Electronic device and heat dissipation control method thereof

Abstract

The present application provides an electronic device and a heat dissipation control method thereof. The electronic device includes a body, a heat source, an active fan, a heat pipe, an ion fan and two temperature sensors disposed in the body. The heat source includes a processor. The active fan, the ion fan and the two temperature sensors are electrically coupled to the processor. The two temperature sensors detect temperatures at different positions of the heat pipe. The processor applies a driving voltage to the ion fan and determines whether to turn on the active fan based on a judgment result of detection signals of the two temperature sensors.

Description

Technical Field

[0001] This invention relates to an electronic device, and more particularly to an electronic device and a method for controlling its heat dissipation. Background Technology

[0002] A laptop computer consists of a first chassis with logical processing capabilities and a second chassis with image display capabilities. The first chassis contains a central processing unit (CPU) and a graphics processing unit (GPU), which generate a significant amount of heat during operation. To quickly dissipate this heat, the first chassis typically incorporates an active fan (such as a centrifugal or axial fan), heat pipes, and cooling fins for forced heat dissipation.

[0003] In detail, active fans can adjust their speed according to load changes, operating at low speeds under low load and at high speeds under high load. However, the low-frequency noise caused by low-speed operation and the high-frequency noise caused by high-speed operation can both negatively impact the user experience. On the other hand, frequent speed adjustments not only generate additional energy consumption but also shorten the lifespan of the active fan. Summary of the Invention

[0004] This invention relates to an electronic device and its heat dissipation control method, which can perform silent heat dissipation in low-load mode to reduce energy consumption, and automatically increase airflow in high-load mode to perform efficient heat dissipation.

[0005] According to an embodiment of the present invention, an electronic device includes a body and a heat source, an active fan, a heat pipe, an ion fan, a first temperature sensor, and a second temperature sensor disposed within the body. The body has a first side, a second side opposite to the first side, and an exhaust port extending through the second side. The heat source includes at least a processor. The active fan is electrically coupled to the processor. The heat pipe includes an evaporation section and a condensation section. The evaporation section is thermally coupled to the heat source. The condensation section extends along the exhaust port and has a first position and a second position. The ion fan includes a driver electrically coupled to the processor and a plurality of airflow drive modules electrically coupled to the driver. The plurality of airflow drive modules are arranged along the condensation section, and the condensation section is located between the exhaust port and the airflow drive modules. The first temperature sensor and the second temperature sensor correspond to the condensation section and are electrically coupled to the processor. The first temperature sensor is used to detect the temperature at the first position, and the second temperature sensor is used to detect the temperature at the second position. The processor is used to control the driver to apply a drive voltage to the plurality of airflow drive modules, and to determine whether to turn on the active fan based on the determination results of the temperature at the first position and the temperature at the second position.

[0006] According to an embodiment of the present invention, the heat dissipation control method is applicable to the above-mentioned electronic device and includes the following steps: the processor controls the driver to apply a driving voltage to a plurality of airflow driving modules; and the processor determines whether to turn on the active fan based on the judgment result of the temperature at the first position and the temperature at the second position.

[0007] Based on the above, in the electronic device and its heat dissipation control method of the present invention, the processor controls the ion fan to be driven by a voltage in both low-load and high-load modes, and controls the active fan to be turned on in high-load mode. In low-load mode, the ion fan can perform silent heat dissipation to reduce energy consumption. In high-load mode, based on real-time monitoring of the temperatures at the first and second locations of the condensation section, the speed of the active fan and the driving voltage of the ion fan are dynamically adjusted. This not only provides optimal heat dissipation measures according to the real-time status of heat dissipation management, but also prevents the active fan and ion fan from operating at high speed and high driving voltage for a long time, preventing the generation of long-term high-frequency noise and effectively reducing energy consumption. Attached Figure Description

[0008] Figure 1A This is a schematic diagram of an electronic device according to an embodiment of the present invention;

[0009] Figure 1B yes Figure 1A A top-view diagram of the internal configuration of the first unit;

[0010] Figure 1C yes Figure 1A A partial cross-sectional view along section line 1C-1C;

[0011] Figure 1D yes Figure 1A A diagram from another perspective;

[0012] Figure 1E yes Figure 1D An enlarged schematic diagram of region 1E;

[0013] Figure 2 This is a circuit diagram of an electronic device according to an embodiment of the present invention;

[0014] Figure 3 This is a schematic flowchart of a heat dissipation control method for an electronic device according to an embodiment of the present invention;

[0015] Figure 4 and Figure 5 This is a top view schematic diagram of the internal configuration of the body in another embodiment of the present invention. Detailed Implementation

[0016] Reference will now be made in detail to exemplary embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same element references are used in the drawings and description to denote the same or similar parts.

[0017] Figure 1A This is a schematic diagram of an electronic device according to an embodiment of the present invention. Figure 1B yes Figure 1A A top-down view of the internal configuration of the first unit. Figure 1C yes Figure 1A A partial cross-sectional view along section line 1C-1C. Figure 1D yes Figure 1A A diagram from another perspective. Figure 1E yes Figure 1D A magnified view of region 1E. Please refer to... Figures 1A to 1D In this embodiment, the electronic device 10 may be a laptop computer, and includes a first body 100 with logic operation capabilities and a second body 200 with image display capabilities. The second body 200 is pivotally connected to the first body 100 to rotate and open relative to the first body 100.

[0018] The first housing 100 has a first side 101, a second side 102 opposite to the first side 101, and an exhaust vent 103 penetrating the second side 102. The electronic device 10 inside the first housing 100 includes a heat source, an active fan 120, a heat pipe 130, an ion fan 140, a first temperature sensor 150, a second temperature sensor 160, and heat sink fins 170. The heat source includes at least a processor 110, such as a central processing unit, a graphics processing unit, a programmable general-purpose or special-purpose microprocessor, a digital signal processor, a programmable controller, a field-programmable gate array, an application-specific integrated circuit, other similar components, or combinations thereof.

[0019] Figure 2 This is a circuit diagram of an electronic device according to an embodiment of the present invention. Please refer to it. Figure 1B , Figure 1C as well as Figure 2 The active fan 120 can be a centrifugal fan or an axial fan and is electrically coupled to the processor 110. The heat pipe 130 includes an evaporation section 131 and a condensation section 132, wherein the evaporation section 131 is thermally coupled to the heat source (i.e., the processor 110) and the condensation section 132 extends along the exhaust port 103.

[0020] The ion fan 140 includes a driver 141 and a plurality of airflow drive modules 142 arranged along a condensation section 132, wherein the driver 141 is electrically coupled to the processor 110 and the airflow drive modules 142 are electrically coupled to the driver 141. On the other hand, the condensation section 132 extends laterally between the exhaust port 103 and the plurality of airflow drive modules 142.

[0021] For example, the airflow drive module 142 may include a shroud and emitter and collector electrodes disposed opposite each other within the shroud, wherein the emitter electrodes are electrically coupled to the driver 141, and the collector electrodes are closer to the exhaust port 103 than the emitter electrodes. A driving voltage is applied to the emitter electrodes by the driver 141, ionizing the cold air introduced into the interior of the first body 100. Driven by the electric field between the emitter and collector electrodes, air ions move from the emitter electrodes to the collector electrodes to form an ion flow, which in turn drives the cold air to form an airflow toward the exhaust port 103. This method of heat dissipation via ion airflow is a conventional ion cooling system, therefore the internal details of the airflow drive module are omitted.

[0022] Please refer to Figure 1B and Figure 2 A first temperature sensor 150 and a second temperature sensor 160 are electrically coupled to the processor 110. The first temperature sensor 150 is located at a first position in the condensation section 132, and the second temperature sensor 160 is located at a second position in the condensation section 132. The first temperature sensor 150 and the second temperature sensor 160 are used to detect the temperature at the first and second positions in the condensation section 132, respectively. The second temperature sensor 160 is located closer to the evaporation section 131 in the condensation section 132 than the first temperature sensor 150.

[0023] In this embodiment, the condensation section 132 includes a first portion 1321 relative to the evaporation section 131 and a second portion 1322 located between the first portion 1321 and the evaporation section 131. A first temperature sensor 150 is located in the first portion 1321, and a second temperature sensor 160 is located in the second portion 1322. That is, the first temperature sensor 150 is positioned corresponding to the first portion 1321, and the second temperature sensor 160 is positioned corresponding to the second portion 1322. Furthermore, an airflow drive module 142 is provided on one side of the first portion 1321, and another airflow drive module 142 is provided on one side of the second portion 1322.

[0024] Please refer to Figure 1B and Figure 1C The heat dissipation fins 170 are arranged along the exhaust port 103, and the condensation section 132 of the heat pipe 130 is thermally coupled to the heat dissipation fins 170. Specifically, the heat dissipation fins 170 are arranged laterally between the exhaust port 103 and multiple airflow drive modules 142, wherein the arrangement direction of the heat dissipation fins 170 is approximately coincident with the extension direction of the condensation section 132 of the heat pipe 130, and the condensation section 132 of the heat pipe 130 is superimposed and welded onto the heat dissipation fins 170.

[0025] Please refer to Figures 1A to 1CThe exhaust port 121 of the active fan 120 faces the condenser section 132 of the heat pipe 130, the heat sink 170, and the exhaust port 103. The heat generated by the heat source (i.e., the processor 110) can be conducted from the evaporation section 131 of the heat pipe 130 to the condenser section 132, and then from the condenser section 132 to the heat sink 170. Therefore, the cool air introduced into the first chassis 100 by the active fan 120, together with the ion fan 140, forms an airflow that flows toward the exhaust port 103, and undergoes heat exchange as it flows past the heat sink 170, and is finally discharged from the first chassis 100 through the exhaust port 103.

[0026] Please refer to Figures 1C to 1E The first body 100 also has a bottom 104 and an air inlet 105 extending through the bottom 104, and a plurality of airflow drive modules 142 are arranged laterally between the air inlet 105 and the air outlet 103. On the other hand, the first body 100 has a foot pad 106 extending laterally along the air inlet 105 at the bottom 104, wherein the foot pad 106 has a guide channel 107 communicating with the air inlet 105, and the guide channel 107 has an opening 1071 facing the first side 101.

[0027] In detail, external cold air flows sequentially through opening 1071, guide channel 107, and air inlet 105, and enters the interior of the first body 100. Guided by guide channel 107, the cold air entering the interior of the first body 100 through air inlet 105 can be directed to heat dissipation fins 170.

[0028] like Figure 1C and Figure 1D As shown, the foot pad 106 can support the first unit 100, leaving a drainage gap between the bottom 104 and the table. In addition, the foot pad 106 covers the air inlet 105, that is, the foot pad 106 visually obscures the air inlet 105 to optimize the visual appearance of the first unit 100.

[0029] Figure 3 This is a schematic flowchart of a heat dissipation control method for an electronic device according to an embodiment of the present invention. Please refer to it. Figure 1B , Figure 2 as well as Figure 3 In steps S1 to S3, when the electronic device 10 is turned on or awakened from sleep mode, the processor 110 receives a start command. Then, the processor 110 controls the driver 141 of the ion fan 140 to apply a driving voltage to multiple airflow drive modules 142, thereby driving cold air to form an airflow towards the exhaust vent 103, and after heat exchange, forming hot air that is discharged from the first housing 100, thus providing basic heat dissipation performance in low-load mode. Furthermore, in low-load mode, silent cooling is performed by the ion fan 140, and the active fan 120 is not activated, thereby reducing energy consumption and providing a virtually noiseless operating environment.

[0030] During the silent cooling process performed by the ion fan 140, the processor 110 reads the detection signals from the first temperature sensor 150 and the second temperature sensor 160 to determine whether the temperature of the first position (i.e., the first part 1321) and the temperature of the second position (i.e., the second part 1322) of the condensation section 132 of the heat pipe 130 exceed a first threshold (e.g., 40 degrees Celsius).

[0031] If the temperature at the first and second positions of the condenser section 132 does not exceed the first threshold, the ion fan 140 continues to perform silent cooling, and the active fan 120 is not activated. If the temperature at the first and second positions of the condenser section 132 exceeds the first threshold, the system enters a high-load mode and executes step S4.

[0032] In step S4, the active fan 120 is started to operate at a first speed to increase the intake of cold air. The cold air is driven by the ion fan 140 to form an airflow that flows towards the exhaust port 103, and after heat exchange, it forms hot air that is discharged from the first unit 100 to perform efficient heat dissipation.

[0033] During the period when the active fan 120 is running at the first speed, the processor 110 continuously reads the detection signals from the first temperature sensor 150 and the second temperature sensor 160, and determines whether the temperature at the first position of the condenser section 132 is lower than the temperature at the second position (step S5).

[0034] If the temperature at the first position of the condenser section 132 is lower than the temperature at the second position, it means that the ion airflow at the second part 1322 can still expel hot air from the first unit 100. Therefore, it is determined that the heat dissipation management is approaching equilibrium, and the internal temperature of the first unit 100 has not shown a further upward trend. Accordingly, step S6 is executed: the processor 110 controls the driver 141 to maintain a constant driving voltage applied to the multiple airflow drive modules 142, and controls the active fan 120 to maintain operation at the first speed to avoid increasing noise and generating unnecessary energy consumption.

[0035] If the temperature at the first position of the condenser section 132 is not lower than the temperature at the second position, it means that the ion airflow at the second part 1322 cannot expel the hot air from the first unit 100 in real time, causing heat to diffuse to the first position of the condenser section 132. Based on this, it is determined that the heat dissipation management is becoming unbalanced, and the internal temperature of the first unit 100 has a tendency to rise further. Accordingly, step S7 is executed to determine whether the temperature at the first position and the temperature at the second position of the condenser section 132 of the heat pipe 130 exceed a second threshold (e.g., 60 degrees Celsius) that is greater than the first threshold.

[0036] If the temperature at the first position and the temperature at the second position of the condenser section 132 exceed the second threshold, it means that too much heat cannot be simultaneously discharged from the first part 1321 and the second part 1322 through the ion airflow to the first body 100, and step S8 is executed. In step S8, the processor 110 controls the driver 141 to increase the driving voltage applied to the multiple airflow drive modules 142, and controls the active fan 120 to operate at a second speed higher than the first speed, so as to further increase the intake of cold air and accelerate the flow rate of airflow to the exhaust port 103, thereby maximizing the heat dissipation efficiency.

[0037] If the determination result is that the temperature at the first position and the temperature at the second position of the condensation section 132 do not exceed the second threshold, then step S9 is executed. In step S9, the processor 110 controls the driver 141 to increase the driving voltage applied to the multiple airflow drive modules 142, and controls the active fan 120 to maintain operation at the first speed, so as to accelerate the airflow speed towards the exhaust port 103.

[0038] Compared to step S6, in step S8, by increasing the speed of the active fan 120 and the driving voltage of the ion fan 140, the intake volume of cold air required for heat exchange is significantly increased, and the exhaust of the hot air formed after heat exchange is accelerated. However, the high-frequency noise generated by the active fan 120 operating at high speed in step S8 is significantly higher than that in step S6. Furthermore, compared to step S6, in step S9, although the speed of the active fan 120 remains unchanged, by increasing the driving voltage of the ion fan 140, not only can the exhaust of the hot air formed after heat exchange be accelerated, but the intake volume of cold air required for heat exchange can also be slightly increased. The high-frequency noise in step S9 is only slightly higher than that in step S6.

[0039] In high-load mode, based on real-time monitoring of the temperature at the first and second positions of the condenser section 132, the speed of the active fan 120 and the driving voltage of the ion fan 140 are dynamically adjusted. This not only provides the best heat dissipation measures in response to the real-time status of heat dissipation management, but also prevents the active fan 120 and the ion fan 140 from operating at high speed and high driving voltage for a long time, thus preventing the generation of long-term high-frequency noise and effectively reducing energy consumption.

[0040] Please refer to Figure 1B , Figure 2 as well as Figure 3In step S8, when the temperatures at the first and second positions of the condensation section 132 exceed a second threshold, the processor 110 controls the driver 141 to increase the driving voltage applied to the plurality of airflow drive modules 142, and applies different driving voltages to the plurality of airflow drive modules 142. Specifically, the driver 141 applies a first driving voltage to one airflow drive module 142 corresponding to the first position of the condensation section 132, and applies a second driving voltage to another airflow drive module 142 corresponding to the second position of the condensation section 132.

[0041] Since the temperature at the first position of the condensing section 132 is not lower than the temperature at the second position, the first driving voltage is set to be higher than the second driving voltage to guide a larger amount of cold air to the first part 1321 of the condensing section 132 and accelerate the airflow in the area where the first part 1321 is located.

[0042] Figure 4 and Figure 5 This is a top view schematic diagram of the internal configuration of the first body according to another embodiment of the present invention. Please refer to... Figure 4 Different from Figure 1B The internal configuration of the first housing 100 shown in this embodiment is such that the air outlet 121 of the active fan 120 faces the heat source (i.e., the processor 110), and the heat source is located between the active fan 120 and the driver 141. Please refer to... Figure 5 Different from Figure 1B The internal configuration of the first housing 100 shown in this embodiment is such that the exhaust vent 121 of the active fan 120 faces the heat source (i.e., the processor 110), and the driver 141 is located between the heat source and the active fan 120. Regardless of Figure 4 or Figure 5 As shown in the configuration, the air outlet 121 of the active fan 120 is configured to more actively pre-dissipate the waste heat at the front end of the heat pipe 130 and the heat source, thereby reducing the energy consumption of the airflow drive module 142 at the rear end of the heat pipe 130 (i.e., corresponding to the second part 1322).

[0043] In summary, in the electronic device and its heat dissipation control method of the present invention, the processor controls the ion fan to be driven by a voltage in both low-load and high-load modes, and controls the active fan to be turned on in high-load mode. In low-load mode, the ion fan can perform silent heat dissipation to reduce energy consumption. In high-load mode, based on real-time monitoring of the temperatures at the first and second locations of the condensation section, the speed of the active fan and the driving voltage of the ion fan are dynamically adjusted. This not only provides optimal heat dissipation measures in stages according to the real-time status of heat dissipation management, but also avoids the active fan and ion fan from operating at high speed and high driving voltage for a long time, preventing the generation of long-term high-frequency noise and effectively reducing energy consumption.

[0044] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An electronic device, characterized in that, It includes a body and a heat source, an active fan, a heat pipe, an ion fan, a first temperature sensor, and a second temperature sensor disposed within the body, wherein, The body has a first side, a second side opposite to the first side, and an exhaust vent penetrating the second side. The heat source includes at least a processor. The active fan is electrically coupled to the processor. The heat pipe includes an evaporation section and a condensation section. The evaporation section is thermally coupled to the heat source, and the condensation section extends along the exhaust port and has a first position and a second position. The ion fan includes: The driver, electrically coupled to the processor; and Multiple airflow drive modules are electrically coupled to the driver, wherein the multiple airflow drive modules are arranged along the condensation section, and the condensation section is located between the exhaust port and the multiple airflow drive modules. The first temperature sensor and the second temperature sensor correspond to the condensation section and are electrically coupled to the processor. The first temperature sensor is used to detect the temperature at the first location, and the second temperature sensor is used to detect the temperature at the second location. The processor is used to control the driver to apply a driving voltage to the plurality of airflow drive modules, and to determine whether to turn on the active fan based on the determination result of the temperature at the first position and the temperature at the second position.

2. The electronic device according to claim 1, characterized in that, Also includes: Heat dissipation fins are arranged along the exhaust port in the body, wherein the condensation section of the heat pipe is thermally coupled to the heat dissipation fins, and the heat dissipation fins are located between the exhaust port and the plurality of airflow drive modules.

3. The electronic device according to claim 1, characterized in that, The condensation section includes a first portion relative to the evaporation section and a second portion located between the first portion and the evaporation section, the first position being located in the first portion and the second position being located in the second portion, the first temperature sensor being disposed corresponding to the first portion and the second temperature sensor being disposed corresponding to the second portion.

4. The electronic device according to claim 3, characterized in that, One side of the first part is provided with the airflow drive module, and one side of the second part is provided with another airflow drive module.

5. The electronic device according to claim 1, characterized in that, The body also has a bottom and an air inlet extending through the bottom, and the plurality of airflow drive modules are located between the air inlet and the air outlet.

6. The electronic device according to claim 5, characterized in that, The body has a foot pad extending along the air inlet at the bottom, and the foot pad has a guide channel communicating with the air inlet, the guide channel having an opening facing the first side.

7. The electronic device according to claim 6, characterized in that, The foot pad covers the air inlet.

8. The electronic device according to claim 1, characterized in that, The air outlet of the active fan is directed toward the heat source.

9. The electronic device according to claim 1, characterized in that, The outlet of the active fan faces the exhaust port.

10. The electronic device according to claim 1, characterized in that, After the active fan is turned on, the processor continues to control the driving voltage applied by the driver to the plurality of airflow driving modules and control the speed of the active fan based on the judgment result.

11. The electronic device according to claim 1, characterized in that, The processor is used to: Receive the startup command; The driver is controlled to apply a driving voltage to the plurality of airflow drive modules; After activating the plurality of airflow drive modules, it is determined whether the temperature at the first position and the temperature at the second position exceed a first threshold. as well as When the temperature at the first location and the temperature at the second location exceed the first threshold, the active fan is activated and operates at a first speed.

12. The electronic device according to claim 11, characterized in that, The processor is also used to: After starting the active fan and operating it at the first speed, it is determined whether the temperature at the first position is lower than the temperature at the second position; as well as When the temperature at the first position is lower than the temperature at the second position, the driving voltage is kept constant, and the active fan is controlled to maintain operation at the first speed.

13. The electronic device according to claim 12, characterized in that, The processor is also used to: When the temperature at the first position is not lower than the temperature at the second position, determine whether the temperature at the first position and the temperature at the second position exceed a second threshold. When the temperature at the first position and the temperature at the second position exceed the second threshold, the driving voltage is increased, and the active fan is controlled to operate at a second speed higher than the first speed. as well as When the temperature at the first position and the temperature at the second position do not exceed the second threshold, the driving voltage is increased, and the active fan is controlled to maintain operation at the first speed.

14. The electronic device according to claim 13, characterized in that, The processor is also used to: When the temperature at the first position and the temperature at the second position exceed the second threshold, the driver is controlled to apply different driving voltages to the plurality of airflow drive modules.

15. The electronic device according to claim 14, characterized in that, The processor controls the driver to apply a first driving voltage to one of the airflow drive modules corresponding to the first position and a second driving voltage to another airflow drive module corresponding to the second position, wherein the first driving voltage is higher than the second driving voltage.

16. The electronic device according to claim 13, characterized in that, The second threshold is greater than the first threshold.

17. A heat dissipation control method for an electronic device, characterized in that, The electronic device includes a body and a heat source, an active fan, a heat pipe, an ion fan, a first temperature sensor, and a second temperature sensor disposed within the body. The body has a first side, a second side opposite to the first side, and an exhaust vent penetrating the second side. The heat source includes at least a processor. The active fan is electrically coupled to the processor. The heat pipe includes an evaporation section and a condensation section. The evaporation section is thermally coupled to the heat source, and the condensation section extends along the exhaust port and has a first position and a second position. The ion fan includes: The driver, electrically coupled to the processor; and Multiple airflow drive modules are electrically coupled to the driver, wherein the multiple airflow drive modules are arranged along the condensation section, and the condensation section is located between the exhaust port and the multiple airflow drive modules. The first temperature sensor and the second temperature sensor correspond to the condensation section and are electrically coupled to the processor. The first temperature sensor is used to detect the temperature at the first location, and the second temperature sensor is used to detect the temperature at the second location. The heat dissipation control method includes: The processor controls the driver to apply a driving voltage to the plurality of airflow drive modules; and The processor determines whether to turn on the active fan based on the temperature at the first location and the temperature at the second location.

18. The heat dissipation control method for an electronic device according to claim 17, characterized in that, After the active fan is turned on, the processor continues to control the driving voltage applied by the driver to the plurality of airflow driving modules and control the speed of the active fan based on the judgment result.

19. The heat dissipation control method for an electronic device according to claim 17, wherein the step of the processor controlling the driver and the active fan includes: Receive the startup command; The control driver applies drive voltage to multiple airflow drive modules; After activating the plurality of airflow drive modules, it is determined whether the temperature at the first position and the temperature at the second position of the condensation section of the heat pipe exceed a first threshold. as well as When the temperature at the first location and the temperature at the second location exceed the first threshold, the active fan is activated and operates at a first speed.

20. The heat dissipation control method for an electronic device according to claim 19, characterized in that, The step of the processor controlling the driver and the active fan further includes: After starting the active fan and operating it at the first speed, determine whether the temperature at the first position is lower than the temperature at the second position; and When the temperature at the first position is lower than the temperature at the second position, the driving voltage is kept constant, and the active fan is controlled to maintain operation at the first speed.

21. The heat dissipation control method for an electronic device according to claim 20, characterized in that, The step of the processor controlling the driver and the active fan further includes: When the temperature at the first position is not lower than the temperature at the second position, determine whether the temperature at the first position and the temperature at the second position exceed a second threshold. When the temperature at the first location and the temperature at the second location exceed the second threshold, the drive voltage is increased, and the active fan is controlled to operate at a second speed higher than the first speed; and When the temperature at the first position and the temperature at the second position do not exceed the second threshold, the driving voltage is increased, and the active fan is controlled to maintain operation at the first speed.

22. The heat dissipation control method for an electronic device according to claim 21, characterized in that, Also includes: When the temperature at the first position and the temperature at the second position exceed the second threshold, the driver is controlled to apply different driving voltages to the plurality of airflow drive modules.

23. The heat dissipation control method for an electronic device according to claim 22, characterized in that, The driver is used to apply a first driving voltage to one of the airflow drive modules corresponding to the first position and a second driving voltage to the other airflow drive module corresponding to the second position, wherein the first driving voltage is higher than the second driving voltage.

24. The heat dissipation control method for an electronic device according to claim 21, characterized in that, The second threshold is greater than the first threshold.

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