Display panel, preparation method thereof, display module and display device

Abstract

The application provides a display panel, a preparation method thereof, a display module and a display device. The display panel has a display area and a non-display area surrounding the display area at least partially. The non-display area includes a bending area on at least one side of the display area and a binding area. The binding area is located on the side of the bending area away from the display area. The display panel includes a substrate extending from the display area to the binding area. The substrate is provided with a groove. The groove is located at least in the bending area. A first planarization layer is located on one side of the substrate. The first planarization layer extends from the display area to the binding area. The first planarization layer includes a first part filling the groove and a second part not filling the groove. In the direction perpendicular to the substrate, the height of the first part is greater than the depth of the groove. A conductive layer is located on the side of the first planarization layer away from the substrate. At least part of the conductive layer is located in the bending area. A first film layer is located on the side of the conductive layer away from the substrate. At least part of the first film layer is located in the bending area. The technical scheme of the application can realize a narrow frame.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to a display panel and its manufacturing method, a display module, and a display device. Background Technology

[0002] With the widespread use of electronic products, users have increasingly higher requirements for the resolution, screen-to-body ratio, and other display aspects of these products. Driven by this demand, display products with narrow or borderless bezels have emerged. Typically, the bezel area of ​​an electronic product's display panel can be bent to the back, thus creating the visual effect of a narrow or borderless bezel. However, due to the inherent structural characteristics of the display panel, bending it can easily cause damage, making it difficult to achieve an extremely small bending radius and further reduce the bezel area. Summary of the Invention

[0003] To address the aforementioned issues, embodiments of this application provide a display panel, a method for manufacturing the same, a display module, and a display device.

[0004] In a first aspect, embodiments of this application provide a display panel having a display area and a non-display area at least partially surrounding the display area. The non-display area includes a bending area and a bonding area located on at least one side of the display area. The bonding area is located on the side of the bending area opposite to the display area. The display panel includes: a substrate extending from the display area to the bonding area, with a groove provided on the substrate, the groove being at least located in the bending area; a first planarization layer located on one side of the substrate, extending from the display area to the bonding area, the first planarization layer including a first portion filling the groove and a second portion not filling the groove, the height of the first portion being greater than the depth of the groove along a direction perpendicular to the substrate; a conductive layer located on the side of the first planarization layer opposite to the substrate, at least a portion of the conductive layer being located in the bending area; and a first film layer located on the side of the conductive layer opposite to the substrate, at least a portion of the first film layer being located in the bending area.

[0005] In conjunction with the first aspect, along the direction perpendicular to the substrate, the height of the first portion is greater than the sum of the depth of the groove and a first preset value; preferably, the first preset value includes 1 μm; preferably, along the direction parallel to the substrate, the width of the groove is greater than or equal to the width of the bending area; preferably, the depth of the groove is greater than or equal to 2 μm and less than or equal to 9 μm.

[0006] In conjunction with the first aspect, the distance from the surface of the first part away from the substrate to the substrate is less than or equal to the distance from the surface of the second part away from the substrate to the substrate.

[0007] In conjunction with the first aspect, the substrate includes a first substrate, a barrier layer, and a second substrate stacked sequentially, with at least a portion of the second substrate located between the barrier layer and the first planarization layer, and the bottom wall of the groove located in the second substrate, or at the interface between the second substrate and the barrier layer, or in the barrier layer, or in the first substrate.

[0008] In conjunction with the first aspect, the Young's modulus of the first planarization layer is less than the Young's modulus of the substrate; preferably, the Young's modulus of the first planarization layer is greater than or equal to 0.1 GPa and less than or equal to 1 GPa; and / or, the viscosity of the first planarization layer is greater than or equal to 1 cps and less than or equal to 5 cps; preferably, the material of the first planarization layer includes a low-temperature curing material or a UV-curing material; preferably, the material of the first planarization layer includes an organic material; preferably, the material of the first planarization layer includes at least one of polyimide, acrylic, or epoxy.

[0009] In conjunction with the first aspect, the first film layer includes at least one of a second planarization layer, a pixel definition layer, and a spacer layer; preferably, the first film layer includes the second planarization layer, the pixel definition layer, and the spacer layer sequentially stacked along a direction away from the substrate; preferably, the Young's modulus of at least one of the first film layers is greater than or equal to 0.1 GPa and less than or equal to 1 GPa; preferably, the strain of at least one of the first film layers is greater than or equal to 10% and less than or equal to 30%; preferably, the material of at least one of the first film layers includes a low-temperature curing material or an ultraviolet curing material.

[0010] Secondly, embodiments of this application also provide a method for manufacturing a display panel. The display panel has a display area and a non-display area at least partially surrounding the display area. The non-display area includes a bending area and a bonding area located on at least one side of the display area. The method for manufacturing the display panel includes: forming a substrate on a substrate, wherein a groove is provided on the substrate, and the groove is at least located in the bending area; forming a first planarization layer on the side of the substrate away from the substrate, the first planarization layer including a first portion filling the groove and a second portion not filling the groove, wherein the height of the first portion is greater than the depth of the groove along a direction perpendicular to the substrate; forming a conductive layer on the side of the first planarization layer away from the substrate, wherein at least a portion of the conductive layer is located in the bending area; and forming a first film layer on the side of the conductive layer away from the substrate, wherein at least a portion of the first film layer is located in the bending area.

[0011] In conjunction with the second aspect, forming a first planarization layer on the side of the substrate away from the substrate includes: coating a first organic material on the side of the substrate away from the substrate using a coating process to obtain a first planarization layer; preferably, forming a substrate on the substrate includes: sequentially forming a first substrate, a barrier layer, and a second substrate on the substrate; in the bending region, etching at least the second substrate from the side of the second substrate away from the substrate to form a groove to obtain a substrate, wherein the bottom wall of the groove is located in the second substrate, or at the interface between the second substrate and the barrier layer, or in the barrier layer, or in the first substrate.

[0012] Thirdly, embodiments of this application also provide a display module, comprising: the aforementioned display panel, wherein the bonding area of ​​the display panel is bent to the non-light-emitting side of the display panel; a support layer located on the side of the substrate away from the first planarization layer, the support layer comprising a first sub-support portion and a second sub-support portion, the first sub-support portion being at least located in the display area, and the second sub-support portion being located in the bonding area; a buffer layer located between the first sub-support portion and the second sub-support portion; a padding block located between the buffer layer and the second sub-support portion; and an organic adhesive layer located in the bending area and on the side of the first film layer away from the substrate.

[0013] Fourthly, embodiments of this application also provide a display device, including the aforementioned display panel or the aforementioned display module.

[0014] The above technical solution involves creating a groove on the substrate of the bending area, which thins the substrate of the bending area. The groove is filled with the material of the first planarization layer. Since the Young's modulus of the first planarization layer is less than that of the substrate material, the stress-neutral layer can move towards the conductive layer. By reasonably setting the depth of the groove, the stress-neutral layer can be located in the conductive layer. This avoids the conductive layer from breaking during bending, and the conductive layer will not break even at a small bending radius, which is beneficial for achieving a narrow bezel. Attached Figure Description

[0015] Figure 1 This is a top view of the display panel provided in one embodiment of this application.

[0016] Figure 2 This is a schematic cross-sectional view of a display panel provided in an embodiment of this application.

[0017] Figure 3 This is a cross-sectional structural diagram of a display panel provided in another embodiment of this application.

[0018] Figure 4 This is a cross-sectional structural diagram of a display panel provided in another embodiment of this application.

[0019] Figure 5 This is a cross-sectional structural diagram of a display panel provided in another embodiment of this application.

[0020] Figure 6 This is a cross-sectional structural diagram of a display panel provided in another embodiment of this application.

[0021] Figure 7 This is a cross-sectional structural diagram of a display panel provided in another embodiment of this application.

[0022] Figure 8 This is a cross-sectional structural diagram of a display panel provided in another embodiment of this application.

[0023] Figure 9 This is a schematic flowchart of a method for manufacturing a display panel according to an embodiment of this application.

[0024] Figure 10 This is a schematic cross-sectional view of a display module provided in an embodiment of this application.

[0025] Figure 11 This is a schematic diagram of the structure of a display device provided in an embodiment of this application. Detailed Implementation

[0026] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0027] To achieve narrow or borderless bezels in display panels, a portion of the panel (e.g., the bonding area) is typically bent to the back. Bending the display panel generates stress. If the stress on either side of the conductive layer (usually consisting of multiple metal traces) is unequal, the conductive layer can stretch and break under stress. This is especially true when the bending radius is small, as the stress on the conductive layer is greater, making it more prone to breakage and resulting in poor signal reception.

[0028] Based on this, embodiments of this application provide a display panel. The display panel has a display area AA and a non-display area NA that at least partially surrounds the display area AA. The non-display area NA includes a bending area NA1 and a bonding area NA2 located on at least one side of the display area AA. The bonding area NA2 is located on the side of the bending area NA1 opposite to the display area AA. The display panel includes a substrate 10, a first planarization layer 20, a conductive layer 30, and a first film layer 40. Specifically, the substrate 10 extends from the display area AA to the bonding area NA2, and a groove 101 is provided on the substrate 10, the groove 101 being at least located in the bending area NA1; the first planarization layer 20 is located on one side of the substrate 10, the first planarization layer 20 extends from the display area AA to the bonding area NA2, the first planarization layer 20 includes a first portion 210 filling the groove 101 and a second portion 220 not filling the groove 101, and along the direction perpendicular to the substrate 10, the height h2 of the first portion 210 is greater than the depth h1 of the groove 101; the conductive layer 30 is located on the side of the first planarization layer 20 away from the substrate 10, at least a portion of the conductive layer 30 being located in the bending area NA1; the first film layer 40 is located on the side of the conductive layer 30 away from the substrate 10, at least a portion of the first film layer 40 being located in the bending area NA1. In this embodiment, a groove is formed on the substrate of the bending region, i.e., the substrate of the bending region is thinned, and the groove is filled with the material of the first planarization layer. Since the Young's modulus of the first planarization layer material is less than that of the substrate material, the stress-neutral layer can move towards the conductive layer. By reasonably setting the depth of the groove, the stress-neutral layer can be located in the conductive layer. In this way, the conductive layer can be prevented from breaking during bending, and it will not break even at a small bending radius, which is beneficial for achieving a narrow bezel. In addition, the filling height of the first planarization layer is higher than the depth of the groove, which can prevent the subsequently prepared conductive layer from breaking due to excessive step difference at the groove boundary, and ensure the flatness of the conductive layer deposition.

[0029] Figure 1 This is a top view of the display panel provided in one embodiment of this application. Figure 2 This is a schematic cross-sectional view of a display panel provided in an embodiment of this application. Specifically, Figure 2 yes Figure 1 The diagram shows a cross-sectional view of the display panel along line B1B2. Figure 3 yes Figure 2 The diagram shows a cross-sectional view of the display panel in a bent state. Figures 1 to 3 As shown, the display panel includes a display area AA and a non-display area NA that at least partially surrounds the display area AA. The non-display area NA includes a bent area NA1 and a bonding area NA2 located on at least one side of the display area AA. The bonding area NA2 is located on the side of the bent area NA1 opposite to the display area AA. It can be understood that a portion of the non-display area NA is also included between the bent area NA1 and the display area AA. Figures 1 to 3(Not shown in the image), not described in the embodiments of this application.

[0030] In this embodiment, the display panel includes a substrate 10, a first planarization layer 20, a conductive layer 30, and a first film layer 40. The substrate 10 extends from the display area AA to the bonding area NA2, and a groove 101 is provided on the substrate 10, with the groove 101 located at least in the bending area NA1. In some embodiments, the groove 101 may also extend to a portion of the bonding area NA2 or the display area AA; for example, the width of the groove 101 is greater than or equal to the width of the bending area NA1, which is not limited in this embodiment. In this embodiment, the depth of the groove 101 is greater than or equal to 2 μm and less than or equal to 9 μm. For example, the depth of the groove 101 is 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, etc. If the depth of the groove 101 is less than 2 μm, the stress neutralization layer adjustment effect is not significant. Since the groove 101 is etched by a dry etching process, if the groove 101 is too deep, it may result in poor uniformity and poor surface flatness. In addition, if the groove 101 is too deep, the substrate 10 may not provide sufficient support for the display panel, resulting in adverse effects.

[0031] In this embodiment, the first planarization layer 20 is located on one side of the substrate 10, extending from the display area AA to the bonding area NA2. The first planarization layer 20 includes a first portion 210 filled with the groove 101 and a second portion 220 unfilled with the groove 101. Along the direction perpendicular to the substrate 10, the height h2 of the first portion 210 is greater than the depth h1 of the groove 101. In this embodiment, the material of the first planarization layer 20 is filled in the groove 101. Since the Young's modulus of the material of the first planarization layer 20 is less than that of the Young's modulus of the substrate 10, the stress neutral layer can move towards the conductive layer 30. Furthermore, when preparing the first planarization layer 20, the material of the first planarization layer 20 directly fills the groove 101, eliminating the need for additional filling of the groove 101 and simplifying the preparation process. In addition, the filling height of the first planarization layer 20 is higher than the depth of the groove 101, which can prevent the subsequently prepared conductive layer 30 from breaking due to excessive step difference at the boundary of the groove 101, ensuring the flatness of the conductive layer 30 deposition.

[0032] Optionally, along the direction perpendicular to the substrate 10, the height h2 of the first portion 210 is greater than the sum of the depth h1 of the groove 101 and a first preset value. The first preset value includes 1 μm. This ensures that the step difference of the first planarization layer 20 at the boundary of the groove 101 is not too large, preventing the conductive layer 30 from breaking due to excessive step difference during subsequent fabrication.

[0033] In this embodiment, the distance d1 from the surface of the first portion 210 away from the substrate 10 to the substrate 10 (e.g., the upper surface of the substrate 10) is less than or equal to the distance d2 from the surface of the second portion 220 away from the substrate 10 to the substrate 10 (e.g., the upper surface of the substrate 10). In this embodiment, since the first planarization layer 20 is prepared by a coating process, due to the presence of the groove 101, more coating material is required here than at other locations. However, coating is typically uniform, resulting in the surface of the first portion 210 away from the substrate 10 being lower than the surface of the second portion 220 away from the substrate 10. If the material has a lower viscosity and better flowability, the problem of uneven height between the first portion 210 and the second portion 220 can be improved. In some cases, if the flowability is good enough, the surfaces of the first portion 210 and the second portion 220 away from the substrate 10 are flush, i.e., the surfaces of the first planarization layer 20 are flush.

[0034] The conductive layer 30 is located on the side of the first planarization layer 20 opposite to the substrate 10, and at least a portion of the conductive layer 30 is located in the bending region NA1. Optionally, the conductive layer 30 may also be located in the display region AA and / or the bonding region NA2. The first film layer 40 is located on the side of the conductive layer 30 opposite to the substrate 10, and at least a portion of the first film layer 40 is located in the bending region NA1. Optionally, the first film layer 40 may also be located in the display region AA and / or the bonding region NA2. In this embodiment, a stress-neutralizing layer is located within the conductive layer 30, thus preventing the conductive layer 30 from breaking.

[0035] The stress-neutral layer of a display panel refers to a transition layer that is subjected to neither tensile nor compressive forces during the bending process of the display panel; the stress at the stress center layer is almost zero. Typically, the stress-neutral layer is located on the conductive layer 30 near the substrate 10 (e.g., within the substrate 10). By providing a groove 101 and filling the groove 101 with the material of the first planarization layer 20, and by appropriately setting the depth of the groove 101, the stress-neutral layer can be moved into the conductive layer 30. Figure 3 As shown, the stress neutral layer C is located in the conductive layer 30, which can prevent the conductive layer 30 from breaking when bent and can achieve a very small bending radius, thus reducing the bezel of the display panel.

[0036] Figure 4 This is a cross-sectional structural diagram of a display panel provided in another embodiment of this application. Figure 4 The display panel shown is Figure 2The difference in the display panel shown is that the substrate 10 includes a first substrate 110, a barrier layer 120, and a second substrate 130 stacked sequentially, with at least a portion of the second substrate 130 located between the barrier layer 120 and the first planarization layer 20. In this embodiment, the bottom wall of the groove 101 is located within the second substrate 130. Typically, the thickness of the first substrate 110 of the display panel is approximately 9 μm, and the thickness of the second substrate 130 is approximately 6 μm. When the depth of the groove 101 is less than 6 μm, the bottom wall of the groove 101 is located within the second substrate 130, such as... Figure 4 As shown. In this case, the amount of the first planarization layer 20 is relatively small. During bending, the stress neutral layer may still be located in the substrate 10. At this time, an organic adhesive layer needs to be provided on the outer surface of the first film layer 40 of the display panel located in the bending area NA1, so that the stress neutral layer is located in the conductive layer 30. In this embodiment, compared with the prior art, the thickness of the organic adhesive layer can be reduced, thus reducing the bending radius and facilitating the achievement of a narrow bezel. In this embodiment, since the depth of the groove 101 is less than 6μm, the uniformity of the etched groove 101 is better, and the material of the first planarization layer 20 is easier to fill the groove 101 and it is easier to achieve a filling height higher than the depth of the groove 101. Therefore, it is easier to achieve in terms of process, that is, it is possible to simultaneously achieve a narrow bezel and a good manufacturing process.

[0037] However, in some cases, if a narrow bezel is required, the organic adhesive layer may limit further reduction in the bending radius. In such cases, increasing the depth of the groove 101 can be considered, adjusting the stress neutral layer into the conductive layer 30 by adjusting the depth of the groove 101. Specifically, as... Figure 5 As shown, the bottom wall of the groove 101 is located at the interface between the second substrate 130 and the barrier layer 120, that is, the second substrate 130 completely etched away the bending region NA1. Or, as Figure 6 As shown, the bottom wall of the groove 101 is located in the barrier layer 120, that is, the second substrate 130 and the barrier layer 120 are etched away from the bending region NA1. Or, as Figure 7 As shown, the bottom wall of the groove 101 is located in the first substrate 110, specifically the second substrate 130 and the barrier layer 120 that have etched away the bending region NA1, as well as a portion of the first substrate 110. It should be noted that as the depth of the groove 101 increases, the requirements for the etching process become more stringent; furthermore, the deeper the groove 101, the more difficult it is to fill the material of the first planarization layer 20. Therefore, as the depth of the groove 101 increases, the requirements for the fabrication process become more stringent, and those skilled in the art need to weigh the bending radius and fabrication process to select an appropriate groove 101 depth.

[0038] In this embodiment, the Young's modulus of the first planarization layer 20 is less than the Young's modulus of the substrate 10 (specifically, the first substrate 110 and the second substrate 130). Optionally, the Young's modulus of the first planarization layer 20 is greater than or equal to 0.1 GPa and less than or equal to 1 GPa. For example, the Young's modulus of the first planarization layer 20 is 0.1 GPa, 0.3 GPa, 0.5 GPa, 0.7 GPa, or 1 GPa. This reduces the hardness of the conductive layer 30 near the substrate 10, which is beneficial for the stress-neutral layer to move towards the conductive layer 30. Furthermore, to ensure that the material of the first planarization layer can fill the groove 101, the material of the first planarization layer 20 needs to have a low viscosity. Optionally, the viscosity of the first planarization layer 20 is greater than or equal to 1 cps and less than or equal to 5 cps. For example, the viscosity of the first planarization layer 20 is 1 cps, 2 cps, 3 cps, 4 cps, or 5 cps. Thus, when the material of the first planarization layer 20 is coated, the material has good leveling properties and can easily flow into the groove 101 and fill the groove 101, so that the surface of the first planarization layer 20 has good flatness. In the subsequent preparation of the conductive layer 30, it is more conducive to the deposition of the conductive layer 30, the conductive layer 30 has better flatness, and it is not easy to break.

[0039] Currently, the first planarization layer 20 is typically cured at high temperatures (e.g., around 200°C). High temperatures can affect the previously formed film. Therefore, to reduce the impact of temperature on the previously formed film, the material of the first planarization layer 20 includes low-temperature curing (e.g., below 130°C) materials or UV-curing materials. In this embodiment, the material of the first planarization layer 20 includes organic materials. Optionally, the material of the first planarization layer 20 includes at least one of polyimide, acrylic, or epoxy resins, as long as it meets the aforementioned Young's modulus and viscosity requirements.

[0040] In this embodiment, the first film layer 40 includes at least one of the second planarization layer 410, the pixel definition layer 420, and the spacer layer 430. Figure 8 This is a cross-sectional structural diagram of a display panel provided in another embodiment of this application. For example... Figure 8 As shown, the first film layer 40 includes a second planarization layer 410, a pixel definition layer 420 and a spacer layer 430, which are sequentially stacked along the direction away from the substrate 10.

[0041] In the prior art, limited by existing materials (e.g., the first planarization layer 20, the second planarization layer 410, and the pixel definition layer 420 are typically photosensitive polyimide), the material, thickness, and stacking order of each film layer cannot be arbitrarily adjusted or changed. The first film layer 40, especially the pixel definition layer 420, has relatively small strain and is easily damaged during bending. In this embodiment, because a groove 101 is provided on the substrate 10, the first planarization layer 20 fills the groove 101. The first planarization layer 20 has a low Young's modulus, causing the stress-neutral layer to move towards the conductive layer 30 until it reaches the conductive layer 30. In some cases, at least one of the first film layers 40 can also be made of a material with a lower Young's modulus. Optionally, the Young's modulus of at least one of the first film layers 40 is greater than or equal to 0.1 GPa and less than or equal to 1 GPa. Specifically, the Young's modulus of the second planarization layer 410 is greater than or equal to 0.1 GPa and less than or equal to 1 GPa; and / or, the Young's modulus of the pixel definition layer 420 is greater than or equal to 0.1 GPa and less than or equal to 1 GPa; and / or, the Young's modulus of the spacer layer 430 is greater than or equal to 0.1 GPa and less than or equal to 1 GPa. Exemplarily, the Young's modulus of at least one of the first film layers 40 (e.g., the second planarization layer 410, the pixel definition layer 420, and / or the spacer layer 430) is 0.1 GPa, 0.3 GPa, 0.5 GPa, 0.7 GPa, 0.9 GPa, or 1 GPa.

[0042] Optionally, the strain of at least one of the first film layers 40 (e.g., the second planarization layer 410, the pixel definition layer 420, and / or the spacer layer 430) is greater than or equal to 10% and less than or equal to 30%. For example, the strain of at least one of the first film layers 40 (e.g., the second planarization layer 410, the pixel definition layer 420, and / or the spacer layer 430) is 10%, 15%, 20%, 25%, or 30%. During bending, the first film layer 40 is located outside the bend of the conductive layer 30. When the stress neutral layer is located on the conductive layer 30, the first film layer 40 will be subjected to greater tensile stress. If the first film layer 40 is made of a material with a larger strain, tensile loss can be avoided. Optionally, the closer to the outside of the bend, the greater the strain of the material. For example, the strain of the second planarization layer 410 is less than the strain of the pixel definition layer 420, and the strain of the pixel definition layer 420 is less than the strain of the spacer layer 430. In some embodiments, to simplify the fabrication process, the second planarization layer 410, the pixel definition layer 420, and the spacer layer 430 may be made of the same material and all have high strain to avoid tensile damage.

[0043] In this embodiment, at least one layer of the first film layer 40 (e.g., the second planarization layer 410, the pixel definition layer 420, and / or the spacer layer 430) is made of a low-temperature curing material or a UV-curing material. This avoids the impact of high-temperature curing on the previously formed film layer. Optionally, the material of at least one layer of the first film layer 40 (e.g., the second planarization layer 410, the pixel definition layer 420, and / or the spacer layer 430) includes at least one of polyimide, acrylic, or epoxy resins, as long as the Young's modulus and strain requirements described above are met.

[0044] This application also provides a method for manufacturing a display panel, which has a display area and a non-display area at least partially surrounding the display area. The non-display area includes a bending area and a bonding area located on at least one side of the display area. The method for manufacturing the display panel includes: forming a substrate on a substrate, wherein a groove is provided on the substrate, and the groove is at least located in the bending area; forming a first planarization layer on the side of the substrate away from the substrate, the first planarization layer including a first portion filling the groove and a second portion not filling the groove, wherein the height of the first portion is greater than the depth of the groove along a direction perpendicular to the substrate; forming a conductive layer on the side of the first planarization layer away from the substrate, wherein at least a portion of the conductive layer is located in the bending area; and forming a first film layer on the side of the conductive layer away from the substrate, wherein at least a portion of the first film layer is located in the bending area. In this embodiment, a groove is formed on the substrate of the bending region, i.e., the substrate of the bending region is thinned, and the groove is filled with the material of the first planarization layer. Since the Young's modulus of the first planarization layer material is less than that of the substrate material, the stress-neutral layer can move towards the conductive layer. By reasonably setting the depth of the groove, the stress-neutral layer can be located in the conductive layer. In this way, the conductive layer can be prevented from breaking during bending, and the conductive layer will not break even at a small bending radius. In addition, the filling height of the first planarization layer is higher than the depth of the groove, which can prevent the subsequently prepared conductive layer from breaking due to excessive step difference at the groove boundary, thus ensuring the flatness of the conductive layer deposition.

[0045] Figure 9 This is a schematic flowchart illustrating a method for manufacturing a display panel according to an embodiment of this application. Figure 9 As shown, the preparation method includes the following steps.

[0046] Step S910: A substrate is formed on the substrate.

[0047] In this embodiment, a groove is provided on the substrate, and the groove is located at least in the bending region. Optionally, the substrate includes a rigid substrate, such as glass.

[0048] Optionally, forming a substrate on a substrate includes: sequentially forming a first substrate, a barrier layer, and a second substrate on the substrate; and in the bending region, etching at least one groove in the second substrate from the side away from the substrate to form a groove, thereby obtaining the substrate. In embodiments of this application, if only a portion of the second substrate in the bending region is etched, the bottom wall of the groove is located within the second substrate. If the second substrate in the bending region is completely etched, the bottom wall of the groove is located at the interface between the second substrate and the barrier layer. If the barrier layer in the bending region is completely etched, the bottom wall of the groove is located within the barrier layer. If a portion of the first substrate in the bending region is etched, the bottom wall of the groove is located within the first substrate.

[0049] Step S920: A first planarization layer is formed on the side of the substrate away from the substrate.

[0050] In this embodiment of the application, the first planarization layer includes a first portion filled with a groove and a second portion unfilled with a groove. Along the direction perpendicular to the substrate, the height of the first portion is greater than the depth of the groove.

[0051] In this embodiment, a coating process is used to coat a first organic material onto the side of the substrate facing away from the substrate, resulting in a first planarization layer. When coating the first organic material, a uniform coating speed can be used, and the first organic material fills the grooves. Since the coating machine moves at a uniform speed, the coating thickness is approximately the same at different locations. At the groove locations, the first organic material mainly fills the grooves, so the surface of the first part facing away from the substrate is lower than the surface of the second part facing away from the substrate; that is, the distance from the surface of the first part facing away from the substrate to the substrate is less than the distance from the surface of the second part facing away from the substrate to the substrate. In this case, to ensure that the step difference between the first part and the second part is not too large, a first organic material with low viscosity and good leveling properties can be selected. In other embodiments, the coating of the first organic material can also be non-uniform. For example, a first speed can be used in the groove area, and a second speed can be used in other areas, with the first speed being less than the second speed. This ensures that the first organic material fully fills the grooves and that the step difference between the first part and the second part is not too large, ensuring the smoothness of the subsequent conductive layer deposition.

[0052] In some embodiments, when preparing the first planarization layer, it is also necessary to pattern the first planarization layer. For example, vias may be formed on the first planarization layer located in the display area so that the subsequently prepared conductive layer can be electrically connected to the underlying conductive layer through the vias. Another example is to etch away a portion of the first planarization layer located in the non-display area to prevent moisture from entering the display area through the first planarization layer, and the etching may form a dam-like portion.

[0053] In step S930, a conductive layer is formed on the side of the first planarization layer away from the substrate.

[0054] In this embodiment, at least a portion of the conductive layer is located in the bending region. In this embodiment, a metal material is deposited on the side of the first planarization layer opposite to the substrate, and the metal material is patterned to form the conductive layer. The conductive layer includes multiple metal traces.

[0055] Step S940: A first film layer is formed on the side of the conductive layer away from the substrate.

[0056] In this embodiment, at least a portion of the first film layer is located in the bending region. In this embodiment, the first film layer includes at least one of a second planarization layer, a pixel definition layer, and a spacer layer. Optionally, the first film layer includes a second planarization layer, a pixel definition layer, and a spacer layer sequentially stacked along a direction away from the substrate. Forming the first film layer on the side of the conductive layer away from the substrate includes: sequentially forming the second planarization layer, the pixel definition layer, and the spacer layer on the side of the conductive layer away from the substrate. Specifically, when preparing the second planarization layer, it is patterned; for example, vias are formed on the second planarization layer located in the display area to facilitate the subsequent electrical connection of the anode to the conductive layer through the vias. Alternatively, a portion of the second planarization layer located in the non-display area is etched away to prevent moisture from entering the display area through the second planarization layer, and the etched portion can form a dam. When preparing the pixel definition layer, the pixel definition layer located in the display area encloses multiple pixel openings to facilitate the formation of light-emitting devices within the pixel openings. It should be noted that the anode of the light-emitting device is prepared before the pixel definition layer is prepared; the anode preparation step is omitted here.

[0057] Optionally, the preparation method further includes: peeling off the substrate after the first film layer is prepared.

[0058] This application embodiment also provides a display module, specifically as follows: Figure 10 As shown, the display module includes a display panel, a support layer 50, a buffer layer 60, and a raising block 70. The display panel is the same as in the above embodiment, with the bonding area NA2 of the display panel bent to the non-light-emitting side of the display panel.

[0059] A support layer 50 is located on the side of the substrate 10 opposite to the first planarization layer 20. The support layer 50 includes a first sub-support portion 510 and a second sub-support portion 520. The first sub-support portion 510 is located at least in the display area AA, and the second sub-support portion 520 is located in the bonding area NA2. The support layer 50 is used to support the display panel. A buffer layer 60 is located between the first sub-support portion 510 and the second sub-support portion 520. The buffer layer 60 includes copper foil, foam, and mesh adhesive stacked sequentially, providing heat dissipation and impact resistance. A shim 70 is located between the buffer layer 60 and the second sub-support portion 520. In this embodiment, the shim 70 includes double-sided adhesive for bonding the bonding area NA2 to the non-light-emitting side of the display panel.

[0060] like Figure 10 As shown, the display panel also includes an organic adhesive layer 100, located in the bending region NA1 and on the side of the first film layer 40 facing away from the substrate 10. In this embodiment, if the stress neutral layer of the display panel is located on the side of the conductive layer 30 close to the substrate 10, the organic adhesive layer 100 can be disposed on the side of the first film layer 40 facing away from the substrate 10, adjusting the stress neutral layer to be located in the conductive layer 30. The thickness of the organic adhesive layer 100 in this embodiment is less than the thickness of the organic adhesive layer 100 in the prior art, which is beneficial for reducing the bending radius and achieving a narrow bezel. Optionally, if the stress neutral layer of the display panel is located in the conductive layer 30, the organic adhesive layer 100 can be omitted, which can further reduce the bending radius and achieve a narrow bezel.

[0061] Optionally, the display panel also includes an optical adhesive layer 80 and a cover plate 90 located on the side of the first film layer 40 away from the substrate 10, wherein the optical adhesive layer 80 and the cover plate 90 are stacked sequentially in a direction away from the substrate 10.

[0062] This application provides a display device, which includes the display panel or display module described in the above embodiments.

[0063] Figure 11 This is a schematic diagram of the structure of a display device provided in an embodiment of this application. Figure 11 As shown, display device 1100 is a product with image display function. For example, display device 1100 can be used to display static images, such as pictures or photographs. Display device 1100 can also be used to display moving images, such as videos.

[0064] Display device 1100 may be a laptop, mobile phone, handheld or portable computer, camera, camcorder, in-vehicle smart central control screen, calculator, smartwatch, GPS navigator, electronic photo, electronic billboard or sign, projector, etc.

[0065] The display device 1100 includes the display panel and the display module provided in any of the above embodiments. The display panel may be an organic light-emitting diode display panel or a quantum dot electroluminescent display panel.

[0066] In addition, the display device 1100 can also perform functions such as taking photos, recording videos, fingerprint recognition, and facial recognition. Accordingly, the display device 1100 also includes at least one functional module for implementing the above functions, such as an under-display camera or an under-display fingerprint recognition sensor.

[0067] The basic principles of this application have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this application are merely examples and not limitations, and should not be considered as essential features of each embodiment of this application. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the application to the necessity of employing the aforementioned specific details for implementation.

[0068] The block diagrams of devices, apparatuses, devices, and systems involved in this application are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, devices, and systems can be connected, arranged, and configured in any manner. Words such as “comprising,” “including,” “having,” etc., are open-ended terms meaning “including but not limited to,” and are used interchangeably with them. The terms “or” and “and” as used herein refer to the terms “and / or,” and are used interchangeably with them unless the context clearly indicates otherwise. The term “such as” as used herein refers to the phrase “such as but not limited to,” and is used interchangeably with it.

[0069] It should also be noted that in the apparatus, equipment, and methods of this application, the components or steps can be disassembled and / or recombined. These disassemblies and / or recombinations should be considered as equivalent solutions of this application.

[0070] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use this application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein can be applied to other aspects without departing from the scope of this application. Therefore, this application is not intended to be limited to the aspects shown herein, but rather to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0071] The above description has been given for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of this application to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

[0072] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A display panel, characterized in that, The display panel includes a display area and a non-display area at least partially surrounding the display area, the non-display area including a bent area and a bonding area located on at least one side of the display area, the bonding area being located on the side of the bent area opposite to the display area. A substrate extending from the display area to the bonding area, wherein a groove is provided on the substrate, and the groove is located at least in the bending area; A first planarization layer is located on one side of the substrate. The first planarization layer extends from the display area to the bonding area. The first planarization layer includes a first portion that fills the groove and a second portion that does not fill the groove. Along a direction perpendicular to the substrate, the height of the first portion is greater than the depth of the groove. A conductive layer is located on the side of the first planarization layer opposite to the substrate, and at least a portion of the conductive layer is located in the bending region; A first film layer is located on the side of the conductive layer opposite to the substrate, and at least a portion of the first film layer is located in the bending region.

2. The display panel according to claim 1, characterized in that, Along the direction perpendicular to the base, the height of the first portion is greater than the sum of the depth of the groove and a first preset value; Preferably, the first preset value includes 1 μm; Preferably, along a direction parallel to the base, the width of the groove is greater than or equal to the width of the bending area; Preferably, the depth of the groove is greater than or equal to 2 μm and less than or equal to 9 μm.

3. The display panel according to claim 1, characterized in that, The distance from the surface of the first portion facing away from the substrate to the substrate is less than or equal to the distance from the surface of the second portion facing away from the substrate to the substrate.

4. The display panel according to claim 1, characterized in that, The substrate includes a first substrate, a barrier layer, and a second substrate stacked sequentially. At least a portion of the second substrate is located between the barrier layer and the first planarization layer. The bottom wall of the groove is located in the second substrate, or at the interface between the second substrate and the barrier layer, or in the barrier layer, or in the first substrate.

5. The display panel according to claim 1, characterized in that, The Young's modulus of the first planarization layer is less than that of the substrate; Preferably, the Young's modulus of the first planarization layer is greater than or equal to 0.1 GPa and less than or equal to 1 GPa; and / or, the viscosity of the first planarization layer is greater than or equal to 1 cps and less than or equal to 5 cps. Preferably, the material of the first planarization layer includes a low-temperature curing material or a UV-curing material; Preferably, the material of the first planarization layer includes an organic material; Preferably, the material of the first planarization layer includes at least one of polyimide, acrylic, or epoxy.

6. The display panel according to claim 5, characterized in that, The first film layer includes at least one of a second planarization layer, a pixel definition layer, and a spacer layer; Preferably, the first film layer includes a second planarization layer, a pixel definition layer, and a spacer layer sequentially stacked along a direction away from the substrate; Preferably, at least one of the first film layers has a Young's modulus greater than or equal to 0.1 GPa and less than or equal to 1 GPa; Preferably, the strain of at least one of the first film layers is greater than or equal to 10% and less than or equal to 30%; Preferably, at least one layer of the first film layer comprises a low-temperature curing material or an ultraviolet curing material.

7. A method for manufacturing a display panel, characterized in that, The display panel has a display area and a non-display area at least partially surrounding the display area, the non-display area including a bending area and a bonding area located on at least one side of the display area, and the method for manufacturing the display panel includes: A substrate is formed on a base plate, and a groove is provided on the substrate, the groove being at least located in the bending region; A first planarization layer is formed on the side of the substrate away from the substrate. The first planarization layer includes a first portion that fills the groove and a second portion that does not fill the groove. Along the direction perpendicular to the substrate, the height of the first portion is greater than the depth of the groove. A conductive layer is formed on the side of the first planarization layer away from the substrate, and at least a portion of the conductive layer is located in the bending region; A first film layer is formed on the side of the conductive layer opposite to the substrate, and at least a portion of the first film layer is located in the bending region.

8. The method for manufacturing a display panel according to claim 7, characterized in that, The step of forming a first planarization layer on the side of the substrate opposite to the substrate includes: A first organic material is coated onto the side of the substrate opposite to the substrate using a coating process to obtain the first planarization layer. Preferably, forming a substrate on the substrate includes: sequentially forming a first substrate, a barrier layer, and a second substrate on the substrate; in the bending region, etching at least one groove on the second substrate from the side away from the substrate to form the substrate, thereby obtaining the substrate, wherein the bottom wall of the groove is located in the second substrate, or at the interface between the second substrate and the barrier layer, or in the barrier layer, or in the first substrate.

9. A display module, characterized in that, include: The display panel according to any one of claims 1 to 6, wherein the bonding area of ​​the display panel is bent to the non-light-emitting side of the display panel; A support layer is located on the side of the substrate opposite to the first planarization layer. The support layer includes a first sub-support portion and a second sub-support portion. The first sub-support portion is located at least in the display area, and the second sub-support portion is located in the bonding area. A buffer layer is located between the first sub-support portion and the second sub-support portion; A raised block is located between the buffer layer and the second sub-support; An organic adhesive layer is located in the bending area and on the side of the first film layer opposite to the substrate.

10. A display device, characterized in that, It includes the display panel as described in any one of claims 1 to 6, or the display module as described in claim 9.

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