Thermal property verification system and thermal property verification method

Abstract

The present disclosure provides a thermal characteristic verification system and method, which comprises a plurality of electronic devices under test, a plurality of temperature sensors and a management server. The temperature sensors are arranged between the electronic devices under test, and each of the temperature sensors is configured to generate ambient temperature data. The management server commands each of the electronic devices under test to perform a heat dissipation test and a plurality of workload tests in a staggered manner according to a predetermined sequence, and receives component temperature data and ambient temperature data in real time. The management server comprehensively determines whether the test is successful according to the component temperature data and the ambient temperature data. The present disclosure solves the problems of mutual interference of heat transfer, unreasonable test process and inaccurate temperature sampling in the conventional test by monitoring the change of ambient temperature, optimizing the test process and using the cumulative moving average method to sample the temperature, thereby improving the accuracy and efficiency of thermal characteristic verification.

Description

Technical Field

[0001] This disclosure relates to the field of electronic device testing technology, and in particular to a thermal characteristic verification system and method for portable electronic devices such as laptops. Background Technology

[0002] With the widespread use of portable electronic devices such as laptops, the requirements for device performance and stability are becoming increasingly stringent. In these electronic devices, core components such as the central processing unit (CPU) and graphics processing unit (GPU) generate a significant amount of heat during operation, requiring timely cooling systems to dissipate it and ensure the normal operation and lifespan of the device.

[0003] In traditional production testing environments, to save space and facilitate deployment, multiple laptops under test are typically placed densely on a burn-in rack and connected to a server via a multiplexer for centralized testing. The testing process generally includes: the laptop under test obtains an IP address from the DHCP server and enters PXE Boot mode; it then uses the WDS service to download a WinPE image and boots into PE mode; the system image file is installed using the MDT automated deployment program; and finally, thermal and heat dissipation tests are performed.

[0004] However, this traditional approach has several problems: First, the electronic devices under test are too close to each other, and heat transfer will inevitably affect each other. An abnormal temperature in one device may cause abnormalities in the surrounding normally functioning devices. Second, in order to save testing time, heat dissipation testing is usually performed first and then heat dissipation testing. However, in reality, most abnormalities occur in the heat dissipation testing stage, and this testing sequence is not reasonable. Finally, the traditional approach uses a periodic temperature sampling method, which may miss important temperature thresholds and affect the accuracy of the test. Summary of the Invention

[0005] The purpose of this disclosure is to provide a thermal characteristic verification system and method that solves problems such as mutual interference of heat transfer, unreasonable test procedures, and inaccurate temperature sampling in traditional tests by monitoring changes in ambient temperature, optimizing test procedures, and improving temperature sampling methods.

[0006] One or more embodiments of the present invention provide a thermal characteristic verification system, the system comprising: a plurality of electronic devices under test (DUTs), each DUT having at least one central processing unit (CPU) and at least one image processor (GPU); a plurality of temperature sensors disposed among the plurality of DUTs, each temperature sensor being used to generate a plurality of ambient temperature data; and a management server communicatively connected to the plurality of DUTs and the plurality of temperature sensors, for: commanding each DUT to perform a heat dissipation test and a plurality of workload tests in a predetermined sequence; receiving, in real time, a plurality of component temperature data and the plurality of ambient temperature data of each DUT during the execution of the heat dissipation test and the plurality of workload tests; and determining, based on the plurality of component temperature data and the plurality of ambient temperature data, whether the plurality of workload tests of each DUT are successful.

[0007] In one or more embodiments of this disclosure, two adjacent electronic devices under test are spaced at a predetermined horizontal distance, and each temperature sensor is positioned at the midpoint of the predetermined horizontal distance, so that the influence of the two adjacent electronic devices under test on the plurality of ambient temperature data is below a predetermined threshold.

[0008] In one or more embodiments of this disclosure, the plurality of workload tests include: a processor load test of the at least one central processing unit; an image processor load test of the at least one image processor; and a combined load test of the at least one central processing unit and the at least one image processor.

[0009] In one or more embodiments of this disclosure, the predetermined order is, in sequence, any one of the processor load test, the image processor load test, and the comprehensive load test; the thermal test; another of the processor load test, the image processor load test, and the comprehensive load test; the thermal test; and one of the processor load test, the image processor load test, and the comprehensive load test that has not yet been performed.

[0010] In one or more embodiments of this disclosure, each of the electronic devices under test includes a fan, wherein when the heat dissipation test is performed, each of the electronic devices under test is further configured to: set an initial speed of the fan; start the fan after waiting for a first predetermined time; read the actual fan speed after waiting for a second predetermined time; and compare the actual fan speed with a preset speed mapping table.

[0011] In one or more embodiments of this disclosure, the temperature data of each component is a cumulative average temperature value, which is calculated by the following formula:

[0012]

[0013] Among them, MA n x is the cumulative average temperature value. n The current temperature value is given, n is the number of samples, and MA is the maximum temperature. n-1 This is the previous cumulative average temperature value.

[0014] One or more embodiments of this disclosure also provide a thermal characteristic verification method applicable to a thermal characteristic verification system including multiple electronic devices under test (DUTs), multiple temperature sensors, and a management server. The method includes: generating multiple ambient temperature data via each of the multiple temperature sensors; commanding each DUT to perform a heat dissipation test and multiple workload tests in a predetermined sequence via the management server; receiving multiple component temperature data and the multiple ambient temperature data of each DUT in real time via the management server while the heat dissipation test and the multiple workload tests are being performed; and determining, based on the multiple component temperature data and the multiple ambient temperature data, whether the multiple workload tests of each DUT are successful via the management server.

[0015] Compared with the prior art, this disclosure has the following beneficial effects:

[0016] By placing temperature sensors between the electronic devices under test to monitor the ambient temperature, test anomalies caused by environmental factors can be effectively identified, thereby improving test accuracy.

[0017] By adopting an interleaved approach to thermal management and workload testing, the testing process has been optimized and is more in line with actual usage conditions.

[0018] Using the cumulative moving average method to sample temperature data makes temperature sampling smoother and more accurate, and can better reflect the true thermal characteristics of the equipment.

[0019] Through the above technical solutions, the thermal characteristic verification system and method provided in this disclosure can effectively solve the problems existing in traditional testing and improve the accuracy and efficiency of thermal characteristic verification of electronic devices. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the system architecture of a thermal characteristic verification system according to an embodiment of the present disclosure;

[0021] Figure 2 This is a block diagram of a management server according to an embodiment of the present disclosure;

[0022] Figure 3 This is a block diagram of an electronic device under test according to an embodiment of the present disclosure;

[0023] Figure 4 This is a flowchart illustrating a thermal characteristic verification method according to an embodiment of the present disclosure;

[0024] Figure 5 This is a schematic diagram illustrating a safe distance test according to an embodiment of the present disclosure.

[0025] Explanation of reference numerals in the attached figures

[0026] 10: Thermal Characteristic Verification System

[0027] 100: Management Server

[0028] 110: Processor

[0029] 120: Storage device

[0030] 121: Database

[0031] 122: Network Service Module

[0032] 123: System Deployment Module

[0033] 124: Resource Scheduling Module

[0034] 125: Test Result Judgment Module

[0035] 130: Communication circuit unit

[0036] 200,200(1)-200(N): Electronic device under test

[0037] 210: Central Processing Unit

[0038] 220: Storage device

[0039] 230: Communication circuit unit

[0040] 240: Image Processor

[0041] 250: Heat dissipation unit

[0042] 260(1), 260(2): Component temperature sensor

[0043] 300(1)-300(N-1): Temperature sensor

[0044] L1: Predetermined horizontal distance Detailed Implementation

[0045] Reference will now be made in detail to exemplary embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same element references are used in the drawings and description to denote the same or similar parts.

[0046] Figure 1 This is a schematic diagram of the system architecture of a thermal characteristic verification system according to an embodiment of the present disclosure.

[0047] Reference Figure 1 In one embodiment, the thermal characteristic verification system 10 includes a plurality of electronic devices under test 200(1) to 200(N), a plurality of temperature sensors 300(1) to 300(N-1), and a management server 100.

[0048] In one embodiment, the plurality of electronic devices under test 200(1) to 200(N) may be laptops, tablets or other portable electronic devices, each of the electronic devices under test having at least one central processing unit and at least one image processor for performing various software applications and processing tasks.

[0049] In one embodiment, a plurality of temperature sensors 300(1) to 300(N-1) are disposed between the plurality of electronic devices under test (DUTs), each of the temperature sensors generating multiple ambient temperature data. Specifically, two adjacent DUTs (e.g., DUTs 200(1) and 200(2)) are disposed at a predetermined horizontal distance L1, and each temperature sensor (e.g., temperature sensor 300(1)) is disposed at the midpoint of the predetermined horizontal distance L1, i.e., the so-called predetermined monitoring position. This arrangement allows the temperature sensors to accurately capture the ambient temperature without being excessively affected by the heat of any adjacent DUT.

[0050] In one embodiment, a management server 100 is communicatively connected to the electronic devices under test (DUT) 200(1) to 200(N) and temperature sensors 300(1) to 300(N-1) for managing and coordinating the entire testing process. Specifically, the management server 100 is used to: command each DUT to perform heat dissipation tests and multiple workload tests in a predetermined sequence; receive multiple component temperature data and multiple ambient temperature data of each DUT in real time while the heat dissipation tests and multiple workload tests are being performed; and determine whether the multiple workload tests of each DUT are successful based on the multiple component temperature data and multiple ambient temperature data.

[0051] Figure 2 This is a block diagram of a management server according to an embodiment of the present disclosure.

[0052] Reference Figure 2 In one embodiment, the management server 100 of this disclosure includes a processor 110, a storage device 120, and a communication circuit unit 130.

[0053] The processor 110 is electrically connected to the storage device 120 and the communication circuit unit 130 to execute multiple program code modules stored in the storage device 120, thereby controlling the overall operation of the thermal characteristic verification system.

[0054] The storage device 120 includes a database 121, a network service module 122, a system deployment module 123, a resource scheduling module 124, and a test result judgment module 125.

[0055] Specifically, database 121 is used to store component temperature data from multiple electronic devices under test and ambient temperature data generated by multiple temperature sensors in real time. This data can be read by other modules for further processing or analysis.

[0056] The network service module 122 assigns a network address to each device under test (DUT) and is responsible for enabling data communication between the management server 100 and multiple DUTs and temperature sensors. This includes receiving component temperature data uploaded by the DUTs and ambient temperature data uploaded by the temperature sensors. Furthermore, the network service module 122 can send control commands to the DUTs to perform thermal testing or workload testing, enabling remote interaction with the DUTs.

[0057] The system deployment module 123 is used to execute an automatic deployment program, including allocating network IP addresses, downloading and installing operating system images (such as WinPE) using the network service module 122, and managing the software environment of the electronic device under test.

[0058] The resource scheduling module 124 is responsible for managing and allocating hardware and software resources in the thermal characteristic verification system, including load balancing and scheduling of test tasks for multiple electronic devices under test.

[0059] The test result judgment module 125 is used to analyze the component temperature data and ambient temperature data obtained from the database 121 to determine whether the workload test performed by each electronic device under test was successful. The test result judgment module 125 can compare and analyze the results based on preset temperature ranges or safe temperature thresholds to further determine whether the test result of the electronic device under test is successful or unsuccessful, or whether it is necessary to suspend the investigation of environmental factors.

[0060] The communication circuit unit 130 can be a wired or wireless communication interface, such as an Ethernet communication interface or a wireless network interface, to realize bidirectional data exchange between the management server 100 and the electronic device under test and the temperature sensor.

[0061] In practical applications, the above components can take many different forms.

[0062] The processor 110 may be a central processing unit (CPU), a graphics processing unit (GPU), a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), or other computing units suitable for executing the methods of this disclosure. The processor 110 is responsible for executing program instructions or program code modules stored in the storage device 120 or memory (not shown) to implement the thermal characteristic verification method of this disclosure.

[0063] Storage device 120 can be a non-volatile storage device or a volatile storage device, such as, but not limited to, hard disk drive (HDD), solid-state drive (SSD), flash memory, or random access memory (RAM), for storing program instructions, test data, system configuration data, and other related information.

[0064] The communication circuit unit 130 may include, but is not limited to, an RJ45 interface, a wireless network adapter, or other wired or wireless interfaces suitable for data communication, to ensure that the management server 100 can communicate efficiently and stably with multiple devices in the thermal characteristic verification system.

[0065] In practical applications, database 121 can use relational databases, such as MySQL or Oracle, to provide access to and management of component temperature data and ambient temperature data.

[0066] The network service module 122 can be specifically implemented as a network application or web service, such as a Socket communication program or other network service interface, to ensure that the management server 100 can interact with the device under test and the temperature sensor in real time and effectively.

[0067] The system deployment module 123 can be automated deployment software, such as Windows Deployment Services (WDS) and Microsoft Deployment Toolkit (MDT), to quickly and automatically configure the hardware and software environment of a large number of electronic devices under test.

[0068] In practice, the resource scheduling module 124 can use cloud computing technology or cluster scheduling technology for dynamic resource scheduling and load balancing.

[0069] The test result judgment module 125 can analyze and confirm whether the temperature data of each electronic device component under test falls within the safe range by executing a predefined algorithm program, such as the cumulative moving average algorithm (MA).

[0070] Figure 3 This is a block diagram of an electronic device under test according to an embodiment of the present disclosure.

[0071] Reference Figure 3 In one embodiment, the electronic device under test 200 disclosed herein includes a central processing unit 210, a storage device 220, a communication circuit unit 230, an image processor 240, a heat dissipation unit 250, and a plurality of component temperature sensors 260(1) and 260(2).

[0072] The central processing unit 210 is electrically connected to the storage device 220, the communication circuit unit 230, the image processor 240, the heat dissipation unit 250, and the component temperature sensors 260(1) and 260(2) for performing workload testing and heat dissipation testing of the electronic device under test 200. In addition, the central processing unit 210 is also used to execute program code stored in the storage device 220 to realize temperature data sampling, cumulative moving average calculation, and response and processing of test commands.

[0073] Specifically, the storage device 220 is used to store the program code, workload test software, heat dissipation test software, fan speed mapping table, and temporary cache data area for storing component temperature data required by the electronic device under test 200, so as to support the central processing unit 210 and the image processor 240 to perform various test operations.

[0074] Communication circuit unit 230 is used to realize the communication between the electronic device under test 200 and the management server 100. Figure 2 Wired or wireless data communication connections (as shown) are used, for example, to exchange control commands with the management server 100 in real time via a network, upload component temperature data, or receive commands for heat dissipation and workload testing from the management server 100.

[0075] The image processor 240 is another core component of the electronic device under test 200. It is electrically connected to the central processing unit 210 and performs image processor load tests and comprehensive load tests under the control of the central processing unit 210. When performing workload tests, the image processor 240 performs high-load image operations based on preset program code to achieve predetermined high power consumption and high temperature conditions.

[0076] The heat dissipation unit 250 includes a fan to perform heat dissipation operations in response to heat dissipation test control commands from the central processing unit 210. Specifically, when the central processing unit 210 performs a heat dissipation test, the heat dissipation unit 250 starts according to a preset fan speed and runs for a predetermined time to reduce the temperature of the internal components of the electronic device under test 200. Furthermore, during operation, the actual fan speed data of the heat dissipation unit 250 is recorded and fed back to the central processing unit 210 for comparison with a preset speed mapping table stored in the storage device 220, thereby verifying the fan's heat dissipation performance.

[0077] Component temperature sensors 260(1) and 260(2) are respectively located near the central processing unit 210 and the image processor 240 to monitor and generate temperature data of the central processing unit 210 and the image processor 240 in real time, and transmit the temperature data to the central processing unit 210 for further processing. After receiving the temperature data from the component temperature sensors 260(1) and 260(2), the central processing unit 210 executes the cumulative moving average algorithm pre-stored in the storage device 220 to obtain smooth and accurate component temperature data (e.g., cumulative average temperature value), and uploads it to the management server 100 via the communication circuit unit 230 for test result judgment.

[0078] In practical applications, the above components can take many different forms:

[0079] The central processing unit 210 may be, for example, a general-purpose central processing unit (CPU), a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), or other computing units suitable for performing workload test programs and temperature data processing tasks.

[0080] The image processor 240 may be, for example, a graphics processing unit (GPU), such as a high-performance GPU chip manufactured by manufacturers such as NVIDIA, AMD or Intel, to perform high-density image processing or image rendering tasks.

[0081] In practice, the communication circuit unit 230 can be specifically manifested as a wireless network interface (e.g., a Wi-Fi module), a wired network interface (e.g., an Ethernet interface), or other suitable data communication interface to ensure stable data transmission between the electronic device under test 200 and the management server 100.

[0082] The heat dissipation unit 250 may include a fan, a motor drive circuit and a fan speed monitoring circuit. The fan specifications can be selected according to the heat dissipation requirements of the electronic device under test 200. Different sizes and powers of cooling fans can be selected to ensure that the internal component temperature of the electronic device under test 200 can be appropriately reduced to a safe range.

[0083] Storage device 220 may be a solid-state drive (SSD), flash memory, random access memory (RAM), or other storage media suitable for storing program instructions and temporary data to provide data storage and computing support required for the central processing unit 210 to perform tests.

[0084] The component temperature sensors 260(1) and 260(2) can be thermistors (NTC Thermistors), thermocouples or other types of temperature sensing elements, respectively, and are placed close to important components of the electronic device under test 200 (such as central processing unit 210 and image processor 240) to monitor their operating temperature changes in real time.

[0085] In one embodiment, the central processing unit 210 executes the installed test execution program, which may include, for example, four functional modules: a burn-in program, a heat dissipation program, a temperature detection program, and a data transmission program. These programs work together to complete the various test procedures for thermal characteristic verification.

[0086] Specifically, the burn-in program is used to cause the at least one central processing unit 210 or the at least one image processor 240 to perform high-load operations based on the workload test, so as to achieve a predetermined load.

[0087] The heat dissipation program is used to control the heat dissipation unit 250 to perform heat dissipation operations based on the heat dissipation test. During the heat dissipation test phase, the heat dissipation program first sets the initial fan speed parameters according to the test requirements, and then sends a command to start the fan in the heat dissipation unit 250 after a predetermined waiting time (such as a first predetermined time of 90 seconds). The heat dissipation program is also responsible for reading the actual fan speed data after the fan has been running for a period of time (such as a second predetermined time) and comparing it with a preset speed mapping table stored in the storage device 220 to verify whether the heat dissipation unit 250 is functioning properly.

[0088] The temperature detection program reads temperature values ​​from each component temperature sensor 260(1) and 260(2) every second to obtain the corresponding component temperature data. During workload and heat dissipation tests, the temperature detection program continuously monitors and records the temperature changes of the central processing unit 210 and the image processor 240 at intervals of 1 second (or other shorter intervals). The program processes the collected temperature data using a cumulative moving average algorithm. In this way, the temperature detection program can obtain smoother and more stable temperature data, avoiding errors caused by instantaneous fluctuations.

[0089] The data transmission program is used to transmit the acquired temperature data of the multiple components to the management server 100 in real time via the network connection.

[0090] Through these four functional modules, the test execution program can systematically test the thermal characteristics of the electronic device under test, ensuring that it can maintain a normal operating temperature under various workload conditions, thereby improving the reliability and stability of the product.

[0091] Figure 4 This is a flowchart illustrating a thermal characteristic verification method according to an embodiment of the present disclosure.

[0092] Reference Figure 4 In one embodiment, this disclosure provides a thermal characteristic verification method applicable to the aforementioned thermal characteristic verification system. The thermal characteristic verification system includes multiple electronic devices under test (DUTs), multiple temperature sensors, and a management server. This method primarily verifies whether the thermal characteristics of the DUTs meet expected requirements by monitoring and analyzing the temperature data of the DUTs and their surrounding environment.

[0093] In step S410, multiple ambient temperature data are generated via each of the plurality of temperature sensors 300(1)-300(N-1). Specifically, the plurality of temperature sensors 300(1) to 300(N-1) are positioned at predetermined monitoring locations between the plurality of electronic devices under test (DUTs) to capture real-time temperature changes in the surrounding environment. Each temperature sensor is positioned at the midpoint of a predetermined horizontal distance L1 between two adjacent DUTs. This arrangement ensures that the temperature sensors can accurately measure the ambient temperature without being excessively affected by the heat of any adjacent DUT.

[0094] Figure 5 This is a schematic diagram illustrating a safe distance test according to an embodiment of the present disclosure.

[0095] Reference Figure 5In one embodiment, this disclosure provides a test method for determining the safe distance between electronic devices under test. This method experimentally determines the minimum horizontal safe distance between multiple electronic devices under test to ensure that the ambient temperature data collected by the temperature sensor accurately reflects the true conditions of the test environment.

[0096] In one embodiment, each temperature sensor is positioned at the midpoint of a predetermined horizontal distance L1 between two adjacent electronic devices under test. This arrangement ensures that the temperature sensors can accurately measure the ambient temperature without being excessively affected by the heat of either adjacent electronic device under test.

[0097] Specifically, in safe distance testing, such as Figure 5 As shown, two electronic devices under test, 200(1) and 200(2), are placed at points 0 and L on the horizontal coordinate axis, respectively, and a temperature sensor 300(1) is set at a predetermined monitoring position (i.e., the midpoint between the two electronic devices under test). During the test, when the two devices perform workload tests simultaneously, the change in ambient temperature measured by the temperature sensor located in the middle is observed to adjust the distance L between the two electronic devices under test.

[0098] In one embodiment, the heat dissipation function of the two electronic devices under test (DUTs) is disabled, and a calibration workload test (e.g., a combined load test of the CPU and the GPU) is performed on DUTs 200(1) and 200(2) until the component temperatures of DUTs 200(1) and 200(2) reach a predetermined threshold. Then, multiple ambient temperature data are received from the plurality of calibration temperature sensors to obtain the ambient temperature trend over a horizontal distance L. Subsequently, the horizontal distance L is adjusted according to the ambient temperature trend, for example, by gradually increasing the distance between the two DUTs and repeating the test until the temperature at the midpoint of the adjusted horizontal distance L is less than another predetermined threshold (e.g., the increase is no more than 5% relative to the initial ambient temperature measured before the DUTs were not running). Finally, the midpoint of the adjusted horizontal distance L is set as a predetermined monitoring position, that is, the optimal position for arranging the temperature sensor 300(1) in the actual test environment, to ensure that it can accurately capture the ambient temperature without being excessively affected by the heat of any adjacent DUT.

[0099] Please return to Figure 4 In step S420, via the management server 100, each electronic device under test 200 is commanded to perform thermal tests and multiple workload tests in a predetermined sequence. Specifically, the predetermined sequence refers to performing thermal tests and different types of workload tests alternately in a specific order.

[0100] In one embodiment of this disclosure, the multiple workload tests include: a processor load test of at least one central processing unit (CPU); an image processor load test of at least one image processor (GPU); and a combined load test of at least one CPU and at least one GPU. The predetermined order may be: first, performing any one of the processor load test, GPU load test, and combined load test; then performing a thermal test; next, performing another of the processor load test, GPU load test, and combined load test; then performing a thermal test again; and finally performing one of the processor load test, GPU load test, and combined load test that has not yet been performed.

[0101] Taking a specific process as an example, the electronic device under test 300 can first perform a processor load test, making the central processing unit 210 run under high load for 6 minutes and measuring its temperature change characteristics; then perform a heat dissipation test, starting the fan of the heat dissipation unit 250 and testing its cooling effect; next, perform an image processor load test, making the image processor 240 run under high load for 6 minutes and observing its temperature change; then perform a heat dissipation test again, testing the cooling performance of the fan of the heat dissipation unit 250 again; finally, perform a comprehensive load test, applying load to both the central processing unit 210 and the image processor 240 simultaneously, running for 10 minutes, and testing the temperature stability under maximum power consumption conditions.

[0102] In another embodiment, when the heat dissipation test is performed, each of the electronic devices under test controls the fan of the heat dissipation unit 250 via its central processing unit 210 to perform the following steps: setting the initial speed of the fan; starting the fan after waiting for a first predetermined time (e.g., 90 seconds); reading the actual fan speed after waiting for a second predetermined time; and comparing the actual fan speed with a preset speed mapping table. Through this series of steps, it can be verified whether the heat dissipation performance of the fan meets the expected requirements.

[0103] In step S430, during the execution of heat dissipation tests and multiple workload tests, the management server 100 receives multiple component temperature data and multiple ambient temperature data for each electronic device under test (DUT) in real time. Specifically, when the DUT performs various tests, the component temperature sensors 260(1) and 260(2) of its central processing unit 210 and image processor 240 monitor and record temperature data in real time. After being processed by the central processing unit 210, this temperature data is uploaded to the database 121 of the management server 100 via the communication circuit unit 230. At the same time, the ambient temperature sensors also upload the collected ambient temperature data to the management server 100 for subsequent analysis.

[0104] In one embodiment, the temperature data for each component is a cumulative average temperature value, which is calculated using the following formula:

[0105]

[0106] Among them, MA n x represents the cumulative average temperature value. n The current temperature value is given, n is the number of samples, and MA is the maximum temperature. n-1 This is the previous cumulative average temperature value. This cumulative moving average sampling method makes the temperature data smoother and more accurate, avoiding errors caused by sampling time being too early or too late, or by sampling intervals being too large or too small.

[0107] In one embodiment, for various workload tests, temperature sampling follows a specific time schedule to obtain the most representative temperature data. Specifically, each device under test (DUT) performs any of the aforementioned processor load test, image processor load test, and comprehensive load test for a period of time, and temperature sampling is performed during the last sampling time interval of that period. For example, assuming the processor load test (stress CPU) lasts for 6 minutes, during the last 2 minutes of the processor load test (sampling time interval), temperature is sampled at 1-second intervals. For each sample, an average temperature value is calculated using a cumulative moving average (MA) algorithm, and then compared with a data mapping table to check for correctness.

[0108] Similarly, assuming the GPU stress test also runs for 6 minutes, temperature data is collected and a cumulative moving average algorithm is applied during the last 2-minute time window.

[0109] In other embodiments, assuming a comprehensive load test (stress CPU & GPU) is performed for 10 minutes, temperature sampling is performed and a cumulative moving average algorithm is applied during the last 6-minute time window (sampling time interval) of the processor load test.

[0110] It is worth noting that the test execution time and sampling time interval can be adjusted based on the characteristics of different workload tests. Specifically, comprehensive load tests apply stress to both the CPU and GPU simultaneously, generating more heat and resulting in a more complex temperature change process. Therefore, they require a longer time to reach a stable state and a longer sampling window to obtain more sample points, thereby ensuring the representativeness of the temperature data.

[0111] In step S440, the management server 100 determines whether the multiple workload tests of each electronic device under test 200 are successful based on multiple component temperature data and multiple ambient temperature data. Specifically, the test result judgment module 125 of the management server 100 reads the component temperature data and ambient temperature data stored in the database 121, compares and analyzes them according to preset temperature thresholds or safe temperature ranges, and determines the test results.

[0112] In one embodiment, the test result judgment module 125 can make a judgment based on the following principles: if the component temperature of the electronic device under test is normal and the temperature measured by the adjacent ambient temperature sensor is normal, the test is successful; if the component temperature of the electronic device under test is abnormal but the temperature measured by the adjacent ambient temperature sensor is normal, the test fails; if the component temperature of the electronic device under test is normal but the temperature measured by the adjacent ambient temperature sensor is abnormal, it may be because environmental factors have affected the test results. In this case, the test needs to be paused and the cause of the abnormal ambient temperature needs to be investigated, and an abnormality warning signal should be issued.

[0113] Through the above Figure 4 Through multiple steps, this disclosed thermal characteristic verification method can verify the thermal characteristics of the electronic device under test (DUT) while considering / monitoring the influence of ambient temperature, ensuring that it can maintain normal operating temperature under various workload conditions, thereby improving the reliability and stability of the DUT. By incorporating ambient temperature monitoring as one of the criteria for judging test results, this method can eliminate the influence of environmental factors on test results and improve the accuracy of the test.

[0114] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A thermal characteristic verification system, characterized in that, The system includes: Multiple electronic devices under test, each having at least one central processing unit and at least one image processor; Multiple temperature sensors are disposed among the multiple electronic devices under test, and each temperature sensor is used to generate multiple ambient temperature data. The management server is communicatively connected to the plurality of devices under test and the plurality of temperature sensors, for the purpose of: Each of the said electronic devices under test is ordered to perform thermal tests and multiple workload tests in a predetermined sequence and alternately. During the thermal testing and the multiple workload testing, multiple component temperature data and multiple ambient temperature data of each of the electronic devices under test are received in real time; and Based on the temperature data of the multiple components and the multiple ambient temperature data, it is determined whether the multiple workload tests of each of the electronic devices under test are successful.

2. The thermal characteristic verification system according to claim 1, characterized in that, in: The plurality of electronic devices under test are set at a predetermined horizontal distance between two adjacent electronic devices under test, and each temperature sensor is set at the middle position of the predetermined horizontal distance, so that the influence of the two adjacent electronic devices under test on the plurality of ambient temperature data is below a predetermined threshold.

3. The thermal characteristic verification system according to claim 1, characterized in that, The multiple workload tests mentioned above include: Processor load test of at least one central processing unit; Image processor load test of at least one image processor; and Comprehensive load test of the at least one central processing unit and the at least one image processor.

4. The thermal characteristic verification system according to claim 3, characterized in that, The predetermined order is as follows: Any one of the processor load test, the image processor load test, and the comprehensive load test; The heat dissipation test; The processor load test, the image processor load test, and the comprehensive load test are all one of the following: The heat dissipation test; and One of the processor load test, the image processor load test, and the comprehensive load test that has not yet been performed.

5. The thermal characteristic verification system according to claim 1, characterized in that, Each of the said electronic devices under test includes a fan, wherein, during the thermal testing, each of the said electronic devices under test is further configured to: Set the initial speed of the fan; After waiting for the first predetermined time, the fan is started; After waiting for the second predetermined time, the actual fan speed of the fan is read; as well as The actual fan speed is compared with a preset speed mapping table.

6. The thermal characteristic verification system according to claim 1, characterized in that, The temperature data for each component is a cumulative average temperature value, which is calculated using the following formula: Among them, MA n x is the cumulative average temperature value. n The current temperature value is given, n is the number of samples, and MA is the maximum temperature. n-1 This is the previous cumulative average temperature value.

7. A thermal characteristic verification method, applicable to a thermal characteristic verification system, wherein the thermal characteristic verification system includes multiple electronic devices under test, multiple temperature sensors, and a management server, characterized in that, The method includes: Multiple ambient temperature data are generated via each of the plurality of temperature sensors; The management server commands each of the electronic devices under test to perform thermal tests and multiple workload tests in a predetermined sequence. The management server receives, in real-time, multiple component temperature data and multiple ambient temperature data for each of the electronic devices under test during the thermal testing and the multiple workload tests; and The management server determines whether the multiple workload tests of each electronic device under test are successful based on the multiple component temperature data and the multiple ambient temperature data.

8. The thermal characteristic verification method according to claim 7, characterized in that, The method further includes: Set a predetermined horizontal distance between two adjacent electronic devices under test (DUTs); and Each temperature sensor is positioned at the midpoint of the predetermined horizontal distance so that the influence of the two adjacent electronic devices under test on the plurality of ambient temperature data is below a predetermined threshold.

9. The thermal characteristic verification method according to claim 7, characterized in that, The multiple workload tests mentioned above include: Processor load test of at least one central processing unit of the management server; Image processor load test of at least one image processor of the management server; and Comprehensive load test of the at least one central processing unit and the at least one image processor.

10. The thermal characteristic verification method according to claim 9, characterized in that, The steps of performing thermal tests and multiple workload tests in a predetermined sequence include: Perform any one of the processor load test, the image processor load test, and the comprehensive load test on each of the said electronic devices under test; The heat dissipation test is performed on each of the said electronic devices under test; One of the processor load test, the image processor load test, and the comprehensive load test is performed on each of the said electronic devices under test. The heat dissipation test is performed again for each of the aforementioned electronic devices under test; and One of the processor load test, the image processor load test, and the comprehensive load test that has not yet been performed is performed on each of the said electronic devices under test.

11. The thermal characteristic verification method according to claim 7, characterized in that, Installing a fan in each of the electronic devices under test, wherein the method further includes: When the heat dissipation test is performed, the following steps are performed via each of the electronic devices under test: Set the initial speed of the fan; After waiting for the first predetermined time, the fan is started; After waiting for a second predetermined time, the actual fan speed of the fan is read; and The actual fan speed is compared with a preset speed mapping table.

12. The thermal characteristic verification method according to claim 7, characterized in that, The method further includes: For each electronic device under test, the temperature data of each component is calculated as a cumulative average temperature value, which is obtained by the following formula: Among them, MA n x is the cumulative average temperature value. n The current temperature value is given, n is the number of samples, and MA is the maximum temperature. n-1 This is the previous cumulative average temperature value.

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