Original film and remaining film integrated management method, device, system, electronic equipment and storage medium

Abstract

The application discloses a kind of original piece and piece integration management method, device, system, electronic equipment and storage medium, integration management method includes obtaining inventory sequence information in target material carrying unit;In response to the piece recovery trigger signal generated by cutting task, the piece is moved to the empty storage position of target material carrying unit, and the attribute information of the piece and its storage order in target material carrying unit are added to inventory sequence information;In response to receiving a new cutting task, based on inventory sequence information, non-standard specification base material is input as a priority layout object into a layout optimization model to generate a combined cutting plan;Control the material handling device to move the corresponding base material from the target material carrying unit to the processing station one by one;The present application realizes multiple technical effects such as warehouse space utilization rate improvement, piece utilization rate maximization, production process automation, piece management closed loop, etc. under the premise of almost no increase in hardware investment.

Description

Technical Field

[0001] This invention relates to the field of glass processing technology, and more specifically to a method, apparatus, system, electronic device, and storage medium for integrated management of raw glass sheets and surplus glass sheets. Background Technology

[0002] In the glass deep processing industry, after raw glass is cut into finished products by the cutting production line, a large number of surplus sheets, i.e., unused raw glass sheets, are inevitably generated. How to effectively manage and reuse these surplus sheets has always been a technical challenge in the industry.

[0003] Traditional methods of handling leftover glass sheets, such as manually collecting them after cutting and placing them on special racks for later use, have several problems: First, manually handling leftover glass sheets is time-consuming, labor-intensive, and inefficient; second, the sharp edges of the glass pose significant safety hazards when handled manually; third, stacking multiple leftover sheets on racks requires manually moving the other sheets one by one when a specific size is needed, which is inconvenient and poses secondary safety risks. Furthermore, stacking leftover sheets occupies a large amount of production space and presents numerous safety hazards.

[0004] To address the shortcomings of traditional waste sheet handling methods, existing technologies have developed solutions using vertical or horizontal automated equipment to store waste sheets. However, these dedicated waste sheet storage devices generally suffer from limited storage capacity; vertical equipment typically stores only 60 to 100 sheets, while horizontal equipment stores only 20 to 30 sheets, and each interval usually only stores one waste sheet for quick retrieval. Furthermore, such equipment is expensive, typically costing between 500,000 and 1 million yuan, resulting in a low return on investment and limiting its application to small and medium-sized glass processing enterprises.

[0005] Regarding raw glass sheet storage, existing systems primarily store raw glass sheets from glass factories in an orderly manner for easy transport during subsequent cutting. The storage logic is as follows: a single shelf in a raw glass sheet storage unit can only store glass of the same specification and material; even if there is remaining space, other specifications cannot be stored. This storage method results in insufficient space utilization and is completely incompatible with the storage and management of surplus sheets. Furthermore, existing technologies include solutions for storing surplus sheet information such as size, quantity, and storage location in computer memory for later retrieval, and management systems that utilize surplus sheet cages to temporarily store surplus sheets of different specifications. However, these solutions either only achieve information management of surplus sheets without solving the problems of storage space and retrieval efficiency, or still rely on dedicated storage equipment, failing to fundamentally address the high cost and inconvenient access associated with surplus sheet storage.

[0006] In summary, the existing technology lacks an integrated solution that can achieve both efficient storage of original wafers and convenient management of surplus wafers without requiring a significant increase in equipment investment. Summary of the Invention

[0007] This invention aims to overcome the shortcomings of existing technologies, such as high cost of surplus film storage management, inconvenient access, large space occupation, incompatibility of original film storage systems with surplus film storage, and inability to coordinate scheduling of original and surplus films. It provides an integrated management method for original and surplus films, which utilizes existing original film storage equipment to store and reuse surplus films in a low-cost and high-efficiency manner.

[0008] To achieve the above objectives, the present invention provides an integrated management method for original wafers and surplus wafers, comprising:

[0009] Obtain inventory sequence information within the target material carrying unit, wherein the inventory sequence information includes at least the attribute information and storage order of standard specification substrates; the target material carrying unit is used for mixed storage of standard specification substrates and non-standard specification substrates of the same material;

[0010] In response to the scrap recycling trigger signal generated by the cutting task, the attribute information of the scrap is obtained, the scrap is transferred as the non-standard specification substrate to the empty storage space of the target material carrying unit, and the attribute information of the scrap and its storage order in the target material carrying unit are added to the inventory sequence information.

[0011] In response to receiving a new cutting task, based on the inventory sequence information, the non-standard specification substrates are input into the layout optimization model as priority layout objects according to the storage order to generate a combined cutting scheme;

[0012] Based on the combined cutting scheme, the material loading and unloading device sequentially transfers the corresponding substrate from the target material carrying unit to the processing station.

[0013] Preferably, the process of storing the non-standard specification substrates mixed within the target material carrying unit specifically includes:

[0014] Obtain the attribute information of the non-standard specification substrate, including material parameters and size parameters;

[0015] Verify whether the material parameters of the non-standard substrate are consistent with the material parameters of the standard substrate already stored in the target material carrier unit;

[0016] If they match, the non-standard substrate can be stored in the target material carrier unit; if they do not match, a prompt will be made to replace the storage unit.

[0017] Identification information is generated based on the attribute information, and the identification information is bound to the storage location and storage order of the non-standard specification substrate in the target material carrying unit to update the inventory sequence information.

[0018] Preferably, the operation of binding the identification information with the storage location and storage order of the non-standard specification substrate within the target material carrying unit, and updating the inventory sequence information specifically includes:

[0019] The material and dimensional parameters of the non-standard substrate are read using an identification device.

[0020] Based on the material parameters and the size parameters, an identification information containing QR code or radio frequency identification data is generated, and the identification information is attached to the surface of the non-standard specification substrate.

[0021] The identification information and the storage location and storage order of the non-standard specification substrate in the target material carrying unit are written into the warehouse management database to form a mixed inventory sequence containing standard specification substrates and non-standard specification substrates of the same material arranged in storage order. The storage order is used to indicate the grab priority of the material loading and unloading device when taking out the substrate.

[0022] Preferably, the typesetting optimization model adopts a two-stage typesetting strategy:

[0023] First stage: According to the storage order of non-standard specification substrates recorded in the inventory sequence information, local layout is performed sequentially with the outline of each non-standard specification substrate as the boundary to generate one or more first cutting sub-schemes;

[0024] Second stage: Take the remaining cutting sub-tasks that are not covered by each of the first cutting sub-schemes in the cutting task, perform global layout with the standard specification substrate as the boundary, and generate the second cutting sub-scheme.

[0025] Based on each of the first cutting sub-schemes and the second cutting sub-schemes, the combined cutting scheme is generated;

[0026] Preferably, the first stage specifically includes:

[0027] Based on the property information of the current non-standard specification substrate, select a set of cutting sub-tasks that can be accommodated from the cutting tasks;

[0028] The layout calculation is performed on the set of cutting subtasks within the outline of the current non-standard specification substrate to obtain the layout utilization rate;

[0029] If the layout utilization rate is greater than or equal to the preset utilization rate threshold, the current layout result is taken as the first cutting sub-scheme, and the current non-standard specification substrate is marked as used from the inventory sequence information;

[0030] If the layout utilization rate is less than the preset utilization rate threshold, then skip the current non-standard specification substrate and keep it in the inventory sequence information, and traverse the next non-standard specification substrate in the inventory sequence information.

[0031] Preferably, based on the combined cutting scheme, the operation of controlling the material loading and unloading device to sequentially transfer the corresponding substrate from the target material carrying unit to the processing station specifically includes:

[0032] The material grabbing order in the combined cutting scheme is analyzed, and the material grabbing order is based on the storage order of non-standard specification substrates in the inventory sequence information, which preferentially points to the non-standard specification substrates.

[0033] Based on the material grabbing sequence, generate equipment control instructions;

[0034] The equipment control command is sent to the material loading and unloading device to control the material loading and unloading device to transfer the corresponding non-standard specification substrates and standard specification substrates from the target material carrying unit to the processing station in the order of storage.

[0035] Preferably, the integrated management method for original films and surplus films further includes:

[0036] After cutting is completed at the processing station, the actual size parameters of the remaining substrate are identified based on the cutting layout record using the layout optimization model or the MES system.

[0037] If the actual size parameter is greater than or equal to the preset size threshold, the remaining substrate is determined to be a recyclable scrap, and the scrap recycling trigger signal generated by the cutting task is triggered.

[0038] The material loading and unloading device is controlled to transfer the recyclable scrap as a new non-standard specification substrate back to the empty storage space of the target material carrying unit;

[0039] Obtain the attribute information of new non-standard specification substrates, generate corresponding identification information, and append it to the end of the inventory sequence information to complete the closed loop of surplus wafer recycling.

[0040] The present invention also provides an integrated management device for original wafers and surplus wafers, comprising:

[0041] The storage management module is used to acquire inventory sequence information within the target material carrying unit. The inventory sequence information includes at least the attribute information and storage order of standard specification substrates. The target material carrying unit is used to mix and store standard specification substrates and non-standard specification substrates of the same material.

[0042] The waste sheet recycling module is used to respond to the waste sheet recycling trigger signal generated by the cutting task, obtain the attribute information of the waste sheet, transfer the waste sheet as the non-standard specification substrate to the empty storage space of the target material carrying unit, and add the attribute information of the waste sheet and its storage order in the target material carrying unit to the inventory sequence information.

[0043] The layout scheduling module is used to respond to the receipt of a new cutting task, and based on the inventory sequence information, input the non-standard specification substrates as priority layout objects into the layout optimization model according to the storage order to generate a combined cutting scheme.

[0044] The execution control module is used to control the material loading and unloading device to sequentially transfer the corresponding substrate from the target material carrying unit to the processing station based on the combined cutting scheme.

[0045] This invention also provides an integrated management system for original and surplus wafers, comprising:

[0046] The target material carrying unit is used for mixed storage of standard and non-standard substrates of the same material.

[0047] A material loading and unloading device is used to transfer a substrate between the target material carrying unit and the processing station, wherein the processing station is used to perform a cutting operation on the transferred substrate.

[0048] A labeling and identification device used to read the attribute information of the substrate;

[0049] The control terminal is communicatively connected to the material loading and unloading device, the processing station, and the identification device. The control terminal is configured to execute the above-described integrated management method for original and surplus films.

[0050] The present invention also provides an electronic device, including a processor and a memory, wherein the memory stores machine-executable instructions that can be executed by the processor, and the processor can execute the machine-executable instructions to implement the above-described integrated management method for original and surplus wafers.

[0051] The present invention also provides a computer-readable storage medium having a computer program stored thereon, wherein the computer program, when executed by a processor, implements the above-described method for integrated management of original and surplus wafers.

[0052] Compared with existing technologies, the integrated management method for original and surplus wafers provided by this invention effectively overcomes the shortcomings of relying on manual management, which is characterized by low efficiency and high safety risks, or relying on dedicated automated equipment, which is characterized by high cost and small storage capacity. This invention achieves multiple technical effects such as improved warehouse space utilization, maximized surplus wafer utilization, automated production process, and closed-loop surplus wafer management, without increasing hardware investment. Attached Figure Description

[0053] Figure 1 This is a flowchart of an integrated management method for original wafers and surplus wafers provided in an embodiment of the present invention;

[0054] Figure 2 This is a schematic diagram of an integrated management system for original wafers and surplus wafers provided in an embodiment of the present invention;

[0055] Figure 3 This is a schematic diagram of the layout of the remaining pieces generated in a single cutting task according to the present invention.

[0056] Explanation of reference numerals in the attached figures

[0057] 10. Raw glass storage area; 11. Storage glass racks; 20. Loading and unloading integrated machine; 30. Cutting production line. Detailed Implementation

[0058] To make the technical means, creative features, objectives, and effects of this invention readily understandable, the invention is further illustrated below with reference to specific embodiments. It should be understood that the specific embodiments described herein are for illustrative and explanatory purposes only and are not intended to limit the invention.

[0059] To facilitate understanding of this invention, several terms used in this invention are defined and explained below.

[0060] Standard specification substrates refer to raw glass sheets purchased according to standard factory specifications in the glass deep processing industry. They have uniform material, thickness, and size specifications, such as 3660mm×2300mm×5mm clear glass sheets. Standard specification substrates are usually purchased and stored in the glass factory in whole racks. Multiple standard specification substrates stored in the same glass rack have exactly the same material, thickness, and size.

[0061] Non-standard substrate materials refer to glass sheets with unconventional dimensions that differ from the aforementioned standard substrate materials. In this invention, they mainly refer to the leftover pieces (also known as scraps) produced after cutting a glass sheet. For example, after cutting a portion of the finished product from a 3660mm×2300mm×5mm clear glass sheet, the remaining sheet material may be 1900mm×3300mm×5mm or 540mm×1908mm×5mm. The material of the non-standard substrate material is the same as that of the original sheet from which it is produced, but its dimensions are not standardized.

[0062] A target material carrying unit refers to a storage glass rack in a glass deep-processing production line used to carry and store glass substrates. Each target material carrying unit has a unique identifier, such as a rack number. A corresponding independent inventory record exists in the warehouse management system.

[0063] Inventory sequence information refers to a set of data stored in the warehouse management database that describes the storage status of all substrates within a target material carrying unit. This inventory sequence information includes at least the material parameters, size parameters, and stacking sequence number (i.e., storage order) for each substrate. The stacking sequence number indicates the priority of the material handling device when retrieving the substrate; substrates with earlier sequence numbers have higher priority when retrieved.

[0064] Material loading and unloading device refers to an automated device that can transfer glass substrate between the target material carrying unit and the processing station. In this invention, it can be a loading and unloading integrated machine, which has a two-way transfer function of taking glass from the storage rack and sending it to the cutting table (loading) and sending the cut surplus from the cutting table back to the storage rack (unloading).

[0065] The identification device refers to a device used to read identification information attached to the surface of a glass substrate. In this invention, it can specifically be a handheld barcode scanner used to scan QR code labels on the surface of the substrate to obtain its material, size and other attribute information.

[0066] The layout optimization model refers to the optimization algorithm program running in the MES system (Manufacturing Execution System) or an independent computing unit. It takes the finished product requirement list and the attribute information of the available substrates in the cutting task as input, performs two-dimensional layout calculations with the outline of each substrate as the boundary, and outputs the cutting scheme of which finished products to cut on each substrate.

[0067] like Figure 1 As shown, this embodiment of the invention provides a method for integrated management of original wafers and surplus wafers, including the following steps:

[0068] S100. Obtain inventory sequence information within the target material carrying unit. The inventory sequence information includes at least the attribute information and storage order of standard specification substrates. The target material carrying unit is used to mix and store standard specification substrates and non-standard specification substrates of the same material.

[0069] In traditional raw glass storage, a single glass rack can only store glass of the same specification and material. Even with ample remaining space, other specifications cannot be stored, resulting in significant waste of storage space. This invention completely changes this storage logic, allowing raw glass of the same material to be mixed with surplus glass of various specifications within the same glass rack. Without altering the physical structure of the storage equipment or increasing any hardware investment, this invention fully utilizes the previously idle space within glass racks, significantly improving the volumetric utilization rate of storage space. For example, in a glass rack capable of storing 20 3660×2300mm raw sheets, when only a portion of the raw sheets are actually stored, the remaining space can be used to accommodate smaller surplus sheets of the same material, truly maximizing space utilization. Simultaneously, this step introduces inventory sequence information, transforming the mixed storage of substrates in the physical storage space into structured data that can be read and processed by a computer. This means the storage sequence not only records what is stored but also precisely records its position within the rack, ensuring the system accurately tracks the location of each substrate within the storage rack. This data foundation is crucial, as it transforms hybrid storage from physical disorder to data order, providing the necessary prerequisite for subsequent automated retrieval and scheduling. Without this data foundation, hybrid storage will only exacerbate the chaotic situation of not being able to find data.

[0070] S200, in response to the scrap recycling trigger signal generated by the cutting task, obtain the attribute information of the scrap, transfer the scrap as the non-standard specification substrate to the empty storage space of the target material carrying unit, and add the attribute information of the scrap and its storage order in the target material carrying unit to the inventory sequence information.

[0071] After the glass cutting operation is completed, the system identifies recyclable scrap pieces based on preset size thresholds, such as those larger than 500×500mm. Once identified, the recycling process is triggered, transferring the scrap pieces back to the storage rack and automatically updating the inventory sequence information. This step completely changes the inefficient traditional method of relying on manual judgment of whether to retain the scrap pieces and manual handling to the stacking area. Recyclable scrap pieces are detected by the system as soon as they are generated and automatically included in the warehouse management process, avoiding the subjectivity and omission risks of manual judgment. Furthermore, the method of appending to the end of the inventory sequence information not only achieves real-time synchronous updates of inventory data but also preserves the chronological order of each piece of substrate entering the warehouse. This order serves as the basis for subsequent scheduling priority data and is completely transmitted to the next stage, forming a key data transmission node in the entire technical solution's logical chain.

[0072] S300. In response to receiving a new cutting task, based on the inventory sequence information, the non-standard specification substrates are input into the layout optimization model as priority layout objects according to the storage order to generate a combined cutting scheme.

[0073] When a new cutting task arrives, the system automatically reads the inventory sequence information, first determining whether there are non-standard specification substrates (i.e., surplus pieces). If so, these are input into the optimization model as layout boundaries according to the storage order. After completing local layout on the surplus pieces, the remaining cutting tasks are then globally layoutd on the original pieces, ultimately outputting a combined cutting scheme that integrates the surplus piece cutting sub-schemes and the original piece cutting sub-schemes. This technical solution achieves two key advantages: First, it completely eliminates the reliance on manual memory and judgment for surplus piece usage in traditional methods. Operators no longer need to recall whether there are available surplus pieces or determine whether they are suitable for the current task. The system automatically prioritizes eligible surplus pieces in the layout calculation, fundamentally preventing the possibility of surplus pieces being forgotten or left idle. Second, surplus piece layout and original piece layout are no longer two separate processes but are planned and connected within the same optimization framework. This ensures that the original pieces are not used before all available surplus pieces are exhausted, significantly reducing the consumption of new original pieces.

[0074] S400. Based on the combined cutting scheme, the material loading and unloading device is controlled to sequentially transfer the corresponding substrate from the target material carrying unit to the processing station.

[0075] The material loading and unloading device follows the substrate sequence determined in the combined cutting scheme, for example, taking the first remaining sheet, then the second remaining sheet, and finally the original sheet. Through this invention, the material retrieval sequence precisely corresponds to the storage sequence recorded in the inventory sequence information. The last substrate stored in the warehouse shelf is retrieved in a predetermined order, preventing disruption of the storage order due to manual searching. Simultaneously, continuous automated operation avoids the process interruption required by manually resetting cutting parameters when replacing the original sheet after using up the remaining sheets, as is common in traditional methods. This improves equipment utilization and production line smoothness, and more importantly, significantly reduces the frequency of direct manual contact with the remaining sheets, lowering the safety risks posed by sharp glass edges and improving the working environment on the production floor.

[0076] In this embodiment of the invention, the process of storing the non-standard specification substrates mixed within the target material carrying unit specifically includes:

[0077] Obtain the attribute information of the non-standard specification substrate, including material parameters and size parameters;

[0078] Verify whether the material parameters of the non-standard substrate are consistent with the material parameters of the standard substrate already stored in the target material carrier unit;

[0079] If they match, the non-standard substrate can be stored in the target material carrier unit; if they do not match, a prompt will be made to replace the storage unit.

[0080] Identification information is generated based on the attribute information, and the identification information is bound to the storage location and storage order of the non-standard specification substrate in the target material carrying unit to update the inventory sequence information.

[0081] Through the above steps, when the layout optimization model performs cutting and layout, the original and surplus pieces within the same glass holder have identical material parameters. They can be directly merged for the same layout calculation without requiring separate processing or additional labeling of material differences for different substrates. This simplifies the input parameters and calculation logic of the layout optimization model. Understandably, without material verification, surplus pieces of different materials stored in the same glass holder would not only lead to material confusion during subsequent handling and quality issues with incorrect material in the finished product, but also prevent the layout optimization model from incorporating the original and surplus pieces into the same optimization framework due to inconsistent material parameters.

[0082] In this embodiment of the invention, the operation of binding the identification information with the storage location and storage order of the non-standard specification substrate within the target material carrying unit, and updating the inventory sequence information specifically includes:

[0083] The material and dimensional parameters of the non-standard substrate are read using an identification device.

[0084] Based on the material parameters and the size parameters, an identification information containing QR code or radio frequency identification data is generated, and the identification information is attached to the surface of the non-standard specification substrate.

[0085] The identification information and the storage location and storage order of the non-standard specification substrate in the target material carrying unit are written into the warehouse management database to form a mixed inventory sequence containing standard specification substrates and non-standard specification substrates of the same material arranged in storage order. The storage order is used to indicate the grab priority of the material loading and unloading device when taking out the substrate.

[0086] It is understood that the present invention utilizes the storage order to indicate the grasping priority of the material loading and unloading device when taking out the substrate, directly mapping the physical storage location to the mechanically executed sequential instructions, so that the material loading and unloading device can accurately grasp the target substrate without the need for visual recognition or additional sensors, simplifying the equipment control logic and reducing system deployment costs and failure rates.

[0087] Example 1

[0088] The following example, using a cutting task on a glass deep processing production line, illustrates how surplus sheets are identified, marked, and stored in the target material carrying unit.

[0089] like Figure 2 As shown, the glass deep processing production line includes a raw glass storage area 10, an integrated loading and unloading machine 20, a cutting production line 30, and an MES system (not shown in the figure).

[0090] The raw glass storage area 10 is equipped with multiple storage glass racks 11, which are target material carrying units. Each storage glass rack 11 is used to carry glass substrates. In this embodiment, the target material carrying unit is a storage glass rack that can store 22 pieces of glass. Currently, the storage glass rack stores 20 standard-sized substrates, all of which are 3660mm×2300mm×5mm clear glass raw sheets.

[0091] The cutting production line 30 performs steps according to actual needs. For example, in a specific embodiment of the present invention, the cutting production line 30 includes a laser marking table, a cutting machine and a splitting table arranged in sequence. During normal production, the substrate to be processed passes through the above-mentioned equipment in sequence and is processed.

[0092] After the cutting production line 30 completes the cutting of a batch of finished products, the MES system automatically identifies the remaining glass sheets based on the cutting layout record. The MES system has preset size thresholds for recyclable leftover sheets; for example, sheets larger than 500mm × 500mm are considered recyclable leftover sheets. For leftover sheets smaller than this threshold, the system determines them as non-recyclable waste and does not recycle them; for leftover sheets larger than or equal to this threshold, the system determines them as recyclable leftover sheets and triggers the leftover sheet recycling process.

[0093] Taking a single cutting task as an example, such as Figure 3 As shown, after completing the required number of finished product cuts, the last original piece (3660mm×2300mm×5mm) was not fully utilized. After cutting, two leftover pieces with dimensions of 1900mm×3300mm×5mm and 540mm×1908mm×5mm will be generated. Both of them are larger than the preset threshold of 500mm×500mm, and the MES system determines them to be recyclable leftover pieces.

[0094] The MES system acquires the attribute information of the remaining sheets, including the material parameter of clear glass and the dimensions of 1900mm×3300mm×5mm and 540mm×1908mm×5mm. The MES system then prints QR code labels containing this information. The operator affixes the QR code labels to the surfaces of the two remaining sheets.

[0095] Subsequently, the operator used a handheld barcode scanner (i.e., identification device) to scan the QR code labels on the two remaining wafers in sequence. The handheld barcode scanner then sent the read wafer attribute information to the MES system, informing the MES system of the specifications, material, and other information of the wafers that were about to be processed.

[0096] After confirming the remaining sheet information, the MES system first verifies whether the material parameters of the remaining sheet are consistent with the material parameters of the standard-specification substrate already stored in the target material carrier unit. In this embodiment, both remaining sheets are made of 5mm clear glass, which is consistent with the material of the 3660mm×2300mm×5mm clear glass original sheet already stored in the target glass holder. The verification passes, and the remaining sheets are allowed to be stored in the glass holder. If the material of the remaining sheet is inconsistent with the material of the existing substrate in the glass holder (for example, the glass holder stores clear glass, while the remaining sheet is ultra-clear glass), the MES system prompts the operator to change the storage unit and store the remaining sheet in another glass holder with a matching material.

[0097] After the material verification is passed, the MES system controls the loading / unloading machine 20 (i.e., the material loading and unloading device) to transfer the 1900mm×3300mm×5mm excess sheet from the cutting table back to the empty storage position of the target glass shelf. This excess sheet is placed at the top of the glass shelf (i.e., the first layer / first position). After the first excess sheet is unloaded, the loading / unloading machine then transfers the 540mm×1908mm×5mm excess sheet back to the same glass shelf and places it in the second layer / second position.

[0098] Simultaneously with the completion of the physical unloading operation, the MES system writes the identification information (QR code data), material parameters, size parameters, and storage location (shelf number + stacking sequence number) of the two remaining glass pieces into the warehouse management database, forming updated inventory sequence information. The final inventory sequence information for this glass shelf is as follows: Piece 1: 540mm×1908mm×5mm clear glass (remaining piece); Piece 2: 1900mm×3300mm×5mm clear glass (remaining piece); Pieces 3 to 22: 3660mm×2300mm×5mm clear glass (original pieces).

[0099] Through the above process, standard and non-standard substrates of the same material are mixed and stored within the same target material carrying unit. The storage order (i.e., the stacked storage sequence number) is recorded in the inventory sequence information, and this order will serve as the priority for subsequent retrieval of substrates.

[0100] In this embodiment of the invention, the typesetting optimization model adopts a two-stage typesetting strategy:

[0101] First stage: According to the storage order of non-standard specification substrates recorded in the inventory sequence information, local layout is performed sequentially with the outline of each non-standard specification substrate as the boundary to generate one or more first cutting sub-schemes;

[0102] Second stage: Take the remaining cutting sub-tasks that are not covered by each of the first cutting sub-schemes in the cutting task, perform global layout with the standard specification substrate as the boundary, and generate the second cutting sub-scheme.

[0103] The combined cutting scheme is generated based on each of the first cutting sub-scheme and the second cutting sub-scheme.

[0104] In traditional layout methods, all finished products are globally optimized and laid out on the same standard original sheet. Leftover sheets, if not processed separately, are not included in the layout calculation. This invention employs a two-stage strategy: in the first stage, each leftover sheet is treated as an independent layout boundary for local optimization; in the second stage, the uncovered remaining tasks are globally optimized on the original sheet. The layout results from both stages are then combined into a complete combined cutting scheme. This strategy transforms the issue of leftover sheet usage from whether manual intervention is required to automatically incorporating it into the optimization calculation, achieving collaborative layout of leftover sheets and original sheets without increasing the computational complexity of the layout optimization model. It should be noted that if all substrates (leftover sheets and original sheets of different specifications) are mixed in the same layout calculation, the layout optimization model needs to handle high-dimensional combinatorial optimization problems due to the significant differences in the size and specifications of each substrate. The computational complexity and time consumption will increase exponentially, making it difficult to meet real-time scheduling requirements in actual production.

[0105] In this embodiment of the invention, the first stage specifically includes:

[0106] Based on the property information of the current non-standard specification substrate, select a set of cutting sub-tasks that can be accommodated from the cutting tasks;

[0107] The layout calculation is performed on the set of cutting subtasks within the outline of the current non-standard specification substrate to obtain the layout utilization rate;

[0108] If the layout utilization rate is greater than or equal to the preset utilization rate threshold, the current layout result is taken as the first cutting sub-scheme, and the current non-standard specification substrate is marked as used from the inventory sequence information;

[0109] If the layout utilization rate is less than the preset utilization rate threshold, then skip the current non-standard specification substrate and keep it in the inventory sequence information, and traverse the next non-standard specification substrate in the inventory sequence information.

[0110] It is understandable that in this invention, surplus pieces are not necessarily used simply because they exist. In actual production, surplus pieces vary in size and specifications. When their size does not match the finished product size of the current cutting task, forcibly laying out the pieces on them will result in extremely low layout utilization. For example, cutting only a small finished product from a 540mm×1908mm surplus piece results in a utilization rate of less than 20%. In this case, using the surplus piece is extremely inefficient and will reduce production efficiency by adding an extra loading operation, while also occupying production time that could have been used for cutting the original piece. By setting a utilization threshold (e.g., 70%), the system automatically quantifies the value of each surplus piece. Only when a surplus piece has a high utilization value in the current cutting task is it used. Surplus pieces with a layout utilization rate below the threshold are retained in the inventory sequence information, waiting for a more suitable cutting task to appear. This selective use mechanism avoids the efficiency loss caused by using surplus pieces for the sake of using them, and achieves a dynamic balance between surplus piece utilization and production efficiency. Meanwhile, this judgment step is built into the two-stage strategy of the layout optimization model and is executed completely automatically, without the need for manual evaluation and decision-making on a piece-by-piece basis.

[0111] In this embodiment of the invention, based on the combined cutting scheme, the operation of controlling the material loading and unloading device to sequentially transfer the corresponding substrate from the target material carrying unit to the processing station specifically includes:

[0112] The material grabbing order in the combined cutting scheme is analyzed, and the material grabbing order is based on the storage order of non-standard specification substrates in the inventory sequence information, which preferentially points to the non-standard specification substrates.

[0113] Based on the material grabbing sequence, generate equipment control instructions;

[0114] The equipment control command is sent to the material loading and unloading device to control the material loading and unloading device to transfer the corresponding non-standard specification substrates and standard specification substrates from the target material carrying unit to the processing station in the order of storage.

[0115] In this invention, by converting the substrate sequence information in the layout scheme into mechanical equipment control signals that the material loading and unloading device can execute, the layout scheme can be executed accurately and without error. In addition, after the material loading and unloading device completes the transfer of a substrate, the system can confirm the execution status through feedback signals and trigger the sending of the next instruction, thereby realizing continuous automatic production.

[0116] Example 2

[0117] The following example, using a new cutting task, illustrates how the system utilizes inventory sequence information to prioritize the use of surplus pieces and coordinate the layout of original and surplus pieces.

[0118] Based on the above embodiment 1, the inventory sequence information of the target and the glass frame is as follows: 1st piece: 540mm×1908mm×5mm clear glass (remaining pieces); 2nd piece: 1900mm×3300mm×5mm clear glass (remaining pieces); 3rd to 22nd pieces: 3660mm×2300mm×5mm clear glass (original pieces).

[0119] When the MES system receives a new cutting task, such as cutting 196 finished products made of 5mm clear glass, the MES system first obtains the inventory sequence information within the target material carrying unit. This inventory sequence information includes at least the attribute information and storage order of the standard specification substrate.

[0120] Based on inventory sequence information, the MES system prioritizes non-standard specification substrates (i.e., surplus sheets) as layout optimization objects and inputs them into the layout optimization model according to their storage order. Specifically, the layout optimization model adopts a two-stage layout strategy:

[0121] Phase 1 (Local Layout): The layout optimization model performs local layout according to the storage order of non-standard specification substrates recorded in the inventory sequence information, using the outline of each non-standard specification substrate as the boundary.

[0122] First, the layout optimization model reads the first non-standard substrate, i.e., 540mm×1908mm×5mm clear glass. Based on the substrate's size parameters, the model selects a set of cutting sub-tasks from the current cutting tasks that can be accommodated within this contour, i.e., the finished products with dimensions smaller than 540mm×1908mm. Then, the model performs two-dimensional layout calculations within this contour to obtain the layout utilization rate. If the layout utilization rate is greater than or equal to a preset utilization rate threshold (e.g., 70%), the current layout result is used as the first cutting sub-scheme, and the non-standard substrate is marked as "used" in the inventory sequence information. If the layout utilization rate is less than the preset utilization rate threshold, the current non-standard substrate is skipped, retained in the inventory sequence information, and the process continues to iterate through the next non-standard substrate.

[0123] In this embodiment, assuming that several small-sized finished products can be cut from the remaining 540mm×1908mm sheet, and the layout utilization rate reaches a preset threshold, the model uses this as the first cutting sub-scheme. Subsequently, the model reads the second non-standard substrate: 1900mm×3300mm×5mm clear glass, and takes the remaining finished products from the 196 finished products not covered by the first cutting sub-scheme as input. It then performs local layout within the outline of this remaining sheet to generate the second cutting sub-scheme. Assuming that the layout utilization rate of this remaining sheet also reaches the preset threshold, the model uses this as the second cutting sub-scheme.

[0124] The second stage (global layout): The model will perform global layout of the remaining cutting sub-tasks that are not covered by the first cutting sub-schemes mentioned above, using the standard specification substrate (3660mm×2300mm×5mm white glass sheet) as the boundary, to generate the third cutting sub-scheme.

[0125] Finally, the layout optimization model generates a complete combined cutting scheme based on the first cutting sub-scheme (partial finished products cut from the remaining 540mm×1908mm sheet), the second cutting sub-scheme (partial finished products cut from the remaining 1900mm×3300mm sheet), and the third cutting sub-scheme (the remaining finished products cut from the original 3660mm×2300mm sheet).

[0126] After the combined cutting scheme is generated, the MES system parses the material grabbing order in the scheme. According to the scheduling logic of the present invention, the material grabbing order prioritizes non-standard specification substrates and grabs them sequentially from first to last according to the storage order in the inventory sequence information. In this embodiment, the grabbing order is as follows: first grab the first piece (540mm×1908mm and the remainder), then grab the second piece (1900mm×3300mm and the remainder), and finally grab the original pieces (3660mm×2300mm original pieces) from the third to the 22nd pieces.

[0127] The MES system generates equipment control instructions based on the material grabbing sequence described above and sends these instructions to the integrated loading and unloading machine. Following the instructions, the integrated loading and unloading machine first grabs the first remaining piece (540mm×1908mm×5mm clear glass) from the target glass holder and transfers it to the cutting station. After cutting, it grabs the second remaining piece (1900mm×3300mm×5mm clear glass) and transfers it to the cutting station. Finally, it grabs the standard-sized substrate (3660mm×2300mm×5mm clear glass sheet) and transfers it to the cutting station, completing the cutting of all 196 finished pieces.

[0128] In this embodiment of the invention, the integrated management method for original and surplus wafers further includes:

[0129] After cutting is completed at the processing station, the actual size parameters of the remaining substrate are identified based on the cutting layout record using the layout optimization model or the MES system.

[0130] If the actual size parameter is greater than or equal to the preset size threshold, the remaining substrate is determined to be a recyclable scrap, and the scrap recycling trigger signal generated by the cutting task is triggered.

[0131] The material loading and unloading device is controlled to transfer the recyclable scrap as a new non-standard specification substrate back to the empty storage space of the target material carrying unit;

[0132] Obtain the attribute information of new non-standard specification substrates, generate corresponding identification information, and append it to the end of the inventory sequence information to complete the closed loop of surplus wafer recycling.

[0133] Example 3

[0134] This embodiment 3 takes the completion of the cutting task in embodiment 2 as an example to illustrate how the system can automatically identify newly generated recyclable scraps and incorporate them back into the warehouse management, forming a complete recycling closed loop.

[0135] In the cutting task of Example 2, the integrated upper and lower sheet cutting machine sequentially transfers the first remaining sheet (540mm×1908mm), the second remaining sheet (1900mm×3300mm), and the standard-sized substrate (3660mm×2300mm original sheet) to the cutting station to complete the cutting according to the combined cutting scheme. After the cutting is completed, new remaining sheet material may be generated on each substrate sheet.

[0136] For each completed substrate, the MES system identifies the actual size parameters of the remaining substrate based on the cutting layout record. Specifically, when generating the combined cutting scheme, the layout optimization model has accurately recorded which finished products were cut from each substrate, as well as the size and position of the remaining area after cutting. Therefore, the MES system can directly obtain the size parameters of the remaining substrate from the cutting layout record without the need for additional visual inspection devices or sensors.

[0137] The MES system compares the actual size parameters of the remaining substrate with a preset size threshold (e.g., 500mm × 500mm). If the actual size parameter is greater than or equal to the preset size threshold, the remaining substrate is determined to be recyclable scrap, triggering a scrap recycling trigger signal; if the actual size parameter is less than the preset size threshold, it is determined to be non-recyclable waste and will not be recycled.

[0138] Taking this embodiment as an example, assuming that after the remaining finished products are cut on the original 3660mm×2300mm sheet, a remaining sheet with a size of 1200mm×800mm×5mm is generated. This size is greater than the preset threshold of 500mm×500mm, and the MES system determines that it is a recyclable remaining sheet.

[0139] The MES system acquires the attribute information of the new glass sheet (material: 5mm clear glass; size: 1200mm×800mm), automatically prints a QR code label containing the above information, and the operator affixes the label to the surface of the new glass sheet and scans it with a handheld barcode scanner. After the MES system verifies that the material of the new glass sheet matches the material of the existing substrate in the target glass rack, it controls the loading / unloading machine to move the new glass sheet back to an empty storage space in the target glass rack. The new glass sheet is placed at the very top of the glass rack (i.e., at the end of the current inventory sequence).

[0140] Simultaneously, the MES system writes the identification information, material parameters, size parameters, and storage location of the new surplus glass pane into the warehouse management database, appending it to the end of the inventory sequence information. The updated inventory sequence information is as follows: Piece 1: 540mm×1908mm×5mm clear glass (marked as "used," removed or marked from the sequence); Piece 2: 1900mm×3300mm×5mm clear glass (marked as "used"); Pieces 3 to 22: 3660mm×2300mm×5mm clear glass (partially used, the number of remaining pieces decreased accordingly); Piece 23: 1200mm×800mm×5mm clear glass (newly recovered surplus glass).

[0141] Through the above process, a complete cycle of surplus sheet generation, automatic recycling, and sequence recording is completed. When a new cutting task arrives again, the newly recycled surplus sheet (the 23rd sheet) will be included in the inventory sequence information as a non-standard specification substrate and will be prioritized for use according to the order of storage.

[0142] According to the technical solution provided by this invention, the MES system automatically identifies the size of the remaining substrate based on the cutting and layout records, eliminating the need for additional visual inspection hardware to determine the remaining pieces and reducing system deployment costs. By appending newly recovered remaining pieces to the end of the inventory sequence information, dynamic expansion and real-time synchronization of inventory data are achieved, ensuring that recyclable remaining pieces generated from each cutting process are automatically identified, stored, and included in the next layout candidate. This closed-loop mechanism eliminates reliance on accidental human discovery or deliberate memorization for the reuse of remaining pieces, internalizing it as a standard system operation process. Newly generated recyclable remaining pieces automatically enter the recycling process after cutting, creating a continuous cycle. This makes the original sheet storage system a truly unified management platform for both original sheets and remaining pieces, achieving sustainability and self-circulation capabilities in remaining piece management.

[0143] This invention also provides an integrated management device for original and surplus wafers, including a storage management module, a surplus wafer recycling module, a layout scheduling module, and an execution control module;

[0144] The storage management module is used to obtain the inventory sequence information within the target material carrying unit. The inventory sequence information includes at least the attribute information and storage order of standard specification substrates. The target material carrying unit is used to mix and store standard specification substrates and non-standard specification substrates of the same material.

[0145] The waste sheet recycling module is used to respond to the waste sheet recycling trigger signal generated by the cutting task, obtain the attribute information of the waste sheet, transfer the waste sheet as the non-standard specification substrate to the empty storage space of the target material carrying unit, and add the attribute information of the waste sheet and its storage order in the target material carrying unit to the inventory sequence information.

[0146] The layout scheduling module is used to respond to the receipt of a new cutting task, and based on the inventory sequence information, input the non-standard specification substrates as priority layout objects into the layout optimization model according to the storage order to generate a combined cutting scheme.

[0147] The execution control module is used to control the material loading and unloading device to sequentially transfer the corresponding substrate from the target material carrying unit to the processing station based on the combined cutting scheme.

[0148] In the integrated management device provided by this invention, a storage management module establishes the data foundation for inventory sequence information, a surplus piece recycling module realizes automatic recycling and sequence updating after surplus pieces are generated, a layout scheduling module completes the generation of priority layout and combination cutting schemes for surplus pieces, and an execution control module achieves precise mapping from scheme to physical execution. These four modules transmit information through the unified data carrier of inventory sequence information: the storage management module establishes the data foundation, the surplus piece recycling module realizes data updates, the layout scheduling module completes data application, and the execution control module achieves physical execution, forming a complete data-driven management closed loop. The modules are decoupled, allowing for independent deployment and upgrades, facilitating integration with existing MES systems, and exhibiting good compatibility and scalability. Those skilled in the art should understand that the above modules can be different functional units running in the same control terminal, or independent service units distributed across multiple computing nodes according to actual deployment needs, all of which are within the scope of protection of this invention.

[0149] This invention also provides an integrated management system for original and surplus wafers, including a target material carrying unit, a material loading and unloading device, an identification device, and a control terminal;

[0150] The target material carrying unit is used for mixed storage of standard and non-standard substrates of the same material.

[0151] The material loading and unloading device is used to transfer the substrate between the target material carrying unit and the processing station, and the processing station is used to perform a cutting operation on the transferred substrate.

[0152] The identification device is used to read the attribute information of the substrate;

[0153] The control terminal is communicatively connected to the material loading and unloading device, the processing station, and the identification device. The control terminal is configured to execute the above-described integrated management method for original and surplus films.

[0154] The integrated management system provided by this invention achieves integrated management of the entire process of raw glass and surplus glass from storage, identification, scheduling to cutting and recycling through the coordinated operation of the target material carrying unit, material loading and unloading device, identification and recognition device, and control terminal. Specifically, the target material carrying unit provides a hardware foundation for fully utilizing storage space by allowing the mixed storage of raw and surplus glass of the same material at the physical level; the identification and recognition device provides the system with accurate input data by reading QR codes or RFID tags on the surface of the substrate; the control terminal organically integrates physical equipment and data logic by executing the method of this invention; and the material loading and unloading device acts as the actuator to complete the physical transfer of the substrate. This system does not require the purchase of dedicated vertical or horizontal surplus glass storage equipment; it only requires upgrading the existing loading table into an integrated loading and unloading machine and adding a handheld barcode scanner. This upgrade can be completed on the basis of existing raw glass storage equipment, resulting in low equipment investment costs and a short transformation cycle, making it suitable for widespread application in small and medium-sized glass deep processing enterprises.

[0155] This invention also provides an electronic device, including a processor and a memory, wherein the memory stores machine-executable instructions that can be executed by the processor, and the processor can execute the machine-executable instructions to implement the above-described integrated management method for original and surplus wafers.

[0156] In this invention, the processor contains a kernel, which retrieves the corresponding program units from memory. One or more kernels can be configured.

[0157] The memory may include non-permanent memory in a computer-readable storage medium, such as random access memory (RAM) and / or non-volatile memory, such as read-only memory (ROM) or flash RAM, and the memory includes at least one memory chip.

[0158] This invention also provides a computer-readable storage medium storing a computer program thereon, which, when executed by a processor, implements the above-described integrated management method for original and surplus wafers.

[0159] Those skilled in the art will understand that embodiments of the present invention can be provided as methods, systems, or computer program products. Therefore, the present invention can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, the present invention can take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0160] This invention is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the invention. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart illustrations and / or block diagrams. Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0161] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0162] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0163] In a typical configuration, a computing device includes one or more processors (CPU), input / output interfaces, network interfaces, and memory.

[0164] Memory may include non-persistent memory in computer-readable storage media, such as random access memory (RAM) and / or non-volatile memory, such as read-only memory (ROM) or flash RAM. Memory is an example of a computer-readable storage medium.

[0165] Computer-readable storage media include both permanent and non-permanent, removable and non-removable media that can store information by any method or technology. Information can be computer-readable instructions, data structures, program modules, or other data. Examples of computer storage media include, but are not limited to, phase-change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technologies, CD-ROM, digital versatile optical disc (DVD) or other optical storage, magnetic tape, magnetic magnetic disk storage or other magnetic storage devices, or any other non-transferable medium that can be used to store information accessible by a computing device. As defined herein, computer-readable storage media does not include transient media, such as modulated data signals and carrier waves.

[0166] In summary, the integrated management method, apparatus, system, electronic equipment, and storage medium for raw and surplus glass provided by this invention can be widely applied to the field of raw glass storage and cutting layout management in the glass deep processing industry.

[0167] By changing the storage logic of the original film storage, the original film storage rack can simultaneously store original films and surplus films of the same material. By using the MES system to realize the automatic recycling, priority layout and recycling of surplus films, this invention effectively solves the technical problems of high cost of surplus film management, inconvenient access and low utilization rate in the prior art without increasing a lot of hardware investment. It has significant industrial application value and economic benefits.

[0168] It should also be noted that the term "comprising," or any other variation thereof, is intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0169] The foregoing has shown and described the basic principles, main features, and characteristics of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the invention as claimed. The scope of protection of this invention is defined by the appended claims and their equivalents.

Claims

1. A method for integrated management of original wafers and surplus wafers, characterized in that, include: Obtain inventory sequence information within the target material carrying unit, wherein the inventory sequence information includes at least the attribute information and storage order of standard specification substrates; the target material carrying unit is used for mixed storage of standard specification substrates and non-standard specification substrates of the same material; In response to the scrap recycling trigger signal generated by the cutting task, the attribute information of the scrap is obtained, the scrap is transferred as the non-standard specification substrate to the empty storage space of the target material carrying unit, and the attribute information of the scrap and its storage order in the target material carrying unit are added to the inventory sequence information. In response to receiving a new cutting task, based on the inventory sequence information, the non-standard specification substrates are input into the layout optimization model as priority layout objects according to the storage order to generate a combined cutting scheme; Based on the combined cutting scheme, the material loading and unloading device sequentially transfers the corresponding substrate from the target material carrying unit to the processing station.

2. The integrated management method for original and surplus films according to claim 1, characterized in that, The process of storing the non-standard substrate materials mixed in the target material carrying unit specifically includes: Obtain the attribute information of the non-standard specification substrate, including material parameters and size parameters; Verify whether the material parameters of the non-standard substrate are consistent with the material parameters of the standard substrate already stored in the target material carrier unit; If they match, the non-standard substrate can be stored in the target material carrier unit; if they do not match, a prompt will be made to replace the storage unit. Identification information is generated based on the attribute information, and the identification information is bound to the storage location and storage order of the non-standard specification substrate in the target material carrying unit to update the inventory sequence information.

3. The integrated management method for original and surplus films according to claim 2, characterized in that, The operation of binding the identification information with the storage location and storage order of the non-standard specification substrate within the target material carrying unit, and updating the inventory sequence information specifically includes: The material and dimensional parameters of the non-standard substrate are read using an identification device. Based on the material parameters and the size parameters, an identification information containing QR code or radio frequency identification data is generated, and the identification information is attached to the surface of the non-standard specification substrate. The identification information and the storage location and storage order of the non-standard specification substrate in the target material carrying unit are written into the warehouse management database to form a mixed inventory sequence containing standard specification substrates and non-standard specification substrates of the same material arranged in storage order. The storage order is used to indicate the grab priority of the material loading and unloading device when taking out the substrate.

4. The integrated management method for original and surplus films according to claim 1, characterized in that, The layout optimization model adopts a two-stage layout strategy: First stage: According to the storage order of non-standard specification substrates recorded in the inventory sequence information, local layout is performed sequentially with the outline of each non-standard specification substrate as the boundary to generate one or more first cutting sub-schemes; Second stage: Take the remaining cutting sub-tasks that are not covered by each of the first cutting sub-schemes in the cutting task, perform global layout with the standard specification substrate as the boundary, and generate the second cutting sub-scheme. Based on each of the first cutting sub-schemes and the second cutting sub-schemes, the combined cutting scheme is generated; Preferably, the first stage specifically includes: Based on the property information of the current non-standard specification substrate, select a set of cutting sub-tasks that can be accommodated from the cutting tasks; The layout calculation is performed on the set of cutting subtasks within the outline of the current non-standard specification substrate to obtain the layout utilization rate; If the layout utilization rate is greater than or equal to the preset utilization rate threshold, the current layout result is taken as the first cutting sub-scheme, and the current non-standard specification substrate is marked as used from the inventory sequence information; If the layout utilization rate is less than the preset utilization rate threshold, then skip the current non-standard specification substrate and keep it in the inventory sequence information, and traverse the next non-standard specification substrate in the inventory sequence information.

5. The integrated management method for original and surplus films according to claim 1, characterized in that, Based on the aforementioned combined cutting scheme, the operation of controlling the material loading and unloading device to sequentially transfer the corresponding substrate from the target material carrying unit to the processing station specifically includes: The material grabbing order in the combined cutting scheme is analyzed, and the material grabbing order is based on the storage order of non-standard specification substrates in the inventory sequence information, which preferentially points to the non-standard specification substrates. Based on the material grabbing sequence, generate equipment control instructions; The equipment control command is sent to the material loading and unloading device to control the material loading and unloading device to transfer the corresponding non-standard specification substrates and standard specification substrates from the target material carrying unit to the processing station in the order of storage.

6. The integrated management method for original and surplus films according to claim 5, characterized in that, Also includes: After cutting is completed at the processing station, the actual size parameters of the remaining substrate are identified based on the cutting layout record using the layout optimization model or the MES system. If the actual size parameter is greater than or equal to the preset size threshold, the remaining substrate is determined to be a recyclable scrap, and the scrap recycling trigger signal generated by the cutting task is triggered. The material loading and unloading device is controlled to transfer the recyclable scrap as a new non-standard specification substrate back to the empty storage space of the target material carrying unit; Obtain the attribute information of new non-standard specification substrates, generate corresponding identification information, and append it to the end of the inventory sequence information to complete the closed loop of surplus wafer recycling.

7. An integrated management device for original wafers and surplus wafers, characterized in that, include: The storage management module is used to acquire inventory sequence information within the target material carrying unit. The inventory sequence information includes at least the attribute information and storage order of standard specification substrates. The target material carrying unit is used to mix and store standard specification substrates and non-standard specification substrates of the same material. The waste sheet recycling module is used to respond to the waste sheet recycling trigger signal generated by the cutting task, obtain the attribute information of the waste sheet, transfer the waste sheet as the non-standard specification substrate to the empty storage space of the target material carrying unit, and add the attribute information of the waste sheet and its storage order in the target material carrying unit to the inventory sequence information. The layout scheduling module is used to respond to the receipt of a new cutting task, and based on the inventory sequence information, input the non-standard specification substrates as priority layout objects into the layout optimization model according to the storage order to generate a combined cutting scheme. The execution control module is used to control the material loading and unloading device to sequentially transfer the corresponding substrate from the target material carrying unit to the processing station based on the combined cutting scheme.

8. An integrated management system for original and surplus films, characterized in that, include: The target material carrying unit is used for mixed storage of standard and non-standard substrates of the same material. A material loading and unloading device is used to transfer a substrate between the target material carrying unit and the processing station, wherein the processing station is used to perform a cutting operation on the transferred substrate. A labeling and identification device used to read the attribute information of the substrate; The control terminal is communicatively connected to the material loading and unloading device, the processing station, and the identification device, and the control terminal is configured to perform the integrated management method for original and surplus films as described in any one of claims 1-6.

9. An electronic device, characterized in that, The method includes a processor and a memory, wherein the memory stores machine-executable instructions that can be executed by the processor, and the processor can execute the machine-executable instructions to implement the integrated management method for original wafers and surplus wafers as described in any one of claims 1-6.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, it implements the integrated management method for original and surplus wafers as described in any one of claims 1-6.

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