A power supply circuit, a circuit board, a mainboard module and an electronic device

Abstract

The application discloses a power supply circuit, a circuit board, a mainboard module and electronic equipment, and relates to the technical field of servers. The power supply circuit comprises a substrate, a processor arranged on a first electric surface of the substrate, the processor having a first pin and a second pin, a conductive path arranged on the substrate and connected to the second pin to transmit a second current to the processor, a power supply board card, a power supply board card electric surface, the power supply board card being arranged on the first electric surface, the power supply board card electric surface being connected to the first pin through a first wire to transmit a first current to the processor, the first current being greater than the second current, and a shell enclosing the first electric surface, the power supply board card and the first wire. The power supply circuit, the circuit board, the mainboard module and the electronic equipment disclosed in the application can arrange the power supply board card and the processor in the same shell, connect through a bonding wire and provide a stable core device working voltage to the core device.

Description

Technical Field

[0001] This invention relates to the field of server technology, and in particular to a power supply circuit, circuit board, motherboard module, and electronic device. Background Technology

[0002] Servers are the core equipment of data centers. With the improvement of server computing power, the power consumption of a single core device in a server can reach the kilowatt level, which makes the current required by the core device reach the hundred-ampere level. Due to the parasitic resistance of the transmission line, the operating voltage transmitted to the core device is inevitably lower than the output voltage of the power module. Moreover, the longer the transmission line, the more significant the reduction in the operating voltage of the core device. This can easily cause the operating voltage conducted to the core device to be lower than the operating voltage range required by the core device, resulting in unstable operation of the core device. Summary of the Invention

[0003] In a first aspect, this application provides a power supply circuit, including: A substrate includes: a first electrical surface and a processor disposed on the first electrical surface, the processor having a first pin and a second pin, the second pin being connected to a conductive path disposed on the substrate to transmit a second current to the processor; and a power board including: a power board electrical surface, the power board being disposed on the first electrical surface, the power board electrical surface being connected to the first pin via a first wire to transmit a first current to the processor, wherein the first current is greater than the second current; and a housing encapsulating the first electrical surface, the power board, and the first wire.

[0004] Secondly, this application also provides a circuit board, including the power supply circuit described in the first aspect; and a circuit board having a second signal pad corresponding to the position of the first signal pad in the power supply circuit, the power supply circuit being disposed on the surface of the circuit board, the second signal pad being electrically connected to the first signal pad; and a fourth wire connected to a power supply post in the power supply circuit to transmit a power supply voltage to a power supply board in the power supply circuit through the power supply post; and a fifth wire connected to a conductive path in the power supply circuit to transmit a second current.

[0005] Thirdly, this application also provides a motherboard module, including the circuit board described in the second aspect. The circuit board further includes a fixing hole for fixing a pressing plate for pressing a power supply circuit; and a pressing plate disposed on the side facing the power supply circuit in the circuit board, which is fixed to the circuit board by fasteners passing through the fixing hole in the circuit board; the pressing plate is provided with a first groove and a second groove on the side facing the circuit board, the position of the first groove corresponding to the first communication pad, and the second groove for accommodating a power board card enclosed in the housing in the power supply circuit; and a communication module disposed in the first groove, which is pressed to form an electrical connection with the first communication pad.

[0006] Fourthly, this application also provides an electronic device, including the motherboard module described in the third aspect.

[0007] The beneficial effects of the technical solution provided in this application are as follows: By implementing the power supply circuit, circuit board, motherboard module, and electronic device described in this application, the processor and power board can be housed in the same casing, and the core operating voltage is provided to the processor through a first wire, which serves as a bonding wire. Compared with the method of laying conductive lines on the printed circuit board for core operating voltage transmission, the transmission distance of the core operating voltage is effectively reduced, and the voltage drop phenomenon caused by parasitic resistance during the transmission of the core operating voltage in the metallized traces on the printed circuit board is avoided. This effectively ensures the accuracy of the core operating voltage provided to the processor, enabling the processor to operate stably. In addition, since it is not necessary to connect to the metallized traces on the printed circuit board through pads, the pad space laid out for transmitting the processor core operating voltage is saved in the power supply circuit. This allows for the allocation of more high-speed signal pads and management signal pads to the power supply circuit, thereby improving the functional integration of the power supply circuit and facilitating the fan-out of the aforementioned signals. Furthermore, integrating the power supply board that provides the core operating voltage to the processor into the same housing eliminates the need for component placement on the printed circuit board (PCB), reducing PCB size, the number of power supply layers, and manufacturing costs. By press-fitting the communication module to the housing, the first and second communication pads are coupled, forming a strong electrical contact. This avoids the need for metallized traces, improves high-speed signal transmission reflection noise, significantly reduces losses in high-speed signal transmission paths, and enhances high-speed signal quality. Attached Figure Description

[0008] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0009] Figure 1 This is a schematic diagram of a power supply circuit provided in an embodiment of this application; Figure 2 This is another power supply circuit diagram provided in the embodiments of this application; Figure 3 This is a front view of the surface where the power contact and ground contact are located, as provided in the embodiments of this application; Figure 4 This is another power supply circuit diagram provided in the embodiments of this application; Figure 5This is a top view of the housing provided in an embodiment of this application; Figure 6 This is a top view of the circuit board provided in an embodiment of this application; Figure 7 This is a schematic diagram of the circuit board grounding network provided in an embodiment of this application; Figure 8 This is a side view of a portion of the power supply circuit of an electronic device provided in an embodiment of this application. Detailed Implementation

[0010] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0011] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an,” “a,” or “the,” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The numbers in the accompanying drawings are only used to distinguish individual functional parts or modules and do not indicate logical relationships between parts or modules. The terms “comprising,” “including,” or “including,” and similar terms mean that the element or object preceding the term encompasses the element or object listed following the term and its equivalents, without excluding other elements or objects. The terms “connected,” “linked,” and similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. “Above,” “below,” “left,” “right,” etc., are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0012] The various embodiments according to this disclosure will now be described in detail with reference to the accompanying drawings. It should be noted that in the drawings, the same reference numerals are assigned to components having substantially the same or similar structure and function, and repeated descriptions of them will be omitted.

[0013] To address the metastability issue that exists in existing technologies using Gray code representation when a state transitions from a final state to a first state, this application provides the following implementation method: In some embodiments, such as Figure 1 As shown, a power supply circuit includes: The substrate 110 includes: a first electrical surface 111 and a processor 101 disposed on the first electrical surface 111, the processor 101 having a first pin and a second pin, the second pin being connected to a conductive path disposed on the substrate 110 to transmit a second current to the processor 101; and a power board 120 including: a power board electrical surface 121, the power board 120 being disposed on the first electrical surface 111, the power board electrical surface 121 being connected to the first pin via a first wire 141 to transmit a first current to the processor 101, wherein the first current is greater than the second current; and a housing 130 encapsulating the first electrical surface 111, the power board 120, and the first wire 141.

[0014] The substrate 110 houses a processor, which can be a Central Processing Unit (CPU) or a Graphics Processing Unit (GPU). Tiny pins from the processor are fanned out through internal traces on the substrate 110 and connected to corresponding pads on the substrate 110, achieving electrical connections between the processor pins and the substrate pads. The substrate 110 provides robust mechanical support for the processor, protecting it from external damage. Furthermore, the metal layer inside the substrate conducts heat generated by the processor during operation, achieving a degree of heat dissipation.

[0015] The power supply board 120 receives voltage from the first voltage conversion module outside the housing 130 (typically the first voltage conversion module provides 12V to the power supply board) and converts this voltage into the core operating voltage of the processor 101 (the core operating voltage is typically 0.8V to 1.4V) to ensure stable and safe power supply. For example, the core component operating voltages commonly used in CPUs are 0.75V and 0.85V; the core component powering the GPU memory operates at 1.35V, and the core component powering the PCIe bus operates at 1.0V, etc.

[0016] Providing power to the processor means supplying the corresponding voltage to the corresponding processor pin while simultaneously supplying load current to that pin.

[0017] The first electrical surface 111 is electrically connected to the power board 120 and receives the core operating voltage converted by the power board 120.

[0018] The processor 101 has a first pin and a second pin. The first pin is used to receive the core operating voltage, and the current transmitted through the first pin is a first current; the current transmitted through the second pin is a second current.

[0019] Since the processor 101 is disposed on the first electrical surface 111, the first pin is correspondingly disposed on the first electrical surface 111. Optionally, the first pin is fanned out to the corresponding pad on the first electrical surface 111.

[0020] The electrical surface 121 of the power board is the surface where the various voltage output ports of the power board 120 are located, and is used to output different core operating voltages to the processor 101.

[0021] The first electrical surface 111 is connected to the corresponding voltage output port on the electrical surface 121 of the power supply board via a first wire 141 to transmit the core operating voltage. Optionally, one end of the first wire 141 is directly connected to the first pin, or connected to the corresponding pad fanned out by the first pin. The other end of the first wire 141 is connected to the corresponding voltage output port. In this way, the core operating voltage is transmitted from the power supply board 120 to the processor 101.

[0022] The first conductor 141 is a bonding wire, which is usually made of gold wire.

[0023] The processor's core operating voltage has the characteristic of a high current load, which can reach the order of hundreds of amps. Because the core operating voltage amplitude is relatively small, if this high current is transmitted through long metallized traces on the printed circuit board, the parasitic resistance of the metallized traces can cause the core operating voltage to drop below the rated core operating voltage, resulting in a voltage sag. However, by directly connecting the core device operating voltage output from the power supply board 120 to the first pin via the first wire 141, the transmission distance of the core device operating voltage can be greatly reduced, mitigating the voltage sag and ensuring normal processor operation.

[0024] The second voltage conversion module, which provides a small current to the processor, is located outside the power supply circuit. It can supply voltage and transmit current to the corresponding second pin through metallized traces on the motherboard and conductive paths on the substrate. Since the voltage drop is negligible due to the parasitic resistance, placing the second voltage conversion module outside the power supply circuit can effectively reduce the size of the power supply circuit, alleviate heat accumulation within the power supply circuit, and also ensure high compatibility with current motherboard circuit board designs.

[0025] The housing 130 provides reliable physical support for the processor inside, enabling it to withstand various operating environments. It protects and isolates the processor from moisture, dust, and harmful gases, and prevents physical impacts. Through pins or solder balls, it connects the processor's internal circuitry to an external circuit board (typically a PCB) for signal and power transmission. The housing also provides a heat conduction path for the processor, preventing overheating that could lead to performance degradation or damage. Some housings also shield against electromagnetic interference.

[0026] To facilitate the mounting of the substrate 110 and the power board 120 in the same housing, the thickness of the power board 120 is set to 0.9 mm to 1.0 mm. To meet stress requirements, the thickness of the substrate 110 is 8 mm to 10 mm.

[0027] By implementing this power supply circuit, the processor and power board can be housed in the same casing, connected via a first wire acting as a bonding wire to provide operating voltage to the processor. Compared to using metallized traces on the printed circuit board for core voltage transmission, this effectively reduces the transmission distance of the core voltage, preventing voltage drops due to parasitic resistance during transmission through the metallized traces. It also effectively ensures the accuracy of the core voltage supplied to the processor, enabling stable processor operation. Furthermore, since there is no need to connect to the metallized traces on the printed circuit board via pads, it saves pad space previously allocated for core voltage transmission. This allows the power supply circuit to allocate more high-speed signal pads and management signal pads to the processor, improving the functional integration of the core components and facilitating signal fan-out. Moreover, integrating the power board providing the core voltage to the processor into the same casing eliminates the need for component placement on the printed circuit board for this core voltage module, reducing the size of the printed circuit board, decreasing the number of power layers, and lowering manufacturing costs. After implementing this power supply circuit, the power board in the electronic device can be separated from the motherboard that carries the processor. This increases the distance between the power board and the motherboard, reduces crosstalk between power signals and high-speed signals on the motherboard, suppresses excessive radiation crosstalk of the whole machine, and improves the electromagnetic compatibility of the whole machine.

[0028] The power board 120 is disposed perpendicular to the substrate 110 on the first electrical surface 111.

[0029] To reduce the height of the housing 130, the height of the power board 120 shall not exceed 40 mm.

[0030] The power board 120, which is perpendicular to the substrate 110, can extend the bonding wires that originally extended in the horizontal direction to the direction perpendicular to the substrate 110, thereby further reducing the transmission distance of the processor core operating voltage and optimizing the stability of the processor core operating voltage.

[0031] A groove 150 is provided on the first electrical surface 111 where it contacts the power board 120. The width of the groove 150 is adapted to the thickness of the power board 120. The power board 120 is fixed in the groove 150 by a conductive material 190.

[0032] Preferably, the conductive material 190 is solder.

[0033] Trench 150 is a metallized trench used to connect to ground potential.

[0034] During substrate fabrication, a controlled-depth milling process is used to create milled grooves. The groove depth is 1 mm to 2 mm, and the width is 1.1 mm to 1.3 mm. The edge of the power board 120 that contacts the milled groove has an exposed copper window, which serves as the ground network. The power board 120 is vertically inserted into the milled groove and secured with a conductive material, ensuring a firm connection between the power board 120 and the substrate 110. Simultaneously, large-area copper soldering connections enhance the power network return current.

[0035] like Figure 2 As shown, the power board 120 also includes: a core power module 122; The core power module 122 is disposed on the electrical surface 121 of the power board and is directly connected to the first pin disposed on the first electrical surface 111 via the first wire 141.

[0036] The core power module 122 is a module that converts the input voltage (e.g., 12V input voltage) received by the power supply board 120 into the processor core operating voltage. It may include voltage conversion circuits such as DC-DC converters and low-dropout linear regulators. This application does not limit the specific internal structure of the core power module 122. It should be noted that a single core power module 122 only provides one specification for the processor core operating voltage. For the component parameter settings of a single core power module 122, those skilled in the art can design it specifically based on the input voltage received by the power supply board 120 and the core operating voltage required by the processor. This application does not limit the component parameters in the core power module 122.

[0037] The number of core power modules 122 corresponds to the number of core operating voltage specifications required by the processor. For example, if the processor only requires a core operating voltage of 0.75V, then the number of core operating voltage specifications is 1, and the number of core power modules 122 is 1; if the processor requires core operating voltages of 1.0V and 1.35V, then the number of core operating voltage specifications is 2, and the number of core power modules 122 is 2.

[0038] The core power module 122 is electrically connected to the electrical surface 121 of the power board. The core operating voltage provided by the power board 120 to the core device is transmitted through the first wire 141, which serves as a bonding wire. The first wire 141 is connected between the output terminal of the core power module 122 and the first pin or pad corresponding to the first electrical surface 111, so that the processor 101 directly receives the core operating voltage.

[0039] Since the power board 120 is vertically disposed on the surface of the substrate 110, in order to facilitate the stable fixing of the core power module 122 to the surface of the vertically disposed power board 120, the thickness of any core power module 122 is 3 mm to 3.5 mm.

[0040] The core power module 122 generates and outputs the core operating voltage required by the processor 101, and transmits the core operating voltage required by the processor 101 to the corresponding point on the substrate 110 through the first wire 141, so that the processor 101 can obtain the corresponding core operating voltage and work normally.

[0041] The power supply board 120 also includes: Power contact 123 is used to obtain power supply voltage, which is used to supply power to the power board; and ground contact 124 is used to connect to ground potential.

[0042] Please see Figure 3 , Figure 3 This is a front view of the surface where the power contact 123 and ground contact 124 are located. The power contact 123 is disposed on the electrical surface 121 of the power board, and the power supply voltage received by the power contact 123 comes from the voltage transmitted by the first voltage conversion module outside the power supply circuit. Typically, the first voltage conversion module is a voltage conversion module that converts 54V voltage to 12V voltage, outputting 12V voltage to power the power board 120. The core power module 122 converts the 12V input voltage received by the power board 120 into the core operating voltage required by the processor 101.

[0043] The grounding contact 124 is located on the electrical surface 121 of the power board. The grounding contact 124 is grounded, serving as the return current of the power network.

[0044] The power supply circuit also includes: Power post 125 is used to connect to a power supply device outside the housing 130 to obtain a power supply voltage. One end of power post 125 is electrically connected to power contact 123, and the other end of power post 125 extends to the outside of housing 130. Ground post 126 is used to connect to the ground potential provided outside the housing 130. One end of ground post 126 is electrically connected to ground contact 124, and the other end of ground post 126 extends to the outside of housing 130.

[0045] Here, the external power supply device is the first voltage conversion module, which can be located on the same printed circuit board as the power supply circuit, or on a different printed circuit board. When the power supply circuit is located on the same printed circuit board, the power supply post 125 can be connected to the first voltage conversion module via a conductive wire, or it can be connected to the first voltage conversion module via a combination of a conductive wire and a metallized trace laid on the printed circuit board. The conductive wire can be a cable.

[0046] A good electrical connection is formed between the power post 125 and the power contact 123. The power post 125 extends to the outside of the housing 130 to form an electrical connection with the first voltage conversion module, thereby obtaining the power supply voltage. By setting the power post 125, the power supply voltage receiving point of the power board 120 is extended to the outside of the housing 130, making it easy for the power supply circuit to connect to the port that provides the power supply voltage.

[0047] A good electrical connection is formed between the grounding post 126 and the grounding contact 124. The grounding post 126 extends to the outside of the housing 130 to connect to the ground potential. Schematic, the grounding post 126 can be connected to the ground potential via a conductive wire. By providing the grounding post 126, the grounding point of the power supply board 120 is extended to the outside of the housing 130, making the power supply circuit easier to ground.

[0048] The diameter of the power supply post 125 is the first diameter, and the diameter of the grounding post 126 is the second diameter; The second diameter is larger than the first diameter.

[0049] The initial diameter is determined by the current carried by the power supply post 125. The relationship between the cross-sectional area of ​​the power supply post 125 and the current carried by the power supply post 125 is as follows: every 1 square millimeter of the cross-sectional area of ​​the power supply post 125 carries 1 ampere of current. The diameter of the power supply post 125 can be obtained by converting the area to the diameter.

[0050] The grounding post 126 needs to carry both power return current and signal return current; therefore, the cross-sectional area of ​​the grounding post 126 is larger than that of the power post 125. Accordingly, the second diameter is larger than the first diameter.

[0051] Preferably, the first diameter is 15 mm. Since the power of the core device is approximately 1000W or more, the diameter of the power supply post 125 used to receive the 12V input voltage needs to be 15 mm or more.

[0052] Preferably, the second diameter is 20 mm. The grounding post 126 is used to provide a power return path.

[0053] Furthermore, for ease of assembly, the distance between the power supply post 125 and the grounding post 126 is 3 mm to 5 mm, preferably 4 mm.

[0054] Preferably, both the power supply post 125 and the grounding post 126 are treated with a chemical gold process.

[0055] like Figure 4 As shown, the housing 130 has a first housing surface 131; The power supply circuit also includes a first communication pad 160, which is spherical and protrudes from the surface 131 of the first housing. The first communication pad 160 is connected to the first electrical surface 111 via the second wire 142.

[0056] The first communication pad 160 in the power supply circuit is a chemical gold pad.

[0057] The second wire 142 is a bonding wire used to form a good electrical connection between the first communication pad 160 and the corresponding processor 101 pin. Specifically, one end of the second wire 142 is connected to the first communication pad 160, and the other end of the second wire 142 can be directly connected to the processor 101 pin corresponding to the first communication pad 160, or it can be connected to the pad fanned out from the corresponding processor 101 pin to the first electrical surface 111.

[0058] For the power supply circuit that needs to support the communication module, a first communication pad 160 is provided on the first housing surface 131 of the housing 130 to facilitate connection with the communication module. Preferably, the communication module is an optical module, and the connection method is crimping.

[0059] The number and position of the first communication pads 160 are adapted to the communication module to be connected to the power supply circuit, so that the pads on the communication module can be connected to the first communication pads 160 one by one.

[0060] The first communication pad 160 is a spherical pad. The height of the first communication pad 160 protruding from the surface 131 of the first housing is 0.2 mm to 0.25 mm. The spacing between adjacent first communication pads 160 is adapted to the pad spacing of the communication module to which they are to be connected; schematically, the center-to-center spacing of the first communication pads 160 is 0.6 mm to 0.7 mm. The surface of the first communication pad 160 is treated with a chemical gold process.

[0061] The electroless nickel immersion gold pads mentioned above are pads treated with an electroless nickel immersion gold process. Electroless nickel immersion gold (ENIG) is a surface treatment technology used in electronic manufacturing and device packaging.

[0062] It involves chemically plating a layer of nickel onto the exposed copper surface of a printed circuit board or substrate, and then replacing the nickel layer with an extremely thin layer of gold, thus forming a special protective layer.

[0063] The electroless gold plating process mainly consists of two core chemical reaction steps: electroless nickel plating and immersion gold plating.

[0064] Electroless nickel plating is a process in which a layer of metallic nickel is deposited on the surface of copper pads through an autocatalytic chemical reaction. This nickel layer not only provides a smooth substrate for the subsequent gold layer but also acts as a barrier layer to prevent copper atoms from diffusing outwards, while providing a certain degree of wear resistance and solderability.

[0065] Immersion gold plating involves immersing a nickel-plated component in a solution containing gold ions. Utilizing the difference in metal reactivity, the gold ions in the solution are reduced to metallic gold, which is deposited on the surface of the nickel layer; the nickel, on the other hand, is oxidized and dissolves into the solution. This process continues until the nickel surface is completely covered by gold, forming an extremely thin layer (typically only a few microinches).

[0066] Applying a chemical gold plating process to the first communication pad 160 provides it with oxidation resistance. Due to the extremely stable chemical properties of gold, it effectively isolates the pad from air and moisture, protecting the internal nickel layer and copper pads from oxidation over a long period, ensuring that the first communication pad 160 retains good conductivity even after extended storage. The chemical gold plating process also results in a high degree of surface smoothness on the first communication pad. Compared to traditional electroplating, the plating layer formed by chemical gold plating is more uniform and smoother. This is crucial for devices with extremely dense pins and very small spacing (such as BGA-packaged devices), effectively preventing cold solder joints or short circuits during soldering.

[0067] The first communication pad 160, treated with a chemical gold process, exhibits excellent conductivity and crimping performance. Due to the excellent conductivity and ductility of gold, physical crimping allows for slight plastic deformation of the gold layer, ensuring a low-resistance, highly reliable electrical connection between the two contact surfaces. The chemical gold process for the crimping surfaces utilizes gold's good ductility and oxidation resistance, ensuring stable, low-loss transmission of high-speed signals even under long-term physical pressing conditions, and preventing signal attenuation or failure due to oxidation at the contact points.

[0068] Figure 5 A top view of housing 130 is shown.

[0069] like Figure 4 As shown, the substrate 110 also includes a second electrical surface 112 opposite to the first electrical surface 111, and the housing 130 also has a second housing surface 132 opposite to the first housing surface 131 of the housing 130. The power supply circuit also includes a first signal pad 180, which is spherical and protrudes from the surface 132 of the second housing. The first signal pad 180 is connected to the second electrical surface 112 via the third conductor 143.

[0070] The second electrical surface 112 is the surface of the substrate 110 opposite to the first electrical surface 111, typically the bottom surface of the substrate 110. First signal pads 180 are disposed on the second electrical surface 112, and these first signal pads 180 are connected to corresponding pins within the processor 101 for signal transmission. These signals include DDR signals, clock signals, low-speed management signals, low-current power supply networks, etc., used to manage the routine operation of the processor 101. The pad spacing of the first signal pads 180 is 0.8 mm to 1 mm, and can be adjusted according to the size of the power supply circuit. A third wire 143 serves as a bonding wire, connecting the second electrical surface 112 to the corresponding first signal pads 180. The second electrical surface 112 has pads or contacts that form electrical connections with corresponding signal pins of the processor 101. Through the connection of the third wire 143, a good electrical connection can be formed between the first signal pads 180 and the corresponding pins on the processor 101.

[0071] In other embodiments, such as Figure 6As shown, a circuit board includes the power supply circuit described above; and a circuit board 200, which is provided with a second signal pad 210 corresponding to the position of the first signal pad 180 in the power supply circuit. The power supply circuit is disposed on the surface of the circuit board 200, and the second signal pad 210 is electrically connected to the first signal pad 180; a fourth wire is connected to a power supply post 125 in the power supply circuit to transmit a power supply voltage to a power supply board in the power supply circuit through the power supply post 125; and a fifth wire is connected to a conductive path in the power supply circuit to transmit a second current.

[0072] The fourth wire transmits the power supply voltage from the first voltage conversion module outside the power supply circuit. This power supply voltage powers the power board, i.e., the power supply voltage mentioned earlier. The fifth wire transmits the voltage from the second voltage conversion module outside the power supply circuit to the processor.

[0073] The first voltage conversion module 230 and the second voltage conversion module 240 can be mounted on a circuit board. When both the first voltage conversion module 230 and the second voltage conversion module 240 are mounted on the circuit board, the fourth wire is at least a conductive cable, forming part of the electrical connection path between the voltage output terminal of the first voltage conversion module 230 and the power supply post 125. One end of the fourth wire is connected to the power supply post 125, and the other end can be directly connected to the voltage output terminal of the first voltage conversion module 230, or it can be connected to the voltage output terminal of the first voltage conversion module 230 via a metallized trace mounted on the circuit board 200. The fifth wire is a metallized trace mounted on the circuit board 200.

[0074] If at least one of the first voltage conversion module 230 or the second voltage conversion module 240 is not mounted on the circuit board 200: the connection path between the first voltage conversion module 230 and the power supply post 125 includes at least wires connecting the corresponding ports of the two boards; the connection path between the second voltage conversion module 240 and the processor includes at least wires connecting the corresponding ports of the two boards.

[0075] Preferably, the circuit board further includes: a first voltage conversion module 230 connected to a fourth wire to form a power supply path from the first voltage conversion module 230 to the power supply board via the fourth wire; and a second voltage conversion module 240 connected to a fifth wire to form a power supply path from the second voltage conversion module 240 to the conductive path via the fifth wire.

[0076] The power supply circuit specifically includes: The substrate 110 includes: a first electrical surface 111 and a processor 101 disposed on the first electrical surface 111, the processor 101 having a first pin and a second pin, the second pin being connected to a conductive path disposed on the substrate 110 to transmit a second current to the processor 101; and a power board 120 including: a power board electrical surface 121, the power board 120 being disposed on the first electrical surface 111, the power board electrical surface 121 being connected to the first pin via a first wire 141 to transmit a first current to the processor 101, wherein the first current is greater than the second current; and a housing 130 encapsulating the first electrical surface 111, the power board 120, and the first wire 141.

[0077] The power board 120 is disposed perpendicular to the substrate 110 on the first electrical surface 111.

[0078] A groove 150 is provided on the first electrical surface 111 where it contacts the power board 120. The width of the groove is adapted to the thickness of the power board 120. The power board 120 is fixed in the groove 150 by a conductive material 190.

[0079] Trench 150 is a metallized trench used to connect to ground potential.

[0080] The power board 120 also includes a core power module 122; the core power module 122 is disposed on the electrical surface 121 of the power board and is connected to a first pin disposed on the first electrical surface 111 via a first wire 141.

[0081] Power supply board 120 also includes: Power contact 123 is used to obtain power supply voltage, which is used to supply power to the power board; and ground contact 124 is used to connect to ground potential.

[0082] The power supply circuit also includes: Power post 125 is used to connect to a power supply device outside the housing 130 to obtain a power supply voltage. One end of power post 125 is electrically connected to power contact 123, and the other end of power post 125 extends to the outside of housing 130. Ground post 126 is used to connect to the ground potential provided outside the housing 130. One end of ground post 126 is electrically connected to ground contact 124, and the other end of ground post 126 extends to the outside of housing 130.

[0083] The diameter of the power supply post 125 is the first diameter, and the diameter of the grounding post 126 is the second diameter; the second diameter is larger than the first diameter.

[0084] The housing 130 has a first housing surface 131; the power supply circuit also includes a first communication pad 160, which is spherical and protrudes from the first housing surface 131; the first communication pad 160 is connected to the first electrical surface 111 through a second wire 142.

[0085] The substrate 110 also includes a second electrical surface 112 opposite to the first electrical surface 111, and the housing 130 also has a second housing surface 132 opposite to the first housing surface 131 of the housing 130; the power supply circuit also includes a first signal pad 180, which is spherical and protrudes from the second housing surface 132; the first signal pad 180 is connected to the second electrical surface 112 through a third wire 143.

[0086] The first communication pad 160 in the power supply circuit is a chemical gold pad.

[0087] By pressing the communication module to the first communication pad 160, the high-speed signal transmission distance is shortened, the high-speed line bandwidth is increased, and the package size of the core device can be reduced. Since there are no longer high-speed signal transmission lines on the circuit board, it is beneficial to the circuit board design, reduce the size of the circuit board of the whole machine, and improve the integration of the whole machine assembly. It can also reduce the specifications of the circuit board material and reduce the manufacturing cost of the circuit board.

[0088] The circuit board also has an analog reference potential area 250 and a digital reference potential area 260; The circuit board 200 is provided with a mounting hole 220, which is a metallized hole and is electrically connected to the analog reference potential area 250 to shield the digital reference potential area 260 from noise.

[0089] Schematic diagram: analog reference potential area 250 is connected to analog ground; digital reference potential area 260 is connected to digital ground.

[0090] The metallized mounting holes 220 serve two purposes: firstly, to provide a fixed position for the pressure plate 300 on the circuit board; and secondly, to establish good electrical contact between the pressure plate and the ground potential (analog ground), increasing the single-point return current of the analog ground network. This isolates it from the digital ground network and suppresses crosstalk. The distribution of the AGND network (analog ground) and GND network (digital ground) is as follows: Figure 7 As shown.

[0091] In other embodiments, such as Figure 8 As shown, a motherboard module includes the circuit board described above, a pressure plate 300, and a communication module 400.

[0092] The mounting holes 220 provided on the circuit board are used to fix the crimping plate 300 of the crimping power supply circuit; A pressure plate 300 is disposed on the side facing the power supply circuit in the circuit board and is fixed to the circuit board by fasteners passing through the fixing holes 220 in the circuit board. The side of the pressure plate 300 facing the circuit board is provided with a first groove 310 and a second groove 320. The position of the first groove 310 corresponds to the first communication pad 160, and the second groove 320 is used to accommodate the power board 120 enclosed by the housing in the power supply circuit. The communication module 400 is disposed in the first groove 310 and is electrically connected to the first communication pad 160 by crimping.

[0093] The circuit board includes the power supply circuit described above; and a circuit board 200, which is provided with a second signal pad 210 corresponding to the position of the first signal pad 180 in the power supply circuit. The power supply circuit is disposed on the surface of the circuit board 200, and the second signal pad 210 is electrically connected to the first signal pad; a fourth wire, which is connected to the power supply post 125 in the power supply circuit, and transmits the power supply voltage to the power supply board in the power supply circuit through the power supply post 125; and a fifth wire, which is connected to the conductive path in the power supply circuit to transmit a second current.

[0094] The power supply circuit specifically includes: The substrate 110 includes: a first electrical surface 111 and a processor 101 disposed on the first electrical surface 111, the processor 101 having a first pin and a second pin, the second pin being connected to a conductive path disposed on the substrate 110 to transmit a second current to the processor 101; and a power board 120 including: a power board electrical surface 121, the power board 120 being disposed on the first electrical surface 111, the power board electrical surface 121 being connected to the first pin via a first wire 141 to transmit a first current to the processor 101, wherein the first current is greater than the second current; and a housing 130 encapsulating the first electrical surface 111, the power board 120, and the first wire 141.

[0095] The power board 120 is disposed perpendicular to the substrate 110 on the first electrical surface 111.

[0096] A groove 150 is provided on the first electrical surface 111 where it contacts the power board 120. The width of the groove is adapted to the thickness of the power board 120. The power board 120 is fixed in the groove 150 by a conductive material 190.

[0097] Trench 150 is a metallized trench used to connect to ground potential.

[0098] The power board 120 also includes a core power module 122; the core power module 122 is disposed on the electrical surface 121 of the power board and is connected to a first pin disposed on the first electrical surface 111 via a first wire 141.

[0099] Power supply board 120 also includes: Power contact 123 is used to obtain power supply voltage, which is used to supply power to the power board; and ground contact 124 is used to connect to ground potential.

[0100] The power supply circuit also includes: Power post 125 is used to connect to a power supply device outside the housing 130 to obtain a power supply voltage. One end of power post 125 is electrically connected to power contact 123, and the other end of power post 125 extends to the outside of housing 130. Ground post 126 is used to connect to the ground potential provided outside the housing 130. One end of ground post 126 is electrically connected to ground contact 124, and the other end of ground post 126 extends to the outside of housing 130.

[0101] The diameter of the power supply post 125 is the first diameter, and the diameter of the grounding post 126 is the second diameter; the second diameter is larger than the first diameter.

[0102] The housing 130 has a first housing surface 131; the power supply circuit also includes a first communication pad 160, which is spherical and protrudes from the first housing surface 131; the first communication pad 160 is connected to the first electrical surface 111 through a second wire 142.

[0103] The substrate 110 also includes a second electrical surface 112 opposite to the first electrical surface 111, and the housing 130 also has a second housing surface 132 opposite to the first housing surface 131 of the housing 130; the power supply circuit also includes a first signal pad 180, which is spherical and protrudes from the second housing surface 132; the first signal pad 180 is connected to the second electrical surface 112 through a third wire 143.

[0104] The first communication pad 160 in the power supply circuit is a chemical gold pad.

[0105] The fastener is at least one of the following: screw, bolt, or bolt.

[0106] The aforementioned fasteners establish a good electrical connection between the crimp plate and the analog ground network, increasing single-point return current and suppressing crosstalk with digital signals.

[0107] The communication module 400 has a second communication pad; The second communication pad is a metallized concave surface, which is set to correspond to the first communication pad 160 on the power supply circuit. After being pressed by the pressing plate 300, the first communication pad 160 and the second communication pad form an electrical connection.

[0108] The second communication pad is disposed on the communication module 400, and its shape is adapted to the shape of the first communication pad 160 to be pressed, and it is a concave pad. The second communication pad and the first communication pad 160 to be pressed are in one-to-one correspondence in position, that is, for any second communication pad on the communication module 400, there is only one corresponding first communication pad 160 on the first housing surface 131.

[0109] A communication through-hole is provided on the pressure plate 300 corresponding to the first groove 310. Preferably, the communication through-hole is located on the side wall of the first groove 310, allowing an optical fiber to pass through, and the communication module is an optical module. The optical fiber passes through the communication through-hole and connects to the corresponding communication module 400, enabling the corresponding communication module 400 to perform optical communication with the outside of the motherboard module.

[0110] The first groove 310 is used to accommodate the communication module 400. After the crimping plate 300 is fixed to the circuit board described above by fasteners, the second communication pad of the communication module 400 located in the first groove 310 forms a good electrical connection with the first communication pad. This allows the communication module 400 to be crimped with the power supply circuit. The crimped communication module 400 is detachable, which facilitates later maintenance and reduces the overall maintenance cost of the device.

[0111] The communication module, which is located in the first groove 310, is connected through a communication through-hole, enabling the communication module to communicate via optical fiber.

[0112] The pressure plate 300 has a power supply through hole and a grounding through hole corresponding to the second groove 320. Preferably, the power supply through hole and the grounding through hole are located on the side wall of the second groove 320.

[0113] The power through hole allows the power cable to pass through, and the power cable is connected to the power post 125 in the power supply circuit through the power through hole; The grounding cable passes through the grounding through-hole, and the grounding cable is connected to the grounding post 126 in the power supply circuit through the grounding through-hole.

[0114] The cable connected to power post 125 is connected to the external input voltage through the power through-hole.

[0115] The cable connected to the grounding post 126 forms an electrical connection with the grounding point through the grounding through hole.

[0116] The gap between the second groove 320 and the power supply circuit is 1 mm to 2 mm to avoid collision with the power supply circuit and damage to the power board 120 or core components inside the power supply circuit. After the electronic device is assembled, it is fixed with thermally conductive foam to achieve good heat dissipation.

[0117] The communication module is press-fitted to the housing, ensuring complete coupling between the first and second communication pads and forming a good electrical contact. This eliminates the need for extra conductive traces, avoids noise reflection during high-speed signal transmission, significantly reduces losses in the high-speed signal transmission path, and improves signal quality. The routing of fiber optic cables, power cables, and ground cables is also easier to manage through bundling and tidying. The entire electronic device is easy to disassemble, and the communication module is easy to remove or install, facilitating maintenance and reducing overall maintenance costs.

[0118] Preferably, the pressing plate is a cooling plate, and a connecting cooling pipe is provided inside the cooling plate. Refrigerant is disposed within the cooling pipe. The cooling pipe has a first end and a second end. The refrigerant flows through the cooling pipe between the first end and the second end, forming a flow path. This application does not limit the direction of refrigerant circulation.

[0119] There are gaps between adjacent cooling pipe sections in the cooling plate; The spacing settings for communication vias, power vias, and grounding vias in electronic devices.

[0120] Numerous liquid-cooled pipes are laid around the communication module, greatly improving heat dissipation efficiency and ensuring excellent electro-optical conversion. The cooling plate is close to the communication module and the power supply board inside the housing, facilitating heat dissipation and improving the operational stability of the power supply module. A single layer of cooling pipes is laid in the first and second recesses to limit the overall height and facilitate miniaturization.

[0121] In other embodiments, an electronic device is provided, including the motherboard module described above.

[0122] For the assembly of this electronic device, the first step is to follow the standard procedure and solder the motherboard PCB circuit board to fix the power supply circuit onto the motherboard PCB. Next, the liquid cooling plate heatsink is assembled, and the inlet, outlet, optical fiber, 12V cable, and ground cable are all connected to the cooling plate. Then, the cooling plate is snapped onto the power supply circuit, with the power board aligned vertically. The copper pillars of the 12V power supply are first joined, and then the communication module pads are pressed together. To increase the assembly firmness and prevent the motherboard PCB from warping and deforming, which could lead to poor contact of the processor pins, a metal tray of the same size as the main chip is added to the bottom of the motherboard PCB. Finally, the heatsink, motherboard, and bottom tray are secured with screws.

[0123] Each functional module is assembled independently, which facilitates subsequent disassembly and maintenance. If an important module is damaged, it can be replaced individually, reducing maintenance costs. Fiber optic cables, 12V power cables, and ground cables are easy to bundle and manage, and their reasonable distribution facilitates assembly.

[0124] Preferably, the electronic device is a server.

[0125] The beneficial effects of the technical solution provided in this application are as follows: By implementing the power supply circuit, circuit board, motherboard module, and electronic device described in this application, the processor and power board can be packaged in the same housing, and the core operating voltage is provided to the processor through a first wire as a bonding wire. Compared with the method of laying conductive lines on the printed circuit board for core operating voltage transmission, the transmission distance of the core operating voltage is effectively reduced, and voltage drop due to parasitic resistance is avoided when the core operating voltage is transmitted in the metallized traces on the printed circuit board; the accuracy of the core operating voltage provided to the processor is effectively guaranteed, so that the processor can operate stably. In addition, since it is not necessary to connect to the metallized traces on the printed circuit board through pads, the pad space laid for transmitting the processor core operating voltage is saved in the power supply circuit, which makes it easier to allocate more high-speed signal pads and management signal pads to the power supply circuit, thereby improving the functional integration of the power supply circuit. Furthermore, by integrating the power supply module providing the core operating voltage to the processor into the same housing, it avoids the need for component placement on the printed circuit board (PCB), reducing the PCB size, the number of power supply layers, and manufacturing costs. By press-fitting the communication module to the housing, the first and second communication pads are coupled, forming a good electrical contact. This avoids the need for metallized traces, improves high-speed signal transmission reflection noise, significantly reduces losses in high-speed signal transmission paths, and enhances high-speed signal quality.

[0126] Those skilled in the art will further recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of both. To clearly illustrate the interchangeability of hardware and software, the components and steps of the various examples have been generally described in terms of functionality in the foregoing description. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0127] Specifically, according to embodiments of this application, the processes described above with reference to the flowcharts can be implemented as steps controlled by a computer software program. For example, embodiments of this application include a computer program product comprising a computer program loaded on a computer-readable medium, the computer program containing program code for performing the methods shown in the flowcharts. In such embodiments, the computer program can be downloaded and installed from a network via a communication device, or installed from memory, or installed from ROM. When the computer program is executed by an external processor, it performs the functions defined in the methods of embodiments of this application.

[0128] It should be noted that the computer-readable medium in the embodiments of this application can be a computer-readable signal medium or a computer-readable storage medium, or any combination of the two. A computer-readable storage medium can be, for example,—but not limited to—an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination thereof. More specific examples of a computer-readable storage medium may include, but are not limited to: an electrical connection having one or more wires, a portable computer disk, a hard disk, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage device, magnetic storage device, or any suitable combination thereof. In the embodiments of this application, a computer-readable storage medium can be any tangible medium containing or storing a program that can be used by or in conjunction with an instruction execution system, apparatus, or device. In the embodiments of this application, a computer-readable signal medium can include a data signal propagated in baseband or as part of a carrier wave, carrying computer-readable program code. Such propagated data signals can take various forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination thereof. A computer-readable signal medium may also be any computer-readable medium other than a computer-readable storage medium, which can send, propagate, or transmit a program for use by or in connection with an instruction execution system, apparatus, or device. The program code contained on the computer-readable medium can be transmitted using any suitable medium, including but not limited to: wires, optical fibers, RF (Radio Frequency), etc., or any suitable combination thereof.

[0129] The aforementioned computer-readable medium may be included in the aforementioned server; or it may exist independently and not assembled into the server. The aforementioned computer-readable medium carries one or more programs that, when executed by the server, cause the server to: in response to detecting that the peripheral mode of the terminal is not activated, acquire the frame rate of the application on the terminal; when the frame rate meets the screen-off condition, determine whether the user is acquiring the terminal's screen information; and in response to the determination that the user is not acquiring the terminal's screen information, control the screen to enter an immediate dimming mode.

[0130] Computer program code for performing the operations of the embodiments of this application can be written in one or more programming languages ​​or a combination thereof. Programming languages ​​include object-oriented programming languages—such as Java, Smalltalk, and C++—and conventional procedural programming languages—such as the "C" language or similar programming languages. The program code can be executed entirely on the user's computer, partially on the user's computer, as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving remote computers, the remote computer can be connected to the user's computer via any type of network—including a local area network (LAN) or a wide area network (WAN)—or can be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0131] The various embodiments in this specification are described in a progressive manner. Similar or identical parts between embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, for system or system embodiments, since they are basically similar to method embodiments, the description is relatively simple, and relevant parts can be referred to the descriptions in the method embodiments. The systems and system embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. Those skilled in the art can understand and implement this without creative effort.

[0132] The technical solutions provided in this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only intended to help understand the methods and core ideas of this application. Furthermore, those skilled in the art will recognize that, based on the ideas of this application, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this application.

[0133] The power supply circuit, circuit board, motherboard module, and electronic device provided in this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. These embodiments are merely preferred embodiments of this application, used to help understand the method and core ideas of this application, and are not intended to limit this application. It should be noted that for those skilled in the art, any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application without departing from its principles are also within the protection scope of this application.

Claims

1. A power supply circuit, characterized in that, include: A substrate (110) includes: a first electrical surface (111) and a processor (101) disposed on the first electrical surface (111). The processor (101) has a first pin and a second pin, the second pin being connected to a conductive path disposed on the substrate (110) to transmit a second current to the processor (101); and A power board (120) includes: a power board electrical surface (121), the power board (120) being disposed on the first electrical surface (111), the power board electrical surface (121) being connected to the first pin via a first wire (141) disposed outside the power board (120) to transmit a first current to the processor (101), wherein the first current is greater than the second current.

2. The power supply circuit according to claim 1, characterized in that, The power board (120) is disposed perpendicular to the substrate (110) on the first electrical surface (111).

3. The power supply circuit according to claim 2, characterized in that, A groove (150) is provided on the first electrical surface (111) where it contacts the power board (120), and the width of the groove is adapted to the thickness of the power board (120). The power board (120) is fixed in the groove (150) by a conductive material (190).

4. The power supply circuit according to claim 3, characterized in that, The trench (150) is a metallized trench used to connect to the ground potential.

5. The power supply circuit according to claim 1, characterized in that, The power board (120) also includes: a core power module (122); The core power module (122) is disposed on the electrical surface (121) of the power board and is connected to the first pin disposed on the first electrical surface (111) via the first wire (141).

6. The power supply circuit according to claim 1, characterized in that, The power supply board (120) also includes: Power contact (123) is used to obtain power supply voltage, which is used to supply power to the power board; and Grounding contact (124) is used to connect to ground potential.

7. The power supply circuit according to claim 6, characterized in that, The power supply circuit also includes: The housing (130) encloses the first electrical surface (111), the power board (120), and the first wire (141). A power post (125) is used to connect to a power supply device outside the housing (130) to obtain the power supply voltage. One end of the power post (125) is electrically connected to the power contact (123), and the other end of the power post (125) extends outside the housing (130). A grounding post (126) is used to connect to the ground potential provided outside the housing (130). One end of the grounding post (126) is electrically connected to the grounding contact (124), and the other end of the grounding post (126) extends to the outside of the housing (130).

8. The power supply circuit according to claim 7, characterized in that, The diameter of the power supply post (125) is a first diameter, and the diameter of the grounding post (126) is a second diameter; The second diameter is larger than the first diameter.

9. The power supply circuit according to claim 7, characterized in that, The housing (130) has a first housing surface (131). The power supply circuit also includes a first communication pad (160), which protrudes from the surface of the first housing (131). The first communication pad (160) is connected to the first electrical surface (111) via the second conductor (142).

10. The power supply circuit according to claim 9, characterized in that, The substrate (110) also includes a second electrical surface (112) opposite to the first electrical surface (111), and the housing (130) also has a second housing surface (132) opposite to the first housing surface (131) of the housing (130). The power supply circuit also includes a first signal pad (180), which protrudes from the surface of the second housing (132). The first signal pad (180) is connected to the second electrical surface (112) via a third conductor (143).

11. The power supply circuit according to claim 9 or 10, characterized in that, The first communication pad (160) in the power supply circuit is a chemical gold pad.

12. A circuit board, characterized in that, Includes the power supply circuit as described in any one of claims 1 to 11; and The circuit board (200) is provided with a second signal pad (210) corresponding to the position of the first signal pad (180) in the power supply circuit. The power supply circuit is disposed on the surface of the circuit board (200). The second signal pad (210) is electrically connected to the first signal pad (180). as well as The fourth wire is connected to the power supply post (125) in the power supply circuit, and transmits the power supply voltage to the power supply board in the power supply circuit through the power supply post (125); as well as The fifth wire is connected to the conductive path in the power supply circuit to transmit the second current.

13. The circuit board according to claim 12, characterized in that, The circuit board also includes: A first voltage conversion module (230) is connected to the fourth wire, forming a power supply path from the first voltage conversion module (230) to the power board via the fourth wire; and The second voltage conversion module (240) is connected to the fifth wire to form a power supply path from the second voltage conversion module (240) to the conductive path via the fifth wire.

14. A motherboard module, characterized in that, The circuit board includes the circuit board of claim 12 or 13, the circuit board further including a fixing hole (220) for fixing a pressing plate (300) for pressing the power supply circuit; and A pressure plate (300) is disposed on the side facing the power supply circuit in the circuit board and is fixed to the circuit board by fasteners passing through the fixing holes (220) in the circuit board; the pressure plate (300) is provided with a first groove (310) and a second groove (320) on the side facing the circuit board, the first groove (310) is located corresponding to the first communication pad (160), and the second groove (320) is used to accommodate the power supply board (120) enclosed by the housing in the power supply circuit. as well as The communication module (400) is disposed in the first groove (310) and is electrically connected to the first communication pad (160) by crimping.

15. The motherboard module according to claim 14, characterized in that, The communication module (400) has a second communication pad; The second communication pad is a metallized concave surface, which is set corresponding to the first communication pad (160) on the power supply circuit; After being pressed by the pressing plate (300), the first communication pad (160) and the second communication pad form an electrical connection.

16. The motherboard module according to claim 14, characterized in that, The pressure plate (300) has a communication through hole corresponding to the first groove (310); The communication through hole allows the communication cable to pass through, and the communication cable is connected to the corresponding communication module (400) through the communication through hole, so that the corresponding communication module (400) can communicate optically with the outside of the motherboard module.

17. The motherboard module according to claim 14, characterized in that, The pressure plate (300) has a power supply through hole and a grounding through hole corresponding to the second groove (320); The power through hole allows the power cable to pass through, and the power cable is connected to the power post (125) in the power supply circuit through the power through hole; The grounding through hole allows the grounding cable to pass through, and the grounding cable is connected to the grounding post (126) in the power supply circuit through the grounding through hole.

18. The motherboard module according to any one of claims 14-17, characterized in that, The circuit board (200) in the circuit board also has an analog reference potential area (250) and a digital reference potential area (260). The mounting hole (220) is a metallized hole that is electrically connected to the analog reference potential region (250) to shield the digital reference potential region (260) from noise.

19. The motherboard module according to claim 14, characterized in that, The pressing plate is a cooling plate, and a connecting cooling pipe is provided inside the cooling plate, and a refrigerant is provided inside the cooling pipe; The cooling pipe has a first end and a second end; The refrigerant passes through the first end and then through the cooling pipe to the second end, forming a flow path.

20. An electronic device, characterized in that, Includes the motherboard module as described in any one of claims 14-19.

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