Display panel, manufacturing method of display panel and electronic device

Abstract

The application provides a display panel, a manufacturing method of the display panel and an electronic device, and relates to the technical field of display panels.The display panel comprises a display area, a bonding area and a bending area located between the display area and the bonding area; the display panel further comprises a carrier film layer and a conductive layer; the carrier film layer comprises a first surface and a second surface arranged oppositely; in a direction away from the first surface, the thickness of the carrier film layer at at least one position of the bending area is smaller than the thickness of the carrier film layer at at least one position of the display area and / or the bonding area, thereby forming a recess structure located in the bending area; the conductive layer extends from the display area to the bonding area through the bending area; at least part of the conductive layer extends into the recess structure, so that the spacing between the conductive layer and the stress neutral layer can be reduced, and thus the stress on the conductive layer can be reduced.

Description

Technical Field

[0001] This application relates to the field of display panel technology, and more specifically, to a display panel, a method for manufacturing the display panel, and an electronic device. Background Technology

[0002] With the development of display technology, users have increasingly higher demands for display devices, such as high resolution and high screen-to-body ratio. As people pursue the ultimate screen-to-body ratio, display panels with narrow bezels or no bezels have received widespread attention. Typically, the bezel area of ​​a display panel can be bent to the back, thus achieving a narrow bezel or no bezel. However, due to the inherent structural characteristics of the display panel, it is prone to bending damage during the bending process. Summary of the Invention

[0003] In order to overcome the above-mentioned deficiencies in the prior art, the purpose of this application is to provide a display panel, the display panel including a display area, a bonding area and a bent area located between the display area and the bonding area;

[0004] The display panel also includes:

[0005] A carrier film layer; the carrier film layer includes a first surface and a second surface disposed opposite to each other, wherein, in a direction away from the first surface, the thickness of the carrier film layer at at least one location in the bending region is less than the thickness of the carrier film layer at at least one location in the display area and / or the bonding area, forming a recessed structure located in the bending region;

[0006] A conductive layer located on the second surface extends from the display area through the bending area to the bonding area; at least a portion of the conductive layer extends into the recessed structure.

[0007] In one possible implementation, the display area, the bending area, and the bonding area are arranged sequentially along a first direction, and the recessed structure extends along a second direction, the first direction being different from the second direction;

[0008] Preferably, the first direction intersects with the second direction;

[0009] Preferably, the conductive layer includes multiple traces extending from the display area through the bending area to the bonding area.

[0010] In one possible implementation, the carrier film layer comprises a plurality of stacked sublayers; in a direction away from the first surface, the thickness of at least one of the sublayers at at least one location in the bending region is less than the thickness of the sublayer at at least one location in the display area and / or the bonding area;

[0011] Preferably, the plurality of sub-layers include a first substrate, a buffer layer, a second substrate, and a first planarization layer stacked sequentially; the side of the first substrate away from the first planarization layer is the first side, and the side of the first planarization layer away from the first substrate is the second side.

[0012] In one possible implementation, at least one of the sub-layers includes a first part, a second part, and a third part connected in sequence, wherein the thickness of the first part is less than the thickness of the third part, and the thickness of the second part gradually increases from the side closer to the first part to the side closer to the third part; the first part is located in the bending region.

[0013] Preferably, the second portion and the third portion are located in the display area and / or the bonding area.

[0014] In one possible implementation, the thickness of the third portion differs from the thickness of the first portion by less than 4 micrometers.

[0015] In one possible implementation, the display panel further includes a second planarization layer located on the side of the conductive layer away from the first planarization layer;

[0016] The second planarization layer extends from the display area through the bending area to the bonding area; the thickness of the second planarization layer in the bending area is greater than the thickness of the second planarization layer in the display area and / or the bonding area.

[0017] In one possible implementation, the display panel further includes a bending protection layer located on the side of the second planarization layer away from the conductive layer, wherein the orthographic projection of the bending protection layer onto the second planarization layer is at least partially located in the bending region.

[0018] Another objective of this application is to provide a method for manufacturing a display panel, the display panel including a display area, a bonding area, and a bent area located between the display area and the bonding area;

[0019] The method includes:

[0020] A carrier film layer is provided; the carrier film layer includes a first surface and a second surface disposed opposite to each other, and in a direction away from the first surface, the thickness of the carrier film layer at at least one location in the bending region is less than the thickness of the carrier film layer at at least one location in the display area and / or the bonding area, forming a recessed structure in the bending region;

[0021] A conductive layer is disposed on the second side of the carrier film layer, the conductive layer extending from the display area through the bending area to the bonding area; at least a portion of the conductive layer extends into the recessed structure.

[0022] In one possible implementation, the step of providing the carrier film layer includes:

[0023] Multiple sub-layers of the carrier film are formed sequentially, wherein, for at least one sub-layer, after the sub-layer is formed, the portion of the sub-layer located in the bending region is thinned to form a recessed structure.

[0024] Another object of this application is to provide an electronic device, the electronic device including the display panel provided in this application or the display panel manufactured by the method of manufacturing the display panel provided in this application.

[0025] Compared with the prior art, this application has the following beneficial effects:

[0026] This application provides a display panel, a method for manufacturing the display panel, and an electronic device. By setting the thickness of the carrier film layer in the bending area to be less than the thickness of the carrier film layer in the display area and / or bonding area, the spacing between the conductive layer and the stress neutral layer can be reduced, thereby reducing the stress on the conductive layer, preventing the conductive layer from breaking, ensuring the stability and reliability of the display panel during the bending process, and improving the service life of the display panel. Attached Figure Description

[0027] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a schematic diagram of the structure of a display panel in the prior art;

[0029] Figure 2 This is one of the structural schematic diagrams of the display panel provided in the embodiments of this application;

[0030] Figure 3 This is a second schematic diagram of the structure of the display panel provided in the embodiments of this application;

[0031] Figure 4 This is the third schematic diagram of the structure of the display panel provided in the embodiments of this application;

[0032] Figure 5 Fourth schematic diagram of the structure of the display panel provided in the embodiments of this application;

[0033] Figure 6 Fifth schematic diagram of the structure of the display panel provided in the embodiments of this application;

[0034] Figure 7 This is the sixth schematic diagram of the structure of the display panel provided in the embodiments of this application;

[0035] Figure 8 This is a flowchart illustrating a method for manufacturing a display panel according to an embodiment of this application.

[0036] Icons: 110 - Display area; 120 - Bending area; 130 - Bonding area; 200 - Bearing film layer; 201 - First part; 202 - Second part; 203 - Third part; 210 - First substrate; 220 - Buffer layer; 230 - Second substrate; 240 - First planarization layer; 300 - Conductive layer; 400 - Second planarization layer; 500 - Bending protection layer. Detailed Implementation

[0037] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0038] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0039] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0040] In the description of this application, it should be noted that the terms "center," "upper," "lower," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of the invention is in use. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. In addition, the terms "first," "second," and "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0041] It should be noted that, where there is no conflict, different features in the embodiments of this application can be combined with each other.

[0042] The inventors discovered that to achieve a narrow bezel in the display panel, a portion of the display panel (e.g., bonding area 130') can be bent to the back of the display panel. As the bezel area of ​​the display panel becomes narrower, the length of the conductive layer in the bending area 120' also gradually decreases, resulting in a lower bending radius and increased stress on the conductive layer. Therefore, please refer to... Figure 1 In the prior art, a bending protective layer 500' (BPL) can be added to the bending area 120' to reduce the stiffness of the display panel during bending. However, this method cannot reduce the stress on the conductive layer and is prone to bending damage to the display panel.

[0043] In view of this, this embodiment provides a solution to the above problems, and the solution provided in this embodiment will be described in detail below.

[0044] Please refer to Figure 2 , Figure 2 Example: A schematic diagram of the structure of the display panel provided in this embodiment. The display panel may include a display area 110, a bonding area 130, and a bending area 120 located between the display area 110 and the bonding area 130.

[0045] In this embodiment, the bending area 120 can be used to connect the display area 110 and the bonding area 130. The bending area 120 is located on one side of the display area 110 and is adjacent to the display area 110. The bonding area 130 is located on the side of the bending area 120 away from the display area 110 and is also adjacent to the bending area 120.

[0046] The display panel may also include a carrier film layer 200 and a conductive layer 300.

[0047] The carrier film layer 200 can extend from the display area 110 through the bending area 120 to the bonding area 130. The carrier film layer 200 may include a first surface and a second surface disposed opposite to each other. In the direction away from the first surface, the thickness of the carrier film layer 200 at at least one location in the bending area 120 may be less than the thickness of the carrier film layer 200 at at least one location in the display area 110 and / or the bonding area 130, forming a recessed structure located in the bending area 120.

[0048] In this embodiment, the bearing film layer 200 located in the bending region 120 can be thinned to form a recessed structure in the bending region 120, thereby reducing the distance between the conductive layer 300 and the stress neutral layer (located within the bearing film layer 200), thus reducing the stress on the conductive layer 300 and preventing the conductive layer 300 from breaking. The stress neutral layer is a virtual layer on which the object is subjected to neither pressure nor tension.

[0049] Specifically, the thickness of the carrier film layer 200 located in the bending area 120 can be equal, and the thickness of the carrier film layer 200 located in the bending area 120 can be less than the thickness of the carrier film layer 200 located in the display area 110 and / or the bonding area 130.

[0050] The conductive layer 300 may be located on the second side of the carrier film layer 200, and the conductive layer 300 may extend from the display area 110 through the bending area 120 to the bonding area 130. At least a portion of the conductive layer 300 may extend into the recessed structure.

[0051] In this embodiment, the thickness of the conductive layer 300 in the display area 110 and the bonding area 130 can be equal to the thickness of the conductive layer 300 in the bending area 120. In the thickness direction of the conductive layer 300, the surface of the conductive layer 300 away from the carrier film layer 200 may not be planar. The shape of the conductive layer 300 can match the shape of the recessed structure. The conductive layer 300 located in the display area 110 and the bonding area 130 may each include a slope. For example, the angle of the slope can be 30°.

[0052] Based on the above design, in the display panel provided in this embodiment, by setting the thickness of the carrier film layer 200 in the bending area 120 to be less than the thickness of the carrier film layer 200 in the display area 110 and / or the bonding area 130, the distance between the conductive layer 300 and the stress neutral layer can be reduced, thereby reducing the stress on the conductive layer 300, preventing the conductive layer 300 from breaking, ensuring the stability and reliability of the display panel during the bending process, and improving the service life of the display panel.

[0053] In one possible implementation, the display area 110, the bending area 120, and the bonding area 130 may be arranged sequentially along a first direction, and the recessed structure may extend along a second direction, with the first direction intersecting the second direction. The conductive layer 300 may include multiple traces extending from the display area 110 through the bending area 120 to the bonding area 130.

[0054] In this embodiment, the first direction can be the arrangement direction of the display area 110, the bending area 120, and the bonding area 130, and the second direction can be the thickness direction of the carrier film layer 200. Please refer again. Figure 2 When the display panel is not bent, the first direction can be perpendicular to the second direction. Please refer to... Figure 3 During the bending process, the bonding area 130 can be bent to the back of the display panel, and the first direction can be the bending direction.

[0055] In the above design, by reducing the spacing between the conductive layer 300 and the stress neutral layer, the stress on the conductive layer 300 can be reduced, thereby preventing the traces in the conductive layer 300 from breaking.

[0056] In one possible implementation, the carrier film layer 200 may include a plurality of stacked sublayers. In a direction away from the first surface, the thickness of at least one sublayer at at least one location in the bending region 120 may be less than the thickness of the sublayer at at least one location in the display region 110 and / or the bonding region 130.

[0057] The multiple sublayers may include a first substrate 210 (PI1), a buffer layer 220 (BL1), a second substrate 230 (PI2), and a first planarization layer 240 (PLN2) stacked sequentially. The conductive layer 300 may be located on the side of the first planarization layer 240 (PLN2) away from the first substrate 210 (PI1). The side of the first substrate 210 (PI1) away from the first planarization layer 240 (PLN2) may be a first side, and the side of the first planarization layer 240 (PLN2) away from the first substrate 210 (PI1) may be a second side. The materials of the first substrate 210 (PI1) and the second substrate 230 (PI2) may be polyimide (PI), the material of the buffer layer 220 (BL1) may be an inorganic material, such as silicon oxide and silicon nitride, and the material of the first planarization layer 240 (PLN2) may be a photosensitive polyimide material. The material of the conductive layer 300 may be a metallic material, such as titanium-aluminum-titanium (Ti-Al-Ti).

[0058] In one possible implementation, any sublayer of the carrier film 200 can be thinned to reduce the spacing between the conductive layer 300 and the stress-neutral layer (located within the second substrate 230 (PI2) or the first planarization layer 240 (PLN2)), thereby reducing the stress on the conductive layer 300 and preventing it from cracking. For example, please refer to... Figure 4 The first planarization layer 240 (PLN2) can be thinned only, so that the thickness of the first planarization layer 240 (PLN2) located in the bending region 120 is equal, and the thickness of the first planarization layer 240 (PLN2) located in the bending region 120 is less than the thickness of the first planarization layer 240 (PLN2) located in the display region 110 and the bonding region 130. In this way, the stress on the conductive layer 300 can be reduced.

[0059] It should be noted that when thinning any sublayer in the carrier film layer 200, it is not limited to thinning only the first planarization layer 240 (PLN2). It can also thin any sublayer in the first substrate 210, buffer layer 220 (BL1) or second substrate 230 (PI2). The thinning can be adjusted according to the actual situation, and no specific limitation is made here.

[0060] In another possible implementation, any two sublayers in the carrier film layer 200 can be thinned to reduce the spacing between the conductive layer 300 and the stress-neutral layer (located within the second substrate 230 (PI2) or the first planarization layer 240 (PLN2)), thereby reducing the stress on the conductive layer 300 and preventing it from breaking. For example, please refer to... Figure 5 Both the second substrate 230 (PI2) and the first planarization layer 240 (PLN2) can be thinned to make the thickness of the second substrate 230 (PI2) in the bending region 120 equal, and the thickness of the first planarization layer 240 (PLN2) in the bending region 120 also equal. Furthermore, the thicknesses of the second substrate 230 (PI2) and the first planarization layer 240 (PLN2) located in the bending region 120 are less than the thicknesses of the second substrate 230 (PI2) and the first planarization layer 240 (PLN2) located in the display region 110 and the bonding region 130. In this way, the stress on the conductive layer 300 can be reduced.

[0061] It should be noted that when thinning any two sublayers in the carrier film layer 200, it is not limited to thinning the second substrate 230 (PI2) and the first planarization layer 240 (PLN2). It can also be thinned on any other two sublayers in the carrier film layer 200. The thinning can be adjusted according to the actual situation, and no specific limitation is made here.

[0062] In addition, three or more sub-layers in the carrier film layer 200 can be thinned to further reduce the stress on the conductive layer 300.

[0063] In one possible implementation, at least one sublayer may include a first portion 201, a second portion 202, and a third portion 203 connected in sequence. The thickness of the first portion 201 may be less than the thickness of the third portion 203. The thickness of the second portion 202 may gradually increase from the side closer to the first portion 201 to the side closer to the third portion 203. The first portion 201 may be located in the bending area 120, and the second portion 202 and the third portion 203 may be located in the display area 110 and / or the bonding area 130.

[0064] In this embodiment, the first part 201 can be located between two adjacent second parts 202 to form a recessed structure. The first part 201 can form the bottom of the recessed structure, the two second parts 202 can form the sidewalls of the recessed structure, and the thickness of the two second parts 202 gradually increases in the direction away from the first part 201. The side of the two second parts 202 away from the first part 201 can be connected to the two third parts 203 respectively.

[0065] The junction of the first part 201 and the second part 202 can overlap with the junction of the bending area 120 and the display area 110, as well as the junction of the bending area 120 and the bonding area 130. That is, the first part 201 located between two adjacent second parts 202 can be located in the bending area 120, the two second parts 202 can be located in the display area 110 and the bonding area 130 respectively, and the two third parts 203 can also be located in the display area 110 and the bonding area 130 respectively. The second parts 202 located in the display area 110 can be symmetrically arranged with the second parts 202 located in the bonding area 130 relative to the first parts 201 located in the bending area 120.

[0066] In some examples, please refer to Figure 6 The first planarization layer 240 (PLN2) can be thinned so that the thickness of the first planarization layer 240 (PLN2) located in the bending region 120 is less than the thickness of the first planarization layer 240 (PLN2) in the display region 110 and the bonding region 130. The thinned first planarization layer 240 (PLN2) may include a first portion 201, a second portion 202 and a third portion 203 connected in sequence. The first portion 201 has the smallest thickness and is located in the bending region 120; the third portion 203 has the largest thickness and is located in the display region 110 and the bonding region 130; the second portion 202 is used to connect the first portion 201 and the third portion 203, and the thickness of the second portion 202 gradually increases in the direction away from the first portion 201. The second portion 202 is also located in the display region 110 and the bonding region 130.

[0067] In the above design, by setting the thickness of the second part 202 of at least one sub-layer to gradually increase from the side closer to the first part 201 to the side closer to the third part 203, the stress on the conductive layer 300 during bending can be effectively reduced, and the flatter the second part 202, the smaller the stress on the conductive layer 300.

[0068] In one possible implementation, please refer again. Figure 6 The thickness difference between the third part 203 and the first part 201 can be less than 4 micrometers. For example, the thickness difference between the third part 203 and the first part 201 can be 4 micrometers, 3.6 micrometers, 3 micrometers, 2.4 micrometers or 2 micrometers, which can be adjusted according to actual application requirements.

[0069] In this embodiment, when thinning at least one sublayer, the thinning thickness can be less than 4 micrometers. For example, if the second substrate 230 (PI2) is thinned, the thickness of the second substrate 230 (PI2) in the first portion 201 can be 4 micrometers smaller than the thickness of the second substrate 230 (PI2) in the third portion 203.

[0070] In one possible implementation, please refer to Figure 7 The display panel may further include a second planarization layer 400 (PLN3), which may be located on the side of the conductive layer 300 away from the first planarization layer 240 (PLN2). The second planarization layer 400 (PLN3) may extend from the display area 110 through the bending area 120 to the bonding area 130, and the thickness of the second planarization layer 400 (PLN3) in the bending area 120 may be greater than the thickness of the second planarization layer 400 (PLN3) in the display area 110 and the bonding area 130.

[0071] In this embodiment, the shape of the surface of the second planarization layer 400 (PLN3) near the conductive layer 300 can match the shape of the conductive layer 300, and the surface of the second planarization layer 400 (PLN3) away from the conductive layer 300 can be planar. Therefore, the thickness of the second planarization layer 400 (PLN3) in the bending region 120 can be greater than the thickness of the second planarization layer 400 (PLN3) in the display region 110 and the bonding region 130. In addition, the material of the second planarization layer 400 (PLN3) can be the same as the material of the first planarization layer 240 (PLN2).

[0072] In one possible implementation, please refer again. Figure 7 The display panel may also include a bending protection layer 500, which may be located on the side of the second planarization layer 400 (PLN3) away from the conductive layer 300. The orthographic projection of the bending protection layer 500 on the second planarization layer 400 (PLN3) is at least partially located in the bending region 120.

[0073] In this embodiment, the bending protective layer 500 may be located only in the bending area 120. The bending protective layer 500 can be used to increase the thickness of the bending area 120, thereby reducing the stiffness of the bending area 120 during bending, so as to achieve a good bending morphology.

[0074] Additionally, the display panel may include a support layer and a shim block located on the side of the carrier film layer 200 away from the conductive layer 300. The support layer is located on the side of the carrier film layer 200 away from the conductive layer 300. The support layer may be located in the display area 110 and the bonding area 130. The shim block may be located between the support layer located in the display area 110 and the support layer located in the bonding area 130 for adjusting the bending radius.

[0075] This application also provides a method for manufacturing a display panel, which may include a display area 110, a bonding area 130, and a bending area 120 located between the display area 110 and the bonding area 130.

[0076] Please refer to Figure 8The method for manufacturing a display panel may include the following steps.

[0077] Step S110, providing a carrier film layer 200; the carrier film layer 200 includes a first surface and a second surface disposed opposite to each other, and in a direction away from the first surface, the thickness of the carrier film layer 200 at at least one location in the bending region 120 is less than the thickness of the carrier film layer 200 at at least one location in the display region 110 and / or the bonding region 130, forming a recessed structure located in the bending region 120.

[0078] In this embodiment, the carrier film layer 200 located in the bending region 120 can be thinned to form a recessed structure in the bending region 120. The thickness of the carrier film layer 200 located in the bending region 120 can be equal, and the thickness of the carrier film layer 200 located in the bending region 120 can be less than the thickness of the carrier film layer 200 located in the display region 110 and the bonding region 130.

[0079] In step S120, a conductive layer 300 is provided on the second surface of the carrier film layer 200. The conductive layer 300 extends from the display area 110 through the bending area 120 to the bonding area 130. At least a portion of the conductive layer 300 extends into the recessed structure.

[0080] In this embodiment, a conductive layer 300 can be provided on the second side of the carrier film layer 200. The conductive layer 300 can completely cover the carrier film layer 200, and the conductive layer 300 located in the bending region 120 can be located in the recessed structure formed by the carrier film layer 200.

[0081] In one possible implementation, in step S110, when providing the carrier film layer 200, multiple sub-layers of the carrier film layer 200 can be formed sequentially. For at least one sub-layer, after the sub-layer is formed, the portion of the sub-layer located in the bending region 120 can be thinned to form a recessed structure.

[0082] In this embodiment, the multiple sublayers may include a first substrate 210 (PI1), a buffer layer 220 (BL1), a second substrate 230 (PI2), and a first planarization layer 240 (PLN2) stacked sequentially. The conductive layer 300 may be located on the side of the first planarization layer 240 (PLN2) away from the first substrate 210 (PI1). When thinning the sublayers of the carrier film layer 200, one or more sublayers of the carrier film layer 200 may be thinned to form a recessed structure.

[0083] In some examples, the second substrate 230 (PI2) and the first planarization layer 240 (PLN2) can be thinned. Specifically, other film structures, such as inorganic semiconductor active layer P-Si, gate insulating layer GI, etc., may also be included between the second substrate 230 (PI2) and the first planarization layer 240 (PLN2). These film structures can also extend from the display area 110 through the bending area 120 to the bonding area 130. Before forming the first planarization layer 240 (PLN2), these film structures can be etched to remove the portion located in the bending area 120, and then the second substrate 230 (PI2) can be thinned by an asher process. After thinning the second substrate 230 (PI2), a first planarization layer 240 (PLN2) can be formed on the side of the second substrate 230 (PI2) away from the first substrate 210 (PI1), and the first planarization layer 240 (PLN2) can be thinned by a half-tone mask (HTM) to form a recessed structure located in the bending region 120.

[0084] In the above design, by thinning at least one sublayer of the carrier film layer 200, the thickness of the carrier film layer 200 in the bending region 120 is less than the thickness of the carrier film layer 200 in the display region 110 and / or the bonding region 130. This reduces the spacing between the conductive layer 300 and the stress neutral layer, thereby reducing the stress on the conductive layer 300, preventing the conductive layer 300 from breaking, and ensuring the stability and reliability of the display panel during bending.

[0085] This application also provides an electronic device, which may include the display panel provided in this application or a display panel manufactured using the method described in this application. The electronic device may include devices with display functions such as monitors, video walls, mobile phones, tablets, laptops, and televisions.

[0086] In summary, the embodiments of this application provide a display panel, a method for manufacturing the display panel, and an electronic device. By setting the thickness of the carrier film layer in the bending area to be less than the thickness of the carrier film layer in the display area and / or the bonding area, the spacing between the conductive layer and the stress neutral layer can be reduced, thereby reducing the stress on the conductive layer, preventing the conductive layer from breaking, ensuring the stability and reliability of the display panel during the bending process, and improving the service life of the display panel.

[0087] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0088] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A display panel, characterized in that, The display panel includes a display area, a bonding area, and a bent area located between the display area and the bonding area; The display panel also includes: A carrier film layer; the carrier film layer includes a first surface and a second surface disposed opposite to each other, wherein, in a direction away from the first surface, the thickness of the carrier film layer at at least one location in the bending region is less than the thickness of the carrier film layer at at least one location in the display area and / or the bonding area, forming a recessed structure located in the bending region; A conductive layer located on the second surface extends from the display area through the bending area to the bonding area; at least a portion of the conductive layer extends into the recessed structure.

2. The display panel according to claim 1, characterized in that, The display area, the bending area, and the bonding area are arranged sequentially along a first direction, and the recessed structure extends along a second direction, wherein the first direction is different from the second direction. Preferably, the first direction intersects with the second direction; Preferably, the conductive layer includes multiple traces extending from the display area through the bending area to the bonding area.

3. The display panel according to claim 1, characterized in that, The carrier film layer includes a plurality of stacked sublayers; in a direction away from the first surface, the thickness of at least one of the sublayers at at least one location in the bending region is less than the thickness of the sublayer at at least one location in the display area and / or the bonding area; Preferably, the plurality of sub-layers include a first substrate, a buffer layer, a second substrate, and a first planarization layer stacked sequentially; the side of the first substrate away from the first planarization layer is the first side, and the side of the first planarization layer away from the first substrate is the second side.

4. The display panel according to claim 3, characterized in that, At least one of the sublayers includes a first part, a second part, and a third part connected in sequence, wherein the thickness of the first part is less than the thickness of the third part, and the thickness of the second part gradually increases from the side closer to the first part to the side closer to the third part; the first part is located in the bending region. Preferably, the second portion and the third portion are located in the display area and / or the bonding area.

5. The display panel according to claim 4, characterized in that, The thickness difference between the third part and the first part is less than 4 micrometers.

6. The display panel according to claim 3, characterized in that, The display panel further includes a second planarization layer, which is located on the side of the conductive layer away from the first planarization layer; The second planarization layer extends from the display area through the bending area to the bonding area; the thickness of the second planarization layer in the bending area is greater than the thickness of the second planarization layer in the display area and / or the bonding area.

7. The display panel according to claim 6, characterized in that, The display panel further includes a bending protection layer located on the side of the second planarization layer away from the conductive layer, and the orthographic projection of the bending protection layer on the second planarization layer is at least partially located in the bending area.

8. A method for manufacturing a display panel, characterized in that, The display panel includes a display area, a bonding area, and a bent area located between the display area and the bonding area; The method includes: A carrier film layer is provided; the carrier film layer includes a first surface and a second surface disposed opposite to each other, and in a direction away from the first surface, the thickness of the carrier film layer at at least one location in the bending region is less than the thickness of the carrier film layer at at least one location in the display area and / or the bonding area, forming a recessed structure in the bending region; A conductive layer is disposed on the second side of the carrier film layer, the conductive layer extending from the display area through the bending area to the bonding area; at least a portion of the conductive layer extends into the recessed structure.

9. The method for manufacturing a display panel according to claim 8, characterized in that, The step of providing the carrier film layer includes: Multiple sub-layers of the carrier film are formed sequentially, wherein, for at least one sub-layer, after the sub-layer is formed, the portion of the sub-layer located in the bending region is thinned to form a recessed structure.

10. An electronic device, characterized in that, The electronic device includes a display panel made by the method of manufacturing the display panel according to any one of claims 1-7 or any one of claims 8-9.

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