Display module, preparation method thereof and display device

Abstract

Embodiments of the present disclosure provide a display module, a preparation method thereof and a display device, and relate to the technical field of display, and are used for improving the reliability of the display module. The display module comprises a display panel, a cover plate, a buffer layer, an ink layer and an adhesive layer. The display panel comprises a bending portion. The cover plate is arranged on the display panel, and a surface of the cover plate on a side close to the display panel has a first region, and an orthographic projection of the bending portion on the cover plate is located in the first region. The buffer layer is arranged in the first region. The ink layer is arranged on a side of the buffer layer away from the cover plate and located in the first region. The adhesive layer is at least partially arranged between the ink layer and the bending portion. The modulus of the material of the buffer layer is greater than the modulus of the material of the ink layer and less than the modulus of the material of the cover plate. The display panel is used for displaying an image.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to a display module, its manufacturing method, and a display device. Background Technology

[0002] Organic light-emitting diodes (OLEDs) have been widely used in the display field due to their advantages such as self-illumination, low driving voltage, high luminous efficiency, fast response speed, and flexible display capabilities.

[0003] To provide a better visual experience, narrow bezels have become a trend. However, how to reduce the risk of low reliability caused by narrow bezels has become a problem to be solved in the field. Summary of the Invention

[0004] The purpose of this disclosure is to provide a display module and its manufacturing method, as well as a display device, to improve the reliability of the display module.

[0005] To achieve the above objectives, the embodiments of this disclosure provide the following technical solutions: On one hand, a display module is provided. The display module includes a display panel, a cover plate, a buffer layer, an ink layer, and an adhesive layer. The display panel includes a bent portion. The cover plate is disposed on the display panel, and the surface of the cover plate near the display panel has a first region, the orthographic projection of the bent portion onto the cover plate being located within the first region. The buffer layer is disposed within the first region. The ink layer is disposed on the side of the buffer layer away from the cover plate and is located within the first region. The adhesive layer is at least partially disposed between the ink layer and the bent portion. The modulus of the material of the buffer layer is greater than the modulus of the material of the ink layer and less than the modulus of the material of the cover plate.

[0006] The aforementioned display device includes a display panel, a cover plate, a buffer layer, an ink layer, and an adhesive layer. Within a first region on the surface of the cover plate closest to the display panel, the buffer layer, ink layer, and adhesive layer are sequentially stacked on the side of the first region closest to the display panel. The adhesive layer is at least partially disposed between the ink layer and the bent portion, thereby achieving a narrow bezel effect for the display device.

[0007] It is understandable that during the formation of the adhesive layer, the adhesive layer material has a curing shrinkage rate, and the contact area between the adhesive layer and the ink layer is large, resulting in a large curing shrinkage stress at the interface between the adhesive layer and the ink layer. This generates a large shear stress on the ink layer, which may cause the ink layer to detach from the cover plate, leading to a decrease in the reliability of the display module.

[0008] Furthermore, the modulus of the buffer layer material is greater than that of the ink layer material, but less than that of the cover plate material. Understandably, between the display panel and the cover plate, the modulus of the ink layer, buffer layer, and cover plate materials increases sequentially. The buffer layer can serve as a modulus gradient transition layer between the ink layer and the cover plate. In the event of curing shrinkage stress caused by the adhesive layer's curing shrinkage, the buffer layer can act as a stress buffer transition layer, alleviating the interface stress concentration caused by the modulus mismatch between the ink layer and the cover plate. This reduces the difference in stress changes between the film layers caused by thermal shock, thereby reducing the risk of the ink layer detaching from the cover plate and improving the reliability of the display module.

[0009] In some embodiments, the ink layer includes a first ink layer and a second ink layer, wherein the first ink layer is stacked on the side of the buffer layer away from the cover plate, and the second ink layer is stacked on the side of the first ink layer away from the cover plate. The modulus of the buffer layer, the first ink layer, the second ink layer, and the adhesive layer decreases sequentially.

[0010] In some embodiments, along the bending direction of the display panel, the inner surface of the bent portion has a central region and edge regions located on both sides of the central region. The display module further includes a first potting structure and two second potting structures, the first potting structure being disposed in the central region and the second potting structures being disposed in the edge regions. The modulus of the material of the first potting structure is less than the modulus of the material of the second potting structures.

[0011] In some embodiments, the display module further includes a back film disposed on the non-display side of the display panel, the back film including a groove exposing the inner surface of the bend. The first potting structure and two second potting structures are all located within the groove.

[0012] In some embodiments, the display module further includes a support layer disposed on the side of the back film away from the display panel. The integral formed by the first potting structure and the second potting structure has pores between it and the support layer.

[0013] In some embodiments, the ratio of the volume of the whole formed by the first potting structure and the second potting structure to the volume of the pore ranges from 3 to 9.

[0014] In some embodiments, the first potting structure and the second potting structure have the same volume.

[0015] In some embodiments, the display module further includes a first protective structure, which at least partially covers the outer side of the bend and is connected to the adhesive layer. The modulus of the material of the first protective structure is equal to the modulus of the material of the adhesive layer.

[0016] In some embodiments, the display module further includes a back film and a support layer stacked on the non-display side of the display panel, and a third potting structure disposed inside the bend, wherein a cavity is formed between the bend and the back film and the support layer, and the third potting structure fills the cavity. The display module also includes a first protective structure, at least partially covering the outer side of the bend and connected to the adhesive layer. The modulus of the material of the first protective structure is greater than the modulus of the material of the adhesive layer.

[0017] In some embodiments, the display module further includes a first protective structure, which at least partially covers the outer side of the bend and is connected to the adhesive layer. The modulus of the material of the first protective structure is greater than the modulus of the material of the adhesive layer.

[0018] In some embodiments, the display module further includes a dam, a plurality of retaining walls, and a plurality of second protective structures. The dam is disposed around the bend, and a cavity is formed between the adhesive layer, the bend, and the dam. The plurality of retaining walls are disposed within the cavity and divide the cavity into at least three sub-cavities. A second protective structure fills one sub-cavity.

[0019] In some embodiments, the display module further includes a third protective structure that is filled within the dam and located on the side of the second protective structure away from the cover plate.

[0020] In some embodiments, the height of the retaining wall is less than or equal to the height of the dam in the direction perpendicular to the cover plate.

[0021] In some embodiments, the material of the buffer layer includes at least one of nano-silica, nano-alumina, nano-titanium oxide, or cage-type polysilsesquioxane.

[0022] On the other hand, a method for manufacturing a display module is provided, the method comprising: forming a buffer layer in a first region on the surface of a cover plate; forming an ink layer on the side of the buffer layer away from the cover plate, the ink layer being located within the first region; the modulus of the material of the buffer layer being greater than the modulus of the material of the ink layer and less than the modulus of the material of the cover plate; and bonding the cover plate to a display panel. The display panel includes a bent portion, the orthographic projection of the bent portion onto the cover plate being located within the first region. The bent portion is bonded to the cover plate by an adhesive layer, the adhesive layer being at least partially located between the ink layer and the bent portion.

[0023] The method for manufacturing the aforementioned display device includes forming a buffer layer in a first region on the surface of a cover plate. An ink layer is formed on the side of the buffer layer away from the cover plate, the ink layer being located within the first region. The cover plate is then bonded to a display panel to form a display module. The display panel includes a bent portion, the orthographic projection of which onto the cover plate is located within the first region. The bent portion is bonded to the cover plate via an adhesive layer, the adhesive layer being at least partially located between the ink layer and the bent portion, thereby achieving a narrow bezel effect for the display device.

[0024] It is understandable that during the formation of the adhesive layer, the adhesive layer material has a curing shrinkage rate, and the contact area between the adhesive layer and the ink layer is large, resulting in a large curing shrinkage stress at the interface between the adhesive layer and the ink layer. This generates a large shear stress on the ink layer, which may cause the ink layer to detach from the cover plate, leading to a decrease in the reliability of the display module.

[0025] The modulus of the buffer layer material is greater than that of the ink layer material, but less than that of the cover plate material. Understandably, the modulus of the ink layer, buffer layer, and cover plate materials increases sequentially between the display panel and the cover plate. The buffer layer can act as a modulus gradient transition layer between the ink layer and the cover plate. In the event of curing shrinkage stress caused by the adhesive layer's curing shrinkage, the buffer layer can act as a stress buffer transition layer, alleviating the interface stress concentration caused by the modulus mismatch between the ink layer and the cover plate. This reduces the difference in stress changes between the film layers caused by thermal shock, thereby reducing the risk of the ink layer detaching from the cover plate and improving the reliability of the display module.

[0026] In some embodiments, forming an ink layer includes: forming a first ink layer on the side of the buffer layer away from the cover plate; and forming a second ink layer on the side of the first ink layer away from the cover plate. The modulus of the buffer layer, the first ink layer, the second ink layer, and the adhesive layer decreases sequentially.

[0027] In some embodiments, the above-described preparation method further includes: providing a back film on the non-display side of the display panel, the back film including a groove exposing the inner surface of the bent portion. Along the bending direction of the display panel, the inner surface of the bent portion has a central region and edge regions located on both sides of the central region. A first potting structure and two second potting structures are formed within the groove, the first potting structure being located in the central region and the second potting structures being located in the edge regions. The modulus of the material of the first potting structure is less than the modulus of the material of the second potting structures. The display panel is then bent.

[0028] In some embodiments, after bonding the cover plate to the display panel, the above-described preparation method further includes: forming a first protective structure, the first protective structure at least partially covering the outer side of the bend and connected to the adhesive layer. The modulus of the material of the first protective structure is greater than the modulus of the material of the adhesive layer.

[0029] In some embodiments, after bonding the cover plate to the display panel, the above-described preparation method further includes: forming a dam around the bend, and forming a cavity between the adhesive layer, the bend, and the dam. A plurality of baffles are formed within the cavity, the baffles being arranged along a first direction to divide the cavity into at least three sub-cavities. Along the first direction, the at least three sub-cavities include a first sub-cavity and a second sub-cavity, the first and second sub-cavities being alternately arranged. The first direction is parallel to the cover plate and perpendicular to the bending direction of the display panel. A first application of adhesive is performed to form a protective adhesive in the first sub-cavity. A second application of adhesive is performed to form a protective adhesive in the second sub-cavity.

[0030] In some embodiments, after the second application of adhesive, the above preparation method further includes: applying adhesive inside the dam to fill the dam.

[0031] In another aspect, a display device is provided. The display device includes a display module and a controller as described in any of the above embodiments. The controller is electrically connected to the display module.

[0032] The above-described display device has the same structure and beneficial technical effects as the display panel provided in some of the above embodiments, and will not be described again here. Attached Figure Description

[0033] To more clearly illustrate the technical solutions in this disclosure, the accompanying drawings used in some embodiments of this disclosure will be briefly described below. Obviously, the drawings described below are only drawings of some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual process of the method, etc. involved in the embodiments of this disclosure.

[0034] Figure 1 This is a structural diagram of a display module according to some embodiments; Figure 2 for Figure 1 A magnified view of the display module at point M; Figure 3 This is a structural diagram of a display module according to some other embodiments; Figure 4 This is a structural diagram of a display module according to some other embodiments; Figure 5 This is a top view of the structure of a display module according to some other embodiments; Figure 6 for Figure 5 A cross-sectional view of the display module along section line CC'; Figure 7 for Figure 5 A cross-sectional view of the display module along section line DD'; Figure 8 for Figure 7 The right view of the display module at point N; Figure 9 This is a flowchart of a method for manufacturing a display module according to some embodiments; Figures 10-28 The diagram shows the steps of a method for manufacturing a display module according to some embodiments; Figure 29 This is a structural diagram of a display device according to some embodiments. Detailed Implementation

[0035] The technical solutions in some embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0036] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as open-ended and encompassing, meaning "including, but not limited to." In the description of the specification, terms such as "one embodiment," "some embodiments," "exemplary embodiment," "example," or "some examples" are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this disclosure. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics mentioned may be included in any suitable manner in any one or more embodiments or examples.

[0037] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this disclosure, unless otherwise stated, "a plurality of" means two or more.

[0038] In describing some embodiments, the terms "coupled" and "connected," and their derivative expressions, may be used. The term "connected" should be interpreted broadly; for example, a "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection via an intermediate medium. The term "coupled," for example, indicates that two or more components have direct physical or electrical contact. The term "coupled" or "communicatively coupled" may also refer to two or more components that do not have direct contact with each other but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the content of this document.

[0039] "At least one of A, B and C" has the same meaning as "at least one of A, B or C", both including the following combinations of A, B and C: only A, only B, only C, combinations of A and B, combinations of A and C, combinations of B and C, and combinations of A, B and C.

[0040] "A and / or B" includes the following three combinations: A only, B only, and a combination of A and B.

[0041] As used herein, depending on the context, the term “if” may optionally be interpreted as meaning “when”, “in the event of”, “in response to determination”, or “in response to detection”. Similarly, depending on the context, the phrase “if it is determined that…” or “if [the stated condition or event] is detected” may optionally be interpreted as meaning “in the event of determination that…”, “in response to determination that…”, “when [the stated condition or event] is detected”, or “in response to the detection of [the stated condition or event]”.

[0042] The use of “applies to” or “configured to” in this article implies an open and inclusive language that does not preclude applicability to or configuration to devices that perform additional tasks or steps.

[0043] In addition, the use of “based on” implies openness and inclusivity, because processes, steps, calculations or other actions “based on” one or more of the stated conditions or values ​​may in practice be based on additional conditions or values ​​beyond those stated.

[0044] As used herein, “about,” “approximately,” or “approximately” includes the stated value and the average value within an acceptable range of deviation from the given value, wherein the acceptable range of deviation is determined by a person skilled in the art taking into account the measurement under discussion and the error associated with the measurement of the given quantity (i.e., the limitations of the measurement system).

[0045] As used herein, “parallel,” “perpendicular,” and “equal” include the described situation and situations that are similar to the described situation, within an acceptable deviation range, which is determined by those skilled in the art taking into account the measurement under discussion and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, “parallel” includes absolute parallelism and approximate parallelism, where an acceptable deviation range for approximate parallelism may be, for example, within 5°; “perpendicular” includes absolute perpendicularity and approximate perpendicularity, where an acceptable deviation range for approximate perpendicularity may also be, for example, within 5°; “equal” includes absolute equality and approximate equality, where an acceptable deviation range for approximate equality may be, for example, a difference between the two equals being less than or equal to 5% of either one.

[0046] It should be understood that when a layer or element is referred to as being on another layer or substrate, it can mean that the layer or element is directly on the other layer or substrate, or that there is an intermediate layer between the layer or element and the other layer or substrate.

[0047] This document describes exemplary embodiments with reference to cross-sectional views and / or plan views, which are idealized exemplary drawings. In the drawings, the thickness of layers and the area of ​​regions are enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Thus, exemplary embodiments should not be construed as being limited to the shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing processes. For example, etched areas shown as rectangular would typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the areas of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0048] With the rapid development of the Organic Light Emitting Diode (OLED) display industry, a large number of new display devices are gradually entering the market. To achieve a larger screen-to-body ratio and provide users with a better visual experience, narrow bezels have become a trend in display devices. However, narrow bezels also bring the risk of lower reliability. In related technologies, the mid-frame of the device is bonded to the cover glass (CG) of the flexible display panel, requiring a bonding width of 0.8mm.

[0049] To further reduce the bonding width between the CG and the flexible display panel, a corresponding adhesive structure can be formed on the ink on the bezel using 3D printing technology or five-axis linkage adhesive dispensing technology. This transfers the bonding surface of the entire frame, allowing the interface with the ink layer on the CG to be directly bonded to the display panel with adhesive. This assembly method can significantly reduce the bezel of the display module by more than 0.5mm.

[0050] However, the modulus of conventional inks is approximately 3 GPa to 5 GPa, while that of CG is approximately 75 GPa, a difference of 15 to 25 times. Therefore, the interfacial shear stress generated by these two materials in thermal shock environments is extremely high. Since the bonding surface with the ink is an adhesive structure, to meet the corresponding overall mechanical properties, the modulus of the adhesive structure material needs to be maintained at 1.6 GPa to 2.3 GPa, while ensuring a thickness of 2 mm to 2.5 mm and a width of approximately 3 mm. Therefore, a large amount of adhesive material is required for the adhesive structure. Furthermore, due to the curing shrinkage of the adhesive, the large bonding area between the adhesive and the ink surface during curing, coupled with significant curing shrinkage stress, generates extremely high shear stress on the ink surface.

[0051] Therefore, due to the huge difference between the ink modulus and the CG modulus, as well as the huge shear stress on the ink surface caused by the characteristics of the glue modulus, curing shrinkage rate, and dosage under the aforementioned narrow bezel structure, the shear stress between the adhesive structure, ink, and CG interface changes significantly in the thermal shock test environment. This results in a high rate of ink and CG interface detachment, leading to a decrease in the reliability of the display module.

[0052] Furthermore, since the mid-frame, mid-frame adhesive, bonding structure, and display panel form a single unit, under thermal shock conditions, the display panel is subjected to a combination of stresses, including compressive stress from the mid-frame constraint, shrinkage stress from the adhesive material, and warping stress from the flexible screen. This combined stress is transmitted to the flexible screen, potentially causing defects in the flexible screen's film layer. For example, this defect manifests as a fracture in the inorganic layer below the Gate Driver on Array (GOA) traces, leading to a breakage of the GOA metal lines, resulting in a yellow screen and an inability to switch images, thus reducing the display quality of the display module.

[0053] To address at least one of the aforementioned problems, in one aspect, embodiments of this disclosure provide a display module. Figure 1 This is a structural diagram of a display module according to some embodiments; Figure 2 for Figure 1 The enlarged view of the display module at point M.

[0054] See Figure 1 The display module 10 includes a display panel 1, a cover plate 2, a buffer layer 3, an ink layer 4, and an adhesive layer 5.

[0055] For example, the display module 10 also includes an optical adhesive layer 13, which is disposed between the display panel 1 and the cover plate 2. The optical adhesive layer 13 can be used to bond and fix the display panel 1 and the cover plate 2.

[0056] For example, display module 10 can be an OLED.

[0057] See also Figure 1 The display panel 1 includes a bent portion 6.

[0058] For example, the display panel 1 further includes a display part A and a bonding part B, which are connected by a bending part 6. The display part A can be used for displaying an image. The bonding part B can be used for bonding a circuit board. For example, a flexible circuit board 111 can be electrically connected to the display panel 1 through the pads on the bonding part B.

[0059] For example, the display module 10 also includes a protective adhesive layer 14, which is disposed on the outside of the bending portion 6 and serves multiple functions such as stress dispersion, environmental isolation, and structural protection. For example, the material of the protective adhesive layer 14 can be a micro coating layer (MCL).

[0060] See also Figure 1 The cover plate 2 is disposed on the display panel 1. The surface of the cover plate 2 near the display panel 1 has a first region 21. The orthographic projection of the bent portion 6 on the cover plate 2 is located within the first region 21.

[0061] For example, the material of the cover plate 2 can be glass.

[0062] See Figure 1 and Figure 2 The buffer layer 3 is disposed within the first region 21. The ink layer 4 is disposed on the side of the buffer layer 3 away from the cover plate 2, and is located within the first region 21.

[0063] For example, the material of the buffer layer 3 can be a porous nanomaterial. The ink layer 4 can be a decorative or light-shielding ink on the side of the cover plate 2 near the display panel 1. The ink layer 4 can be used to shield components located within the first area 21, such as wiring, driver chips, etc., and also serve to beautify the bezel and prevent light leakage.

[0064] For example, the modulus of the cover plate 2 is approximately 75 GPa, and the modulus of the ink layer 4 is approximately 3 GPa to 5 GPa. The above modulus can be Young's modulus or storage modulus. The significant difference in modulus between the cover plate 2 and the ink layer 4 means that when the display module 10 is subjected to stress, modulus mismatch may occur between the cover plate 2 and the ink layer 4, leading to interface stress concentration. This results in a large difference in stress changes between the cover plate 2 and the ink layer 4 during thermal shocks of the display module 10.

[0065] See Figure 1 The adhesive layer 5 is at least partially disposed between the ink layer 4 and the bent portion 6.

[0066] For example, the material of adhesive layer 5 can be glue.

[0067] For example, during the formation of the adhesive layer 5, adhesive needs to be applied between the ink layer 4 and the bent portion 6, and then the adhesive is cured. During the curing process of the adhesive, due to the curing shrinkage rate of the adhesive and the large contact area between the adhesive and the ink layer 4, there is a large curing shrinkage stress at the interface between the adhesive and the ink layer 4, which generates a large shear stress on the ink layer 4.

[0068] For example, along the Z direction, the thickness of the buffer layer 3 can range from 320 nm to 400 nm. Along the X direction, the width of the adhesive layer 5 can be approximately 3 mm.

[0069] Among them, see Figure 2 The modulus of the material of the buffer layer 3 is greater than that of the material of the ink layer 4, but less than that of the material of the cover plate 2.

[0070] For example, the modulus of the materials of the buffer layer 3, ink layer 4, and cover plate 2 can all be either storage modulus or Young's modulus. Modulus can characterize the rigidity of a material, that is, the hardness of the material. The larger the modulus, the greater the hardness of the material and the lower the flexibility; the smaller the modulus, the lower the hardness of the material and the higher the flexibility.

[0071] For example, the modulus of the material of the buffer layer 3 can be in the range of 10 GPa to 60 GPa.

[0072] The aforementioned display device 10 includes a display panel 1, a cover plate 2, a buffer layer 3, an ink layer 4, and an adhesive layer 5. Within a first region 21 on the surface of the cover plate 2 closest to the display panel 1, the buffer layer 3, the ink layer 4, and the adhesive layer 5 are sequentially stacked. The adhesive layer 5 is at least partially disposed between the ink layer 4 and the bent portion 6, thereby achieving a narrow bezel effect for the display device 10.

[0073] It is understandable that during the formation of adhesive layer 5, the material of adhesive layer 5 has a curing shrinkage rate, and the contact area between adhesive layer 5 and ink layer 4 is large, resulting in a large curing shrinkage stress at the interface between adhesive layer 5 and ink layer 4, which generates a large shear stress on ink layer 4. This shear stress may cause ink layer 4 to detach from cover plate 2, resulting in a decrease in the reliability of display module.

[0074] Furthermore, the modulus of the material of the buffer layer 3 is greater than that of the material of the ink layer 4, but less than that of the material of the cover plate 2. It is understood that the modulus of the materials of the ink layer 4, buffer layer 3, and cover plate 2 increases sequentially between the display panel 1 and the cover plate 2. The buffer layer 3 can serve as a modulus gradient transition layer between the ink layer 4 and the cover plate 2. In the event of curing shrinkage stress generated by the curing shrinkage of the adhesive layer 5, the buffer layer 3 can act as a stress buffer transition layer, alleviating the interface stress concentration caused by the modulus mismatch between the ink layer 4 and the cover plate 2, reducing the difference in interlayer stress changes between the ink layer 4 and the cover plate 2 due to thermal shock, thereby reducing the risk of the ink layer 4 detaching from the cover plate 2 and improving the reliability of the display module 10.

[0075] For example, the orthographic projection of the ink layer 4 on the cover plate 2 can at least partially overlap with the orthographic projection of the buffer layer 3 on the cover plate 2, thereby achieving stress buffering of the ink layer 4 by the buffer layer 3. Alternatively, the orthographic projection of the ink layer 4 on the cover plate 2 can also overlap with the orthographic projection of the buffer layer 3 on the cover plate 2, thereby further achieving stress buffering of the ink layer 4 by the buffer layer 3.

[0076] In some embodiments, see Figure 2 The ink layer 4 includes a first ink layer 41 and a second ink layer 42. The first ink layer 41 is stacked on the side of the buffer layer 3 away from the cover plate 2, and the second ink layer 42 is stacked on the side of the first ink layer 41 away from the cover plate 2.

[0077] It is understandable that, along direction Z, a buffer layer 3, a first ink layer 41, a second ink layer 42, an adhesive layer 5, and a bending area 6 are sequentially stacked on the first region 21 of the cover plate 2.

[0078] For example, the first ink layer 41 and the second ink layer 42 can be one of black ink and white ink, respectively. The black ink can absorb stray light leaking from the side or back of the display module 10, reducing halo effect and improving display contrast. The white ink can act as a light shielding layer, blocking backlight or ambient light from penetrating from the bezel area, preventing light leakage and halo at the edge of the display unit A. Furthermore, white has high reflectivity, which can reflect backlight incident on the bezel back to the display unit A, improving the overall brightness of the screen and reducing dark corners.

[0079] The modulus of the buffer layer 3, the first ink layer 41, the second ink layer 42 and the adhesive layer 5 decreases sequentially.

[0080] For example, the material of the first ink layer 41 can be an epoxy-amine curing system ink, and the modulus of the epoxy-amine curing system ink is approximately 5 GPa. The material of the buffer layer 3 can be porous nano-silica (SiO2), and the epoxy-amine curing system ink has good adhesion to SiO2. During the process of forming the first ink layer 41 on the buffer layer 3, the adhesion rate of the first ink layer 41 can be improved.

[0081] For example, the material of the second ink layer 42 can be a silicone-modified ink with a modulus of about 1 GPa to 2 GPa. The modulus of the silicone-modified ink is similar to that of the adhesive layer 5 and greater than that of the adhesive layer 5, which is beneficial to forming a more gradual modulus change.

[0082] It is understandable that the first ink layer 41 and the second ink layer 42 adopt different modulus parameters. The modulus of the buffer layer 3, the first ink layer 41, the second ink layer 42 and the adhesive layer 5 stacked in sequence decreases in sequence, further forming a gradient transition of the stacked film layers. A modulus gradient transition is formed between the second ink layer 42 and the adhesive layer 5, between the first ink layer 41 and the second ink layer 42, between the first ink layer 41 and the buffer layer 3, and between the buffer layer 3 and the cover plate 2. The buffer layer 3 can better absorb the shear stress generated by the curing shrinkage of the adhesive layer 5, further alleviate the interface stress concentration caused by the modulus mismatch between the ink layer 4 and the cover plate 2, reduce the stress change difference between the film layers caused by thermal shock between the ink layer 4 and the cover plate 2, thereby further reducing the risk of the ink layer 4 and the cover plate 2 falling off, and thus further improving the reliability of the display module 10.

[0083] In some embodiments, see Figure 1 Along the bending direction U of the display panel 1, the inner surface of the bent portion 6 has a central region 61 and edge regions 62 located on both sides of the central region 61. It can be understood that, along the direction U, the two parts of the edge regions 62 are located on opposite sides of the central region 61.

[0084] For example, the bending direction U can be clockwise or counterclockwise. For instance, the display panel 1 can be bent along the bending direction U, and the binding part B can be bent to the non-display side 101 of the display part A to form the bending part 6.

[0085] For example, the inner surface of the bend 6 can be an extension of the non-display side 101.

[0086] See also Figure 1 The display module 10 also includes a first potting structure 71 and two second potting structures 72. The first potting structure 71 is disposed in the middle region 61, and the second potting structures 72 are disposed in the edge region 62. It can be understood that the two second potting structures 72 are respectively disposed in two parts of the edge region 62 located on opposite sides of the middle region 61.

[0087] For example, the first potting structure 71 is in contact with both second potting structures 72.

[0088] The modulus of the material of the first potting structure 71 is less than the modulus of the material of the second potting structure 72.

[0089] For example, the modulus of the material of the first potting structure 71 can be in the range of 0.5 MPa to 1.9 MPa. The first potting structure 71 can be formed by curing adhesive. After curing, the hardness of the adhesive can be in the range of 10A to 20A. The elongation at break of the cured first potting structure 71 can be 350% to 500%, and the creep recovery rate can be greater than 93%. For example, the curing temperature of the adhesive can be 65°C, and the curing time can be 30 minutes.

[0090] Understandably, the material of the first potting structure 71 has a low modulus, low hardness, and high elongation at break and creep recovery rate. Due to its low modulus, low hardness, high elongation at break and high creep recovery rate, when the display module 10 is subjected to external stress, the adhesive itself can absorb the external stress through shear deformation. This allows at least part of the external stress to be transferred to the low-modulus first potting structure 71, thereby improving the toughness of the bending portion 6 and reducing the stress intensity on the structure within the bending portion 6. This reduces the possibility of the wiring within the display panel 1 cracking, thereby further improving the reliability of the display module 10.

[0091] For example, the modulus of the material of the second potting structure 72 can be in the range of 1.9 GPa to 2.5 GPa. The second potting structure 72 can be formed by curing adhesive. The hardness of the cured adhesive can be in the range of 65D to 73D, and the elongation at break of the cured second potting structure 72 can be 26% to 47%. For example, the curing temperature of the adhesive can be 65°C, and the curing time can be 30 minutes.

[0092] Understandably, the material of the second potting structure 72 has a large modulus, high hardness, and low elongation at break and creep recovery. Due to its large modulus and high hardness, the cured second potting structure 72 has a strong supporting effect and can effectively resist the impact of external stress on the bending area 6. When the display module 10 is subjected to external impact, the second potting structure 72 can protect the structure inside the bending part 6, reduce the possibility of the wiring inside the display panel 1 breaking, and thus further improve the reliability of the display module 10.

[0093] In some embodiments, see Figure 1 The display module 10 also includes a back film 11 disposed on the non-display side 101 of the display panel 1, the back film 11 including a groove 60 exposing the inner surface of the bent portion 6.

[0094] For example, the back film 11 can be bonded to the non-display side 101 of the display panel 1. Other functional layers, such as a support layer, spacer layer, heat dissipation layer, or optical material layer, are also provided on the side of the back film 11 away from the display panel 1. These examples of functional layers do not necessarily encompass all functional layers within the display module 10. Any layer structure in the display module 10 that has a lateral protrusion relationship with the upper and lower layers in a direction parallel to the cover plate 2 is applicable to the structural design and protection scope described in this solution.

[0095] See also Figure 1 The first potting structure 71 and the two second potting structures 72 are all located within the groove 60.

[0096] Understandably, both the first potting structure 71 and the two second potting structures 72 are in contact with the inner surface of the bent portion 6. When the display module 10 is subjected to external stress, the low-modulus first potting structure 71 can absorb the external stress through its own shear deformation, thereby transferring at least a portion of the external stress from the inner surface of the bent portion 6 to the first potting structure 71. Furthermore, the high-modulus second potting structures 72 can further enhance the support performance for the inner surface of the bent portion 6, achieving support and protection for the inner surface of the bent portion 6, thereby further reducing the possibility of poor wiring breakage within the display panel 1, and thus further improving the reliability of the display module 10.

[0097] In some embodiments, see Figure 1 The display module 10 also includes a support layer 12, which is disposed on the side of the back film 11 away from the display panel 1.

[0098] For example, the material of the support layer 12 can be super clean foam (SCF). The support layer 12 can be attached to the non-display side 101 of the display panel 1 to achieve at least one of the functions of support, heat dissipation and cushioning.

[0099] See also Figure 1 The integral formed by the first potting structure 71 and the second potting structure 72 has a hole 70 between it and the support layer 12.

[0100] For example, the hole 70 may exist between the integral formed by the first potting structure 71 and the second potting structure 72 and the support layer 12 and the back membrane 11.

[0101] Understandably, the hole 70 can physically isolate the support layer 12 from the whole formed by the first potting structure 71 and the second potting structure 72. Due to the presence of the hole 70, the stress on the bending area 6 cannot be directly transmitted to the support layer 12 through physical contact, and thus the stress cannot be transmitted to the display panel 1 through the support layer 12. This further improves the stress buffering effect inside the bending area 6, thereby further reducing the possibility of the wiring in the display panel 1 breaking or malfunctioning, and thus further improving the reliability of the display module 10.

[0102] In some embodiments, see Figure 1 The ratio of the volume of the whole formed by the first potting structure 71 and the second potting structure 72 to the volume of the hole 70 is in the range of 3 to 9.

[0103] For example, the ratio of the volume of the whole formed by the first potting structure 71 and the second potting structure 72 to the volume of the hole 70 can be 3, 4.5, 6, 7.5 or 9.

[0104] For example, the volume of the whole formed by the first potting structure 71 and the second potting structure 72 can account for 75% to 90% of the volume of the bent portion 6, and the volume of the hole 70 can account for 10% to 25% of the volume of the bent portion 6.

[0105] Understandably, if the ratio is greater than 9, the volume of the hole 70 is smaller, leaving less allowance for deformation of the bending portion 6. After the display panel 1 deforms, the support layer 12 may come into contact with the first potting structure 71 or the second potting structure 72, thereby increasing the possibility that the support layer 12 will transmit stress to the display panel 1. If the ratio is less than 3, the volume of the hole 70 is larger, the glue filling in the bending portion 6 is insufficient, and the encapsulation strength inside the bending portion 3 is reduced.

[0106] Therefore, by setting the ratio of the volume of the whole formed by the first potting structure 71 and the second potting structure 72 to the volume of the hole 70 in the range of 3 to 9, the stress buffering effect inside the bending area 6 is improved while ensuring the encapsulation strength inside the bending area 6, thereby further improving the reliability of the display module 10.

[0107] In some embodiments, see Figure 1 The volumes of the first potting structure 71 and the second potting structure 72 are equal.

[0108] For example, in the process of forming the first potting structure 71 and the two second potting structures 72, the first potting structure 71 is formed by curing a low-modulus adhesive, and the second potting structure 72 is formed by curing a high-modulus adhesive. The filling ratio of the low-modulus adhesive and the high-modulus adhesive can be 1:2.

[0109] It is understandable that by setting the volumes of the first potting structure 71 and the second potting structure 72 to be equal, the stress buffering effect inside the bending area 6 can be further improved while ensuring the encapsulation strength inside the bending area 6, thereby further improving the reliability of the display module 10.

[0110] In some embodiments, see Figure 1 The display module 10 also includes a first protective structure 81, at least a portion of which covers the outside of the bent portion 6 and is connected to the adhesive layer 5.

[0111] For example, a five-axis linkage dispensing process can be used to sequentially dispense adhesive on the outside of the bent portion 6 to form the adhesive layer 5 and the first protective structure 81.

[0112] The five-axis linkage dispensing process refers to the simultaneous and coordinated movement of five motion axes (X / Y / Z + A / C dual rotation axes) during the dispensing process. This allows the dispensing head to approach the workpiece surface at any spatial orientation and angle, achieving high-precision and high-efficiency dispensing operations on complex three-dimensional curved surfaces. Compared to traditional three-axis dispensing (only X / Y / Z translation), five-axis linkage overcomes planar limitations and can handle complex structures such as irregular shapes, curved surfaces, and dead angles. Through the five-axis linkage dispensing process, a first protective structure 81 and an adhesive layer 5 that fit more closely to the outer side of the bend 6 on the curved surface can be formed.

[0113] See also Figure 1 The modulus of the material of the first protective structure 81 is equal to the modulus of the material of the adhesive layer 5.

[0114] For example, the modulus of the materials of the first protective structure 81 and the adhesive layer 5 can both be in the range of 1.6 GPa to 2 GPa, and the hardness of both materials can both be in the range of 70D to 75D. By using the adhesive layer 5 with the above-mentioned modulus and hardness to the first protective structure 81, the encapsulation strength of the outer side of the bent portion 6 can be further enhanced, the structural reliability of the bent portion 6 can be improved, and thus the reliability of the display module 10 can be improved.

[0115] It is understandable that the buffer layer 3 set between the ink layer 4 and the cover plate 2 can serve as a modulus gradient transition layer. When the adhesive layer 5 undergoes curing shrinkage and generates curing shrinkage stress, the buffer layer 3 can serve as a stress buffer transition layer to alleviate the interface stress concentration caused by the modulus mismatch between the ink layer 4 and the cover plate 2, reduce the difference in stress change between the film layers caused by thermal shock between the ink layer 4 and the cover plate 2, and thus reduce the risk of the ink layer 4 and the cover plate 2 falling off.

[0116] Furthermore, a first protective structure 81 connected to the adhesive layer 5 is provided on the outer side of the bent portion 6. The first protective structure 81 protects at least part of the outer side of the bent portion 6 it covers. The modulus of the first protective structure 81 is equal to the modulus of the adhesive layer 5. The first protective structure 81 can further enhance the encapsulation strength of the outer side of the bent portion 6, improve the structural reliability of the bent portion 6, and thus improve the reliability of the display module 10.

[0117] For example, see [link to example]. Figure 1 The modulus of the material of the first protective structure 81 can be greater than that of the material of the adhesive layer 5. The adhesive layer 5 with a lower modulus has the function of stress buffering, while the first protective structure 81 with a higher modulus has the function of enhancing mechanical support. The combination of the two can also improve the structural reliability of the display module 10.

[0118] Figure 3 This is a structural diagram of a display module according to some other embodiments.

[0119] In some embodiments, see Figure 3 The display module 10 also includes a back film 11 and a support layer 12 stacked on the non-display side 101 of the display panel 1, and a third potting structure 73 disposed inside the bending portion 6. A hole 70 is formed between the bending portion 6 and the back film 11 and the support layer 12, and the third potting structure 73 fills the hole 70.

[0120] For example, the non-display side 101 of the display panel 1 may also be provided with other functional film layers, and the bending portion 6 together with the back film 11, the support layer 12 and the other functional film layers to form a hole 70.

[0121] For example, the third potting structure 73 can be a potting compound to fill the cavity 70. The potting compound can be a high modulus adhesive, for example, the modulus range of the potting compound can be 1.9 GPa to 2.5 GPa, thereby ensuring the hardness and support performance of the third potting structure 73 filled in the cavity 70 and improving the structural strength of the display module 10.

[0122] It is understandable that, since the adhesive layer 5 is in contact with the bent portion 6 of the display panel 1, and the third potting structure 73 filling the hole 70 is also in contact with the bent portion 6, the curing shrinkage stress of the adhesive layer 5 and the third potting structure 73 may be transmitted to the bent portion 6, which may cause the traces provided in the bent portion 6 to break, resulting in the display panel 1 displaying a yellow screen and being unable to switch images, thus reducing the display quality of the display module 10.

[0123] See also Figure 3The display module 10 also includes a first protective structure 81, at least a portion of which covers the outside of the bent portion 6 and is connected to the adhesive layer 5. The modulus of the material of the first protective structure 81 is greater than the modulus of the material of the adhesive layer 5.

[0124] For example, the modulus of the material of the first protective structure 81 can range from 1.4 GPa to 1.9 GPa, the hardness of the cured first protective structure 81 can range from 65D to 73D, and the elongation at break of the first protective structure 81 can range from 26% to 47%. For example, light with a wavelength range of 365 nm or 470 nm can be used to irradiate the material of the first protective structure 81 for 1 minute to achieve curing. The viscosity of the adhesive used in the first protective structure 81 can range from 25000 cps to 46000 cps, and the thixotropic index can range from 2 to 5.

[0125] It is understandable that a high-modulus, high-hardness, and low-elongation-at-break adhesive can be applied to the outside of the bending portion 6, that is, at least a portion of the first protective structure 81 can be applied to the outside of the bending portion 6. The first protective structure 81 has a strong protective effect and can effectively resist the impact transmitted to the bending portion 6 from the outside, thereby further enhancing the encapsulation strength of the outside of the bending portion 6, improving the structural reliability of the bending portion 6, and thus improving the reliability of the display module 10.

[0126] For example, see [link to example]. Figure 3 The modulus of the adhesive layer 5 can range from 0.5 MPa to 1.9 MPa, the hardness of the cured adhesive layer 5 can range from 10A to 20A, its elongation at break can range from 350% to 500%, and its creep recovery rate is greater than 93%. For example, light with a wavelength range of 365 nm or 470 nm can be used to irradiate the material of the adhesive layer 5 for 1 minute to achieve curing. The viscosity of the adhesive used in the adhesive layer 5 can range from 25,000 cps (centipoise) to 46,000 cps, and its thixotropic index can range from 2 to 5.

[0127] Understandably, adhesives with low modulus, low hardness, high elongation at break, and high creep recovery can be filled into areas of weak strength. That is, the adhesive layer 5 is placed between the ink layer 4 and the bending part 6. When the display module 10 is subjected to external force, the stress transmitted to the display panel 1 can be absorbed by the deformation of the adhesive layer 5, thereby protecting the display panel 1.

[0128] For example, a first five-axis linkage dispensing process can be used to dispense adhesive between the ink layer 4 and the bending portion 6 to form an adhesive layer 6. Then, a second five-axis linkage dispensing process can be used to dispense adhesive to reinforce the strength of at least a portion on the outside of the bending portion 6 to form a first protective structure 81.

[0129] It is understandable that the buffer layer 3 set between the ink layer 4 and the cover plate 2 can serve as a modulus gradient transition layer. When the adhesive layer 5 undergoes curing shrinkage and generates curing shrinkage stress, the buffer layer 3 can serve as a stress buffer transition layer to alleviate the interface stress concentration caused by the modulus mismatch between the ink layer 4 and the cover plate 2, reduce the difference in stress change between the film layers caused by thermal shock between the ink layer 4 and the cover plate 2, and thus reduce the risk of the ink layer 4 and the cover plate 2 falling off.

[0130] Furthermore, a first protective structure 81 connected to the adhesive layer 5 is provided on the outer side of the bent portion 6. The first protective structure 81 protects at least part of the outer side of the bent portion 6 it covers. The modulus of the first protective structure 81 is greater than that of the adhesive layer 5. The adhesive layer 5 can achieve stress buffering, and the first protective structure 81 can enhance the encapsulation strength of the outer side of the bent portion 6, thereby further improving the reliability of the display module 10.

[0131] Figure 4 This is a structural diagram of a display module according to some other embodiments.

[0132] In some embodiments, see Figure 3 and Figure 4 The display module 10 also includes a first protective structure 81, at least a portion of which covers the outside of the bent portion 6 and is connected to the adhesive layer 5. The modulus of the material of the first protective structure 81 is greater than the modulus of the material of the adhesive layer 5.

[0133] It is understandable that, since the adhesive layer 5 is in contact with the bent portion 6 of the display panel 1, the curing shrinkage stress of the adhesive layer 5 may be transmitted to the bent portion 6, which may cause the wiring provided in the bent portion 6 to break, resulting in the display panel 1 displaying a yellow screen and being unable to switch images, thereby reducing the display quality of the display module 10.

[0134] For example, a GOA may be provided at the contact point between the adhesive layer 5 and the bending part 6. The curing shrinkage stress of the adhesive layer 5 may cause the inorganic layer below the GOA trace to break, which in turn causes the GOA metal line to break, resulting in a yellow screen and inability to switch images, thus reducing the display quality of the display module.

[0135] For example, see Figure 3When a third potting structure 73 is provided within the hole 70, the modulus of the material of the first protective structure 81 can be greater than the modulus of the material of the adhesive layer 5. When the display module 10 is subjected to external force, the larger moduli of the third potting structure 73 and the first protective structure 81 provide sufficient support strength and rigidity for the bent portion 6, improving its mechanical strength and structural reliability. The adhesive layer 5 has a smaller modulus; combined with the buffer layer 3, they provide stress buffering for the bent portion 6. The buffer layer 3 reduces the risk of the ink layer 4 detaching from the cover plate 2, and the adhesive layer 5 reduces the possibility of poor wiring breakage within the display panel 1, thereby further improving the reliability of the display module 10.

[0136] Or see Figure 4 When a first potting structure 71 and two second potting structures 72 are provided within the hole 70, the modulus of the material of the first protective structure 81 can be greater than the modulus of the material of the adhesive layer 5. When the display module 10 is subjected to external force, the second potting structure 72 and the first protective structure 81 have larger moduli, which can provide sufficient support strength and hardness for the bending part 6, improving the mechanical strength and structural reliability of the bending part 6. The first potting structure 71 and the adhesive layer 5 have smaller moduli. Combined with the buffer layer 3, the three can provide stress buffering for the bending part 6. The buffer layer 3 can reduce the risk of the ink layer 4 detaching from the cover plate 2. The first potting structure 71 and the adhesive layer 5 can both reduce the possibility of poor wiring breakage within the display panel 1, thereby further improving the reliability of the display module 10.

[0137] Figure 5 This is a top view of the structure of a display module according to some other embodiments; Figure 6 for Figure 5 The sectional view of the display module along section line CC'.

[0138] In some embodiments, see Figure 5 The display module 10 also includes a dam 91, multiple retaining walls 92 and multiple second protective structures 82.

[0139] For example, the dam 91 and the multiple retaining walls 92 may be made of the same material, or they may be made of different materials.

[0140] For example, the dam 91 and the plurality of retaining walls 92 can both be formed by curing a bank adhesive. The plurality of second protective structures 82 can be formed by curing a filling adhesive.

[0141] For example, the aforementioned Bank adhesive can be an epoxy-based adhesive with a viscosity greater than 700,000 mp.s (millipascals per second). The Bank adhesive can be cured by irradiation with light at a wavelength of 470 nm to form dams 91 and multiple retaining walls 92. The thixotropic index of the aforementioned Bank adhesive is approximately 7, and the Young's modulus of the cured Bank adhesive ranges from 1.6 GPa to 2.3 GPa, with a hardness greater than 75 D and a curing shrinkage rate of approximately 3%.

[0142] The aforementioned Filling adhesive can be an epoxy system adhesive with a viscosity of less than 200 mp.s. The Filling adhesive can be cured by irradiation with light of wavelength 470 nm to form multiple second protective structures 82. The thixotropic index of the aforementioned Filling adhesive is approximately 0. After curing, the Young's modulus of the Filling adhesive can range from 1.6 GPa to 2.3 GPa, the hardness is greater than 75 D, and the curing shrinkage rate is approximately 3%.

[0143] See Figure 5 and Figure 6 The dam 91 is set around the bend 6, and a cavity 90 is formed between the adhesive layer 5, the bend 6 and the dam 91.

[0144] Understandably, the dam 91 can be used to define the encapsulation boundary of the bend 6. The cavity 90 exposes at least a portion of the ink layer 4.

[0145] See also Figure 5 Multiple baffles 92 are disposed within the cavity 90, and the multiple baffles 92 divide the cavity 90 into at least three sub-cavities 900. A second protective structure 82 is filled within one of the sub-cavities 900.

[0146] It is understandable that a second protective structure 82 is filled inside a sub-cavity 900, and the second protective structure 82 is set in a one-to-one correspondence with the sub-cavity 900.

[0147] For example, the display module 10 may include three baffles 92 and four second protective structures 82. The three baffles 92 divide the cavity 90 into four sub-cavities 900. For example, the three baffles 92 may divide the cavity 90 into four sub-cavities 900 on an even basis.

[0148] For example, during the formation of multiple second protective structures 82, at least three sub-cavities 900 can be sequentially filled and cured with filling material, and non-adjacent sub-cavities 900 can be filled and cured with filling material before the remaining sub-cavities 900 are filled and cured with filling material.

[0149] In related technologies, during the encapsulation of the outer side of the bending area 6, the second protective structure 82 directly fills the cavity 90, exposing at least a portion of the ink layer 4. The contact area between the second protective structure 82 and the ink layer 4 is relatively large. During the curing process of the adhesive material of the second protective structure 82, the large shrinkage stress generated by the adhesive material is transmitted to the ink layer 4, causing the ink layer 4 to be subjected to greater stress, thereby increasing the risk of the ink layer 4 detaching from the cover plate 2.

[0150] In this disclosure, on the one hand, by providing a buffer layer 3 between the ink layer 4 and the cover plate 2, the buffer layer 3 can serve as a modulus gradient transition layer between the ink layer 4 and the cover plate 2. When the adhesive layer 5 undergoes curing shrinkage and generates curing shrinkage stress, the buffer layer 3 can serve as a stress buffer transition layer to alleviate the interface stress concentration caused by the modulus mismatch between the ink layer 4 and the cover plate 2, thereby reducing the risk of the ink layer 4 and the cover plate 2 falling off.

[0151] On the other hand, by dividing the cavity 90 into at least three sub-cavities 900, and then filling one sub-cavity 900 with a second protective structure 82, the second protective structure 82 is regionally filled. The contact area between one second protective structure 82 and the ink layer 4 is much smaller than the total area of ​​the ink layer 4 exposed in the cavity 90. That is, within one sub-cavity 900, the contact area between the second protective structure 82 and the ink layer 4 is reduced, the amount of adhesive required for the second protective structure 82 is reduced, the shrinkage stress generated by the curing of one second protective structure 82 is reduced, and the stress transmitted to the ink layer 4 is also reduced, thereby further reducing the risk of the ink layer 4 detaching from the cover plate 2.

[0152] In some embodiments, see Figure 6 The display module 10 also includes a third protective structure 83, which is filled within the dam 91 and located on the side of the second protective structure 82 away from the cover plate 2.

[0153] For example, the material of the third protective structure 83 can be a filling adhesive. The modulus of the third protective structure 83 can be the same as that of the second protective structure 82, or it can be different from the modulus of the second protective structure 82.

[0154] Understandably, the third protective structure 83 can be used to fill the dam 91 to improve the uniformity of the overall thickness and flatness of the protective structure, thereby further improving the structural reliability of the display module 10 and helping to improve the service life and optical uniformity of the display module 10.

[0155] For example, the third protective structure 83 can also cover the location where the flexible circuit board 111 is electrically connected to the bonding part B, thereby improving the reliability of the electrical connection between the flexible circuit board 111 and the bonding part B.

[0156] Figure 7 for Figure 5 The sectional view of the display module along section line DD'.

[0157] In some embodiments, see Figure 7 Along the direction Z perpendicular to the cover plate 2, the height of the retaining wall 92 is less than or equal to the height of the dam 91.

[0158] For example, the embodiments of this disclosure are illustrated by taking the example that the height of the retaining wall 92 is less than the height of the dam 91.

[0159] For example, along direction Z, the height of the retaining wall 92 can be greater than or equal to the height of the second protective structure 82, which is beneficial to realize the regional filling of the second protective structure 82.

[0160] For example, along direction Z, the height of the dam 91 can range from 2mm to 2.5mm.

[0161] It is understandable that, along direction Z, the height of the retaining wall 92 is less than or equal to the height of the dam 91, which can divide the cavity 90 into multiple sub-cavities 900. This facilitates the relative independence of multiple second protective structures 82, avoids stress concentration caused by the curing of the second protective structure 82, further reduces the risk of the ink layer 4 falling off the cover plate 2, improves the reliability of the display module 10, and is conducive to the subsequent planarization of the third protective structure 83.

[0162] Figure 8 for Figure 7 The right view of the display module at point N.

[0163] In some embodiments, see Figures 1-8 The material of the buffer layer 3 includes at least one of nano-silica (SiO2), nano-alumina (Al2O3), nano-titanium oxide (TiO2), or cage-type polysilsesquioxane.

[0164] For example, the embodiments of this disclosure illustrate the use of nano-silica as the material of the buffer layer 3. For instance, the modulus of nano-silica ranges from approximately 30 GPa to 37 GPa, and its modulus is located between the ink layer 4 and the cover plate 2. Furthermore, the difference between the modulus of nano-silica and the ink layer 4, as well as the difference between the modulus of nano-silica and the cover plate 2, is similar, which is beneficial for further improving the stress buffering transition effect of the buffer layer 3.

[0165] It is understandable that by using the above-mentioned material as the material of the buffer layer 3, the modulus of the buffer layer 3 is located between the modulus of the ink layer 4 and the modulus of the cover plate 2. The buffer layer 3 can serve as a modulus gradient transition layer between the ink layer 4 and the cover plate 2. When the adhesive layer 5 undergoes curing shrinkage and generates curing shrinkage stress, the buffer layer 3 can serve as a stress buffer transition layer to alleviate the interface stress concentration caused by the modulus mismatch between the ink layer 4 and the cover plate 2, reduce the difference in stress change between the film layers caused by thermal shock between the ink layer 4 and the cover plate 2, thereby reducing the risk of the ink layer 4 and the cover plate 2 falling off, and thus improving the reliability of the display module 10.

[0166] On the other hand, a method for manufacturing a display module 10 is provided. Figure 9 This is a flowchart of a method for manufacturing a display module according to some embodiments; Figures 10-28 The diagram shows the steps of a method for manufacturing a display module according to some embodiments.

[0167] See Figure 9 The preparation method includes the following steps S1 to S3: Step S1: See Figure 10 A buffer layer 3 is formed in the first region 21 on the surface of the cover plate 2.

[0168] For example, a buffer layer 3 can be formed in the first region 21 by a chemical vapor deposition process.

[0169] For example, the material of the buffer layer 3 may include at least one of nano-silica, nano-alumina, nano-titanium oxide, or cage-type polysilsesquioxane.

[0170] Step S2: See Figure 11 and Figure 12 An ink layer 4 is formed on the side of the buffer layer 3 away from the cover plate 2, and the ink layer 4 is located within the first region 21. The modulus of the material of the buffer layer 3 is greater than the modulus of the material of the ink layer 4, but less than the modulus of the material of the cover plate 2.

[0171] For example, an ink layer 4 can be formed on the side of the buffer layer 3 away from the cover plate 2 by screen printing.

[0172] For example, the modulus of the materials of the buffer layer 3, ink layer 4, and cover plate 2 can all be storage modulus or Young's modulus. Modulus can characterize the rigidity of a material, that is, the hardness of the material. The larger the modulus, the greater the hardness of the material and the lower the flexibility; the smaller the modulus, the lower the hardness of the material and the higher the flexibility.

[0173] It is understandable that the modulus of the materials of ink layer 4, buffer layer 3 and cover plate 2 increases sequentially. Buffer layer 3 can serve as a modulus gradient transition layer between ink layer 4 and cover plate 2, alleviating the interface stress concentration caused by the modulus mismatch between ink layer 4 and cover plate 2.

[0174] Step S3: Attach the cover plate 2 to the display panel 1 to form as shown. Figures 1-6 The display device 10 shown. The display panel 1 includes a bent portion 6, the orthographic projection of which onto the cover plate 2 is located within a first region 21. The bent portion 6 is bonded to the cover plate 2 by an adhesive layer 5, which is at least partially located between the ink layer 4 and the bent portion 6.

[0175] For example, the cover plate 2 can be first bonded and fixed to the display portion A of the display panel 1 using the optical adhesive layer 13. Then, the bonding portion B of the display panel 1 is bent to the non-display side 101 of the display portion A to form a bent portion 6. Then, adhesive is applied between the bent portion 6 and the cover plate 2 to form an adhesive layer 5.

[0176] The method for manufacturing the display device 10 includes forming a buffer layer 3 in a first region 21 on the surface of a cover plate 2. An ink layer 4 is formed on the side of the buffer layer 3 away from the cover plate 2, and the ink layer 4 is located within the first region 21. The cover plate 2 is then bonded to a display panel 1 to form a display module 10. The display panel 1 includes a bent portion 6, the orthographic projection of which onto the cover plate 2 is located within the first region 21. The bent portion 6 is bonded to the cover plate 2 via an adhesive layer 5, which is at least partially located between the ink layer 4 and the bent portion 6, thereby achieving a narrow bezel effect for the display device 10.

[0177] It is understandable that during the formation of adhesive layer 5, the material of adhesive layer 5 has a curing shrinkage rate, and the contact area between adhesive layer 5 and ink layer 4 is large, resulting in a large curing shrinkage stress at the interface between adhesive layer 5 and ink layer 4, which generates a large shear stress on ink layer 4. This shear stress may cause ink layer 4 to detach from cover plate 2, resulting in a decrease in the reliability of display module.

[0178] The modulus of the material in the buffer layer 3 is greater than that of the material in the ink layer 4, but less than that of the material in the cover plate 2. It is understood that the modulus of the materials in the ink layer 4, buffer layer 3, and cover plate 2 increases sequentially between the display panel 1 and the cover plate 2. The buffer layer 3 can serve as a modulus gradient transition layer between the ink layer 4 and the cover plate 2. In the event of curing shrinkage stress generated by the curing shrinkage of the adhesive layer 5, the buffer layer 3 can act as a stress buffer transition layer, alleviating the interface stress concentration caused by the modulus mismatch between the ink layer 4 and the cover plate 2, reducing the difference in interlayer stress changes between the ink layer 4 and the cover plate 2 due to thermal shock, thereby reducing the risk of the ink layer 4 detaching from the cover plate 2 and improving the reliability of the display module 10.

[0179] In some embodiments, see Figure 11 and Figure 12 The formation of ink layer 4 in step S2 above may include the following steps S201 and S202: Step S201: See Figure 11 A first ink layer 41 is formed on the side of the buffer layer 3 away from the cover plate 2. The modulus of the first ink layer 41 is less than that of the buffer layer 3.

[0180] For example, a first ink layer 41 can be formed on the side of the buffer layer 3 away from the cover plate 2 by screen printing.

[0181] For example, the orthographic projection of the first ink layer 41 on the cover plate 2 can overlap with the orthographic projection of the buffer layer 3 on the cover plate 2.

[0182] Step S202: See Figure 12 A second ink layer 42 is formed on the side of the first ink layer 41 away from the cover plate 2. The modulus of the buffer layer 3, the first ink layer 41, the second ink layer 42 and the adhesive layer 5 decreases sequentially.

[0183] For example, a second ink layer 42 can be formed on the side of the first ink layer 41 away from the cover plate 2 by screen printing.

[0184] For example, the orthographic projection of the second ink layer 42 on the cover plate 2 may overlap with the orthographic projection of the first ink layer 41 on the cover plate 2. The orthographic projection of the second ink layer 42 on the cover plate 2 may overlap with or at least partially overlap with the orthographic projection of the buffer layer 3 on the cover plate 2.

[0185] For example, the first ink layer 41 and the second ink layer 42 can be one of black ink and white ink, respectively. The black ink can absorb stray light leaking from the side or back of the display module 10, reducing halo effect and improving display contrast. The white ink can act as a light-shielding layer, blocking backlight or ambient light from penetrating from the bezel area, preventing light leakage and halo from appearing at the edge of the display unit A. Furthermore, white has high reflectivity, which can reflect backlight incident on the bezel back to the display unit A, improving the overall brightness of the screen and reducing dark corners at the edges.

[0186] It is understandable that the first ink layer 41 and the second ink layer 42 adopt different modulus parameters. The modulus of the buffer layer 3, the first ink layer 41, the second ink layer 42 and the adhesive layer 5 stacked in sequence decreases in sequence, further forming a gradient transition of the stacked film layers. A modulus gradient transition is formed between the second ink layer 42 and the adhesive layer 5, between the first ink layer 41 and the second ink layer 42, between the first ink layer 41 and the buffer layer 3, and between the buffer layer 3 and the cover plate 2. The buffer layer 3 can better absorb the shear stress generated by the curing shrinkage of the adhesive layer 5, further alleviate the interface stress concentration caused by the modulus mismatch between the ink layer 4 and the cover plate 2, reduce the stress change difference between the film layers caused by thermal shock between the ink layer 4 and the cover plate 2, thereby further reducing the risk of the ink layer 4 and the cover plate 2 falling off, and thus further improving the reliability of the display module 10.

[0187] In some embodiments, the above preparation method further includes the following steps S301 to S303: Step S301, see Figure 13 A back film 11 is provided on the non-display side 101 of the display panel 1. The back film 11 includes a groove 60 that exposes the inner surface of the bent portion 6. Along the bending direction U of the display panel 1, the inner surface of the bent portion 6 has a middle region 61 and edge regions 62 located on both sides of the middle region 61.

[0188] It is understandable that, along direction U, the two portions of edge region 62 are located on opposite sides of middle region 61. For example, in... Figure 13 In this context, direction U can be direction X.

[0189] For example, the back film 11 can be bonded to the non-display side 101 of the display panel 1. Other functional layers, such as a support layer 12, a spacer layer, a heat dissipation layer, or an optical material layer, are also provided on the side of the back film 11 away from the display panel 1. These examples of functional layers do not necessarily encompass all functional layers within the display module 10. Any layer structure in the display module 10 that has a lateral protrusion relationship with the upper and lower layers in a direction parallel to the cover plate 2 is applicable to the structural design and protection scope described in this solution.

[0190] Step S302: See Figure 14 and Figure 15 A first potting structure 71 and two second potting structures 72 are formed within the groove 60. The first potting structure 71 is located in the middle region 61, and the second potting structures 72 are located in the edge region 62. The modulus of the material of the first potting structure 71 is smaller than the modulus of the material of the second potting structure 72.

[0191] For example, the modulus of the material of the first potting structure 71 can be in the range of 0.5 MPa to 1.9 MPa. The first potting structure 71 can be formed by curing adhesive. After curing, the hardness of the adhesive can be in the range of 10A to 20A. The elongation at break of the cured first potting structure 71 can be 350% to 500%, and the creep recovery rate can be greater than 93%. For example, the curing temperature of the adhesive can be 65°C, and the curing time can be 30 minutes.

[0192] Understandably, the material of the first potting structure 71 has a low modulus, low hardness, and high elongation at break and creep recovery rate. Due to its low modulus, low hardness, high elongation at break and high creep recovery rate, when the display module 10 is subjected to external stress, the adhesive itself can absorb the external stress through shear deformation. This allows at least part of the external stress to be transferred to the low-modulus first potting structure 71, thereby improving the toughness of the bending portion 6 and reducing the stress intensity on the structure within the bending portion 6. This reduces the possibility of poor wiring breakage within the display panel 1, thereby further improving the reliability of the display module 10.

[0193] For example, the modulus of the material of the second potting structure 72 can be in the range of 1.9 GPa to 2.5 GPa. The second potting structure 72 can be formed by curing adhesive. The hardness of the cured adhesive can be in the range of 65D to 73D, and the elongation at break of the cured second potting structure 72 can be 26% to 47%. For example, the curing temperature of the adhesive can be 65°C, and the curing time can be 30 minutes.

[0194] Understandably, the material of the second potting structure 72 has a large modulus, high hardness, and low elongation at break and creep recovery. Due to its large modulus and high hardness, the cured second potting structure 72 has a strong supporting effect and can effectively resist the impact of external stress on the bending area 6. When the display module 10 is subjected to external impact, the second potting structure 72 can protect the structure inside the bending part 6, reduce the possibility of the wiring inside the display panel 1 breaking, and thus further improve the reliability of the display module 10.

[0195] For example, see Figure 14 A second potting structure 72 can be formed first in the edge region 62 using a dispensing process; that is, two second potting structures 72 are formed on opposite sides of the groove 60. Then refer to... Figure 15 A first potting structure 71 is formed in the middle region 61 through a dispensing process, that is, the first potting structure 71 is formed between two second potting structures 72. Along the direction U, both sides of the first potting structure 71 can be in contact with the second potting structures 72.

[0196] Step S303: See Figure 16 , Bend display panel 1.

[0197] For example, the display panel 1 can be bent along the bending direction U, and the binding part B can be bent to the non-display side 101 of the display part A to form the bending part 6.

[0198] For example, see Figure 17 After bending the display panel 1, an adhesive layer 5 can be formed between the ink layer 4 and the bent portion 6 using an adhesive dispensing process. The adhesive layer 5 bonds the bent portion 6 to the cover plate 2. Along direction X, the outer boundary of the adhesive layer 5 is located outside the outer boundary of the bent portion 6.

[0199] For example, see Figure 18 After bending the display panel 1, an adhesive layer 5 can be formed between the ink layer 4 and the bent portion 6 using an adhesive dispensing process. The adhesive layer 5 bonds the bent portion 6 to the cover plate 2. Along direction X, the outer boundary of the adhesive layer 5 is located inside the outer boundary of the bent portion 6.

[0200] In some embodiments, see Figure 1 , Figure 3 and Figure 4 After bonding the cover plate 2 to the display panel 1 in step S3 above, the above preparation method further includes: forming a first protective structure 81, at least a portion of which covers the outside of the bent portion 6 and is connected to the adhesive layer 5. The modulus of the material of the first protective structure 81 is greater than the modulus of the material of the adhesive layer 5.

[0201] For example, the above Figure 17 After the adhesive portion 5 is formed, a first protective structure 81 can be formed on the outside of the bent portion 6 by applying adhesive through a five-axis linkage dispensing process, so as to form a protective structure 81. Figure 1 The display module 10 shown.

[0202] For example, such as Figure 1 In the display module 10 shown, the modulus of the material of the first protective structure 81 can be greater than or equal to the modulus of the material of the adhesive layer 5. When the moduli of the materials of the first protective structure 81 and the adhesive layer 5 are equal, they can be formed by a single five-axis linkage dispensing process.

[0203] Or, the above Figure 18 After the adhesive portion 5 is formed, a first protective structure 81 can be formed on the outside of the bent portion 6 by applying adhesive through a five-axis linkage dispensing process, so as to form a protective structure 81. Figure 4 The display module 10 shown.

[0204] Or see Figure 19A hole 70 is formed between the bent portion 6, the back film 11, and the support layer 12. The third potting structure 73 fills the hole 70. After the display panel 1 is bent, a first protective structure 81 can be formed on the outside of the bent portion 6 by applying adhesive through a five-axis linkage dispensing process. For example, see Figure 20 The first protective structure 812 can be formed first using a five-axis linkage dispensing process, and then the remaining parts of the first protective structure 81 can be formed sequentially to form a structure like... Figure 3 The display module 10 shown.

[0205] For example, see Figure 1 , Figure 3 and Figure 4 The modulus of the material of the first protective structure 81 can range from 1.4 GPa to 1.9 GPa, the hardness of the cured first protective structure 81 can range from 65D to 73D, and the elongation at break of the first protective structure 81 can range from 26% to 47%. For example, light with a wavelength range of 365 nm or 470 nm can be used to irradiate the material of the first protective structure 81 for 1 minute to achieve curing. The viscosity of the adhesive used in the first protective structure 81 can range from 25000 cps to 46000 cps, and the thixotropic index can range from 2 to 5.

[0206] It is understandable that a high-modulus, high-hardness, and low-elongation-at-break adhesive can be applied to the outside of the bending portion 6, that is, at least a portion of the first protective structure 81 can be applied to the outside of the bending portion 6. The first protective structure 81 has a strong protective effect and can effectively resist the impact transmitted to the bending portion 6 from the outside, thereby further enhancing the encapsulation strength of the outside of the bending portion 6, improving the structural reliability of the bending portion 6, and thus improving the reliability of the display module 10.

[0207] For example, see [link to example]. Figure 1 , Figure 3 and Figure 4 The modulus of the adhesive layer 5 can range from 0.5 MPa to 1.9 MPa, the hardness of the cured adhesive layer 5 can range from 10A to 20A, its elongation at break can range from 350% to 500%, and its creep recovery rate is greater than 93%. For example, light with a wavelength range of 365 nm or 470 nm can be used to irradiate the material of the adhesive layer 5 for 1 minute to achieve curing. The viscosity of the adhesive used in the adhesive layer 5 can range from 25,000 cps (centipoise) to 46,000 cps, and its thixotropic index can range from 2 to 5.

[0208] Understandably, adhesives with low modulus, low hardness, high elongation at break, and high creep recovery can be filled into areas of weak strength. That is, the adhesive layer 5 is placed between the ink layer 4 and the bending part 6. When the display module 10 is subjected to external force, the stress transmitted to the display panel 1 can be absorbed by the deformation of the adhesive layer 5, thereby protecting the display panel 1.

[0209] It is understandable that the buffer layer 3 set between the ink layer 4 and the cover plate 2 can serve as a modulus gradient transition layer. When the adhesive layer 5 undergoes curing shrinkage and generates curing shrinkage stress, the buffer layer 3 can serve as a stress buffer transition layer to alleviate the interface stress concentration caused by the modulus mismatch between the ink layer 4 and the cover plate 2, reduce the difference in stress change between the film layers caused by thermal shock between the ink layer 4 and the cover plate 2, and thus reduce the risk of the ink layer 4 and the cover plate 2 falling off.

[0210] Furthermore, a first protective structure 81 connected to the adhesive layer 5 is provided on the outer side of the bent portion 6. The first protective structure 81 protects at least part of the outer side of the bent portion 6 it covers. The modulus of the first protective structure 81 is greater than that of the adhesive layer 5. The adhesive layer 5 can achieve stress buffering, and the first protective structure 81 can enhance the encapsulation strength of the outer side of the bent portion 6, thereby further improving the reliability of the display module 10.

[0211] In some embodiments, after bonding the cover plate 2 to the display panel 1 in step S3 above, the above preparation method further includes the following steps S401 to S404: Step S401: See Figure 21 and Figure 22 This forms a dam 91 around the bend 6, and a cavity 90 is formed between the adhesive layer 5, the bend 6, and the dam 91. Figure 22 for Figure 21 The structure in the diagram is a cross-sectional view along section line CC'.

[0212] In related technologies, during the encapsulation of the outer side of the bending area 6, the protective adhesive directly fills the cavity 90, exposing at least a portion of the ink layer 4, resulting in a large contact area between the protective adhesive and the ink layer 4. During the curing process of the protective adhesive, the significant shrinkage stress generated by the adhesive is transmitted to the ink layer 4, subjecting it to considerable stress and thus increasing the risk of the ink layer 4 detaching from the cover plate 2.

[0213] Step S402: See Figure 23 and Figure 24Multiple baffles 92 are formed within the cavity 90, arranged along a first direction X to divide the cavity 90 into at least three sub-cavities 900. Along the first direction X, the at least three sub-cavities 900 include a first sub-cavity 901 and a second sub-cavity 902, which are arranged alternately. The first direction X is parallel to the cover plate 2 and perpendicular to the bending direction U of the display panel 1. The embodiments of this disclosure are illustrated using direction X as an example. Figure 24 for Figure 23 The structure in the diagram is a cross-sectional view along section line CC'.

[0214] For example, the dam 91 and the plurality of retaining walls 92 may be made of the same material, or they may be made of different materials. For instance, the dam 91 and the plurality of retaining walls 92 may all be formed by curing a bank adhesive. The plurality of second protective structures 82 may be formed by curing a filling adhesive.

[0215] Understandably, the dam 91 can be used to define the encapsulation boundary of the bend 6. The cavity 90 exposes at least a portion of the ink layer 4. The first sub-cavity 901 and the second sub-cavity 902 are arranged alternately, that is, the first sub-cavity 901 and the second sub-cavity 902 are not adjacent.

[0216] For example, see Figure 23 Three baffles 92 can be formed within the cavity 90 to divide the cavity 90 into four sub-cavities 900. Along the first direction X, the four sub-cavities 900 are respectively the first sub-cavity 901, the second sub-cavity 902, and the first sub-cavity 901 and the second sub-cavity 902.

[0217] Step S403: See Figure 25 and Figure 26 The first application of adhesive is performed to form a protective adhesive within the first sub-cavity 901. Among these steps... Figure 26 for Figure 25 The structure in the diagram is a cross-sectional view along section line CC'.

[0218] For example, adhesive can be applied and cured inside the two first sub-cavities 901 to form a second protective structure 82 inside the two first sub-cavities 901 respectively.

[0219] Understandably, a protective adhesive is first formed within the first sub-cavity 901. The area of ​​the ink layer 4 exposed in the first sub-cavity 901 is much smaller than the total area of ​​the ink layer 4 exposed in the cavity 90. In other words, within the first sub-cavity 901, the contact area between the protective adhesive and the ink layer 4 is reduced, the amount of adhesive required is reduced, the shrinkage stress generated by the curing of the protective adhesive is reduced, and the stress transmitted to the ink layer 4 is also reduced, thereby reducing the risk of the ink layer 4 detaching from the cover plate 2.

[0220] Furthermore, the two adjacent first sub-cavities 901 are spaced apart, so the shrinkage stress generated by the protective adhesive in one first sub-cavity 901 during the curing process will not be directly transmitted to the other first sub-cavity 901. By applying adhesive in sections, it is beneficial to reduce the stress on the ink layer 4 caused by the curing of the protective adhesive in each first sub-cavity 901, thereby reducing the stress on the ink layer 4 caused by the overall curing of the protective adhesive, and further reducing the risk of the ink layer 4 falling off from the cover plate 2.

[0221] Step S404: See Figures 26-28 A second application of adhesive is then performed to form a protective adhesive within the second sub-cavity 902. Among these steps... Figure 27 The sectional view of the structure along section line CC' is also as follows. Figure 26 The above, Figure 28 for Figure 27 The cross-sectional view of the structure along section line DD'.

[0222] For example, after a protective adhesive is formed in the first sub-cavity 901, adhesive can be applied to and cured inside the two second sub-cavities 902 to form a second protective structure 82 in each of the two second sub-cavities 902, so that the multiple second protective structures 82 fill the cavity 90.

[0223] Understandably, after the protective adhesive is formed in the first sub-cavity 901, a protective adhesive is formed in the second sub-cavity 902. The area of ​​the ink layer 4 exposed in the second sub-cavity 902 is much smaller than the total area of ​​the ink layer 4 exposed in the cavity 90. In other words, in the second sub-cavity 902, the contact area between the protective adhesive and the ink layer 4 is reduced, the amount of adhesive required is reduced, the shrinkage stress generated by the curing of the protective adhesive is reduced, and the stress transmitted to the ink layer 4 is also reduced, thereby reducing the risk of the ink layer 4 detaching from the cover plate 2.

[0224] Furthermore, the two adjacent second sub-cavities 902 are spaced apart, so the shrinkage stress generated by the protective adhesive in one second sub-cavity 902 during the curing process will not be directly transmitted to the other second sub-cavity 902. By applying adhesive in sections, it is beneficial to reduce the stress on the ink layer 4 caused by the curing of the protective adhesive in each second sub-cavity 902, thereby reducing the stress on the ink layer 4 caused by the overall curing of the protective adhesive, and further reducing the risk of the ink layer 4 falling off from the cover plate 2.

[0225] For example, see Figure 28 Along direction Z, the height of retaining wall 92 is less than or equal to the height of dam 91. The height of retaining wall 92 can be greater than or equal to the height of second protective structure 82, which is beneficial for achieving zoned filling of second protective structure 82.

[0226] In some embodiments, see Figures 5-7After the second dispensing in step S404 above, the preparation method further includes dispensing adhesive inside the dam 91 to fill the dam 91.

[0227] For example, after applying adhesive and allowing it to cure within the dam 91, a third protective structure 83 can be formed. The material of the third protective structure 83 can be a filling adhesive. The modulus of the third protective structure 83 can be the same as that of the second protective structure 82, or it can be different from the modulus of the second protective structure 82.

[0228] It is understandable that applying adhesive to fill the dam 91 can improve the uniformity of the overall thickness and flatness of the protective structure, thereby further improving the structural reliability of the display module 10, and also helping to improve the service life and optical uniformity of the display module 10.

[0229] On the other hand, a display device is provided. Figure 29 This is a structural diagram of a display device according to some embodiments.

[0230] See Figure 29 The display device 1000 includes a display module 10 and a controller 100 as described in any of the above embodiments. The controller 100 is electrically connected to the display module 10.

[0231] For example, the controller 100 may be located on the non-display side of the display module 10 to control the display panel 1 in the display module 10 to display images.

[0232] The beneficial effects of the above-described display device 1000 are the same as those of the display module 10 described in some of the above embodiments, and will not be repeated here.

[0233] The aforementioned display device 1000 can be any device that displays images, whether moving (e.g., video) or fixed (e.g., still images), and whether it contains text or images. More specifically, the embodiments described are contemplated to be implemented in or associated with a variety of electronic devices, such as (but not limited to) mobile phones, wireless devices, personal data assistants (PDAs), handheld or portable computers, GPS receivers / navigators, cameras, MP4 video players, camcorders, game consoles, watches, clocks, calculators, television monitors, flat panel displays, computer monitors, automotive displays (e.g., odometer displays, etc.), navigators, cockpit controllers and / or displays, displays of camera views (e.g., displays of rearview cameras in vehicles), electronic photographs, electronic billboards or signs, projectors, architectural structures, packaging and aesthetic structures (e.g., displays of images of a piece of jewelry), etc.

[0234] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A display module, characterized in that, include: Display panel, including the bent portion; A cover plate is disposed on the display panel, and the surface of the cover plate near the display panel has a first region, and the orthographic projection of the bent portion on the cover plate is located within the first region; A buffer layer is disposed within the first area; An ink layer is disposed on the side of the buffer layer away from the cover plate and located within the first region; An adhesive layer is at least partially disposed between the ink layer and the bent portion; The modulus of the material of the buffer layer is greater than that of the material of the ink layer, but less than that of the material of the cover plate.

2. The display module according to claim 1, characterized in that, The ink layer includes a first ink layer and a second ink layer, wherein the first ink layer is stacked on the side of the buffer layer away from the cover plate, and the second ink layer is stacked on the side of the first ink layer away from the cover plate; The modulus of the buffer layer, the first ink layer, the second ink layer, and the adhesive layer decreases sequentially.

3. The display module according to claim 1 or 2, characterized in that, Along the bending direction of the display panel, the inner surface of the bent portion has a central region and edge regions located on both sides of the central region; The display module further includes a first potting structure and two second potting structures, wherein the first potting structure is disposed in the middle region and the second potting structures are disposed in the edge region; The modulus of the material in the first potting structure is less than the modulus of the material in the second potting structure.

4. The display module according to claim 3, characterized in that, The display module further includes a back film disposed on the non-display side of the display panel, the back film including a groove that exposes the inner surface of the bent portion; The first potting structure and the two second potting structures are all located within the groove.

5. The display module according to claim 4, characterized in that, The display module further includes a support layer, which is disposed on the side of the back film away from the display panel; The integral formed by the first potting structure and the second potting structure has pores between it and the support layer.

6. The display module according to claim 5, characterized in that, The ratio of the volume of the whole formed by the first potting structure and the second potting structure to the volume of the hole is in the range of 3 to 9.

7. The display module according to claim 3, characterized in that, The first potting structure and the second potting structure have the same volume.

8. The display module according to claim 3, characterized in that, The display module further includes a first protective structure, which at least partially covers the outside of the bent portion and is connected to the adhesive layer; The modulus of the material of the first protective structure is equal to the modulus of the material of the adhesive layer.

9. The display module according to claim 1 or 2, characterized in that, The display module further includes a back film and a support layer stacked on the non-display side of the display panel, and a third potting structure disposed inside the bending portion, wherein a hole is formed between the bending portion and the back film and the support layer, and the third potting structure fills the hole; The display module further includes a first protective structure, which at least partially covers the outside of the bent portion and is connected to the adhesive layer; The modulus of the material of the first protective structure is greater than the modulus of the material of the adhesive layer.

10. The display module according to claim 1, characterized in that, The display module further includes a first protective structure, which at least partially covers the outside of the bent portion and is connected to the adhesive layer; The modulus of the material of the first protective structure is greater than the modulus of the material of the adhesive layer.

11. The display module according to claim 1, characterized in that, The display module also includes: A dam is provided around the bend, and a cavity is formed between the adhesive layer, the bend, and the dam. Multiple retaining walls are disposed within the cavity, dividing the cavity into at least three sub-cavities; Multiple second protective structures, one of which is filled within a sub-cavity.

12. The display module according to claim 11, characterized in that, The display module also includes a third protective structure, which is filled within the dam and located on the side of the second protective structure away from the cover plate.

13. The display module according to claim 11 or 12, characterized in that, Along the direction perpendicular to the cover plate, the height of the retaining wall is less than or equal to the height of the dam.

14. The display module according to claim 1, characterized in that, The material of the buffer layer includes at least one of nano-silica, nano-alumina, nano-titanium oxide, or cage-type polysilsesquioxane.

15. A method for manufacturing a display module, characterized in that, include: A buffer layer is formed in the first area on the surface of the cover plate; An ink layer is formed on the side of the buffer layer away from the cover plate, and the ink layer is located in the first region; the modulus of the material of the buffer layer is greater than the modulus of the material of the ink layer and less than the modulus of the material of the cover plate; The cover plate is bonded to the display panel; the display panel includes a bent portion, and the orthographic projection of the bent portion on the cover plate is located in the first region; The bent portion is bonded to the cover plate by an adhesive layer, which is at least partially located between the ink layer and the bent portion.

16. The preparation method according to claim 15, characterized in that, The formation of the ink layer includes: A first ink layer is formed on the side of the buffer layer away from the cover plate; A second ink layer is formed on the side of the first ink layer away from the cover plate; the modulus of the buffer layer, the first ink layer, the second ink layer and the adhesive layer decreases in sequence.

17. The preparation method according to claim 15 or 16, characterized in that, The preparation method further includes: A back film is provided on the non-display side of the display panel, the back film including a groove that exposes the inner surface of the bend; along the bending direction of the display panel, the inner surface of the bend has a middle region and edge regions located on both sides of the middle region; A first potting structure and two second potting structures are formed within the groove, the first potting structure being located in the middle region and the second potting structures being located in the edge region; the modulus of the material of the first potting structure is less than the modulus of the material of the second potting structure. The display panel is bent.

18. The preparation method according to claim 15, characterized in that, After bonding the cover plate to the display panel, the preparation method further includes: A first protective structure is formed, at least partially covering the outside of the bend and connected to the adhesive layer; the modulus of the material of the first protective structure is greater than the modulus of the material of the adhesive layer.

19. The preparation method according to claim 15, characterized in that, After bonding the cover plate to the display panel, the preparation method further includes: A dam is formed around the bend, and a cavity is formed between the adhesive layer, the bend, and the dam; Multiple baffles are formed within the cavity, and the multiple baffles are arranged along a first direction to divide the cavity into at least three sub-cavities; along the first direction, the at least three sub-cavities include a first sub-cavity and a second sub-cavity, and the first sub-cavity and the second sub-cavity are arranged alternately; the first direction is parallel to the cover plate and perpendicular to the bending direction of the display panel; Perform the first dispensing to form a protective adhesive within the first sub-cavity; A second application of adhesive is performed to form a protective adhesive within the second sub-cavity.

20. The preparation method according to claim 19, characterized in that, After the second dispensing, the preparation method further includes: Apply adhesive to the inside of the dam to fill it in.

21. A display device, characterized in that, include: The display module as described in any one of claims 1 to 14; The controller is electrically connected to the display module.

Images