Display device and electronic device including the same

Abstract

The present application relates to a display device and an electronic apparatus including the same. The display device includes a display panel, a digitizer having a first side disposed on a side surface of the display panel and including a folded portion. A panel support is between the display panel and the digitizer. A center rod is at a second side of the digitizer. The center rod is positioned to overlap the folded portion in a thickness direction of the display panel. A wing plate is disposed at each of opposite sides of the center rod in a first direction. A gap as a separation space is defined between each of the wing plates and the center rod. The folded portion includes a first area including a first hole and a second area overlapping the gap in the thickness direction of the display panel.

Description

Technical Field

[0001] The embodiments relate to display devices and electronic devices including display devices. Background Technology

[0002] Display devices are devices that display moving and / or still images to provide visual information to users. With the advancement of the information society, flexible display devices that can transform into various shapes have become increasingly popular. Unlike flat panel displays, flexible displays can be folded, bent, or rolled up like paper. Flexible display devices are easy to carry and can increase portability and user convenience.

[0003] In addition, the display device may include a digitizer that detects input applied from an external device. For example, the digitizer may be driven using electromagnetic resonance (EMR). Summary of the Invention

[0004] Embodiments of this disclosure may provide foldable display devices with improved reliability and electronic devices including foldable display devices.

[0005] However, the technical objectives addressed by this disclosure are not limited to those described above, and other objectives not described herein will be clearly understood by those skilled in the art from the following description of this disclosure.

[0006] According to an embodiment of this disclosure, a display device includes a display panel. A digitizer has a first side disposed on a side surface of the display panel. The digitizer includes a folded portion. A panel support member is located between the display panel and the digitizer in the thickness direction of the display panel. A central rod is located on a second side of the digitizer opposite to the first side of the digitizer. The central rod is positioned to overlap with the folded portion in the thickness direction of the display panel. Wings are respectively disposed on opposite sides of the central rod in a first direction intersecting the thickness direction of the display panel. A gap, serving as a separation space, is defined between each of the wings and the central rod. The folded portion includes: a first region including a first hole; and a second region overlapping the gap in the thickness direction of the display panel.

[0007] In one embodiment, the maximum extension distance of the first region when the display device is folded can be greater than the maximum extension distance of the second region when the display device is folded.

[0008] In one embodiment, the second region includes a second hole that has at least one of a different size and shape from the first hole in a plan view.

[0009] In one embodiment, the width of each of the first holes in the first direction may be less than the width of each of the first holes in the second direction intersecting the first direction, and the second hole may have the same shape as the first hole, and the area of ​​the second hole in the plan view may be less than the area of ​​the first hole in the plan view.

[0010] In an embodiment, each of the second holes may include an extension portion extending in a second direction intersecting the first direction and an expansion portion disposed at the opposite end of the extension portion, and in the first direction, the width of at least one region of each of the expansion portions may be greater than the width of the extension portion.

[0011] In an implementation, the expanded portion may have at least one planar shape selected from circular, elliptical, triangular, and quadrilateral shapes.

[0012] In an implementation, the aperture ratio of the first region can be greater than that of the second region.

[0013] In one embodiment, the display device may further include an adhesive portion disposed between the panel support and the digitizer, and the adhesive portion may be configured to overlap the gap at least in the thickness direction of the display panel.

[0014] In one embodiment, the adhesive portion may overlap at least with the folded portion in the thickness direction of the display panel, and the modulus of the adhesive portion may be less than or equal to about 0.2 MPa.

[0015] In one implementation, the digitizer may include sensing coils disposed between adjacent first holes.

[0016] According to an embodiment of this disclosure, a display device includes a display panel. A digitizer has a first side disposed on a side surface of the display panel. The digitizer includes a folded portion. A panel support is located between the display panel and the digitizer in the thickness direction of the display panel. An adhesive portion is disposed between the panel support and the digitizer. A center rod is located on a second side of the digitizer opposite to the first side of the digitizer. The center rod is positioned to overlap the folded portion in the thickness direction of the display panel. Wings are respectively disposed on opposite sides of the center rod in a first direction intersecting the thickness direction of the display panel. A gap, serving as a separation space, is defined between each of the wings and the center rod. The adhesive portion is configured to overlap at least with the gap in the thickness direction of the display panel.

[0017] In one embodiment, the adhesive portion may overlap at least with the folded portion in the thickness direction of the display panel, and the modulus of the adhesive portion may be less than or equal to about 0.2 MPa.

[0018] In one embodiment, the folded portion may include a first region having a first hole and a second region overlapping the gap in the thickness direction of the display panel.

[0019] In one embodiment, the maximum extension distance of the first region when the display device is folded can be greater than the maximum extension distance of the second region when the display device is folded.

[0020] In one embodiment, the second hole is disposed in the second region and has at least one of different sizes and shapes from the first hole in the plan view.

[0021] In one embodiment, the width of each of the first holes in the first direction may be less than the width of each of the first holes in the second direction intersecting the first direction, and the second hole may have the same shape as the first hole, and the area of ​​the second hole in the plan view may be less than the area of ​​the first hole in the plan view.

[0022] In an embodiment, each of the second holes may include an extension portion extending in a second direction intersecting the first direction and an expansion portion disposed at the opposite end of the extension portion, and in the first direction, the width of at least one region of each of the expansion portions may be greater than the width of the extension portion.

[0023] In an implementation, the expanded portion may have at least one planar shape selected from circular, elliptical, triangular, and quadrilateral shapes.

[0024] In an implementation, the aperture ratio of the first region can be greater than that of the second region.

[0025] According to embodiments of this disclosure, an electronic device includes: a display device; a memory for storing data information; a processor configured to send data information to the display device; and a power module configured to provide and generate power. The display device includes a display panel. A digitizer has a first side disposed on a side surface of the display panel. The digitizer includes a folded portion. A panel support is located between the display panel and the digitizer in the thickness direction of the display panel. A center rod is located on a second side of the digitizer opposite to the first side of the digitizer. The center rod is positioned to overlap with the folded portion in the thickness direction of the display panel. Wings are respectively disposed on opposite sides of the center rod in a first direction intersecting the thickness direction of the display panel. A gap, serving as a separation space, is defined between each of the wings and the center rod. The folded portion includes: a first region including a first hole; and a second region overlapping the gap in the thickness direction of the display panel. Attached Figure Description

[0026] The accompanying drawings illustrate embodiments of the present disclosure and, together with the detailed description below, serve to provide a further understanding of the technical spirit of the present disclosure. However, the embodiments of the present disclosure should not be construed as limited to the details shown in the accompanying drawings, in which: Figure 1 This is a perspective view showing the unfolded shape of a display device according to an embodiment of the present disclosure; Figure 2 and Figure 3 It is shown Figure 1 A three-dimensional view of the folded shape of the display device; Figure 4 yes Figure 1 An exploded perspective view of the display device; Figure 5 It is shown Figure 1 A cross-sectional view of the display device; Figure 6 It is shown that it includes Figure 1 A schematic cross-sectional view of a portion of the display panel in a display device; Figure 7 and Figure 8 This is a plan view showing a digitizer according to an embodiment of the present disclosure; Figure 9 It is shown Figure 7 A floor plan of an example of region B; Figure 10 It is shown Figure 7 A schematic plan view of another example of area B; Figure 11 It is shown Figure 7 A schematic plan view of another example of area B; Figure 12 It is shown Figure 5 A schematic cross-sectional view of an example of region A; Figure 13 It is shown Figure 5 A schematic cross-sectional view of another example of region A; Figure 14 This is a block diagram illustrating an electronic device according to an embodiment of the present disclosure; and Figure 15 A schematic diagram illustrating an electronic device according to an embodiment of the present disclosure is shown. Detailed Implementation

[0027] Because this disclosure can be applied in various variations and has various implementations, exemplary embodiments will be shown in the accompanying drawings and described in detail in specific embodiments. The effects and features of this disclosure, and the methods for achieving the effects and features of this disclosure, will become clear with reference to the embodiments described in detail below in conjunction with the accompanying drawings. However, this disclosure is not limited to the embodiments disclosed below and can be implemented in various forms.

[0028] In the following embodiments, the terms first, second, etc., are not limiting in meaning, but are used to distinguish one component from another.

[0029] In the following implementation, unless the context clearly indicates otherwise, expressions such as “a,” “an,” and “the” used in the singular are also intended to include the plural forms.

[0030] In the following implementation, it will be understood that terms such as “comprising,” “including,” and “having” specify the presence of the stated features or components, but do not exclude the presence or addition of one or more other features or components.

[0031] In the following embodiments, when a unit, region, component, etc. is located on or above another part, this disclosure includes not only the case where the unit, region, component, etc. is directly above another part, but also the case where other units, other regions, other components, etc. can be located between them.

[0032] In the following implementation, unless the terms “connection” or “linkage” are clearly different in the context, the terms “connection” or “linkage” do not necessarily mean a direct connection or linking of two components, and / or a fixed connection or linking, but do not exclude components located between two components.

[0033] In the accompanying drawings, the dimensions of the components may be exaggerated or reduced for ease of description. For example, the dimensions and / or thicknesses of the various components shown in the drawings may be arbitrarily depicted for ease of description, and therefore one or more embodiments are not necessarily limited thereto.

[0034] In the following, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings, wherein the same reference numerals denote the same or corresponding parts throughout the drawings, and redundant descriptions thereof will be omitted.

[0035] The display device includes a display panel, a digitizer comprising a non-folding portion and a folding portion, a central rod overlapping the folding portion, and wing plates on the opposite side of the central rod. A gap is defined between each of the wing plates and the central rod.

[0036] The folding portion includes a first region with a first hole and a second region overlapping the gap. The hole (e.g., a through hole) may not be provided in the second region, or the size of the second hole in the second region may be smaller than the size of the first hole. The maximum elongation / maximum elongation rate of the second region is less than that of the first region to prevent damage to the digitizer due to it being stuck or clamped between the center rod and the wing plate when the display device is folded / unfolded. Therefore, the impact resistance of the folding portion can be increased, and the reliability of the circuit interconnects provided in the folding portion can be improved.

[0037] Figure 1 This is a perspective view showing the unfolded shape of a display device DD according to an embodiment of the present disclosure. Figure 2 and Figure 3 It is shown Figure 1 A three-dimensional view of the folded shape of the display device DD. For example, Figure 2 It is shown Figure 1 A perspective view of the inward folding shape of the display device DD, and Figure 3 It is shown Figure 1 A perspective view of the outward folding shape of the display device DD.

[0038] In this specification, the plane may be defined on a first direction DR1 and a second direction DR2 intersecting the first direction DR1. For example, in an embodiment, the first direction DR1 and the second direction DR2 may be perpendicular to each other. The normal direction of the plane (that is, the thickness direction of the display device DD) may be a third direction DR3. For example, the third direction DR3 may be perpendicular to each of the first direction DR1 and the second direction DR2. However, embodiments of this disclosure are not necessarily limited to this, and the first direction DR1 to the third direction DR3 may intersect each other at various different angles (e.g., cross each other).

[0039] refer to Figure 1 , Figure 2 and Figure 3 The display device DD may include a display area DA, a transmission area TA, and a non-display area NDA.

[0040] The display area DA can be an area that generates light and displays an image. Multiple pixels can be arranged in the display area DA. For example, the pixels can be arranged in a matrix on a first direction DR1 and a second direction DR2 intersecting the first direction DR1. For example, the first direction DR1 and the second direction DR2 can be perpendicular to each other. Each pixel can generate light according to a driving signal. Therefore, an image can be displayed in the display area DA. For example, in the display area DA, an image can be displayed on a third direction DR3 that intersects each of the first direction DR1 and the second direction DR2. For example, the third direction DR3 can be perpendicular to each of the first direction DR1 and the second direction DR2.

[0041] The non-display area NDA can be an area where no image is displayed. The non-display area NDA can (e.g., in a plan view) be located around the display area DA. In a plan view, the non-display area NDA can surround at least a portion of the display area DA. However, embodiments of this disclosure are not necessarily limited to this, and images can be displayed in at least a portion of the non-display area NDA. For example, light-emitting pixels can be disposed in at least a portion of the non-display area NDA.

[0042] The transmissive region TA can have a higher transmittance than the display region DA and the non-display region NDA. In an embodiment, the display device DD can capture external images using visible light passing through the transmissive region TA, and may also include a sensor that determines the proximity of external objects by using infrared light. In a plan view, the sensor may overlap with the transmissive region TA. For example, the transmissive region TA may be located within the display region DA. However, embodiments of this disclosure are not necessarily limited thereto, and in some embodiments, in a plan view, the transmissive region TA may be located within the non-display region NDA, or may be surrounded by the display region DA and the non-display region NDA.

[0043] like Figure 2 As shown, the display device DD can be a foldable display device. For example, the display device DD can be folded along a virtual first folding axis AX1 extending in the second direction DR2.

[0044] The display device DD may include a folded region FA and non-folded regions NFA1 and NFA2. The folded region FA may be an area in which the display device DD bends or folds (e.g., foldable or otherwise deformable). The folded region FA may be bent or folded about a first folding axis AX1. The non-folded regions NFA1 and NFA2 may be areas in which the display device DD does not bend or fold (e.g., non-foldable). In an embodiment, the non-folded regions NFA1 and NFA2 may include a first non-folded region NFA1 and a second non-folded region NFA2 spaced apart from each other (e.g., in a first direction DR1). The folded region FA may be located between the first non-folded region NFA1 and the second non-folded region NFA2. For example, in an embodiment, the first non-folded region NFA1 may be adjacent to the folded region FA in a direction opposite to the first direction DR1, and the second non-folded region NFA2 may be adjacent to the folded region FA in the first direction DR1.

[0045] The display device DD can be folded inward along the first folding axis AX1. Here, "inward folding" can refer to the way the display area DA is set and folded inward.

[0046] However, the embodiments of this disclosure are not necessarily limited thereto, and as follows Figure 3 As shown, the display device DD can be folded along a virtual second folding axis AX2 extending in the second direction DR2. In this case, the display device DD can be folded outward along the second folding axis AX2. Here, outward folding can refer to the way the display area DA is set outward and folded.

[0047] For example, in one embodiment, the display device DD can operate around a folding axis in an inward or outward manner.

[0048] exist Figures 1 to 3 In the illustration, the display device DD is shown to include a folding region FA, but embodiments of the present disclosure are not necessarily limited to this. For example, the display device DD can be folded multiple times, or it can have multiple folding regions to achieve a rollable display device.

[0049] Figure 4 It is shown Figure 1 An exploded perspective view of the display device DD. Figure 5 It is shown Figure 1 A cross-sectional view of the display device DD.

[0050] refer to Figure 4 and Figure 5In one embodiment, the display device DD may include a display module DM, an upper functional layer disposed on the display module DM (e.g., on a third-direction DR3), and a lower functional layer disposed below the display module DM (e.g., in the direction opposite to the third-direction DR3). For example, in one embodiment, the upper functional layer may include an anti-reflective layer ARL and a cover window CW. For example, in one embodiment, the lower functional layer may include a protective layer PFL, a digitizer DGT1, a shielding layer SHL, a padding layer CUS, a metal plate MP, a step compensation member SC, and a lower insulating layer ISL.

[0051] In an implementation, the display module DM may include a display panel DP and a touch component TSM. The display panel DP may include pixels that generate and emit light. Reference will be made below. Figure 6 A more detailed description of the cross-sectional structure of the display panel (DP).

[0052] The touch component TSM can be disposed on the display panel DP (e.g., on the third-party DR3). For example, in one embodiment, the touch component TSM can be disposed directly on the display panel DP without a separate adhesive component between the touch component TSM and the display panel DP. As another example, the touch component TSM can be attached to the upper surface of the display panel DP via an adhesive component.

[0053] A touch component (TSM) can detect a user's touch. For example, the TSM can acquire coordinate information based on external input such as a user's touch. For instance, in one implementation, the TSM can acquire coordinate information based on external input using mutual capacitance and / or self-capacitance methods. The TSM may include a plurality of touch electrodes, second interconnects connected to the corresponding touch electrodes, and at least one touch insulating layer.

[0054] An anti-reflective layer ARL can be disposed on the touch component TSM (e.g., on the third-party DR3). The anti-reflective layer ARL can be attached to the upper surface of the display module DM via a first adhesive layer ADL1. In some embodiments, the anti-reflective layer ARL can be attached to the upper surface of the touch component TSM via the first adhesive layer ADL1. The anti-reflective layer ARL can reduce external light reflected by the display device DD. For example, in embodiments, the anti-reflective layer ARL may include a polarizer and / or a phase delayer. For example, the anti-reflective layer ARL may include a color filter and a black matrix disposed between the color filters.

[0055] The first adhesive layer ADL1 can be disposed (e.g., on the third-party DR3) between the display module DM and the anti-reflective layer ARL. The first adhesive layer ADL1 can attach the display module DM to the anti-reflective layer ARL.

[0056] The overlay window CW can be (e.g., on the third-party DR3) disposed on the anti-reflective layer ARL. The overlay window CW may include a transparent material to transmit light supplied from the display module DM to the outside. In an embodiment, the overlay window CW may include a flexible material. Therefore, the overlay window CW can be folded about the folding axis AX. In an embodiment, the overlay window CW may include a first overlay layer CW1, a second overlay layer CW2, and a border pattern BZ.

[0057] The first cover layer CW1 may be disposed on the antireflective layer ARL (e.g., on the third-party DR3). In an embodiment, the first cover layer CW1 may be attached to the upper surface of the antireflective layer ARL via a second adhesive layer ADL2. The first cover layer CW1 may comprise a thin-film glass or a synthetic resin. For example, in an embodiment, the synthetic resin may comprise polyimide or polyethylene terephthalate (PET).

[0058] The second adhesive layer ADL2 can be disposed (e.g., on the third-party DR3) between the anti-reflective layer ARL and the first cover layer CW1. The second adhesive layer ADL2 can attach the anti-reflective layer ARL to the first cover layer CW1.

[0059] A second cover layer CW2 may be disposed on the first cover layer CW1 (e.g., on the third-direction DR3). The second cover layer CW2 may comprise a material having a relatively lower modulus than the first cover layer CW1. Furthermore, the second cover layer CW2 may have a relatively larger thickness than the first cover layer CW1 (e.g., in terms of length on the third-direction DR3). Therefore, the second cover layer CW2 can protect the first cover layer CW1. For example, the second cover layer CW2 may have a multilayer structure. For example, the second cover layer CW2 may include an anti-fingerprint layer.

[0060] The border pattern BZ can be disposed inside the second cover layer CW2. The border pattern BZ can also be disposed at the edge of the second cover layer CW2. In an embodiment, the border pattern BZ may include a light-blocking material capable of blocking light. For example, the border pattern BZ may include organic materials, inorganic materials, etc., containing a light-blocking material with a black color.

[0061] The protective layer PFL can be disposed below the display module DM (e.g., in the direction opposite to the third adhesive layer DR3). In an embodiment, the protective layer PFL can be attached to the lower surface of the display module DM via the third adhesive layer ADL3. The protective layer PFL can protect the display module DM from external impacts. The protective layer PFL can include a flexible organic material. For example, in an embodiment, the protective layer PFL can include polyimide, PET, polyethylene naphthalate (PEN), etc.

[0062] The third adhesive layer ADL3 can be (e.g., on the third-party DR3) disposed between the display module DM and the protective layer PFL. The third adhesive layer ADL3 can attach the display module DM to the protective layer PFL.

[0063] A panel support member SS may be disposed between the display panel DP and the digitizer DGT1 (e.g., on a third direction DR3, which is the thickness direction of the display module DM). The panel support member SS may be disposed below the protective layer PFL and may be used to support the lower surface of the display module DM. The panel support member SS may be a rigid member whose shape or volume is not easily changed by external pressure. In embodiments, the thickness of the panel support member SS (e.g., its length on the third direction DR3) may be, for example, in the range of about 30 μm to about 200 μm.

[0064] In an embodiment, the panel support SS may include a first panel support SS1, a second panel support SS2, and a grid pattern, wherein the first panel support SS1 overlaps with the first non-folded region NFA1 on the third direction DR3, the second panel support SS2 overlaps with the second non-folded region NFA2 on the third direction DR3, and the grid pattern overlaps with the folded region FA on the third direction DR3 so as to be easily bent in the folded region FA.

[0065] In one embodiment, the panel support SS can be attached to the lower surface of the protective layer PFL via the fourth adhesive layer ADL4.

[0066] A fourth adhesive layer ADL4 may be disposed (e.g., on a third direction DR3) between the protective layer PFL and the panel support SS. In some embodiments, the fourth adhesive layer ADL4 may include a first portion and a second portion. The first portion of the fourth adhesive layer ADL4 may be spaced apart from the second portion of the fourth adhesive layer ADL4 on the first direction DR1, and a folded region FA is interposed between the first and second portions. The first portion of the fourth adhesive layer ADL4 may attach a portion of the protective layer PFL to the first panel support SS1. The second portion of the fourth adhesive layer ADL4 may attach another portion of the protective layer PFL to the second panel support SS2.

[0067] The digitizer DGT1 can be disposed on a side surface of the display panel DP. For example, in one embodiment, the first surface (e.g., the upper surface) of the digitizer DGT1 can be disposed on a side surface (e.g., the lower surface) of the display module DM. In some embodiments, the digitizer DGT1 can be disposed on the lower portion of the panel support SS. In one embodiment, the digitizer DGT1 can be attached to the lower surface of the panel support SS via a fifth adhesive layer ADL5. In another embodiment, the digitizer DGT1 can detect input using an electromagnetic pen. For example, the digitizer DGT1 can be driven using electromagnetic resonance (EMR).

[0068] In an implementation, the digitizer DGT1 may include a first non-folding portion NFP1, a second non-folding portion NFP2, and a folding portion FP. The first non-folding portion NFP1 and the second non-folding portion NFP2 may be non-bending or non-folding (e.g., non-foldable) portions of the digitizer DGT1, and the folding portion FP may be a bending or folding (e.g., foldable) portion of the digitizer DGT1.

[0069] In the plan view, the first non-folded portion NFP1 may at least partially overlap with the first non-folded region NFA1. In the plan view, the second non-folded portion NFP2 may at least partially overlap with the second non-folded region NFA2. In the plan view, the folded portion FP may at least partially overlap with the folded region FA. The folded portion FP may (e.g., in the first direction DR1) be located between the first non-folded portion NFP1 and the second non-folded portion NFP2. For example, the first non-folded portion NFP1 may be adjacent to the folded portion FP in a direction opposite to the first direction DR1, and the second non-folded portion NFP2 may be adjacent to the folded portion FP in the first direction DR1.

[0070] Multiple through-hole HL ( Figure 7 The vias HL can be defined within the folded portion FP. The vias HL can pass through the folded portion FP in the thickness direction (e.g., the third direction DR3). The vias HL can be spaced apart from each other in the first direction DR1. Furthermore, the vias HL can be spaced apart from each other in the second direction DR2.

[0071] In an implementation, the digitizer DGT1 may further include a sensing coil that is curved and extends at least a portion of the edge of the through-hole HL in a plan view (e.g., Figure 7 The first sensing coil RF or Figure 8 The second sensing coil CF). A base layer of sensing coils is disposed on it (e.g., Figure 7The base layer (BSL) may include a material with a relatively low dielectric constant. For example, in one embodiment, the base layer may be a polyimide film, but embodiments of this disclosure are not necessarily limited thereto. For example, in one embodiment, the thickness of the digitizer DGT1 (e.g., its length on the third-direction DR3) may be less than or equal to about 400 micrometers (μm).

[0072] The digitizer DGT1 may include a folding portion FP corresponding to the folding area FA, and thus can ensure flexibility during the folding operation of the display device DD, making the shape of the digitizer DGT1 easy to change and easy to fold.

[0073] The fifth adhesive layer ADL5 may be disposed (e.g., on the third-party DR3) between the panel support SS and the digitizer DGT1. In some embodiments, the fifth adhesive layer ADL5 may include a first portion PT1 for attaching the first panel support SS1 to the first non-folded portion NFP1 and a second portion PT2 for attaching the second panel support SS2 to the second non-folded portion NFP2.

[0074] For example, the first portion PT1 of the fifth adhesive layer ADL5 may be spaced apart from the second portion PT2 of the fifth adhesive layer ADL5 in the first direction DR1, and the folded region FA may be interposed between the first portion PT1 and the second portion PT2. The fifth adhesive layer ADL5 may not overlap with the folded portion FP of the digitizer DGT1 in the third direction DR3.

[0075] In the unfolded state of the display device DD, the gap G, serving as a separation space, can be defined between each of the wing plates WP and the center rod CB. For example, in the same layer as the fifth adhesive layer ADL5, the adhesive portion ADP can be additionally provided in an area of ​​the folded portion FP that overlaps with the gap G on the third-direction DR3. Due to the adhesive portion ADP, interference problems occurring between the center rod CB and the wing plates WP can be mitigated and prevented.

[0076] The cover layer SCV can be disposed on another surface (hereinafter referred to as the "lower surface") of the digitizer DGT1 in the direction opposite to the third direction DR3. In some embodiments, the cover layer SCV can be disposed on the lower surface of the digitizer DGT1 in the area on the third direction DR3 that overlaps with the folding area FA. The cover layer SCV may include an elastic material whose length can vary according to the folding and unfolding operation of the display device DD.

[0077] In embodiments, the cover layer SCV may comprise a polymer material with superelastic properties. For example, the cover layer SCV may comprise elastic thermoplastic polyurethane (TPU). In embodiments, the cover layer SCV may have a thickness in the range of about 1 μm to about 20 μm (e.g., the length on a third-direction DR3).

[0078] In some embodiments, the cover layer SCV may have a low modulus to correspond to the folding and unfolding operations of the display device DD. For example, in one embodiment, the cover layer SCV may comprise a material having a modulus of less than or equal to about 1 GPa.

[0079] The SCV coating prevents external impurities from entering the DGT1 digitizer.

[0080] The shielding layer SHL can be disposed below the digitizer DGT1 (e.g., in a direction opposite to the third direction DR3). For example, in one embodiment, the shielding layer SHL can be disposed on the lower surface of the digitizer DGT1 without a separate adhesive member. As another example, the shielding layer SHL can be attached to the lower surface of the digitizer DGT1 by an adhesive member. The shielding layer SHL can block electromagnetic interference noise. The shielding layer SHL can include a metal. For example, in one embodiment, the shielding layer SHL can include magnetic metal powder (MMP). However, the embodiments of this disclosure are not necessarily limited to this, and in some embodiments, the shielding layer SHL can include permalloy, invar alloy, stainless steel, etc., which are alloys of nickel (Ni) and iron (Fe).

[0081] In some embodiments, the shielding layer SHL may include a first shielding layer SHL1 and a second shielding layer SHL2. The first shielding layer SHL1 may be spaced apart from the second shielding layer SHL2 in the first direction DR1 within the folded region FA. In a plan view, the first shielding layer SHL1 may overlap with a portion of the folded portion FP and the first non-folded portion NFP1. In a plan view, the second shielding layer SHL2 may overlap with another portion of the folded portion FP and the second non-folded portion NFP2. However, embodiments of this disclosure are not necessarily limited thereto. For example, in some embodiments, the cover layer SCV may be absent, and in a plan view, the shielding layer SHL may overlap with the entire folded region FA and may cover the via HL. In some embodiments, in a plan view, the shielding layer SHL may not overlap with the folded portion FP and may overlap only with the first non-folded portion NFP1 and the second non-folded portion NFP2.

[0082] The padding layer CUS can be disposed below the shielding layer SHL (e.g., in the direction opposite to the third direction DR3). In an embodiment, the padding layer CUS can be attached to the lower surface of the shielding layer SHL via a sixth adhesive layer ADL6. The padding layer CUS can protect the display module DM and the digitizer DGT1 from external impacts. Furthermore, when the display device DD is opened (e.g., unfolded), the padding layer CUS can prevent impurities from entering the through-hole HL. For example, in an embodiment, the padding layer CUS can include rubber, urethane-based materials, acrylic-based materials, foam tape, foam pads, etc.

[0083] In some embodiments, the padding layer CUS may include a first padding layer CUS1 and a second padding layer CUS2. The first padding layer CUS1 may be spaced apart from the second padding layer CUS2 in the folded region FA along a first direction DR1. In plan view, the first padding layer CUS1 may overlap with the first shielding layer SHL1. Furthermore, in plan view, the first padding layer CUS1 may overlap with a portion of the folded portion FP and the first non-folded portion NFP1. In plan view, the second padding layer CUS2 may overlap with the second shielding layer SHL2. Furthermore, in plan view, the second padding layer CUS2 may overlap with another portion of the folded portion FP and the second non-folded portion NFP2. In some embodiments, in plan view, the padding layer CUS may not overlap with the folded portion FP and may overlap only with the first non-folded portion NFP1 and the second non-folded portion NFP2.

[0084] The first pad CUS1 can be spaced apart from the second pad CUS2 in the first direction DR1 in the folded region FA, and therefore the shape of the digitizer DGT1 can be easily changed when the folded portion FP is folded with a curvature.

[0085] A sixth adhesive layer ADL6 may be disposed (e.g., on a third direction DR3) between the shielding layer SHL and the padding layer CUS. In some embodiments, the sixth adhesive layer ADL6 may include a first portion and a second portion. The first portion of the sixth adhesive layer ADL6 may be spaced apart from the second portion of the sixth adhesive layer ADL6 in the folded region FA on the first direction DR1. The first portion of the sixth adhesive layer ADL6 may attach the first shielding layer SHL1 to the first padding layer CUS1. The second portion of the sixth adhesive layer ADL6 may attach the second shielding layer SHL2 to the second padding layer CUS2.

[0086] In this embodiment, the metal plate MP, the step compensation member SC, and the lower insulating layer ISL may be disposed below the pad CUS (e.g., in the direction opposite to the third direction DR3).

[0087] The metal plate MP can protect the display module DM from external impacts. For example, in one embodiment, the metal plate MP may include stainless steel, but the embodiments disclosed herein are not necessarily limited to this. In another embodiment, the metal plate MP may include a first metal layer MP1 and a second metal layer MP2. The first metal layer MP1 may be in direct contact with the first pad CUS1, and the second metal layer MP2 may be in direct contact with the second pad CUS2.

[0088] In one embodiment, the step compensation component SC may include double-sided tape or an insulating film. In another embodiment, the step compensation component SC may include a first step compensation layer SC1 and a second step compensation layer SC2. The first step compensation layer SC1 may be in direct contact with the first padding layer CUS1 and may be adjacent to the first metal layer MP1. The second step compensation layer SC2 may be in direct contact with the second padding layer CUS2 and may be adjacent to the second metal layer MP2.

[0089] The lower insulating layer ISL can be disposed below the metal plate MP (e.g., in a direction opposite to the third direction DR3). The lower insulating layer ISL can block noise (such as static electricity generated from the outside, e.g., the external environment). The lower insulating layer ISL can include inorganic insulating materials and / or organic insulating materials. In an embodiment, the lower insulating layer ISL can include a first lower insulating layer ISL1 and a second lower insulating layer ISL2. The first lower insulating layer ISL1 can be in direct contact with the first metal layer MP1, and the second lower insulating layer ISL2 can be in direct contact with the second metal layer MP2.

[0090] The display device DD may include a center rod CB and wing plates WP, wherein the center rod CB (e.g., in the direction opposite to the third direction DR3) is positioned relative to the digitizer DGT1 and the display panel DP and (e.g., in the direction opposite to the third direction DR3) overlaps with the folding portion FP, and the wing plates WP are located on opposite sides of the center rod CB in the first direction DR1. For example, in one embodiment, the center rod CB may be disposed on a second side (e.g., the lower surface) of the digitizer DGT1 opposite to the first side surface of the digitizer DGT1.

[0091] In one embodiment, the display device DD may include a folding assembly disposed below the digitizer DGT1, and the folding assembly may accommodate the display module DM and the digitizer DGT1, and may fold the display module DM. The folding assembly may include a center rod CB and a wing plate WP.

[0092] In one implementation, the folding group may include a first group overlapping a first non-folding region NFA1 on a third-direction DR3 and a second group overlapping a second non-folding region NFA2. A hinge may be provided between the first and second groups to fold the display device DD.

[0093] The wing plate WP can be disposed between the first group and the hinge, and between the second group and the hinge. The wing plate WP can maintain the display device DD folded to the shape of the digitizer DGT1. When the display device DD is folded, the wing plate WP can be used to relieve the bending stress of the display module DM. In an embodiment, the wing plate WP can rotate about a rotation axis extending in the second direction DR2.

[0094] The center rod CB may (e.g., in the first direction DR1) be located between the wing plates WP and may be defined as an area protruding from the hinge toward the digitizer DGT1 in the third direction DR3. When the display device DD is folded, the center rod CB can prevent the folded portion FP from sagging and can support the folded portion FP. For example, when the display device DD is folded, a portion of the center rod CB may be in direct contact with the folded portion FP.

[0095] The center rod CB can be applied to a display device DD comprising a digitizer DGT1 in which the first non-folding portion NFP1, the folding portion FP, and the second non-folding portion NFP2 are integrally connected to each other, thereby reducing the thickness of the display device DD.

[0096] Figure 6 It is shown that it includes Figure 1 A cross-sectional view of the display panel DP in the display device DD.

[0097] refer to Figure 6 In an embodiment, the display panel DP may include a substrate SUB, a buffer layer BUF, a gate insulating layer GI, an interlayer insulating layer ILD, a via insulating layer VIA, an active layer ACT, a source electrode SE, a gate electrode GE, a drain electrode DE, a pixel electrode PE, a pixel limiting layer PDL, an emitter layer EML, a common electrode CE, and a packaging layer TFE.

[0098] In this implementation, the transistor TR may include an active layer ACT, a source electrode SE, a gate electrode GE, and a drain electrode DE. The light-emitting element LE may include a common electrode CE, a pixel electrode PE, and an emitter layer EML.

[0099] The substrate SUB can form the base of the display device DD. The substrate SUB can include transparent or opaque materials. For example, in some embodiments, the substrate SUB can include glass, quartz, plastic, silicon, etc. These materials can be used alone or in combination with each other.

[0100] A buffer layer BUF can be disposed on the substrate SUB (e.g., directly on the substrate SUB on a third-party DR3). The buffer layer BUF can prevent metal atoms or impurities from diffusing from the substrate SUB to the transistor TR. Furthermore, when the surface of the substrate SUB is uneven, the buffer layer BUF can increase the surface smoothness of the substrate SUB. For example, in an embodiment, the buffer layer BUF may include silicon oxide (SiO2). x Silicon nitride (SiN) x ) or silicon oxynitride (SiO) x N y Inorganic insulating materials. These materials can be used alone or in combination with each other.

[0101] The active layer ACT can be disposed on the buffer layer BUF (e.g., directly disposed on the buffer layer BUF on the third-direction DR3). The active layer ACT may include a source region, a drain region, and a channel region located between the source and drain regions. The source and drain regions may have higher conductivity than the channel region. The active layer ACT may include oxide semiconductors, silicon semiconductors, etc. For example, in an embodiment, the oxide semiconductor may include an oxide selected from at least one of indium (In), gallium (Ga), tin (Sn), zirconium (Zr), vanadium (V), hafnium (Hf), cadmium (Cd), germanium (Ge), chromium (Cr), titanium (Ti), and zinc (Zn). The silicon semiconductor may include amorphous silicon, polycrystalline silicon, etc.

[0102] The gate insulating layer GI can be disposed on the buffer layer BUF (e.g., directly on the buffer layer BUF) and can cover at least a portion of the active layer ACT. For example, in one embodiment, the gate insulating layer GI may comprise an inorganic insulating material such as silicon oxide, silicon nitride, or silicon oxynitride. These materials may be used individually or in combination with each other.

[0103] The gate electrode GE can be disposed on the gate insulating layer GI (e.g., directly disposed on the gate insulating layer GI on the third-direction DR3). In a planar view, the gate electrode GE can overlap with the channel region of the active layer ACT. For example, the gate electrode GE can include a conductive material such as a metal, alloy, conductive metal nitride, conductive metal oxide, or transparent conductive material. For example, in an embodiment, the gate electrode GE can include gold (Au), silver (Ag), aluminum (Al), platinum (Pt), nickel (Ni), titanium (Ti), palladium (Pd), magnesium (Mg), calcium (Ca), lithium (Li), chromium (Cr), tantalum (Ta), tungsten (W), copper (Cu), molybdenum (Mo), scandium (SC), neodymium (Nd), iridium (Ir), aluminum-containing alloys, silver-containing alloys, copper-containing alloys, molybdenum-containing alloys, and aluminum nitride (AlN). x ), Tungsten nitride (WN) x Titanium nitride (TiN) x), Chromium nitride (CrN) x ), Tantalum nitride (TaN) x ), zinc oxide (ZnO) x Indium tin oxide (ITO), tin oxide (SnO) x Indium oxide (InO) x Gallium oxide (GaO) x Indium zinc oxide (IZO), etc. These materials can be used alone or in combination with each other.

[0104] The interlayer insulating layer (ILD) can be disposed on the gate insulating layer (GI) (e.g., directly on the gate insulating layer GI) and can cover the gate electrode (GE). For example, in one embodiment, the interlayer insulating layer (ILD) may comprise an inorganic insulating material such as silicon oxide, silicon nitride, or silicon oxynitride. These materials may be used individually or in combination with each other.

[0105] The source electrode SE and drain electrode DE can be disposed on the interlayer insulating layer ILD. In an embodiment, the source electrode SE can be connected to the source region of the active layer ACT through a first contact hole passing through the lower insulating layer (e.g., the gate insulating layer GI and the interlayer insulating layer ILD). The drain electrode DE can be connected to the drain region of the active layer ACT through a second contact hole passing through the lower insulating layer (e.g., the gate insulating layer GI and the interlayer insulating layer ILD). For example, in an embodiment, the source electrode SE and drain electrode DE can comprise conductive materials such as metals, alloys, conductive metal nitrides, conductive metal oxides, or transparent conductive materials. These materials can be used individually or in combination with each other.

[0106] The via insulating layer VIA can be disposed on the interlayer insulating layer ILD (e.g., directly disposed on the interlayer insulating layer ILD) and can cover the source electrode SE and the drain electrode DE. For example, in an embodiment, the via insulating layer VIA may include an organic insulating material such as photoresist, acrylic resin, polyimide resin, polyamide resin, siloxane resin, or epoxy resin. These materials may be used alone or in combination with each other.

[0107] The pixel electrode PE can be disposed on the via insulating layer VIA (e.g., directly disposed on the via insulating layer VIA on a third-party DR3). In an embodiment, the pixel electrode PE can be electrically connected to the transistor TR. For example, the pixel electrode PE can be connected to the drain electrode DE (or source electrode SE) through a contact hole passing through the lower insulating layer (e.g., the via insulating layer VIA). For example, the pixel electrode PE can be the first terminal (e.g., the anode) of the light-emitting element LE. For example, in an embodiment, the pixel electrode PE can include a conductive material such as a metal, alloy, conductive metal nitride, conductive metal oxide, or transparent conductive material. These materials can be used alone or in combination with each other.

[0108] A pixel defining layer (PDL) may be disposed on the pixel electrode (PE) (e.g., directly disposed on the pixel electrode PE) and may cover at least a portion of the pixel electrode PE. The PDL may define an opening that exposes at least a portion of the pixel electrode PE. For example, in one embodiment, the PDL may cover the side ends of the pixel electrode PE and expose the central portion of the pixel electrode PE. For example, in one embodiment, the PDL may comprise an organic insulating material such as a photoresist, acrylic resin, polyimide resin, or polyamide resin, and / or an inorganic insulating material such as silicon oxide, silicon nitride, or silicon oxynitride. These materials may be used individually or in combination with each other.

[0109] The emitter layer EML can be disposed on the pixel electrode PE (e.g., on a third-direction DR3). The emitter layer EML can be located in an opening of the pixel defining layer PDL. The emitter layer EML can include a light-emitting material. For example, in one embodiment, the emitter layer EML can include at least one selected from organic light-emitting materials and quantum dots. The emitter layer EML can also include a functional layer comprising at least one of a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer.

[0110] A common electrode CE can be disposed on the emitting layer EML (e.g., on the third-party DR3). For example, the common electrode CE can be the second terminal (e.g., cathode) of the light-emitting element LE. For example, in embodiments, the common electrode CE can include a conductive material such as a metal, alloy, conductive metal nitride, conductive metal oxide, or transparent conductive material. These materials can be used alone or in combination with each other.

[0111] The encapsulation layer TFE can be disposed on the common electrode CE (e.g., directly on the common electrode CE). The encapsulation layer TFE can prevent impurities such as oxygen and moisture from penetrating into the light-emitting element LE. The encapsulation layer TFE may include at least one inorganic layer and at least one organic layer.

[0112] Figure 7 and Figure 8 This is a plan view showing the digitizer DGT1 according to an embodiment of the present disclosure.

[0113] For example, Figure 7 It is shown Figure 4 and Figure 5 A plan view of the front surface DGT_F of the DGT1 digitizer, and Figure 8 It is shown Figure 4 and Figure 5 A plan view of the rear surface DGT_B of the digitizer DGT1. For example, Figure 7 The sensing coil is shown on the front surface DGT_F of the digitizer DGT1, and... Figure 8 A sensing coil is shown on the rear surface DGT_B of the digitizer DGT1.

[0114] refer to Figure 7 and Figure 8 The digitizer DGT1 can include an active region AA and a non-active region NAA.

[0115] In the plan view, the active area AA of the digitizer DGT1 can be connected to the display device (e.g., Figure 1 The display area of ​​the display device (DD) (e.g., Figure 1 The display area DA of the digitizer DGT1 overlaps with the display area of ​​the display device. For example, the active area AA of the digitizer DGT1 may correspond to the display area of ​​the display device. However, embodiments of this disclosure are not necessarily limited to this, and in the plan view, the active area AA of the digitizer DGT1 may at least partially overlap with the non-display area of ​​the display device (e.g., Figure 1 The non-display area (NDA) overlaps.

[0116] In a plan view, the non-active region NAA of the digitizer DGT1 may overlap with the non-display region of the display device. For example, the non-active region NAA of the digitizer DGT1 may correspond to the non-display region of the display device. However, the embodiments of this disclosure are not necessarily limited to this, and in a plan view, the non-active region NAA of the digitizer DGT1 may at least partially overlap with the display region of the display device.

[0117] For example, the active region AA can be defined as the area for detecting pen input. Furthermore, the passive region NAA can be an area where interconnecting elements are arranged, with each of the first sensing coil RF and the second sensing coil CF forming a loop through the interconnecting elements. In the passive region NAA, interconnecting elements forming a loop through each of the first sensing coil RF and the second sensing coil CF can be densely arranged.

[0118] In an implementation, the digitizer DGT1 may include a base layer BSL, a first sensing coil RF, a second sensing coil CF, and a connector CT.

[0119] The base layer (BSL) can form the substrate of the digitizer DGT1. In embodiments, the base layer (BSL) may comprise a material having a relatively low dielectric constant. For example, in embodiments, the base layer (BSL) may comprise a polyimide film, but embodiments of this disclosure are not necessarily limited to this.

[0120] The connector CT can be located in the non-active region NAA of the digitizer DGT1. For example, the connector CT can be located in the first non-folding portion NFP1 or the second non-folding portion NFP2.

[0121] In one embodiment, the first sensing coil RF can be disposed on the front surface DGT_F of the digitizer DGT1, and the second sensing coil CF can be disposed on the rear surface DGT_B of the digitizer DGT1. The first sensing coil RF and the second sensing coil CF can be disposed on the base layer BSL. In another embodiment, the first sensing coil RF and the second sensing coil CF can comprise conductive materials such as metals, alloys, conductive metal nitrides, conductive metal oxides, or transparent conductive materials.

[0122] In an embodiment, the first sensing coil RF may include a first extending interconnect RFL1_1, a second extending interconnect RFL1_2, and a first connecting interconnect RFL2. Each of the first extending interconnect RFL1_1 and the second extending interconnect RFL1_2 may extend in a first direction DR1. For example, each of the first extending interconnect RFL1_1 and the second extending interconnect RFL1_2 may be located in an active region AA and an active region NAA. Each of the first connecting interconnect RFL2 may extend in a second direction DR2. For example, each of the first connecting interconnect RFL2 may be located in an active region NAA. In an embodiment, each of the first connecting interconnect RFL2 may connect one end of one of the first extending interconnect RFL1_1 to one end of one of the second extending interconnect RFL1_2. Therefore, the first sensing coil RF can form multiple loops.

[0123] In one embodiment, the plurality of loops formed by the first sensing coil RF may include a plurality of loops having different lengths in the second direction DR2. For example, the length of each of the first connecting interconnects RFL2 forming the plurality of loops formed by the first sensing coil RF in the second direction DR2 may be different for each loop. For example, the widths of the first extending interconnect RFL1_1 and the second extending interconnect RFL1_2 in the second direction DR2 may be different from each other. However, embodiments of this disclosure are not necessarily limited to this, and in another embodiment, the plurality of loops formed by the first sensing coil RF may include a plurality of loops whose lengths in the second direction DR2 are substantially equal to each other. In this case, the lengths of the first connecting interconnects RFL2 forming the plurality of loops formed by the first sensing coil RF in the second direction DR2 may be substantially equal to each other.

[0124] According to the implementation, the shape of the plurality of loops formed by the first sensing coil RF can be changed in various ways. For example, the shape of the plurality of loops formed by the first sensing coil RF can be any shape extending in the first direction DR1.

[0125] The first extended interconnect RFL1_1 and the second extended interconnect RFL1_2 can be disposed in the first non-folded portion NFP1, the second non-folded portion NFP2, and the folded portion FP. In an embodiment, the first connecting interconnect RFL2 can be disposed in either the first non-folded portion NFP1 or the second non-folded portion NFP2.

[0126] In one embodiment, the portion of each of the first extended interconnects RFL1_1 disposed in the folded portion FP of the digitizer DGT1 can be disposed between vias HL. The portion of each of the first extended interconnects RFL1_1 disposed in the folded portion FP of the digitizer DGT1 can continuously extend from the first non-folded portion NFP1 through the vias HL to the second non-folded portion NFP2. Furthermore, in one embodiment, the portion of each of the second extended interconnects RFL1_2 disposed in the folded portion FP of the digitizer DGT1 can be disposed between vias HL. The portion of each of the second extended interconnects RFL1_2 disposed in the folded portion FP of the digitizer DGT1 can continuously extend from the first non-folded portion NFP1 through the vias HL to the second non-folded portion NFP2.

[0127] In an implementation, each of the first extended interconnect RFL1_1 and the second extended interconnect RFL1_2 may be bent (e.g., have a bent configuration in a plan view) and extend along the edge of the via HL in the folded portion FP. Therefore, each of the first extended interconnect RFL1_1 and the second extended interconnect RFL1_2 may (e.g., in a plan view) include a bent pattern with curvature.

[0128] Each of the first sensing coils RF can be connected to the connector CT. For example, in one embodiment, one end of each of the first sensing coils RF can be connected to the connector CT in the non-active region NAA. For example, the first sensing coils RF can be connected to the connector CT respectively via connector connection interconnects.

[0129] although Figure 7 An example is shown where the first sensing coil RF is disposed on the front surface DGT_F of the digitizer DGT1, but this is for ease of description, and in some embodiments, some of the first sensing coils RF may be disposed on the rear surface DGT_B of the digitizer DGT1.

[0130] The second sensing coil CF may include a third extending interconnect CFL1_1, a fourth extending interconnect CFL1_2, and a second connecting interconnect CFL2. Each of the third extending interconnect CFL1_1 and the fourth extending interconnect CFL1_2 may extend in a second direction DR2. For example, the third extending interconnect CFL1_1 and the fourth extending interconnect CFL1_2 may be disposed in an active region AA and an active region NAA. Each of the second connecting interconnect CFL2 may extend in a first direction DR1. For example, the second connecting interconnect CFL2 may be disposed in an active region NAA. In an embodiment, each of the second connecting interconnect CFL2 may connect one end of one of the third extending interconnect CFL1_1 to one end of one of the fourth extending interconnect CFL1_2. Therefore, the second sensing coil CF may form multiple loops.

[0131] In one embodiment, the plurality of loops formed by the second sensing coil CF may include a plurality of loops having different lengths in the first direction DR1. For example, the length of each of the second connecting interconnects CFL2 forming the plurality of loops formed by the second sensing coil CF in the first direction DR1 may be different for each loop. For example, the widths of the third extending interconnect CFL1_1 and the fourth extending interconnect CFL1_2 in the first direction DR1 may be different from each other. However, embodiments of this disclosure are not necessarily limited to this, and in another embodiment, the plurality of loops formed by the second sensing coil CF may include a plurality of loops whose lengths in the first direction DR1 are substantially equal to each other. In this case, the lengths of the second connecting interconnects CFL2 forming the plurality of loops formed by the second sensing coil CF in the first direction DR1 may be substantially equal to each other.

[0132] According to the implementation, the shape of the plurality of loops formed by the second sensing coil CF can be changed in various ways. For example, the shape of the plurality of loops formed by the second sensing coil CF can be any shape extending in the second direction DR2.

[0133] In this embodiment, the third extended interconnect CFL1_1 and the fourth extended interconnect CFL1_2 may be disposed in the first non-folded portion NFP1, the second non-folded portion NFP2, and the folded portion FP. The second connecting interconnect CFL2 may be disposed in the first non-folded portion NFP1, the second non-folded portion NFP2, and the folded portion FP.

[0134] In one embodiment, a portion of each of the third extended interconnects CFL1_1 disposed in the folded portion FP of the digitizer DGT1 can be disposed between vias HL. The portion of each of the third extended interconnects CFL1_1 disposed in the folded portion FP of the digitizer DGT1 can extend in the second direction DR2 via the vias HL. Furthermore, a portion of each of the fourth extended interconnects CFL1_2 disposed in the folded portion FP of the digitizer DGT1 can be disposed between vias HL. The portion of each of the fourth extended interconnects CFL1_2 disposed in the folded portion FP of the digitizer DGT1 can extend in the second direction DR2 via the vias HL. Additionally, a portion of each of the second connecting interconnects CFL2 disposed in the folded portion FP of the digitizer DGT1 can be disposed between vias HL. In one embodiment, a portion of the second connecting interconnect CFL2 disposed in the folded portion FP of the digitizer DGT1 can be connected to one end of the third extended interconnect CFL1_1 and one end of the fourth extended interconnect CFL1_2 via the vias HL.

[0135] Each of the second sensing coils CF can be connected to the connector CT. For example, an end of each of the second sensing coils CF can be connected to the connector CT in the non-active region NAA. For example, the second sensing coils CF can be connected to the connector CT respectively via connector connection interconnects.

[0136] although Figure 8 An example is shown where the second sensing coil CF is disposed on the rear surface DGT_B of the digitizer DGT1, but this is for ease of description, and in some embodiments, some of the second sensing coils CF may be disposed on the front surface DGT_F of the digitizer DGT1.

[0137] For example, a first sensing coil RF can be defined as a sensing coil, and a second sensing coil CF can be defined as a driving coil. When current flows in the second sensing coil CF, magnetic field lines can be induced between the second sensing coil CF and the first sensing coil RF. The first sensing coil RF can detect the induced electromagnetic force emitted from the electromagnetic pen, and a detection signal can be output through one terminal of each of the first sensing coils RF. One terminal of the first sensing coil RF can be connected to a signal line disposed in an active area (NAA). However, embodiments of this disclosure are not necessarily limited thereto, and in some embodiments, the first sensing coil RF can be defined as a driving coil, and the second sensing coil CF can be defined as a sensing coil.

[0138] By applying the center rod CB to the display device DD, which includes a digitizer DGT1 in which the first non-folding portion NFP1, the folding portion FP, and the second non-folding portion NFP2 are integrally connected, the thickness of the display device DD can be reduced, but interference may occur in the digitizer DGT1 between the center rod CB and the wing plate WP.

[0139] For example, in some embodiments, when the display device DD is folded / unfolded, the digitizer DGT1 may be damaged due to becoming stuck or clamped between the center rod CB and the wing plate WP. Consequently, interconnects such as the sensing coils of the digitizer DGT1 passing between the center rod CB and the wing plate WP may be physically damaged, potentially causing resistance defects such as increased resistance in the interconnects and reduced reliability of the display device DD. Hereinafter, the digitizer DGT1 and the display device DD, designed to address these problems, will be described.

[0140] Figure 9 It is shown Figure 7 A floor plan of an example of region B.

[0141] refer to Figure 5 , Figure 7 and Figure 9 The vias HL can be defined in the folded portion FP of the digitizer DGT1. Each of the vias HL can pass through the base layer BSL in the thickness direction (e.g., the third direction DR3).

[0142] In the unfolded state of the display device DD, the gap G, which serves as a separation space, can be defined between each of the wing plates WP and the central rod CB. In this embodiment, the gap G can have a dimension of less than or equal to about 0.8 mm in the first direction DR1.

[0143] In an implementation, the folded portion FP of the digitizer DGT1 may include a first region A1, which is (e.g., on the third-direction DR3) does not overlap with the gap G, and a second region A2, which is (e.g., on the third-direction DR3) overlaps with the gap G.

[0144] When the display device DD is repeatedly folded / unfolded, interference may occur due to phenomena such as the second region A2, which overlaps with the gap G on the third-direction DR3 in the digitizer DGT1, being stuck or clamped between the center rod CB and the wing plate WP. To increase the impact resistance of the second region A2, the elongation of the first region A1 can be greater than that of the second region A2. The "elongation" of a region can refer to the maximum elongation distance or maximum elongation rate of the region when the display device DD is folded or otherwise deformed.

[0145] In one embodiment, the through-hole HL may include a first hole H1 disposed in the first region A1. The first holes H1 may be disposed in the first region A1 and arranged to be spaced apart from each other in the second direction DR2. The first holes H1 may be spaced apart from each other by a certain distance in the first direction DR1, and for example, the first holes H1 may be arranged in a zigzag pattern in the first direction DR1. Therefore, the remaining portion of the folded portion FP, excluding the through-hole HL, may have a slit shape patterned in a grid pattern, and the display device DD may fold more smoothly along a folding axis extending in the second direction DR2.

[0146] In this embodiment, the width w1 of each of the first holes H1 in the first direction DR1 can be smaller than the width w2 of each of the first holes H1 in the second direction DR2 perpendicular to the first direction DR1. Therefore, the display device DD can be folded more smoothly along the folding axis extending in the second direction DR2.

[0147] For example, the aperture ratio of the first region A1 can be greater than that of the second region A2. For example, the density of through holes HL in the first region A1 can be greater than the density of through holes HL in the second region A2. In an embodiment, through holes HL may not be provided in the second region A2. Therefore, the impact resistance of the digitizer DGT1 can be further increased. For example, the distance between the two first holes H1 closest to the gap G on the first direction DR1 can be greater than approximately 1.4 mm.

[0148] In this embodiment, the first hole H1 can be formed by laser processing. For example, the width w1 of the first hole H1 in the first direction DR1 can be smaller than the width w2 of the first hole H1 in the second direction DR2. Therefore, the display device DD can be folded more smoothly along the folding axis extending in the second direction DR2.

[0149] In an implementation, the folded portion FP may include three first regions A1 arranged in the first direction DR1, and although Figure 9 The diagram shows that among the columns of the first hole H1 disposed on the first direction DR1, the first region A1 in the middle has three columns, and the first regions A1 on opposite sides of the first region A1 in the middle each have two columns; one or more embodiments are not necessarily limited to this. For example, the number of columns of the first hole H1 on the first direction DR1 can be adjusted according to the desired size of the folded portion FP, the size of the first hole H1, etc.

[0150] The first non-folding portion NFP1 and the second non-folding portion NFP2 may have substantially the same or symmetrical shapes. Therefore, for ease of explanation, the first non-folding portion NFP1 will be described primarily below. The description of the first non-folding portion NFP1 can be applied to the description of the second non-folding portion NFP2.

[0151] The first sensing coil RF can be disposed in the first non-folded portion NFP1 and the folded portion FP. Figure 9 The diagram illustrates, as an example, coils RF1, RF2, RF3, RF4, RF5, and RF6 forming different loops within a first sensing coil RF. In the folded portion FP, each of the first sensing coils RF can extend to pass between the first holes H1. In an embodiment, in the folded portion FP, each of the first sensing coils RF can be bent (e.g., having a bent configuration in the plan view) and extend along the edge of the first holes H1.

[0152] In one embodiment, each of the first sensing coils RF in the folded portion FP may include a patterned portion PP. In another embodiment, the patterned portion PP may include a first pattern P1, a second pattern P2, a third pattern P3, and a fourth pattern P4.

[0153] In one embodiment, each of the first pattern P1 and the second pattern P2 may extend in the second direction DR2. The first pattern P1 and the second pattern P2 may be spaced apart from each other in the first direction DR1, and a first hole H1 may be disposed between the first pattern P1 and the second pattern P2. In a plan view, the first pattern P1 and the second pattern P2 may surround at least a portion of the first hole H1.

[0154] The third pattern P3 can connect the first pattern P1 to the second pattern P2. In an embodiment, the third pattern P3 may have curvature. In a plan view, the third pattern P3 may surround the end of the first hole H1 (e.g., the upper end in the second direction DR2).

[0155] The fourth pattern P4 can extend from the second pattern P2 in the first direction DR1. The fourth pattern P4 can be connected to the first pattern P1 of another pattern portion PP included in the same first sensing coil RF.

[0156] Therefore, the patterned portion PP can be set between adjacent first holes H1.

[0157] like Figure 9 As shown, the first pattern P1 and the second pattern P2 may have the shape of a straight line extending in the second direction DR2, and the fourth pattern P4 may have the shape of a straight line extending in the first direction DR1, but the embodiments of this disclosure are not necessarily limited thereto. For example, in some embodiments, one or more of the first pattern P1, the second pattern P2 and the fourth pattern P4 may have curvature like the third pattern P3.

[0158] A digitizer DGT1 according to an embodiment of the present disclosure may include a folded portion FP defining a through-hole HL and a first sensing coil RF extending along the edge of the through-hole HL.

[0159] For example, in the folding portion FP of the digitizer DGT1, the first hole H1 can be set in the first region A1, and the through hole HL can be not set in the second region A2, so that even when the display device DD is repeatedly folded / unfolded, the impact resistance of the folding portion FP can be increased, and the reliability of the circuit interconnects set in the folding portion FP can also be improved.

[0160] Figure 10 It is shown Figure 7 A schematic plan view of another example of area B.

[0161] refer to Figure 5 and Figure 10 The through-hole HL can be defined in the folded portion FP' of the digitizer DGT1. Each of the through-holes HL can pass through the digitizer DGT1 in the thickness direction (e.g., the third direction DR3).

[0162] In the unfolded state of the display device DD, the gap G, which serves as a separation space, can be defined between each of the wing plates WP and the central rod CB. In an embodiment, the gap G can (e.g., in the first direction DR1) have a size less than or equal to about 0.8 mm.

[0163] In an implementation, the folded portion FP' of the digitizer DGT1 may include a first region A1, which is (e.g., on the third-direction DR3) does not overlap with the gap G, and a second region A2, which is (e.g., on the third-direction DR3) overlaps with the gap G.

[0164] When the display device DD is repeatedly folded / unfolded, interference may occur due to phenomena such as the second region A2, which overlaps with the gap G on the third-direction DR3 in the digitizer DGT1, being stuck or clamped between the center rod CB and the wing plate WP. To increase the impact resistance of the second region A2, the elongation (e.g., maximum elongation distance or maximum elongation rate) of the first region A1 can be greater than that of the second region A2.

[0165] The through-hole HL may include a first hole H1 disposed in the first region A1. The first holes H1 may be disposed in the first region A1 and may be arranged to be spaced apart from each other in the second direction DR2. The first holes H1 may be spaced apart from each other by a certain distance in the first direction DR1, and for example, in an embodiment, the first holes H1 may be arranged in a zigzag manner in the first direction DR1. Therefore, the remaining portion of the folded portion FP' excluding the through-hole HL may have a slit shape with a grid pattern, and the display device DD may fold more smoothly along the folding axis extending in the second direction DR2.

[0166] In this embodiment, the width w1 of each of the first holes H1 in the first direction DR1 can be smaller than the width w2 in the second direction DR2 perpendicular to the first direction DR1. Therefore, the display device DD can be folded more smoothly along the folding axis extending in the second direction DR2.

[0167] For example, the aperture ratio of the first region A1 can be greater than that of the second region A2. In an embodiment, the through hole HL may include a second hole H2 disposed in the second region A2.

[0168] The second hole H2 may differ from the first hole H1. For example, compared to the first hole H1, the second hole H2 may have at least one of different dimensions (e.g., area in a plan view) and shapes (e.g., shape in a plan view). For example, the second hole H2 may (e.g., in a plan view) have the same shape as the first hole H1, but the dimensions of the second hole H2 (e.g., area in a plan view) may be smaller than the dimensions of the first hole H1 (e.g., area in a plan view). For example, the width w3 of the second hole H2 in the first direction DR1 may be smaller than the width w1 of the first hole H1 in the first direction DR1, and the width w4 of the second hole H2 in the second direction DR2 may be smaller than the width w2 of the first hole H1 in the second direction DR2.

[0169] In the folded portion FP', a second hole H2 smaller than the first hole H1 can be provided in the second region A2, such that the elongation (e.g., maximum elongation distance or maximum elongation rate) in the second region A2 can be less than the elongation in the first region A1, and the shock resistance of the digitizer DGT1 can be further increased. Therefore, even when the display device DD is repeatedly folded / unfolded, physical damage to the second region A2 and problems such as increased resistance of the interconnects of the sensing coils provided in the second region A2 can be mitigated and prevented, and the reliability of the display device DD can be improved.

[0170] For reference Figure 9As described, in each of the first region A1 and the second region A2, the number of columns of the first hole H1 or the second hole H2 disposed on the first direction DR1 is not necessarily limited to [the number of columns described]. Figure 10 The quantities shown, and the number of columns of the first hole H1 and the second hole H2 on the first direction DR1, can be adjusted according to the desired size of the folded portion FP', the size of the first hole H1 and the second hole H2, etc.

[0171] Although for convenience, it was not in Figure 10 The sensing coil is shown, but as Figure 9 As shown, the sensing coil can be coupled with... Figure 9 The sensing coils shown and described bend and extend in the same manner between the first holes H1, along the edges of the second holes H2, and between the first holes H1.

[0172] Figure 11 It is shown Figure 7 A schematic plan view of another example of area B.

[0173] refer to Figure 5 and Figure 11 The through-hole HL can be defined in the folded portion FP'' of the digitizer DGT1. Each of the through-holes HL can pass through the digitizer DGT1 in the thickness direction (e.g., the third direction DR3).

[0174] In the unfolded state of the display device DD, the gap G, which serves as a separation space, can be defined between each of the wing plates WP and the central rod CB. For example, in an embodiment, the gap G can (e.g., in the first direction DR1) have a size less than or equal to about 0.8 mm.

[0175] In an implementation, the folded portion FP'' of the digitizer DGT1 may include a first region A1, which is (e.g., on the third-direction DR3) does not overlap with the gap G, and a second region A2, which is (e.g., on the third-direction DR3) overlaps with the gap G.

[0176] When the display device DD is repeatedly folded / unfolded, interference may occur due to phenomena such as the second region A2, which overlaps with the gap G on the third-direction DR3 in the digitizer DGT1, being stuck or clamped between the center rod CB and the wing plate WP. To increase the impact resistance of the second region A2, the elongation (e.g., maximum elongation distance or maximum elongation rate) of the first region A1 can be greater than that of the second region A2.

[0177] The through-hole HL may include a first hole H1 disposed in the first region A1. The first holes H1 may be disposed in the first region A1 and arranged to be spaced apart from each other in the second direction DR2. In an embodiment, the first holes H1 may be spaced apart from each other by a certain distance in the first direction DR1, and for example, the first holes H1 may be arranged in a zigzag pattern in the first direction DR1. Therefore, the remaining portion of the folded portion FP'', excluding the through-hole HL, may have a slit shape patterned in a grid pattern, and the display device DD may fold more smoothly along the folding axis extending in the second direction DR2.

[0178] In this embodiment, the width w1 of each of the first holes H1 in the first direction DR1 can be smaller than the width w2 in the second direction DR2 perpendicular to the first direction DR1. Therefore, the display device DD can be folded more smoothly along the folding axis extending in the second direction DR2.

[0179] For example, the aperture ratio of the first region A1 can be greater than that of the second region A2. In an embodiment, the through hole HL may include a second hole H2' disposed in the second region A2.

[0180] The second hole H2' may differ from the first hole H1. For example, the second hole H2' may (e.g., in a plan view) have a different shape than the first hole H1. The size of the second hole H2' (e.g., the area in a plan view) may be smaller than the size of the first hole H1 (e.g., the area in a plan view).

[0181] In some embodiments, each of the second holes H2' may include an extension portion ELA extending in a second direction DR2 perpendicular to the first direction DR1 and an expansion portion EXA disposed at opposite ends of the extension portion ELA. In some embodiments, the extension portion ELA may extend in the second direction DR2, and the expansion portion EXA may be defined at a first end of the extension portion ELA and a second end opposite to the first end (e.g., the side opposite to the first end). For example, in one second hole H2', the expansion portions EXA may be spaced apart from each other in the second direction DR2, and the extension portion ELA may connect the expansion portions EXA to each other.

[0182] In embodiments, the planar shape of the extension portion ELA may differ from the planar shape of each of the expansion portions EXA. For example, the planar shapes of the expansion portions EXA may be substantially the same or similar to each other. In embodiments, at least a portion of each of the expansion portions EXA may have curvature. For example, each of the expansion portions EXA may be defined as a circular planar shape. For example, in embodiments, the expansion portions EXA may have at least one planar shape selected from circular, elliptical, triangular, and quadrilateral shapes. However, embodiments of this disclosure are not necessarily limited to these, and the planar shape of each of the expansion portions EXA may be varied in various ways.

[0183] In this implementation, in the first direction DR1, the width of at least one region of each of the expanded portions EXA can be greater than the width of the extended portion ELA. The maximum width d2 of the expanded portion EXA in the first direction DR1 can be greater than the width d1 of the extended portion ELA in the first direction DR1. The maximum width d2 of the expanded portion EXA in the first direction DR1 can be less than the width w1 of the first hole H1 in the first direction DR1. Therefore, when the folded portion FP'' of the digitizer DGT1 is folded, tearing of the second region A2 can be prevented, and impact resistance can be increased.

[0184] In an embodiment, the extension portion ELA can be formed by minimal laser processing. The width d1 of the extension portion ELA in the first direction DR1 can be defined as the width of the laser beam that can be generated in a single laser processing step. For example, in an embodiment, the width d1 of the extension portion ELA in the first direction DR1 can be in the range of 0 mm to about 0.15 mm. However, the embodiments of this disclosure are not necessarily limited to this, and the width d1 of the extension portion ELA in the first direction DR1 can be varied depending on the laser that can be used for laser processing.

[0185] For example, in an embodiment, the maximum width d2 of the expansion portion EXA in the first direction DR1 can be greater than the width d1 of the extension portion ELA in the first direction DR1, and the maximum width d2 of the expansion portion EXA in the first direction DR1 is in the range of 0 mm to about 0.9 mm or greater.

[0186] By arranging the second hole H2' as described above in the second region A2, the elongation (e.g., maximum elongation distance or maximum elongation rate) in the second region A2 can be less than that in the first region A1, and the shock resistance of the digitizer DGT1 can be further increased. Therefore, even when the display device DD is repeatedly folded / unfolded, physical damage to the second region A2 and problems such as increased resistance of the interconnects of the sensing coils disposed in the second region A2 can be mitigated and prevented, and the reliability of the display device DD can be improved.

[0187] For reference Figure 9 As described, in each of the first region A1 and the second region A2, the number of columns of the first hole H1 or the second hole H2' disposed on the first direction DR1 is not necessarily limited to [the number of columns described]. Figure 11 The number shown, and the number of columns of the first hole H1 and the second hole H2' on the first direction DR1, can be adjusted according to the desired size of the folded portion FP'', the size of the first hole H1 and the second hole H2', etc.

[0188] Although for convenience, it was not in Figure 11 The sensing coil is shown, but as Figure 9 As shown, the sensing coil can be coupled with... Figure 9 The sensing coils shown and described bend and extend in the same manner between the first holes H1, along the edges of the second holes H2' and between the first holes H1 (e.g., in a bent configuration in the plan view)

[0189] Figure 12 It is shown Figure 5 A schematic cross-sectional view of an example of region A.

[0190] refer to Figure 12 The display device DD may also include an adhesive portion ADP between the panel support SS and the digitizer DGT1. In the deployed state of the display device DD, a gap G, serving as a separation space, may be defined between each of the wing plates WP and the central rod CB.

[0191] For example, the adhesive portion ADP can be configured to overlap at least with the gap G on the third direction DR3, which is the thickness direction of the display panel DP. Therefore, the phenomenon of the second region A2 being stuck or sandwiched between the wing plate WP and the center rod CB can be mitigated and prevented, and the impact resistance of the digitizer DGT1 can be increased.

[0192] The adhesive portion ADP overlapping the gap G can be in the form of an island. For example, the adhesive portions ADP overlapping the gap G can be spaced apart from each other. The adhesive portions ADP can be located on the same plane as the adhesive portions ADP in a region that overlaps with the first region A1 on the third-direction DR3, thereby ensuring the foldability of the digitizer DGT1 and the panel support SS.

[0193] In one embodiment, a first portion PT1 of the fifth adhesive layer ADL5 (e.g., on the third-direction DR3) is disposed between the first panel support SS1 and the first non-folded portion NFP1, and a second portion PT2 of the fifth adhesive layer ADL5 (e.g., on the third-direction DR3) is disposed between the second panel support SS2 and the second non-folded portion NFP2, wherein the first portion PT1 and the second portion PT2 are spaced apart from each other, and each adhesive portion ADP is also spaced apart from the first portion PT1 and the second portion PT2.

[0194] The adhesive portion ADP may include the same material as the fifth adhesive layer ADL5, and may have a higher or lower modulus than the fifth adhesive layer ADL5, wherein the fifth adhesive layer ADL5 and the adhesive portion ADP are located on the same plane.

[0195] Figure 13 It is shown Figure 5 A schematic cross-sectional view of another example of region A.

[0196] refer to Figure 13 The display device DD may also include (for example, on the third-party DR3) an adhesive portion ADP' between the panel support SS and the digitizer DGT1. In the unfolded state of the display device DD, a gap G, serving as a separation space, may be defined between each of the wing plates WP and the central rod CB.

[0197] For example, the adhesive portion ADP' can be configured to overlap at least with the folded portion FP on a third direction DR3, which is the thickness direction of the display panel DP. For example, the adhesive portion ADP' can have a lower modulus than other adhesive layers. For example, in an embodiment, at a temperature of -20°C, the modulus of the adhesive portion ADP' can be less than or equal to about 0.2 MPa. Therefore, sagging of the folded portion FP can be mitigated and prevented, and interference and circuit failures caused by repeated folding / unfolding of the display device DD in the second region A2 between the wing plate WP and the center rod CB can be mitigated and prevented.

[0198] For example, the adhesive portion ADP' can be integrally formed with a fifth adhesive layer ADL5 disposed between the panel support SS and the digitizer DGT1 and on the same plane as the adhesive portion ADP'. For example, the adhesive portion ADP' can include the same material as the fifth adhesive layer ADL5.

[0199] Because of the low modulus and integrally layered shape of the adhesive portion ADP', the phenomenon of the second region A2 being stuck or clamped between the wing plate WP and the center rod CB can be mitigated and prevented, and the reliability of the display device DD can be improved.

[0200] The display device DD according to the embodiments of this disclosure can be applied to various electronic devices 1000 (see...). Figure 14 The electronic device 1000 according to the embodiment may include the display device DD described above, and may also include modules or devices with additional functions in addition to the display device DD.

[0201] Figure 14 This is a block diagram of an electronic device 1000 according to an embodiment of the present disclosure. (See reference...) Figure 14 The electronic device 1000 according to the embodiment may include a display module DM, a processor 1200, a memory 1300 and a power module 1400.

[0202] The processor 1200 may include at least one of a central processing unit (CPU), an application processor (AP), a graphics processing unit (GPU), a communication processor (CP), an image signal processor (ISP), and a controller.

[0203] The memory 1300 can store data information required for the operation of the processor 1200 or the display module DM. When the processor 1200 executes the application program stored in the memory 1300, image data signals and / or input control signals can be sent to the display module DM, and the display module DM can process the received signals to output image information through the display screen.

[0204] The power module 1400 may include a power module such as a power adapter or battery device, and a power conversion module that converts the power supplied by the power module to generate the power required for the operation of the electronic device 1000.

[0205] At least one of the components of the electronic device 1000 described above may be included in the display device DD according to the embodiments described above. Furthermore, some of the independent modules functionally included in a single module may be included in the display device DD, and other modules may be provided separately from the display device DD. For example, the display device DD may include a display module DM, and the processor 1200, memory 1300, and power module 1400 may be provided within the electronic device 1000 in the form of other devices besides the display device DD.

[0206] Figure 15 Schematic diagrams of electronic devices according to various embodiments are shown.

[0207] refer to Figure 15 The various electronic devices using the display device DD according to the embodiments may include not only electronic devices for image display (such as smartphones 1000.1a, tablet PCs 1000.1b, laptops 1000.1c, televisions (TVs) 1000.1d, and desktop monitors 1000.1e), but also wearable electronic devices including display modules (such as smart glasses 1000.2a, head-mounted displays 1000.2b, and smartwatches 1000.2c) and vehicle electronic devices 1000.3 including display modules (such as central information displays (CIDs) and interior mirror displays installed on the dashboard, center console, or instrument panel of a vehicle). However, the display device DD can be applied to a variety of other small, medium, or large electronic devices.

[0208] Each of the embodiments described above can be implemented independently, but of course, the structure of each embodiment can be combined with other embodiments.

[0209] Although this disclosure has been described with reference to embodiments shown in the accompanying drawings, it is merely illustrative. It should be understood that various equivalent modifications and variations can be made to the embodiments by those skilled in the art without departing from the spirit and scope of this disclosure.

[0210] The specific embodiments described in the implementation are examples and do not limit the scope of the implementation in any way. Furthermore, unless specifically mentioned as "essential," "important," etc., they may not be essential components for applying this disclosure.

[0211] In the description of the embodiments, the term "the" and similar indicative terms may correspond to both the singular and the plural. Furthermore, where a scope is described in the embodiments, since the scope includes the disclosure of individual values ​​belonging to that scope, unless otherwise stated, the scope is equivalent to each individual value constituting the scope as described in the specific embodiments. Finally, when no explicit or contrary description is given of the operations constituting the method according to the embodiments, the operations may be performed in a suitable order. The embodiments are not necessarily limited to the order of the described operations. All examples or terms used in the embodiments are for the purpose of describing the embodiments in detail only. Therefore, the scope of the embodiments may not be limited by the examples or terms. Furthermore, those skilled in the art will recognize that various modifications, combinations, and changes can be made according to design conditions and design factors within the scope of the appended claims or their equivalents.

[0212] According to embodiments of the present disclosure, a display device that is easy to fold during folding operations and has improved reliability, as well as an electronic device including the display device, can be provided.

[0213] However, the effects that can be achieved through this disclosure are not limited to those described above, and those skilled in the art will clearly understand from the foregoing description of this disclosure other technical effects not described herein.

Claims

1. A display device, comprising: Display panel; A digitizer having a first side disposed on the side surface of the display panel, the digitizer including a folding portion; A panel support is located between the display panel and the digitizer in the thickness direction of the display panel; A center rod is located on the second side of the digitizer opposite to the first side of the digitizer, and the center rod is positioned to overlap with the folded portion in the thickness direction of the display panel; as well as The wing plates are respectively disposed on opposite sides of the central rod in a first direction intersecting the thickness direction of the display panel. The gap, serving as a separation space, is defined between each of the wing plates and the central rod. The folded portion includes: The first region, including the first hole; and The second region overlaps with the gap in the thickness direction of the display panel.

2. The display device according to claim 1, wherein, When the display device is folded, the maximum extension distance of the first region is greater than the maximum extension distance of the second region when the display device is folded.

3. The display device according to claim 2, wherein, The second region includes a second hole, which has at least one of a different size and shape from the first hole in the plan view.

4. The display device according to claim 3, wherein, The width of each of the first holes in the first direction is smaller than the width of each of the first holes in the second direction intersecting the first direction; as well as The second hole has the same shape as the first hole, and the area of ​​the second hole in the plan view is smaller than the area of ​​the first hole in the plan view.

5. The display device according to claim 3, wherein, Each of the second holes includes: The extended portion extends in a second direction intersecting the first direction; and An expansion portion is provided at the opposite ends of the extension portion, and In the first direction, at least one region of each of the expanded portions has a width greater than the width of the extended portion.

6. The display device according to claim 5, wherein, The expanded portion has at least one planar shape selected from circular, elliptical, triangular, and quadrilateral shapes.

7. The display device according to claim 1, wherein, The aperture ratio of the first region is greater than that of the second region.

8. The display device according to claim 1, further comprising an adhesive portion disposed between the panel support and the digitizer, in, The adhesive portion is configured to overlap at least with the gap in the thickness direction of the display panel.

9. The display device according to claim 8, wherein, The adhesive portion overlaps at least with the folded portion in the thickness direction of the display panel; as well as The modulus of the adhesive portion is less than or equal to 0.2 MPa.

10. The display device according to claim 1, wherein, The digitizer also includes sensing coils disposed between adjacent first holes.

11. A display device, comprising: Display panel; A digitizer having a first side disposed on the side surface of the display panel, the digitizer including a folding portion; A panel support is located between the display panel and the digitizer in the thickness direction of the display panel; An adhesive portion is disposed between the panel support and the digitizer; A center rod is located on the second side of the digitizer opposite to the first side of the digitizer, and the center rod is positioned to overlap with the folded portion in the thickness direction of the display panel; as well as The wing plates are respectively disposed on opposite sides of the central rod in a first direction intersecting the thickness direction of the display panel. The gap, serving as a separation space, is defined between each of the wing plates and the central rod. The adhesive portion is configured to overlap at least with the gap in the thickness direction of the display panel.

12. The display device according to claim 11, wherein, The adhesive portion overlaps at least with the folded portion in the thickness direction of the display panel, and The modulus of the adhesive portion is less than or equal to 0.2 MPa.

13. The display device according to claim 11, wherein, The folded portion includes: The first region, including the first hole; and The second region overlaps with the gap in the thickness direction of the display panel.

14. The display device according to claim 13, wherein, When the display device is folded, the maximum extension distance of the first region is greater than the maximum extension distance of the second region when the display device is folded.

15. The display device according to claim 14, wherein, A second hole is disposed in the second region, and the second hole has at least one of a different size and shape than the first hole in the plan view.

16. The display device according to claim 15, wherein, The width of each of the first holes in the first direction is smaller than the width of each of the first holes in the second direction intersecting the first direction, and The second hole has the same shape as the first hole, and the area of ​​the second hole in the plan view is smaller than the area of ​​the first hole in the plan view.

17. The display device according to claim 15, wherein, Each of the second holes includes: The extended portion extends in a second direction intersecting the first direction; and An expansion portion is provided at the opposite ends of the extension portion, and In the first direction, at least one region of each of the expanded portions has a width greater than the width of the extended portion.

18. The display device according to claim 17, wherein, The expanded portion has at least one planar shape selected from circular, elliptical, triangular, and quadrilateral shapes.

19. The display device according to claim 13, wherein, The aperture ratio of the first region is greater than that of the second region.

20. Electronic devices, including: Display device; Memory, used to store data and information; A processor configured to send the data information to the display device; as well as The power module is configured to provide and generate power. The display device includes: Display panel; A digitizer having a first side disposed on the side surface of the display panel, the digitizer including a folding portion; A panel support is located between the display panel and the digitizer in the thickness direction of the display panel; A center rod, located on a second side of the digitizer opposite to the first side of the digitizer, is positioned to overlap with the folded portion in the thickness direction of the display panel. The wing plates are respectively disposed on opposite sides of the central rod in a first direction intersecting the thickness direction of the display panel. The gaps serving as separation spaces are defined between each of the wing plates and the central rod, and The folded portion includes: The first region, including the first hole; and The second region overlaps with the gap in the thickness direction of the display panel.

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