Display panel, manufacturing method thereof and display device

Abstract

The application relates to a display panel, a manufacturing method thereof and a display device. A support layer is an integral layer structure arranged on the back of a substrate. A net-shaped groove is arranged in a bending area, the net-shaped groove provides a stress release channel for the support layer in the bending area, can reduce the stress peak of the vertical surface in the bending area, and can reduce the fracture risk of the support layer in the bending area. A net-shaped elastic glue layer is filled in the net-shaped groove, the net-shaped elastic glue layer and the support layer jointly bear the bending stress, the net-shaped elastic glue layer has good deformation elasticity, the net-shaped elastic glue layer absorbs the stress released by the support layer, and the stress dispersion capacity of the bending area is optimized. The Young's modulus of the central area of the bending area is lower than the Young's modulus of the edge side area of the bending area close to the display area and the binding area, the low modulus of the central area disperses the stress peak of the vertical surface in the bending area, the high modulus of the edge side area limits the deformation of the support layer at the connection between the bending area and the display area or the binding area, and the risk of layer separation and falling of the support layer is reduced.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display panel, a method for manufacturing the same, and a display device. Background Technology

[0002] Flexible display panels, as a new display technology, feature wide color gamut, fast response, high contrast, and no need for backlighting. They can be applied to wearable products and other applications. However, when a flexible display panel is bonded to external circuitry, bending in the bending area generates vertical stress. Under this stress, the circuitry in the bending area is prone to breakage and damage, affecting the display panel's performance. Summary of the Invention

[0003] Therefore, it is necessary to provide a display panel, its manufacturing method, and a display device to address the aforementioned technical problems.

[0004] In a first aspect, this application provides a display panel, comprising:

[0005] A substrate, the substrate including a display area, a bonding area and a bending area, the display area and the bonding area being connected through the bending area, the substrate including a first surface and a second surface disposed opposite to each other, the second surface being bent toward the first surface, the bonding area being bent to the opposite side of the display area and disposed parallel to the display area;

[0006] A support layer is disposed on the first surface of the substrate, the support layer continuously covers the display area, the bending area and the bonding area, and the support layer is provided with a mesh groove in the bending area;

[0007] A mesh elastic adhesive layer is disposed within the mesh groove. The mesh elastic adhesive layer fills the mesh groove and is bonded to the support layer. The mesh elastic adhesive layer and the support layer in the bending area work together to buffer bending stress.

[0008] The Young's modulus of the central region of the bending area is lower than that of the side regions of the bending area near the display area and the binding area.

[0009] The aforementioned display panel features a support layer that is a single-layer structure disposed on the back of the substrate. By incorporating mesh grooves in the bending area, these grooves provide stress relief channels for the support layer in the bending region, reducing the stress peak at the mid-face of the bending area (i.e., the region of maximum bending stress) and lowering the risk of breakage. A mesh elastic adhesive layer fills the mesh grooves, sharing the bending stress with the support layer. This layer exhibits excellent deformation elasticity and absorbs the stress released by the support layer, thereby optimizing the stress dispersion capability in the bending region. The Young's modulus of the central region of the bending region is lower than that of the side regions near the display and bonding areas. The lower modulus in the central region helps disperse the stress peak at the mid-face of the bending region, while the higher modulus in the side regions helps limit the deformation of the support layer at the connection between the bending region and the display or bonding areas, reducing the risk of delamination and detachment of the support layer.

[0010] In one embodiment, the Young's modulus of the mesh elastic adhesive layer ranges from 10 MPa to 80 MPa;

[0011] Preferably, in the bending area, the area ratio of the mesh elastic adhesive layer to the support layer is 1:2 to 1:5.

[0012] In this way, by rationally designing the Young's modulus range of the mesh elastic adhesive layer, the mesh elastic adhesive layer has sufficient deformation capacity to absorb stress when bent; the area ratio of the mesh elastic adhesive layer to the support layer is 1:2-1:5, and the mesh elastic adhesive layer and the support layer have a better effect of synergistically dispersing stress in the bending area, which can not only improve the stress buffering capacity in the bending area, but also have good support effect and structural stability.

[0013] In one embodiment, the mesh groove includes a plurality of cutting grooves, and the density of the cutting grooves in the central region of the bending area is greater than the density of the cutting grooves in the side regions of the bending area.

[0014] Preferably, the density of the cutting grooves gradually decreases from the center region of the bending area to the side region of the bending area;

[0015] Preferably, the depth of the cutting groove is less than the thickness of the support layer;

[0016] Preferably, the ratio of the depth of the cutting groove to the thickness of the support layer is 0.5:1 to 0.9:1;

[0017] Preferably, the depth of the cutting groove in the central region is greater than the depth of the cutting groove in the side region of the bending area;

[0018] Preferably, the depth of the cutting groove gradually decreases from the center region of the bending area to the side region of the bending area;

[0019] Preferably, the bottom surface of the cutting groove is an arc surface that is concave from the edge to the center;

[0020] Preferably, along the extending direction of the cutting groove, the depth of the center of the cutting groove is greater than the depth of the end of the cutting groove.

[0021] In this way, the density of cutting grooves in the central region of the bending zone is greater. By increasing the number of cutting grooves, the stress on the central facade is dispersed. The density of cutting grooves in the side regions of the bending zone is reduced, which is conducive to maintaining the structural stability of the support layer in the bending zone. The depth of the cutting grooves in the central region is greater than that in the side regions, which further enhances the deformation capacity of the central region. The bottom surface of the cutting grooves is an arc surface that is concave from the edge to the center, which helps to reduce stress concentration points, improve fatigue resistance, and optimize stress transmission path.

[0022] In one embodiment, multiple cutting grooves are arranged intersectingly to divide the support layer of the bending area into multiple support patterns;

[0023] Preferably, the supporting pattern is rhomboid, rectangular, honeycomb, or hexagonal;

[0024] Preferably, the depth at the intersection of the cutting grooves is greater than the depth at the non-intersection of the cutting grooves.

[0025] In this way, the cutting groove guides the stress to diffuse along the grid path, which helps to avoid local stress accumulation. The depth at the intersection of the cutting groove is greater, forming a stress-relieving channel, which helps to block the transmission of bending stress to the bonding area.

[0026] In one embodiment, the mesh trench includes:

[0027] Multiple first cutting grooves, which extend along a first direction and are spaced apart along a second direction;

[0028] Multiple second cutting grooves, which extend along the second direction and are spaced apart along the first direction;

[0029] Multiple first cutting grooves and multiple second cutting grooves are intersected to divide the support layer of the bending area into multiple support patterns.

[0030] In this way, the mesh groove is simple to manufacture and has a low manufacturing cost.

[0031] In one embodiment, the thickness of the support layer in the central region of the bending area is less than the thickness of the support layer in the side regions of the bending area;

[0032] Preferably, the thickness of the support layer gradually decreases from the side region of the bending area to the center region of the bending area;

[0033] Preferably, the thickness of the support layer in the bending region is 15μm-80μm, and the ratio of the thickness of the support layer in the central region of the bending region to the thickness of the support layer in the side region of the bending region is 0.6:1-0.9:1;

[0034] Preferably, the material of the mesh elastic adhesive layer includes at least one of silicone rubber, polyurethane elastomer, acrylic rubber, fluororubber, or thermoplastic elastomer;

[0035] Preferably, the display panel further includes:

[0036] A first adhesive layer is disposed on the second surface of the substrate, and the first adhesive layer is located at least in the bending region.

[0037] In this way, from the display area to the binding area, the thickness of the support layer in the central area of ​​the bending area is less than that in the side area, which helps to balance the bending performance of the central area of ​​the bending area with the support stiffness of the side area and reduce the unevenness of deformation in the bending area.

[0038] Secondly, this application provides a method for manufacturing a display panel, comprising:

[0039] A substrate is provided, the substrate including a display area, a bonding area and a bending area, the display area and the bonding area being connected through the bending area, and the substrate including a first surface and a second surface disposed opposite to each other;

[0040] A support layer is formed on the first surface of the substrate;

[0041] The support layer in the bending region is etched using a laser to form a mesh-like trench in the bending region;

[0042] Liquid adhesive is filled into the mesh grooves. After the liquid adhesive cures, it forms a mesh elastic adhesive layer. The mesh elastic adhesive layer fills the mesh grooves and is bonded to the support layer. The mesh elastic adhesive layer and the support layer of the bending area work together to buffer the bending stress, so that the Young's modulus of the central region of the bending area is lower than that of the side regions of the bending area near the display area and the bonding area.

[0043] The aforementioned method for manufacturing the display panel exhibits good process compatibility with the steps of forming mesh grooves and a mesh elastic adhesive layer in the bending area, resulting in a simple manufacturing process. The integrally set support layer reduces the risk of support layer detachment, and the mesh grooves provide stress release channels for the support layer in the bending area, reducing the stress peak value on the central surface of the bending area (i.e., the area with the greatest bending stress) and lowering the risk of support layer breakage in the bending area. The mesh elastic adhesive layer absorbs stress, optimizing the stress dispersion capability of the bending area. The low modulus in the central region of the bending area helps disperse the stress peak value on the central surface of the bending area, while the high modulus in the side regions of the bending area helps limit the deformation of the support layer at the connection between the bending area and the display area or bonding area, reducing the risk of support layer delamination and detachment.

[0044] In one embodiment, before the mesh grooves are formed in the bending area, the method further includes:

[0045] The support layer in the bending region is etched so that the thickness of the support layer in the bending region is thinner than the thickness of the support layer in other regions.

[0046] In this way, the support layer located in the bending zone is thinner, which can improve the bending performance of the support layer in the bending zone and reduce the risk of the support layer breaking in the bending zone.

[0047] In one embodiment, it further includes:

[0048] A first adhesive layer is formed on the second surface of the substrate, and the first adhesive layer is located at least in the bending region;

[0049] The second surface of the substrate is bent toward the first surface, and the bonding area is bent to the opposite side of the display area and is arranged parallel to the display area.

[0050] In this way, the driving circuit can be set in the bonding area, and the bonding area can be bent to the opposite side of the display area, thereby increasing the screen ratio of the display panel; the first adhesive layer is set on the outer surface of the substrate to block water and oxygen, and delay the adverse effects of water and oxygen attacking the substrate; the first adhesive layer, together with the support layer and the mesh elastic adhesive layer in the bending area, disperses the bending stress, which can further improve the bending effect and make the bending curve of the bending area have higher tensile density.

[0051] Thirdly, this application provides a display device, including a display panel as described in the first aspect.

[0052] In the aforementioned display device, the support layer is a single-layer structure disposed on the back of the substrate. A mesh groove is formed in the bending area, providing a stress release channel for the support layer in the bending area. This reduces the stress peak at the mid-face of the bending area (i.e., the region of maximum bending stress), thus lowering the risk of breakage of the support layer in the bending area. A mesh elastic adhesive layer fills the mesh groove, sharing the bending stress with the support layer. The mesh elastic adhesive layer exhibits good deformation elasticity, absorbing the stress released by the support layer, thereby optimizing the stress dispersion capability of the bending area. The Young's modulus of the central region of the bending area is lower than that of the side regions of the bending area near the display area and bonding area. The lower modulus in the central region helps disperse the stress peak at the mid-face of the bending area, while the higher modulus in the side regions helps limit the deformation of the support layer at the connection between the bending area and the display area or bonding area, reducing the risk of delamination and detachment of the support layer. Attached Figure Description

[0053] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0054] Figure 1 This is a schematic diagram of the structure of a display panel provided in one embodiment of this application;

[0055] Figure 2 A schematic diagram of the bending area provided in an embodiment of this application;

[0056] Figure 3 A schematic diagram of a substrate for a display panel provided in one embodiment of this application;

[0057] Figure 4 Schematic diagrams of various shapes of mesh trenches provided in one embodiment of this application;

[0058] Figure 5 A flowchart illustrating a method for manufacturing a display panel according to an embodiment of this application.

[0059] Explanation of reference numerals in the attached figures:

[0060] 20. Substrate; 20a. First surface; 20b. Second surface; 30. Support layer; 40. Mesh elastic adhesive layer; 50. Mesh groove; 51. First cutting groove; 52. Second cutting groove; 60. Adhesive layer; 70. First adhesive layer; A1. Display area; A2. Bonding area; A3. Bending area. Detailed Implementation

[0061] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of this application.

[0062] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0063] When describing positional relationships, unless otherwise specified, when an element such as a layer, film, or substrate is referred to as being "on" another element, it may be directly on the other element or there may be intermediate elements present. Furthermore, when a layer is referred to as being "below" another layer, it may be directly below it or there may be one or more light-emitting units present. It is also understood that when a layer is referred to as being "between" two layers, it may be the only layer between the two layers, or there may be one or more light-emitting units present.

[0064] When using the terms “including,” “having,” and “comprising” as described herein, another component may be added unless explicitly qualifying terms such as “only,” “consisting of,” etc. are used. Unless otherwise stated, singular terms may include plural forms and should not be construed as having a quantity of one.

[0065] It should be understood that although the terms “first,” “second,” etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, without departing from the scope of this application, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element.

[0066] It should also be understood that, in interpreting an element, although not explicitly described, the element is interpreted as including a range of error, which should be within the acceptable deviation range of a particular value as determined by a person skilled in the art. For example, "approximately," "about," or "substantially" can mean within one or more standard deviations, without limitation herein.

[0067] Furthermore, in the instruction manual, the phrase "planar distribution diagram" refers to the diagram when the target part is viewed from above, and the phrase "cross-sectional diagram" refers to the diagram when the target part is viewed from the side as a cross-section taken by vertically cutting the target part.

[0068] Furthermore, the accompanying drawings are not drawn to a 1:1 scale, and the relative dimensions of the components are shown in the drawings only as examples and not necessarily to actual scale.

[0069] Traditional liquid crystal display (LCD) and early flexible organic light-emitting diode (OLED) technologies are limited by rigid glass substrates, making it difficult to achieve curved or foldable shapes. This results in low screen-to-body ratios and wide chins in the non-display areas of the display panel. OLED technology based on flexible substrates such as polyimide (PI) uses chip-on-film (COF) or driver chips bonded to a back film on the glass substrate (COP), which can improve the screen-to-body ratio and reduce the chin width to 4mm-5mm. However, this still cannot meet the demands of high-end devices for an ultra-high screen-to-body ratio. PAD bending technology bends the terminal area circuitry at the bottom of the screen to the back of the screen, achieving a "chinless" design. This can increase the screen-to-body ratio to over 90% and support curved screens, foldable screens, and other irregular designs.

[0070] However, the bending stress in the bending area may cause problems such as metal circuit breakage and film delamination, affecting its reliability. Related technologies use encapsulating adhesives to alleviate problems arising during terminal area bending, but the effect is limited. Furthermore, frequent bending of the device can easily cause permanent deformation of the terminal area circuitry, affecting display stability.

[0071] Firstly, referring to Figures 1-4 As shown, this application embodiment provides a display panel, which includes a substrate 20, a support layer 30, and a mesh elastic adhesive layer 40. The substrate 20 includes a display area A1, a bonding area A2, and a bending area A3. The display area A1 and the bonding area A2 are connected through the bending area A3. The substrate 20 includes a first surface 20a and a second surface 20b disposed opposite to each other. The second surface 20b is bent toward the first surface 20a. The bonding area A2 is bent to the opposite side of the display area A1 and is parallel to the display area A1. The support layer 30 is disposed on the first surface 20a of the substrate 20, and the support layer 30 continuously covers the display area A1. The bending area A3 and the bonding area A2 are defined. The support layer 30 has a mesh groove 50 in the bending area A3. A mesh elastic adhesive layer 40 is disposed in the mesh groove 50. The mesh elastic adhesive layer 40 fills the mesh groove 50 and is bonded to the support layer 30. The mesh elastic adhesive layer 40 and the support layer 30 of the bending area A3 together buffer the bending stress. The Young's modulus of the central region of the bending area A3 is lower than that of the side regions of the bending area A3 near the display area A1 and the bonding area A2.

[0072] The substrate 20 can be a flexible substrate, such as a polyimide substrate. The substrate 20 includes a first surface 20a and a second surface 20b disposed opposite to each other. The second surface 20b is the front side of the substrate 20 facing the user, and the first surface 20a is the back side of the substrate 20. The display area A1 is used to display images. The second surface 20b of the display area A1 is its light-emitting side, and the first surface 20a is its backlight side. The bonding area A2 is the area where the display panel is electrically connected to external circuits (such as driver chips, flexible circuit boards, etc.). The bending area A3 is the transition area connecting the display area A1 and the bonding area A2. The bending area A3 is used for bending the display panel. By bending the display panel through the bending area A3, the bonding area A2 is bent to the back side of the display area A1, thereby achieving a "chinless" design and increasing the screen-to-body ratio of the front of the display panel.

[0073] A support layer 30 is located on the first surface 20a of the substrate 20 and is used to support the substrate 20, reducing the impact of external impacts and damage on the internal structure and circuitry of the substrate 20. The support layer 30 located in the bonding area A2 and the display area A1 is thicker to provide good mechanical support for these areas. The support layer 30 is a continuous layer structure laid on the first surface 20a, without interruption in the bending area A3. This mitigates problems such as bending stress acting on the edges of the support layer 30, which could cause it to warp or even peel off or break. For example, the support layer 30 can be a metal layer. For instance, the material of the support layer 30 could include copper or aluminum.

[0074] The support layer 30 of the bending zone A3 is provided with a mesh groove 50 so that the stress on the support layer 30 of the bending zone A3 can be released at the groove, which improves the situation where the stress on the support layer 30 of the bending zone A3 is concentrated on the middle surface. The bending zone A3 is distributed with stress, avoiding continuous stress accumulation, which can reduce the occurrence of cracks or fracture defects in the bending zone A3, and reduce irreversible deformation caused by stress accumulation in the support layer 30 of the bending zone A3.

[0075] The mesh elastic adhesive layer 40 fills the mesh groove 50 to absorb and buffer the stress released by the support layer 30 at the mesh groove 50, increasing the stress dispersion area and reducing the stress transmission to the bonding area A2. This can improve the problem of excessive local stress causing circuit breakage or film delamination.

[0076] Meanwhile, in this embodiment, the Young's modulus of the central region of the bending area A3 is lower than that of the side regions of the bending area A3 near the display area A1 and the bonding area A2, which allows the bending area A3 to distribute stress more evenly during bending, reducing stress concentration and thus improving the stability and reliability of the display panel.

[0077] In the aforementioned display panel, the support layer 30 is a single-layer structure disposed on the back of the substrate 20. A mesh groove 50 is provided in the bending area A3, which provides a stress relief channel for the support layer 30 in the bending area A3. This reduces the stress peak on the central surface of the bending area A3 (i.e., the area of ​​maximum bending stress), thus reducing the risk of breakage of the support layer 30 in the bending area A3. A mesh elastic adhesive layer 40 fills the mesh groove 50, and the mesh elastic adhesive layer 40 and the support layer 30 share the bending stress. The mesh elastic adhesive layer 40 has good... The deformable elasticity of the mesh elastic adhesive layer 40 absorbs the stress released by the support layer 30, thereby optimizing the stress dispersion ability of the bending area A3. The Young's modulus of the central region of the bending area A3 is lower than that of the side regions of the bending area A3 near the display area A1 and the binding area A2. The low modulus of the central region is conducive to dispersing the stress peak of the central surface of the bending area A3, while the high modulus of the side regions is conducive to limiting the deformation of the support layer 30 at the connection between the bending area A3 and the display area A1 or the binding area A2, reducing the risk of delamination and detachment of the support layer 30.

[0078] In one embodiment, reference Figures 1-4 As shown, the Young's modulus of the mesh elastic adhesive layer 40 ranges from 10 MPa to 800 MPa. For example, the Young's modulus of the mesh elastic adhesive layer 40 can be 10 MPa, 50 MPa, 100 MPa, 150 MPa, 200 MPa, 250 MPa, 300 MPa, 350 MPa, 400 MPa, 450 MPa, 500 MPa, 550 MPa, 600 MPa, 650 MPa, 700 MPa, 750 MPa, or 800 MPa. Thus, by rationally designing the Young's modulus range of the mesh elastic adhesive layer 40, the mesh elastic adhesive layer 40 possesses sufficient deformation capacity to absorb stress during bending.

[0079] In one embodiment, reference Figure 2 As shown, in the bending zone A3, the area ratio of the mesh elastic adhesive layer 40 to the support layer 30 is 1:2-1:5. For example, the area ratio of the mesh elastic adhesive layer 40 to the support layer 30 in the bending zone A3 is 1:2, 1:2.5, 1:3, 1:3.5, 1:4, 1:4.5, or 1:5. This reasonable area ratio of the mesh elastic adhesive layer 40 to the support layer 30 results in a better synergistic stress dispersion effect between the mesh elastic adhesive layer 40 and the support layer 30 in the bending zone A3. This improves the stress buffering capacity of the bending zone A3 while providing good support and structural stability.

[0080] In one embodiment, reference Figures 1-4As shown, the mesh groove 50 includes multiple cutting grooves. From the display area A1 to the binding area A2, the density of the cutting grooves in the central region of the bending area A3 is greater than the density of the cutting grooves in the side regions of the bending area A3. This results in a higher cutting groove density in the central region of the bending area A3, which disperses the stress on the central facade by increasing the number of cutting grooves. The lower cutting groove density in the side regions of the bending area A3 helps maintain the structural stability of the support layer 30 of the bending area A3.

[0081] In one embodiment, the density of the cutting grooves gradually decreases from the center region of the bending region A3 to the side region of the bending region A3.

[0082] In this embodiment, the bending area A3 includes a central region, two side regions connected to the display area A1 and the bonding area A2, and a transition region located between the side regions and the central region. The central region is provided with high-density cutting grooves to enhance its elastic buffering capacity and further disperse stress, thereby reducing the risk of central facade fracture. The side regions are provided with low-density cutting grooves to enhance the structural strength of the support layer 30, increase the connection strength between the support layer 30 and the display area A1 / bonding area A2, and prevent the support layer 30 from fracture. The transition region is provided with medium-density cutting grooves to ensure a smooth stress transition from the central region to the support layer 30 in the side regions, improving the stress transmission path in the bending area A3 and reducing deformation unevenness in the bending area A3.

[0083] In one embodiment, the depth of the cutting groove is less than the thickness of the support layer 30. Preferably, the ratio of the depth of the cutting groove to the thickness of the support layer 30 is 0.5:1 to 0.9:1. For example, the ratio of the depth of the cutting groove to the thickness of the support layer 30 can be 0.5:1, 0.55:1, 0.6:1, 0.65:1, 0.7:1, 0.75:1, 0.8:1, 0.85:1, or 0.9:1.

[0084] In this way, the depth of the cutting groove is less than the thickness of the support layer 30, so that the support layer 30 remains continuous at the groove. The support layer 30 is a continuous structure covering the first surface 20a of the substrate 20. The entire support layer 30 can better resist the tensile and compressive stress during bending, reducing the risk of breakage in the bending area A3. The incompletely cut support layer 30 works synergistically with the mesh elastic adhesive layer 40 to form a composite structure of rigid support layer 30 and mesh elastic adhesive layer 40 on the first surface 20a of the bending area A3, optimizing the stress distribution in the bending area A3. At the same time, the cutting groove does not penetrate the support layer 30, which can avoid damage to the substrate 20 during the formation of the cutting groove, and is conducive to improving product yield.

[0085] In one embodiment, the depth of the cutting groove in the central region is greater than the depth of the cutting groove in the side region of the bending area A3. This further enhances the deformation capability of the central region.

[0086] In one embodiment, the depth of the cutting groove gradually decreases from the center region of the bending region A3 to both sides of the bending region A3.

[0087] In one embodiment, the bottom surface of the cutting groove is an arc surface that is concave from the edge to the center. This helps to reduce stress concentration points, improve fatigue resistance, and optimize the stress transmission path.

[0088] In this embodiment, the bottom surface of the cutting groove is designed as an arc surface, which can disperse the stress generated during bending. The stress forms sharp concentration points at the corners of the bottom of the groove, thereby reducing the risk of breakage of the support layer 30. At the same time, the bottom surface of the mesh elastic adhesive layer 40 is also an arc surface, which improves the adhesion between the mesh elastic adhesive layer 40 and the support layer 30, enhances the elastic buffering capacity of the support layer 30 and the mesh elastic adhesive layer 40 in the bending area A3, and improves the bending performance of the bending area A3.

[0089] In one embodiment, the depth of the center of the cutting groove is greater than the depth of its ends along the extension direction of the cutting groove. This helps to enhance the integration of the mesh elastic adhesive layer 40 and the support layer 30, and reduces the risk of the mesh elastic adhesive layer 40 detaching.

[0090] In one embodiment, multiple cutting grooves are intersected to divide the support layer 30 of the bending area A3 into multiple support patterns. In this way, the cutting grooves guide the stress to diffuse along the grid path, which helps to avoid local stress accumulation. The depth at the intersection of the cutting grooves is greater, forming a stress-relieving channel, which helps to block the transmission of bending stress to the lines in the binding area A2, so as to protect the lines in the binding area A2 from damage.

[0091] Preferably, the supporting pattern is rhomboid, rectangular, honeycomb, or hexagonal. Alternatively, the supporting pattern can be other shapes such as circular, trapezoidal, or elliptical. This embodiment does not impose any limitations on this.

[0092] In other embodiments, refer to Figure 4 The diagram shows various shapes of the mesh groove 50, which can divide the support pattern into shapes such as triangles and trapezoids.

[0093] In other embodiments, the multiple cutting grooves may not intersect, and the multiple cutting grooves may be staggered to form a mesh groove 50.

[0094] In one embodiment, the depth at the intersection of the cutting grooves is greater than the depth at the non-intersections. The bending stress at the intersection of the cutting grooves is greater and more concentrated. In this embodiment, by increasing the depth at the intersection of the cutting grooves, the local rigidity at the intersection is reduced, which can more effectively absorb and disperse the stress at the intersection, enhance the elastic buffering capacity at the intersection, improve bending performance, thereby optimizing the stress transmission path and preventing fracture in the bending zone A3.

[0095] In one embodiment, reference Figure 3 As shown, the mesh groove 50 includes multiple first cutting grooves 51 and multiple second cutting grooves 52; the first cutting grooves 51 extend along a first direction and are spaced apart along a second direction; the second cutting grooves 52 extend along the second direction and are spaced apart along the first direction; the multiple first cutting grooves 51 and multiple second cutting grooves 52 are intersecting, dividing the support layer 30 of the bending area A3 into multiple support patterns. Thus, the mesh groove 50 is simple to manufacture and has low manufacturing cost.

[0096] In this embodiment, the display area A1, bending area A3, and bonding area A2 of the substrate 20 are arranged sequentially along a third direction. The first direction and the second direction intersect with the third direction, respectively.

[0097] In this embodiment, the angle between the first direction and the third direction is 45°, the angle between the second direction and the third direction is 45°, and the first direction is perpendicular to the second direction. The first cutting groove 51 and the second cutting groove 52 divide the support layer 30 of the bending area A3 into a rectangular support pattern.

[0098] In this embodiment, multiple first cutting grooves 51 are equally spaced, and the density of the second cutting grooves 52 gradually decreases from the center region of the bending area A3 to the side region.

[0099] In one embodiment, the thickness of the support layer 30 located in the bending region A3 is thinner than the thickness of the support layers 30 located in the display region A1 and the bonding region A2. This thinner thickness of the support layer 30 in the bending region A3 improves its bending performance and reduces the risk of breakage in the bending region A3.

[0100] In one embodiment, reference Figures 1-4 As shown, the thickness of the support layer 30 in the central region of the bending region A3 is less than the thickness of the support layer 30 in the side regions of the bending region A3.

[0101] In one embodiment, the thickness of the support layer 30 gradually decreases from the side region of the bending region A3 toward the center region of the bending region A3; this helps to balance the bending performance of the center region of the bending region A3 with the support stiffness of the side region, and reduces the deformation inhomogeneity in the bending region A3.

[0102] In one embodiment, the thickness of the support layer 30 in the bending region A3 is 15μm-80μm. For example, the thickness of the support layer 30 in the bending region A3 can be 15μm, 20μm, 25μm, 30μm, 35μm, 40μm, 45μm, 50μm, 55μm, 60μm, 65μm, 70μm, 75μm, or 80μm. The ratio of the thickness of the support layer 30 in the central region of the bending region A3 to the thickness of the support layer 30 in the side regions of the bending region A3 near the display area A1 and the bonding area A2 is 0.6:1-0.9:1. For example, the ratio of the thickness of the support layer 30 in the central region of the bending region A3 to the thickness of the support layer 30 in the side region of the bending region A3 can be 0.6:1, 0.65:1, 0.7:1, 0.75:1, 0.8:1, 0.85:1 or 0.9:1.

[0103] In some embodiments, refer to Figure 1 As shown, the thickness of the support layer 30 decreases from the center region of the bending region A3 to the side region of the bending region A3, which can further improve the bending performance of the bending region A3, reduce the deformation inhomogeneity in the bending region A3, and reduce the risk of breakage of the support layer 30 on the side of the bending region A3.

[0104] In one embodiment, the material of the mesh elastic adhesive layer 40 includes at least one of silicone rubber, polyurethane elastomer, acrylic rubber, fluororubber, or thermoplastic elastomer. Thus, the mesh elastic adhesive layer 40 has good cushioning elasticity and excellent fatigue resistance, high adhesion between the mesh elastic adhesive layer 40 and the support layer 30, and high structural stability when the mesh elastic adhesive layer 40 and the support layer 30 are bent together.

[0105] In one embodiment, reference Figure 1 As shown, the display panel also includes a first adhesive layer 70, which is disposed on the second surface 20b of the substrate 20, and the first adhesive layer 70 is located at least in the bending region A3.

[0106] In this way, the first adhesive layer 70, located on the outer surface of the substrate 20, can block water and oxygen, delaying the adverse effects of water and oxygen attacking the substrate 20. At the same time, the first adhesive layer 70, together with the support layer 30 and the mesh elastic adhesive layer 40 of the bending area A3, can disperse the bending stress, further improve the bending effect, and make the bending curve of the bending area A3 have higher tensile density.

[0107] In one embodiment, reference Figure 1 As shown, a driver chip is attached to the first surface 20a of the bonding area A2. The second surface 20b of the substrate 20 is bent towards the first surface 20a, and the bonding area A2 is bent to be parallel to the opposite side of the display area A1. An adhesive layer 60 is provided between the bonding area A2 and the display area A1, and the bonding area A2 and the display area A1 are bonded together by the adhesive layer 60. The adhesive layer 60 can be adhesive foam, and the material of the adhesive foam can be acrylic foam or silicone foam. The adhesive layer 60 is used to absorb stress and enhance structural stability.

[0108] Secondly, this application provides a method for manufacturing a display panel, referring to... Figure 5 As shown, and in conjunction with reference Figures 1-4 The manufacturing method of the display panel includes the following steps:

[0109] Step S101: Provide a substrate 20. The substrate 20 includes a display area A1, a bonding area A2, and a bending area A3. The display area A1 and the bonding area A2 are connected through the bending area A3. The substrate 20 includes a first surface 20a and a second surface 20b disposed opposite to each other.

[0110] In this embodiment, the substrate 20 can be a flexible substrate, such as a polyimide substrate. The substrate 20 includes a first surface 20a and a second surface 20b disposed opposite to each other. The second surface 20b is the front side of the substrate 20 facing the user, and the first surface 20a is the back side of the substrate 20. The display area A1 is used to display images. The second surface 20b of the display area A1 is its light-emitting side, and the first surface 20a is its backlight side. The bonding area A2 is the area where the display panel is electrically connected to external circuits (such as driver chips, flexible circuit boards, etc.). The bending area A3 is the transition area connecting the display area A1 and the bonding area A2. The bending area A3 is used for bending the display panel.

[0111] Step S102: A support layer 30 is formed on the first surface 20a of the substrate 20.

[0112] In this embodiment, the support layer 30 can be formed by physical vapor deposition (PVD) or atomic layer deposition (ALD). The support layer 30 can be a metal layer. For example, the material of the support layer 30 may include copper or aluminum.

[0113] Step S103: Use laser etching to etch the support layer 30 of the bending area A3 to form a mesh groove 50 in the bending area A3.

[0114] In this embodiment, the depth of the cutting groove is less than the thickness of the support layer 30. This ensures that the support layer 30 remains continuous at the groove. The support layer 30 is a continuous structure covering the first surface 20a of the substrate 20. The continuous support layer 30 can better resist tensile and compressive stresses during bending, reducing the risk of breakage in the bending area A3.

[0115] Preferably, the ratio of the depth of the cutting groove to the thickness of the support layer 30 is 0.5:1 to 0.9:1. For example, the ratio of the depth of the cutting groove to the thickness of the support layer 30 can be 0.5:1, 0.55:1, 0.6:1, 0.65:1, 0.7:1, 0.75:1, 0.8:1, 0.85:1, or 0.9:1.

[0116] Step S104: Fill the mesh groove 50 with liquid adhesive. After the liquid adhesive cures, it forms a mesh elastic adhesive layer 40. The mesh elastic adhesive layer 40 fills the mesh groove 50 and is bonded to the support layer 30. The mesh elastic adhesive layer 40 and the support layer 30 of the bending area A3 work together to buffer the bending stress, so that the Young's modulus of the central area of ​​the bending area A3 is lower than the Young's modulus of the side areas of the bending area A3 near the display area A1 and the binding area A2.

[0117] For example, the Young's modulus of the mesh elastic adhesive layer 40 ranges from 10 MPa to 800 MPa. For example, the Young's modulus of the mesh elastic adhesive layer 40 can be 10 MPa, 50 MPa, 100 MPa, 150 MPa, 200 MPa, 250 MPa, 300 MPa, 350 MPa, 400 MPa, 450 MPa, 500 MPa, 550 MPa, 600 MPa, 650 MPa, 700 MPa, 750 MPa, or 800 MPa.

[0118] In this embodiment, the material of the mesh elastic adhesive layer 40 may include at least one of silicone rubber, polyurethane elastomer, acrylic rubber, fluororubber, or thermoplastic elastomer. Thus, the mesh elastic adhesive layer 40 has good cushioning elasticity and excellent fatigue resistance, high adhesion between the mesh elastic adhesive layer 40 and the support layer 30, and high structural stability when the mesh elastic adhesive layer 40 and the support layer 30 are bent together.

[0119] In one embodiment, in the bending region A3, the area ratio of the mesh elastic adhesive layer 40 to the support layer 30 is 1:2 to 1:5. For example, the area ratio of the mesh elastic adhesive layer 40 to the support layer 30 in the bending region A3 is 1:2, 1:2.5, 1:3, 1:3.5, 1:4, 1:4.5, or 1:5.

[0120] The above-described method for manufacturing the display panel has good process compatibility with the steps of forming the mesh groove 50 and the mesh elastic adhesive layer 40 in the bending area A3, and the manufacturing process is simple. The support layer 30, which is set as a whole layer, reduces the risk of the support layer 30 falling off. The mesh groove 50 provides a stress release channel for the support layer 30 in the bending area A3, which can reduce the stress peak of the central surface of the bending area A3 (i.e., the area with the greatest bending stress) and reduce the risk of breakage of the support layer 30 in the bending area A3. The mesh elastic adhesive layer 40 absorbs stress and optimizes the stress dispersion ability of the bending area A3. The low modulus in the central area helps to disperse the stress peak of the central surface of the bending area A3, while the high modulus in the side areas helps to limit the deformation of the support layer 30 at the connection between the bending area A3 and the display area A1 or the bonding area A2, reducing the risk of delamination and falling off of the support layer 30.

[0121] In one embodiment, before step S103 forms the mesh groove 40 in the bending area A3, step S1001 is also performed:

[0122] Step S1001: Etch the support layer 30 of the bending region A3 so that the thickness of the support layer 30 of the bending region A3 is thinner than the thickness of the support layer 30 of other regions.

[0123] In this embodiment, a dry etching process can be used to remove part of the support layer 30 in the bending area A3, so that the thickness of the support layer 30 in the bending area A3 is thinner than the thickness of the support layer 30 in the display area A1 and the bonding area A2.

[0124] In some embodiments, after etching the support layer 30 of the bending region A3, the thickness of the support layer 30 of the bending region A3 is 15μm-80μm. For example, the thickness of the support layer 30 of the bending region A3 can be 15μm, 20μm, 25μm, 30μm, 35μm, 40μm, 45μm, 50μm, 55μm, 60μm, 65μm, 70μm, 75μm, or 80μm.

[0125] In some embodiments, after etching the support layer 30 of the bending region A3, the ratio of the thickness of the support layer 30 in the central region of the bending region A3 to the thickness of the support layer 30 in the side regions of the bending region A3 near the display region A1 and the bonding region A2 is 0.6:1-0.9:1. For example, the ratio of the thickness of the support layer 30 in the central region of the bending region A3 to the thickness of the support layer 30 in the side regions of the bending region A3 can be 0.6:1, 0.65:1, 0.7:1, 0.75:1, 0.8:1, 0.85:1, or 0.9:1.

[0126] In some embodiments, the thickness of the support layer 30 decreases from the central region of the bending region A3 toward the side region of the bending region A3, which can further improve the bending performance of the bending region A3, reduce the deformation inhomogeneity in the bending region A3, and reduce the risk of breakage of the support layer 30 on the side of the bending region A3.

[0127] In one embodiment, after forming the mesh elastic adhesive layer 40 in step S104, the method further includes:

[0128] Step S105: A first adhesive layer 70 is formed on the second surface 20b of the substrate 20, wherein the first adhesive layer 70 is located at least in the bending region A3.

[0129] In this embodiment, refer to Figure 1 A first adhesive layer 70 can be formed by coating the second surface 20b of the substrate 20. The material of the first adhesive layer 70 may include acrylic adhesive, silicone adhesive, or polyurethane adhesive. The first adhesive layer 70 has good adhesion and elasticity, and the first adhesive layer 70 is located at least in the bending region A3. In this way, the first adhesive layer 70, located on the outer surface of the substrate 20, can block water and oxygen, delaying the adverse effects of water and oxygen attacking the substrate 20. The first adhesive layer 70, together with the support layer 30 and the mesh elastic adhesive layer 40 of the bending region A3, can synergistically disperse bending stress, further improving the bending effect and giving the bending curve of the bending region A3 higher tensile density.

[0130] Step S106: Bend the second surface 20b of the substrate 20 toward the first surface 20a, and bend the bonding area A2 to the opposite side of the display area A1 and set parallel to the display area A1.

[0131] In this embodiment, refer to Figure 1 An adhesive layer 60 is adhered to the first surface 20a of the bonding area A2. The second surface 20b of the substrate 20 is bent toward the first surface 20a, bending the bonding area A2 to be parallel to the opposite side of the display area A1. The bonding area A2 and the display area A1 are bonded together by the adhesive layer 60. This allows the driving circuitry to be located in the bonding area A2, and by bending the bonding area A2 to the opposite side of the display area A1, the screen-to-body ratio of the display panel can be increased. The adhesive layer 60 can be adhesive foam, which can be made of acrylic foam or silicone foam. The adhesive layer 60 is used to absorb stress and enhance structural stability.

[0132] In some embodiments, refer to Figures 1-4 The mesh groove 50 includes multiple cutting grooves. From the display area A1 to the binding area A2, the density of the cutting grooves in the central region of the bending area A3 is greater than the density of the cutting grooves in the side regions of the bending area A3. For example, the density of the cutting grooves gradually decreases from the central region of the bending area A3 to the side regions of the bending area A3.

[0133] In some embodiments, the depth of the cutting groove in the central region is greater than the depth of the cutting groove in the side region of the bending region A3. For example, the depth of the cutting groove gradually decreases from the central region of the bending region A3 to the side region of the bending region A3.

[0134] In some embodiments, the bottom surface of the cutting groove is an arc surface that is concave from the edge to the center. This helps to reduce stress concentration points, improve fatigue resistance, and optimize the stress transmission path.

[0135] In some embodiments, along the extension direction of the cutting groove, the depth of the center of the cutting groove is greater than the depth of the end of the cutting groove.

[0136] In some embodiments, multiple cutting grooves are arranged intersectingly to divide the support layer 30 of the bending area A3 into multiple support patterns. Preferably, the support pattern is rhomboid, rectangular, honeycomb, or hexagonal. Alternatively, the support pattern can be other shapes such as circular, trapezoidal, or elliptical. This embodiment does not impose any limitations on this.

[0137] In some embodiments, the depth at the intersection of the cutting grooves is greater than the depth at the non-intersection of the cutting grooves.

[0138] In some embodiments, refer to Figures 1-4 The mesh groove 50 includes a plurality of first cutting grooves 51 and a plurality of second cutting grooves 52; the first cutting grooves 51 extend along a first direction and are spaced apart along a second direction; the second cutting grooves 52 extend along a second direction and are spaced apart along a first direction; the plurality of first cutting grooves 51 and the plurality of second cutting grooves 52 are intersected and arranged to divide the support layer 30 of the bending area A3 into a plurality of support patterns.

[0139] Thirdly, this application provides a display device, including the display panel as described in the first aspect.

[0140] The aforementioned display device reduces the thickness of the support layer 30 in the bending region A3 and provides a mesh groove 50 in the bending region A3. The support layer 30 is a single-layer structure disposed on the back of the substrate 20, reducing the risk of the support layer 30 detaching. The mesh groove 50 provides a stress relief channel for the support layer 30 in the bending region A3, which can reduce the stress peak value on the central surface of the bending region A3 (i.e., the area with the greatest bending stress) and reduce the risk of breakage of the support layer 30 in the bending region A3. The mesh elastic adhesive layer 40 is filled in the mesh groove 50, and the mesh elastic adhesive layer 40 and the support layer 30 jointly bear the bending load. The mesh elastic adhesive layer 40 has good deformation elasticity and absorbs the stress released by the support layer 30, thereby optimizing the stress dispersion ability of the bending area A3. The Young's modulus of the central region of the bending area A3 is lower than that of the side regions of the bending area A3 near the display area A1 and the binding area A2. The low modulus of the central region is conducive to dispersing the stress peak of the central surface of the bending area A3, while the high modulus on both sides is conducive to limiting the deformation of the support layer 30 at the connection between the bending area A3 and the display area A1 or the binding area A2, reducing the risk of delamination and detachment of the support layer 30.

[0141] It should be understood that although the steps in the flowcharts of the accompanying drawings are shown sequentially as indicated by the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some of the steps in the accompanying drawings may include multiple steps or stages, which are not necessarily completed at the same time, but may be executed at different times, and the execution order of these steps or stages is not necessarily sequential, but may be performed alternately or in turn with other steps or at least some of the steps or stages of other steps.

[0142] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0143] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A display panel, characterized in that, include: A substrate, the substrate including a display area, a bonding area and a bending area, the display area and the bonding area being connected through the bending area, the substrate including a first surface and a second surface disposed opposite to each other, the second surface being bent toward the first surface, the bonding area being bent to the opposite side of the display area and disposed parallel to the display area; A support layer is disposed on the first surface of the substrate, the support layer continuously covers the display area, the bending area and the bonding area, and the support layer is provided with a mesh groove in the bending area; A mesh elastic adhesive layer is disposed within the mesh groove. The mesh elastic adhesive layer fills the mesh groove and is bonded to the support layer. The mesh elastic adhesive layer and the support layer in the bending area work together to buffer bending stress. The Young's modulus of the central region of the bending area is lower than that of the side regions of the bending area near the display area and the binding area.

2. The display panel according to claim 1, characterized in that, The Young's modulus of the mesh elastic adhesive layer ranges from 10 MPa to 800 MPa; Preferably, in the bending area, the area ratio of the mesh elastic adhesive layer to the support layer is 1:2 to 1:

5.

3. The display panel according to claim 1, characterized in that, The mesh groove includes multiple cutting grooves, and the density of the cutting grooves in the central region of the bending area is greater than the density of the cutting grooves in the side regions of the bending area. Preferably, the density of the cutting grooves gradually decreases from the center region of the bending area to the side region of the bending area; Preferably, the depth of the cutting groove is less than the thickness of the support layer; Preferably, the ratio of the depth of the cutting groove to the thickness of the support layer is 0.5:1 to 0.9:1; Preferably, the depth of the cutting groove in the central region is greater than the depth of the cutting groove in the side region of the bending area; Preferably, the depth of the cutting groove gradually decreases from the center region of the bending area to the side region of the bending area; Preferably, the bottom surface of the cutting groove is an arc surface that is concave from the edge to the center; Preferably, along the extending direction of the cutting groove, the depth of the center of the cutting groove is greater than the depth of the end of the cutting groove.

4. The display panel according to claim 3, characterized in that, Multiple cutting grooves are intersecting to divide the support layer of the bending area into multiple support patterns; Preferably, the supporting pattern is rhomboid, rectangular, honeycomb, or hexagonal; Preferably, the depth at the intersection of the cutting grooves is greater than the depth at the non-intersection of the cutting grooves.

5. The display panel according to claim 4, characterized in that, The mesh trench includes: Multiple first cutting grooves, which extend along a first direction and are spaced apart along a second direction; Multiple second cutting grooves, which extend along the second direction and are spaced apart along the first direction; Multiple first cutting grooves and multiple second cutting grooves are intersected to divide the support layer of the bending area into multiple support patterns.

6. The display panel according to claim 1, characterized in that, The thickness of the support layer in the central region of the bending area is less than the thickness of the support layer in the side regions of the bending area; Preferably, the thickness of the support layer gradually decreases from the side region of the bending area to the center region of the bending area; Preferably, the thickness of the support layer in the bending region is 15μm-80μm, and the ratio of the thickness of the support layer in the central region of the bending region to the thickness of the support layer in the side region of the bending region is 0.6:1-0.9:1; Preferably, the material of the mesh elastic adhesive layer includes at least one of silicone rubber, polyurethane elastomer, acrylic rubber, fluororubber, or thermoplastic elastomer; Preferably, the display panel further includes: A first adhesive layer is disposed on the second surface of the substrate, and the first adhesive layer is located at least in the bending region.

7. A method for manufacturing a display panel, characterized in that, include: A substrate is provided, the substrate including a display area, a bonding area and a bending area, the display area and the bonding area being connected through the bending area, and the substrate including a first surface and a second surface disposed opposite to each other; A support layer is formed on the first surface of the substrate; The support layer in the bending region is etched using a laser to form a mesh-like trench in the bending region; Liquid adhesive is filled into the mesh grooves. After the liquid adhesive cures, it forms a mesh elastic adhesive layer. The mesh elastic adhesive layer fills the mesh grooves and is bonded to the support layer. The mesh elastic adhesive layer and the support layer of the bending area work together to buffer the bending stress, so that the Young's modulus of the central region of the bending area is lower than that of the side regions of the bending area near the display area and the bonding area.

8. The method for manufacturing a display panel according to claim 7, characterized in that, Before the formation of the mesh grooves in the bending area, the method further includes: The support layer in the bending region is etched so that the thickness of the support layer in the bending region is thinner than the thickness of the support layer in other regions.

9. The method for manufacturing a display panel according to claim 7, characterized in that, Also includes: A first adhesive layer is formed on the second surface of the substrate, and the first adhesive layer is located at least in the bending region; The second surface of the substrate is bent toward the first surface, and the bonding area is bent to the opposite side of the display area and is arranged parallel to the display area.

10. A display device, characterized in that, Includes the display panel as described in any one of claims 1-6.

Images