Water-cooling heat dissipation device for server multi-core central processing unit and heat dissipation method thereof

Abstract

The application relates to the technical field of water cooling heat dissipation of processors, and discloses a water cooling heat dissipation device for a multi-core central processing unit of a server, which comprises an outer frame, a heat dissipation frame fixedly connected to the inside of the outer frame, a water inlet pipe fixedly connected to the top of the heat dissipation frame, a water outlet pipe fixedly connected to one side of the water inlet pipe, a contact groove arranged in the inside of the heat dissipation frame, heat dissipation holes arranged in the inside of the outer frame and the heat dissipation frame, guide grooves arranged in the inside of the water inlet pipe and the water outlet pipe, fixing frames fixedly connected to the inside of the water inlet pipe and the water outlet pipe, and connecting rods fixedly connected to one side of the fixing frames. In the application, the cooling liquid flow path is prolonged, the water flow form is optimized, the vortex air bubble problem is eliminated, the passive disturbance structure composed of the fixing frames, the connecting rods and the fan blades is used, the water flow impact force is used to drive the fan blades to rotate to realize cooling liquid turbulent flow distribution, the cooling liquid heat exchange contact area is expanded in all directions, and the cooling liquid heat absorption efficiency is greatly improved under the premise of no additional energy consumption.

Description

Technical Field

[0001] This invention relates to the field of processor water cooling technology, and more particularly to a water cooling device and method for a multi-core central processing unit in a server. Background Technology

[0002] Water-cooled CPUs for multi-core servers are highly efficient cooling systems designed for the high power consumption and high heat generation characteristics of multi-core CPUs, using liquid as the heat transfer medium. Leveraging the significantly higher specific heat capacity and thermal conductivity of liquid compared to air, they overcome the heat dissipation bottlenecks of traditional air cooling in high-density computing scenarios. These systems are widely used in data centers, AI servers, and high-performance computing environments. The circulation system uses a pump to drive the liquid flow, which is then transported to a heat exchanger via flexible tubing and quick-connect fittings. After heat release, the cooled liquid flows back to the cold plate, forming a closed loop. This system can maintain a stable CPU operating temperature even with single-rack power exceeding 180kW, while simultaneously reducing the PUE value to below 1.1. This improves cooling efficiency, reduces fan energy consumption and noise, extends processor lifespan, and ensures stable performance in multi-core parallel computing.

[0003] However, some existing server multi-core CPU water cooling devices and methods have inherent design and operational flaws in the water cooling system, making it difficult to achieve stable and efficient heat dissipation. Water cooling circuits are prone to generating air bubbles, forming air resistance, which causes poor coolant circulation, a sharp drop in heat exchange efficiency, insufficient heat exchange capacity of the heat dissipation mechanism, and excessively rapid temperature rise of the coolant. Heat cannot be dissipated in time, further weakening the water cooling effect. Ultimately, this leads to persistently high CPU core temperatures, which not only affects computing performance but also increases the risk of hardware aging and operational failures.

[0004] Therefore, a water-cooling heat dissipation device and its heat dissipation method for a multi-core central processing unit of a server are proposed to address the above problems. Summary of the Invention

[0005] To overcome the above deficiencies, the present invention provides a water-cooling heat dissipation device and heat dissipation method for a server multi-core central processing unit.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A water-cooled heat dissipation device for a multi-core central processing unit of a server includes an outer frame, a heat dissipation frame fixedly connected inside the outer frame, a water inlet pipe fixedly connected to the top of the heat dissipation frame, a water outlet pipe fixedly connected to one side of the water inlet pipe, a contact groove inside the heat dissipation frame, heat dissipation holes inside both the outer frame and the heat dissipation frame, guide grooves inside both the water inlet pipe and the water outlet pipe, a fixing frame fixedly connected inside both the water inlet pipe and the water outlet pipe, a connecting rod fixedly connected to one side of the fixing frame, a fan blade rotatably connected to the outside of the connecting rod, a clamping plate slidably connected inside the heat dissipation frame, a fixing component provided on one side of the clamping plate, and a rotating plate rotatably connected inside the outer frame.

[0008] As a further description of the above technical solution:

[0009] The fixing component includes a push rod, one side of which is fixedly connected to one side of the clamping plate. A fixing sleeve is slidably connected to the outside of the push rod. An elastic component is provided inside the fixing sleeve. An ejection component is provided on one side of the push rod. An inclined plate is fixedly connected to one side of the clamping plate.

[0010] As a further description of the above technical solution:

[0011] The elastic component includes a limiting plate, one side of which is fixedly connected to one side of the push rod, and a spring is provided inside the fixing sleeve;

[0012] As a further description of the above technical solution:

[0013] The ejection assembly includes an ejection rod, one side of which is fixedly connected to one side of a limiting plate, a connecting frame is fixedly connected to one side of the ejection rod, and a movable ball is fixedly connected to one side of the connecting frame.

[0014] As a further description of the above technical solution:

[0015] The contact groove is arc-shaped to increase the contact area, and the inlet pipe and outlet pipe are U-shaped.

[0016] As a further description of the above technical solution:

[0017] The guide groove has a spiral advancing pattern, and a flow guide groove is provided at the bend of the water inlet pipe and the water outlet pipe;

[0018] As a further description of the above technical solution:

[0019] The limiting plate is externally slidably connected to the inside of the fixed sleeve, and the ejector rod is externally slidably connected to the inside of the fixed sleeve;

[0020] As a further description of the above technical solution:

[0021] The movable ball is externally slidably connected to the inside of the rotating plate, and the ejector rod is externally slidably connected to the inside of the outer frame;

[0022] As a further description of the above technical solution:

[0023] One end of the spring is fixedly connected to the outside of the limiting plate, and the other end of the spring is fixedly connected to the inside of the fixing sleeve;

[0024] As a further description of the above technical solution:

[0025] A multi-core central processing unit for servers, the specific method includes the following steps:

[0026] S1. Installation: First, align the multi-core CPU into the inside of the heat sink frame. This will cause the tilting plate to be squeezed, which will cause the clamping plate to move. This will cause the push rod to move, which will then cause the limiting plate to move. This will cause the spring to be compressed, thus using the spring force to clamp and fix the CPU.

[0027] S2. Deployment: As the limit plate moves, the ejector rod will move, which in turn will move the connecting frame. As the connecting frame moves, it will push the rotating plate to rotate. During this process, the movable ball can be used to ensure that the rotating plate opens.

[0028] S3. Heat dissipation steps: Coolant is injected into the inlet pipe using a suction pump. As the coolant flows, it impacts the fan blades, causing them to rotate. This allows the coolant to be distributed and agitated, increasing the contact area with the inlet pipe. The guide groove and flow channel further guide the coolant, greatly improving heat absorption. Heat is then dissipated through the opening of the rotating plate and the heat dissipation holes.

[0029] The present invention has the following beneficial effects:

[0030] 1. In this invention, a U-shaped integrated inlet and outlet pipe is used, along with an arc-shaped guide groove at the pipe bend and a spiral guide groove on the inner wall to form a dual flow guiding system. This extends the coolant flow path, optimizes the water flow pattern, and eliminates eddy bubble problems. Furthermore, with the help of a passive disturbance structure composed of an internal fixing frame, connecting rod, and fan blades, the fan blades are driven to rotate by the impact force of the water flow to achieve turbulent flow and diversion of the coolant. This comprehensively expands the heat exchange contact area of ​​the coolant, significantly improving the heat adsorption efficiency of the coolant without additional energy consumption. The entire chain from heat conduction and water cooling heat exchange to heat dissipation is optimized, completely making up for the shortcomings of traditional heat dissipation devices such as small contact area, poor water flow heat exchange, and blocked heat dissipation channels. This perfectly adapts to the high-power, high-heat, and high-efficiency heat dissipation requirements of multi-core CPUs. Attached Figure Description

[0031] Figure 1 This is a three-dimensional schematic diagram of a water-cooled heat dissipation device and heat dissipation method for a multi-core central processing unit of a server, as proposed in this invention.

[0032] Figure 2 This is a schematic diagram of the outer frame structure of a water-cooled heat dissipation device and heat dissipation method for a server multi-core central processing unit proposed in this invention.

[0033] Figure 3 This is a schematic diagram of the water inlet pipe structure of a water-cooled heat dissipation device and heat dissipation method for a server multi-core central processing unit proposed in this invention.

[0034] Figure 4 This is a schematic diagram of the water outlet pipe structure of a water-cooled heat dissipation device and heat dissipation method for a server multi-core central processing unit proposed in this invention.

[0035] Figure 5 for Figure 4 Enlarged view of point A in the middle;

[0036] Figure 6 This is a schematic diagram of the mounting frame structure of a water-cooled heat dissipation device and heat dissipation method for a server multi-core central processing unit proposed in this invention;

[0037] Figure 7 This is a schematic diagram of the heat dissipation frame structure of a water-cooled heat dissipation device and heat dissipation method for a server multi-core central processing unit proposed in this invention.

[0038] Figure 8 This is a schematic diagram of the clamping plate structure of a water-cooled heat dissipation device and heat dissipation method for a server multi-core central processing unit proposed in this invention.

[0039] Figure 9 This is a schematic diagram of a movable sphere structure for a water-cooled heat dissipation device and heat dissipation method for a multi-core central processing unit of a server, as proposed in this invention.

[0040] Legend:

[0041] 1. Outer frame; 2. Heat dissipation frame; 3. Water inlet pipe; 4. Water outlet pipe; 5. Contact groove; 6. Heat dissipation hole; 7. Guide groove; 8. Fixing frame; 9. Connecting rod; 10. Fan blade; 11. Clamping plate; 12. Push rod; 13. Fixing sleeve; 14. Limiting plate; 15. Spring; 16. Push rod; 17. Connecting frame; 18. Movable ball; 19. Rotating plate; 20. Inclined plate. Detailed Implementation

[0042] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0043] Reference Figures 1 to 3 This invention provides an embodiment of a water-cooled heat dissipation device for a server multi-core CPU, comprising an outer frame 1. The outer frame 1 serves as the outer supporting base of the entire water-cooled heat dissipation device, and is die-cast from a high-strength, low-thermal-resistance alloy material. It possesses the characteristics of structural stability, deformation resistance, and strong thermal inertia. It provides a closed and orderly installation space for the internal heat dissipation frame 2, pipes, and clamping components, while also preventing external dust and moisture from entering the heat dissipation cavity, thus avoiding dust accumulation in the internal structure and affecting heat dissipation efficiency. The heat dissipation frame 2 is fixedly connected inside the outer frame 1. The heat dissipation frame 2 is nested and fixed inside the outer frame 1 and is the core heat-conducting component that directly contacts the multi-core CPU. It is made of high thermal conductivity copper or aluminum alloy material to maximize heat conduction efficiency. An installation cavity adapted to the shape of the CPU is opened inside, providing precise assembly positioning for the CPU. The top supports the inlet pipe 3 and the outlet pipe 4. The contact surface between the heat dissipation frame 2 and the outer frame 1 is smoothed to reduce heat conduction resistance. At the same time, heat dissipation holes 6 are opened to quickly divert the heat transferred from the CPU to the cavity of the outer frame 1.

[0044] Reference Figure 1 , Figure 2 and Figure 7A water inlet pipe 3 is fixedly connected to the top of the heat sink 2. The water inlet pipe 3, fixed to the top of the heat sink 2, adopts a U-shaped integrated bending design. Unlike traditional straight pipes, the U-shaped structure extends the flow path of the coolant inside the device, increasing the heat exchange time between the coolant and the heat sink 2 and improving heat absorption. The water inlet pipe 3 serves as the coolant input channel, with one end connected to a suction pump. The pump pressure continuously delivers low-temperature coolant to the heat sink 2 area. A spiral guide groove 7 is opened inside the pipe, working in conjunction with the flow guide groove at the bend to optimize the water flow pattern and avoid turbulence and stagnation. A water outlet pipe 4 is fixedly connected to one side of the water inlet pipe 3. Both the water inlet pipe 3 and the water outlet pipe 4 are U-shaped, forming a complete water-cooling circulation loop with the water inlet pipe 3, responsible for discharging the high-temperature coolant after absorbing CPU heat from the device. To achieve continuous replacement of hot and cold coolant, a flow guide groove is provided at the bend of the inlet pipe 3 and the outlet pipe 4. The flow guide groove is located at the U-shaped bend of the inlet pipe 3 and the outlet pipe 4. It is an auxiliary structure for optimizing the water flow in the pipeline. The arc-shaped groove design fits the curvature of the pipeline bend and solves the problems of dead angles and sudden drops in flow velocity that are easy to occur in traditional right-angle or bend pipelines. When the coolant flows through the U-shaped bend, the flow guide groove can guide and dredge the water flow, eliminate water eddies and air bubbles, and ensure that the coolant passes through the bend area at a uniform speed and maintains the pressure stability of the water circulation system. At the same time, the groove shape of the flow guide groove can slightly increase the contact area between the water flow and the pipeline, help improve the heat exchange efficiency of the water flow, avoid heat accumulation at the bend, and form a double flow guiding effect with the spiral guide groove 7 inside the pipe, so that the coolant has a uniform flow rate and sufficient heat exchange throughout the circulation path.

[0045] Reference Figures 2 to 4The heat sink 2 has a contact groove 5 inside. The contact groove 5 is arc-shaped to increase the contact area. The contact groove 5 is located inside the heat sink 2 in the area that directly contacts the CPU. It adopts an arc-shaped curved surface design, which is different from the traditional flat contact groove 5. The arc structure can significantly increase the actual contact area between the heat sink 2 and the CPU surface, solving the problems of contact gaps and uneven heat conduction that are easy to occur with flat contacts. Both the outer frame 1 and the heat sink 2 have heat dissipation holes 6 inside. The heat dissipation holes 6 are evenly distributed in the corresponding areas of the outer frame 1 and the heat sink 2. They adopt an array-style arrangement design. The hole diameter is moderate, which ensures smooth air circulation between the inside and outside. Both the water inlet pipe 3 and the water outlet pipe 4 have guide grooves 7 inside. The guide grooves 7 have a spiral advancing pattern. The guide grooves 7 are evenly distributed on the inner wall of the water inlet pipe 3 and the water outlet pipe 4. They are the core structure for water flow disturbance and guidance. The spiral pattern extends along the pipe axis. The design without sharp edges and burrs avoids scratching the pipe wall and obstructing the water flow. When the coolant flows inside the pipe, the spiral guide groove 7 can change the straight flow pattern of the water flow and guide the coolant to move forward in a spiral shape. On the one hand, it prolongs the residence time of the water flow in the pipe and improves the heat exchange efficiency; on the other hand, the spiral water flow can further disturb the coolant and avoid local heat exchange insufficiency caused by water flow stratification. The inlet pipe 3 and the outlet pipe 4 are both fixedly connected to the fixing frame 8. The fixing frame 8 adopts a cross-shaped support structure, which has the characteristics of water flow impact resistance and corrosion resistance. It is the bearing base of the connecting rod 9 and the fan blade 10, ensuring that it does not shake or shift under the impact of high-speed water flow, and providing a stable support point for the connecting rod 9.

[0046] Reference Figures 5 to 7 A connecting rod 9 is fixedly connected to one side of the mounting bracket 8. A fan blade 10 is rotatably connected to the outside of the connecting rod 9. When the low-temperature coolant flows in through the inlet pipe 3, the high-speed water flow continuously impacts the blades of the fan blade 10, driving the fan blade 10 to rotate rapidly around the connecting rod 9. The rotating fan blade 10 cuts and splits the straight-flowing coolant, forming multiple streams of turbulent coolant, breaking the water flow stratification phenomenon, greatly increasing the contact area between the coolant and the pipes and heat sink 2, and enhancing the heat exchange efficiency. A clamping plate 11 is slidably connected inside the heat sink 2. A fixing component is provided on one side of the clamping plate 11. When the CPU is installed in the heat sink 2, the clamping plate 11 is squeezed and slides to both sides, driving the push rod 12 to compress. Spring 15 stores force; after the CPU is installed in place, the spring 15 rebounds and the thrust is transmitted to the clamping plate 11 through the push rod 12, so that the clamping plate 11 is tightly attached to both sides of the CPU, realizing adaptive clamping. The fixing component includes the push rod 12, one side of which is fixedly connected to one side of the clamping plate 11. The function of the push rod 12 is to transmit the displacement force between the clamping plate 11 and the limiting plate 14. When the CPU squeezes the clamping plate 11, the push rod 12 transmits the lateral thrust to the limiting plate 14, driving the limiting plate 14 to compress the spring 15; when the spring 15 rebounds, the push rod 12 transmits the spring force in the opposite direction to the clamping plate 11, realizing the clamping action. The push rod 12 is externally slidably connected to the fixing sleeve 13.

[0047] Reference Figures 7 to 9 The fixed sleeve 13 has an internal elastic component, which serves as the mounting cavity for the elastic component and provides sliding guidance for the limiting plate 14 and the push rod 12. The elastic component includes the limiting plate 14, one side of which is fixedly connected to one side of the push rod 12. The fixed sleeve 13 has an internal spring 15, one end of which is fixedly connected to the outside of the limiting plate 14, while the outside of the limiting plate 14 is slidably connected to the inside of the fixed sleeve 13. The other end of the spring 15 is fixedly connected to the inside of the fixed sleeve 13. When the CPU is installed into the heat sink 2 and the clamping plate 11 is pressed, the spring 15 is laterally compressed by the limiting plate 14, storing elastic potential energy. After the CPU is fully installed, the spring 15 releases its potential energy, and through the rebound thrust, drives the limiting plate 14, the push rod 12, and the clamping plate 11 to reset, achieving adaptive clamping of the CPU. The push rod 12 has an ejection component on one side, which includes an ejection rod 16. One side is fixedly connected to one side of the limiting plate 14, the outside of the ejector rod 16 is slidably connected to the inside of the outer frame 1, and the outside of the ejector rod 16 is slidably connected to the inside of the fixed sleeve 13. The ejector rod 16 moves synchronously with the limiting plate 14. When the limiting plate 14 compresses the spring 15, the ejector rod 16 moves forward. A connecting frame 17 is fixedly connected to one side of the ejector rod 16. The connecting frame 17 is the connecting carrier between the ejector rod 16 and the movable ball 18. It moves laterally synchronously with the ejector rod 16. A movable ball 18 is fixedly connected to one side of the connecting frame 17. The movable ball 18 is the guide component that realizes the conversion of linear displacement to rotational action. When the connecting frame 17 moves with the ejector rod 16, the movable ball 18 slides smoothly in the groove of the rotating plate 19. It not only transmits the thrust to drive the rotating plate 19 to rotate around the rotation axis of the outer frame 1, but also avoids jamming between the connecting frame 17 and the rotating plate 19, ensuring that the opening and closing action of the rotating plate 19 is smooth.

[0048] Reference Figure 1 , Figure 2 and Figure 8The movable ball 18 is externally slidably connected to the inside of the rotating plate 19. The rotating plate 19 is rotatably connected to the inside of the outer frame 1. Under normal conditions, the rotating plate 19 is in a closed state, which serves as a dustproof protection. When the CPU is installed and the clamping action is triggered, the ejector component pushes the rotating plate 19 to rotate outward and open through the movable ball 18, so that the internal cavity of the outer frame 1 is connected to the external environment. Together with the heat dissipation hole 6, it forms an efficient air convection channel to accelerate heat dissipation. After the CPU is removed, the spring 15 returns to its original position and drives the ejector component to retract. The rotating plate 19 closes in turn and returns to the dustproof state. An inclined plate 20 is fixedly connected to one side of the clamping plate 11. The inclined plate 20 is fixed to the side of the clamping plate 11 near the CPU inlet. It adopts an inclined surface design. The angle of the inclined surface is adapted to the insertion direction of the CPU. It is a guide and trigger component for CPU installation. When the CPU is inserted into the heat dissipation frame 2, it first contacts the inclined surface of the inclined plate 20. The downward pressure of the CPU is converted into a lateral thrust, which pushes the clamping plate 11 to slide to both sides, triggering the linkage action of the fixing component and the ejector component.

[0049] A multi-core central processing unit for servers, the specific method includes the following steps:

[0050] S1. Installation: First, align the multi-core CPU into the heat sink 2. This will cause the tilt plate 20 to be squeezed, which will cause the clamping plate 11 to move. This will cause the push rod 12 to move, which will then cause the limiting plate 14 to move. This will cause the spring 15 to be compressed, thereby using the elastic force of the spring 15 to clamp and fix the CPU.

[0051] S2, Deployment: As the limiting plate 14 moves, the ejector rod 16 will move, which in turn will move the connecting frame 17. As the connecting frame 17 moves, it will push the rotating plate 19 to rotate. During this process, the movable ball 18 can be used to ensure that the rotating plate 19 opens.

[0052] S3. Heat dissipation steps: Coolant is injected into the inlet pipe 3 using a suction pump. As the coolant flows, it impacts the fan blade 10, causing it to rotate. This allows the coolant to be diverted and disturbed, increasing the contact area with the inlet pipe 3. Simultaneously, the guide groove 7 and the flow channel further guide the coolant, greatly improving heat absorption. Heat is then dissipated through the opening of the rotating plate 19 and the heat dissipation holes 6.

[0053] Working principle: When the multi-core CPU is installed inside the heatsink frame 2, the CPU will squeeze the inclined plate 20 of the clamping plate 11, pushing the clamping plate 11, push rod 12 and limiting plate 14 to move synchronously, compressing the spring 15 inside the fixing sleeve 13. The spring 15 rebounds to achieve adaptive clamping and fixing of the CPU, ensuring that the heatsink components are in close contact with the CPU. During this clamping and displacement process, the limiting plate 14 simultaneously drives the ejector rod 16 and connecting bracket 17 to move together. With the sliding guide of the movable ball 18, the rotating plate 19 inside the outer frame 1 opens accordingly, reserving a heat dissipation channel for heat flow. Subsequently, coolant is injected into the U-shaped water inlet pipe 3 by a suction pump. During the flow of coolant, it impacts the fixing bracket 8 and connecting sleeve 13 inside the pipe. The fan blades 10 on rod 9 rotate to divert and disturb the coolant flow. Combined with the dual guiding effect of the spiral grooves 7 inside the pipe and the guide grooves at the bends, the contact area between the coolant and the pipe is greatly increased, enhancing the heat adsorption efficiency. At the same time, the arc-shaped contact grooves 5 further increase the contact area between the heat sink 2 and the processor. Together with the heat dissipation holes 6 on the outer frame 1 and the heat sink 2, as well as the rotating plate 19 that opens in conjunction, a high-efficiency heat dissipation path is formed. Ultimately, the heat generated by the processor is quickly conducted and dissipated, achieving continuous and stable water cooling for the server's multi-core CPU. This overcomes the shortcomings of traditional heat dissipation devices, such as small contact area, low coolant flow efficiency, and blocked heat dissipation channels, and is suitable for the high power consumption and high heat dissipation requirements of multi-core CPUs.

[0054] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A water-cooling heat dissipation device for a multi-core central processing unit of a server, comprising an outer frame (1), characterized in that: A heat dissipation frame (2) is fixedly connected inside the outer frame (1). A water inlet pipe (3) is fixedly connected to the top of the heat dissipation frame (2). A water outlet pipe (4) is fixedly connected to one side of the water inlet pipe (3). A contact groove (5) is provided inside the heat dissipation frame (2). Heat dissipation holes (6) are provided inside both the outer frame (1) and the heat dissipation frame (2). Guide grooves (7) are provided inside both the water inlet pipe (3) and the water outlet pipe (4). A fixing frame (8) is fixedly connected inside both the water inlet pipe (3) and the water outlet pipe (4). A connecting rod (9) is fixedly connected to one side of the fixing frame (8). A fan blade (10) is rotatably connected to the outside of the connecting rod (9). A clamping plate (11) is slidably connected inside the heat dissipation frame (2). A fixing component is provided on one side of the clamping plate (11). A rotating plate (19) is rotatably connected inside the outer frame (1).

2. The water-cooling heat dissipation device for a multi-core central processing unit of a server according to claim 1, characterized in that: The fixing component includes a push rod (12), one side of which is fixedly connected to one side of the clamping plate (11). A fixing sleeve (13) is slidably connected to the outside of the push rod (12). An elastic component is provided inside the fixing sleeve (13). An ejection component is provided on one side of the push rod (12). An inclined plate (20) is fixedly connected to one side of the clamping plate (11).

3. The water-cooling heat dissipation device for a multi-core central processing unit of a server according to claim 2, characterized in that: The elastic component includes a limiting plate (14), one side of which is fixedly connected to one side of the push rod (12), and a spring (15) is provided inside the fixing sleeve (13).

4. The water-cooling heat dissipation device for a server multi-core central processing unit according to claim 3, characterized in that: The ejection assembly includes an ejection rod (16), one side of which is fixedly connected to one side of a limiting plate (14), a connecting frame (17) is fixedly connected to one side of the ejection rod (16), and a movable ball (18) is fixedly connected to one side of the connecting frame (17).

5. The water-cooling heat dissipation device for a server multi-core central processing unit according to claim 1, characterized in that: The contact groove (5) is arc-shaped to increase the contact area, and the water inlet pipe (3) and the water outlet pipe (4) are U-shaped.

6. The water-cooling heat dissipation device for a multi-core central processing unit of a server according to claim 1, characterized in that: The guide groove (7) has a spiral forward pattern, and a flow guide groove is provided at the bend of the water inlet pipe (3) and the water outlet pipe (4).

7. A water-cooling heat dissipation device for a multi-core central processing unit of a server according to claim 4, characterized in that: The limiting plate (14) is externally slidably connected to the inside of the fixed sleeve (13), and the ejector rod (16) is externally slidably connected to the inside of the fixed sleeve (13).

8. A water-cooling heat dissipation device for a server multi-core central processing unit according to claim 4, characterized in that: The movable ball (18) is externally slidably connected to the inside of the rotating plate (19), and the ejector rod (16) is externally slidably connected to the inside of the outer frame (1).

9. A water-cooling heat dissipation device for a server multi-core central processing unit according to claim 3, characterized in that: One end of the spring (15) is fixedly connected to the outside of the limiting plate (14), and the other end of the spring (15) is fixedly connected to the inside of the fixing sleeve (13).

10. A heat dissipation method for a multi-core central processing unit in a server, characterized in that, According to claim 1, the method for a multi-core central processing unit for servers includes the following steps: S1. Installation: First, align the multi-core CPU into the heat sink (2). This will cause the tilt plate (20) to be squeezed, which will cause the clamping plate (11) to move. This will cause the push rod (12) to move, which will then cause the limiting plate (14) to move. This will cause the spring (15) to be compressed, thus using the elastic force of the spring (15) to clamp and fix the CPU. S2, unfolding work: As the limit plate (14) moves, it will drive the ejector rod (16) to move, which in turn will drive the connecting frame (17) to move. As the connecting frame (17) moves, it will push the rotating plate (19) to rotate. During this process, the movable ball (18) can be used to ensure that the rotating plate (19) opens. S3, heat dissipation steps: Coolant is injected into the inlet pipe (3) by means of a suction pump. At this time, the flow of coolant will impact the fan blade (10) and cause the fan blade (10) to rotate, thereby allowing the coolant to be diverted and disturbed, so as to increase the contact area with the inlet pipe (3). At the same time, the coolant is further guided by the guide groove (7) and the flow channel, which can greatly improve the adsorption of heat. Heat can be dissipated by means of the opening of the rotating plate (19) and the heat dissipation hole (6).

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