Display module, preparation method thereof and display device

Abstract

The application provides a display module, a preparation method thereof and a display device. The display module comprises a display layer and a touch layer. The touch layer is arranged on the light-emitting side of the display layer. A first flexible circuit board is connected to a binding area. A protection structure is arranged on the side of the display layer facing the touch layer. The protection structure and the touch layer are arranged side by side along a first direction. The protection structure and the first flexible circuit board are arranged apart along a second direction. The second direction intersects the first direction. A second flexible circuit board is arranged on the same side of the display area as the first flexible circuit board. The second flexible circuit board is connected to the touch layer. The second flexible circuit board covers at least part of the protection structure. The display module provided by the application can effectively block water vapor intrusion and solution corrosion during reliability tests by adding a protection structure to fill the gap between the second flexible circuit board and the display layer, thereby improving product reliability and improving the binding effect of the flexible circuit board.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display module, its manufacturing method, and a display device. Background Technology

[0002] With the widespread adoption of miniaturized wearable devices such as smartwatches and smart bands, the bonding area of ​​their touch panel (TP) and the bonding area of ​​the driver chip (IC) are usually located on the same side of the display area. When the width of one side of the display panel is limited, the driver-flexible printed circuit board (D-FPC) and the touch flexible printed circuit board (TP-FPC) are prone to overlap in height. This results in a large gap between the touch flexible printed circuit board on the outer side and the display panel after bending, making the gap susceptible to moisture intrusion and affecting product reliability. Summary of the Invention

[0003] In view of this, the purpose of this application is to propose a display module and its manufacturing method, as well as a display device, which improves product reliability by optimizing the bonding effect through a protective structure.

[0004] To achieve the above objectives, the first aspect of this application provides a display module comprising:

[0005] The display layer has a light-emitting side and a back side disposed opposite to each other, and the display layer includes a display area and a bonding area arranged along a first direction;

[0006] A touch layer is disposed on the light-emitting side of the display layer;

[0007] A first flexible circuit board, at least partially located on the side of the display layer facing the touch layer, is bonded to the bonding area;

[0008] A protective structure is disposed on the side of the display layer facing the touch layer; the protective structure and the touch layer are arranged side by side along the first direction, and the protective structure and the first flexible circuit board are spaced apart along the second direction, the second direction intersecting the first direction;

[0009] The second flexible circuit board is located on the same side of the display area as the first flexible circuit board. The second flexible circuit board is bonded to the touch layer. The second flexible circuit board is at least partially located on the side of the protective structure away from the display layer, and the second flexible circuit board covers at least a portion of the protective structure.

[0010] Optionally, the distance between the surface of the protective structure facing away from the display layer and the display layer is smaller than the distance between the surface of the touch layer facing away from the display layer and the display layer.

[0011] Alternatively, the distance between the surface of the protective structure facing away from the display layer and the display layer is equal to the distance between the surface of the touch layer facing away from the display layer and the display layer, and the surface of the protective structure facing away from the display layer is in contact with the surface of the second flexible circuit board facing the display layer.

[0012] Optionally, the second flexible circuit board covers at least a portion of the first flexible circuit board.

[0013] Optionally, the first flexible circuit board includes a first bonding end and a second bonding end disposed opposite to each other, and a first bending segment located between the first bonding end and the second bonding end. The first bonding end is bonded to the bonding area, and the second bonding end is bent to the back side of the display layer through the first bending segment. The second flexible circuit board includes a third bonding end and a fourth bonding end disposed opposite to each other, and a second bending segment located between the third bonding end and the fourth bonding end. The third bonding end is bonded to the touch layer, and the fourth bonding end is bent to the back side of the display layer through the second bending segment.

[0014] Optionally, the display module further includes:

[0015] A shim block, wherein the shim block is disposed between the display layer and the fourth binding end;

[0016] The bending radius of the second bending segment is greater than that of the first bending segment.

[0017] Optionally, the protective structure may be made of high-strength materials or compression-cushioning materials, wherein the high-strength materials may be polyethylene terephthalate or polyimide, and the compression-cushioning materials may be foam or silicone.

[0018] Optionally, the display module further includes:

[0019] A cover plate is disposed on the side of the touch layer opposite to the display layer;

[0020] A polarizing layer is disposed between the display layer and the cover plate.

[0021] A second aspect of this application provides a method for manufacturing a display module, the method comprising:

[0022] A display layer is provided, the display layer having a light-emitting side and a back side disposed opposite to each other, the display layer including a display area and a bonding area arranged along a first direction;

[0023] A touch layer is provided on the light-emitting side of the display layer;

[0024] A first flexible circuit board and a protective structure are disposed on the side of the display layer facing the touch layer, so that the first flexible circuit board is bonded to the bonding area. The protective structure and the touch layer are disposed side by side along the first direction, and the protective structure and the first flexible circuit board are disposed at a distance along the second direction, the second direction intersecting the first direction.

[0025] A second flexible circuit board is provided, such that the second flexible circuit board and the first flexible circuit board are located on the same side of the display area. The second flexible circuit board is bonded to the touch layer. The second flexible circuit board is at least partially located on the side of the touch layer opposite to the display layer, and the second flexible circuit board covers at least part of the protective structure.

[0026] Optionally, the method further includes:

[0027] The end of the first flexible circuit board away from the bonding area is bent to the back side of the display layer, and the end of the second flexible circuit board away from the touch layer is bent to the back side of the display layer.

[0028] An embodiment of the third aspect of this application provides a display device, including the display module provided in any embodiment of the first aspect.

[0029] The display module provided in this application, by adding a protective structure to fill the gap between the second flexible circuit board and the display layer, can effectively prevent moisture intrusion and solution corrosion during reliability testing, thereby improving the product's reliability testing capabilities and enhancing the bonding effect of the single-sided double flexible circuit board. Simultaneously, the protective structure also provides protection, reducing the stress on the second flexible circuit board during bending and lowering the risk of trace cracks in the bent section. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in this application or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0031] Figure 1 This is a schematic diagram of the structure of a related display module;

[0032] Figure 2This is a schematic diagram of the structure of a display module provided in one embodiment of this application;

[0033] Figure 3 This is a schematic diagram of the layered structure of a display module provided in one embodiment of this application;

[0034] Figure 4 This is a schematic diagram of the structure of a display module during its manufacturing process, provided in an embodiment of this application.

[0035] Figure 5 This is a schematic diagram of a layered structure in a display module according to another embodiment of this application;

[0036] Figure 6 This is a schematic flowchart illustrating a method for fabricating a display module according to an embodiment of this application.

[0037] Marker explanation:

[0038] 100. Display module; 1. Display layer; 101. Display area; 102. Bonding area; 2. Touch layer; 3. First flexible circuit board; 31. First bonding end; 32. Second bonding end; 33. First bending section; 4. Second flexible circuit board; 41. Third bonding end; 42. Fourth bonding end; 43. Second bending section; 5. Protective structure; 6. Pad block; 7. Polarizing layer; 8. Cover plate; 9. Buffer layer. Detailed Implementation

[0039] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with specific embodiments and the accompanying drawings.

[0040] It should be noted that, unless otherwise defined, the technical or scientific terms used in an embodiment of this application should have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms "first," "second," and similar terms used in an embodiment of this application do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are only used to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0041] In the accompanying drawings, the dimensions of layers and regions may be exaggerated for clarity. It is understood that when a structure is referred to as being "on" or "below" another structure, the structure may be directly on or below the other structure, or there may be intermediate structures. The same reference numerals always indicate the same structure. Structures referred to herein include any of the following: membrane, element, device, component, assembly.

[0042] When a structure is referred to as being “connected” to another structure, it can be directly connected to the other structure or indirectly connected to the other structure by means of one or more intermediate structures placed between them.

[0043] As wearable devices such as smartwatches and fitness trackers become smaller and thinner, the design of their display modules faces challenges.

[0044] Figure 1 This is a structural schematic diagram of a related display module. For example... Figure 1 As shown, in related technologies, the display module 100 includes a display layer 1 and a touch layer 2. The touch layer 2 is located on the light-emitting side of the display layer 1. A first flexible circuit board 3 is bonded to the display layer 1, and a second flexible circuit board 4 is bonded to the touch layer 2. The first flexible circuit board 3 and the second flexible circuit board 4 are located on the same side of the display area of ​​the display layer 1. When the size of the display module 100 in the width direction (Y direction in the figure) is relatively small, the first flexible circuit board 3 and the second flexible circuit board 4 overlap in the height direction.

[0045] Through research conducted by the inventors of this application, it was discovered that during the bending process, gaps easily form between the first flexible circuit board 3 and the second flexible circuit board 4, due to the lack of effective support between the outermost second flexible circuit board 4 and the display layer 1. Figure 1 At point A, this gap could become a primary pathway for moisture and solution intrusion. Specifically, when a gap exists between the second flexible circuit board 4 and the display layer 1, the bonding terminals (such as metal pads) on the inner side of the second flexible circuit board 4 are directly exposed to the external environment. During reliability tests involving high temperature and humidity (85℃ / 85%RH) and solution immersion (such as simulated sweat), moisture or corrosive liquids can easily penetrate the gap, leading to oxidation, corrosion, or breakage of the bonding area, significantly increasing the risk of circuit failure. Here, "inner side" can be considered as the side closer to the bending center, and "outer side" can be considered as the side farther from the bending center.

[0046] In some related technologies, a highly fluid back-marking adhesive is applied to the inner side of the second flexible circuit board 4, forming an adhesive layer that can partially fill the gap between the second flexible circuit board 4 and the display layer 1. However, the adhesive expands in volume after curing, causing the display module height to increase, potentially exceeding the overall height limit. During drop tests, the adhesive layer is prone to stress concentration, leading to localized cracking of the cover plate. Furthermore, the adhesive's fluidity makes precise control difficult, potentially covering the area where the first flexible circuit board 3 is located. If the first flexible circuit board 3 and the second flexible circuit board 4 overlap along the height direction, the bonding end of the second flexible circuit board 4 may become uneven, easily interfering with the upper cover plate, causing uneven stress and increasing the risk of breakage during drops.

[0047] Based on this, this application proposes a solution for a display module to address the problem that gaps easily form between the first and second flexible circuit boards located on the same side when bent, leading to moisture intrusion. By setting a protective structure, the bonding effect can be optimized.

[0048] To better understand this application, the following will be combined with... Figures 2 to 5 The display module provided in the embodiments of this application will be described in detail.

[0049] Figure 2 This is a schematic diagram of the structure of a display module provided in one embodiment of this application; Figure 3 This is a schematic diagram of the layered structure of a display module provided in one embodiment of this application.

[0050] like Figure 2 , Figure 3 As shown, an embodiment of the first aspect of this application provides a display module 100. The display module 100 includes a display layer 1, a touch layer 2, a first flexible circuit board 3, a second flexible circuit board 4, and a protective structure 5. The display layer 1 has a light-emitting side and a back side disposed opposite to each other, and includes a display area 101 and a bonding area 102 arranged along a first direction (X direction in the figure). The touch layer 2 is disposed on the light-emitting side of the display layer 1. A portion of the first flexible circuit board 3 is located on the side of the display layer 1 facing the touch layer 2, and the first flexible circuit board 3 is bonded to the bonding area 102. The protective structure 5 is disposed on the side of the display layer 1 facing the touch layer 2.

[0051] Figure 4 This is a schematic diagram illustrating the structure of a display module during its fabrication process, as provided in an embodiment of this application. Specifically, it shows a partial structure of the display module before the second flexible circuit board 4 is bonded and after the protective structure 5 is installed. For example... Figure 4As shown, the protective structure 5 and the touch layer 2 are arranged side by side along the first direction, and the protective structure 5 and the first flexible circuit board 3 are spaced apart along the second direction (the Y direction in the figure), the second direction intersecting the first direction. The second flexible circuit board 4 and the first flexible circuit board 3 are located on the same side of the display area 101. The second flexible circuit board 4 is bonded to the touch layer 2, and part of the second flexible circuit board 4 is located on the side of the protective structure 5 away from the display layer 1, and the second flexible circuit board 4 covers part of the protective structure 5. That is, part of the protective structure 5 is located within the projection range of the second flexible circuit board 4 along the thickness direction. Optionally, the second direction is perpendicular to the first direction. Furthermore, the second direction and the first direction are mutually perpendicular to the thickness direction (the Z direction in the figure).

[0052] It is understood that the second flexible circuit board 4 can cover the entire protective structure 5. The second flexible circuit board 4 includes a straight section parallel to the display layer 1 and located on the light-emitting side, and the straight section of the second flexible circuit board 4 covers the protective structure 5.

[0053] Specifically, the display layer 1 has a light-emitting side and a back side, and can be divided into a display area 101 and a bonding area 102 along a first direction. The display area 101 is an area for displaying images and has a pixel array formed by arranging multiple pixel units. The bonding area 102 is used for circuit connection and may include pins or metal pads for bonding with the display driver chip. The display layer 1 and the display area 101 can be of any shape, such as square, rectangular, or circular. In this embodiment, the edge contour shape of the display area 101 is rectangular, the border contour shape of the display layer 1 is rectangular, the border contour shape of the touch layer 2 is also rectangular, and the edge contour shape of the protective structure 5 is rectangular.

[0054] Touch layer 2 is disposed on the light-emitting side of display layer 1 to enable touch functionality. The area of ​​touch layer 2 is smaller than that of display layer 1, and touch layer 2 can completely cover the display area 101 of display layer 1. Bonding area 102 is located on the portion of display layer 1 extending outwards beyond touch layer 2. First flexible circuit board 3 is a driving flexible circuit board, and second flexible circuit board 4 is a touch flexible circuit board. Part of first flexible circuit board 3 is located on the side of display layer 1 facing touch layer 2 and is bonded to bonding area 102 for transmitting display signals. Protective structure 5 is disposed on the side of display layer 1 facing touch layer 2, arranged side-by-side with touch layer 2 along a first direction and spaced apart from first flexible circuit board 3 along a second direction, thus forming a protective barrier in spatial layout.

[0055] The second flexible circuit board 4 is bonded to the touch layer 2 and is partially located on the side of the protective structure 5 away from the display layer 1, and covers at least part of the protective structure 5.

[0056] For example, the display layer 1 can employ OLED or LCD technology. The touch layer 2 can be bonded to the light-emitting side of the display layer 1 using optically transparent adhesive (OCA), and may include an ITO (indium tin oxide) conductive layer to support multi-touch functionality. The first flexible circuit board 3 uses a polyimide (PI) substrate with a thickness of 0.05 mm. One end of the board is connected to the metal pad of the bonding area 102 via a hot-pressing process, and the other end is bent to the back side of the display layer 1 via a first bending section. The protective structure 5 is disposed on the side of the display layer 1 facing the touch layer 2, parallel to the touch layer 2 along a first direction, and spaced 0.2 mm from the first flexible circuit board 3 along a second direction. The protective structure 5 is made of PET (polyethylene terephthalate), has a thickness of 0.1 mm, and a tensile strength of 120 MPa.

[0057] The display module 100 provided in one embodiment of this application, by adding a protective structure 5, can fill the gap between the second flexible circuit board 4 and the display layer 1, effectively blocking moisture intrusion and solution corrosion during reliability testing, thereby improving product reliability testing capabilities and enhancing the bonding effect of the single-sided double flexible circuit board. Simultaneously, the protective structure 5 also provides protection, reducing the stress on the second flexible circuit board 4 during bending and minimizing the risk of trace cracks in the bent section.

[0058] Specifically, the display module 100 of this application effectively solves the problems of moisture intrusion and reliability caused by space constraints during the miniaturization of the display module by introducing a protective structure 5 and a reasonable circuit board layout. The protective structure 5 not only physically isolates the display layer 1 and the second flexible circuit board 4, but also forms a closed protective area through its covering relationship with the second flexible circuit board 4, reducing the risk of moisture and corrosive liquids intruding into the bonding area. In addition, the protective structure 5 is arranged side by side with the first flexible circuit board 3 and provides support to one end of the second flexible circuit board 4, reducing structural instability caused by spatial interference.

[0059] Optionally, in this embodiment, when the first flexible circuit board 3 and the second flexible circuit board 4 are bent together to the back side of the display layer 1, a buffer layer 9 is provided on the back side of the display layer 1, that is, the buffer layer 9 is provided on the side of the display layer 1 away from the touch layer 2. The buffer layer 9 can provide certain support and protection for the display layer 1 and the touch layer 2. The material of the buffer layer 9 can be foam or PET, which can absorb impact force.

[0060] In some optional embodiments, the distance between the protective structure 5 and the display layer 1 on the side facing away from the display layer 1 is less than or equal to the distance between the touch layer 2 and the display layer 1 on the side facing away from the display layer 1.

[0061] Specifically, by ensuring that the distance between the protective structure 5 and the display layer 1 on the side away from the display layer 1 is less than or equal to the distance between the touch layer 2 and the display layer 1 on the side away from the display layer 1, the height of the protective structure 5 is limited to not exceeding the height of the touch layer 2. This height can be ensured by controlling the thickness and position of the protective structure 5. In this way, while guaranteeing the protective function, interference between the protective structure 5 and the touch layer 2 and the cover plate is avoided, ensuring the overall flatness of the display module. The optimized height design of the protective structure 5 enhances the reliability and stability of the display module. By controlling the height of the protective structure 5, interference with the touch layer 2 and the cover plate is avoided, thereby reducing stress concentration problems caused by height differences. This design not only reduces the risk of breakage due to drop tests but also optimizes the optical performance of the module, ensuring a more uniform bonding effect between the touch layer 2 and the cover plate. Simultaneously, the height control of the protective structure 5 helps reduce the overall thickness of the module, meeting the stringent space requirements of miniaturized products.

[0062] For example, the upper surface of the protective structure 5 is not higher than the upper surface of the touch layer 2, ensuring that its overall height on the front of the display module is flush with or lower than that of the touch layer 2. In actual production, the thickness of the protective structure 5 is controlled by die-cutting or lamination processes. For example, the protective structure 5 is made of 0.1mm thick PET film or 0.2mm thick foam, and the touch layer 2 is made of 0.3mm thick glass, ensuring that the height difference between the two is within the design range. This avoids uneven stress on the upper cover (such as a glass cover) caused by the protrusion of the protective structure 5, reduces the risk of breakage in drop tests, and meets the customer's strict requirements for the overall thickness of the device, making it especially suitable for ultra-thin wearable devices.

[0063] Optionally, the distance between the surface of the protective structure 5 facing away from the display layer 1 and the display layer 1 is equal to the distance between the surface of the touch layer 2 facing away from the display layer 1 and the display layer 1. That is, the surface of the protective structure 5 facing away from the display layer 1 is flush with the surface of the touch layer 2 facing away from the display layer 1. Simultaneously, the surface of the protective structure 5 facing away from the display layer 1 contacts the surface of the second flexible circuit board 4 facing the display layer 1. The protective structure 5 can provide support near the ends or straight sections of the second flexible circuit board 4, helping to improve the stress distribution when the second flexible circuit board 4 is bent.

[0064] In some alternative embodiments, the second flexible circuit board 4 covers at least a portion of the first flexible circuit board 3.

[0065] Specifically, in the design of the display module 100, the second flexible circuit board 4 is not only bonded to the touch layer 2, but also covers a portion of the first flexible circuit board 3 through its extension. By forming a multi-layer circuit board stack, a more compact and robust signal transmission path is created.

[0066] It should be noted that the second flexible circuit board 4 covers a local area of ​​the first flexible circuit board 3 on the straight section of the light-emitting side of the display layer 1, for example, by overlapping in the bonding area 102. The covered area must avoid the bending sections of the first flexible circuit board 3 to ensure that the bending of the second flexible circuit board 4 and the first flexible circuit board 3 does not interfere with each other. This results in a compact layout, saves lateral space, and is suitable for narrow bezel designs. When the second flexible circuit board 4 covers a local area of ​​the first flexible circuit board 3, the second flexible circuit board 4 is further fixed with the support of the protective structure 5, reducing the risk of poor contact at the bonding end caused by its shaking.

[0067] In the miniaturized module, two flexible circuit boards are bonded to the same side of the display area 101, and the two flexible circuit boards overlap, which enables efficient signal transmission and protection functions within a limited space. In addition, the overlapping design optimizes the overall layout of the module, reduces reliability issues caused by exposed circuit boards, and further improves the lifespan and stability of the display module.

[0068] In some optional embodiments, the first flexible circuit board 3 includes a first binding end 31 and a second binding end 32 disposed opposite to each other, and a first bending segment 33 located between the first binding end 31 and the second binding end 32. The first binding end 31 is bound to the binding area 102, and the second binding end 32 is bent to the back side of the display layer 1 through the first bending segment 33.

[0069] The second flexible circuit board 4 includes a third bonding end 41 and a fourth bonding end 42 disposed opposite to each other, and a second bending section 43 located between the third bonding end 41 and the fourth bonding end 42. The third bonding end 41 is bonded to the touch layer 2, and the fourth bonding end 42 is bent to the back side of the display layer 1 through the second bending section 43.

[0070] Specifically, the first bending segment 33 and the second bending segment 43 ensure that the flexible circuit board is not excessively stretched or compressed during bending, thereby avoiding circuit breakage or short circuits caused by bending. The bending design of the flexible circuit board improves the reliability and miniaturization capability of the display module. By rationally designing the shape and position of the bending segments, not only is the mechanical stability of the flexible circuit board ensured during bending, but the overall layout of the display module is also optimized, enabling efficient signal transmission within a limited space. Furthermore, the bending design reduces the thickness of the display module, meeting the stringent space requirements of miniaturized products. By bending the bonding end of the flexible circuit board to the back side of the display layer, the structural stability of the display module is further enhanced, reducing the risk of damage caused by external impacts.

[0071] Figure 5 This is a schematic diagram of a layered structure in a display module according to another embodiment of this application. For example... Figure 5As shown, in some optional embodiments, the display module 100 further includes a shim block 6 disposed between the display layer 1 and the fourth bonding end 42.

[0072] Optionally, the bending radius of the second bending segment 43 is greater than the bending radius of the first bending segment 33.

[0073] In this process, a padding block 6 (such as a 0.3mm thick PET sheet) is provided between the back side of the display layer 1 and the fourth bonding end 42 of the second flexible circuit board 4 to fill the gap between the fourth bonding end 42 and the back side of the display layer 1.

[0074] By adding a shim 6 between the display layer 1 and the fourth bonding end 42, sufficient support is ensured for the second flexible circuit board 4 during bending, and the bending radius is optimized, reducing stress concentration in the second bending section 43 and thus avoiding circuit breakage caused by excessive bending. Simultaneously, optimizing the bending radius improves the fit between the second flexible circuit board 4 and the protective structure 5, preventing moisture intrusion and further enhancing the reliability of the display module. Specifically, adding the shim 6 between the display layer 1 and the fourth bonding end 42 not only provides physical support but also optimizes the bending path, reducing the risk of circuit breakage due to bending. Furthermore, the optimized bending radius design further reduces stress concentration in the second bending section 43, improving the reliability of the display module in extreme environments such as high temperature and high humidity. When applied to miniaturized display modules, it enables efficient mechanical protection and signal transmission within a limited space.

[0075] In some alternative embodiments, the protective structure 5 is made of a high-strength material or a compression cushioning material, the high-strength material being polyethylene terephthalate (PET) or polyimide (PI), and the compression cushioning material being foam or silicone.

[0076] Specifically, high-strength materials refer to materials with high mechanical strength (e.g., tensile strength ≥100MPa) and low deformation characteristics (e.g., polyethylene terephthalate PET or polyimide PI). When used in protective layers, they can resist external pressure and reduce module interference. Extrusion cushioning materials refer to materials with elasticity (e.g., compression rebound rate ≥80%) and energy absorption characteristics (e.g., foam or silicone). When used in protective layers, they reduce the risk of wiring breakage by absorbing the bending stress of the FPC, while also preventing moisture intrusion.

[0077] For example, high-strength materials are used in scenarios requiring rigid support, while extruded cushioning materials are used in scenarios requiring shock absorption. The protective structure 5 can be die-cut into specific shapes (such as rectangles or L-shapes) and attached to the surface of the display layer 1. High-strength materials provide stable support, preventing cracking of the bonding ends of the second flexible circuit board 4 due to deformation caused by external forces. Extruded cushioning materials absorb the energy of external impacts (such as drops), reducing stress on the bent sections of the flexible circuit board. Simultaneously, the porous structure of the foam or the elastic structure of the silicone can fill tiny gaps, enhancing waterproofing performance.

[0078] High-strength materials provide physical protection against damage from external impacts. Extrusion-damping materials absorb stress, reducing stress concentration in bending areas while preventing the intrusion of moisture and corrosive liquids. The use of high-strength materials ensures the physical stability of the protective structure 5, effectively resisting external impacts and mechanical vibrations. Extrusion-damping materials, through their elastic properties, absorb stress generated during bending, reducing the risk of circuit breakage due to stress concentration. Furthermore, both materials possess excellent waterproof and moisture-proof properties, effectively preventing the intrusion of moisture and corrosive liquids, thereby improving the module's reliability in extreme environments such as high temperature and high humidity.

[0079] like Figure 5 As shown, in some optional embodiments, the display module 100 further includes a polarizing layer 7 and a cover plate 8, the cover plate 8 being disposed on the side of the touch layer 2 opposite to the display layer 1. The polarizing layer 7 is disposed between the display layer 1 and the cover plate 8.

[0080] Specifically, both the cover plate 8 and the polarizing layer 7 are disposed on the light-emitting side of the display layer 1. The polarizing layer 7 is disposed between the touch layer 2 and the cover plate 8. In this embodiment, a corresponding adhesive can also be provided between the polarizing layer 7 and the cover plate 8. Commonly used transparent adhesives in the display technology field can be used, such as OCA (Optically Clear Adhesive) and OCR (Optical Clear Resin). The polarizing layer 7 can reduce the reflection of ambient light, thereby improving the display effect of the display layer 1 in environments with strong ambient light. In addition, the polarizing layer 7 disposed between the touch layer 2 and the cover plate 8 can also increase the distance between the cover plate 8 and the touch layer 2 in the thickness direction, thereby providing a larger space to accommodate any warping or bulging that may occur in the first flexible circuit board 3.

[0081] In some optional embodiments, the display module 100 further includes an encapsulation layer, which may be disposed between the touch layer 2 and the display layer 1, or the encapsulation layer may be disposed on the side of the touch layer 2 opposite to the display layer 1.

[0082] Figure 6This is a schematic flowchart illustrating a method for fabricating a display module according to an embodiment of this application. Figure 6 As shown, an embodiment of the second aspect of this application provides a method for manufacturing a display module 100. The method for manufacturing the display module 100 specifically includes the following steps:

[0083] Step S1: Provide a display layer 1. The display layer 1 has a light-emitting side and a back side that are disposed opposite to each other. The display layer 1 includes a display area 101 and a bonding area 102 arranged along a first direction.

[0084] Step S2: Set a touch layer 2 on the light-emitting side of the display layer 1;

[0085] Step S3: A first flexible circuit board 3 and a protective structure 5 are provided on the side of the display layer 1 facing the touch layer 2, so that the first flexible circuit board 3 is bonded to the bonding area 102. The protective structure 5 and the touch layer 2 are arranged side by side along the first direction, and the protective structure 5 and the first flexible circuit board 3 are arranged at intervals along the second direction, and the second direction intersects the first direction.

[0086] Step S4: Set the second flexible circuit board 4 so that the second flexible circuit board 4 and the first flexible circuit board 3 are located on the same side of the display area 101. The second flexible circuit board 4 is bonded to the touch layer 2. The second flexible circuit board 4 is partially located on the side of the touch layer 2 away from the display layer 1, and the second flexible circuit board 4 covers part of the protective structure 5.

[0087] For example, the display layer 1 includes an OLED light-emitting layer deposited on a glass substrate. The touch layer 2 is bonded to the light-emitting side of the display layer 1 using OCA adhesive. A first flexible circuit board 3 is bonded to the bonding area 102, and a protective structure 5 is fixed to the side of the display layer 1 using UV-curable adhesive. A second flexible circuit board 4 covers the protective structure 5 and is bonded to the touch layer 2 using a thermosetting process.

[0088] The introduction of protective structure 5 and a reasonable circuit board layout effectively solves the problems of moisture intrusion and reliability caused by space constraints during the miniaturization of the display module. The protective structure 5 not only physically isolates the display layer 1 and the second flexible circuit board 4, but also forms a closed protective area through its covering relationship with the second flexible circuit board 4, reducing the risk of moisture and corrosive liquids intruding into the bonding area.

[0089] In some alternative embodiments, the protective structure 5 is made of a high-strength material or a compression cushioning material, the high-strength material being polyethylene terephthalate (PET) or polyimide (PI), and the compression cushioning material being foam or silicone.

[0090] For example, high-strength materials are used in scenarios requiring rigid support, while extruded cushioning materials are used in scenarios requiring shock absorption. The protective structure 5 can be die-cut into specific shapes (such as rectangles or L-shapes) and attached to the surface of the display layer 1. High-strength materials provide stable support, preventing cracking of the bonding ends of the second flexible circuit board 4 due to deformation caused by external forces. Extruded cushioning materials absorb the energy of external impacts (such as drops), reducing stress on the bent sections of the flexible circuit board. Simultaneously, the porous structure of the foam or the elastic structure of the silicone can fill tiny gaps, enhancing waterproofing performance.

[0091] In some optional embodiments, the method for manufacturing the display module 100 further includes the following steps:

[0092] Step S5: Bend the end of the first flexible circuit board 3 away from the bonding area 102 to the back side of the display layer 1, and bend the end of the second flexible circuit board 4 away from the touch layer 2 to the back side of the display layer 1.

[0093] For example, the second flexible circuit board 4 is bonded to the touch layer 2, such that the straight section of the second flexible circuit board 4 covers the protective structure 5. Then, an automated bending device can be used to bend the free ends of the first flexible circuit board 3 and the second flexible circuit board 4 to the back side of the display layer 1.

[0094] In some optional embodiments, the display module 100 further includes a shim block 6 disposed on the back side of the display layer 1 and located between the display layer 1 and the second flexible circuit board 4.

[0095] Optionally, during the bending process, the bending radius of the second flexible circuit board 4 is controlled to be greater than that of the first flexible circuit board 3, and the padding block 6 is attached to the inner side of the second flexible circuit board 4 during bending.

[0096] Among these improvements, the optimization of the flexible circuit board bending process enhanced the reliability and miniaturization capabilities of the display module. By controlling the bending angle and path, not only was the mechanical stability of the flexible circuit board ensured during bending, but the overall layout of the display module was also optimized, enabling efficient signal transmission within a limited space. Furthermore, the optimized bending process reduced the module's thickness, meeting the stringent space requirements of miniaturized products. By bending the bonding end of the flexible circuit board to the back of the display layer, the structural stability of the module was further enhanced, reducing the risk of damage from external impacts.

[0097] In some optional embodiments, the distance between the protective structure 5 and the display layer 1 on the side facing away from the display layer 1 is less than or equal to the distance between the touch layer 2 and the display layer 1 on the side facing away from the display layer 1.

[0098] In some alternative embodiments, the second flexible circuit board 4 covers a portion of the first flexible circuit board 3.

[0099] An embodiment of the third aspect of this application provides a display device, which includes the display module 100 provided in any embodiment of the first aspect. The display device provided in the embodiments of this application has all the beneficial effects of the display module 100 provided in the embodiments of this application. For details, please refer to the specific description of the display module 100 in the above embodiments, which will not be repeated here.

[0100] Furthermore, the display device can be a mobile phone, laptop computer, tablet computer, television, monitor, in-vehicle display device, wearable device, touch screen all-in-one machine, or conference screen, or any other device that needs to display content. Optionally, the display device can be a watch or bracelet among wearable devices.

[0101] Although this application has been described in conjunction with specific embodiments thereof, many substitutions, modifications and variations of these embodiments will be apparent to those skilled in the art from the foregoing description.

[0102] It should be noted that the above description describes some embodiments of this application. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in a different order than that shown in the above embodiments and still achieve the desired result. Furthermore, the processes depicted in the drawings do not necessarily require a specific or sequential order to achieve the desired result. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0103] This application is intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A display module, characterized in that, The display module includes: The display layer has a light-emitting side and a back side disposed opposite to each other, and the display layer includes a display area and a bonding area arranged along a first direction; A touch layer is disposed on the light-emitting side of the display layer; A first flexible circuit board, at least partially located on the side of the display layer facing the touch layer, is bonded to the bonding area; A protective structure is disposed on the side of the display layer facing the touch layer; the protective structure and the touch layer are arranged side by side along the first direction, and the protective structure and the first flexible circuit board are spaced apart along the second direction, the second direction intersecting the first direction; The second flexible circuit board is located on the same side of the display area as the first flexible circuit board. The second flexible circuit board is bonded to the touch layer. The second flexible circuit board is at least partially located on the side of the protective structure away from the display layer, and the second flexible circuit board covers at least a portion of the protective structure.

2. The display module according to claim 1, characterized in that, The distance between the surface of the protective structure facing away from the display layer and the display layer is smaller than the distance between the surface of the touch layer facing away from the display layer and the display layer. Alternatively, the distance between the surface of the protective structure facing away from the display layer and the display layer is equal to the distance between the surface of the touch layer facing away from the display layer and the display layer, and the surface of the protective structure facing away from the display layer is in contact with the surface of the second flexible circuit board facing the display layer.

3. The display module according to claim 1, characterized in that, The second flexible circuit board covers at least a portion of the first flexible circuit board.

4. The display module according to claim 1, characterized in that, The first flexible circuit board includes a first bonding end and a second bonding end disposed opposite to each other, and a first bending segment located between the first bonding end and the second bonding end. The first bonding end is bonded to the bonding area, and the second bonding end is bent to the back side of the display layer through the first bending segment. The second flexible circuit board includes a third bonding end and a fourth bonding end disposed opposite to each other, and a second bending segment located between the third bonding end and the fourth bonding end. The third bonding end is bonded to the touch layer, and the fourth bonding end is bent to the back side of the display layer through the second bending segment.

5. The display module according to claim 4, characterized in that, The display module also includes: A shim block, wherein the shim block is disposed between the display layer and the fourth binding end; The bending radius of the second bending segment is greater than that of the first bending segment.

6. The display module according to claim 1, characterized in that, The protective structure is made of high-strength materials or compression cushioning materials. The high-strength materials include polyethylene terephthalate or polyimide, and the compression cushioning materials include foam or silicone.

7. The display module according to claim 1, characterized in that, The display module also includes: A cover plate is disposed on the side of the touch layer opposite to the display layer; A polarizing layer is disposed between the display layer and the cover plate.

8. A method for manufacturing a display module, characterized in that, The method includes: A display layer is provided, the display layer having a light-emitting side and a back side disposed opposite to each other, the display layer including a display area and a bonding area arranged along a first direction; A touch layer is provided on the light-emitting side of the display layer; A first flexible circuit board and a protective structure are disposed on the side of the display layer facing the touch layer, so that the first flexible circuit board is bonded to the bonding area. The protective structure and the touch layer are disposed side by side along the first direction, and the protective structure and the first flexible circuit board are disposed at a distance along the second direction, the second direction intersecting the first direction. A second flexible circuit board is provided, such that the second flexible circuit board and the first flexible circuit board are located on the same side of the display area. The second flexible circuit board is bonded to the touch layer. The second flexible circuit board is at least partially located on the side of the touch layer opposite to the display layer, and the second flexible circuit board covers at least part of the protective structure.

9. The method for preparing a display module according to claim 8, characterized in that, The method also includes: The end of the first flexible circuit board away from the bonding area is bent to the back side of the display layer, and the end of the second flexible circuit board away from the touch layer is bent to the back side of the display layer.

10. A display device, characterized in that, Includes the display module as described in any one of claims 1-7.

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