Display module and display device

Abstract

The application relates to a display module and a display device, which comprise a display panel, a heightening structure and sealing glue. The display panel comprises a display area and a non-display area surrounding the display area. The non-display area comprises a first frame area, a bending area and a binding area. The first frame area is located on one side of the display area in a first direction. The binding area is located on the back of the display panel. The bending area connects the binding area and the first frame area. The heightening structure is located on the back of the display panel and is used for fixing the binding area on the display panel. The sealing glue is located in the non-display area. The sealing glue surrounds the display area on the back of the display panel and covers the bending area, the binding area and the heightening structure. The width of the heightening structure in a second direction is greater than that of the binding area. In the first direction, the heightening structure exceeds the sealing glue on the side towards the center of the display panel. The second direction intersects the first direction. The display module and the display device have excellent vacuum glue injection performance and low manufacturing cost.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display module and display device. Background Technology

[0002] With the increasing pursuit of ultra-narrow bezels and thin and light designs in smartphones, low-temperature vacuum encapsulation (LIPO) technology has become a key technology for flexible display panel packaging. LIPO achieves screen fixation and sealing through encapsulation, improving durability and aesthetics. However, the presence of shims in the bending areas of flexible display panels creates vertical discontinuities, leading to gaps during encapsulation. This affects the vacuum environment, adhesive filling effect, and adhesion strength, and may even cause adhesive overflow, damaging the screen's appearance and functionality.

[0003] Existing technology reduces gaps by applying dammed adhesive to the side edges of the raised block, but this method increases the application process and leads to higher production costs. Summary of the Invention

[0004] Therefore, it is necessary to provide a display module and display device to address the problems in the prior art where the gap space caused by the vertical discontinuity of the raised block affects the LIPO glue injection effect and the increased manufacturing cost due to the design of the dammed glue.

[0005] To achieve the above objectives, this application provides a display module, comprising:

[0006] A display panel includes a display area and a non-display area surrounding the display area. The non-display area includes a first border area, a bending area, and a bonding area. The first border area is located on one side of the display area in a first direction. The bonding area is located on the back of the display panel. The bending area connects the bonding area and the first border area.

[0007] A raised structure is located on the back of the display panel, and the raised structure is used to fix the bonding area to the display panel;

[0008] A sealant is located in the non-display area, the sealant surrounds the display area on the back of the display panel, and covers the bending area, the bonding area, and the raised structure;

[0009] Wherein, the width of the shim structure in the second direction is greater than the width of the bonding area in the second direction, and in the first direction, the side of the shim structure toward the center of the display panel extends beyond the side of the sealant toward the center of the display panel, and the second direction intersects with the first direction.

[0010] In one embodiment, the raised structure is a single-layer structure.

[0011] Optionally, the raised structure includes double-sided adhesive.

[0012] In one embodiment, the distance between the two ends of the bolster structure in the second direction and the corresponding ends of the binding area in the second direction ranges from 0.1 mm to 1 mm.

[0013] In one embodiment, the width of the side of the bolster structure furthest from the display panel in the second direction is greater than the width of the side of the bolster structure closest to the display panel in the second direction.

[0014] In one embodiment, the raised structure includes at least two raised layers, the width of the at least two raised layers gradually increasing in the second direction from the direction away from the display panel to the direction closer to the display panel;

[0015] Optionally, the padding layer includes double-sided adhesive.

[0016] In one embodiment, the bolster structure further includes at least one support substrate, the support substrate being located at least between two adjacent bolster layers;

[0017] Optionally, the supporting substrate includes at least one of polyimide, polyacetylimide, and polyethylene terephthalate.

[0018] In one embodiment, the width of the support substrate in the second direction lies between the widths of the two adjacent pad layers in the second direction;

[0019] Optionally, the material of the support substrate includes a heat-dissipating material, and / or the material of the support substrate includes a conductive material, and the support substrate is grounded and electrically connected to the bonding area.

[0020] In one embodiment, the raised structure further includes a functional layer;

[0021] Optionally, the functional layer is located between two adjacent pad layers;

[0022] Optionally, the functional layer includes a conductive material layer, and / or the functional layer includes a heat dissipation material layer;

[0023] Optionally, both ends of the shim structure in the second direction extend beyond both ends of the binding area in the second direction;

[0024] Optionally, the two ends of the bolster structure in the second direction extend by the same distance beyond the corresponding ends of the binding area in the second direction.

[0025] In one embodiment, the display module further includes an anti-fouling coating located on a portion of the surface of the raised structure that extends beyond the bonding area in the second direction;

[0026] Optionally, the display module further includes a cover plate structure disposed on the light-emitting side of the display panel;

[0027] Optionally, a circuit board, including a flexible circuit board, is also electrically connected to the bonding area.

[0028] Optionally, a driver chip is also electrically connected to the binding area.

[0029] On the other hand, this application also provides a display device, which includes a display module as described in any of the above embodiments.

[0030] The aforementioned display module and display device, by setting a raised structure on the back of the display panel, and fixing the bonding area to the display panel with the raised structure, and making the width of the raised structure in the second direction greater than the width of the bonding area in the second direction, and in the first direction, the side of the raised structure facing the center of the display panel exceeds the side of the sealant facing the center of the display panel, effectively reduces the gap space between the bonding area and the display panel during the LIPO glue injection process, thereby improving the vacuum performance of the LIPO glue injection process, increasing the fullness of glue filling, avoiding glue overflow problems caused by the discontinuity of the raised structure, making the screen edges smoother and the appearance more beautiful, further enhancing the market competitiveness of the product, and eliminating the need for additional dispensing processes, thereby reducing the complexity and cost of screen manufacturing, simplifying the production process, and the design of the raised structure also ensures the bending accuracy of the display panel, enhances the overall structural stability of the display module, and reduces screen deformation or damage caused by bending or external pressure. Furthermore, in some embodiments, by setting the padding structure to include at least two layers of padding layers stacked sequentially, and the width of the at least two padding layers gradually increases in the second direction from the direction away from the display panel to the direction closer to the display panel, the width of the padding structure in the second direction achieves a gradient design with a buffer function, making the glue filling more full. This further optimizes the glue filling effect in the LIPO vacuum glue filling process, and also improves the problem of foreign matter and lint adhering to the exposed surface of the padding structure by flexibly controlling the size of the padding layers away from the display panel. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1 This is a schematic diagram of the structure of a display module provided in one embodiment;

[0033] Figure 2 Provided in one embodiment Figure 1 A schematic diagram of the cross-sectional structure of the display module along the AA direction;

[0034] Figure 3 This is a schematic diagram of a portion of the structure of a display module provided in one embodiment;

[0035] Figure 4 Provided in one embodiment Figure 3 A schematic diagram of the cross-sectional structure of the display module along the BB direction;

[0036] Figure 5 This is a schematic diagram of another structure of a display module provided in one embodiment;

[0037] Figure 6 Provided in one embodiment Figure 5 A schematic diagram of the cross-sectional structure of the display module along the BB direction.

[0038] Explanation of reference numerals in the attached figures:

[0039] 1-Display panel, 11-Display area, 12-Non-display area, 13-First frame area, 14-Bending area, 15-Binding area, 16-Second frame area, 17-Third frame area, 18-Fourth frame area, 2-Elevation structure, 21-Elevation layer, 22-Support substrate, 3-Sealant, 4-Circuit board, 5-Driver chip, 6-Cover structure, 61-Cover layer, 62-Light shielding layer, 63-Polarizing layer, 64-Adhesive layer. Detailed Implementation

[0040] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings, which illustrate embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this application will be thorough and complete.

[0041] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0042] It should be understood that when an element or layer is referred to as "on," "adjacent to," "connected to," or "coupled to" other elements or layers, it may be directly on, adjacent to, connected to, or coupled to other elements or layers, or there may be intervening elements or layers. Conversely, when an element is referred to as "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" other elements or layers, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc., may be used to describe various elements, components, regions, layers, doping types, and / or portions, these elements, components, regions, layers, doping types, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer, doping type, or portion from another element, component, region, layer, doping type, or portion. Therefore, without departing from the teachings of this invention, the first element, component, region, layer, doping type, or portion discussed below may be referred to as a second element, component, region, layer, or portion.

[0043] Spatial relation terms such as “below,” “under,” “below,” “under,” “above,” “above,” etc., are used herein to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms also include different orientations of the device in use and operation. For example, if the device in the figure is flipped, the element or feature described as “below,” “under,” or “below” will be oriented “above” the other element or feature. Therefore, the exemplary terms “below” and “under” can include both above and below orientations. Furthermore, the device may also include other orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptive terms used herein will be interpreted accordingly.

[0044] When used herein, the singular forms of “a,” “an,” and “the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising / including” or “having,” etc., specify the presence of the stated features, wholes, steps, operations, components, parts, or combinations thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof. Meanwhile, in this specification, the term “and / or” includes any and all combinations of the associated listed items.

[0045] Please see Figure 1In one embodiment, this application provides a display module, including: a display panel 1, a raised structure 2, and a sealant 3. The display panel 1 includes a display area 11 and a non-display area 12 surrounding the display area 11. The non-display area 12 includes a first border area 13, a bending area 14, and a bonding area 15. The first border area 13 is located on one side of the display area 11 in a first direction, the bonding area 15 is located on the back side of the display panel 1, and the bending area 14 connects the bonding area 15 and the first border area 13. The raised structure 2 is located on the back side of the display panel 1 (i.e., the side of the display panel 1 that is not light-emitting). The shim structure 2 is used to fix the bonding area 15 to the display panel 1; the sealant 3 is located in the non-display area 12, and the sealant 3 surrounds the display area 11 on the back of the display panel 1, and covers the bending area 14, the bonding area 15 and the shim structure 2; wherein, the width of the shim structure 2 in the second direction is greater than the width of the bonding area 15 in the second direction, and in the first direction, the side of the shim structure 2 facing the center of the display panel 1 extends beyond the side of the sealant 3 facing the center of the display panel 1, and the second direction intersects the first direction, optionally, the second direction intersects the first direction perpendicularly.

[0046] In the above example, the bonding area 15 is fixed to the display panel 1 by setting the shim structure 2. The width of the shim structure 2 in the second direction is greater than the width of the bonding area 15 in the second direction. In the first direction, the side of the shim structure 2 facing the center of the display panel 1 exceeds the side of the sealant 3 facing the center of the display panel 1. This effectively reduces the gap space between the bonding area 15 and the display panel 1 during the LIPO glue injection process, thereby optimizing the vacuum performance in the low-temperature vacuum glue injection process, improving the fullness of glue filling, avoiding glue overflow problems caused by gaps, achieving a narrow screen bezel design, making the screen edge flatter and the appearance more beautiful, further enhancing the market competitiveness of the product, and eliminating the need for additional glue dispensing process, thereby reducing the complexity and cost of screen manufacturing, simplifying the production process, and the shim structure 2 can also ensure the bending accuracy of the display panel 1, enhance the overall structural stability of the display module, and reduce screen deformation or damage caused by bending or external pressure. Furthermore, in some embodiments, by setting the padding structure 2 to include at least two layers of padding height 21 stacked sequentially, and the width of at least two padding height 21 gradually increases in the second direction from the direction away from the display panel 1 to the direction closer to the display panel 1, the width of the padding structure 2 in the second direction achieves a gradient design with a buffer function, making the glue filling more full. This further optimizes the glue filling effect in the LIPO vacuum glue filling process, and also optimizes the problem of foreign matter and lint adhesion on the exposed surface of the padding structure 2 by flexibly controlling the size of the padding height 21 away from the display panel 1.

[0047] For example, at least a portion of the display panel 1 is bendable. The display panel 1 can be a flexible organic light-emitting diode (OLED). For example, CN118251982A, CN115666161A, CN116648095A, CN117062489A, CN118678742A, CN118785761A, CN115224220A, CN118678729A, CN118660529A, and CN118660589A record relevant content about the display panel 1 and can be used for reference. The display panel 1 can also be other types of display panels and is not limited to the flexible OLED of the embodiments of this application. The flexible OLED has a higher degree of design freedom and can further reduce the width of the non-display area 12 through folding or bending design.

[0048] Optionally, the display panel 1 includes an array substrate (not shown), a light-emitting functional layer (not shown), and an encapsulation layer (not shown) stacked sequentially. The array substrate is used to support the entire display panel 1 and provide electrical control for the pixel array. The light-emitting functional layer includes an organic light-emitting layer and a pixel definition layer. The organic light-emitting layer is used to realize the light-emitting function of the display panel 1. The pixel definition layer is used to separate and define the light-emitting area of ​​each pixel to prevent light crosstalk. The encapsulation layer is used to protect the light-emitting functional layer from the influence of the external environment.

[0049] The display area 11 is the core part of the display panel 1, used to display images and videos. The non-display area 12 is the area surrounding the display area 11, mainly used to house other functional components of the display panel 1, such as driving circuits, signal connections, and protective structures. By reducing the width of the non-display area 12, a higher screen-to-body ratio and a narrow bezel design for the display panel 1 can be achieved.

[0050] The first bezel area 13 is located on one side of the display area 11 in the first direction and is used to accommodate the bent portion of the display panel 1 to hide the driving circuit, signal connection, or protection structure. The non-display area 12 also includes a second bezel area 16 located on the other side of the display area 11 in the first direction, and a third bezel area 17 and a fourth bezel area 18 located on both sides of the display area 11 in the second direction. The second bezel area 16, the third bezel area 17, and the fourth bezel area 18 are typically used to accommodate additional driving circuits, sensors, or signal connections to further optimize signal connections.

[0051] For example, please refer to Figure 2By bending the display panel 1 toward the side opposite to the light-emitting surface of the display panel 1, a bonding area 15 located on the back of the display panel 1 and a bending area 14 connecting the bonding area 15 and the first bezel area 13 can be obtained. The bending area 14 should ensure a stable and reliable electrical connection between the bent display panel 1 and the bonding area 15, provide sufficient mechanical strength to prevent damage or deformation during bending, and ensure that signal transmission in the bending area is not affected, maintaining the normal operating performance of the display panel 1. Therefore, the structural design, material selection, and manufacturing process of the bending area 14 can be selected according to the actual situation to ensure the performance and reliability of the bending area 14 in terms of physical bending, electrical connection, and mechanical strength. The bonding area 15 is used to lead the signals of the display panel 1 to the external circuit to realize communication between the display panel 1 and external devices. Therefore, by placing the bonding area 15 on the back of the display panel 1 (i.e., the side of the display panel 1 opposite to the light-emitting surface), signal communication can be realized on the side of the display panel 1 opposite to the light-emitting surface, enabling a narrower bezel design.

[0052] In one embodiment, a circuit board 4 is also electrically connected to the bonding area 15. The circuit board 4 is used for electrical connection, signal transmission, and mechanical support of the display panel 1. Optionally, the circuit board 4 includes a flexible circuit board. The flexible circuit board has good flexibility and bendability, making it suitable for display panels 1 that require bending designs.

[0053] In one embodiment, a driver chip 5 is also electrically connected to the bonding area 15. The driver chip 5 is used to perform signal conversion and display driving of the display panel 1. The bonding area 15 integrates the driver chip 5 with the circuit board 4 and the display panel 1, thereby realizing the efficient and reliable display function of the display panel 1.

[0054] In one embodiment, in a third direction (i.e., along the thickness direction of the display module), the display module further includes a cover plate structure 6 disposed on the light-emitting side of the display panel 1, the third direction being perpendicular to both the first and second directions. The cover plate structure 6 can prevent external objects from directly contacting and scratching the display panel 1, improving the durability of the display panel 1. The cover plate structure 6 also reduces light reflection, improving the display effect. In addition, the cover plate structure 6 can provide additional mechanical support to prevent the display panel 1 from deforming or being damaged due to external pressure.

[0055] Exemplarily, the cover structure 6 includes a cover layer 61 and a light-shielding layer 62. The light-shielding layer 62 is located at the inner edge of the cover layer 61 in a first direction. The material of the cover layer 61 includes glass, plastic, sapphire glass, or other suitable materials. The cover layer 61 can be designed as a curved surface to adapt to different device shapes and functional requirements. The cover layer 61 can be multi-layered to provide better protection and optical performance. The cover layer 61 can also be coated with an anti-reflective coating to reduce light reflection and improve display effect, which can be selected according to actual conditions. The light-shielding layer 62 is used to shield the circuit, adhesive, or sensor openings at the edge of the display module. It prevents light leakage at the edge of the display panel and improves display contrast. The light-shielding layer 62 includes a layer of black ink or other suitable light-shielding material.

[0056] Exemplarily, the cover plate structure 6 also includes a polarizing layer 63 and an adhesive layer 64. In the third direction, the polarizing layer 63 and the adhesive layer 64 are stacked between the display panel 1 and the cover plate layer 61. The polarizing layer 63 is used to suppress ambient light reflection, block stray light, enhance display contrast and color purity, and in some scenarios, a privacy polarizing film can be used to limit the viewing angle and prevent side-viewing peeping. The polarizing layer 63 includes an anti-reflective coating or other suitable functional coating. The adhesive layer 64 is used to fill the air gap between the display panel 1 and the cover plate layer 61, reduce interface reflection, absorb stress caused by mechanical shock or thermal expansion differences, prevent the cover plate layer 61 from cracking, and ensure that the layers are tightly bonded, avoiding displacement or delamination. The material of the adhesive layer 64 includes optically transparent adhesive, which can be selected according to the actual optical requirements of the display module.

[0057] In one embodiment, the bonding area 15 is further folded and hidden behind the display panel 1. While ensuring smooth signal connection, a sealant 3 is formed by injecting a low-temperature vacuum encapsulation process into the non-display area 12 and the area surrounding the display area 11, covering the bending area 14, the bonding area 15, and the raised structure 2 on the back of the display panel 1. The sealant 3 surrounding the display area 11 on the back of the display panel 1 forms a closed sealing area, preventing external substances (such as moisture and dust) from entering the display area 11. This protects the display area 11 of the display panel 1 from the influence of the external environment. At the same time, the sealant 3 surrounding the display area 11 is equivalent to filling the gap. The second bezel area 16, the third bezel area 17, and the fourth bezel area 18, which occupy the non-display area 12, further reduce the bezel width of the second bezel area 16, the third bezel area 17, and the fourth bezel area 18; the sealant 3 covering the bending area 14, the bonding area 15, and the area of ​​the raised structure 2 further protects the display area 11 of the display panel 1 and prevents the display panel 1 from being damaged. At the same time, it can also replace the extra buffer space between the cover structure 6 and the display panel 1 in the first direction in the prior art by flexibly designing the injection precision, further reducing the bezel width at the first bezel area 13, and realizing the narrow bezel display design.

[0058] Optionally, the sealant 3 covers the side of the raised structure 2 near the bending area 14 in the first direction, and also covers both sides of the bending area 14 in the first direction. Therefore, the sealant 3 can fully replace the additional buffer space between the cover structure 6 and the display panel 1 in the first direction in the prior art, thereby reducing the bezel width at the first bezel area 13.

[0059] For example, sealant 3 includes epoxy, acrylic, or other suitable UV-curable materials. It can be rapidly cured by UV irradiation, making it suitable for mass production. The cured sealant 3 has good optical transparency and durability, and its viscosity and hardness can be adjusted as needed to meet different sealing requirements.

[0060] Furthermore, it should be noted that the sealant 3 is made by using liquid adhesive to flow into the target filling area through a customized mold, and then curing and demolding. Therefore, in the bending space between the bonding area 15 and the display panel 1, the structural design of the shim structure 2 will affect the sealing of the adhesive flow channel of the mold. Therefore, by adjusting the structure of the shim structure 2, the vacuum performance of the injection process can be improved, avoiding adhesive overflow, which would result in poor injection quality and failure to meet the process requirements of low-temperature vacuum injection process.

[0061] Furthermore, the design of the raised structure 2 in this application is applicable to conventional display panels 1, as well as display panels 1 that have undergone performance optimization and improvement, such as display panels 1 with significantly improved resolution and contrast through pixel arrangement optimization and packaging technology improvement, display panels 1 with thinner and lighter weights through integrated driving circuit and packaging structure optimization, and display panels 1 with significantly improved durability and lifespan through packaging technology and bending area optimization.

[0062] For example, the shim structure 2 is used to fix the bonding area 15 to the display panel 1, ensuring a tight fit between the bonding area 15 and the display panel 1. The shim structure 2 can ensure the bending accuracy of the display panel 1, enhance the overall structural stability of the display module, and reduce screen deformation or damage caused by bending or external pressure. By adjusting the thickness of the shim structure 2, the bending radius of the bending area 14 can be precisely adjusted. Therefore, the thickness of the shim structure 2 (here, the thickness refers to the thickness of the shim structure 2 in the third direction) can be adjusted according to the actual bending requirements of the display panel 1 to adapt to different bending accuracy requirements.

[0063] In one embodiment, see Figure 3 and Figure 4The raised structure 2 is a single-layer structure. Based on the bending accuracy requirements of the display panel 1, by setting a single-layer raised structure 2 with a target thickness and setting the width of the raised structure 2 in the second direction to be greater than the width of the bonding area 15 in the second direction, the glue injection process can be improved.

[0064] Optionally, the raised structure 2 includes double-sided adhesive. Double-sided adhesive has strong adhesion, is suitable for various surfaces, and is flexible enough to adapt to certain bending and deformation. Therefore, double-sided adhesive can provide excellent adhesion performance, ensuring a tight fit between the bonding area 15 and the display panel 1, guaranteeing the fixing effect of the bonding area 15, and improving the mechanical stability of the display module. Furthermore, double-sided adhesive can provide a uniform sealing effect, ensuring that the sealant 3 is evenly distributed during the application process. The materials of the double-sided adhesive include acrylic, silicone, or other suitable adhesive materials.

[0065] In one embodiment, when the raised structure 2 extends beyond the bonding area 15 at both ends in the second direction, i.e., when the raised structure 2 is a single-layer structure, the portions of the raised structure 2 extending beyond the corresponding ends of the bonding area 15 in the second direction can reduce the glue injection gap between the bonding area 15 and the display panel 1. This provides a buffer during the glue injection process, further optimizes the glue injection process, makes the glue filling more complete, and reduces glue overflow. At the same time, compared with the existing point-setting damming glue process, no additional process is required, simplifying the process flow and reducing process costs.

[0066] Optionally, the two ends of the shim structure 2 extend equidistantly beyond the corresponding ends of the bonding area 15 in the second direction. This allows for a symmetrical distribution of the adhesive path during the injection process, ensuring uniform distribution of the sealant 3 and improving sealing reliability. Furthermore, the equidistant extension of the shim structure 2 beyond the bonding area 15 in the second direction provides uniform support for the bonding area 15, preventing deformation or displacement of the bonding area 15 due to uneven pressure during injection.

[0067] It should be noted that, in order to meet the light emission performance and glue injection performance of the display panel 1, the distances of the two ends of the shim structure 2 beyond the bonding area 15 in the second direction are not equal, and can be selected according to actual needs.

[0068] In one embodiment, the distance between the two ends of the raised structure 2 in the second direction and the corresponding ends of the bonding area 15 in the second direction ranges from 0.1mm to 1mm. The bending accuracy directly affects the distance range between the raised structure 2 and the bonding area 15; higher bending accuracy allows for a smaller allowable distance range. By precisely controlling the distance between the raised structure 2 and the two ends of the bonding area 15 in the second direction, it is possible to ensure that the bonding area 15 maintains a stable relative position during bending, avoiding poor contact due to displacement. Furthermore, the portion of the raised structure 2 extending beyond the bonding area 15 in the second direction can be precisely controlled based on the bending accuracy and the amount of adhesive applied, ensuring uniform adhesive application. When the raised structure 2 is a single-layer structure, precisely controlling the distance between the raised structure 2 and the two ends of the bonding area 15 in the second direction also allows control over the amount of dust and impurities adhering to the exposed surface of the portion of the raised structure 2 extending beyond the bonding area 15 in the second direction.

[0069] In one embodiment, the display module further includes an anti-fouling coating (not shown) located on the surface of the raised structure 2 extending beyond the bonding area 15 in the second direction. Exemplarily, the anti-fouling coating includes a hydrophobic coating, an oleophobic coating, an antistatic coating, a nano-coating, or other suitable coatings with special surface treatment. Therefore, when the raised structure 2 is a single-layer structure, by further providing an anti-fouling coating on the portion of the raised structure 2 extending beyond the bonding area 15 in the second direction, it is possible to further prevent dust from adsorbing onto the exposed portion of the raised structure 2, thereby avoiding any impact on the performance of the display panel 1.

[0070] In one embodiment, when the shim structure 2 is a single-layer structure, the cross-sectional shape of the shim structure 2 in the second direction includes a rectangle. The rectangular cross-sectional shape, while satisfying the function of providing glue injection cushioning, is more in line with the current process, is simple to obtain, and has a relatively low cost.

[0071] In one embodiment, the width of the side of the raised structure 2 furthest from the display panel 1 in the second direction is greater than the width of the side of the raised structure 2 closest to the display panel 1 in the second direction. Therefore, when the raised structure 2 is a single-layer structure, further process design, such as designing the two end sidewalls of the raised structure 2 to be inclined in the second direction, can further optimize the glue injection gap and provide buffering for the glue injection process. When the raised structure 2 is a single-layer structure, optionally, the shape of the two end sidewalls of the raised structure 2 in the second direction includes a straight line, an arc, a stepped shape, or other suitable shapes.

[0072] In another embodiment, please refer to Figure 5 and Figure 6The raised structure 2 includes at least two raised layers 21. The width of the at least two raised layers 21 gradually increases in the second direction from the direction away from the display panel 1 to the direction closer to the display panel 1. By designing the raised structure 2 as a multi-layered stacked raised layer 21 with progressively increasing widths in the second direction, the flow of the sealant 3 during the injection process can be gradually guided, ensuring that the sealant 3 is evenly filled into the area requiring sealing. This provides a buffer design for the injection process, further optimizing the injection process and quality.

[0073] Furthermore, when the padding structure 2 is designed as a multi-layer stacked padding layer 21, the difference between the width of the padding layer 21 furthest from the display panel 1 in the second direction and the width of the bonding area 15 in the second direction can be flexibly controlled. This can improve the problem of foreign matter and lint adhering to the exposed surface of the padding structure 2. For example, while ensuring improved glue injection performance, by reducing the difference between the width of the padding layer 21 furthest from the display panel 1 in the second direction and the width of the bonding area 15 in the second direction, it can be ensured that the amount of foreign matter adhering to the exposed surface of the portion of the padding structure 2 whose width in the second direction exceeds the width of the bonding area 15 in the second direction does not affect the performance of the display panel 1.

[0074] Optionally, both ends of each pad height 21 extend beyond both ends of the binding area 15 in the second direction. Furthermore, the distance by which both ends of each pad height 21 extend beyond the corresponding ends of the binding area 15 in the second direction is the same.

[0075] In another embodiment, the display module further includes an anti-fouling coating located on the surface of the raised structure 2 extending beyond the bonding area 15 in the second direction. Therefore, when the raised structure 2 includes at least two raised layers 21, by further providing an anti-fouling coating on the portion of the raised layers 21 extending beyond the bonding area 15 in the second direction, it is possible to further prevent the exposed portion of the raised structure from adsorbing foreign matter, thereby avoiding any impact on the performance of the display module. Exemplarily, the anti-fouling coating includes a hydrophobic coating, an oleophobic coating, an antistatic coating, a nano-coating, or other suitable coatings with special surface treatments, which can be selected according to actual needs.

[0076] Optionally, the padding layer 21 includes double-sided adhesive. Double-sided adhesive has strong adhesion, is suitable for various surfaces, and is flexible enough to adapt to certain bending and deformation. Therefore, double-sided adhesive can provide excellent adhesion performance, ensuring a tight fit between the bonding area 15 and the display panel 1, guaranteeing the fixing effect of the bonding area 15, and improving the mechanical stability of the display module. Furthermore, double-sided adhesive can also provide a uniform sealing effect, ensuring that the sealant 3 is evenly distributed during the injection process. It can also ensure the stability of the support substrate 22 and / or functional layer when subsequently placed between adjacent padding layers 21.

[0077] In one embodiment, when the raised structure 2 includes at least two raised layers 21, the cross-sectional shape of the raised layer 21 in the second direction includes a rectangle. The rectangular cross-sectional shape is more in line with the current process while satisfying the function of providing injection cushioning. For example, in the current process, the raised structure 2 is generally obtained by punching. Therefore, the raised structure 2 with a rectangular cross-sectional shape, especially when the raised structure 2 is a multi-layered design, is simpler and easier to obtain without incurring excessive costs.

[0078] In one embodiment, the raised structure 2 further includes at least one supporting substrate 22, which is located between at least two adjacent raised layers 21. The supporting substrate 22 located between two adjacent raised layers 21 can enhance the overall stability of the raised structure 2, ensure a tight fit between the bonding area 15 and the display panel 1, and provide additional mechanical support for the raised structure 2 to prevent deformation or displacement caused by pressure during the glue injection process.

[0079] Optionally, the support substrate 22 may include at least one of polyimide, polyacetylimide, and polyethylene terephthalate. In other words, a material with certain mechanical strength, flexibility, durability and compatibility with the display panel 1 may be selected as the support substrate 22 according to the actual situation.

[0080] In one embodiment, the width of the support substrate 22 in the second direction is located between the widths of the two adjacent padding layers 21 in the second direction, which enables the padding structure 2 to have a buffering function in the width in the second direction, making the glue filling more full and further optimizing the glue filling effect in the vacuum glue filling process.

[0081] For example, the cross-sectional shape of the support substrate 22 in the second direction includes a rectangle, not only because the padding layer 21 with a rectangular cross-sectional shape is simpler and more readily available, but also because the support substrate 22 with a rectangular cross-sectional shape is more compatible with the rectangular design of the padding layer 21, and is suitable for the multi-layer buffer design of the padding structure 2.

[0082] In another embodiment, the material of the support substrate 22 includes a heat-dissipating material, and / or the material of the support substrate 22 includes a conductive material, and the support substrate 22 is grounded and electrically connected to the bonding area 15. That is, the support substrate 22 can not only provide mechanical support, but also integrate heat dissipation and conductivity functions to significantly improve the performance and reliability of the display panel 1.

[0083] For example, the heat dissipation material is used to effectively conduct and dissipate the heat generated by the display panel 1 during operation, preventing performance degradation or damage due to overheating, maintaining stable performance of the display panel 1, and extending the service life of the display panel 1. The heat dissipation material includes graphene, copper, aluminum, thermally conductive adhesive, or other suitable heat dissipation materials.

[0084] For example, conductive material is used to provide electrical connections, ensuring stable electrical performance of display panel 1. Furthermore, grounding and electrically connecting the conductive material to bonding area 15 also enables electromagnetic interference protection and electrostatic discharge protection. Conductive materials include conductive adhesive, copper, aluminum, or other suitable conductive materials.

[0085] Therefore, by using materials including heat-dissipating and conductive materials in the support substrate 22, the performance and reliability of the display panel 1 can be significantly improved. It should be noted that the heat-dissipating and conductive materials can be integrated into a single design. This multi-functional integrated design reduces the need for additional components and optimizes the structural design of the display panel 1. Alternatively, heat-dissipating or conductive materials can be designed separately, depending on actual needs.

[0086] In one embodiment, the raised structure 2 further includes a functional layer (not shown) to provide additional performance optimizations. The functional layer can provide a variety of functions, including electrical conductivity and heat dissipation, to optimize the performance and reliability of the display panel 1.

[0087] Optionally, the functional layer is located between two adjacent raised structures 21 to provide uniform functional support. Thus, the functional layer can be designed only in the raised structure 2 to meet the functional requirements of the display panel 1.

[0088] Optionally, the functional layer is located between the raised platform 21 and the supporting substrate 22. That is, the supporting substrate 22 and the functional layer can be designed in the raised structure 2 at the same time. Through the flexible design of the raised structure 2, the performance optimization and flexible selection of the raised structure can be achieved.

[0089] Optionally, the functional layer includes a conductive material layer, and / or a heat dissipation material layer. The conductive material layer provides electrical connections to ensure stable electrical performance of the display panel, and is grounded and electrically connected to the bonding area 15 to achieve electromagnetic interference protection and electrostatic discharge protection. The conductive material layer includes conductive adhesive, copper, aluminum, or other suitable conductive materials. The heat dissipation material layer effectively conducts and dissipates heat generated by the display panel 1 during operation, preventing performance degradation or damage due to overheating, maintaining stable performance of the display panel 1, and extending its lifespan. The heat dissipation material layer includes graphene, copper, aluminum, thermally conductive adhesive, or other suitable heat dissipation materials. It should be noted that the heat dissipation material layer and the conductive material layer can be integrated into a single design. This multi-functional integrated design reduces the need for additional components and optimizes the structural design of the display panel 1. Alternatively, the heat dissipation material layer or the conductive material layer can be designed separately, depending on actual needs.

[0090] In another embodiment, this application also provides a display device, including a display module as described in any of the above embodiments. The display device provided in this application has the technical effects of the display module in any of the above embodiments, such as achieving a higher screen-to-body ratio, a narrower bezel design, and more reliable performance. The explanations of the same or corresponding structures and terms as in the above embodiments will not be repeated here.

[0091] The display device provided in this application has a wide range of applications and can be used in a variety of electronic products with display functions. For example, the display device provided in this application can be used in mobile phones, or in any electronic product with display functions, including but not limited to the following categories: televisions, laptops, desktop monitors, tablets, digital cameras, smart bracelets, smart glasses, automotive displays, medical devices, industrial control equipment, touch interactive terminals, etc., using display panels 1 with ultra-narrow bezel low-temperature vacuum encapsulation technology. This application does not impose any special limitations on these categories.

[0092] In the description of this specification, references to terms such as "some embodiments," "other embodiments," and "ideal embodiments" indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative descriptions of the above terms do not necessarily refer to the same embodiments or examples.

[0093] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features of the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0094] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A display module, characterized by include: A display panel includes a display area and a non-display area surrounding the display area. The non-display area includes a first border area, a bending area, and a bonding area. The first border area is located on one side of the display area in a first direction. The bonding area is located on the back of the display panel. The bending area connects the bonding area and the first border area. A raised structure is located on the back of the display panel, and the raised structure is used to fix the bonding area to the display panel; A sealant is located in the non-display area, the sealant surrounds the display area on the back of the display panel, and covers the bending area, the bonding area, and the raised structure; Wherein, the width of the shim structure in the second direction is greater than the width of the bonding area in the second direction, and in the first direction, the side of the shim structure toward the center of the display panel extends beyond the side of the sealant toward the center of the display panel, and the second direction intersects with the first direction.

2. The display module of claim 1, wherein, The raised structure is a single-layer structure. Optionally, the raised structure includes double-sided adhesive.

3. The display module according to claim 2, characterized in that, The distance between the two ends of the bolster structure in the second direction and the corresponding ends of the binding area in the second direction ranges from 0.1mm to 1mm.

4. The display module according to claim 1, characterized in that, The width of the side of the shim structure furthest from the display panel in the second direction is greater than the width of the side of the shim structure closest to the display panel in the second direction.

5. The display module according to claim 1, characterized in that, The raised structure includes at least two raised layers, and the width of the at least two raised layers gradually increases in the second direction from the direction away from the display panel to the direction closer to the display panel; Optionally, the padding layer includes double-sided adhesive.

6. The display module according to claim 5, characterized in that, The raised structure also includes at least one supporting substrate, which is located between two adjacent raised layers; Optionally, the supporting substrate includes at least one of polyimide, polyacetylimide, and polyethylene terephthalate.

7. The display module according to claim 6, characterized in that, The width of the supporting substrate in the second direction lies between the widths of the two adjacent pad layers in the second direction; Optionally, the material of the support substrate includes a heat-dissipating material, and / or the material of the support substrate includes a conductive material, and the support substrate is grounded and electrically connected to the bonding area.

8. The display module according to claim 5, characterized in that, The raised structure also includes a functional layer; Optionally, the functional layer is located between two adjacent pad layers; Optionally, the functional layer includes a conductive material layer, and / or the functional layer includes a heat dissipation material layer; Optionally, both ends of the shim structure in the second direction extend beyond both ends of the binding area in the second direction; Optionally, the two ends of the bolster structure in the second direction extend by the same distance beyond the corresponding ends of the binding area in the second direction.

9. The display module according to claim 1, characterized in that, The display module also includes an anti-fouling coating, which is located on the portion of the surface of the raised structure that extends beyond the bonding area in the second direction; Optionally, the display module further includes a cover plate structure disposed on the light-emitting side of the display panel; Optionally, a circuit board, including a flexible circuit board, is also electrically connected to the bonding area. Optionally, a driver chip is also electrically connected to the binding area.

10. A display device, characterized in that, The display device includes the display module as described in any one of claims 1 to 9.

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