Display module, display device and preparation method of display module

Abstract

The application provides a display module, a display device and a preparation method of the display module. The display module comprises: a display panel, a connecting area is arranged on the light-emitting side of the display panel; a driving chip, the driving chip is arranged on the light-emitting side of the display panel, the driving chip is located in the connecting area and is electrically connected with the display panel through the connecting area; a supporting film, the supporting film is located on the backlight side of the display panel, the light-emitting side and the backlight side are oppositely arranged in a first direction; and an adhesive layer, the adhesive layer is located between the display panel and the supporting film, the display panel and the supporting film are connected through the adhesive layer, the adhesive layer comprises a high-crosslinking area and at least one low-crosslinking area, the high-crosslinking area and the at least one low-crosslinking area do not overlap, the low-crosslinking area is located at the periphery of the high-crosslinking area, the crosslinking degree of the high-crosslinking area is greater than that of the at least one low-crosslinking area, and the high-crosslinking area and the driving chip are correspondingly arranged in the first direction. The problem of screen body wire fracture is solved.

Description

Technical Field

[0001] This invention relates to the field of electronic product technology, and specifically to a display module, a display device, and a method for manufacturing the display module. Background Technology

[0002] With the development of display technology, flexible screens have gradually come into people's view. Flexible screens are made using flexible substrate materials and thin-film electronic devices, achieving the flexibility of the screen body. When applied to electronic products, bending the screen body can achieve narrow bezels and increase the screen-to-body ratio.

[0003] In related technologies, to support and protect flexible screens, a support film is typically placed on the non-display side of the flexible screen, and the support film is connected to the non-display side of the screen body using adhesive. Existing adhesives generally use PSA adhesive, which increases its impedance by adding rubber-based resins to acrylic resin-type adhesives.

[0004] However, rubber is difficult to crosslink under normal conditions and can only partially copolymerize with acrylic resin. This results in limited room for increasing the crosslinking density of the entire PSA adhesive, which prevents the high-temperature modulus of the adhesive from being increased. During COP high-temperature bonding, the deformation of the adhesive causes the screen traces to deform and break, resulting in display defects. Summary of the Invention

[0005] In view of this, the present invention aims to provide a display module, a display device, and a method for manufacturing the display module, so as to solve the problem of broken screen traces in related technologies.

[0006] This invention provides a display module, comprising: a display panel, wherein a connection area is provided on the light-emitting side of the display panel; a driving chip, wherein the driving chip is disposed on the light-emitting side of the display panel, the driving chip is located in the connection area, and is electrically connected to the display panel through the connection area; a support film, wherein the support film is located on the backlight side of the display panel, and the light-emitting side and the backlight side are disposed opposite to each other in a first direction; and an adhesive layer, wherein the adhesive layer is located between the display panel and the support film, the display panel and the support film are connected by the adhesive layer, the adhesive layer comprising a highly cross-linked region and at least one low cross-linked region, the highly cross-linked region and at least one low cross-linked region do not overlap, the low cross-linked region is located on the periphery of the highly cross-linked region, the degree of cross-linking of the highly cross-linked region is greater than the degree of cross-linking of the at least one low cross-linked region, and the highly cross-linked region and the driving chip are disposed correspondingly in the first direction.

[0007] In one embodiment, a marker point is provided on the backlight side of the display panel, and the marker point is located outside the highly cross-linked region.

[0008] In one embodiment, the gelation rate of the highly cross-linked region is greater than or equal to 50%; and / or, the gelation rate of the low cross-linked region is less than or equal to 35%.

[0009] In one embodiment, the room temperature storage modulus of the highly cross-linked region is greater than 200 kPa; and / or, the room temperature storage modulus of the lowly cross-linked region is less than 170 kPa.

[0010] In one embodiment, the adhesive layer further includes a transition region located between a highly cross-linked region and at least one low cross-linked region, wherein the degree of cross-linking of the transition region gradually decreases in the direction from the highly cross-linked region to the low cross-linked region.

[0011] In one embodiment, the orthographic projection of the connection area on the backlight side of the display panel is located within the highly cross-linked region, and the area of ​​the connection area is less than or equal to the area of ​​the highly cross-linked region.

[0012] In one embodiment, the highly cross-linked region is formed by electron beam radiation or laser irradiation.

[0013] In one embodiment, the adhesive layer is formed by copolymerizing acrylic resin and rubber.

[0014] In another aspect, the present invention provides a display device, which includes the display module provided above.

[0015] In another aspect, the present invention provides a method for fabricating a display module, the method comprising: obtaining an adhesive layer and a support film, coating the adhesive layer onto the support film; irradiating the adhesive layer with an electron beam or a laser to form a highly cross-linked region; obtaining a display panel, attaching the support film to the backlight side of the display panel, such that the highly cross-linked region and the driving chip are correspondingly disposed in a first direction; or, the method comprising: obtaining an adhesive layer and a support film, coating the adhesive layer onto the support film; obtaining a display panel, attaching the support film to the backlight side of the display panel; irradiating the adhesive layer with an electron beam or a laser to form a highly cross-linked region, wherein the highly cross-linked region and the driving chip are correspondingly disposed in a first direction.

[0016] According to the technical solution of this invention, the display module includes a display panel, a driving chip, a support film, and an adhesive layer. The driving chip is disposed on the light-emitting side of the display panel, and the support film is disposed on the backlight side of the display panel. The display panel and the support film are connected by the adhesive layer. Since the adhesive layer includes a highly cross-linked region and at least one low-cross-linked region, and the degree of cross-linking of the highly cross-linked region is greater than that of the at least one low-cross-linked region, the highly cross-linked region and the at least one low-cross-linked region do not overlap. The highly cross-linked region and the driving chip are correspondingly disposed in a first direction. By setting the highly cross-linked region, the high-temperature modulus of the adhesive layer is improved. During COP bonding, the highly cross-linked region can remain stable at high temperatures and will not undergo physical deformation, thus ensuring the stability of the display panel and preventing physical deformation. This prevents the wiring in the connection area from breaking, avoiding display defects in the display module. Attached Figure Description

[0017] Figure 1The diagram shown is a schematic diagram of the structure of a display module provided in an embodiment of the present invention.

[0018] Figure 2 The image shown is a top view of a display module provided in an embodiment of the present invention.

[0019] Figure 3 The figure shown is an assembly diagram of a display panel and a support film provided in an embodiment of the present invention.

[0020] Figure 4 The diagram shown is a structural schematic of a display module provided in another embodiment of the present invention.

[0021] Figure 5 The image shown is a top view of a display module provided in another embodiment of the present invention.

[0022] Figure 6 The figure shown is an assembly diagram of the support film and adhesive layer provided in an embodiment of the present invention.

[0023] Figure 7 The diagram shown is another assembly diagram of the support film and adhesive layer provided in an embodiment of the present invention.

[0024] Figure 8 The diagram shows a flowchart of a method for preparing a display module according to an embodiment of the present invention.

[0025] Figure 9 The diagram shows a flowchart of a method for preparing a display module according to another embodiment of the present invention. Detailed Implementation

[0026] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0027] Figure 1 The diagram shown is a schematic diagram of the structure of a display module provided in an embodiment of the present invention. Figure 2 The image shown is a top view of a display module provided in an embodiment of the present invention. Figure 3 The diagram shown is an assembly diagram of a display panel and a support film according to an embodiment of the present invention. Figures 1 to 3As shown, an embodiment of the present invention provides a display module, which includes a display panel 10, a driving chip 20, a support film 30, and an adhesive layer 40. A connection area is provided on the light-emitting side of the display panel 10. The driving chip 20 is disposed on the light-emitting side of the display panel 10, located in the connection area, and electrically connected to the display panel 10 through the connection area. The support film 30 is located on the backlight side of the display panel 10, and the light-emitting side and the backlight side are disposed opposite each other in a first direction. The adhesive layer 40 is located between the display panel 10 and the support film 30, connecting the display panel 10 and the support film 30. The adhesive layer 40 includes a highly cross-linked region 41 and at least one low cross-linked region 42, which do not overlap. The low cross-linked region 42 is located on the outer periphery of the highly cross-linked region 41, and the degree of cross-linking of the highly cross-linked region 41 is greater than the degree of cross-linking of the at least one low cross-linked region 42. The highly cross-linked region 41 and the driving chip 20 are correspondingly disposed in the first direction.

[0028] According to the technical solution of this invention, the display module includes a display panel 10, a driving chip 20, a support film 30, and an adhesive layer 40. The driving chip 20 is disposed on the light-emitting side of the display panel 10, and the support film 30 is disposed on the backlight side of the display panel 10. The display panel 10 and the support film 30 are connected by the adhesive layer 40. Since the adhesive layer 40 includes a highly cross-linked region 41 and at least one low cross-linked region 42, and the degree of cross-linking of the highly cross-linked region 41 is greater than the degree of cross-linking of the at least one low cross-linked region 42, the highly cross-linked region 41 and the at least one low cross-linked region 42 do not overlap. The highly cross-linked region 41 and the driving chip 20 are correspondingly disposed in the first direction. By setting the highly cross-linked region 41, the high-temperature modulus of the adhesive layer 40 is improved. During COP bonding, the highly cross-linked region 41 can remain stable at high temperatures and will not undergo physical deformation, so that the display panel 10 can also remain stable and will not undergo physical deformation. Therefore, the wiring in the connection area will not break, avoiding display defects in the display module.

[0029] The first direction refers to the X direction in the attached diagram.

[0030] Crosslinking degree is an important parameter characterizing the degree of crosslinking in polymer chains. It is usually expressed as crosslinking density, the number-average molecular weight between two adjacent crosslinking points, or the number of moles of crosslinking points per cubic centimeter. It reflects the density of the crosslinked structure within the material and has a significant impact on the material's mechanical properties, thermal stability, and chemical stability. A higher degree of crosslinking generally results in higher mechanical strength and hardness. Furthermore, it improves the material's thermal stability; through crosslinking, resin molecules can be mutually constrained, making them less prone to decomposition and deformation at high temperatures. For example, highly crosslinked epoxy resins can maintain their properties at high temperatures without physical loss or chemical changes.

[0031] Of course, the higher the degree of cross-linking of a material, the more cross-linking points between polymer chains, and the lower the degree of freedom of the chain segments. Compared with materials with a low degree of cross-linking, its flowability is also poor. By utilizing the low cross-linking density of the low cross-linking region 42, it has good flowability and can form good adhesion performance under room temperature conditions, so as to attach the support film 30 to the backlight side of the display panel 10.

[0032] Furthermore, the curing time of the adhesive layer 40 can be reduced by using a partitioned cross-linking method, thereby improving production efficiency.

[0033] In some embodiments, the adhesive layer 40 is a PSA (Pressure Sensitive Adhesive) formed by copolymerizing acrylic resin and rubber. The acrylic resin, through high crosslinking modification, introduces crosslinking points, increasing the degree of crosslinking and significantly improving its physical properties, making the adhesive layer 40 less prone to deformation. The acrylic resin serves as the base material, providing the adhesive's basic adhesion and cohesive strength. By adding rubber-like resins to the acrylic resin base, the impedance of the pressure-sensitive adhesive can be increased, thereby enhancing the antistatic properties of the display module.

[0034] Pressure-sensitive adhesives (PSAs) are adhesives that are sensitive to pressure, quickly adhering to surfaces under slight pressure without the need for solvents, water, or heat activation. PSAs formed by copolymerizing acrylic resin and rubber, incorporating the rubber component, improve initial tack and holding power, resulting in rapid adhesion and resistance to detachment on various substrates. Furthermore, the excellent high-temperature resistance of acrylic and the excellent low-temperature resistance of rubber combine to maintain good tack over a wide temperature range. The weather resistance and oxidation resistance of acrylic provide excellent aging resistance, further enhanced by the addition of the rubber component.

[0035] In this application, the high crosslinking region 41 and at least one low crosslinking region 42 do not overlap, meaning that the high crosslinking region 41 and the low crosslinking region 42 have no overlapping areas. The high crosslinking region 41 is only provided for the driver chip 20. Furthermore, there can be one or more low crosslinking regions 42. In addition to the low crosslinking region 42 and the high crosslinking region 41, the adhesive layer 40 may also include a transition region 43. The transition region 43 can be used to connect the low crosslinking region 42 and the high crosslinking region 41, or it can be used to connect adjacent low crosslinking regions 42. The degree of crosslinking of the transition region 43 should be between the degree of crosslinking of the low crosslinking region 42 and the degree of crosslinking of the high crosslinking region 41.

[0036] COP (Chip On Pi) packaging technology is a screen packaging process mainly used in flexible OLED screens. By bending a portion of the display panel 10, the bezels are further reduced, achieving a near-bezel-less effect. Compared to traditional COG (Chip On Glass) and COF (Chip On Film), directly bending and packaging a portion of the display panel 10, integrating the screen cable and driver chip 20, can achieve a near-bezel-less effect.

[0037] The traces consist of multiple metal electrode lines arranged sequentially on the substrate of the display panel 10. In some areas, the metal electrode lines form connection zones. Generally, the driver chip 20 is electrically connected to the metal electrode lines via soldering. Since the substrate of the COP-packaged display panel 10 is a flexible substrate, when the adhesive layer 40 deforms at high temperatures, it will cause the flexible substrate it is bonded to to to deform, resulting in the metal electrode lines breaking due to deformation.

[0038] Specifically, the display panel 10 employing COP packaging technology includes a flexible display segment, a flexible bending segment, and a flexible support segment connected in sequence. The flexible bending segment causes bending, allowing the flexible support segment to fold over to the backlight side of the flexible display segment. The display module provided in the accompanying drawings is the display panel 10 before folding, and the support film 30 supports the flexible support segment and is located between the folded flexible display segment and the flexible support segment. The light-emitting side of the flexible display segment is the display surface viewed by the user.

[0039] Generally, a flexible substrate, a TFT array layer, a light-emitting layer, and other film layers are stacked sequentially on the light-emitting side of a display module. These other film layers can be polarizing layers, optical adhesive layers, and cover plates, which are used to protect the display module and improve the light emission effect.

[0040] The substrate, serving as the foundation of the display panel 10, possesses a certain degree of mechanical strength, supporting the TFT array layer, light-emitting layer, and other film layers. Simultaneously, the substrate must also possess excellent insulation properties to prevent short circuits and other abnormalities between different layers.

[0041] The TFT array layer, as a key control unit of the display panel 10, consists of numerous thin-film transistors, each corresponding to a pixel. By controlling the switching state of the transistors, the light-emitting or light-transmitting state of each pixel can be precisely controlled. Furthermore, the TFT array layer also plays a signal driving role, converting externally input image signals into electrical signals that can drive the pixels to emit or transmit light.

[0042] The light-emitting layer is a film layer in the display panel 10 that directly generates light. When the control current of the TFT array layer passes through the light-emitting layer, the light-emitting material emits light of different colors. By combining and controlling different light-emitting color materials, full-color display can be achieved.

[0043] The support film 30 can be made of polyimide. Polyimide films remain stable at high temperatures and possess excellent mechanical properties, including high tensile strength and good flexibility. They can withstand multiple bends without creases and are resistant to various chemicals, making them less susceptible to corrosion. This meets the requirements of high-temperature processes such as electrode film deposition and annealing in optoelectronic device manufacturing. Alternatively, lower-cost polyester films can be used. Polyester films offer good flexibility and plasticity, adapting to various curved shapes. Alternatively, ultra-thin glass, used in flexible displays, can be employed. Ultra-thin glass has higher light transmittance, providing better display effects. Furthermore, ultra-thin glass has higher hardness, making it more wear-resistant and heat-resistant, suitable for applications requiring high wear resistance. Other materials, such as composite materials or high-resistivity support film 30, can also be used.

[0044] like Figure 2 and Figure 5 As shown, a marker point 12 is provided on the backlight side of the display panel 10, and the marker point 12 is located outside the highly cross-linked region 41. Due to the overall increase in the cross-linking density of the highly cross-linked region 41, the adhesive layer 40 of the highly cross-linked region 41 has poor fluidity. By placing the marker point 12 outside the highly cross-linked region 41, it is possible to avoid the formation of air bubbles at the marker point 12 after the support film 30 is attached to the display panel 10.

[0045] The marker 12, also known as the Mark point, is a reference point used for optical positioning. It is pre-marked on the substrate of the display panel 10. The marker 12 is generally a raised metal mark, and its shape is not limited; it can be circular, cross-shaped, or other shapes. Because the marker 12 is generally a raised structure, if the flowability of the adhesive layer 40 is too poor when the support film 30 is attached, air will have difficulty escaping naturally at the marker 12, thus generating air bubbles.

[0046] In some embodiments, the marker point 12 is disposed within the low cross-linking region 42. The low cross-linking region 42 has good fluidity and low viscosity. By utilizing the low viscosity and good fluidity of the adhesive layer 40 in the low cross-linking region 42, gas can easily be discharged from the low cross-linking region 42 through its own flow, reducing the possibility of bubble formation, so that the adhesive layer 40 avoids the formation of bubbles at the marker point 12.

[0047] Furthermore, by avoiding reducing the risk of bubble generation at marker point 12, the identification of marker point 12 in subsequent processes can be reduced, thereby lowering the risk of grasping due to misidentification.

[0048] In some embodiments, the gelation rate of the highly cross-linked region 41 is greater than or equal to 50%. By adopting the above-mentioned gelation rate, the adhesive layer 40 has a higher degree of cross-linking in the highly cross-linked region 41, thereby improving its high-temperature modulus.

[0049] The gelation rate of the highly cross-linked region 41 can be 50%, 51%, 52%, 53%, 54%, 55%, or any value greater than or equal to 50%.

[0050] In some embodiments, the gelation rate of the low crosslinking region 42 is less than or equal to 35%. By adopting the above-mentioned gelation rate, the adhesive layer 40 has a lower degree of crosslinking in the low crosslinking region 42, which improves the fluidity of the adhesive layer 40 and enables the support film 30 to have a good adhesion effect to the display panel 10.

[0051] The gelation rate of the low cross-linking region 42 can be any value of 30%, 31%, 32%, 33%, 34%, 35%, or less than or equal to 35%.

[0052] In some embodiments, the room temperature storage modulus of the highly cross-linked region 41 is greater than 200 kPa. With the aforementioned room temperature storage modulus, the highly cross-linked region 41 of the adhesive layer 40 also has a high storage modulus at high temperatures, thus exhibiting high stability and being less prone to deformation.

[0053] Among them, the high-temperature storage modulus of the highly cross-linked region 41 is greater than 80 kPa.

[0054] Storage modulus, also known as energy storage modulus, is an indicator that measures a material's ability to store energy during elastic deformation, reflecting its rigidity and elastic properties. A higher storage modulus indicates greater rigidity and the ability to store more elastic energy. This allows the material to better maintain its shape under external forces, resist deformation, and quickly return to its original state after the force is removed.

[0055] In some embodiments, the room temperature storage modulus of the low crosslinking region 42 is less than 170 kPa. With the above-mentioned room temperature storage modulus, the low crosslinking region 42 of the adhesive layer 40 has good fluidity at high temperatures, which enables the support film 30 to have a good adhesion effect to the display panel 10.

[0056] Among them, the high-temperature storage modulus of the low cross-linking region 42 is less than 50 kPa.

[0057] The smaller the storage modulus, the better the flexibility and ductility of the material. It will not break under large deformation, so the flexible display module can withstand multiple bending and folding operations without deformation or breakage, and can still work normally, ensuring the service life of the display device.

[0058] Figure 4 The diagram shown is a structural schematic of a display module provided in another embodiment of the present invention. Figure 5 The image shown is a top view of a display module provided in another embodiment of the present invention. Figure 4 and Figure 5 As shown, the adhesive layer 40 also includes a transition region 43, which is located between the highly cross-linked region 41 and at least one low cross-linked region 42. The degree of cross-linking in the transition region 43 gradually decreases in the direction from the highly cross-linked region 41 to the low cross-linked region 42. By providing the transition region 43, abrupt changes in the degree of cross-linking between the highly cross-linked region 41 and the low cross-linked region 42 can be avoided, resulting in better continuity of the cross-linking degree of the adhesive layer 40 and improving its adhesive ability.

[0059] In some embodiments, the adhesive layer 40 includes a highly cross-linked region 41, a low cross-linked region 42, and a transition region 43, wherein the transition region 43 is disposed between the highly cross-linked region 41 and the low cross-linked region 42.

[0060] certainly, Figure 4 and Figure 5 This is only an example showing an adhesive layer 40 including a transition region 43. The specific number and area of ​​the low crosslinking region 42 and the transition region 43 should be determined according to the actual situation.

[0061] In some embodiments, the orthographic projection of the connection region on the backlight side of the display panel 10 is located within the highly cross-linked region 41, and the area of ​​the connection region is less than or equal to the area of ​​the highly cross-linked region 41. With the above configuration, during COP high-temperature bonding, the highly cross-linked region 41 can always correspond to the connection region, and the thermal stability of the highly cross-linked region 41 ensures that the substrate of the display panel 10 will not deform.

[0062] COP high-temperature bonding primarily integrates the driver chip 20 directly onto the flexible substrate of the display panel 10 using high temperature and pressure. During the high-temperature bonding process, high temperature and pressure are used to bond the gold bumps of the chip to the inner pins of the flexible substrate. A highly cross-linked region 41, with an area slightly larger than or equal to the connection area, corresponds to the connection area. During the high-temperature bonding process, the highly cross-linked region 41 has high thermal stability and will not deform at high temperatures. Consequently, the flexible substrate will not deform at high temperatures, and the wiring on the substrate will not break.

[0063] The highly cross-linked region 41 is formed by electron beam radiation or laser irradiation. Using electron beam or laser irradiation technology has the advantages of mature technology and high yield.

[0064] In some embodiments, such as Figure 6 and Figure 7 As shown, the adhesive layer 40 is directly coated on the support film 30, and a removable release film 31 is provided on the side of the adhesive layer 40 away from the support film 30. In use, the release film 31 is removed, and the support film 30 is bonded to the backlight side of the display panel 10 by the adhesive layer 40. The electron beam or laser irradiation process can be performed before or after the support film 30 is attached to the display panel 10.

[0065] In related technologies, the curing method of adhesive layer 40 uses an initiator to generate free radicals to open the double bonds of rubber and acrylic resin for cross-linking. However, the above method cannot produce cross-linking between rubbers, so the overall cross-linking degree of the pressure-sensitive adhesive cannot be improved.

[0066] In some embodiments, the highly cross-linked region 41 is formed using electron beam irradiation. Electron beam irradiation is a high-energy irradiation technique in which a high-energy electron beam generated by an accelerator acts on the material. When the high-energy electron beam irradiates the material, the energy of the electron beam causes the chemical bonds of the material molecules to break, generating free radicals. These free radicals can react with other molecules or free radicals to form new chemical bonds, thereby achieving intermolecular cross-linking.

[0067] Electron beam radiation can be achieved using an electron accelerator. The high-energy electron beam generated by the accelerator ionizes and excites the polymer chains, causing the chemical bonds of the material molecules to break and generate free radicals. Since free radicals are unstable, they can recombine with each other. The recombinated polymer chains become entangled with each other, forming a three-dimensional network structure, which improves the heat resistance and stability of the highly cross-linked region 41.

[0068] In some embodiments, the highly cross-linked region 41 is formed by laser irradiation. Laser irradiation is a high-energy physics technique that provides a high-energy-density beam of light. When applied to the material surface, it can induce the breaking and recombination of chemical bonds in the material molecules, forming a new cross-linked structure. By precisely controlling the laser energy, wavelength, power density, irradiation time, and irradiation method, a precisely defined highly cross-linked region 41 can be formed on the material surface.

[0069] Electron beam radiation or laser irradiation can activate rubber molecules in the rubber matrix, generating rubber macromolecular free radicals. These free radicals are highly reactive and can induce the breaking of rubber molecular chains, especially the opening of double bonds. These free radicals can further undergo cross-linking reactions with other rubber molecules or acrylic resins to form a three-dimensional network structure, thereby altering the molecular structure of the rubber and increasing the cross-linking density between rubber molecules.

[0070] It should be noted that, regardless of whether electron beam radiation or laser irradiation is used, since the area of ​​the highly cross-linked region 41 is smaller than that of the low cross-linked region 42, it is generally necessary to use process structural components to shield the areas that do not need to be irradiated so that the highly cross-linked region 41 can be formed in a specific area.

[0071] Compared to thermal radiation and light irradiation, electron beam radiation and laser irradiation offer higher energy density and more precise irradiation areas, causing the chemical bonds in material molecules to break and generate free radicals. Thermal radiation, due to its large irradiation area, results in less precise formation of the highly cross-linked region 41, affecting the area of ​​the low-cross-linked region 42 and consequently the adhesive performance of the adhesive layer 40. Light irradiation, with its lower energy density, cannot achieve the breaking of chemical bonds in material molecules to generate free radicals.

[0072] Figure 8 The diagram shows a flowchart of a method for manufacturing a display module according to an embodiment of the present invention. Figure 8 As shown, another embodiment of the present invention provides a display device, which includes the display module provided above. Since the adhesive layer 40 includes a highly cross-linked region 41 and at least one low cross-linked region 42, and the degree of cross-linking of the highly cross-linked region 41 is greater than the degree of cross-linking of the at least one low cross-linked region 42, the highly cross-linked region 41 and the at least one low cross-linked region 42 do not overlap. The highly cross-linked region 41 and the driving chip 20 are correspondingly disposed in the first direction. By setting the highly cross-linked region 41, the high-temperature modulus of the adhesive layer 40 is increased. During COP bonding, the highly cross-linked region 41 can remain stable at high temperatures and will not undergo physical deformation, thus ensuring that the display panel 10 also remains stable and does not undergo physical deformation. Therefore, the wiring in the connection area will not break, avoiding display defects in the display module.

[0073] Furthermore, by utilizing the low cross-linking density of the low cross-linking region 42, it has good fluidity and can form good adhesion performance under room temperature conditions, so as to attach the support film 30 to the backlight side of the display panel 10.

[0074] Figure 9 The diagram shows a flowchart of a method for manufacturing a display module according to another embodiment of the present invention. Figure 9 As shown, another embodiment of the present invention provides a method for manufacturing a display module, the method comprising the following steps.

[0075] Obtain the adhesive layer 40 and the support film 30, and coat the adhesive layer 40 onto the support film 30.

[0076] By using the above steps, by coating the adhesive layer 40 onto the support film 30, the support film 30 can be used to support the adhesive layer 40 and prepare for the subsequent formation of the highly cross-linked region 41.

[0077] The adhesive layer 40 is irradiated with an electron beam or laser to form a highly cross-linked region 41.

[0078] By using the above steps, a highly cross-linked region 41 can be formed in a specific area of ​​the adhesive layer 40 by electron beam or laser irradiation, corresponding to the connection area of ​​the display panel 10, in preparation for subsequent COP high-temperature bonding.

[0079] It should be noted that after the adhesive layer 40 is coated onto the support film 30, a release film 31 is generally attached to the side of the adhesive layer 40 away from the support film 30. The release film 31 enables controllable separation from the adhesive layer 40. After the release film 31 is attached, the support film 30 is generally prepared in roll form. In use, it is cut to the appropriate size according to the actual dimensions to form a support film sheet. The cut support film sheet is then irradiated with an electron beam or laser to form a highly cross-linked region 41.

[0080] Therefore, when irradiating the adhesive layer 40 with an electron beam or laser, the irradiation can be performed from the support film 30 side or from the release film 31 side. After the highly cross-linked region 41 is formed, the release film 31 needs to be removed so that the support film 30 can be attached to the display panel 10 through the adhesive layer 40.

[0081] Obtain the display panel 10, attach the support film 30 to the backlight side of the display panel 10, and arrange the highly cross-linked area 41 and the driving chip 20 in a corresponding manner in the first direction.

[0082] By using the above steps, the support film 30 is attached to the display panel 10 using the adhesive layer 40, and the highly cross-linked region 41 corresponds to the driving chip 20. During COP high-temperature bonding, the flexible substrate of the display panel 10 is prevented from deforming, thereby preventing the metal electrode lines from breaking.

[0083] Another embodiment of the present invention provides a method for preparing a display module. The difference between the preparation method of this embodiment and the preparation method of the above embodiment is that, after the step of obtaining the adhesive layer 40 and the support film 30 and coating the adhesive layer 40 onto the support film 30, the preparation method includes the following steps.

[0084] Take the display panel 10 and attach the support film 30 to the backlight side of the display panel 10. By attaching the support film 30 to the display panel 10, the display panel 10 can be supported by the support film 30, and preparation can be made for the subsequent formation of the highly crosslinked region 41.

[0085] The adhesive layer 40 is irradiated with an electron beam or laser to form a highly cross-linked region 41, which is correspondingly disposed with the driving chip 20 in the first direction. By using the above steps, a highly cross-linked region 41 can be formed in a specific area of ​​the adhesive layer 40 by irradiation with an electron beam or laser. During COP high-temperature bonding, deformation of the flexible substrate of the display panel 10 is avoided, thereby preventing the metal electrode lines from breaking.

[0086] It should be noted that, in this embodiment, since the support film 30 is pre-attached to the display panel 10, when using electron beam or laser irradiation, the adhesive can only be irradiated by irradiating the support film 30 side.

[0087] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0088] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following figures denote similar items; therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0089] In the description of this invention, it should be understood that the orientation or positional relationship indicated by directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" is generally based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this invention and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this invention; the directional terms "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself.

[0090] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0091] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore should not be construed as limiting the scope of protection of this invention.

[0092] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A display module, characterized in that, The display module includes: The display panel has a connection area on its light-emitting side; A driver chip is disposed on the light-emitting side of the display panel, the driver chip is located in the connection area, and is electrically connected to the display panel through the connection area; A support film is provided, located on the backlight side of the display panel, wherein the light-emitting side and the backlight side are disposed opposite to each other in a first direction; An adhesive layer is located between the display panel and the support film, and the display panel and the support film are connected by the adhesive layer. The adhesive layer includes a highly cross-linked region and at least one low cross-linked region. The highly cross-linked region and at least one low cross-linked region do not overlap. The low cross-linked region is located on the periphery of the highly cross-linked region. The degree of cross-linking of the highly cross-linked region is greater than the degree of cross-linking of at least one low cross-linked region. The highly cross-linked region and the driving chip are correspondingly arranged in the first direction.

2. The display module according to claim 1, characterized in that, The backlight side of the display panel is provided with marking points, which are located outside the highly cross-linked region.

3. The display module according to claim 1, characterized in that, The gelation rate of the highly cross-linked region is greater than or equal to 50%; and / or, the gelation rate of the low cross-linked region is less than or equal to 35%.

4. The display module according to claim 1, characterized in that, The room temperature storage modulus of the highly cross-linked region is greater than 200 kPa; and / or, the room temperature storage modulus of the low cross-linked region is less than 170 kPa.

5. The display module according to claim 1, characterized in that, The adhesive layer further includes a transition region located between the highly cross-linked region and at least one of the low cross-linked regions, wherein the degree of cross-linking of the transition region gradually decreases in the direction from the highly cross-linked region to the low cross-linked region.

6. The display module according to claim 1, characterized in that, The orthographic projection of the connection area on the backlight side of the display panel is located within the highly cross-linked region, and the area of ​​the connection area is less than or equal to the area of ​​the highly cross-linked region.

7. The display module according to claim 1, characterized in that, The highly cross-linked region is formed by electron beam radiation or laser irradiation.

8. The display module according to claim 1, characterized in that, The adhesive layer comprises an acrylic and rubber copolymer pressure-sensitive adhesive.

9. A display device, characterized in that, The display device includes the display module according to any one of claims 1 to 8.

10. A method for manufacturing a display module, characterized in that, The preparation method includes: obtaining an adhesive layer and a support film; coating the adhesive layer onto the support film; irradiating the adhesive layer with an electron beam or laser to form a highly cross-linked region; obtaining a display panel; attaching the support film to the backlight side of the display panel, such that the highly cross-linked region and the driving chip are correspondingly arranged in a first direction; or, The preparation method includes: obtaining an adhesive layer and a support film, coating the adhesive layer onto the support film; obtaining a display panel, attaching the support film to the backlight side of the display panel; irradiating the adhesive layer with an electron beam or a laser to form a highly cross-linked region, wherein the highly cross-linked region and the driving chip are correspondingly arranged in a first direction.

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