelevant factors.

[0044] Step S40: Within the corner segment, control the laser power to decrease based on the laser shutdown delay value.

[0045] In this embodiment, the laser processing system controls the laser power to decrease gradually within the corner section based on the laser shutdown delay value, thereby reducing the heat input at the corner section and suppressing heat accumulation caused by the reduction in processing head speed. Laser power reduction refers to the process of gradually decreasing the laser output power from its initial value within the corner section. The technology used to control the laser power reduction is a power gradient control technique based on the laser shutdown delay value. The laser processing system uses the laser shutdown delay value as a time reference and controls the laser output power to gradually decrease within the corner section according to the time length determined by the laser shutdown delay value, thereby achieving time modulation of the heat input at the corner section.

[0046] Furthermore, the core idea of ​​the progressive attenuation algorithm is to dynamically adjust the T_off value based on the corner angle θ and the processing speed v, so that the laser energy gradually attenuates at the corner rather than being instantaneously cut off. The attenuation function of T_off is defined as: T_off(θ, v) = T_off_base × f(θ) × g(v), where f(θ) is the angle attenuation factor and g(v) is the speed attenuation factor. For example, the angle attenuation factor f(θ) uses a piecewise function. When θ ≤ 45°, f(θ) = 0.3 + 0.7 × (θ / 45). When 45° < θ ≤ 90°, f(θ) = 1.0 - 0.3 × ((θ - 45) / 45). When θ > 90°, f(θ) = 0.7 - 0.2 × ((θ - 90) / 90). The speed decay factor g(v) is a linear function: g(v) = 1.0 - 0.5 × (v / v_max), where v_max is the maximum processing speed.

[0047] Specifically, the laser processing system acquires the initial power value of the laser beam when it enters the corner section. Acquiring this initial power value determines the starting point of power reduction, providing a reference power level for the subsequent reduction process. The system then determines the duration of power reduction based on the laser shutdown delay. This duration translates the laser shutdown delay into a time window for the power reduction process, ensuring the duration of power reduction matches the degree of heat accumulation in the corner section. Within the corner section, the system gradually reduces the laser power from the initial power value. This gradual reduction ensures a smooth decrease in heat input over time, preventing sudden power drops that could cause rapid solidification of the molten pool, while also avoiding a slow power reduction that would prevent the timely release of accumulated heat.

[0048] As an optional implementation, the laser processing system divides the laser shutdown delay value into multiple sub-time periods, obtains the initial power value of the laser power when it enters the corner segment, and gradually reduces the laser power from the initial power value within multiple sub-time periods until it is reduced to a preset lower power limit. Dividing the decreasing process corresponding to the laser shutdown delay value into multiple sub-time periods ensures that the laser power decreases in a step-like manner rather than a sudden drop, forming a power transition between adjacent sub-time periods. This suppresses heat accumulation while maintaining a gradient decrease in the molten pool temperature, avoiding sudden solidification defects.

[0049] As an alternative implementation, after controlling the laser power to decrease, the laser processing system acquires the processing head speed during the idle segment after the corner section. Based on the basic idle delay value and the processing head speed, it determines the idle delay value, which decreases as the processing head speed increases. The transition time of the idle segment is then controlled based on this idle delay value. During the idle segment, the processing head moves at high speed, and the idle delay value adaptively adjusts with the movement speed. This shortens the transition time during high-speed idle to maintain thermal continuity and lengthens the transition time during low-speed idle to ensure sufficient heat dissipation. Furthermore, after controlling the laser power to decrease, the laser processing system also collects the molten pool temperature in real-time during the corner section, calculates the temperature deviation between the molten pool temperature and the target temperature, and adjusts the laser shut-off delay value based on the temperature deviation using proportional-integral-derivative control. The principle is that by collecting the molten pool temperature in real-time to form a closed-loop feedback, the deviation between the actual molten pool temperature and the target temperature is used as the adjustment basis to dynamically adjust the laser shut-off delay value, upgrading the corner section thermal field control from open-loop preset attenuation to closed-loop adaptive regulation.

[0050] For example, when the laser power is initially 1500 watts when entering the corner segment, and the preset power lower limit is 1200 watts, the laser processing system gradually reduces the laser power from 1500 watts to 1200 watts within the time corresponding to the laser shut-off delay value, thereby preventing the temperature of the molten pool at the corner from exceeding the overheating temperature of the material.

[0051] This embodiment determines an angle attenuation factor based on the corner angle and a speed attenuation factor based on the processing speed of the corner segment. The laser shutdown delay value is obtained by multiplying the base shutdown delay value by the angle and speed attenuation factors. Within the corner segment, the laser power is controlled to decrease based on this shutdown delay value, achieving joint control of geometric and motion dimension corrections for the laser power reduction process at the corner segment. Compared to existing methods where fixed laser switch delay parameters cannot be adjusted in real-time according to changes in the processing path, this embodiment enables the laser shutdown delay value to adaptively change with the corner angle and processing speed, thereby suppressing heat accumulation at the corner caused by the reduction in processing head speed, reducing the heat-affected zone, and improving corner processing accuracy.

[0052] Based on the same inventive concept, this application also provides a second embodiment, referring to... Figure 2 , Figure 2 This is a flowchart illustrating the second embodiment of the corner thermal field control method for laser processing according to this application.

[0053] In this embodiment, the corner thermal field control method for laser processing further includes steps S11 to S13: Step S11: Obtain the current position of the machining head on the machining path; Step S12: Calculate the distance between the current position and the corner point of the corner segment; Step S13: When the distance is less than the preset distance threshold, determine the angle attenuation factor and the velocity attenuation factor.

[0054] In this embodiment, before the processing head enters the corner section, the laser processing system determines whether to activate corner thermal field control based on the real-time distance between the processing head and the corner point, and initiates the determination of angle attenuation factor and velocity attenuation factor when the distance meets the conditions. Distance triggering refers to the triggering mechanism in which the laser processing system uses the distance between the processing head and the corner point as the basis for determining whether to activate corner thermal field control. The preset distance threshold is a pre-set distance limit value used to determine whether the processing head is approaching the corner section. When the distance between the processing head and the corner point is less than the preset distance threshold, the distance triggering condition is met. The distance triggering technology used is a position detection-based control timing judgment technology. The laser processing system detects the position of the processing head in real time and calculates the distance between it and the corner point, compares the distance with the preset distance threshold, and thus determines the timing for activating corner thermal field control.

[0055] Specifically, the laser processing system acquires the current position of the processing head on the processing path in real time. This current position serves as a real-time coordinate reference for subsequent distance calculations, and is obtained through position feedback signals from the motion control system. The laser processing system calculates the distance between the current position and the corner point of the corner segment. This distance calculation quantifies the proximity between the processing head and the corner point, and is obtained by calculating the difference between the coordinates of the current position and the corner point. The laser processing system compares the calculated distance with a preset distance threshold to determine whether the processing head has entered the proximity range required to initiate corner thermal field control. When the distance is less than the preset distance threshold, the laser processing system triggers the determination of the angle attenuation factor and the velocity attenuation factor. This triggering ensures that the control process is initiated before the processing head officially enters the corner segment, guaranteeing that the angle attenuation factor and the velocity attenuation factor are calculated before the corner segment processing begins.

[0056] This embodiment obtains the current position of the processing head and calculates its distance to the corner point. When the distance is less than a preset distance threshold, it triggers the determination of the angle attenuation factor and the velocity attenuation factor, thus setting a clear start time for corner thermal field control. The laser processing system coordinates the calculation of the attenuation factor with the timing of the processing head entering the corner segment. It initiates the control process in a timely manner when the processing head approaches the corner segment, avoiding unnecessary calculation overhead caused by premature control and avoiding lag in corner segment thermal field control caused by late control, thereby improving the real-time performance and accuracy of corner thermal field control.

[0057] Since the system described in Embodiment 2 of this application is a system used to implement the method of Embodiment 1 of this application, those skilled in the art can understand the specific structure and variations of the system based on the method described in Embodiment 1 of this application, and therefore will not be described again here. All systems used in the methods of the embodiments of this application fall within the scope of protection of this application.

[0058] Based on the same inventive concept, this application also provides a third embodiment, referring to... Figure 3 , Figure 3 This is a flowchart illustrating the third embodiment of the corner thermal field control method for laser processing according to this application.

[0059] In this embodiment, the corner thermal field control method for laser processing further includes steps S01 to S04: Step S01: Obtain the melting point, thermal diffusivity, current temperature of the preheating zone, and temperature change rate of the material to be processed; Step S02: Calculate the temperature difference between the melting point and the current temperature of the preheated region; Step S03: Determine the laser activation delay value by multiplying the thermal diffusivity by the temperature difference and then dividing by the rate of temperature change. Step S04: Before the processing start point, the laser is turned on in advance for preheating based on the laser turn-on delay value.

[0060] In this embodiment, before the formal processing begins, the laser processing system determines the laser's pre-on time based on the thermophysical properties of the material to be processed and the thermal state of the preheated area. Based on this, the laser is pre-on to preheat the area to be processed, ensuring it reaches a temperature close to its melting point before the formal processing begins. The laser on-time delay refers to the time the laser is pre-on relative to the processing start point. Preheating refers to the operation of the laser processing system pre-onting the area to be processed before the formal processing begins. The preheating technique used is a preheating control technology based on material phase change parameters. The laser processing system calculates the laser on-time delay value based on the temperature difference between the melting point and the current temperature of the preheated area, combined with the thermal diffusivity and temperature change rate, thereby determining the pre-on time of the laser.

[0061] Specifically, the laser processing system acquires the melting point, thermal diffusivity, current temperature of the preheating area, and rate of temperature change of the material to be processed. These parameters provide the material's thermal properties and thermal state parameters for calculating the laser on-time delay. The melting point determines the target temperature level that preheating needs to achieve, the thermal diffusivity determines the ability of heat to diffuse within the material, and the rate of temperature change determines how quickly the temperature rises in the preheating area. The laser processing system calculates the temperature difference between the melting point and the current temperature of the preheating area. This temperature difference quantifies the gap between the current thermal state of the preheating area and the target thermal state; a larger temperature difference indicates that the preheating area is further from the melting state. The laser processing system determines the laser on-time delay by multiplying the thermal diffusivity by the temperature difference and then dividing by the rate of temperature change. This determination integrates the temperature difference, thermal diffusivity, and rate of temperature change into a single time parameter. The laser on-time delay increases with increasing temperature difference and decreases with increasing rate of temperature change. The laser processing system preheats the area to be processed by turning on the laser based on the laser start-up delay value before the processing begins. The purpose of turning on the laser in advance is to allow the area to be processed to be heated to a temperature close to the melting point before the actual processing begins.

[0062] At the starting point or corner entry point of processing, the initial T_on value is obtained according to the mapping relationship library, and a lead time control strategy is introduced. The formula for calculating the lead time ΔT_on is ΔT_on=α×(T_melt-T_pre) / (dT / dt), where α is the thermal diffusivity of the material, T_melt is the melting point of the material, T_pre is the current temperature of the preheating area, and dT / dt is the temperature change rate. By turning on the laser in advance, the preheating area reaches the optimal thermal state before the processing head arrives, reducing the thermal shock effect in the initial stage and improving the stability of the molten pool formation.

[0063] In this embodiment, the laser processing system pre-heats the area to be processed to a state close to the melting point before the actual processing begins, reducing the thermal shock at the start of the actual processing and making the initial thermal state of the corner section more stable, thereby avoiding processing instability caused by excessively low initial temperature.

[0064] Since the system described in Embodiment 3 of this application is a system used to implement the method of Embodiment 1 of this application, those skilled in the art can understand the specific structure and variations of the system based on the method described in Embodiment 1 of this application, and therefore will not be described again here. All systems used in the methods of the embodiments of this application fall within the scope of protection of this application.

[0065] Based on the same inventive concept, this application also provides a fourth embodiment, referring to... Figure 4 , Figure 4 This is a flowchart illustrating the fourth embodiment of the corner thermal field control method for laser processing in this application.

[0066] In this embodiment, the corner thermal field control method for laser processing further includes steps S41 to S43: Step S41: Obtain the machining head movement speed during the idle segment after the corner segment; Step S42: Determine the idle delay value based on the basic idle delay value and the machining head movement speed. The idle delay value decreases as the machining head movement speed increases. Step S43: Control the transition duration of the idle segment based on the idle delay value.

[0067] In this embodiment, after the laser processing system completes processing in the corner section, it determines the idle delay duration based on the movement speed of the processing head in the idle section, and controls the transition duration of the idle section accordingly. The idle section refers to the segment where the laser is turned off and the processing head moves without processing material. The basic idle delay value refers to the preset reference value for the idle transition duration. The actual idle delay value refers to the value of the idle transition duration determined after comprehensively considering the movement speed of the processing head. The technology used for idle delay control is a negative feedback adjustment technology based on movement speed. The laser processing system determines the idle delay value based on the basic idle delay value and the movement speed of the processing head, so that the idle delay value decreases as the movement speed of the processing head increases, thereby achieving a continuous transition of the thermal field in the idle section.

[0068] Specifically, the laser processing system acquires the processing head's movement speed during the idle segment after the corner section. Acquiring this speed provides a basis for determining the idle delay value, as the processing head's speed in the idle segment determines the actual idle time. The laser processing system determines the idle delay value based on the basic idle delay value and the processing head's movement speed. Determining the idle delay value correlates the idle delay with the movement speed, causing the idle delay value to decrease as the processing head's movement speed increases. When the movement speed is high, the idle segment time is short, and the idle delay value decreases accordingly to maintain thermal continuity. When the movement speed is low, the idle segment time is long, and the idle delay value increases accordingly to ensure sufficient heat dissipation. The laser processing system controls the transition duration of the idle segment based on the idle delay value. Controlling the transition duration ensures that the thermal field changes in the idle segment match the movement state of the processing head, preventing thermal field interruption or excessive heat loss during the idle segment.

[0069] For example, a negative feedback adjustment mechanism is established between the idle delay T_idle and the machining head movement speed v. The dynamic adjustment formula is T_idle_new = T_idle_base × (1 - v / 2000), where v is the movement speed and T_idle_base is the base idle delay. When the machining head moves at high speed during idle travel, for example, v > 1000 mm / s, T_idle_new decreases significantly, maintaining the continuity of the thermal field. When moving at low speed, for example, v < 500 mm / s, T_idle_new increases, allowing sufficient heat dissipation and avoiding excessive heat accumulation. This negative feedback mechanism achieves dynamic balance of the thermal field state by automatically calculating and updating the T_idle value through real-time monitoring of the machining head speed.

[0070] In this embodiment, the laser processing system matches the transition time of the idle segment with the movement speed of the processing head. During high-speed idle, the transition time is shortened to maintain the continuity of the thermal field, and during low-speed idle, the transition time is extended to fully dissipate heat, thereby ensuring the stability of the initial thermal state of the subsequent processing segment.

[0071] Since the system described in Embodiment 4 of this application is a system used to implement the method of Embodiment 1 of this application, those skilled in the art can understand the specific structure and variations of the system based on the method described in Embodiment 1 of this application, and therefore will not be described again here. All systems used in the methods of the embodiments of this application fall within the scope of protection of this application.

[0072] Based on the same inventive concept, this application also provides a fifth embodiment, referring to... Figure 5 , Figure 5 This is a flowchart illustrating the fifth embodiment of the corner thermal field control method for laser processing according to this application.

[0073] In this embodiment, the corner thermal field control method for laser processing further includes steps S51 to S53: Step S51: Real-time acquisition of the molten pool temperature at the corner section; Step S52: Calculate the temperature deviation between the molten pool temperature and the target temperature; Step S53: Based on the temperature deviation, adjust the laser shutdown delay value through proportional-integral-derivative control.

[0074] In this embodiment, after the laser processing system completes processing at the corner section, it collects the molten pool temperature at the corner section in real time, calculates the temperature deviation between the molten pool temperature and the target temperature, and adjusts the laser shut-off delay value in a closed loop accordingly. The temperature deviation refers to the difference between the molten pool temperature and the target temperature. Proportional-integral-derivative (PID) control is a closed-loop control method that performs weighted calculations of proportional, integral, and derivative terms based on the error signal. The closed-loop feedback adjustment uses PID closed-loop control technology based on molten pool temperature monitoring. The laser processing system collects the molten pool temperature in real time and calculates its deviation from the target temperature, dynamically adjusting the laser shut-off delay value through PID control.

[0075] Specifically, the laser processing system acquires the molten pool temperature at the corner section in real time. This temperature acquisition provides real-time feedback to the controlled variable for closed-loop control. The molten pool temperature is obtained through an infrared thermal imaging device or a pyrometer. The laser processing system calculates the temperature deviation between the molten pool temperature and the target temperature. This calculation quantifies the difference between the current actual temperature and the desired temperature, providing an error input signal for proportional-integral-derivative (PID) control. Based on the temperature deviation, the laser processing system adjusts the laser shut-off delay value using PID control. Adjusting the laser shut-off delay value dynamically corrects the delay value based on the magnitude and trend of the temperature deviation. The proportional term makes immediate adjustments based on the current deviation, the integral term eliminates steady-state errors, and the derivative term suppresses overshoot due to temperature changes. These three control components work together to stabilize the molten pool temperature near the target temperature.

[0076] Heat conduction during laser-material interaction follows Fourier's law: q = -k T, where q is the heat flux density and k is the thermal conductivity of the material. T represents the temperature gradient. In laser processing, the heat source term generated after the material absorbs laser energy can be expressed as Q = αI(1-R)exp(-αz), where α is the material absorption coefficient, I is the laser intensity, R is the reflectivity, and z is the depth coordinate. By controlling the delay parameters for laser on and off, the spatiotemporal distribution of the heat source term Q is essentially modulated, thereby affecting the evolution of the temperature field T(x, y, z, t).

[0077] The formation and evolution of the molten pool follow the energy conservation equation ρc_p ( T / t+v· T) = ·(k T) + Q - Q_loss, where ρ is density, c_p is specific heat capacity, v is molten pool flow velocity, and Q_loss is the heat loss term. T / t is the partial derivative of temperature with respect to time, i.e., the rate of temperature change, representing how quickly temperature T changes with time t. The essence of heat accumulation at the corner is that when the processing speed decreases, the convection term v· When T decreases, while the heat source term Q remains unchanged or increases, it leads to T / As t increases, the temperature rises rapidly. The gradual decay algorithm reduces Q step by step, causing... T / When t approaches a negative value, the temperature of the molten pool can be controlled to decrease, thus avoiding solidification defects caused by sudden temperature changes.

[0078] This embodiment acquires the temperature of the molten pool in the corner section in real time, calculates the temperature deviation, and adjusts the laser shut-off delay value through proportional-integral-derivative control. This upgrades the corner thermal field control from open-loop preset attenuation to closed-loop adaptive control, enabling the laser shut-off delay value to be corrected in real time according to the deviation between the actual temperature of the molten pool and the target temperature. This suppresses the temperature deviation caused by material parameter fluctuations or environmental changes, stabilizes the molten pool temperature in the corner section near the target temperature, and improves the accuracy of corner thermal field control.

[0079] Since the system described in Embodiment 5 of this application is a system used to implement the method of Embodiment 1 of this application, those skilled in the art can understand the specific structure and variations of the system based on the method described in Embodiment 1 of this application, and therefore will not be described again here. All systems used in the methods of the embodiments of this application fall within the scope of protection of this application.

[0080] This application provides a corner thermal field control device for laser processing, the device comprising: at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores instructions executable by the at least one processor, the instructions being executed by the at least one processor to enable the at least one processor to perform the corner thermal field control method for laser processing as described in Embodiment 1 above.

[0081] The following is for reference. Figure 6 The diagram illustrates a structural schematic of a corner thermal field control device suitable for implementing the embodiments of this application in laser processing. The corner thermal field control device for laser processing in the embodiments of this application may include, but is not limited to, mobile terminals such as laptops and fixed terminals such as desktop computers.Figure 6 The illustrated corner thermal field control device for laser processing is merely an example and should not impose any limitations on the functionality and scope of use of the embodiments of this application.

[0082] like Figure 6 As shown, the corner thermal field control device for laser processing may include a processing unit 1001 (e.g., a core processor, graphics processor, etc.), which can perform various appropriate actions and processes according to a program stored in a read-only memory (ROM) 1002 or a program loaded from a storage device 1003 into a random access memory (RAM) 1004. The RAM 1004 also stores various programs and data required for the operation of the corner thermal field control device for laser processing. The processing unit 1001, the ROM 1002, and the RAM 1004 are interconnected via a bus 1005. An input / output (I / O) interface 1006 is also connected to the bus. Typically, the following systems can be connected to I / O interface 1006: input devices 1007 including, for example, touchscreens, touchpads, keyboards, mice, image sensors, microphones, accelerometers, gyroscopes, etc.; output devices 1008 including, for example, liquid crystal displays (LCDs), speakers, vibrators, etc.; storage devices 1003 including, for example, magnetic tapes, hard disks, etc.; and communication devices 1009. Communication device 1009 allows the corner thermal field control equipment for laser processing to communicate wirelessly or wiredly with other devices to exchange data. Although the figure shows a corner thermal field control equipment for laser processing with various systems, it should be understood that it is not required to implement or possess all the systems shown. More or fewer systems can be implemented alternatively.

[0083] Specifically, according to the embodiments disclosed in this application, the processes described above with reference to the flowcharts can be implemented as computer software programs. For example, embodiments disclosed in this application include a computer program product comprising a computer program carried on a computer-readable medium, the computer program containing program code for performing the methods shown in the flowcharts. In such embodiments, the computer program can be downloaded and installed from a network via a communication device, or installed from storage device 1003, or installed from read-only memory 1002. When the computer program is executed by processing device 1001, it performs the functions defined in the methods of the embodiments disclosed in this application.

[0084] The corner thermal field control device for laser processing provided in this application, employing the corner thermal field control method for laser processing described in the above embodiments, can solve the technical problem of low processing accuracy at corners. Compared with the prior art, the beneficial effects of the corner thermal field control device for laser processing provided in this application are the same as those of the corner thermal field control method for laser processing provided in the above embodiments, and other technical features of this corner thermal field control device are the same as those disclosed in the previous embodiment method, and will not be repeated here.

[0085] It should be understood that the various parts disclosed in this application can be implemented using hardware, software, firmware, or a combination thereof. In the description of the above embodiments, specific features, structures, materials, or characteristics can be combined in any suitable manner in one or more embodiments or examples.

[0086] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

[0087] This application provides a computer-readable storage medium having computer-readable program instructions (i.e., a computer program) stored thereon, the computer-readable program instructions being used to execute the corner thermal field control method for laser processing in the above embodiments.

[0088] The computer-readable storage medium provided in this application may be, for example, a USB flash drive, but is not limited to, electrical, magnetic, optical, electromagnetic, infrared, or semiconductor systems, devices, or any combination thereof. More specific examples of computer-readable storage media may include, but are not limited to: electrical connections having one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fibers, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination thereof. In this embodiment, the computer-readable storage medium may be any tangible medium containing or storing a program that can be used by or in conjunction with an instruction execution system, system, or device. The program code contained on the computer-readable storage medium may be transmitted using any suitable medium, including but not limited to: wires, optical cables, radio frequency (RF), etc., or any suitable combination thereof.

[0089] The aforementioned computer-readable storage medium may be included in the corner thermal field control device for laser processing; or it may exist independently and not be assembled into the corner thermal field control device for laser processing.

[0090] The aforementioned computer-readable storage medium carries one or more programs. When the aforementioned one or more programs are executed by the corner thermal field control device for laser processing, the corner thermal field control device for laser processing: determines an angle attenuation factor based on the corner angle of the corner segment in the processing path, determines a speed attenuation factor based on the processing speed of the corner segment, multiplies the basic shutdown delay value with the angle attenuation factor and / or the speed attenuation factor to obtain a laser shutdown delay value, and controls the laser power to decrease based on the laser shutdown delay value within the corner segment.

[0091] Computer program code for performing the operations of this application can be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages ​​such as Java, Smalltalk, and C++, as well as conventional procedural programming languages ​​such as the "C" language or similar programming languages. The program code can be executed entirely on the user's computer, partially on the user's computer, as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving remote computers, the remote computer can be connected to the user's computer via any type of network—including a local area network (LAN) or a wide area network (WAN)—or can be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0092] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation that may be implemented in systems, methods, and computer program products according to various embodiments of this application. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those indicated in the drawings. For example, two consecutively indicated blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or operation, or using a combination of dedicated hardware and computer instructions.

[0093] The modules described in the embodiments of this application can be implemented in software or hardware. The names of the modules do not necessarily limit the functionality of the unit itself.

[0094] The readable storage medium provided in this application is a computer-readable storage medium that stores computer-readable program instructions (i.e., a computer program) for executing the corner thermal field control method for laser processing described above, which can solve the technical problem of low processing accuracy at corners. Compared with the prior art, the beneficial effects of the computer-readable storage medium provided in this application are the same as the beneficial effects of the corner thermal field control method for laser processing provided in the above embodiments, and will not be repeated here.

[0095] The above description is only a part of the embodiments of this application and does not limit the patent scope of this application. All equivalent structural transformations made under the technical concept of this application and using the contents of the specification and drawings of this application, or direct / indirect applications in other related technical fields, are included in the patent protection scope of this application.

Claims

1. A method for controlling the corner thermal field in laser processing, characterized in that, The method includes the following steps: An angle attenuation factor is determined based on the corner angle of the corner segment in the processing path. The corner angle is compared with a preset angle threshold. When the corner angle is not greater than the preset angle threshold, the angle attenuation factor is determined to increase as the corner angle increases. When the corner angle is greater than the preset angle threshold, the angle attenuation factor is determined to decrease as the corner angle increases. Based on the processing speed of the corner segment, determine the speed attenuation factor; Multiply the base shutdown delay value by the angle attenuation factor and / or the velocity attenuation factor to obtain the laser shutdown delay value; Within the corner segment, the laser power is controlled to decrease based on the laser shutdown delay value.

2. The corner thermal field control method for laser processing as described in claim 1, characterized in that, The step of determining the speed attenuation factor based on the processing speed of the corner segment includes: Obtain the preset maximum processing speed; Calculate the ratio of the processing speed to the maximum processing speed; The velocity decay factor is determined to decrease as the ratio increases.

3. The corner thermal field control method for laser processing as described in claim 1, characterized in that, Before the step of determining the angle attenuation factor based on the corner angle of the corner segment in the processing path, the method further includes: Obtain the current position of the processing head on the processing path; Calculate the distance between the current position and the corner point of the corner segment; When the distance is less than a preset distance threshold, the angle attenuation factor and the velocity attenuation factor are determined.

4. The corner thermal field control method for laser processing as described in claim 1, characterized in that, The step of controlling the laser power to decrease based on the laser shutdown delay value within the corner segment includes: The laser shutdown delay value is divided into multiple sub-time periods; Obtain the initial power value of the laser when it enters the corner segment; During the multiple sub-time periods, the laser power is gradually reduced from the initial power value until it is reduced to a preset lower power limit.

5. The corner thermal field control method for laser processing as described in claim 1, characterized in that, Before the step of determining the angle attenuation factor based on the corner angle of the corner segment in the processing path, the method further includes: Obtain the melting point, thermal diffusivity, current temperature of the preheating zone, and rate of temperature change of the material to be processed; Calculate the temperature difference between the melting point and the current temperature of the preheated region; Multiply the thermal diffusivity by the temperature difference and then divide by the temperature change rate to determine the laser activation delay value; Before the processing start point, the laser is turned on in advance for preheating based on the laser turn-on delay value.

6. The corner thermal field control method for laser processing as described in claim 1, characterized in that, After the step of controlling the laser power to decrease based on the laser shutdown delay value within the corner segment, the method further includes: Obtain the machining head movement speed during the idle segment after the corner segment; The idle delay value is determined based on the basic idle delay value and the speed of the processing head. The idle delay value decreases as the speed of the processing head increases. The transition duration of the idle segment is controlled based on the idle delay value.

7. The corner thermal field control method for laser processing as described in claim 1, characterized in that, After the step of controlling the laser power to decrease based on the laser shutdown delay value within the corner segment, the method further includes: The temperature of the molten pool in the corner section is collected in real time; Calculate the temperature deviation between the molten pool temperature and the target temperature; Based on the temperature deviation, the laser shutdown delay value is adjusted using proportional-integral-derivative control.

8. A corner thermal field control device for laser processing, characterized in that, The device includes: a memory, a processor, and a computer program stored in the memory and executable on the processor, the computer program being configured to implement the steps of the corner thermal field control method for laser processing as described in any one of claims 1 to 7.

9. A storage medium, characterized in that, The storage medium is a computer-readable storage medium, and a computer program is stored on the storage medium. When the computer program is executed by a processor, it implements the steps of the corner thermal field control method for laser processing as described in any one of claims 1 to 7.

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