Display module, display device and display terminal

Abstract

The application provides a display module, a display device and a display terminal. The display module comprises a touch area and a frame area surrounding the touch area. The display module comprises: an array substrate comprising a substrate and a first bonding terminal arranged on one side of the substrate, the first bonding terminal being located in the frame area; an encapsulation cover plate arranged opposite to the array substrate and located on the side of the array substrate where the first bonding terminal is arranged; the side of the encapsulation cover plate facing the array substrate is provided with a second bonding terminal, the second bonding terminal being located in the frame area; the edge of the encapsulation cover plate is recessed towards the touch area in the region corresponding to the first bonding terminal, thereby exposing the first bonding terminal; and the edge of the substrate is recessed towards the touch area in the region corresponding to the second bonding terminal, thereby exposing the second bonding terminal. The technical scheme provided by the application can solve the problem that the existing bonding scheme causes the display module to have a large single-side area, thereby affecting the reliability of the display module, and is beneficial to improving the reliability of the display module and reducing the cost.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display module, display device and display terminal. Background Technology

[0002] In the rapidly developing field of display and touch technology, the integration of display and touch technologies has become an inevitable trend in the industry to meet market demands for more efficient and compact electronic devices. With the widespread adoption of smartphones, tablets, and other portable electronic devices, electronic products with touch display capabilities have become essential tools in people's daily lives and work. Users are increasingly reliant on these products, thus placing higher demands on their reliability, durability, and other performance characteristics. However, current electronic products with touch display capabilities suffer from low reliability and high cost. Summary of the Invention

[0003] In view of this, the embodiments of this application aim to provide a display module, display device and display terminal to solve the problems of low reliability and high cost of touch display modules.

[0004] This application provides a display module including a touch area and a bezel area surrounding the touch area. The display module includes: an array substrate including a substrate and a first bonding terminal disposed on one side of the substrate, the substrate covering the touch area, at least a portion of the substrate being located in the bezel area, and the first bonding terminal being located in the bezel area; an encapsulation cover plate disposed opposite to the array substrate and located on the side of the array substrate where the first bonding terminal is disposed; the encapsulation cover plate covering the touch area, at least a portion of the encapsulation cover plate being located in the bezel area, and a second bonding terminal being disposed on the side of the encapsulation cover plate facing the array substrate, the second bonding terminal being located in the bezel area; the edge of the encapsulation cover plate is recessed into the touch area in the region corresponding to the first bonding terminal, exposing the first bonding terminal; the edge of the substrate is recessed into the touch area in the region corresponding to the second bonding terminal, exposing the second bonding terminal.

[0005] In one embodiment, the first bonding terminal and the second bonding terminal are located on the same side of the touch area, and the orthographic projection of the second bonding terminal on the plane of the substrate and the orthographic projection of the first bonding terminal on the substrate are interleaved.

[0006] In one embodiment, the display module further includes a connecting portion located in the bezel area, wherein a first end of the connecting portion is electrically connected to a first bonding terminal, and a second end of the connecting portion is electrically connected to a second bonding terminal; preferably, the connecting portion includes a flexible circuit board.

[0007] In one embodiment, the display module further includes a touch electrode layer located between the array substrate and the encapsulation cover and in the touch area, the touch electrode layer being electrically connected to a second bonding terminal, and the touch electrode layer being insulated from the array substrate.

[0008] In one embodiment, the touch electrode layer includes a first conductive layer, a first insulating layer, and a second conductive layer arranged sequentially on the side of the encapsulation cover plate facing the substrate.

[0009] In one embodiment, the display module further includes a pixel circuit located between the substrate and the touch electrode layer and in the touch area, and the pixel circuit is electrically connected to a first bonding terminal; preferably, the display module further includes a second insulating layer located between the pixel circuit and the second conductive layer.

[0010] In one embodiment, the pixel circuit includes an anode, an organic light-emitting layer, and a cathode arranged sequentially on the side of the substrate facing the encapsulation cover.

[0011] In one embodiment, the display module further includes a packaging structure located between the packaging cover and the substrate, and in contact with the packaging cover and the substrate, the packaging structure surrounding the touch area; the touch electrode layer, the insulating layer and the pixel circuit are all located inside the packaging structure, and the first bonding terminal, the second bonding terminal and the connection portion are all located outside the packaging structure.

[0012] A second aspect of this application provides a display device, including a display module as mentioned in any of the above embodiments.

[0013] A third aspect of this application provides a display terminal, including: a display device as mentioned in any of the above embodiments.

[0014] The technical solution provided in this application involves setting opposing array substrates and encapsulation covers within the bezel area of ​​a display module. A first bonding terminal is positioned on the side of the array substrate opposite to the encapsulation cover, and a second bonding terminal is positioned on the side of the encapsulation cover opposite to the array substrate. The edge of the encapsulation cover is recessed towards the touch area in the region corresponding to the first bonding terminal, exposing the first bonding terminal; similarly, the edge of the substrate is recessed towards the touch area in the region corresponding to the second bonding terminal, exposing the second bonding terminal. By setting the edges of the substrate and encapsulation cover to be recessed towards the touch area in the regions corresponding to the first and second bonding terminals, respectively, the first and second bonding terminals are exposed, ensuring that both terminals meet bonding requirements. This configuration solves the problem of large single-sided areas in existing bonding solutions, which affects the reliability of the display module. It improves the reliability of the display module and reduces costs.

[0015] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this application, nor is it intended to limit the scope of this application. Other features of this application will become readily apparent from the following description. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 The diagram shown is a structural schematic of a display module provided in an embodiment of this application.

[0018] Figure 2 The image shown is an embodiment provided by this application. Figure 1 A magnified view of a portion of point B in the middle.

[0019] Figure 3 The image shown is an embodiment provided by this application. Figure 1 A schematic diagram of the cross-sectional structure along section line A-A'.

[0020] Figure 4 The image shown is provided by another embodiment of this application. Figure 1 A schematic diagram of the cross-sectional structure along section line A-A'.

[0021] Figure 5 The image shown is provided in yet another embodiment of this application. Figure 1 A schematic diagram of the cross-sectional structure along section line A-A'.

[0022] Figure 6 The diagram shown is a schematic diagram of the structure of a touch electrode layer provided in an embodiment of this application.

[0023] Figure 7 The image shown is provided in yet another embodiment of this application. Figure 1 A schematic diagram of the cross-sectional structure along section line A-A'.

[0024] Figure 8 The image shown is provided in yet another embodiment of this application. Figure 1 A schematic diagram of the cross-sectional structure along section line A-A'.

[0025] Figure 9 The image shown is provided in yet another embodiment of this application. Figure 1 A schematic diagram of the cross-sectional structure along section line A-A'. Detailed Implementation

[0026] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of the present application.

[0027] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0028] Figure 1 The diagram shown is a structural schematic of a display module provided in one embodiment of this application. Figure 2 The image shown is an embodiment provided by this application. Figure 1 A magnified view of a portion of point B in the diagram. Figure 3 The image shown is an embodiment provided by this application. Figure 1 A schematic diagram of the cross-sectional structure along section line A-A'. See also... Figures 1-3 The display module 100 includes a touch area 101 and a border area 102 surrounding the touch area 101. The display module 100 includes: an array substrate, including a substrate 111 and a first bonding terminal 112 disposed on one side of the substrate 111, the first bonding terminal 112 being located in the border area 102; an encapsulation cover plate 120, disposed opposite to the array substrate and located on the side of the array substrate where the first bonding terminal 112 is disposed; a second bonding terminal 121 is disposed on the side of the encapsulation cover plate 120 facing the array substrate, the second bonding terminal 121 being located in the border area 102; the edge of the encapsulation cover plate 120 is recessed toward the touch area 101 in the area corresponding to the first bonding terminal 112, exposing the first bonding terminal 112; the edge of the substrate 111 is recessed toward the touch area 101 in the area corresponding to the second bonding terminal 121, exposing the second bonding terminal 121.

[0029] Specifically, substrate 111 covers touch area 101, and at least a portion of substrate 111 is located in border area 102. Substrate 111 is used to support other electronic devices or circuits in the array substrate. Substrate 111 can be a rigid substrate or a flexible substrate. The material of substrate 111 can include glass, plastic, or polyimide, etc. A first bonding terminal 112 disposed on one side of substrate 111 is a metal contact for electrically connecting the array substrate to other circuits. Encapsulation cover 120 is disposed opposite to the array substrate, located on one side of the first bonding terminal 112 of the array substrate. Encapsulation cover 120 covers touch area 101, and at least a portion of encapsulation cover 120 is located in border area 102, for protecting internal components of display module 100. Exemplarily, encapsulation cover 120 can be made of transparent material to protect internal circuits and allow light to pass through. The encapsulation cover 120 has a second bonding terminal 121 on the side facing the array substrate. Exemplarily, the first bonding terminal 112 is a bonding terminal of the display substrate, and the second bonding terminal 121 is a bonding terminal of the touch substrate. Exemplarily, the materials of the first bonding terminal 112 and the second bonding terminal 121 can be low resistivity materials such as metals or metal alloys, for example, they can be single metals or metal alloys such as gold, silver, copper, aluminum, molybdenum, iron, and titanium.

[0030] Both the first bonding terminal 112 and the second bonding terminal 121 are located in the border area 102, but their specific positions can be reasonably set according to actual needs, and this embodiment does not impose specific limitations. For example, when the shape of the border area 102 is a triangle, square, or polygon (here, the shape refers to the shape enclosed by the edges of the border area 102), the second bonding terminal 121 and the first bonding terminal 112 can be located in the same area along the same side of the border area 102, or they can be located in different areas along different sides of the border area 102.

[0031] In related technologies, the bonding portions of the touch substrate and the display substrate protrude from both sides of the display panel, forming a large single-sided area, which reduces the reliability of the display module 100; and the circuit board connecting the two bonding portions is large, leading to increased cost. In this embodiment, the edges of the encapsulation cover 120 and the substrate 111 are recessed into the touch area 101 in the regions corresponding to the first bonding terminal 112 and the second bonding terminal 121, respectively, exposing the first bonding terminal 112 and the second bonding terminal 121 for electrical connection. The first bonding terminal 112 and the second bonding terminal 121 are arranged opposite each other, which does not form a large single-sided area and eliminates the need for a large circuit board, thereby improving the reliability of the display module 100 and reducing costs. Exemplarily, both the substrate 111 and the encapsulation cover 120 can be made of glass. During the fabrication of the display module 100, after the substrate 111 and the encapsulation cover 120 are formed, the area of ​​the encapsulation cover 120 corresponding to the first bonding terminal 112 is cut away, causing the edge of the encapsulation cover 120 to be recessed into the touch area 101 in the area corresponding to the first bonding terminal 112, exposing the first bonding terminal 112; the area of ​​the substrate 111 corresponding to the second bonding terminal 121 is cut away, causing the edge of the substrate 111 to be recessed into the touch area 101 in the area corresponding to the second bonding terminal 121, exposing the second bonding terminal 121. Thus, both the first bonding terminal 112 and the second bonding terminal 121 meet the bonding requirements.

[0032] The technical solution of this embodiment involves setting opposing array substrates and encapsulation cover plates 120 within the frame area 102 of the display module 100. A first bonding terminal 112 is provided on the side of the array substrate opposite to the encapsulation cover plate 120, and a second bonding terminal 121 is provided on the side of the encapsulation cover plate 120 opposite to the array substrate. The edge of the encapsulation cover plate 120 is recessed towards the touch area 101 in the region corresponding to the first bonding terminal 112, exposing the first bonding terminal 112. The edge of the substrate 111 is recessed towards the touch area 101 in the region corresponding to the second bonding terminal 121, exposing the second bonding terminal 121. By setting the edges of the substrate 111 and the encapsulation cover plate 120 to be recessed towards the touch area 101 in the regions corresponding to the first bonding terminal 112 and the second bonding terminal 121, respectively, the first bonding terminal 112 and the second bonding terminal 121 are exposed, ensuring that both the first bonding terminal 112 and the second bonding terminal 121 meet the bonding requirements. This configuration can solve the problem that the existing bonding scheme results in a large single-sided area of ​​the display module 100, which affects the reliability of the display module 100. It is beneficial to improve the reliability of the display module 100 and reduce costs.

[0033] In one embodiment, see Figure 3The first bonding terminal 112 and the second bonding terminal 121 are located on the same side of the touch area 101, and the orthographic projection of the second bonding terminal 121 on the plane of the substrate 111 and the orthographic projection of the first bonding terminal 112 on the substrate 111 are intersected.

[0034] Specifically, the first bonding terminal 112 can connect to pixel signal lines extending from the array substrate, and the second bonding terminal 121 can connect to touch signal lines extending from the encapsulation cover plate 120. The encapsulation cover plate 120 can form through-holes plated with conductive material for wiring. The first bonding terminal 112 and the second bonding terminal 121 are located on the same side of the display module 100, shortening the wiring distance for the electrical connection of the first bonding terminal 112 and the second bonding terminal 121, which helps to reduce the circuit structure connecting the first bonding terminal 112 and the second bonding terminal 121. With this configuration, it is not necessary to stack multiple film layers in the touch area 101 to achieve the effect of electrical connection between the display substrate and the touch substrate, which further helps to reduce costs. The orthographic projection of the second bonding terminal 121 on the plane of the substrate 111 and the orthographic projection of the first bonding terminal 112 on the substrate 111 are staggered and do not overlap. In one optional embodiment, the orthographic projections of the second bonding terminal 121 and the first bonding terminal 112 on the plane of the substrate 111 are adjacent to each other, facilitating electrical connection between the second bonding terminal 121 and the first bonding terminal 112. In another optional embodiment, there is a gap between the orthographic projections of the second bonding terminal 121 and the first bonding terminal 112 on the plane of the substrate 111 and the orthographic projection of the first bonding terminal 112 on the substrate 111, preventing electrical short circuits.

[0035] In this embodiment, the first bonding terminal 112 and the second bonding terminal 121 are disposed on the same side of the touch area 101, and the orthographic projections of the first bonding terminal 112 and the second bonding terminal 121 on the substrate 111 are staggered. This design reduces the space required in the bezel area 102 of the display module 100, thereby reducing the size of a single-sided area. By optimizing the layout of the bonding terminals, the bezel area of ​​the display module 100 can be reduced, which is beneficial for manufacturing display devices with narrower bezels and can improve the aesthetics and user experience of the product. The staggered layout of the bonding terminals can make more efficient use of limited space, which is particularly important for miniaturized or high-density packaged display modules 100.

[0036] Figure 4 The image shown is provided by another embodiment of this application. Figure 1 A schematic diagram of the cross-sectional structure along section line A-A'. (See diagram below.) Figure 4As shown, the display module 100 also includes a connection portion 130 located in the frame area 102. The first end of the connection portion 130 is electrically connected to the first bonding terminal 112, and the second end of the connection portion 130 is electrically connected to the second bonding terminal 121. Preferably, the connection portion 130 includes a flexible circuit board.

[0037] Specifically, a connecting portion 130 is disposed in the frame area 102 for establishing an electrical connection between the first bonding terminal 112 and the second bonding terminal 121. The connecting portion 130 has a first end and a second end. The first end is electrically connected to the first bonding terminal 112, ensuring that a signal or current can be transmitted to the first bonding terminal 112. Exemplarily, the first bonding terminal 112 is fixed to the first end of the connecting portion 130 by soldering or crimping. The second end is electrically connected to the second bonding terminal 121, completing the signal or current transmission from the first bonding terminal 112 to the second bonding terminal 121. Exemplarily, the second bonding terminal 121 is fixed to the second end of the connecting portion 130 by soldering or crimping. The two bonding terminals form a complete electrical path through the connecting portion 130. Exemplarily, the connecting portion 130 can be a flexible circuit board, characterized by its bendability and deformability, suitable for flexible display modules 100. The flexible circuit board can consist of a flexible substrate (such as polyimide) and conductive lines attached to the substrate. For example, the flexible circuit board is a double-sided conductive circuit board, which facilitates the electrical connection of the first bonding terminal 112 and the second bonding terminal 121. The flexible circuit board is suitable for applications requiring complex wiring in a limited space or where a certain degree of flexibility is needed during assembly.

[0038] The technical solution of this embodiment ensures reliable transmission of electrical signals between the bonding terminals on the array substrate and the encapsulation cover plate 120 by setting the connection part 130. Using a flexible circuit board as the connection part 130 provides greater design flexibility because it can adapt to different space constraints and assembly requirements, especially when it is necessary to bypass obstacles or make connections in confined spaces. Furthermore, flexible circuit boards are typically thinner, which can reduce the space occupied by the bezel area 102 of the display module 100, contributing to thinner modules and narrower bezel designs. Flexible circuit boards have good bending resistance, maintaining the stability of electrical connections during repeated bending and assembly, thereby improving the reliability of the entire display module 100. The manufacturing process of flexible circuit boards is mature and easily compatible with existing assembly lines. Connecting and disassembling flexible circuit boards is also relatively simple during maintenance or replacement.

[0039] Figure 5 The image shown is provided in yet another embodiment of this application. Figure 1 A schematic diagram of the cross-sectional structure along section line A-A'. (See diagram below.) Figure 5As shown, the display module 100 also includes a touch electrode layer 140, located between the array substrate and the encapsulation cover plate 120 and in the touch area 101. The touch electrode layer 140 is electrically connected to the second bonding terminal 121, and the touch electrode layer 140 is insulated from the array substrate.

[0040] Specifically, the touch electrode layer 140 is an electrode structure for detecting and transmitting touch signals. It is disposed on the side of the array substrate facing the encapsulation cover 120 and is insulated from the array substrate to prevent signal interference or short circuits. The touch electrode layer 140 is located in the touch area 101 of the display module 100 and is used to detect user touch operations, such as touching and swiping, and convert them into electrical signals. Exemplarily, the touch electrode layer 140 may be a series of tiny transparent conductive materials arranged to sense finger touch. The touch electrode layer 140 is electrically connected to the second bonding terminal 121, so that touch signals can be transmitted to the external circuitry of the display module 100 through the second bonding terminal 121. Exemplarily, the touch electrode layer 140 is connected to the second bonding terminal 121 by wires or conductive adhesive. Exemplarily, the touch electrode layer 140 may also include multiple driving electrodes and multiple sensing electrodes located in the touch area 101, with the driving electrodes and sensing electrodes intersecting each other. Multiple first signal lines and multiple second signal lines extend from the touch electrode layer 140 into the frame area 102. One end of each of the first and second signal lines is connected to a driving electrode and a sensing electrode, respectively, and the other end is connected to wires in different terminal structures of the second bonding terminal 121. The first and second signal lines are led out through the second bonding terminal 121 for connection to external circuitry. For example, the driving electrode and the sensing electrode form a mutual inductance capacitance at their intersection, and the capacitance value of this mutual inductance capacitance is detected to determine whether a touch event has occurred.

[0041] For example, an insulating layer is provided between the touch electrode layer 140 and the array substrate to ensure that the signal of the touch electrode layer 140 will not short-circuit or interfere with other conductive layers on the array substrate. For example, the material of the insulating layer may include polyimide.

[0042] The technical solution in this example, by setting a touch electrode layer 140 in the touch area 101, can more accurately detect the user's touch position and action, thereby improving the accuracy of touch operation. By directly electrically connecting the touch electrode layer 140 to the second bonding terminal 121, the signal transmission path is shortened, signal loss is reduced, and signal transmission efficiency is improved. The touch electrode layer 140 is insulated from the array substrate, preventing interference between touch signals and display signals, ensuring display quality and touch performance. Integrating the touch electrode layer 140 into the display module 100 reduces the need for external touch components, simplifies the overall structural design, and lowers costs.

[0043] Figure 6 The diagram shown is a schematic representation of the structure of a touch electrode layer according to an embodiment of this application. Figure 6 As shown, the touch electrode layer 140 includes a first conductive layer 141, a first insulating layer 142, and a second conductive layer 143 arranged sequentially on the side of the encapsulation cover plate 120 facing the substrate 111.

[0044] Specifically, a first conductive layer 141 is located on the side of the encapsulation cover 120 facing the substrate 111 and is used to receive user touch input. The material of the first conductive layer 141 can be a transparent conductive material, such as indium tin oxide (ITO), silver nanowires, or conductive polymers. The shape of the first conductive layer 141 can be a grid or multiple lines. A first insulating layer 142 is located between the first conductive layer 141 and the second conductive layer 143 to isolate the two conductive layers and prevent short circuits. The material of the first insulating layer 142 can include insulating materials such as silicon oxide and polyimide. The second conductive layer 143 is located on the side of the first insulating layer 142 away from the first conductive layer 141 and is also made of a transparent conductive material. The shape of the second conductive layer 143 may be complementary to or overlap with the first conductive layer 141. Exemplarily, the second conductive layer 143 and the first conductive layer 141 together constitute a pair of touch electrodes. Using a structure of two conductive layers and one insulating layer, a capacitive touch sensor can be formed. This type of sensor can respond quickly to touch operations, improving the user experience. When a user touches the screen, the touch location is detected by the change in capacitance between the two conductive layers.

[0045] The technical solution of this embodiment, by setting a first conductive layer 141, a first insulating layer 142, and a second conductive layer 143 arranged sequentially in the touch electrode layer 140, allows for the formation of a smaller touch unit, enabling more accurate detection of the touch position and improving touch resolution. The effective isolation of the first insulating layer 142 reduces signal interference between the first conductive layer 141 and the second conductive layer 143, ensuring stable transmission of touch signals. Integrating the touch electrode layer 140 into the display module 100 further enhances the integration density of the display module 100. This structure of the touch electrode layer 140 can adapt to different display technologies, such as Liquid Crystal Display (LCD) or Organic Light-Emitting Diode (OLED), and can be used in display modules 100 of various sizes and shapes.

[0046] It should be noted that the touch electrode layer 140 structure described in this embodiment is merely an example, intended to clearly demonstrate the core ideas and implementation methods of the technical solution provided in this application. However, the technical solution of this application is not limited to this specific touch electrode layer 140 structure. The technical solution provided in this application can be applied to display modules 100 that include various touch electrode layer 140 structures. For example, resistive touch screens or capacitive touch screens, or other types of touch technologies, as long as their basic working principles and structural characteristics conform to the technical framework described in this application, can all be optimized and improved through the technical solution of this application.

[0047] Figure 7 The image shown is provided in yet another embodiment of this application. Figure 1 A schematic diagram of the cross-sectional structure along section line A-A'. (See diagram below.) Figure 7 As shown, the display module 100 further includes a pixel circuit 150 located between the substrate 111 and the touch electrode layer 140 and in the touch area 101. The pixel circuit 150 is electrically connected to the first bonding terminal 112. Preferably, the display module 100 further includes a second insulating layer located between the pixel circuit 150 and the second conductive layer 143.

[0048] Specifically, the pixel circuit 150 is the core component of the display module 100, located between the substrate 111 and the touch electrode layer 140, and situated within the touch area 101. Exemplarily, in an OLED display device, the pixel circuit 150 is responsible for controlling the display of each pixel, including switching transistors, driving transistors, storage capacitors, and light-emitting elements. For example, the pixel circuit 150 can be in various forms such as 2T1C (i.e., two transistors (T) and one capacitor (C)), 3T1C, or 7T1C. Exemplarily, in an LCD, the pixel circuit 150 may include thin-film transistors and storage capacitors for controlling the alignment of liquid crystal molecules, thereby regulating light transmission. The pixel circuit 150 is electrically connected to the first bonding terminal 112 and can receive or transmit signals with other circuits in the display module 100, such as driving circuits or control circuits. The pixel circuit 150 can form pixel signal lines connected to the first bonding terminal 112. For example, when displaying an image, the circuit board generates a drive signal, which is transmitted to the pixel circuit 150 through the first bonding terminal 112 to control the brightness and color of each pixel.

[0049] A second insulating layer is disposed between the pixel circuit 150 and the second conductive layer 143 to isolate the pixel circuit 150 and the touch electrode layer 140, preventing electrical interference and short circuits. For example, the material of the second insulating layer may include insulating materials such as silicon oxide, silicon nitride, and polyimide.

[0050] The technical solution of this embodiment improves the display performance of the display module 100 by setting a pixel circuit 150 in the display module 100. By setting a second insulating layer between the pixel circuit 150 and the touch electrode layer 140, electrical interference between the two can be effectively prevented, ensuring the normal operation of the display and touch functions. Due to the electrical isolation between the pixel circuit 150 and the touch electrode layer 140, the display module 100 can provide a clearer and more stable image display. The presence of the second insulating layer reduces potential electrical failure points and improves the overall reliability and durability of the display module 100. This setting optimizes the use of internal space in the display module 100, making the overall structure more compact. Integrating the pixel circuit 150 and the touch electrode layer 140 on the same substrate 111 is beneficial for achieving a thinner and lighter display module 100 design.

[0051] Figure 8 The image shown is provided in yet another embodiment of this application. Figure 1 A schematic diagram of the cross-sectional structure along section line A-A'. (See diagram below.) Figure 8 As shown, the pixel circuit 150 includes an anode 151, an organic light-emitting layer 152, and a cathode 153 arranged sequentially on the side of the substrate 111 facing the encapsulation cover plate 120.

[0052] Specifically, the anode 151 can be made of a transparent conductive material, such as indium tin oxide (ITO) or silver nanowires. The anode 151 is used to inject positive charges (holes) into the organic light-emitting layer 152. For example, in an OLED display, the anode 151 typically serves as the top electrode of a pixel, allowing light to pass through. The organic light-emitting layer 152, located between the anode 151 and the cathode 153, is composed of organic compounds and is capable of emitting light under an electric field. When electrons and holes recombine in the light-emitting layer, photons are emitted. The organic light-emitting layer 152 is a key component of an OLED; by selecting suitable organic materials, optimizing the layer structure design, improving carrier injection and transport characteristics, and increasing light extraction efficiency, the color and efficiency of the OLED display can be effectively controlled. Exemplarily, the organic light-emitting layer 152 includes a hole transport layer, an electron transport layer, and a light-emitting layer. For example, in an OLED display, the light-emitting layer may include red, green, and blue light-emitting materials to achieve full-color display. The cathode 153 can be made of a metal or alloy, such as aluminum or silver. The cathode 153 is used to inject electrons into the organic light-emitting layer 152.

[0053] In this embodiment, the pixel circuit 150 includes an anode 151, an organic light-emitting layer 152, and a cathode 153, forming the basic light-emitting unit of an OLED display. The effective arrangement of the anode 151 and cathode 153 ensures balanced injection of holes and electrons, and the organic light-emitting layer 152 emits light efficiently when current passes through, improving display brightness. By using organic light-emitting layers 152 with different light-emitting materials, multiple colors can be emitted, making the displayed image colors richer and more realistic. Since the organic light-emitting layer 152 can emit light directly without backlighting, OLED display technology has higher brightness and lower energy consumption. Furthermore, using the organic light-emitting layer 152 allows for a thinner display panel, further contributing to the thinner and lighter display module 100. In addition, OLED screens can provide a wider color gamut, higher contrast, and deeper blacks because each pixel emits light independently, allowing for true black even when completely off. OLED pixels have a very fast response time, suitable for displaying dynamic images and reducing motion blur. OLED display technology provides a wider viewing angle; even when viewed at extreme angles, color and brightness do not change significantly. The organic light-emitting layer is made of organic materials, which allows the OLED screen to be made flexible, further enhancing the aesthetics and user experience of the display module 100.

[0054] Figure 9 The image shown is provided in yet another embodiment of this application. Figure 1 A schematic diagram of the cross-sectional structure along section line A-A'. (See diagram below.) Figure 9 As shown, the display module 100 also includes a packaging structure 160 located between the packaging cover plate 120 and the substrate 111, and in contact with the packaging cover plate 120 and the substrate 111. The packaging structure 160 surrounds the touch area 101. The touch electrode layer 140, the insulating layer and the pixel circuit 150 are all located inside the packaging structure 160, and the first bonding terminal 112, the second bonding terminal 121 and the connection portion 130 are all located outside the packaging structure 160.

[0055] Specifically, the encapsulation structure 160 is disposed between the encapsulation cover 120 and the substrate 111 to seal and protect the electronic components inside the display module 100, preventing moisture, oxygen, dust, and other external factors from damaging the sensitive electronic components. The encapsulation structure 160 surrounds the touch area 101, isolating the touch area 101 from the bezel area 102. The touch electrode layer 140, insulating layer, and pixel circuit 150 located within the touch area 101 are encapsulated inside the encapsulation structure 160, receiving good protection while maintaining the compact structure of the display module 100. Exemplarily, the encapsulation structure 160 can be made of materials such as adhesive, sealant, or a plastic bezel to ensure the sealing of the touch area 101. The first bonding terminal 112, the second bonding terminal 121, and the connection portion 130 located in the bezel area 102 are isolated outside the encapsulation structure 160, facilitating connection to external circuits without affecting the integrity of the encapsulation structure 160.

[0056] The technical solution of this embodiment provides protection for sensitive electronic components inside the display module 100 by setting an encapsulation structure 160 between the substrate 111 and the encapsulation cover 120. By encapsulating the touch electrode layer 140, insulating layer, and pixel circuit 150 located in the touch area 101 inside the encapsulation structure 160, the influence of the external environment on the internal components is effectively isolated, enhancing the display module 100's resistance to environmental factors such as dust and moisture, improving device stability, extending the service life of the display module 100, and improving its reliability under various environmental conditions. By isolating the first bonding terminal 112, the second bonding terminal 121, and the connecting portion 130 located in the bezel area 102 outside the encapsulation structure 160, connection and maintenance with external circuits are facilitated, reducing the difficulty of assembly and maintenance and improving production efficiency. This arrangement further optimizes space utilization, allowing the display module 100 to be thinner and lighter.

[0057] This application also provides a display device, including a display module 100 as mentioned in any of the above embodiments. This display device has the beneficial effects of the display module 100 mentioned in any of the above embodiments, and its technical principles and effects are similar, so they will not be repeated here.

[0058] This application also provides a display terminal, including a display device as mentioned in any of the above embodiments, such as a tablet computer, smartphone, smart wearable, etc. This display terminal has the beneficial effects of the display module 100 or display device mentioned in any of the above embodiments; its technical principles and effects are similar and will not be repeated here.

[0059] The embodiments described above are not exhaustive, nor do they limit the application to the specific embodiments described herein. Clearly, many modifications and variations can be made based on the above description. These embodiments are selected and specifically described in this specification to better explain the principles and practical applications of this application, thereby enabling those skilled in the art to effectively utilize this application and its modifications. This application is limited only by the claims and their full scope and equivalents.

[0060] It should be understood that the various forms of processes shown above can be used to rearrange, add, or delete steps. For example, the steps described in this application can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this application can be achieved, and this is not limited herein.

[0061] The specific embodiments described above do not constitute a limitation on the scope of protection of this application. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A display module, characterized in that, The display module includes a touch area and a border area surrounding the touch area. An array substrate includes a substrate and a first bonding terminal disposed on one side of the substrate, the substrate covering the touch area, at least a portion of the substrate being located in the border area, and the first bonding terminal being located in the border area; A package cover is disposed opposite to the array substrate and located on the side of the array substrate where the first bonding terminal is disposed; the package cover covers the touch area, at least a portion of the package cover is located in the border area, and a second bonding terminal is disposed on the side of the package cover facing the array substrate, the second bonding terminal being located in the border area; the edge of the package cover is recessed into the touch area in the region corresponding to the first bonding terminal, exposing the first bonding terminal; the edge of the substrate is recessed into the touch area in the region corresponding to the second bonding terminal, exposing the second bonding terminal.

2. The display module according to claim 1, characterized in that, The first bonding terminal and the second bonding terminal are located on the same side of the touch area, and the orthographic projection of the second bonding terminal on the plane of the substrate and the orthographic projection of the first bonding terminal on the substrate are intersected.

3. The display module according to claim 1, characterized in that, It also includes a connecting portion located in the frame area, wherein a first end of the connecting portion is electrically connected to the first bonding terminal, and a second end of the connecting portion is electrically connected to the second bonding terminal; Preferably, the connecting portion includes a flexible circuit board.

4. The display module according to claim 1, characterized in that, It also includes a touch electrode layer located between the array substrate and the package cover and in the touch area, the touch electrode layer being electrically connected to the second bonding terminal, and the touch electrode layer being insulated from the array substrate.

5. The display module according to claim 4, characterized in that, The touch electrode layer includes a first conductive layer, a first insulating layer, and a second conductive layer arranged sequentially on the side of the encapsulation cover plate facing the substrate.

6. The display module according to claim 5, characterized in that, It also includes a pixel circuit located between the substrate and the touch electrode layer and in the touch area, the pixel circuit being electrically connected to the first bonding terminal; Preferably, the display module further includes a second insulating layer located between the pixel circuit and the second conductive layer.

7. The display module according to claim 6, characterized in that, The pixel circuit includes an anode, an organic light-emitting layer, and a cathode arranged sequentially on the side of the substrate facing the encapsulation cover.

8. The display module according to claim 7, characterized in that, It also includes a packaging structure located between the packaging cover and the substrate, and in contact with the packaging cover and the substrate, the packaging structure surrounding the touch area; the touch electrode layer, the insulating layer and the pixel circuit are all located inside the packaging structure, and the first bonding terminal, the second bonding terminal and the connection portion are all located outside the packaging structure.

9. A display device, characterized in that, include: The display module as described in any one of claims 1 to 8.

10. A display terminal, characterized in that, include: The display device as described in claim 9.

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