Touch module, display device and processing method of touch module

Abstract

The application relates to a touch module, a display device and a processing method of the touch module. The touch module comprises a substrate, a first touch electrode layer, a first insulating layer, a second touch electrode layer, a barrier layer and an organic planarization layer. The first touch electrode layer is arranged on one side of the substrate in the thickness direction of the touch module and comprises a plurality of first touch electrodes. The first insulating layer covers the first touch electrode layer. The second touch electrode layer is arranged on the side, away from the substrate, of the first touch electrode layer and is at least partially spaced from the first touch electrode layer. At least part of the first insulating layer is arranged between the first touch electrode layer and the second touch electrode layer. The second touch electrode layer comprises a plurality of second touch electrodes. The barrier layer is arranged on the side, away from the substrate, of the second touch electrode layer and covers at least part of the second touch electrode layer. The barrier layer is arranged between the organic planarization layer and the second touch electrode layer. The touch module provided by the application can improve the uniformity of light transmission and the yield.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a touch module, a display device, and a method for processing the touch module. Background Technology

[0002] To improve ease of operation, existing mobile display devices typically achieve human-computer interaction through touch. Based on this, the touch module in the display device usually includes touch electrodes, an insulating layer to form insulation between the electrodes, and a protective layer for protection. Meanwhile, some existing display panels employ COE (Color Filter on Encapsulation) technology, which integrates color filters directly into the encapsulation layer, replacing the circular polarizer and part of the optical layer in traditional OLED panels. This significantly improves light transmittance, color performance, and power efficiency. However, in display devices using COE technology, the organic encapsulation layer and the touch electrode layer are stacked. During the curing of the encapsulation layer, uneven thermal conductivity and air bubbles can easily occur, affecting the light transmission uniformity of the touch module and the product yield.

[0003] Therefore, there is an urgent need for a touch module that can improve light transmission uniformity and yield, as well as a corresponding display device and touch module processing method. Summary of the Invention

[0004] This application provides a touch module, a display device, and a method for processing the touch module, which can improve the uniformity of light transmission and the yield rate of the touch module.

[0005] In a first aspect, according to embodiments of this application, a touch module is provided, comprising: a substrate; a first touch electrode layer, stacked on one side of the substrate in the thickness direction of the touch module, the first touch electrode layer including a plurality of first touch electrodes; a first insulating layer, located on the side of the first touch electrode layer away from the substrate and covering the first touch electrode layer; a second touch electrode layer, disposed on the side of the first touch electrode layer away from the substrate and at least partially spaced from the first touch electrode layer, at least a portion of the first insulating layer being sandwiched between the first touch electrode layer and the second touch electrode layer, the second touch electrode layer including a plurality of second touch electrodes; a barrier layer, located on the side of the second touch electrode layer away from the substrate, the barrier layer covering at least a portion of the second touch electrode layer; and an organic planarization layer, at least a portion located on the side of the barrier layer away from the substrate, the barrier layer being sandwiched between the organic planarization layer and the second touch electrode layer.

[0006] According to one aspect of the embodiments of this application, along the thickness direction, the orthographic projection of the barrier layer covers the orthographic projection of the second touch electrode layer, and the organic planarization layer is spaced apart from the second touch electrode layer; or, the barrier layer and the first insulating layer are made of the same material and are integrally disposed.

[0007] According to one aspect of the present application, an organic planarization layer is disposed at a distance from the second touch electrode layer; a barrier layer is disposed covering the side surface of the second touch electrode layer opposite to the substrate and each side surface parallel to the thickness direction.

[0008] According to one aspect of the embodiments of this application, the thickness of the barrier layer is less than the thickness of the second touch electrode layer.

[0009] According to one aspect of the embodiments of this application, the barrier layer and the first insulating layer are made of the same material and are integrally disposed therein; the barrier layer is provided with an exhaust hole, which is disposed through the barrier layer along the thickness direction, and the orthogonal projection of the second touch electrode layer covers the orthogonal projection of the exhaust hole along the thickness direction.

[0010] According to one aspect of the embodiments of this application, the barrier layer is made of an inorganic material, and the material of the barrier layer includes at least one of silicon nitride and silicon oxide.

[0011] According to one aspect of the embodiments of this application, at least a portion of the second touch electrode is a metal mesh electrode, and an organic planarization layer covers the second touch electrode and is partially disposed in the same layer as the second touch electrode layer.

[0012] Secondly, according to the embodiments of this application, a display device is provided, including: a screen body having a backlight side and a light-emitting side disposed opposite to each other; and a touch module as described in any embodiment of the first aspect, located on the side surface of the screen body near the light-emitting side and stacked with the screen body.

[0013] Thirdly, according to embodiments of this application, a method for processing a touch module is proposed, comprising: providing a substrate; forming a first touch electrode layer on the substrate, the first touch electrode layer including a plurality of first touch electrodes; forming a first insulating layer on the first touch electrode layer, such that the first insulating layer covers the first touch electrode layer; forming a second touch electrode layer on the first insulating layer, the second touch electrode layer including a plurality of second touch electrodes; forming a barrier layer on the second touch electrode layer, such that the barrier layer covers at least a portion of the second touch electrode layer; and forming an organic planarization layer on the side of the barrier layer opposite to the substrate, such that the barrier layer is sandwiched between the organic planarization layer and the second touch electrode layer.

[0014] According to one aspect of the present application, the step of forming a barrier layer on the second touch electrode layer includes: making the orthographic projection of the barrier layer on the substrate coincide with the orthographic projection of the second touch electrode layer on the substrate; or, the step of forming a barrier layer on the second touch electrode layer includes: forming a barrier substrate layer on the side of the second touch electrode layer away from the substrate using the same material as the first insulating layer, such that the barrier substrate layer covers the second touch electrode layer and the first insulating layer; forming a plurality of vent holes on the barrier substrate layer to form the barrier layer, such that the vent holes penetrate the barrier layer along the thickness direction of the substrate, and along the thickness direction, the orthographic projection of the second touch electrode layer covers the orthographic projection of the plurality of vent holes.

[0015] The touch module provided in this application includes a substrate, a first touch electrode layer, a first insulating layer, a second touch electrode layer, a barrier layer, and an organic planarization layer stacked sequentially along the thickness direction. The organic planarization layer is spaced apart from the second touch electrode layer by the barrier layer sandwiched therebetween. This reduces the thermal conductivity between the organic planarization layer and the second touch electrode layer, thereby ensuring uniform heating during the fabrication of the organic planarization layer, reducing the possibility of bubble formation, and improving the light transmittance uniformity and yield of the touch module. Attached Figure Description

[0016] The features, advantages, and technical effects of exemplary embodiments of this application will now be described with reference to the accompanying drawings.

[0017] Figure 1 This is a schematic diagram of the structure of a touch module board provided in one embodiment of this application;

[0018] Figure 2 This is a schematic diagram of the structure of a touch module board provided in another embodiment of this application;

[0019] Figure 3 This is a schematic diagram of the structure of a touch module board provided in another embodiment of this application;

[0020] Figure 4 This is a schematic diagram of the structure of a display device provided in one embodiment of this application;

[0021] Figure 5 This is a flowchart of a method for processing a display panel according to an embodiment of this application.

[0022] in:

[0023] 100 - Touch module; 200 - Display device; 300 - Screen;

[0024] 10 - Substrate; 20 - First touch electrode layer; 30 - First insulating layer; 40 - Second touch electrode layer; 50 - Barrier layer; 60 - Organic planarization layer;

[0025] 21-First touch electrode; 41-Second touch electrode; 51-Exhaust port;

[0026] X - Thickness direction; Y - First direction; Z - Second direction. Detailed Implementation

[0027] The features and exemplary embodiments of various aspects of this application will now be described in detail. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain this application and are not configured to limit this application. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples of this application.

[0028] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.

[0029] It should be understood that when describing the structure of a component, when referring to a layer or region as being "above" or "on top of" another layer or region, it can mean that it is directly above the other layer or region, or that it contains other layers or regions between it and the other layer or region. Furthermore, if the component is flipped over, that layer or region will be located "below" or "under" the other layer or region.

[0030] The features and exemplary embodiments of various aspects of this application will now be described in detail. Furthermore, the features, structures, or characteristics described below may be combined in any suitable manner in one or more embodiments.

[0031] Organic light-emitting diodes (OLEDs) are currently the mainstream display products used in smart display terminals due to their numerous advantages, including self-illumination, high brightness, high contrast, wide color gamut, fast response speed, wide viewing angle, low power consumption, and flexible display. With the development of display technology, the use of portable devices such as smartphones and tablets is becoming increasingly widespread, and people are paying more and more attention to the display effect, as well as parameters such as thinness and portability of display devices.

[0032] Some existing mobile display devices employ COE (Color Filter on Encapsulation) technology to enhance their display performance. COE technology refers to the technique of forming a color filter on a thin-film encapsulation layer. By directly integrating the color filter into the encapsulation layer, replacing the circular polarizer and part of the optical layer in traditional OLED panels, it can significantly improve light transmittance, color performance, and power efficiency, making it particularly suitable for foldable screens and high-end smartphones. In touch display devices using COE technology, an organic planarization layer is typically directly covered on the touch electrode layer. This organic planarization layer is usually directly connected to multiple touch electrodes in the touch electrode layer.

[0033] Based on this, the applicant discovered that insulating planarization layers made of organic materials are typically produced by first coating a substrate layer and then heating and curing it. During the heating process, the uniformity of temperature change throughout the substrate layer is a crucial parameter, affecting the quality of the resulting organic planarization layer. Since organic materials release gases during heating, if the substrate layer heats up slowly or its temperature is lower than the surrounding areas during curing, gas accumulation and bubble formation can easily occur, severely impacting the uniformity of light transmittance in the touch module.

[0034] In the touch module using COE technology as described above, the organic layer directly covers the touch electrode layer. The touch electrode is usually made of a metal or metal oxide with high thermal conductivity. During the curing process, heat is transferred and dissipated outward through the touch electrode, causing the part of the substrate layer in contact with the touch electrode to cool down too quickly. This can easily generate bubbles in the area and affect the uniformity of light transmittance of the touch module.

[0035] To address the aforementioned issues, this application proposes a touch module, a display device, and a method for processing the touch module. The touch module has a barrier layer on the side of the touch electrode layer facing the organic planarization layer, which can reduce heat transfer and decrease the possibility of air bubbles being generated during the curing process.

[0036] It is understood that the following embodiments of this application are only used as an example of applying a structure in which a barrier layer is provided between the electrode layer and the organic layer to a touch module. However, this application is not limited to this and can also be applied to other occasions where it is necessary to reduce the possibility of bubbles being generated during the curing process and to provide protection for them.

[0037] To better understand this application, the following will be combined with... Figures 1 to 5 The touch module, display device, and processing method of the touch module provided in the embodiments of this application will be described in detail.

[0038] Please refer to the following: Figures 1 to 3 , Figure 1 This is a schematic diagram of the structure of a touch module board provided in one embodiment of this application. Figure 2 This is a schematic diagram of the structure of a touch module board provided in another embodiment of this application. Figure 3 This is a schematic diagram of the structure of a touch module board provided in another embodiment of this application.

[0039] In a first aspect, according to an embodiment of this application, a touch module 100 is provided, comprising: a substrate 10; a first touch electrode layer 20, stacked on one side of the substrate 10 in the thickness direction X of the touch module 100, the first touch electrode layer 20 including a plurality of first touch electrodes 21; a first insulating layer 30 located on the side of the first touch electrode layer 20 away from the substrate 10 and covering the first touch electrode layer 20; and a second touch electrode layer 40 disposed on the side of the first touch electrode layer 20 away from the substrate 10 and at least partially connected to the first touch electrode layer 21. The control electrode layers 20 are spaced apart, and at least a portion of the first insulating layer 30 is sandwiched between the first touch electrode layer 20 and the second touch electrode layer 40. The second touch electrode layer 40 includes a plurality of second touch electrodes 41. A barrier layer 50 is located on the side of the second touch electrode layer 40 away from the substrate 10, and the barrier layer 50 covers at least a portion of the second touch electrode layer 40. An organic planarization layer 60 is located at least partially on the side of the barrier layer 50 away from the substrate 10, and the barrier layer 50 is sandwiched between the organic planarization layer 60 and the second touch electrode layer 40.

[0040] This application first provides a touch module 100, which includes a substrate 10, a first touch electrode layer 20, a first insulating layer 30, a second touch electrode layer 40, a barrier layer 50, and an organic planarization layer 60 stacked sequentially. The substrate 10 can be selected according to the structure of the display panel to be matched with the touch module 100. For example, a flexible substrate 10 can be used to adapt to a foldable display panel. The substrate 10 can be an independent layer structure or can be a reuse of part of the layer structure in the display panel as the substrate 10.

[0041] The first touch electrode layer 20 and the second touch electrode layer 40 are used to realize touch control function through the change of capacitance between the electrodes. The first touch electrode layer 20 and the second touch electrode layer 40 are spaced apart in the thickness direction X by a first insulating layer 30. The two electrode layers can be mutually insulated or electrically connected through vias in the first insulating layer 30. The first touch electrode layer 20 and the second touch electrode layer 40 each include a plurality of first touch electrodes 21 and a plurality of second touch electrodes 41. For example, along the thickness direction X, the orthographic projections of the two types of touch electrodes can be staggered, with overlapping areas only at the connection points between the electrodes; or, the two types of touch electrodes can be at least partially arranged opposite each other along the thickness direction X to form corresponding touch capacitances in that direction.

[0042] The first insulating layer 30 may be an insulating layer made of inorganic material, used to provide insulation between the aforementioned two touch electrode layers. The first insulating layer 30 may have a certain thickness to form a relatively flat surface on the side opposite to the substrate 10. In the gaps between the plurality of first touch electrodes 21, the first insulating layer 30 may be partially disposed in the same layer as the first touch electrodes 21.

[0043] A barrier layer 50 is provided on the side of the second touch electrode layer 40 facing away from the substrate 10. The barrier layer 50 provides blocking and heat insulation functions on this side of the second touch electrode layer 40, so that it is at least partially spaced apart from the organic planarization layer 60. The position of the barrier layer 50 can correspond to the distribution of the second touch electrodes 41, or the barrier layer 50 can be provided as a whole layer, as long as it can separate most of the outer surface of the second touch electrodes 41 from the organic planarization layer 60.

[0044] An organic planarization layer 60 is disposed on the side of the barrier layer 50 facing away from the substrate 10. It is made of organic material and can provide buffering, protection and planarization functions. The organic planarization layer 60 covers the barrier layer 50, and optionally also covers part of the surface of the first insulating layer 30 facing away from the substrate 10. The organic planarization layer 60 can optionally be a whole layer.

[0045] The organic planarization layer 60 is typically formed by applying a layer of organic material of a certain thickness and then heating and curing it. Temperature uniformity throughout the organic material during curing is a crucial parameter. Furthermore, by adding a barrier layer 50, the organic material and the second touch electrode layer 40 are separated, reducing the heat conducted through the metal second touch electrode layer 40. This reduces the rate of heat loss and excessive temperature drop in the organic material layer near the second touch electrode 41, thus decreasing the likelihood of uneven gas absorption and release within the organic material layer, leading to bubble formation. Consequently, the light transmission uniformity of the touch module 100 and the product yield during manufacturing are improved.

[0046] In some alternative embodiments, the orthographic projection of the barrier layer 50 along the thickness direction X covers the orthographic projection of the second touch electrode layer 40, and the organic planarization layer 60 is spaced apart from the second touch electrode layer 40; or, the barrier layer 50 and the first insulating layer 30 are made of the same material and are integrally disposed thereon.

[0047] Optionally, the barrier layer 50 can adopt two different distribution forms. For example, the barrier layer 50 can be configured to be completely opposite to the second touch electrode 41. That is, along the thickness direction X, the orthographic projection of the barrier layer 50 can be shaped and directly opposite to the orthographic projection of the second touch electrode layer 40. To completely cover each of the second touch electrodes 41, the orthographic projection of the barrier layer 50 can be slightly larger than the orthographic projection of the second touch electrode 41 and cover the orthographic projection of the second touch electrode 41. Furthermore, the minimum spacing between the edge of the orthographic projection of the barrier layer 50 and the edge of the orthographic projection of the second touch electrode layer 40 can be the same or similar, so that the barrier layer 50 uniformly covers all parts of the second touch electrode layer 40.

[0048] In this embodiment, the partial spacing area where the second touch electrode 41 is not provided is also not provided with the barrier layer 50, while the barrier layer 50 is provided on the second touch electrode 41 with a uniform thickness, so that the thickness is the same or similar at each place after the two are stacked.

[0049] Alternatively, the barrier layer 50 can be integrally formed with the first insulating layer 30. Here, "integrated" means using the same material and being connected. The barrier layer 50 can be processed in the same step as the first insulating layer 30, or they can be fabricated in two different steps. In this embodiment, the second touch electrode 41 can be considered as being recessed and encapsulated within a layer structure of a certain thickness made of inorganic insulating material. By using the same material and integrally forming the barrier layer 50, its processing difficulty can be reduced.

[0050] In some alternative embodiments, the organic planarization layer 60 is spaced apart from the second touch electrode layer 40; the barrier layer 50 covers the side surface of the second touch electrode layer 40 away from the substrate 10 and the sides parallel to the thickness direction X.

[0051] Optionally, the organic planarization layer 60 can be completely spaced apart from the second touch electrode layer 40, that is, the barrier layer 50 can completely cover all surfaces of the second touch electrode layer 40 facing the organic planarization layer 60. Specifically, the second touch electrode layer 40 is disposed on the first insulating layer 30, and it typically has a top surface facing away from the substrate 10 and multiple side surfaces parallel to the thickness direction X of the touch module 100. The barrier layer 50 can cover both the top surface and the side surfaces simultaneously. It is understood that in embodiments where the barrier layer 50 covers the side surfaces, the orthographic projection of the barrier layer 50 on the substrate 10 can be kept slightly larger than the orthographic projection of the second touch electrode layer 40 on the substrate 10, that is, there is a small gap between the edges of the orthographic projection patterns of the two layers, so as to avoid affecting the flatness of the areas where the second touch electrode layer 40 is not disposed, while reducing costs.

[0052] By completely covering each surface of the second touch electrode 41 with the barrier layer 50, the thermal conductivity between the second touch electrode 41 and the organic planarization layer 60 can be effectively reduced, thereby reducing the possibility of bubble formation.

[0053] In some alternative embodiments, the thickness of the barrier layer 50 is less than the thickness of the second touch electrode layer 40.

[0054] In the embodiment where the barrier layer 50 is shaped and corresponds to the second touch electrode 41 along the thickness direction X, the barrier layer 50 can have a relatively thin thickness to reduce the impact of the barrier layer 50 on the overall thickness of the touch module 100 while covering the second touch electrode 41 and providing heat insulation. Specifically, the barrier layer 50 itself can be relatively thin, for example, it can be selected to have a thickness less than that of the second touch electrode 41.

[0055] By adjusting the thickness of the barrier layer 50, the overall thickness of the touch module 100 can be reduced.

[0056] In some optional embodiments, the barrier layer 50 and the first insulating layer 30 are made of the same material and are integrally disposed thereon; the barrier layer 50 is provided with an exhaust hole 51, which is disposed through the barrier layer 50 along the thickness direction X, and the orthographic projection of the second touch electrode layer 40 covers the orthographic projection of the exhaust hole 51 along the thickness direction X.

[0057] In an embodiment where the second touch electrode 41 is recessed and the barrier layer 50 and the first insulating layer 30 are made of the same material, vent holes 51 can be provided in the area corresponding to the barrier layer 50 and the second touch electrode 41. These vent holes 51 can be provided through the barrier layer 50 along the thickness direction X, that is, the two ends of the vent holes 51 are respectively connected to the second touch electrode layer 40 and the organic planarization layer 60. The organic planarization layer 60 can partially enter the vent holes 51 and connect with the second touch electrode layer 40.

[0058] Furthermore, the position of the vent 51 is set according to the position of the second touch electrode 41, that is, the orthogonal projection of the vent 51 on the substrate 10 is covered by the orthogonal projection of the second touch electrode 41. In embodiments where the areas of the various second touch electrodes 41 are the same or similar, the number and cross-sectional area of ​​the vent 51 corresponding to each second touch electrode 41 can be the same, so as to facilitate processing and ensure uniform venting; or, the number of vent 51 can be proportional to the area of ​​the corresponding second touch electrode 41. Multiple vent 51 corresponding to the same second touch electrode 41 can be arranged in an array or uniformly distributed in the area corresponding to the second touch electrode 41.

[0059] Optionally, the cross-sectional shape of the vent 51 in the cross-section perpendicular to the thickness direction can be circular, rectangular, triangular, etc., to facilitate processing. Multiple vents 51 can be arranged at intervals.

[0060] In some alternative embodiments, the barrier layer 50 is made of an inorganic material, including at least one of silicon nitride and silicon oxide.

[0061] In this embodiment, the barrier layer 50 is used to cover the second touch electrode 41 and provide functions such as blocking and heat insulation. The barrier layer 50 may be made of inorganic materials, such as silicon nitride (SiN). x Silicon oxide (SiO2), among others, possesses high chemical stability, resisting acid and alkali corrosion, making it suitable for complex process environments. It also exhibits excellent electrical insulation properties, with high resistivity and strong dielectric strength, effectively preventing leakage and breakdown, while maintaining good process compatibility. Silicon nitride, on the other hand, has high density, strong water and oxygen penetration resistance, extending the lifespan of display panels, and good high-temperature resistance, making it suitable for high-temperature processes.

[0062] In addition to the aforementioned materials, the barrier layer 50 may also include aluminum oxide (Al2O3), zirconium oxide (ZrO2), and magnesium oxide (MgO), etc. This application does not impose specific limitations on these materials, as long as they have good insulation and heat insulation properties.

[0063] By making the barrier layer 50 from inorganic materials, the barrier layer 50 can have good insulation and heat insulation properties, as well as good stability and reliability, and is easy to process.

[0064] In some alternative embodiments, at least a portion of the second touch electrode 41 is a metal mesh electrode, and the organic planarization layer 60 covers the second touch electrode 41 and is partially disposed in the same layer as the second touch electrode layer 40.

[0065] Based on the embodiments including the two barrier layer 50 structures mentioned above, the second touch electrode 41 can be configured to adopt a metal mesh electrode structure. The metal mesh electrode refers to a new type of transparent conductive structure obtained by forming a mesh conductive layer by micron or nano-scale metal wires. The metal mesh electrode has low resistance and high conductivity, which can significantly reduce signal delay and power consumption. In addition, the metal mesh electrode has high light transmittance and excellent flexibility and bending resistance, which can perfectly adapt to flexible devices such as foldable screens and rollable screens.

[0066] The metal mesh electrode has multiple mesh openings, and the organic planarization layer 60 can enter at least some of these openings and be partially disposed in the same layer as the second touch electrode 41. Optionally, when the touch module 100 is applied to the display device 200, the light-emitting units in the display device 200 can be arranged corresponding to the mesh openings of the metal mesh electrode. That is, the orthographic projection of the metal mesh electrode on the substrate 10 can be located between the orthographic projections of adjacent light-emitting units, so as to further reduce the influence of the second touch electrode 41 on the light extraction efficiency.

[0067] By setting all the second touch electrodes 41 as metal mesh electrodes, the thermal conductivity of the second touch electrodes 41 can be further reduced, thereby further reducing the possibility of uneven heating during the curing process of the organic planarization layer 60, which leads to poor gas discharge and the generation of bubbles, and thus improving the light transmission uniformity of the touch module 100.

[0068] Please see Figure 4 , Figure 4 This is a schematic diagram of the structure of a display device 200 provided in one embodiment of this application. In a second aspect, according to an embodiment of this application, a display device 200 is provided, comprising: a screen 300 having a backlight side and a light-emitting side disposed opposite to each other; and a touch module 100, as described in any embodiment of the first aspect, located on the surface of the screen 300 near the light-emitting side and stacked with the screen 300.

[0069] This application embodiment also provides a display device 200 including the aforementioned touch module 100. The display device 200 includes the touch module 100 and the screen 300 stacked together. The screen 300 is used to realize the display function, and the touch module 100 is used to realize the human-computer interaction function of touch control. On this basis, the screen 300 has a light-emitting side for display. The touch module 100 is disposed on the light-emitting side, which can be optionally bonded together, or optionally connected by reusing the layer structure in the screen 300 as the structure of the substrate 10 in the touch module 100.

[0070] The display device 200 in this application embodiment can be any product or component with display function, such as a mobile phone, tablet computer, digital photo frame, or electronic paper. The display device 200 provided in this application embodiment has all the beneficial effects of the touch module 100 provided in the first aspect above. For details, please refer to the specific descriptions of the touch module 100 in the above embodiments. This embodiment will not repeat them here.

[0071] Please see Figure 5 , Figure 5 This is a flowchart of a display panel processing method according to one embodiment of this application. In a third aspect, according to an embodiment of this application, a processing method for a touch module 100 is provided, including:

[0072] S1. Provide substrate 10;

[0073] S2. A first touch electrode layer 20 is formed on the substrate 10, the first touch electrode layer 20 including a plurality of first touch electrodes 21;

[0074] S3. A first insulating layer 30 is formed on the first touch electrode layer 20, such that the first insulating layer 30 covers the first touch electrode layer 20.

[0075] S4. A second touch electrode layer 40 is formed on the first insulating layer 30, the second touch electrode layer 40 including a plurality of second touch electrodes 41;

[0076] S5. A barrier layer 50 is formed on the second touch electrode layer 40, such that the barrier layer 50 covers at least a portion of the second touch electrode layer 40.

[0077] S6. An organic planarization layer 60 is formed on the side of the barrier layer 50 away from the substrate 10, so that the barrier layer 50 is sandwiched between the organic planarization layer 60 and the second touch electrode layer 40.

[0078] Optionally, embodiments of this application also provide a processing method for processing the touch module 100 as described in any of the embodiments of the first aspect above. The method first includes a step S1 of providing a substrate 10. The substrate 10 may be a substrate 10 separately disposed within the touch module 100. Alternatively, in embodiments where the touch module 100 is applied to a display device 200, the layer structure in the screen 300 of the display device 200 may be used as the substrate 10 of the display module. As long as the substrate 10 has a flat surface and can provide support and insulation, this application does not impose any specific limitations on it.

[0079] In step S2, a first touch electrode layer 20 is prepared on one side of the substrate 10 in the thickness direction X. The first touch electrode layer 20 includes a plurality of first touch electrodes 21, which can be made of metal mesh electrodes or transparent metal oxides.

[0080] Furthermore, in manufacturing the first touch electrode layer 20, it can be processed by methods such as magnetron sputtering and etching. For example, a substrate layer can first be formed by sputtering, that is, by bombarding a metal target (such as copper, molybdenum, aluminum, or their alloys) with high-energy particles, causing metal atoms to deposit on one side surface of the substrate 10 and form a uniform thin film. Subsequently, patterning is performed using photolithography. First, a patterned photoresist layer is formed by coating, exposure, and development, serving as a mask for etching or deposition. Then, selective removal is performed using wet etching, that is, using a chemical solution (such as a mixture of nitric acid and phosphoric acid) to selectively etch away the metal areas not protected by the patterned photoresist layer, completing the processing of the first touch electrode layer 20.

[0081] In step S3, a first insulating layer 30 is formed on the first touch electrode layer 20. The first insulating layer 30 may be made of an inorganic material, such as silicon nitride or silicon oxide. In this step, the process can be carried out by chemical vapor deposition (CVD), sputtering, or atomic layer deposition (ALD). Chemical vapor deposition refers to a method that generates an inorganic material through gas reaction at high temperature to form a dense insulating film. Sputtering refers to sputtering a film using a target material such as silicon, silicon dioxide, or silicon nitride at low temperature (24℃–250℃). Atomic layer deposition refers to a processing method that achieves nanoscale thickness control through layer-by-layer deposition to prepare a highly uniform film.

[0082] The aforementioned processing methods can all produce the required first insulating layer 30, and can make the first insulating layer 30 uniform and dense.

[0083] Optionally, if the first touch electrode layer 20 needs to be electrically connected to the second touch electrode layer 40, a via can be provided in the first insulating layer 30, and the electrical connection can be made through the via.

[0084] In step S4, a second touch electrode layer 40 is prepared. The preparation method of the second touch electrode layer 40 can be the same as or different from the preparation method of the first touch electrode layer 20. It can also be prepared by the same method to reduce costs.

[0085] In step S5, a barrier layer 50 is formed covering the second electrode layer. The barrier layer 50 may be made of inorganic material and may be disposed corresponding to multiple electrodes in the second touch electrode layer 40. Alternatively, the barrier layer 50 may be disposed as a whole layer.

[0086] In step S6, an organic planarization layer 60 is further formed on the barrier layer 50. The organic planarization layer 60 can be made of organic materials such as polymethyl methacrylate (PMMA), and is typically formed by first forming a substrate layer of a certain thickness, followed by curing. Specifically, the method for forming the substrate layer can be at least one of spin coating, inkjet printing, etc. Spin coating refers to uniformly coating organic materials (such as polyimide) onto the substrate 10, controlling the film thickness by centrifugal force; this method is suitable for large-area planarization. Inkjet printing refers to precisely spraying organic materials onto specific areas; this method can reduce material waste and lower processing costs. The specific curing method can be light curing or heat curing.

[0087] Optionally, the organic planarization layer 60 can be an integral layer, or the organic planarization layer 60 can be patterned in a similar manner to the aforementioned film layers. The specific method used for patterning can also be wet etching / dry etching after photolithography.

[0088] The processing method of the touch module 100 provided in this application embodiment has all the beneficial effects of the touch module 100 provided in the first aspect above. For details, please refer to the specific description of the touch module 100 in the above embodiments. This embodiment will not repeat the description here.

[0089] According to one aspect of the present application, step S5 of forming a barrier layer 50 on the second touch electrode layer 40 includes:

[0090] The orthographic projection of the barrier layer 50 on the substrate 10 coincides with the orthographic projection of the second touch electrode layer 40 on the substrate 10.

[0091] Alternatively, step S5, which involves forming the barrier layer 50 on the second touch electrode layer 40, includes:

[0092] A barrier substrate layer is formed on the side of the second touch electrode layer 40 away from the substrate 10 using the same material as the first insulating layer 30, so that the barrier substrate layer covers the second touch electrode layer 40 and the first insulating layer 30.

[0093] Multiple vent holes 51 are formed on the barrier substrate layer to form a barrier layer 50, such that the vent holes 51 are disposed through the barrier layer 50 along the thickness direction X of the substrate 10. Along the thickness direction X, the orthographic projection of the second touch electrode layer 40 covers the orthographic projection of the multiple vent holes 51.

[0094] Corresponding to the structure of the barrier layer 50 in the two embodiments of the first aspect described above, the barrier layer 50 can be manufactured in different ways and formed into different structural forms. Specifically, the barrier layer 50 can be configured such that its orthographic projection coincides with the orthographic projection of the second touch electrode layer 40, or the orthographic projection of the barrier layer 50 along the thickness direction is slightly larger than the orthographic projection of the second touch electrode layer 40. In this method, the thickness of the barrier layer 50 can be reduced to a certain extent when it is prepared, so as to avoid adversely affecting the overall thickness of the touch module 100 and keep the touch module 100 with a small thickness. At the same time, in this method, the barrier layer 50 can cover the top surface of the second touch electrode 41 facing away from the substrate 10 and several side surfaces parallel to the thickness direction X, so as to completely isolate the contact between the second touch electrode 41 and the organic planarization layer 60 and provide a good heat insulation effect.

[0095] Alternatively, the barrier layer 50 can be made of the same material as the first insulating layer 30, and the barrier layer 50 can be integrally formed with the first insulating layer 30. Optionally, the barrier layer 50 can be manufactured using the same processing method as the first insulating layer 30 to facilitate its processing. The barrier layer 50 and the first insulating layer 30 can be manufactured in the same step or in two separate steps using the same method.

[0096] Based on this, a barrier substrate layer can be formed first on the second touch electrode layer 40 and the first insulating layer 30, and then an exhaust hole 51 for venting gas can be formed on the barrier substrate layer. This exhaust hole 51 can be set at a position corresponding to the second touch electrode 41 to obtain the barrier layer 50.

[0097] Optionally, when setting the exhaust hole 51, it can be processed by etching or other methods. The orthographic projection of the exhaust hole 51 along the thickness direction X can be within the orthographic projection coverage of the second touch electrode 41, so that the gas at that position can be discharged.

[0098] It is understood that the above description and details are merely exemplary and explanatory, and do not constitute a limitation on this application. Those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Thus, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. A touch module, characterized in that, include: substrate; A first touch electrode layer is stacked on one side of the substrate in the thickness direction of the touch module, and the first touch electrode layer includes a plurality of first touch electrodes; A first insulating layer is provided on the side of the first touch electrode layer away from the substrate and covers the first touch electrode layer. The second touch electrode layer is disposed on the side of the first touch electrode layer away from the substrate and is at least partially spaced from the first touch electrode layer. At least a portion of the first insulating layer is sandwiched between the first touch electrode layer and the second touch electrode layer. The second touch electrode layer includes a plurality of second touch electrodes. A barrier layer is located on the side of the second touch electrode layer opposite to the substrate, and the barrier layer covers at least a portion of the second touch electrode layer; An organic planarization layer is located at least partially on the side of the barrier layer opposite to the substrate, and the barrier layer is sandwiched between the organic planarization layer and the second touch electrode layer. 2.The touch module according to claim 1, characterized in that, Along the thickness direction, the orthographic projection of the barrier layer covers the orthographic projection of the second touch electrode layer, and the organic planarization layer is spaced apart from the second touch electrode layer; Alternatively, the barrier layer and the first insulating layer may be made of the same material and integrally formed. 3.The touch module according to claim 2, wherein, The organic planarization layer is spaced apart from the second touch electrode layer; The barrier layer covers the side surface of the second touch electrode layer opposite to the substrate and each side surface parallel to the thickness direction.

4. The touch module according to claim 3, characterized in that, The thickness of the barrier layer is less than the thickness of the second touch electrode layer.

5. The touch module according to claim 2, characterized in that, The barrier layer and the first insulating layer are made of the same material and are integrally formed; The barrier layer is provided with an exhaust hole, which is disposed through the barrier layer along the thickness direction. Along the thickness direction, the orthographic projection of the second touch electrode layer covers the orthographic projection of the exhaust hole.

6. The touch module according to claim 1, characterized in that, The barrier layer is made of inorganic materials, and the material of the barrier layer includes at least one of silicon nitride and silicon oxide.

7. The touch module according to any one of claims 1 to 6, characterized in that, At least a portion of the second touch electrode is a metal mesh electrode, and the organic planarization layer covers the second touch electrode and is partially disposed in the same layer as the second touch electrode layer.

8. A display device, characterized in that, include: The screen has a backlight side and a light-emitting side that are positioned opposite to each other; The touch module as described in any one of claims 1 to 7 is located on the side surface of the screen body near the light-emitting side and is stacked with the screen body.

9. A method for processing a touch module, characterized in that, include: Provide substrate; A first touch electrode layer is formed on the substrate, the first touch electrode layer including a plurality of first touch electrodes; A first insulating layer is formed on the first touch electrode layer, such that the first insulating layer covers the first touch electrode layer; A second touch electrode layer is formed on the first insulating layer, the second touch electrode layer including a plurality of second touch electrodes; A barrier layer is formed on the second touch electrode layer, such that the barrier layer covers at least a portion of the second touch electrode layer; An organic planarization layer is formed on the side of the barrier layer opposite to the substrate, such that the barrier layer is sandwiched between the organic planarization layer and the second touch electrode layer.

10. The processing method according to claim 9, characterized in that, The step of forming a barrier layer on the second touch electrode layer includes: The orthographic projection of the barrier layer on the substrate coincides with the orthographic projection of the second touch electrode layer on the substrate; Alternatively, the step of forming a barrier layer on the second touch electrode layer includes: A barrier substrate layer is formed on the side of the second touch electrode layer away from the substrate using the same material as the first insulating layer, so that the barrier substrate layer covers the second touch electrode layer and the first insulating layer. Multiple vent holes are formed on the barrier substrate layer to form a barrier layer, such that the vent holes penetrate the barrier layer along the thickness direction of the substrate, and the orthographic projection of the second touch electrode layer along the thickness direction covers the orthographic projection of the multiple vent holes.

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