Flexible circuit board reinforcing metal sheet adhesion quality full life cycle tracing method

Abstract

The application discloses a flexible circuit board reinforcing metal sheet bonding quality full life cycle tracing method, and relates to the field of mechanical vision detection, and comprises the following steps: acquiring failure parameters and defect detection data of each quality defect; acquiring failure parameter characteristics corresponding to quality defects and full cycle defect source points; and finally, based on the detection failure parameters of each real-time bonding defect and the full cycle defect source points, acquiring the defect causes of the real-time bonding defect; the application is used to solve the problem that in the aspect of reinforcing metal sheet bonding quality tracing, there is a lack of method for matching each production process node and detection cycle by relying on defect quantitative characterization information, the defect appearance cannot be associated with the production stage, only the explicit detected defects can be processed, it is difficult to locate the later period of the hidden defects, and the tracing efficiency is low and the cause judgment is subjective.

Description

Technical Field

[0001] This invention relates to the field of machine vision inspection technology, specifically a method for tracing the entire lifecycle of the bonding quality of reinforcing metal sheets on flexible circuit boards. Background Technology

[0002] Flexible circuit board (FPC) reinforcing metal sheets are metal auxiliary materials that are bonded to FPCs. Their core function is to compensate for the structural shortcomings of flexible substrates, taking into account both the flexibility of FPCs and the local rigidity requirements. They are one of the core auxiliary materials for ensuring the reliability of precision electronic equipment. The full life cycle traceability of the bonding quality of FPC reinforcing metal sheets is a digital quality control system covering the entire chain from raw material entry, production and processing to finished product delivery and after-sales service, targeting the key process of bonding metal reinforcing sheets in FPC production.

[0003] Existing methods for tracing the full lifecycle quality of FPC reinforcing sheet bonding typically involve acquiring images of the bonded FPC reinforcing steel sheets, performing preprocessing and feature extraction, identifying defects such as bonding misalignment, bubbles, and warping, and binding the defect information to the product code. This achieves automatic detection of FPC reinforcing sheet bonding defects and traceability of quality information. While this improved method can detect FPC defects, it lacks a method for tracing the source of reinforcing sheet bonding quality by matching the quantitative characterization information of defects to each production process node and detection cycle. This results in a lack of correlation between defect appearance and production stage, only handling visible defects and failing to locate latent defects that emerge later. Consequently, the traceability efficiency is low and the determination of the cause is highly subjective. For example, patent application CN120852423A discloses an FPC reinforcing sheet bonding quality detection method and system. This scheme determines the target defect area by cross-solving the defect feature vectors and identifying the intersection of each defect feature vector. The bonding judgment results of the target defect area are used to map the distribution points of defects after bonding, and determine the defect set during production. Other improvements to the full life cycle traceability method for the bonding quality of flexible circuit board reinforcing metal sheets are usually improvements in data and product binding. In terms of the traceability of the bonding quality of reinforcing metal sheets, there is still a lack of methods to match each production process node and detection cycle with the quantitative characterization information of defects. This results in the inability to associate the defect appearance with the production stage, and can only deal with obvious detected defects. It is difficult to locate latent defects that occur later, resulting in low traceability efficiency and strong subjectivity in cause judgment. In view of this, it is necessary to improve the existing full life cycle traceability method for the bonding quality of flexible circuit board reinforcing metal sheets. Summary of the Invention

[0004] This invention aims to at least partially solve one of the technical problems in the prior art. It addresses the lack of a method for tracing the bonding quality of reinforcing metal sheets in the existing full life cycle traceability methods for flexible circuit boards. In terms of tracing the bonding quality of reinforcing metal sheets, the method relies on the quantitative characterization information of defects to match each production process node and detection cycle. This results in the inability to correlate defect manifestations with production stages, and can only handle obvious defects. It is difficult to locate latent defects that occur later, leading to low traceability efficiency and strong subjectivity in the determination of causes.

[0005] To achieve the above objectives, this application provides a method for tracing the entire lifecycle of the bonding quality of reinforcing metal sheets in flexible printed circuit boards, including: All quality defects existing in the bonding quality inspection of the reinforcing metal sheet of the flexible circuit board are obtained, and the failure parameters and defect detection data corresponding to each quality defect are obtained respectively. Based on the failure parameters and defect detection data corresponding to each quality defect, all full-cycle defect source points for each quality defect are obtained, as well as the failure parameter characteristics of the quality defect and each corresponding full-cycle defect source point. When the bonding quality of the reinforcing metal sheet of the flexible circuit board is traced throughout its entire life cycle, the real-time bonding defects of the reinforcing metal sheet of the flexible circuit board are obtained, and the defect causes of the real-time bonding defects are obtained based on the detection failure parameters of each real-time bonding defect and the defect source points throughout the entire life cycle.

[0006] Furthermore, the process of acquiring all quality defects present in the bonding quality inspection of the flexible circuit board reinforcing metal sheet, and acquiring the failure parameters and defect detection data corresponding to each quality defect, includes: All quality inspection data of the reinforcing metal sheet of the flexible circuit board during the bonding stage and the use stage are recorded as bonding inspection data and use inspection data, respectively. Among them, the quality inspection data corresponding to the bonding stage are all the quality inspection data when the reinforcing metal sheet is bonded to the flexible circuit board, and the quality inspection data corresponding to the use stage are the data of periodic quality inspection of the bonding quality of the reinforcing metal sheet after it is bonded to the flexible circuit board. For bonding inspection data: Based on the process stage corresponding to when the reinforcing metal sheet is bonded to the flexible circuit board, the quality inspection data of the reinforcing metal sheet corresponding to different process stages in the bonding inspection data are recorded as stage inspection data JD1 to stage inspection data JD. u , where u is the number of process stages corresponding to when the reinforcing metal sheet is bonded to the flexible circuit board; Regarding the use of test data: Based on the requirement to periodically test the bonding quality of the reinforcing metal sheet after it is bonded to the flexible circuit board, the quality test data corresponding to different periodic tests in the test data will be sorted by time and recorded as periodic test data ZD1 to periodic test data ZD. m Where m represents the total number of reinforcing metal sheets subjected to periodic testing after being bonded to the flexible circuit board, and periodic test data ZD1 represents the first periodic test, and periodic test data ZD... m This is the last periodic test.

[0007] Furthermore, the process of acquiring all quality defects present during the bonding quality inspection of the flexible circuit board reinforcing metal sheet, and acquiring the failure parameters and defect detection data corresponding to each quality defect, further includes: For any test data α: the quality defect β of the reinforcing metal sheet in the test results of the reinforcing metal sheet in the test data α is recorded as the standard quality defect of the test data α, where the test data α is any stage test data or periodic test data; The characteristic parameter corresponding to the quality defect β when it is identified is recorded as the failure parameter of the quality defect β, and the detection data of the failure parameter in the detection data α is recorded as the defect detection data. Based on the analysis of the detection data α, we obtain all standard quality defects corresponding to each stage of detection data and each cycle of detection data, as well as the failure parameters and defect detection data corresponding to each standard quality defect.

[0008] Furthermore, in obtaining all full-cycle defect source points for each quality defect based on the failure parameters and defect detection data corresponding to each quality defect, the following is included: For any quality defect β obtained from stage inspection data and periodic inspection data: the process stage corresponding to the stage inspection data with quality defect β as the standard quality defect is recorded as the storable process stage of quality defect β, and the number of periods corresponding to the periodic inspection data with quality defect β as the standard quality defect is recorded as the storable period of quality defect β. All survivable process stages and survivable cycles of quality defect β are recorded as the full-cycle defect source points of quality defect β. For any full-cycle defect source point corresponding to quality defect β, the failure parameters of quality defect β in the defect detection data are sequentially denoted as the parameters to be analyzed, DC1 to DC2. r .

[0009] Furthermore, the process of acquiring all full-cycle defect source points for each type of quality defect, and the failure parameter characteristics of the quality defect and its corresponding full-cycle defect source point, further includes: For the parameter DC to be analyzed e Establish a Cartesian coordinate system with the x-axis in units of min and the y-axis in units of γ, and denote it as the parameter point analysis coordinate system, where e is a positive integer less than or equal to r and greater than 1, and γ is the parameter DC to be analyzed. e Units; Based on the parameter DC to be analyzed in the defect detection data e For all corresponding detection records, the data from the start time of the detection to the DC parameter to be analyzed in each detection record will be processed. e The time interval between the detected times is denoted as T, and the parameter to be analyzed is DC. e The detected value is denoted as R.

[0010] Furthermore, the process of acquiring all full-cycle defect source points for each type of quality defect, and the failure parameter characteristics of the quality defect and its corresponding full-cycle defect source point, further includes: In the parameter point analysis coordinate system, the point with T as the abscissa and R as the ordinate is recorded as the analysis parameter point of the detection record; the parameter DC to be analyzed in the defect detection data is obtained. e The corresponding analysis parameter points for all detection records are defined, and the smallest region in the parameter point analysis coordinate system that can encompass all analysis parameter points is denoted as the parameter DC to be analyzed. e Parameter characteristics; Construct a parameter point analysis coordinate system for each parameter to be analyzed, and denote the parameter point characteristics of all parameters to be analyzed as the failure parameter characteristics corresponding to the quality defect β and the full-cycle defect source point; Obtain the failure parameter characteristics corresponding to quality defect β and all full-cycle defect source points.

[0011] Furthermore, in the process of tracing the bonding quality of the flexible circuit board reinforcing metal sheet throughout its entire lifecycle, obtaining real-time bonding defects of the flexible circuit board reinforcing metal sheet, and obtaining the defect cause of the real-time bonding defect based on the detection failure parameters of each real-time bonding defect and the defect source point throughout the entire lifecycle, the following are included: When performing full lifecycle traceability of the bonding quality of the reinforcing metal sheet of flexible circuit board, based on the existing quality inspection methods for the reinforcing metal sheet, the corresponding defects of the reinforcing metal sheet are obtained and recorded as real-time bonding defects. For any real-time bonding defect: record the detection data corresponding to the real-time bonding defect as real-time defect data; record the detection records of the failure parameters corresponding to the real-time bonding defect in the real-time defect data as failure parameter records SC1 to failure parameter records SC2. b , where b is the number of failure parameters corresponding to real-time fitting defects.

[0012] Furthermore, in obtaining the defect cause of the real-time bonding defect based on the detection failure parameters of each real-time bonding defect and the defect source point throughout the entire cycle, the method further includes: For any failure parameter record and the failure parameter δ detected in the failure parameter record: obtain a parameter point analysis coordinate system with the horizontal axis in min and the vertical axis in γ1, where γ1 is the unit of the failure parameter δ. In the parametric analysis coordinate system, place the parametric features corresponding to the failure parameter δ in the failure parameter features corresponding to the real-time fitting defect and all full-cycle defect source points; In the failure parameter record, the time interval between the start of the detection and the time when the failure parameter is detected is recorded as T1, and the value obtained by the detection of the failure parameter is recorded as R1; in the parameter point analysis coordinate system, the point with the horizontal coordinate T1 and the vertical coordinate R1 is recorded as the real-time parameter point.

[0013] Furthermore, in obtaining the defect cause of the real-time bonding defect based on the detection failure parameters of each real-time bonding defect and the defect source point throughout the entire cycle, the method further includes: In the parameter point analysis coordinate system, the full-cycle defect source point corresponding to the parameter point feature containing real-time parameters is denoted as the defect survivable source point of the failure parameter δ. Obtain all possible source points of defects with failure parameter δ, and record the source point of defects with the most occurrences among all possible source points of defects with failure parameter δ as the source point of defect generation for real-time fitting defects.

[0014] Furthermore, in obtaining the defect cause of the real-time bonding defect based on the detection failure parameters of each real-time bonding defect and the defect source point throughout the entire cycle, the method further includes: The corresponding process stage or inspection cycle in which the real-time bonding defect is detected is recorded as the defect detection period. When the process stage or inspection cycle corresponding to the defect generation source point of the real-time bonding defect is after the defect inspection period, the defect generation source point will be removed from all defect generation sources of the real-time bonding defect. When the process stage or inspection cycle corresponding to the defect generation source point of the real-time fitting defect is before the defect inspection period, or when the process stage or inspection cycle corresponding to the defect generation source point is equal to the defect inspection period, the defect generation source point will be retained among all the defect generation source points of the real-time fitting defect. The defect generation source point of each real-time bonding defect is obtained, and the defect generation source point of the real-time bonding defect is either removed or retained; the process stage or inspection cycle corresponding to the retained defect generation source point is recorded as the time period in which the defect cause of the real-time bonding defect occurs.

[0015] The beneficial effects of this invention are as follows: 1. This application first obtains all quality defects existing in the bonding quality inspection of the reinforcing metal sheet of the flexible circuit board, and obtains the failure parameters and defect detection data corresponding to each quality defect. The advantage of this is that by obtaining various quality defects and their corresponding failure parameters and defect detection data, the defect quantitative characterization information can be uniformly collected, abandoning the simple manual visual qualitative judgment, providing a standardized data basis for subsequent source tracing analysis, realizing complete retention of defect information, and ensuring the data reliability of subsequent cause matching analysis. 2. This application also obtains all full-cycle defect source points for each quality defect based on the failure parameters and defect detection data corresponding to each quality defect, as well as the failure parameter characteristics of the quality defect and each corresponding full-cycle defect source point; finally, based on the detection failure parameters and full-cycle defect source points of each real-time bonding defect, the defect cause of the real-time bonding defect is obtained. The advantage of this is that by obtaining the full-cycle defect source points and parameter characteristics through failure parameters, and then matching them with real-time defect parameters to determine the cause, it is possible to accurately correspond defects with production stages and detection cycles, take into account both detection and latent defects in later use, reduce reliance on human experience, quickly locate the root cause, and improve the accuracy of defect tracing throughout the entire life cycle. Attached Figure Description

[0016] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0017] Figure 1 This is a flowchart illustrating the steps of the method of the present invention; Figure 2 This is a schematic diagram illustrating the acquisition of potential sources of defects in this invention. Detailed Implementation

[0018] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0019] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be used interchangeably where appropriate so that the embodiments of the invention described herein can cover implementations in sequences other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0020] With the rapid development of the flexible electronics industry, reinforcing metal sheets have been widely used for local reinforcement of flexible circuit boards, effectively improving product structural strength and assembly stability. However, due to the numerous bonding processes and complex service conditions, traditional testing methods are difficult to implement throughout the entire production and usage cycle, posing a significant challenge to accurate traceability of bonding quality. To address these issues, this application provides a method for full lifecycle traceability of the bonding quality of reinforcing metal sheets for flexible circuit boards, including: Step S1: Obtain all quality defects present in the bonding quality inspection of the flexible circuit board reinforcing metal sheet, and obtain the failure parameters and defect detection data corresponding to each quality defect. Step S1 includes the following sub-steps: Step S101, all quality inspection data of the reinforcing metal sheet of the flexible circuit board in the bonding stage and the use stage are recorded as bonding inspection data and use inspection data, respectively. The quality inspection data corresponding to the bonding stage is all the quality inspection data corresponding to when the reinforcing metal sheet is bonded to the flexible circuit board, and the quality inspection data corresponding to the use stage is the data of periodic quality inspection of the bonding quality of the reinforcing metal sheet after it is bonded to the flexible circuit board. In specific implementation processes, for example, the production stages corresponding to the reinforcement metal sheets of flexible printed circuit boards (FPCs) being bonded to the FPC include: reinforcement sheet pretreatment stage, FPC... The pre-treatment stage, alignment and bonding stage, lamination and venting stage, and post-curing stage can all be used to record the quality inspection data for the bonding stage. Similarly, after the reinforcing metal sheet is bonded to the flexible circuit board, the stages for periodically inspecting the bonding quality of the reinforcing metal sheet include: first batch inspection, batch online inspection, final product inspection, reliability testing, and customer incoming inspection. The quality inspection data for each of these stages can be recorded as the usage inspection data for the usage stage. Furthermore, if the customer still performs periodic quality inspections and retains the corresponding quality inspection data when using the flexible circuit board with the bonded reinforcing metal sheet, these periodic inspections can be supplemented later in the usage stage. For example, if the customer performs three periodic quality inspections after receiving the flexible circuit board with the bonded reinforcing metal sheet, the stages for periodic quality inspection of the bonding quality of the reinforcing metal sheet include: first batch inspection, batch online inspection, final product inspection, reliability testing, customer incoming inspection, customer's first inspection, customer's second inspection, and customer's third inspection. Step S102, for bonding inspection data: Based on the process stage corresponding to when the reinforcing metal sheet is bonded to the flexible circuit board, the quality inspection data of the reinforcing metal sheet corresponding to different process stages in the bonding inspection data are recorded as stage inspection data JD1 to stage inspection data JD. u , where u is the number of process stages corresponding to when the reinforcing metal sheet is bonded to the flexible circuit board; In the specific implementation process, for example, for the production stage obtained above, the value of u can be obtained as 5, and the corresponding stage detection data JD1 to stage detection data JD5 are respectively the reinforcement sheet pretreatment stage, FPC board pretreatment stage, alignment and bonding stage, pressing and venting stage, and post-curing stage; the subsequent periodic detection data are similar. Step S103: Regarding the use of test data: Based on the requirement to periodically test the bonding quality of the reinforcing metal sheet after it is bonded to the flexible circuit board, the quality test data corresponding to different periodic tests in the test data are sorted by time and recorded as periodic test data ZD1 to periodic test data ZD. m Where m represents the total number of reinforcing metal sheets subjected to periodic testing after being bonded to the flexible circuit board, and periodic test data ZD1 represents the first periodic test, and periodic test data ZD... m This is the last periodic test.

[0021] In step S1, the method further includes: step S104, for any detection data α: the quality defect β of the reinforcing metal sheet in the detection results of the reinforcing metal sheet in the detection data α is recorded as the standard quality defect of the detection data α, wherein the detection data α is any stage detection data or periodic detection data. Step S105: Record the feature parameters corresponding to the quality defect β when it is identified as the failure parameters of the quality defect β, and record the detection data of the failure parameters in the detection data α as the defect detection data. In the data analysis of this embodiment, for example, if a quality defect of the reinforcing metal sheet in a stage of data analysis is a warped edge, then the warped edge can be recorded as the standard quality defect of the stage of data analysis. The characteristic parameters of each quality defect are different. For example, for the warped edge obtained above, the corresponding characteristic parameters are: the area occupied by the warped edge, the position of the warped edge, and the maximum angle between the warped edge and the bonding plane. The corresponding data obtained in the stage of data analysis are 1.32cm², the upper left corner of the bonding area, and 30°. The above data can be recorded as the defect detection data of the warped edge, and the area occupied by the warped edge, the position of the warped edge, and the maximum angle between the warped edge and the bonding plane can be recorded as the failure parameters of the warped edge. In the specific implementation process, the corresponding characteristic parameters can be obtained according to the detection standards for different quality defects during actual quality inspection, and the corresponding defect detection data can be further obtained to provide an accurate and effective data basis for subsequent analysis. Step S106: Based on the analysis method of the detection data α, obtain all standard quality defects corresponding to each stage of detection data and each cycle of detection data, as well as the failure parameters and defect detection data corresponding to each standard quality defect.

[0022] Step S2: Based on the failure parameters and defect detection data corresponding to each quality defect, obtain all full-cycle defect source points for each quality defect, as well as the failure parameter characteristics of the quality defect and each corresponding full-cycle defect source point. In step S2, the following steps are included: Step S201, for any quality defect β obtained from stage detection data and periodic detection data: the process stage corresponding to the stage detection data with quality defect β as the standard quality defect is recorded as the storable process stage of quality defect β, and the number of periods corresponding to the periodic detection data with quality defect β as the standard quality defect is recorded as the storable period of quality defect β. Step S202: Record all survivable process stages and survivable cycles of quality defect β as the full-cycle defect source points of quality defect β. Step S203: For any full-cycle defect source point of quality defect β, the failure parameters of quality defect β in the defect detection data are sequentially recorded as parameters to be analyzed, DC1 to DC1.r .

[0023] Step S2 further includes: step S204, for the parameter DC to be analyzed e Establish a Cartesian coordinate system with the x-axis in units of min and the y-axis in units of γ, and denote it as the parameter point analysis coordinate system, where e is a positive integer less than or equal to r and greater than 1, and γ is the parameter DC to be analyzed. e Units; Step S205, based on the parameter DC to be analyzed in the defect detection data e For all corresponding detection records, the data from the start time of the detection to the DC parameter to be analyzed in each detection record will be processed. e The time interval between the detected times is denoted as T, and the parameter to be analyzed is DC. e The detected value is denoted as R; In a specific implementation process, for example, during a data analysis, the parameter to be analyzed is the area occupied by the warped edge. In a detection record, the detection starts at 14:11:30, and the area occupied by the warped edge is detected at 14:12:00. Therefore, the value of T should be 0.5 min. In addition, the value of the detected area occupied by the warped edge is recorded as 1.32 cm². Therefore, the value of R should be 1.32, and γ should be cm². In summary, the analysis parameter points obtained from the above parameters should be (0.5, 1.32).

[0024] Step S2 further includes: Step S206, in the parameter point analysis coordinate system, the point with T as the abscissa and R as the ordinate is recorded as the analysis parameter point of the detection record; the parameter DC to be analyzed in the defect detection data is obtained. e The corresponding analysis parameter points for all detection records are defined, and the smallest region in the parameter point analysis coordinate system that can encompass all analysis parameter points is denoted as the parameter DC to be analyzed. e Parameter characteristics; In the specific implementation process, for example, if the analysis parameters obtained above are the defect detection data corresponding to the full cycle defect source point of the warped edge, namely the "pressing and venting stage", then the area occupied by the warped edge, the position of the warped edge, and the parameter features corresponding to the maximum angle between the warped edge and the bonding plane can be recorded as the failure parameter features corresponding to the warped edge and the "pressing and venting stage". This will facilitate the accurate identification of the warped edge whose cause is in the "pressing and venting stage" during subsequent analysis. Step S207: Construct the parameter point analysis coordinate system corresponding to each parameter to be analyzed, and record the parameter point characteristics of all parameters to be analyzed as the failure parameter characteristics corresponding to the quality defect β and the full cycle defect source point; Step S208: Obtain the failure parameter characteristics corresponding to quality defect β and all full-cycle defect source points; In the specific implementation process, the source points and parameter characteristics of defects throughout the entire life cycle are obtained through failure parameters, and the causes are determined by matching them with real-time defect parameters. This enables precise correspondence between defects and production stages and detection cycles, taking into account both latent defects in detection and later use, reducing reliance on human experience, quickly locating the root cause, and improving the accuracy of defect tracing throughout the entire life cycle.

[0025] Step S3: When performing full lifecycle traceability of the bonding quality of the flexible circuit board reinforcing metal sheet, obtain the real-time bonding defects of the flexible circuit board reinforcing metal sheet, and obtain the defect cause of the real-time bonding defect based on the detection failure parameters of each real-time bonding defect and the full lifecycle defect source point. In step S3, the following steps are included: Step S301, when the bonding quality of the flexible circuit board reinforcing metal sheet is traced throughout its entire life cycle, based on the existing quality inspection methods for the reinforcing metal sheet, the corresponding defects of the reinforcing metal sheet are obtained and recorded as real-time bonding defects. Step S302, for any real-time bonding defect: record the detection data corresponding to the real-time bonding defect as real-time defect data; record the detection records of the failure parameters corresponding to the real-time bonding defect in the real-time defect data as failure parameter records SC1 to failure parameter records SC2 in sequence. b , where b is the number of failure parameters corresponding to real-time fitting defects.

[0026] In step S3, the following steps are also included: Step S303, for any failure parameter record and the failure parameter δ detected in the failure parameter record: obtain a parameter point analysis coordinate system with the unit of the horizontal axis being min and the unit of the vertical axis being γ1, where γ1 is the unit of the failure parameter δ. Step S304: In the parameter point analysis coordinate system, place the parameter point feature corresponding to the failure parameter δ in the failure parameter features corresponding to the real-time fitting defect and all full-cycle defect source points. Step S305: Record the time interval between the start of the detection and the time when the failure parameter is detected in the failure parameter record as T1, and record the value obtained by the failure parameter detection as R1; record the point in the parameter point analysis coordinate system with the horizontal coordinate as T1 and the vertical coordinate as R1 as the real-time parameter point. In the data analysis of this embodiment, for example, in a real-time analysis, the real-time bonding defect being analyzed is edge curling, and the failure parameter δ is the "area occupied by the curling edge". Through data acquisition, the parameter feature corresponding to the "area occupied by the curling edge" in the failure parameter features of the curling edge and all corresponding full-cycle defect source points is obtained, as shown in the following example. Figure 2 The regions CT1, CT2, CT3, CT4, and CT5 are shown in the diagram; in addition, the coordinates of a real-time parameter point obtained are (0.5, 1.32), derived from... Figure 2It can be seen that the parameter features containing real-time parameters are CT3 and CT4, and the corresponding full-cycle defect source points are the alignment and bonding stage and the pressing and venting stage. Therefore, the alignment and bonding stage and the pressing and venting stage can be recorded as the defect source points of "area occupied by the warped edge".

[0027] In step S3, the following step is also included: step S306, in the parameter point analysis coordinate system, the full-cycle defect source point corresponding to the parameter point feature containing real-time parameter points is recorded as the defect survivable source point of failure parameter δ. Step S307: Obtain the defect storable source points of all failure parameters δ, and record the defect storable source point that appears most frequently among all the defect storable source points of failure parameters δ as the defect generation source point of real-time fitting defect. In the specific implementation process, for example, in a data analysis, it was found that among all the possible sources of defects corresponding to edge warping, the compression and venting stage occurred the most frequently. Therefore, it can be preliminarily determined that the time period in which edge warping occurs is the time period in the compression and venting stage.

[0028] In step S3, the method further includes: step S308, recording the corresponding process stage or detection cycle in which the real-time bonding defect is detected as the defect detection period. Step S309: When the process stage or inspection cycle corresponding to the defect generation source point of the real-time bonding defect is after the defect detection period, the defect generation source point is removed from all the defect generation source points of the real-time bonding defect. In the specific implementation process, if the process stage or detection cycle corresponding to the defect generation source point of the real-time bonding defect is after the defect detection period, it means that the generation time of the real-time bonding defect is before the defect generation source point. It is impossible to realize that the real-time bonding defect appears at the defect generation source point. For example, if the process stage corresponding to the obtained defect generation source point is the post-curing stage, but the defect detection period is the pressing and venting stage, and the post-curing stage is the stage after the pressing and venting stage, it cannot be used as the result of the defect cause. Therefore, the post-curing stage should be removed from all defect generation sources. If the defect generation source point is removed from all defect generation sources of the real-time bonding defect, and there is no defect generation source point at this time, then the defect generation source point should be re-obtained from the defect susceptibility source points. Step S310: When the process stage or detection cycle corresponding to the defect generation source point of the real-time bonding defect is before the defect detection period, or when the process stage or detection cycle corresponding to the defect generation source point is equal to the defect detection period, the defect generation source point is retained among all the defect generation source points of the real-time bonding defect. Step S311: Obtain the defect generation source point for each real-time bonding defect, and remove or retain the defect generation source point of the real-time bonding defect; record the process stage or detection cycle corresponding to the retained defect generation source point as the time period in which the defect cause of the real-time bonding defect is located.

[0029] This application also provides an electronic device. This electronic device can be a server. Specifically, the server may include: at least one processor, at least one memory, a power supply, a communication interface, an input / output interface, and a communication bus. The memory stores a computer program, which is loaded and executed by the processor to implement the relevant steps in the methods disclosed in the foregoing embodiments.

[0030] In the above embodiments, it should be understood that the processor can be a Central Processing Unit (CPU), or other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), etc. The general-purpose processor can be a microprocessor or any conventional processor. The steps of the method disclosed in this invention can be directly implemented by a hardware processor, or implemented by a combination of hardware and software modules within the processor.

[0031] The memory may include random access memory (RAM) and may also include non-volatile memory (NVM), such as at least one disk storage device.

[0032] The bus can be an Industry Standard Architecture (ISA) bus, a Peripheral Component Interconnect (PCI) bus, or an Extended Industry Standard Architecture (EISA) bus, etc. Buses can be categorized as address buses, data buses, control buses, etc. For ease of illustration, the buses shown in the accompanying drawings are not limited to a single bus or a single type of bus.

[0033] This application also provides a computer program product, including a computer program that, when executed by a processor, implements the above-described method.

[0034] This application also provides a computer-readable storage medium storing computer-executable instructions, which, when executed by a processor, implement the above-described method.

[0035] The aforementioned readable storage medium can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic storage, flash memory, magnetic disk, or optical disk. The readable storage medium can be any available medium accessible to a general-purpose or special-purpose computer.

[0036] An exemplary readable storage medium is coupled to a processor, enabling the processor to read information from and write information to the readable storage medium. Of course, the readable storage medium can also be a component of the processor. The processor and the readable storage medium can reside in an Application Specific Integrated Circuit (ASIC). Alternatively, the processor and the readable storage medium can exist as discrete components in the device.

[0037] Those skilled in the art will understand that all or part of the steps of the above-described method embodiments can be implemented by hardware related to program instructions. The aforementioned program can be stored in a computer-readable storage medium. When executed, the program performs the steps of the above-described method embodiments; and the aforementioned storage medium includes various media capable of storing program code, such as ROM, RAM, magnetic disks, or optical disks.

[0038] Finally, it should be noted that other embodiments of the invention will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This invention is intended to cover any variations, uses, or adaptations of the invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not disclosed herein, and is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of the invention is limited only by the appended claims.

Claims

1. A method for tracing the entire lifecycle of bonding quality of reinforcing metal sheets in flexible circuit boards, characterized in that: include: All quality defects existing in the bonding quality inspection of the reinforcing metal sheet of the flexible circuit board are obtained, and the failure parameters and defect detection data corresponding to each quality defect are obtained respectively. Based on the failure parameters and defect detection data corresponding to each quality defect, all full-cycle defect source points for each quality defect are obtained, as well as the failure parameter characteristics of the quality defect and each corresponding full-cycle defect source point. When the bonding quality of the flexible circuit board reinforcing metal sheet is traced throughout its entire life cycle, the real-time bonding defects of the flexible circuit board reinforcing metal sheet are obtained, and the defect causes of the real-time bonding defects are obtained based on the detection failure parameters of each real-time bonding defect and the defect source points throughout the entire life cycle. The process of acquiring all quality defects present during the bonding quality inspection of the flexible circuit board reinforcing metal sheet, and acquiring the failure parameters and defect detection data corresponding to each quality defect, includes: All quality inspection data of the reinforcing metal sheet of the flexible circuit board during the bonding stage and the use stage are recorded as bonding inspection data and use inspection data, respectively. Among them, the quality inspection data corresponding to the bonding stage are all the quality inspection data when the reinforcing metal sheet is bonded to the flexible circuit board, and the quality inspection data corresponding to the use stage are the data of periodic quality inspection of the bonding quality of the reinforcing metal sheet after it is bonded to the flexible circuit board. For bonding inspection data: Based on the process stage corresponding to when the reinforcing metal sheet is bonded to the flexible circuit board, the quality inspection data of the reinforcing metal sheet corresponding to different process stages in the bonding inspection data are recorded as stage inspection data JD1 to stage inspection data JD. u , where u is the number of process stages corresponding to when the reinforcing metal sheet is bonded to the flexible circuit board; Regarding the use of test data: Based on the requirement to periodically test the bonding quality of the reinforcing metal sheet after it is bonded to the flexible circuit board, the quality test data corresponding to different periodic tests in the test data will be sorted by time and recorded as periodic test data ZD1 to periodic test data ZD. m Where m represents the total number of reinforcing metal sheets subjected to periodic testing after being bonded to the flexible circuit board, and periodic test data ZD1 represents the first periodic test, and periodic test data ZD... m This is the last periodic test.

2. The method according to claim 1, characterized in that, The process of acquiring all quality defects present during the bonding quality inspection of the flexible circuit board reinforcing metal sheet, and acquiring the failure parameters and defect detection data corresponding to each quality defect, further includes: For any test data α: the quality defect β of the reinforcing metal sheet in the test results of the reinforcing metal sheet in the test data α is recorded as the standard quality defect of the test data α, where the test data α is any stage test data or periodic test data; The characteristic parameter corresponding to the quality defect β when it is identified is recorded as the failure parameter of the quality defect β, and the detection data of the failure parameter in the detection data α is recorded as the defect detection data. Based on the analysis of the detection data α, we obtain all standard quality defects corresponding to each stage of detection data and each cycle of detection data, as well as the failure parameters and defect detection data corresponding to each standard quality defect.

3. The method according to claim 2, characterized in that, The process of obtaining all full-cycle defect source points for each quality defect based on the failure parameters and defect detection data corresponding to each quality defect includes: For any quality defect β obtained from stage inspection data and periodic inspection data: the process stage corresponding to the stage inspection data with quality defect β as the standard quality defect is recorded as the storable process stage of quality defect β, and the number of periods corresponding to the periodic inspection data with quality defect β as the standard quality defect is recorded as the storable period of quality defect β. All survivable process stages and survivable cycles of quality defect β are recorded as the full-cycle defect source points of quality defect β. For any full-cycle defect source point corresponding to quality defect β, the failure parameters of quality defect β in the defect detection data are sequentially denoted as the parameters to be analyzed, DC1 to DC2. r .

4. The method according to claim 3, characterized in that, The process of acquiring all full-cycle defect source points for each type of quality defect, and the failure parameter characteristics of the quality defect and its corresponding full-cycle defect source point, further includes: For the parameter DC to be analyzed e Establish a Cartesian coordinate system with the x-axis in units of min and the y-axis in units of γ, and denote it as the parameter point analysis coordinate system, where e is a positive integer less than or equal to r and greater than 1, and γ is the parameter DC to be analyzed. e Units; Based on the parameter DC to be analyzed in the defect detection data e For all corresponding detection records, the data from the start time of the detection to the DC parameter to be analyzed in each detection record will be processed. e The time interval between the detected times is denoted as T, and the parameter to be analyzed is DC. e The detected value is denoted as R.

5. The method according to claim 4, characterized in that, The process of acquiring all full-cycle defect source points for each type of quality defect, and the failure parameter characteristics of the quality defect and its corresponding full-cycle defect source point, further includes: In the parameter point analysis coordinate system, the point with T as the abscissa and R as the ordinate is recorded as the analysis parameter point of the detection record; the parameter DC to be analyzed in the defect detection data is obtained. e The corresponding analysis parameter points for all detection records are defined, and the smallest region in the parameter point analysis coordinate system that can encompass all analysis parameter points is denoted as the parameter DC to be analyzed. e Parameter characteristics; Construct a parameter point analysis coordinate system for each parameter to be analyzed, and denote the parameter point characteristics of all parameters to be analyzed as the failure parameter characteristics corresponding to the quality defect β and the full-cycle defect source point; Obtain the failure parameter characteristics corresponding to quality defect β and all full-cycle defect source points.

6. The method according to claim 5, characterized in that, When performing full lifecycle traceability of the bonding quality of the flexible circuit board reinforcing metal sheet, the real-time bonding defects of the flexible circuit board reinforcing metal sheet are obtained, and the defect causes of the real-time bonding defects are obtained based on the detection failure parameters of each real-time bonding defect and the defect source points throughout the entire lifecycle, including: When performing full lifecycle traceability of the bonding quality of the reinforcing metal sheet of flexible circuit board, based on the existing quality inspection methods for the reinforcing metal sheet, the corresponding defects of the reinforcing metal sheet are obtained and recorded as real-time bonding defects. For any real-time bonding defect: record the detection data corresponding to the real-time bonding defect as real-time defect data; record the detection records of the failure parameters corresponding to the real-time bonding defect in the real-time defect data as failure parameter records SC1 to failure parameter records SC2. b , where b is the number of failure parameters corresponding to real-time fitting defects.

7. The method according to claim 6, characterized in that, The method for obtaining the defect cause of real-time bonding defects based on the detection failure parameters of each real-time bonding defect and the defect source points throughout the entire cycle also includes: For any failure parameter record and the failure parameter δ detected in the failure parameter record: obtain a parameter point analysis coordinate system with the horizontal axis in min and the vertical axis in γ1, where γ1 is the unit of the failure parameter δ. In the parametric analysis coordinate system, place the parametric features corresponding to the failure parameter δ in the failure parameter features corresponding to the real-time fitting defect and all full-cycle defect source points; In the failure parameter record, the time interval between the start of the detection and the time when the failure parameter is detected is recorded as T1, and the value obtained by the detection of the failure parameter is recorded as R1; in the parameter point analysis coordinate system, the point with the horizontal coordinate T1 and the vertical coordinate R1 is recorded as the real-time parameter point.

8. The method according to claim 7, characterized in that, The method for obtaining the defect cause of real-time bonding defects based on the detection failure parameters of each real-time bonding defect and the defect source points throughout the entire cycle also includes: In the parameter point analysis coordinate system, the full-cycle defect source point corresponding to the parameter point feature containing real-time parameters is denoted as the defect survivable source point of the failure parameter δ. Obtain all possible source points of defects with failure parameter δ, and record the source point of defects with the most occurrences among all possible source points of defects with failure parameter δ as the source point of defect generation for real-time fitting defects.

9. The method according to claim 8, characterized in that, The method for obtaining the defect cause of real-time bonding defects based on the detection failure parameters of each real-time bonding defect and the defect source points throughout the entire cycle also includes: The corresponding process stage or inspection cycle in which the real-time bonding defect is detected is recorded as the defect detection period. When the process stage or inspection cycle corresponding to the defect generation source point of the real-time bonding defect is after the defect inspection period, the defect generation source point will be removed from all defect generation sources of the real-time bonding defect. When the process stage or inspection cycle corresponding to the defect generation source point of the real-time fitting defect is before the defect inspection period, or when the process stage or inspection cycle corresponding to the defect generation source point is equal to the defect inspection period, the defect generation source point will be retained among all the defect generation source points of the real-time fitting defect. The defect generation source point of each real-time bonding defect is obtained, and the defect generation source point of the real-time bonding defect is either removed or retained; the process stage or inspection cycle corresponding to the retained defect generation source point is recorded as the time period in which the defect cause of the real-time bonding defect occurs.

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