Display module and display device

Abstract

The application provides a display module and a display device. The display module comprises a screen body, a first PCB, a second PCB, a first component and a second component. The screen body comprises a display part, a bending part and a bonding part connected in sequence. The first PCB is arranged on the side of the display part away from the cover plate and is electrically connected with the bonding part. The second PCB is arranged on the same side of the screen body relative to the cover plate and is electrically connected with the first PCB. The first component is arranged on the side of the first PCB away from the display part. The second component is arranged on the side of the second PCB away from the cover plate. The height of the second component is greater than the height of the first component. The overall thickness of the display module can be effectively reduced, and the performance of the display module is improved. Meanwhile, since the components are distributed on different PCBs, the wiring space is more spacious, and the overall thickness of the display module can be further reduced by compressing the thickness of the first PCB and the second PCB.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display module and display device. Background Technology

[0002] OLED (Organic Light-Emitting Diode) is an active-matrix light-emitting device with a sandwich structure consisting of multiple organic layers and electrodes on both sides. Currently, AMOLED (Active-Matrix Organic Light-Emitting Diode) based displays have been commercialized in fields such as smartphones, watches, and laptops.

[0003] However, existing display products still suffer from excessive thickness. Summary of the Invention

[0004] In view of this, the purpose of this application is to propose a display module that is conducive to reducing module thickness and improving module performance.

[0005] For the purposes described above, this application provides a display module, which includes:

[0006] The screen body includes a display part, a bending part, and a bonding part connected in sequence. The display part and the bonding part are stacked and spaced apart from each other. The bending part is connected between the display part and the bonding part.

[0007] A cover plate, the cover plate being disposed on the side of the display portion away from the bonding portion;

[0008] A driving module is disposed on the side of the bonding portion away from the display portion and is connected to the bonding portion;

[0009] A first PCB is disposed on the side of the display unit away from the cover plate. The first PCB is electrically connected to the bonding unit. The orthographic projection of the first PCB on the cover plate is located within the orthographic projection of the screen body on the cover plate.

[0010] The second PCB is disposed on the same side of the screen body opposite to the cover plate. The second PCB is electrically connected to the first PCB. The orthographic projection of the second PCB on the cover plate does not overlap with the orthographic projection of the screen body on the cover plate.

[0011] A first component group is disposed on the side of the first PCB away from the display section, and the first component group includes a plurality of first components;

[0012] The second component group is disposed on the side of the second PCB away from the cover plate, and the second component group includes a plurality of second components; wherein, along the thickness direction of the display module, the maximum size of the second component is greater than the maximum size of the first component.

[0013] In one embodiment, along the thickness direction of the display module, the size of the smallest second component among a plurality of second components is larger than the size of the largest first component among a plurality of first component groups;

[0014] Preferably, along the thickness direction of the display module, the size of the first component is less than or equal to 0.4 mm; the size of the second component is 1-1.2 mm.

[0015] Preferably, along the thickness direction of the display module, the size of the first PCB is less than or equal to 0.4 mm, and the size of the second PCB is less than or equal to 0.4 mm.

[0016] Preferably, along the thickness direction of the display module, the size of the first PCB is equal to the size of the second PCB.

[0017] In one embodiment, the heat-generating capacity of the second component is greater than that of the first component.

[0018] In one embodiment, along the thickness direction of the display module, the sum of the dimensions of the first PCB and the first component is 1.4-1.6 mm, and the sum of the dimensions of the second PCB and the second component is 1.4-1.6 mm.

[0019] Preferably, the shortest distance between the driving module and the cover plate along the thickness direction of the display module is 1.4-1.6 mm;

[0020] In one embodiment, the cover plate has a size of 0.4-0.5 mm along the thickness direction of the display module;

[0021] Preferably, the thickness of the display module is 1.8-2.2 mm.

[0022] In one embodiment, the display module further includes a first FPC, and the first PCB is connected to the bonding portion via the first FPC; one end of the first FPC is bonded to the first PCB, and the other end is bonded to the bonding portion.

[0023] In one embodiment, the display module further includes a second FPC, one end of which is pressed against the second PCB and the other end is bonded to the first PCB;

[0024] Preferably, the second PCB and the second FPC form a rigid-flex board.

[0025] In one embodiment, the second PCB is located on the side of the bend away from the first PCB, and the orthographic projection of the second PCB on the cover plate does not overlap with the orthographic projection of the bend on the cover plate.

[0026] In one embodiment, the display module further includes double-sided adhesive, and the second PCB is bonded to the cover plate by the double-sided adhesive.

[0027] Based on the same inventive concept, this application also discloses a display device, which includes the display module described in any of the above claims.

[0028] Compared with existing technologies, the display module provided in this application includes a screen body, a first PCB, a second PCB, a first component, and a second component. The screen body includes a display section, a bending section, and a bonding section connected in sequence. The first PCB is disposed on the side of the display section away from the cover plate and is electrically connected to the bonding section. The second PCB is disposed on the same side of the screen body opposite to the cover plate and is electrically connected to the first PCB. The first component is disposed on the side of the first PCB away from the display section, and the second component is disposed on the side of the second PCB away from the cover plate. The height of the second component is greater than the height of the first component. This is equivalent to placing the taller second component and the shorter first component on different PCBs. Since there is no screen body between the second PCB and the cover plate, the overall thickness of the display module can be effectively reduced, and the performance of the display module can be improved.

[0029] Meanwhile, since the components are distributed on different PCBs, there is more space for wiring, and the overall thickness of the display module can be further reduced by compressing the thickness of the first PCB and the second PCB. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in this application or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0031] Figure 1 This is a schematic diagram of the structure of a related display module;

[0032] Figure 2 This is a schematic diagram of the structure of a display module provided in one embodiment of this application;

[0033] Figure 3 This is a schematic diagram of the structure of a display module provided in another embodiment of this application;

[0034] Figure 4 This is a schematic diagram of the structure of a display module provided in another embodiment of this application.

[0035] Marker explanation:

[0036] 100. Display module; 101. PCB; 102. FPC; 103. Components; 110. Double-sided adhesive;

[0037] 10. Screen body; 11. Display unit; 12. Bending part; 13. Bonding part;

[0038] 20. Cover plate;

[0039] 30. Driver module;

[0040] 40. First PCB;

[0041] 50. Second PCB;

[0042] 60. First Component Group; 61. First Component;

[0043] 70. Second component group; 71. Second component;

[0044] 80. The first FPC;

[0045] 90. Second FPC. Detailed Implementation

[0046] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with specific embodiments and the accompanying drawings.

[0047] It should be noted that, unless otherwise defined, the technical or scientific terms used in the embodiments of this application should have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms "first," "second," and similar terms used in the embodiments of this application do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are only used to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0048] Please refer to Figure 1 As shown, a related display module 100 is provided. The display module 100 includes a screen body 10, which includes a display part 11, a bending part 12, and a bonding part 13. The display part 11 is provided with a signal terminal, and the bonding part 13 is provided with a bonding electrode. The signal terminal and the bonding electrode are electrically connected through a signal line.

[0049] In order to reduce the bezel (usually the bottom bezel) of the display module 100, the bonding portion 13 is bent to the back of the display module 100. Simultaneously, after bending, the bonding portion 13 needs to be connected to the PCB (printed circuit board) 101 on the back of the display unit 11 via an FPC (flexible printed circuit board) 102. Components are mounted on the PCB 101. Therefore, the thickest point of the display module 100 is at the PCB 101, and the thickness at this location becomes a bottleneck for achieving a thinner and lighter display module.

[0050] Therefore, this application provides a display module solution to address the aforementioned problems.

[0051] Please refer to Figure 2 As shown, a display module 100 provided in an embodiment of this application is shown. The display module 100 includes a screen body 10, a cover plate 20, and a driving module 30. The screen body 10 includes a display part 11, a bending part 12, and a bonding part 13 connected in sequence. The display part 11 and the bonding part 13 are stacked and spaced apart from each other. The bending part 12 is connected between the display part 11 and the bonding part 13. The cover plate 20 is disposed on the side of the display part 11 away from the bonding part 13. The driving module 30 is disposed on the side of the bonding part 13 away from the display part 11 and is connected to the bonding part 13.

[0052] The display module 100 also includes a first PCB 40 and a second PCB 50. The first PCB 40 is disposed on the side of the display unit 11 away from the cover plate 20. The first PCB 40 is electrically connected to the bonding unit 13. The orthographic projection of the first PCB 40 on the cover plate 20 is located within the orthographic projection of the screen body 10 on the cover plate 20. The second PCB 50 is disposed on the same side of the screen body 10 opposite to the cover plate 20. The second PCB 50 is electrically connected to the first PCB 40. The orthographic projection of the second PCB 50 on the cover plate 20 does not overlap with the orthographic projection of the screen body 10 on the cover plate 20.

[0053] The display module 100 also includes a first component group 60 and a second component group 70. The first component group 60 is disposed on the side of the first PCB 40 away from the display section 11, and includes a plurality of first components 61. The second component group 70 is disposed on the side of the second PCB 50 away from the cover plate 20, and includes a plurality of second components 71. In the thickness direction of the display module 100 (as shown by the X direction in the figure), the maximum size of the second component 71 is greater than the maximum size of the first component 61.

[0054] The display module 100 provided in this embodiment includes a screen 10, a first PCB 40, a second PCB 50, a first component 61, and a second component 71. The screen 10 includes a display section 11, a bending section 12, and a bonding section 13 connected in sequence. The first PCB 40 is disposed on the side of the display section 11 away from the cover plate 20 and is electrically connected to the bonding section 13. The second PCB 50 is disposed on the same side of the screen 10 opposite to the cover plate 20 and is electrically connected to the first PCB 40. The first component 61 is disposed on the side of the first PCB 40 away from the display section 11, and the second component 71 is disposed on the side of the second PCB 50 away from the cover plate 20. The height of the second component 71 is greater than the height of the first component 61. This is equivalent to placing the taller second component 71 and the shorter first component 61 on different PCBs. Since there is no screen 10 between the second PCB 50 and the cover plate 20, the overall thickness of the display module 100 can be effectively reduced, and the performance of the display module 100 can be improved.

[0055] Meanwhile, since the components are distributed on different PCBs, the wiring space is more spacious, and the overall thickness of the display module 100 can be further reduced by compressing the thickness of the first PCB40 and the second PCB50.

[0056] It should be noted that the first component group 60 includes multiple first components 61, and the second component group 70 includes multiple second components 71. The multiple first components 61 may include first components 61 with different heights, and the multiple second components 71 may include second components 71 with different heights. In this application, as long as the size of the largest second component 71 among the multiple second components 71 is greater than the size of the largest first component 61 among the multiple first components 61, the overall thickness of the display module 100 can be reduced.

[0057] Optionally, the first PCB 40 and the second PCB 50 use glass fiber reinforced material as the substrate. This material has high rigidity and stability, providing solid support for electronic components. Copper foil is attached to the surface of the substrate through processes such as lamination to form conductive lines. Unwanted copper foil is then removed through processes such as etching to form a precise circuit pattern. In addition, there will be solder mask layers, screen-printed layers, etc., to protect the circuit and provide identification functions.

[0058] PCBs possess excellent mechanical strength and stability, capable of withstanding significant mechanical stresses such as those caused by impacts and vibrations during equipment assembly and use. Their rigid structure ensures dimensional stability and reduces deformation, facilitating precise component mounting and reliable circuit connections. Furthermore, PCBs exhibit good thermal conductivity, aiding in heat dissipation during operation and ensuring stable equipment performance.

[0059] The manufacturing process of PCBs is relatively simple, mainly including substrate fabrication, copper foil etching, drilling, and surface treatment. First, copper foil is pasted onto the substrate, and then circuit patterns are formed through processes such as photolithography and etching. Next, holes are drilled to achieve electrical connections between different layers. Finally, surface treatments such as tin plating and gold plating are performed to improve the solderability and oxidation resistance of the circuit board.

[0060] In one embodiment, the screen 10 includes the following structure:

[0061] The substrate is typically made of glass or plastic. Glass substrates offer good flatness, hardness, and thermal stability, providing reliable support for the panel and are suitable for display modules requiring high display precision, such as televisions and monitors. Plastic substrates, on the other hand, offer advantages such as good flexibility, light weight, and resistance to breakage, and are commonly used in bendable and foldable display devices, such as mobile phones and wearable devices.

[0062] The substrate serves to provide mechanical support for the other film layers of the display module, ensuring the stability and integrity of each layer. Simultaneously, the substrate needs to possess excellent insulation properties to prevent current leakage and short circuits, guaranteeing the normal operation of the display module.

[0063] The anode is typically a transparent conductive oxide, most commonly indium tin oxide (ITO). ITO has high transparency and good conductivity, allowing light to pass through while effectively transmitting current, providing positive charge injection for the display device. The anode acts as the positive electrode of the OLED display module. During operation, the anode injects positive charges (holes) from the external circuit into the organic functional layer, providing holes for the hole transport layer. This is a crucial step in the charge injection process of OLED light emission.

[0064] Hole injection layers, commonly made of materials such as copper phthalocyanine, possess energy level structures that match those of the anode material, effectively facilitating hole injection from the anode into the hole transport layer. Their primary function is to lower the interfacial energy barrier between the anode and the hole transport layer, allowing for more efficient hole injection. Simultaneously, they can block electron transport towards the anode, preventing electron-hole recombination near the anode and improving charge injection efficiency and luminescence performance.

[0065] Hole transport layers typically utilize organic materials with high hole mobility, such as binatidine diphenylphosphine. These materials can rapidly transport holes under an electric field and exhibit good stability and compatibility. Their function is to transport holes injected from the anode to the light-emitting layer. During transport, the hole transport layer must ensure efficient hole transport, reduce hole loss and recombination, and maintain good interfacial contact with adjacent layers to ensure the overall stability of the device.

[0066] The light-emitting layer, based on different light-emitting principles and performance requirements, can be divided into small-molecule organic materials and high-molecular-weight polymer materials. Small-molecule organic light-emitting materials have high luminous efficiency and good color purity; high-molecular-weight polymer light-emitting materials, such as poly(p-phenylenevinyl)ethylene and its derivatives, have good film-forming properties and processability. The light-emitting layer is the core component of the display module. When holes and electrons recombine in the light-emitting layer, excitons are generated. These excitons release photons through radiative transitions, thus achieving light emission. The performance of the light-emitting layer directly determines the key indicators of the display module, such as luminous efficiency, color, and brightness.

[0067] Electron transport layers, commonly made of materials such as lithium fluoride, possess high electron mobility and excellent electron injection performance, enabling efficient electron transport. Their function is to transport electrons injected from the cathode to the light-emitting layer while simultaneously blocking holes from transporting towards the cathode, allowing electrons and holes to recombine effectively within the light-emitting layer and improving luminous efficiency. The electron transport layer also requires good interfacial contact with the light-emitting layer and the cathode to ensure smooth electron transport and device stability.

[0068] The electron injection layer typically employs metals or metal compounds with low work functions, such as calcium or barium, or organic electron transport materials. These materials effectively reduce the interfacial energy barrier between the cathode and the electron transport layer, promoting electron injection. Located between the electron transport layer and the cathode, the electron injection layer helps the cathode inject electrons more smoothly, enhancing electron injection efficiency. It can improve the contact between the cathode and the electron transport layer, reduce obstacles to electron injection, and further improve device performance, especially luminous efficiency and stability at low voltages.

[0069] The cathode is typically made of a metal or metal alloy with a low work function, such as aluminum, calcium, or magnesium-silver alloys. These materials readily donate electrons and have good conductivity and reflectivity.

[0070] Function: As the negative electrode of the display module, the cathode injects electrons into the electron transport layer during operation. These electrons recombine with holes transported from the anode in the light-emitting layer, forming a current loop, thereby enabling the display module to emit light. Simultaneously, the reflective properties of the cathode can improve the light extraction efficiency for some top-emitting display module structures.

[0071] The pixel definition layer typically uses organic materials such as photoresist. These materials possess excellent photolithographic properties, enabling precise definition of the pixel's shape and size through photolithography. It defines the pixel's area and shape, isolates the light-emitting areas between different pixels, and prevents crosstalk between pixels. It ensures that each pixel can independently emit light and display images, improving display resolution and contrast. Furthermore, the pixel definition layer also supports and protects the internal functional layers, preventing damage to other film layers during manufacturing.

[0072] The encapsulation layer typically employs a film structure consisting of a superimposed inorganic and organic layer. The inorganic layer generally uses materials such as silicon nitride and aluminum oxide, which possess excellent barrier properties, preventing the intrusion of moisture and oxygen. The organic layer can be made of materials such as polyimide, primarily serving a buffering and protective function while also improving the flexibility and adhesion of the encapsulation layer. Because luminescent materials are highly sensitive to moisture and oxygen, easily affected by external environmental factors that can reduce their performance and lifespan, the main function of the encapsulation layer is to protect the internal organic functional layer, preventing moisture and oxygen from reacting with the luminescent material, thereby extending the lifespan of the display module and improving its reliability and stability.

[0073] Optionally, the cover plate 20 includes a glass substrate, typically made of silicate glass, whose main components include silicon dioxide, aluminum oxide, calcium oxide, sodium oxide, etc. These components are interconnected in the form of silicon-oxygen tetrahedra, forming the basic framework of the glass and determining many of its physical and chemical properties.

[0074] Optionally, the cover plate 20 is provided with an ink layer, which covers the sides and light-shielding areas of the cover plate 20 to block light and prevent light leakage caused by reflection inside the cover plate, thus affecting the display effect. This can be formed by a spray coating process or a pad printing process.

[0075] Optionally, the cover plate 20 is provided with a coating layer. In order to improve the optical and surface properties of the glass cover plate, various functional films are coated on its surface, such as anti-reflective films, anti-fingerprint films, and hydrophobic and oleophobic films. Anti-reflective films can reduce light reflection and improve light transmittance; anti-fingerprint films and hydrophobic and oleophobic films can prevent fingerprints and oil stains from being left when fingers touch the screen, keeping the screen clean.

[0076] As the outermost layer of the display module, the cover plate 20 can prevent the internal components such as the screen 10 from being impacted, scratched and worn by external forces, avoid damage caused by collisions and friction during daily use, and extend the service life of the module.

[0077] Meanwhile, for display devices with touch functionality, the cover plate 20 can work in conjunction with the touch sensing layer to enable touch operation, accurately sense the user's touch position and actions, and transmit the touch signal to the internal circuitry for processing.

[0078] The cover plate 20 can process light through refraction, reflection, and transmission, optimizing the display effect, reducing light scattering and reflection, improving contrast and viewing angle, and enabling users to see the content on the screen clearly from different angles.

[0079] The cover plate 20 can prevent dust, moisture, grease and other contaminants from entering the display module, keeping the internal components clean and preventing display abnormalities or circuit failures caused by contaminants.

[0080] The cover plate 20 needs to have a high light transmittance, usually above 90%, to ensure that the light emitted by the screen 10 can pass through the cover plate to the maximum extent, making the screen display brighter and clearer.

[0081] To effectively protect internal components, the cover plate 20 needs to have sufficient strength and hardness to withstand a certain degree of external impact and scratches. For example, materials such as chemically strengthened glass can be used to give it high impact resistance and wear resistance, making it less prone to cracking or scratches.

[0082] The surface flatness of the cover plate 20 is required to ensure the bonding quality between it and the screen body 10, and to avoid problems such as bubbles, gaps or uneven light refraction, thereby ensuring the consistency of the display effect.

[0083] By using processes such as coating, the reflectivity of the cover plate 20 to light is reduced, the reflection of ambient light on the surface of the screen 10 is reduced, the readability of the screen 10 in strong light environment is improved, and users can see the images and text on the screen 10 more clearly.

[0084] Optionally, the driver module includes a source IC (source driver chip) which has the following functions:

[0085] Signal conversion and transmission: Receives digital signals from the timing control chip (TCON), converts them into analog signals suitable for driving pixels, such as voltage or current signals, and transmits them to the source lines of the pixel module via the data bus.

[0086] Pixel control: Responsible for controlling the brightness, grayscale, and color of each pixel. By precisely adjusting the output voltage or current, the intensity of pixel emission is controlled, thereby achieving different grayscale and color displays to present a clear and detailed image.

[0087] Working principle: In pixel driving, voltage signals need to be converted into current signals to control the brightness of the light-emitting units. The Source IC sends instructions to the thin-film transistors behind the light-emitting units to control the switching state and conduction level of the thin-film transistors, thereby controlling the amount of current flowing through the pixel and achieving precise control of pixel emission. For example, when displaying a color image, the Source IC provides corresponding driving currents to the red, green, and blue sub-pixels of each pixel according to the image data, causing them to emit light of different intensities, which are then mixed to form the desired color.

[0088] The source IC can also work in conjunction with other components, such as the gate IC (gate driver chip). The gate IC controls the switching of each column of transistors. Only when the transistors are on can the source IC apply voltage or current signals to the corresponding pixels, thereby achieving line-by-line scanning and control of the pixels. Working together, they ensure that image data is accurately transmitted to each pixel of the display module, achieving correct image display.

[0089] The source IC is controlled by the timing controller chip (TCON), which is responsible for generating various control and timing signals, including data signals, source control signals, and gate control signals. The source IC determines when to transmit data, what kind of data to transmit, and how to control the display state of the pixels based on the signals output by the TCON, so as to ensure timing synchronization with the entire display system.

[0090] In one embodiment, along the thickness direction of the display module 100, the size of the smallest second component 71 among the plurality of second components 71 is greater than or equal to the size of the largest first component 61 among the plurality of first components 61, which is beneficial to further reduce the overall thickness of the display module 100.

[0091] Preferably, along the thickness direction of the display module 100, the size of the first component 61 is less than or equal to 0.4 mm; the size of the second component 71 is 1-1.2 mm. For example, the size of the first component 61 is 0.2 mm, 0.25 mm, 0.3 mm, 0.35 mm, 0.4 mm, etc., and the size of the second component 71 is 1 mm, 1.05 mm, 1.1 mm, 1.15 mm, 1.2 mm, etc.

[0092] Preferably, along the thickness direction of the display module 100, the size of the first PCB 40 is less than or equal to 0.4 mm, and the size of the second PCB 50 is less than or equal to 0.4 mm. For example, the size of the first PCB 40 is 0.2 mm, 0.25 mm, 0.3 mm, 0.35 mm, 0.4 mm, etc., and the size of the second PCB 50 is 0.2 mm, 0.25 mm, 0.3 mm, 0.35 mm, 0.4 mm, etc. The thinner first PCB 40 and second PCB 50 can further reduce the thickness of the display module 100.

[0093] Preferably, along the thickness direction of the display module 100, the size of the first PCB 40 is equal to the size of the second PCB 50, which facilitates manufacturing, helps reduce costs, and allows for the selection of identical PCBs.

[0094] In one embodiment, the heat generation capacity of the second component 71 is greater than that of the first component 61, which helps to reduce the damage to the screen 10 caused by the heat generated by the component. Specifically, since the second component 71 is disposed on the second PCB 50, the orthographic projection of the second PCB 50 on the cover plate 20 does not overlap with the orthographic projection of the screen 10 on the cover plate 20. Therefore, the second PCB 50 does not contact the screen 10. By placing the second component 71 with a greater heat generation capacity on the second PCB 50, damage to the screen 10 caused by the heat generated by the second component 71 with a greater heat generation capacity can be avoided.

[0095] In one embodiment, along the thickness direction of the display module 100, the sum of the dimensions of the first PCB 40 and the first component 61 is 1.4-1.6 mm, and the sum of the dimensions of the second PCB 50 and the second component 71 is 1.4-1.6 mm. Exemplarily, the sum of the dimensions of the first PCB 40 and the first component 61 is 1.4, 1.45 mm, 1.5 mm, 1.55 mm, 1.6 mm, etc., and the sum of the dimensions of the second PCB 50 and the second component 71 is 1.4, 1.45 mm, 1.5 mm, 1.55 mm, 1.6 mm, etc. The smaller the sum of the dimensions of the first PCB 40 and the first component 61, and the smaller the sum of the dimensions of the second PCB 50 and the second component 71, the thinner the display module 100 can be. Preferably, the sum of the dimensions of the first PCB 40 and the first component 61 is 1.47 mm.

[0096] Preferably, the shortest distance between the driving module 30 and the cover plate 20 along the thickness direction of the display module 100 is 1.4-1.6 mm. For example, the shortest distance between the driving module 30 and the cover plate 20 is 1.4, 1.45 mm, 1.5 mm, 1.55 mm, 1.6 mm, etc., and preferably, the shortest distance between the driving module 30 and the cover plate 20 is 1.52 mm.

[0097] In one embodiment, the cover plate 20 has a thickness of 0.4-0.5 mm along the thickness direction of the display module 100. Exemplarily, the cover plate 20 has dimensions of 0.4 mm, 0.42 mm, 0.46 mm, 0.48 mm, 0.5 mm, etc. A thinner cover plate 20 is advantageous for reducing the thickness of the display module 100.

[0098] Preferably, the thickness of the display module 100 is 1.8-2.2 mm. For example, the thickness of the display module 100 is 1.8 mm, 1.9 mm, 2.0 mm, 2.1 mm, 2.2 mm, etc.

[0099] In one embodiment, the display module 100 further includes a first FPC 80, and the first PCB 40 and the bonding portion 13 are connected through the first FPC 80; one end of the first FPC 80 is bonded to the first PCB 40 and the other end is bonded to the bonding portion 13, ensuring that the first FPC 80 can effectively control and drive the screen 10.

[0100] Optionally, the first FPC80 uses flexible materials such as polyimide or polyester film as the substrate, which have excellent flexibility, bendability, and foldability. Conductive lines and mounting areas for electronic components are created on the flexible substrate through processes such as printing and etching. The surface is usually covered with a protective film, such as a cover film, to enhance the circuit board's resistance to environmental interference and prevent circuit oxidation or damage.

[0101] The most significant characteristic of FPC is its high flexibility, enabling flexible wiring in confined spaces or where bending and folding are required. It adapts to various complex shapes and spatial requirements, facilitating three-dimensional assembly and providing strong support for the miniaturization, weight reduction, and multifunctionality of electronic devices. Furthermore, FPC's light weight and thinness offer significant advantages in devices with stringent weight and space constraints.

[0102] The manufacturing process of FPC is more complex than that of PCB, requiring precise circuit pattern transfer and lamination on a flexible substrate. Due to the characteristics of the flexible substrate, special attention must be paid to material protection and process parameter control during manufacturing to ensure the reliability and flexibility of the circuit.

[0103] In one embodiment, the display module 100 further includes a second FPC 90, one end of which is pressed against the second PCB 50 and the other end is bonded to the first PCB 40, thereby ensuring stable signal transmission between the first PCB 40 and the second PCB 50.

[0104] Preferably, the second PCB 50 and the second FPC 90 form a rigid-flex board. Therefore, the second PCB 50 and the second FPC 90 can be supplied as a single unit, reducing the manufacturing process and cost of the display module 100.

[0105] In fabricating a rigid-flex PCB, the second PCB 50 and the second FPC 90 can be fabricated separately. This includes drilling, electroplating, and etching on the second PCB 50 to form circuit patterns and metallized holes; and thin-film deposition, photolithography, and etching on the second FPC 90 to create flexible circuit lines. The second PCB 50 and the second FPC 90 are then joined together using an adhesive bonding process, typically employing hot pressing or adhesives, to ensure reliable electrical and mechanical connections. Finally, surface treatment and testing are performed to inspect the rigid-flex PCB and ensure its electrical and mechanical properties meet requirements.

[0106] Reference Figure 2 As shown, in one embodiment, the second PCB 50 is located on the side of the bend 12 away from the first PCB 40. The orthographic projection of the second PCB 50 on the cover plate 20 does not overlap with the orthographic projection of the bend 12 on the cover plate 20, which avoids interference between the second PCB 50 and the bend 12 and facilitates fabrication. This also helps reduce mutual interference between signals.

[0107] Reference Figure 3As shown, in another embodiment, the second PCB 50 is located on the side of the bending portion 12 away from the first PCB 40. The orthographic projection of the second PCB 50 on the cover plate 20 overlaps with the orthographic projection of the bending portion 12 on the cover plate 20, thereby partially placing the second PCB 50 between the cover plate 20 and the bending portion 12. This helps to reduce the width of the area on the cover plate 20 that is not connected to the screen body 10, and further helps to reduce the width of the bezel, thus achieving a narrower bezel.

[0108] Reference Figure 3 As shown, in one embodiment, the display module 100 further includes double-sided adhesive tape 110, through which the second PCB 50 is bonded to the cover plate 20, ensuring the stability between the second PCB 50 and the cover plate 20. This also facilitates fabrication.

[0109] Optionally, the double-sided adhesive 110 is an acrylic double-sided adhesive, a silicone double-sided adhesive, or a hot melt adhesive double-sided adhesive, etc.

[0110] Among them, acrylic double-sided tape has good adhesion and weather resistance, and has a good adhesion effect on the surface of various materials, and can maintain stable performance under different environmental conditions.

[0111] Silicone-based double-sided adhesives possess excellent high-temperature resistance and flexibility, maintaining good adhesion even at high temperatures without corroding or causing other adverse effects on the surfaces of the second PCB 50 and the cover plate 20. They are suitable for display module manufacturing processes with high temperature resistance requirements, such as those involving high-temperature baking, where silicone-based double-sided adhesives perform better.

[0112] Hot melt adhesive double-sided tape exhibits good flowability and tack when heated, enabling rapid adhesion to the surfaces of the second PCB 50 and the cover plate 20, forming a strong bond upon cooling. Its advantages include high adhesive strength and fast curing speed, making it suitable for rapid bonding processes on automated production lines and improving production efficiency.

[0113] Based on the same inventive concept, another embodiment of this application discloses a display device, which includes the display module in the above embodiments. Furthermore, the display device includes mobile phones, VR devices, computers, televisions, in-vehicle display devices, etc.

[0114] This embodiment provides a display device, whose display module 100 includes a screen body 10, a first PCB 40, a second PCB 50, a first component 61, and a second component 71. The screen body 10 includes a display section 11, a bending section 12, and a bonding section 13 connected in sequence. The first PCB 40 is disposed on the side of the display section 11 away from the cover plate 20 and is electrically connected to the bonding section 13. The second PCB 50 is disposed on the same side of the screen body 10 opposite to the cover plate 20 and is electrically connected to the first PCB 40. The first component 61 is disposed on the side of the first PCB 40 away from the display section 11, and the second component 71 is disposed on the side of the second PCB 50 away from the cover plate 20. The height of the second component 71 is greater than the height of the first component 61. This is equivalent to placing the taller second component 71 and the shorter first component 61 on different PCBs. Since there is no screen 10 between the second PCB 50 and the cover plate 20, the overall thickness of the display module 100 can be effectively reduced, thus improving the performance of the display device.

[0115] Meanwhile, since the components are distributed on different PCBs, the wiring space is more spacious. The overall thickness of the display module 100 can be further reduced by compressing the thickness of the first PCB40 and the second PCB50, thereby improving the performance of the display device.

[0116] Although this application has been described in conjunction with specific embodiments thereof, many substitutions, modifications and variations of these embodiments will be apparent to those skilled in the art from the foregoing description.

[0117] It should be noted that the above description describes some embodiments of this application. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in a different order than that shown in the above embodiments and still achieve the desired result. Furthermore, the processes depicted in the drawings do not necessarily require a specific or sequential order to achieve the desired result. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0118] The embodiments of this application are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the embodiments of this application should be included within the protection scope of this application.

Claims

1. A display module, characterized in that, include: The screen body includes a display part, a bending part, and a bonding part connected in sequence. The display part and the bonding part are stacked and spaced apart from each other. The bending part is connected between the display part and the bonding part. A cover plate is disposed on the side of the display portion away from the bonding portion; The driving module is located on the side of the bonding portion away from the display portion and is connected to the bonding portion; A first PCB is disposed on the side of the display unit away from the cover plate. The first PCB is electrically connected to the bonding unit. The orthographic projection of the first PCB on the cover plate is located within the orthographic projection of the screen body on the cover plate. The second PCB is disposed on the same side of the screen body opposite to the cover plate. The second PCB is electrically connected to the first PCB. The orthographic projection of the second PCB on the cover plate does not overlap with the orthographic projection of the screen body on the cover plate. A first component group is disposed on the side of the first PCB away from the display section, and the first component group includes a plurality of first components; The second component group is disposed on the side of the second PCB away from the cover plate. The second component group includes a plurality of second components. Among the plurality of second components, the size of the largest second component is greater than the size of the largest first component in the plurality of first component groups along the thickness direction of the display module.

2. The display module according to claim 1, characterized in that, Along the thickness direction of the display module, the size of the smallest second component among the plurality of second components is greater than the size of the largest first component among the plurality of first component groups; Preferably, along the thickness direction of the display module, the size of the first component is less than or equal to 0.4 mm; the size of the second component is 1-1.2 mm. Preferably, along the thickness direction of the display module, the size of the first PCB is less than or equal to 0.4 mm, and the size of the second PCB is less than or equal to 0.4 mm. Preferably, along the thickness direction of the display module, the size of the first PCB is equal to the size of the second PCB.

3. The display module according to claim 1 or 2, characterized in that, The second component has a greater heat generation capacity than the first component.

4. The display module according to claim 1 or 2, characterized in that, Along the thickness direction of the display module, the sum of the dimensions of the first PCB and the first component is 1.4-1.6mm, and the sum of the dimensions of the second PCB and the second component is 1.4-1.6mm. Preferably, the shortest distance between the driving module and the cover plate along the thickness direction of the display module is 1.4-1.6 mm.

5. The display module according to claim 1, characterized in that, Along the thickness direction of the display module, the cover plate has a size of 0.4-0.5 mm; Preferably, the thickness of the display module is 1.8-2.2 mm.

6. The display module according to claim 1, characterized in that, The display module further includes a first FPC, and the first PCB and the bonding portion are connected through the first FPC; one end of the first FPC is bonded to the first PCB, and the other end is bonded to the bonding portion.

7. The display module according to claim 1, characterized in that, The display module further includes a second FPC, one end of which is pressed against the second PCB, and the other end is bonded to the first PCB; Preferably, the second PCB and the second FPC form a rigid-flex board.

8. The display module according to claim 1, characterized in that, The second PCB is located on the side of the bend away from the first PCB, and the orthographic projection of the second PCB on the cover plate does not overlap with the orthographic projection of the bend on the cover plate.

9. The display module according to claim 1, characterized in that, The display module also includes double-sided adhesive, and the second PCB is bonded to the cover plate by the double-sided adhesive.

10. A display device, characterized in that, Includes the display module as described in any one of claims 1-9.

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