Display panel, manufacturing process thereof and electronic device

Abstract

The application belongs to the technical field of display, and discloses a display panel, a manufacturing process thereof and electronic equipment, which comprises a screen body and a first conductive adhesive, the screen body comprises a display area and a bending area, the bending area comprises a planar section in a one-letter shape and a bending section in a C shape, the bending section connects the planar section and the display area, the planar section and the display area are arranged in parallel, and an insulating composite adhesive tape is arranged on one side of the planar section away from the display area; a first supporting film, a first insulating adhesive and a grounding layer are sequentially arranged on one side of the planar section close to the display area; the first supporting film and the planar section are provided with a through hole in communication; the first insulating adhesive is provided with a first through hole, and the through hole and the first through hole are in communication; the first conductive adhesive is arranged in the through hole and the first through hole, one end of the first conductive adhesive is connected to a conductive layer of the insulating composite adhesive tape, and the other end of the first conductive adhesive is connected to the grounding layer, so that the conductive layer and the grounding layer are conductively connected through the first conductive adhesive, and the problem of display failure caused by electrostatic breakdown of the bending area of the screen body is solved.

Description

Technical Field

[0001] This invention relates to the field of display technology, and more particularly to a display panel, its manufacturing process, and electronic equipment. Background Technology

[0002] In existing technology, the back of the display panel is covered with insulating composite tape, which consists of conductive cloth, insulating pads, and conductive adhesive. This tape prevents external charges from affecting the metal traces and components on the panel and transfers external static charges to the grounding terminal. However, both the grounding terminal and the conductive adhesive are located on one side of the bending area of ​​the panel. The distance between the grounding terminal and the bending area is relatively large, resulting in a long electrostatic discharge path and high electrostatic discharge pressure, which prevents static charges from being transferred to the grounding terminal to the maximum extent. Especially during ESD testing, instantaneous high voltage may directly damage the metal traces or components in the bending area of ​​the panel, causing display defects. Summary of the Invention

[0003] The purpose of this invention is to provide a display panel, its manufacturing process, and an electronic device that solves the problem of electrostatic discharge damaging the metal traces or devices in the bending area of ​​the screen, causing display defects.

[0004] To achieve this objective, the present invention adopts the following technical solution:

[0005] A display panel includes a screen body, an insulating composite tape, a first support film, a first insulating adhesive, a grounding layer, and a first conductive adhesive;

[0006] The screen body includes a display area and a bending area. The bending area includes a flat segment with a straight cross-section and a bending segment with a C-shape. The bending segment connects the flat segment and the display area. The flat segment and the display area are arranged in parallel. The flat segment is provided with a first opening.

[0007] The insulating composite tape is disposed on the side of the planar segment away from the display area;

[0008] The first support film, the first insulating adhesive, and the grounding layer are sequentially disposed on the side of the planar segment near the display area; the first support film has a second opening, and the first opening and the second opening are connected to form a through hole; the first insulating adhesive has a first through hole, and the through hole and the first through hole are connected.

[0009] The first conductive adhesive is disposed in the through hole and the first through hole. One end of the first conductive adhesive is connected to the conductive layer of the insulating composite tape, and the other end of the first conductive adhesive is connected to the grounding layer, so that the conductive layer and the grounding layer are electrically connected through the first conductive adhesive.

[0010] In some possible implementations, the through holes are provided in multiples.

[0011] In some possible implementations, the planar segment includes a first region and a second region, the first region being used to mount a device and the second region being used to connect to a flexible circuit board, both the first region and the second region being offset from the first opening.

[0012] In some possible implementations, the insulating composite tape further includes an insulating layer disposed between the conductive layer and the planar segment, the insulating layer having a first clearance hole, and the first conductive adhesive disposed in the first clearance hole to connect with the conductive layer.

[0013] In some possible implementations, a protective adhesive layer is also included, which covers the outside of the bent section and extends at one end between the planar section and the insulating composite tape, wherein the protective adhesive layer and the first clearance hole are offset from each other in the orthographic projection of the planar section.

[0014] In some possible implementations, the display area includes a third region and a fourth region, with the orthographic projection of the planar segment located in the third region; the display panel further includes a conductive component, with a first end connected to the conductive layer, a second end connected to the ground layer, and the orthographic projection of the second end located in the fourth region.

[0015] In some possible implementations, the display panel further includes a flexible circuit board, a second insulating adhesive, a second conductive adhesive, and a third conductive adhesive. The flexible circuit board is connected to the planar segment. The second conductive adhesive, the flexible circuit board, and the second insulating adhesive are sequentially located between the insulating composite tape and the grounding layer. The orthographic projection of the second insulating adhesive is located in the fourth region. The flexible circuit board has a first conductive connection portion and a second conductive connection portion on each side. The second conductive adhesive connects the conductive layer and the first conductive connection portion. The third conductive adhesive connects the second conductive connection portion and the grounding layer. The third conductive adhesive is embedded in the second insulating adhesive. The conductive component includes the second conductive adhesive, the third conductive adhesive, and the first and second conductive connection portions.

[0016] A manufacturing process for a display panel as described in any of the preceding claims, wherein the first conductive adhesive comprises a first portion, a second portion, and a third portion, and the manufacturing process for the display panel includes:

[0017] When the screen is unfolded, the second part is located in the first through hole and one end is connected to the grounding layer;

[0018] Bend the screen to a preset state;

[0019] The first part is disposed on the conductive layer of the insulating composite tape, and the insulating composite tape is connected to the side of the planar section opposite to the display area;

[0020] The insulating composite tape and the screen are squeezed together so that the first part and the second part fill the through hole to form the third part.

[0021] In some possible implementations, the first part and the second part are both films, respectively attached to the conductive layer and the first through hole; or, the first part and the second part are both adhesives, respectively coated on the conductive layer and the first through hole.

[0022] An electronic device comprising a display panel as described in any of the preceding claims.

[0023] The beneficial effects of this invention are:

[0024] This invention provides a display panel, its manufacturing process, and an electronic device. A first opening is provided in the planar section of the bending area of ​​the screen, and a second opening is simultaneously formed at the corresponding position of the first support film. The first and second openings are connected to form a through-hole. A first conductive adhesive is applied to the through-hole and the through-hole, connecting its two ends to the conductive layer and grounding layer of the insulating composite tape, respectively. The conductive layer, the first conductive adhesive, and the grounding layer form an electrostatic transfer path. External static charges are transferred sequentially through this path. Because the first conductive adhesive is located in the planar section of the bending area, the electrostatic transfer path is shortened, alleviating electrostatic transmission pressure. Especially during ESD testing, static electricity generated by instantaneous high voltage can be quickly transferred to the grounding end through the conductive adhesive, solving the problem of electrostatic discharge damaging the metal traces and components in the bending area of ​​the screen, causing display defects. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of a display panel provided in a specific embodiment of the present invention;

[0026] Figure 2 yes Figure 1 Enlarged view of point A;

[0027] Figure 3 This is a schematic diagram of the display panel before bending, provided in a specific embodiment of the present invention;

[0028] Figure 4 This is a flowchart of the display panel manufacturing process provided in a specific embodiment of the present invention.

[0029] In the picture:

[0030] 100. Screen body; 110. Display area; 111. Third area; 112. Fourth area; 120. Bending area; 121. Planar section; 1211. First opening; 122. Bending section;

[0031] 200. Insulating composite tape; 210. Insulating layer; 211. First clearance hole; 220. Conductive layer;

[0032] 300. First support membrane; 310. Second opening;

[0033] 400, First insulating adhesive; 410, First through hole;

[0034] 500. Composite foam tape; 510. Grounding layer; 520. Foam layer;

[0035] 600, First conductive adhesive; 610, First part; 620, Second part; 630, Third part;

[0036] 700, IC chips;

[0037] 800, Flexible circuit board; 810, First conductive connection part; 820, Second conductive connection part;

[0038] 900. Protective adhesive layer;

[0039] 1000, Second insulating adhesive; 1100, Second through hole; 2000, Second conductive adhesive; 3000, Third conductive adhesive; 4000, Second support film; 5000, Optical adhesive layer; 6000, Polarizing film; 7000, Cover plate;

[0040] a. Through hole. Detailed Implementation

[0041] To make the technical problems solved by the present invention, the technical solutions adopted, and the technical effects achieved clearer, the technical solutions of the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0042] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0043] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0044] like Figures 1-3 As shown, this embodiment provides a display panel, including a screen body 100, an insulating composite tape 200, a first support film 300, a first insulating adhesive 400, a grounding layer 510, and a first conductive adhesive 600.

[0045] The screen 100 includes a display area 110 and a bending area 120. The bending area 120 includes a flat segment 121 with a straight cross-section and a C-shaped bending segment 122. The bending segment 122 connects the flat segment 121 and the display area 110. The flat segment 121 and the display area 110 are arranged parallel to each other. An insulating composite tape 200 is disposed on the side of the flat segment 121 away from the display area 110. A first support film 300, a first insulating adhesive 400, and a grounding layer 510 are sequentially disposed on the side of the flat segment 121 near the display area 110. The flat segment 121 has a first opening 1211, and the first support film 300 has a second opening 310. The first opening 1211 and the second opening 310 are connected to form a through hole a. The first insulating adhesive 400 has a first through hole 410, and the through hole a and the first through hole 410 are connected. The first conductive adhesive 600 is disposed in the through hole a and the first through hole 410. One end of the first conductive adhesive 600 is connected to the conductive layer 220 of the insulating composite tape 200, and the other end of the first conductive adhesive 600 is connected to the grounding layer 510, so that the conductive layer 220 and the grounding layer 510 are electrically connected through the first conductive adhesive 600.

[0046] A first opening 1211 is provided in the planar segment 121 of the bending area 120 of the screen body 100, and a second opening 310 is simultaneously opened at the corresponding position of the first support film 300. The first opening 1211 and the second opening 310 are connected to form a through hole a. A first conductive adhesive 600 is provided in the through hole a and the through hole, so that the two ends of the first conductive adhesive 600 are connected to the conductive layer 220 and the grounding layer 510 of the insulating composite tape 200, respectively. The conductive layer 220, the first conductive adhesive 600 and the grounding layer 510 form an electrostatic transfer path. External static charges are transferred sequentially through the conductive layer 220, the first conductive adhesive 600 and the grounding layer 510, i.e., through this electrostatic transfer path. Since the first conductive adhesive 600 is located in the planar segment 121 of the bending area 120, the electrostatic transfer path of the planar segment 121 of the bending area 120 is shortened, and the electrostatic transmission pressure is alleviated. Especially during ESD testing, the static electricity generated by the instantaneous high voltage can be quickly transferred to the grounding terminal through the conductive adhesive, which solves the problem of electrostatic discharge damaging the metal traces and components in the bending area 120 of the screen body 100, causing display defects.

[0047] The planar segment 121 includes a first region and a second region. The first region is used to house a device, such as an IC chip 700, and the second region is used for metal traces to connect with the flexible circuit board 800. Both the first region and the second region are staggered from the first opening 1211 to prevent the first opening 1211 from damaging the device or metal trace of the planar segment 121, to prevent the first conductive adhesive 600 from interfering with the structure of the IC chip 700 or the flexible circuit board 800, and to facilitate structural layout.

[0048] Optionally, both the first region and the second region can be regular shapes such as rectangles, circles, and ellipses, or they can be irregular shapes. The first region may include one region or multiple regions. The second region may include one region or multiple regions, and there is no limitation on either. In this embodiment, the first region is rectangular and includes only one region, and the second region includes only one region.

[0049] Optionally, combined Figures 1-3 As shown, the first region is located in the middle of the planar segment 121, and the second region is located at the end of the planar segment 121 away from the bending segment 122. That is, the flexible circuit board 800 is connected to the end of the planar segment 121 away from the bending segment 122, and the second region is located at... Figure 2 The bottom of the first region. The through hole a can be located anywhere around the first region or the second region.

[0050] Optionally, a plurality of through holes a are provided, and the plurality of through holes a are all disposed away from the first region and the second region. Specifically, the planar segment 121 is provided with a plurality of first openings 1211, and the first support membrane 300 is provided with a plurality of second openings 310. The plurality of first openings 1211 and the plurality of second openings 310 are connected in a one-to-one correspondence, thereby forming a plurality of through holes a. By increasing the number of through holes a, the electrostatic transmission grounding area can be increased, thereby improving the electrostatic transmission effect.

[0051] Optionally, the through holes a are interspersed in the first region and the second region, and can be arranged in a regular or irregular manner.

[0052] like Figure 2 As shown, the planar segment 121 is provided with five first openings 1211, and the first support membrane 300 is provided with five second openings 310. The five first openings 1211 and the five second openings 310 are connected in a one-to-one correspondence, thereby forming five through holes a. The five through holes a are all connected to the first through hole 410, and the five through holes a are located on the outer periphery of the first region.

[0053] Optionally, the diameter of the through hole a can be set according to actual needs. By appropriately increasing the diameter of the through hole a, the electrostatic charge transfer area can be increased, and the transfer speed can be improved. By appropriately decreasing the diameter of the through hole a, the structural layout of the through hole a can be facilitated. When multiple through holes a are provided, the sizes of the multiple through holes a can all be the same, all be different, or some can be the same and others different; there is no limitation. In this embodiment, the five through holes a are all the same size.

[0054] The shape of the through hole 'a' can be any regular shape, such as a circle, rectangle, or ellipse, or it can be an irregular shape; there is no limitation. When multiple through holes 'a' are provided, the shapes of the multiple through holes 'a' can all be the same, all be different, or some can be the same and others different; there is no limitation. In this embodiment, the five through holes 'a' are all the same shape and are all circular holes.

[0055] When multiple through holes a are provided, the spacing between adjacent through holes a can be a fixed value or an indefinite value, and is not limited. In this embodiment, Figure 2 In the middle, three through holes a are equally spaced on the upper side of the first region, and the other two through holes a are located on the left and right sides of the first region, respectively.

[0056] The number of first through holes 410 can be one or more. For example, there may be several first through holes 410, and each of the several first through holes 410 is connected to a corresponding number of through holes a. Alternatively, there may be one first through hole 410, and several through holes a are all connected to the same first through hole 410. That is, the orthographic projection of the five through holes a is located within the first through hole 410. By increasing the opening area of ​​the first through hole 410, the electrostatic transmission grounding area is increased, thereby improving the electrostatic transmission effect.

[0057] Specifically, when there is only one first through hole 410, it can be any shape such as rectangular, circular, or elliptical, as long as the orthographic projection of all through holes a is located within the first through hole 410, ensuring the reliability of the connection between the first through hole 410 and the several through holes a. When there are several first through holes 410, the shape of the first through hole 410 is the same as the shape of the through hole a, that is, when the through hole a is a circular hole, then the first through hole 410 is a circular hole.

[0058] Specifically, when there is only one first through hole 410, the diameter of the first through hole 410 can be appropriately increased or decreased, as long as the orthographic projection of all through holes a is located within the first through hole 410. When there are multiple first through holes 410, the size of the first through hole 410 is the same as the size of the through hole a.

[0059] The first through hole 410 is located directly below the planar segment 121 to ensure a shorter electrostatic transfer path.

[0060] In this embodiment, there is one first through hole 410, which is rectangular in shape, and the orthographic projection of all through holes a is located within the first through hole 410. The cross-section of the first insulating adhesive 400 is rectangular, and the first through hole 410 is located in the middle of the first insulating adhesive 400, ensuring that the first insulating adhesive 400 plays a stable supporting role in connecting the first support film 300 and the grounding layer 510.

[0061] In other embodiments, the first insulating adhesive 400 may also have a plurality of first through holes 410, and the plurality of first through holes 410 and the plurality of through holes a are connected in a one-to-one correspondence. The configuration can be set according to the requirements and is not limited.

[0062] The insulating composite tape 200 also includes an insulating layer 210, which is disposed between the conductive layer 220 and the planar segment 121. The insulating layer 210 has a first clearance hole 211, and the first conductive adhesive 600 is disposed in the first clearance hole 211 to connect with the conductive layer 220. By providing the first clearance hole 211, the first conductive adhesive 600 can pass through the first clearance hole 211 to connect with the conductive layer 220.

[0063] Optionally, the number of first clearance holes 211 can be one or more. For example, there are several first clearance holes 211, and several first clearance holes 211 are connected to several through holes a one-to-one. Alternatively, there is one first clearance hole 211, and several through holes a are all connected to the same first clearance hole 211.

[0064] Specifically, when there is only one first clearance hole 211, it can be any shape such as rectangular, circular, or elliptical, as long as the orthographic projection of all through holes a is located within the first clearance hole 211. When there are multiple first clearance holes 211, the shape of the first clearance hole 211 is the same as the shape of the through hole a, that is, when the through hole a is a circular hole, the first clearance hole 211 is a circular hole.

[0065] Specifically, when there is only one first clearance hole 211, the diameter of the first clearance hole 211 can be appropriately increased or decreased, as long as the orthographic projection of all through holes a is located within the first clearance hole 211. When there are multiple first clearance holes 211, the size of the first clearance hole 211 is the same as the size of the through hole a.

[0066] The first clearance hole 211 is located directly above the planar segment 121 to ensure a shorter electrostatic transfer path.

[0067] In this embodiment, there is one first clearance hole 211, which is rectangular in shape. The orthographic projection of all through holes a is located within the first clearance hole 211, ensuring the reliability of the connection between the first clearance hole 211 and the through holes a. In other embodiments, the first insulating adhesive 400 may also have several first clearance holes 211, with each of the several first clearance holes 211 corresponding to and connected to several through holes a. This can be configured according to requirements and is not limited.

[0068] Optionally, the first conductive adhesive 600 includes a first portion 610, a second portion 620, and a third portion 630, which are connected sequentially. Specifically, the first portion 610 is disposed within the first clearance hole 211 for connection with the conductive layer 220 of the insulating composite tape 200; the second portion 620 is disposed within the first through hole 410, with one end connected to the grounding layer 510; and the third portion 630 is disposed within the through hole a, with both ends connected to the first portion 610 and the second portion 620, respectively. Further, the first portion 610 fills the first clearance hole 211, the second portion 620 fills the first through hole 410, and the third portion 630 fills the through hole a to improve connection reliability.

[0069] In one embodiment, the first conductive adhesive 600 includes a first conductive film and a second conductive film. The first conductive film is attached to the first clearance hole 211, and its bottom is connected to the conductive layer 220. The second conductive film is disposed in the first through hole 410, and its bottom is connected to the ground layer 510. Since the thickness of the screen body 100 and the thickness of the first support film 300 are both relatively thin, the thickness of the screen body 100 and the thickness of the first support film 300 can be referred to in the prior art, and will not be described in detail here. The first and second conductive films are pressed into the through hole a by means of extrusion or other methods. Specifically, the first and second conductive films are pressed into the through hole a from both sides, causing a portion of the first conductive film to form a first part 610 located within the first through hole 410, a portion of the second conductive film to form a second part 620 located within the first clearance hole 211, and another portion of the first and second conductive films to form a third part 630 located within the through hole a. This achieves the connection between the first conductive adhesive 600 and the conductive layer 220 and the ground layer 510. By setting the first conductive adhesive 600 as a first conductive film and a second conductive film, assembly is facilitated.

[0070] In another embodiment, the first conductive adhesive 600 includes a first coating portion and a second coating portion. The first coating portion is coated inside the first clearance hole 211, and the bottom of the first coating portion is connected to the conductive layer 220. The second coating portion is disposed inside the first through hole 410, and the bottom of the second coating portion is connected to the ground layer 510. Since the thickness of the screen body 100 and the thickness of the first support film 300 are both relatively thin, the thickness of the screen body 100 and the thickness of the first support film 300 can be referred to the prior art, and will not be described in detail here. The first and second adhesive coating portions are forced into the through hole a by means of extrusion or other methods. Specifically, the first and second adhesive coating portions are forced into the through hole a from both sides, forming a first portion 610 within the first through hole 410, a second portion 620 within the first clearance hole 211, and a third portion 630 within the through hole a. This achieves the connection between the first conductive adhesive 600 and the conductive layer 220 and the ground layer 510. By setting the first conductive adhesive 600 into first and second adhesive coating portions, assembly is facilitated, and the adhesive has good flowability, allowing the first and second adhesive coating portions to flow into the through hole a, thus improving conductivity.

[0071] When the first conductive adhesive 600 is set in the above manner, that is, the first part 610 and the second part 620 are respectively squeezed from both sides toward the middle into the through hole a to form the third part 630, then the first clearance hole 211 and the first through hole 410 are both set, which can facilitate the operation of the first conductive adhesive 600 by applying adhesive or coating adhesive, thereby improving work efficiency.

[0072] In some embodiments, a foam layer 520 and a second support film 4000 are further disposed between the planar segment 121 and the display area 110. The second support film 4000 is disposed close to the display area 110, and the foam layer 520 is disposed close to the ground layer 510. The ground layer 510 is a copper foil layer, and the foam layer 520 and the ground layer 510 form a composite foam tape 500.

[0073] Display area 110 includes a third region 111 and a fourth region 112. The orthographic projection of the planar segment 121 is located in the third region 111. The display panel also includes a conductive component. The first end of the conductive component is connected to the conductive layer 220, and the second end is connected to the ground layer 510. The orthographic projection of the second end is located in the fourth region 112. By setting the conductive component, one end of the planar segment 121 and the conductive component are respectively connected to the ground layer 510, and the other end is respectively connected to the conductive layer 220 of the insulating composite tape 200. The conductive layer 220, the conductive component, and the ground layer 510 form a second electrostatic transfer path. External static charges are transferred sequentially through the conductive layer 220, the conductive component, and the ground layer 510, i.e., through this electrostatic transfer path, relieving the electrostatic transmission pressure. External static charges are transferred through two electrostatic transfer paths, increasing the electrostatic transmission grounding area, enhancing the electrostatic charge transmission capability, reducing the electrostatic transmission pressure, improving the electrostatic transmission effect, and further solving the problem of poor display. In addition, the planar segment 121 and the conductive component are respectively disposed in the third region 111 and the fourth region 112 of the display area 110, which facilitates the structural layout and prevents structural interference.

[0074] The display panel also includes a flexible circuit board 800, a second insulating adhesive 1000, a second conductive adhesive 2000, and a third conductive adhesive 3000. The flexible circuit board 800 is connected to the planar segment 121. The second conductive adhesive 2000, the flexible circuit board 800, and the second insulating adhesive 1000 are sequentially located between the insulating composite tape 200 and the grounding layer 510. The orthographic projection of the second insulating adhesive 1000 is located in the fourth region 112. The flexible circuit board 800 has a first conductive connection portion 810 and a second conductive connection portion 820 respectively on both sides. The second conductive adhesive 2000 connects the conductive layer 220 and the first conductive connection portion 810. The third conductive adhesive 3000 connects the second conductive connection portion 820 and the grounding layer 510. The third conductive adhesive 3000 is embedded in the second insulating adhesive 1000. The conductive component includes the second conductive adhesive 2000, the third conductive adhesive 3000, and the first conductive connection portion 810 and the second conductive connection portion 820. Specifically, the conductive layer 220, the second conductive adhesive 2000, the first conductive connection portion 810, the second conductive connection portion 820, the third conductive adhesive 3000, and the grounding layer 510 are connected to form a second electrostatic transfer path. External static charges are sequentially transferred through the conductive layer 220, the second conductive adhesive 2000, the first conductive connection portion 810, the second conductive connection portion 820, the third conductive adhesive 3000, and the grounding layer 510. By fully utilizing the structure of the flexible circuit board 800, electrostatic transfer is achieved, avoiding the need for additional structural components and simplifying the structure.

[0075] Specifically, the first conductive connection portion 810 and the second conductive connection portion 820 are copper foils on both sides of the flexible circuit board 800, and the two copper foils are connected by copper, so that the first conductive connection portion 810 and the second conductive connection portion 820 can be electrically connected to realize electrostatic charge transfer.

[0076] Optionally, the insulating composite tape 200 includes an insulating layer 210 and a conductive layer 220. The insulating layer 210 has a second clearance hole, and the second conductive adhesive 2000 is disposed in the second clearance hole. Optionally, the shape and size of the second clearance hole are adapted to the first conductive connection portion 810 to ensure connection reliability, maximize the flow of static charge, increase the flow speed, and reduce electrostatic transmission pressure.

[0077] The second insulating adhesive 1000 has a second through hole 1100, and the third conductive adhesive 3000 is disposed in the second through hole 1100. Optionally, the shape and size of the third through hole are adapted to the second conductive connection part 820 to ensure connection reliability, maximize the flow of static charge, increase the flow speed, and reduce electrostatic transmission pressure.

[0078] The display panel also includes a protective adhesive layer 900, which covers the outer side of the bent section 122 and extends at one end between the flat section 121 and the insulating composite tape 200. The protective adhesive layer 900 and the first clearance hole 211 are offset from each other in their orthogonal projections on the flat section 121. By providing the protective adhesive layer 900, a certain degree of electrostatic protection is provided for the bent section 122, improving its antistatic performance. Specifically, the protective adhesive layer 900 is formed by applying protective adhesive to the bent section 122. Since the structure of the bent area 120 of the screen body 100 is relatively thin, it is impossible to increase the adhesion pressure to ensure the adhesion effect. By extending the protective adhesive layer 900 between the flat section 121 and the insulating composite tape 200, the adhesion effect is improved. By offsetting the orthogonal projections of the protective adhesive layer 900 and the first clearance hole 211 on the flat section 121, structural interference is avoided, which would affect the performance.

[0079] Optionally, the flexible circuit board 800 is provided with devices, and the planar segment 121 is provided with devices such as IC chip 700. Since the height of different devices is different, the height of the side facing the insulating composite tape 200 is uneven. The insulating composite tape 200 can be adapted to the height of different devices.

[0080] Optionally, a polarizer 6000, an optical adhesive layer 5000, and a cover plate 7000 are sequentially provided on the side of the display area 110 away from the planar section 121. The specific configuration can be based on existing technology and is not limited.

[0081] Optionally, the optical adhesive used in the optical adhesive layer 5000, the protective adhesive used in the protective adhesive layer 900, the adhesive used in the first insulating adhesive 400, the adhesive used in the first conductive adhesive 600, the adhesive used in the second insulating adhesive 1000, and the adhesive used in the second conductive adhesive 2000 can all refer to the existing technology and will not be described in detail here.

[0082] like Figures 1-4 As shown, this embodiment also provides a manufacturing process for a display panel as described above. The first conductive adhesive 600 in the display panel includes a first portion 610, a second portion 620, and a third portion 630. The manufacturing process for the display panel includes:

[0083] S100, when the screen 100 is unfolded, the second part 620 is located in the first through hole 410 and one end is connected to the grounding layer 510.

[0084] S200, bend the screen body 100 to the preset state;

[0085] S300, the first part 610 is disposed on the conductive layer 220 of the insulating composite tape 200, and the insulating composite tape 200 is connected to the side of the planar section 121 away from the display area 110.

[0086] S400, the insulating composite tape 200 and the screen 100 are compressed, so that the first part 610 and the second part 620 fill the through hole a to form the third part 630. Specifically, the insulating composite tape 200 includes a conductive layer 220 and an insulating layer 210. The insulating layer 210 has a first clearance hole 211. The first part 610 is disposed in the first clearance hole 211 for connection with the conductive layer 220 of the insulating composite tape 200. The second part 620 is disposed in the first through hole 410. One end of the second part 620 is used to connect with the grounding layer 510. The third part 630 is disposed in the through hole a, and its two ends are respectively connected to the first part 610 and the second part 620.

[0087] Through the above method, the first conductive adhesive 600 is made to penetrate the first clearance hole 211, the through hole a and the first through hole 410, and the first part 610, the third part 630 and the second part 620 are connected in sequence, and the two ends are connected to the ground layer 510 and the conductive layer 220 respectively. The manufacturing process is simple, convenient and reliable.

[0088] Furthermore, the first part 610 fills the first clearance hole 211, the second part 620 fills the first through hole 410, and the third part 630 fills the through hole a to improve connection reliability.

[0089] Specifically, the display panel also includes a flexible circuit board 800, a second insulating adhesive 1000, a second conductive adhesive 2000, and a third conductive adhesive 3000. The flexible circuit board 800 is connected to the planar segment 121. The second conductive adhesive 2000, the flexible circuit board 800, and the second insulating adhesive 1000 are sequentially located between the insulating composite tape 200 and the grounding layer 510. The orthographic projection of the second insulating adhesive 1000 is located in the fourth region 112. The flexible circuit board 800 has a first conductive connection portion 810 and a second conductive connection portion 820 respectively on both sides. The second conductive adhesive 2000 connects the conductive layer 220 and the first conductive connection portion 810. The third conductive adhesive 3000 connects the second conductive connection portion 820 and the grounding layer 510. The third conductive adhesive 3000 is embedded in the second insulating adhesive 1000. The conductive component includes the second conductive adhesive 2000, the third conductive adhesive 3000, and the first conductive connection portion 810 and the second conductive connection portion 820. The conductive layer 220, the second conductive adhesive 2000, the first conductive connection portion 810, the second conductive connection portion 820, the third conductive adhesive 3000, and the grounding layer 510 are connected to form a second electrostatic transfer path. External static charges are electrostatically transferred sequentially through the conductive layer 220, the second conductive adhesive 2000, the first conductive connection portion 810, the second conductive connection portion 820, the third conductive adhesive 3000, and the grounding layer 510.

[0090] The display panel includes a screen body 100, an insulating composite tape 200 (specifically including an insulating layer 210 and a conductive layer 220, the insulating layer 210 having a first clearance hole 211 pre-formed), a first support film 300 (with a second opening 310 pre-formed), a first insulating adhesive 400 (with a first through hole 410 pre-formed), a composite foam tape 500 (specifically including a grounding layer 510 and a foam layer 520), a flexible circuit board 800 (with IC chip 700 and other devices, and a first conductive connection part 810 and a second conductive connection part 820 that are electrically connected to each other), a protective adhesive layer 900, a second insulating adhesive 1000, a second conductive adhesive 2000, a third conductive adhesive 3000, a second support film 4000, an optical adhesive layer 5000, a polarizer 6000, and a cover plate 7000, etc. Specifically, the above structure is assembled before step S100, or the above structure can be supplied as raw material.

[0091] For example, when assembling the above structure, the steps include: a second support film 4000 and a composite foam tape 500 are sequentially disposed on the display area 110 of the screen 100; a first insulating adhesive 400 and a second insulating adhesive 1000 are both disposed on the grounding layer 510. A first support film 300 is disposed on the planar segment 121 of the bending area 120. A flexible circuit board 800 is disposed on the planar segment 121 of the bending area 120 of the screen 100. A second conductive adhesive 2000 and a third conductive adhesive 3000 are respectively disposed on the second through holes 1100 of the conductive layer 220 and the second insulating adhesive 1000, and then correspondingly connected to the first conductive connection portion 810 and the second conductive connection portion 820 of the flexible circuit board 800. A protective adhesive layer 900 is coated on the bending segment 122, and a polarizer 6000, an optical adhesive layer 5000, and a cover plate 7000 are sequentially disposed on one side of the display area 110.

[0092] Specifically, steps S100 and S300 can be performed simultaneously, or steps S100 and S300 can be performed sequentially, or steps S300 and S100 can be performed sequentially. The order of steps S100, S200 and S300 can be arranged according to requirements and is not limited, as long as it satisfies the requirement of compressing the insulating composite tape 200 and the screen 100 so that the first part 610 and the second part 620 fill the through hole a to form the third part 630.

[0093] In one embodiment, both the first portion 610 and the second portion 620 are films, respectively attached to the conductive layer 220 and the first through-hole 410. Specifically, the first portion 610 is a first conductive film, and the second portion 620 is a second conductive film. The first conductive film is attached inside the first clearance hole 211, and its bottom is connected to the conductive layer 220. The second conductive film is disposed inside the first through-hole 410, and its bottom is connected to the ground layer 510. Since the thickness of the screen body 100 and the thickness of the first support film 300 are both relatively thin, the thickness of the screen body 100 and the thickness of the first support film 300 can be referred to in the prior art, and will not be described in detail here. The first and second conductive films are pressed into the through hole a by means of extrusion or other methods. Specifically, the first and second conductive films are pressed into the through hole a from both sides, causing a portion of the first conductive film to form a first part 610 located within the first through hole 410, a portion of the second conductive film to form a second part 620 located within the first clearance hole 211, and another portion of the first and second conductive films to form a third part 630 located within the through hole a. This achieves the connection between the first conductive adhesive 600 and the conductive layer 220 and the ground layer 510. By setting the first conductive adhesive 600 as a first conductive film and a second conductive film, assembly is facilitated.

[0094] In another embodiment, both the first portion 610 and the second portion 620 are adhesives, respectively coated on the conductive layer 220 and the first through-hole 410. Specifically, the first conductive adhesive 600 includes a first adhesive coating portion and a second adhesive coating portion. The first adhesive coating portion is coated inside the first clearance hole 211, and the bottom of the first adhesive coating portion is connected to the conductive layer 220. The second adhesive coating portion is disposed inside the first through-hole 410, and the bottom of the second adhesive coating portion is connected to the ground layer 510. Since the thickness of the screen body 100 and the thickness of the first support film 300 are both relatively thin, the thickness of the screen body 100 and the thickness of the first support film 300 can be referred to the prior art, and will not be described in detail here. The first and second adhesive coating portions are forced into the through hole a through extrusion or other means. Specifically, the first and second adhesive coating portions are forced into the through hole a from both sides, forming a first portion 610 within the first through hole 410, a second portion 620 within the first clearance hole 211, and a third portion 630 within the through hole a. This achieves the connection between the first conductive adhesive 600 and the conductive layer 220 and the ground layer 510. By setting the first conductive adhesive 600 into first and second adhesive coating portions, assembly is facilitated, and the adhesive has good flowability, allowing the first and second adhesive coating portions to flow into the through hole a, better filling the first through hole 410, the first clearance hole 211, and the through hole a, thus improving conductivity.

[0095] This embodiment also provides an electronic device, including the display panel described above. Specifically, the electronic device can be a smartphone, monitor, television, tablet computer, laptop computer, e-reader such as Kindle, game console, and surveillance camera, etc. Because the display panel has good anti-static properties, the electronic device using the above-described display panel has stable display functionality, thereby ensuring the user experience of the electronic device and improving its market competitiveness.

[0096] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A display panel, characterized in that, It includes a screen body (100), an insulating composite tape (200), a first support film (300), a first insulating adhesive (400), a grounding layer (510), and a first conductive adhesive (600); The screen (100) includes a display area (110) and a bending area (120). The bending area (120) includes a planar segment (121) with a straight cross-section and a bending segment (122) with a C-shape. The bending segment (122) connects the planar segment (121) and the display area (110). The planar segment (121) and the display area (110) are arranged in parallel. The planar segment (121) is provided with a first opening (1211). The insulating composite tape (200) is disposed on the side of the planar segment (121) away from the display area (110); The first support film (300), the first insulating adhesive (400), and the grounding layer (510) are sequentially disposed on the side of the planar segment (121) near the display area (110); the first support film (300) has a second opening (310), and the first opening (1211) and the second opening (310) are connected to form a through hole (a); the first insulating adhesive (400) has a first through hole (410), and the through hole (a) and the first through hole (410) are connected; The first conductive adhesive (600) is disposed in the through hole (a) and the first through hole (410). One end of the first conductive adhesive (600) is connected to the conductive layer (220) of the insulating composite tape (200), and the other end of the first conductive adhesive (600) is connected to the grounding layer (510) so that the conductive layer (220) and the grounding layer (510) are electrically connected through the first conductive adhesive (600).

2. The display panel according to claim 1, characterized in that, The through hole (a) has several holes.

3. The display panel according to claim 1, characterized in that, The planar segment (121) includes a first region and a second region. The first region is used to set the device, and the second region is used to connect to the flexible circuit board (800). Both the first region and the second region are offset from the first opening (1211).

4. The display panel according to claim 1, characterized in that, The insulating composite tape (200) further includes an insulating layer (210), which is disposed between the conductive layer (220) and the planar segment (121). The insulating layer (210) is provided with a first clearance hole (211), and the first conductive adhesive (600) is disposed in the first clearance hole (211) to connect with the conductive layer (220).

5. The display panel according to claim 4, characterized in that, It also includes a protective adhesive layer (900) that covers the outside of the bent section (122) and extends at one end between the planar section (121) and the insulating composite tape (200). The protective adhesive layer (900) and the first clearance hole (211) are offset from each other in their orthographic projections on the planar section (121).

6. The display panel according to any one of claims 1-5, characterized in that, The display area (110) includes a third region (111) and a fourth region (112), and the orthographic projection of the planar segment (121) is located in the third region (111); the display panel also includes a conductive component, the first end of which is connected to the conductive layer (220), the second end of which is connected to the ground layer (510), and the orthographic projection of the second end is located in the fourth region (112).

7. The display panel according to claim 6, characterized in that, The display panel further includes a flexible circuit board (800), a second insulating adhesive (1000), a second conductive adhesive (2000), and a third conductive adhesive (3000). The flexible circuit board (800) is connected to the planar segment (121). The second conductive adhesive (2000), the flexible circuit board (800), and the second insulating adhesive (1000) are sequentially located between the insulating composite tape (200) and the grounding layer (510). The orthographic projection of the second insulating adhesive (1000) is located in the fourth region (112). Conductive connections are respectively provided on both sides of the flexible circuit board (800). The conductive component includes a first conductive connection portion (810) and a second conductive connection portion (820), the second conductive adhesive (2000) connecting the conductive layer (220) and the first conductive connection portion (810), the third conductive adhesive (3000) connecting the second conductive connection portion (820) and the ground layer (510), and the third conductive adhesive (3000) embedded in the second insulating adhesive (1000); the conductive component includes the second conductive adhesive (2000), the third conductive adhesive (3000), and the first conductive connection portion (810) and the second conductive connection portion (820) that are conductively connected.

8. A manufacturing process for a display panel as described in any one of claims 1-7, characterized in that, The first conductive adhesive (600) includes a first part (610), a second part (620), and a third part (630). The manufacturing process of the display panel includes: In the unfolded state of the screen (100), the second part (620) is located in the first through hole (410) and one end is connected to the ground layer (510); Bending the screen (100) to a preset state; The first part (610) is disposed on the conductive layer (220) of the insulating composite tape (200), and the insulating composite tape (200) is connected to the side of the planar segment (121) away from the display area (110); The insulating composite tape (200) and the screen (100) are squeezed together so that the first part (610) and the second part (620) fill the through hole (a) to form the third part (630).

9. The manufacturing process of the display panel according to claim 8, characterized in that, The first part (610) and the second part (620) are both films, which are respectively attached to the conductive layer (220) and the first through hole (410); or, the first part (610) and the second part (620) are both adhesives, which are respectively coated on the conductive layer (220) and the first through hole (410).

10. An electronic device, characterized in that, Includes the display panel as described in any one of claims 1-7.

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