Touch panel, display screen and display device

Abstract

The application provides a touch panel, a display screen and a display device, and belongs to the technical field of display screens. The touch panel comprises, from bottom to top, a packaging layer, a touch buffer layer, a stress buffer layer, a touch layer and a cover layer which are arranged in a stacked manner. The stress buffer layer comprises at least three buffer films arranged on the upper surface of the touch buffer layer in a stacked manner. A stress buffer hole is formed in each buffer film. The aperture of the stress buffer holes in the at least three buffer films gradually decreases from bottom to top, and the density of the stress buffer holes in the plurality of buffer films gradually increases from bottom to top. The touch layer is arranged on the upper surface of the stress buffer layer. The touch layer comprises first metal lines and second metal lines arranged in a cross manner. An insulating isolation layer is arranged between the first metal lines and the second metal lines. The stress buffer layer disperses and releases the concentrated stress generated by folding or curling, improves the anti-cracking ability of the touch layer, and prolongs the service life of the touch panel.

Description

Technical Field

[0001] This application belongs to the technical field of displays, and more specifically, relates to a touch panel, display screen and display device. Background Technology

[0002] In modern display technology, organic light-emitting diode (OLED) screens have attracted widespread attention due to their excellent display effects and flexibility. The touch stack structure of an OLED screen typically includes multiple layers, with the touch metal layer comprising cross-arranged first and second metal lines. These first and second metal lines are usually made of a titanium / aluminum / titanium (Ti / Al / Ti) composite material. This material combination is widely used due to its good electrical conductivity and mechanical properties.

[0003] However, for rollable or foldable OLED screens, the touch panel is prone to stress concentration during repeated folding or rolling, especially in bending areas or parts with large curvature. Because the material in these areas cannot effectively release stress, the long-term accumulated stress can cause cracks in the touch metal layer, disrupting the continuity of the touch layer and leading to touch function failure. Summary of the Invention

[0004] The purpose of this application is to provide a touch panel, a display screen, and a display device to solve the defect in the prior art that touch panels are prone to cracking and failure when rolled or folded.

[0005] To achieve the above objectives, in a first aspect, this application provides a touch panel, comprising:

[0006] Encapsulation layer;

[0007] A touch buffer layer is disposed on the upper surface of the encapsulation layer;

[0008] The stress buffer layer includes at least three buffer films stacked on the upper surface of the touch buffer layer. Each buffer film has a stress buffer hole. The diameter of the stress buffer holes on the at least three buffer films gradually decreases from bottom to top, and the density of the stress buffer holes on the multiple buffer films gradually increases from bottom to top.

[0009] A touch layer is disposed on the upper surface of the stress buffer layer. The touch layer includes a first metal line and a second metal line arranged in a cross pattern, and an insulating isolation layer is disposed between the first metal line and the second metal line.

[0010] A cover layer is disposed on the upper surface of the touch layer.

[0011] In some embodiments of the first aspect, the stress-relief holes on two adjacent buffer films are arranged with their orthographic projections on the upper surface of the encapsulation layer spaced apart or partially overlapping.

[0012] In some embodiments of the first aspect, the stress buffer holes are hexagonal in shape, and the plurality of stress buffer holes are arranged in a honeycomb pattern.

[0013] In some embodiments of the first aspect, the stress buffer holes are circular in shape, and a plurality of the stress buffer holes are arranged along a circumferential path of a plurality of concentric circles.

[0014] In some embodiments of the first aspect, the stress buffer holes are circular in shape, and a plurality of the stress buffer holes are arranged along a spiral path.

[0015] In some embodiments of the first aspect, the insulating layer is made of polyimide, polyethylene terephthalate, or acrylic resin.

[0016] In some embodiments of the first aspect, the touch panel further includes an organic silicone layer disposed between the stress buffer layer and the touch layer.

[0017] In some embodiments of the first aspect, the refractive index of the silicone layer gradually increases from bottom to top.

[0018] Secondly, this application provides a display screen, including a display panel and a touch panel as described in the first aspect and any alternative embodiments thereof, the touch panel being disposed on the upper surface of the display panel.

[0019] Thirdly, this application provides a display device including a display screen as described in the second aspect.

[0020] The beneficial effects of the touch panel, display screen and display device provided in this application are as follows: Compared with the prior art, by using multiple stacked buffer films and a gradient decreasing structure of pore size and density on the multiple buffer films, the concentrated stress generated when the touch panel is folded or rolled up can be effectively dispersed and released, thereby improving the crack resistance of the touch layer and having the advantages of improving touch reliability and extending service life. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1This is a schematic diagram of the display screen structure in an embodiment of this application;

[0023] Figure 2 This is an exploded view of the stress buffer layer in the embodiments of this application;

[0024] Figure 3 This is a schematic diagram of the structure of the buffer film in another embodiment of this application;

[0025] Figure 4 This is a schematic diagram of the structure of the buffer film in another embodiment of this application;

[0026] Figure 5 This is a partial view of the stress buffer layer in an embodiment of this application;

[0027] Figure 6 This is a schematic diagram of the display screen structure in an embodiment of this application.

[0028] The following are the labeling elements in the figure:

[0029] 10 - Touch panel; 20 - Display panel;

[0030] 100 - Encapsulation layer; 200 - Touch buffer layer; 300 - Stress buffer layer; 310 - Buffer film; 311 - Stress buffer hole; 310a - First buffer film; 310b - Second buffer film; 310c - Third buffer film; 400 - Silicone layer; 500 - Touch layer; 510 - First metal circuit; 520 - Second metal circuit; 530 - Insulating layer; 600 - Cover layer. Detailed Implementation

[0031] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0032] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0033] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0034] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0035] In traditional OLED touch panels, the first and second metal lines of the touch metal layer employ a Ti / Al / Ti stacked structure. When applied to rollable or foldable screens, the mechanical stress generated by repeated deformation in the bending area concentrates at the interface between the touch layer and the encapsulation layer. This stress accumulates in a gradient between the touch buffer layer and the touch layer, causing crack propagation in the metal lines at the location of maximum curvature, ultimately leading to touch signal interruption.

[0036] For example, in the folding area of ​​a flexible display, the touch panel is subjected to periodic mechanical loads during dynamic bending. Stress waves propagate upwards along the touch buffer layer and form local stress peaks in the touch layer. When the bending radius is less than 3 mm, the interfacial shear stress between the touch layer and the encapsulation layer exceeds the yield strength of the metal circuit, causing cracks to propagate along the grain boundaries of the first metal circuit. When the crack propagation path intersects with the second metal circuit, it triggers the fracture of the insulating isolation layer, forming a short circuit point and disrupting the continuity of user interaction.

[0037] To address the aforementioned technical problems, this application provides a touch panel 10, referring to... Figure 1 The touch panel 10 includes an encapsulation layer 100, a touch buffer layer 200, a stress buffer layer 300, a touch layer 500, and a cover layer 600 arranged sequentially from bottom to top.

[0038] The encapsulation layer 100 refers to the protective structural layer covering the surface of the touch panel 10, used to isolate the internal structure from physical damage and moisture penetration by the external environment. The encapsulation layer 100 can be a thin-film encapsulation (TFE) structure, and may include a first inorganic layer, an organic layer, and a second inorganic layer stacked together. The first and second inorganic layers may be silicon nitride (SiN).x The inorganic layers consist of aluminum oxide (Al2O3), with the first and second inorganic layers having a thickness of 0.1-1 μm. These layers are formed through atomic layer deposition (ALD) or chemical vapor deposition (CVD) to provide a highly dense water and oxygen barrier. The organic layer can be polyimide or acrylic resin, with a thickness of 5-20 μm. It is applied by spin coating or spraying to cover defects in the inorganic layer and to buffer mechanical stress.

[0039] The touch buffer layer 200 is an intermediate transition layer disposed above the encapsulation layer 100. It can be made of polyurethane or silicone-based materials and is used to reduce the mechanical stress transmission between the touch layer 500 and the encapsulation layer 100. Optionally, the touch buffer layer 200 is made of silicone material and has a thickness of 10 μm.

[0040] The stress buffer layer 300 is used to disperse and release the stress generated during the folding or rolling of the touch panel 10. The stress buffer layer 300 includes at least three buffer films 310 stacked on the upper surface of the touch buffer layer 200. Each buffer film 310 has a stress buffer hole 311. The diameter of the stress buffer holes 311 on the at least three buffer films 310 gradually decreases from bottom to top, and the density of the stress buffer holes 311 on the multiple buffer films 310 gradually increases from bottom to top.

[0041] The buffer film 310 is an elastic material with a certain thickness, which can be made of polyimide (PI), polydimethylsiloxane (PDMS), or thermoplastic polyurethane (TPU). The thickness of each buffer film 310 is 5-15 μm. The stress buffer hole 311 refers to the through-hole structure that penetrates the film, which can be formed by laser etching or photolithography, and is used to provide deformation space during bending to release local stress.

[0042] The stress buffer layer 300 contains at least three buffer films 310. In this embodiment, refer to... Figure 2 The stress buffer layer 300 includes three buffer films 310, which are, from bottom to top, a first buffer film 310a, a second buffer film 310b, and a third buffer film 310c. Optionally, the first buffer film 310a has a thickness of 5 micrometers and stress buffer holes 311 on it have a diameter of 10 micrometers; the second buffer film 310b has a thickness of 3 micrometers and stress buffer holes 311 on it have a diameter of 5 micrometers; the third buffer film 310c has a thickness of 2 micrometers and stress buffer holes 311 on it have a diameter of 2 micrometers.

[0043] The touch layer 500 refers to a functional layer containing cross-arranged metal lines. The touch layer 500 includes a first metal line 510 and a second metal line 520 arranged in a cross-arranged manner, with an insulating layer 530 disposed between the first metal line 510 and the second metal line 520. The first metal line 510 and the second metal line 520 are implemented using a titanium / aluminum / titanium laminated metal, and electrical signal isolation is achieved through the insulating layer 530. The insulating material can be polyimide or acrylic resin.

[0044] The cover layer 600 is a transparent protective layer on the surface of the touch layer 500, used to further protect the touch layer 500 from damage caused by the external environment. The cover layer 600 can be made of transparent materials such as silicone, optical adhesive (OCA), or polyethylene terephthalate (PET), with a thickness of 5-20 μm. The cover layer 600 not only has excellent light transmittance, but also effectively buffers external mechanical stress, improving the overall durability of the touch panel 10.

[0045] The cover layer 600 can also adopt a combined structure of inorganic and organic components. Both the inorganic and organic components extend along the folding direction of the touch panel and are arranged alternately perpendicular to the folding direction. The orthographic projection of the inorganic component on the encapsulation layer 100 overlaps with the orthographic projection of the first metal line 510 on the encapsulation layer 100, meaning that at least a portion of the inorganic component is located on the side of the first metal line 510 away from the encapsulation layer 100. This improves the insulation effect between the first metal line 510 and the second metal line 520, preventing short circuits.

[0046] The organic portion and the orthographic projection of the first metal line 510 on the encapsulation layer 100 may overlap or not overlap. When the orthographic projections of the organic portion and the first metal line 510 on the encapsulation layer 100 do not overlap, the inorganic portion may cover the side end face of the first metal line 510.

[0047] In the touch panel 10, a stress buffer layer 300 is provided, comprising multiple layers of buffer films 310. The gradient pore size and increasing density design of the multiple buffer films 310 disperses stress layer by layer during bending or rolling, preventing excessive stress concentration in a single area. Simultaneously, the porous structure provides deformation buffer space, reducing the risk of breakage of the touch layer 500 metal circuitry due to stress accumulation. Specifically, the large-aperture stress buffer holes 311 on the lower buffer film 310 absorb most of the stress, while the small-aperture, high-density stress buffer holes 311 on the upper buffer film 310 further disperse the remaining stress. This gradient design avoids abrupt stress changes between layers, effectively preventing cracking of the touch layer 500. Furthermore, the arrangement of the pore structure in the buffer film 310 reduces the diffraction effect at the edges of the metal circuitry, minimizing optical interference with the OLED display layer.

[0048] On multiple buffer films 310, the shape of the stress buffer hole 311 can be any shape such as circular, elliptical, rectangular, or regular polygon, and the arrangement of the multiple stress buffer holes 311 on each buffer film 310 can be adapted to its shape.

[0049] Reference Figure 2 In one example, the stress buffer hole 311 is hexagonal in shape, and multiple stress buffer holes 311 are arranged in a honeycomb pattern.

[0050] The regular hexagonal structure forms a close-packed arrangement without gaps in the planar space, with the edges of adjacent holes perfectly aligned by the hexagonal edges. In the honeycomb arrangement, each hole is symmetrically distributed with six adjacent holes at a 60-degree angle, and the center-to-center distance between holes is equal to twice the side length of the regular hexagon. This arrangement, combined with the projected intervals or partial overlap of adjacent buffer films 310, creates a three-dimensional staggered structure for the stress relief areas of different hole layers.

[0051] Specifically, when the touch panel 10 is subjected to bending stress, the honeycomb-shaped hexagonal holes evenly distribute the concentrated stress to six directions through geometric symmetry. The six edges of each hole form a continuous stress transmission path, avoiding local stress accumulation. In the multi-layer structure, the small-diameter holes in the upper layer and the large-diameter holes in the lower layer form a gradient stress reduction zone in the vertical direction. The regularity of the honeycomb arrangement ensures that the holes in each layer are strictly aligned or misaligned, eliminating the superposition of interlayer stress.

[0052] The hexagonal shape allows the stress-buffering holes 311 to be tightly arranged on the buffer film 310, improving the stress-buffering effect. The honeycomb arrangement allows stress to be evenly distributed in multiple directions, further enhancing the stress-buffering effect. Furthermore, the design of the stress-buffering holes 311, with their diameter gradually decreasing and density gradually increasing from bottom to top, allows stress to be released gradually from bottom to top, avoiding localized damage caused by sudden stress release. The stress-buffering holes 311 on adjacent buffer films 310 are spaced apart on the orthographic projection of their projections onto the upper surface of the encapsulation layer 100, further improving the stress-buffering effect. Therefore, the touch panel 10 of this application can effectively prevent the touch layer 500 from cracking when repeatedly folded or rolled, improving the service life and reliability of the touch panel 10.

[0053] Reference Figure 3 In another example, the stress buffer hole 311 is circular in shape, and multiple stress buffer holes 311 are arranged along the circumferential path of multiple concentric circles.

[0054] The stress buffer holes 311 are circular in shape, and multiple stress buffer holes 311 are arranged along the circumference of multiple concentric circles. Specifically, multiple circular stress buffer holes 311 can be provided on each buffer film 310, and these stress buffer holes 311 are arranged in a concentric circle manner. For example, three concentric circles can be provided, and several circular stress buffer holes 311 can be evenly distributed on the circumference of each concentric circle. This forms a regular circular arrangement structure, which is beneficial for the uniform distribution and release of stress.

[0055] Through the above technical solution, this application can effectively alleviate the stress concentration problem of the touch panel 10 during bending or rolling. The circular stress buffer holes 311 are arranged along a concentric circumferential path, which can evenly distribute stress in all directions and avoid excessive stress concentration in a specific direction. At the same time, this arrangement also helps to improve the overall structural stability of the touch panel 10 and reduce the risk of cracking of the touch layer 500. Furthermore, the circular hole design can reduce stress concentration points, further improving the durability and service life of the touch panel 10.

[0056] Reference Figure 4 In another example, the stress buffer hole 311 is circular in shape, and multiple stress buffer holes 311 are arranged along a spiral path.

[0057] The spiral path arrangement covers the surface of the buffer film 310 with a continuous curved trajectory, forming stress dispersion channels without a fixed direction. The circular hole structure eliminates local stress concentration in sharp corner areas, and the curvature variation of the spiral path adapts to stress transmission in different directions. The starting angle of the spiral path of adjacent buffer films 310 can be set to different values, so that the positions of the holes in the upper and lower layers are staggered in the projection direction. The spacing parameter of the spiral path is set to 0.1-0.5 mm, and the hole diameter is controlled in the range of 10-50 μm. This combination of parameters can achieve a balance between stress dispersion and structural strength.

[0058] Specifically, when the touch panel 10 is subjected to bending, the circular holes arranged in a spiral path achieve stress buffering in the following way: when the bending force is applied to the buffer film 310, the continuous curve of the spiral path guides the stress to be dispersed in multiple directions, avoiding stress concentration along a straight path. The uniform curvature of the edges of the circular holes makes the stress distribution symmetrical, eliminating stress concentration points at the sharp corners of the polygonal holes.

[0059] Different spiral paths of the 310 layers of buffer films are set with different rotation angles to form three-dimensional interlaced stress release channels. When the upper layer holes are arranged in a clockwise spiral, the lower layer holes can be arranged in a counterclockwise spiral. This cross arrangement makes the hole projections of adjacent film layers form a dynamic coverage area. During bending, the hole structure of each spiral path absorbs stress components in different directions in stages. Through the curvature change of the spiral line, the linear stress is transformed into multi-directional dispersed small deformations, effectively preventing excessive stress accumulation in a single direction.

[0060] When external bending stress is applied to the touch panel 10, the circular holes arranged in a spiral path guide the stress to be dispersed and transmitted along the spiral tangent direction through multi-directional curvature changes. The spiral arrangement with phase difference between adjacent layers causes the stress to form a wave-like diffusion path in the vertical direction, avoiding excessive stress accumulation in a single axis. The uniform curvature of the circular hole edges further reduces the stress gradient at the hole wall. The decreasing hole diameter and increasing hole density in the spiral expansion direction complement each other, achieving layer-by-layer stress attenuation while ensuring structural strength.

[0061] By designing the stress buffer holes 311 as circular and arranging them along a spiral path, the distribution of the stress buffer holes 311 can be made more uniform, avoiding the generation of stress concentration points. At the same time, the spirally arranged circular stress buffer holes 311 can better disperse and release the stress generated by the touch panel 10 during bending or rolling, further improving the flexibility and durability of the touch panel 10.

[0062] It is understandable that the shape and arrangement of the stress-reducing holes 311 on each buffer film 310 can be the same or different. For example, one buffer film 310 can use a honeycomb arrangement of hexagonal holes, while another buffer film 310 can use a concentric circle arrangement of circular holes or a spiral path arrangement. The mixed arrangement method can flexibly adjust the shape and arrangement of the stress-reducing holes 311 according to different parts of the touch panel 10 and the expected bending stress distribution to achieve the best stress-reducing effect.

[0063] Through the above-described solution, this application can effectively alleviate the stress concentration problem of the touch panel 10 during bending or rolling, preventing cracking of the touch layer 500 and touch function failure. The multi-layer stress buffer structure can absorb and disperse stress step by step, extending the service life of the touch panel 10. Simultaneously, the special design of the stress buffer hole 311 can reduce optical interference between the metal lines of the touch layer 500 and the OLED display layer, improving display transmittance and color reproduction accuracy. Furthermore, the stress buffer layer 300 can also prevent the encapsulation layer 100 from peeling off, avoiding moisture or oxygen penetration into the display panel and improving device stability.

[0064] Furthermore, the stress buffer holes 311 on two adjacent buffer films 310 are arranged with intervals or partial overlaps on the orthographic projection of the upper surface of the encapsulation layer 100.

[0065] Specifically, refer to Figure 3 The staggered arrangement means that the pore projection of the upper buffer film 310 completely avoids the pore projection area of ​​the lower layer, forming a misaligned distribution; the partial overlap arrangement means that the pore projections of the upper and lower layers overlap, but do not completely cover each other. The pore size of adjacent buffer films 310 gradually decreases from bottom to top, while the density gradually increases from bottom to top. This arrangement creates a complementary structure between the small-diameter, high-density pores in the upper layer and the large-diameter, low-density pores in the lower layer.

[0066] For example, the orthographic projections of the stress-buffering holes 311 on the first buffer film 310a and the stress-buffering holes 311 on the second buffer film 310b onto the upper surface of the encapsulation layer 100 can be completely staggered, forming an intermittent arrangement. Alternatively, the orthographic projections of the stress-buffering holes 311 on the first buffer film 310a and the stress-buffering holes 311 on the second buffer film 310b onto the upper surface of the encapsulation layer 100 can partially overlap. This arrangement allows the stress-buffering holes 311 to be staggered among the different buffer films 310, increasing the stress-buffering effect.

[0067] By setting spaced or partially overlapping stress buffer holes 311 on adjacent buffer films 310, a more uniform and effective stress buffer structure is formed, which can better disperse and absorb the stress generated during bending or rolling of the touch panel 10, preventing the touch layer 500 from cracking due to stress concentration. At the same time, the staggered distribution of stress buffer holes 311 can also reduce optical interference and improve display transmittance.

[0068] Furthermore, in the touch layer 500, an insulating layer 530 is used to isolate the first metal line 510 and the second metal line 520. The insulating layer 530 can be made of polyimide, polyethylene terephthalate, or acrylic resin. Polyimide, polyethylene terephthalate, or acrylic resin are all organic materials, which can further enhance the flexibility of the touch layer 500.

[0069] Specifically, the polyimide material has a Young's modulus of less than 1.5 GPa, and its coefficient of thermal expansion matches the titanium-aluminum composite material of the metal circuit with an error of less than 15%, allowing for synchronous deformation during bending. Polyethylene terephthalate has an elongation at break exceeding 120%, maintaining a continuous film structure even with a curl radius of less than 3 mm. Acrylic resin achieves an adhesion strength of 8 N / cm. 2 It can effectively bond intersecting metal lines.

[0070] When the touch layer 500 is subjected to bending stress, polyimide absorbs deformation energy through the slippage of its molecular chains, and its matching coefficient of thermal expansion prevents interfacial delamination with the metal circuitry. The high ductility of polyethylene terephthalate (PET) allows for a gradual thickness distribution in the bending region, with the thickness gradient controlled within 0.05 μm per micrometer. Acrylic resin maintains the contact integrity between the insulating layer and the metal circuitry through intermolecular forces, resulting in an interfacial delamination area of ​​less than 0.5% after 10^6 bending tests. The material's optical anisotropy is below 0.02, reducing transmittance loss due to optical interference from 8% in conventional materials to less than 2%, with polyimide exhibiting an extinction coefficient of less than 0.01 at 550 nm.

[0071] Optionally, the insulating layer 530 is made of polyimide. The insulating layer 530 is prepared using polyimide material, and the specific preparation process may include the following steps:

[0072] The polyimide raw material is dissolved in an organic solvent to form a polyimide solution;

[0073] The polyimide solution is uniformly coated onto the first metal line 510 using a coating device;

[0074] The substrate coated with polyimide solution is placed in an oven for drying to evaporate the solvent and form a cured polyimide insulating layer 530.

[0075] A second metal circuit 520 is fabricated on the polyimide insulating layer 530 to complete the preparation of the touch layer 500.

[0076] Through the above technical solution, due to the excellent insulation, heat resistance, and mechanical strength of polyimide material, using polyimide as the insulating layer 530 material can effectively prevent short circuits between the first metal line 510 and the second metal line 520, improving the reliability of the touch panel 10. Simultaneously, polyimide material also has good flexibility, which can adapt to stress changes during bending or rolling of the touch panel 10, reducing the risk of cracking of the insulating layer 530 and thus improving the service life of the touch panel 10. Furthermore, the good light transmittance of polyimide material can reduce the impact on display effects and improve the overall performance of the touch panel 10.

[0077] In some embodiments, the touch panel 10 further includes an organic silicone layer 400 disposed between the stress buffer layer 300 and the touch layer 500. The organic silicone layer 400 is made of silicone material and is used to transfer stress and eliminate optical interference between the touch layer 500 and the display panel 20, thereby improving the display transmittance of the touch panel 10.

[0078] Specifically, the silicone layer 400 can be made of liquid silicone material, which is applied to the surface of the stress buffer layer 300 by coating, spin coating, or other methods, and then cured. Thus, the silicone layer 400 can fill the unevenness on the surface of the stress buffer layer 300, providing a smooth surface for the subsequent formation of the touch layer 500.

[0079] Furthermore, the refractive index of the silicone layer 400 gradually increases from bottom to top. Specifically, the silicone layer 400 consists of multiple sublayers with different refractive indices, and the refractive index changes between the sublayers are achieved through continuous or stepwise gradients. Adjacent sublayers are connected by chemical cross-linking or physical bonding. For example, the refractive index of the bottom layer is close to that of the stress buffer layer 300, the refractive index of the middle layer is between that of the bottom layer and the touch layer 500, and the refractive index of the top layer matches that of the insulating isolation layer 530 of the touch layer 500. The refractive index gradient can be achieved by adjusting the concentration or type of nanoparticles in the silicone material; for example, the bottom layer is doped with low-refractive-index silica particles, and the top layer is doped with high-refractive-index titanium dioxide particles.

[0080] When light enters the silicone layer 400 from the stress buffer layer 300, the refractive index of the bottom layer is similar to that of the stress buffer layer 300, reducing reflection at the interface. As light propagates upwards, the refractive index of each layer gradually increases, reducing the difference in refractive index as light propagates between layers and suppressing reflection. Finally, when the light reaches the touch layer 500, the refractive index of the top layer matches that of the insulating isolation layer 530 of the touch layer 500, further reducing interface reflection. The continuously varying refractive index distribution allows for a smooth transition of light through the multi-layer structure, reducing cumulative reflection effects and thus improving the transmittance of the display panel 20.

[0081] Optionally, the refractive index of the silicone layer 400 gradually increases from 1.45 at the bottom to 1.65 at the top, forming a non-abrupt interface with the polyimide insulating layer with a refractive index of 1.65.

[0082] In summary, the touch panel 10 provided in this application includes, from bottom to top, an encapsulation layer 100, a touch buffer layer 200, a stress buffer layer 300, an silicone layer 400, a touch layer 500, and a cover layer 600. The stress buffer layer 300 includes at least three buffer films 310 stacked on the upper surface of the touch buffer layer 200. Each buffer film 310 has stress buffer holes 311. The aperture of the stress buffer holes 311 on the at least three buffer films 310 gradually decreases from bottom to top, and the density of the stress buffer holes 311 on the multiple buffer films 310 gradually increases from bottom to top. Through the special design of the stress buffer layer 300, the stress of the touch panel 10 can be effectively dispersed and absorbed when bent or rolled. The variation in aperture and density of the stress buffer holes 311 forms a gradient stress buffer structure, which can better adapt to stress changes of different directions and magnitudes. This design not only improves the flexibility and durability of the touch panel 10, but also ensures the stability and reliability of the touch function. The touch layer 500 includes a first metal line 510 and a second metal line 520 arranged in a cross pattern. An insulating layer is disposed between the first metal line 510 and the second metal line 520. The insulating layer is made of organic material to further enhance the flexibility and durability of the touch layer 500. The silicone layer 400 can effectively transfer stress and reduce optical interference between the touch layer 500 and the display panel 20, improving the overall display effect of the touch panel 10. The softness and elasticity of the silicone layer 400 allow it to adapt to the deformation of the touch panel 10 during bending or rolling, ensuring a tight fit between the touch layer 500 and the display panel 20 and avoiding touch failure or display abnormalities caused by stress concentration.

[0083] Secondly, embodiments of this application also provide a display screen, referring to... Figure 6 The display screen includes a display panel 20 and a touch panel 10 provided in the first aspect embodiment, the touch panel 10 being disposed on the upper surface of the display panel 20. The display panel 20 is used to provide image display functions, and the touch panel 10 is used to implement touch operations and alleviate bending stress.

[0084] The touch panel 10 includes an encapsulation layer 100, a touch buffer layer 200, a stress buffer layer 300, a touch layer 500, and a cover layer 600. The stress buffer layer 300 includes at least three stacked buffer films 310, each buffer film 310 having stress buffer holes 311 formed therein. The hole diameter of the buffer films 310 gradually decreases from bottom to top, while the density gradually increases. The touch layer 500 includes first metal lines 510 and second metal lines 520 arranged in a cross pattern, with an insulating layer 530 disposed between them. The touch panel 10 may also include an silicone layer 400 disposed between the stress buffer layer 300 and the touch layer 500, with its refractive index gradually increasing from bottom to top.

[0085] Specifically, the display device disperses the stress generated by bending or rolling through the multi-layer structure of the touch panel 10. When the display device undergoes bending, the multiple buffer films 310 of the stress buffer layer 300 absorb and disperse the stress step by step through stress buffer holes 311 with different apertures and densities, preventing stress concentration from causing the touch layer 500 to crack. The intersecting metal lines in the touch layer 500 achieve signal transmission through the insulating isolation layer 530, while reducing the risk of short circuits between lines. Furthermore, the presence of an organic silicone layer 400 between the stress buffer layer 300 and the touch layer 500 can further alleviate the stress generated by bending or rolling the touch panel 10, reducing the impact of stress concentration on the touch layer 500. The organic silicone layer 400 has good elasticity and cushioning properties, which can absorb and disperse stress, preventing stress from being directly transmitted to the touch layer 500, thereby reducing the risk of the touch layer 500 cracking.

[0086] As a preferred embodiment, the solution of this application is specifically implemented as follows: the display panel 20 and the touch panel 10 are fully bonded together by an optical adhesive layer. The lower surface of the encapsulation layer 100 of the touch panel 10 is fixedly connected to the upper surface of the display panel 20. The upper surface of the cover layer 600 of the touch panel 10 is further coated with an anti-fingerprint coating. The stress buffer layer 300 of the touch panel 10 is composed of three polyimide (PI) buffer films 310, and the stress buffer holes 311 of each buffer film 310 are distributed in a honeycomb pattern when projected in the vertical direction. In the touch layer 500, the first metal line 510 and the second metal line 520 together form a metal touch grid, and polyimide is used as an insulating isolation layer 530 between the first metal line 510 and the second metal line 520. An organic silicone layer 400 is filled between the stress buffer layer 300 and the touch layer 500 of the touch panel 10 with a gradient refractive index structure.

[0087] Through the above technical solution, this application achieves stress dispersion and optical path control through a composite layered structure. During the bending process of the touch panel 10, the stress buffer holes 311 with gradient apertures and the honeycomb arrangement form a multi-level stress release path, avoiding cracks in the metal circuit due to stress concentration. The silicone layer 400 with gradient refractive index can adapt to the optical parameters of different media, eliminate optical interference between the metal circuit and the display panel 20, and keep the light transmittance stable, thereby maintaining the reliability of the touch function in the folded or rolled state.

[0088] Thirdly, embodiments of this application also provide a display device, including the display screen described in the second aspect embodiment. The display device can be a smartphone, tablet, laptop, wearable device, or automotive display, etc. By employing the aforementioned display screen structure, these display devices not only achieve high-quality image display but also improve the sensitivity and durability of touch operation. Especially when bent or rolled, the display screen maintains stable touch functionality and high display transmittance, providing users with a good user experience. Furthermore, the display device has a compact structural design and strong connections between layers, effectively preventing the penetration of moisture and oxygen, thus improving the stability and lifespan of the device.

[0089] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A touch panel, characterized in that, include: Encapsulation layer (100); A touch buffer layer (200) is disposed on the upper surface of the encapsulation layer (100); The stress buffer layer (300) includes at least three buffer films (310) stacked on the upper surface of the touch buffer layer (200). Each buffer film (310) has a stress buffer hole (311). The diameter of the stress buffer hole (311) on the at least three buffer films (310) gradually decreases from bottom to top, and the density of the stress buffer hole (311) on the multiple buffer films (310) gradually increases from bottom to top. A touch layer (500) is disposed on the upper surface of the stress buffer layer (300). The touch layer (500) includes a first metal line (510) and a second metal line (520) arranged in a cross pattern. An insulating isolation layer (530) is disposed between the first metal line (510) and the second metal line (520). A cover layer (600) is disposed on the upper surface of the touch layer (500).

2. The touch panel according to claim 1, characterized in that, The stress buffer holes (311) on two adjacent buffer films (310) are arranged with their orthogonal projections on the upper surface of the encapsulation layer (100) spaced apart or partially overlapping.

3. The touch panel according to claim 2, characterized in that, The stress buffer hole (311) is hexagonal in shape, and the multiple stress buffer holes (311) are arranged in a honeycomb pattern.

4. The touch panel according to claim 2, characterized in that, The stress buffer hole (311) is circular in shape, and the multiple stress buffer holes (311) are arranged along the circumferential path of multiple concentric circles.

5. The touch panel according to claim 2, characterized in that, The stress buffer hole (311) is circular in shape, and a plurality of the stress buffer holes (311) are arranged along a spiral path.

6. The touch panel according to any one of claims 1-5, characterized in that, The insulating layer (530) is made of polyimide, polyethylene terephthalate, or acrylic resin.

7. The touch panel according to any one of claims 1-5, characterized in that, The touch panel (10) also includes an organic silicone layer (400) disposed between the stress buffer layer (300) and the touch layer (500).

8. The touch panel according to claim 7, characterized in that, The refractive index of the silicone layer (400) gradually increases from bottom to top.

9. A display screen, characterized in that, It includes a display panel (20) and a touch panel as claimed in any one of claims 1-8, wherein the touch panel (10) is disposed on the upper surface of the display panel (20).

10. A display device, characterized in that, Includes the display screen as described in claim 9.

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