Support plate assembly, display module and preparation method of support plate assembly

Abstract

The application discloses a support plate assembly, a display module and a preparation method of the support plate assembly. The support plate assembly is used for a display panel and comprises at least two layers of support plates, the support plates comprise support fibers, the at least two layers of support plates comprise a first support plate and a second support plate, the first support plate comprises a plurality of first support fibers, the second support plate comprises a plurality of second support fibers, and a conductive structure is arranged between the first support plate and the second support plate, the conductive structure comprises a conductive part, the conductive part extends along a thickness direction, and the first support fibers, the second support fibers and the conductive part are in contact and conduct with each other. The conductive structure is arranged between the first support plate and the second support plate, the support fibers are in contact with the conductive part and conduct with each other, the conductive performance along the thickness direction between the first support plate and the second support plate is improved, the static electricity can be effectively conducted between the first support plate and the second support plate, the uneven brightness of some display areas is reduced, and the performance and reliability are improved.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to a support plate assembly, a display module, and a method for preparing the support plate assembly. Background Technology

[0002] Carbon fiber is widely used in the display panel industry due to its excellent properties such as light weight, high strength, and good stiffness. However, carbon fiber sheets have significant shortcomings in conductivity. This problem is particularly prominent in the back support components of foldable screen displays. The insufficient conductivity of carbon fiber sheets in certain directions affects the rapid conduction of static electricity, and the accumulation of charge leads to uneven brightness in some areas of the display device.

[0003] Therefore, the performance of current foldable screen products needs to be improved. Summary of the Invention

[0004] This application provides a method for preparing a support plate assembly, a display module, and a support plate assembly, which can improve the conductivity of the carbon fiber plate along the thickness direction, effectively conduct static electricity, reduce uneven brightness in some display areas, and further improve performance and reliability.

[0005] In a first aspect, embodiments of this application provide a support plate assembly for a display panel, comprising: at least two support plates, each support plate including support fibers; the at least two support plates including a first support plate and a second support plate; the first support plate including a plurality of first support fibers arranged side-by-side along a first direction, each first support fiber extending along a second direction; the second support plate including a plurality of second support fibers arranged side-by-side along the second direction, each second support fiber extending along the first direction; the first and second directions intersecting; and a conductive structure disposed between the first and second support plates, the conductive structure including a conductive portion extending along a thickness direction, the conductive portion having its orthographic projection on the surface of the support plate distributed at the intersection of the first and second support fibers; the first support fibers of the first support plate and the second support fibers of the second support plate contacting and communicating with each other.

[0006] The support plate assembly provided in the first aspect of this application improves the conductivity along the thickness direction between the first and second support plates by setting a conductive structure between the first and second support plates, so that the first and second support fibers are in contact with the conductive part and conduct to each other. The first and second support plates can effectively conduct static electricity, reduce uneven brightness in some display areas, and further improve performance and reliability.

[0007] According to one aspect of the embodiments of this application, the support plate further includes a matrix, support fibers are distributed inside the matrix, conductive parts are laid and embedded in the surface of the matrix, and the conductive parts extend into the matrix to contact the support fibers and conduct electricity with each other.

[0008] According to one aspect of the embodiments of this application, the support plate assembly further includes at least two support areas and a hollow area located between adjacent support areas. The hollow area is provided with a hollow structure that penetrates the support plate assembly. At least one conductive part is located in the hollow area and electrically connects the support fibers of two adjacent support plates to each other.

[0009] According to one aspect of the embodiments of this application, at least two support areas include a first support area and a second support area, and a hollow area is disposed between the first support area and the second support area.

[0010] According to one aspect of the embodiments of this application, the hollow structure includes a plurality of hollow holes, which are arrayed in the hollow area.

[0011] According to one aspect of the embodiments of this application, the shape of the perforated hole is at least one of the following: circular, elliptical, square, and rhomboid.

[0012] According to one aspect of the embodiments of this application, the support plate includes a carbon fiber plate, and the support fiber includes carbon fiber filaments.

[0013] According to one aspect of an embodiment of this application, the matrix material includes epoxy resin.

[0014] According to one aspect of the embodiments of this application, the material of the conductive structure includes anisotropic conductive adhesive.

[0015] Secondly, embodiments of this application also provide a display module, including a display panel and a support plate assembly disposed on one side of the display panel, wherein the support plate assembly is the support plate assembly provided in any of the first aspects of this application.

[0016] According to one aspect of the embodiments of this application, the display panel is a flexible display panel, and the display module is a foldable display module.

[0017] Thirdly, embodiments of this application also provide a method for preparing a support plate assembly, comprising:

[0018] At least two support plates are provided, each support plate comprising a matrix and support fibers distributed within the matrix;

[0019] A conductive layer is laid between two adjacent support plates to form a prefabricated component. The conductive layer includes conductive particles.

[0020] The prefabricated components are pressed together, which causes the conductive layer to deform. The conductive particles come into contact with the supporting fibers and form conductive parts. The supporting fibers of two adjacent supporting plates are interconnected with the conductive parts and form a conductive structure.

[0021] According to one aspect of the embodiments of this application, the step of pressing the prefabricated component further includes:

[0022] Thermo-press bonding process is used;

[0023] According to one aspect of the embodiments of this application, the step of pressing the prefabricated component further includes:

[0024] The support plate also includes a first substrate, and the conductive layer also includes a second substrate. Supporting fibers are distributed inside the first substrate, and conductive particles are distributed inside the second substrate. The conductive particles are embedded in the first substrate and come into contact with the supporting fibers to form a conductive part. The first substrate and the second substrate are softened and fused to form a matrix. Attached Figure Description

[0025] The features, advantages, and technical effects of exemplary embodiments of this application will now be described with reference to the accompanying drawings.

[0026] Figure 1 This is a schematic diagram of the overall structure of a support plate assembly provided in the first aspect embodiment of this application;

[0027] Figure 2 yes Figure 1 A schematic diagram of the cross-sectional structure along the AA direction;

[0028] Figure 3 This is a schematic diagram of the overall structure of another support plate assembly provided in the first aspect embodiment of this application;

[0029] Figure 4 This is a schematic diagram of the overall structure of a display module provided in the second aspect embodiment of this application;

[0030] Figure 5 yes Figure 4 A schematic diagram of the cross-sectional structure along the BB direction;

[0031] Figure 6 This is a process flow diagram of a method for manufacturing a support plate assembly provided in the third aspect embodiment of this application;

[0032] Figures 7a to 7c A process step diagram of a method for preparing a support plate assembly provided in the third aspect embodiment of this application.

[0033] in:

[0034] 100 - Support plate assembly; 100' - Prefabricated component;

[0035] 110 - Support area; 110a - First support area; 110b - Second support area; 120 - Hollowed-out area;

[0036] 10-Support plate; 10a-First support plate; 10b-Second support plate; 11-Support fiber; 11a-First support fiber; 11b-Second support fiber;

[0037] 20-Conductive structure; 20'-Conductive layer; 21-Conductive part; 21'-Conductive particle;

[0038] 30 - Substrate; 31 - First substrate; 32 - Second substrate;

[0039] 40 - Hollowed-out structure; 41 - Hollowed-out hole;

[0040] 200 - Display module; 210 - Display panel;

[0041] X - First direction; Y - Second direction; Z - Thickness direction.

[0042] In the accompanying drawings, the same parts use the same reference numerals. The drawings are not drawn to scale. Detailed Implementation

[0043] The features and exemplary embodiments of various aspects of this application will now be described in detail. Numerous specific details are set forth in the following detailed description to provide a comprehensive understanding of this application. However, it will be apparent to those skilled in the art that this application can be implemented without requiring some of these specific details. The following description of embodiments is merely intended to provide a better understanding of this application by illustrating examples. In the accompanying drawings and the following description, at least some well-known structures and techniques are not shown to avoid unnecessarily obscuring the application; and, for clarity, the dimensions of some structures may be exaggerated. Furthermore, the features, structures, or characteristics described below can be combined in any suitable manner in one or more embodiments.

[0044] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.

[0045] The directional terms used in the following description refer to the directions shown in the figures and are not intended to limit the specific structure of the support plate assembly and display module of this application. It should also be noted in the description of this application that, unless otherwise explicitly specified and limited, the terms "setup" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0046] In related technologies, static electricity is generated on the front and back of the screen during the screen production process, such as film removal and equipment logistics transportation. Because carbon fiber sheets have significantly insufficient conductivity in directions opposite to the extension direction of the carbon fiber filaments—and because carbon fiber filaments are generally arranged parallel to the plane of the carbon fiber sheet—the carbon fiber sheet exhibits high resistance along its thickness, making it unable to effectively conduct these charges.

[0047] To achieve a bendable design, the bending area of ​​carbon fiber sheets is usually partially hollowed out. However, this causes static electricity to easily accumulate in the bending area. This localized static electricity accumulation can have an uneven effect on the characteristics of the light-emitting diode, ultimately leading to low-grayscale vertical murmurs.

[0048] Furthermore, the poor conductivity of carbon fiber sheets along their thickness direction can also affect the overall performance and reliability of the display module. In foldable screen devices, good conductivity is crucial for maintaining stable display performance and device lifespan. Current carbon fiber sheet designs struggle to meet this requirement, especially under repeated bending and long-term use, making them more prone to performance degradation and decreased display quality.

[0049] While the importance of the conductivity of carbon fiber sheets along their thickness direction has been recognized in existing technologies, no effective solution has yet been proposed. Traditional improvement methods, such as adding conductive coatings or embedding metal meshes, often increase product weight, reduce flexibility, or significantly increase production costs, all of which contradict the design philosophy of foldable screen devices to be lightweight and flexible.

[0050] In view of the considerations and technical needs of solving the above-mentioned technical problems, this application provides a method for preparing a support plate assembly, a display module and a support plate assembly.

[0051] Figure 1 This illustration shows the overall structure of a support plate assembly 100 provided in the first aspect embodiment of this application. Figure 2 It shows Figure 1 The cross-sectional structure along the AA direction.

[0052] Please see Figure 1and Figure 2 In a first aspect, embodiments of this application provide a support plate assembly 100 for a display panel 210, including at least two support plates 10 and a conductive structure 20.

[0053] At least two support plates 10 include support fibers 11. At least two support plates 10 include a first support plate 10a and a second support plate 10b. The first support plate 10a includes a plurality of first support fibers 11a arranged side by side along a first direction X. Each first support fiber 11a extends along a second direction Y. The second support plate 10b includes a plurality of second support fibers 11b arranged side by side along the second direction Y. Each second support fiber 11b extends along the first direction X. The first direction X and the second direction Y intersect.

[0054] The conductive structure 20 is disposed between the first support plate 10a and the second support plate 10b. The conductive structure 20 includes a conductive part 21, which extends along the thickness direction Z. The orthographic projection of the conductive part 21 on the surface of the support plate 10 is distributed at the intersection of the first support fiber 11a and the second support fiber 11b. The first support fiber 11a of the first support plate 10a and the second support fiber 11b of the second support plate 10b are in contact with the conductive part 21 and are mutually conductive.

[0055] The support plate assembly 100 provided in the first aspect embodiment of this application improves the conductivity of the first support plate 10a and the second support plate 10b along the thickness direction Z by providing a conductive structure 20 between the first support plate 10a and the second support plate 10b, so that the first support fiber 11a and the second support fiber 11b contact and conduct with the conductive part 21, thereby improving the conductivity of the first support plate 10a and the second support plate 10b along the thickness direction Z. The first support plate 10a and the second support plate 10b can effectively conduct static electricity, reduce uneven brightness in some display areas, and further improve performance and reliability.

[0056] The support plate assembly 100 includes at least two support plates 10, each containing support fibers 11, and a conductive structure 20 is disposed between adjacent support plates 10. The conductive structure 20 includes a conductive portion 21, through which the support fibers 11 of adjacent support plates 10 contact and conduct electricity to each other. This design, by introducing the conductive structure 20 between the support plates 10, allows current to be smoothly conducted in the thickness direction Z, thereby effectively improving the conductivity problem in the thickness direction Z of the carbon fiber plate.

[0057] There are various ways to set up the support plate assembly 100. The support plate assembly 100 may also include other film layers. The support plate 10 mainly plays the role of supporting and bearing and resisting impact. Other film layers of display devices such as the display panel 210 are stacked on the support plate assembly 100 in sequence. The stacking arrangement mentioned here means that the other film layers are set in sequence along the thickness direction Z of the support plate 10.

[0058] The display panel 210 and other display devices may include various film layer structures within their layers. The specific composition of the film layer structures within the display panel 210 and other display devices is not limited in the embodiments of this application.

[0059] The display panel 210 and other display devices are all disposed on one side of the support plate assembly 100. The thickness direction Z of the display panel 210 and other display devices is the same as the thickness direction Z of the support plate assembly 100. The display panel 210 and other display devices are also disposed along the thickness direction Z.

[0060] The thickness direction Z of the support plate assembly 100 is generally consistent with the thickness direction Z of the support plate 10 itself, and the thickness direction Z of the display device such as the display panel 210 disposed on the support plate assembly 100 is also consistent with the thickness direction Z of the support plate 10 itself. Therefore, for ease of description, the thickness direction Z of other different film layers mentioned later in the embodiments of this application are all the same direction.

[0061] The first support plate 10a has a plurality of first support fibers 11a extending along the second direction Y, and the second support plate 10b has a plurality of second support fibers 11b extending along the first direction X. This design can provide support in the first direction X and the second direction Y, making the support structure of the entire support assembly more stable, and is provided with conductive paths covering the entire surface of the support assembly.

[0062] Optionally, the shape and distribution of the conductive part 21 can be optimized according to actual needs to ensure good conductivity in different areas of the support plate 10. The specific arrangement of the conductive part 21 will be further described in the support plate assembly 100 provided in other first aspect embodiments of this application below.

[0063] For example, to make it clear, the first direction X and the second direction Y are perpendicular to each other.

[0064] The directions are specified as the first direction X and the second direction Y only for the sake of illustration. The support plate assembly 100 provided in the first aspect embodiment of this application does not limit the specific settings of the first direction X and the second direction Y. It is only necessary to ensure that the first direction X and the second direction Y intersect and are not the same or opposite directions.

[0065] By optimizing the directional design of the first support fiber 11a and the second support fiber 11b on the first support plate 10a and the second support plate 10b, and combining the reasonable arrangement of the conductive part 21, the first support plate 10a and the second support plate 10b are effectively conductive in the thickness direction Z, which significantly improves the overall performance of the support plate assembly 100. In particular, its application in the back support component of display devices can effectively eliminate static electricity accumulation and improve the uneven brightness phenomenon in the bending area of ​​the screen.

[0066] For example, the conductive part 21 is disposed between the two support plates 10, and the conductive part 21 is in contact with and connected to the support fiber 11. As a result, the current can be smoothly conducted in the thickness direction Z of the upper and lower support plates 10, solving the problem of poor conductivity of the support plate assembly 100 in the thickness direction Z.

[0067] The conductive part 21 extends along the thickness direction Z and is distributed on the surface of the support plate 10 at the intersection of the first support fiber 11a and the second support fiber 11b. This allows the first support fiber 11a and the second support fiber 11b to be connected using the shortest path, providing better conductivity at the intersection.

[0068] Alternatively, the support plate assembly 100 may also include multiple support plates 10, with the conductive structure 20 disposed between any two adjacent support plates 10. This also enables smooth conduction between the multiple support plates 10 along the thickness direction Z, thus solving the problem of poor conductivity of the support plate assembly 100 along the thickness direction Z.

[0069] For example, in the application of display devices, the support plate assembly 100 can not only provide the necessary support, but also effectively conduct away the static electricity generated during the production process through the conductive structure 20, so as to avoid uneven brightness in the bending area.

[0070] Please continue reading. Figure 1 and Figure 2 In some embodiments, the support plate 10 further includes a substrate 30, with support fibers 11 distributed inside the substrate 30, and conductive parts 21 laid and embedded on the surface of the substrate 30. The conductive parts 21 extend into the substrate 30 to contact and communicate with the support fibers 11.

[0071] In these embodiments, the support plate 10 includes a substrate 30, support fibers 11 are distributed inside the substrate 30, and conductive parts 21 are laid and embedded on the surface of the substrate 30. The material of the substrate 30 may include resin. The substrate 30 provides a basic support structure for the arrangement of the support fibers 11 and the conductive parts 21. The conductive parts 21 extend into the substrate 30 to contact and conduct with the support fibers 11.

[0072] For example, the matrix 30 may be made of epoxy resin or other suitable resin materials that have good mechanical and electrical insulation properties.

[0073] The conductive part 21 can be made of conductive metal or conductive polymer material, which have good electrical conductivity.

[0074] The conductive part 21 can be fixed to the surface of the substrate 30 by means of hot pressing, embedding, etc., and extends into the interior of the substrate 30 to contact the supporting fiber 11.

[0075] The supporting fiber 11 can be carbon fiber filament, which has the characteristics of high strength and high modulus. The contact between the conductive part 21 and the supporting fiber 11 can be achieved by conductive adhesive or other conductive connection methods.

[0076] Therefore, by embedding the conductive part 21 on the surface of the substrate 30, the conductive part 21 extends into the interior of the substrate 30 to contact and conduct with the support fiber 11, effectively solving the problem of poor conductivity in the thickness direction Z between adjacent support plates 10.

[0077] Figure 3 The overall structure of another support plate assembly 100 provided in the first aspect embodiment of this application is shown.

[0078] Please continue reading. Figure 2 and Figure 3 In some embodiments, the support plate assembly 100 further includes at least two support areas 110 and a hollow area 120 located between adjacent support areas 110. The hollow area 120 is provided with a hollow structure 40 that penetrates the support plate assembly 100. At least one conductive part 21 is located in the hollow area 120 and electrically connects the support fibers 11 of two adjacent support plates 10 to each other.

[0079] In these embodiments, the design of the hollow area 120 enables the support plate 10 to not only achieve the bending function, but also to have a more concentrated conductive path in the thickness direction Z. The conductive part 21 between the hollow structures 40 can effectively connect the support fibers 11 of adjacent support plates 10, thereby improving the conductivity of the support plates 10 in the hollow area 120 along the thickness direction Z.

[0080] The hollow area 120 is designed to release stress concentration in the support plate assembly 100 at the bending position as much as possible, which can further realize the bending function of the support plate assembly 100, thereby achieving a smaller bending radius and a larger number of bending cycles, resulting in better performance.

[0081] By introducing the design of the cutout area 120, its application in the back support component of foldable screen display devices is made more reliable.

[0082] Optionally, the support plate assembly 100 includes a hollow area 120, which enables the support plate assembly 100 to be bent on both sides, and is applied to a dual-folding screen display device.

[0083] Optionally, the support plate assembly 100 includes two hollow areas 120, which enables the support plate assembly 100 to be bent on three sides, and can be applied to a tri-fold screen display device.

[0084] The design of the cutout area 120 can better conduct away the static electricity generated and concentrated in the cutout area 120 during the production process, reduce the impact of static electricity on the characteristics of the light-emitting diode, thereby improving the low grayscale vertical Mura phenomenon and improving the display effect and reliability of the foldable screen display device.

[0085] In some optional embodiments, at least two support areas 110 include a first support area 110a and a second support area 110b, and a hollow area 120 is disposed between the first support area 110a and the second support area 110b.

[0086] In these alternative embodiments, the support plate assembly 100 includes a cutout area 120 disposed between the first support area 110a and the second support area 110b. The support plate assembly 100 is applied to a double-folding screen display device, which enables static electricity to be concentrated in the middle cutout area 120 and to be conducted away more quickly, reducing the residue of static electricity in local areas, thereby improving the low grayscale vertical Mura phenomenon.

[0087] In some optional embodiments, the hollow structure 40 includes a plurality of hollow holes 41, which are arrayed in the hollow area 120.

[0088] In these alternative embodiments, the array distribution of the perforations 41 further optimizes the conductive path, allowing static electricity to concentrate in the perforated area 120 and be conducted away more quickly, reducing static electricity residue in local areas and thus improving the low grayscale vertical Mura phenomenon.

[0089] In some alternative embodiments, the shape of the perforation 41 is at least one of circular, elliptical, square, and rhomboid.

[0090] In these alternative embodiments, the shape design of the cutout 41 further optimizes the conductive path, allowing static electricity to concentrate in the cutout area 120 and be conducted away more quickly, reducing static electricity residue in local areas and thus improving the low grayscale vertical Mura phenomenon.

[0091] Considering the bending performance of the support plate assembly 100, the specific shape of the perforated hole 41 in the perforated area 120 can be adjusted according to the size of the bending area of ​​different sizes and the minimum bending radius. This application does not limit this, and the perforated hole 41 can be at least one of the following: circular, elliptical, square and rhomboid.

[0092] For example, the perforated holes 41 are multiple rectangles arranged in an array, which simplifies the processing and increases production efficiency.

[0093] In some embodiments, the support plate 10 includes a carbon fiber plate, and the support fiber 11 includes carbon fiber filaments.

[0094] In these embodiments, carbon fiber plates and carbon fiber filaments are used, and these carbon fiber materials are characterized by light weight, high strength, and good stiffness. By using carbon fiber plates and carbon fiber filaments, the support plate 10 and the support fiber 11 can improve the electrical conductivity of the support plate 10 along the thickness direction Z by utilizing the conductive part 21 while providing strength and stiffness.

[0095] The support plate 10 is made of carbon fiber plate, and the support fiber 11 is made of carbon fiber filament. Multi-dimensional optimization is achieved through the unique properties of carbon fiber material.

[0096] First, due to its high specific strength and high specific modulus, carbon fiber material gives the support plate 10 excellent compressive and bending resistance in the thickness direction Z, while significantly reducing the overall structural weight. It is especially suitable for the support plate assembly 100 of foldable screen products with stringent requirements for lightweighting.

[0097] The supporting fibers 11 are distributed in the form of carbon fiber filaments, which can form a directional reinforcement network inside the plate, further improving the local shear resistance and dispersing stress concentration, thereby enhancing the stability of the structure.

[0098] The introduction of the conductive part 21 is to supplement the function of the conductive anisotropy of the carbon fiber material itself. Although the carbon fiber has good conductivity along the axial direction, its conductivity in the interlayer or thickness direction is weak. By setting the conductive part 21, a stable conductive channel in the thickness direction Z can be established between the support plates 10, which can effectively eliminate static electricity accumulation or realize electromagnetic shielding function, while not affecting the original mechanical advantages of the carbon fiber.

[0099] Furthermore, the corrosion resistance and low coefficient of thermal expansion of carbon fiber further ensure the long-term reliability of the support plate assembly 100 under complex working conditions. The overall design achieves a multi-objective balance of lightweight, high strength, high stiffness, and electrical conductivity through the coordinated selection of materials and functional zoning.

[0100] In some alternative embodiments, the material of the matrix 30 includes epoxy resin.

[0101] In these alternative embodiments, epoxy resin, as the matrix material 30, can effectively fix the carbon fiber filaments in place and provide the necessary support and protection.

[0102] For example, carbon fiber sheets can be manufactured using a prepreg method, and carbon fiber filaments can be embedded into the carbon fiber sheet through weaving, laying, or other methods. Epoxy resin, as the matrix material, can fix the carbon fiber filaments to appropriate positions on the carbon fiber sheet through impregnation, coating, or other methods. Epoxy resin not only provides the necessary mechanical support but also protects the carbon fiber filaments from the influence of the external environment, improving the durability and reliability of the overall structure.

[0103] In some embodiments, the material of the conductive structure 20 includes anisotropic conductive adhesive.

[0104] In these embodiments, the conductive structure 20 is made of anisotropic conductive film (ACF), which allows for better conductivity in the thickness direction Z of the carbon fiber plate.

[0105] Anisotropic conductive adhesive exhibits good conductivity in the vertical direction and insulation in the horizontal direction. This characteristic effectively solves the problem of poor conductivity of carbon fiber sheets along the thickness direction Z. By using ACF adhesive as the material of the conductive structure 20, the carbon fiber sheet can better conduct charges along the thickness direction Z, avoiding the accumulation of static electricity in local areas. This improves the uneven brightness of the back support component of the foldable screen display device in the hollow area 120.

[0106] Figure 4 This illustrates the overall structure of a display module 200 provided in a second aspect embodiment of this application. Figure 5 It shows Figure 4 Cross-sectional structure along the BB direction.

[0107] Secondly, embodiments of this application also provide a display module 200, including a display panel 210 and a support plate assembly 100 disposed on one side of the display panel 210. The support plate assembly 100 is the support plate assembly 100 provided in any of the first aspect embodiments described above. Since the display module 200 provided in this application includes the support plate assembly 100 provided in any of the first aspect embodiments described above, the display module 200 provided in the second aspect embodiments of this application has the beneficial effects of the support plate assembly 100 provided in any of the first aspect embodiments described above, which will not be elaborated further here.

[0108] In some embodiments, the display panel 210 is a flexible display panel 210, and the display module 200 is a foldable display module 200.

[0109] In these embodiments, the display module 200 provided in the second aspect of this application can effectively support the display panel 210. In particular, for flexible display panels 210 and foldable display modules 200, the design of the support plate assembly 100 not only provides the necessary mechanical support, but also solves the static electricity problem through the conductive structure 20, avoids uneven brightness at the bending position, and improves the display effect and service life of the display module 200.

[0110] The flexible display panel 210 can maintain its display function in the folded state, while the foldable display module 200 provides the necessary support and conductive path to ensure that the display panel 210 can work normally during folding and unfolding.

[0111] The display module 200 provided in the second aspect of this application solves the support and conductivity problems of the flexible display panel 210 when folded, ensuring that the display module 200 can work normally during folding and unfolding, and provides a stable conductive path, avoiding the decline in conductivity and mechanical properties caused by folding.

[0112] Specifically, the flexible display panel 210 can maintain its display function in the folded state, meaning that the display panel 210 will not have its display effect affected by bending when folded. The foldable display module 200 provides the necessary support, which ensures that the flexible display panel 210 maintains its structural stability during folding and unfolding, avoiding mechanical damage caused by folding. At the same time, the design of the conductive path ensures that the flexible display panel 210 maintains good conductivity during folding and unfolding, avoiding degradation of electrical performance caused by folding. The conductive path can be implemented by setting conductive structures 20 in the support plate assembly 100. These conductive structures 20 include conductive parts 21, ensuring the continuity and stability of the circuit of the flexible display panel 210 during folding and unfolding.

[0113] Through this design, this application effectively solves the problems of insufficient support and decreased conductivity of the flexible display panel 210 when folded in the prior art, ensuring that the flexible display panel 210 can work normally during folding and unfolding, and significantly improving the reliability and service life of the flexible display panel 210.

[0114] Figure 6 The present invention illustrates a process flow for a method of manufacturing a support plate assembly 100 according to an embodiment of the third aspect of this application. Figures 7a to 7c The third aspect of this application provides a method for manufacturing a support plate assembly 100, including the following process steps.

[0115] Please see Figure 6 and Figures 7a to 7c Thirdly, embodiments of this application provide a method for preparing a support plate assembly 100, comprising:

[0116] Step S10: Provide at least two support plates 10, each support plate 10 including a substrate 30 and support fibers 11 distributed inside the substrate 30;

[0117] Step S20: Lay a conductive layer 20' between two adjacent support plates 10 to form a prefabricated component 100'. The conductive layer 20' includes conductive particles 21'.

[0118] Step S30: Press the prefabricated component 100' to deform the conductive layer 20', and the conductive particles 21' come into contact with the supporting fibers 11 to form a conductive part 21. The supporting fibers 11 of the two adjacent supporting plates 10 are interconnected with the conductive part 21 to form a conductive structure 20.

[0119] Thirdly, the preparation method of the support plate assembly 100 provided in this application embodiment effectively solves the problem of poor conductivity of carbon fiber plate along the thickness direction Z. Through reasonable material distribution and pressing process, the conductive particles 21' are fully in contact with the support fibers 11 to form a stable conductive structure 20, thereby improving the conductivity of carbon fiber plate along the thickness direction Z, further improving the conductivity of the back support component of the foldable screen display device during use, solving the static electricity problem generated in the production process, and avoiding uneven brightness in the bending area.

[0120] In step S10, at least two support plates 10 are provided. Each support plate 10 includes a substrate 30 and support fibers 11 distributed inside the substrate 30, which ensures the basic structure and material distribution of the support plate 10.

[0121] In step S20, a conductive layer 20' is laid between two adjacent support plates 10 to form a prefabricated component 100'. The conductive layer 20' includes conductive particles 21'. This step ensures the reasonable distribution of conductive materials.

[0122] In step S30, the prefabricated component 100' is pressed together, causing the conductive layer 20' to deform. The conductive particles 21' come into contact with the supporting fibers 11 and form a conductive part 21. The supporting fibers 11 of the two adjacent supporting plates 10 are interconnected with the conductive part 21 and form a conductive structure 20. By pressing, the conductive particles 21' are fully in contact with the supporting fibers 11, which solves the problem of poor conductivity of the carbon fiber plate along the thickness direction Z.

[0123] Please continue reading. Figures 7a to 7c In some embodiments, step S30 further includes:

[0124] The hot-press bonding process is adopted.

[0125] In these embodiments, the hot-press bonding process is used in the step of pressing the prefabricated component 100'. The hot pressing allows the conductive particles 21' to be better embedded in the first substrate 31 and to contact the supporting fibers 11, thereby forming the conductive part 21, which solves the problem of poor conductivity along the thickness direction Z.

[0126] Please continue reading. Figures 7a to 7c In some optional embodiments, step S30 further includes:

[0127] The support plate 10 also includes a first substrate 31, and the conductive layer 20' also includes a second substrate 32. The support fibers 11 are distributed inside the first substrate 31, and the conductive particles 21' are distributed inside the second substrate 32. The conductive particles 21' are embedded in the first substrate 31 and come into contact with the support fibers 11 to form a conductive part 21. The first substrate 31 and the second substrate 32 are softened and fused to form a matrix 30.

[0128] In these alternative embodiments, the support fibers 11 are distributed inside the first substrate 31, and the conductive particles 21' are distributed inside the second substrate 32. Through a hot-press bonding process, the first substrate 31 and the second substrate 32 are softened and fused to form a matrix 30, so that the conductive particles 21' are embedded in the first substrate 31 and in contact with the support fibers 11 to form a stable conductive structure 20.

[0129] The hot-press bonding process softens and fuses the first substrate 31 and the second substrate 32 under certain temperature and pressure by heating and pressurizing.

[0130] Specifically, the hot-press bonding process can be implemented in several ways: for example, by using a hot press to heat and pressurize the first substrate 31 and the second substrate 32, softening and fusing them under certain temperature and pressure, and then cooling to obtain the matrix 30; or by using an infrared heating device to heat the first substrate 31 and the second substrate 32 while applying certain pressure, so that they soften and fuse. As a preferred embodiment, the hot-press bonding process can also be carried out in a vacuum environment to improve the stability of the contact between the conductive particles 21' and the supporting fibers 11.

[0131] This application employs a hot-press bonding process to better embed conductive particles 21' into the first substrate 31 and make contact with the supporting fiber 11. At the same time, the supporting fiber 11 can be better embedded into the second substrate 32 and make contact with the conductive particles 21' to form a conductive structure 20. The conductive particles 21' form a stable conductive part 21, thereby effectively solving the problem of poor conductivity of carbon fiber plates along the thickness direction Z.

[0132] Although this application has been described with reference to preferred embodiments, various modifications can be made thereto and components can be replaced with equivalents without departing from the scope of this application. In particular, the technical features mentioned in the various embodiments can be combined in any manner, provided there is no structural conflict. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A support plate assembly for a display panel, characterized in that, include: At least two support plates, each support plate including support fibers, the at least two support plates including a first support plate and a second support plate, the first support plate including a plurality of first support fibers arranged side by side along a first direction, each first support fiber extending along a second direction, the second support plate including a plurality of second support fibers arranged side by side along the second direction, each second support fiber extending along the first direction, the first direction and the second direction intersecting; A conductive structure is disposed between the first support plate and the second support plate. The conductive structure includes a conductive part that extends along the thickness direction. The orthographic projection of the conductive part onto the surface of the support plate is distributed at the intersection of the first support fiber and the second support fiber. The first support fiber of the first support plate and the second support fiber of the second support plate are in contact with the conductive part and are mutually conductive.

2. The support plate assembly according to claim 1, characterized in that, The support plate also includes a matrix, the support fibers are distributed inside the matrix, the conductive part is laid and embedded on the surface of the matrix, and the conductive part extends into the matrix to contact the support fibers and conduct electricity with them.

3. The support plate assembly according to claim 1, characterized in that, The support plate assembly further includes at least two support areas and a hollow area located between adjacent support areas. The hollow area is provided with a hollow structure that penetrates the support plate assembly. At least one of the conductive parts is located in the hollow area and electrically connects the support fibers of two adjacent support plates to each other.

4. The support plate assembly according to claim 3, characterized in that, The at least two support areas include a first support area and a second support area, and the hollow area is disposed between the first support area and the second support area; Preferably, the hollow structure includes a plurality of hollow holes, which are arrayed in the hollow area; Preferably, the shape of the perforated hole is at least one of the following: circular, elliptical, square, and rhomboid.

5. The support plate assembly according to claim 2, characterized in that, The support plate includes a carbon fiber plate, and the support fiber includes carbon fiber filaments; Preferably, the matrix material includes epoxy resin.

6. The support plate assembly according to claim 1, characterized in that, The material of the conductive structure includes anisotropic conductive adhesive.

7. A display module, characterized in that, It includes a display panel and a support plate assembly disposed on one side of the display panel, wherein the support plate assembly is the support plate assembly as described in any one of claims 1 to 6.

8. The display module according to claim 7, characterized in that, The display panel is a flexible display panel, and the display module is a foldable display module.

9. A method for preparing a support plate assembly, characterized in that, include: At least two support plates are provided, each support plate comprising a matrix and support fibers distributed within the matrix; A conductive layer is laid between two adjacent support plates to form a prefabricated component, wherein the conductive layer includes conductive particles; The prefabricated components are pressed together, causing the conductive layer to deform. The conductive particles come into contact with the supporting fibers and form conductive parts. The supporting fibers of two adjacent supporting plates are interconnected with the conductive parts and form a conductive structure.

10. The method for preparing the support plate assembly according to claim 9, characterized in that, The step of pressing the prefabricated components also includes: Thermo-press bonding process is used; Preferably, the step of pressing the prefabricated component further includes: The support plate further includes a first substrate, and the conductive layer further includes a second substrate. The supporting fibers are distributed inside the first substrate, and the conductive particles are distributed inside the second substrate. The conductive particles are embedded in the first substrate and contact the supporting fibers to form the conductive portion. The first substrate and the second substrate are softened and fused to form a matrix.

Images