Display module and electronic device

Abstract

The application provides a display module and an electronic device. The display module comprises a substrate, and active functional layers, fan-out wiring layers, pixel test circuit layers, electrostatic discharge devices and module driving components arranged in sequence. The electrostatic discharge devices are spaced apart from the module driving components. The substrate is made of ultrathin flexible glass. The substrate has active areas, fan-out areas, contact terminal areas, electrostatic discharge areas and module driving areas corresponding to the functional layers. The electrostatic discharge areas and the module driving areas have a spacing area therebetween. The substrate is provided with a first groove corresponding to at least part of the electrostatic discharge areas and / or the spacing area. The substrate is bent and deformed at the first groove. The substrate shortens the width of the non-display area that needs to be shielded on the display module by bending at the first groove, thereby shortening the width of the black border and improving the aesthetic appearance of the electronic device.

Description

Technical Field

[0001] This invention belongs to the field of display module technology, and particularly relates to a display module and electronic device. Background Technology

[0002] Current display modules, whether OLED or LCD, have a fan-out area, a contact terminal area, an electrostatic discharge area, and a module driving area arranged sequentially on the edge outside the active area. The fan-out area is used to lead out the signal from the active area, the contact terminal area is used for signal transmission and connection, the electrostatic discharge area can prevent static electricity from damaging the internal circuits, and the driver chip and flexible circuit board are located in the module driving area to process and control the screen display signal and signal transmission. The above edge areas need to be covered by an ink layer on the cover plate to form the black border of the display screen. The black border of the current display screen is relatively wide, which reduces the screen ratio and affects the user experience. Summary of the Invention

[0003] The purpose of this invention is to provide a display module and electronic device that aims to solve the technical problem of wide black borders on existing displays, which reduces the screen-to-body ratio.

[0004] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0005] In a first aspect, a display module is provided, comprising a substrate, an active functional layer, a fan-out wiring layer, a pixel test circuit layer, an electrostatic discharge device, and a module driving component. The active functional layer, the fan-out wiring layer, the pixel test circuit layer, the electrostatic discharge device, and the module driving component are all disposed on a first side of the substrate and arranged in sequence, with the electrostatic discharge device spaced apart from the module driving component.

[0006] The substrate is made of ultra-thin flexible glass and has an active region corresponding to the active functional layer, a fan-out region corresponding to the fan-out wiring layer, a contact terminal region corresponding to the pixel test circuit layer, an electrostatic discharge region corresponding to the electrostatic discharge device, a module driving region corresponding to the module driving assembly, and a gap region located between the electrostatic discharge region and the module driving region.

[0007] The substrate has a first groove, which corresponds to at least a portion of the electrostatic discharge area and / or the interval area. The substrate is divided into a main body and an edge portion by the first groove. The active functional layer, the fan-out wiring layer and the contact terminal layer are all disposed in the main body, and the module driving assembly is disposed in the edge portion. The substrate is bent and deformed at the first groove so that the edge portion and the main body are opposite each other in the thickness direction of the substrate.

[0008] In one embodiment of the first aspect, the first trench is disposed on the side of the substrate opposite to the electrostatic discharge device.

[0009] In one embodiment of the first aspect, the distance between the first side surface of the substrate and the bottom surface of the first trench is 0.03mm-0.1mm.

[0010] In one embodiment of the first aspect, the width of the fan-out area is 2mm-4mm, the width of the contact terminal area is 0.3mm-1mm, the width of the electrostatic discharge area is 0.3mm-1mm, and the width of the interval area is greater than 0.6mm.

[0011] As one embodiment of the first aspect, the bottom of the first groove is provided with a plurality of through holes.

[0012] As one embodiment of the first aspect, the display module further includes a reinforcing adhesive layer disposed on a first side of the substrate and located in the spacing region.

[0013] In one embodiment of the first aspect, the main body portion abuts against the edge portion.

[0014] As one embodiment of the first aspect, the main body portion has a second groove, which is located between the active functional layer and the first groove and extends through the first groove.

[0015] In one embodiment of the first aspect, the edge portion is at least partially received within the second groove.

[0016] In one embodiment of the first aspect, the edge portion abuts against the bottom of the second groove.

[0017] In a second aspect, an electronic device is provided, including the display module described in the above embodiments.

[0018] The technical advantages of this invention compared to the prior art are: by setting the substrate as ultra-thin flexible glass, the display module can be thinned while ensuring the support strength of the substrate. The display module has a first groove on the substrate, which increases the flexibility of the substrate at the first groove, thereby enabling the substrate to bend and deform at the first groove. In this way, the substrate shortens the width of the non-display area that needs to be covered on the display module by bending the edge relative to the main body, which also shortens the width of the black border, thereby improving the aesthetics of the electronic device. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments of the present invention or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a three-dimensional structural diagram of the electronic device provided in the embodiment of the present invention;

[0021] Figure 2 yes Figure 1 A cross-sectional view of the electronic equipment at point AA;

[0022] Figure 3 This is a partial cross-sectional view of the display module provided in this embodiment of the invention when it is not folded.

[0023] Figures 4-6 This is a partial cross-sectional view of the display module and cover plate provided in different embodiments of the present invention in the assembled state.

[0024] Explanation of reference numerals in the attached figures:

[0025] 100. Display module; 10. Substrate; 11. Main body; 12. Edge; 13. Middle part; 20. Active functional layer; 30. Fan-out wiring layer; 40. Pixel test circuit layer; 50. Electrostatic discharge device; 60. Module driving assembly; 61. Driver chip; 62. Flexible circuit board; 70. Reinforcing adhesive layer; 101. First groove; 102. Through hole; 103. Second groove; a. Active area; b. Fan-out area; c. Contact terminal area; d. Electrostatic discharge area; e. Spacing area; f. Module driving area; 200. Equipment body; 210. Controller; 300. Cover plate; 310. Ink layer. Detailed Implementation

[0026] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0027] In the description of this invention, it should be understood that the terms "upper", "lower", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0028] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0029] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0030] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments.

[0031] Please see Figure 1 and Figure 2 This invention provides a display module 100 and an electronic device. The electronic device includes a device body 200 and the display module 100. The display module 100 is used to display images. In some embodiments, the display module 100 can also be touch-controlled. The electronic device can be a tablet computer, mobile phone, tablet navigator, e-reader, remote control, personal computer (PC), laptop computer, in-vehicle device, smart TV, wearable device, augmented reality (AR) / virtual reality (VR) device, ultra-mobile personal computer (UMPC), netbook, personal digital assistant (PDA), handheld mobile terminal, or other electronic devices with a display module 100.

[0032] In some embodiments, the electronic device further includes a cover plate 300, which is connected to the device body 200 and covers the display module 100. The cover plate 300 is made of a light-transmitting material and is used to protect the display module 100. An ink layer 310 is provided on the edge of the cover plate 300, which can be used to shield the non-display areas of the display module 100. The cover plate 300 and the display module 100 together form the display screen of the electronic device, and the ink layer 310 forms the black border on the display screen.

[0033] To facilitate the description of the technical solution of the present invention, this embodiment uses a first side and a second side to represent two relative reference positions of the display module 100. For example... Figure 1 As shown, for ease of understanding, the following embodiments are described with the first side as the upper side and the second side as the lower side. The display module 100 has a top and a bottom. The direction from the top to the bottom of the display module 100 is its length direction. The black border of the display screen covers the bottom edge area of ​​the display module 100, and the width direction of the black border is the length direction of the display module 100. In other embodiments, the direction from the top to the bottom of the display module 100 may also be the width direction of the display module 100; this is not a limitation here. When a user views the image displayed by the display module 100, with the user's viewing position as a reference, the top of the display module 100 is located above or in front of the bottom, the first side of the display module 100 faces the user, and the second side of the display module 100 faces the device body 200. The display module 100 can be an OLED display module 100, an LCD display module 100, or a digital screen display module 100; this is not a limitation here.

[0034] Please see Figure 3 and Figure 4 The display module 100 includes a substrate 10, an active functional layer 20, a fan-out wiring layer 30, a pixel testing circuit layer 40, an electrostatic discharge device 50, and a module driving assembly 60. The active functional layer 20, fan-out wiring layer 30, pixel testing circuit layer 40, electrostatic discharge device 50, and module driving assembly 60 are all disposed on the first side of the substrate 10 and arranged sequentially. It can be understood that the active functional layer 20 covers most of the substrate 10. The fan-out wiring layer 30, pixel testing circuit layer 40, electrostatic discharge device 50, and module driving assembly 60 are all located at the bottom edge of the substrate 10. The fan-out wiring layer 30, pixel testing circuit layer 40, electrostatic discharge device 50, and module driving assembly 60 are arranged sequentially along the direction from the active functional layer 20 to the bottom edge of the substrate 10, that is, along the length of the display module 100.

[0035] Specifically, the substrate 10 is made of ultra-thin glass (UTG). The UTG substrate 10 can be made extremely thin and, while providing sufficient support for other film layers, can withstand a certain degree of bending and folding without easily breaking. The UTG substrate 10 also has extremely high optical transparency and maintains good thermal and chemical stability under different operating temperature environments. In this embodiment, the thickness of the substrate 10 is typically 0.2mm-0.5mm. The thinner the UTG material, the smaller the internal stress generated when subjected to external forces, thus significantly increasing its flexibility.

[0036] The active functional layer 20 is the core functional layer for realizing image display. This active functional layer 20 may contain organic light-emitting materials, such as a light-emitting layer, an electron transport layer, and a hole transport layer; in this case, the display module 100 is an OLED display module 100. Alternatively, the active functional layer 20 may primarily consist of a thin-film transistor (TFT) array. TFTs are typically composed of semiconductor materials (such as amorphous silicon, oxide semiconductors, etc.), metal electrodes, and an insulating layer; in this case, the display module 100 is an LCD display module 100.

[0037] The fan-out wiring layer 30 is used to lead out the signals from the display driver chip 61 and distribute them to each pixel of the display panel, enabling precise control of each pixel. This fan-out wiring layer 30 is generally composed of metal wires (such as copper, aluminum, etc.) and insulating materials. The metal wires form a dense network structure for transmitting signals and power, while the insulating material separates different wires to prevent short circuits.

[0038] The pixel test circuit layer 40 is used to perform electrical performance tests on each pixel to detect whether there are problems such as short circuit, open circuit, and uneven brightness. The pixel test circuit layer 40 includes various test circuit components, such as test pins, switching circuits, and signal detection circuits.

[0039] The electrostatic discharge device 50 is used to protect the internal circuits and components of the display module 100 from electrostatic damage. This electrostatic discharge device 50 is typically made of materials with good electrostatic discharge properties, such as metal-oxide-semiconductor (MOS) devices and transient voltage suppressor diodes (TVS). These devices have specific structures and electrode layouts that enable them to quickly conduct during electrostatic discharge, guiding the electrostatic charge to the ground or other locations where static electricity can be released.

[0040] The module driving assembly 60 includes a driving chip 61 and a flexible circuit board 62 (FPC) connected thereto. The driving chip 61 is responsible for receiving display signals from the controller 210 (such as a motherboard) in the main body 200, processing, converting, and amplifying the signals, and then transmitting the driving signals to each pixel of the display panel through the flexible circuit board 62 to control the light emission or display state of the pixels, thereby achieving correct image display. The driving chip 61 is located close to the electrostatic discharge device 50, and the flexible circuit board 62 extends away from the electrostatic discharge device 50 and is electrically connected to the controller 210 in the electronic device.

[0041] The electrostatic discharge device 50 is spaced apart from the module drive assembly 60, with the width of the gap region e being greater than 0.6 mm. During the electrostatic discharge process, a large instantaneous current flows through the electrostatic discharge device 50. If it is too close to the drive chip 61, it may generate a strong electromagnetic field, causing electromagnetic interference to the weak electrical signals within the drive chip 61 and affecting its normal signal processing and logic operation functions. Therefore, maintaining a distance of more than 0.6 mm between the electrostatic discharge device 50 and the drive chip 61 can reduce this risk of electromagnetic interference.

[0042] The substrate 10 has an active region a corresponding to the active functional layer 20, a fan-out region b corresponding to the fan-out wiring layer 30, a contact terminal region c corresponding to the pixel test circuit layer 40, an electrostatic discharge region d corresponding to the electrostatic discharge device 50, a module driving region f corresponding to the module driving assembly 60, and a gap region e located between the contact terminal region c and the module driving region f. That is, the area of ​​the substrate 10 connected to the active functional layer 20 is named active region a, the area connected to the fan-out wiring layer 30 is named fan-out region b, the area connected to the pixel test circuit layer 40 is named contact terminal region c, the area connected to the electrostatic discharge device 50 is named electrostatic discharge region d, the area where the module driving assembly 60 is located is named module driving region f, and the area without the aforementioned film layers is named gap region e. Specifically, the area of ​​the substrate 10 between the corresponding driving chip 61 and the electrostatic discharge device 50 is the gap region e. It should be noted that the fan-out area b, the contact terminal area c, the electrostatic discharge area d, the interval area e, and the module driving area f are all located in the non-display area of ​​the display module 100, and the ink layer 310 on the cover plate 300 needs to cover the above areas.

[0043] The substrate 10 has a first groove 101. The opening of the first groove 101 can be located on the same side of the substrate 10 as the active functional layer 20, or on a different side of the substrate 10; this is not limited. The first groove 101 corresponds to at least a portion of the electrostatic discharge region d and / or the interval region e. That is, the first groove 101 is formed in the electrostatic discharge region d and completely or partially covers the electrostatic discharge region d; or, the first groove 101 is formed in the interval region e and completely or partially covers the interval region e; or, the first groove 101 is partially formed in the electrostatic discharge region d and completely or partially covers the electrostatic discharge region d, while another portion of the first groove 101 is formed in the interval region e and completely or partially covers the interval region e. The first groove 101 can be disposed through the width direction of the display module 100, so that the entire middle portion 13 is sandwiched between the main body portion 11 and the edge portion 12.

[0044] The substrate 10 is divided into a main body portion 11 and an edge portion 12 by a first groove 101. A middle portion 13 is formed in the substrate 10 at the first groove 101. Due to the opening of the first groove 101, the thickness of the middle portion 13 is less than the thickness of the main body portion 11 and also less than the thickness of the edge portion 12. The active functional layer 20, the fan-out wiring layer 30 and the contact terminal layer are all disposed on the main body portion 11. The module driving assembly 60 is disposed on the edge portion 12. The electrostatic discharge device 50 can be located on the main body portion 11, or on the middle portion 13, or partially on the main body portion 11 and partially on the middle portion 13, or span across the middle portion 13 and extend to the main body portion 11 and the edge portion 12 respectively. There are no restrictions here.

[0045] The substrate 10 is bent at the first groove 101 so that the edge portion 12 and the main body portion 11 are opposite each other in the thickness direction of the substrate 10. It is understood that the substrate 10 may only be bent at the middle portion 13, while the main body portion 11 and the edge portion 12 are flat. Alternatively, the edge of the main body portion 11 near the middle portion 13 may also be slightly deformed along with the deformation of the middle portion 13, while the other parts are flat. And / or, the edge of the main body portion 11 near the middle portion 13 may also be slightly deformed along with the deformation of the middle portion 13, while the other parts are flat. The main body 11 and the edge 12 can be parallel or at a certain angle. When the middle part 13 is not bent or deformed, the angle between the main body 11 and the edge 12 is 180°. When the middle part 13 is bent or deformed to the point that the main body 11 and the edge 12 are parallel, the angle between the main body 11 and the edge 12 is 0°. In between, the greater the bending and deformation of the middle part 13, the smaller the angle between the main body 11 and the edge 12.

[0046] It should be noted that the parallelism between the main body 11 and the edge 12 refers to the parallelism between the flat plate area of ​​the main body 11 and the flat plate area of ​​the edge 12. Taking the first and second sides of the main body 11 as the first and second sides of the entire display module 100, after the middle part 13 is bent and deformed, the edge 12 can be located on the first side of the main body 11 or on the second side of the main body 11. That is, the edge 12 can be located on the upper side or the lower side of the main body 11, without any limitation.

[0047] Setting the substrate 10 as ultra-thin flexible glass can achieve the thinning of the display module 100 while ensuring the supporting strength of the substrate 10. The display module 100 improves the flexibility of the substrate 10 at the first groove 101 by opening a first groove 101 on the substrate 10, thereby enabling the substrate 10 to bend and deform at the first groove 101. In this way, the substrate 10 shortens the width of the non-display area that needs to be shielded on the display module 100 by bending the edge portion 12 relative to the main body portion 11, which also shortens the width of the black border, thereby improving the aesthetics of the electronic device.

[0048] The first groove 101 can be formed by etching. The specific steps include: first, coating a layer of photoresist on the surface of the substrate 10; then transferring the pattern of the first groove 101 onto the photoresist using a photolithography process. Next, placing the substrate 10 into an etching apparatus, and using a chemical etching solution or plasma to etch the exposed substrate 10 material, removing unwanted portions to form the first groove 101. The advantages of this method are that it achieves high-precision pattern transfer and can create complex groove shapes; the etching process is relatively gentle, causing less damage to the substrate 10, which helps maintain the performance of the substrate 10. In other embodiments, the first groove 101 can also be formed by cutting or blade cutting; this is not limited here.

[0049] Optionally, the first groove 101 is at least partially located in the electrostatic discharge region d. Since the thickness of the substrate 10 affects the resistance of the charge transport path, positioning the first groove 101 in the electrostatic discharge region d allows the electrostatic discharge device 50 to be placed on the thinner middle portion 13. The thinner substrate 10 reduces the charge transport distance and lowers the resistance, allowing the electrostatic charge to be discharged more smoothly and quickly through the electrostatic discharge device 50. If the substrate 10 is too thick, the resistance increases, the charge discharge speed slows down, and excessively high voltage may accumulate locally, affecting the protective effect of the electrostatic discharge device 50.

[0050] Please see Figure 3 and Figure 4 In some embodiments, the first groove 101 is disposed on the side of the substrate 10 opposite to the electrostatic discharge device 50. That is, the opening of the first groove 101 faces the side of the substrate 10 without the electrostatic discharge device 50. This ensures that the surface of the substrate 10 with each functional layer is flat, maintains the structural strength and stability of the upper surface of the display module 100, effectively reduces the direct impact of external factors on the display area, reduces the risk of damage to the display module 100 due to external forces, and improves the reliability and durability of the product. In addition, compared with disposing the first groove 101 on the side of the substrate 10 with the electrostatic discharge device 50, this solution can reduce the impact on light propagation, which is beneficial to ensuring the optical performance of the display module 100, avoiding light scattering or reflection problems caused by the presence of the first groove 101, thereby achieving better brightness uniformity and contrast, and providing users with a high-quality visual experience. Meanwhile, when the edge portion 12 is bent to the same position on the lower side of the main body portion 11, compared to setting the first groove 101 with the groove opening facing the side where the electrostatic discharge device 50 is provided, the bending amplitude of the middle portion 13 can be reduced, thereby improving the structural reliability of the middle portion 13.

[0051] Of course, in other embodiments, the first groove 101 may also be disposed on the side of the substrate 10 where the electrostatic discharge device 50 is disposed. In this way, the opening of the first groove 101 can be carried out simultaneously with the surface treatment of the first side of the substrate 10, reducing process steps and equipment switching, and improving production efficiency.

[0052] Optionally, the thickness of the substrate 10 is 0.2mm-0.5mm, that is, the thickness of the main body 11 is 0.2mm-0.5mm, to ensure the support effect for the active functional layer 20 and the structural strength of the substrate itself. The thickness of the edge portion 12 is also 0.2mm-0.5mm, to ensure the support effect for the driver chip 61 and the structural strength of the edge portion 12. The distance between the first side surface of the substrate 10 and the bottom surface of the first trench 101 is 0.03mm-0.1mm, that is, the thickness of the middle portion 13 is 0.03mm-0.1mm. This thickness can make the electric field near the electrostatic discharge region d more uniform, avoid local electric field concentration, and ensure that the electrostatic discharge device 50 is turned on in a timely and effective manner when an electrostatic event occurs, and quickly discharges the charge. An excessively thick or thin middle portion 13 may cause abnormal electric field distribution, resulting in a delay in the triggering of the electrostatic discharge device 50 or failure to trigger normally. In addition, there are parasitic capacitances between the substrate 10, the electrostatic discharge device 50, and the surrounding circuitry. The thickness of the middle portion 13 optimizes the parasitic capacitance value, matching it with the capacitance characteristics of the electrostatic discharge device 50, which is beneficial for the rapid response and discharge of electrostatic charge.

[0053] In some embodiments, the width of the fan-out region b is 2mm-4mm. A wider fan-out region b can provide more wiring space, which helps to reduce wiring density, reduce interference between signals, and improve the stability and reliability of signal transmission. It also facilitates process implementation; in processes such as photolithography and etching, a larger size can reduce processing difficulty and improve process tolerance. If the width of the fan-out region b is less than 2mm, it may lead to tight wiring space, overly dense signal traces, and problems such as crosstalk and electromagnetic interference, affecting signal quality. Moreover, narrow space increases process difficulty, requiring higher photolithography precision and making it prone to process defects such as short circuits and open circuits. Conversely, if the width of the fan-out region b is greater than 4mm, although it can further reduce wiring difficulty and signal interference, it will occupy too much chip area, potentially leading to an excessively large overall chip size. This may not be suitable for some space-constrained applications (such as portable devices) and will increase manufacturing costs.

[0054] In some embodiments, the width of the contact terminal region c is 0.3mm-1mm. Narrower contact terminals allow for the arrangement of more terminals within a limited chip edge area, increasing pin density and meeting the connection requirements of complex functional chips. Simultaneously, a width of 0.3mm-1mm ensures sufficient metal contact area for good electrical conductivity, guaranteeing the stability and reliability of signal transmission. If the width of the contact terminal region c is less than 0.3mm, the small metal contact area leads to increased contact resistance, causing signal attenuation, overheating, and other problems, affecting chip performance and stability. Furthermore, excessively narrow terminals are prone to defects such as poor soldering and short circuits during packaging and soldering, reducing product yield. Conversely, if the width of the contact terminal region c is greater than 1mm, while it can further reduce contact resistance and improve electrical performance, it reduces the number of terminals that can be arranged, limiting the chip's pin density. For some chips requiring a large number of pins, this may not meet functional requirements, and it also wastes space around the chip.

[0055] In some embodiments, the width of the electrostatic discharge region d is 0.3mm-1mm. This width range provides sufficient space to arrange the electrostatic discharge device 50 and related circuit structures. A width of 0.3mm allows for the compact arrangement of small electrostatic discharge elements, fulfilling basic electrostatic discharge functions. A width of 1mm accommodates more complex electrostatic discharge structures, such as multiple series or parallel electrostatic discharge diodes, improving the efficiency and reliability of electrostatic discharge and ensuring rapid conduction of charge to ground upon encountering electrostatic shocks, protecting internal circuitry from damage.

[0056] In some embodiments, the width of the first slot 101 can be selected as 0.15mm-0.3mm. This range can ensure that the substrate 10 can be bent smoothly while minimizing the impact on the electrostatic discharge function and structural strength. If the width is too large, it may disrupt the electric field distribution and current conduction path of the electrostatic discharge area d, reducing the electrostatic discharge efficiency, increasing the risk of electrostatic damage to the display module 100, and weakening the structural strength of the substrate 10, making the substrate 10 more prone to breakage at the slot when bent or subjected to external force, affecting the reliability and service life of the display module 100. If the width is too narrow, the substrate 10 is difficult to bend according to the design requirements, and it is impossible to effectively bend the driver chip 61 and the flexible circuit board 62 below the fan-out wiring layer 30, thus failing to achieve the purpose of narrowing the black border. During bending, an excessively narrow first slot 101 will also cause the substrate 10 to bear excessive stress at the slot, which is prone to cracking. Long-term use may lead to crack propagation, affecting the stability of the display module 100.

[0057] Optionally, the orthographic projection of the first groove 101 onto the first side surface of the substrate 10 may be mostly or entirely located in the electrostatic discharge region d. Since no other structural layers or devices are disposed on the spacer region e, the structural strength requirement is high. Therefore, the orthographic projection of the first groove 101 onto the first side surface of the substrate 10 may be mostly or entirely located in the electrostatic discharge region d. The relatively wide space of the electrostatic discharge region d allows for more flexible design of the shape and position of the first groove 101, which is beneficial for achieving better bending effects. At the same time, it can also protect the structural integrity of the spacer region e to a certain extent, so as to ensure the connection stability of the driver chip 61, etc.

[0058] Optionally, the orthographic projection of the first groove 101 onto the first side surface of the substrate 10 may be mostly or entirely located in the spacing region e. This reduces the direct impact on the electrostatic discharge device 50, maximizes the protection of the performance of the electrostatic discharge device 50 from interference, and improves the electrostatic protection capability of the display module 100.

[0059] Furthermore, the intermediate portion 13 can be connected to the main body 200, which allows the bottom edge of the display module 100 to be a spaced-out area e, meaning that no other components are placed along the bottom edge of the display module 100. This prevents the bottom of the display module 100 from being affected by wear from the main body 200, thus improving its reliability. Additionally, the bottom edge of the display module 100 can be directly sealed, improving its sealing performance. Moreover, since the intermediate portion 13 can absorb impact through its own elastic deformation, connecting it to the main body 200 can buffer the main body 11 when the edge of the electronic device is impacted, increasing the structural strength of the main body 11 and thus improving the reliability of the display module 100.

[0060] Please see Figure 3 and Figure 5In some embodiments, the bottom of the first groove 101 is provided with several through holes 102, that is, one or more through holes 102 are provided on the middle part 13. The presence of through holes 102 breaks the material continuity at the first groove 101, reducing the mutual constraints within the material during bending. When the first groove 101 is bent, the material in the parts without through holes 102 will be squeezed and stretched against each other, generating greater stress and limiting the degree of bending. In the areas with through holes 102, the material can "flow" into the through holes 102 to a certain extent, alleviating the stress concentration during bending, making it easier for the first groove 101 to bend to a greater extent. In addition, since the electrostatic discharge device 50 and the driving chip 61 are both heat-generating devices, the through holes 102 can provide additional heat dissipation channels, allowing heat to be dissipated more effectively to the external environment, helping to reduce the temperature of related components, improve their performance and reliability, and extend their service life. The through holes 102 can also serve as channels for wires, optical fibers, or other small components, facilitating electrical connections or signal transmission between different areas, which is beneficial for optimizing the internal structural layout and improving space utilization.

[0061] Please see Figure 3 and Figure 5 In some embodiments, the display module 100 further includes a reinforcing adhesive layer 70, which is disposed on the first side of the substrate 10 and located in the spacing region e. The reinforcing adhesive layer 70 is a functional layer formed by reinforcing adhesive. The placement of the reinforcing adhesive in the spacing region e effectively fills the gap between the electrostatic discharge device 50 and the driving chip 61, improving the stability and reliability of the overall structure and reducing relative displacement and loosening between components. Furthermore, due to the elasticity of the reinforcing adhesive, it can also evenly distribute the stress acting on the spacing region e, avoiding stress concentration at local points, thereby reducing the risk of damage to the middle part 13 due to excessive stress at a point involving the spacing region e. Especially when subjected to external impact or vibration, it can effectively protect components and connection points. In addition, the reinforcing adhesive can form a good sealing effect, preventing external dust, moisture, chemicals, etc., from entering the internal structure of the substrate 10, protecting internal electronic components and circuits, and improving the product's moisture-proof, dust-proof, and corrosion-proof performance. To improve the insulation performance of the substrate 10, a reinforcing adhesive with insulating properties can be applied to the spacing region e to prevent short circuits between adjacent conductive components, while also reducing electromagnetic interference and improving the electrical performance and stability of the product. Furthermore, when a through-hole 102 is provided on the middle portion 13, the reinforcing adhesive layer 70 can also improve the structural strength of the area where the through-hole 102 is located, preventing cracks from appearing at the through-hole 102.

[0062] The material of the reinforcing adhesive layer 70 can be epoxy resin, silicone rubber, acrylic resin, etc.

[0063] Please see Figure 4In some embodiments, the main body 11 abuts against the edge portion 12, that is, the second side of the main body 11 abuts against the second side of the edge portion 12. This allows for a more compact overall structure of the display module 100, achieving a more rational layout within a limited space. Compared to a configuration where the main body 11 and the edge portion 12 are spaced apart in the thickness direction of the display module 100, this configuration effectively saves internal space and contributes to a thinner and lighter design of the display module 100. Furthermore, the abutment between the edge portion 12 and the main body 11 increases the overall strength and stability of the non-display areas of the display module 100. The folded edge portion 12 provides additional support for the main body 11, reducing deformation and wobbling of the main body 11 under external forces. Especially when the device is subjected to impact or vibration, this structure better protects internal electronic components and circuitry, reducing the risk of damage due to structural instability. Meanwhile, folding the driver chip 61 under the main body 11 allows the flexible circuit board 62 to be closer to the controller 210 of the device body 200, preventing the flexible circuit board 62 from bending and deforming, thereby improving the reliability of the flexible circuit board 62.

[0064] Please see Figure 3 and Figure 6 In some embodiments, the main body 11 has a second slot 103 located between the active functional layer 20 and the first slot 101, and extending through the first slot 101. That is, the second slot 103 occupies all or part of the fan-out region b and the entire contact terminal region c, or the second slot 103 occupies all or part of the contact terminal region c. The second slot 103 can form a more efficient heat dissipation channel, enabling better heat dissipation of the fan-out wiring layer 30 and the pixel test circuit layer 40, thereby improving overall heat dissipation efficiency, preventing local overheating, helping to maintain the performance and stability of the device, and extending the device's service life. Furthermore, because the second slot 103 reduces the thickness of the contact terminal region c where the pixel test circuit layer 40 is located, it increases the flexibility of the contact terminals in connecting to external components. In the fan-out region b and the contact terminal region c, stress concentration is easily generated due to the connection of different materials and thermal expansion and contraction. The existence of the second groove 103 can serve as a channel for stress release. When the material expands or contracts, the second groove 103 can accommodate the deformation of the material, reduce stress concentration, thereby reducing the risk of component damage due to excessive stress and improving the reliability of the entire structure.

[0065] Optionally, the edge portion 12 is at least partially accommodated within the second groove 103. In this way, the second groove 103 provides a specific accommodating space for the edge portion 12, precisely defining its position and preventing it from moving arbitrarily during assembly or use. This provides good positioning and fixation, contributing to improved stability and reliability of the entire structure. The second groove 103 also protects the edge portion 12 from damage caused by external impacts, friction, or corrosion. Simultaneously, it makes the overall structure more compact, improves space utilization, and allows for a thinner display module 100 at its bottom edge.

[0066] Furthermore, the edge portion 12 can abut against the bottom of the second slot 103 to improve the overall structural stability of the display module 100 and enhance its support for the fan-out wiring layer 30 and the pixel test circuit layer 40. Compared to not having the second slot 103, having the second slot 103 and abutting the edge portion 12 against the bottom of the second slot 103 can further achieve a thinning of the bottom edge of the display module 100.

[0067] The above descriptions are merely several specific embodiments of the present invention, and only specifically describe the technical principles of the present invention. These descriptions are only for explaining the principles of the present invention and should not be construed as limiting the scope of protection of the present invention in any way. Based on this explanation, any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention, as well as other specific embodiments of the present invention that can be conceived by those skilled in the art without creative effort, should be included within the scope of protection of the present invention.

Claims

1. A display module, characterized in that, The device includes a substrate, an active functional layer, a fan-out wiring layer, a pixel test circuit layer, an electrostatic discharge device, and a module driving assembly. The active functional layer, the fan-out wiring layer, the pixel test circuit layer, the electrostatic discharge device, and the module driving assembly are all disposed on the first side of the substrate and arranged in sequence. The electrostatic discharge device is spaced apart from the module driving assembly. The substrate is made of ultra-thin flexible glass and has an active region corresponding to the active functional layer, a fan-out region corresponding to the fan-out wiring layer, a contact terminal region corresponding to the pixel test circuit layer, an electrostatic discharge region corresponding to the electrostatic discharge device, a module driving region corresponding to the module driving assembly, and a gap region located between the electrostatic discharge region and the module driving region. The substrate has a first groove, which corresponds to at least a portion of the electrostatic discharge area and / or the interval area. The substrate is divided into a main body and an edge portion by the first groove. The active functional layer, the fan-out wiring layer and the contact terminal layer are all disposed in the main body, and the module driving assembly is disposed in the edge portion. The substrate is bent and deformed at the first groove so that the edge portion and the main body are opposite each other in the thickness direction of the substrate.

2. The display module as described in claim 1, characterized in that, The first groove is disposed on the side of the substrate opposite to the electrostatic discharge device.

3. The display module as described in claim 1, characterized in that, The distance between the first side surface of the substrate and the bottom surface of the first trench is 0.03mm-0.1mm.

4. The display module as described in claim 1, characterized in that, The width of the fan-out area is 2mm-4mm, the width of the contact terminal area is 0.3mm-1mm, the width of the electrostatic discharge area is 0.3mm-1mm, and the width of the interval area is greater than 0.6mm.

5. The display module as described in claim 1, characterized in that, The bottom of the first groove has several through holes.

6. The display module as described in claim 2, characterized in that, The display module further includes a reinforcing adhesive layer disposed on a first side of the substrate and located in the spacing region.

7. The display module as described in claim 1, characterized in that, The main body abuts against the edge portion.

8. The display module as described in claim 7, characterized in that, The main body has a second groove, which is located between the active functional layer and the first groove and extends through the first groove.

9. The display module as described in claim 8, characterized in that, The edge portion is at least partially housed within the second groove.

10. The display module as described in claim 9, characterized in that, The edge portion abuts against the bottom of the second groove.

11. An electronic device, characterized in that, Includes the display module as described in any one of claims 1 to 10.

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