Display module and display device

Abstract

The application discloses a display module and a display device. The display module comprises a display panel, the display panel comprising a first part, a second part and a bending part connecting the first part and the second part arranged oppositely at least partially; the bending part comprises a circuit layer, the circuit layer comprising a signal line arranged in a wave shape along the extension direction of the bending part, the signal line comprising a center region, transition regions respectively arranged on both sides of the center region along the extension direction of the bending part and edge regions arranged on the side of the transition regions away from the center region, the signal line comprising a first wave-shaped trace located in the center region, a second wave-shaped trace located in the transition region and a third wave-shaped trace located in the edge region; wherein the amplitude of the first wave-shaped trace is greater than the amplitude of the second wave-shaped trace, and the amplitude of the second wave-shaped trace is greater than the amplitude of the third wave-shaped trace. The problem that the signal line is broken due to excessive strain in the bending process is avoided, and the reliability and use performance of the display module are improved.

Description

Technical Field

[0001] This application belongs to the field of display technology, and in particular relates to a display module and display device. Background Technology

[0002] Organic light-emitting diodes (OLEDs) and flat panel display modules based on light-emitting diodes (LEDs) are widely used in various consumer electronics products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, power saving, thin body and wide range of applications, becoming the mainstream of display panels.

[0003] Due to limitations in the existing display module structure, the performance of the display module cannot meet the requirements.

[0004] Therefore, there is an urgent need for a new display module and display device. Summary of the Invention

[0005] This application provides a display module and display device. By restricting the signal lines to a wavy shape, and ensuring that the amplitude of the first wavy line is greater than that of the second wavy line, and the amplitude of the second wavy line is greater than that of the third wavy line, the stress resistance of the first wavy line is increased, the flexibility of the signal line is improved, and the problem of signal line breakage due to excessive strain during bending is avoided, thereby improving the reliability and performance of the display module.

[0006] This application provides a display module, including: a display panel, the display panel including at least partially oppositely disposed first portion, second portion, and a bent portion connecting the first portion and the second portion, the second portion being located on the side of the first portion away from the light-emitting side of the display panel; the bent portion including a circuit layer, the circuit layer including signal lines arranged in a wavy shape along the extension direction of the bent portion, the signal lines including a central region, transition regions respectively disposed on both sides of the central region along the extension direction of the bent portion, and an edge region disposed on the side of the transition region away from the central region, the signal lines including a first wavy trace located in the central region, a second wavy trace located in the transition region, and a third wavy trace located in the edge region; wherein, the amplitude of the first wavy trace is greater than the amplitude of the second wavy trace, and the amplitude of the second wavy trace is greater than the amplitude of the third wavy trace.

[0007] According to one aspect of this application, the wavelength of the second wave trace is greater than the wavelength of the third wave trace, and the wavelength of the second wave trace is greater than the wavelength of the first wave trace; preferably, the wavelength of the third wave trace is greater than the wavelength of the first wave trace and less than the wavelength of the second wave trace.

[0008] According to one aspect of this application, in the direction from the transition zone to the central zone, the wavelength of the second wave trace is gradually decreased, and the amplitude of the second wave trace is gradually increased.

[0009] According to one aspect of this application, the wavelength and amplitude of each ripple in the first wave trace are equal; and / or, the wavelength and amplitude of each ripple in the third wave trace are equal.

[0010] According to one aspect of this application, the bending portion further includes at least one stress-relieving layer disposed on one side of the circuit layer; preferably, the circuit layer further includes a fixing layer, and the signal line is embedded in the fixing layer; preferably, the fixing layer comprises an inorganic material.

[0011] According to one aspect of this application, the at least one stress-relieving layer includes a shear-thickening fluid filling layer; preferably, the material of the shear-thickening fluid filling layer includes polyborosiloxane.

[0012] According to one aspect of this application, the at least one stress relief layer further includes a gel layer disposed on the side of the shear thickening fluid filling layer opposite to the circuit layer and an encapsulation layer disposed on the side of the gel layer opposite to the circuit layer.

[0013] According to one aspect of this application, the gel layer includes a first gel layer and a second gel layer, the second gel layer being disposed close to the encapsulation layer relative to the first gel layer; the porosity of the material of the first gel layer is greater than the porosity of the material of the second gel layer; preferably, the material of the first gel layer includes silica aerogel; preferably, the material of the second gel layer includes graphene gel; preferably, the porosity of the material of the first gel layer is greater than or equal to 98%; preferably, the porosity of the material of the second gel layer is greater than or equal to 90%; preferably, the encapsulation layer includes an organic encapsulation layer.

[0014] According to one aspect of this application, the pore density of the gel layer material gradually increases from the edge region towards the center region; preferably, the pore density of the gel layer material in the corresponding center region is greater than or equal to 8 × 10⁻⁶. ^8 pores / cm 2 The pore density of the gel layer material in the corresponding edge region is greater than or equal to 6 × 10⁻⁶.^8 pores / cm 2 .

[0015] Another aspect of this application provides a display device, including the display module in any of the above embodiments.

[0016] Compared with the prior art, the display module provided in this embodiment of the invention includes a display panel. The first part may include a light-emitting surface for light emission display. The bent part is bent relative to the first part and the second part. The circuit layer of the bent part includes signal lines arranged in a wavy shape along the extension direction of the bent part. The amplitude of the first wavy line is greater than the amplitude of the second wavy line, and the amplitude of the second wavy line is greater than the amplitude of the third wavy line. This increases the stress resistance of the first wavy line, improves the flexibility of the signal lines, avoids the problem of signal lines breaking due to excessive strain during bending, and improves the reliability and performance of the display module. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of a display module before bending, according to an embodiment of the present invention;

[0019] Figure 2 This is provided by one embodiment of the present invention. Figure 1 A schematic diagram of the structure of the membrane layer at the BB section after bending;

[0020] Figure 3 This is a schematic diagram of the circuit layer structure provided in one embodiment of the present invention;

[0021] Figure 4 This is a schematic diagram of the structure of the bent portion provided in one embodiment of the present invention.

[0022] In the attached image:

[0023] 10 - Display panel; 11 - First part; 12 - Bending part; 121 - Circuit layer; 122 - Shear thickening fluid filling layer; 123 - Gel layer; 1231 - First gel layer; 1232 - Second gel layer; 124 - Encapsulation layer; Q - Signal line; Q1 - First wavy trace; Q2 - Second wavy trace; Q3 - Third wavy trace; G - Fixing layer; ZA - Center area; GA - Transition area; BA - Edge area. Detailed Implementation

[0024] The features and exemplary embodiments of various aspects of this application will now be described in detail. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain this application and are not configured to limit this application. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples of this application.

[0025] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.

[0026] It should be understood that when describing the structure of a component, when referring to a layer or region as being "above" or "on top of" another layer or region, it can mean that it is directly above the other layer or region, or that it contains other layers or regions between it and the other layer or region. Furthermore, if the component is flipped over, that layer or region will be located "below" or "under" the other layer or region.

[0027] Various modifications and variations can be made to this application without departing from its spirit or scope, which will be apparent to those skilled in the art. Therefore, this application is intended to cover modifications and variations falling within the scope of the corresponding claims (the claimed technical solutions) and their equivalents. It should be noted that the embodiments provided in this application can be combined with each other without contradiction.

[0028] In existing technologies, flexible display modules require a bending process for components such as flexible circuit boards bonded to the display panel. During this process, the display panel undergoes a folding motion with an extremely small bending radius. This places high demands on the bending resistance of the display panel's circuitry. Because the bending angle of the circuitry in this bending area is very small, circuit breakage is highly likely, leading to abnormal signal on the screen.

[0029] To address the aforementioned issues, this invention provides a solution where the signal lines are arranged in a wavy pattern, with the amplitude of the first wavy line being greater than that of the second wavy line, and the amplitude of the second wavy line being greater than that of the third wavy line. This increases the stress resistance of the first wavy line, improves the flexibility of the signal line, and prevents breakage due to excessive strain during bending. This enhances the reliability and performance of the display module.

[0030] This application provides a display module and a display device, which will be described below in conjunction with the accompanying drawings. Figures 1 to 4 Various embodiments of the display module and display device are described.

[0031] Please see Figures 1 to 3 , Figure 1 This is a schematic diagram of the structure of a display module before bending, according to an embodiment of the present invention; Figure 2 This is provided by one embodiment of the present invention. Figure 1 A schematic diagram of the structure of the membrane layer at the BB section after bending; Figure 3 This is a schematic diagram of the circuit layer structure provided in one embodiment of the present invention.

[0032] This application provides a display module, including: a display panel 10, the display panel 10 including at least partially oppositely disposed first part 11, second part, and bent part 12 connecting the first part 11 and the second part, the second part being located on the side of the first part 11 away from the light-emitting side of the display panel 10; the bent part 12 includes a circuit layer 121, the circuit layer 121 including signal lines Q arranged in a wavy shape along the extension direction of the bent part 12, the signal lines Q including a central region ZA, transition regions GA respectively disposed on both sides of the central region ZA along the extension direction of the bent part 12, and an edge region BA disposed on the side of the transition region GA away from the central region ZA, the signal lines Q including a first wavy trace Q1 located in the central region ZA, a second wavy trace Q2 located in the transition region GA, and a third wavy trace Q3 located in the edge region BA; wherein, the amplitude of the first wavy trace Q1 is greater than the amplitude of the second wavy trace Q2, and the amplitude of the second wavy trace Q2 is greater than the amplitude of the third wavy trace Q3.

[0033] The display module provided in this embodiment of the invention includes a display panel 10. The first part 11 may include a light-emitting surface for light emission display. The bending part 12 bends relative to the first part 11 and the second part. The circuit layer 121 of the bending part 12 includes signal lines Q arranged in a wave shape along the extension direction of the bending part 12. The amplitude of the first wave line Q1 is greater than the amplitude of the second wave line Q2, and the amplitude of the second wave line Q2 is greater than the amplitude of the third wave line Q3. This increases the stress resistance of the first wave line Q1, improves the flexibility of the signal line Q, and avoids the problem of the signal line Q breaking due to excessive strain during bending. This improves the reliability and performance of the display module.

[0034] It should be noted that the bending amplitude of the first wave trace Q1 located in the central area ZA of the bending section 12 is greater than that of the second wave trace Q2 located in the transition area GA, while the bending amplitude of the third wave trace Q3 in the edge area BA is relatively smaller. In this embodiment, by limiting the amplitude of the first wave trace Q1 to be greater than that of the second wave trace Q2, and the amplitude of the second wave trace Q2 to be greater than that of the third wave trace Q3, the stress absorption capacity of the first wave trace Q1 is increased, thus avoiding the problem of the first wave trace Q1 breaking. The signal line Q in the above form can achieve a bending effect similar to a spring. By the different amplitudes of the signal lines Q in each area, i.e., the height difference, a certain degree of expansion and contraction is formed to achieve the release of bending stress and disperse the force direction. Here, the amplitude refers to half of the maximum difference between the peak and trough values ​​of each wave trace, i.e., the distance between the peak or trough and the equilibrium position (middle position).

[0035] In this embodiment, the first part 11 includes a light-emitting surface, and therefore, the first part 11 may include a light-emitting element. The second part is located on the backlight surface of the display module and may include components such as a circuit board and a chip. The bending part 12 connects the first part 11 and the second part, and therefore, the bending part 12 may include film components such as signal lines Q that connect the first part 11 and the second part.

[0036] Specifically, the circuit board can be an FPC (Flexible Printed Circuit) board. An FPC board is a printed circuit board with polyimide or polyester film as its substrate; it can also be called a flexible circuit board, flexographic circuit board, or soft board. It features high reliability and excellent flexibility. FPC boards are characterized by their light weight, thinness, high wiring density, and good bending ability, capable of withstanding millions of dynamic bends without damaging the conductors.

[0037] In this embodiment, along the extension direction of the bending portion 12, the edge region BA, the transition region GA, the center region ZA, the transition region GA, and the edge region BA are arranged in sequence, and correspondingly, the third wave trace Q3, the second wave trace Q2, the first wave trace Q1, the second wave trace Q2, and the third wave trace Q3 are arranged in sequence.

[0038] Optionally, the signal line Q can be made of metallic materials, such as molybdenum, titanium, aluminum, silver, etc. Alternatively, the signal line Q can also be made of ITO (Indium Tin Oxide). ITO material has high light transmittance, which can effectively improve the light transmittance of the display module and ensure display effect.

[0039] In some alternative embodiments, the wavelength of the second wave trace Q2 is greater than the wavelength of the third wave trace Q3, and the wavelength of the second wave trace Q2 is greater than the wavelength of the first wave trace Q1.

[0040] It is understood that wavelength represents the distance between two adjacent crests or troughs in a continuous wave. The shorter the wavelength, the smaller the distance between the crests and the greater the wave density. In this embodiment, the wavelength of the second wave trace Q2 is greater than the wavelength of the first wave trace Q1, that is, the wave density of the first wave trace Q1 is greater, so as to improve the stress relief effect of the first wave trace Q1.

[0041] Optionally, the wavelength of the third wave trace Q3 is greater than the wavelength of the first wave trace Q1 and less than the wavelength of the second wave trace Q2. That is, the wave density of the third wave trace Q3 is lower, which makes it easier to prepare.

[0042] It should be noted that the wavelength of the second wave trace Q2 can be set in a gradually changing ripple pattern to achieve a gradual buffering effect.

[0043] Please see Figures 3 to 4 In some optional embodiments, the wavelength of the second wave trace Q2 is gradually reduced and the amplitude of the second wave trace Q2 is gradually increased in the direction from the transition region GA to the center region ZA. This achieves a gradual change from the ripple form of the third wave trace Q3 to the ripple form of the first wave trace Q1, avoiding abrupt changes in the ripple shape that could lead to stress concentration in some locations and improving the reliability of the signal line Q.

[0044] In this embodiment, the second wave trace Q2 has multiple ripples of different wavelengths, and the direction from the transition region GA to the center region ZA is required to be along the bending direction of the bending part 12. The wavelength of each ripple of the second wave trace Q2 is gradually reduced.

[0045] In some optional embodiments, the wavelength and amplitude of each ripple of the first wave trace Q1 are equal to ensure the uniformity of the force at each position of the first wave trace Q1 and the consistency of the stress relief effect on bending, so as to avoid problems such as the first wave trace Q1 breaking due to excessive bending stress in some areas, and improve the reliability of the first wave trace Q1.

[0046] And / or, the wavelength and amplitude are equal at all points of the third wavy trace Q3. Since the third wavy trace Q3 is located in the edge region BA, it experiences less bending stress. Therefore, compared to the first bending trace, the amplitude of the third wavy trace Q3 is smaller, reducing space requirements and manufacturing costs. Simultaneously, the equal wavelength and amplitude at all points of the third wavy trace Q3 also reduces the manufacturing difficulty of Q3, improves the uniformity of stress distribution at all locations, and enhances the consistency of its bending stress mitigation effect.

[0047] In some optional embodiments, the bending portion 12 may further include at least one stress relief layer disposed on one side of the circuit layer 121 to support the circuit layer 121 and to provide a certain function of relieving bending stress.

[0048] Please see Figure 3 Optionally, the line layer 121 also includes a fixing layer G, in which the signal line Q is embedded to fix the signal line Q and ensure the wavy shape of the signal line Q.

[0049] Optionally, the fixing layer G may comprise an inorganic material to provide insulation and prevent short circuits or mutual interference between the signal line Q and other components. For example, the material of the fixing layer G may include any one of silicon nitride, silicon oxide, and silicon oxynitride.

[0050] Please see Figure 4 In some alternative embodiments, at least one stress relief layer includes a shear thickening fluid filling layer 122.

[0051] It should be noted that shear thickening, also known as dilatation, refers to the non-Newtonian fluid behavior in which the viscosity of a system increases by an order of magnitude with increasing shear rate or shear stress. Shear thickening is defined as viscosity increasing with increasing shear rate. This type of non-Newtonian fluid generates weak resistance under slow stress, but generates very large resistance under severe stress, and may even exhibit a solid state. Therefore, the shear thickening fluid filling layer 122 can reduce the impact of sudden changes in dynamic shear force when bent, avoiding the problem of film breakage.

[0052] In this embodiment, the shear-thickening fluid (STF) is a mixed fluid formed by dispersing nanoparticles in a polymer or polymerizing long-chain polymers. Because the nanoparticles can move freely, the STF is in a liquid state. When subjected to rapid external shear stress, the system viscosity increases sharply, and the stressed region becomes almost solid, greatly dissipating the energy of the external stress. When the external force is removed, the system gradually recovers its state, exhibiting reversible properties.

[0053] Optionally, the material of the shear-thickening fluid filling layer 122 includes polyborosiloxane. Polyborosiloxane (PBDMS) is an intrinsically self-healing polymer synthesized by substituting Si atoms on polydimethylsiloxane with B atoms. Its unique molecular structure allows the outermost empty orbitals of the B atoms to combine with oxygen atoms on other molecular chains, thereby forming dynamic electron pairs. This unique property of the bonding endows PBDMS with solid-liquid transformation properties.

[0054] Polyborosiloxanes (PBDMS) possess a unique property of being "soft in soft environments and hard in hard environments." Under normal conditions, they are soft and elastic, but upon impact, they harden instantly to absorb energy and rapidly recover after the external force disappears. This is due to their reversible physical cross-linking mechanism and self-healing ability. Specifically, when PBDMS is subjected to impact, the interaction between boron and oxygen within it changes. This change causes the temporary Si-OB weak bonds to break and recombine, thus forming a reversible physical cross-linking.

[0055] The shear-thickening fluid filling layer 122, which includes polyborosiloxane, can effectively absorb the bending stress generated when the bending portion 12 is bent, thus preventing the film layer from breaking due to excessive bending stress.

[0056] Of course, depending on actual needs, the shear thickening fluid filling layer 122 can also be prepared using other materials, and is not limited to the above embodiments.

[0057] Please see Figure 4 In some optional embodiments, at least one stress-relieving layer further includes a gel layer 123 disposed on the side of the shear-thickening fluid filling layer 122 opposite to the circuit layer 121, and an encapsulation layer 124 disposed on the side of the gel layer 123 opposite to the circuit layer 121. The gel layer 123 is a film layer comprising gel material. A gel is a special semi-solid substance formed by a polymer solution or sol under specific conditions, possessing elastic and highly dispersed properties. In this embodiment, the elasticity of the gel layer 123 can be utilized to achieve stress relief during the bending process of the bending portion 12.

[0058] The encapsulation layer 124 can be used to support and protect the gel layer 123, shear-thickening fluid filling layer 122, circuit layer 121 and other film layers located thereon.

[0059] Please see Figure 4 In some optional embodiments, the gel layer 123 includes a first gel layer 1231 and a second gel layer 1232, the second gel layer 1232 being disposed close to the encapsulation layer 124 relative to the first gel layer 1231; the porosity of the material of the first gel layer 1231 is greater than the porosity of the material of the second gel layer 1232.

[0060] As is understood, porosity refers to the percentage of the volume of pores inside a material to the total volume of the material in its natural state. It reflects the amount of pores inside the material; the higher the porosity, the greater the proportion of pores. In this embodiment, when the bending portion 12 bends, by limiting the porosity of the material of the first gel layer 1231 to be greater than that of the material of the second gel layer 1232, the deformable space of the first gel layer 1231 during bending can be increased. This allows the first gel layer 1231 to absorb and alleviate bending stress through its own deformation, thus avoiding the problem of film breakage.

[0061] Optionally, the material of the first gel layer 1231 includes silica aerogel;

[0062] Silica aerogel is a novel lightweight material with a nanoporous structure, composed of a three-dimensional silica network framework with a porosity of 80% to 99.8% and filled with gas. Its unique structure gives it extremely low density, ultra-high specific surface area, and excellent thermal insulation properties. The apparent density of silica aerogel ranges from 0.003 to 0.35 g / cm³. 3 Between 800-1000 m² 2 Between / g. Most silica aerogels can be made into fully transparent or translucent materials, with a refractive index similar to that of air, exhibiting good transparency.

[0063] The preparation process of silica aerogel consists of three key stages: precursor hydrolysis and condensation, gel aging, and supercritical drying. The precursor is typically tetraethyl orthosilicate or sodium silicate, which hydrolyzes under acidic or alkaline catalysts to generate triterpenoid groups, which then condense to form a three-dimensional network structure. The gel aging process involves soaking the aerogel in an ethanol solution for at least 7 hours, using Ostwald curing to strengthen the framework. In the supercritical drying stage, carbon dioxide is used as the medium, and solvent displacement is achieved at 31.1℃ and 7.38 MPa, preventing structural collapse caused by fine tube forces.

[0064] In this embodiment, the pores of the silica aerogel itself can be used as deformation space during bending deformation, which can absorb and relieve bending stress and prevent breakage due to bending.

[0065] Optionally, the material of the second gel layer 1232 includes graphene gel;

[0066] Graphene gel is a three-dimensional structural material assembled from graphene sheets, commonly referred to as "graphene aerogel" or "graphene hydrogel". It has numerous pores filled with air, giving it high elasticity, strong adsorption, excellent conductivity, and water retention. Graphene gel exhibits excellent elasticity, capable of withstanding significant deformation without breaking; therefore, it can be applied to the bending portion 12 required in this embodiment.

[0067] The preparation of graphene gels typically involves assembling graphene sheets into a three-dimensional structure under specific conditions. Specific methods include treatment at temperatures of 90-200°C for 1-24 hours. For example, polydopamine / reduced graphene oxide (PDA / rGO) composite hydrogels can be prepared under mild conditions and exhibit high swelling ratios, good adhesion, and self-healing capabilities.

[0068] Optionally, the porosity of the material of the first gel layer 1231 is greater than or equal to 98%. For example, the porosity of the material of the first gel layer 1231 can be any one of 98%, 98.5%, or 99%.

[0069] Optionally, the porosity of the material of the second gel layer 1232 is greater than or equal to 90%. For example, the porosity of the material of the second gel layer 1232 can be any one of 90%, 92%, 94%, or 96%.

[0070] Optionally, the encapsulation layer 124 includes an organic encapsulation layer 124 to ensure the flatness of the film layer.

[0071] In some optional embodiments, the pore density of the material of the gel layer 123 gradually increases from the edge region BA to the center region ZA.

[0072] Understandably, during the bending process of the bending section 12, the degree of film deformation is greater closer to the central region ZA. Therefore, by restricting the direction from the edge region BA to the central region ZA, the pore density of the gel layer 123 gradually increases. This ensures that the pore density of the gel layer 123 is greater closer to the central region ZA, resulting in a larger deformable space and a greater degree of deformation that can be withstood. This improves the bending resistance of the gel layer 123 and avoids the problem of film breakage.

[0073] Optionally, the pore density of the gel layer 123 in the corresponding central region ZA is greater than or equal to 8 × 10⁻⁶. ^ 8 pores / cm 2 The pore density of the gel layer 123 in the corresponding edge region BA is greater than or equal to 6 × 10⁻⁶. ^8 pores / cm 2 Correspondingly, the pore density of the gel layer 123 in the transition region GA needs to be less than that in the central region ZA, but greater than that in the edge region BA. For example, the pore density of the gel layer 123 in the transition region GA can be equal to 7 × 10⁻⁶. ^8 pores / cm 2 Among them, pores / cm 2 (Number of holes per square centimeter) refers to the number of holes per unit area.

[0074] Optionally, the pore density of the gel layer 123 in the corresponding central region ZA can be equal to 8 × 10⁻⁶. ^8 pores / cm 2 9×10 ^8 pores / cm 2 10×10 ^8 pores / cm 2 Any one of them.

[0075] Optionally, the pore density of the material of the gel layer 123 in the corresponding edge region BA can be equal to 6 × 10⁻⁶. ^8 pores / cm 2 6.5×10 ^8 pores / cm 2 7×10 ^8 pores / cm 2 Any one of them.

[0076] Optionally, the first part 11 provided in the embodiments of the present invention may include a substrate, a light-emitting functional layer, an encapsulation layer 124, and other film layers.

[0077] Optionally, the substrate may include a substrate and an array layer, the array layer including a driving circuit. For example, the array layer may include a first conductive layer, a second conductive layer, and a third conductive layer disposed on one side of the substrate and stacked thereon. An insulating layer is disposed between adjacent conductive film layers. Exemplarily, the pixel driving circuit disposed on the array layer includes a transistor and a storage capacitor. The transistor includes an active layer, a gate, a source, and a drain. The materials of the source and gate may include one or more combinations of molybdenum, titanium, aluminum, copper, etc. The gate of the transistor is typically used to receive a control signal, causing the transistor to turn on or off under the control of the control signal. One of the source and drain of the thin-film transistor is connected to the light-emitting unit to control the normal light emission of the light-emitting unit.

[0078] The storage capacitor includes a first plate and a second plate. As an example, the gate and the first plate can be located in a first conductive layer, the second plate can be located in a second conductive layer, and the source and drain can be located in a third conductive layer.

[0079] The substrate can be a rigid substrate, such as a glass substrate, or a flexible substrate, made of materials such as polyimide, polystyrene, polyethylene terephthalate, poly(p-xylene), polyethersulfone, or polyethylene naphthalate. The substrate is mainly used to support the devices mounted on it.

[0080] Optionally, the display panel 10 may also include a light-emitting functional layer and a thin-film encapsulation layer disposed on the side of the array layer away from the substrate, wherein at least one of the light-emitting functional layer and the thin-film encapsulation layer may be formed using IJP (Inkjet printing) technology.

[0081] Optionally, the light-emitting functional layer includes a first electrode layer, a light-emitting layer, and a second electrode layer stacked along the direction away from the substrate.

[0082] Optionally, the light-emitting layer includes one or more of the following: an electron injection layer, an electron transport layer, a light-emitting material layer, a hole blocking layer, an electron blocking layer, a hole transport layer, and a hole injection layer. The specific selection depends on the type of light-emitting layer and is not particularly limited. The electron injection layer, electron transport layer, and hole blocking layer can be disposed between the second electrode layer and the light-emitting material layer. The electron blocking layer, hole transport layer, and hole injection layer can be disposed between the first electrode layer and the light-emitting material layer.

[0083] The material of the first electrode layer is generally a material with a high work function to improve hole injection efficiency. It can be gold (Au), platinum (Pt), titanium (Ti), silver (Ag), indium tin oxide (ITO), zinc tin oxide (IZO), or a transparent conductive polymer (such as polyaniline). For example, the first electrode layer can be made of an ITO-Ag-ITO composite material, without any particular limitation.

[0084] The material of the second electrode layer can be one of the following metals: silver (Ag), aluminum (Al), lithium (Li), magnesium (Mg), ytterbium (Yb), calcium (Ca), or indium (In). It can also be an alloy of the aforementioned metals, such as magnesium-silver alloy (Mg / Ag) or lithium-aluminum alloy (Li / Al). This embodiment does not limit the material in this regard.

[0085] Optionally, the display panel 10 further includes a pixel definition layer disposed on one side of the substrate, the pixel definition layer having pixel openings; the first electrode layer is at least partially disposed within the pixel openings.

[0086] In this embodiment, a pixel definition layer is disposed on the substrate including a pixel opening, and a light-emitting functional layer can be disposed within the pixel opening to realize the light-emitting display of the display panel 10.

[0087] Optionally, multiple pixel openings are spaced apart, and each pixel opening contains a light-emitting functional layer.

[0088] Optionally, a planarization layer may be included between the substrate and the pixel definition layer. The planarization layer may be made of hexamethyl dimethyl ether, epoxy resin, or polyimide, or other materials. This embodiment does not limit the application of this material.

[0089] Optionally, the thin-film encapsulation layer includes a first encapsulation layer, the material of which includes an inorganic material.

[0090] Optionally, the thin-film encapsulation layer further includes a second encapsulation layer located on the side of the first encapsulation layer opposite to the substrate. The material of the second encapsulation layer includes an organic material. The organic material can be made of resin or polymeric organic material, and can be formed using IJP (Inkjet printing) technology.

[0091] Optionally, the encapsulation layer may also include a third encapsulation layer located on the side of the second encapsulation layer away from the substrate. The material of the third encapsulation layer includes inorganic materials. Adding an inorganic encapsulation layer outside the organic encapsulation layer can further improve the encapsulation effect of the encapsulation layer. In this embodiment, the material of the third encapsulation layer may be the same as or different from the material of the first encapsulation layer, and there is no special limitation.

[0092] Optionally, the materials of the first encapsulation layer and the third encapsulation layer are the same, so that the first encapsulation layer and the third encapsulation layer can be prepared using the same equipment, which can simplify the manufacturing process of the display panel 10.

[0093] Optionally, the display module may also include a polarizer, a cover plate, and other film layers disposed on the side of the first part 11 opposite to the second part, as well as a support layer disposed between the first part 11 and the second part.

[0094] Understandably, the cover plate is a film layer made of materials such as glass with high light transmittance, which serves to protect the display panel 10. Specifically, the cover plate can be made of rigid materials, which has a relatively low cost; or it can be made of flexible materials, so that the cover plate can be folded and thus can be applied to flexible and foldable display modules. Specifically, the cover plate can be made of transparent, soft and foldable materials such as UTG (Ultra Thin Glass), CPI (Colorless Polyimide), and PET (Polyethylene Terephthalate) to achieve the bendability and foldability of the cover plate, making it easy to apply to foldable display panels 10.

[0095] This invention also provides a display device, including the display module in any of the above embodiments.

[0096] The display module in the display device provided in this embodiment of the invention includes a display panel 10. The first part 11 may include a light-emitting surface for light emission display. The bending part 12 bends relative to the first part 11 and the second part. The circuit layer 121 of the bending part 12 includes signal lines Q arranged in a wave shape along the extension direction of the bending part 12. The amplitude of the first wave line Q1 is greater than the amplitude of the second wave line Q2, and the amplitude of the second wave line Q2 is greater than the amplitude of the third wave line Q3. This increases the stress resistance of the first wave line Q1, improves the flexibility of the signal line Q, and avoids the problem of the signal line Q breaking due to excessive strain during bending. This improves the reliability and performance of the display device.

[0097] The display device provided in this embodiment of the invention has the technical effects of the display module in any of the above embodiments. The explanations of the same or corresponding structures and terms in the above embodiments will not be repeated here.

[0098] The display module provided in this embodiment of the invention can be an organic light-emitting diode (OLED) display module, a quantum dot light-emitting diode (QLED) module, or a micro-flat panel display module (Micro-OLED or Micro-LED), etc.

[0099] The display devices in this application include, but are not limited to, mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, control consoles, and other devices with display functions.

[0100] The above are merely specific embodiments of this application. Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, modules, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here. It should be understood that the protection scope of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the protection scope of this application.

[0101] It should also be noted that the exemplary embodiments mentioned in this application describe methods or systems based on a series of steps or apparatus. However, this application is not limited to the order of the above steps; that is, the steps can be performed in the order mentioned in the embodiments, or in a different order, or several steps can be performed simultaneously.

Claims

1. A display module, characterized in that, include: The display panel includes at least a first part, a second part, and a bent portion connecting the first part and the second part, wherein the second part is located on the side of the first part away from the light-emitting side of the display panel. The bending portion includes a circuit layer, the circuit layer includes signal lines arranged in a wavy shape along the extension direction of the bending portion, the signal lines include a central area, transition areas respectively disposed on both sides of the central area along the extension direction of the bending portion, and an edge area disposed on the side of the transition area away from the central area, the signal lines include a first wavy trace located in the central area, a second wavy trace located in the transition area, and a third wavy trace located in the edge area; The amplitude of the first wave line is greater than that of the second wave line, and the amplitude of the second wave line is greater than that of the third wave line.

2. The display module according to claim 1, characterized in that, The wavelength of the second wave trace is greater than the wavelength of the third wave trace, and the wavelength of the second wave trace is greater than the wavelength of the first wave trace. Preferably, the wavelength of the third wave trace is greater than the wavelength of the first wave trace and less than the wavelength of the second wave trace.

3. The display module according to claim 1, characterized in that, From the transition zone toward the center zone, the wavelength of the second wave trace is gradually reduced, and the amplitude of the second wave trace is gradually increased.

4. The display module according to claim 1, characterized in that, The wavelengths and amplitudes of each ripple in the first wave pattern are all equal; and / or, The wavelength and amplitude of each wave in the third wave pattern are equal.

5. The display module according to claim 1, characterized in that, The bending portion further includes at least one stress-relieving layer disposed on one side of the circuit layer; Preferably, the line layer further includes a fixing layer, and the signal line is embedded in the fixing layer; Preferably, the fixing layer comprises an inorganic material.

6. The display module according to claim 5, characterized in that, The at least one stress relief layer includes a shear thickening fluid filling layer; Preferably, the material of the shear-thickening fluid filling layer includes polyborosiloxane.

7. The display module according to claim 6, characterized in that, The at least one stress relief layer further includes a gel layer disposed on the side of the shear thickening fluid filling layer opposite to the circuit layer and an encapsulation layer disposed on the side of the gel layer opposite to the circuit layer.

8. The display module according to claim 7, characterized in that, The gel layer includes a first gel layer and a second gel layer, wherein the second gel layer is disposed close to the encapsulation layer relative to the first gel layer. The porosity of the material in the first gel layer is greater than that of the material in the second gel layer; Preferably, the material of the first gel layer includes silica aerogel; Preferably, the material of the second gel layer includes graphene gel; Preferably, the porosity of the material of the first gel layer is greater than or equal to 98%; Preferably, the porosity of the material of the second gel layer is greater than or equal to 90%; Preferably, the encapsulation layer includes an organic encapsulation layer.

9. The display module according to claim 8, characterized in that, From the edge region to the center region, the pore density of the corresponding gel layer material gradually increases; Preferably, the pore density of the gel layer material in the corresponding central region is greater than or equal to 8 × 10⁻⁶. ^8 pores / cm 2 The pore density of the gel layer material in the corresponding edge region is greater than or equal to 6 × 10⁻⁶. ^8 pores / cm 2 .

10. A display device, characterized in that, Includes the display module as described in any one of claims 1 to 9.

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